Recessed jig pad for passive surface mount assembly

Abstract

The invention relates to a recessed jig pad for a passive surface mount assembly. An electronic device (100) includes: a semiconductor die (118) attached to a lead frame or substrate (116); conductive first and second metal clips (114) attached to the lead frame or substrate (116); a molded package structure (108) surrounding the semiconductor die (118) and having a top side with first and second recesses (109), the first and second recesses extending into the molded package structure (108) to top sides of respective first and second metal clips (114); and an electronic assembly (110) having conductive metal first and second terminals (111) extending into the respective first and second recesses (109) and electrically connected to the top sides of the respective first and second metal clips (114).

Description

Technical Field

[0001] The present disclosure relates to a recessed fixture pad for a passive surface mount component. Background Art

[0002] Integrated power modules and other packaged electronic devices may include semiconductor dies and one or more passive components in a shared package structure and may have surface mount technology (SMT) components mounted outside the package. However, non-wetting or insufficient soldering of the SMT component terminals and / or insufficient adhesive may cause the SMT components to move out of the package assembly. Summary of the Invention

[0003] In one aspect, an electronic device includes: a semiconductor die attached to a lead frame or a substrate; conductive first and second metal fixtures attached to the lead frame or the substrate; a molded package structure; and an electronic component. The molded package structure surrounds the semiconductor die and has a top side with first and second notches that extend into the molded package structure to reach the top sides of the corresponding first and second metal fixtures, and the electronic component has conductive metal terminals that extend into the corresponding notches and are electrically connected to the top sides of the corresponding first and second metal fixtures.

[0004] In another aspect, a system includes a circuit board having conductive metal pads and an electronic device attached to the circuit board. The electronic device includes: conductive metal leads electrically connected to corresponding ones of the conductive metal pads in the circuit board; a semiconductor die attached to a lead frame or a substrate; conductive first and second metal fixtures attached to the lead frame or the substrate; a molded package structure; and an electronic component. The molded package structure surrounds the semiconductor die and has a top side with first and second notches that extend into the molded package structure to reach the top sides of the corresponding first and second metal fixtures, and the electronic component has conductive metal terminals that extend into the corresponding notches and are electrically connected to the top sides of the corresponding first and second metal fixtures.

[0005] In another aspect, a method of manufacturing an electronic device includes: attaching a semiconductor die to a lead frame or a substrate; attaching conductive first and second metal fixtures to the lead frame or the substrate; and forming a molded encapsulation structure surrounding the semiconductor die and having a top side. The method further includes: removing molding material from the top side of the molded encapsulation structure to form first and second notches that extend into the molded encapsulation structure to reach the top sides of corresponding first and second metal fixtures; and electrically connecting conductive first and second terminals of an electronic component to the top sides of the corresponding first and second metal fixtures through the notches. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] Figure 1 is a partial top perspective view of an electronic device attached to a printed circuit board of a system, the electronic device including an electronic component attached to the top side of the electronic device.

[0007] Figure 1A is along Figure 1 partial cross-sectional side view of the electronic device taken along line 1A-1A.

[0008] Figure 2 is a flow chart showing a method for manufacturing an electronic device according to another aspect.

[0009] Figure 3 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing a die attachment process.

[0010] Figure 4 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing a surface mount component attachment process.

[0011] Figure 5 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing a metal fixture attachment process.

[0012] Figure 6 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing a thermal solder reflow process.

[0013] Figure 7 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing a molding process.

[0014] Figure 8 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing a laser ablation process to expose the top sides of metal fixtures.

[0015] Figure 9 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing an adhesive formation process.

[0016] Figure 10 is a partial cross-sectional side view of a multi-layer encapsulation substrate undergoing a solder paste formation process.

[0017] Figure 11 is a partial cross-sectional side view of a multi-layer package substrate that has undergone an electronic component attachment process.

[0018] Figure 12 is a partial cross-sectional side view of a multi-layer package substrate that has undergone a thermal solder reflow process.

[0019] Figure 13 is a partial cross-sectional side view of a multi-layer package substrate that has undergone an optional second molding process.

[0020] Figure 14 is a partial cross-sectional side view of a multi-layer package substrate that has undergone a package separation process. DETAILED DESCRIPTION

[0021] In the figures, like reference numerals refer to like elements throughout, and the various features are not necessarily drawn to scale. Also, the term "coupled" includes indirect or direct electrical or mechanical connections or combinations thereof. For example, if a first device is coupled to or coupled with a second device, the connection can be by a direct electrical connection or by an indirect electrical connection via one or more intervening devices and connections. One or more operating characteristics of various circuits, systems, and / or components are described below in the context of functions that in some cases are created by the configuration and / or interconnection of various structures when the circuit system is powered on and operating. In the following discussion and claims, the terms "including", "includes", "having", "has", "with" or variations thereof are intended to be inclusive in a manner similar to the term "comprising" and should therefore be interpreted to mean "including but not limited to...".

[0022] Unless otherwise stated, "about", "approximately" or "substantially" in front of a value means + / - 10% of the stated value. One or more operating characteristics of various circuits, systems, and / or components are described below in the context of functions that in some cases are created by the configuration and / or interconnection of various structures when the circuit system is powered on and operating. For ease of description in connection with specific figures, one or more structures, features, aspects, components, etc. may be referred to herein as first, second, third, etc., such as first and second terminals, first, second, and third wells, etc., where these should not be construed as limitations on the claims. The various disclosed structures and methods of the present disclosure can be advantageously applied to the manufacture of electronic devices such as integrated circuits. While such examples may be desirable to provide various improvements, the present disclosure does not require specific results unless explicitly recited in the specific claims.

[0023] The disclosed examples include an electronic device, a manufacturing method, and a system having a device package structure that surrounds a semiconductor die and has a top side with a notch that extends onto the package structure to the top sides of respective first and second metal clamps. The electronic components of the electronic device have conductive metal terminals that extend into respective notches and are electrically connected to the top sides of the respective metal clamps. These examples mitigate or overcome manufacturing and performance issues associated with devices having metal clamps with a top side flush with the top of a molded package structure, where non-wetting or insufficient soldering of component terminals and / or insufficient adhesive can cause the components to become dislodged from the package assembly. Additionally, the described examples can facilitate device height reduction and enhance the adhesion of electronic components to the clamps and the package structure.

[0024] Figure 1 and 1A A system showing an example electronic device 100 located in an example three-dimensional space having a first direction X, a perpendicular (orthogonal) second direction Y ( Figure 1 ), and a third direction Z perpendicular (orthogonal) to the respective first direction X and second direction Y. Structures or features along any two of these directions are orthogonal to each other. As Figure 1 shown, in the illustrated position, the electronic device 100 has opposite first side 101 and second side 102 (e.g., bottom side and top side) spaced apart from each other along the third direction Z. In the illustrated position, the electronic device 100 also has opposite third side 103 and fourth side 104 (e.g., lateral sides) spaced apart from each other along the first direction X, and fifth side 105 and sixth side 106 spaced apart from each other along the second direction Y.

[0025] In the illustrated system, the electronic device 100 is attached to a circuit board 120 having conductive metal pads 121. The electronic device 100 includes conductive metal leads 107 that are electrically connected to respective ones of the conductive metal pads 121 of the circuit board 120. The electronic device 100 includes a molded package structure 108 having first and second notches 109 in its top side that extend into the molded package structure 108 a distance D. The illustrated electronic device 100 includes an electronic component 110 having conductive metal first and second terminals 111 that extend into respective first and second notches 109. The component terminals 111 are electrically coupled to the top sides of respective first and second metal clamps 114 by solder 113 ( Figure 1A ). The example electronic device also includes an internal capacitor 115 ( Figure 1A ) enclosed within the molded package structure 108.

[0026] AsFigure 1A As further shown in Figure 1A , the molded encapsulation structure 108 also encloses the semiconductor die 118. In this example, the semiconductor die 118 includes one or more electronic components, such as transistors, diodes, etc., and includes conductive metal features that provide electrical connections to one or more of the conductive metal leads 107 and to other components of the electronic device 100.

[0027] The semiconductor die 118 is attached to a multi-layer encapsulation substrate 116 that includes the conductive metal leads 107. In another example, the electronic device may include the remaining elements of a starting lead frame (not shown) and may include other electrical interconnections (e.g., bond wires, not shown) to form the electrical interconnections of the components of the semiconductor die 118, the conductive metal leads 107, and any additional components or conductive structures integrated into the electronic device, the additional components or conductive structures including the capacitor 115, the electronic component 110, and the conductive metal clamp 114.

[0028] In one example, the electronic component 110 is a surface mount technology (SMT) component that has a first terminal 111 that extends into the first notch 109 and is electrically connected to the top side of the first metal clamp 114, and a second terminal 111 that extends into the second notch 109 and is electrically connected to the top side of the second metal clamp 114. In the illustrated example, the semiconductor die 118 is a flip chip attached to the top side of the multi-layer encapsulation substrate 116, where the die terminals are soldered to corresponding conductive features on the top layer of the substrate 116. In this example, the substrate 116 includes multiple layers having conductive metal traces and via features. In this example, one or more peripheral traces and / or lead features of the substrate 116 form the conductive metal leads 107 of the electronic device. Additionally, in this example, the bottom metal features of the multi-layer encapsulation substrate 116 are electrically coupled to corresponding conductive metal pads in the conductive metal pads 121 of the system circuit board 120 by solder (not shown).

[0029] The exemplary electronic device 100 includes an adhesive 117 (e.g., Figure 1A glue). In one example, the adhesive 117 extends between the top side of the molded encapsulation structure 108 and a portion of the bottom side of the electronic component 110. The adhesive 117 helps to adhere the bottom side of the electronic component 110 to a portion of the top side of the molded encapsulation structure 108. In another embodiment, the adhesive 117 may be omitted. In the case of being included in the illustrated example as shown, in addition to the solder connection 113 between the component terminal 111 and the top side of the conductive metal clamp 114, the adhesive 117 also provides structural support and helps to adhere the electronic component 110 to the top side of the molded encapsulation structure 108.

[0030] The conductive first and second metal clamps 114 are each attached to corresponding top-side conductive metal features of the substrate 116. The first and second electronic component terminals 111 are individually connected by solder joints 113 to the top sides of the respective first and second metal clamps 114. The conductive metal clamps 114 provide electrical connection of the terminals 111 of the electronic component 110 to corresponding circuit nodes of the system and / or electronic device 100.

[0031] In one example, the electronic device 100 is an integrated power module, where one or more transistors of the semiconductor die 118 are operatively interconnected to the capacitor 115 and the electronic component 110 to provide a power converter circuit, such as a boost converter, a buck converter, a buck-boost converter, a cuk converter, etc. In one example, the electronic component 110 is an inductor. In other examples, other forms and types of electronic components 110 may be used, for example, where the electronic component 110 is a passive SMT component such as a resistor, a capacitor, an inductor, etc. and / or an active or switching-type component such as a diode, a transistor, etc. In the illustrated example, the electronic component 110 is an SMT inductor component having leads with opposite ends and is configured for surface mounting by solder joints to a printed circuit board or other host system. In the illustrated embodiment, the component terminals 111 are soldered ( Figure 1A ) to the top sides of the conductive metal clamps 114 by SMT attachment techniques and solder 113. This provides structural attachment and support as well as electrical interconnection of the electronic component 110 to the metal clamps 114, and may be enhanced or facilitated by optionally using an adhesive 117 as Figure 1A shown.

[0032] The notch 109 of the molded package structure 108 provides a channel that facilitates formation of the solder 113 along at least a portion of the top side of the intended conductive metal clamp 114, and also relieves or prevents lateral movement of the solder 113 caused by the weight of the electronic component 110 during a solder reflow operation, thereby facilitating provision of a sufficient solder thickness (e.g., along the third direction Z) to prevent or mitigate non-wetted solder joints and helping to ensure proper attachment and mechanical support of the electronic component 110 on the electronic device 100. Additionally, in one example, the notch 109 is formed from an initially overmolded package structure 108 by laser ablation or other material removal processes, and laser ablation is used during manufacturing to provide a clean surface at the top side of the conductive metal clamp 114 to further facilitate proper soldering connection between the electronic component terminals 111 and the top side of the conductive metal clamp 114.

[0033] In one example, the electronic component 110 has a vertical height (e.g., along a third direction Z in the illustrated orientation) that is greater than the height of the remainder of the electronic device 100 including the molded encapsulation structure 108 and the height of the substrate 116. A notch 109 is provided in the top side of the molded encapsulation structure 1084, and the solder connection of the electronic component terminals 111 to the top side of the conductive metal fixture 114 helps reduce the overall height of the electronic device 100 (along the third direction Z).

[0034] In addition, even in the case of dimensional tolerance variations in other components of the device 100, such as dimensional variations in the Z-direction thickness of the multi-layer encapsulation substrate 116, the solder connection between the substrate 116 and the conductive metal fixture 114, and the Z-direction height of the metal fixture 114, the solder connection of the electronic component 110 through the notch 109 helps control the overall device height.

[0035] In one example, the electronic device 100 may include a second molded encapsulation structure 1308 that surrounds the electronic component 110, as described below in connection with Figure 13 illustrated and described, but is not a strict requirement for all possible embodiments.

[0036] Reference is also made to Figures 2 to 14 , Figure 2 which shows an example method 200 for manufacturing an electronic device, and Figures 3 to 14 illustrates one or more embodiments of an example electronic device 100 that has undergone a manufacturing process according to method 200. Method 200 is described in connection with the above-described multi-layer encapsulation substrate-based electronic device 100. In another embodiment, the encapsulation process begins with a starting lead frame (not shown). In the illustrated embodiment, the starting multi-layer encapsulation substrate 116 is located on a fixture (not shown). In this example, the substrate 116 is formed as a panel array including rows and columns of unit areas 301 as shown in Figure 3 and each unit area 301 corresponds to a respective instance of the expected finished packaged electronic device 100 after the encapsulation process.

[0037] Method 200 begins the die attachment process at 202 in Figure 2 . Figure 3 An example is shown in which a die attachment process 300 is performed that attaches an instance of a semiconductor die 118 to a corresponding conductive metal feature on the top side of the multi-layer encapsulation substrate 116 in each respective unit area 301 of the substrate panel array. The die attachment process 300 can be automated, for example, using a pick-and-place device (not shown) that sequentially attaches instances of the semiconductor die 118 in each unit area 301.

[0038] In one embodiment, the attachment process 300 incorporates Figure 2Subsequent reflow soldering treatment at 206 in [[ID=]] performs flip-chip solder attachment. The attachment can include, for example, initial solder paste formation by screen printing, printing, etc., which forms solder paste on corresponding conductive metal features on the top side of the multi-layer package substrate 116 before placing the individual semiconductor dies 118 in each unit area 301. In another embodiment, the conductive metal terminals (e.g., copper bumps, etc.) of the semiconductor die instance 118 are impregnated with or otherwise pre-provided with solder before being bonded to the top side of the conductive metal substrate features. In the illustrated example, multiple components and structures will be attached to the substrate 116 (e.g., semiconductor die 118, fixture 114, capacitor 115), and a single process can be used to form solder paste at the necessary positions on the top side of the multi-layer package substrate.

[0039] At Figure 2 203 in [[ID=]], in one example, the method includes attaching one or more passive components to the package substrate 116. Figure 4 An example is shown where a surface mount component attachment process 400 is performed, which, for example, uses an automatic pick-and-place device to attach the above capacitor 115 to the corresponding conductive metal features in each unit area 301 on the top side of the multi-layer package substrate 116. In one embodiment, the capacitor attachment process 400 can be a continuation of the attachment process 300 for attaching the semiconductor die 118. In one example, before the automatic attachment or placement of the component 115, the substrate conductive features to be connected to the terminals of the capacitor component 115 are screen printed or printed with solder paste.

[0040] Method 200 continues at Figure 2 204 in [[ID=]], where conductive first and second metal fixtures 114 are attached to the substrate 116. Figure 5 An example is shown where a surface mount component attachment process 500 is performed, which, for example, uses an automatic pick-and-place device to attach the conductive metal fixture 114 to the corresponding conductive metal features in each unit area 301 on the top side of the multi-layer package substrate 116. In one embodiment, the metal fixture attachment process 500 can be a continuation of the attachment process 300 for attaching the semiconductor die 118 or the attachment process 400 for attaching the capacitor 115. In one example, before the automatic attachment or placement of the conductive metal fixture 114, for example, in a single solder paste screen printing or printing process before attaching the semiconductor die 118, capacitor 115, and conductive metal fixture 114, the substrate conductive features to be connected to the conductive metal fixture 114 are screen printed or printed with solder paste.

[0041] At Figure 2 206 in [[ID=]], method 200 includes forming electrical connections for various components 114, 115, and 118 in each unit area 301 of [[ID=]]. Figure 6Shows an example where a hot solder reflow process 600 is performed, which reflows previously formed solder and forms solder connections between the corresponding conductive features of the substrate 116 and the components 114, 115, and 118 in each unit area 301.

[0042] Method 200 continues at Figure 2 208 in, where molding is performed to form a molded package structure 108 that encloses the semiconductor die 118, the capacitor 115, and the conductive metal fixture 114. Figure 7 Shows an example where a molding process 700 for forming the molded package structure 108 is performed. The molding process 700 uses a mold (not shown) having a top cavity surface that is positioned (i.e., spaced apart) above the top side of the conductive metal fixture 114 along a third direction Z in the illustrated orientation during process 700. As Figure 7 shown, this provides an initial molded structure 108 that covers the top side of the conductive metal fixture 114, for example, by the spacing distance D described above in connection with Figure 1A description.

[0043] At Figure 2 method 210 in, method 200 continues, where molding material is removed to form a notch 109 in the top side of the molded structure 108 to expose the top side of the conductive metal fixture 114. Figure 8 Shows an example where a material removal process 800 is performed, which forms a notch 109 in the top side of the molded structure 108 and exposes the top side of the conductive metal fixture 114. In one example, the material removal process 800 is a laser ablation process that uses a laser (not shown) to selectively ablate a portion of the molding material 108 above at least a portion of each of the conductive metal fixtures 114. In this example, the laser ablation process 800 provides a clean surface at the top side of the conductive metal fixture 114 and produces a notch 109 having a recessed depth D, as Figure 8 shown.

[0044] In one example, method 200 includes an optional adhesive formation at Figure 2 211 in. Figure 9 Shows an example where an adhesive formation process 900 is performed, which forms an adhesive 117 on a portion of the top side of the molded package structure 108 in each unit area 301 of the panel array. Any suitable adhesive formation process 900 and adhesive material 117 can be used, such as gluing, screen printing, printing, dispensing, etc. of a UV or heat-activated adhesive 117. In another embodiment, the adhesive formation at 211 can be omitted.

[0045] Method 200 is at Figure 2Continue at 212 therein, where solder paste formation occurs. When the assembly includes an adhesive, the adhesive formation at 211 and the solder paste formation at 212 can be in any suitable order. Figure 10 Show an example where a solder paste formation process 1000 is performed, which forms a solder paste 113 on the exposed portion of the top side of the conductive metal fixture 114 in each unit area 301 of the panel array. Any suitable formation process 1000 can be used, for example, screen printing using a stencil, printing, dispensing, etc., to form the solder paste 113 on the top sides of the first and second metal fixtures 114 exposed in the corresponding notches 109 of the molded package structure 108. In one example, the solder paste 114 is formed at 212 by printing the solder paste 113 on the top sides of the first and second metal fixtures 114 exposed in the corresponding notches 109. In another example, the solder paste formation at 212 includes screen printing the solder paste 113 on the top sides of the first and second metal fixtures 114 exposed in the corresponding notches 109.

[0046] Different from the alternative method where the top surface of the metal fixture is not overmolded and is substantially flush with the top side of the molded package structure 108, the notch 109 created after overmolding the top of the metal fixture facilitates a proper solder connection between the electronic component terminal 111 and the top side of the conductive metal fixture 114. Specifically, the notch 109 provides a channel that facilitates the formation of the solder 113 along at least a portion of the top side of the intended conductive metal fixture 114. The notch also reduces or prevents lateral solder paste movement caused by the weight of the subsequently attached electronic component 110 during solder reflow. This helps ensure an appropriate final solder thickness (e.g., along the third direction Z) to prevent or reduce non-wetted solder joints, and helps ensure a robust attachment and mechanical support of the electronic component 110 on the electronic device 100, either alone or in combination with any included adhesive 117. Additionally, examples where the notch 109 is formed by laser ablation or other cleaning material removal processes help provide a clean surface along the exposed top side of the conductive metal fixture 114 to further facilitate a proper solder connection between the electronic component terminal 111 and the top side of the conductive metal fixture 114.

[0047] Method 200 continues at Figure 2 214 and 216 therein to mechanically and electrically connect the electronic component 110 and its terminals 111. In the illustrated example, the electrical connection process includes attaching an external electronic component 110 at Figure 2 214 therein. Figure 11Shows an example where, for example, an attachment process 1100 is performed using an automated pick-and-place device (not shown) that attaches first and second terminals 111 of an electronic component 110 to solder paste 113 on the top side of corresponding first and second metal fixtures 114 through a notch 109. In the illustrated example, the attachment process 1100 also joins a portion of the bottom side of the electronic component 110 to an adhesive 117, as Figure 11 shown in

[0048] At Figure 2 216 in Figure 12 an example implementation of method 200 includes completing the electrical interconnection of component terminals 111 with the top side of metal fixtures 114 by reflowing solder paste 113.

[0049] In one example, Figure 2 method 200 in Figure 13 may include an optional additional molding process at 217. Figure 2 Shows an example where a second molding process 1300 is performed that forms a second molding encapsulation structure 1308 that surrounds the electronic component 110 and covers a portion of the top side of the first or bottom molding encapsulation structure 108. This can provide additional protection and / or electrical isolation for the added electronic component 110. In another implementation, the second molding process at 217 in

[0050] Method 200 continues at Figure 2 218 in Figure 2 where a package separation process is performed. In the illustrated example, the packaged electronic devices in each unit area 301 are processed simultaneously or sequentially with respective portions of a substrate 116 formed in a continuous substrate structure having rows and columns of unit areas 301. Figure 14An example is shown in which an encapsulation separation process 1400, such as sawing, laser cutting, etching, etc., is performed to separate the finished electronic device 100 from the panel array structure. In this embodiment, a cutting process 1400 is used, which cuts along the scribe lines 1402 between the unit areas 301 in the row and column directions of the multi-layer encapsulation substrate panel array structure.

[0051] The example described includes creating encapsulation structure notches 109, for example, by laser ablation or other suitable techniques, to remove molding compound or other materials from an initially overmolded (e.g., covered) fixture 114. The described embodiment avoids problems associated with attempting to perform molding operations using a mold attached to the top side of the fixture, which may require complex and expensive dual-mold assisted molding (FAM) techniques and equipment, and facilitates easy accommodation of dimensional tolerance variations during manufacturing, while helping to reduce the overall height of the electronic device along the Z direction. The example described also provides benefits associated with the notch 109, including a recessed channel structure that helps to accommodate solder paste and ensure a desired solder thickness and a robust mechanical mounting of the electronic component 110. Additionally, the laser ablation example embodiment helps to reduce or avoid residual molding material on the top side of the fixture 114 and enhances the solder connection between the component terminals 111 and the conductive metal fixture 114. The example described helps to improve manufacturing yield and reduce manufacturing costs, while providing a robust electronic device structure, even in cases where the electronic component 110 has a large vertical height along the Z direction to produce a potentially high aspect ratio electronic device 100, while reducing the chance of the electronic component 110 detaching from the electronic device 100.

[0052] Within the scope of the claims, modifications may be made in the example described, and other embodiments are possible.

Claims

1. An electronic device, comprising: a semiconductor die, which is attached to a lead frame or substrate; electrically conductive first and second metal clips attached to the lead frame or substrate; a molded package structure surrounding the semiconductor die and having a top side with first and second recesses extending into the molded package structure to the top sides of respective first and second metal fixtures; as well as An electronic component has conductive metal first and second terminals extending into respective first and second recesses and electrically connected to the top sides of the respective first and second metal fixtures.

2. An electronic device according to claim 1, wherein the electronic component is a passive surface mount technology component having a first terminal extending into the first recess and electrically connected to the top side of the first metal fixture, and a second terminal extending into the second recess and electrically connected to the top side of the second metal fixture. 3 . The electronic device of claim 1 , wherein the electronic component is one of a resistor, a capacitor, an inductor, a diode, and a transistor. 4 . The electronic device of claim 1 , comprising an adhesive extending between the top side of the molded package structure and a side of the electronic component.

5. The electronic device of claim 4, comprising a second molded encapsulation structure surrounding the electronic component. The electronic device of claim 1 , comprising a second molded encapsulation structure surrounding the electronic component.

7. A system comprising: a circuit board having conductive metal pads; as well as an electronic device attached to the circuit board and comprising: a conductive metal lead electrically connected to a corresponding one of the conductive metal pads; a semiconductor die, which is attached to a lead frame or substrate; electrically conductive first and second metal clips attached to the lead frame or substrate; a molded package structure surrounding the semiconductor die and having a top side with first and second recesses extending into the molded package structure to the top sides of respective first and second metal fixtures; and An electronic component has conductive metal first and second terminals extending into respective first and second recesses and electrically connected to the top sides of the respective first and second metal fixtures.

8. The system of claim 7, wherein the electronic component is a passive surface mount technology component having a first terminal extending into the first recess and electrically connected to the top side of the first metal fixture, and a second terminal extending into the second recess and electrically connected to the top side of the second metal fixture.

9. The system of claim 7, wherein the electronic component is one of a resistor, a capacitor, an inductor, a diode, and a transistor.

10. The system of claim 7 including an adhesive extending between the top side of the molded package structure and a side of the electronic component.

11. The system of claim 10, comprising a second molded packaging structure surrounding the electronic component.

12. The system of claim 7, comprising a second molded packaging structure surrounding the electronic component.

13. A method of manufacturing an electronic device, the method comprising: attaching a semiconductor die to a lead frame or substrate; attaching electrically conductive first and second metal clips to the lead frame or substrate; forming a molded package structure surrounding the semiconductor die and having a top side; removing molding material from a top side of the molded package structure to form first and second recesses extending into the molded package structure to top sides of respective first and second metal fixtures; as well as Conductive metal first and second terminals of an electronic component are electrically connected to the top sides of the respective first and second metal fixtures through the recesses.

14. The method of claim 13, wherein removing molding material from the top side of the molded package structure comprises performing a laser ablation process.

15. The method according to claim 14, further comprising: forming an adhesive on a portion of the top side of the molded package structure; as well as A portion of a side of the electronic component is bonded to the adhesive.

16. The method of claim 15, wherein electrically connecting the first and second terminals comprises: forming solder paste on the top sides of the first and second metal fixtures exposed in the corresponding recesses; attaching the first and second terminals of the electronic component to the solder paste on the top sides of the respective first and second metal fixtures through the recesses; and The solder paste is reflowed to form solder connections between the first and second terminals of the electronic component and the top sides of the respective first and second metal fixtures. 17 . The method of claim 13 , further comprising forming a second molded package structure surrounding the electronic component and covering a portion of the top side of the molded package structure.

18. The method of claim 13, wherein electrically connecting the first and second terminals comprises: printing solder paste on the top sides of the first and second metal fixtures exposed in the respective recesses; attaching the first and second terminals of the electronic component to the solder paste on the top sides of the respective first and second metal fixtures through the recesses; and The solder paste is reflowed to form solder connections between the first and second terminals of the electronic component and the top sides of the respective first and second metal fixtures.

19. The method of claim 13, wherein electrically connecting the first and second terminals comprises: screen printing solder paste on the top sides of the first and second metal fixtures exposed in the respective recesses; attaching the first and second terminals of the electronic component to the solder paste on the top sides of the respective first and second metal fixtures through the recesses; and The solder paste is reflowed to form solder connections between the first and second terminals of the electronic component and the top sides of the respective first and second metal fixtures.

20. The method of claim 13, further comprising: forming an adhesive on a portion of the top side of the molded package structure; as well as A portion of a side of the electronic component is bonded to the adhesive.

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