Multi-band patch antenna and method for manufacturing multi-band patch antenna
By adopting a multi-band patch antenna with a multi-layer stacking structure, the defects in the antenna in the prior art in terms of space occupation and mechanical stability are solved, and the reception of multiple RF band signals is achieved and high mechanical reliability is achieved, and it is suitable for mobile and wireless devices.
Patent Information
- Application Number
- CN202411714814.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2023-11-28
- Filing Date
- 2024-11-27
- Publication Date
- 2025-05-30
AI Technical Summary
Existing patch antennas and chip-based antennas have shortcomings in their space and mechanical stability, making it difficult to support multiple RF bands and mechanical impact testing simultaneously.
Multi-band patch antennas with multi-layer stacking structure, including two antennas and three printed circuit boards (PCBs), are mechanical and electrically connected through glued connections and pin connections, forming a compact shape and improving mechanical stability.
The reception and processing of at least two different frequency band signals is realized, with small form factors and high mechanical reliability, suitable for use in mobile and wireless devices, especially GNSS functions.
Smart Images
Figure CN120073324A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to the field of wireless communication, and more particularly to antennas for receiving radio frequency signals. Specifically, the present disclosure relates to multi-band patch antennas and methods of manufacturing multi-band patch antennas. Background Art
[0002] A patch antenna is a flat directional antenna consisting of a metallic surface mounted on an insulating substrate. The surface typically has a rectangular or circular shape and is approximately half the length of the wavelength of the desired frequency. The patch antenna is shielded by a metallic surface on the other side of the substrate, which serves as a ground plane. The patch antenna can be connected to a coaxial cable or a microstrip line in various ways. Patch antennas are easy to design and inexpensive to manufacture. They also have a small thickness and can be attached to various surfaces. They can have different polarization types, such as linear, circular, or elliptical. Patch antennas can be used in various devices, such as terminals or user equipment in wireless communication (e.g., mobile radio, wireless local area network WLAN, or Bluetooth), or for global navigation satellite system (GNSS) receivers. For all these application scenarios, compact and low-cost antennas are particularly desirable.
[0003] However, patch antennas have a limited beam width and a narrow bandwidth, and thus are not suitable for large-area coverage. This means that they can only receive and transmit signals in a specific direction and are typically optimized for a specific frequency or a narrow frequency range. If the frequency changes, the performance of the antenna may degrade or the impedance matching may be lost. Therefore, in order to cover different frequency ranges or bands, a patch antenna must be provided for each band, resulting in a large occupied space.
[0004] In other known implementations, chip-based antennas are employed. A chip-based antenna is an antenna consisting of small chips made of dielectric materials, with metallic structures on their surfaces or inside. The metallic structures form electrical resonators that can receive or transmit electromagnetic waves. Chip-based antennas are compact, lightweight, and easy to integrate, but they also have some disadvantages, such as low bandwidth, high sensitivity to the environment, and low radiation efficiency. Chip-based antennas can have different shapes and sizes according to the desired frequency range, impedance matching, polarization, and radiation pattern. However, compared with patch antennas, chip-based antennas have a higher height, which makes them not suitable for appliances with limited size.
[0005] A GNSS-enabled device uses an antenna capable of receiving electromagnetic waves from GNSS satellites. These antennas should have high sensitivity, good impedance matching, and small size. It is usually required to be able to receive signals in different frequency bands. Moreover, these devices must pass certain drop tests and / or structural integrity tests to ensure product quality. Therefore, the antennas implemented in such devices should be able to resist mechanical shock. In addition, the signals received via the antenna must be pre-processed for further processing within a receiver (such as a GNSS receiver). Known solutions implement this function in separate components, thus occupying more space, which seems counterproductive.
[0006] Therefore, an object of the present invention is to provide an antenna for more than one RF band to overcome one or more disadvantages of the prior art in terms of occupied space and mechanical stability.
[0007] This object is achieved by the subject matter of the independent claims. Embodiments and developments are defined in the dependent claims.
[0008] Unless otherwise specified, the definitions provided above also apply to the following description. Summary of the Invention
[0009] In one embodiment, a multi-band patch antenna includes a first antenna, a second antenna, a first pin, an antenna printed circuit board (PCB), an interposer PCB, and a main PCB. The first antenna includes a first through-hole feed. The second antenna includes a second through-hole feed. The antenna PCB includes a first antenna feed point. The first antenna is mounted on top of the second antenna, and the second antenna is mounted on top of the antenna PCB. Both the first antenna and the second antenna have electrical connections to the antenna PCB. The first pin is mechanically and electrically connected to at least one of the first through-hole feed and the second through-hole feed and the first antenna feed point of the antenna PCB. The interposer PCB is mounted between the antenna PCB and the main PCB and is mechanically and electrically connected to the antenna PCB and the main PCB.
[0010] The multi-band patch antenna specified herein is based on two antennas stacked together and three PCBs arranged in a sandwich structure below the two stacked antennas. The resulting multi-band patch antenna is capable of receiving signals in at least two different frequency bands. In addition, through the stacked arrangement, a compact form factor is achieved while improving mechanical stability and reliability.
[0011] All three PCBs can be implemented as single-layer or multi-layer PCBs. The first antenna feed point can be implemented as a through-hole via or a feed-through.
[0012] Therefore, the specified multi-band patch antenna is very suitable for implementation as part of a receiver in mobile and wireless devices, especially for implementing the GNSS function in a receiver.
[0013] According to one development, the respective dimensions of the antenna PCB, the interposer PCB, and the main PCB match.
[0014] This increases the mechanical stability and supports the compact form factor of the multi-band patch antenna.
[0015] In one development, the main PCB includes electronic components for processing signals received by the first antenna and / or the second antenna. The height of the interposer PCB is higher than the height of the highest electronic component among the electronic components mounted on the main PCB.
[0016] The electronic components mounted on the main PCB can implement the functions of a classical antenna front end, as known to those skilled in the art. These tasks basically include filtering and amplifying incoming radio frequency signals. A suitable power circuit can also be part of these components on the main PCB. The height of the interposer PCB is adjusted such that in the final arrangement of the multi-band patch antenna, the electronic components of the main PCB are covered by the antenna PCB, and it can be said that the antenna PCB forms a lid. This hides the detailed structure of the antenna or RF front end implemented by the components on the main PCB and provides additional protection for the components.
[0017] In one development, the multi-band patch antenna includes a first gluing connection and a second gluing connection. The first gluing connection is arranged between the antenna PCB and the interposer PCB, and the second gluing connection is arranged between the interposer PCB and the main PCB.
[0018] The first gluing connection and the second gluing connection achieve a mechanical connection within the stack of the three PCBs. Each gluing connection (also referred to as an adhesive bond) can be achieved by applying a plurality of glue dots to one of the PCB surfaces involved in the gluing connection. In this way, a low-cost solution for achieving the high mechanical strength of the resulting multi-band patch antenna is realized. As an alternative or supplement to the gluing connection, the surfaces of the interposer PCB and the main PCB, and / or the surfaces of the interposer PCB and the antenna PCB, may include oppositely formed or mirror-inverted surface structures, such as steps, grooves, ridges, and other forms of tight fits, which engage with each other when in contact and are configured to enhance and / or provide a stable mechanical connection between the PCBs arranged one on top of the other.
[0019] In one development, both the first antenna and the second antenna are implemented as circularly polarized patch antennas. The first antenna is configured to operate in a GNSS frequency band, specifically one of the L1, L2, or L5 frequency bands. The second antenna is configured to operate in a GNSS frequency band different from the first antenna, specifically in a different one of the L1, L2, or L5 frequency bands.
[0020] Here, the L1, L2, and L5 frequency bands are only mentioned as examples of important and most widely used GNSS frequency bands. Other equivalent frequency bands (such as the E6 or E5 frequency bands) as well as the G1 and G2 frequency bands or the S frequency band can also represent the frequency bands in which the first or second antenna is configured to operate. Thus, the specified multi-band patch antenna achieves multi-band and multi-GNSS functionality.
[0021] In one development, the interposer PCB has a groove, and the center of the groove coincides with the center of the interposer PCB. The size of the groove is adapted to accommodate all the electronic components of the main PCB.
[0022] Therefore, the interposer PCB has a cutout, thereby forming a frame-like shape. Thus, the frame-like interposer PCB forms a rectangular ring that surrounds the components of the main PCB in the final stack of the multi-band patch antenna.
[0023] In one development, the first antenna feed point of the antenna PCB is located at or near the center of the antenna PCB.
[0024] This centered arrangement further improves mechanical stability.
[0025] In one development, the first pin passes through the first via feed portion of the first antenna and the second via feed portion of the second antenna, such that the first antenna and the second antenna are mechanically and electrically connected to each other. The first pin is soldered to the first antenna feed point of the antenna PCB on the surface of the antenna PCB facing the main PCB. The main PCB has an area without any electronic components. This area is arranged corresponding to the first antenna feed point of the antenna PCB.
[0026] In this embodiment, the first pin mechanically fixes the first antenna and the second antenna to the antenna PCB and provides an electrical connection between the first antenna and / or the second antenna and the first antenna feed point. Thus, the multi-band patch antenna is well-prepared for drop tests and / or structural integrity tests. The area below the solder joint connecting the first pin to the first antenna feed point on the main PCB is not covered by any electronic components.
[0027] In a development, the antenna PCB includes a first antenna radio frequency (RF) pad having an electrical connection to the first antenna feed point. The first antenna RF pad is disposed on a surface of the antenna PCB facing the main PCB and extends to an edge of the antenna PCB.
[0028] Advantageously, the surface of the antenna PCB facing the main PCB (i.e., the bottom surface of the antenna PCB) is provided with a conductive layer and is configured to carry a ground potential, except for the first antenna RF pad on the lower surface. The grounded conductive layer can be used as a counterbalance for the first antenna and / or the second antenna, i.e., as part of the first antenna and / or the second antenna, and provides electromagnetic protection for components on the main PCB based on Faraday's principle. Signals received by the first antenna and / or the second antenna propagate towards the first antenna RF pad through the first pin and the first antenna feed point.
[0029] In a development, the interposer PCB includes a first interposer RF pad located on one of the edges of the interposer PCB. The position of the first interposer RF pad corresponds to the position of the first antenna RF pad of the antenna PCB. The first interposer RF pad includes a via extending from a first surface of the interposer PCB facing the antenna PCB to a second surface of the interposer PCB facing the main PCB.
[0030] The via is an electrical connection between the first surface and the second surface of the interposer PCB. Both the first surface and the second surface are implemented as metal layers. The via can be provided by drilling a hole in the interposer PCB and plating it with a metal (such as copper), as is known to those skilled in the art. Thus, with the help of the via, signals can propagate from the first surface to the second surface. By arranging the interposer PCB relative to the antenna PCB such that the first antenna RF pad is directly above the first interposer RF pad, signals received by the first antenna and / or the second antenna can propagate to the second surface of the interposer PCB.
[0031] In a development, the main PCB includes a first main RF pad located on one of the edges of the main PCB. The position of the first main RF pad corresponds to the position of the first interposer RF pad of the interposer PCB.
[0032] With the help of the first main RF pad, the received RF signals (such as GNSS signals) propagate from the interposer PCB towards the electronic components of the main PCB.
[0033] In an alternative development, the multi-band patch antenna further includes a second pin. The second antenna includes a third via feed portion, and the antenna PCB includes a second antenna feed point. The first pin passes through the first via feed portion of the first antenna, the second via feed portion of the second antenna and is soldered to the first antenna feed point of the antenna PCB. The first pin is electrically and mechanically connected to the first via feed portion. The second pin passes through the third via feed portion of the second antenna and is soldered to the second antenna feed point of the antenna PCB. The second pin is electrically and mechanically connected to the third via feed portion.
[0034] This embodiment of the multi-band patch antenna relies on two pins, namely, a first pin and a second pin. Signals received by the first antenna and / or the second antenna are provided to the antenna PCB via the first antenna feed point and the second antenna feed point, respectively. This two-pin solution can further improve mechanical stability while achieving the same small footprint.
[0035] According to one development, the antenna PCB includes a first antenna RF pad and a second antenna RF pad. The first antenna RF pad extends to the edge of the antenna PCB and is electrically connected to the first antenna feed point. The second antenna RF pad extends to the edge of the antenna PCB and is electrically connected to the second antenna feed point. The first antenna RF pad and the second antenna RF pad are arranged on the surface of the antenna PCB facing the main PCB.
[0036] Signals received by the first antenna are propagated to the first antenna RF pad via the first antenna feed point. Signals received by the second antenna are transmitted to the second antenna RF pad via the second antenna feed point. Both the first antenna RF pad and the second antenna RF pad are located on the edge of the antenna PCB, for example, on different edges or the same edge of the antenna PCB.
[0037] In one development, the interposer PCB includes a first interposer RF pad and a second interposer RF pad each located on one of the edges of the interposer PCB. The position of the first interposer RF pad corresponds to the position of the first antenna RF pad of the antenna PCB. The position of the second interposer RF pad corresponds to the position of the second antenna RF pad of the antenna PCB. Each of the first interposer RF pad and the second interposer RF pad includes a via extending from a first surface of the interposer PCB facing the antenna PCB to a second surface of the interposer PCB facing the main PCB. The main PCB includes a first main RF pad and a second main RF pad each located on one of the edges of the main PCB. The position of the first main RF pad corresponds to the position of the first interposer RF pad of the interposer PCB, and the position of the second main RF pad corresponds to the position of the second interposer RF pad of the interposer PCB.
[0038] The signal received by the first antenna is transmitted via the first antenna RF pad and the first interposer RF pad to the first main RF pad and the electronic components of the main PCB. The signal received by the second antenna is transmitted via the second antenna RF pad and the second interposer RF pad to the second main RF pad and finally to the electronic components of the main PCB for further processing. The electrical connection between the different RF pads of the three PCBs, namely the main PCB, the interposer PCB, and the antenna PCB, is achieved, for example, by direct mechanical contact of the relevant RF pads or by soldering the corresponding RF pads.
[0039] In one development, the interposer PCB includes a plurality of vias placed along its edge. The plurality of vias forms part of a Faraday cage.
[0040] Each of these vias has the same potential, for example, ground potential. The surface of the antenna PCB facing the main PCB also has ground potential. Similarly, the surface of the main PCB facing the interposer PCB also has ground potential. Thus, the plurality of vias along the edge of the interposer PCB, the surface of the main PCB, and the surface of the antenna PCB form a Faraday cage. Thereby, the electromagnetic fields originating from radio waves or static charges appearing around the multi-band patch antenna are blocked from the electronic components of the main PCB. The plurality of vias are combined with the bottom surface of the antenna PCB to form a conductive shell around these electronic components, and the influence of the external field is canceled inside the cage. Unnecessary electromagnetic interference is prohibited.
[0041] In one embodiment, a method of manufacturing a multi-band patch antenna includes the following steps:
[0042] Receive an antenna assembly having an antenna PCB, a second antenna, and a first antenna, with the antenna PCB, the second antenna, and the first antenna arranged in a stacked configuration with one mounted on top of the other.
[0043] Provide an interposer PCB.
[0044] Provide a main PCB.
[0045] Fill the main PCB and apply solder paste to the main PCB.
[0046] Apply at least two glue dots to the surface of the interposer PCB.
[0047] Provide a base assembly by soldering and gluing the interposer PCB to the top of the main PCB.
[0048] Apply solder paste to the interposer PCB of the base assembly.
[0049] Apply at least two glue dots to the antenna assembly.
[0050] Provide the multi-band patch antenna by soldering and gluing the base assembly to the antenna assembly.
[0051] The multi-band patch antenna manufactured by the proposed method has a small form factor, is capable of receiving and processing signals in at least two different frequency ranges or bands, and has good mechanical stability.
[0052] Within the antenna assembly, one or two pins can be used for electrical and / or mechanical connection between the first antenna and the second antenna and the antenna PCB.
[0053] The step of filling the main PCB includes mounting electronic components onto the main PCB.
[0054] The way of manufacturing the multi-band patch antenna is a low-cost process and provides an inexpensive multi-band patch antenna. In the antenna assembly, the first antenna and the second antenna are soldered onto the antenna PCB. The interposer PCB can be provided in a tape form for efficient and precise mounting. To speed up the process, some steps can be processed simultaneously, such as applying solder paste to the main PCB and applying glue dots to the interposer PCB, or applying solder paste to the interposer PCB and applying glue dots to the antenna assembly. The glued connection as defined above is achieved by applying glue dots and then gluing the two components together (e.g., by heating).
[0055] Although the above method has been found to be the most efficient way to manufacture a multi-band patch antenna, some steps can be implemented in an alternative manner. For example, instead of or in addition to applying glue dots to the antenna assembly, glue dots can be applied to both surfaces of the interposer PCB. Description of the Drawings
[0056] The proposed solution will be explained in detail below with reference to the accompanying drawings using exemplary embodiments. Components and elements with the same function or the same effect have the same reference numerals. As long as the functions of the parts or components correspond to each other, their descriptions will not be repeated in the following figures. Among them,
[0057] Figures 1A to 1E Exemplary embodiments of the proposed multi-band patch antenna or parts thereof are shown respectively.
[0058] Figure 2A and Figure 2B Exemplary embodiments of the antenna assembly for the proposed multi-band patch antenna are shown respectively.
[0059] Figure 3A and Figure 3B Exemplary embodiments of the proposed antenna PCB are shown respectively,
[0060] Figure 4A and Figure 4B , Figure 5A and Figure 5B as well as Figure 6 Exemplary embodiments of the proposed interposer PCB are shown respectively, and
[0061] Figure 7 An exemplary flowchart of the proposed method is shown.
[0062] List of Reference Numerals
[0063] PCB1, PCB2, PCB3 Antenna, Interposer, Main PCB
[0064] AFP1, APF2 Antenna Feed Points
[0065] F1, F2, F3 Via Feed Parts
[0066] P1, P2 Pins
[0067] RF11, RF12, RF21, RF22 RF Pads
[0068] A1, A2 Antennas
[0069] D11, D12, D13, D14 Adhesive Points
[0070] D21, D22, D23, D24 Adhesive Points
[0071] C1, C2, C3 Electronic Components
[0072] V1, V2, V3, V4 Vias
[0073] Steps S1, S2, …, S9 Detailed implementation
[0074] Figures 1A to 1D Each shows an exemplary implementation of the proposed multi - band patch antenna or a part thereof from a different perspective.
[0075] Figure 1A and Figure 1C Each shows an exemplary implementation of the proposed multi - band patch antenna in an equally - spaced exploded view. In each case, the multi - band patch antenna is depicted in a separated form so that all components can be discerned. Figure 1A Shows an isometric view seen from above. The multi - band patch antenna includes a first pin P1, a first antenna A1 having a first via - feed portion F1, a second antenna A2 having a second via - feed portion F2, an antenna PCB PCB1, an interposer PCB PCB2, and a main PCB PCB3.
[0076] Both the first antenna A1 and the second antenna A2 are implemented as circularly - polarized patch antennas, which have a rectangular shape in this example. The antennas A1 and A2 can also be of other shapes. The antennas are configured to operate in different RF bands. For example, the first antenna A1 is configured for the GNSS band L1, while the second antenna A2 is configured for the GNSS band L5. The first via - feed portion F1 and the second via - feed portion F2 are arranged at or near the center of the corresponding first antenna A1 or second antenna A2. When the multi - band patch antenna is installed, the first pin passes through the first via - feed portion F1, the second via - feed portion F2 until the first antenna feed point AFP1 of the antenna PCB PCB1, and forms a kind of intermediate pin. The first pin P1 is soldered to the first antenna feed point AFP1 on the surface of the antenna PCB PCB1 facing the main PCB PCB3. The potential at the upper surface of each PCB is the ground potential.
[0077] As Figure 1A shown, the first antenna A1 and the second antenna A2 can have different sizes. For reasons of mechanical strength, the smaller - sized first antenna A1 is mounted on top of the second antenna A2. In this single - pin implementation of the multi - band patch antenna with only one pin (i.e., the first pin P1), the pin mechanically and electrically connects the first antenna A1 and the second antenna A2 to the antenna PCB PCB1. The height of the interposer PCB is configured to be higher than the tallest electronic component placed on the main PCB PCB3. The interposer PCB PCB2 has a central groove, resulting in the PCB being in a frame - like shape, which encloses the electronic components when mounted on top of the main PCB PCB3.
[0078] Figure 1B Shows in more detail Figure 1AThe three PCBs in []. In this figure, the first antenna feed point AFP1 can be identified on the antenna PCB PCB1. In addition, the first interposer RF pad RF21 on the interposer PCB PCB2 is shown. The pad RF21 is located on the front edge of the interposer PCB PCB2 in this example. It includes a via that extends from the upper surface to the lower surface of the interposer PCB PCB2, thus electrically connecting the two surfaces of the pad RF21. Electronic components C1, C2, and C3, as well as the first main RF pad RF31, are shown on the main PCB PCB3. The position of the first main RF pad RF31 corresponds to the position of the first interposer RF pad RF21, such that when the three PCBs (PCB1, PCB2, and PCB3) are mounted and fixed to each other, electrical connection between these pads is achieved.
[0079] Figure 1C is shown Figure 1A exploded isometric view of a multi-band patch antenna as seen from below. The antenna is rotated 90° to the left with respect to Figure 1A In this view, the first antenna RF pad RF11 can be seen, which is electrically connected to the first antenna feed point AFP1 on the antenna PCB PCB1 and extends towards the left front edge of the antenna PCB PCB1. In addition, four glue dots D11, D12, D13, and D14 are also shown, which are arranged near the corners of the antenna PCB PCB1 and are located on the lower surface of the PCB facing the interposer PCB PCB2.
[0080] Four glue dots D21, D22, D23, D24 are provided on the interposer PCB PCB2 and are arranged on the lower surface of the interposer PCB PCB2 facing the main PCB PCB3. The position of each of D21 to D24 on the interposer PCB PCB2 is roughly aligned with the position of the glue dots D11 to D14 on the antenna PCB PCB1 to achieve optimal mechanical strength.
[0081] This exemplary embodiment uses four glue dots on the lower surface of the antenna PCB PCB1 and four glue dots on the lower surface of the interposer PCB PCB2. However, two glue dots are also sufficient to achieve a stable multi-band patch antenna that will not fall off during drop and / or structural integrity tests. Positioning the glue dots in the corners of the relevant PCBs can provide the best results in terms of stability.
[0082] Figure 1D is shown in more detail Figure 1C the three PCBs in []. It can be seen that the position of the first interposer RF pad RF21 is aligned with the position of the first antenna RF pad RF11.
[0083] Figure 1EAn exemplary embodiment of the proposed multi - band patch antenna is shown in an assembled form. The first antenna A1 is mounted on top of the second antenna A2, and the two are fixed together by the first pin P1, which is soldered to the antenna PCB PCB1. This provides the antenna assembly. The antenna PCB PCB1, the interposer PCB PCB2, and the main PCB PCB3 are arranged in a stacked manner, fixed to each other by suitable gluing connections, and electrically connected by suitable soldering connections or close contacts. It can be seen that the resulting assembled multi - band patch antenna has a small form factor and high mechanical reliability.
[0084] Figure 2A An exemplary embodiment of the antenna assembly for the proposed multi - band patch antenna is shown in a cross - sectional view. The first pin P1 passes through the via - feed portion F1 of the first antenna A1, the via - feed portion F2 of the second antenna A2, and reaches the first antenna feed point AFP1 on the antenna PCB PCB1. The first pin P1 realizes the electrical and mechanical connections between the first antenna A1 and the second antenna A2 and the antenna PCB PCB1.
[0085] Figure 2B Another exemplary embodiment of the antenna assembly for the proposed multi - band patch antenna is shown in a cross - sectional view. This embodiment employs two pins, namely, the first pin P1 and the second pin P2. Figure 2A As before, the first pin P1 passes through the via - feed portions F1 and F2 of the first antenna A1 and the second antenna A2 and is soldered to the first antenna feed point AFP1 on the bottom layer of the antenna PCB PCB1. Figure 2A Differently, the first pin is only mechanically connected to the second antenna A2, not electrically. The electrical connection between the second antenna A2 and the antenna PCB PCB1 is realized by the second pin P2, which passes through the third via - feed portion F3 on the second antenna A2 and reaches the second antenna feed point AFP2 on the antenna PCB PCB1.
[0086] Figure 3A An exemplary embodiment of the antenna PCB for the Figure 2B dual - pin solution is shown. The upper surface of the PCB is shown, which faces the second antenna. The first antenna feed point AFP1 is arranged at or near the middle of the antenna PCB PCB1, while the second antenna feed point AFP2 is located at a position separated from the first antenna feed point AFP1 but still close to the center. Except for the two feed points AFP1 and AFP2, the rest of the upper surface has no conductive layer or connection.
[0087] Figure 3B Shown is Figure 3AOn the lower or bottom side of the antenna PCB, this surface faces the interposer and the main PCB. The lower surface has a first antenna RF pad RF11 and a second antenna RF pad RF12, which are implemented in a similar manner to RF11. Each of the RF pads RF11, RF12 is connected to an antenna feed point AFP1, AFP2 respectively. In this example, the RF pads RF11 and RF12 are arranged on different edges of the antenna PCB PCB1. The RF pads RF11, RF12 and the antenna feed points AFP1, AFP2 are all isolated from and surrounded by a conductive layer having a different potential (e.g., ground). When in contact with the corresponding vias of the interposer PCB, this conductive layer will form part of a Faraday cage. In another exemplary embodiment not shown, the ground conductive layer can be arranged on the top side instead of the bottom side of the antenna PCB, electrically isolated from the antenna feed points AFP1, AFP2. In this case, the antenna PCB includes additional vias arranged in the same manner as the vias of the interposer PCB to provide multiple electrical contacts from the ground layer on the top side of the antenna PCB to the bottom side. Compared with the solution of the bottom-side conductive layer, due to the lack of RF pads RF11, RF12, the area of the top-side ground conductive layer will be larger.
[0088] Figure 4A shows Figure 2B the upper surface of the interposer PCB of the dual-pin solution. The interposer PCB will be used with Figure 3A and Figure 3B the antenna PCB. The upper surface facing the antenna PCB includes a first interposer RF pad RF21 and a second interposer RF pad RF22. Both pads RF21 and RF22 include vias from the upper surface to the lower surface of the interposer PCB2, as Figure 4B shown. The position of the first interposer RF pad RF21 is aligned with the position of the first antenna RF pad RF11, while the position of the second interposer RF pad RF22 is aligned with the position of the second antenna RF pad RF12.
[0089] Figure 5A shows an exemplary embodiment of the interposer PCB having multiple vias that form part of the proposed Faraday cage. For example, this interposer PCB PCB2 can be used in Figures 1A to 1E the single-pin solution. In addition to the first interposer RF pad RF21, the interposer PCB PCB2 also includes multiple vias V1, V2, V3 and V4. These vias are positioned along the edges of the interposer PCB PCB2, leaving the corners empty.
[0090] Figure 5B shows, for example, for Figure 2AAnother exemplary embodiment of an interposer PCB with the proposed vias for a dual-pin solution. A plurality of vias V1, V2, V3, and V4 are arranged along the four edges of the interposer PCB but not in its corners to increase structural stability.
[0091] In Figure 5A and Figure 5B each of the plurality of vias V1 to V4 is implemented as a via well-known to those skilled in the art.
[0092] Figure 6 Another embodiment of an interposer PCB with the proposed plurality of vias is shown in a three-dimensional view. The embodiment is applicable to a single-pin embodiment as shown in Figures 1A to 1E In this example, each of the vias of the plurality of vias V1 to V4 is implemented as a filled via having conductive pads on both surfaces of the interposer PCB PCB2.
[0093] As previously mentioned, the plurality of vias V1 to V4 together with the conductive surfaces of the antenna PCB PCB1 and the main PCB PCB3 form a Faraday cage that protects the electronic components mounted on the main PCB from electrostatic discharge or radio waves from the outside world.
[0094] Figure 7 An exemplary flowchart showing a method of manufacturing the proposed multi-band patch antenna is shown. The method of manufacturing the multi-band patch antenna includes the following steps:
[0095] S1: Receive an antenna assembly having an antenna PCB, a second antenna, and a first antenna, the antenna PCB, the second antenna, and the first antenna being arranged in a stacked arrangement with one mounted on top of the other,
[0096] S2: Provide an interposer PCB,
[0097] S3: Provide a main PCB,
[0098] S4: Fill the main PCB and apply solder paste to the main PCB,
[0099] S5: Apply at least two glue dots to the surface of the interposer PCB,
[0100] S6: Provide a base assembly by soldering and gluing the interposer PCB to the top of the main PCB,
[0101] S7: Apply solder paste to the interposer PCB of the base assembly,
[0102] S8: Apply at least two glue dots to the antenna assembly, and
[0103] S9: Provide a multi-band patch antenna by welding and gluing the base components to the antenna assembly.
[0104] This method can be used to manufacture the multi-band patch antenna as described herein and shown in the above figures.
[0105] It should be understood that the present invention is not limited to the disclosed embodiments and the content specifically shown and described above. On the contrary, the features described in the individual dependent claims or in the specification can be advantageously combined. The multi-band patch antenna can also be advantageously used in other systems besides satellite navigation systems and in other applications besides navigation systems. In addition, the scope of the present invention includes those variations and modifications that are obvious to a person skilled in the art and fall within the scope of the appended claims. The term "comprising" used in the claims does not exclude other elements or steps of the corresponding features or procedures. When the term "a" is used in combination with a feature, they do not exclude a plurality of such features. In addition, any reference signs in the claims should not be construed as limiting the scope.
Claims
1. A multi-band patch antenna, the multi-band patch antenna comprising a first antenna (A1), the first antenna comprising a first through-hole feed portion (F1), a second antenna (A2), the second antenna comprising a second through-hole feed portion (F2), The first pin (P1), an antenna printed circuit board PCB (PCB1), the antenna PCB comprising a first antenna feed point (AFP1), Interposer PCB (PCB2), and Main PCB (PCB3), in, The first antenna (A1) and the second antenna (A2) are mounted one on top of the other and on top of the antenna PCB (PCB1), each of the first antenna (A1) and the second antenna (A2) having an electrical connection with the antenna PCB (PCB1), wherein the first pin (P1) is mechanically and electrically connected to at least one of the first through hole feed (F1) and the second through hole feed (F2) and the first antenna feed point (AFP1) of the antenna PCB (PCB1), and The interposer PCB (PCB2) is installed between the antenna PCB (PCB1) and the main PCB (PCB3), and is mechanically and electrically connected to the antenna PCB (PCB1) and the main PCB (PCB3).
2. The multi-band patch antenna according to claim 1, in, The corresponding sizes of the antenna PCB (PCB1), the intermediate layer PCB (PCB2) and the main PCB (PCB3) match, and / or The main PCB (PCB3) includes various electronic components (C1, C2, C3, C4) for processing signals received via the first antenna (A1) and / or the second antenna (A2), and Wherein, the height of the intermediate layer PCB (PCB2) is higher than the height of the highest electronic component among the electronic components (C1, C2, C3, C4) of the main PCB (PCB3).
3. The multi-band patch antenna according to claim 1 or 2, The multi-band patch antenna further comprises a first glue connection between the antenna PCB (PCB1) and the interposer PCB (PCB2) and a second glue connection between the interposer PCB (PCB2) and the main PCB (PCB3).
4. The multi-band patch antenna according to claim 1 or 2, in, The first antenna (A1) and the second antenna (A2) are both implemented as circularly polarized patch antennas, The first antenna (A1) is configured to operate in a global navigation satellite system GNSS frequency band, wherein the one GNSS frequency band is specifically one of the L1, L2 or L5 frequency bands, and The second antenna (A2) is configured to operate in a GNSS frequency band different from that of the first antenna (A1), specifically, in a different frequency band among the L1, L2 or L5 frequency bands.
5. The multi-band patch antenna according to claim 1 or 2, in, The intermediary PCB (PCB2) has a groove, the center of which coincides with the center of the intermediary PCB (PCB2), and wherein the size of the groove is adapted to accommodate all electronic components (C1, C2, C3, C4) of the main PCB (PCB3).
6. The multi-band patch antenna according to claim 1 or 2, in, The first antenna feed point (AFP1) of the antenna PCB (PCB1) is located at or near the center of the antenna PCB (PCB1).
7. The multi-band patch antenna according to claim 1 or 2, in, The first pin (P1) passes through the first through-hole feed portion (F1) of the first antenna (A1) and the second through-hole feed portion (F2) of the second antenna (A2), so that the first antenna (A1) and the second antenna (A2) are mechanically and electrically connected to each other, wherein the first pin (P1) is soldered to the first antenna feed point (AFP1) of the antenna PCB (PCB1) on the surface of the antenna PCB (PCB1) facing the main PCB (PCB3), and The main PCB (PCB3) has an area without any electronic components, and the area is arranged corresponding to the first antenna feeding point (AFP1) of the antenna PCB (PCB1).
8. The multi-band patch antenna according to claim 1 or 2, in, The antenna PCB (PCB1) comprises a first antenna radio frequency RF pad (RF11) having an electrical connection to the first antenna feed point (AFP1), The first antenna RF pad (RF11) is arranged on a surface of the antenna PCB (PCB1) facing the main PCB (PCB3) and extends to an edge of the antenna PCB (PCB1).
9. The multi-band patch antenna according to claim 8, in, The intermediary PCB (PCB2) includes a first intermediary RF pad (RF21) located on one of the edges of the intermediary PCB, wherein the position of the first intermediary RF pad (RF21) corresponds to the position of the first antenna RF pad (RF11) of the antenna PCB (PCB1), and wherein the first intermediary RF pad (RF21) includes a via extending from a first surface of the intermediary PCB (PCB2) facing the antenna PCB (PCB1) to a second surface of the intermediary PCB (PCB2) facing the main PCB (PCB3).
10. The multi-band patch antenna according to claim 9, in, The main PCB (PCB3) includes a first main RF pad (RF31) located on one of the edges of the main PCB, wherein the position of the first main RF pad (RF31) corresponds to the position of the first interposer RF pad (RF21) of the interposer PCB (PCB2).
11. The multi-band patch antenna according to claim 1 or 2, The multi-band patch antenna further comprises a second pin (P2), in, The second antenna comprises a third through hole feed portion (F3), and the antenna PCB (PCB1) comprises a second antenna feed point (AFP2), wherein the first pin (P1) passes through the first through-hole feed portion (F1) of the first antenna (A1), the second through-hole feed portion (F2) of the second antenna (A2) and is soldered to the first antenna feed point (AFP1) of the antenna PCB (PCB1), wherein the first pin (P1) is electrically and mechanically connected to the first through-hole feed portion (F1), The second pin (P2) passes through the third through-hole feed portion (F3) of the second antenna (A2) and is soldered to the second antenna feed point (AFP2) of the antenna PCB (PCB1), wherein the second pin (P2) is electrically and mechanically connected to the third through-hole feed portion (F3).
12. The multi-band patch antenna according to claim 11, in, The antenna PCB (PCB1) comprises a first antenna RF pad (RF11) and a second antenna RF pad (RF12), wherein the first antenna RF pad (RF11) extends to the edge of the antenna PCB (PCB1) and is electrically connected to the first antenna feed point (AFP1), wherein the second antenna RF pad (RF12) extends to the edge of the antenna PCB (PCB1) and is electrically connected to the second antenna feed point (AFP2), and The first antenna RF pad (RF11) and the second antenna RF pad (RF12) are arranged on a surface of the antenna PCB (PCB1) facing the main PCB (PCB3).
13. The multi-band patch antenna according to claim 12, in, The interposer PCB (PCB2) comprises a first interposer RF pad (RF21) and a second interposer RF pad (RF22), each of which is located on one of the edges of the interposer PCB (PCB2), The position of the first intermediary layer RF pad (RF21) corresponds to the position of the first antenna RF pad (RF11) of the antenna PCB (PCB1), The position of the second intermediary layer RF pad (RF22) corresponds to the position of the second antenna RF pad (RF12) of the antenna PCB (PCB1), wherein each of the first interposer RF pad (RF21) and the second interposer RF pad (RF22) comprises a via extending from a first surface of the interposer PCB (PCB2) facing the antenna PCB (PCB1) to a second surface of the interposer PCB (PCB2) facing the main PCB (PCB3), And wherein, the main PCB (PCB3) includes a first main RF pad (RF31) and a second main RF pad (RF32), each located on one of the edges of the main PCB (PCB3), wherein the position of the first main RF pad (RF31) corresponds to the position of the first intermediary layer RF pad (RF21) of the intermediary layer PCB (PCB2), and the position of the second main RF pad (RF32) corresponds to the position of the second intermediary layer RF pad (RF22) of the intermediary layer PCB (PCB2).
14. The multi-band patch antenna according to claim 1 or 2, in, The interposer PCB (PCB2) includes a plurality of vias (V1, V2, V3, V4) placed along its edge, the plurality of vias forming a portion of a Faraday cage.
15. A method of manufacturing a multi-band patch antenna, the method comprising the steps of: receiving (S1) an antenna assembly having an antenna printed circuit board PCB (PCB1), a second antenna (A2) and a first antenna (A1), the antenna PCB, the second antenna and the first antenna being mounted one on top of the other in a stacked arrangement, Provide (S2) interposer PCB (PCB2), Provide (S3) main PCB (PCB3), filling (S4) the main PCB (PCB3) and applying solder paste to the main PCB (PCB3), applying (S5) at least two glue dots to the surface of the interposer PCB (PCB2), providing (S6) a basic assembly by soldering and gluing the interposer PCB (PCB2) onto the top of the main PCB (PCB3), applying (S7) solder paste to the interposer PCB (PCB2) of the base assembly, applying (S8) at least two glue dots to the antenna assembly, The multi-band patch antenna is provided (S9) by soldering and gluing the base component to the antenna component.