High and low temperature test equipment for memory bank

Abstract

The invention discloses high and low temperature test equipment for memory banks, which comprises a test module, an air duct module, a refrigeration module, a heating module, an air supply module and an electric control module, and is characterized in that a test cavity is formed in the test module, and a plurality of memory banks are inserted into the test module and are located in the test cavity; the air duct module comprises an air inlet duct and an air return duct, the air inlet duct is communicated with the air inlet of the test cavity, and the air return duct is communicated with the air outlet of the test cavity; the refrigeration module and the heating module are both arranged in the air duct module, and the air supply module is used for supplying air into the test cavity, so that the air circularly flows among the air inlet duct, the test cavity, the air return duct and the air supply module in sequence; the electric control module is electrically connected with the test module, the refrigeration module, the heating module and the air supply module at the same time. According to the invention, the performance of the memory bank can be tested in the high-low temperature environment, the low-temperature test condition is compensated, and the accuracy of the test result is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of memory module testing, and particularly relates to a high and low temperature testing device for memory modules. Background Art

[0002] In the development and production process of electronic products, memory module testing is a key link to ensure product quality and stability. Among them, temperature is one of the important factors affecting the operating performance of memory modules. Therefore, detecting the operating state of memory modules at different temperatures is an important part of memory testing.

[0003] Generally speaking, during the testing process of memory modules, the memory modules to be tested are usually inserted into the memory module slots on the main board of the testing device to simulate the actual use situation of the memory modules for testing. However, there are still many phenomena of high damage rates during the use of memory modules at present. This is because there is no corresponding supporting detection equipment for memory modules. The existing memory module temperature testing equipment can only achieve some simple high-temperature tests, and the accuracy of the test results is low, resulting in poor product quality and unstable performance. Summary of the Invention

[0004] In view of the deficiencies of the prior art, the present invention provides a high and low temperature testing device for memory modules, which can realize the performance testing of memory modules in high and low temperature environments, make up for the low-temperature testing conditions, and ensure the accuracy of the test results.

[0005] The present invention is realized through the following technical solutions:

[0006] A high and low temperature testing device for memory modules, including a support frame, on which are provided:

[0007] A test module, a test cavity is formed in the test module, and a plurality of memory modules are plugged on the test module and located in the test cavity;

[0008] An air duct module, including an air inlet duct and an air return duct, the air inlet duct is communicated with the air inlet of the test cavity, and the air return duct is communicated with the air outlet of the test cavity;

[0009] A refrigeration module, the refrigeration module is arranged in the air duct module for reducing the air temperature in the air duct module;

[0010] A heating module, the heating module is arranged in the air duct module for raising the air temperature in the air duct module;

[0011] A air supply module, the air supply module is arranged in the air duct module for sending air into the test cavity so that the air circulates in turn between the air inlet duct, the test cavity, the air return duct and the air supply module;

[0012] An electronic control module, which is electrically connected to the test module, the refrigeration module, the heating module and the air supply module at the same time.

[0013] Furthermore, it further includes a cabin body, which is communicated with the return air duct and the air supply module at the same time. The refrigeration module includes a compressor and an evaporator connected to the compressor. The heating module includes a heating sheet connected to the electronic control module. Both the evaporator and the heating sheet are arranged in the cabin body.

[0014] Furthermore, the test module, the air inlet duct, the return air duct, the air supply module and the cabin body are arranged on the same horizontal plane. And the compressor is arranged below the test module, and the electronic control module is arranged adjacent to the test module.

[0015] Furthermore, the air inlet duct and the return air duct are symmetrically arranged on the front and rear sides of the test module. The cabin body and the air supply module are both located on the right side of the test module. And the test module, the air inlet duct, the return air duct, the air supply module and the cabin body form a square shape.

[0016] Furthermore, a number of branch ducts communicating with the test cavity are connected to both the air inlet duct and the return air duct. Flow equalizing plates are arranged in the branch ducts.

[0017] Furthermore, the test module includes a test box upper cover, a test box body, a main board support plate and a test main board. The main board support plate is fixed on the opening edge of the test box body. The test main board is fixed on the side of the main board support plate facing the test box upper cover. The memory module is plugged into the slot of the test main board. A sealing strip is fixed on the opening edge of the test box upper cover. The main board support plate abuts against the sealing strip, and a test cavity is formed between the main board support plate and the test box upper cover.

[0018] Furthermore, the test module further includes a tray for supporting the test box body. The tray is located below the test box upper cover. And a pair of guide rails are arranged inside the tray. The two sides of the test box body are respectively fixedly connected to a pair of the guide rails, so that the test box body can reciprocally slide along the axial direction of the guide rails.

[0019] Furthermore, the test module further includes an electric push rod, which is fixedly connected to the tray and is used to drive the tray to perform a lifting movement so as to drive the test box body to perform a lifting movement.

[0020] Further, the test module further includes a main board CPU, a heat sink, and a plurality of cooling fans. The main board CPU is fixed on the side of the test main board facing away from the upper cover of the test box. The heat sink is attached to the main board CPU and is located in the cavity of the test box body. The cavity and the test cavity are respectively located on both sides of the main board support plate. A plurality of the cooling fans are respectively fixed on two opposite side walls of the test box body to discharge the heat in the cavity.

[0021] Further, the upper cover of the test box includes an upper cover body and a door panel hinged to the upper cover body. A window made of a transparent material is provided on the door panel. A sensor for detecting the opening and closing of the door panel is further provided on the upper cover of the test box. An air inlet regulating valve is provided in the air inlet duct, and an air return regulating valve is provided in the air return duct. The sensor, the air inlet regulating valve, and the air return regulating valve are all electrically connected to the electric control module.

[0022] Compared with the prior art, the advantages of the present invention are as follows:

[0023] 1. By providing a refrigeration module and a heating module, the high and low temperature test equipment can meet the tests of memory modules in high temperature environments and low temperature environments, and can test under the condition of minus 10 °C, ensuring that the environmental temperature deviation during the test of the memory module is within ±4 °C, making up for the low temperature test conditions and ensuring the accuracy of the test results.

[0024] 2. By arranging the test module, the air inlet duct, the air return duct, the air supply module, and the cabin body on the same horizontal plane, and arranging the compressor below the test module and the electric control module adjacent to the test module, the purpose of such arrangement is to make the structure of the high and low temperature test equipment more compact.

[0025] 3. By attaching a heat sink to the main board CPU and simultaneously cooperating with a plurality of cooling fans to discharge the internal hot air, the heat dissipation effect of the main board CPU is greatly improved.

[0026] 4. The test main board is fixed on the side of the main board support plate facing the upper cover of the test box, and the main board CPU is fixed on the side of the test main board facing away from the upper cover of the test box. The test cavity and the main board CPU are respectively located on opposite sides of the main board support plate, ensuring that the heat dissipation of the main board CPU does not affect the test of the memory module.

[0027] 5. By providing a sealing strip between the upper cover of the test box and the test box body, the sealing performance of the test cavity is better.

[0028] 6. By providing an electric push rod, it is ensured that the upper cover of the test box and the test box body are in a stable abutting state, and the sealing performance of the test cavity is better in cooperation with the sealing strip.

[0029] 7. By setting up the air inlet duct and the air return duct, the air can circulate. Meanwhile, with the air inlet regulating valve and the air return regulating valve, the air flow can be opened or closed at any time, which is convenient to use.

[0030] 8. By setting up the flow equalizing plate, the air can flow into the test cavity evenly, ensuring the uniformity of the stable environment of the memory module. Description of the Drawings

[0031] Figure 1 It is a partial structural schematic diagram of the high and low temperature test equipment;

[0032] Figure 2 It is a sectional view of the high and low temperature test equipment;

[0033] Figure 3 It is a partial structural explosion diagram of the test module;

[0034] Figure 4 It is an overall structural schematic diagram of the high and low temperature test equipment.

[0035] 100. Support frame; 200. Test module; 201. Test cavity; 210. Upper cover of the test box; 211. Upper cover body; 212. Door panel; 2120. Door and window; 213. Sensor; 214. Air inlet regulating valve; 215. Air return regulating valve; 220. Test box body; 221. Box cavity; 230. Main board support plate; 231. Main board power supply; 232. Main board cover plate; 233. Avoidance hole; 240. Test main board; 250. Sealing strip; 260. Tray; 270. Guide rail; 280. Electric push rod; 290. Main board CPU; 291. Heat sink; 292. Cooling fan; 300. Air duct module; 310. Air inlet duct; 320. Air return duct; 330. Branch air duct; 340. Flow equalizing plate; 400. Air supply module; 500. Electric control module; 510. Acousto-optic alarm lamp; 520. Host computer; 530. Touch screen; 540. Emergency stop button; 550. Equipment control button; 600. Cabin; 700. Memory module. Detailed Embodiments

[0036] The technical solution of the invention will be further described in detail below in conjunction with the preferred embodiments and their accompanying drawings in a non-limiting manner. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise specifically defined. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as a limitation of the present invention.

[0037] As Figures 1-4As shown in the figure, a high and low temperature testing device for memory modules according to an embodiment of the present invention includes a support frame 100. A testing module 200, an air duct module 300, a refrigeration module, a heating module, a air supply module 400 and an electric control module 500 are arranged on the support frame 100. A testing cavity 201 is formed in the testing module 200. A plurality of memory modules 700 are plugged on the testing module 200 and located in the testing cavity 201. The air duct module 300 includes an air inlet duct 310 and an air return duct 320. The air inlet duct 310 is communicated with the air inlet of the testing cavity 201, and the air return duct 320 is communicated with the air outlet of the testing cavity 201. The refrigeration module is arranged in the air duct module 300 to reduce the air temperature in the air duct module 300, and the heating module is arranged in the air duct module 300 to increase the air temperature in the air duct module 300. The air supply module 400 is arranged in the air duct module 300 to send air into the testing cavity 201, so that the air circulates in turn between the air inlet duct 310, the testing cavity 201, the air return duct 320 and the air supply module 400. The electric control module 500 is electrically connected to the testing module 200, the refrigeration module, the heating module and the air supply module 400 at the same time. During operation, the refrigeration module or the heating module is controlled by the electric control module 500, and the air with cold and heat is sent into the testing cavity 201 of the testing module 200 through the air inlet duct 310, so as to ensure that the memory modules 700 in the testing cavity 201 are tested in a preset temperature environment, and return to the air duct module 300 through the air return duct 320, thus forming a closed-loop air duct system. By setting the refrigeration module and the heating module, the high and low temperature testing device can meet the testing of the memory modules 700 in high temperature environment and low temperature environment, can test the condition of minus 10 °C, ensure that the environmental temperature deviation of the memory modules 700 during the testing is within ±4 °C, make up for the low temperature testing conditions, and ensure the accuracy of the test results.

[0038] As Figure 2 shown, the high and low temperature testing device further includes a cabin 600. The cabin 600 is communicated with the air return duct 320 and the air supply module 400 at the same time. The refrigeration module includes a compressor and an evaporator connected to the compressor. The heating module includes a heating sheet connected to the electric control module 500. The evaporator and the heating sheet are both arranged in the cabin 600. The air coming out of the air return duct 320 returns to the cabin 600 again and returns to the air duct module 300 from the cabin 600.

[0039] In this embodiment, the testing module 200, the air inlet duct 310, the air return duct 320, the air supply module 400 and the cabin 600 are arranged on the same horizontal plane, and the compressor is arranged below the testing module 200, and the electric control module 500 is arranged adjacent to the testing module 200. Such an arrangement can make the structure of the high and low temperature testing device more compact.

[0040] To further optimize the structural layout, referring to Figure 1 , the air inlet duct 310 and the air return duct 320 are symmetrically arranged on the front and rear sides of the test module 200. The cabin body 600 and the air supply module 400 are both located on the right side of the test module 200, and the test module 200, the air inlet duct 310, the air return duct 320, the air supply module 400 and the cabin body 600 form a square shape.

[0041] As Figure 2 shown, a plurality of branch ducts 330 communicating with the test cavity 201 are connected to both the air inlet duct 310 and the air return duct 320. In this embodiment, the test cavity 201 includes four independent memory module test areas. It can be understood that one end of each memory module test area is connected to a branch duct 330 respectively. In addition, a flow equalizing plate 340 is arranged in the branch duct 330. By arranging the flow equalizing plate 340, air can flow into the test cavity 201 evenly, ensuring the uniformity of air flow in the memory module test environment.

[0042] As Figure 2 and Figure 3 shown, the test module 200 includes a test box upper cover 210, a test box body 220, a main board support plate 230 and a test main board 240. The main board support plate 230 is fixed on the opening edge of the test box body 220. The test main board 240 is fixed on the side of the main board support plate 230 facing the test box upper cover 210. The memory module 700 is inserted into the slot of the test main board 240. A sealing strip 250 is fixed on the opening edge of the test box upper cover 210. The main board support plate 230 abuts against the sealing strip 250, and a test cavity 201 is formed between the main board support plate 230 and the test box upper cover 210. By arranging the sealing strip 250, the sealing performance of the test cavity 201 is better.

[0043] In addition, a main board power supply 231 and a main board cover plate 232 are also arranged on the main board support plate 230. The main board power supply 231 supplies power to the test main board 240. The main board cover plate 232 covers the test main board 240, and an avoidance hole 233 for avoiding the slot on the test main board 240 is opened on the main board cover plate 232. A sealing member (not shown in the figure) is arranged in the avoidance hole 233, and the sealing member is wrapped around the periphery of the slot. Among them, both the main board support plate 230 and the main board cover plate 232 are made of static electricity-proof bakelite material to ensure the stable operation of the test main board 240.

[0044] As Figure 2As shown in the figure, the test module 200 further includes a tray 260 for supporting the test box body 220 and an electric push rod 280. The tray 260 is located below the upper cover 210 of the test box, and a pair of guide rails 270 are arranged inside the tray 260. The two sides of the test box body 220 are respectively fixedly connected to the pair of guide rails 270, so that the test box body 220 can reciprocally slide along the axial direction of the guide rails 270. The electric push rod 280 is fixedly connected to the tray 260 and is used to drive the tray 260 to move up and down, thereby driving the test box body 220 to move up and down. During use, the test box body 220 is placed on the tray 260, and the test box body 220 is pushed under the upper cover 210 of the test box through the guide rails 270 on the tray 260. At this time, the electric push rod 280 extends and drives the tray 260 to rise. Relying on the electric push rod 280, the test box body 220 on the tray 260 is lifted to a preset position. At this time, the upper cover 210 of the test box is in direct contact with the test box body 220, and the main board support plate 230 on the test box body 220 is attached to the upper cover 210 of the test box through the sealing strip 250, forming a sealed test cavity 201. By setting the electric push rod 280, it is ensured that the upper cover 210 of the test box and the test box body 220 are in a stable contact state, and the sealing strip 250 is used to make the sealing performance of the test cavity 201 better.

[0045] As Figure 3 shown in the figure, the test module 200 further includes a main board CPU 290, a heat sink 291 and a plurality of cooling fans 292. The main board CPU 290 is fixed on the side of the test main board 240 facing away from the upper cover 210 of the test box, ensuring that the heat dissipation of the main board CPU 290 will not affect the test of the memory module 700. The heat sink 291 is attached to the main board CPU 290 and is located in the cavity 221 of the test box body 220. The cavity 221 and the test cavity 201 are respectively located on both sides of the main board support plate 230. The plurality of cooling fans 292 are respectively fixed on two opposite side walls of the test box body 220 for exhausting the heat in the cavity 221, and the air volume of the cooling fans 292 is adjustable. By attaching the heat sink 291 to the main board CPU 290 and simultaneously cooperating with the plurality of cooling fans 292 to exhaust the hot air inside, the heat dissipation effect of the main board CPU 290 is greatly improved. In addition, the test main board 240 is fixed on the side of the main board support plate 230 facing the upper cover 210 of the test box, and the main board CPU 290 is fixed on the side of the test main board 240 facing away from the upper cover 210 of the test box. The test cavity 201 and the main board CPU 290 are respectively located on opposite sides of the main board support plate 230, ensuring that the heat dissipation of the main board CPU 290 will not affect the test of the memory module 700.

[0046] The upper cover 210 of the test box includes an upper cover body 211 and a door panel 212 hinged to the upper cover body 211, which is convenient for manual opening when replacing the next batch of memory modules 700 after the test is completed. A window 2120 made of transparent material is provided on the door panel 212 to facilitate observing the test situation of the memory module 700 in the test cavity 201 from the outside. A sensor 213 for detecting the opening and closing of the door panel 212 is also provided on the upper cover 210 of the test box. An inlet air regulating valve 214 is provided in the inlet air duct 310, and an outlet air regulating valve 215 is provided in the return air duct 320. The sensor 213, the inlet air regulating valve 214, and the outlet air regulating valve 215 are all electrically connected to the electronic control module 500. When the door panel 212 is opened, the electronic control module 500 controls the inlet air regulating valve 214 and the outlet air regulating valve 215 to close. By providing the inlet air duct 310 and the return air duct 320, air can circulate, and by cooperating with the inlet air regulating valve 214 and the outlet air regulating valve 215, the air flow can be opened or closed at any time, which is convenient to use.

[0047] In addition, referring to Figure 4 , other components such as an audible and visual alarm lamp 510, a host computer 520, a touch screen 530, an emergency stop button 540, and a device control button 550, which are electrically connected to the electronic control module 500, are also provided on the high and low temperature test equipment. Among them, the audible and visual alarm lamp 510, the host computer 520, the touch screen 530, the emergency stop button 540, and the device control button 550 are all integrated on the housing of the electronic control module 500, with a compact structure and saving the floor area of the equipment.

[0048] The above-described embodiments merely represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A high and low temperature testing device for memory sticks, characterized in that: The invention comprises a supporting frame (100), on which is arranged: A test module (200), wherein a test cavity (201) is formed in the test module (200), and a plurality of memory sticks (700) are plugged into the test module (200) and are located in the test cavity (201); An air duct module (300), comprising an air inlet duct (310) and an air return duct (320), wherein the air inlet duct (310) is communicated with an air inlet of the test cavity (201), and the air return duct (320) is communicated with an air outlet of the test cavity (201); a refrigeration module, the refrigeration module being arranged in the air duct module (300) and being used to reduce the air temperature in the air duct module (300); A heating module, the heating module being arranged in the air duct module (300); Used to increase the air temperature in the air duct module (300); an air supply module (400), the air supply module (400) being arranged in the air duct module (300) and being used for supplying air into the test cavity (201), so that the air circulates in sequence between the air inlet duct (310), the test cavity (201), the air return duct (320) and the air supply module (400); An electric control module (500), wherein the electric control module (500) is electrically connected to the test module (200), the cooling module, the heating module and the air supply module (400) at the same time.

2. The high and low temperature testing device for memory sticks according to claim 1, characterized in that: It also includes a cabin (600), which is connected to the return air duct (320) and the air supply module (400) at the same time. The refrigeration module includes a compressor and an evaporator connected to the compressor. The heating module includes a heating plate connected to the electric control module (500), and the evaporator and the heating plate are both arranged in the cabin (600).

3. The high and low temperature testing device for memory sticks according to claim 2, characterized in that: The test module (200), the air inlet duct (310), the air return duct (320), the air supply module (400) and the cabin (600) are arranged on the same horizontal plane, and the compressor is arranged below the test module (200), and the electric control module (500) is arranged adjacent to the test module (200).

4. The high and low temperature testing device for memory sticks according to claim 3, characterized in that: The air inlet duct (310) and the air return duct (320) are symmetrically arranged on the front and rear sides of the test module (200); the cabin (600) and the air supply module (400) are both located on the right side of the test module (200); and the test module (200), the air inlet duct (310), the air return duct (320), the air supply module (400) and the cabin (600) form a square shape.

5. The high and low temperature testing device for memory sticks according to claim 2, characterized in that: The air inlet duct (310) and the air return duct (320) are both connected to a plurality of branch ducts (330) connected to the test cavity (201), and a flow equalizing plate (340) is arranged in the branch duct (330).

6. The high and low temperature testing device for memory sticks according to claim 1, characterized in that: The test module (200) comprises a test box upper cover (210), a test box body (220), a mainboard support plate (230) and a test mainboard (240); the mainboard support plate (230) is fixed on the opening edge of the test box body (220); the test mainboard (240) is fixed on the side of the mainboard support plate (230) facing the test box upper cover (210); the memory bar (700) is plugged into the slot of the test mainboard (240); a sealing strip (250) is fixed on the opening edge of the test box upper cover (210); the mainboard support plate (230) abuts against the sealing strip (250); and the test cavity (201) is formed between the mainboard support plate (230) and the test box upper cover (210).

7. The high and low temperature testing device for memory sticks according to claim 6, characterized in that: The test module (200) further comprises a tray (260) for supporting the test box body (220); the tray (260) is located below the test box upper cover (210); a pair of guide rails (270) are arranged on the inner side of the tray (260); two sides of the test box body (220) are respectively fixedly connected to the pair of guide rails (270), so that the test box body (220) can slide back and forth along the axial direction of the guide rails (270).

8. The high and low temperature testing device for memory sticks according to claim 7, characterized in that: The test module (200) further comprises an electric push rod (280), wherein the electric push rod (280) is fixedly connected to the tray (260) and is used to drive the tray (260) to perform lifting movement and thereby drive the test box body (220) to perform lifting movement.

9. The high and low temperature testing device for memory sticks according to claim 6, characterized in that: The test module (200) further comprises a mainboard CPU (290), a heat sink (291) and a plurality of heat dissipation fans (292); the mainboard CPU (290) is fixed on a side of the test mainboard (240) away from the test box upper cover (210); the heat sink (291) is fitted with the mainboard CPU (290) and is located in a box cavity (221) of the test box body (220); the box cavity (221) and the test cavity (201) are respectively located on two sides of the mainboard support plate (230); and the plurality of heat dissipation fans (292) are respectively fixed on two opposite side walls of the test box body (220) for discharging heat in the box cavity (221).

10. The high and low temperature testing device for memory sticks according to claim 6, characterized in that: The test box upper cover (210) comprises an upper cover body (211) and a door panel (212) hinged to the upper cover body (211); a door window (2120) made of a transparent material is arranged on the door panel (212); a sensor (213) for detecting the opening and closing of the door panel (212) is also arranged on the test box upper cover (210); an air inlet regulating valve (214) is arranged in the air inlet duct (310); a return air regulating valve (215) is arranged in the return air duct (320); and the sensor (213), the air inlet regulating valve (214) and the return air regulating valve (215) are all electrically connected to the electric control module (500).

Images