Display device and thermosetting conductive film

Abstract

The invention relates to a display device and a thermosetting conductive film. The display device comprises a display panel, the display panel includes a base layer, a driving element layer disposed on the base layer and including circuitry, a light emitting element layer disposed on the driving element layer and including a plurality of light emitting elements electrically connected to the circuitry of the driving element layer, respectively, a plurality of pads disposed on the base layer, and a plurality of openings passing through the base layer, the driving element layer, and the plurality of pads; a circuit board disposed below the display panel; a plurality of conductive members disposed on the base layer and overlapping the plurality of pads; and a thermosetting member covering the plurality of conductive members, in which the plurality of conductive members are disposed in the plurality of openings, respectively, and electrically connect the driving element layer and the circuit board.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority and the benefit of Korean Patent Application No. 10 - 2023 - 0169890, filed with the Korean Intellectual Property Office on November 29, 2023, the entire contents of which are incorporated herein by reference. Technical Field

[0003] Embodiments relate to a display device and a thermosetting conductive film, and more particularly, to a display device having a reduced area of a non - display region and capable of ensuring the reliability of electrical connection, and to a thermosetting conductive film including aligned conductive members. Background Art

[0004] Display devices that provide images to users, such as televisions, monitors, smartphones, and tablet PCs, include a display panel for displaying an image. Various display panels, such as liquid crystal display panels, organic light - emitting display panels, electro - wetting display panels, and electrophoretic display panels, have been developed.

[0005] Recently, in response to market demands, research has been conducted on reducing the area of a region in the display panel that does not display an image. Research has been conducted on expanding the display region in the display panel that displays an image to users. Summary of the Invention

[0006] Embodiments provide a display device including a display panel having a reduced area of a non - display region.

[0007] Embodiments also provide a display device capable of improving the reliability of electrical connection.

[0008] However, the embodiments are not limited to the embodiments set forth herein. The above - mentioned and other embodiments will become more apparent to those of ordinary skill in the art to which the present disclosure pertains by referring to the following detailed description of the present disclosure.

[0009] Embodiments provide a display device including: a display panel including a base layer, a driving element layer provided on the base layer and including a circuit, a light - emitting element layer provided on the driving element layer and including a plurality of light - emitting elements respectively electrically connected to the circuit of the driving element layer, a plurality of pads provided on the base layer, and a plurality of openings passing through the base layer, the driving element layer, and the plurality of pads; a circuit board provided under the display panel; a plurality of conductive members provided on the base layer and overlapping the plurality of pads; and a thermosetting member covering the plurality of conductive members, wherein the plurality of conductive members may be respectively provided in the openings and electrically connect the driving element layer and the circuit board.

[0010] In an embodiment, the plurality of conductive members may include: a plurality of first row conductive members arranged in a first direction; and a plurality of second row conductive members spaced apart from the first row conductive members in a second direction intersecting the first direction and arranged in the first direction.

[0011] In an embodiment, when viewed in the second direction, the plurality of second row conductive members may not overlap with the plurality of first row conductive members.

[0012] In an embodiment, in a plan view, the sizes of the first row conductive members and the second row conductive members may be different from each other.

[0013] In an embodiment, the plurality of second row conductive members may include a plurality of first conductive members and a plurality of second conductive members aligned along the first direction, and the plurality of second conductive members may be arranged to be offset from the first conductive members by a selected distance in the second direction.

[0014] In an embodiment, the cross-sectional area of each of the plurality of openings may decrease as it is farther from the upper surface of the base layer.

[0015] In an embodiment, in a plan view, the width of each of the plurality of openings may be in the range of about 20 μm to about 40 μm.

[0016] In an embodiment, the maximum width of the plurality of conductive members may be substantially equal to or greater than the maximum width of the plurality of openings.

[0017] In an embodiment, the size of the upper surface of the plurality of conductive members may be substantially equal to or smaller than the size of the plurality of pads.

[0018] In an embodiment, when viewed from above the base layer, the plurality of conductive members may be completely covered by a thermosetting member.

[0019] In an embodiment, the display panel may further include auxiliary pads provided on the inner surface of at least one of the plurality of openings.

[0020] In an embodiment, when viewed from below the base layer, the plurality of conductive members may be completely covered by the auxiliary pads.

[0021] In an embodiment, the plurality of conductive members may include tin (Sn), silver (Ag), or copper (Cu).

[0022] In an embodiment, the thermosetting conductive film may include: a base film including a lower surface defined by a first direction and a second direction intersecting each other and an upper surface opposite to the lower surface; a thermosetting film provided on the lower surface of the base film; and a plurality of conductive members dispersed in the thermosetting film, passing through the thermosetting film in a cross-sectional view, and including tin (Sn).

[0023] In an embodiment, a plurality of conductive members may be arranged in a first direction, and a spacing between the plurality of conductive members adjacent to each other may be substantially equal to or greater than a width of each of the plurality of conductive members in the first direction.

[0024] In an embodiment, the base film may include silicon (Si).

[0025] In an embodiment, the thermosetting conductive film may further include a protective film disposed under the thermosetting film and covering the conductive members and an adhesive film disposed between the thermosetting film and the protective film.

[0026] In an embodiment, a diameter of the plurality of conductive members may be in a range of about 30 μm to about 130 μm.

[0027] In an embodiment, the plurality of conductive members may have an initial form of spheres.

[0028] In an embodiment, a width of the plurality of conductive members in the first direction or the second direction may decrease as it is farther from the thermosetting film. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The accompanying drawings are included to provide a further understanding of the present invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments and, together with the description, serve to explain the principles of the present invention. In the drawings:

[0030] Figure 1 is a schematic perspective view of an electronic device according to an embodiment;

[0031] Figure 2 is an exploded schematic perspective view of an electronic device according to an embodiment;

[0032] Figure 3 is a schematic plan view of a display panel according to an embodiment;

[0033] Figure 4 is a schematic cross-sectional view of a display module according to an embodiment;

[0034] Figure 5A and Figure 5B is a schematic cross-sectional view of a display device according to an embodiment;

[0035] Figure 6A is an enlarged schematic view of a part of a display module according to an embodiment;

[0036] Figure 6B is a schematic plan view of a display module according to an embodiment;

[0037] Figure 6C is an enlarged schematic view of a part of a display module according to an embodiment;

[0038] Figure 7 is a schematic cross-sectional view of a thermosetting conductive film according to an embodiment;

[0039] Figures 8A to 8C is a schematic plan view of a thermosetting conductive film according to an embodiment;

[0040] Figures 9A to 9C is a schematic cross-sectional view of a thermosetting conductive film according to an embodiment; and

[0041] Figures 10A to 10D is a schematic cross-sectional view showing some of the operations of connecting a thermosetting conductive film to a display panel. Detailed Description

[0042] In the following description, for purposes of illustration, numerous specific details are set forth in order to provide a thorough understanding of the various embodiments or implementations of the present invention. As used herein, "embodiment" and "implementation" are interchangeable words, which are non-limiting examples of the devices or methods disclosed herein. However, it will be apparent that the various embodiments may be practiced without these specific details or with one or more equivalent arrangements. Here, the various embodiments need not be exclusive and do not limit the disclosure. For example, the specific shapes, configurations, and characteristics of an embodiment may be used or implemented in another embodiment.

[0043] Unless otherwise specified, the embodiments shown are to be understood as providing features of the present invention. Thus, unless otherwise specified, without departing from the scope of the present invention, the features, components, modules, layers, films, panels, regions, and / or aspects, etc. (hereinafter, individually or collectively referred to as "elements") of the various embodiments may be otherwise combined, separated, interchanged, and / or rearranged.

[0044] The use of cross-hatching and / or shading in the drawings is generally provided to clarify the boundaries between adjacent elements. Thus, unless specified, the presence or absence of cross-hatching or shading does not convey or indicate any preference or requirement for a particular material, material property, dimension, ratio, commonality between the elements shown, and / or any other characteristic, attribute, property, etc. of the elements. In addition, in the drawings, for clarity and / or description purposes, the dimensions and relative dimensions of the elements may be exaggerated. When an embodiment can be implemented differently, a particular process sequence may be performed differently from the described sequence. For example, two consecutively described processes may be performed substantially simultaneously or in a sequence opposite to the described sequence. Also, the same reference numerals denote the same elements.

[0045] When an element or layer is referred to as being “on,” “connected to,” or “coupled to” another element or layer, it can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being “directly on,” “directly connected to,” or “directly coupled to” another element or layer, no intervening elements or layers are present. For this reason, the term “connected” can refer to physical, electrical, and / or fluid connections with or without intervening elements. Additionally, the axes of the first direction DR1, the second direction DR2, and the third direction DR3 are not limited to the three axes such as the X-axis, Y-axis, and Z-axis of a rectangular coordinate system and can be interpreted in a broader sense. For example, the axes of the first direction DR1, the second direction DR2, and the third direction DR3 can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, “at least one of A and B” can be understood to mean only A, only B, or any combination of A and B. Additionally, “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted to mean only X, only Y, only Z, or any combination of two or more of X, Y, and Z. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0046] Although the terms “first,” “second,” etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, a first element discussed below could be termed a second element without departing from the teachings of this disclosure.

[0047] For descriptive purposes, spatial relative terms such as “below,” “beneath,” “under,” “lower,” “above,” “upper,” “on top of,” “higher,” “side” (e.g., as in “sidewall”), etc. may be used herein and thereby to describe the relationship of one element to another(s) as shown in the figures. In addition to the orientation depicted in the figures, the spatial relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture. For example, if the device in the figures is turned over, an element described as “below” or “beneath” other elements or features will then be oriented “above” the other elements or features. Thus, the term “below” can encompass both an orientation above and below. Additionally, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and thus, the spatial relative descriptors used herein should be interpreted accordingly.

[0048] The terms used in this specification are for the purpose of describing particular embodiments and are not intended to be limiting. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Additionally, when used in this specification, the terms "comprising", "comprises", "including" and "includes" specify the presence of the stated features, integers, steps, operations, elements, components and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should also be noted that as used herein, the terms "substantially", "about" and other similar terms are used as approximate terms and not as terms of degree, and are thus used to interpret the inherent deviations in measured, calculated and / or provided values that would be recognized by a person of ordinary skill in the art.

[0049] In this document, various embodiments are described with reference to cross-sectional views and / or exploded views that are schematic diagrams of embodiments and / or intermediate structures. Accordingly, variations in the illustrated shapes, such as those due to manufacturing techniques and / or tolerances, should be expected. Thus, the embodiments disclosed herein should not necessarily be construed as limited to the shapes of the specific regions shown, but should include, for example, deviations in shape resulting from manufacturing. In this way, the regions shown in the drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device, and thus are not necessarily intended to be limiting.

[0050] Hereinafter, a display panel and a method of manufacturing the display panel according to an embodiment will be described with reference to the drawings.

[0051] Figure 1 is a schematic perspective view of an electronic device ED according to an embodiment. Figure 2 is an exploded schematic perspective view of an electronic device ED according to an embodiment.

[0052] Reference Figure 1 , an electronic device ED according to an embodiment may include a display surface DS defined by a first direction DR1 and a second direction DR2 that intersect each other. The electronic device ED may provide an image IM to a user through the display surface DS.

[0053] The display surface DS may include a display area DA and a non-display area NDA around the display area DA. The display area DA may display the image IM, and the non-display area NDA may not display the image IM. The non-display area NDA may surround the display area DA. However, the embodiment is not limited thereto, and the shapes of the display area DA and the non-display area NDA may be modified.

[0054] Hereinafter, a direction substantially perpendicular to the plane defined by the first direction DR1 and the second direction DR2 is defined as the third direction DR3. The front surface and the rear surface of each component are distinguished based on the third direction DR3. As used herein, the phrase "in a plan view" may be defined as a state observed in the third direction DR3. Hereinafter, the first direction DR1, the second direction DR2, and the third direction DR3 are the corresponding directions indicated by the first direction axis to the third direction axis, and are represented by the same reference numerals or symbols as the reference numerals or symbols of the direction axes.

[0055] In an embodiment, the electronic device ED may also be a foldable electronic device capable of folding with respect to a folding axis. The folding axis may be parallel to the first direction DR1 or the second direction DR2, and a folding region may be defined in a part of the display region DA. The electronic device ED may be folded inward so that parts of the display region DA may face each other, or the electronic device ED may be folded outward so that parts of the display region DA may face away from each other.

[0056] As Figure 2 shown, the electronic device ED may include a display device DD, an electronic module EM, a power supply module PSM, and a housing HM. Figure 2 The electronic device ED is schematically illustrated. For example, the electronic device ED may further include a mechanical structure (e.g., a hinge) for controlling the operation (e.g., folding or curling) of the display device DD.

[0057] The display device DD may generate an image and sense an external input. The display device DD includes a window WM, an upper member UM, a display module DM, a lower member LM, a circuit board FCB, and a driving chip DIC. The upper member UM may include a member disposed above the display module DM, and the lower member LM may include a member disposed below the display module DM.

[0058] The window WM may provide the front surface of the electronic device ED. The window WM may include a transmissive region TA and a border region BA. Figure 1 The display region DA and the non-display region NDA of the display surface DS shown in

[0059] are defined by the transmissive region TA and the border region BA. The transmissive region TA may be a region through which an image passes, and the border region BA may be a region covering the structure / member disposed below the window WM. Figure 2 Only the display panel DP in the stacked structure of the display module DM is shown, but in addition to the display panel DP, the display module DM may substantially further include additional components disposed on the display panel DP. A detailed description of the stacked structure of the display module DM will be made later.

[0060] The display panel DP is not limited thereto and may include, for example, an organic light-emitting display panel or an inorganic light-emitting display panel. The display panel DP may include a display area DP-DA and a non-display area DP-NDA corresponding to the display area DA and the non-display area NDA shown in Figure 1 As used herein, the phrase "area / portion corresponding to area / portion" means that the area / portion overlaps with the area / portion, and is not limited to the case where these areas / portions have the same area.

[0061] The pad area PA of the display panel DP may be provided on one side of the non-display area DP-NDA. The pad area PA may be an area electrically joined (or connected) to a circuit board FCB to be described later. In an embodiment, the pad area PA may be defined on the rear surface of the display panel DP.

[0062] The display panel DP may generally have a quadrilateral shape in a plan view. Here, the "substantially quadrilateral shape" includes not only a quadrilateral shape in a mathematical sense but also a shape similar to a quadrilateral that can be perceived as a quadrilateral by a user. For example, the substantially quadrilateral shape may include a quadrilateral shape having a rounded corner area. For example, the substantially quadrilateral shape is not limited to the shape of the display panel DP having straight edge portions, and the edge portions may include curved areas.

[0063] The upper member UM may include a protective film or an optical film. The optical film may include a polarizer and a retarder for reducing external light reflection. The lower member LM may include a protective film for protecting the display panel DP, a support member for supporting the display panel DP, a digitizer, etc. A detailed description of the upper member UM and the lower member LM will be made later.

[0064] Figure 2 The circuit board FCB shown in

[0065] may be provided below the display panel DP. The circuit board FCB may be joined to the rear surface of the display panel DP and may electrically connect the display panel DP and the main circuit board. The circuit board FCB may include at least one insulating layer and at least one conductive layer. The conductive layer may include signal lines. Figure 2 The structure in which the driving chip DIC is mounted on the circuit board FCB is shown, but the embodiment is not limited thereto. For example, the driving chip DIC may also be mounted on the display panel DP or the main circuit board.

[0066] The electronic module EM may include components such as a control module, a wireless communication module, an image input module, a sound input module, a sound output module, a memory, an external interface module, etc. The electronic module EM may include a main circuit board, and the components of the electronic module EM may be mounted on the main circuit board or electrically connected to the main circuit board through a flexible circuit board. The electronic module EM may be electrically connected to the power module PSM.

[0067] For example, the electronic device ED may further include an electro-optical module. The electro-optical module may be an electronic component for outputting or receiving an optical signal. The electro-optical module may include a camera module and / or a proximity sensor. The camera module may capture an external image through a partial area of the display panel DP.

[0068] Figure 2 The housing HM shown in may be coupled to the display device DD (e.g., the window WM) and accommodate other modules. The housing HM is shown as having an integral shape, but the embodiments are not limited thereto. The housing HM may include parts (e.g., a side edge part and a bottom part) coupled to each other.

[0069] The upper member UM may include a synthetic resin film. The synthetic resin film may include polyimide, polycarbonate, polyamide, triacetyl cellulose, polymethyl methacrylate, or polyethylene terephthalate.

[0070] The upper member UM may absorb an external impact applied to the front surface of the display device DD. In an embodiment, the display module DM may include a color filter instead of a polarizing film as an antireflection member, thereby reducing the impact strength of the front surface of the display device DD. The upper member UM may compensate for the reduced impact strength due to the application of the color filter.

[0071] The synthetic resin film overlaps with the bezel area BA and the transmissive area TA. The synthetic resin film may overlap only with a partial area of the bezel area BA. In another example, the synthetic resin film may also be omitted. In another example, the synthetic resin film may be replaced by an optical film including a polarizer and a retarder.

[0072] The upper member UM may further include a first adhesive layer that joins the synthetic resin film and the window WM and a second adhesive layer that joins the synthetic resin film and the display module DM. The first adhesive layer and the second adhesive layer may each be a pressure-sensitive adhesive (PSA) film or an optically clear adhesive (OCA) member. The adhesive layers to be described below may also include the same adhesive as the adhesive of the first adhesive layer.

[0073] The display module DM can be disposed under the synthetic resin film. The display module DM overlaps with the border area BA and the transmissive area TA. The display module DM can overlap with the synthetic resin film in the border area BA (e.g., completely overlap). The side surface of the display module DM can be aligned with the side surface of the synthetic resin film, and in a plan view, the corner portion of the display module DM can be aligned with the corner portion of the synthetic resin film.

[0074] The pad area PA can overlap with the synthetic resin film in the border area BA. The portion of the display module DM corresponding to the pad area PA can be joined to the lower surface of the synthetic resin film by the second adhesive layer. Since the pad area PA can overlap with the synthetic resin film and the portion of the display module DM overlapping with the pad area PA can be joined to the synthetic resin film, when the circuit board FCB is joined to the pad area PA, the synthetic resin film can sufficiently support the pad area PA.

[0075] The lower member LM can include a lower film and a cover plate. In an embodiment, the lower member LM can further include a support plate and a digitizer. Its description will be given later.

[0076] Figure 3 is a schematic plan view of a display panel DP according to an embodiment.

[0077] As Figure 3 shown, the display panel DP can include a scan driving circuit SDC, signal lines SGL, and pixels PX. The pixels PX can be disposed in the display area DP-DA. Each of the pixels PX can include a light-emitting element and a pixel driving circuit connected to the light-emitting element. The scan driving circuit SDC, the signal lines SGL, and the pixel driving circuit can be included in the driving element layer 120 shown in Figure 4 described later.

[0078] The scan driving circuit SDC can include a gate driving circuit. The gate driving circuit can generate scan signals and can sequentially output the scan signals to scan lines GL described later. The scan driving circuit SDC can further include an emission driving circuit separated from the gate driving circuit. The emission driving circuit can output scan signals to another group of scan lines.

[0079] The scan driving circuit SDC can include thin film transistors formed by the same process as the process for the pixel driving circuit (e.g., low temperature polycrystalline silicon (LTPS) process or low temperature polycrystalline oxide (LTPO) process).

[0080] The signal line SGL may include a scan line GL, a data line DL, a power line PL, and a control signal line CSL. Each of the scan lines GL may be connected to a corresponding pixel PX in the pixel PX, and each of the data lines DL may be connected to a corresponding pixel PX in the pixel PX. The power line PL may be connected to the pixel PX. The data line DL may supply a data signal to the pixel PX. The control signal line CSL may supply a control signal to the scan driving circuit SDC.

[0081] The power line PL may include a first power line receiving a first power voltage and a second power line receiving a second power voltage having a level higher than the first power voltage. The first power voltage may be supplied to the pixel PX through the first power line, and the second power voltage may be supplied to the pixel PX through the second power line. A single control signal line CSL is shown as an example, but the control signal line CSL may be provided in plural.

[0082] The scan line GL, the data line DL, and the power line PL may overlap with the display area DP-DA and the non-display area DP-NDA, and the control signal line CSL may overlap with the non-display area DP-NDA. The end portions of the signal line SGL may be aligned at one side of the non-display area DP-NDA. Each of the signal lines SGL may have an integral shape, but may include different portions provided on different layers. The different portions separated from each other by an insulating layer may be connected to each other through contact holes passing through the insulating layer. For example, the data line DL may include a first portion provided in the display area DP-DA and a second portion provided in the non-display area DP-NDA and provided on a layer different from the layer on which the first portion is provided. The first portion and the second portion may include different materials and have different stacking structures.

[0083] The display panel DP may include insulating patterns DMP1 and DMP2. Figure 3 The first insulating pattern DMP1 and the second insulating pattern DMP2 are shown. The first insulating pattern DMP1 and the second insulating pattern DMP2 may be provided in the non-display area DP-NDA and surround the display area DP-DA. Each of the first insulating pattern DMP1 and the second insulating pattern DMP2 may have a closed line shape. The first insulating pattern DMP1 and the second insulating pattern DMP2 may serve as dams for preventing a liquid organic material from overflowing in an inkjet process for the display panel DP. A detailed description thereof will be made later.

[0084] Figure 4 is a schematic cross-sectional view of a display module DM according to an embodiment.

[0085] Reference Figure 4, the display module DM may include a display panel DP and an input sensor ISL. The display panel DP may include a base layer 110, a driving element layer 120, a light-emitting element layer 130, and a packaging layer 140.

[0086] The driving element layer 120 may be disposed on the upper surface of the base layer 110. The base layer 110 may be a flexible substrate that is bendable, foldable, rollable, etc. The base layer 110 may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiments are not limited thereto, and the base layer 110 may be an inorganic layer, an organic layer, or a composite material layer. The base layer 110 may generally have the same shape as the shape of the display panel DP.

[0087] The base layer 110 may have a multilayer structure. For example, the base layer 110 may include a first synthetic resin layer, a second synthetic resin layer, and an inorganic layer disposed between the first synthetic resin layer and the second synthetic resin layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin, but the embodiments are not limited thereto.

[0088] The driving element layer 120 may be disposed on the base layer 110. The driving element layer 120 may include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, etc. The driving element layer 120 may include a pixel driving circuit. Hereinafter, unless otherwise specified, it is interpreted that if component A and component B are disposed on the same layer, the components are formed by the same process and include the same materials or have the same stacked structure. The conductive pattern or the semiconductor pattern disposed on the same layer may be interpreted as those described above.

[0089] The light-emitting element layer 130 may be disposed on the driving element layer 120. The light-emitting element layer 130 may include light-emitting elements. For example, the light-emitting elements may include organic light-emitting materials, inorganic light-emitting materials, organic-inorganic light-emitting materials, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0090] The packaging layer 140 may be disposed on the light-emitting element layer 130. The packaging layer 140 may protect the light-emitting element layer 130 (e.g., the light-emitting elements) from moisture, oxygen, and foreign substances such as dust particles. The packaging layer 140 may include at least one inorganic packaging layer. The packaging layer 140 may include a stacked structure formed by sequentially stacking a first inorganic packaging layer, an organic packaging layer, and a second inorganic packaging layer.

[0091] The input sensor ISL can be disposed (e.g., directly disposed) on the display panel DP. The input sensor ISL can sense a user input by, for example, an electromagnetic induction method or a capacitive method. The display panel DP and the input sensor ISL can be formed by a continuous process. Here, "directly disposed" can mean that no intermediate element is disposed between the input sensor ISL and the display panel DP. For example, a separate adhesive layer may not be disposed between the input sensor ISL and the display panel DP.

[0092] Figure 5A and Figure 5B is a schematic cross-sectional view of a display device DD according to an embodiment.

[0093] Reference Figure 5A and Figure 5B , the display device DD may include a display panel DP, a circuit board FCB, a driving chip DIC, an upper member UM, and a lower member LM.

[0094] An opening CH may be defined (or formed) in the display panel DP. For example, the opening CH may be defined by passing through a base layer 110 and a driving element layer 120. The opening CH may be provided in plural.

[0095] A first pad PD1 may be disposed on the base layer 110 of the display panel DP. For example, the first pad PD1 may be disposed on the upper portion of the base layer 110.

[0096] The circuit board FCB may be disposed under the display panel DP. The circuit board FCB may include a second pad PD2 and a third pad PD3. Each of the second pad PD2 and the third pad PD3 may be disposed on a part of the circuit board FCB. The second pad PD2 and the third pad PD3 may be positioned on the lower portion of the display panel DP.

[0097] The second pad PD2 of the circuit board FCB may be electrically connected to the first pad PD1 through a conductive member SOL to be described later. The first pad PD1 may overlap the second pad PD2 in a plan view.

[0098] The driving chip DIC may be disposed under the display panel DP. The driving chip DIC may be connected to the third pad PD3 of the circuit board FCB.

[0099] The conductive member SOL may be disposed on the base layer 110. For example, the conductive member SOL may be received (or filled) in the opening CH. The conductive member SOL may be received (or filled) in the opening CH and electrically connect the first pad PD1 and the second pad PD2.

[0100] A plurality of conductive members SOL may be provided. The conductive members SOL may be respectively received (or filled) in the openings CH and are respectively electrically connected to the first pad PD1 and the second pad PD2.

[0101] The conductive member SOL may overlap the first pad PD1 in a plan view. In addition, the conductive member SOL may overlap the second pad PD2.

[0102] The conductive member SOL may include a conductive material. For example, the conductive material may include tin (Sn), silver (Ag), or copper (Cu), but the embodiments are not limited thereto.

[0103] The thermosetting member CV may cover the conductive member SOL. The thermosetting member CV may protect the conductive member SOL from external damage. The thermosetting member CV may protect the conductive member SOL from external foreign substances (e.g., moisture, etc.) and prevent external foreign substances from being introduced (or penetrating) into the opening CH.

[0104] The thermosetting member CV may overlap the non-display area NDA. The thermosetting member CV may overlap the pad area PA. The thermosetting member CV may be spaced apart from the display area DA.

[0105] The base film BF-SF (see Figure 7 ) may be further provided on the thermosetting member CV. The base film BF-SF (see Figure 7 ) together with the thermosetting member CV may protect the conductive member SOL and the opening CH from external foreign substances. The thermosetting member CV may be a thermosetting film HL-SF (see Figure 7 ), and the thermosetting film HL-SF (see Figure 7 ) is thermally cured by being pressed and heated after being provided on the base layer 110 through the thermosetting film HL-SF (see Figure 7 ) of the thermosetting conductive film SF (see Figure 7 ).

[0106] The lower member LM may include a lower film PF and a support plate PT.

[0107] The lower film PF may be provided under the display module DM and is bonded to the lower surface of the display module DM through a third adhesive layer. The lower film PF may protect the lower part of the display module DM. The lower film PF may include a flexible synthetic resin film. For example, the lower film PF may include polyethylene terephthalate or polyimide, but the embodiments are not limited thereto.

[0108] The lower film PF can improve the resistance to the compressive force caused by external pressing. Therefore, the lower film PF can function to protect the display panel DP from being deformed. The lower film PF can include a flexible plastic material such as polyimide or polyethylene terephthalate. For example, the lower film PF can be a colored film with a low light transmittance. The lower film PF can absorb the light incident from the outside. For example, the lower film PF can be a black synthetic resin film. In the case of observing the display device DD from above the window WM, the components disposed under the lower film PF can be invisible to the user.

[0109] The support plate PT can also be disposed under the lower film PF. The support plate PT can include a metal material with high strength. The support plate PT can also include a fiber-reinforced composite material. The support plate PT can include reinforcing fibers disposed inside the matrix portion. The reinforcing fibers can be carbon fibers or glass fibers. The matrix portion can include a polymer resin. The matrix portion can include a thermoplastic resin. For example, the matrix portion can include a polyamide-based resin or a polypropylene-based resin. For example, the fiber-reinforced composite material can be carbon fiber reinforced plastic (CFRP) or glass fiber reinforced plastic (GFRP).

[0110] Reference Figure 5A , a plate opening HA can be defined (or formed) in the support plate PT. A part of the support plate PT can be removed in the plate opening HA. The plate opening HA can overlap with the non-display area NDA and the pad area PA. However, the embodiment is not limited thereto, and the plate opening HA can overlap with the display area DA.

[0111] A part of the circuit board FCB can be received in the plate opening HA. The second pad PD2 can be received in the plate opening HA. In a plan view, the plate opening HA can overlap with the first pad PD1, the second pad PD2, and the conductive member SOL.

[0112] The crack dam CRD can be disposed on the base layer 110. The crack dam CRD can be disposed in the non-display area NDA. The crack dam CRD can be spaced apart from the driving element layer 120. In addition, the crack dam CRD can be spaced apart from the thermosetting member CV.

[0113] In the case of applying an external impact to the edge portion of the display module DM, the crack dam CRD can break and absorb the impact. When the crack dam CRD breaks, the crack can be blocked and prevented from spreading to the pad area PA and the display area DA.

[0114] The crack dam CRD can include a stacked structure corresponding to the stacked structure of the insulating layer of the driving element layer 120. The drawings show a single crack dam CRD, but the crack dam CRD can be provided in multiple.

[0115] Reference Figure 5B, a plate opening HA may not be defined (or formed) in the support plate PT. For example, the second pad PD2 may be provided in the support plate PT, and the second pad PD2 may be electrically connected to the conductive member SOL and the first pad PD1 in the support plate PT. For example, the lower film PF may be attached to the support plate PT by the adhesive layer ADL.

[0116] For example, the conductive members SOLa and SOLb may be received (or filled) in the openings CHa and CHb, respectively.

[0117] Figure 6A is an enlarged schematic view of a part of the display module DM according to an embodiment. Figure 6A is according to Figure 5B an enlarged schematic view of a part of the display device DD according to the embodiment in. The description to be referred to later Figure 6A can also be applied to the display device DD according to the embodiment in Figure 5A .

[0118] Referring to Figure 6A , the height (or depth) D1 of the openings CHa and CHb may be greater than the diameters (D2 or D3) of the openings CHa and CHb.

[0119] For example, in the thickness direction of the display panel DP (see Figure 5B ), the height D1 of the openings CHa and CHb may be in the range of about 100 μm or more. For example, the height D1 of the openings CHa and CHb in the third direction DR3 may be in the range of about 100 μm or more.

[0120] The cross-sectional diameters of the openings CHa and CHb may be in the range of about 20 μm to about 40 μm. The cross-sectional areas of the openings CHa and CHb may decrease as they are farther from the upper surface of the base layer 110.

[0121] The first diameter D2 of the openings CHa and CHb at the upper surface of the base layer 110 may be in the range of about 30 μm to about 40 μm. The second diameter D3 of the openings CHa and CHb at the lower surface of the base layer 110 may be in the range of about 20 μm to about 30 μm. For example, the maximum diameter of the openings CHa and CHb may be about 40 μm.

[0122] Referring to the drawings, the maximum widths of the conductive members SOLa and SOLb may be substantially equal to or greater than the maximum widths of the openings CHa and CHb. The maximum diameters of the conductive members SOLa and SOLb may be substantially equal to or greater than the maximum diameters of the openings CHa and CHb.

[0123] The conductive members SOLa and SOLb may have a maximum width that is substantially equal to or greater than the maximum width of the openings CHa and CHb, thereby preventing foreign substances from the outside from being introduced (or penetrating) into the openings CHa and CHb. For example, the first pad PD1 and the second pad PD2 (see Figure 5B ) may be electrically connected by the conductive members SOLa and SOLb accommodated (or filled) in the openings CHa and CHb, thereby improving the reliability of the electrical connection between the first pad PD1 and the second pad PD2 (see Figure 5B ). In addition, the size of the upper surface of the conductive members SOLa and SOLb may be substantially equal to or greater than the size of the first pad PD1.

[0124] As will be described later, the diameter of the conductive member SOL (see Figure 7 ) of the thermosetting conductive film SF (see Figure 7 ) may be in the range of about 30 μm to about 130 μm. In the display panel DP (see Figure 5B ) in which the openings CHa and CHb having the above-described height D1 range and diameter range are defined, and the thermosetting conductive film SF (see Figure 7 ) including the conductive member SOL (see Figure 7 ) having the above-described diameter range are coupled to each other, the conductive member SOL (see Figure 7 ) can be easily accommodated (or filled) in the openings CHa and CHb, and the reliability of the electrical connection between the display panel DP (see Figure 5B ) and the circuit board FCB (see Figure 2 ) can be improved or ensured through the conductive members SOLa and SOLb.

[0125] Figure 6B is a schematic plan view of a part of a display module DM according to an embodiment.

[0126] Referring to Figure 6B , the first pad PD1 (see Figure 6A ) may include a first row of pads PD-L1, a second row of pads PD-L2, and a third row of pads PD-L3.

[0127] The first row of pads PD-L1 and the second row of pads PD-L2 may be spaced apart from each other in the second direction DR2. The second row of pads PD-L2 and the third row of pads PD-L3 may be spaced apart from each other in the second direction DR2.

[0128] The first row of pads PD-L1 can be arranged in the first direction DR1. For example, the first row of pads PD-L1 can include the first-first row of pads Pda-L1, the second-first row of pads Pdb-L1, and the third-first row of pads Pdc-L1. The first-first row of pads Pda-L1, the second-first row of pads Pdb-L1, and the third-first row of pads Pdc-L1 can be arranged in sequence in the first direction DR1. The distance between the central portions of adjacent first row of pads PD-L1 in the first row of pads PD-L1 can be the fourth distance D4. In the case where the first diameters D2 (see Figure 6A ) of the above openings CHa and CHb (see Figure 6A ) are about 40 μm, the fourth distance D4 can be in the range of about 80 μm or greater. In another example, the fourth distance D4 can be in the range of about 85 μm to about 90 μm.

[0129] The second row of pads PD-L2 can be arranged in the first direction DR1. The second row of pads PD-L2 can be offset from the first row of pads PD-L1 by a selected distance in the first direction DR1.

[0130] The third row of pads PD-L3 can be arranged in the first direction DR1. The third row of pads PD-L3 can be offset from the second row of pads PD-L2 by a selected distance in the first direction DR1.

[0131] The signal lines SGL can be respectively connected to the first row of pads PD-L1, the second row of pads PD-L2, and the third row of pads PD-L3 arranged in the first direction DR1 and the second direction DR2. The fourth distance D4 can be in the range of about 80 μm or greater, and the signal lines SGL respectively connected to the second row of pads PD-L2 and the third row of pads PD-L3 can pass between adjacent first row of pads PD-L1.

[0132] In a plan view, the first row of pads PD-L1, the second row of pads PD-L2, and the third row of pads PD-L3 can be adjacent to the openings CHa and CHb (see Figure 6A ) respectively and surround the openings CHa and CHb (see Figure 6A ). In another example, the openings CHa and CHb (see Figure 6A ) can overlap with the first row of pads PD-L1, the second row of pads PD-L2, and the third row of pads PD-L3.

[0133] The arrangement relationship of the openings CHa and CHb (see Figure 6A ) can correspond to the arrangement relationship of the first row of pads PD-L1, the second row of pads PD-L2, and the third row of pads PD-L3.

[0134] The conductive member SOL may include a first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1, a second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2, and a third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3.

[0135] The first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 and the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 may be spaced apart from each other in the second direction DR2. The second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 and the third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 may be spaced apart from each other in the second direction DR2.

[0136] The first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 may be arranged in the first direction DR1. The second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 may be arranged in the first direction DR1. The third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 may be arranged in the first direction DR1.

[0137] In a plan view, the first row of pads PD-L1, the second row of pads PD-L2, and the third row of pads PD-L3 may overlap the conductive member SOL, respectively, and the arrangement relationship of the conductive member SOL may correspond to the arrangement relationship of the first row of pads PD-L1, the second row of pads PD-L2, and the third row of pads PD-L3.

[0138] The drawings only show the first row of pads PD-L1, the second row of pads PD-L2, the third row of pads PD-L3, and the first row to the third row of conductive members SOL, but the display device DD may further include a fourth row of pads and a fourth row of conductive members.

[0139] Figure 6C is an enlarged schematic view of a part of the display module DM according to an embodiment.

[0140] Reference Figure 6C , the display panel DP (see Figure 5B ) may further include auxiliary pads PD-I. The auxiliary pads PD-I may be provided on the inner surfaces of the openings CHa and CHb. Referring to the drawings, the auxiliary pads PD-I may cover a part of the inner surfaces of the openings CHa and CHb. However, the embodiment is not limited thereto, and the auxiliary pads PD-I may completely cover the inner surfaces of the openings CHa and CHb.

[0141] The auxiliary pad PD-I can be electrically connected to the first pad PD1. The auxiliary pad PD-I can be electrically connected to the first pad PD1 through the conductive members SOLa and SOLb. The auxiliary pad PD-I can be electrically connected to the second pad PD2 (see Figure 5B ).

[0142] When viewed from below the base layer 110, the auxiliary pad PD-I can cover (e.g., completely cover) the conductive members SOLa and SOLb. For example, by expanding the contact area between the auxiliary pad PD-I and the conductive members SOLa and SOLb, the reliability of the electrical connection between the first pad PD1 and the second pad PD2 (see Figure 5B ) can be improved or ensured by the auxiliary pad PD-I and the conductive members SOLa and SOLb.

[0143] A plurality of auxiliary pads PD-I can be provided, and the number of auxiliary pads PD-I can correspond to the number of conductive members SOLa and SOLb or the number of openings CHa and CHb.

[0144] Figure 7 is a schematic cross-sectional view of the thermosetting conductive film SF according to an embodiment. For example, Figure 7 shows the thermosetting conductive film SF before being provided on the base layer 110 (see Figure 5A ), pressed, and thermally cured.

[0145] Referring to Figure 7 , the thermosetting conductive film SF can include a base film BF-SF, a thermosetting film HL-SF, a conductive member SOL, and a lining LNR. The thermosetting conductive film SF according to an embodiment can be provided on the above-mentioned base layer 110 (see Figure 5A ) after removing the lining LNR later. Then, the thermosetting film HL-SF can be thermally cured by being pressed and heated, and protect the conductive member SOL (see Figure 5A ) and the opening CH (see Figure 5A ) from external foreign matters.

[0146] The base film BF-SF can include a lower surface defined by a first direction DR1 and a second direction DR2 intersecting each other and an upper surface opposite to the lower surface.

[0147] The base film BF-SF can include a material with high thermal conductivity. For example, the base film BF-SF can include silicon (Si), but the embodiment is not limited thereto. For example, the base film BF-SF can include a silicon compound.

[0148] Similar to the thermosetting film HL-SF to be described later, the base film BF-SF can be coupled to the display panel DP (see Figure 5A), and then protect the conductive member SOL and the opening CH (see Figure 5A ) from external foreign matters.

[0149] The thermosetting film HL-SF may be disposed under the base film BF-SF. The surface of the thermosetting film HL-SF may be in contact with the lower surface of the base film BF-SF.

[0150] The thermosetting film HL-SF may include a resin. The resin included in the thermosetting film HL-SF may be an epoxy-based resin. For example, the thermosetting film HL-SF may include a curing agent and a catalyst, but the materials included in the thermosetting film HL-SF are not limited to the above materials.

[0151] The thermosetting film HL-SF may be coupled to the display panel DP (see Figure 5A ), and then correspond to the above thermosetting member CV (see Figure 5A ). The thermosetting film HL-SF may protect the conductive member SOL and the opening CH (see Figure 5A ) from external foreign matters before and after curing.

[0152] The conductive member SOL may be dispersed in the thermosetting film HL-SF. The conductive member SOL may pass through the thermosetting film HL-SF in a cross-sectional view.

[0153] At least a part of the conductive member SOL may protrude from the thermosetting film HL-SF. As shown in the drawings, one side of the conductive member SOL may be positioned below the thermosetting film HL-SF. Therefore, as will be described later, the conductive member SOL may be easily accommodated (or filled) in the opening CH (see Figure 5A ). Therefore, the ability to accommodate (or fill) the conductive member SOL in the opening CH (see Figure 5A ) may be improved.

[0154] The diameter of the conductive member SOL in the thermosetting conductive film SF may be in the range of about 30 μm to about 130 μm.

[0155] The conductive member SOL of the thermosetting conductive film SF may have a diameter of about 30 μm to about 130 μm, and when the thermosetting conductive film SF and the display module DM (see Figure 5A ) are coupled to each other, the conductive member SOL may be accommodated (or filled) inside the opening CH (see Figure 5A ). For example, the conductive member SOL may be filled (e.g., completely filled) inside the opening CH (see Figure 5A ). Therefore, the first pad PD1 (see Figure 5A ) and the second pad PD2 (see Figure 5A) are electrically connected to each other through the conductive member SOL accommodated (or filled) in the opening CH (see Figure 5A ). Therefore, the reliability of the electrical connection between the display module DM (see Figure 5A ) and the circuit board FCB (see Figure 5A ) can be improved or ensured.

[0156] When the conductive member SOL has a diameter of about 30 μm or less, although the conductive member SOL is accommodated (or filled) inside the opening CH (see Figure 5A ), since the maximum diameter (e.g., the first diameter) of the opening CH (see Figure 5A ) can be in the range of about 30 μm or more, it is difficult for the conductive member SOL (e.g., see Figure 5A ) to completely cover the opening CH (see Figure 5A ) on the upper surface of the base layer 110. As a result, it may be difficult to allow the conductive member SOL and the first pad PD1 (see Figure 5A ) to be electrically connected to each other, and it may be difficult to allow the first pad PD1 (see Figure 5A ) and the second pad PD2 (see Figure 5A ) to be electrically connected to each other through the conductive member SOL.

[0157] When the conductive member SOL has a diameter of about 130 μm or more, the conductive member SOL can not only be accommodated (or filled) in the opening CH (see Figure 5A ), but may also be accommodated (or filled) in another opening CH (see Figure 5A ) adjacent to the opening CH (see Figure 5A ), and thus, the pads PD (see Figure 10B ) adjacent to each other may be electrically connected. As a result, the reliability of signal transmission may not be improved or ensured.

[0158]

[0159] The conductive member SOL may include tin (Sn). The conductive member SOL may also include materials such as silver (Ag) or copper (Cu).

[0160] The inner liner LNR may be provided under the thermosetting film HL-SF. The inner liner LNR may include a protective film PL-SF and an adhesive film ADL-SF. Figure 5A The protective film PL-SF may be provided under the thermosetting film HL-SF. The protective film PL-SF may cover the conductive member SOL. In addition, the protective film PL-SF may cover the lower part of the thermosetting film HL-SF. When the thermosetting conductive film SF is coupled to the display panel DP (see Figure 5ABefore that, the protective film PL-SF can protect the thermosetting film HL-SF and the conductive member SOL from external foreign matters and external damage.

[0161] The adhesive film ADL-SF can be disposed between the protective film PL-SF and the thermosetting film HL-SF. The adhesive film ADL-SF can be in contact with (e.g., directly in contact with) or coated (e.g., directly coated on) the protective film PL-SF. The adhesive film ADL-SF can be attached to each of the thermosetting film HL-SF and the protective film PL-SF. In another example, the adhesive film can be attached to each of the conductive member SOL and the protective film PL-SF.

[0162] Figures 8A to 8C is a schematic plan view of the thermosetting conductive film SF according to an embodiment.

[0163] Reference Figure 8A , the conductive member SOL in the thermosetting conductive film SF (see Figure 7 ) can include a first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1, a second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2, and a third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3.

[0164] The first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 and the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 can be spaced apart from each other in the second direction DR2. The second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 and the third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 can be spaced apart from each other in the second direction DR2.

[0165] The first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 can be arranged in the first direction DR1 along the first alignment line ALL1. The second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 can be arranged in the first direction DR1 along the second alignment line ALL2. The third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 can be arranged in the first direction DR1 along the third alignment line ALL3.

[0166] The second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 can be offset by a selected distance in the first direction DR1 from the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1. That is, when viewed in the second direction DR2, the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 may not overlap with the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1. The third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 can be arranged in the first direction DR1. The third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 can be offset by a selected distance in the first direction DR1 from the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2. For example, the interval SP1 in the first direction DR1 between the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 can be substantially equal to or greater than the width W1 of the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1. For example, the interval SP2 in the first direction DR1 between the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 can be substantially equal to or greater than the width W2 of the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2. For example, the interval SP3 in the first direction DR1 between the third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 can be substantially equal to or greater than the width W3 of the third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3.

[0167] The arrangement relationship of the conductive members SOL in the thermosetting conductive film SF can correspond to the arrangement relationship of the openings CH (see Figure 5A ) of the display panel DP (see Figure 5A ) or the arrangement relationship of the first pads PD1 (see Figure 5A ). The drawings only show the first row to the third row of conductive members SOL, but the display device DD (see 5A) may also include a fourth row of conductive members.

[0168] Refer to Figure 8B, the dimensions of the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 may be different from the dimensions of the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1. As shown in the drawings, the dimensions of the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 may be larger than the dimensions of the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1. For example, the spacing SP1 between the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 in the first direction DR1 may be substantially equal to or greater than the width W1 of the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1. For example, the spacing SP2 between the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 in the first direction DR1 may be substantially equal to or less than the width W2 of the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2. For example, the spacing SP3 between the third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 in the first direction DR1 may be substantially equal to or greater than the width W3 of the third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3.

[0169] Without being limited to those shown in the drawings, the dimensions of the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 may be larger than the dimensions of the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2, but the embodiments are not limited thereto.

[0170] The drawings show that the conductive members SOL in the same row have the same dimensions, but the embodiments are not limited thereto, and the conductive members SOL in the same row may have different dimensions.

[0171] Reference Figure 8C , the spacing SP1 between the first row of conductive members SOL1-L1, SOL2-L1, and SOL3-L1 in the first direction DR1, the spacing SP2 between the second row of conductive members SOL1-L2, SOL2-L2, and SOL3-L2 in the first direction DR1, and the spacing SP3 between the third row of conductive members SOL1-L3, SOL2-L3, and SOL3-L3 in the first direction DR1 may be the same as each other.

[0172] The second alignment line ALL2 may include a (2-1) alignment line ALL2-1 and a (2-2) alignment line ALL2-2. The (2-1) alignment line ALL2-1 and the (2-2) alignment line ALL2-2 may be spaced apart from each other in the second direction DR2.

[0173] Some of the second-row conductive members SOL1-L2, SOL2-L2, and SOL3-L2 may be arranged along the (2-1) alignment line ALL2-1, and the remaining conductive members among the second-row conductive members SOL1-L2, SOL2-L2, and SOL3-L2 may be arranged along the (2-2) alignment line ALL2-2.

[0174] The second-row conductive member SOL2-L2 arranged along the (2-2) alignment line ALL2-2 may be offset by a selected distance from the second-row conductive members SOL1-L2 and SOL3-L2 arranged along the (2-1) alignment line ALL2-1 in the first direction DR1.

[0175] Figures 9A to 9C is a schematic cross-sectional view of the thermosetting conductive film SF according to an embodiment.

[0176] Reference Figure 9A , the thermosetting film HL-SF may further include a filler. The filler may further increase the thermal conductivity of the thermosetting film HL-SF in the process of heating the thermosetting film HL-SF to be described later.

[0177] The conductive member SOL may be spaced apart from the base film BF-SF. The conductive member SOL may have an initial form of a sphere. The conductive member SOL in the thermosetting conductive film SF may have various forms, not limited to the forms shown in the drawings, but the embodiment is not limited thereto.

[0178] Reference Figure 9B , the width of the conductive member SOL-1 in the second direction DR2 may decrease as it is farther away from the thermosetting film HL-SF. Therefore, in the process of connecting the thermosetting conductive film SF and the display panel DP (see Figure 5A ) to each other later, the conductive member SOL-1 can be easily accommodated (or filled) in the opening CH (see Figure 5A ).

[0179] The drawings show that the width of the conductive member SOL-1 decreases in the second direction DR2, but the width of the conductive member SOL-1 may also decrease in the first direction DR1, but the embodiment is not limited thereto.

[0180] Reference Figure 9C , the width of the conductive member SOL-2 may be constant in the second direction DR2. The drawings show that the width of the conductive member SOL-2 in the second direction DR2 is substantially constant, but the width of the conductive member SOL-2 in the first direction DR1 may also be constant, but the embodiment is not limited thereto.

[0181] For example, the conductive member SOL-2 may pass through the thermosetting film HL-SF and may contact the base film BF-SF.

[0182] Figures 10A to 10D is a schematic cross-sectional view showing some of the operations of coupling a thermosetting conductive film SF (see Figure 7 ) to a display panel DP (see Figure 5A ) according to an embodiment. Components that are the same / similar to those described with reference to Figures 1 to 9C are denoted by the same / similar reference numerals or symbols, and repeated descriptions are omitted.

[0183] A method of manufacturing a display device according to an embodiment may include preparing a display panel DP (see Figure 5A ) and a thermosetting conductive film SF (see Figure 7 ) and coupling the display panel DP (see Figure 5A ) and the thermosetting conductive film SF (see Figure 7 ) to each other.

[0184] Coupling the display panel DP (see Figure 5A ) and the thermosetting conductive film SF (see Figure 7 ) to each other may include: removing the protective film PL-SF (see Figure 7 ) of the thermosetting conductive film SF (see Figure 7 ); aligning the opening CH (see Figure 5A ) of the display panel DP (see Figure 5A ) with the conductive member SOL of the thermosetting conductive film SF (see Figure 7 ); inserting the conductive member SOL of the thermosetting conductive film SF (see Figure 7 ) into the opening CH (see Figure 5A ) of the display panel DP (see Figure 5A ); disposing a heat conductive member HPL on the thermosetting conductive film SF (see Figure 7 ); disposing a thermal compression device PRU on the heat conductive member HPL, and applying pressure and heat to the thermosetting conductive film SF (see Figure 7 ); and removing the heat conductive member HPL and the thermal compression device PRU.

[0185] Referring to Figure 10A , when removing the protective film PL-SF (see Figure 7 ) of the thermosetting conductive film SF (see Figure 7 ), the adhesive film ADL-SF (see Figure 7 ) may be removed together with the protective film PL-SF (see Figure 7 ). As shown in the drawings, the base film BF-SF may be retained, but the base film BF-SF may be separated from the protective film PL-SF (see Figure 7) Removed together, and the implementation is not limited to this.

[0186] Reference Figure 10B , after aligning the opening CH (see Figure 5A ) of the display panel DP (see Figure 5A ) and the conductive member SOL of the thermosetting conductive film SF (see Figure 7 ), the conductive member SOL of the thermosetting conductive film SF (see Figure 7 ) can be inserted into the opening CH (see Figure 5A ) of the display panel DP (see Figure 5A ). The conductive member SOL can be inserted together and accommodated (or filled) in the opening CH (see Figure 5A ). It is not necessary to separately insert and accommodate (or fill) the conductive member SOL in the opening CH (see Figure 5A ), thereby reducing the process cost and process time. For example, the lower member LM can be attached to the support plate PT by the adhesive layer ADL.

[0187] Reference Figure 10C And Figure 10D , after setting the heat conducting member HPL on the thermosetting conductive film SF (see Figure 7 ) and setting the hot compression device PRU on the heat conducting member HPL, pressure and heat can be applied to the thermosetting film HL - SF and the conductive member SOL.

[0188] The heat conducting member HPL can include a material with high thermal conductivity to easily transfer pressure and heat to the thermosetting film HL - SF and the conductive member SOL.

[0189] Heat can be applied to the conductive member SOL, and thus, the form of the conductive member SOL can be changed. Here, the conductive member SOL can be accommodated (or filled) in the opening CH and cover (e.g., completely cover) the opening CH. Therefore, the pads PD (e.g., the first pad PD1 and the second pad PD2) can be electrically connected to the conductive member SOL. The reliability of the electrical connection between the display panel DP (see Figure 5A ) and the circuit board FCB (see Figure 5A ) can be improved or ensured.

[0190] Heat and pressure can be applied to the thermosetting film HL - SF, and thus, the thermosetting film HL - SF can be cured. The cured thermosetting film HL - SF can protect the conductive member SOL and the opening CH from external foreign matters.

[0191] Then, the heat conducting member HPL and the hot compression device PRU can be removed, and the display device DD according to the embodiment can be completed.

[0192] The display device DD according to an embodiment may have a reduced area of the pad region PA of the display panel DP, and thus may have a reduced area of the entire non-display area NDA of the display panel DP.

[0193] The display device DD according to an embodiment may have some pads positioned on the lower portion of the display panel DP, and thus may have a reduced area of the pad region PA on the upper portion of the display panel DP.

[0194] The display device DD according to an embodiment may electrically connect the pads PD provided on the upper and lower portions of the display panel DP through a conductive member SOL accommodated (or filled) in the opening CH of the display panel DP.

[0195] The display device DD according to an embodiment may improve or ensure the reliability of the electrical connection between the display panel DP and the circuit board FCB through the conductive member SOL that extends down to the lower portion of the opening CH of the display panel DP.

[0196] The display device DD according to an embodiment may prevent external substances from being introduced (or penetrating) between the conductive member SOL and the opening CH through a thermosetting member CV provided on the conductive member SOL, and thus may ensure the reliability of the electrical connection between the display panel DP and the circuit board FCB.

[0197] The display device DD according to an embodiment may improve or ensure the reliability of the electrical connection between the pads PD of the display panel DP through the opening CH and the thermosetting member CV that fixes the conductive member SOL.

[0198] The display device DD according to an embodiment may match the conductive member SOL together with the opening CH through a thermosetting conductive film SF that fixes the aligned conductive member SOL, and thus may reduce the process time and cost.

[0199] At the end of the detailed description, those skilled in the art will understand that many changes and modifications can be made to the embodiments without substantially departing from the principles, spirit, and scope of the present disclosure. Therefore, the disclosed embodiments are for general and descriptive purposes only and are not for the purpose of limitation.

Claims

1. A display device, comprising: Display panel, including: Grassroots; a driving element layer, disposed on the base layer and comprising a circuit; a light emitting element layer disposed on the driving element layer and comprising a plurality of light emitting elements respectively electrically connected to the circuits of the driving element layer; A plurality of pads are disposed on the base layer; and A plurality of openings passing through the base layer, the driving element layer and the plurality of pads; A circuit board, arranged below the display panel; a plurality of conductive members disposed on the base layer and overlapping the plurality of pads; and a thermosetting member covering the plurality of conductive members, The plurality of conductive members are respectively disposed in the plurality of openings and electrically connect the driving element layer and the circuit board.

2. The display device according to claim 1, wherein: The plurality of conductive members include: a plurality of first row conductive members arranged in a first direction; and A plurality of second-row conductive members are spaced apart from the first-row conductive members in a second direction intersecting the first direction and are arranged in the first direction.

3. The display device according to claim 2, wherein: The plurality of second row conductive members do not overlap the plurality of first row conductive members when viewed in the second direction.

4. The display device according to claim 2, wherein: In a plan view, a size of the first row conductive members and a size of the second row conductive members are different from each other.

5. The display device according to claim 4, wherein: The plurality of second row conductive members include a plurality of first conductive members and a plurality of second conductive members aligned along the first direction, and The plurality of second conductive members are disposed offset from the first conductive members by a selected distance in the second direction.

6. The display device according to claim 1, wherein: A cross-sectional area of ​​each of the plurality of openings decreases as it moves away from an upper surface of the base layer.

7. The display device according to claim 1, wherein: In a plan view, a width of each of the plurality of openings is in a range of 20 μm to 40 μm.

8. The display device according to claim 1, wherein: A maximum width of the plurality of conductive members is equal to or greater than a maximum width of the plurality of openings.

9. The display device according to claim 1, wherein: The size of the upper surfaces of the plurality of conductive members is equal to or smaller than the size of the plurality of pads.

10. The display device according to claim 1, wherein: When viewed from above the base layer, the plurality of conductive members are completely covered by the thermosetting member.

11. The display device according to claim 1, wherein: The display panel further includes an auxiliary pad disposed on an inner surface of at least one of the plurality of openings.

12. The display device according to claim 11, wherein: When viewed from below the base layer, the plurality of conductive members are completely covered by the auxiliary pad.

13. The display device according to claim 1, wherein: The plurality of conductive members include tin, silver, or copper.

14. A thermosetting conductive film, comprising: a base film including a lower surface defined by a first direction and a second direction intersecting each other and an upper surface opposite to the lower surface; a thermosetting film disposed on the lower surface of the base film; as well as A plurality of conductive members are dispersed in the thermosetting film, penetrate the thermosetting film in a cross-sectional view, and include tin.

15. The thermosetting conductive film according to claim 14, wherein: The plurality of conductive members are arranged in the first direction, and An interval between the plurality of conductive members adjacent to each other is equal to or greater than a width of each of the plurality of conductive members in the first direction.

16. The thermosetting conductive film according to claim 14, wherein: The base film includes silicon.

17. The thermosetting conductive film according to claim 14, further comprising: a protective film disposed below the thermosetting film and covering the plurality of conductive members; as well as An adhesive film is disposed between the thermosetting film and the protective film.

18. The thermosetting conductive film according to claim 14, wherein: The plurality of conductive members have diameters ranging from 30 μm to 130 μm.

19. The thermosetting conductive film according to claim 14, wherein: The plurality of conductive members have an initial form of spheres.

20. The thermosetting conductive film according to claim 14, wherein The widths of the plurality of conductive members in the first direction or the second direction decrease as they move away from the thermosetting film.

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