Semiconductor cleaning process equipment and semiconductor cleaning process detection method

Abstract

The invention provides semiconductor cleaning process equipment and a semiconductor cleaning process detection method, the semiconductor cleaning process equipment comprises a cleaning part and a detection part, the cleaning part is used for conveying cleaning liquid for cleaning a wafer, the cleaning part is provided with a liquid discharge part, and the cleaning part discharges the cleaning liquid to the wafer through the liquid discharge part. And the detection part is arranged corresponding to the liquid discharge part and is used for detecting the liquid level position of the cleaning liquid in the liquid discharge part. According to the semiconductor cleaning process equipment and the semiconductor cleaning process detection method provided by the invention, the dripping condition of the cleaning liquid can be detected and found in time, so that the loss of the wafer can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more specifically, to a semiconductor cleaning process equipment and a semiconductor cleaning process detection method. Background Art

[0002] In the semiconductor cleaning process, a cleaning liquid can be sprayed onto a wafer through a spray pipe to clean the wafer. In the prior art, a back suction valve can be provided on the spray pipe, and the on / off of the spray pipe can be controlled by controlling the opening and closing of the back suction valve, so as to control the start and stop of spraying. Moreover, when the back suction valve is closed, the residual cleaning liquid in the spray pipe can be back suctioned to prevent the residual cleaning liquid in the spray pipe from dripping after spraying stops.

[0003] However, if the back suction effect of the back suction valve becomes weak or the back suction of the back suction valve fails due to a fault, the residual cleaning liquid in the spray pipe may drip onto the wafer after spraying stops. And the dripping of the cleaning liquid is difficult to be detected in real time by detection methods such as flow rate or pressure, resulting in the dripping of the cleaning liquid being difficult to be discovered and processed in time, which will have an adverse impact on a large number of wafers, causing a large number of wafers to need to be reworked or even scrapped. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art, and provides a semiconductor cleaning process equipment and a semiconductor cleaning process detection method, which can detect and discover the situation of cleaning liquid dripping in time, so as to reduce the loss of wafers.

[0005] To achieve the purpose of the present invention, a semiconductor cleaning process equipment is provided, including a cleaning component and a detection component. The cleaning component is used to convey a cleaning liquid for cleaning a wafer. The cleaning component has a liquid discharging part, and the cleaning component discharges the cleaning liquid to the wafer through the liquid discharging part. The detection component is correspondingly arranged with the liquid discharging part and is used to detect the liquid level position of the cleaning liquid in the liquid discharging part.

[0006] Optionally, the detection component includes a light sensing part and a light processing part. The light sensing part is arranged above the liquid discharging port of the liquid discharging part and is oppositely arranged with the liquid discharging port, and is used to emit detection light from above the liquid discharging port to the liquid level of the cleaning liquid in the liquid discharging part and receive the reflected light formed by the liquid level of the cleaning liquid in the liquid discharging part reflecting the detection light. The light processing part is connected with the light sensing part and is used to process the reflected light received by the light sensing part to obtain the liquid level position of the cleaning liquid in the liquid discharging part.

[0007] Optionally, the light sensing member includes a light emitting optical fiber and a light receiving optical fiber, the light processing member includes a photoelectric converter and an electrical signal processor, the light emitting optical fiber is used to emit the detection light, the light receiving optical fiber is used to receive the reflected light, the photoelectric converter is connected to the light receiving optical fiber and is used to convert the light intensity signal of the reflected light received by the light receiving optical fiber into an electrical signal, and the electrical signal processor is connected to the photoelectric converter and is used to process the electrical signal converted by the photoelectric converter into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharging portion.

[0008] Optionally, the cleaning member includes a first pipe body, the first pipe body has a liquid inlet portion and the liquid discharging portion, the liquid inlet portion is communicated with the liquid discharging portion and is also communicated with a liquid supply member for conveying the cleaning liquid provided by the liquid supply member to the liquid discharging portion, at least the material of the liquid discharging portion of the first pipe body is a transparent material, the light sensing member is arranged outside the liquid discharging portion, and emits detection light into the cleaning liquid in the liquid discharging portion from above the liquid discharging port through the liquid discharging portion.

[0009] Optionally, the cleaning member further includes a second pipe body, the second pipe body is at least sleeved outside the liquid discharging portion, and the light sensing member penetrates through the second pipe body.

[0010] Optionally, the detection member further includes a fixing member, the fixing member is fixedly arranged outside the second pipe body, the light sensing member penetrates through the fixing member, and the fixing member is used to fix the light sensing member.

[0011] Optionally, the first pipe body further includes a conveying portion, the conveying portion is arranged between the liquid inlet portion and the liquid discharging portion and is respectively communicated with the liquid inlet portion and the liquid discharging portion, the liquid discharging portion has a bent section, the liquid discharging portion is communicated with the conveying portion through the bent section, and the light sensing member is arranged corresponding to the bent section.

[0012] Optionally, the cleaning member further includes a rotating mechanism, the second pipe body is sleeved outside the liquid discharging portion and the conveying portion, and the rotating mechanism is connected to the second pipe body and is used to drive the second pipe body to rotate so as to drive the first pipe body to rotate.

[0013] Optionally, a back suction valve is arranged on the cleaning member, and in the direction of the cleaning member conveying the cleaning liquid, the back suction valve is located upstream of the liquid discharging portion, and the back suction valve is used to control the on-off of the cleaning member.

[0014] Optionally, the semiconductor cleaning process equipment further includes a processing component, which is connected to the detection component and is used to judge whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops conveying the cleaning liquid according to the change range of the liquid level position of the cleaning liquid in the liquid discharge part detected by the detection component.

[0015] The present invention also provides a semiconductor cleaning process detection method, which is applied to the semiconductor cleaning process equipment provided by the present invention. The semiconductor cleaning process detection method includes:

[0016] After the cleaning component stops conveying the cleaning liquid, detect the liquid level position of the cleaning liquid in the liquid discharge part;

[0017] Judge whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops conveying the cleaning liquid according to the change range of the liquid level position.

[0018] Optionally, the step of detecting the liquid level position of the cleaning liquid in the liquid discharge part after the cleaning component stops conveying the cleaning liquid specifically includes:

[0019] Detect the liquid level position of the cleaning liquid in the liquid discharge part multiple times to obtain multiple first detection values;

[0020] The step of judging whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops conveying the cleaning liquid according to the change range of the liquid level position specifically includes:

[0021] Calculate the difference between the maximum value and the minimum value among the multiple first detection values, and compare the difference between the maximum value and the minimum value among the multiple first detection values with a preset first standard value;

[0022] If the difference between the maximum value and the minimum value among the multiple first detection values is greater than the first standard value, it is judged that the cleaning liquid in the liquid discharge part drips after the cleaning component stops conveying the cleaning liquid;

[0023] The first standard value is the difference between the maximum value and the minimum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharge part multiple times after the cleaning component stops conveying the cleaning liquid and before the cleaning liquid in the cleaning component drips.

[0024] Optionally, the step of detecting the liquid level position of the cleaning liquid in the liquid discharge part after the cleaning component stops conveying the cleaning liquid specifically includes:

[0025] Emitting detection light to the liquid level of the cleaning liquid in the liquid discharge part, and receiving the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part reflecting the detection light;

[0026] Judging whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops transporting the cleaning liquid according to the change range of the liquid level position, specifically including:

[0027] Converting the optical intensity signal of the received reflected light into an electrical signal, and processing the converted electrical signal into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharge part;

[0028] Judging whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops transporting the cleaning liquid according to the change range of the digital quantity.

[0029] Optionally, the semiconductor cleaning process detection method further includes: after the cleaning component stops transporting the cleaning liquid, detecting the liquid level position of the cleaning liquid in the liquid discharge part to obtain a second detection value, comparing the second detection value with a preset second standard value range, and if the second detection value is outside the second standard value range, judging that the cleaning component transports the cleaning liquid abnormally, and the second standard value range is the minimum value to the maximum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharge part multiple times when the cleaning component transports the cleaning liquid normally and after the cleaning component stops transporting the cleaning liquid.

[0030] Optionally, the semiconductor cleaning process detection method further includes: emitting detection light to the cleaning liquid in the liquid discharge part both during the process of the cleaning component transporting the cleaning liquid and after the cleaning component stops transporting the cleaning liquid, and receiving the reflected light formed by the cleaning liquid in the liquid discharge part reflecting the detection light;

[0031] Obtaining a plurality of optical intensity signals of the reflected light during the process of the cleaning component transporting the cleaning liquid and processing them into corresponding plurality of digital quantities as a plurality of third detection values, and obtaining a plurality of optical intensity signals of the reflected light after the cleaning component stops transporting the cleaning liquid and processing them into corresponding plurality of digital quantities as a plurality of fourth detection values;

[0032] Calculating a first average value of the plurality of third detection values and a second average value of the plurality of fourth detection values, calculating the difference between the first average value and the second average value, and comparing the difference between the first average value and the second average value with a preset third standard value. If the difference between the first average value and the second average value is less than or equal to the third standard value, judging that the cleaning component transports the cleaning liquid abnormally;

[0033] When the cleaning liquid is being conveyed by the cleaning component without abnormality, during the process of the cleaning component conveying the cleaning liquid and after the cleaning component stops conveying the cleaning liquid, detection light is emitted to the cleaning liquid in the liquid discharge part, and the reflected light formed by the cleaning liquid in the liquid discharge part reflecting the detection light is received. A plurality of light intensity signals of the reflected light during the process of the cleaning component conveying the cleaning liquid are obtained and processed into corresponding digital quantities as a plurality of fifth detection values, and a plurality of light intensity signals of the reflected light after the cleaning component stops conveying the cleaning liquid are obtained and processed into corresponding digital quantities as a plurality of sixth detection values. The absolute values of the differences between the maximum value among the plurality of fifth detection values and the maximum and minimum values among the plurality of sixth detection values are calculated respectively, and the minimum absolute value among the absolute values of the differences between the minimum value among the plurality of fifth detection values and the maximum and minimum values among the plurality of sixth detection values is used as the third standard value.

[0034] The present invention has the following beneficial effects:

[0035] The semiconductor cleaning process equipment provided by the present invention uses a detection component to detect the liquid level position of the cleaning liquid in the liquid discharge part. Since whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops conveying the cleaning liquid will affect whether the liquid level position of the cleaning liquid in the liquid discharge part changes after the cleaning component stops conveying the cleaning liquid, therefore, according to the change amplitude of the liquid level position of the cleaning liquid in the liquid discharge part after the cleaning component stops conveying the cleaning liquid, it can be judged whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops conveying the cleaning liquid, so that the situation of cleaning liquid dripping can be detected in time. Furthermore, the wafer currently dripping with cleaning liquid can be processed in time, preventing the wafer currently dripping with cleaning liquid from entering the subsequent process. Moreover, the cleaning component can be inspected in time to avoid the continuous dripping of the cleaning component from having an adverse impact on a large number of wafers, resulting in the need for rework or even scrapping of a large number of wafers, thereby reducing the loss of wafers.

[0036] The semiconductor cleaning process detection method provided by the present invention, with the aid of the semiconductor cleaning process equipment provided by the present invention, after the cleaning component stops transporting the cleaning liquid, detects the liquid level position of the cleaning liquid in the liquid discharge part of the cleaning component, and determines whether the cleaning liquid in the liquid discharge part drips after the cleaning component stops transporting the cleaning liquid according to the change range of the liquid level position of the cleaning liquid in the liquid discharge part, can detect the dripping situation of the cleaning liquid in time, so that the wafer currently dripping with the cleaning liquid can be processed in time, avoiding the wafer currently dripping with the cleaning liquid from entering the subsequent process, and, can inspect the cleaning component in time, avoiding the continuous dripping of the cleaning component from having an adverse impact on a large number of wafers, resulting in the need for rework or even scrapping of a large number of wafers, and thus can reduce the loss of wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 is a schematic structural diagram of the semiconductor cleaning process equipment provided by an embodiment of the present invention;

[0038] Figure 2 is a flowchart of the semiconductor cleaning process detection method provided by an embodiment of the present invention;

[0039] DESCRIPTION OF REFERENCE NUMERALS:

[0040] 1 - cleaning component; 11 - first pipe body; 111 - liquid discharge part; 112 - liquid inlet part; 113 - conveying part;

[0041] 12 - second pipe body; 2 - detection component; 21 - light sensing element; 22 - light processing element; 221 - photoelectric converter; 222 - electrical signal processor; 3 - liquid supply component; 4 - fixing component; 5 - rotating mechanism; 6 - back suction valve; 100 - wafer. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0042] To enable those skilled in the art to better understand the technical solutions of the present invention, the semiconductor cleaning process equipment and the semiconductor cleaning process detection method provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0043] As Figure 1 shown, an embodiment of the present invention provides a semiconductor cleaning process equipment, including a cleaning component 1 and a detection component 2. The cleaning component 1 is used to transport the cleaning liquid for cleaning the wafer 100. The cleaning component 1 has a liquid discharge part 111. The cleaning component 1 discharges the cleaning liquid to the wafer 100 through the liquid discharge part 111. The detection component 2 is correspondingly arranged with the liquid discharge part 111 and is used to detect the liquid level position of the cleaning liquid in the liquid discharge part 111.

[0044] The semiconductor cleaning process equipment provided by the embodiments of the present invention detects the liquid level position of the cleaning liquid in the liquid discharge part 111 by means of the detection component 2. Since whether the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops transporting the cleaning liquid will affect whether the liquid level position of the cleaning liquid in the liquid discharge part 111 changes after the cleaning component 1 stops transporting the cleaning liquid, therefore, according to the change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 after the cleaning component 1 stops transporting the cleaning liquid, it is possible to determine whether the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops transporting the cleaning liquid, so that the situation of cleaning liquid dripping can be detected and discovered in time, and then the wafer 100 with cleaning liquid dripping currently can be processed in time, preventing the wafer 100 with cleaning liquid dripping currently from entering the subsequent process, and moreover, the cleaning component 1 can be inspected in time to avoid the continuous dripping of the cleaning component 1 from causing adverse effects on a large number of wafers 100, resulting in the need for rework or even scrapping of a large number of wafers 100, and further reducing the loss of the wafers 100.

[0045] Specifically, after the cleaning component 1 stops transporting the cleaning liquid, if the cleaning liquid in the liquid discharge part 111 does not drip, the change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 is small, and if the cleaning liquid in the liquid discharge part 111 drips, the change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 is large. Therefore, in practical applications, after the cleaning component 1 stops transporting the cleaning liquid and when the cleaning liquid in the liquid discharge part 111 does not drip, the change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 can be detected first, and the change range of the liquid level position at this time can be used as the preset standard change range. In this way, after the cleaning component 1 stops transporting the cleaning liquid, if the detected change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 is less than or equal to the preset standard change range, it can be determined that the cleaning liquid in the liquid discharge part 111 does not drip, and if the detected change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 is greater than the preset standard change range, it can be determined that the cleaning liquid in the liquid discharge part 111 drips.

[0046] In an embodiment of the present invention, the detection component 2 may include a light sensing component 21 and a light processing component 22. The light sensing component 21 is arranged above the liquid discharge port of the liquid discharge part 111 and is arranged opposite to the liquid discharge port, and is used to emit detection light from above the liquid discharge port to the liquid level of the cleaning liquid in the liquid discharge part 111 and receive the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part 111 reflecting the detection light. The light processing component 22 is connected to the light sensing component 21 and is used to process the reflected light received by the light sensing component 21 to obtain the liquid level position of the cleaning liquid in the liquid discharge part 111.

[0047] By arranging the light sensor 21 above the liquid discharge port of the liquid discharge part 111 and opposite to the liquid discharge port, the detection light emitted by the light sensor 21 can be emitted from above the liquid discharge port to the liquid level of the cleaning liquid in the liquid discharge part 111, and the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part 111 reflecting the detection light can be reflected from above the liquid level of the cleaning liquid in the liquid discharge part 111 to the light sensor 21. In practical applications, when the liquid level position of the cleaning liquid in the liquid discharge part 111 changes, the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part 111 reflecting the detection light will change accordingly. Therefore, by processing the reflected light received by the light sensor 21 with the light processing part 22, the liquid level position of the cleaning liquid in the liquid discharge part 111 can be obtained, and thus the change amplitude of the liquid level position of the cleaning liquid in the liquid discharge part 111 can be calculated.

[0048] In an embodiment of the present invention, the light sensor 21 may include a light-emitting optical fiber and a receiving optical fiber, and the light processing part 22 may include a photoelectric converter 221 and an electrical signal processor 222. The light-emitting optical fiber is used for emitting detection light, the receiving optical fiber is used for receiving the reflected light, the photoelectric converter 221 is connected to the receiving optical fiber and is used for converting the light intensity signal of the reflected light received by the receiving optical fiber into an electrical signal, and the electrical signal processor 222 is connected to the photoelectric converter 221 and is used for processing the electrical signal converted by the photoelectric converter 221 into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharge part 111.

[0049] In practical applications, when the liquid level position of the cleaning liquid in the liquid discharge part 111 changes closer to the receiving end of the receiving optical fiber, that is, when the distance between the liquid level position of the cleaning liquid in the liquid discharge part 111 after the change and the receiving end of the receiving optical fiber decreases, the light intensity signal of the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part 111 reflecting the detection light increases. When the liquid level position of the cleaning liquid in the liquid discharge part 111 changes away from the receiving end of the receiving optical fiber, that is, when the distance between the liquid level position of the cleaning liquid in the liquid discharge part 111 after the change and the receiving end of the receiving optical fiber increases, the light intensity signal of the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part 111 reflecting the detection light decreases.

[0050] After the receiving optical fiber receives the reflected light, it can generate an optical intensity signal and transmit the optical intensity signal to the optoelectronic converter 221. After receiving the optical intensity signal, the optoelectronic converter 221 can convert the optical intensity signal into an electrical signal and transmit the electrical signal to the electrical signal processor 222. After receiving the electrical signal, the electrical signal processor 222 can process the electrical signal into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharging part 111. When the liquid level position of the cleaning liquid in the liquid discharging part 111 changes, the digital quantity representing the liquid level position of the cleaning liquid in the liquid discharging part 111 generated by the electrical signal processor 222 will change accordingly. Thus, the change amplitude of the liquid level position of the cleaning liquid in the liquid discharging part 111 can be obtained according to the change amplitude of the digital quantity generated by the electrical signal processor 222.

[0051] Optionally, after receiving the optical intensity signal, the optoelectronic converter 221 can convert the optical intensity signal into a current signal.

[0052] For example, after receiving the optical intensity signal, the optoelectronic converter 221 can convert the optical intensity signal into a 4 mA - 20 mA current signal and transmit the 4 mA - 20 mA current signal to the electrical signal processor 222. After receiving the 4 mA - 20 mA current signal, the electrical signal processor 222 can process the 4 mA - 20 mA current signal into a 0 - 10000 digital quantity representing the liquid level position of the cleaning liquid in the liquid discharging part 111.

[0053] Optionally, the optoelectronic converter 221 can include an optical fiber amplifier.

[0054] Optionally, the electrical signal processor 222 can include a Programmable Logic Controller (PLC for short). The input (IN) port of the programmable logic controller can be connected to the optoelectronic converter 221 to receive the electrical signal converted by the optoelectronic converter 221 through the input port.

[0055] In an embodiment of the present invention, the cleaning component 1 can include a first pipe body 11. The first pipe body 11 has a liquid inlet part 112 and a liquid discharging part 111. The liquid inlet part 112 is communicated with the liquid discharging part 111 and is communicated with the liquid supply component 3 for conveying the cleaning liquid provided by the liquid supply component 3 to the liquid discharging part 111. At least the material of the liquid discharging part 111 of the first pipe body 11 is a transparent material. The light sensing member 21 is arranged outside the liquid discharging part 111 and emits detection light from above the liquid discharging port into the liquid level of the cleaning liquid in the liquid discharging part 111 through the liquid discharging part 111.

[0056] In practical applications, the cleaning liquid provided by the liquid supply component 3 can first enter the first pipe body 11 through the liquid inlet part 112, then be transported to the liquid discharge part 111 through the first pipe body 11, and then be discharged from the liquid discharge port of the liquid discharge part 111 towards the wafer 100, so as to clean the wafer 100 by means of the cleaning liquid. By making the material of the liquid discharge part 111 a transparent material, the light sensing element 21 can be arranged outside the liquid discharge part 111. The detection light emitted by the light sensing element 21 can be emitted from above the liquid discharge port through the transparent liquid discharge part 111 to the liquid level of the cleaning liquid inside the liquid discharge part 111, and the reflected light formed by the liquid level of the cleaning liquid inside the liquid discharge part 111 reflecting the detection light can be emitted from above the liquid discharge port through the transparent liquid discharge part 111 to the light sensing element 21.

[0057] Optionally, the transparent material can be transparent soluble polytetrafluoroethylene (abbreviated as PFA for Polyfluoroalkoxy).

[0058] Optionally, the material of the whole first pipe body 11 can be a transparent material.

[0059] In an embodiment of the present invention, the cleaning component 1 can further include a second pipe body 12. The second pipe body 12 is at least sleeved outside the liquid discharge part 111, and the light sensing element 21 is arranged through the second pipe body 12.

[0060] That is to say, at least the liquid discharge part 111 of the first pipe body 11 is sleeved with the second pipe body 12. In this case, the light sensing element 21 is arranged through the second pipe body 12 to be able to emit detection light to the liquid level of the cleaning liquid inside the liquid discharge part 111 through the transparent liquid discharge part 111, and be able to receive the reflected light formed by the liquid level of the cleaning liquid inside the liquid discharge part 111 reflecting the detection light.

[0061] In an embodiment of the present invention, the detection component 2 can further include a fixing part 4. The fixing part 4 is fixedly arranged outside the second pipe body 12, and the light sensing element 21 is arranged through the fixing part 4. The fixing part 4 is used to fix the light sensing element 21.

[0062] That is to say, the fixing part 4 is arranged outside the second pipe body 12 and fixed to the second pipe body 12. The light sensing element 21 passes through the fixing part 4 and through the second pipe body 12, and is fixed to the fixing part 4 to fix the light sensing element 21 by means of the fixing part 4.

[0063] In an embodiment of the present invention, the first pipe body 11 can further include a conveying part 113. The conveying part 113 is arranged between the liquid inlet part 112 and the liquid discharge part 111 and is respectively communicated with the liquid inlet part 112 and the liquid discharge part 111. The liquid discharge part 111 has a bent section. The liquid discharge part 111 is communicated with the conveying part 113 through the bent section. The light sensing element 21 is arranged corresponding to the bent section.

[0064] In practical applications, by making the liquid discharging part 111 have a bent section, the liquid discharging part 111 can be arranged vertically downward opposite to the wafer 100, and the liquid discharging port can be arranged opposite to the wafer 100. By making the light sensing member 21 correspond to the bent section, the light sensing member 21 can be located above the liquid discharging port of the liquid discharging part 111 and arranged opposite to the liquid discharging port.

[0065] In an embodiment of the present invention, the cleaning component 1 may further include a rotating mechanism 5. The second pipe body 12 is sleeved outside the liquid discharging part 111 and the conveying part 113. The rotating mechanism 5 is connected to the second pipe body 12 and is used to drive the second pipe body 12 to rotate, so as to drive the first pipe body 11 to rotate.

[0066] In practical applications, the material of the first pipe body 11 may be a flexible material, the material of the second pipe body 12 may be a rigid material, a part of the conveying part 113 may be arranged vertically, and a part of the second pipe body 12 may be arranged vertically to be sleeved outside the vertically arranged part of the conveying part 113. The rotating mechanism 5 may be connected to the vertically arranged part of the second pipe body 12. By driving the second pipe body 12 to rotate, the rotating mechanism 5 can drive the first pipe body 11 to rotate through the second pipe body 12. In this way, during the semiconductor cleaning process, the first pipe body 11 can rotate to convey the cleaning liquid to the wafer 100, thereby improving the cleaning uniformity of the wafer 100.

[0067] In an embodiment of the present invention, a back suction valve 6 may be arranged on the cleaning component 1, and in the direction of the cleaning component 1 conveying the cleaning liquid, the back suction valve 6 is located upstream of the liquid discharging part 111, and the back suction valve 6 is used to control the on-off of the cleaning component 1.

[0068] Optionally, the back suction valve 6 may be arranged on the liquid inlet part 112 or the conveying part 113 of the first pipe body 11. By controlling the opening and closing of the back suction valve 6, the on-off of the first pipe body 11 can be controlled, so as to control the start and stop of the first pipe body 11 conveying the cleaning liquid. Moreover, by arranging the back suction valve 6 upstream of the liquid discharging part 111, the cleaning liquid remaining in the liquid discharging part 111 in the first pipe body 11 can be back-sucked when the back suction valve 6 is closed, avoiding the cleaning liquid remaining in the liquid discharging part 111 in the first pipe body 11 from dripping after the first pipe body 11 stops conveying the cleaning liquid. When the back suction function of the back suction valve 6 is normal, after the first pipe body 11 stops conveying the cleaning liquid, the liquid level of the cleaning liquid remaining in the liquid discharging part 111 in the first pipe body 11 is as Figure 1 shown by the liquid level A. When the back suction function effect of the back suction valve 6 becomes weak or the back suction function of the back suction valve 6 fails due to a fault, the cleaning liquid remaining in the liquid discharging part 111 in the first pipe body 11 may drip after the first pipe body 11 stops conveying the cleaning liquid. At this time, the liquid level of the cleaning liquid in the liquid discharging part 111 may be lower than Figure 1 the liquid level B shown ( Figure 1The liquid level B shown is the liquid level when the cleaning liquid remaining in the liquid discharge part 111 is in a critical state where it is about to drip but has not dripped after the first pipe body 11 stops transporting the cleaning liquid. And when the back suction function effect of the back suction valve 6 becomes weak or the back suction function of the back suction valve 6 fails due to a malfunction, the liquid remaining in the transport part 113 may continue to flow towards the liquid discharge part 111 without being back suctioned. At this time, the liquid level of the cleaning liquid in the liquid discharge part 111 (such as Figure 1 the liquid level C shown) may be higher than the liquid level A.

[0069] Optionally, the back suction valve 6 can be connected to a control processor, and the control processor is used to control the opening and closing of the back suction valve 6.

[0070] Optionally, the control processor can include a Programmable Logic Controller (abbreviated as PLC). The output (OUT) port of the programmable logic controller can be connected to the back suction valve 6 to output an opening and closing control signal to the back suction valve 6 through the output port.

[0071] Optionally, the electrical signal processor 222 can be used as the control processor.

[0072] In an embodiment of the present invention, the semiconductor cleaning process equipment may further include a processing component, which is connected to the detection component 2 and is used to judge whether the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops transporting the cleaning liquid according to the change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 detected by the detection component 2 after the cleaning component 1 stops transporting the cleaning liquid.

[0073] Since whether the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops transporting the cleaning liquid will affect whether the liquid level position of the cleaning liquid in the liquid discharge part 111 changes after the cleaning component 1 stops transporting the cleaning liquid, therefore, according to the change range of the liquid level position of the cleaning liquid in the liquid discharge part 111 after the cleaning component 1 stops transporting the cleaning liquid, it is possible to judge whether the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops transporting the cleaning liquid, so as to be able to detect and discover the situation of the cleaning liquid dripping in a timely manner.

[0074] Optionally, the processing component can include a Programmable Logic Controller (abbreviated as PLC).

[0075] Optionally, the electrical signal processor 222 can be used as the processing component.

[0076] Such as Figure 2As shown in the figure, an embodiment of the present invention further provides a semiconductor cleaning process detection method, which is applied to the semiconductor cleaning process equipment provided in the embodiment of the present invention. The semiconductor cleaning process detection method may include: S1. After the cleaning component 1 stops transporting the cleaning liquid, detect the liquid level position of the cleaning liquid in the liquid discharging part 111;

[0077] S2. According to the change range of the liquid level position, determine whether the cleaning liquid in the liquid discharging part 111 drips after the cleaning component 1 stops transporting the cleaning liquid.

[0078] The semiconductor cleaning process detection method provided by the embodiment of the present invention, with the help of the semiconductor cleaning process equipment provided by the embodiment of the present invention, by detecting the liquid level position of the cleaning liquid in the liquid discharging part 111 of the cleaning component 1 after the cleaning component 1 stops transporting the cleaning liquid, and according to the change range of the liquid level position of the cleaning liquid in the liquid discharging part 111, determine whether the cleaning liquid in the liquid discharging part 111 drips after the cleaning component 1 stops transporting the cleaning liquid, can timely detect the situation of cleaning liquid dripping, so as to be able to timely process the wafer 100 with cleaning liquid dripping currently, avoid the wafer 100 with cleaning liquid dripping currently from entering the subsequent process, and, can timely check the cleaning component 1, avoid the continuous dripping of the cleaning component 1 from causing adverse effects on a large number of wafers 100, resulting in the need for rework or even scrapping of a large number of wafers 100, and further can reduce the loss of wafers 100.

[0079] In an embodiment of the present invention, S1. After the cleaning component 1 stops transporting the cleaning liquid, detect the liquid level position of the cleaning liquid in the liquid discharging part 111, which may specifically include: detecting the liquid level position of the cleaning liquid in the liquid discharging part 111 multiple times to obtain multiple first detection values; S2. According to the change range of the liquid level position, determine whether the cleaning liquid in the liquid discharging part 111 drips after the cleaning component 1 stops transporting the cleaning liquid, which may specifically include: calculating the difference between the maximum value and the minimum value among the multiple first detection values, and comparing the difference between the maximum value and the minimum value among the multiple first detection values with a preset first standard value; if the difference between the maximum value and the minimum value among the multiple first detection values is greater than the first standard value, it is determined that the cleaning liquid in the liquid discharging part 111 drips after the cleaning component 1 stops transporting the cleaning liquid; the first standard value is the difference between the maximum value and the minimum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharging part 111 multiple times after the cleaning component 1 stops transporting the cleaning liquid and before the cleaning liquid in the cleaning component 1 drips.

[0080] For example, after the cleaning component 1 stops delivering the cleaning liquid, the liquid level position of the cleaning liquid in the liquid discharge part 111 can be detected once every second preset time within the first preset time to obtain a plurality of first detection values. After the first preset time, the maximum value and the minimum value among the plurality of first detection values can be calculated, and then the difference between the maximum value and the minimum value among the plurality of first detection values can be calculated, and the difference between the maximum value and the minimum value among the plurality of first detection values can be compared with a preset first standard value. Since the first standard value is the difference between the maximum value and the minimum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharge part 111 multiple times after the cleaning component 1 stops delivering the cleaning liquid and before the cleaning liquid in the cleaning component 1 drips. For example, the maximum value can be obtained by detecting the liquid level position when the liquid level of the cleaning liquid in the liquid discharge part 111 is at the liquid level A as shown in Figure 1 shown, and the minimum value can be obtained by detecting the liquid level position when the liquid level of the cleaning liquid in the liquid discharge part 111 is at the liquid level B as shown in Figure 1 shown. That is to say, the first standard value can be determined in advance and can be the difference between the maximum value and the minimum value obtained by detecting the liquid level position when the liquid level of the cleaning liquid in the liquid discharge part 111 drops from the normal liquid level A to the critical liquid level B where it is about to drip but has not dripped. When the cleaning component 1 stops delivering the cleaning liquid and the cleaning liquid in the cleaning component 1 drips, the liquid level position of the cleaning liquid in the liquid discharge part 111 will drop (for example, from the liquid level A in Figure 1 to the liquid level B). At this time, the difference between the maximum value and the minimum value of the liquid level position of the cleaning liquid in the liquid discharge part 111 will increase. Therefore, if the difference between the maximum value and the minimum value among the plurality of first detection values is greater than the first standard value, it can be determined that the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops delivering the cleaning liquid.

[0081] Optionally, the first preset time can be 1 s - 10 s. The first preset time can be set according to the cleaning interval time between two adjacent wafers 100. For example, when the cleaning of one wafer 100 is completed, it is necessary to wait for 2 s before cleaning the next wafer 100, then the first preset time can be set to 2 s.

[0082] Optionally, the first preset time can be 2 s.

[0083] Optionally, the second preset time can be 10 ms - 500 ms.

[0084] Optionally, the second preset time can be 100 ms.

[0085] In an embodiment of the present invention, S1. After the cleaning component 1 stops delivering the cleaning liquid, detecting the liquid level position of the cleaning liquid in the liquid discharge part 111 may specifically include:

[0086] Detecting light is emitted to the liquid level of the cleaning liquid in the liquid discharge part 111, and the reflected light formed by receiving the reflected detecting light from the liquid level of the cleaning liquid in the liquid discharge part 111 is received;

[0087] S2. Judging whether the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops conveying the cleaning liquid according to the change range of the liquid level position, which may specifically include:

[0088] Converting the optical intensity signal of the received reflected light into an electrical signal, and processing the converted electrical signal into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharge part 111;

[0089] Judging whether the cleaning liquid in the liquid discharge part 111 drips after the cleaning component 1 stops conveying the cleaning liquid according to the change range of the digital quantity.

[0090] That is to say, optionally, the first detection value may be that the electrical signal processor 222 processes the electrical signal into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharge part 111. When the first detection value is that the electrical signal processor 222 processes the electrical signal into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharge part 111, the first standard value may be 500 for the digital quantity.

[0091] In practical applications, when the liquid level position of the cleaning liquid in the liquid discharge part 111 rises close to (for example, rises from the liquid level A in Figure 1 to the liquid level C) the receiving end of the receiving optical fiber, that is to say, when the distance between the changed liquid level position of the cleaning liquid in the liquid discharge part 111 and the receiving end of the receiving optical fiber decreases, the optical intensity signal of the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part 111 reflecting the detecting light increases. When the liquid level position of the cleaning liquid in the liquid discharge part 111 drops away from (for example, drops from the liquid level A in Figure 1 to the liquid level B) the receiving end of the receiving optical fiber, that is to say, when the distance between the changed liquid level position of the cleaning liquid in the liquid discharge part 111 and the receiving end of the receiving optical fiber increases, the optical intensity signal of the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part 111 reflecting the detecting light decreases.

[0092] In an embodiment of the present invention, the semiconductor cleaning process detection method may further include: after the cleaning component 1 stops conveying the cleaning liquid, detecting the liquid level position of the cleaning liquid in the liquid discharge part 111 to obtain a second detection value, comparing the second detection value with a preset second standard value range, and if the second detection value is outside the second standard value range, judging that the cleaning component 1 conveys the cleaning liquid abnormally, and the second standard value range is the minimum value to the maximum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharge part 111 multiple times when the cleaning component 1 conveys the cleaning liquid normally and after the cleaning component 1 stops conveying the cleaning liquid.

[0093] Optionally, the second detection value may be a digital quantity obtained by the electrical signal processor 222 processing the electrical signal to represent the liquid level position of the cleaning liquid in the liquid discharge portion 111, and the second standard value range may be a digital quantity of 4000-6000.

[0094] Since the second standard value range is the minimum value to the maximum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharge portion 111 multiple times when the cleaning component 1 transports the cleaning liquid without abnormality and after the cleaning component 1 stops transporting the cleaning liquid. For example, when the cleaning component 1 transports the cleaning liquid without abnormality such as the back suction function of the back suction valve 6 being normal, after the first pipe body 11 stops transporting the cleaning liquid, the liquid level of the cleaning liquid remaining in the liquid discharge portion 111 in the first pipe body 11 is as Figure 1 shown by the liquid level A in the figure, and the detection value corresponding to the liquid level A is within the second standard value range. When the cleaning component 1 transports the cleaning liquid abnormally, such as the back suction function of the back suction valve 6 becoming weak or the back suction function of the back suction valve 6 failing due to a fault, after the first pipe body 11 stops transporting the cleaning liquid, the liquid level of the cleaning liquid remaining in the liquid discharge portion 111 in the first pipe body 11 may be as Figure 1 shown by the liquid level B in the figure, which is lower than the liquid level A, or as Figure 1 shown by the liquid level C in the figure, which is higher than the liquid level A. Among them, the detection value corresponding to the liquid level B may be less than the minimum value of the second standard value range, and the detection value corresponding to the liquid level C may be greater than the maximum value of the second standard value range. That is to say, the detection values corresponding to the liquid level B and the liquid level C may be outside the second standard value range. Therefore, if the second detection value is outside the second standard value range, that is, the second detection value is less than the minimum value of the second standard value range or greater than the maximum value of the second standard value range, it can be determined that the cleaning component 1 transports the cleaning liquid abnormally.

[0095] In an embodiment of the present invention, the semiconductor cleaning process detection method may further include: emitting detection light to the cleaning liquid in the liquid discharge portion 111 both during the process of the cleaning component 1 transporting the cleaning liquid and after the cleaning component 1 stops transporting the cleaning liquid, and receiving the emitted light formed by the cleaning liquid in the liquid discharge portion 111 reflecting the detection light;

[0096] Obtaining a plurality of light intensity signals of the reflected light during the process of the cleaning component 1 transporting the cleaning liquid and processing them into corresponding digital quantities as a plurality of third detection values, and obtaining a plurality of light intensity signals of the reflected light after the cleaning component 1 stops transporting the cleaning liquid and processing them into corresponding digital quantities as a plurality of fourth detection values;

[0097] Calculate the first average value of multiple third detection values and the second average value of multiple fourth detection values, calculate the difference between the first average value and the second average value, and compare the difference between the first average value and the second average value with a preset third standard value. If the difference between the first average value and the second average value is less than or equal to the third standard value, it is determined that the cleaning component 1 transports the cleaning liquid abnormally;

[0098] When the cleaning component 1 transports the cleaning liquid normally, during the process of the cleaning component 1 transporting the cleaning liquid and after the cleaning component 1 stops transporting the cleaning liquid, detection light is emitted to the cleaning liquid in the liquid discharge part 111, and the reflected light formed by the cleaning liquid in the liquid discharge part 111 reflecting the detection light is received. Multiple light intensity signals of the reflected light during the process of the cleaning component 1 transporting the cleaning liquid are obtained and processed into corresponding multiple digital quantities as multiple fifth detection values, and multiple light intensity signals of the reflected light after the cleaning component 1 stops transporting the cleaning liquid are obtained and processed into corresponding multiple digital quantities as multiple sixth detection values. And calculate the absolute values of the differences between the maximum value among multiple fifth detection values and the maximum and minimum values among multiple sixth detection values respectively, and the absolute value of the difference between the minimum value among multiple fifth detection values and the maximum and minimum values among multiple sixth detection values respectively. The minimum absolute value is used as the third standard value.

[0099] For example, during the process of the cleaning component 1 transporting the cleaning liquid, the liquid level position of the cleaning liquid in the liquid discharge part 111 can be detected every third preset time to obtain multiple third detection values. And during the process of obtaining multiple third detection values, the maximum and minimum values among multiple third detection values and the first average value of multiple third detection values can be calculated in real time until the cleaning component 1 stops transporting the cleaning liquid. After the cleaning component 1 stops transporting the cleaning liquid, within the fourth preset time, the liquid level position of the cleaning liquid in the liquid discharge part 111 can be detected every fifth preset time to obtain multiple fourth detection values. After the fourth preset time, the maximum and minimum values among multiple fourth detection values and the second average value of multiple fourth detection values can be calculated. Then, the difference between the first average value and the second average value can be calculated, and the difference between the first average value and the second average value can be compared with the preset third standard value.

[0100] When the backwashing function of the backwashing valve 6 is normal and there is no abnormality in the cleaning liquid conveyed by the cleaning component 1, during the process of the cleaning component 1 conveying the cleaning liquid, detection light is emitted to the cleaning liquid in the liquid discharge part 111, and the reflected light formed by the cleaning liquid in the liquid discharge part 111 reflecting the detection light is received. Moreover, multiple light intensity signals of the reflected light are obtained and processed into corresponding multiple digital quantities as multiple fifth detection values, and the maximum value and the minimum value among the multiple fifth detection values are calculated. After the cleaning component 1 stops conveying the cleaning liquid, detection light is emitted to the cleaning liquid in the liquid discharge part 111, and the reflected light formed by the cleaning liquid in the liquid discharge part 111 reflecting the detection light is received. Moreover, multiple light intensity signals of the reflected light are obtained and processed into corresponding multiple digital quantities as multiple sixth detection values, and the maximum value and the minimum value among the multiple sixth detection values are calculated. Then, the absolute values of the differences between the maximum value among the multiple fifth detection values and the maximum value and the minimum value among the multiple sixth detection values respectively, and the absolute values of the differences between the minimum value among the multiple fifth detection values and the maximum value and the minimum value among the multiple sixth detection values respectively are calculated. For example, if the maximum value among the multiple fifth detection values is VSmax, the minimum value among the multiple fifth detection values is VSmin, the maximum value among the multiple sixth detection values is VTmax, and the minimum value among the multiple sixth detection values is VTmin, then |VSmax - VTmax| = the first absolute value, |VSmax - VTmin| = the second absolute value, |VSmin - VTmax| = the third absolute value, |VSmin - VTmin| = the fourth absolute value. Then, the minimum absolute value among the first absolute value, the second absolute value, the third absolute value and the fourth absolute value can be calculated, and this minimum absolute value can be used as the third standard value.

[0101] Since when the cleaning component 1 transports the cleaning liquid without abnormality, during the process of the cleaning component 1 transporting the cleaning liquid, the digital quantity corresponding to the light intensity signal of the reflected light in the liquid discharge part 111 (i.e., the fifth detection value), and the difference between the digital quantity corresponding to the light intensity signal of the reflected light in the liquid discharge part 111 (i.e., the sixth detection value) obtained after the cleaning component 1 stops transporting the cleaning liquid should be relatively large. That is to say, when the cleaning component 1 transports the cleaning liquid without abnormality, for the two situations of when the cleaning component 1 transports the cleaning liquid and when the cleaning component 1 stops transporting the cleaning liquid, the difference in the light intensity signals of the reflected light in the liquid discharge part 111 obtained should be relatively large. When the cleaning component 1 transports the cleaning liquid abnormally, such as when the cleaning liquid is not discharged from the liquid discharge part 111 during the process of the cleaning component 1 transporting the cleaning liquid, or when the cleaning liquid is still discharged from the liquid discharge part 111 during the process of the cleaning component 1 stopping transporting the cleaning liquid, during the process of the cleaning component 1 transporting the cleaning liquid, the difference between the digital quantity corresponding to the light intensity signal of the reflected light in the liquid discharge part 111 (i.e., the third detection value) and the digital quantity corresponding to the light intensity signal of the reflected light in the liquid discharge part 111 (i.e., the fourth detection value) obtained after the cleaning component 1 stops transporting the cleaning liquid will decrease. That is to say, when the cleaning component 1 transports the cleaning liquid abnormally, for the two situations of when the cleaning component 1 transports the cleaning liquid and when the cleaning component 1 stops transporting the cleaning liquid, the difference in the light intensity signals of the reflected light in the liquid discharge part 111 obtained will decrease, which makes the difference between the first average value and the second average value decrease. The third standard value obtained by the method for obtaining the third standard value provided in the embodiment of the present invention represents the minimum difference between the limit value of the fifth detection value and the limit value of the sixth detection value when the cleaning component 1 transports the cleaning liquid without abnormality. That is, the third standard value represents the minimum state of the difference in the light intensity signals of the reflected light in the liquid discharge part 111 obtained for the two situations of when the cleaning component 1 transports the cleaning liquid and when the cleaning component 1 stops transporting the cleaning liquid when the cleaning component 1 transports the cleaning liquid without abnormality. Therefore, if the difference between the first average value and the second average value is less than or equal to the third standard value, it can be determined that the cleaning component 1 transports the cleaning liquid abnormally.

[0102] Optionally, the fourth preset time can be 1 s - 10 s. The fourth preset time can be set according to the cleaning interval time between two adjacent wafers 100. For example, when the cleaning of one wafer 100 is completed, it is necessary to wait for 2 s before cleaning the next wafer 100, then the fourth preset time can be set to 2 s.

[0103] Optionally, the fourth preset time can be 2 s.

[0104] Optionally, the third preset time can be 10 ms - 500 ms.

[0105] Optionally, the third preset time can be 100 ms.

[0106] Optionally, the fifth preset time may be 10 ms - 500 ms.

[0107] Optionally, the fifth preset time may be 100 ms.

[0108] Optionally, one or more of the third detection value, the fourth detection value, the fifth detection value, and the sixth detection value may be the digital quantity corresponding to the light intensity signal of the reflected light converted and processed by the optical - electric converter 221 and the electric - signal processor 222. For example, the third standard value may be the digital quantity 1000.

[0109] In summary, the semiconductor cleaning process equipment and the semiconductor cleaning process detection method provided by the embodiments of the present invention can timely detect the situation of cleaning liquid dripping, thereby reducing the loss of the wafer 100.

[0110] It can be understood that the above - mentioned embodiments are merely exemplary embodiments adopted to illustrate the principle of the present invention. However, the present invention is not limited thereto. For those of ordinary skill in the art, various deformations and improvements can be made without departing from the spirit and essence of the present invention, and these deformations and improvements are also regarded as the protection scope of the present invention.

Claims

1. A semiconductor cleaning process equipment, characterized in that, it includes a cleaning component and a detection component. The cleaning component is used to convey a cleaning liquid for cleaning a wafer. The cleaning component has a liquid discharge part. The cleaning component discharges the cleaning liquid to the wafer through the liquid discharge part. The detection component is correspondingly arranged with the liquid discharge part and is used to detect the liquid level position of the cleaning liquid in the liquid discharge part.

2. The semiconductor cleaning process equipment according to claim 1, characterized in that, the detection component includes a light sensing element and a light processing element. The light sensing element is arranged above the liquid discharge port of the liquid discharge part and is oppositely arranged with the liquid discharge port. It is used to emit detection light from above the liquid discharge port to the liquid level of the cleaning liquid in the liquid discharge part and receive the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part reflecting the detection light. The light processing element is connected to the light sensing element and is used to process the reflected light received by the light sensing element to obtain the liquid level position of the cleaning liquid in the liquid discharge part.

3. The semiconductor cleaning process equipment according to claim 2, characterized in that, the light sensing element includes a light emitting optical fiber and a receiving optical fiber. The light processing element includes a photoelectric converter and an electrical signal processor. The light emitting optical fiber is used to emit the detection light. The receiving optical fiber is used to receive the reflected light. The photoelectric converter is connected to the receiving optical fiber and is used to convert the light intensity signal of the reflected light received by the receiving optical fiber into an electrical signal. The electrical signal processor is connected to the photoelectric converter and is used to process the electrical signal converted by the photoelectric converter into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharge part.

4. The semiconductor cleaning process equipment according to claim 2, characterized in that, the cleaning component includes a first pipe body. The first pipe body has a liquid inlet part and the liquid discharge part. The liquid inlet part is communicated with the liquid discharge part and is communicated with a liquid supply component, and is used to convey the cleaning liquid provided by the liquid supply component to the liquid discharge part. At least the material of the liquid discharge part of the first pipe body is a transparent material. The light sensing element is arranged outside the liquid discharge part and emits detection light from above the liquid discharge port through the liquid discharge part to the liquid level of the cleaning liquid in the liquid discharge part.

5. The semiconductor cleaning process equipment according to claim 4, characterized in that, the cleaning component further includes a second pipe body. The second pipe body is at least sleeved outside the liquid discharge part. The light sensing element penetrates through the second pipe body.

6. The semiconductor cleaning process equipment according to claim 5, characterized in that, the detection component further includes a fixing part. The fixing part is fixedly arranged outside the second pipe body. The light sensing element penetrates through the fixing part. The fixing part is used to fix the light sensing element.

7. The semiconductor cleaning process equipment according to claim 5, characterized in that, The first tube body further includes a conveying portion, which is disposed between the liquid inlet portion and the liquid discharge portion and is respectively communicated with the liquid inlet portion and the liquid discharge portion. The liquid discharge portion has a bent section, and the liquid discharge portion is communicated with the conveying portion through the bent section. The light sensing member is correspondingly disposed with the bent section.

8. The semiconductor cleaning process equipment according to claim 7, wherein, the cleaning component further includes a rotating mechanism. The second tube body is sleeved outside the liquid discharge portion and the conveying portion. The rotating mechanism is connected to the second tube body and is used to drive the second tube body to rotate, so as to drive the first tube body to rotate.

9. The semiconductor cleaning process equipment according to claim 1, wherein, a back suction valve is arranged on the cleaning component, and in the direction of the cleaning component conveying the cleaning liquid, the back suction valve is located upstream of the liquid discharge portion. The back suction valve is used to control the on-off of the cleaning component.

10. The semiconductor cleaning process equipment according to claim 1, wherein, the semiconductor cleaning process equipment further includes a processing component, which is connected to the detection component and is used to judge whether the cleaning liquid in the liquid discharge portion drips after the cleaning component stops conveying the cleaning liquid according to the change range of the liquid level position of the cleaning liquid in the liquid discharge portion detected by the detection component.

11. A semiconductor cleaning process detection method, wherein, applied to the semiconductor cleaning process equipment according to any one of claims 1-10, the semiconductor cleaning process detection method includes: after the cleaning component stops conveying the cleaning liquid, detecting the liquid level position of the cleaning liquid in the liquid discharge portion; judging whether the cleaning liquid in the liquid discharge portion drips after the cleaning component stops conveying the cleaning liquid according to the change range of the liquid level position.

12. The semiconductor cleaning process detection method according to claim 11, wherein, the step of detecting the liquid level position of the cleaning liquid in the liquid discharge portion after the cleaning component stops conveying the cleaning liquid specifically includes: detecting the liquid level position of the cleaning liquid in the liquid discharge portion multiple times to obtain multiple first detection values; the step of judging whether the cleaning liquid in the liquid discharge portion drips after the cleaning component stops conveying the cleaning liquid according to the change range of the liquid level position specifically includes: calculating the difference between the maximum value and the minimum value among the multiple first detection values, and comparing the difference between the maximum value and the minimum value among the multiple first detection values with a preset first standard value; if the difference between the maximum value and the minimum value among the multiple first detection values is greater than the first standard value, it is judged that the cleaning liquid in the liquid discharge portion drips after the cleaning component stops conveying the cleaning liquid; The first standard value is the difference between the maximum value and the minimum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharge part multiple times after the cleaning part stops transporting the cleaning liquid and before the cleaning liquid in the cleaning part drips.

13. The semiconductor cleaning process detection method according to claim 11, wherein, after the cleaning part stops transporting the cleaning liquid, detecting the liquid level position of the cleaning liquid in the liquid discharge part specifically includes: emitting detection light to the liquid level of the cleaning liquid in the liquid discharge part and receiving the reflected light formed by the liquid level of the cleaning liquid in the liquid discharge part reflecting the detection light; judging whether the cleaning liquid in the liquid discharge part drips after the cleaning part stops transporting the cleaning liquid according to the change range of the liquid level position specifically includes: converting the light intensity signal of the received reflected light into an electrical signal and processing the converted electrical signal into a digital quantity representing the liquid level position of the cleaning liquid in the liquid discharge part; judging whether the cleaning liquid in the liquid discharge part drips after the cleaning part stops transporting the cleaning liquid according to the change range of the digital quantity.

14. The semiconductor cleaning process detection method according to claim 11, wherein, the semiconductor cleaning process detection method further includes: after the cleaning part stops transporting the cleaning liquid, detecting the liquid level position of the cleaning liquid in the liquid discharge part to obtain a second detection value, comparing the second detection value with a preset second standard value range, and if the second detection value is outside the second standard value range, judging that the cleaning part transports the cleaning liquid abnormally. The second standard value range is the minimum value to the maximum value obtained by detecting the liquid level position of the cleaning liquid in the liquid discharge part multiple times when the cleaning part transports the cleaning liquid normally and after the cleaning part stops transporting the cleaning liquid.

15. The semiconductor cleaning process detection method according to claim 11, wherein, the semiconductor cleaning process detection method further includes: during the process of the cleaning part transporting the cleaning liquid and after the cleaning part stops transporting the cleaning liquid, emitting detection light to the cleaning liquid in the liquid discharge part and receiving the reflected light formed by the cleaning liquid in the liquid discharge part reflecting the detection light; acquiring a plurality of light intensity signals of the reflected light during the process of the cleaning part transporting the cleaning liquid and processing them into corresponding plurality of digital quantities as a plurality of third detection values, and acquiring a plurality of light intensity signals of the reflected light after the cleaning part stops transporting the cleaning liquid and processing them into corresponding plurality of digital quantities as a plurality of fourth detection values; Calculate the first average value of multiple said third detection values and the second average value of multiple said fourth detection values, calculate the difference between the first average value and the second average value, and compare the difference between the first average value and the second average value with a preset third standard value. If the difference between the first average value and the second average value is less than or equal to the third standard value, it is determined that the cleaning component transports the cleaning liquid abnormally; When the cleaning component transports the cleaning liquid normally, during the process of the cleaning component transporting the cleaning liquid and after the cleaning component stops transporting the cleaning liquid, detection light is emitted to the cleaning liquid in the liquid discharge part, and the reflected light formed by the cleaning liquid in the liquid discharge part reflecting the detection light is received. Multiple light intensity signals of the reflected light during the process of the cleaning component transporting the cleaning liquid are obtained and processed into corresponding multiple digital quantities as multiple fifth detection values, and multiple light intensity signals of the reflected light after the cleaning component stops transporting the cleaning liquid are obtained and processed into corresponding multiple digital quantities as multiple sixth detection values. Calculate the absolute values of the differences between the maximum value among multiple said fifth detection values and the maximum value and the minimum value among multiple said sixth detection values respectively, and the minimum absolute value among the absolute values of the differences between the minimum value among multiple said fifth detection values and the maximum value and the minimum value among multiple said sixth detection values respectively. The minimum absolute value is used as the third standard value.

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