Heat dissipation shielding structure, processing method, circuit board assembly and electronic equipment

Abstract

The invention relates to a heat dissipation structure, in particular to a heat dissipation shielding structure, a processing method, a circuit board assembly and electronic equipment. The method is applied to a circuit board, the circuit board comprises a mounting surface, electronic components are mounted on the mounting surface, and the electronic components comprise active components and passive components; the heat dissipation shielding structure comprises an insulating layer, and the insulating layer covers the mounting surface, wraps the side surface and the top surface of the passive device and at least wraps the side surface of the active device, so that a first surface is formed on the side, deviating from the mounting surface, of the insulating layer, or the first surface is formed by the side, deviating from the mounting surface, of the insulating layer and the top surface of the active device together; the shielding layer covers the first surface, the shape of the shielding layer is matched with that of the first surface, and the shielding layer is electrically connected to the grounding end of the circuit board. According to the heat dissipation shielding structure provided by the invention, the heat dissipation effect of the electronic component can be improved while the shielding effect on the electronic component on the circuit board is realized, and the working stability and safety of the circuit board are improved.

Description

Heat dissipation shielding structure and processing method, circuit board assembly, and electronic equipment

[0001] This application claims priority to the Chinese patent application filed with the State Intellectual Property Office on September 28, 2023, with application number 202311279857.7 and invention name “A heat dissipation shielding structure and processing method, circuit board assembly, and electronic device”, the entire contents of which are incorporated by reference into this application. Technical Field

[0002] The present application relates to a heat dissipation structure, and in particular to a heat dissipation shielding structure and processing method, a circuit board assembly, and an electronic device. Background Art

[0003] As electronic devices become increasingly versatile, the number of electronic components on printed circuit boards (PCBs) is also increasing. Some electronic components on PCBs require shielding to prevent interference between components and potential user disruption. Therefore, shielding covers are often installed on PCBs to achieve this shielding.

[0004] However, since electronic components generate heat during operation, and the heat is accumulated in the shielding cover, the heat dissipation effect of the electronic components is poor, and even the service life of the electronic components and the circuit board is affected.

[0005] Summary of the Invention

[0006] In order to solve the above problems, the present application provides a heat dissipation shielding structure and processing method, a circuit board assembly, and an electronic device, which can not only achieve the shielding effect of electronic components on the circuit board, but also improve the heat dissipation effect of the electronic components and improve the working stability and safety of the circuit board.

[0007] In order to achieve the above-mentioned objectives, in a first aspect, the present application provides a heat dissipation shielding structure, which is applied to a circuit board, the circuit board including a mounting surface, on which electronic components are mounted, the electronic components including active components and passive components, and the heat generation of the active components is greater than the heat generation of the passive components; the heat dissipation shielding structure includes: an insulating layer, the insulating layer covering the mounting surface and covering the side and top surfaces of the passive components, and at least covering the side surfaces of the active components, so that the insulating layer forms a first surface on the side facing away from the mounting surface, or the insulating layer forms a first surface together with the top surface of the active component on the side facing away from the mounting surface; the first surface fluctuates with the height of the electronic components; a shielding layer, the shielding layer covering the first surface, the shape of the shielding layer matching the shape of the first surface, and the shielding layer electrically connected to the ground terminal of the circuit board.

[0008] In the embodiments provided herein, an insulating layer and a shielding layer are provided on the circuit board so that the height of the electronic components varies, thereby ensuring that the distance between the top surface of each electronic component and the shielding layer is similar. This allows the heat from each electronic component to be transferred to the shielding layer as quickly as possible, thereby improving the heat dissipation effect. Furthermore, because the thermal conductivity of the insulating layer is greater than that of air, providing an insulating layer between the shielding layer and the electronic components not only achieves insulation isolation of the electronic components but also improves the efficiency of heat conduction between the electronic components and the shielding layer, thereby improving the heat dissipation effect.

[0009] In one implementation, the insulating layer covers the side surfaces of the active device, so that the insulating layer and the top surface of the active device on the side facing away from the mounting surface jointly form a first surface; the shielding layer covers the top surface of the active device. In this way, the shielding layer can directly contact the top surface of the active device, thereby improving the heat dissipation effect of the active device.

[0010] In one implementation, an insulating layer covers the side and top surfaces of the active device, forming a first surface on the side of the insulating layer facing away from the mounting surface. A first groove is provided in the insulating layer, located between the top surface of the active device and the shielding layer, connecting the top surface of the active device to the shielding layer. A thermally conductive structure is filled in the first groove, with one end of the thermally conductive structure connected to the top surface of the active device and the other end to the shielding layer. In this way, the thermally conductive structure can be used to connect the top surface of the active device to the shielding layer, thereby improving the heat conduction efficiency of the active device and thus improving the heat dissipation effect of the active device.

[0011] One implementation further includes a graphite layer covering the side of the shielding layer facing away from the first surface. This allows the graphite layer to evenly distribute heat across the shielding layer, preventing localized high temperatures. The graphite layer also increases the heat exchange area with the air, improving heat dissipation.

[0012] In one implementation, a thermally conductive gel is provided between the shielding layer and the graphite layer, so that the thermally conductive gel can be used to fill the gap between the shielding layer and the graphite layer to improve the heat dissipation effect.

[0013] In one implementation, the shielding layer has a recessed portion located near the edge of the electronic component and recessed toward the insulating layer. The thermally conductive gel fills at least the recessed portion. This prevents the graphite layer from being unable to fill the recessed portion, creating air gaps and improving thermal conductivity and heat dissipation.

[0014] In one implementation, a grounding pad is mounted on the mounting surface; the shielding layer is electrically connected to the grounding pad. This allows the shielding layer to be grounded while also reducing the space occupied by the shielding layer grounding structure.

[0015] In one implementation, the insulating layer is provided with a second groove, located between the top surface of the ground pad and the shielding layer, and connecting the top surface of the ground pad to the shielding layer. The shielding layer includes a main portion and a first conductive portion. The main portion covers the first surface, and its shape matches the shape of the first surface. The first conductive portion fills the second groove, with one end of the first conductive portion connected to the main portion and the other end connected to the top surface of the ground pad. In this way, the shielding layer can be directly connected to the ground pad through the second groove, thereby facilitating grounding of the shielding layer.

[0016] In one implementation, the insulating layer is provided with a second groove, located between the top surface of the ground pad and the shielding layer, and connecting the top surface of the ground pad to the shielding layer. The second groove is filled with a first conductive structure, which is electrically connected to the ground pad and the shielding layer. In this way, the first conductive structure can be used to achieve an electrical connection between the shielding layer and the ground pad.

[0017] In one implementation, one end of the first conductive structure is connected to the top surface of the ground pad, and the other end is connected to the shielding layer. In this way, the first conductive structure can be used to achieve electrical connection between the shielding layer and the ground pad.

[0018] One implementation further includes: a conductive pad disposed on the top surface of the ground pad; an insulating layer covering the side and top surfaces of the conductive pad; a second groove located between the top surface of the conductive pad and the shielding layer, connecting the top surface of the conductive pad to the shielding layer; and a first conductive structure connected at one end to the top surface of the conductive pad and at the other end to the shielding layer. In this way, the conductive pad can be used to reduce the distance between the shielding layer and the ground pad, thereby preventing the second groove from being too deep and facilitating the filling of the first conductive structure to achieve grounding of the shielding layer.

[0019] In one implementation, the device further includes a conductive pad disposed on the top surface of the ground pad; an insulating layer covering the side surfaces of the conductive pad; a top surface of the conductive pad located on the first surface; and a shielding layer connected to the conductive pad. Thus, the conductive pad can be used to electrically connect the shielding layer to the ground pad.

[0020] In one implementation, the passive component includes a capacitor having a ground terminal; the shielding layer is electrically connected to the ground terminal. This allows the shielding layer to be grounded using the capacitor, eliminating the need for an additional grounding structure and facilitating miniaturization of the circuit board.

[0021] In one implementation, the insulating layer is provided with a third groove, located between the top surface of the ground terminal and the shielding layer, and connecting the top surface of the ground terminal to the shielding layer. The shielding layer includes a main portion and a second conductive portion. The main portion covers the first surface, and its shape matches the shape of the first surface. The second conductive portion fills the third groove, with one end of the second conductive portion connected to the main portion and the other end connected to the top surface of the ground terminal. In this way, the shielding layer can be directly connected to the ground terminal to achieve grounding of the shielding layer.

[0022] In one implementation, the insulating layer is provided with a third groove, located between the top surface of the ground terminal and the shielding layer, and connecting the top surface of the ground terminal to the shielding layer. The third groove is filled with a second conductive structure, one end of which is connected to the top surface of the ground terminal and the other end is connected to the shielding layer. In this way, the second conductive structure can be used to achieve an electrical connection between the shielding layer and the ground terminal.

[0023] In one implementation, the electronic component is connected to the mounting surface via an electrical connection structure, with a gap existing between the bottom surface of the electronic component and the mounting surface. The heat dissipation shielding structure also includes a protective structure, which fills the gap between the bottom surface of the electronic component and the mounting surface and surrounds the electrical connection structure. The protective structure is made of an insulating material. In this way, the protective structure can protect the connection between the electronic component and the mounting surface.

[0024] In one implementation, the active device includes a stacked processor and a memory; the processor is connected to the mounting surface; and the memory is electrically connected to the processor. This facilitates the implementation of the circuit board's functions.

[0025] In a second aspect, the present application provides a method for processing a heat dissipation shielding structure, comprising: providing a circuit board, the circuit board including a mounting surface, the mounting surface having electronic components mounted thereon, the electronic components including active components and passive components, the active components generating more heat than the passive components; applying an insulating material to the mounting surface, the insulating material covering the side and top surfaces of the passive components, and at least covering the side surfaces of the active components, to form an insulating layer, wherein the insulating layer forms a first surface on a side facing away from the mounting surface, or the insulating layer and the top surface of the active components on a side facing away from the mounting surface together form a first surface; the first surface fluctuates with the height of the electronic components; applying a shielding material to the first surface to form a shielding layer, wherein the shape of the shielding layer matches the shape of the first surface, and the shielding layer is electrically connected to a ground terminal of the circuit board. By providing the insulating layer and the shielding layer on the circuit board to fluctuate with the height of the electronic components, the distance between the top surface of each electronic component and the shielding layer is similar, thereby enabling heat from each electronic component to be transferred to the shielding layer as quickly as possible, thereby improving the heat dissipation effect. At the same time, since the thermal conductivity of the insulating layer is greater than the thermal conductivity of air, by providing an insulating layer between the shielding layer and the electronic components, not only can the insulation isolation of each electronic component be achieved, but also the heat conduction efficiency between the electronic components and the shielding layer can be improved, thereby improving the heat dissipation effect.

[0026] In one implementation, an insulating material is applied to the mounting surface, covering the side and top surfaces of the passive components, and at least the side surfaces of the active components to form an insulating layer. The insulating layer forms a first surface on the side facing away from the mounting surface, or the insulating layer and the top surface of the active components on the side facing away from the mounting surface together form the first surface. The first surface fluctuates with the height of the electronic components. This method includes: applying the insulating material to the mounting surface, covering the side and top surfaces of the active and passive components; removing the insulating material from the top surface of the active components to expose the top surface of the active components, forming an insulating layer. The insulating layer and the top surface of the active components on the side facing away from the mounting surface together form the first surface. The first surface fluctuates with the height of the electronic components. This facilitates direct contact between the subsequent shielding layer and the top surface of the active components, thereby improving heat dissipation for the active components.

[0027] In one implementation, insulating material covers the side and top surfaces of the active device; the insulating material is applied to the mounting surface, the insulating material covers the side and top surfaces of the passive device, and at least covers the side surfaces of the active device to form an insulating layer, so that the insulating layer forms a first surface on the side facing away from the mounting surface, or the insulating layer and the top surface of the active device together form a first surface on the side facing away from the mounting surface; the first surface fluctuates with the height of the electronic component, and then further includes: removing a portion of the insulating material on the top surface of the active device, forming a first groove in the insulating layer, and connecting the first groove to the top surface of the active device to expose the top surface of the active device. This provides a location for filling the thermal conductive structure, so that the top surface of the active device can be connected to the shielding layer using the thermal conductive structure, thereby improving the heat conduction efficiency of the active device and thus improving the heat dissipation effect of the active device.

[0028] In one implementation, a portion of the insulating material on the top surface of the active device is removed, and a first trench is formed in the insulating layer, connecting the first trench to the top surface of the active device. The method then includes filling the first trench with a thermally conductive material to form a thermally conductive structure, connecting the thermally conductive structure to the top surface of the active device, with the side of the thermally conductive structure facing away from the active device being located on the first surface. In this way, the thermally conductive structure can be used to connect the top surface of the active device to the shielding layer, thereby improving the heat conduction efficiency of the active device and thereby enhancing the heat dissipation effect of the active device.

[0029] In one implementation, a shielding material is applied to the first surface to form a shielding layer. The shape of the shielding layer matches the shape of the first surface and is electrically connected to the ground terminal of the circuit board. The method then includes applying graphite to the side of the shielding layer facing away from the first surface to form a graphite layer. This allows the graphite layer to evenly distribute heat across the shielding layer, preventing localized high temperatures. The graphite layer also increases the heat exchange area with the air, improving heat dissipation.

[0030] In one implementation, graphite is applied to the side of the shielding layer facing away from the first surface to form a graphite layer. Prior to this, the method further includes: filling at least a portion of the shielding layer facing away from the first surface with liquid thermally conductive gel; and curing the thermally conductive gel. This allows the thermally conductive gel to fill the gap between the shielding layer and the graphite layer, improving heat dissipation.

[0031] In one implementation, a ground pad is mounted on the mounting surface; shielding material is applied to the first surface to form a shielding layer, the shape of the shielding layer being aligned with the shape of the first surface, and the shielding layer being electrically connected to the ground terminal of the circuit board. The method also includes removing a portion of the insulating material from the top surface of the ground pad, forming a second groove in the insulating layer, and connecting the second groove to the top surface of the ground pad to expose the top surface of the ground pad. This facilitates subsequent electrical connection between the shielding layer and the ground pad.

[0032] In one implementation, a portion of the insulating material on the top surface of the ground pad is removed, and a second trench is formed in the insulating layer. The second trench is connected to the top surface of the ground pad to expose the top surface of the ground pad. The method then includes filling the second trench with a conductive material to form a first conductive structure, with one end of the first conductive structure connected to the top surface of the ground pad and the other end located on the first surface. In this way, the first conductive structure can be used to achieve electrical connection between the shielding layer and the ground pad.

[0033] In one implementation, a ground pad is mounted on the mounting surface; a circuit board is provided, the circuit board including the mounting surface, electronic components are mounted on the mounting surface, the electronic components include active components and passive components, the active components generating more heat than the passive components, and the further step includes: placing a conductive pad on the ground pad. This allows the conductive pad to electrically connect the shielding layer to the ground pad.

[0034] In one implementation, a shielding material is applied to the first surface to form a shielding layer, the shape of the shielding layer being aligned with the shape of the first surface, and the shielding layer being electrically connected to the ground terminal of the circuit board. This also includes removing insulating material from the top surface of the conductive pad to expose the top surface of the conductive pad, with the top surface of the conductive pad being located on the first surface. This facilitates subsequent electrical connection between the conductive pad and the shielding layer.

[0035] In one implementation, shielding material is applied to the first surface to form a shielding layer, the shape of the shielding layer being aligned with the shape of the first surface, and the shielding layer being electrically connected to the ground terminal of the circuit board. This also includes removing a portion of the insulating material from the top surface of the conductive pad, forming a second groove in the insulating layer, and connecting the second groove to the top surface of the conductive pad to expose the top surface of the conductive pad. This facilitates subsequent electrical connection between the conductive pad and the shielding layer.

[0036] In one implementation, a portion of the insulating material on the top surface of the conductive pad is removed, and a second trench is formed in the insulating layer. The second trench is connected to the top surface of the conductive pad to expose the top surface of the conductive pad. The method then includes: filling the second trench with conductive material to form a first conductive structure, with one end of the first conductive structure connected to the top surface of the conductive pad and the other end located on the first surface. In this way, the conductive pad can be used to reduce the distance between the shielding layer and the grounding pad, thereby preventing the second trench from being too deep, thereby facilitating the filling of the first conductive structure and achieving grounding of the shielding layer.

[0037] In one implementation, the passive component includes a capacitor having a ground terminal. A shielding material is applied to a first surface to form a shielding layer, the shape of the shielding layer matching the shape of the first surface, and the shielding layer is electrically connected to the ground terminal of the circuit board. The method also includes removing insulating material from a top surface of the ground terminal to expose the top surface of the ground terminal, the top surface of the ground terminal being located on the first surface. This allows the shielding layer to be grounded using the capacitor, eliminating the need for an additional grounding structure and facilitating a miniaturized circuit board design.

[0038] In one implementation, the passive component includes a capacitor having a ground terminal; a shielding material is applied to a first surface to form a shielding layer, the shape of the shielding layer being aligned with the shape of the first surface and electrically connected to the ground terminal of the circuit board; and the method also includes removing a portion of insulating material from a top surface of the ground terminal, forming a third groove in the insulating layer, and connecting the third groove to the top surface of the ground terminal to expose the top surface of the ground terminal. This facilitates electrical connection between the shielding layer and the ground terminal.

[0039] In one implementation, a portion of the insulating material on the top surface of the ground terminal is removed, and a third trench is formed in the insulating layer. The third trench is connected to the top surface of the ground terminal to expose the top surface of the ground terminal. The method then includes filling the third trench with a conductive material to form a second conductive structure, with one end of the second conductive structure connected to the top surface of the ground terminal and the other end located on the first surface. In this way, the second conductive structure can be used to achieve an electrical connection between the shielding layer and the ground terminal.

[0040] In one implementation, a circuit board is provided, comprising a mounting surface, on which electronic components are mounted. The electronic components include active components and passive components, wherein the active components generate more heat than the passive components. The method further includes: filling a gap between the bottom surface of the electronic component and the mounting surface with a protective adhesive, the protective adhesive surrounding an electrical connection structure connecting the bottom surface of the electronic component and the mounting surface, the protective adhesive being made of an insulating material; and curing the protective adhesive to form a protective structure. In this manner, the protective structure can be used to protect the connection between the electronic component and the mounting surface.

[0041] In a third aspect, the present application provides a circuit board assembly, comprising a circuit board and a heat dissipation shielding structure as described in the first aspect above; the circuit board comprises a mounting surface, on which electronic components are mounted, the electronic components comprising active components and passive components, the heat generation of the active components being greater than the heat generation of the passive components; an insulating layer covering the mounting surface, the insulating layer covering the side and top surfaces of the passive components, and the insulating layer covering at least the side surfaces of the active components; and the shielding layer being electrically connected to the ground terminal of the circuit board.

[0042] In a fourth aspect, the present application provides an electronic device comprising the circuit board assembly according to the third aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solution of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0044] FIG1 is a circuit board module with a shielding cover provided in this embodiment;

[0045] FIG2 is another circuit board module with a shielding cover provided in this embodiment;

[0046] FIG3 is a schematic structural diagram of a first heat dissipation shielding structure and a circuit board provided in this embodiment;

[0047] FIG4 is an exploded schematic diagram of FIG3 ;

[0048] FIG5 is a schematic structural diagram of an active device provided in this embodiment;

[0049] FIG6 is a schematic structural diagram of a second heat dissipation shielding structure and a circuit board provided in this embodiment;

[0050] FIG7 is an exploded schematic diagram of FIG6 ;

[0051] FIG8 is a schematic structural diagram of a third heat dissipation shielding structure and a circuit board provided in this embodiment;

[0052] FIG9 is an exploded schematic diagram of FIG8 ;

[0053] FIG10 is a schematic structural diagram of a fourth heat dissipation shielding structure and a circuit board provided in this embodiment;

[0054] FIG11 is an exploded view of FIG10 ;

[0055] FIG12 is a schematic structural diagram of a fifth heat dissipation shielding structure and a circuit board provided in this embodiment;

[0056] FIG13 is an exploded view of FIG12;

[0057] FIG14 is a flow chart of a first processing method for the heat dissipation shielding structure provided in this embodiment;

[0058] FIG15 is a diagram showing the first processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board;

[0059] FIG16 is a flow chart of a second method for processing the heat dissipation shielding structure provided in this embodiment;

[0060] FIG17 is a diagram showing the first part of a second processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board;

[0061] FIG18 is a second part of the second processing diagram of the heat dissipation shielding structure provided in this embodiment on a circuit board;

[0062] FIG19 is a flow chart of a third processing method for the heat dissipation shielding structure provided in this embodiment;

[0063] FIG20 is a diagram showing the first part of a third processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board;

[0064] FIG21 is the second part of the third processing diagram of the heat dissipation shielding structure provided by this embodiment on the circuit board;

[0065] FIG. 22 is a partial diagram of the fourth processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board. DETAILED DESCRIPTION

[0066] The following will clearly describe the technical solutions in the embodiments of the present application in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments of the present application, other embodiments obtained by ordinary technicians in this field without making any creative work are all within the scope of protection of this application.

[0067] Hereinafter, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified with "first," "second," etc., may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0068] In addition, in this application, directional terms such as "upper", "lower", "inner" and "outer" are defined relative to the orientation of the components in the drawings. It should be understood that these directional terms are relative concepts. They are used for relative description and clarification, and they can change accordingly according to changes in the orientation of the components in the drawings.

[0069] As a key component within electronic devices, circuit boards (PCBs) perform various functions, including circuit connection, signal transmission, power supply, control, and drive. These functions are primarily achieved through the various electronic components mounted on them. As electronic devices become increasingly versatile, the variety and number of electronic components on PCBs are also increasing.

[0070] During circuit board operation, some electronic components emit electromagnetic waves of various frequencies and intensities. These electromagnetic waves can cause mutual interference between electronic components, generating electromagnetic interference and radio frequency interference, which can affect their proper function. These electromagnetic waves can also affect external electronic devices and users.

[0071] In view of this, the world has strict electromagnetic compatibility control requirements for various electronic equipment before they leave the factory.

[0072] To shield against electromagnetic interference (EMI) and radio frequency interference (RFI), a shielding cover can be placed on a circuit board. This cover can be a metal covering made of copper or other conductive materials. Placed over the electronic components, circuits, assemblies, and entire circuit boards that require shielding, it shields and isolates the electronic components and signals on the circuit board. This prevents external electromagnetic interference from affecting electronic components and prevents electromagnetic waves generated by components within the shielding cover from affecting other devices.

[0073] FIG1 is a circuit board module with a shielding cover provided by this embodiment.

[0074] As shown in FIG. 1 , the circuit board module includes a circuit board 100 and a shielding cover 201 .

[0075] The circuit board 100 includes a mounting surface 110 , on which a plurality of electronic components 120 are disposed.

[0076] Shielding cover 201 is positioned over electronic components 120 and is grounded. Shielding cover 201 can be electrically connected to the ground of circuit board 100 or to the ground of an electronic device via connecting posts 2011. Providing shielding cover 201 on circuit board 100 can help improve the circuit board's anti-interference capabilities, signal integrity, and stability.

[0077] When the circuit board 100 is working, the electronic components 120 on the circuit board 100 will generate heat. When the shielding cover 201 is not provided, the heat generated by the electronic components 120 can be dissipated into the air, thereby reducing the impact of high temperature on the performance of the electronic components 120.

[0078] However, after the shielding cover 201 is provided on the circuit board 100, the shielding cover 201 will affect the heat dissipation of the internal electronic components 120. The main reasons are as follows:

[0079] Restricted air flow: Shielding cover 201 is typically a closed structure, which restricts the free flow of air within the cover. Normally, air flow removes heat generated by electronic components 120, maintaining a stable temperature. However, when shielding cover 201 is present, air flow is hindered, preventing the effective dissipation of heat.

[0080] Heat accumulation: The shielding cover 201 restricts the heat dissipation path, making it easier for heat to accumulate inside the cover. Without adequate heat dissipation measures, such as heat sinks and cooling fans, the heat inside the cover will gradually accumulate, causing the temperature of the electronic components 120 to rise.

[0081] It can be seen that the provision of the shielding cover 201 will affect the heat dissipation of the internal electronic components 120 .

[0082] Furthermore, as the power of electronic components 120 continues to increase and their size gradually decreases, they generate a large amount of heat during operation, resulting in a rapid instantaneous temperature rise. High temperatures can adversely affect the performance of electronic components 120, even causing them to fail. In this case, a heat dissipation structure can be provided on the surface of electronic components 120 to dissipate heat from them.

[0083] However, since the circuit board 100 itself is relatively small and the shielding cover 201 is also relatively small, the space inside the shielding cover 201 is limited and insufficient to set a heat dissipation structure inside the shielding cover 201, making it difficult to achieve heat dissipation, resulting in the electronic component 120 being prone to overheating failure.

[0084] For example, to improve the heat dissipation effect of the electronic components 120 within the shielding cover 201, the height of the shielding cover 201 can be lowered so that taller electronic components 120 can directly contact the shielding cover 201. Since the shielding cover 201 has a better thermal conductivity than air, when the taller electronic components 120 come into contact with the shielding cover 201, the electronic components 120 can directly contact the shielding cover 201 to dissipate heat, thereby improving heat dissipation performance.

[0085] FIG. 2 shows another circuit board module with a shielding cover provided in this embodiment.

[0086] As shown in FIG. 2 , in order to further improve the heat dissipation effect, the circuit board module may further include copper foil 202 , thermal conductive adhesive 203 and graphite 204 .

[0087] An opening is provided at the position of the shielding cover 201 corresponding to the higher electronic component 120, and the opening is covered with a copper foil 202. The copper foil 202 is used to seal the opening to ensure a shielding effect.

[0088] The thermal conductive adhesive 203 is disposed between the copper foil 202 and the surface of the higher electronic component 120 , so that the heat of the electronic component 120 is transferred to the copper foil 202 by the thermal conductive adhesive 203 , thereby improving the heat conduction efficiency.

[0089] The graphite 204 covers the copper foil 202 and the side of the shielding cover 201 facing away from the circuit board 100 to transfer the heat on the copper foil 202 to the graphite 204, thereby increasing the heat exchange area with the air and improving the heat dissipation effect.

[0090] However, the electronic components 120 on the circuit board 100 are typically of varying heights, a problem also faced by the electronic components 120 within the shielding cover 201. The shielding cover 201 is typically a regularly shaped housing, with the side of the shielding cover 201 facing the circuit board 100 parallel to the mounting surface 110 of the circuit board 100. This results in a fixed height for the shielding cover 201, which means that only the tallest electronic components 120 can directly contact the shielding cover 201. Shorter electronic components 120 within the shielding cover 201 are still surrounded by the air within the shielding cover 201, resulting in poor heat dissipation for the shorter electronic components 120.

[0091] To sum up, in order to achieve shielding protection for electronic components 120 while taking into account the heat dissipation effect of electronic components 120 at different heights within the shielding cover 201, the present application provides a heat dissipation shielding structure 300 and its processing method, circuit board assembly, and electronic equipment. The heat dissipation shielding structure 300 can improve the heat dissipation effect of electronic components 120 at different heights on the circuit board 100, extend the service life of the electronic components 120, and improve the working stability of the circuit board 100.

[0092] FIG3 is a schematic structural diagram of a first heat dissipation shielding structure and a circuit board provided in this embodiment.

[0093] FIG4 is an exploded schematic diagram of FIG3 .

[0094] As shown in FIG. 3 and FIG. 4 , the circuit board 100 includes a mounting surface 110 , on which various electronic components 120 are mounted, so as to utilize the electronic components 120 to achieve functional requirements of the circuit board 100 .

[0095] The electronic component 120 can be mounted on the mounting surface 110 by using surface mount technology (SMT) to achieve the installation and connection between the electronic component 120 and the circuit board 100 .

[0096] For example, solder balls or solder columns can be placed at designated locations on mounting surface 110, heated and melted, and then electronic component 120 can be connected to the melted solder balls or solder columns. After cooling, the solder balls or solder columns form electrical connection structures 130 between electronic component 120 and circuit board 100. Electrical connection structures 130 can secure electronic component 120 and also provide electrical connection between electronic component 120 and circuit board 100.

[0097] It is worth noting that, in other implementations, the electronic component 120 may also be assembled to the circuit board 100 in an insert-type manner. In this embodiment, the connection and fixation of the electronic component 120 and the circuit board 100 are not limited.

[0098] The electronic components 120 include active components 121 and passive components 122 .

[0099] Active devices 121 are electronic devices that can actively input and output electrical energy or signals. They can amplify, control, and regulate current and voltage through specific semiconductor materials and design structures. Active devices 121 may include NOR flash memory, system-on-chip (SoC), codec IC, charger chip, Bluetooth chip, radio frequency chip, wireless LAN (Wi-Fi) chip, near field communication (NFC) chip, power system monitoring and management unit (PMU), etc.

[0100] FIG5 is a schematic structural diagram of an active device provided in this embodiment.

[0101] As shown in FIG. 5 , illustratively, taking the active device 121 provided on the circuit board 100 including a SoC chip as an example, the active device 121 may include a processor 1211 and a memory 1212 that are stacked in sequence.

[0102] The processor 1211 is connected to the circuit board 100 . As a main computing engine, the processor 1211 can execute instructions and handle various tasks.

[0103] The memory 1212 is electrically connected to the processor 1211 for storing program codes, data and temporary variables. The memory 1212 may include a random access memory 1212 (RAM) and a read-only memory 1212 (ROM).

[0104] The active device 121 may further include an external interface, such as a Universal Serial Bus (USB), Ethernet, wireless communication (such as Bluetooth, WiFi), etc.

[0105] Optionally, the active device 121 may further include a controller, an input / output interface, a power management module, and other functional modules, which may be adjusted according to the actual function of the active device 121 and are not limited in this embodiment.

[0106] Passive components 122 refer to electronic components that cannot actively input or output electrical energy or signals, and may include resistors, capacitors, inductors, diodes, photosensitive devices, transistors, and the like.

[0107] During the operation of circuit board 100, active devices 121 typically need to perform operations such as calculations, control, and energy conversion, resulting in higher power consumption. This results in the active devices 121 generating more heat than the passive devices 122. As can be seen, active devices 121 are the primary source of heat generated during operation of circuit board 100. When dissipating heat from circuit board 100, improving the heat dissipation of active devices 121 can be prioritized.

[0108] It is worth noting that a circuit board 100 can be provided with multiple active devices 121 and multiple passive devices 122. The specific types and quantities of the active devices 121 and passive devices 122 provided therein can be adjusted according to the actual functions of the circuit board 100 and are not limited in this embodiment.

[0109] Please refer to FIG. 3 and FIG. 4 again. In a first aspect, the present application provides a heat dissipation shielding structure 300 . The heat dissipation shielding structure 300 includes an insulating layer 310 and a shielding layer 320 stacked in sequence.

[0110] To facilitate the description of the positions of various structures within the heat shield structure 300, this application exemplarily establishes a coordinate system based on the circuit board 100. As shown in Figures 3 and 4, the thickness direction of the circuit board 100 (the height direction of the electronic component 120) is set as the z-axis direction, where the z-axis is also the stacking direction of the insulation layer 310 and the shielding layer 320. The length direction of the circuit board 100 is set as the x-axis direction.

[0111] The active components 121 and passive components 122 on the circuit board 100 each have side surfaces, a top surface, and a bottom surface. The side of the active component 121 facing and connected to the mounting surface 110 is defined as the bottom surface. The side opposite the bottom surface along the z-axis is defined as the top surface. The surface between the bottom and top surfaces is defined as the side surface. The same applies to the passive component 122.

[0112] For example, if the active device 121 has a cubic structure, it has one top surface and one bottom surface, and the side surfaces are the four circumferential side surfaces between the top and bottom surfaces. If the active device 121 has a cylindrical structure, it has one top surface and one bottom surface, and the side surfaces are the curved surfaces between the top and bottom surfaces. The same applies to the passive device 122.

[0113] It can be understood that in this embodiment, in order to facilitate the description of the internal structure of the circuit board 100 and the heat dissipation shielding structure 300, the structure provided in the accompanying drawings is a structural schematic diagram after the circuit board 100 and the heat dissipation shielding structure 300 are cut using a plane parallel to the xz plane.

[0114] As shown in FIG. 3 and FIG. 4 , the insulating layer 310 covers the mounting surface 110 to be connected to the circuit board 100 .

[0115] The insulating layer 310 covers the side and top surfaces of the passive device 122 . At the same time, the insulating layer 310 covers the side and top surfaces of the active device 121 . In this way, the insulating layer 310 can be used to isolate the active devices 121 and the passive devices 122 to avoid short circuits.

[0116] When the insulating layer 310 covers the side and top surfaces of the active components 121, the side of the insulating layer 310 facing away from the mounting surface 110 forms a first surface 311. This first surface 311 fluctuates with the height of the electronic components 120. Specifically, the first surface 311 fluctuates with the height of the active and passive components 121, 122 on the circuit board 100, enabling the insulating layer 310 to achieve conformal coverage. While the insulating layer 310 covers the active and passive components 121, 122, it also prevents the insulating layer 310 from becoming excessively thick on the surfaces of shorter electronic components 120. This not only saves local z-direction space but also improves heat dissipation from shorter electronic components 120.

[0117] Optionally, the thickness of the insulating layer 310 may be no less than 10 μm, so as to cover and isolate the electronic component 120 , thereby avoiding a short circuit.

[0118] For example, to facilitate heat dissipation from the electronic components 120 on the circuit board 100, the insulating layer 310 can be made of a material with a thermal conductivity greater than that of air, such as polyimide, epoxy resin, polyethylene naphthalate, polytetrafluoroethylene, or polyvinyl chloride. In this way, the insulating layer 310 can be used to improve the efficiency of heat dissipation from the electronic components 120, thereby enhancing the heat dissipation effect.

[0119] Alternatively, the insulating layer 310 can be laminated onto the mounting surface 110 and the top surface of the electronic components 120 using high-temperature vacuum lamination. This allows the insulating layer 310 to rise and fall with the height of the electronic components 120 on the circuit board 100, achieving conformal coverage. This allows for uniform coverage of electronic components 120 at varying heights, improving heat dissipation for all electronic components 120 at varying heights.

[0120] Alternatively, the insulating layer 310 can be coated on the mounting surface 110 and the top surface of the electronic components 120 by spraying insulating adhesive. This allows the insulating layer 310 to rise and fall with the height of the electronic components 120 on the circuit board 100, achieving conformal coverage. This allows for uniform heat dissipation of electronic components 120 at different heights, thereby simultaneously improving the heat dissipation effect of electronic components 120 at different heights.

[0121] The shielding layer 320 covers the first surface 311. The shape of the shielding layer 320 matches that of the first surface 311, and the shielding layer 320 is electrically connected to the ground terminal of the circuit board 100. Thus, the shielding layer 320 not only provides a shielding cover 201 for the electronic components 120, but also ensures that the undulations of the shielding layer 320 match those of the insulating layer 310. Furthermore, since the thermal conductivity of the shielding layer 320 is typically 2-380 W / m·K, it has excellent thermal conductivity and can better transfer heat from the various electronic components 120 on the circuit board 100, thereby improving heat dissipation.

[0122] It is worth noting that the shape of the shielding layer 320 matches the shape of the first surface 311, which can be understood as the undulation trend of the shielding layer 320 being the same as the undulation trend of the first surface 311. Since the shielding layer 320 has a certain thickness compared to the first surface 311, if the thickness of the shielding layer 320 is very small, the shape of the shielding layer 320 may be consistent with the shape of the first surface 311; if the thickness of the shielding layer 320 is slightly greater, the shape of the shielding layer 320 may be similar to the shape of the first surface 311.

[0123] Comparing Figures 2 and 3 , we can see that the shielding cover 201 in Figure 2 is of a regular shape. Consequently, the shielding cover 201 can only contact the tallest electronic component 120 on the circuit board 100. However, the shorter electronic components 120 on the circuit board 100 are located farther away from the shielding cover 201, resulting in a longer path for heat transfer from the electronic components 120 to the shielding cover 201. This not only makes it difficult for the shorter electronic components 120 to dissipate heat, but also wastes space in the z-direction.

[0124] The shape of the shielding layer 320 in FIG3 matches the shape of the first surface 311, and the shielding layer 320 can be simultaneously close to electronic components 120 at different heights on the circuit board 100. This can save local z-direction space and shorten the path for electronic components 120 at different heights to transfer heat to the shielding layer 320, thereby facilitating heat dissipation for electronic components 120 at different heights and comprehensively improving the heat dissipation effect of electronic components 120 at different heights.

[0125] Furthermore, the thermal conductivity of the insulating layer 310 is typically 0.2-10 W / m·K, while the thermal conductivity of air is approximately 0.024 W / m·K. It can be seen that the thermal conductivity of air is much lower than that of the insulating layer 310. Providing the insulating layer 310 between the shielding layer 320 and the electronic components 120 not only isolates the electronic components 120 but also facilitates heat conduction through the insulating layer 310, thereby improving the efficiency of heat conduction between the electronic components 120 and the shielding layer 320, thereby enhancing the heat dissipation effect on the electronic components 120 on the circuit board 100.

[0126] Exemplarily, shielding layer 320 may be a metal film or a conductive film formed from a mixture of a resin material and metal particles. The metal may be a single metal, such as copper, nickel, chromium, aluminum, silver, or gold, or an alloy or composite. The thermal conductivity of the metal film is approximately 380 W / m·K, while the thermal conductivity of a conductive film formed from a resin material with metal particles is approximately 2.5 W / m·K. It is understood that the material of shielding layer 320 can be selected based on actual heat dissipation needs and is not limited in this embodiment.

[0127] Optionally, the shielding layer 320 may have a thickness of 1-50 μm.

[0128] Exemplarily, the shielding layer 320 may be covered on the first surface 311 by high-temperature vacuum lamination, spraying, sputtering, etc., which is not limited in this embodiment.

[0129] In the embodiment provided herein, the insulating layer 310 and the shielding layer 320 are arranged to fluctuate with the height of the electronic components 120, so that the distance between the top surface of each electronic component 120 and the shielding layer 320 is similar. This allows the heat of each electronic component 120 to be transferred to the shielding layer 320 as quickly as possible, thereby improving the heat dissipation effect. Furthermore, because the thermal conductivity of the insulating layer 310 is greater than that of air, providing the insulating layer 310 between the shielding layer 320 and the electronic components 120 not only achieves insulation isolation of each electronic component 120, but also improves the heat conduction efficiency between the electronic components 120 and the shielding layer 320, thereby improving the heat dissipation effect.

[0130] Compared to the passive device 122, the active device 121 generates more heat during operation. Furthermore, since the thermal conductivity of the shielding layer 320 is generally greater than that of the insulating layer 310, if the active device 121 can transfer heat to the shielding layer 320 as quickly as possible, the heat transfer efficiency of the active device 121 to the shielding layer 320 can be further improved, thereby enhancing the heat dissipation effect of the active device 121.

[0131] FIG6 is a schematic structural diagram of a second heat dissipation shielding structure and a circuit board provided in this embodiment.

[0132] FIG7 is an exploded schematic diagram of FIG6 .

[0133] As shown in Figures 6 and 7, in one implementation, when the insulating layer 310 covers the top and side surfaces of the active device 121, a first groove 312 can be provided in the insulating layer 310. The first groove 312 is located between the top surface of the active device 121 and the shielding layer 320. The first groove 312 extends through both sides of the insulating layer 310 in a direction perpendicular to the mounting surface 110 (such as the z-axis direction in Figure 6) and connects the top surface of the active device 121 with the shielding layer 320. In this way, the shielding layer 320 can be connected to the top surface of the active device 121 through the first groove 312, thereby improving the efficiency of heat transfer from the active device 121 to the shielding layer 320 and further enhancing the heat dissipation effect on the active device 121.

[0134] Furthermore, if the active device 121 is relatively small along the x-axis, one or two first trenches 312 may be provided on the insulating layer 310 corresponding to the top surface of the active device 121. If the active device 121 is relatively large along the x-axis, multiple first trenches 312, such as three or four, may be provided on the insulating layer 310 corresponding to the top surface of the active device 121. In this way, by providing as many first trenches 312 as possible while ensuring sufficient space for providing the first trenches 312, the heat conduction efficiency is improved, thereby further enhancing the heat dissipation effect of the active device 121.

[0135] Optionally, the first trench 312 may be formed by laser etching, plasma etching, etc. Along the x-axis direction, the dimension of the first trench 312 on a side close to the top surface of the active device 121 may be greater than or equal to 0.1 mm.

[0136] In one example, the heat dissipation shielding structure 300 further includes a heat conducting structure 330 .

[0137] The heat-conducting structure 330 is embedded in the first groove 312. One end of the heat-conducting structure 330 is connected to the top surface of the active device 121, and the other end is connected to the shielding layer 320. In this way, the heat of the active device 121 can be transferred to the shielding layer 320 through the heat-conducting structure 330, thereby improving the heat dissipation effect of the active device 121.

[0138] Generally speaking, the thermal conductivity of the thermally conductive structure 330 is greater than or equal to 5 W / m·K, indicating good thermal conductivity. By filling the first trench 312 with the thermally conductive structure 330, and by ensuring that the thermal conductivity of the thermally conductive structure 330 is greater than that of the insulating layer 310, the thermally conductive structure 330 can improve the heat conduction efficiency between the active device 121 and the shielding layer 320, thereby enhancing the heat dissipation effect on the active device 121.

[0139] Optionally, the thermal conductive structure 330 may be made of thermal conductive paste, metal particles, thermal conductive gel, etc., which is filled in the first groove 312 . The thermal conductive paste may be silver paste, alloy thermal conductive paste, graphene thermal conductive paste, etc.

[0140] If the heat-conducting structure 330 is made of a material that is liquid at high temperatures, such as a thermally conductive paste or gel, the liquid can be directly filled into the first groove 312 and allowed to solidify to form the heat-conducting structure 330. If the heat-conducting structure 330 is made of metal particles, the metal particles can be melted at high temperatures and then filled, or the metal particles can be directly placed in the first groove 312.

[0141] For example, since the heat-conducting structure 330 is formed by filling the first groove 312, it can be seen that the shape of the heat-conducting structure 330 can change according to the shape of the first groove 312. If the first groove 312 has a truncated cone structure, the heat-conducting structure 330 filled in the first groove 312 is also a truncated cone structure. If the first groove 312 has a cylindrical structure, the heat-conducting structure 330 filled in the first groove 312 is also a cylindrical structure. If the first groove 312 has a prismatic structure, the heat-conducting structure 330 filled in the first groove 312 is also a prismatic structure. It will be understood that in this embodiment, the shapes of the first groove 312 and the heat-conducting structure 330 are not limited.

[0142] In another example, if the insulating layer 310 on the top surface of the active device 121 is provided with a first trench 312, in addition to providing the heat-conducting structure 330 in the first trench 312, the first trench 312 can also be directly used to form the first surface 311. In this way, the shielding layer 320 can be recessed in the first trench 312 or the shielding layer 320 can be raised in the first trench 312, so that the shielding layer 320 itself can fill the first trench 312 and contact the top surface of the active device 121, thereby achieving direct contact between the top surface of the active device 121 and the shielding layer 320, thereby improving the heat dissipation effect of the active device 121.

[0143] FIG8 is a schematic structural diagram of a third heat dissipation shielding structure and a circuit board provided in this embodiment.

[0144] FIG9 is an exploded schematic diagram of FIG8 .

[0145] As shown in Figures 8 and 9 , in another implementation, an insulating layer 310 covers the side surfaces of the active device 121. In this case, the insulating layer 310, on the side facing away from the mounting surface 110, forms a first surface 311 with the top surface of the active device 121. The shielding layer 320 covers the top surface of the active device 121. This allows the shielding layer 320 covering the first surface 311 to directly contact the top surface of the active device 121, further improving heat dissipation for the active device 121.

[0146] As shown in Figures 8 and 9, the heat shielding structure 300 further includes a graphite layer 340. The graphite layer 340 covers the side of the shielding layer 320 facing away from the first surface 311. This allows the heat from the shielding layer 320, corresponding to the location of the active device 121, to be quickly dispersed to the surface of the graphite 204 by utilizing the heat-dissipating effect of the graphite layer 340. This reduces the local temperature of the shielding layer 320, avoids the generation of hot and cold spots, and thus improves the heat dissipation effect on the active device 121. It also reduces the generation of thermal stress and prevents deformation of the shielding layer 320.

[0147] Exemplarily, the side of the graphite layer 340 facing away from the shielding layer 320 is flat, and the dimensions of the graphite layer 340 along the z-axis vary at various locations along the x-axis, allowing the graphite layer 340 to cover various locations on the shielding layer 320, thereby improving heat dissipation. If the graphite layer 340 were not provided, the side of the shielding layer 320 facing away from the first surface 311 would be the primary heat dissipation surface for heat exchange with the air. However, the provision of the graphite layer 340 allows both the side of the graphite layer 340 facing away from the shielding layer 320 and the side surface of the graphite layer 340 to form heat dissipation surfaces. This allows the graphite layer 340 to increase the heat exchange area and improve heat conduction efficiency, thereby achieving more efficient heat conduction and heat dissipation.

[0148] For example, the thickness of the graphite layer 340 may be 30-100 μm. The thickness of the graphite layer 340 may be different depending on the electronic components 120 of different heights.

[0149] 8 and 9 , in some implementations, the heat dissipation shielding structure 300 further includes a thermally conductive gel 350 . The thermally conductive gel 350 is disposed between the graphite layers 340 of the shielding layer 320 .

[0150] Since the shielding layer 320 and the insulating layer 310 are conformally covered, the insulating layer 310 and the shielding layer 320 may have large fluctuations at local locations in the gap between two adjacent electronic components 120 or due to the height difference between two adjacent electronic components 120 .

[0151] When the graphite layer 340 covers the shielding layer 320 , the graphite layer 340 may not completely fill the undulating portion of the shielding layer 320 , resulting in an air gap between the shielding layer 320 and the graphite layer 340 , which affects the heat conduction efficiency.

[0152] By placing thermally conductive gel 350 between graphite layer 340 and shielding layer 320, the fluidity of thermally conductive gel 350 can be utilized to fill the areas with larger fluctuations in shielding layer 320, thereby preventing the formation of air gaps. This improves heat conduction efficiency and heat dissipation by leveraging the greater thermal conductivity of thermally conductive gel 350 than that of air.

[0153] For example, the shielding layer 320 forms recesses 321 at locations with greater undulations. These recesses 321 are typically located near the edges of the electronic component 120 and recessed toward the insulating layer 310. Along the z-axis, the depth of the recesses 321 is typically deeper than at other locations. When covered with the graphite layer 340, it is difficult for the graphite layer 340 to completely fill the recesses 321, resulting in air gaps. The thermally conductive gel 350 fills at least the recesses 321 to prevent air gaps, improve heat conduction efficiency, and enhance heat dissipation.

[0154] As shown in FIG8 , thermally conductive gel 350 may be disposed at one location between shielding layer 320 and graphite layer 340. Alternatively, as shown in FIG6 , thermally conductive gel 350 may be disposed at two locations between shielding layer 320 and graphite layer 340. Alternatively, thermally conductive gel 350 may be disposed at all locations between shielding layer 320 and graphite layer 340 to form a thermally conductive gel layer. This reduces the undulation of the shielding layer 320 on the side facing away from first surface 311, thereby facilitating a close fit of graphite layer 340.

[0155] It is understandable that the location and area of ​​the thermal conductive gel 350 can be adjusted according to actual conditions, and are not limited in this embodiment.

[0156] 8 and 9 , in some implementations, the heat dissipation shielding structure 300 further includes a protection structure 360 ​​.

[0157] The protection structure 360 ​​fills the gap between the bottom surface of the electronic component 120 and the mounting surface 110 . The protection structure 360 ​​surrounds the electrical connection structure 130 and is connected to the electronic component 120 and the circuit board 100 .

[0158] When insulating layer 310 is applied to mounting surface 110, if the insulating material's fluidity is low, a certain air gap will form between the bottom of electronic component 120 and mounting surface 110. The provision of protective structure 360 ​​can avoid this problem. In other words, by pre-filling the gap between electronic component 120 and mounting surface 110 with protective structure 360, the fluidity requirements of the insulating material can be reduced.

[0159] At the same time, because the protective structure 360 ​​surrounds the electrical connection structure 130, the protective structure 360 ​​can also improve the reliability of the electrical connection structure 130. If the electrical connection structure 130 is subjected to external forces and is about to deform, the protective structure 360 ​​can absorb some of the external forces, thereby reducing the possibility of deformation of the electrical connection structure 130.

[0160] Furthermore, the formation of the insulating layer 310, shielding layer 320, and graphite layer 340 may exert downward pressure on the electronic component 120. The electronic component 120 is primarily connected to the mounting surface 110 via the connection structure. To prevent excessive downward pressure from crushing the connection structure, a protective structure 360 ​​may be placed between the bottom of the electronic component 120 and the mounting surface 110. This protective structure 360 ​​surrounds the connection structure, supporting and protecting the electronic component 120.

[0161] Optionally, in order to prevent the protection structure 360 ​​from affecting the electrical connection between the electronic component 120 and the circuit board 100 , the protection structure 360 ​​should be made of an insulating material to achieve insulation protection for each electrical connection structure 130 .

[0162] For example, the material of the protective structure 360 ​​can be underfill (UF glue). The underfill can be silicone, polyurethane glue, acrylic glue, etc. When the UF glue is in liquid form, it can easily fill the gap between the bottom of the electronic component 120 and the mounting surface 110, thereby surrounding the connection structure. After the filling is completed, the UF glue can be cured to form a solid protective structure 360 ​​to support the electronic component 120.

[0163] At the same time, the modulus of the bottom filler is small, and it acts as a buffer between the chip, solder joints, and PCB, thereby improving the reliability of the solder joints (preventing cracking); during the process of setting the insulating layer 310, the shielding layer 320 or the graphite layer 340, it will not be affected by the high temperature environment and expand, so as to avoid the expansion stress between the bottom of the electronic component 120 and the mounting surface 110 due to the expansion, thereby further improving the connection stability between the electronic component 120 and the mounting surface 110.

[0164] Continuing with Figures 8 and 9 , in some implementations, a ground pad 140 is mounted on the mounting surface 110 of the circuit board 100, and the shielding layer 320 is electrically connected to the ground pad 140. By utilizing the ground pad 140 on the mounting surface 110, the shielding layer 320 eliminates the need for additional grounding structures. This facilitates the simplification of the circuit board 100 and the heat shielding structure 300 while also facilitating a miniaturized design of the circuit board 100.

[0165] As shown in FIG8 and FIG9 , in the first implementation, the insulating layer 310 is provided with a second groove 313 . The second groove 313 is located between the top surface of the ground pad 140 and the shielding layer 320 , and connects the top surface of the ground pad 140 with the shielding layer 320 .

[0166] It is understandable that the formation method of the second groove 313 can refer to the first groove 312, and the size of the second groove 313 can refer to the first groove 312, which will not be repeated here.

[0167] The second trench 313 is filled with a first conductive structure 370 , which is electrically connected to the ground pad 140 and the shielding layer 320 .

[0168] In one example, one end of the first conductive structure 370 is connected to the top surface of the ground pad 140, and the other end is connected to the shielding layer 320. In this way, the first conductive structure 370 can be used to achieve an electrical connection between the shielding layer 320 and the ground pad 140. Furthermore, the provision of the first conductive structure 370 can reduce the grounding space of the shielding layer 320, thereby reducing the area occupied on the mounting surface 110 and facilitating a miniaturized design of the circuit board 100.

[0169] The material of the first conductive structure 370 can be conductive paste, such as silver paste, carbon paste, copper paste, gold paste, conductive glue, etc.

[0170] The first conductive structure 370 can be formed in the second groove 313 by spraying, printing, or the like.

[0171] As shown in FIG2 , when a shielding cover 201 having a regular shape is grounded to the circuit board 100, the shielding cover 201 can be connected to the grounding pad 140 on the circuit board 100 via the connecting posts 2011 on the shielding cover 201. However, because the shielding cover 201 is typically an integrally formed structure and is affected by the manufacturing process, the dimension w1 of the connecting posts 2011 along the x-axis is typically 0.4-0.5 mm, which results in the dimension w2 of the grounding pad 140 being at least 0.5 mm larger.

[0172] As shown in Figures 8 and 9, the first conductive structure 370 is formed by filling the second groove 313. The size of the first conductive structure 370 depends on the size of the second groove 313. The second groove 313 can be formed by laser etching or plasma etching. In this case, the minimum dimension w3 of the second groove 313 on the ground pad 140 along the x-axis can be 0.1 mm. In other words, the minimum dimension of the first conductive structure 370 can be 0.1 mm. Taking into account processing errors, the dimension w4 of the ground pad 140 along the x-axis can be 0.2 mm, which can significantly reduce the size of the ground pad 140, thereby reducing the space occupied by the mounting surface 110 of the circuit board 100.

[0173] In addition, there are electronic components 120 around the connecting column 2011 in Figure 2. When connecting the connecting column 2011 to the ground pad 140, the connecting column 2011 may damage the electronic components 120 close to the ground pad 140, thereby reducing the product yield.

[0174] Compared to the structure in Figure 2 , the first conductive structure 370 in Figure 8 is surrounded by an insulating layer 310, and the electronic components 120 adjacent to the first conductive structure 370 are also surrounded by the insulating layer 310. The insulating layer 310 also protects the electronic components 120, preventing any impact on the surrounding electronic components 120 during the formation of the second trench 313 and the first conductive structure 370. This improves product yield, thereby enhancing the safety and reliability of the circuit board 100 and the heat shielding structure 300.

[0175] FIG10 is a schematic structural diagram of a fourth heat dissipation shielding structure and a circuit board provided in this embodiment.

[0176] FIG11 is an exploded view of FIG10 .

[0177] As shown in FIG. 10 and FIG. 11 , in another example, the heat dissipation shielding structure 300 further includes a conductive pad 380 .

[0178] The conductive pad 380 is disposed on the top surface of the ground pad 140 , and the insulating layer 310 covers the side surfaces and the top surface of the conductive pad 380 .

[0179] The second trench 313 is located between the top surface of the conductive block 380 and the shielding layer 320 , and connects the top surface of the conductive block 380 with the shielding layer 320 .

[0180] The second trench 313 is filled with a first conductive structure 370, one end of which is connected to the top surface of the conductive spacer 380, and the other end is connected to the shielding layer 320. In this way, the conductive spacer 380 can be used to reduce the distance between the shielding layer 320 and the ground pad 140, thereby preventing the second trench 313 from being too deep. This facilitates filling the first conductive structure 370 and achieves grounding of the shielding layer 320.

[0181] Optionally, the conductive pad 380 may be a tin block, a copper block, a silver block, a carbon block, a conductive glue block, or the like.

[0182] Please refer to FIG. 10 and FIG. 11 again. In the second implementation, the heat dissipation structure further includes a conductive pad 380 .

[0183] The conductive pad 380 is disposed on the top surface of the ground pad 140, the insulating layer 310 covers the side of the conductive pad 380, the top surface of the conductive pad 380 is located on the first surface 311, and the shielding layer 320 is connected to the conductive pad 380. It can be seen that along the z-axis, when the dimensions of the conductive pad 380, the top surface of the ground pad 140, and the first surface 311 are the same, the top surface of the conductive pad 380 can be located on the first surface 311. In this way, when the conductive pad 380 can be used to achieve an electrical connection between the shielding layer 320 and the ground pad 140, the shielding layer 320 can directly contact the top surface of the conductive pad 380, without the need for the first conductive structure 370.

[0184] FIG12 is a schematic structural diagram of a fifth heat dissipation shielding structure and a circuit board provided in this embodiment.

[0185] FIG13 is an exploded view of FIG12 .

[0186] As shown in FIG. 12 and FIG. 13 , in the third implementation, the insulating layer 310 is provided with a second groove 313 . The second groove 313 is located between the top surface of the ground pad 140 and the shielding layer 320 , and connects the top surface of the ground pad 140 with the shielding layer 320 .

[0187] In one example, the shielding layer 320 includes a main body portion 322 and a first conductive portion 323 .

[0188] The main body portion 322 covers the first surface 311 , and the shape of the main body portion 322 matches the shape of the first surface 311 .

[0189] The first conductive portion 323 fills the second groove 313, one end of the first conductive portion 323 is connected to the main body 322, and the other end is connected to the top surface of the ground pad 140. In this way, the shielding layer 320 can be directly connected to the ground pad 140 through the second groove 313, so that the shielding layer 320 can be grounded.

[0190] For example, in order to facilitate the simultaneous formation of the main body portion 322 and the first conductive portion 323 , the shielding layer 320 may be formed on the first surface 311 by spraying or sputtering.

[0191] In another example, the insulating layer 310 is provided with a second groove 313, which is located between the top surface of the ground pad 140 and the shielding layer 320, and connects the top surface of the ground pad 140 with the shielding layer 320. In this case, the shielding layer 320 can be bent or recessed directly toward the second groove 313 to connect to the top surface of the ground pad 140. While achieving a direct connection between the shielding layer 320 and the ground pad 140, it also avoids adding additional structures, facilitating processing.

[0192] For example, in order to facilitate bending and recessing toward the second groove 313 , the shielding layer 320 may be formed on the first surface 311 by high-temperature vacuum pressing.

[0193] Please refer to FIG. 10 and FIG. 11 again. In the fourth implementation, the passive component 122 includes a capacitor 150 .

[0194] The capacitor 150 has a ground terminal 151, and the shielding layer 320 is electrically connected to the ground terminal 151. In this way, the capacitor 150 can be used to ground the shielding layer 320 without the need for an additional grounding structure, which helps to achieve a miniaturized design of the circuit board 100.

[0195] In one example, the insulating layer 310 is provided with a third groove 314 . The third groove 314 is located between the top surface of the ground terminal 151 and the shielding layer 320 , and connects the top surface of the ground terminal 151 with the shielding layer 320 .

[0196] It is understandable that the formation method of the third trench 314 can refer to the first trench 312, and the size of the third trench 314 can refer to the first trench 312, which will not be repeated here.

[0197] The third trench 314 is filled with a second conductive structure 390, one end of which is connected to the top surface of the ground terminal 151 and the other end is connected to the shielding layer 320. In this way, the second conductive structure 390 can be used to achieve electrical connection between the shielding layer 320 and the ground terminal 151.

[0198] It is worth noting that the material, formation method and size of the second conductive structure 390 can refer to the first conductive structure 370 and will not be repeated here.

[0199] Please refer to FIG. 12 and FIG. 13 again. In another example, the insulating layer 310 is provided with a third groove 314 . The third groove 314 is located between the top surface of the ground terminal 151 and the shielding layer 320 , and connects the top surface of the ground terminal 151 with the shielding layer 320 .

[0200] The shielding layer 320 includes a main body portion 322 and a second conductive portion 324 .

[0201] The main body portion 322 covers the first surface 311 , and the shape of the main body portion 322 matches the shape of the first surface 311 .

[0202] The second conductive portion 324 fills the third groove 314, one end of the second conductive portion 324 is connected to the main body 322, and the other end is connected to the top surface of the ground terminal 151. In this way, the shielding layer 320 can be directly connected to the ground terminal 151 to achieve grounding of the shielding layer 320.

[0203] For example, in order to facilitate the simultaneous formation of the main body portion 322 and the second conductive portion 324 , the shielding layer 320 may be formed on the first surface 311 by spraying or sputtering.

[0204] In another example, the insulating layer 310 is provided with a third groove 314, which is located between the top surface of the ground terminal 151 and the shielding layer 320, and connects the top surface of the ground terminal 151 with the shielding layer 320. In this case, the shielding layer 320 can be bent or recessed directly toward the third groove 314 to connect to the top surface of the ground terminal 151. While achieving a direct connection between the shielding layer 320 and the ground terminal 151, it also avoids adding additional structures, facilitating processing.

[0205] For example, in order to facilitate bending and recessing toward the third groove 314 , the shielding layer 320 may be formed on the first surface 311 by high-temperature vacuum pressing.

[0206] FIG14 is a flow chart of a first processing method of the heat dissipation shielding structure provided in this embodiment.

[0207] FIG15 is a diagram showing the first processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board.

[0208] As shown in FIG. 14 and FIG. 15 , this embodiment provides a method for processing a heat dissipation shielding structure 300 , including:

[0209] Step S401: providing a circuit board 100.

[0210] The circuit board 100 includes a mounting surface 110 , on which electronic components 120 are mounted. The electronic components 120 include active components 121 and passive components 122 . The heat generated by the active components 121 is greater than that of the passive components 122 .

[0211] Step S402 : Covering the mounting surface 110 with an insulating material. The insulating material covers the side surfaces and top surfaces of the passive components 122 , and at least covers the side surfaces of the active components 121 , to form an insulating layer 310 .

[0212] When forming the insulating layer 310, the insulating layer 310 can form a first surface 311 on the side facing away from the mounting surface 110, or the insulating layer 310 can form the first surface 311 together with the top surface of the active device 121 on the side facing away from the mounting surface 110. In this way, the insulating layer 310 can be used to insulate and isolate the electronic components 120 on the circuit board 100, and can also be used to improve the thermal conductivity of each electronic component 120.

[0213] At the same time, the first surface 311 fluctuates with the height of the electronic components 120. This allows the insulating layer 310 to conform to the shape of each electronic component 120, thereby reducing the z-direction space occupied by the insulating layer 310, thereby facilitating the miniaturization of the circuit board 100 and the shielding and heat dissipation structure.

[0214] In one implementation, the insulating material may be an insulating film.

[0215] After obtaining the circuit board 100 with the electronic components 120 mounted thereon, a high temperature environment, such as 120-150° C., may be provided for the insulating film to heat the insulating film and thereby soften the insulating film.

[0216] After the insulating film softens, vacuum lamination technology can be used to press the softened insulating film against the surface of the electronic components 120 using a soft surface lamination structure. Simultaneously, a vacuum is drawn on the circuit board 100 side to allow the softened insulating film to fill the gap between adjacent electronic components 120. In this way, the insulating film can cover the side and top surfaces of the passive components 122, while also covering the side and top surfaces of the active components 121, to form an insulating layer 310.

[0217] Optionally, before the insulating film is heated, the thickness of the insulating film is 20-300 μm, which can prevent the insulating film from being damaged during subsequent pressing and vacuum processes, thereby achieving continuous coverage of the insulating film.

[0218] In another implementation, the insulating material may be insulating glue.

[0219] After obtaining the circuit board 100 with the electronic components 120 installed, the insulating glue can be sprayed on the side and top surfaces of the passive components 122 and the side and top surfaces of the active components 121 to form an insulating layer 310.

[0220] Optionally, the minimum thickness of the insulating layer 310 on the top surface or side surface of the electronic component 120 should be no less than 10 μm to prevent the insulating layer 310 from being damaged during subsequent operations, thereby affecting the insulation performance.

[0221] Optionally, the insulating layer 310 may be made of a material having a thermal conductivity greater than that of air, such as polyimide, epoxy resin, polyethylene naphthalate, polytetrafluoroethylene, or polyvinyl chloride.

[0222] Step S403 : Covering the first surface 311 with a shielding material to form a shielding layer 320 , making the shape of the shielding layer 320 match the shape of the first surface 311 , and making the shielding layer 320 electrically connected to the ground terminal of the circuit board 100 .

[0223] The shape of the shielding layer 320 matches the first surface 311, allowing the shielding layer 320 to conform to the insulating layer 310. Furthermore, the conformal coverage of the insulating layer 310 ensures that electronic components 120 of different heights are at similar distances from the shielding layer 320, thereby preventing taller components from being close to the shielding layer 320 and shorter components from being far away from it.

[0224] Optionally, the shielding layer 320 may have a thickness of 1-50 μm.

[0225] For example, the shielding layer 320 can be a conductive film formed by a metal film or a mixture of a resin material and metal particles, wherein the metal can be a single metal such as copper, nickel, chromium, aluminum, silver, gold, etc., or an alloy or a composite.

[0226] In one example, if the shielding material is a thin film structure before forming the shielding layer 320 , the shielding material can be covered on the first surface 311 by high-temperature vacuum lamination to form the shielding layer 320 .

[0227] In another example, if the shielding material is metal particles or liquid slurry before forming the shielding layer 320 , the shielding material can be coated on the first surface 311 by spraying or sputtering to form the shielding layer 320 .

[0228] In this embodiment, by making the insulating layer 310 and the shielding layer 320 fluctuate with the height of the electronic components 120, conformal coverage of the circuit board 100 can be achieved. This ensures that electronic components 120 of different heights are at similar distances from the shielding layer 320, improving the heat conduction efficiency of each electronic component 120 and thus enhancing heat dissipation. Conformal coverage also helps save space in the z-direction. For shorter electronic components 120, the space above them can be saved, facilitating the miniaturization of the circuit board 100, circuit board assemblies, and electronic devices.

[0229] FIG16 is a flow chart of a second processing method of the heat dissipation shielding structure provided in this embodiment.

[0230] FIG17 is a diagram showing the first part of a second processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board.

[0231] FIG18 is a second part of the second processing diagram of the heat dissipation shielding structure provided in this embodiment on the circuit board.

[0232] As shown in FIG. 16 to FIG. 18 , this embodiment further provides a method for processing a heat dissipation shielding structure 300 , including:

[0233] Step S501: providing a circuit board 100.

[0234] Among them, the circuit board 100 includes a mounting surface 110, on which electronic components 120 are mounted. The electronic components 120 include active components 121 and passive components 122. The heat generated by the active components 121 is greater than the heat generated by the passive components 122. The passive components 122 include capacitors 150. The capacitors 150 include grounding terminals 151. A grounding pad 140 is mounted on the mounting surface 110 of the circuit board 100.

[0235] When the circuit board 100 is provided, the electronic components 120 are already mounted on the mounting surface 110. However, during the mounting process, some impurities such as flux and oil stains will inevitably remain on the mounting surface 110. Before covering the heat shield structure 300, the mounting surface 110 of the circuit board 100 must first be cleaned to remove any remaining flux, oil stains, and other impurities, facilitating the subsequent installation of the heat shield structure 300.

[0236] Step S502 : Filling the gap between the bottom surface of the electronic component 120 and the mounting surface 110 with a protective adhesive. The protective adhesive surrounds the electrical connection structure 130 connecting the bottom surface of the electronic component 120 and the mounting surface 110 . The protective adhesive is made of an insulating material.

[0237] For example, the protective adhesive may be an underfill (UF adhesive). The underfill may be silicone, polyurethane, acrylic, or the like. When the UF adhesive is in liquid form, it can easily fill the gap between the bottom of the electronic component 120 and the mounting surface 110, thereby surrounding the connection structure.

[0238] At the same time, since the thermal expansion coefficient of UF glue is small, it will not expand due to the influence of high temperature environment during subsequent processing, so as to avoid the expansion stress between the bottom of the electronic component 120 and the mounting surface 110 due to expansion, thereby further improving the connection stability between the electronic component 120 and the mounting surface 110.

[0239] Step S503 : curing the protective adhesive to form a protective structure 360 ​​.

[0240] After the filling is completed, the protective glue may be cured to form a solid protective structure 360 ​​to support the electronic component 120 .

[0241] Exemplarily, the curing process may be light curing, air drying curing, etc. The specific method needs to consider the material and characteristics of the protective glue, which is not limited in this embodiment.

[0242] Step S504 : Covering the mounting surface 110 with an insulating material, the insulating material covers the side surfaces and top surfaces of the active components 121 and the passive components 122 .

[0243] It is understandable that examples of insulating materials and specific covering methods can be found in the description of step S402 and will not be repeated here.

[0244] Step S505 : removing the insulating material on the top surface of the active device 121 to expose the top surface of the active device 121 and form an insulating layer 310 .

[0245] In this way, the insulating layer 310 and the top surface of the active device 121 on the side facing away from the mounting surface 110 can form a first surface 311 together; the first surface 311 presents fluctuations as the height of the electronic component 120 varies.

[0246] Exemplarily, the insulating material on the top surface of the active device 121 may be removed by laser removal or plasma etching, which is not limited in this embodiment.

[0247] Step S506 : removing a portion of the insulating material on the top surface of the ground pad 140 , forming a second trench 313 in the insulating layer 310 , and connecting the second trench 313 to the top surface of the ground pad 140 to expose the top surface of the ground pad 140 .

[0248] It is understandable that step S506 can be performed simultaneously with step S505.

[0249] Step S507 : filling the second trench 313 with a conductive material to form a first conductive structure 370 , with one end of the first conductive structure 370 connected to the top surface of the ground pad 140 and the other end located on the first surface 311 .

[0250] Illustratively, the conductive material may be a conductive paste, such as silver paste, carbon paste, copper paste, gold paste, conductive glue, and the like.

[0251] Optionally, the conductive material may be filled into the second groove 313 by spraying, printing, or the like, which is not limited in this embodiment.

[0252] Step S508 : Covering the first surface 311 with a shielding material to form a shielding layer 320 , making the shape of the shielding layer 320 match the shape of the first surface 311 , and making the shielding layer 320 electrically connected to the ground terminal of the circuit board 100 .

[0253] It is understandable that step S507 may be omitted. In this way, step S508 may be used to simultaneously fill the second trench 313 with shielding material, so that the shielding layer 320 can directly contact the top surface of the ground pad 140 .

[0254] For example, if the shielding material is a metal film, the shielding material filled in the second groove 313 can directly serve as the shielding layer 320, so that the shielding layer 320 directly contacts the top surface of the ground pad 140, thereby achieving a ground connection for the shielding layer 320. If the shielding material is a conductive paste, the shielding material filled in the second groove 313 can form the first conductive portion 323 of the shielding layer 320, while the shielding material covering the first surface 311 forms the main body 322 of the shielding layer 320. The first conductive portion 323 is connected to the main body 322 and the top surface of the ground pad 140, thereby achieving a ground connection for the shielding layer 320.

[0255] Step S509 : filling the liquid thermal conductive gel 350 into at least a portion of the side of the shielding layer 320 facing away from the first surface 311 .

[0256] For example, the thermally conductive gel 350 can be applied to a designated location where the shielding layer 320 has a recess 321 , so that the recess 321 is filled with the thermally conductive gel 350 to avoid air gaps that would affect heat dissipation.

[0257] Step S510 : curing the thermal conductive gel 350 .

[0258] Step S511 : Covering the shielding layer 320 and the side of the thermally conductive gel 350 facing away from the first surface 311 with graphite 204 to form a graphite layer 340 .

[0259] The graphite layer 340 covers the side of the shielding layer 320 facing away from the first surface 311. In this way, the graphite layer 340 can be used to distribute heat from the shielding layer 320 at the location corresponding to the active device 121 to the surface of the graphite 204, thereby reducing the local temperature of the shielding layer 320 and avoiding the generation of hot spots and cold spots. This improves the heat dissipation effect on the active device 121, reduces the generation of thermal stress, and prevents deformation of the shielding layer 320.

[0260] At the same time, the graphite layer 340 can also increase the heat exchange area with the air, further improving the heat dissipation effect.

[0261] For example, the thickness of the graphite layer 340 may be 30-100 μm. The thickness of the graphite layer 340 may be different depending on the electronic components 120 of different heights.

[0262] FIG19 is a flow chart of a third processing method of the heat dissipation shielding structure provided in this embodiment.

[0263] FIG20 is a diagram showing the first part of the third processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board.

[0264] FIG21 is the second part of the third processing diagram of the heat dissipation shielding structure provided in this embodiment on the circuit board.

[0265] As shown in FIG. 19 and FIG. 21 , this embodiment further provides a method for processing a heat dissipation shielding structure 300 , including:

[0266] Step S601: providing a circuit board 100.

[0267] Among them, the circuit board 100 includes a mounting surface 110, on which electronic components 120 are mounted. The electronic components 120 include active components 121 and passive components 122. The heat generated by the active components 121 is greater than the heat generated by the passive components 122. The passive components 122 include capacitors 150. The capacitors 150 include grounding terminals 151. A grounding pad 140 is mounted on the mounting surface 110 of the circuit board 100.

[0268] Step S602 : Filling the gap between the bottom surface of the electronic component 120 and the mounting surface 110 with a protective adhesive. The protective adhesive surrounds the electrical connection structure 130 connecting the bottom surface of the electronic component 120 and the mounting surface 110 . The protective adhesive is made of an insulating material.

[0269] Step S603 : curing the protective adhesive to form a protective structure 360 ​​.

[0270] Step S604 : Covering the mounting surface 110 with an insulating material. The insulating material covers the side surfaces and top surfaces of the active components 121 and the passive components 122 to form an insulating layer 310 .

[0271] The insulating layer 310 forms a first surface 311 on a side facing away from the mounting surface 110 . The first surface 311 fluctuates with the height of the electronic component 120 .

[0272] It is understandable that the above steps S601 to S604 can refer to the description of steps S501 to S504 and are not repeated here.

[0273] Step S605 : removing part of the insulating material on the top surface of the active device 121 , forming a first trench 312 in the insulating layer 310 , and connecting the first trench 312 to the top surface of the active device 121 to expose the top surface of the active device 121 .

[0274] In this way, the insulating layer 310 and the top surface of the active device 121 on the side facing away from the mounting surface 110 can form a first surface 311 together; the first surface 311 presents fluctuations as the height of the electronic component 120 varies.

[0275] For example, if the active device 121 is relatively small along the x-axis, one or two first trenches 312 may be provided on the insulating layer 310 corresponding to the top surface of the active device 121. If the active device 121 is relatively large along the x-axis, multiple first trenches 312, such as three or four, may be provided on the insulating layer 310 corresponding to the top surface of the active device 121. In this way, by providing as many first trenches 312 as possible while ensuring sufficient space for providing the first trenches 312, the heat conduction efficiency is improved, thereby further enhancing the heat dissipation effect of the active device 121.

[0276] Optionally, the first trench 312 may be formed by laser etching, plasma etching, etc. Along the x-axis direction, the dimension of the first trench 312 on a side close to the top surface of the active device 121 may be greater than or equal to 0.1 mm.

[0277] For example, the shape of the first groove 312 can be cylindrical, truncated cone, prism, etc., which is not limited in this embodiment.

[0278] Step S606 : removing a portion of the insulating material on the top surface of the ground pad 140 , forming a second trench 313 in the insulating layer 310 , and connecting the second trench 313 to the top surface of the ground pad 140 to expose the top surface of the ground pad 140 .

[0279] It is worth noting that the formation method of the second groove 313 can refer to the first groove 312 and will not be repeated here.

[0280] It is understandable that step S606 can be performed simultaneously with step S605.

[0281] Step S607 : Filling the first trench 312 with a thermally conductive material to form a thermally conductive structure 330 , such that the thermally conductive structure 330 is connected to the top surface of the active device 121 , and a side of the thermally conductive structure 330 facing away from the active device 121 is located on the first surface 311 .

[0282] Optionally, the thermal conductive material may be thermal conductive paste, metal particles, thermal conductive gel, etc., wherein the thermal conductive paste may be silver paste, alloy thermal conductive paste, graphene thermal conductive paste, etc.

[0283] For example, if the thermally conductive material is a material that is liquid at high temperatures, such as a thermally conductive paste or a thermally conductive gel, it can be directly filled into the first groove 312 in a liquid state and allowed to solidify to form the thermally conductive structure 330. If the thermally conductive material is metal particles, it can be melted at high temperature and filled, or the metal particles can be directly placed in the first groove 312 to form the thermally conductive structure 330.

[0284] It is worth noting that the shape of the heat conducting structure 330 is the same as that of the first groove 312 .

[0285] Step S608 : filling the second trench 313 with a conductive material to form a first conductive structure 370 , with one end of the first conductive structure 370 connected to the top surface of the ground pad 140 and the other end located on the first surface 311 .

[0286] It is understandable that step S608 can be performed simultaneously with step S607.

[0287] Step S609 : Covering the first surface 311 with a shielding material to form a shielding layer 320 , making the shape of the shielding layer 320 match the shape of the first surface 311 , and making the shielding layer 320 electrically connected to the ground terminal of the circuit board 100 .

[0288] Steps S608 and S607 can be omitted. Thus, step S609 can be used to simultaneously fill the first trench 312 and the second trench 313 with shielding material, so that the shielding layer 320 can directly contact the top surface of the active device 121 and the top surface of the ground pad 140. The specific arrangement of the shielding material in the first trench 312 and the second trench 313 can be based on the description of step S508 above and will not be repeated here.

[0289] Step S610 : filling liquid thermal conductive gel 350 into at least a portion of a side of the shielding layer 320 facing away from the first surface 311 .

[0290] Step S611 : curing the thermal conductive gel 350 .

[0291] Step S612 : Covering the shielding layer 320 and the side of the thermally conductive gel 350 facing away from the first surface 311 with graphite 204 to form a graphite layer 340 .

[0292] It is understandable that the above steps S608 to S612 can refer to the description of steps S507 to S511, and will not be repeated here.

[0293] FIG. 22 is a partial diagram of the fourth processing process of the heat dissipation shielding structure provided in this embodiment on a circuit board.

[0294] As shown in FIG. 22 , the processing method of the heat dissipation shielding structure 300 provided in this embodiment may further include, before steps S402 , S504 , and S604 :

[0295] Step S701 : disposing the conductive pad 380 on the ground pad 140 .

[0296] In this way, the conductive spacer 380 can be used to reduce the distance between the shielding layer 320 and the ground pad 140 to prevent the second trench 313 from being too deep, thereby facilitating filling of the first conductive structure 370 to achieve grounding of the shielding layer 320 .

[0297] Optionally, the conductive pad 380 may be a tin block, a copper block, a silver block, a carbon block, a conductive glue block, or the like.

[0298] For example, the conductive pad 380 may be connected to the ground pad 140 by welding. Alternatively, the conductive pad 380 may be connected to the ground pad 140 by conductive adhesive, which is not limited here.

[0299] In order to facilitate the electrical connection between the conductive pad 380 and the shielding layer 320 , in one implementation, after step S430 , step S506 , and step S606 , the following steps may be further included:

[0300] Step S702 : removing a portion of the insulating material on the top surface of the conductive pad 380 , forming a second trench 313 in the insulating layer 310 , and connecting the second trench 313 to the top surface of the conductive pad 380 to expose the top surface of the conductive pad 380 .

[0301] It is understandable that the removal of the insulating material can refer to step S506 and will not be described in detail here.

[0302] Step S703 : filling the second trench 313 with a conductive material to form a first conductive structure 370 , with one end of the first conductive structure 370 connected to the top surface of the conductive pad 380 and the other end located on the first surface 311 .

[0303] In another implementation, after step S430, step S506, and step S606, the following steps may also be included:

[0304] Step S704 : removing the insulating material on the top surface of the conductive pad 380 to expose the top surface of the conductive pad 380 . The top surface of the conductive pad 380 is located on the first surface 311 .

[0305] It is understood that either step S704 or step S702 can be selected based on actual needs. When there are multiple conductive pads 380, both can be selected. This is not limited in this embodiment. When both steps S704 and S702 are used, they can be performed simultaneously. They can also be performed simultaneously with step S606 and step S605, or step S506 and step S505.

[0306] In order to facilitate the ground connection between the shielding layer 320 and the circuit board 100, the passive component 122 includes a capacitor 150, and the capacitor 150 has a ground terminal 151. In one implementation, after step S430, step S506, and step S606, the following steps may be further included:

[0307] Step S705 : removing the insulating material on the top surface of the ground terminal 151 to expose the top surface of the ground terminal 151 . The top surface of the ground terminal 151 is located on the first surface 311 .

[0308] In another implementation, after step S430, step S506, and step S606, the following steps may also be included:

[0309] Step S706 : removing a portion of the insulating material on the top surface of the ground terminal 151 , forming a third trench 314 in the insulating layer 310 , and connecting the third trench 314 to the top surface of the ground terminal 151 to expose the top surface of the ground terminal 151 .

[0310] It is worth noting that the formation of the third trench 314 may refer to the formation of the first trench 312 and the second trench 313 , and will not be described in detail here.

[0311] Step S707 : filling the third trench 314 with a conductive material to form a second conductive structure 390 , with one end of the second conductive structure 390 connected to the top surface of the ground terminal 151 and the other end located on the first surface 311 .

[0312] It is worth noting that the formation of the second conductive structure 390 may refer to the formation of the first conductive structure 370 , and will not be described in detail here.

[0313] It is understood that one of step S705, S706, and S707 can be selected based on actual needs. When there are multiple capacitors 150, both can be selected, and this is not limited in this embodiment. When steps S705, S706, and S707 are used simultaneously, steps S705 and S706 can be performed simultaneously. They can also be performed synchronously with step S606 and step S605, and step S506 and step S505. At the same time, step S707 can be performed synchronously with step S507, and step S608 and step S607.

[0314] In a third aspect, this embodiment provides a circuit board assembly, comprising a circuit board 100 and a heat dissipation shielding structure 300 according to the first aspect. Circuit board 100 includes a mounting surface 110, on which electronic components 120 are mounted. Electronic components 120 include active components 121 and passive components 122, wherein the heat generated by active components 121 is greater than that generated by passive components 122. Circuit board 100 implements required functional operations through active components 121 and passive components 122. The number and type of active components 121 and passive components 122 can be selected based on functional requirements and are not limited in this application.

[0315] The insulating layer 310 covers the mounting surface 110, enclosing the side and top surfaces of the passive components 122 and at least the side surfaces of the active components 121. The shielding layer 320 is electrically connected to the ground terminal of the circuit board 100. The provision of the insulating layer 310 and the shielding layer 320 not only shields the electronic components 120 but also improves heat dissipation from the electronic components 120. Furthermore, the conformal coverage of the insulating layer 310 and the shielding layer 320 reduces the space occupied in the z-direction, thereby reducing the overall volume of the circuit board assembly and facilitating a miniaturized design.

[0316] In a fourth aspect, this embodiment provides an electronic device comprising the circuit board assembly according to the third aspect. Because the circuit board assembly provides excellent heat dissipation, the design difficulty of the electronic device's heat dissipation system can be reduced. Furthermore, because the circuit board assembly occupies a small space, it facilitates the miniaturization of the electronic device.

[0317] It should be noted that those skilled in the art will readily conceive of other embodiments of the present application after considering the specification and practicing the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The description and examples are to be considered merely as exemplary, and the true scope of this application is indicated by the claims.

[0318] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present application is limited only by the appended claims.

Claims

1. A heat dissipation shielding structure, characterized in that: Applied to a circuit board (100), the circuit board (100) comprising a mounting surface (110), the mounting surface (110) having electronic components (120) mounted thereon, the electronic components (120) comprising active components (121) and passive components (122), the heat generated by the active components (121) being greater than the heat generated by the passive components (122); The heat dissipation shielding structure comprises: an insulating layer (310), the insulating layer (310) covering the mounting surface (110), and covering the side surface and the top surface of the passive device (122), and at least covering the side surface of the active device (121), so that the insulating layer (310) forms a first surface (311) on a side away from the mounting surface (110), or the insulating layer (310) forms the first surface (311) together with the top surface of the active device (121) on a side away from the mounting surface (110); the first surface (311) presents fluctuations as the height of the electronic component (120) varies; A shielding layer (320), the shielding layer (320) covers the first surface (311), the shape of the shielding layer (320) matches the shape of the first surface (311), and the shielding layer (320) is electrically connected to the ground terminal of the circuit board (100).

2. The heat dissipation shielding structure according to claim 1, characterized in that: The insulating layer (310) covers the side surface of the active device (121), so that the insulating layer (310) and the top surface of the active device (121) together form the first surface (311) on the side facing away from the mounting surface (110); The shielding layer (320) covers the top surface of the active device (121).

3. The heat dissipation shielding structure according to claim 1, characterized in that: The insulating layer (310) covers the side surface and the top surface of the active device (121), so that the insulating layer (310) forms the first surface (311) on the side facing away from the mounting surface (110); The insulating layer (310) is provided with a first groove (312), the first groove (312) is located between the top surface of the active device (121) and the shielding layer (320), and connects the top surface of the active device (121) with the shielding layer (320); The first groove (312) is filled with a heat-conducting structure (330), one end of the heat-conducting structure (330) is connected to the top surface of the active device (121), and the other end is connected to the shielding layer (320).

4. The heat dissipation shielding structure according to any one of claims 1 to 3, characterized in that: Also includes: A graphite layer (340), the graphite layer (340) covering a side of the shielding layer (320) facing away from the first surface (311).

5. The heat dissipation shielding structure according to claim 4, characterized in that: A thermal conductive gel (350) is provided between the shielding layer (320) and the graphite layer (340).

6. The heat dissipation shielding structure according to claim 5, characterized in that: The shielding layer (320) has a recessed portion (321); The recessed portion (321) is close to the edge of the electronic component (120) and is recessed toward the insulating layer (310); The thermally conductive gel (350) at least fills the recessed portion (321).

7. The heat dissipation shielding structure according to any one of claims 1 to 3, characterized in that: A ground pad (140) is mounted on the mounting surface (110); The shielding layer (320) is electrically connected to the ground pad (140).

8. The heat dissipation shielding structure according to claim 7, characterized in that: The insulating layer (310) is provided with a second groove (313), the second groove (313) is located between the top surface of the ground pad (140) and the shielding layer (320), and connects the top surface of the ground pad (140) with the shielding layer (320); The shielding layer (320) comprises a main body portion (322) and a first conductive portion (323); The main body (322) covers the first surface (311), and the shape of the main body (322) matches the shape of the first surface (311); The first conductive part (323) is filled in the second groove (313), one end of the first conductive part (323) is connected to the main body (322), and the other end is connected to the top surface of the ground pad (140).

9. The heat dissipation shielding structure according to claim 7, characterized in that: The insulating layer (310) is provided with a second groove (313), the second groove (313) is located between the top surface of the ground pad (140) and the shielding layer (320), and connects the top surface of the ground pad (140) with the shielding layer (320); The second groove (313) is filled with a first conductive structure (370), and the first conductive structure (370) is electrically connected to the ground pad (140) and the shielding layer (320).

10. The heat dissipation shielding structure according to claim 9, characterized in that: One end of the first conductive structure (370) is connected to the top surface of the ground pad (140), and the other end is connected to the shielding layer (320).

11. The heat dissipation shielding structure according to claim 9, characterized in that: Also includes: A conductive pad (380), the conductive pad (380) being arranged on the top surface of the ground pad (140); The insulating layer (310) covers the side surface and top surface of the conductive pad (380); The second groove (313) is located between the top surface of the conductive pad (380) and the shielding layer (320), and connects the top surface of the conductive pad (380) with the shielding layer (320); One end of the first conductive structure (370) is connected to the top surface of the conductive pad (380), and the other end is connected to the shielding layer (320).

12. The heat dissipation shielding structure according to claim 7, characterized in that: Also includes: A conductive pad (380), the conductive pad (380) being arranged on the top surface of the ground pad (140); The insulating layer (310) is coated on the side surface of the conductive pad (380); The top surface of the conductive pad (380) is located on the first surface (311); The shielding layer (320) is connected to the conductive pad (380).

13. The heat dissipation shielding structure according to any one of claims 1 to 3, characterized in that: The passive device (122) comprises a capacitor (150), wherein the capacitor (150) has a ground terminal (151); The shielding layer (320) is electrically connected to the grounding terminal (151).

14. The heat dissipation shielding structure according to claim 13, characterized in that: The insulating layer (310) is provided with a third groove (314), and the third groove (314) is located between the top surface of the grounding terminal (151) and the shielding layer (320), and connects the top surface of the grounding terminal (151) with the shielding layer (320); The shielding layer (320) comprises a main body portion (322) and a second conductive portion (324); The main body (322) covers the first surface (311), and the shape of the main body (322) matches the shape of the first surface (311); The second conductive portion (324) is filled in the third groove (314), one end of the second conductive portion (324) is connected to the main body (322), and the other end is connected to the top surface of the ground terminal (151).

15. The heat dissipation shielding structure according to claim 13, characterized in that: The insulating layer (310) is provided with a third groove (314), and the third groove (314) is located between the top surface of the grounding terminal (151) and the shielding layer (320), and connects the top surface of the grounding terminal (151) with the shielding layer (320); The third groove (314) is filled with a second conductive structure (390), one end of the second conductive structure (390) is connected to the top surface of the ground terminal (151), and the other end is connected to the shielding layer (320).

16. The heat dissipation shielding structure according to any one of claims 1 to 3, characterized in that: The electronic component (120) is connected to the mounting surface (110) via an electrical connection structure (130), and a gap exists between the bottom surface of the electronic component (120) and the mounting surface (110); The heat dissipation shielding structure also includes: A protective structure (360), the protective structure (360) filling a gap between the bottom surface of the electronic component (120) and the mounting surface (110), and surrounding the electrical connection structure (130); The material of the protection structure (360) is an insulating material.

17. The heat dissipation shielding structure according to any one of claims 1 to 3, characterized in that: The active device (121) includes a processor (1211) and a memory (1212) which are stacked; The processor (1211) is connected to the mounting surface (110); The memory (1212) is electrically connected to the processor (1211).

18. A method for processing a heat dissipation shielding structure, characterized in that: include: A circuit board is provided, the circuit board comprises a mounting surface, electronic components are mounted on the mounting surface, the electronic components comprise active components and passive components, and the heat generated by the active components is greater than the heat generated by the passive components; Covering the mounting surface with an insulating material, the insulating material covering the side and top surface of the passive device, and at least covering the side surface of the active device, to form an insulating layer, so that the insulating layer forms a first surface on the side away from the mounting surface, or the insulating layer forms the first surface together with the top surface of the active device on the side away from the mounting surface; the first surface presents fluctuations with different heights of the electronic components; The shielding material is covered on the first surface to form a shielding layer, the shape of the shielding layer is matched with the shape of the first surface, and the shielding layer is electrically connected to the grounding terminal of the circuit board.

19. The processing method of the heat dissipation shielding structure according to claim 18, characterized in that: The insulating material is covered on the mounting surface, the insulating material covers the side and top surface of the passive device, and at least covers the side surface of the active device, so as to form an insulating layer, so that the insulating layer forms a first surface on the side away from the mounting surface, or the insulating layer forms the first surface together with the top surface of the active device on the side away from the mounting surface; The first surface presents fluctuations with the height of the electronic components, including: Covering the mounting surface with the insulating material, wherein the insulating material covers the side surfaces and the top surface of the active device and the passive device; Removing the insulating material on the top surface of the active device to expose the top surface of the active device, forming the insulating layer, so that the insulating layer forms the first surface together with the top surface of the active device on a side away from the mounting surface; The first surface presents fluctuations as the height of the electronic component varies.

20. The method for processing the heat dissipation shielding structure according to claim 18, characterized in that: The insulating material covers the side surfaces and top surface of the active device; The insulating material is covered on the mounting surface, the insulating material covers the side and top surface of the passive device, and at least covers the side surface of the active device, so as to form an insulating layer, so that the insulating layer forms a first surface on the side away from the mounting surface, or the insulating layer forms the first surface together with the top surface of the active device on the side away from the mounting surface; The first surface fluctuates with the height of the electronic components, and then further comprises: Part of the insulating material on the top surface of the active device is removed, and a first trench is formed in the insulating layer, so that the first trench is connected to the top surface of the active device to expose the top surface of the active device.

21. The processing method of the heat dissipation shielding structure according to claim 20, characterized in that: The method further comprises: removing a portion of the insulating material on the top surface of the active device, forming a first trench in the insulating layer, and making the first trench connected to the top surface of the active device; and then: The first trench is filled with a heat-conducting material to form a heat-conducting structure, so that the heat-conducting structure is connected to the top surface of the active device, and a side surface of the heat-conducting structure facing away from the active device is located on the first surface.

22. The method for processing the heat dissipation shielding structure according to any one of claims 18 to 21, characterized in that: The shielding material is covered on the first surface to form a shielding layer, the shape of the shielding layer matches the shape of the first surface, and the shielding layer is electrically connected to the ground terminal of the circuit board, and then further includes: Graphite is covered on the side of the shielding layer away from the first surface to form a graphite layer.

23. The processing method of the heat dissipation shielding structure according to claim 22, characterized in that: The step of covering the shielding layer with graphite on a side away from the first surface to form a graphite layer also includes: Filling liquid thermally conductive gel at least partially at a side of the shielding layer facing away from the first surface; The thermally conductive gel is cured.

24. The processing method of the heat dissipation shielding structure according to any one of claims 18 to 21, characterized in that: A ground pad is mounted on the mounting surface; The method of covering the first surface with a shielding material to form a shielding layer, making the shape of the shielding layer match the shape of the first surface, and making the shielding layer electrically connected to the ground terminal of the circuit board, also includes: Part of the insulating material on the top surface of the ground pad is removed, and a second groove is formed in the insulating layer, so that the second groove is connected to the top surface of the ground pad to expose the top surface of the ground pad.

25. The method for processing the heat dissipation shielding structure according to claim 24, characterized in that: The method further comprises removing a portion of the insulating material on the top surface of the ground pad, forming a second groove in the insulating layer, and connecting the second groove to the top surface of the ground pad to expose the top surface of the ground pad. The method further comprises: The second trench is filled with a conductive material to form a first conductive structure, so that one end of the first conductive structure is connected to the top surface of the ground pad, and the other end is located on the first surface.

26. The method for processing the heat dissipation shielding structure according to any one of claims 18 to 21, characterized in that: A ground pad is mounted on the mounting surface; The circuit board is provided, the circuit board comprises a mounting surface, the mounting surface is mounted with electronic components, the electronic components comprise active components and passive components, the heat generated by the active components is greater than the heat generated by the passive components, Later also includes: The conductive pad is disposed on the ground pad.

27. The processing method of the heat dissipation shielding structure according to claim 26, characterized in that: The method of covering the first surface with a shielding material to form a shielding layer, making the shape of the shielding layer match the shape of the first surface, and making the shielding layer electrically connected to the ground terminal of the circuit board, also includes: The insulating material on the top surface of the conductive pad is removed to expose the top surface of the conductive pad, wherein the top surface of the conductive pad is located on the first surface.

28. The method for processing the heat dissipation shielding structure according to claim 26, characterized in that: The method of covering the first surface with a shielding material to form a shielding layer, making the shape of the shielding layer match the shape of the first surface, and making the shielding layer electrically connected to the ground terminal of the circuit board, also includes: A portion of the insulating material on the top surface of the conductive pad is removed, and a second groove is formed in the insulating layer, so that the second groove is connected to the top surface of the conductive pad to expose the top surface of the conductive pad.

29. The method for processing the heat dissipation shielding structure according to claim 28, characterized in that: The step of removing a portion of the insulating material on the top surface of the conductive pad, forming a second groove in the insulating layer, and connecting the second groove to the top surface of the conductive pad to expose the top surface of the conductive pad, further comprises: The second trench is filled with a conductive material to form a first conductive structure, so that one end of the first conductive structure is connected to the top surface of the conductive pad, and the other end is located on the first surface.

30. The method for processing the heat dissipation shielding structure according to any one of claims 18 to 21, characterized in that: The passive device includes a capacitor having a ground terminal; The method of covering the first surface with a shielding material to form a shielding layer, making the shape of the shielding layer match the shape of the first surface, and making the shielding layer electrically connected to the ground terminal of the circuit board, also includes: The insulating material on the top surface of the ground terminal is removed to expose the top surface of the ground terminal, and the top surface of the ground terminal is located on the first surface.

31. The processing method of the heat dissipation shielding structure according to any one of claims 18 to 21, characterized in that: The passive device includes a capacitor having a ground terminal; The method of covering the first surface with a shielding material to form a shielding layer, making the shape of the shielding layer match the shape of the first surface, and making the shielding layer electrically connected to the ground terminal of the circuit board, also includes: A portion of the insulating material on the top surface of the ground terminal is removed, and a third groove is formed in the insulating layer, so that the third groove is connected to the top surface of the ground terminal to expose the top surface of the ground terminal.

32. The processing method of the heat dissipation shielding structure according to claim 31, characterized in that: The step of removing a portion of the insulating material on the top surface of the ground terminal, forming a third groove in the insulating layer, and making the third groove communicate with the top surface of the ground terminal to expose the top surface of the ground terminal, further comprising: A conductive material is filled into the third trench to form a second conductive structure, so that one end of the second conductive structure is connected to the top surface of the ground terminal, and the other end is located on the first surface.

33. The processing method of the heat dissipation shielding structure according to any one of claims 18 to 21, characterized in that: The circuit board is provided, the circuit board includes a mounting surface, the mounting surface is mounted with electronic components, the electronic components include active components and passive components, the heat generated by the active components is greater than the heat generated by the passive components, and then further includes: Filling a protective glue into the gap between the bottom surface of the electronic component and the mounting surface, the protective glue surrounds the electrical connection structure connecting the bottom surface of the electronic component and the mounting surface, and the material of the protective glue is an insulating material; The protective glue is cured to form a protective structure.

34. A circuit board assembly, characterized in that: It comprises a circuit board (100) and a heat dissipation shielding structure as claimed in any one of claims 1 to 17; The circuit board (100) comprises a mounting surface (110), the mounting surface (110) is mounted with electronic components (120), the electronic components (120) comprise active components (121) and passive components (122), and the heat generated by the active components (121) is greater than the heat generated by the passive components (122); The insulating layer (310) covers the mounting surface (110), the insulating layer (310) covers the side surface and the top surface of the passive component (122), and the insulating layer (310) at least covers the side surface of the active component (121); The shielding layer (320) is electrically connected to a ground terminal of the circuit board (100).

35. An electronic device, characterized in that: Comprising a circuit board assembly as claimed in claim 34.

Images