Line body fault identification method and device, equipment and storage medium

Abstract

The invention relates to the technical field of line body recognition, and discloses a line body fault recognition method and device, equipment and a storage medium. According to the technical scheme, the welding spot information of the target state corresponding to the welding spot with the quality fault can be obtained, the welding spot corresponding to the target station can be obtained according to the welding spot position, and whether the number of the welding spots corresponding to the same quality fault type of the target station is larger than the preset number or not is detected; and determining that the number of the welding spots corresponding to the same quality fault type is greater than the preset number of the target stations is abnormal, and further determining that the target line body corresponding to the target stations is abnormal. Whether the target line body where the target station is located is abnormal or not can be determined through abnormal recognition of the target station, and therefore fault recognition of the line body is achieved.

Description

Technical Field

[0001] This application relates to the technical field of line body recognition, and in particular to a method, device, equipment and storage medium for line body fault recognition. Background Art

[0002] In modern manufacturing, the quality of solder joints is a key factor determining product reliability. However, if there is a problem with the quality of solder joints at a work station, the line body corresponding to the work station will also malfunction and stop production, which has a great impact on production. In actual applications, there is only quality recognition of solder joints, lacking fault recognition of the line body. Summary of the Invention

[0003] In view of the above problems, this application provides a method, device, equipment and storage medium for line body fault recognition, which is used to solve the technical problem in the prior art that there is only quality recognition of solder joints and lacking fault recognition of the line body. By obtaining the solder joint information of the target state corresponding to the solder joints with quality faults, and obtaining the solder joints corresponding to the target work station according to the solder joint positions, and detecting whether the number of solder joints corresponding to the same quality fault type at the target work station is greater than a preset number, and determining that the target work station is abnormal when the number of solder joints corresponding to the same quality fault type is greater than the preset number, and further determining that the target line body corresponding to the target work station is abnormal. It can determine whether the target line body where the target work station is located is abnormal through the abnormal recognition of the target work station, thus realizing the fault recognition of the line body.

[0004] According to one aspect of the embodiments of this application, a method for line body fault recognition is provided. A plurality of work stations are provided on the line body. The method includes: obtaining the solder joint information of the target state corresponding to the solder joints with quality faults; wherein, the solder joint information of the target state includes the solder joint position and the quality fault type; obtaining the solder joints corresponding to the target work station according to the solder joint position, and detecting whether the number of solder joints corresponding to the same quality fault type at the target work station is greater than a preset number; if the number of solder joints corresponding to the same quality fault type at the target work station is greater than the preset number, determining that the target work station is abnormal to determine that the target line body where the target work station is located is abnormal.

[0005] In an optional manner, the solder joint information further includes the solder joint fault duration. After the step of obtaining the solder joints corresponding to the target work station according to the solder joint information, the method further includes: calculating the work station fault duration of the target work station according to the solder joints corresponding to the target work station and the solder joint fault duration corresponding to the solder joints; calculating the line body fault duration of the target line body according to each target work station provided on the target line body and the work station fault duration corresponding to each target work station; detecting whether the line body fault duration is greater than a preset duration, and determining whether the target line body is abnormal according to the detection result.

[0006] In an alternative manner, the step of obtaining the solder joint information corresponding to the target state of the solder joint with quality failure further includes: obtaining the solder joint information corresponding to the initial state of the solder joint with quality failure; performing data cleaning and data formatting processing on the solder joint information corresponding to the initial state, and using the processed solder joint information corresponding to the initial state as the solder joint information corresponding to the target state.

[0007] In an alternative manner, the step of obtaining the solder joints corresponding to the target station according to the solder joint information further includes: obtaining the station where the corresponding solder joint is located according to the solder joint information; wherein, one solder joint corresponds to one station; determining the solder joints corresponding to the target station according to the station where the corresponding solder joint is located; wherein, one target station may correspond to one or more solder joints.

[0008] In an alternative manner, the step of calculating the station failure duration of the target station according to the solder joints corresponding to the target station and the solder joint failure duration corresponding to the solder joints further includes: performing a summation calculation on the solder joint failure durations of the solder joints corresponding to the target station, and using the obtained total value as the station failure duration of the target station.

[0009] In an alternative manner, before the step of obtaining the solder joint information corresponding to the target state of the solder joint with quality failure, it further includes: extracting features from the solder joint image, and establishing a reconstruction sample according to the obtained target features; wherein, the solder joint image is the image corresponding to the collected solder joint; calculating the difference value between the reconstruction sample and the solder joint image, and detecting whether the difference value matches a preset threshold; if the difference value does not match the preset threshold, it is determined that the solder joint in the solder joint image corresponding to the difference value has a quality failure.

[0010] In an alternative manner, the method further includes: if it is determined that the target line body is abnormal, generating line body failure information according to the solder joint information; sending the line body failure information to a remote terminal, and performing line body abnormality alarm using a preset alarm mechanism.

[0011] According to another aspect of the embodiments of the present application, a line body failure identification device is provided, including: an information acquisition module, configured to acquire solder joint information corresponding to the target state of a solder joint with quality failure; wherein, the solder joint information corresponding to the target state includes the solder joint position and the quality failure type; a quantity detection module, configured to obtain the solder joints corresponding to the target station according to the solder joint position, and detect whether the number of solder joints corresponding to the same quality failure type of the target station is greater than a preset number; an abnormality determination module, configured to determine that the target station is abnormal if the number of solder joints corresponding to the same quality failure type of the target station is greater than the preset number, so as to determine that the target line body corresponding to the target station is abnormal.

[0012] According to another aspect of the embodiments of the present application, a device is provided, including: a controller; a memory for storing one or more programs, which, when executed by the controller, cause the controller to implement the line body fault identification method described in any one of the above claims.

[0013] According to still another aspect of the embodiments of the present application, a computer-readable storage medium is provided, in which at least one executable instruction is stored. When the executable instruction runs on a computer device, it causes the computer device to perform the operations of the line body fault identification method described in any one of the above claims.

[0014] In the embodiments of the present application, by obtaining the solder joint information of the target state corresponding to the solder joints with quality faults, and obtaining the solder joints corresponding to the target workstations according to the solder joint positions, and detecting whether the number of solder joints corresponding to the same quality fault type at the target workstations is greater than a preset number, and determining that the target workstations where the number of solder joints corresponding to the same quality fault type is greater than the preset number are abnormal, and further determining that the target line body corresponding to the target workstations is abnormal. It is possible to determine whether the target line body where the target workstations are located is abnormal by identifying the abnormalities of the target workstations, thereby realizing the fault identification of the line body.

[0015] The above description is only an overview of the technical solutions of the embodiments of the present application. In order to be able to understand the technical means of the embodiments of the present application more clearly, it can be implemented according to the content of the specification. And in order to make the above and other purposes, features and advantages of the embodiments of the present application more obvious and understandable, the following specific embodiments of the present application are specifically given. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The drawings are only used to illustrate the embodiments and are not considered to be a limitation of the present application. Moreover, throughout the drawings, the same reference numerals are used to represent the same components. In the drawings:

[0017] Figure 1 A flowchart showing an embodiment of the line body fault identification method provided by the present application is shown;

[0018] Figure 2 A flowchart showing another embodiment of the line body fault identification method provided by the present application is shown;

[0019] Figure 3 A flowchart showing still another embodiment of the line body fault identification method provided by the present application is shown;

[0020] Figure 4 A flowchart showing yet another embodiment of the line body fault identification method provided by the present application is shown;

[0021] Figure 5Shows a schematic flowchart of another embodiment of the line fault identification method provided by the present application;

[0022] Figure 6 Shows a schematic flowchart of yet another embodiment of the line fault identification method provided by the present application;

[0023] Figure 7 Shows a schematic structural diagram of an embodiment of the line fault identification device provided by the present application;

[0024] Figure 8 Shows a schematic structural diagram of an embodiment of the device provided by the present application. Detailed implementation manners

[0025] Here, the exemplary embodiments will be described in detail, and the examples are shown in the drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.

[0026] The block diagrams shown in the drawings are only functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software form, or implemented in one or more hardware modules or integrated circuits, or implemented in different networks and / or processor devices and / or microcontroller devices.

[0027] The flowcharts shown in the drawings are only exemplary descriptions and do not necessarily include all contents and operations / steps, nor do they necessarily need to be executed in the described order. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined. Therefore, the actual execution order may change according to the actual situation.

[0028] In the present application, "a plurality of" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the front and rear associated objects.

[0029] In modern manufacturing, the quality of solder joints is a key factor determining the reliability of products. However, existing fault statistics methods mostly rely on manual records, which are inefficient and error-prone. Therefore, an automated and efficient fault statistics method is needed to monitor and analyze the quality of solder joints in real time, so as to quickly identify a line identification method including abnormal lines and bottleneck workstations in the production process. The following embodiments are used for detailed description:

[0030] It should be noted that the method of this application is carried out in real time, and the data obtained each time is the data that has been completed as of the moment of execution. Specifically, the solder joint information of the target state of the solder joints with quality failures includes the duration of the solder joint failure, that is, each solder joint with a quality failure has been resolved. If the solder joint with a quality failure has just been discovered and the failure has not been completely resolved, it does not fall within the scope of the solder joints with quality failures in this application.

[0031] Figure 1 The flowchart of an embodiment of the method for identifying line body failures in this application is shown, and this method is executed by a computer device. Please refer to Figure 1 As shown, there are multiple workstations on the line body, and this method includes the following steps:

[0032] Step S110: Obtain the solder joint information of the target state corresponding to the solder joints with quality failures.

[0033] Among them, the solder joint information of the target state includes the solder joint position and the quality failure type.

[0034] Specifically, the solder joints include two types: normal quality solder joints and solder joints with quality failures. And the quality failure types include various types such as distortion, burr, depression, burn-through, crack, etc. The solder joint position includes the workstation where the solder joint is located and the line body where the workstation is located.

[0035] Step S120: Obtain the solder joints corresponding to the target workstation according to the solder joint position, and detect whether the number of solder joints corresponding to the same quality failure type at the target workstation is greater than a preset number.

[0036] Among them, the target workstation is the workstation including the solder joints with quality failures, and the line body where the target workstation is located is the target line body.

[0037] Specifically, one or more solder joints can correspond to one workstation. Since the solder joints with quality failures are obtained in the previous step, among the various workstations set on a line body, not every workstation has solder joints with quality failures. Therefore, it is necessary to determine the corresponding workstation as the target workstation according to the solder joints with quality failures. According to the line body workstation, time, and quality type where the solder joint quality defect occurs, through defect classification and data grouping, the corresponding target workstation and the quality failure type of the solder joints corresponding to each target workstation can be determined. Classify and count the quality failure types of the solder joints belonging to the same target workstation, and detect whether the number of solder joints corresponding to the same quality failure type in the same target workstation is greater than a preset number.

[0038] Step S130: If the number of solder joints corresponding to the same quality failure type at the target workstation is greater than a preset number, determine that the target workstation is abnormal, so as to determine that the target line body where the target workstation is located is abnormal.

[0039] Specifically, if the number of solder joints corresponding to the same quality fault type at the target work station is greater than the preset number, it is determined that the target work station often makes mistakes in this quality fault type. Therefore, the target work station is a bottleneck work station, and the corresponding target line is also abnormal.

[0040] In practical applications, the preset number is generally set to 3 times. Quality problems of the same type at the same work station with ≥3 times per shift are serious quality problems, and those with <3 times per shift are general quality problems.

[0041] Beneficial effects: In this embodiment, by obtaining the solder joint information of the target state corresponding to the solder joints with quality faults, and obtaining the solder joints corresponding to the target work station according to the solder joint positions, and detecting whether the number of solder joints corresponding to the same quality fault type at the target work station is greater than the preset number, and determining that the target work station with the number of solder joints corresponding to the same quality fault type greater than the preset number is abnormal, and then determining that the target line corresponding to the target work station is abnormal. It is possible to determine whether the target line where the target work station is located is abnormal through the abnormal identification of the target work station, thus realizing the fault identification of the line.

[0042] In some embodiments, as Figure 2 shown, the solder joint information further includes the solder joint fault duration. After the step of obtaining the solder joints corresponding to the target work station according to the solder joint information in step S120, the following steps are further included:

[0043] Step S210: Calculate the work station fault duration of the target work station according to the solder joints corresponding to the target work station and the solder joint fault duration corresponding to the solder joints.

[0044] Among them, when a solder joint quality fault is detected, the work of the work station and the line where the work station is located will be stopped immediately, and maintenance will start until the fault is eliminated before continuing the work of the work station and the line where the work station is located. Therefore, the solder joint fault duration is the duration of the work stoppage of the work station and the line where the work station is located caused by the fault of the solder joints with this quality fault.

[0045] Specifically, according to the solder joint fault durations of all the solder joints corresponding to the target work station, the total fault duration of the target work station can be calculated by superposition, that is, the work station fault duration.

[0046] Step S220: Calculate the line fault duration of the target line according to each target work station provided on the target line and the work station fault duration corresponding to each target work station.

[0047] Specifically, each target work station is classified according to the different lines where it is located, and the corresponding line is used as the target line. Adding up the work station fault durations corresponding to each target work station in each target line, what is obtained is the total fault duration of each target line, that is, the line fault duration.

[0048] Step S230: Detect whether the line body failure duration is greater than the preset duration, and determine whether the target line body is abnormal according to the detection result.

[0049] Among them, the preset duration is the safe shutdown duration of each line body. If the line body failure duration exceeds the preset duration, it is determined that the corresponding line body is abnormal.

[0050] Specifically, the longer the line body failure duration, the longer the shutdown time of the corresponding target line body. Therefore, when the line body failure duration of the target line body is greater than the preset duration, the target line body is obviously abnormal. In actual application, the preset duration is generally set to 10 minutes. If the line body shutdown duration per shift due to solder joint quality is greater than 10 minutes, it is considered that the line body is abnormal.

[0051] Beneficial effect: By calculating the line body failure duration of the target line body and detecting whether the line body failure duration is greater than the preset duration to determine whether the target line body is abnormal, the failure identification of the line body is realized.

[0052] In some embodiments, as Figure 3 shown, step S110 further includes:

[0053] Step S111: Obtain the solder joint information in the initial state corresponding to the solder joint with quality failure.

[0054] Specifically, the solder joint information in the initial state is the solder joint information corresponding to the solder joint with quality failure collected.

[0055] Step S112: Perform data cleaning and data formatting on the solder joint information in the initial state, and use the processed solder joint information in the initial state as the solder joint information in the target state.

[0056] Specifically, clean and format the collected solder joint information in the initial state, and use the processed solder joint information in the initial state as the solder joint information in the target state to ensure the accuracy of the data.

[0057] Beneficial effect: Perform data cleaning and data formatting on the solder joint information in the initial state, and use the processed solder joint information in the initial state as the solder joint information in the target state. Thereby improving the accuracy of the solder joint information in the target state.

[0058] In some embodiments, as Figure 4 shown, the step of obtaining the solder joint corresponding to the target station according to the solder joint information in step S120 further includes:

[0059] Step S121: Obtain the station where the corresponding solder joint is located according to the solder joint information.

[0060] Among them, one solder joint corresponds to one station.

[0061] Specifically, according to the position information in the solder joint information, the workstations where each solder joint is located are determined.

[0062] Step S122: Determine the solder joints corresponding to the target workstation according to the workstations where the corresponding solder joints are located.

[0063] Among them, one target workstation can correspond to one or more solder joints.

[0064] Specifically, the target workstation is the workstation including the solder joints with quality faults, and one target workstation includes at least one solder joint with quality faults. Thus, all the solder joints corresponding to the target workstation can be obtained.

[0065] Beneficial effect: Further refine the steps of obtaining the solder joints corresponding to the target workstation according to the solder joint information. Determine the solder joints corresponding to the target workstation through the solder joints and the solder joint information.

[0066] In some embodiments, step S210 further includes: calculating the sum of the solder joint fault durations of the solder joints corresponding to the target workstation, and using the obtained total value as the workstation fault duration of the target workstation.

[0067] Specifically, obtain the solder joint fault durations of all the solder joints corresponding to the target workstation, and calculate the sum of these solder joint fault durations, so that the total fault duration corresponding to the target workstation, that is, the workstation fault duration, can be quickly obtained.

[0068] Beneficial effect: By converting the calculation of the workstation fault duration into a simple mathematical summation calculation, the method implementation logic is simplified, and the calculation rate is greatly improved.

[0069] In some embodiments, as Figure 5 shown, before step S110, it further includes:

[0070] Step S310: Extract features from the solder joint image, and establish a reconstruction sample according to the extracted target features.

[0071] Among them, the solder joint image is the image corresponding to the collected solder joint.

[0072] Specifically, generally, a convolutional neural network can be used to extract the features in the solder joint image, so as to extract the target features. And an encoder is used to encode the target features extracted by the convolutional neural network into a low-dimensional latent space. In the latent space, sampling is performed through the reparameterization trick to obtain latent variables. Finally, a decoder is used to take the sampled latent variables as input, and the original solder joint image is reconstructed through the reverse process, that is, the reconstruction sample is obtained.

[0073] Step S320: Calculate the difference value between the reconstruction sample and the solder joint image, and detect whether the difference value matches a preset threshold.

[0074] Specifically, the error between the reconstructed sample and the solder joint image is calculated, which indirectly reflects the abnormality degree of the solder joint image. Based on the reconstruction error, an abnormality score value is calculated for each signal sample. The higher this value is, the higher the abnormality degree of the solder joint image is. According to historical data, a threshold interval (i.e., a preset threshold) is generated to determine whether a sample is abnormal.

[0075] Step S330: If the difference value does not match the preset threshold, it is determined that there is a quality fault in the solder joint in the solder joint image corresponding to the difference value.

[0076] Specifically, if the difference value exceeds the interval range of the preset threshold, the image is detected as an abnormal solder joint with a quality fault and further inspection or processing is required.

[0077] Beneficial effects: By extracting features from the solder joint image, establishing a reconstructed sample based on the extracted target features, calculating the difference value between the reconstructed sample and the solder joint image, and determining that there is a quality fault in the solder joint in the solder joint image corresponding to the difference value when the detected difference value does not match the preset threshold. It realizes determining whether there is a quality fault in the solder joint based on the solder joint image.

[0078] In some embodiments, as Figure 6 shown, the method further includes:

[0079] Step S410: If it is determined that the target line body is abnormal, line body fault information is generated according to the solder joint information.

[0080] Specifically, by analyzing and finding that the collected data exceeds the preset control limit, that is, it is determined that the target line body is abnormal. Then corresponding line body fault information will be generated.

[0081] Step S420: Send the line body fault information to the remote terminal and use a preset alarm mechanism to alarm the line body abnormality.

[0082] Among them, the preset alarm mechanism includes on-site sound and light alarm, display screen display alarm, mobile phone fault information push, email notification, etc.

[0083] Specifically, the alarm mechanism will be immediately triggered, including on-site sound and light alarm, display screen display alarm, mobile phone fault information push, email notification, etc. At the same time, the statistical results of each shift of the line body fault and a detailed fault data analysis report are displayed to the user in a visual manner.

[0084] Beneficial effects: By generating line body fault information according to the solder joint information in a timely manner and sending it to the remote terminal after determining that the target line body is abnormal, and using a preset alarm mechanism to alarm the line body abnormality to achieve timely early warning.

[0085] In some embodiments, for the identified abnormal lines and bottleneck stations, the proportion of each type of solder joint failure duration is deeply analyzed, and the data is sorted according to the failure duration, and a threshold is set to determine the normality of the data to determine the cause category and severity of the line failure. For example, if the same quality problem of the same station occurs ≥ 3 times per shift, it is considered a serious quality problem, and if the same quality problem of the same station occurs < 3 times per shift, it is considered a general quality problem.

[0086] In some embodiments, the side enclosure line is used as an example of a line body. The side enclosure line has 6 stations. The weld point of station 01 is twisted once, and the line is stopped for 1 minute; station 02 has no problem; the weld point of station 03 has burrs 3 times, and the line is stopped for 10 minutes; the weld point of station 04 is sunken 2 times, and the line is stopped for 5 minutes; station 05 has no problem; station 06 has no problem. The execution body will automatically collect, count, and alarm, and push the information of stations 01, 03, and 04 to the on-site engineer by mobile phone at the first time. The on-site large screen will display the alarm information of stations 01, 03, and 04 in real time. After the engineer handles the fault, the production line resumes operation and the large screen displays normal. It also automatically stores and records the fault data information of stations 01, 03, and 04 of the line body, and automatically generates daily, weekly, and monthly reports for production management and quality management.

[0087] Figure 7 The schematic diagram of the structure of the embodiment of the line fault identification device of the present application is shown. Figure 7 As shown, the device 500 includes: an information acquisition module 510, a quantity detection module 520 and an abnormality determination module 530.

[0088] The information acquisition module 510 is used to acquire the target state solder joint information corresponding to the solder joint with quality failure; wherein the target state solder joint information includes the solder joint position and the quality failure type;

[0089] The quantity detection module 520 is used to obtain the welding points corresponding to the target station according to the welding point positions, and detect whether the number of welding points corresponding to the same quality failure type of the target station is greater than a preset number;

[0090] The abnormality determination module 530 is used to determine that the target station is abnormal if the number of weld spots corresponding to the same quality fault type of the target station is greater than a preset number, so as to determine that the target line body corresponding to the target station is abnormal.

[0091] Beneficial effects: In this embodiment, by obtaining the solder joint information of the target state corresponding to the solder joints with quality failures, and obtaining the solder joints corresponding to the target workstations according to the solder joint positions, and detecting whether the number of solder joints corresponding to the same quality failure type at the target workstations is greater than a preset number, and determining that the target workstations with the number of solder joints corresponding to the same quality failure type greater than the preset number are abnormal, and further determining that the target line bodies corresponding to the target workstations are abnormal. It is possible to determine whether the target line body where the target workstation is located is abnormal through the abnormality recognition of the target workstation, thereby realizing the fault recognition of the line body.

[0092] It should be noted that the line body fault recognition device provided in the above embodiment and the line body fault recognition method provided in the foregoing embodiment belong to the same concept. The specific manners in which each module and unit perform operations have been described in detail in the method embodiment, and will not be elaborated herein.

[0093] Figure 8 The structural schematic diagram of the embodiment of the device of the present application is shown, which shows the structural schematic diagram of the computer system suitable for implementing the device of the embodiment of the present application. The specific implementation of the device in the specific embodiment of the present application is not limited.

[0094] Please refer to Figure 8 As shown, the device includes: a controller; a memory for storing one or more programs, which when executed by the controller, are used to execute the line body fault recognition method in any one of the above embodiments.

[0095] Please continue to refer to Figure 8 As shown, the computer system 600 of the device includes a central processing unit (CPU) 601, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 602 or the program loaded from the storage section 608 into the random access memory (RAM) 603, such as executing the method in the above embodiment. In the RAM 603, various programs and data required for system operation are also stored. The CPU 601, ROM 602, and RAM 603 are connected to each other through a bus 604. The input / output (I / O) interface 605 is also connected to the bus 604.

[0096] The following components are connected to the I / O interface 605: an input section 606 including a keyboard, a mouse, etc.; an output section 607 including a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc.; a storage section 608 including a hard disk, etc.; and a communication section 609 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 609 performs communication processing via a network such as the Internet. A drive 610 is also connected to the I / O interface 605 as required. A removable medium 611 such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc. is mounted on the drive 610 as required so that a computer program read from it can be installed into the storage section 608 as required.

[0097] Specifically, according to an embodiment of the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, an embodiment of the present application includes a computer program product that includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from the network through the communication section 609, and / or installed from the removable medium 611. When the computer program is executed by a central processing unit (CPU) 601, various functions defined in the system of the present application are executed.

[0098] Another aspect of the present application also provides a computer-readable storage medium, in which at least one executable instruction is stored, and when the executable instruction runs on a device / apparatus, the device / apparatus is caused to execute the operations of the wire body fault identification method in any of the above embodiments.

[0099] Beneficial effects: In this embodiment, by obtaining the solder joint information of the target state corresponding to the solder joints with quality faults, and obtaining the solder joints corresponding to the target station according to the solder joint positions, and detecting whether the number of solder joints corresponding to the same quality fault type at the target station is greater than a preset number, and determining that the target station is abnormal when the number of solder joints corresponding to the same quality fault type is greater than the preset number, and further determining that the target wire body corresponding to the target station is abnormal. It is possible to determine whether the target wire body where the target station is located is abnormal through the abnormality identification of the target station, thereby realizing the fault identification of the wire body.

[0100] It should be noted that the computer-readable medium shown in the embodiments of the present application can be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. A computer-readable storage medium can be, for example, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of the computer-readable storage medium may include, but are not limited to: an electrical connection with one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, the computer-readable storage medium can be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, apparatus, or device. In the present application, a computer-readable signal medium can include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable computer program. Such a propagated data signal can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, and this computer-readable medium can send, propagate, or transmit a program for use by or in combination with an instruction execution system, apparatus, or device. The computer program contained on the computer-readable medium can be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.

[0101] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. Among them, each block in the flowchart or block diagram can represent a module, a program segment, or a part of the code, and the above module, program segment, or part of the code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in an order different from that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, as well as the combination of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.

[0102] The units involved in the embodiments described in this application can be implemented in software or in hardware, and the described units can also be provided in a processor. Among them, the names of these units do not constitute a limitation to the units themselves in some cases.

[0103] According to one aspect of the embodiments of this application, a computer system is further provided, including a central processing unit (CPU), which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) or the program loaded from the storage section into the random access memory (RAM), such as performing the methods in the above embodiments. In the RAM, various programs and data required for system operations are also stored. The CPU, ROM, and RAM are connected to each other via a bus. The input / output (I / O) interface is also connected to the bus.

[0104] The following components are connected to the I / O interface: an input section including a keyboard, a mouse, etc.; an output section including a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc.; a storage section including a hard disk, etc.; and a communication section including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section performs communication processing via a network such as the Internet. A drive is also connected to the I / O interface as required. Removable media, such as magnetic disks, optical disks, magneto-optical disks, semiconductor memories, etc., are installed on the drive as required so that the computer programs read from them can be installed into the storage section as required.

[0105] The above content is only a preferred exemplary embodiment of this application and is not used to limit the implementation of this application. Those of ordinary skill in the art can make corresponding adaptations or modifications very conveniently according to the main concept and spirit of this application. Therefore, the protection scope of this application should be subject to the protection scope required by the claims.

Claims

1. A line fault identification method, characterized in that: The line body is provided with a plurality of workstations, and the method comprises: Obtaining the target state of the weld point information corresponding to the weld point with quality failure; wherein the target state of the weld point information includes the weld point position and the quality failure type; the weld point with quality failure is a weld point with abnormal quality; obtaining the weld point corresponding to the target station according to the weld point position, and detecting whether the number of weld points corresponding to the same quality failure type of the target station is greater than a preset number; If the number of weld spots corresponding to the same quality fault type of the target station is greater than a preset number, the target station is determined to be abnormal, so as to determine that the target line where the target station is located is abnormal.

2. The method according to claim 1, characterized in that The welding point information also includes welding point failure duration. After the step of obtaining the welding point corresponding to the target workstation according to the welding point information, the method further includes: Calculating the workstation failure duration of the target workstation according to the welding points corresponding to the target workstation and the welding point failure duration corresponding to the welding points; According to each target workstation provided in the target line body and the workstation failure duration corresponding to each target workstation, the line body failure duration of the target line body is calculated; Detect whether the line body fault duration is greater than a preset duration, and determine whether the target line body is abnormal based on the detection result.

3. The method according to claim 1, characterized in that The step of obtaining the target state of the solder joint information corresponding to the solder joint with quality failure further includes: Obtaining the initial state solder joint information corresponding to the solder joint with quality failure; Data cleaning and data formatting are performed on the solder joint information in the initial state, and the processed solder joint information in the initial state is used as the solder joint information in the target state.

4. The method according to claim 1, characterized in that The step of obtaining the welding point corresponding to the target station according to the welding point information further includes: According to the soldering point information, the workstation where the corresponding soldering point is located is obtained; wherein one soldering point corresponds to one workstation; The welding point corresponding to the target workstation is determined according to the workstation where the corresponding welding point is located; wherein one target workstation may correspond to one or more welding points.

5. The method according to claim 2, characterized in that: The step of calculating the workstation failure duration of the target workstation according to the welding points corresponding to the target workstation and the welding point failure duration corresponding to the welding points further comprises: The welding point failure durations of the welding points corresponding to the target workstation are summed up and calculated, and the sum value obtained by the summation is used as the workstation failure duration of the target workstation.

6. The method according to claim 2, characterized in that Before the step of obtaining the welding point information of the target state corresponding to the welding point with quality failure, the method further includes: Extracting features from the solder joint image, and establishing a reconstructed sample according to the extracted target features; wherein the solder joint image is an image corresponding to the collected solder joint; Calculating a difference value between the reconstructed sample and the solder joint image, and detecting whether the difference value matches a preset threshold; If the difference value does not match the preset threshold, it is determined that the solder joint in the solder joint image corresponding to the difference value has a quality failure.

7. The method according to claim 1 or 2, characterized in that: The method further comprises: If it is determined that the target wire is abnormal, generating wire fault information according to the welding point information; The line fault information is sent to a remote terminal, and a preset alarm mechanism is used to issue a line abnormality alarm.

8. A line fault identification device, characterized in that: The device comprises: An information acquisition module, used to acquire the target state solder joint information corresponding to the solder joint with quality failure; wherein the target state solder joint information includes the solder joint position and the quality failure type; A quantity detection module, used to obtain the welding points corresponding to the target station according to the welding point positions, and detect whether the number of welding points corresponding to the same quality failure type of the target station is greater than a preset number; The abnormality determination module is used to determine that the target station is abnormal if the number of weld spots corresponding to the same quality fault type of the target station is greater than a preset number, so as to determine that the target line body corresponding to the target station is abnormal.

9. A device, characterized in that: include: Controller; A memory for storing one or more programs, which, when executed by the controller, enables the controller to implement the line fault identification method described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that: The storage medium stores at least one executable instruction, and when the executable instruction is executed on the device / equipment, the device / equipment executes the operation of the line fault identification method according to any one of claims 1 to 7.

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