Power supply device and electronic apparatus

Abstract

The invention discloses a power supply device and electronic equipment, and belongs to the technical field of power electronics. The power supply device comprises a chip, a first circuit board and a power supply, a power supply pin of the chip is electrically connected with the power supply through a connecting part of the first circuit board, the thickness of the connecting part is smaller than that of a main body part of the first circuit board, and the power supply is used for supplying power to the power supply pin of the chip.

Description

Technical Field

[0001] This application relates to the field of power electronics technology, and particularly to a power supply device and an electronic device. Background Art

[0002] Currently, by setting an integrated circuit chip and its core current power supply on the same side of a system printed circuit board (PCB), power supply to the integrated circuit chip is achieved. Since the core current power supply supplies power to the integrated circuit chip through the system PCB board, the power supply path is relatively long. With the increasing demand for chip computing power and the improvement of chip process integration, the core current continues to increase. Due to the relatively long power supply path in the above-mentioned method, the losses brought about by powering the integrated circuit chip through the above-mentioned power supply method also increase significantly with the increase in current. Summary of the Invention

[0003] This application discloses a power supply device and an electronic device, which can reduce the losses caused by powering a chip.

[0004] In a first aspect, an embodiment of this application discloses a power supply device, including: a chip, a first circuit board, and a power supply. Among them: the power supply pin of the chip and the power supply are electrically connected through a connection part of the first circuit board, the thickness of the connection part is less than the thickness of the main body part of the first circuit board, and the power supply is used to supply power to the power supply pin of the chip.

[0005] In a second aspect, an embodiment of this application discloses an electronic device, including the power supply device described in the first aspect.

[0006] An embodiment of this application provides a power supply device. The power supply device includes a chip, a first circuit board, and a power supply. The power supply pin of the chip and the power supply are electrically connected through a connection part of the first circuit board. The thickness of the connection part of the first circuit board is less than the thickness of the main body part of the first circuit board. The power supply is used to supply power to the power supply pin of the chip, which can effectively shorten the power supply path, reduce the losses caused by powering the chip, and reduce the system heat dissipation. Description of the Drawings

[0007] Figure 1 It is a schematic structural diagram of the first power supply device disclosed in an embodiment of this application;

[0008] Figure 2 It is a schematic structural diagram of the second power supply device disclosed in an embodiment of this application;

[0009] Figure 3 It is a schematic structural diagram of the third power supply device disclosed in an embodiment of this application;

[0010] Figure 4Schematic diagram of the fourth power supply device disclosed in the embodiments of the present application;

[0011] Figure 5 Schematic diagram of the fifth power supply device disclosed in the embodiments of the present application;

[0012] Figure 6 Schematic diagram of a second circuit board disclosed in the embodiments of the present application;

[0013] Figure 7 Schematic diagram of the sixth power supply device disclosed in the embodiments of the present application. Detailed implementation manners

[0014] Next, the technical solutions in the embodiments of the present application will be clearly described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope protected by the present application.

[0015] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such terms can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally represents an "or" relationship between the associated objects before and after.

[0016] The present application discloses a power supply device and an electronic device, Figure 1 Schematic diagram of the first power supply device disclosed in the embodiments of the present application.

[0017] As Figure 1 shown, the power supply device disclosed in the embodiments of the present application includes: a chip 110, a first circuit board 120, and a power supply 130, where: the power supply pin of the chip 110 and the power supply 130 are electrically connected through a connection part of the first circuit board 120, the thickness of the connection part is less than the thickness of the main body part of the first circuit board 120, and the power supply 130 is used to supply power to the power supply pin of the chip 110.

[0018] In the present application, as Figure 1As shown, the first circuit board 120 is used to provide input power to the power supply 130. The power supply 130 is used to supply power to the power supply pins of the chip 110. The chip 110, the first circuit board 120, and the power supply 130 are arranged in sequence. The position of the connection part of the first circuit board 120 corresponds to the position of the power supply pins of the chip 110 and the position of the power supply 130.

[0019] Since the power supply pins of the chip 110 and the power supply 130 are electrically connected through the connection part of the first circuit board 120, and the thickness of the connection part of the first circuit board 120 is less than the thickness of the main body part of the first circuit board 120, therefore, the solution disclosed in the embodiments of the present application can effectively shorten the power supply path, reduce the loss caused by power supply to the chip, reduce the system heat consumption, reduce the line parasitic parameters, and improve the power supply performance.

[0020] It should be noted that the main body part of the first circuit board is the area on the first circuit board other than the connection part. The first circuit board can be a system PCB board.

[0021] The embodiments of the present application provide a power supply device, which includes a chip, a first circuit board, and a power supply. The power supply pins of the chip and the power supply are electrically connected through the connection part of the first circuit board. The thickness of the connection part of the first circuit board is less than the thickness of the main body part of the first circuit board. The power supply is used to supply power to the power supply pins of the chip, which can effectively shorten the power supply path, reduce the loss caused by power supply to the chip, and reduce the system heat consumption.

[0022] In one implementation, as Figure 1 shown, the connection part may include a groove 121, and at least part of the power supply 130 may be disposed in the groove 121.

[0023] In the embodiments of the present application, a groove 121 is opened on one side of the first circuit board 120. Solder pads are provided at the bottom of the groove 121 and at the position on the other side of the first circuit board 120 corresponding to the bottom of the groove 121. At least part of the power supply 130 extends into the notch of the groove 121 and is disposed in the groove 121. The power supply pins of the chip 110 and the power supply 130 are electrically connected through the bottom of the groove 121 opened on the first circuit board 120, that is, the power supply 130 supplies power to the power supply pins of the chip through the bottom of the groove 121, thereby shortening the power supply path, reducing the loss caused by power supply to the chip, and reducing the system heat consumption. In this embodiment, as Figure 1 shown, the input power can be provided to the power supply 130 through the bottom of the groove 121 opened on the first circuit board 120.

[0024] By adopting the solution disclosed in the embodiment of the present application, since at least part of the power supply 130 is disposed in the groove 121, the available height of the power supply 130 is increased. The overall conversion efficiency of the power supply can be improved, the heat dissipation can be reduced, and the difficulty of system heat dissipation can be reduced by adopting a larger-sized power supply, reducing the switching frequency, etc. In addition, the height tolerance requirement of the power supply 130 can be reduced by controlling the thickness tolerance of the position where the first circuit board 120 is provided with the groove, thereby reducing the design and processing difficulty of the power supply 130.

[0025] The production process of the above power supply device is simple, and the maintainability of the power supply 130 in the later stage is good.

[0026] In another implementation, as Figure 2 shown, the connecting portion may include a through hole 122, and at least part of the power supply 130 may be disposed in the through hole 122.

[0027] In this case, as Figure 2 shown, some pins of the chip 110 are electrically connected to the first circuit board, and the power supply pin of the chip is directly electrically connected to the power supply 130, shortening the power supply path, reducing the loss caused by power supply to the chip, and reducing the system heat dissipation.

[0028] Moreover, by adopting the solution disclosed in the embodiment of the present application, since at least part of the power supply 130 is disposed in the through hole 122, the available height of the power supply 130 is increased. The overall efficiency of the power supply can be improved by adopting a larger-sized power supply, and the design difficulty of the power supply can be reduced. In addition, the height of the power supply 130 of the power supply device provided in this embodiment is not affected by the thickness tolerance of the first circuit board 120, which can further reduce the design and processing difficulty of the power supply 130.

[0029] In addition, the side wall of the through hole 122 opened in the first circuit board 120 can be metallized. Exemplarily, the side wall of the through hole 122 opened in the first circuit board 120 can be copper-plated, and then the power supply 130 is electrically connected to the side wall of the through hole 122, and the first circuit board 120 provides input power to the power supply 130 through the side wall of the through hole 122.

[0030] In the above embodiment, the force directions of the electrical connection points between the chip 110 and the power supply 130, the electrical connection points between the chip 110 and the first circuit board 120, and the electrical connection points between the power supply 130 and the first circuit board 120 are all downward, and the reliability of the electrical connection points can be improved structurally.

[0031] In one implementation, as Figure 3As shown, the through hole 122 may include a first limiting portion, and the power supply 130 may include a second limiting portion. The first limiting portion and the second limiting portion are in limiting cooperation.

[0032] Exemplarily, a part of the side wall of the through hole 122 may be stepped as the first limiting portion, or the entire side wall of the through hole 122 may be stepped as the first limiting portion. As Figure 3 shown, a second limiting portion corresponding to the first limiting portion of the through hole 122 is provided on the side wall of the power supply 130. The first limiting portion and the second limiting portion are in limiting cooperation, which can position the power supply 130, facilitate soldering, reduce the number of reflow soldering, reduce constraints such as device selection and process, and indirectly improve the reliability of the single board. It should be noted that pads and solder balls for connecting with the second limiting portion may be provided on the first limiting portion.

[0033] In addition, the first circuit board 120 provides an input power supply to the power supply 130 through the first limiting portion. This way of providing an input power supply to the power supply 130 can reduce the resource occupation of the first circuit board 120 and reduce the interference to the high-speed lines of the chip.

[0034] In the embodiment of the present application, as Figure 2 and Figure 4 shown, the power supply 130 and the side wall of the through hole 122 may be electrically connected through a conductive member 140. The first circuit board 120 provides an input power supply to the power supply 130 through the side wall of the through hole 122. Exemplarily, the conductive member 140 may include an elastic member or a plug-in member to improve the stability and reliability of the connection between the power supply 130 and the side wall of the through hole 122. Moreover, the stability and reliability of the connection between the power supply 130 and the side wall of the through hole 122 can be further improved by adding welding materials such as solder at the connection position between the side wall of the through hole 122 and the power supply 130.

[0035] In a possible implementation scheme, the above power supply device may further include a filter capacitor 150, and the filter capacitor 150 may be disposed at a position close to the power supply pin of the chip 110 within the power supply 130. By disposing the filter capacitor 150 at a position close to the power supply pin of the chip 110 within the power supply 130, the filtering performance can be improved, and thus the power supply quality can be improved.

[0036] It should be noted that the positive electrode of the power supply 130 and the positive electrode of the power supply pin of the chip 110 are electrically connected to a first connection point, the negative electrode of the power supply 130 and the negative electrode of the power supply pin of the chip 110 are electrically connected to a second connection point, the positive electrode of the filter capacitor 150 is electrically connected to the first connection point, and the negative electrode of the filter capacitor 150 is electrically connected to the second connection point.

[0037] In another possible implementation, the above power supply device may further include a filter capacitor 150, and the filter capacitor 150 may be disposed between the power supply 130 and the power supply pin of the chip 110. By disposing the filter capacitor 150 between the power supply 130 and the power supply pin of the chip 110, the filtering performance can be improved, and thus the power supply quality can be improved.

[0038] It should be noted that the connection manner of the filter capacitor 150 with the power supply 130 and the chip 110 here is the same as that above, and details are not described herein again in this application.

[0039] In one implementation, when the connecting portion includes a through hole 122 and at least part of the power supply is disposed in the through hole 122, as Figure 5 shown, the above power supply device may further include a second circuit board 160, the second circuit board 160 is disposed between the chip 110 and the first circuit board 120, and the second circuit board 160 is electrically connected to the power supply pin of the chip 110, the first circuit board 120, and the power supply 130 respectively.

[0040] In this case, as Figure 5 shown, the power supply 130 supplies power to the power supply pin of the chip 110 through the second circuit board 160, and the first circuit board 120 provides input power to the power supply 130 through the second circuit board 160. By adopting the solution disclosed in this embodiment, since the power supply 130 supplies power to the power supply pin of the chip 110 through the second circuit board 160, therefore, the pins of the power supply 130 and the pins of the chip do not need to correspond one by one, and one power supply can supply power to different chips. When supplying power to different chips through one power supply, only the second circuit board 160 needs to be correspondingly adjusted. By adopting the power supply device disclosed in this embodiment, the power supply has good reusability and can reduce costs.

[0041] In addition, the current path from the power supply 130 to the chip 110 on the second circuit board 160 can be designed in the form of dense holes to reduce the power supply path and parasitic parameters.

[0042] It should be noted that in practical applications, the material of the second circuit board can be selected according to requirements. While ensuring rigidity, the thickness of the second circuit board can be thinned to shorten the power supply path and reduce the loss and parasitic parameters caused by supplying power to the chip.

[0043] In one implementation, as Figure 6As shown, the above power supply device may further include a filter capacitor 150, and the filter capacitor 150 may be disposed inside the second circuit board 160. Exemplarily, through processes such as embedding, surface mounting, and then encapsulation, the filter capacitor at the output end of the power supply 130 can be disposed inside the second circuit board 160, which can reduce the distance between the filter capacitor 150 and the chip 110, improve the filtering performance, and thus improve the power supply quality while saving space occupancy. In addition, the filter capacitor in this application may be a ceramic filter capacitor.

[0044] It should be noted that the connection manner of the filter capacitor 150 with the power supply 130 and the chip 110 here is the same as above, and this application will not elaborate herein.

[0045] In addition, this application does not limit the number of layers of the second circuit board 160 and the number of layers of the devices embedded in the second circuit board 160. Specifically, the circuit layout can be performed according to actual needs to achieve the connection between layers.

[0046] In another implementation, as Figure 7 shown, the power supply 130 is electrically connected to the second circuit board 160 through a connector 190, and the filter capacitor 150 is disposed between the power supply 130 and the second circuit board 160 to improve the filtering performance and thus improve the power supply quality. Exemplarily, the connector 190 may include, but is not limited to, a copper block or a pin header, and the filter capacitor 150 may be disposed at the power supply end or the second circuit board end.

[0047] It should be noted that the connection manner of the filter capacitor 150 with the power supply 130 and the chip 110 here is the same as above, and this application will not elaborate herein.

[0048] In addition, in addition to the filter capacitor 150, other devices may also be soldered at the position on the second circuit board 160 corresponding to the through hole 122 opened on the first circuit board 120 according to actual needs.

[0049] In the embodiment of this application, as Figure 1 shown, the above power supply device may further include a heat conducting medium 170 and a backing plate 180, and the power supply 130 and the backing plate 180 are connected through the heat conducting medium 170. That is to say, the heat of the power supply 130 can be conducted to the backing plate 180 through the heat conducting medium 170 and dissipated. When adopting this heat dissipation method, the power supply 130 can be correspondingly designed for bottom heat dissipation. Exemplarily, the backing plate 180 may be a metal structure. It should be noted that the surface of the power supply 130 in contact with the heat conducting medium 170 is the bottom of the power supply 130.

[0050] In this case, the height of the power supply 130 can be determined based on the connection part of the first circuit board 120 and the lining board 180, and the heat-conducting medium 170 can also absorb a part of the assembly tolerance to reduce the tolerance requirements for the power supply 130.

[0051] In addition, the above power supply device may further include a heat dissipation device for the chip 110, and the heat dissipation device for the chip 110 may be disposed on the first circuit board 120 or the lining board 180.

[0052] It should be noted that the above power supply device can be applied to the power supply of integrated circuit chips, especially in the power supply of low-voltage and high-current integrated circuit chips.

[0053] This application also discloses an electronic device, including the power supply device described above.

[0054] Exemplarily, the electronic device may include, but is not limited to, a wireless server, a wired router, a switch, etc.

[0055] In the above embodiments of this application, the differences between the various embodiments are mainly described. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a more optimal embodiment. For the sake of brevity of the description, it will not be elaborated herein.

[0056] The above are only the embodiments of this application and are not used to limit this application. For those skilled in the art, various changes and modifications can be made to this application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this application shall be included within the scope of the claims of this application.

Claims

1. A power supply device, characterized in that, it includes: a chip (110), a first circuit board (120), and a power supply (130), wherein: a power supply pin of the chip (110) and the power supply (130) are electrically connected through a connection part of the first circuit board (120), the thickness of the connection part is less than the thickness of the main body part of the first circuit board (120), and the power supply (130) is used to supply power to the power supply pin of the chip (110).

2. The power supply device according to claim 1, characterized in that, the connection part includes a groove (121), and at least part of the power supply (130) is arranged in the groove (121).

3. The power supply device according to claim 1, characterized in that, the connection part includes a through hole (122), and at least part of the power supply (130) is arranged in the through hole (122).

4. The power supply device according to claim 3, characterized in that, the through hole (122) includes a first limiting part, the power supply (130) includes a second limiting part, and the first limiting part and the second limiting part are in limiting cooperation.

5. The power supply device according to claim 3, characterized in that, the power supply (130) is electrically connected to the side wall of the through hole (122) through a conductive part (140).

6. The power supply device according to claim 5, characterized in that, the conductive part (140) includes an elastic part or a plug-in part.

7. The power supply device according to any one of claims 1 to 6, characterized in that, it further includes a filter capacitor (150), and the filter capacitor (150) is arranged at a position in the power supply (130) close to the power supply pin of the chip (110).

8. The power supply device according to any one of claims 1 to 6, characterized in that, it further includes a filter capacitor (150), and the filter capacitor (150) is arranged between the power supply (130) and the power supply pin of the chip (110).

9. The power supply device according to claim 3, characterized in that, it further includes a second circuit board (160), the second circuit board (160) is arranged between the chip (110) and the first circuit board (120), and the second circuit board (160) is electrically connected to the power supply pin of the chip (110), the first circuit board (120), and the power supply (130) respectively.

10. The power supply device according to claim 9, characterized in that, it further includes a filter capacitor (150), and the filter capacitor (150) is arranged inside the second circuit board (160).

11. The power supply device according to claim 1, characterized in that, it further includes a heat-conducting medium (170) and a lining plate (180), and the power supply (130) and the lining plate (180) are connected through the heat-conducting medium (170).

12. An electronic device, characterized in that, it includes the power supply device according to any one of claims 1 to 11.

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