Package device, circuit arrangement, and electronic apparatus

Abstract

The embodiment of the invention discloses a packaging device, a circuit device and electronic equipment, and is characterized in that one part of a signal of the packaging device is led out from a first socket on a first surface of a substrate, and the other part of the signal is transmitted to a system circuit board through a second socket on a second surface, opposite to the first surface, of the substrate; and the third socket is led to the fourth surface, deviating from the packaging device, of the system circuit board through a conduction circuit of the system circuit board, so that the size of the packaging device can be reduced. According to the circuit device, the first clamp, the second clamp and the fixing piece in the switching assembly are adopted to achieve fixation between the packaging device and the system circuit board, the reliability problem of a traditional welding fixing mode is avoided, improvement of impedance continuity of high-speed signals is facilitated, the integrity characteristic of the signals is improved, and the reliability of the packaging device is improved. And the discontinuous structure of the power plane of the system circuit board can be reduced, and the wiring complexity and the manufacturing difficulty of the system circuit board can be reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor devices, and more particularly, to a packaged device, a circuit device, and an electronic device. Background Art

[0002] With the rapid development of the modern electronic design field, in the future application scenarios of high frequency, high speed, and high density, the trend of miniaturization of packaged devices will pose a series of problems to traditional packaging processes (e.g., FCBGA, flip chip ball grid array), such as reliability, signal integrity, and power integrity. For example, as the number of signals increases and the bandwidth requirement increases, due to the limitation of the distance between the solder balls of the BGA, it is usually only possible to continuously increase the package size to meet the bandwidth requirement. In this case, not only does the increase in the package size fail to meet the requirements of miniaturization, but also due to the increase in the package size, the manufacturing difficulty increases, and the length of the traces in the package also increases, which easily causes excessive insertion loss in the package and affects signal integrity. In addition, due to the high wiring density, the number of vias on the PCB board also increases, exacerbating the power integrity (PI) problem. Summary of the Invention

[0003] In view of this, embodiments of the present invention provide a packaged device, a circuit device, and an electronic device, which are beneficial to solving at least some of the above problems existing in the prior art.

[0004] In a first aspect, an embodiment of the present invention provides a packaged device, including a substrate, a semiconductor chip, a first socket, and a second socket; the substrate has a first surface and a second surface disposed opposite to each other, the semiconductor chip is electrically coupled to the first surface, the first socket is electrically coupled to the first surface, and the second socket is electrically coupled to the second surface; wherein, the semiconductor chip realizes signal transmission with the outside through the first socket and the second socket.

[0005] Further, the semiconductor chip is electrically coupled to the middle of the first surface, and the first socket is disposed near the edge of the first surface.

[0006] Further, the substrate has a plurality of signal paths, and at least one of the first sockets and at least one of the second sockets are respectively electrically coupled to different signal paths.

[0007] Further, the substrate has a power path, and at least one of the first sockets and / or at least one of the second sockets is a power socket, and the power socket is electrically coupled to the power path.

[0008] In a second aspect, an embodiment of the present invention provides a circuit device, comprising a packaging device as described in the first aspect, a system circuit board, and; the system circuit board has a third surface and a fourth surface arranged opposite to each other, the system circuit board has a conduction circuit extending from the third surface to the fourth surface, the conduction circuit is arranged at one end of the third surface and is electrically coupled to the second socket, the fourth surface has a third socket, the third socket is electrically coupled to the conduction circuit; the adapter assembly comprises a first clamp, a second clamp, a fixing member, a first electrical connector and a second electrical connector, the first clamp is arranged on the first surface and at least partially arranged on the packaging device, the second clamp is arranged on the fourth surface, the fixing member connects the first clamp and the second clamp to press the packaging device onto the third surface, the first electrical connector comprises a first connector, the first connector is electrically coupled to the first socket, and the second electrical connector comprises a second connector, the second connector is electrically coupled to the third socket.

[0009] Furthermore, the conducting circuit includes a metallized hole penetrating the third surface and the fourth surface.

[0010] Furthermore, the adapter assembly also includes a heat sink connected to the first fixture and thermally coupled to the packaged device.

[0011] Further, the first clamp includes a first connecting hole, the second clamp includes a second connecting hole, the system circuit board includes a third connecting hole, and the fixing member passes through the first connecting hole, the third connecting hole and the second connecting hole to connect the first clamp, the second clamp and the system circuit board.

[0012] Further, at least one of the first electrical connectors electrically couples the first socket to the system circuit board; and / or, at least one of the second electrical connectors electrically couples the second socket to the system circuit board; and / or, the circuit device includes two of the packaged devices, and at least one of the first electrical connectors is electrically coupled between the two packaged devices.

[0013] In a third aspect, an embodiment of the present invention further provides an electronic device, comprising the circuit device as described in the second aspect.

[0014] The embodiment of the present invention provides a packaged device, a circuit device and an electronic device, which is helpful to reduce the size of the packaged device by leading out a part of the signal of the packaged device at a first socket on the first surface of the substrate, transmitting the other part of the signal to the system circuit board via a second socket on the second surface of the substrate opposite to the first surface, and leading to a third socket on the fourth surface of the packaged device away from the system circuit board via a conducting circuit of the system circuit board. The circuit device uses the first clamp, the second clamp and the fixing member in the adapter assembly to fix the packaged device to the system circuit board, avoiding the reliability problem of the traditional welding fixing method, and is helpful to improve the impedance continuity problem of high-speed signals, improve the signal integrity characteristics, and is helpful to reduce the discontinuous structure of the power plane of the system circuit board, which is helpful to reduce the wiring complexity and manufacturing difficulty of the system circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and other objects, features and advantages of the present invention will become more apparent through the following description of the embodiments of the present invention with reference to the accompanying drawings, in which:

[0016] Figure 1 is a schematic structural diagram of a packaging device according to an embodiment of the present invention;

[0017] Figure 2 is a cross-sectional schematic diagram of a circuit device according to an embodiment of the present invention;

[0018] Figure 3 is a schematic diagram of a top view of a circuit device according to an embodiment of the present invention;

[0019] Figure 4 FIG. 4 is a cross-sectional schematic diagram of a circuit device according to another embodiment of the present invention.

[0020] Description of reference numerals:

[0021] 10-packaged device; 11-substrate; 111-first surface; 112-second surface; 12-semiconductor chip; 13-first socket; 14-second socket; 20-system circuit board; 21-third surface; 22-fourth surface; 23-conduction circuit; 24-third socket; 25-third connecting hole; 30-adapter assembly; 31-first clamp; 311-first connecting hole; 32-second clamp; 321-second connecting hole; 33-fixing member; 34-first electrical connector; 341-first connector; 35-second electrical connector; 351-second connector; 36-heat sink. DETAILED DESCRIPTION

[0022] The present application will be described based on embodiments, but the present application is not limited to these embodiments. In the following detailed description of the present application, some specific details are described in detail. Those skilled in the art can fully understand the present application without the description of these details. In order to avoid obscuring the essence of the present application, well-known methods, processes, flows, components, and circuits are not described in detail.

[0023] In addition, those of ordinary skill in the art should understand that the accompanying drawings provided herein are for illustrative purposes only, and the drawings are not necessarily drawn to scale.

[0024] Unless the context clearly requires otherwise, the words "including", "comprising", and the like throughout the application shall be construed in an inclusive sense rather than an exclusive or exhaustive sense; that is, the meaning of "including but not limited to".

[0025] In the description of the present application, it should be understood that the terms "first", "second", etc. are used only for descriptive purposes and cannot be construed as indicating or implying relative importance. In addition, in the description of the present application, unless otherwise specified, the meaning of "a plurality of" is two or more.

[0026] One aspect of the embodiments of the present invention relates to a packaging device 10. Figure 1 is a schematic structural diagram of the packaging device 10 of the embodiments of the present invention. Referring to Figure 1 , the packaging device 10 includes a substrate 11 and a semiconductor chip 12. The substrate 11 has a first surface 111 and a second surface 112 which are oppositely arranged, and the semiconductor chip 12 is electrically coupled to the first surface 111.

[0027] The semiconductor chip 12, as the core part of the packaging device 10, is made of semiconductor materials such as silicon or gallium arsenide. The semiconductor chip 12 is designed to perform specific functions, such as data processing, signal amplification, voltage regulation, etc. In this embodiment, the semiconductor chip 12 can be a chip for various purposes, such as a logic chip, a radio frequency chip, a processor chip, an optoelectronic integrated chip, a communication chip, a microelectronic system chip, a bare chip of an application specific integrated circuit (ASIC), etc.

[0028] The substrate 11 can provide physical support for the chip and also provide electrical connection paths. The substrate 11 can be a circuit board (e.g., a printed circuit board (PCB) or a flexible printed circuit board (FPC)), a direct bond copper (DBC), or any other suitable material. The substrate 11 can have a multi-layer structure, and multiple vias can be formed by conductive materials in the substrate 11. The multiple vias can include signal vias for signal transmission and power vias for coupling to a power module outside the packaged device 10 to obtain the electrical energy required when the packaged device 10 operates.

[0029] In an embodiment of the present invention, the packaged device 10 further includes a first socket 13 and a second socket 14. Among them, the first socket 13 is electrically coupled to the first surface 111, and the second socket 14 is electrically coupled to the second surface 112. The first socket 13 and the second socket 14 are respectively electrically coupled to the semiconductor chip 12 through predetermined vias, so that the semiconductor chip 12 can achieve signal or energy transmission between the packaged device 10 and an external circuit through the first socket 13 and the second socket 14. The second socket 14 can be used for plugging into a corresponding socket on an external printed circuit board. A part of the signals of the packaged device 10 can be led to the printed circuit board connected to the device through the second socket 14. The signal leads of the semiconductor chip 12 are distributed on two opposite surfaces of the substrate 11, which can balance the distribution of signal lead resources and reduce the size of the packaged device 10. And using the second socket 14 can avoid using traditional surface mount technology for the assembly between the packaged device 10 and the printed circuit board, avoiding problems such as reliability brought by surface mount technology, and is beneficial to reducing the thickness of the substrate 11, reducing the size of the packaged device 10, and can also improve the impedance continuity problem introduced by the substrate core layer and improve the signal integrity characteristics.

[0030] In some embodiments, the semiconductor chip 12 is electrically coupled to the first surface 111 by the flip-chip method. The flip-chip method is a method of flipping the chip and directly mounting it on the substrate 11, so that the pads on the semiconductor chip 12 are electrically connected to the corresponding contacts on the substrate 11 through tiny metal bumps. This connection method not only improves the speed and quality of signal transmission but also reduces the package size, which is very suitable for high-density integration application scenarios. In this embodiment, the semiconductor chip 12 and the first surface 111 of the substrate 11 are connected by C4 bumps (Controlled Collapse Chip Connection bumps), which have good mechanical support and thermal stability and are suitable for application in high-performance and high-density interconnect scenarios.

[0031] In this embodiment, the semiconductor chip 12 is electrically coupled to the middle part of the first surface 111, and the first socket 13 is disposed outside the semiconductor chip 12 and near the edge of the first surface 111 to facilitate the connection between the first socket 13 and an external circuit.

[0032] In this embodiment, the substrate 11 has a plurality of signal paths, and at least one first socket 13 and at least one second socket 14 are respectively electrically coupled to different signal paths. That is, at least a part of the signals of the semiconductor chip 12 are transmitted to the external circuit through at least one first socket 13, and at least some of the other part of the signals are transmitted to the external circuit through at least one second socket 14. Optionally, at least one first socket 13 and / or at least one second socket 14 are power sockets, and the power sockets are electrically coupled to the power paths in the substrate 11, and the power sockets are used for electrically coupling to a power module outside the packaged device 10.

[0033] For the packaged device 10 provided in this embodiment, corresponding first sockets 13 and second sockets 14 are respectively disposed on the opposite first surface 111 and second surface 112 of the substrate 11, and the electrical signals of the semiconductor chip 12 are led out to the outside through the first socket 13 or the second socket 14. In this way, the signal output lines of the semiconductor chip 12 are distributed on two opposite surfaces of the substrate 11, which can balance the resource distribution of the signal output lines and reduce the size of the packaged device 10.

[0034] In another aspect of the embodiments of the present invention, a circuit device is involved. The circuit device is formed by connecting the packaged device 10 and an external circuit in a predetermined manner. Among them, the packaged device 10 in the circuit device may be the packaged device 10 described in at least some of the above embodiments.

[0035] In this embodiment, the circuit device includes a system circuit board 20, the system circuit board 20 has a third surface 21 and a fourth surface 22 which are oppositely arranged, and the packaged device 10 is coupled to the third surface 21. For example, the third surface 21 has a socket that matches the second socket 14 and is plugged into the second socket 14. The system circuit board 20 has a conduction circuit 23 extending from the third surface 21 to the fourth surface 22. One end of the conduction circuit 23 provided on the third surface 21 is electrically coupled to the second socket 14, and the fourth surface 22 has a third socket 24, and the third socket 24 is electrically coupled to the conduction circuit 23. Thus, the electrical signal led out by the second socket 14 on the second surface 112 of the packaged device 10 can be led to the third socket 24 on the fourth surface 22 through the conduction circuit 23, so as to be easily connected to other circuits. In this embodiment, the conduction circuit 23 can be a metallized hole (via hole) penetrating the third surface 21 and the fourth surface 22. Optionally, a part of the signals that need to be connected to the circuit on the fourth surface 22 of the system circuit board 20 can be led out through the second socket 14 of the substrate 11.

[0036] In this embodiment, the circuit device further includes an adapter assembly 30, and the adapter assembly 30 includes a first fixture 31, a second fixture 32, a fixing member 33, a first electrical connector 34, and a second electrical connector 35. The first fixture 31 is disposed on the first surface 111 and at least partially disposed on the packaged device 10. The second fixture 32 is disposed on the fourth surface 22. That is, the first fixture 31 and the second fixture 32 sandwich the packaged device 10 and the system circuit board 20 from both sides of the system circuit board. One end of the first electrical connector 34 includes a first connector 341, and the first connector 341 is electrically coupled to the first socket 13 on the substrate 11. The other end of the first connector can be electrically coupled to an external circuit. One end of the second electrical connector 35 includes a second connector 351, and the second connector 351 is electrically coupled to the third socket 24. The other end of the second connector can be electrically coupled to an external circuit. The first electrical connector 34 and the second connector may further include cables for electrical signal transmission. With this arrangement, there can be two signal transmission paths for the signal transmission between the packaged device 10 and the outside in the embodiment of the present invention: a part of the signals of the packaged device 10 can be led out through the first socket 13 on the first surface 111 of the substrate 11 and transmitted to the outside through the first electrical connector 34; another part of the signals can be transmitted to the system circuit board 20 below the packaged device 10 through the second socket 14, led to the third socket 24 on the fourth surface 22 of the system circuit board 20 via the conduction circuit 23, and led out through the second electrical connector 35. This arrangement is beneficial to realizing the reduction of the package size. On the premise of ensuring the electrical performance impedance continuity, the outgoing line layer of the system circuit board 20 can be reduced, and the manufacturing cost of the system circuit board 20 is reduced. And since the solder balls between the packaged device 10 and the system circuit board 20 are omitted, a part of the signals are directly transmitted through the second socket 14 and the via holes (conduction circuit 23), and the transmission path is shortened, which helps to solve the power supply problem and the problem of impedance discontinuity.

[0037] In one embodiment, the first fixture 31 may have an avoidance hole corresponding to the position of the first socket 13 to facilitate the insertion and extraction of the first connector 341 through the avoidance hole and the first socket 13; the second fixture 32 may have an avoidance hole corresponding to the position of the third socket 24 to facilitate the insertion and extraction of the second connector 351 through the avoidance hole and the third socket 24. In another embodiment, the first connector 341 may be fixed at a position corresponding to the first socket 13 on the first fixture 31, and the second connector 351 may be fixed at a position corresponding to the third socket 24 on the second fixture 32. Figure 3 is a schematic view of the circuit device according to an embodiment of the present invention as observed from one side of the third surface 21 of the system circuit board 20. Refer to Figure 3The first socket 13 and the first electrical connector 34 can be arranged in multiple directions, but it should be understood that the first socket 13 and the first electrical connector 34 can also be arranged on a portion of the multiple edges of the package device 10 as required. In addition, the first socket 13 or the first electrical connector 34 can also form a ring, arc or other shape structure around the semiconductor chip 12.

[0038] The fixing member 33 connects the first clamp 31 and the second clamp 32 to press the packaged device 10 onto the third surface 21 to ensure the stability of the electrical coupling between the packaged device 10 and the system circuit board 20. In one embodiment, the fixing member 33 can be a fastener, such as a screw, a pin, etc. Figure 2 The first clamp 31 includes a first connection hole 311, the second clamp 32 includes a second connection hole 321, and the system circuit board 20 includes a third connection hole 25. After the first clamp 31, the second clamp 32 and the system circuit board 20 are installed in place, the first connection hole 311, the third connection hole 25 and the second connection hole 321 are aligned, and the fixing member 33 passes through the first connection hole 311, the third connection hole 25 and the second connection hole 321 to connect the first clamp 31, the second clamp 32 and the system circuit board 20. Figure 3 , a plurality of fixing members 33 may be disposed outside a region corresponding to the packaged device 10 and may be close to an edge of the first fixture 31 .

[0039] In some embodiments, reference Figure 2 The adapter assembly 30 also includes a heat sink 36, which is thermally coupled to the packaged device 10 to obtain heat from the packaged device 10 and conduct the heat to the environment. In the present embodiment, the heat sink 36 can be connected to the first clamp 31 to form a whole. The heat sink 36 can be, for example, an air-cooled heat sink 36, a liquid-cooled heat sink 36, a phase change material heat sink 36, or other applicable heat sinks 36. The heat sink 36 can be thermally coupled to the packaged device 10 through a heat-conducting medium, or can be thermally coupled by directly contacting the packaged device 10. Those skilled in the art can select an appropriate thermal coupling method according to actual needs.

[0040] The first electrical connector 34 and the second electrical connector 35 can be used to electrically connect the packaged device 10 to the system circuit board 20, or can be used to electrically connect two packaged devices 10. Figure 2 , at least one first electrical connector 34 electrically couples the first socket 13 to the system circuit board 20. In some embodiments, referring to Figure 2 , at least one second electrical connector 35 electrically couples the second socket 14 to the system circuit board 20. In some embodiments, referring to Figure 4The circuit device may include a plurality of packaged devices 10 , and at least one first electrical connection member 34 is electrically coupled between two packaged devices 10 to achieve interconnection between the packaged devices 10 in the multi-chip module.

[0041] In the circuit device provided by the embodiment of the present invention, the substrate 11 of the packaged device 10 is electrically coupled to the system circuit board 20 through the second socket 14, and the first clamp 31, the second clamp 32 and the fixing member 33 in the adapter assembly 30 are used to fix the packaged device 10 to the system circuit board 20, thereby avoiding the reliability problem of the traditional welding fixing method and improving the impedance continuity problem of the high-speed signal. By leading out a part of the signal of the packaged device 10 through the first socket 13 on the first surface 111 of the substrate 11, and transmitting the other part of the signal to the system circuit board 20 below through the second socket 14 on the second surface 112 of the substrate 11 opposite to the first surface 111, and leading to the third socket 24 on the fourth surface 22 of the packaged device 10 away from the system circuit board 20 through the conduction circuit 23 of the system circuit board 20, compared with the traditional FCBGA solution, the BGA between the packaged device 10 and the system circuit board 20 is omitted, which is not only conducive to reducing the thickness of the circuit device as a whole, but also can reduce the size of the packaged device 10. Furthermore, by using the first electrical connector 34 and the second electrical connector 35 , wiring can be implemented from the outside of the system circuit board 20 , reducing the discontinuous structure of the power plane and facilitating reducing the wiring complexity and manufacturing difficulty of the system circuit board 20 .

[0042] Another aspect of the embodiments of the present invention also relates to an electronic device, which includes the circuit device in at least some of the above embodiments. By adopting the circuit device, the performance reliability of the electronic device is ensured, and the electronic device is also facilitated to be lightweight and miniaturized.

[0043] The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A packaging device, characterized in that: include: A substrate (11) having a first surface (111) and a second surface (112) arranged opposite to each other; A semiconductor chip (12) electrically coupled to the first surface (111); a first socket (13) electrically coupled to the first surface (111); and a second socket (14) electrically coupled to the second surface (112); The semiconductor chip (12) realizes signal transmission with the outside through the first socket (13) and the second socket (14).

2. The packaged device according to claim 1, characterized in that: The semiconductor chip (12) is electrically coupled to the middle of the first surface (111), and the first socket (13) is arranged close to the edge of the first surface (111).

3. The packaged device according to claim 1, characterized in that: The substrate (11) has a plurality of signal paths, and at least one of the first sockets (13) and at least one of the second sockets (14) are respectively electrically coupled to different signal paths.

4. The packaged device according to claim 1, characterized in that: The substrate (11) has a power path, at least one of the first sockets (13) and / or at least one of the second sockets (14) is a power socket, and the power socket is electrically coupled to the power path.

5. A circuit device, characterized in that: include: The packaging device (10) according to any one of claims 1 to 4; A system circuit board (20) having a third surface (21) and a fourth surface (22) arranged opposite to each other, the system circuit board (20) having a conducting circuit (23) extending from the third surface (21) to the fourth surface (22), the conducting circuit (23) being arranged at one end of the third surface (21) and electrically coupled to the second socket (14), the fourth surface (22) having a third socket (24), the third socket (24) being electrically coupled to the conducting circuit (23); as well as The adapter assembly (30) comprises a first clamp (31), a second clamp (32), a fixing member (33), a first electrical connector (34) and a second electrical connector (35), wherein the first clamp (31) is arranged on the first surface (111) and at least partially arranged on the packaging device (10), the second clamp (32) is arranged on the fourth surface (22), the fixing member (33) connects the first clamp (31) and the second clamp (32) to press the packaging device (10) onto the third surface (21), the first electrical connector (34) comprises a first connector (341), the first connector (341) is electrically coupled to the first socket (13), and the second electrical connector (35) comprises a second connector (351), the second connector (351) is electrically coupled to the third socket (24).

6. The circuit arrangement according to claim 5, characterized in that The conducting circuit (23) comprises a metallized hole penetrating the third surface (21) and the fourth surface (22).

7. The circuit arrangement according to claim 5, characterized in that The adapter assembly (30) further comprises: A heat sink (36) is connected to the first fixture (31) and thermally coupled to the packaged device (10).

8. The circuit arrangement according to claim 5, characterized in that The first clamp (31) includes a first connecting hole (311), the second clamp (32) includes a second connecting hole (321), the system circuit board (20) includes a third connecting hole (25), and the fixing member (33) passes through the first connecting hole (311), the third connecting hole (25) and the second connecting hole (321) to connect the first clamp (31), the second clamp (32) and the system circuit board (20).

9. The circuit arrangement according to claim 5, characterized in that At least one of the first electrical connectors (34) electrically couples the first socket (13) to the system circuit board (20); and / or At least one of the second electrical connectors (35) electrically couples the second socket (14) to the system circuit board (20); and / or The circuit device comprises two packaged devices (10), and at least one first electrical connection member (34) is electrically coupled between the two packaged devices (10).

10. An electronic device, characterized in that: Comprising a circuit arrangement as claimed in any one of claims 5 to 9.

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