High and low temperature test equipment for memory bank

Abstract

The invention discloses high and low temperature test equipment for memory banks, which comprises a plurality of test modules arranged side by side, an air duct module, a refrigeration module, a heating module, an air supply module and an electric control module, and is characterized in that a test cavity is formed in each test module, and a plurality of memory banks are inserted into the test cavities; the air duct module comprises an air inlet duct and an air return duct, the air inlet duct is communicated with the air inlet of the test cavity, and the air return duct is communicated with the air outlet of the test cavity; the refrigeration module and the heating module are both arranged in the air duct module, and the air supply module is used for supplying air into the test cavity, so that the air circularly flows among the air inlet duct, the test cavity, the air return duct and the air supply module in sequence; the electric control module is electrically connected with the test module, the refrigeration module, the heating module and the air supply module at the same time. According to the invention, the performance of the memory bank can be tested in a high and low temperature environment, the low temperature test condition is made up, the accuracy of the test result is ensured, and the test efficiency is greatly improved at the same time.

Description

Technical Field

[0001] The present invention relates to the technical field of memory module testing, and particularly to a high and low temperature testing device for memory modules. Background Art

[0002] In the development and production process of electronic products, memory module testing is a key link to ensure product quality and stability. Among them, temperature is one of the important factors affecting the operating performance of memory modules. Therefore, detecting the operating state of memory modules at different temperatures is an important part of memory testing.

[0003] Generally speaking, during the testing process of memory modules, the memory modules to be tested are usually inserted into the memory module slots on the main board of the testing device to simulate the actual use situation of the memory modules for testing. However, there are still many cases where the damage rate of memory modules is relatively high during use. This is because there is no corresponding supporting detection equipment for memory modules. The existing memory module temperature testing equipment can only achieve some simple high temperature tests, and the accuracy of the test results is low, resulting in poor product quality and unstable performance. In addition, the existing memory module temperature testing equipment can only test a single memory module, resulting in low testing efficiency. Summary of the Invention

[0004] Aiming at the deficiencies of the prior art, the present invention provides a high and low temperature testing device for memory modules. It can realize the performance testing of memory modules in high and low temperature environments, make up for the low temperature testing conditions, ensure the accuracy of test results, and at the same time can test multiple groups of memory modules simultaneously, greatly improving the testing efficiency.

[0005] The present invention is realized through the following technical solutions:

[0006] A high and low temperature testing device for memory modules, including a support frame, on which are provided:

[0007] A plurality of test modules, the plurality of test modules are arranged in sequence along a first direction, and a test cavity is formed in the test module. A plurality of the memory modules are plugged into the test module and located in the test cavity;

[0008] The air duct module includes an air inlet duct and an air return duct. The air inlet duct is communicated with the air inlet of the test cavity, and the air return duct is communicated with the air outlet of the test cavity. Among them, the air inlet duct includes an air inlet main duct and a plurality of air inlet branch ducts communicated with the air inlet main duct. The axial direction of the air inlet main duct is consistent with the first direction. The plurality of air inlet branch ducts are arranged in sequence along the first direction, and the plurality of air inlet branch ducts are communicated with the plurality of test modules in one-to-one correspondence. The air return duct includes an air return main duct and a plurality of air return branch ducts communicated with the air return main duct. The plurality of air return branch ducts are arranged in sequence along the first direction, and the plurality of air return branch ducts are communicated with the plurality of test modules in one-to-one correspondence.

[0009] The refrigeration module is arranged in the air duct module and is used to lower the air temperature in the air duct module.

[0010] The heating module is arranged in the air duct module and is used to raise the air temperature in the air duct module.

[0011] The air supply module is arranged in the air duct module and is used to send air into the test cavity so that the air circulates sequentially among the air inlet duct, the test cavity, the air return duct and the air supply module.

[0012] The electric control module is electrically connected to the test module, the refrigeration module, the heating module and the air supply module at the same time.

[0013] Furthermore, the air inlet branch duct is L-shaped and includes a first air inlet pipe section and a second air inlet pipe section which are communicated with each other. The first air inlet pipe section is arranged horizontally and is vertically communicated with the air inlet main duct. The second air inlet pipe section is communicated with the test cavity, and the axial direction of the second air inlet pipe section is consistent with the first direction. An air inlet control valve is arranged on the first air inlet pipe section.

[0014] The air return branch duct is L-shaped and includes a first air return pipe section and a second air return pipe section which are communicated with each other. The first air return pipe section is communicated with the test cavity, and the axial direction of the first air return pipe section is consistent with the first direction. The second air return pipe section is arranged vertically and is vertically communicated with the air return main duct.

[0015] Further, it further includes a cabin body which is simultaneously communicated with the return air duct and the air supply module. The refrigeration module includes a compressor and an evaporator connected to the compressor. The heating module includes a heating sheet connected to the electric control module. The evaporator and the heating sheet are both arranged in the cabin body. Moreover, the test module, the air inlet duct, the first return air pipe section, the air supply module and the cabin body are arranged on the same horizontal plane. The main return air duct is located below the test module, and the compressor is arranged below the main return air duct. The electric control module is arranged adjacent to the test module.

[0016] Further, a plurality of first branch air ducts communicated with the test cavity are connected to the second air inlet pipe section, and a plurality of second branch air ducts communicated with the test cavity are connected to the first return air pipe section. Flow equalizing plates are arranged in the first branch air duct and the second branch air duct, and an air inlet regulating valve connected to the electric control module is arranged in the first branch air duct.

[0017] Further, the main return air duct includes a first main pipe, a second main pipe and a third main pipe which are sequentially connected. The first main pipe and the second main pipe are arranged horizontally, and the axial direction of the first main pipe is the same as the first direction. The second main pipe is perpendicular to the first main pipe. The third main pipe is arranged vertically and is perpendicularly communicated with the second main pipe. The third main pipe is communicated with the cabin body.

[0018] Further, the test module includes a test box upper cover, a test box body, a main board support plate and a test main board. The main board support plate is fixed on the opening edge of the test box body. The test main board is fixed on one side of the main board support plate facing the test box upper cover. The memory module is inserted into the slot of the test main board. A sealing strip is fixed on the opening edge of the test box upper cover. The main board support plate abuts against the sealing strip, and a test cavity is formed between the main board support plate and the test box upper cover.

[0019] Further, the test module further includes a tray for supporting the test box body. The tray is located below the test box upper cover, and a pair of guide rails are arranged on the inner side of the tray. The two sides of the test box body are respectively fixedly connected with the pair of guide rails, so that the test box body can reciprocally slide along the axial direction of the guide rails.

[0020] Further, the test module further includes an electric push rod. The electric push rod is fixedly connected with the tray and is used for driving the tray to perform lifting movement so as to drive the test box body to perform lifting movement.

[0021] Further, the test module further includes a main board CPU, a heat sink, and a plurality of cooling fans. The main board CPU is fixed on the side of the test main board facing away from the upper cover of the test box. The heat sink is attached to the main board CPU and is located in the cavity of the test box body. The cavity and the test cavity are respectively located on both sides of the main board support plate. A plurality of the cooling fans are respectively fixed on two opposite side walls of the test box body for exhausting the heat in the cavity.

[0022] Further, the upper cover of the test box includes an upper cover body and a door panel hinged to the upper cover body. A window made of a transparent material is provided on the door panel. A sensor for detecting the opening and closing of the door panel is further provided on the upper cover of the test box. Both the sensor and the air inlet control valve are electrically connected to the electric control module.

[0023] Compared with the prior art, the advantages of the present invention are as follows:

[0024] 1. By setting a refrigeration module and a heating module, the high and low temperature test equipment can meet the test of memory modules in high temperature and low temperature environments, and can test under the condition of -10°C, ensuring that the environmental temperature deviation during the test of the memory module is within ±4°C, making up for the low temperature test conditions and ensuring the accuracy of the test results.

[0025] 2. By setting a plurality of test modules and running them in parallel, the test efficiency is greatly improved.

[0026] 3. By optimizing the shapes, layouts, and directions of the air inlet duct and the air return duct, as well as the layout between the air inlet duct, the air return duct, the test module, the air supply module, and the cabin body, the overall structure of the equipment is made more compact.

[0027] 4. By setting an air inlet regulating valve on each first branch duct, the air volume adjustment of the four memory module test areas in each test module can be independently controlled by setting the air inlet regulating valve.

[0028] 5. By setting an air inlet control valve on each branch, each test module can operate independently without interference, which is convenient to use.

[0029] 6. By attaching a heat sink to the main board CPU and simultaneously matching a plurality of cooling fans to exhaust the internal hot air, the heat dissipation effect of the main board CPU is greatly improved.

[0030] 7. The test main board is fixed on the side of the main board support plate facing the upper cover of the test box, and the main board CPU is fixed on the side of the test main board facing away from the upper cover of the test box. The test cavity and the main board CPU are respectively located on opposite sides of the main board support plate, ensuring that the heat dissipation of the main board CPU will not affect the test of the memory module.

[0031] 8. By setting a sealing strip between the upper cover of the test box and the test box body, the sealing performance of the test cavity is better.

[0032] 9. By setting an electric push rod, it is ensured that the upper cover of the test box and the test box body are in a stable abutting state, and with the cooperation of the sealing strip, the sealing performance of the test cavity is better.

[0033] 10. By setting a flow equalizing plate, air can flow into the test cavity evenly, ensuring the uniformity of the stable environment of the memory module. Description of the Drawings

[0034] Figure 1 It is a partial structural schematic diagram of a high and low temperature test equipment;

[0035] Figure 2 It is a sectional view of a high and low temperature test equipment;

[0036] Figure 3 It is a partial structural explosion diagram of a test module;

[0037] Figure 4 It is an overall structural schematic diagram of a high and low temperature test equipment.

[0038] 100. Support frame; 200. Test module; 201. Test cavity; 210. Upper cover of the test box; 211. Upper cover body; 212. Door panel; 2120. Door and window; 213. Sensor; 220. Test box body; 221. Box cavity; 230. Motherboard support plate; 231. Motherboard power supply; 232. Motherboard cover plate; 233. Avoidance hole; 240. Test motherboard; 250. Sealing strip; 260. Tray; 270. Guide rail; 280. Electric push rod; 290. Motherboard CPU; 291. Heat dissipation block; 292. Heat dissipation fan; 300. Air duct module; 310. Inlet air duct; 311. Inlet air main duct; 312. Inlet air branch duct; 314. First inlet air pipe section; 315. Second inlet air pipe section; 313. Inlet air control valve; 320. Return air duct; 321. Return air main duct; 325. First main pipe; 326. Second main pipe; 327. Third main pipe; 322. Return air branch duct; 323. First return air pipe section; 324. Second return air pipe section; 330. First branch air duct; 340. Flow equalizing plate; 350. Inlet air regulating valve; 400. Air supply module; 500. Electric control module; 510. Acousto-optic alarm lamp; 520. Host computer; 530. Touch screen; 540. Emergency stop button; 550. Equipment control button; 600. Cabin body; 700. Memory module. Detailed Implementation Modes

[0039] The technical solution of the invention will be further described in detail below in conjunction with the preferred embodiments and their accompanying drawings in a non-limiting manner. In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined. The embodiments described below by referring to the drawings are exemplary and are intended to explain the present invention and should not be construed as limiting the present invention.

[0040] As Figures 1 - 4As shown in the figure, a high and low temperature test device for a memory module according to an embodiment of the present invention includes a support frame 100. A plurality of test modules 200, an air duct module 300, a refrigeration module, a heating module, a air supply module 400, and an electric control module 500 are arranged on the support frame 100. The plurality of test modules 200 are arranged in sequence along a first direction, and a test cavity 201 is formed in the test module 200. A plurality of memory modules 700 are inserted on the test module 200 and are located in the test cavity 201; the air duct module 300 includes an air inlet duct 310 and an air return duct 320. The air inlet duct 310 is communicated with the air inlet of the test cavity 201, and the air return duct 320 is communicated with the air outlet of the test cavity 201; the refrigeration module is arranged in the air duct module 300 to reduce the air temperature in the air duct module 300; the heating module is arranged in the air duct module 300 to increase the air temperature in the air duct module 300. The air supply module 400 is arranged in the air duct module 300 and is used to send air into the test cavity 201 so that the air circulates sequentially between the air inlet duct 310, the test cavity 201, the air return duct 320, and the air supply module 400; the electric control module 500 is electrically connected to the test module 200, the refrigeration module, the heating module, and the air supply module 400 at the same time. During operation, the refrigeration module or the heating module is controlled by the electric control module 500, and the air with cold or heat is sent into the test cavity 201 of the test module 200 through the air inlet duct 310 to ensure that the memory module 700 in the test cavity 201 is tested in a preset temperature environment, and is returned to the air duct module 300 through the air return duct 320, thereby forming a closed-loop air duct system. By setting the refrigeration module and the heating module, the high and low temperature test device can meet the test of the memory module 700 in a high temperature environment and a low temperature environment, and can test the condition of minus 10 °C, ensuring that the environmental temperature deviation of the memory module 700 during the test is within ±4 °C, making up for the low temperature test condition and ensuring the accuracy of the test result. In addition, in this embodiment, by setting a plurality of test modules 200 and the plurality of test modules 200 running in parallel, the test efficiency is greatly improved.

[0041] As Figure 1As shown in the figure, the air inlet duct 310 includes an air inlet main duct 311 and a plurality of air inlet branch ducts 312 communicating with the air inlet main duct 311. The axial direction of the air inlet main duct 311 is consistent with the first direction. The plurality of air inlet branch ducts 312 are arranged in sequence along the first direction, and the plurality of air inlet branch ducts 312 are in one-to-one correspondence and communication with the plurality of test modules 200. The air return duct 320 includes an air return main duct 321 and a plurality of air return branch ducts 322 communicating with the air return main duct 321. The plurality of air return branch ducts 322 are arranged in sequence along the first direction, and the plurality of air return branch ducts 322 are in one-to-one correspondence and communication with the plurality of test modules 200. The structure is compact, and the parallel operation of the plurality of test modules 200 improves the test efficiency. In this embodiment, four test modules 200 are provided, and the four test modules 200 are arranged in sequence along the first direction.

[0042] Both the air inlet branch duct 312 and the air return branch duct 322 are in an L-shaped structure. The air inlet branch duct 312 includes a first air inlet pipe section 314 and a second air inlet pipe section 315 that are connected to each other. The first air inlet pipe section 314 is arranged in the horizontal direction and is vertically connected to the air inlet main duct 311. The second air inlet pipe section 315 is connected to the test cavity 201, and the axial direction of the second air inlet pipe section 315 is consistent with the first direction. An air inlet control valve 313 is provided on the first air inlet pipe section 314. The air return branch duct 322 includes a first air return pipe section 323 and a second air return pipe section 324 that are connected to each other. The first air return pipe section 323 is connected to the test cavity 201, and the axial direction of the first air return pipe section 323 is consistent with the first direction. The second air return pipe section 324 is arranged in the vertical direction and is vertically connected to the air return main duct 321. By optimizing the shapes and layout directions of the air inlet branch duct 312 and the air return branch duct 322, the whole device is made more compact.

[0043] The high and low temperature test equipment further includes a cabin 600. The cabin 600 is simultaneously connected to the air return duct 320 and the air supply module 400. The refrigeration module includes a compressor and an evaporator connected to the compressor. The heating module includes a heating sheet connected to the electric control module 500. The evaporator and the heating sheet are both arranged in the cabin 600. The test module 200, the air inlet duct 310, the first air return pipe section 323, the air supply module 400, and the cabin 600 are arranged on the same horizontal plane. The air return main duct 321 is located below the test module 200, and the compressor is arranged below the air return main duct 321. The electric control module 500 is adjacent to the test module 200. By optimizing the position of the air return main duct 321 and the layout among the test module 200, the air inlet duct 310, the first air return pipe section 323, the air supply module 400, and the cabin 600, the overall structure of the equipment is made more compact.

[0044] A plurality of first branch air ducts 330 communicating with the test cavity 201 are connected to the second air inlet pipe section 315. A plurality of second branch air ducts communicating with the test cavity 201 are connected to the first air return pipe section 323. The first branch air ducts 330 and the second branch air ducts are respectively located on both sides of the test cavity 201. In this embodiment, the test cavity 201 includes four independent memory module test areas. It can be understood that one first branch air duct 330 and one second branch air duct are respectively connected to both ends of each memory module test area. In addition, flow equalizing plates 340 are arranged in the first branch air ducts 330 and the second branch air ducts, which can make air flow evenly into the corresponding memory module test areas in the test cavity 201, ensuring the uniformity of air flow in the memory module test environment.

[0045] In addition, an air inlet regulating valve 350 connected to the electric control module 500 is also arranged in the first branch air duct 330. In this embodiment, each second air inlet pipe section 315 is connected to four first branch air ducts 330 communicating with the test cavity 201, and an air inlet regulating valve 350 is arranged on each first branch air duct 330. By setting the air inlet regulating valve 350, the air volume of the four memory module test areas in each test module 200 can be independently controlled.

[0046] The main air return duct 321 includes a first main pipe 325, a second main pipe 326, and a third main pipe 327 connected in sequence. The first main pipe 325 and the second main pipe 326 are arranged horizontally, and the axial direction of the first main pipe 325 is the same as the first direction. The second main pipe 326 is perpendicular to the first main pipe 325. The third main pipe 327 is arranged vertically and is perpendicularly communicated with the second main pipe 326. The third main pipe 327 is communicated with the cabin body 600. By optimizing the specific structure and orientation of the main air return duct 321, the overall structure of the equipment is made more compact.

[0047] As Figure 2 and Figure 3 shown, the test module 200 includes a test box upper cover 210, a test box body 220, a main board support plate 230, and a test main board 240. The main board support plate 230 is fixed on the opening edge of the test box body 220. The test main board 240 is fixed on the side of the main board support plate 230 facing the test box upper cover 210. The memory module 700 is inserted into the slot of the test main board 240. A sealing strip 250 is fixed on the opening edge of the test box upper cover 210. The main board support plate 230 abuts against the sealing strip 250, and a test cavity 201 is formed between the main board support plate 230 and the test box upper cover 210. By setting the sealing strip 250, the sealing performance of the test cavity 201 is better.

[0048] In addition, a main board power supply 231 and a main board cover plate 232 are also provided on the main board carrier 230. The main board power supply 231 supplies power to the test main board 240. The main board cover plate 232 is covered on the test main board 240, and an avoidance hole 233 for avoiding the slots on the test main board 240 is provided on the main board cover plate 232. A sealing member (not shown in the figure) is provided in the avoidance hole 233, and the sealing member is wrapped around the periphery of the slot. Among them, both the main board carrier 230 and the main board cover plate 232 are made of static electricity-proof bakelite material to ensure the stable operation of the test main board 240.

[0049] The test module 200 further includes a tray 260 and an electric push rod 280 for supporting the test box body 220. The tray 260 is located below the test box upper cover 210, and a pair of guide rails 270 are provided on the inner side of the tray 260. Both sides of the test box body 220 are fixedly connected to a pair of guide rails 270 respectively, so that the test box body 220 can reciprocally slide along the axial direction of the guide rails 270. The electric push rod 280 is fixedly connected to the tray 260 and is used to drive the tray 260 to perform lifting motion and thus drive the test box body 220 to perform lifting motion. During use, the test box body 220 is placed on the tray 260, and the test box body 220 is pushed into the position below the test box upper cover 210 through the guide rails 270 on the tray 260. At this time, the electric push rod 280 extends and drives the tray 260 to rise. Relying on the electric push rod 280, the test box body 220 on the tray 260 is lifted to a preset position. At this time, the test box upper cover 210 is in direct contact with the test box body 220, and the main board carrier 230 on the test box body 220 is attached to the test box upper cover 210 through the sealing strip 250 to form a sealed test cavity 201. By setting the electric push rod 280, it is ensured that the test box upper cover 210 and the test box body 220 are in a stable contact state, and with the cooperation of the sealing strip 250, the sealing performance of the test cavity 201 is better.

[0050] The test module 200 further includes a mainboard CPU 290, a heat sink 291, and multiple cooling fans 292. The mainboard CPU 290 is fixed on the side of the test mainboard 240 facing away from the test box upper cover 210. The heat sink 291 is attached to the mainboard CPU 290 and is located in the cavity 221 of the test box body 220. The cavity 221 and the test cavity 201 are respectively located on both sides of the mainboard support plate 230. The multiple cooling fans 292 are respectively fixed on two opposite side walls of the test box body 220 to discharge the heat in the cavity 221, and the wind speed of the cooling fan 292 is adjustable. By attaching the heat sink 291 to the mainboard CPU 290 and simultaneously cooperating with the multiple cooling fans 292 to discharge the internal hot air, the heat dissipation effect of the mainboard CPU 290 is greatly improved. In addition, the test mainboard 240 is fixed on the side of the mainboard support plate 230 facing the test box upper cover 210, and the mainboard CPU 290 is fixed on the side of the test mainboard 240 facing away from the test box upper cover 210. The test cavity 201 and the mainboard CPU 290 are respectively located on opposite sides of the mainboard support plate 230, ensuring that the testing of the memory module 700 will not be affected when the mainboard CPU 290 dissipates heat.

[0051] The test box upper cover 210 includes an upper cover body 211 and a door panel 212 hinged to the upper cover body 211. A transparent window 2120 is provided on the door panel 212. A sensor 213 for detecting the opening and closing of the door panel 212 is also provided on the test box upper cover 210. Both the sensor 213 and the air inlet control valve 313 are electrically connected to the electronic control module 500. When one of the door panels 212 of the test module 200 is opened, the electronic control module 500 controls the air inlet control valve 313 of the corresponding branch to close. By providing the air inlet duct 310 and the air return duct 320, the air can circulate, and at the same time, an air inlet control valve 313 is provided for each branch, enabling each test module 200 to operate independently without interference, which is convenient to use.

[0052] In addition, referring to Figure 4 , other components such as an audible and visual alarm light 510, a host computer 520, a touch screen 530, an emergency stop button 540, and a device control button 550 that are electrically connected to the electronic control module 500 are also provided on the high and low temperature test equipment. Among them, the audible and visual alarm light 510, the host computer 520, the touch screen 530, the emergency stop button 540, and the device control button 550 are all integrated on the cabinet of the electronic control module 500, with a compact structure and saving the floor area of the equipment.

[0053] The above-described embodiments merely represent several implementation manners of the present invention. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent for the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all fall within the protection scope of the present invention. Therefore, the protection scope of the patent for the present invention shall be subject to the appended claims.

Claims

1. A high and low temperature testing device for memory sticks, characterized in that: The invention comprises a supporting frame (100), on which is arranged: A plurality of test modules (200), wherein the plurality of test modules (200) are arranged in sequence along a first direction, a test cavity (201) is formed in the test module (200), and the plurality of memory bars (700) are plugged into the test module (200) and located in the test cavity (201); An air duct module (300) comprises an air inlet duct (310) and an air return duct (320), wherein the air inlet duct (310) is communicated with an air inlet of the test cavity (201), and the air return duct (320) is communicated with an air outlet of the test cavity (201); wherein the air inlet duct (310) comprises an air inlet main duct (311) and a plurality of air inlet branch ducts (312) communicated with the air inlet main duct (311), wherein the axial direction of the air inlet main duct (311) is consistent with the first direction, and the plurality of air return ducts (320) are communicated with the air outlet of the test cavity (201); The air inlet branch ducts (312) are arranged in sequence along the first direction, and the plurality of air inlet branch ducts (312) are connected to the plurality of test modules (200) in a one-to-one correspondence; the return air duct (320) comprises a return air main duct (321) and a plurality of return air branch ducts (322) connected to the return air main duct (321), and the plurality of return air branch ducts (322) are arranged in sequence along the first direction, and the plurality of return air branch ducts (322) are connected to the plurality of test modules (200) in a one-to-one correspondence; A refrigeration module, the refrigeration module being arranged in the air duct module (300) and being used to reduce the air temperature in the air duct module (300); A heating module, the heating module being arranged in the air duct module (300) and being used to increase the air temperature in the air duct module (300); an air supply module (400), the air supply module (400) being arranged in the air duct module (300) and being used for supplying air into the test cavity (201), so that the air circulates in sequence between the air inlet duct (310), the test cavity (201), the air return duct (320) and the air supply module (400); An electric control module (500), wherein the electric control module (500) is electrically connected to the test module (200), the cooling module, the heating module and the air supply module (400) at the same time.

2. The high and low temperature testing device for memory sticks according to claim 1, characterized in that: The air inlet branch channel (312) is L-shaped and comprises a first air inlet pipe section (314) and a second air inlet pipe section (315) which are connected to each other, the first air inlet pipe section (314) is arranged in a horizontal direction and is vertically connected to the air inlet main channel (311), the second air inlet pipe section (315) is connected to the test chamber (201), and the axial direction of the second air inlet pipe section (315) is consistent with the first direction, and an air inlet control valve (313) is arranged on the first air inlet pipe section (314); The return air branch duct (322) is L-shaped and comprises a first return air duct section (323) and a second return air duct section (324) which are connected to each other, the first return air duct section (323) is connected to the test cavity (201), and the axial direction of the first return air duct section (323) is consistent with the first direction, and the second return air duct section (324) is arranged in a vertical direction and is vertically connected to the return air main duct (321).

3. The high and low temperature testing device for memory sticks according to claim 2, characterized in that: The invention also includes a cabin (600), wherein the cabin (600) is connected to the return air duct (320) and the air supply module (400) at the same time, the refrigeration module includes a compressor and an evaporator connected to the compressor, the heating module includes a heating plate connected to the electric control module (500), the evaporator and the heating plate are both arranged in the cabin (600), and the test module (200), the air inlet duct (310), the first return air duct section (323), the air supply module (400) and the cabin (600) are arranged on the same horizontal plane, the return air main channel (321) is located below the test module (200), and the compressor is arranged below the return air main channel (321), and the electric control module (500) is arranged adjacent to the test module (200).

4. The high and low temperature testing device for memory sticks according to claim 2, characterized in that: The second air inlet duct section (315) is connected to a plurality of first branch air ducts (330) connected to the test cavity (201), the first air return duct section (323) is connected to a plurality of second branch air ducts connected to the test cavity (201), flow equalizing plates (340) are arranged in the first branch air ducts (330) and the second branch air ducts, and an air inlet regulating valve (350) connected to the electric control module (500) is arranged in the first branch air duct (330).

5. The high and low temperature testing device for memory sticks according to claim 3, characterized in that: The return air main duct (321) comprises a first main pipe (325), a second main pipe (326) and a third main pipe (327) which are connected in sequence; the first main pipe (325) and the second main pipe (326) are arranged in a horizontal direction, and the axial direction of the first main pipe (325) is consistent with the first direction; the second main pipe (326) is vertically arranged with the first main pipe (325); the third main pipe (327) is vertically arranged and vertically connected with the second main pipe (326); and the third main pipe (327) is connected with the cabin body (600).

6. The high and low temperature testing device for memory sticks according to claim 2, characterized in that: The test module (200) comprises a test box upper cover (210), a test box body (220), a mainboard support plate (230) and a test mainboard (240); the mainboard support plate (230) is fixed on the opening edge of the test box body (220); the test mainboard (240) is fixed on the side of the mainboard support plate (230) facing the test box upper cover (210); the memory bar (700) is plugged into the slot of the test mainboard (240); a sealing strip (250) is fixed on the opening edge of the test box upper cover (210); the mainboard support plate (230) abuts against the sealing strip (250); and the test cavity (201) is formed between the mainboard support plate (230) and the test box upper cover (210).

7. The high and low temperature testing device for memory sticks according to claim 6, characterized in that: The test module (200) further comprises a tray (260) for supporting the test box body (220); the tray (260) is located below the test box upper cover (210); a pair of guide rails (270) are arranged on the inner side of the tray (260); two sides of the test box body (220) are respectively fixedly connected to the pair of guide rails (270), so that the test box body (220) can slide back and forth along the axial direction of the guide rails (270).

8. The high and low temperature testing device for memory sticks according to claim 7, characterized in that: The test module (200) further comprises an electric push rod (280), wherein the electric push rod (280) is fixedly connected to the tray (260) and is used to drive the tray (260) to perform lifting movement and thereby drive the test box body (220) to perform lifting movement.

9. The high and low temperature testing device for memory sticks according to claim 6, characterized in that: The test module (200) further comprises a mainboard CPU (290), a heat sink (291) and a plurality of heat dissipation fans (292); the mainboard CPU (290) is fixed on a side of the test mainboard (240) away from the test box upper cover (210); the heat sink (291) is fitted with the mainboard CPU (290) and is located in a box cavity (221) of the test box body (220); the box cavity (221) and the test cavity (201) are respectively located on two sides of the mainboard support plate (230); and the plurality of heat dissipation fans (292) are respectively fixed on two opposite side walls of the test box body (220) for discharging heat in the box cavity (221).

10. The high and low temperature testing device for memory sticks according to claim 6, characterized in that: The test box upper cover (210) comprises an upper cover body (211) and a door panel (212) hinged to the upper cover body (211); a door window (2120) made of a transparent material is arranged on the door panel (212); a sensor (213) for detecting the opening and closing of the door panel (212) is also arranged on the test box upper cover (210); the sensor (213) and the air intake control valve (313) are both electrically connected to the electric control module (500).

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