Substrate transfer device and substrate processing apparatus including the same

Abstract

The invention relates to a substrate transfer apparatus and a substrate processing apparatus including the same. When the first sensor (22a) and the second sensor (22b) respectively detect that the substrate (W) is placed on the first guide (32a) and the second guide (32b), the pusher (35) is allowed to change from the open state to the closed state. On the other hand, when at least one of the first sensor (22a) and the second sensor (22b) does not detect the substrate (W), the pusher (35) is prohibited from changing from the open state to the closed state.

Description

Technical Field

[0001] The present invention relates to a substrate transfer device for transferring various substrates such as semiconductor substrates, substrates for flat panel displays (FPDs) such as liquid crystal display or organic EL (Electroluminescence) display devices, glass substrates for photomasks, and substrates for optical discs, and a substrate processing device including the same. Background Art

[0002] Conventionally, as a substrate transfer device that performs required substrate transfer after substrate processing, there is a device including a hand body portion having a plurality of tactile sensors. If a substrate can be placed on the plurality of tactile sensors, the tactile sensors detect a force in the Z-axis direction. In this way, it is possible to recognize that the substrate is normally placed on the hand body portion. In addition, it is also possible to detect an angular deviation of the hand body portion in the Z-axis direction by the tactile sensors.

[0003] [List of Background Art Documents]

[0004] Japanese Patent Application Laid-Open No. 2022-91240

[0005] However, the conventional substrate transfer device having tactile sensors does not fully utilize the tactile sensors. For example, according to the configuration of Patent Document 1, the tactile sensors are only used to detect abnormalities in substrate transfer.

[0006] Currently, there is a demand for a substrate transfer device that can transfer multiple types of substrates. Such a substrate transfer device needs to transfer substrates based on multiple transfer modes. Although a device that can detect the state of a substrate placed on a hand body portion by tactile sensors is considered, a specific configuration for realizing it has not been studied. Summary of the Invention

[0007] The present invention has been made in view of such circumstances, and an object thereof is to provide a substrate transfer device that can efficiently transfer multiple types of substrates and a substrate processing device including the same.

[0008] That is, the present invention provides a substrate transfer device having a hand that can transfer a substrate in a horizontal posture, and

[0009] the hand includes:

[0010] a base member;

[0011] a first guide member provided on an upper surface of the base member, supporting a lower portion of a periphery of the substrate and abutting against an outer peripheral surface of the substrate;

[0012] a first sensor that detects that the substrate is placed on the first guide member;

[0013] The second guide member is disposed on the upper surface of the base member, supports the lower part of the periphery of the substrate, and abuts against the outer peripheral surface of the substrate;

[0014] The second sensor detects that the substrate is placed on the second guide member; and

[0015] The pusher is disposed opposite to the first guide member and the second guide member on the upper surface of the base member, and can move forward and backward toward the first guide member and the second guide member; and the substrate transfer device includes:

[0016] The pusher driving unit moves the pusher forward and backward; and

[0017] The control unit controls the pusher driving unit; and

[0018] The control unit

[0019] can be switched between an open state and a closed state, and in the open state, the pusher is separated from the outer peripheral surface of the substrate placed on the first guide member and the second guide member,

[0020] In the closed state, the pusher abuts against the outer peripheral surface of the substrate and presses the substrate against the first guide member and the second guide member to clamp the substrate.

[0021] The control unit

[0022] When the pusher is in the open state and the substrate is received by the hand,

[0023] When both the first sensor and the second sensor respectively detect that the substrate is placed on the first guide member and the second guide member, the pusher is allowed to change from the open state to the closed state,

[0024] When at least one of the first sensor and the second sensor does not detect the substrate, the pusher is prohibited from changing from the open state to the closed state.

[0025] [Function and Effect] According to the above configuration, it includes: a first sensor for detecting that the substrate is placed on the first guide; a second sensor for detecting that the substrate is placed on the second guide; and a thruster disposed opposite to the first guide and the second guide, capable of advancing and retreating toward the first guide and the second guide. Moreover, when both the first sensor and the second sensor respectively detect that the substrate is placed on the first guide and the second guide, the thruster is allowed to change from the open state to the closed state, and when at least one of the first sensor and the second sensor does not detect the substrate, the thruster is prohibited from changing from the open state to the closed state. If configured in this way, the first sensor and the second sensor can be used to grasp the condition of the substrate. That is to say, when both the first sensor and the second sensor respectively detect that the substrate is placed on the first guide and the second guide, it can be determined that the shape of the substrate is close to flat. On the other hand, when at least one of the first sensor and the second sensor does not detect the substrate, it can be determined that the shape of the substrate is far from flat. Thus, if the condition of the substrate is understood, the opening and closing of the thruster can be appropriately controlled according to the condition of the substrate. Therefore, according to the present invention, a substrate transfer device capable of efficiently transferring multiple types of substrates can be provided.

[0026] In addition, preferably, in the substrate transfer device,

[0027] when both the first sensor and the second sensor respectively detect that the substrate is placed on the first guide and the second guide,

[0028] the control unit compares the time point when the first sensor detects that the substrate is placed on the first guide with the time point when the second sensor detects that the substrate is placed on the second guide, and obtains the time difference between the two.

[0029] When the time difference is within a preset reference time difference, the thruster is allowed to change from the open state to the closed state.

[0030] When the time difference exceeds the preset reference time difference, the thruster is prohibited from changing from the open state to the closed state.

[0031] [Function and Effect] According to the described configuration, even when the first sensor and the second sensor both detect that the substrate is placed on the first guide member and the second guide member respectively, the condition of the substrate can be correctly detected. That is to say, according to the described configuration, the time point when the first sensor detects that the substrate is placed on the first guide member is compared with the time point when the second sensor detects that the substrate is placed on the second guide member, and the time difference between the two is obtained. And if the obtained time difference is within the standard time difference, it can be determined that the shape of the substrate is close to flat. In addition, when the obtained time difference exceeds the standard time difference, it can be determined that the shape of the substrate is far from flat. Thus, if the condition of the substrate is known, the opening and closing of the thruster can be appropriately controlled in accordance with the condition of the substrate. Therefore, according to the present invention, a substrate transfer device capable of efficiently transferring multiple types of substrates can be provided.

[0032] In addition, preferably, in the substrate transfer device, there is provided:

[0033] A transfer mechanism for moving the hand,

[0034] The transfer mechanism can be switched to a mode in which the hand moves at a first moving speed and a mode in which the hand moves at a second moving speed slower than the first moving speed,

[0035] The control unit

[0036] When the first sensor and the second sensor both detect that the substrate is placed on the first guide member and the second guide member respectively,

[0037] The time point when the first sensor detects that the substrate is placed on the first guide member is compared with the time point when the second sensor detects that the substrate is placed on the second guide member, and the time difference between the two is obtained,

[0038] When the time difference is within a preset reference time difference, the thruster is set from the open state to the closed state to clamp the substrate,

[0039] In addition, the transfer mechanism is controlled to move the hand that clamps the substrate at the first moving speed,

[0040] On the other hand, when at least one of the first sensor and the second sensor does not detect the substrate, and when the time difference exceeds the preset reference time difference,

[0041] It is prohibited to change the thruster from the open state to the closed state to set it to a state of not clamping the substrate,

[0042] In addition, the transfer mechanism is controlled to move the hand at the second moving speed in a state where the substrate is not clamped by the thruster.

[0043] [Function, effect] According to the above configuration, it is possible to switch between a mode in which the hand moves at a first moving speed and a mode in which the hand moves at a second moving speed slower than the first moving speed. And, if the obtained time difference is within the reference time difference, then after clamping the substrate by turning the thruster from the open state to the closed state, the hand moves at the first moving speed. And, if the obtained time difference exceeds the reference time difference, then after prohibiting the thruster from changing from the open state to the closed state, the hand moves at the second moving speed. In addition, when prohibiting the thruster from changing from the open state to the closed state, the hand also moves at the second speed. If configured in this way, a substrate transfer device with high throughput can be realized.

[0044] In addition, preferably, in the substrate transfer device,

[0045] the control unit

[0046] when at least one of the first sensor and the second sensor does not detect the substrate, and when the time difference exceeds a preset reference time difference,

[0047] instead of moving the hand at the second moving speed in a state where the substrate is not clamped by the thruster, the substrate is returned to the original slot.

[0048] [Function, effect] According to the above configuration, when prohibiting the thruster from changing from the open state to the closed state, the transfer of the substrate is aborted and the substrate is returned to the original slot. If configured in this way, a substrate transfer device can be provided that does not transfer substrates that are far from flat and suppresses the dropping of substrates.

[0049] In addition, preferably, in the substrate transfer device,

[0050] the first guide member includes a support portion that supports the lower periphery of the substrate and a wall portion that abuts against the outer peripheral surface of the substrate,

[0051] the second guide member includes a support portion that supports the lower periphery of the substrate and a wall portion that abuts against the outer peripheral surface of the substrate.

[0052] [Function, effect] According to the above configuration, the first guide member includes a support portion that supports the lower periphery of the substrate and a wall portion that abuts against the outer peripheral surface of the substrate, and the second guide member includes a support portion that supports the lower periphery of the substrate and a wall portion that abuts against the outer peripheral surface of the substrate. If configured in this way, a substrate transfer device can be provided that can minimize the dropping of substrates and reliably transfer substrates.

[0053] In addition, preferably, in the substrate transfer device,

[0054] the base member includes:

[0055] The first pallet;

[0056] The second pallet; and

[0057] A connecting part connecting the first pallet and the second pallet; and

[0058] The thruster is arranged at the connecting part,

[0059] The first guide is arranged on the first pallet,

[0060] The second guide is arranged on the second pallet.

[0061] [Function, effect] According to the above configuration, the base member includes a first pallet, a second pallet, and a connecting part connecting the first pallet and the second pallet. And, the thruster is arranged at the connecting part, the first guide is arranged on the first pallet, and the second guide is arranged on the second pallet. If configured in this way, a substrate transfer device capable of surely clamping a substrate can be provided.

[0062] In addition, preferably, in the substrate transfer device,

[0063] The first sensor is a tactile sensor and is arranged between the base member and the first guide,

[0064] The second sensor is a tactile sensor and is arranged between the base member and the second guide.

[0065] [Function, effect] According to the above configuration, the first sensor and the second sensor are tactile sensors. By adopting such a configuration, it can be surely detected whether the substrate is placed on the first guide and the second guide. In addition, according to the above configuration, the first sensor is arranged between the base member and the first guide. By configuring in this way, the first sensor can surely detect the placement of the substrate on the first guide. In addition, according to the above configuration, the second sensor is arranged between the base member and the second guide. By configuring in this way, the same effect as that of the first sensor is achieved.

[0066] In addition, preferably, in the substrate transfer device,

[0067] The first guide separates the support part from the wall part,

[0068] The first sensor is arranged between the base member and the support part of the first guide,

[0069] The second guide separates the support part from the wall part,

[0070] The second sensor is arranged between the base member and the support part of the second guide.

[0071] [Function and Effect] According to the described configuration, the first guide separates the support portion from the wall portion, and the first sensor is disposed between the base member and the support portion of the first guide. If configured in this way, a substrate transfer device capable of detecting the condition of the substrate by determining whether the substrate spans the wall portion can be provided. In addition, according to the described configuration, the second guide separates the support portion from the wall portion, and the second sensor is disposed between the base member and the support portion of the second guide. If configured in this way, the second sensor also exhibits the same effect as the first guide.

[0072] In addition, preferably, in the substrate transfer device,

[0073] the control unit

[0074] when the first sensor detects a specified load, it is determined that the substrate is placed on the first guide,

[0075] when the second sensor detects a specified load, it is determined that the substrate is placed on the second guide.

[0076] [Function and Effect] According to the described configuration, preferably, when the first sensor detects a specified load, it is determined that the substrate is placed on the first guide, and when the second sensor detects a specified load, it is determined that the substrate is placed on the second guide. If configured in this way, a substrate transfer device can be provided that does not malfunction even when the first sensor and the second sensor detect noise.

[0077] In addition, preferably, in the substrate transfer device,

[0078] the first sensor is embedded in a first recess formed in the base member,

[0079] the second sensor is embedded in a second recess formed in the base member.

[0080] [Function and Effect] According to the described configuration, the first sensor is embedded in a first recess formed in the base member, and the second sensor is embedded in a second recess formed in the base member. If configured in this way, a substrate transfer device can be provided that suppresses the thickness in the height direction of the hand and does not cause the hand to collide with the substrate during transfer.

[0081] In addition, preferably, in a substrate processing device including a substrate transfer device, there is provided:

[0082] a single wafer processing unit that processes the wafers transferred by the hand one by one.

[0083] [Function and Effect] According to the described configuration, there is provided a single wafer processing unit that processes the wafers transferred by the hand one by one. According to the described configuration, a substrate processing device capable of reliably transferring multiple types of substrates and performing substrate processing can be provided.

[0084] According to the present invention, a substrate transfer device capable of efficiently transferring substrates of multiple types and a substrate processing apparatus including the same can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0085] Figure 1 It is a top view showing the overall configuration of the substrate processing apparatus of the embodiment.

[0086] Figure 2 It is a side view showing the carrier of the embodiment.

[0087] Figure 3 It is a left side view showing the configuration of the acquisition hand and the return hand of the embodiment.

[0088] Figure 4 It is a top view showing the configuration of the acquisition hand and the return hand of the embodiment.

[0089] Figure 5 It is an exploded perspective view showing the configuration of the acquisition hand of the embodiment.

[0090] Figure 6 It is an exploded perspective view showing the configuration of the acquisition hand of the embodiment.

[0091] Figure 7 It is a top view showing the operation of the acquisition hand of the embodiment.

[0092] Figure 8 It is a cross-sectional view showing the operation of the acquisition hand of the embodiment.

[0093] Figure 9 It is a top view showing the operation of the acquisition hand of the embodiment.

[0094] Figure 10 It is a top view showing the operation of the acquisition hand of the embodiment.

[0095] Figure 11 It is a functional block diagram showing the operation of the acquisition hand of the embodiment.

[0096] Figure 12 It is a functional block diagram showing the operation of the acquisition hand of the embodiment.

[0097] Figure 13 It is a functional block diagram showing the operation of the acquisition hand of the embodiment.

[0098] Figure 14 It is a perspective view showing the operation of the acquisition hand of the embodiment.

[0099] Figure 15 It is a functional block diagram showing the operation of the acquisition hand of the embodiment.

[0100] Figure 16 It is a functional block diagram illustrating the operation of the hand for obtaining an embodiment.

[0101] Figure 17 It is a flowchart illustrating the process of the substrate in the embodiment.

[0102] Figure 18 It is a schematic diagram illustrating a first modification of the present invention.

[0103] Figure 19 It is a schematic diagram illustrating a first modification of the present invention.

[0104] Figure 20 It is a schematic diagram illustrating a first modification of the present invention. Detailed Embodiment

[0105] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The following embodiments are substrate processing apparatuses equipped with the substrate transfer apparatus of the present invention. The substrate transfer apparatus of the present invention corresponds to the transfer block of the substrate processing apparatus in the embodiment. The transfer block has a transfer robot equipped with a hand for transferring the substrate.

[0106] Specific Embodiment

[0107] 1. Overall Configuration

[0108] As Figure 1 shown, the substrate processing apparatus 1 of this example has a load port 10, a transfer block 3, and a processing block 5. The substrate processing apparatus 1 of this example is for single-wafer substrate processing, and is configured to obtain a substrate W in a horizontal posture piece by piece from a carrier C, perform substrate processing, and then return the substrate W to the carrier piece by piece.

[0109] In this specification, for convenience, the direction in which the transfer block 3 and the processing block 5 of the substrate processing apparatus 1 are arranged is referred to as the "front-rear direction X". The front-rear direction X extends horizontally. The direction from the processing block 5 to the transfer block 3 in the front-rear direction X is referred to as "front". The direction opposite to the front is referred to as "rear". The direction extending horizontally and orthogonal to the front-rear direction X is referred to as the "width direction Y". For convenience, one direction of the "width direction Y" is referred to as "right", and for convenience, the other direction is referred to as "left". For convenience, the direction (height direction) orthogonal to the front-rear direction X and the width direction Y is referred to as the "vertical direction Z". In each figure, for reference, front, rear, right, left, up, and down are appropriately shown.

[0110] The load port 10 corresponds to the carrier mounting rack of the present invention. The load port 10 is a carrier mounting rack for mounting the carrier C. A plurality of load ports 10 are arranged in the width direction Y, and each can mount the carrier C one by one. The load port 10 can mount the carrier C in which substrates in a horizontal posture are stacked and stored in the vertical direction.

[0111] That is, the carrier C stores multiple substrates W in a horizontal posture with a specified interval in the vertical direction Z. In addition, an opening for substrate removal and storage is provided on one side of the carrier C. Multiple (e.g., 25) substrates W are stacked and stored in a single carrier C in a horizontal posture with a fixed interval. Figure 2 It is a cross-sectional view showing the structure of the carrier C. For the carrier C, a comb-shaped member 7 having multiple protrusions for placing the substrate W is provided at both ends of the carrier housing. The protrusions of the comb-shaped member 7 are configured to support the ends of the substrate W. The protrusions extend in the front-rear direction X. The protrusions are arranged at intervals of 1 cm. The depressions between the protrusions form grooves for accommodating the substrate W. As the carrier C, for example, there is a closed-type FOUP (Front Opening Unified Pod). In the present invention, an open container can also be used as the carrier C.

[0112] The transfer block 3 corresponds to the substrate transfer device of the present invention. The transfer block 3 is rectangular and extends in the width direction Y. The transfer block 3 includes a transfer robot IR having an acquisition hand 11a capable of transferring a substrate in a horizontal posture and a return hand 11b. The transfer robot IR can move horizontally in the width direction Y. The transfer robot IR has a hand capable of holding and transferring the substrate W. The hand is supported by a multi-joint arm capable of rotational movement, lifting movement, and advancing and retreating movement. The transfer robot IR can access the carrier C on the load port 10 and the passage 24 provided in front of the processing block 5. The transfer robot IR can perform two operations, namely: the operation of sequentially acquiring the substrate W in a horizontal posture from the carrier C and placing it on the passage 24; and the operation of sequentially acquiring the substrate W in a horizontal posture placed on the passage 24 and returning it to the carrier C. The unprocessed substrate W held in the carrier C is transferred to the passage 24 by the transfer robot IR. And, the processed substrate W is placed on the passage 24 and returned to the carrier C by the transfer robot IR.

[0113] The processing block 5 is configured to perform a specified process on the substrate W. The processing block 5 is provided with a plurality of single-wafer processing chambers 5a. The single-wafer processing chamber 5a corresponds to the single-wafer processing unit of the present invention. The single-wafer processing chamber 5a is configured to process the substrate W transferred by the acquisition hand 11a of the transfer robot IR described later one by one.

[0114] The configuration of the single-wafer processing chambers 5a in the processing block 5 will be described. That is, in the processing block 5 of the present invention, three single-wafer processing chambers 5a are arranged in each of the middle layer region, upper layer region, and lower layer region to form a stacked body. Two stacked bodies are arranged in the front-rear direction on the right side of the processing block 5. Similarly, two stacked bodies are arranged in the front-rear direction on the left side of the processing block 5. Therefore, twelve single-wafer processing chambers 5a are mounted in the processing block 5.

[0115] In the central part of the processing block 5, a substrate transfer area extending in the front-rear direction X is provided. The central robot CR can reciprocate in the substrate transfer area, can pick up a substrate W in a horizontal posture piece by piece from the passage 24, and transfer it to any one of the single wafer processing chambers 5a. Further, the central robot CR can pick up a substrate W in a horizontal posture held in the single wafer processing chamber 5a piece by piece, and return it to the passage 24. Thus, the central robot CR can access each of the single wafer processing chambers 5a and the passage 24.

[0116] As the substrate processing performed in the single wafer processing chamber 5a, for example, there is a substrate cleaning process. The substrate processing apparatus 1 in this example may be configured to perform various substrate processes using a chemical solution in addition to the substrate cleaning process.

[0117] 2. Configuration of the transfer robot

[0118] Figure 3 The front end portion related to substrate holding of the transfer robot IR is schematically shown. The transfer robot IR includes a pickup hand 11a and a return hand 11b. The return hand 11b and the pickup hand 11a are held on the arm 12 in a stacked state in the vertical direction Z. The arm 12 can move the return hand 11b and the pickup hand 11a individually forward and backward in the front-rear direction X. Figure 3 In the configuration, the return hand 11b and the pickup hand 11a are arranged in order from top to bottom, but the order of arrangement of each component can be appropriately changed.

[0119] The transfer mechanism 53 moves the arm 12 based on the control of the control unit 100, thereby transferring the substrate W. When the transfer mechanism 53 moves the arm 12, the pickup hand 11a and the return hand 11b also move accordingly. The transfer mechanism 53 can move the pickup hand 11a not only in the front-rear direction but also in the left-right direction. In addition, the transfer mechanism 53 can rotate the pickup hand 11a about the vertical axis. Thus, the transfer mechanism 53 is configured to move the pickup hand 11a. Further, the transfer mechanism 53 also moves and rotates the return hand 11b in the same manner as the pickup hand 11a.

[0120] The pickup hand 11a corresponds to the hand of the present invention. The pickup hand 11a picks up an unprocessed substrate W piece by piece by entering between the vertically adjacent substrates W, and transfers it from the carrier C to the passage 24.

[0121] The substrate acquisition hand 11a includes a base member 31 and guide members 32a and 32b. The guide members 32a and 32b correspond to the first guide member and the second guide member of the present invention. The base member 31 has a flat shape so as to be able to enter between substrates. The guide members 32a and 32b are located at the front end portion of the substrate acquisition hand 11a and are configured such that the end portions of the substrate W abut thereon. That is, the guide members 32a and 32b are protrusions provided at the front end of the base member 31 and are members that come into contact with the substrate W. The guide members 32a and 32b are provided on the upper surface of the base member 31. Therefore, the guide members 32a and 32b are configured to support the lower portion of the peripheral edge of the upper substrate W. Therefore, the guide members 32a and 32b are configured to abut on the outer peripheral surface of the substrate.

[0122] The guide members 32a and 32b have a support portion for supporting the lower portion of the peripheral edge of the substrate W and a wall portion for abutting on the outer peripheral surface. That is, the guide members 32a and 32b have a thick wall portion and a thin wall portion. Therefore, the thickness of the guide members 32a and 32b is locally different in the height direction. The wall portion of the thick wall portion of the guide members 32a and 32b that faces the base end portion of the substrate acquisition hand 11a can contact the end portion (beveled surface) of the substrate W. The support portion facing upward in the thin wall portion of the guide members 32a and 32b can contact the peripheral edge portion of the lower surface of the substrate. The guide members 32a and 32b are provided on the upper surface of the base member 31 and are configured to abut on the outer peripheral surface of the substrate. The guide members are also provided at the base end portion of the base member 31, but this configuration will be described below.

[0123] Since the guide members 32a and 32b provided at the front end portion of the base member 31 are conical in shape, this will be described. The upper surface of the thin wall portion of the guide members 32a and 32b is inclined as Figure 3 shown. That is, the thin wall portion is configured such that the thickness in the height direction becomes smaller as it is farther from the thick wall portion. Thus, the guide members 32a and 32b include a conical portion (thin wall portion) for the lower portion of the substrate W to contact and a wall portion (side surface of the thick wall portion) for the outer peripheral surface of the substrate to contact. The conical portion of the guide members 32a and 32b corresponds to the support portion of the present invention.

[0124] Similarly, the guide members 34a and 34b provided at the base end portion of the base member 31 are conical in shape as Figure 3 shown. That is, the thin wall portion is configured such that the thickness in the height direction becomes smaller as it is farther from the thick wall portion. Thus, the guide members 34a and 34b include a conical portion (thin wall portion) for the lower portion of the substrate W to contact and a wall portion (side surface of the thick wall portion) for the outer peripheral surface of the substrate to contact.

[0125] The return hand 11b has the same configuration as the acquisition hand 11a. That is, the return hand 11b includes a base member 31 and guide members 32a and 32b. In the return hand 11b, the guide members 32a and 32b are arranged at the front end portion and the base portion of the base member 31, and the guide members 32a and 32b have a thin wall portion and a thick wall portion, which are the same as the configuration of the acquisition hand 11a. The return hand 11b of this example is provided for transporting the cleaned and clean substrate W. By distinguishing the use of hands on the forward and return paths of the reciprocating movement of the substrate W, it is not necessary for the hand holding the substrate W before the cleaning process to hold the substrate W after the cleaning process. Therefore, by providing the return hand 11b, the cleanliness of the cleaned substrate W is maintained.

[0126] In addition, the return hand 11b does not require the first sensor 22a and the second sensor 22b described later.

[0127] Figure 4 It is a top view showing the acquisition hand 11a and the return hand 11b. The acquisition hand 11a and the return hand 11b include a connecting portion 36, and a first pallet 33a and a second pallet 33b formed by branching from the connecting portion 36. The connecting portion 36 is configured to connect the first pallet 33a and the second pallet 33b. The first pallet 33a is a member that holds one end portion of the substrate W and extends in the front-rear direction X, and the second pallet 33b is a member that holds the other end portion of the substrate W and extends in the front-rear direction X.

[0128] The guide member 32a is arranged on the first pallet 33a. The guide member 32a corresponds to the first guide member of the present invention. The guide member 32b is arranged on the second pallet 33b. The guide member 32b corresponds to the second guide member of the present invention. In addition, the guide member 34a is arranged on the first pallet 33a. The guide member 34b is arranged on the second pallet 33b.

[0129] The wall portions A of the guide members 32a, 32b, 34a, and 34b are arranged in a manner that belongs to an imaginary circle slightly larger than the substrate W. As a result, the substrate W falls into the receiving area of the substrate W formed by the thin wall portions of the guide members 32a, 32b, 34a, and 34b.

[0130] The pusher 35 is a component disposed on the upper surface of the base member 31. The pusher 35 is disposed at the front end of the connecting portion 36 in a manner facing the guide members 32a and 32b. The pusher 35 is located on the line segment at the middle position between the guide members 32a and 32b and at the middle position between the guide members 34a and 34b. The pusher 35 can push the substrate W held by the guide members 32a, 32b, 34a, and 34b in the forward direction, that is, push against the guide members 32a and 32b. Therefore, the pusher 35 can move forward and backward with respect to the guide members 32a and 32b. The pusher 35 can move in the rear direction to be in an open state and can move in the forward direction to be in a closed state. In order to hold the substrate W by the first pallet 33a and the second pallet 33b, first, the pusher 35 is set to the open state, and the substrate W is held by the guide members 32a, 32b, 34a, and 34b. Then, the pusher 35 is set to the closed state, and the substrate W is clamped between the guide members 32a, 32b and the pusher 35. In this way, the clamping of the substrate W is performed.

[0131] 3. Regarding the sensor

[0132] Figure 5 It is an exploded perspective view illustrating the configuration of the acquisition hand 11a. Figure 5 In [the figure], in order to easily understand the assembly structure of the sensor, the guide members 32a, 32b, 34a, and 34b are omitted from the illustration. At the front end of the first pallet 33a, a first recess 37a for burying the first sensor 22a is provided. Similarly, at the front end of the second pallet 33b, a second recess 37b for burying the second sensor 22b is provided.

[0133] As the first sensor 22a and the second sensor 22b, for example, tactile sensors are used. Hereinafter, the first sensor 22a will be described as an example. Figure 6It is an exploded perspective view showing the positional relationship between the first sensor 22a and the guide member 32a. The guide member 32a and the first sensor 22a are arranged in the Z direction. The first sensor 22a is composed of a main body portion 221 and an elastic body 222 made of an elastic member. The main body portion 221 has an electronic circuit, measures the weight or torque applied to the elastic body 222 in three-dimensional directions, and outputs an electrical signal. When the first sensor 22a is mounted on the first pallet 33a, the main body portion 221 is buried in the first recess 37a, and the elastic body 222 protrudes from the upper surface of the first pallet 33a. The guide member 32a is fixed to the elastic body 222. Therefore, the first sensor 22a is a tactile sensor and is provided between the base member 31 and the guide member 32a. If the substrate W is placed on the guide member 32a, the elastic body 222 deforms. Based on this, the first sensor 22a detects whether the substrate W is in contact with the guide member 32a. That is to say, the first sensor 22a is configured to detect that the substrate W is placed on the guide member 32a.

[0134] More specifically, the first sensor 22a can detect the load applied to the guide member 32a. Therefore, when no substrate W is placed on the guide member 32a, the first sensor 22a outputs a signal indicating 0 mg, and when the substrate W is placed on the guide member 32a, it outputs a signal indicating the weight of the substrate. However, since the substrate W is supported by the guide member 32a, the guide member 32b, the guide member 34a, and the guide member 34b, the weight of the substrate W is dispersed to each guide member. Therefore, the first sensor 22a outputs a signal indicating a weight less than the total weight of the substrate W at most.

[0135] The second sensor 22b has the same configuration as the first sensor 22a. That is to say, the second sensor 22b is configured to detect that the substrate W is placed on the guide member 32a.

[0136] In addition, the second sensor 22b can detect the load input to the guide member 32b. This is the same as the configuration of the first sensor 22a.

[0137] When the first sensor 22a and the second sensor 22b detect a specified load, it is determined that the substrate is placed on the first guide member 32a and the second guide member 32b.

[0138] 4. Structure of the Thruster

[0139] Hereinafter, the state change of the thruster 35 will be specifically described. Figure 7This illustrates the state of the acquisition hand 11a when the thruster 35 is in the open state. At this time, the substrate W is placed on the substrate receiving portion formed by the wall portions A of the guide members 32a, 32b, 34a, and 34b. Since the substrate receiving portion is a region with a diameter larger than that of the substrate W, there is a gap between each wall portion A and the substrate W. At this time, the substrate W is placed on the guide members 32a and 32b.

[0140] Figure 8 This is a cross-sectional view of the acquisition hand 11a when the thruster 35 is in the open state. The guide members 32a and 34 are in contact with the outer peripheral surface of the substrate in the tapered portion B. In addition, although not described in Figure 8 the guide member 32b is also in contact with the outer peripheral surface of the substrate W in the tapered portion B. The outer peripheral surface of the substrate W is located at a position away from the wall portion A of each guide member.

[0141] Figure 9 This illustrates the state of the acquisition hand 11a when the thruster 35 is in the closed state. At this time, the substrate W is pushed by the thruster 35 and held (clamped) in the acquisition hand 11a. As shown in the reference Figure 9 it can be seen that the substrate W is pushed by the thruster 35 and abuts against the wall portion A of the guide member 32a. In addition, although not described in Figure 9 the wall portion A of the guide member 32b also abuts against the substrate W. The substrate W abuts against the wall portion A with its outer peripheral surface. In this way, when the thruster 35 is in the closed state, the substrate W is held by the thruster 35, the guide member 32a, and the guide member 32b. In addition, after the thruster 35 pushes the substrate W, the substrate W moves away from the guide members 34a and 34b. In this way, the thruster 35 can be switched between the open state and the closed state.

[0142] Figure 10 This is a cross-sectional view of the acquisition hand 11a when the thruster 35 is in the closed state. According to the figure, the substrate W is pressed against the guide member 32a by the thruster 35, and the substrate is held by the guide member 32a and the thruster 35. At this time, the substrate W moves away from the wall portions A of the guide members 34a and 34b. In this way, if the substrate W is pushed by the thruster 35, the substrate W is fixed in the acquisition hand 11a, so the substrate W can be transported reliably.

[0143] 5. Control of the Thruster

[0144] Figure 11 This is a view of the acquisition hand 11a observed from the S direction. Hereinafter, refer to Figure 11, the control of the thruster 35 will be described. The thruster drive mechanism 43 can move the thruster 35 forward and backward along the first pallet 33a and the second pallet 33b. That is to say, the thruster drive mechanism 43 is a component that displaces the thruster 35. The thruster drive mechanism 43 is constituted by, for example, a servo motor or a cylinder.

[0145] The control unit 100 is a component that controls the thruster drive mechanism 43. That is to say, the control unit 100 can switch the thruster 35 between the open state and the closed state. When the thruster 35 is in the open state, the substrate W is placed on the guide members 32a, 32b, 34a, and 34b. In addition, when the thruster 35 is in the closed state, the thruster 35 presses the substrate W, and it is also possible to hold the substrate W with the hand for acquisition.

[0146] The open state of the thruster 35 means that the thruster 35 is separated from the outer peripheral surface of the substrate placed on the guide members 32a and 32b. In addition, the closed state of the thruster 35 means that the thruster 35 abuts against the outer peripheral surface of the substrate W and presses the substrate W against the guide members 32a and 32b to hold the substrate W.

[0147] When the substrate W is not placed, the first sensor 22a and the second sensor 22b do not detect the substrate W. Thus, when neither the first sensor 22a nor the second sensor 22b detects the substrate W, the control unit 100 receives the outputs of the first sensor 22a and the second sensor 22b and sets the state of the thruster 35 to the open state.

[0148] Figure 12 The situation when the hand for acquisition 11a receives the substrate W is shown. If the substrate W is placed on the guide member 32a, the load of the substrate W is transmitted in the guide member 32a and reaches the first sensor 22a. The first sensor 22a measures the load of the substrate loaded on the guide member 32a. The signals representing the respective measurement results are input to the control unit 100.

[0149] When the control unit 100 sets the thruster 35 to the open state and the hand for acquisition 11a receives the substrate W, and when the first sensor 22a and the second sensor 22b both detect that the substrate W is placed on the first guide member 32a and the second guide member 32b respectively, the control unit 100 allows the thruster 35 to change from the open state to the closed state. Based on this, as Figure 13 shown, the thruster drive mechanism 43 sets the thruster 35 to the closed state, and the thruster 35 presses the substrate W.

[0150] On the other hand, Figure 14The substrate Wd shown is not flat and protrudes upward against the peripheral edge of the guide member 32a. When transporting such a substrate Wd by hand 11a, if the pusher 35 is in the closed state, it may cause the substrate Wd to break or the substrate Wd to fall off the hand 11a for picking up. The control unit 100 also operates assuming the possibility of the hand 11a for picking up obtaining the substrate Wd.

[0151] Figure 15 Shows the situation when the hand 11a for picking up receives Figure 14 the substrate Wd shown. Since the substrate Wd is not flat, after being received by the hand 11a for picking up, it does not abut against the guide member 32a. Therefore, at this time, the first sensor 22a does not output a signal detecting the substrate Wd to the control unit 100. On the other hand, since the substrate Wd abuts against the guide member 32b, the second sensor 22b outputs a signal detecting the substrate Wd and a signal indicating the load borne by the guide member 32b to the control unit 100.

[0152] Thus, when the second sensor 22b detects that the substrate W is placed on the guide member 32b and the first sensor 22a does not detect that the substrate W is placed on the guide member 32a, the control unit 100 prohibits the pusher 35 from changing from the open state to the closed state.

[0153] Figure 15 In the example, it is the case where the second sensor 22b detects the substrate W, but the configuration of this embodiment also assumes the case where the first sensor 22a detects the substrate W instead of the second sensor 22b. That is, when the first sensor 22a detects that the substrate W is placed on the guide member 32a and the second sensor 22b does not detect that the substrate W is placed on the guide member 32b, the control unit 100 prohibits the pusher 35 from changing from the open state to the closed state.

[0154] In addition, Figure 15 in the example, it is the case where the second sensor 22b detects the substrate W, but the configuration of this embodiment also assumes the case where neither the first sensor 22a nor the second sensor 22b detects the substrate W. The position of the substrate W stored in the carrier C is pre-detected by a prior positioning operation of inserting the hand 11a for picking up into the carrier C. Therefore, even without using the hand 11a for picking up, it has been detected that the substrate W is located in a specified slot. The hand 11a for picking up moves below the substrate W in order to pick up the substrate W detected by the positioning operation. However, due to the warping of the substrate W, there is also a case where the substrate W floats in both the guide member 32a and the guide member 32b and is supported by the guide members 34a and 34b. In this case, neither the first sensor 22a nor the second sensor 22b detects the substrate W regardless of whether the substrate W exists. For this case, the control unit 100 also prohibits the pusher 35 from changing from the open state to the closed state.

[0155] In summary, in the configuration of this embodiment, when the shape of the substrate W is close to flat, the pusher 35 is allowed to shift to the closed position, and when the shape of the substrate W is far from flat, the pusher 35 is prohibited from shifting to the closed state. In other words, when at least one of the first sensor 22a and the second sensor 22b does not detect the substrate W, the pusher 35 is prohibited from shifting to the closed state.

[0156] Figure 15 In the example of, there is a case where even if the first sensor 22a does not detect the substrate W, but when the first sensor 22a detects the substrate W, the pusher 35 is also prohibited from shifting to the closed state, so this point will be described.

[0157] Figure 15 In the example of, since the shape of the substrate W is far from flat, the first sensor 22a does not detect the substrate W. However, when the shape of the substrate W is closer to flat, there is a case where not only the second sensor 22b but also the first sensor 22a detects the substrate W. This embodiment can distinguish such a substrate W with less deformation from a flat substrate W. Even when the deformation of the substrate W placed on the acquisition hand 11a is small, the pusher 35 is prohibited from shifting to the closed state.

[0158] That is to say, when both the first sensor 22a and the second sensor 22 detect that the substrate W is placed on the guide member 32a and the guide member 32b respectively, the control unit 100 performs the following operations. First, the control unit 100 compares the time point when the first sensor 22a detects that the substrate W is placed on the guide member 32a with the time point when the second sensor 22b detects that the substrate W is placed on the guide member 32b, and obtains the time difference between the two. And when the time difference is within a preset reference time difference, the control unit 100 allows the pusher 35 to change from the open state to the closed state. On the other hand, when the time difference exceeds the preset reference time difference, the control unit 100 prohibits the pusher 35 from changing from the open state to the closed state.

[0159] This operation of the control unit 100 utilizes the time difference generated between the detection of the first sensor 22a and the inspection of the second sensor 22b when the substrate W is deformed. If the substrate W is flat, then the first sensor 22a and the second sensor 22b should detect the substrate W simultaneously. However, if the substrate W is deformed, then according to the deformation of the substrate W, a time difference is generated in the detection timings of the first sensor 22a and the second sensor 22b. The control unit 100 of this embodiment utilizes the said time difference and operates without missing the minute deformation of the substrate W.

[0160] 6. Movement control of the acquisition hand

[0161] Since the substrate processing apparatus 1 of the present embodiment can change the moving speed of the pickup hand 11a according to the condition of the substrate W, this will be described. That is, the transfer mechanism 53 of the present embodiment can switch between a high-speed mode and a low-speed mode. The high-speed mode moves the pickup hand 11a at a first moving speed, and the low-speed mode moves the pickup hand 11a at a second moving speed slower than the first moving speed.

[0162] The configuration related to the high-speed mode will be described. When the first sensor 22a detects that the substrate W is placed on the guide member 32a and the second sensor 22b detects that the substrate W is placed on the guide member 32b, as described above, the control unit 100 obtains the detected time difference. When the time difference is within the reference time, the thruster 35 changes from the open state to the closed state, and the substrate W is clamped by the pickup hand 11a. At this time, the transfer of the substrate W is performed in the high-speed mode, and the substrate w is transferred at the first transfer speed. Since the substrate W is firmly supported by the pickup hand 11a through the thruster 35, even if the substrate W is transferred at high speed, the substrate W will not slip off the pickup hand 11a.

[0163] The configuration related to the low-speed mode will be described. When the first sensor 22a detects that the substrate is placed on the guide member 32a and the second sensor 22b does not detect that the substrate is placed on the guide member 32b, the control unit 100 prohibits the thruster 35 from changing from the open state to the closed state, and becomes a state where the substrate W is not clamped. At this time, the transfer of the substrate W is performed in the low-speed mode, and the substrate W is transferred at the second moving speed.

[0164] Similarly, when the second sensor 22b detects that the substrate is placed on the guide member 32b and the first sensor 22a does not detect that the substrate is placed on the guide member 32a, the control unit 100 keeps the thruster 35 in the open state and transfers the substrate W at the second speed. In addition, when the time difference exceeds the reference time even when the first sensor 22a detects that the substrate W is placed on the guide member 32a and the second sensor 22b detects that the substrate W is placed on the guide member 32b, the control unit 100 keeps the thruster 35 in the open state and transfers the substrate W at the second speed.

[0165] In addition, it can also be configured to abort the substrate transfer instead of transferring the substrate W in the low-speed mode. In this case, the pickup hand 11a picks up and holds the substrate W from the groove formed by the comb-shaped member 7 of the carrier C, but the control unit 100 determines that the substrate W cannot be transferred, and lowers the substrate W and returns it to the original groove. And the pickup hand 11a moves toward picking up other substrates W stored in the carrier C. That is, even if there are substrates that cannot be transferred mixed in the substrates W of the carrier C, the transfer operation of the substrate W is continued without interruption.

[0166] 7. Other components

[0167] As shown in Figure 1 FIG. 387, the transfer block 3 includes a control unit 100 related to the control of the transfer robot IR. The control unit 100 is constituted by, for example, a CPU (Central Processing Unit). The specific constitution of the control unit 100 is not limited. For example, the control related to the acquisition hand 11a and the control related to the return hand 11b can be constituted by a single processor, or can be constituted by individual processors.

[0168] As the control related to the control unit 100, for example, there are controls related to the forward and backward movements of the acquisition hand 11a, the forward and backward movements of the return hand 11b, the rotational movement of the acquisition hand 11a, the rotational movement of the return hand 11b, the lifting movement of the acquisition hand 11a, and the lifting movement of the return hand 11b.

[0169] The storage unit stores programs related to control, or parameters such as specified values. The storage unit can be constituted by a single device, or can be constituted by individual devices corresponding to each control. The transfer block 3 of the present invention has no particular limitation on the constitution of the device for realizing the storage unit.

[0170] 8. Substrate processing flow

[0171] Hereinafter, with reference to Figure 17 FIG. 396, the substrate processing flow of the substrate processing apparatus 1 of the present embodiment will be described.

[0172] Step S11: Obtain the substrate W from the carrier C placed on the loading port 10. That is, the acquisition hand 11a enters below the substrate W to be transported into the carrier C, and then rises, and places the substrate W to be transported on the guide members 32a, 32b, 34a, and 34b.

[0173] Step S12: The control unit 100 determines whether the two of the first sensor 22a and the second sensor 22b detect the substrate W. If the determination is true, then the process proceeds to step S13. If the determination is false, then the process proceeds to step S15.

[0174] Step S13: The control unit 100 determines whether the time difference between the first sensor 22a and the second sensor 22b detecting the substrate W is within the standard time difference. If the determination is true, then the substrate W is close to flat, and it is okay to perform high-speed transportation with the thruster 35 in the off state. In this case, the process proceeds to step S14. If the determination is false, then the substrate W is far from flat, and it is impossible to perform high-speed transportation with the thruster 35 in the off state. In this case, the process proceeds to step S15.

[0175] Step S14: The control unit 100 determines that the substrate W placed on the pickup hand 11a is flat, and sets the transfer mode of the substrate W to the high-speed mode. Then, the process proceeds to step S16.

[0176] Step S15: The control unit 100 determines that the substrate W placed on the pickup hand 11a is not flat, and sets the transfer mode of the substrate W to the low-speed mode. Then, the process proceeds to step S17.

[0177] Step S16: The control unit 100 controls the thruster drive mechanism 43 to set the thruster 35 to the off state, and transfers the substrate W at high speed. The pickup hand 11a exits from the carrier C, and transfers the substrate W at high speed to the passage 24. The transferred substrate W is transferred to the single wafer processing chamber 5a by the central robot CR.

[0178] Step S17: The control unit 100 keeps the thruster 35 in the open state and transfers the substrate W at low speed. The pickup hand 11a exits from the carrier C, and transfers the substrate W at low speed to the passage 24. The transferred substrate W is transferred to the single wafer processing chamber 5a by the central robot CR.

[0179] Step S18: In the single wafer processing chamber 5a, a cleaning process and a drying process of the substrate W are performed.

[0180] Step S19: The processed substrate W is transferred to the passage 24 by the central robot CR. The return hand 11b returns the substrate W placed on the passage 24 to the carrier C. Thus, the substrate processing apparatus of the present embodiment processes the substrate.

[0181] In addition, steps S11 to S19 have described the operations focusing on one substrate W stored in the carrier C. Therefore, these steps S11 to S19 are repeated according to the number of substrates W stored in the carrier C.

[0182] 9. Effects of the Invention

[0183] As described above, the transfer block 3 of the present invention has the pickup hand 11a including the guide member 32a and the guide member 32b. The guide member 32a has the first sensor 22a capable of detecting the substrate W, and the guide member 32b has the second sensor 22b capable of detecting the substrate W. If the outputs of the first sensor 22a and the second sensor 22b are used to determine whether the substrate W can be held, then the substrate W can be appropriately transferred in accordance with the condition of the transfer object, that is, the substrate W. Therefore, according to the transfer block 3 of the present invention, multiple types of substrates W can be transferred efficiently.

[0184] According to the above configuration, it includes: a first sensor 22a for detecting that the substrate W is placed on the first guide member 32a; a second sensor 22b for detecting that the substrate W is placed on the second guide member 32b; and a thruster 35 disposed opposite to the first guide member 32a and the second guide member 32b and capable of advancing and retreating toward the first guide member 32a and the second guide member 32b. Moreover, when both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the first guide member 32a and the second guide member 32b respectively, the thruster 35 is allowed to change from the open state to the closed state. On the other hand, when at least one of the first sensor 22a and the second sensor 22b does not detect the substrate W, the thruster 35 is prohibited from changing from the open state to the closed state. If configured in this way, the first sensor 22a and the second sensor 22b can be used to grasp the condition of the substrate W. That is to say, when both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the first guide member 32a and the second guide member 32b respectively, it can be judged that the shape of the substrate W is close to flat. On the other hand, when any one of the first sensor 22a and the second sensor 22b does not detect the substrate W, it can be judged that the shape of the substrate W is far from flat. Thus, if the condition of the substrate W is known, the opening and closing of the thruster 35 can be appropriately controlled in accordance with the condition of the substrate W. Therefore, according to the present invention, a substrate transfer device capable of efficiently transferring multiple types of substrates W can be provided.

[0185] According to the above configuration, even when both the first sensor 22a and the second sensor 22b detect that the substrate W is placed on the first guide member 32a and the second guide member 32b respectively, the condition of the substrate W can be correctly detected. That is to say, according to the above configuration, the time point when the first sensor 22a detects that the substrate W is placed on the first guide member 32a is compared with the time point when the second sensor 22b detects that the substrate W is placed on the second guide member 32b, and the time difference between the two is obtained. And if the obtained time difference is within the standard time difference, it can be judged that the shape of the substrate W is close to flat. In addition, when the obtained time difference exceeds the standard time difference, it can be judged that the shape of the substrate W is far from flat. Thus, if the condition of the substrate W is known, the opening and closing of the thruster 35 can be appropriately controlled in accordance with the condition of the substrate W. Therefore, according to the present invention, a substrate transfer device capable of efficiently transferring multiple types of substrates W can be provided.

[0186] According to the above configuration, it is possible to switch between a mode in which the hand moves at a first moving speed and a mode in which the hand moves at a second moving speed slower than the first moving speed. Moreover, if the obtained time difference is within the reference time difference, then after clamping the substrate W by setting the thruster 35 from the open state to the closed state, the hand moves at the first moving speed. And if the obtained time difference exceeds the reference time difference, then after prohibiting the thruster 35 from changing from the open state to the closed state, the hand moves at the second transfer speed. In addition, even when prohibiting the thruster 35 from changing from the open state to the closed state, the hand also moves at the second speed. If configured in this way, a substrate transfer device with high throughput can be achieved.

[0187] According to the above configuration, when prohibiting the thruster 35 from changing from the open state to the closed state, the transfer of the substrate W is aborted. If configured in this way, a substrate transfer device can be provided that does not transfer a substrate W that is far from flat and suppresses the dropping of the substrate W. In this case, since the hand 11a is used to return the substrate W to the original slot, conveyance errors are prevented, and the transfer to the next substrate conveyance is performed, so a reduction in throughput due to the interruption of conveyance can also be prevented.

[0188] According to the above configuration, the first guide member 32a includes a tapered portion B that supports the lower peripheral edge of the substrate W and a wall portion A that abuts against the outer peripheral surface of the substrate W, and the second guide member 32b includes a tapered portion B that supports the lower peripheral edge of the substrate W and a wall portion A that abuts against the outer peripheral surface of the substrate W. If configured in this way, a substrate transfer device can be provided that can reliably transfer the substrate while minimizing the dropping of the substrate W.

[0189] According to the above configuration, the base member 31 includes a first pallet 33a, a second pallet 33b, and a connecting portion 36 that connects the first pallet 33a and the second pallet 33b. And the thruster 35 is disposed at the connecting portion 36, the first guide member 32a is disposed on the first pallet 33a, and the second guide member 32b is disposed on the second pallet 33b. If configured in this way, a substrate transfer device can be provided that can reliably clamp the substrate W.

[0190] According to the above configuration, the first sensor 22a and the second sensor 22b are tactile sensors. By adopting such a configuration, it is possible to reliably detect whether the substrate W is placed on the first guide member 32a and the second guide member 32b. In addition, according to the above configuration, the first sensor 22a is disposed between the base member 31 and the first guide member 32a. By configuring in this way, the first sensor 22a can reliably detect the placement of the substrate W on the first guide member 32a. And according to the above configuration, the second sensor 22b is disposed between the base member 31 and the second guide member 32b. By configuring in this way, the same effect as that of the first sensor 22a is achieved.

[0191] According to the above configuration, preferably, when the first sensor 22a detects a specified load, it is determined that the substrate W is placed on the first guide member 32a, and when the second sensor 22b detects a specified load, it is determined that the substrate W is placed on the second guide member 32b. With such a configuration, a substrate transfer device can be provided that does not malfunction even when the first sensor 22a and the second sensor 22b detect noise.

[0192] According to the above configuration, the first sensor 22a is embedded in a first recess 37a formed in the base member 31, and the second sensor 22b is embedded in a second recess 37b formed in the base member 31. With such a configuration, a substrate transfer device can be provided that suppresses the thickness in the height direction of the hand and does not cause the hand to collide with the substrate W during transfer.

[0193] According to the above configuration, a single wafer processing unit is provided that processes the wafers W transferred by the hand one by one. According to the above configuration, a substrate processing device can be provided that can reliably transfer multiple types of substrates W and perform substrate processing.

[0194] 10. Variation

[0195] The present invention is not limited to the above embodiments and can be implemented with variations as follows.

[0196] <Variation 1>

[0197] The above Figure 17 judgments in steps S13 and S14 are reflected in the actions of the pickup hand 11a, but the present invention is not limited to the above configuration. The judgment in step S13 can also be used for the displacement action of the pusher 35 in the return hand 11b. That is, for the substrate W that can be gripped in steps S13 and S14, in step S19, the return hand 11b can grip the substrate W. In addition, for the substrate W that cannot be gripped in steps S13 and S14, in step S17, the return hand 11b cannot grip the substrate W. Thus, if the determination related to the deformation of the substrate W performed by the pickup hand 11a is used for the return action of the substrate W by the return hand 11b, a transfer block 3 that can transfer the substrate more reliably can be provided.

[0198] <Variation 2>

[0199] As Figure 18 shown, the guide member 32a may also be configured such that the support portion (conical portion B) and the wall portion A are separately provided. In such a case, the first sensor 22a is provided between the base member 31 and the support portion of the guide member 32a. In addition, in this variation, the guide member 32b may also be configured such that the support portion (conical portion B) and the wall portion A are separately provided. In such a case, the second sensor 22a is provided between the base member 31 and the support portion of the guide member 32b.

[0200] According to the above configuration, the first guide member 32a separates the tapered portion B from the wall portion A, and the first sensor 22a is disposed between the base member 31 and the tapered portion B of the first guide member 32a. If configured in this way, as Figure 19 shown, a substrate transfer device can be provided that detects the state of the substrate W by determining whether the substrate W has straddled the wall portion A. Further, according to the above configuration, the second guide member 32b separates the tapered portion B from the wall portion A, and the second sensor 22b is disposed between the base member 31 and the tapered portion B of the second guide member 32b. If configured in this way, the second sensor 22b also exhibits the same effect as that of the first guide member 32a.

[0201] <Variation 3>

[0202] In the above-described embodiment, the tactile sensors are used to detect whether the substrate W is placed on the guide members 32a and 32b, but the present invention is not limited to this configuration. As Figure 20 shown, a configuration may also be adopted in which a distance measuring sensor 27a is provided on the second pallet 33a and a distance measuring sensor 27b is provided on the second pallet 33b. The distance measuring sensor 27a is disposed at a position shifted from the guide member 32a to the side of the second pallet 33b. The distance measuring sensor 27b is disposed at a position shifted from the guide member 32b to the side of the first pallet 33a. By configuring in this way, the distance measuring sensors 27a and 27b are not covered by the substrate W held by the acquisition hand 11a, and the presence or absence of the substrate W can be surely detected.

[0203] The distance measuring sensor 27a can detect whether the substrate W is placed on the guide member 32a. On the other hand, since the distance from the distance measuring sensor 27a to the substrate W can also be calculated, it can also be detected whether the substrate W is in a floating state with respect to the guide member 32a. Similarly, the distance measuring sensor 27b can detect whether the substrate is placed on the guide member 32b and whether the substrate W is floating with respect to the guide member 32b. Further, the distance measuring sensors 27a and 27b can also detect the timing at which the substrate W is placed on the guide members 32a and 32b. Therefore, in this variation, the thruster 35 can also be controlled by comparing the timings.

[0204] <Variation 4>

[0205] The present invention is not limited to the transfer block 3 and can be applied to the entire substrate transfer device of a robot that conveys a substrate W in a horizontal posture.

Claims

1. A substrate transport device, characterized in that It is a substrate transfer device having a hand for transferring a substrate in a horizontal posture. The hand has: Base components; a first guide member, provided on the upper surface of the base member, supporting the lower peripheral portion of the substrate and abutting against the outer peripheral surface of the substrate; a first sensor for detecting that the substrate is placed on the first guide; a second guide member, provided on the upper surface of the base member, supporting the lower peripheral portion of the substrate and abutting against the outer peripheral surface of the substrate; a second sensor for detecting that the substrate is placed on the second guide; and A pusher is provided on the upper surface of the base member opposite to the first guide and the second guide and can move forward and backward toward the first guide and the second guide; and the substrate transfer device comprises: A propeller driving unit to move the propeller forward and backward; and a control unit, controlling the propeller driving unit; and The control unit The pusher can be switched between an open state and a closed state, and the open state is when the pusher is away from the outer peripheral surface of the substrate placed on the first guide and the second guide. In the closed state, the pusher contacts the outer peripheral surface of the substrate and presses the substrate against the first guide and the second guide to clamp the substrate. The control unit When the pusher is set to the open state and the substrate is received by the hand, When both the first sensor and the second sensor detect that the substrate is placed on the first guide and the second guide, respectively, the pusher is allowed to change from the open state to the closed state, When at least one of the first sensor and the second sensor does not detect the substrate, the pusher is prohibited from changing from the open state to the closed state.

2. The substrate transfer device according to claim 1, wherein: When the first sensor and the second sensor both detect that the substrate is placed on the first guide and the second guide, the control unit The time point when the first sensor detects that the substrate is placed on the first guide is compared with the time point when the second sensor detects that the substrate is placed on the second guide to obtain a time difference between the two. When the time difference is within a predetermined reference time difference, allowing the thruster to change from the open state to the closed state, When the time difference exceeds a predetermined reference time difference, the thruster is prohibited from changing from the open state to the closed state.

3. The substrate transfer device according to claim 2, characterized in that have: a conveying mechanism for moving the hand, The conveying mechanism is switchable between a mode in which the hand moves at a first moving speed and a mode in which the hand moves at a second moving speed that is slower than the first moving speed. The control unit When the first sensor and the second sensor both detect that the substrate is placed on the first guide and the second guide, respectively, The time point when the first sensor detects that the substrate is placed on the first guide is compared with the time point when the second sensor detects that the substrate is placed on the second guide to obtain a time difference between the two. When the time difference is within a predetermined reference time difference, the substrate is clamped by changing the pusher from the open state to the closed state, Furthermore, the conveying mechanism is controlled so that the hand holding the substrate moves at the first moving speed, and on the other hand, When at least one of the first sensor and the second sensor fails to detect the substrate and the time difference exceeds a predetermined reference time difference, The pusher is prohibited from changing from the open state to the closed state, and is set to a state where the substrate is not clamped, Furthermore, the transport mechanism is controlled so that the hand is moved at the second moving speed in a state where the pusher does not hold the substrate.

4. The substrate transfer device according to claim 3, wherein: The control unit When at least one of the first sensor and the second sensor fails to detect the substrate and the time difference exceeds a predetermined reference time difference, The hand is moved at the second moving speed in a state where the pusher does not clamp the substrate, and the substrate is returned to the original groove.

5. The substrate transfer device according to claim 1, wherein: The first guide member includes a support portion for supporting the lower portion of the peripheral edge of the substrate and a wall portion abutting against the outer peripheral surface of the substrate. The second guide includes a support portion that supports a lower portion of a peripheral edge of the substrate, and a wall portion that abuts against an outer peripheral surface of the substrate.

6. The substrate transfer device according to claim 1, wherein: The base component comprises: The first pallet; pallet 2; and A connecting portion connecting the first support plate and the second support plate; and The thruster is arranged at the connection portion. The first guide is disposed on the first support plate. The second guide is arranged on the second support plate.

7. The substrate transfer device according to claim 1, wherein: The first sensor is a tactile sensor provided between the base member and the first guide, and the second sensor is a tactile sensor provided between the base member and the second guide.

8. The substrate transfer device according to claim 7, wherein: The first guide separates the support portion from the wall portion. The first sensor is disposed between the base member and the support portion of the first guide, and the second guide separates the support portion from the wall portion. The second sensor is provided between the base member and the supporting portion of the second guide.

9. The substrate transfer device according to claim 7, wherein: The control unit When the first sensor detects a predetermined load, it is determined that the substrate is placed on the first guide, and when the second sensor detects a predetermined load, it is determined that the substrate is placed on the second guide.

10. The substrate transfer device according to claim 7, wherein: The first sensor is embedded in a first recess formed in the base member. The second sensor is embedded in a second recess formed in the base member.

11. A substrate processing apparatus, comprising: The single-wafer processing section processes the substrates transported by the hand one by one.

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