Integrated circuit packaging support

By dividing the integrated circuit package bracket into two parts, and setting an electrostatic guidance component and a pin protection component in the upper bracket, the problem of poor adaptability of the package bracket in the prior art is solved, and effective electrostatic protection under conventional conditions is achieved.

CN120072805AActive Publication Date: 2025-05-30SHENZHEN ZHENGYUXING ELECTRONICS CO LTD
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Patent Information

Application Number
CN202510244408.1
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-03-03
Publication Date
2025-05-30
Estimated Expiration
2045-03-03

AI Technical Summary

Technical Problem

The existing integrated circuit package supports are poor in anti-static properties, especially in environments where the grounding system is not installed or the humidity is less than 20%, making it difficult to effectively protect the integrated circuit.

Method used

An integrated circuit package bracket was designed. By dividing the bracket into an upper bracket and a lower bracket, and setting an electrostatic guidance component and a pin protection component in the outer frame and installation box of the upper bracket, the electrostatic guidance component is used to guide and store static electricity to prevent static electricity from entering the integrated circuit.

Benefits of technology

It realizes effective protection of integrated circuits against static damage under conventional conditions, and can maintain good conductivity in low humidity environments to meet the needs of electrostatic protection.

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Abstract

The invention relates to the technical field of integrated circuit packaging, in particular to an integrated circuit packaging support. The lower support comprises a lower support body, the outer edge of the lower support body is fixedly connected with a plurality of inner pins which are evenly distributed, and an integrated circuit is arranged in the lower support body. According to the device, the packaging support is divided into the upper support and the lower support, the upper support is divided into the outer frame and the mounting box, and when a user takes the device, fingers can naturally make contact with the outer frame with the long outer perimeter and make contact with the contact current-conducting plate; at the moment, static electricity on the fingers of the user enters the storage capacitor along the contact current-conducting plate and the guide wire, the electrostatic protection effect is achieved, and therefore the problem that a traditional device is poor in adaptability to the external environment when achieving electrostatic protection can be avoided; when the humidity is lower than 20%, the influence on the conductivity is small, and the normal electrostatic protection requirement can still be met.
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Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit packaging, and more specifically, to an integrated circuit packaging bracket. Background Art

[0002] An integrated circuit is a miniature electronic device that integrates multiple electronic components on a semiconductor material to form a complete circuit system. An integrated circuit packaging bracket is a structure used to protect and fix the integrated circuit, and is also a bridge for electrical connection between the integrated circuit and the external circuit.

[0003] The electrical components inside the integrated circuit are very precise. If the user has static electricity on their hands when picking up the packaging bracket and their fingers touch the pins, the static electricity will enter the integrated circuit through the pins, resulting in damage to its internal components. Therefore, anti-static measures are taken on existing packaging brackets. Common anti-static measures are to connect the pins on the bracket to an external grounding system to conduct the static electricity, or to spray an anti-static coating on the outer surface of the bracket.

[0004] However, the grounding method has high requirements for the external storage environment. If the corresponding grounding system is not installed in the storage environment, it is difficult to achieve effective protection. The method of spraying an anti-static coating has high requirements for the humidity of the external environment. When the humidity of the external environment is below 20%, the surface resistivity of the anti-static coating will rise to ten times or even higher than the original, resulting in a decline in the protection effect. Therefore, when existing packaging brackets take anti-static measures, their adaptability to the external environment is poor, and it is difficult to meet the protection requirements under normal conditions. Summary of the Invention

[0005] The purpose of the present invention is to provide an integrated circuit packaging bracket to solve the problems raised in the above background art.

[0006] To achieve the above purpose, one of the purposes of the present invention is to provide an integrated circuit packaging bracket, including a lower bracket. A plurality of evenly distributed inner pins are fixedly connected to the outer edge of the lower bracket. An integrated circuit is arranged inside the lower bracket. An adhesive layer is smeared on the top surface of the lower bracket. An upper bracket is arranged on the top surface of the lower bracket. The upper bracket includes an outer frame and an installation box. The lower bracket is bonded to the installation box through the adhesive layer;

[0007] The outer perimeter of the outer frame is greater than the outer perimeter of the lower bracket. The outer frame is used for clamping by the human hand. An electrostatic guiding component is arranged inside the outer frame and the installation box. The electrostatic guiding component is used to guide and store the static electricity generated when the human hand touches the outer frame. When the human hand picks up the outer frame, the finger contacts the outer frame, and the static electricity is guided and stored by the electrostatic guiding component;

[0008] Four pin protection components are provided below the outer frame. The pin protection components are used to protect the inner pins and control the connection state between the inner pins and the external circuit. The inner pins are connected to the external circuit through the pin protection components.

[0009] The electrostatic guiding component is also used to control the displacement of the pin protection component by pressing with a human finger, so as to change the contact state between the pin protection component and the inner pin.

[0010] As a further improvement of this technical solution, four uniformly distributed first mounting grooves are formed on the outer edge of the outer frame. The electrostatic guiding component includes four contact conductive plates respectively slidably connected inside the four first mounting grooves and a storage capacitor fixedly connected inside the mounting box. Guiding wires are electrically connected between the four contact conductive plates and the storage capacitor.

[0011] As a further improvement of this technical solution, the contact conductive plates and the guiding wires are both made of copper. Four uniformly distributed connecting pipes are fixedly connected between the outer frame and the mounting box. The four guiding wires are respectively arranged inside the four connecting pipes.

[0012] As a further improvement of this technical solution, the pin protection component includes a moving plate. A plurality of connecting strips are fixedly connected to the top of the moving plate. A plurality of sliding grooves are formed at the bottom of the outer frame. The connecting strips penetrate and are slidably connected inside the sliding grooves. The top of the connecting strip is fixedly connected to the bottom of the contact conductive plate. The connecting strip is made of silicon dioxide.

[0013] As a further improvement of this technical solution, a plurality of outer pin sleeves are fixedly connected to the bottom of the connecting strip. The inner pins are slidably arranged inside the outer pin sleeves, and there is a gap between the inner pins and the outer pin sleeves. The outer pin sleeves and the inner pin sleeves are made of the same material.

[0014] As a further improvement of this technical solution, a conductive block is fixedly connected to the bottom surface of the inner wall of the outer pin sleeve. When the inner pin is connected to the external circuit, the top of the conductive block is in contact with the bottom of the inner pin. The outer pin sleeve is electrically connected to the inner pin through the conductive block.

[0015] As a further improvement of this technical solution, limiting components are arranged at both ends of the moving plate. The limiting components include a limiting frame fixedly connected to one end of the moving plate and a fixed strip fixedly connected to one side of the lower bracket. The fixed strip is slidably connected inside the limiting frame.

[0016] As a further improvement of the technical solution, two limiting grooves are provided on the top surface of the inner wall of the limiting frame. A second installation groove is provided on the top surface of the fixing strip. A second spring rod is fixedly connected inside the second installation groove. The top of the second spring rod is fixedly connected with a limiting ball, and the limiting ball is slidably connected with the limiting groove.

[0017] As a further improvement of the technical solution, a number of uniformly distributed first spring rods are fixedly connected between the contact conductive plate and the first installation groove, and the inner diameter of the connecting pipe is larger than the diameter of the guiding wire.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] In this integrated circuit packaging bracket, by dividing the packaging bracket into two parts: an upper bracket and a lower bracket, and further dividing the upper bracket into an outer frame and an installation box, when the user takes the device, the finger will naturally touch the outer frame with a longer outer circumference and the contact conductive plate. At this time, the static electricity on the user's finger enters the storage capacitor along the contact conductive plate and the guiding wire, achieving the effect of static electricity protection. In this way, the problem of poor adaptability to the external environment when the traditional device realizes static electricity protection can be avoided. And because both the contact conductive plate and the guiding wire are made of copper, when the humidity is lower than 20%, the influence on their conductive performance is small, and it can still meet the normal static electricity protection requirements.

[0020] And in order to prevent the user's finger from directly touching the inner pin, through the pin protection component provided under the outer frame, the inner pin is protected by the outer pin sleeve to avoid direct stress. At the same time, when the device is not connected to the external circuit, the outer pin sleeve and the inner pin are in an open circuit state. Even if there is static electricity on the user's finger, it cannot enter the inner pin through the outer pin sleeve, thus more effectively achieving the protection effect on the inner pin and the integrated circuit.

[0021] At the same time, in order to guide the user to actively touch the contact conductive plate, by setting the limiting component to maintain the open circuit state between the outer pin sleeve and the inner pin when the device is not in use. If the user needs to connect the outer pin sleeve and the inner pin, the contact conductive plate must be pressed with the finger. In this way, the static electricity of the user's finger can be guided into the storage capacitor. After that, when the limiting ball enters the next limiting groove, the outer pin sleeve and the inner pin are in a connected state through the conductive block, and then the user can connect the outer pin sleeve to the external circuit to realize the power-on of the device. Description of the Drawings

[0022] Figure 1 is the overall structural schematic diagram of the present invention;

[0023] Figure 2 is the three-dimensional structural schematic diagram after disassembling the lower bracket and the upper bracket of the present invention;

[0024] Figure 3 Schematic diagram of the internal structure of the upper bracket in the present invention;

[0025] Figure 4 Partial structure schematic diagram of the upper bracket in the present invention;

[0026] Figure 5 Side sectional structure schematic diagram of a part of the structure in the present invention;

[0027] Figure 6 Cross-sectional structure schematic diagram before and after the connection between the outer pin sleeve and the inner pin in the present invention;

[0028] Figure 7 Side sectional structure of the limit frame and the fixing strip in the limit component of the present invention.

[0029] The meanings of each label in the figure are as follows:

[0030] 1. Lower bracket; 11. Inner pin; 12. Glue coating layer;

[0031] 2. Upper bracket; 21. Outer frame; 211. First installation groove; 212. Sliding groove; 22. Installation box;

[0032] 23. Electrostatic guiding component; 231. Contact conductive plate; 232. Guiding wire; 233. Storage capacitor;

[0033] 24. Connecting pipe; 25. First spring rod;

[0034] 3. Pin protection component; 31. Moving plate; 32. Connecting strip; 33. Outer pin sleeve; 34. Conductive block;

[0035] 4. Limit component; 41. Limit frame; 42. Fixing strip; 421. Second installation groove; 43. Limit groove; 44. Second spring rod; 45. Limit ball. Specific embodiments

[0036] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0037] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the present invention.

[0038] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is two or more, unless otherwise specifically defined.

[0039] Embodiment 1

[0040] Please refer to Figure 1 - Figure 3 As shown, the purpose of this embodiment is to provide an integrated circuit packaging bracket, which includes a lower bracket 1. A plurality of evenly distributed inner pins 11 are fixedly connected to the outer edge of the lower bracket 1. An integrated circuit is arranged inside the lower bracket 1. An adhesive layer 12 is applied to the top surface of the lower bracket 1. An upper bracket 2 is arranged on the top surface of the lower bracket 1. The upper bracket 2 includes an outer frame 21 and a mounting box 22. The lower bracket 1 is bonded to the mounting box 22 through the adhesive layer 12;

[0041] The outer perimeter of the outer frame 21 is greater than the outer perimeter of the lower bracket 1. The outer frame 21 is used for clamping by the human hand. An electrostatic guiding component 23 is arranged inside the outer frame 21 and the mounting box 22. The electrostatic guiding component 23 is used to guide and store the static electricity generated when the human body touches the outer frame 21. When the human hand picks up the outer frame 21, the finger contacts the outer frame 21, and the static electricity is guided and stored by the electrostatic guiding component 23;

[0042] Four pin protection components 3 are arranged below the outer frame 21. The pin protection components 3 are used to protect the inner pins 11 and control the connection state between the inner pins 11 and the external circuit. The inner pins 11 are connected to the external circuit through the pin protection components 3;

[0043] The electrostatic guiding component 23 is also used to control the displacement of the pin protection component 3 through the pressing of the human finger, so as to change the contact state between the pin protection component 3 and the inner pin 11.

[0044] The inner pin 11 is electrically connected to the integrated circuit inside the lower bracket 1. The inner pin 11 is used to electrically connect the integrated circuit to the external circuit. When the device is placed, the outer frame 21 is located above the lower bracket 1. Since the outer perimeter of the outer frame 21 is larger than the outer perimeter of the lower bracket 1, when a user picks up the device, most likely the user will first touch the outer frame 21 with a larger outer perimeter and which is convenient to pick up with the hand. Naturally, the user's finger will come into contact with the static electricity guiding component 23. If there is static electricity on the user's finger, the static electricity will be guided and released by the static electricity guiding component 23, achieving the effect of static electricity protection;

[0045] At the same time, the pin protection component 3 can effectively prevent the user's finger from directly touching the inner pin 11. And when the device is not connected to the external circuit, the pin protection component 3 and the inner pin 11 are in an open circuit state. Therefore, the static electricity on the user's finger cannot enter the inner pin 11 through the pin protection component 3;

[0046] If it is necessary to connect the inner pin 11 to the external circuit, the user must touch the static electricity guiding component 23 with a finger and control the pin protection component 3 to be connected to the inner pin 11 through the static electricity guiding component 23. Then, the inner pin 11 is connected to the external circuit through the pin protection component 3. During this process, the static electricity on the user's hand will still be guided and released through the static electricity guiding component 23, effectively ensuring that the static electricity protection effect of the device can be normally achieved.

[0047] Further, please refer to Figure 1 - Figure 5 Four uniformly distributed first mounting grooves 211 are provided on the outer edge of the outer frame 21. The static electricity guiding component 23 includes four contact conductive plates 231 respectively slidably connected inside the four first mounting grooves 211 and a storage capacitor 233 fixedly connected inside the mounting box 22. Electrically connecting wires 232 are connected between the four contact conductive plates 231 and the storage capacitor 233.

[0048] The contact conductive plates 231 and the guiding wires 232 are both made of copper. Four uniformly distributed connecting pipes 24 are fixedly connected between the outer frame 21 and the mounting box 22. The four guiding wires 232 are respectively arranged inside the four connecting pipes 24.

[0049] The contact conductive plates 231 are located on the outer edge of the outer frame 21 and occupy most of the area of the outer edge of the outer frame 21, which can effectively ensure that when the user picks up the outer frame 21 with a finger, the finger can come into contact with the contact conductive plates 231. If there is static electricity on the user's finger, the static electricity will enter the guiding wires 232 along the contact conductive plates 231 and enter the storage capacitor 233 from the guiding wires 232, effectively preventing the static electricity from entering the inner pin 11 and damaging the integrated circuit. The contact conductive plates 231 and the guiding wires 232 are made of copper because this material has good electrical conductivity and static electricity will more easily enter the circuit with a smaller resistance;

[0050] The basic structure of the storage capacitor 233 consists of an insulating medium sandwiched between two conductors. When static electricity passes through the circuit formed by the contact conductive plate 231, the guiding wire 232, and the storage capacitor 233, the storage capacitor 233 can provide a low-impedance path, enabling the static electricity charge to be quickly guided into the capacitor for storage. In this way, it can effectively prevent static electricity from entering the integrated circuit and damaging its internal components. At the same time, the installation box 22 can be set as an openable cover type, so that users can regularly remove and replace the storage capacitor 233, thereby transferring the accumulated static electricity in the storage capacitor 233 and enabling the static electricity guiding component 23 to achieve a continuous protection effect.

[0051] Specifically, please refer to Figure 2 、 Figure 3 、 Figure 4 and Figure 5 For ,

[0051] , Figure 2 , Figure 3 , Figure 4 , Figure 5 , the pin protection component 3 includes a moving plate 31. A plurality of connecting strips 32 are fixedly connected to the top of the moving plate 31. A plurality of sliding grooves 212 are opened at the bottom of the outer frame 21. The connecting strips 32 penetrate and are slidably connected inside the sliding grooves 212. The top of the connecting strips 32 is fixedly connected to the bottom of the contact conductive plate 231. The material of the connecting strips 32 is silicon dioxide.

[0052] The material of the connecting strips 32 is silicon dioxide, and silicon dioxide is an insulating material, thus keeping the outer pin sleeve 33 and the contact conductive plate 231 in an open circuit state, preventing a new circuit from being formed between the outer pin sleeve 33 and the contact conductive plate 231 and affecting the normal use of the integrated circuit in the device after power-on.

[0053] Furthermore, please refer to Figure 3 、 Figure 4 and Figure 5 For Figure 3 , Figure 4 , Figure 5 , a plurality of outer pin sleeves 33 are fixedly connected to the bottom of the connecting strips 32. The inner pins 11 are slidably arranged inside the outer pin sleeves 33, and there is a gap between the inner pins 11 and the outer pin sleeves 33. The outer pin sleeves 33 and the inner pins 11 are made of the same material.

[0054] A conductive block 34 is fixedly connected to the bottom surface of the inner wall of the outer pin sleeve 33. When the inner pins 11 are connected to an external circuit, the top of the conductive block 34 fits against the bottom of the inner pins 11, and the outer pin sleeves 33 are electrically connected to the inner pins 11 through the conductive blocks 34.

[0055] When the inner pin 11 is not connected to the external circuit, the inner pin 11 and the outer pin sleeve 33 are in a disconnected state, that is, there is no direct contact between them. Therefore, at this time, the outer pin sleeve 33 cannot conduct charge to the inner pin 11. The outer pin sleeve 33 also plays a role in protecting the inner pin 11, which can effectively prevent the inner pin 11 from being directly subjected to external stress and causing bending. When the inner pin 11 is connected to the external circuit, under the control of the electrostatic guiding component 23, the outer pin sleeve 33 gradually approaches the inner pin 11 until the conductive block 34 is connected to the inner pin 11. During installation, the outer pin sleeve 33 also acts as a pin. It can be installed in the circuit and introduce current into the integrated circuit through the conductive block 34 and the inner pin 11 to achieve the power-on effect.

[0056] In addition, please refer to Figure 5 and Figure 7 , both ends of the moving plate 31 are provided with limiting components 4. The limiting components 4 include a limiting frame 41 fixedly connected to one end of the moving plate 31 and a fixed strip 42 fixedly connected to one side of the lower bracket 1. The fixed strip 42 is slidably connected inside the limiting frame 41.

[0057] For more, please refer to Figure 6 , Figure 6 shows the change in the connection state between the outer pin sleeve 33 and the inner pin 11. When the outer pin sleeve 33 is not connected to the inner pin 11, there is a gap between the conductive block 34 and the inner pin. After connection, the conductive block 34 is in close contact with the inner pin 11, thus forming a complete circuit with the outer pin sleeve 33 and the integrated circuit.

[0058] Two limiting grooves 43 are opened on the top surface of the inner wall of the limiting frame 41. A second mounting groove 421 is opened on the top surface of the fixed strip 42. A second spring rod 44 is fixedly connected inside the second mounting groove 421. The top of the second spring rod 44 is fixedly connected with a limiting ball 45. The limiting ball 45 is slidably connected with the limiting groove 43.

[0059] A number of uniformly distributed first spring rods 25 are fixedly connected between the contact conductive plate 231 and the first mounting groove 211. The inner diameter of the connecting pipe 24 is larger than the diameter of the guiding wire 232.

[0060] The limiting component 4 is used to control the active state of the electrostatic guiding component 23. When the user needs to connect the outer pin sleeve 33 to the inner pin 11, the user can press the contact conductive plate 231 with a finger, so that the contact conductive plate 231 drives the moving plate 31 to move towards the inner pin 11 through the connecting bar 32. During this process, the thrust of the user's finger needs to overcome the resultant elastic force of the first spring rod 25 and the second spring rod 44. At this time, the contact conductive plate 231 gradually enters the inside of the first installation groove 211, and the limiting ball 45 is squeezed by the limiting groove 43 to contract the second spring rod 44 until the limiting frame 41 can slide along the fixed bar 42. After that, when the limiting ball 45 enters the next limiting groove 43, the limiting ball 45 is no longer squeezed by the limiting frame 41, so it abuts in the limiting groove 43. At this time, the user can stop applying thrust to the contact conductive plate 231, and at this time the conductive block 34 is connected to the inner pin 11.

[0061] In summary, the working principle of this device is as follows: When the device is not in use, the placement state of the device is that the lower bracket 1 faces downwards and the outer frame 21 faces upwards. When the user needs to pick up the device, the finger will naturally touch the outer frame 21. When the user needs to use the device, the user needs to press the four contact conductive plates 231 with a finger, so that the outer pin sleeve 33 is connected to the inner pin 11. When the contact conductive plate 231 is pressed by the user's finger, if there is static electricity on the user's finger at this time, the static electricity charge will enter the guiding wire 232 from the contact conductive plate 231 and enter the storage capacitor 233 through the guiding wire 232. The storage capacitor 233 can absorb static electricity, so as to realize the guiding and release of the static electricity on the user's finger;

[0062] At the same time when the contact conductive plate 231 is pressed by the user's finger, when the pressure of the user's finger exceeds the resultant force of the first spring rod 25 and the second spring rod 44, the contact conductive plate 231 moves towards the inside of the first installation groove 211. Through the connecting bar 32, the moving plate 31 moves together with the contact conductive plate 231. At the same time, the limiting frame 41 slides along the fixed bar 42. During this process, the limiting ball 45 is squeezed by the limiting groove 43 and slides into the second installation groove 421 and squeezes the second spring rod 44. After the limiting frame 41 slides a certain distance, the limiting ball 45 enters the next limiting groove 43. At this time, the limiting ball 45 is no longer squeezed by the inner wall of the limiting frame 41, and the elastic force stored in the second spring rod 44 is released, so as to push the limiting ball 45 into the next limiting groove 43 to fix the position of the moving plate 31. At this time, the conductive block 34 on the bottom surface of the inner wall of the outer pin sleeve 33 is connected to the inner pin 11, and the external current can enter the inner pin 11 and the integrated circuit along the outer pin sleeve 33 and the conductive block 34 to achieve the power-on effect.

[0063] The foregoing has shown and described the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments, and the above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of the present invention claimed is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit packaging bracket, comprising a lower bracket (1), the outer edge of the lower bracket (1) being fixedly connected to a plurality of evenly distributed inner pins (11), an integrated circuit being arranged inside the lower bracket (1), characterized in that: The top surface of the lower bracket (1) is coated with a coating layer (12); an upper bracket (2) is arranged on the top surface of the lower bracket (1); the upper bracket (2) comprises an outer frame (21) and an installation box (22); the lower bracket (1) is bonded to the installation box (22) via the coating layer (12); The outer circumference of the outer frame (21) is greater than the outer circumference of the lower bracket (1); an electrostatic guide component (23) is provided inside the outer frame (21) and the mounting box (22); the electrostatic guide component (23) is used to guide and store static electricity generated when a human body touches the outer frame (21); when a human hand takes the outer frame (21), the finger contacts the outer frame (21), and the static electricity is guided and stored by the electrostatic guide component (23); Four pin protection components (3) are arranged below the outer frame (21), and the pin protection components (3) are used to protect the inner pins (11) and control the connection state between the inner pins (11) and the external circuit; the inner pins (11) are connected to the external circuit through the pin protection components (3); The electrostatic guide component (23) is also used to control the displacement of the pin protection component (3) by pressing with a human finger, thereby achieving a contact state between the pin protection component (3) and the inner pin (11).

2. The integrated circuit package bracket according to claim 1, characterized in that: The outer edge of the outer frame (21) is provided with four evenly distributed No. 1 mounting grooves (211), the electrostatic guide component (23) comprises four contact conductive plates (231) respectively slidably connected inside the four No. 1 mounting grooves (211) and a storage capacitor (233) fixedly connected inside the mounting box (22), and a guide wire (232) is electrically connected between the four contact conductive plates (231) and the storage capacitor (233).

3. The integrated circuit package bracket according to claim 2, characterized in that: The contact conductive plate (231) and the guide wire (232) are both made of copper, four evenly distributed connecting tubes (24) are fixedly connected between the outer frame (21) and the installation box (22), and the four guide wires (232) are respectively arranged inside the four connecting tubes (24).

4. The integrated circuit package bracket according to claim 2, characterized in that: The pin protection component (3) comprises a movable plate (31), the top of the movable plate (31) is fixedly connected with a plurality of connecting strips (32), the bottom of the outer frame (21) is provided with a plurality of sliding grooves (212), the connecting strips (32) penetrate and slide in the interior of the sliding grooves (212), the top of the connecting strips (32) is fixedly connected with the bottom of the contact conductive plate (231), and the material of the connecting strips (32) is silicon dioxide.

5. The integrated circuit package bracket according to claim 4, characterized in that: A plurality of outer pin sleeves (33) are fixedly connected to the bottom of the connecting strip (32); the inner pins (11) are slidably arranged inside the outer pin sleeves (33); and there is a gap between the inner pins (11) and the outer pin sleeves (33); the outer pin sleeves (33) and the inner pin sleeves (11) are made of the same material.

6. The integrated circuit package bracket according to claim 5, characterized in that: A conductive block (34) is fixedly connected to the bottom surface of the inner wall of the outer pin sleeve (33); when the inner pin (11) is connected to an external circuit, the top of the conductive block (34) fits with the bottom of the inner pin (11), and the outer pin sleeve (33) is electrically connected to the inner pin (11) via the conductive block (34).

7. The integrated circuit package bracket according to claim 4, characterized in that: A limiting assembly (4) is provided at both ends of the movable plate (31), the limiting assembly (4) comprising a limiting frame (41) fixedly connected to one end of the movable plate (31) and a fixing bar (42) fixedly connected to one side of the lower bracket (1), the fixing bar (42) being slidably connected to the interior of the limiting frame (41).

8. The integrated circuit package bracket according to claim 7, characterized in that: The inner wall top surface of the limit frame (41) is provided with two limit grooves (43), the top surface of the fixing bar (42) is provided with a second installation groove (421), the interior of the second installation groove (421) is fixedly connected with a second spring rod (44), the top of the second spring rod (44) is fixedly connected with a limit ball (45), and the limit ball (45) is slidably connected with the limit groove (43).

9. The integrated circuit package bracket according to claim 3, characterized in that: A plurality of evenly distributed No. 1 spring rods (25) are fixedly connected between the contact conductive plate (231) and the No. 1 mounting groove (211), and the inner diameter of the connecting tube (24) is greater than the diameter of the guide wire (232).

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