Processing platform, processing platform placement state recognition method and storage medium

Abstract

The application provides a processing platform, a method for identifying a placement state of the processing platform, and a storage medium. The method comprises the following steps: acquiring an image of the processing platform through a camera; detecting whether the image simultaneously comprises a second identifier and a third identifier; and if the image simultaneously comprises the second identifier and the third identifier, controlling a tool head to process a to-be-processed object. The placement state of the current processing platform can be automatically detected without increasing the hardware architecture, thereby greatly reducing the cost while ensuring the detection accuracy.

Description

Technical Field

[0001] This application relates to the field of processing technology, and in particular to a processing platform, a method for identifying the placement state of the processing platform, and a storage medium. Background Technology

[0002] Processing equipment, such as 3D printers, (laser) cutters, and laser engraving machines, can provide printing, cutting, and engraving capabilities, enabling the manufacture of complex items that are impossible with traditional manufacturing techniques (such as injection molding or manual assembly). In the specific implementation of processing, slicing software can be provided to the processing equipment. Instructions can be sent from the slicing software to the processing equipment, or copied to the equipment via storage devices such as USB drives. The processing equipment can then execute these instructions to provide a series of steps in the manufacturing process. Processing equipment offers various processing methods, each requiring a different processing platform. The correct placement of the processing platform directly affects the processing quality. Currently, the correct placement of the processing platform is generally determined manually or by acquiring high-resolution images, which is costly. Summary of the Invention

[0003] In view of this, this application provides a processing platform, a method for identifying the placement state of the processing platform, and a storage medium, which can automatically determine whether the current setting state of the processing board matches the setting state required by the object to be processed without increasing the hardware architecture, thereby greatly reducing hardware costs while ensuring that the processing does not encounter abnormalities.

[0004] In a first aspect, embodiments of this application provide a processing platform, which is suitable for processing equipment. The processing equipment includes a tool head and a camera, and the tool head is movable relative to the processing platform. The processing platform is used to carry an object to be processed.

[0005] The processing platform includes:

[0006] A support plate is connected to the processing equipment; and a first mark is provided on the surface of the support plate facing the camera.

[0007] A protective base plate is placed on the surface of the support plate and partially / completely covers the first mark, and the protective base plate has a second mark on the surface away from the support plate;

[0008] At least one working panel is provided for placement on the surface of the protective base plate facing the tool head and partially covering the second mark, and each working panel has a different third mark on the surface away from the protective base plate.

[0009] In one possible embodiment, the protective base plate and the at least one working panel are stacked along the thickness direction of the working panel;

[0010] The working panel has a cutout in the projection area of ​​the second mark, and the projection area is the area where the second mark is projected onto the working panel along the thickness direction of the working panel.

[0011] In one possible embodiment, the third identifier is disposed within the projection area of ​​the second identifier, the projection area being the area where the second identifier is projected onto the working panel along the thickness direction of the working panel.

[0012] In one possible embodiment, the carrier plate includes four vertices, and the carrier plate has the first identifier in each of the four vertex regions.

[0013] In one possible embodiment, the protective base plate includes four sides, and the second identifier is provided on each of three of the sides.

[0014] In one possible embodiment, the work panel includes four sides, and the third identifier is provided on each of three of the sides.

[0015] In one possible embodiment, the tool head includes a cutting module, and the at least one working panel includes a panel for attaching the object to be processed.

[0016] Secondly, embodiments of this application provide a method for identifying the placement state of a processing platform. The processing platform is suitable for a processing device, which includes a tool head and a camera. The tool head and the processing platform are movable relative to each other. The processing platform is used to carry an object to be processed. The processing platform includes: a support plate, which is connected to the processing device; and a first mark is provided on the surface of the support plate facing the camera; a protective base plate, which is placed on the surface of the support plate and partially / completely covers the first mark, and a second mark is provided on the surface of the protective base plate away from the support plate; and at least one work panel, which is placed on the surface of the protective base plate facing the tool head and partially covers the second mark, and each work panel has a different third mark on the surface of the protective base plate away from the protective base plate.

[0017] The method includes:

[0018] The camera captures an image of the processing platform.

[0019] The system detects whether the image simultaneously includes the second identifier and the third identifier. If the image simultaneously includes the second identifier and the third identifier, the system controls the tool head to process the object to be processed.

[0020] In one possible embodiment, the method further includes generating a prompt message if the image is missing the second identifier or the third identifier.

[0021] In one possible embodiment, the tool head includes a cutting module, and the at least one working panel includes a panel for adhering the object to be processed; each working panel has a different adhesion capability;

[0022] The method further includes:

[0023] Obtain the material information of the object to be processed; the material information indicates the adhesion capability of the work panel corresponding to the object to be processed.

[0024] Based on the material information of the object to be processed, it is detected whether the work panel corresponding to the third identifier matches the work panel required by the object to be processed. If so, the tool head is controlled to process the object to be processed.

[0025] In one possible embodiment, the camera is fixedly mounted on the body of the processing equipment, facing the support plate.

[0026] In one possible embodiment, the protective base plate and the at least one working panel are stacked along the thickness direction of the working panel;

[0027] The working panel has a cutout in the projection area of ​​the second mark, and the projection area is the area where the second mark is projected onto the working panel along the thickness direction of the working panel.

[0028] In one possible embodiment, the third identifier is disposed within the projection area of ​​the second identifier, the projection area being the area where the second identifier is projected onto the working panel along the thickness direction of the working panel.

[0029] In one possible embodiment, the carrier plate includes four vertices, and the carrier plate has the first identifier in each of the four vertex regions.

[0030] In one possible embodiment, the protective base plate includes four sides, and the second identifier is provided on each of three of the sides.

[0031] In one possible embodiment, the work panel includes four sides, and the third identifier is provided on each of three of the sides.

[0032] In one possible embodiment, after acquiring an image of the processing platform via the camera, the method further includes:

[0033] If the image is detected to include only the first identifier, the state of the processing platform is determined to be that the protective base plate and the working panel are not placed on the surface of the support plate.

[0034] In one possible embodiment, after acquiring an image of the processing platform via the camera, the method further includes:

[0035] If the image is detected to include only the second identifier or to include both the first and second identifiers, the state of the processing platform is determined to be that the protective base plate is placed on the surface of the support plate.

[0036] In one possible embodiment, the first identifier is located within the projection area of ​​the working panel projected onto the thickness direction of the support plate;

[0037] After acquiring an image of the processing platform via the camera, the method further includes:

[0038] If the image is detected to contain only the third identifier, the state of the processing platform is determined to be that the work panel is placed on the surface of the support plate.

[0039] In one possible embodiment, different third identifiers represent different types of work panels placed on the surface of the protective base plate.

[0040] In one possible embodiment, after acquiring an image of the processing platform via the camera, the method further includes:

[0041] If the image is detected to include the second identifier and the third identifier and the second identifier and the third identifier meet the preset position requirements, the color data and / or processing mark ratio of the work panel are determined based on the image;

[0042] The adhesiveness of the work panel is determined based on the color data and / or the proportion of machining marks on the work panel.

[0043] If the viscosity of the working panel is less than a preset viscosity threshold, a message will be displayed indicating that the viscosity of the working panel does not support the processing of the object to be processed.

[0044] Thirdly, embodiments of this application provide a processing device, which includes a tool head, a camera, and a processing platform as described in any of the first aspects of embodiments of this application, wherein the tool head and the processing platform are movable relative to each other; the processing device further includes a processor, which is used to perform some or all of the steps described in any of the methods in the second aspect of embodiments of this application.

[0045] Fourthly, embodiments of this application provide a computer storage medium, wherein the computer storage medium stores a computer program for electronic data interchange, wherein the computer program causes a computer to perform some or all of the steps described in any method of the second aspect of embodiments of this application.

[0046] Fifthly, embodiments of this application provide a computer program product, wherein the computer program product includes a non-transitory computer-readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps described in any method of the second aspect of this application. The computer program product may be a software installation package.

[0047] As can be seen, through the above-described processing platform, the method for identifying the placement state of the processing platform, and the storage medium, the processing platform is suitable for processing equipment, the processing equipment includes a tool head and a camera, and the tool head and the processing platform are movable relative to each other; the processing platform is used to carry the object to be processed; wherein, the processing platform includes: a support plate, which is connected to the processing equipment in a transmission manner; and the surface of the support plate facing the camera is provided with a first mark; a protective base plate, which is placed on the surface of the support plate and partially / completely covers the first mark, and the protective base plate is provided with a second mark on the surface away from the support plate; at least one working panel, which is placed on the surface of the protective base plate facing the tool head and partially covers the second mark, and each working panel is provided with a different third mark on the surface away from the protective base plate; the method includes: acquiring an image of the processing platform through the camera; detecting whether the image simultaneously includes the second mark and the third mark; if the image simultaneously includes the second mark and the third mark, controlling the tool head to process the object to be processed. This method can automatically detect whether the current placement state of the processing platform is correct without increasing the hardware architecture, greatly reducing costs while ensuring detection accuracy. Attached Figure Description

[0048] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0049] Figure 1 This is a schematic diagram of the structure of a processing device provided in an embodiment of this application;

[0050] Figure 2 This is a schematic diagram of the structure of a processing platform provided in an embodiment of this application;

[0051] Figure 3 A flowchart illustrating a method for identifying the placement state of a processing platform, as provided in an embodiment of this application;

[0052] Figure 4a A schematic diagram of a carrier plate provided in an embodiment of this application;

[0053] Figure 4b A schematic diagram of a protective base plate provided in an embodiment of this application;

[0054] Figure 4c A schematic diagram of a first working panel provided in an embodiment of this application;

[0055] Figure 4d A schematic diagram of a second working panel provided in an embodiment of this application;

[0056] Figure 4e A schematic diagram illustrating a target placement state provided in an embodiment of this application;

[0057] Figure 5 A flowchart illustrating another method for identifying the placement state of a processing platform provided in this application embodiment. Detailed Implementation

[0058] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of the present application without inventive effort are within the scope of protection of the present application. The terms "first," "second," etc., in the specification, claims, and accompanying drawings of the present application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0059] In the embodiments of this application, "at least one item" or its similar expression refers to any combination of these items, including any combination of a single item or a plurality of items. "One or more" means one or more, while "multiple" means two or more. For example, "at least one item" of a, b, or c can represent the following seven cases: a, b, c; a and b; a and c; b and c; a, b, and c. Each of a, b, and c can be an element or a set containing one or more elements.

[0060] In this application's embodiments, "connection" refers to various connection methods, such as direct or indirect connection, to achieve communication between devices. This application's embodiments do not impose any limitations on this. In the description of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "connection" should be interpreted broadly. In one example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or a connection that allows mutual communication; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components or the interaction between two components.

[0061] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0062] Currently, the correct placement of the processing platform is generally determined by manual identification or by using an additional high-resolution camera to obtain high-definition images, which is costly.

[0063] To address the aforementioned issues, this application provides a processing platform, a method for identifying the placement status of the processing platform, and a storage medium. By setting different identifiers on the processing platform, the correctness of the current placement status of the processing platform can be automatically detected without increasing the hardware architecture, thus significantly reducing costs while ensuring detection accuracy.

[0064] Please see Figure 1 , Figure 1 The present application provides a schematic diagram of a processing device, which includes a processor 110, a camera 120, a processing platform 130, and a tool head 140, wherein the processor 110 is electrically connected to the camera 120 and the tool head 140 respectively.

[0065] The camera 120 can be a built-in camera on the processing equipment. The camera 120 can be positioned to capture the entire processing platform, such as above the front door casing, top casing, or side frame of the processing equipment. In one possible embodiment, the camera 120 can also be mounted on a motion component. The movement of the motion component moves the camera 120 to capture images of the processing platform and transmits the images to the processor 110.

[0066] The tool head 140 and the processing platform 130 are movable relative to each other. The tool head 140 may include a 3D printing head, and the 3D printing head can be detachably connected to a cutter assembly, a laser head, and mounting components. The 3D printing head includes a hot end for heating the printing material, and the mounting components include a connector or a laser head with an output laser. The connector is used to connect to the cutter assembly or a pen holder, and the pen holder is used to connect a drawing pen. A laser head can be connected to the 3D printing head, and a connector can also be connected to the 3D printing head. The connector is used to connect the cutter assembly and the pen holder, and the pen holder is used to connect a drawing pen. The type of mounting component on the 3D printing head can be switched. For example, when a laser head is already connected to the 3D printing head, the laser head can be detached and replaced with a connector that can connect to the cutter assembly or the pen holder. When a connector that can connect to the cutter assembly or the pen holder is already connected to the 3D printing head, the connector used to connect the cutter assembly or the pen holder can be detached and replaced with a laser head. The 3D print head uses a hot end to heat the printing material, which is then extruded through a nozzle. The printing material can be easily heated and melted plastic filaments, such as polylactic acid (PLA) or acrylonitrile-butadiene-styrene copolymer. The nozzle diameter can be 0.2mm, 0.4mm, or 0.8mm, etc. The printing material contained within the 3D print head can also be of multiple colors and with different properties, rather than just a single material.

[0067] In some feasible implementations, when the 3D printing head is connected to the laser head, after the 3D printing head has finished printing the product or during the printing process, the laser head performs laser engraving on the 3D printed product / part of the product. The high energy density of the laser beam causes the material surface to heat up rapidly, melt, or vaporize, thereby forming the desired pattern or text. This reduces the steps of first installing the 3D printing head, then disassembling it, and then installing the laser head, improving production efficiency. Alternatively, the processing consumables for the laser head, such as acrylic sheets, wood, metal, glass, stainless steel, and rock, can be placed on the processing platform, allowing the laser head to process products other than 3D printed products. The processing equipment of this application can achieve 3D printing independently, laser engraving / cutting independently, or both simultaneously. By sharing the same set of motion devices, such as guide rods / processing platforms, between the laser head and the 3D printing head, various processing methods can be achieved, such as printing, engraving / cutting, printing while engraving / cutting, or printing first and then engraving / cutting, providing multiple possibilities for complex product manufacturing, further improving production efficiency, and reducing costs.

[0068] Sculpting refers to the process of altering the appearance of a material without completely penetrating it. It involves removing portions of a material through carving, engraving, or other methods to create a desired shape, pattern, or design. Examples include carving fine lines and patterns on a material's surface using a carving knife, or engraving text or images on a material's surface using a laser beam.

[0069] Cutting refers to altering the appearance, properties, and / or state of a material by means of mechanical force, heat, water, or chemical methods, separating the material into two or more parts. Cutting can include, for example, through-cutting, bleaching, curing, burning, etc. Examples include mechanical cutting, thermal cutting, water cutting, or chemical cutting.

[0070] When the 3D printing head is connected to the connector, and the connector is connected to the cutter assembly, the cutter assembly is used to cut the 3D printed product / part of the product after printing or during the printing process, removing excess parts of the 3D printed product. Alternatively, the cutter assembly can perform secondary processing on the 3D printed product, cutting it into the required shape. The cutter assembly can be made of high-hardness materials, such as tool steel and hard alloys. The cutter head in the cutter assembly is detachable and can be of various types, such as disc cutter type, pointed cutter type, etc., providing a variety of different cutting methods. Alternatively, the processing consumables of the cutter assembly, such as wood, paper, plastic, leather, metal sheets such as foil, fabric, etc., can be placed on the processing platform, and the cutter assembly can process products other than 3D printed products. The processing equipment of this application can realize 3D printing alone, cutting alone, or both. Cutting can cut some flammable materials such as paper and plastic, compared to laser cutting.

[0071] When the 3D printing head connects to a connector, and the connector connects to a pen holder, the pen can be used for drawing and design on the 3D printed product / part of the product. The pen has an adjustable tip and ink to achieve different drawing effects and precision. The pen is detachably connected to the pen holder, allowing for multi-colored drawing by changing different colored pens, and different pen effects by changing different types of pens. In this application, the connector is compatible with the connection of the cutter assembly and the pen holder. By sharing the same motion device, such as the guide rod / processing platform, with the 3D printing head, various processing methods can be achieved. Furthermore, the connector can connect to cutter assemblies with different cutter types and to pens of different colors / types, allowing for a wide variety of processing methods and greatly enriching the processing forms and efficiency of the processing equipment.

[0072] Optionally, after the 3D print head finishes printing, the product can be further processed using a mounting device. For example, a laser head can perform laser engraving on the product, a cutting assembly can cut it, or a pen can draw patterns on it. This avoids the repeated installation and removal of the 3D print head, laser head, cutting assembly, and pen holder, thus improving the production efficiency of the processing equipment.

[0073] The processor 110 can be a server or a processor integrated into the processing equipment. It is used to receive and detect images from the camera 120 to determine whether the placement of the processing platform 130 is correct. If the placement of the processing platform 130 is correct, the tool head 140 can be controlled to process the object to be processed. If the current placement of the processing board is incorrect, a prompt message can be generated and displayed through the display module. The display module can be integrated into the processing equipment or decoupled from the processing equipment.

[0074] The processing platform 130 can be used to carry the object to be processed and to process the object on the processing platform 130. Figure 1 The machining platform 130 shown is part of the machining platform. To prevent displacement of the workpiece during machining, which could lead to machining failure, an adhesive work panel, or adhesive plate, can be installed in the machining platform 130. Machining the workpiece on the correct work panel ensures that no displacement occurs. To protect the work panel from damage by the tool head during machining, a protective base plate can be installed below the work panel, forming a structure from top to bottom: workpiece - work panel - protective base plate - support plate.

[0075] Please see Figure 2 , Figure 2 The schematic diagram of a processing platform provided in this application embodiment includes a support plate 210, a protective base plate 220, and at least one working panel 230.

[0076] The support plate 210 is connected to the processing equipment in a transmission manner; and the surface of the support plate facing the camera is provided with a first mark.

[0077] The protective base plate 220 is placed on the surface of the support plate 210 and partially / completely covers the first mark, and the protective base plate 220 has a second mark on the surface away from the support plate 210.

[0078] In this embodiment, at least one working panel 230 is used to be placed on the surface of the protective base plate 220 facing the tool head and partially cover the second mark, and each working panel 230 has a different third mark on the surface away from the protective base plate.

[0079] A processing platform refers to a general-purpose workbench that can be used for various processing methods. For example, a processing platform can be used for 3D printing, laser processing, cutting, and drawing. 3D printing requires a printing platform, which may include a heated bed, and may further include at least one of a printing panel located on the heated bed and a heated bed support for supporting the heated bed. The heated bed support can either flexibly support the heated bed or fixably support the heated bed and the printing panel. In the processing equipment provided in this application, it can be used for 3D printing as well as laser engraving, cutting, or drawing; the support plate 210 can be understood as the printing platform.

[0080] Laser processing platforms may include laser pads on which the object to be laser-processed is placed. Optionally, if the processing equipment can perform both 3D printing and laser processing, the processing platform may include not only the laser pad but also a heated bed, and even a printing panel. When laser processing is required, the laser pad can be placed on the heated bed; when 3D printing is required, the laser pad is removed and the printing panel is placed on the heated bed. Alternatively, the processing platform can also be a printing platform, allowing the equipment to engrave / cut the printed part while printing, or to engrave / cut the printed part on the printing platform after printing is complete. The laser pad can immediately serve as the working panel for this application.

[0081] For 3D printing and drawing, the processing platform can include an adhesive plate for attaching the object to be cut or drawn, and may further include a protective base plate located below the adhesive plate. If the processing equipment can perform both 3D printing and 3D cutting / drawing, the processing platform can include not only the adhesive plate but also a protective base plate and a heated bed, and may even include a printing panel. When 3D cutting / drawing is required, the adhesive plate can be placed on the protective base plate, which is then placed on the heated bed to protect it from scratches or smudges. When 3D printing is required, the adhesive plate and protective base plate are removed, and the printing panel is placed on the heated bed. Alternatively, the processing platform can also be a printing platform, allowing the equipment to cut / draw the printed part while printing, or to cut / draw the printed part on the printing platform after printing is complete.

[0082] In one possible embodiment, the support plate 210 includes four vertices, and the support plate 210 has the first mark in each of the four vertex regions. This facilitates identification of whether the support plate is in place.

[0083] In one possible embodiment, the protective base plate 220 includes four sides, and the second mark is provided on each of three of these sides. This facilitates identification of whether the protective base plate is in place.

[0084] In one possible embodiment, the work panel 230 includes four sides, and the third mark is provided on each of three of the sides of the work panel 230. The side of the work panel 230 with the third mark needs to be the same side as the side of the protective base plate 220 with the second mark. This allows the cutouts of the work panel 230 to display the second mark of the protective base plate when the processing platform is placed normally, making it easy to identify whether the processing platform has been placed normally.

[0085] It needs to be explained that, Figure 2 This is merely one possible example and does not imply any limitation on the first, second, and third identifiers. The number, position, and style of the first identifier, the second identifier, and the third identifier can be flexibly adjusted as needed, which will not be elaborated here.

[0086] In one possible embodiment, a protective base plate and at least one working panel can be stacked along the thickness direction of the working panel. Generally, the protective base plate is placed on the lower side of the working panel, and the working panel has a cutout in the projection area of ​​the second mark. The projection area is the area where the second mark is projected onto the working panel along the thickness direction of the working panel. When the protective base plate and the working panel are stacked and correctly positioned, part of the second mark can be seen through the cutout.

[0087] In one possible embodiment, the third identifier is disposed within the projection area of ​​the second identifier, the projection area being the area where the second identifier is projected onto the working panel along the thickness direction of the working panel. When the protective base plate and the working panel are overlapped and correctly positioned, the third identifier can partially cover the second identifier.

[0088] In one possible embodiment, the at least one working panel includes a panel for adhering the object to be processed. It is understood that different working panels may have different adhesion capabilities to the object to be processed, and the adhesion capability of the working panel will gradually decrease with use.

[0089] After understanding the application scenarios and hardware architecture of the embodiments of this application, the following will be combined with... Figure 3 This application provides a method for identifying the placement state of a processing platform. Figure 3This is a flowchart illustrating a method for identifying the placement state of a processing platform according to an embodiment of this application. The executing entity can be a processor of a processing device. The processing platform is adapted to the processing device, which includes a tool head and a camera. The tool head and the processing platform are movable relative to each other. The processing platform is used to carry an object to be processed. The processing platform includes: a support plate, which is connected to the processing device; and a first mark is provided on the surface of the support plate facing the camera; a protective base plate, which is placed on the surface of the support plate and partially / completely covers the first mark, and a second mark is provided on the surface of the protective base plate away from the support plate; at least one working panel, which is placed on the surface of the protective base plate facing the tool head and partially covers the second mark, and each working panel has a different third mark on the surface of the protective base plate away from the protective base plate. The method specifically includes the following steps:

[0090] Step 301: Acquire an image of the processing platform using a camera.

[0091] The camera can be a chassis camera, which can be fixedly mounted on the body of the processing equipment facing the support plate. Alternatively, the camera can be mounted on a moving component, which moves the camera to face the area of ​​the processing platform, thus acquiring an image from the chassis camera that covers the entire processing platform. This image is generally a top-down view. It should be noted that the lifting or lowering of the processing platform will not affect the image; that is, the chassis camera can capture an image of the entire processing platform area regardless of whether the processing platform is at its lowest or highest position.

[0092] It is evident that acquiring images of the processing platform through a camera can provide data support for subsequent detection of the platform's placement status.

[0093] Step 302: Detect whether the image includes both the second identifier and the third identifier. If the image includes both the second identifier and the third identifier, control the tool head to process the object to be processed.

[0094] The process involves preprocessing the image to obtain a preprocessed image, extracting feature data from the preprocessed image, fusing the feature data to obtain fused feature data, and finally determining relevant identifiers in the image based on the fused feature data.

[0095] Specifically, preprocessing can include image enhancement, adaptive anchor box calculation, adaptive image scaling, etc. The preprocessed image can be input into a trained image detection model, and the output of this model determines the relevant identifiers. For example, the image detection model can include a feature extraction module, a feature fusion module, and a prediction output module. The feature extraction module can consist of a convolutional module, an adaptive aggregation module, and a weighting module. The convolutional module can include convolutional layers, normalization layers, and activation functions. The adaptive aggregation module adaptively aggregates the previously output feature maps. The weighting module obtains more comprehensive spatial information through weighted fusion of global and local features. The weighting module can consist of multiple sequential max-pooling layers and connection layers. The feature fusion module can perform multi-scale feature fusion on the features extracted by the feature extraction module to enhance the model's feature representation ability and receptive field, further improving the model's detection performance. It is understood that the above image detection model can adopt the architecture of models such as YOLOv5, which will not be elaborated upon here.

[0096] If the image includes both the second identifier and the third identifier, the first identifier is obscured because the protective base plate covers the support plate, and the second identifier is partially obscured because the work panel covers the protective base plate. In this case, it can be determined that the support plate, the protective base plate, and the work panel are properly positioned, and the tool head can be controlled to process the object to be processed.

[0097] In one possible embodiment, if the image lacks the second identifier or the third identifier, a prompt message is generated. If the second identifier is missing, it indicates that the protective base plate is not placed or is not placed correctly, requiring a prompt to correctly place the protective base plate. If the third identifier is missing, it indicates that the work panel is not placed or is not placed correctly, requiring a prompt to correctly place the work panel. This prevents abnormalities in subsequent processing.

[0098] In one possible embodiment, the protective base plate and the at least one working panel are stacked along the thickness direction of the working panel; the working panel has a cutout in the projection area of ​​the second mark, and the projection area is the area where the second mark is projected onto the working panel along the thickness direction of the working panel.

[0099] In one possible embodiment, a protective base plate and at least one working panel can be stacked along the thickness direction of the working panel. Generally, the protective base plate is placed on the lower side of the working panel, and the working panel has a cutout in the projection area of ​​the second mark. The projection area is the area where the second mark is projected onto the working panel along the thickness direction of the working panel. When the protective base plate and the working panel are stacked and correctly positioned, part of the second mark can be seen through the cutout.

[0100] In one possible embodiment, the third identifier is disposed within the projection area of ​​the second identifier, the projection area being the area where the second identifier is projected onto the working panel along the thickness direction of the working panel. When the protective base plate and the working panel are overlapped and correctly positioned, the third identifier can partially cover the second identifier.

[0101] In one possible embodiment, the carrier plate includes four vertices, and the carrier plate has the first identifier in each of the four vertex regions.

[0102] In one possible embodiment, the protective base plate includes four sides, and the second identifier is provided on each of three of the sides.

[0103] In one possible embodiment, the work panel includes four sides, and the third identifier is provided on each of three of the sides.

[0104] In one possible embodiment, if the image is detected to include only the first identifier, the state of the processing platform is determined to be that the protective base plate and the working panel are not placed on the surface of the support plate. Since the first identifier of the support plate is not covered, it can be determined that the protective base plate and the working panel are not placed on the surface of the support plate.

[0105] In one possible embodiment, if the image is detected to include only the second identifier or to include both the first and second identifiers, the state of the processing platform is determined to be that the protective base plate is placed on the surface of the support plate.

[0106] In one possible embodiment, the first identifier may be located in the projection area of ​​the working panel onto the thickness direction of the support plate. If the image is detected to include only the third identifier, the state of the processing platform is that the working panel is placed on the surface of the support plate. This is because the first identifier is covered by the working panel, and the inability to identify the second identifier indicates that the protective base plate is not placed.

[0107] In one possible embodiment, different third identifiers represent different types of work panels placed on the surface of the protective base plate. For example, the third identifier of work panel a can be rectangular, and the third identifier of work panel b can be triangular. No specific limitation is made here.

[0108] In one possible embodiment, the tool head includes a cutting module, and the at least one working panel includes a panel for adhering the object to be processed. Material information of the object to be processed can be acquired. The material information indicates the adhesion capability of the working panel corresponding to the object to be processed. Then, based on the material information of the object to be processed, it is detected whether the working panel corresponding to the third identifier matches the working panel required by the object to be processed. If so, the tool head is controlled to process the object to be processed. The third identifier may correspond to the type of the third panel; different third panels have different third identifiers. The type of the working panel can be determined by the third identifier, thereby determining the adhesion capability of that working panel. This allows detection of whether the working panel corresponding to the third identifier matches the working panel required by the object to be processed. If the working panel corresponding to the third identifier does not match the working panel required by the object to be processed, a prompt to replace the working panel can be made. This can improve the efficiency of subsequent processing and prevent processing failures.

[0109] The relevant identifiers in the detected image can include various situations, which will be explained one by one below.

[0110] In one possible embodiment, the relevant identifier may include at least one of a first identifier, a second identifier, a third identifier, and another third identifier.

[0111] It should be noted that in this embodiment, the processing platform includes a support plate, a protective base plate, a first working panel, and a second working panel. The adhesiveness of the first working panel is not equal to that of the second working panel. The support plate includes at least one first identifier, the protective base plate includes at least one second identifier, and the first working panel includes at least one third identifier and a first hollow area. Each first hollow area has the same shape and size as the area where each second identifier is located, or the first hollow area is larger than the shape and size of the area where the second identifier is located. The second working panel includes at least one third identifier (hereinafter referred to as another third identifier for easy distinction) and a second hollow area that is different from the third identifier of the first working panel. Each second hollow area has the same shape and size as the area where each second identifier is located. The target placement state includes: the protective base plate is disposed on the support plate, the second working panel is disposed on the protective base plate, and each second hollow area coincides with the area where each second identifier is located.

[0112] The adhesiveness of the first working panel can be less or greater than that of the second working panel. In this embodiment, the working panel required for the object to be processed is set as the second working panel. The first and second working panels differ in adhesiveness and markings, but are the same in size and shape.

[0113] The first cutout area can be located on either side of the third logo or in other locations, as long as the second logo can be fully presented in the first cutout area after the first working panel and the base plate are perfectly aligned. That is, the size and shape of the area where the second logo is located can be the same as the size and shape of the first cutout area. Similarly, the second cutout area can be located on either side of another third logo or in other locations, as long as the second working panel and the protective base plate are perfectly aligned and the second logo can be fully or partially presented in the first cutout area. That is, the size and shape of the area where the second logo is located can be the same as the size and shape of the first cutout area.

[0114] In one possible embodiment, there may be one or more first identifiers, which can be set at any location on the processing platform, such as the four corners. For easier understanding, please refer to [link to relevant documentation]. Figure 4a , Figure 4a This is a schematic diagram of a support plate provided in an embodiment of this application. Without any protective base plate and work panel, four first marks are provided in the four corner areas of the processing platform. At this time, the first mark is a circle composed of a black semicircle and a white semicircle.

[0115] In one possible embodiment, there may be one or more second identifiers, which can be placed at any location on the protective base plate, such as on the three sides. For easier understanding, please refer to [link to relevant documentation]. Figure 4b , Figure 4b This is a schematic diagram of a protective base plate provided in an embodiment of this application. As can be seen, three second markings are respectively provided in the middle section of the three sides of the protective base plate. At this time, the second markings are parallel stripes of black and white.

[0116] In one possible embodiment, there may be one or more third identifiers, which can be positioned anywhere on the first working panel, such as along the three edges. There may be one or more first cutout areas, and the number of first cutout areas must be the same as the number of second identifiers. The position of the first cutout area can be determined based on the position of the area containing the second identifiers. For ease of understanding, please refer to [link to relevant documentation]. Figure 4c , Figure 4c This is a schematic diagram of a first working panel provided in an embodiment of this application. As can be seen, three third identifiers are respectively provided in the middle section of the three sides of the first working panel. At this time, the third identifier is a black rectangle. Each first hollow area is provided on both sides of the third identifier. It should be noted that the first hollow area used to display a second identifier is referred to as a first hollow area regardless of whether its shape is a continuous hollow shape.

[0117] In one possible embodiment, one or more third identifiers may exist, and these third identifiers may be positioned anywhere on the second working panel, such as along the three sides. One or more second cutout areas may exist, and the number of second cutout areas must be the same as the number of second identifiers. The position of the second cutout area can be determined based on the position of the area containing the second identifier. For ease of understanding, please refer to [link to relevant documentation]. Figure 4d , Figure 4d This is a schematic diagram of a second working panel provided in an embodiment of this application. As can be seen, three other third identifiers are respectively provided in the middle section of the three sides of the second working panel. At this time, the other third identifier is a white rectangle. Each second hollow area is provided on both sides of the other third identifier. It should be noted that the second hollow area used to display a second identifier is referred to as a second hollow area regardless of whether its shape is a continuous hollow shape.

[0118] It is evident that by detecting the image to determine the relevant identifiers, reliable data support can be provided for subsequently determining the current setting status of the processing board. At the same time, setting at least one first identifier on the carrier plate, at least one second identifier on the protective base plate, at least one third identifier and a first hollow area on the first working panel, and at least one other third identifier and a second hollow area on the second working panel can improve the accuracy of identifying the current placement status of the processing platform without increasing hardware, and greatly improve the accuracy of information prompts.

[0119] If the first placement state corresponding to the relevant identifier does not match the target placement state corresponding to the object to be processed, a prompt message is generated and displayed.

[0120] Since there are multiple possible scenarios for the relevant identifiers, there are also multiple possible scenarios for the first placement state. The first placement state is used to indicate the current placement state of the processing platform, while the target placement state is used to indicate the placement state of the processing platform required for the object to be processed.

[0121] The target placement state includes a protective base plate and a working panel for the object to be processed. In this embodiment, the working panel for the object to be processed is described as the second working panel. In reality, it can be any one of multiple working panels with different adhesive properties, which will not be elaborated here.

[0122] To facilitate understanding, firstly, let's combine... Figures 4a-4d For an illustrative example of the target placement state, please refer to [link / reference]. Figure 4e , Figure 4e This is a schematic diagram of a target placement state provided in an embodiment of this application. It can be seen that, in Figures 4a-4dBased on this, the relevant identifiers presented in the image of the target placement state should be three white rectangles on each of the three side terminals, and each second hollow area should display non-offset black and white parallel stripes. It can be understood that if an offset occurs, the second hollow area will display the background color outside the black and white parallel stripes. It can be understood that if any other setting state is presented besides this target placement state, it is an incorrect setting state and requires timely reminders for adjustment.

[0123] In one possible embodiment, if the relevant identifier includes the first identifier, a first prompt message is generated and displayed. The first prompt message is used to prompt the placement of the protective base plate and the second working panel. It can be understood that the relevant identifier identified at this time only includes the first identifier. Since the protective base plate is not transparent, if the protective base plate is placed, it will cover the first identifier on the support plate. Therefore, if the first placement state of the relevant identifier including the first identifier is that the protective base plate and the second working panel are not placed, a first prompt message prompting the placement of the protective base plate and the second working panel needs to be generated and displayed.

[0124] In one possible embodiment, if the relevant identifier includes the second identifier, a second prompt message is generated and displayed. The second prompt message is used to prompt the placement of the second working panel. It can be understood that at this time, the identified relevant identifier only includes the second identifier, that is, the first placement state at this time is the state in which only the protective base plate is placed, and a second prompt message prompting the placement of the second working panel needs to be generated.

[0125] In one possible embodiment, if the relevant identifier includes the third identifier, a third prompt message is generated and displayed. The third prompt message is used to indicate that the work panel is placed incorrectly, and that the protective base plate and the second work panel should be placed. It can be understood that at this time, the relevant identifier identified only includes the third identifier, that is, the first placement state at this time is the state in which only the first work panel is placed, and a third prompt message indicating that the adhesive board is placed incorrectly and that the protective base plate and the second work panel should be placed needs to be generated.

[0126] In one possible embodiment, if the relevant identifier includes the other third identifier, a fourth prompt message is generated and displayed. The fourth prompt message is used to prompt the placement of the protective base plate. It can be understood that at this time, the identified relevant identifier only includes the other third identifier, that is, the first placement state at this time is the state in which only the second working panel is placed, and a fourth prompt message prompting the placement of the protective base plate needs to be generated.

[0127] In one possible embodiment, if the relevant identifier includes the second identifier and the third identifier, a fifth prompt message is generated and displayed. The fifth prompt message is used to prompt the replacement of the first working panel with the second working panel. It can be understood that the first placement state at this time is the state in which the protective base plate and the first working panel are placed, and the fifth prompt message to replace the first working panel with the second working panel needs to be generated.

[0128] In one possible embodiment, if the relevant identifier includes the second identifier and the other third identifier but the positions of the second identifier and the other third identifier do not meet the preset position requirements, a sixth prompt message is generated and displayed. The sixth prompt message is used to prompt that each hollow area be adjusted to coincide with the area where each second identifier is located. It can be understood that the first placement state at this time is a state in which the protective base plate and the second working panel are placed but not aligned, and a sixth prompt message is needed to align the second working panel with the protective base plate.

[0129] In one possible embodiment, if the relevant identifier includes a first identifier and a second identifier, then the first placement state is a state in which a protective base plate is placed but the protective base plate is not aligned with the support plate, and a prompt message needs to be generated to align the protective base plate with the support plate and place the second working panel.

[0130] In one possible embodiment, different prompts can be presented in different ways, forming multiple tiers. The first tier involves placing a protective base plate and a second working panel, but the two panels are not perfectly aligned; in this case, the prompts are image and text. The second tier involves placing either the protective base plate or the second working panel; in this case, the prompts are image, text, and voice alerts. The third tier involves placing the first working panel; in this case, the prompts are image, text, voice, and vibration alerts. It can be understood that the more obvious the placement error, the higher the tier and the stronger the alert; conversely, the less obvious the error, the lower the tier and the weaker the alert. This creates a differentiated alert strategy, allowing users to promptly understand the current placement status of the processing platform.

[0131] As can be seen, through the above-described processing platform, the method for identifying the placement state of the processing platform, and the storage medium, the processing platform is suitable for processing equipment, the processing equipment includes a tool head and a camera, and the tool head and the processing platform are movable relative to each other; the processing platform is used to carry the object to be processed; wherein, the processing platform includes: a support plate, which is connected to the processing equipment in a transmission manner; and the surface of the support plate facing the camera is provided with a first mark; a protective base plate, which is placed on the surface of the support plate and partially / completely covers the first mark, and the protective base plate is provided with a second mark on the surface away from the support plate; at least one working panel, which is placed on the surface of the protective base plate facing the tool head and partially covers the second mark, and each working panel is provided with a different third mark on the surface away from the protective base plate; the method includes: acquiring an image of the processing platform through the camera; detecting whether the image simultaneously includes the second mark and the third mark; if the image simultaneously includes the second mark and the third mark, controlling the tool head to process the object to be processed. This method can automatically detect whether the current placement state of the processing platform is correct without increasing the hardware architecture, greatly reducing costs while ensuring detection accuracy.

[0132] The following is combined Figure 5 Another method for identifying the placement state of a processing platform provided in an embodiment of this application will be described. Figure 5 This is a flowchart illustrating another method for identifying the placement state of a processing platform according to an embodiment of this application. The processing platform is suitable for a processing device, which includes a tool head and a camera. The tool head and the processing platform are movable relative to each other. The processing platform is used to carry an object to be processed. The processing platform includes: a support plate, which is connected to the processing device; and a first mark is provided on the surface of the support plate facing the camera; a protective base plate, which is placed on the surface of the support plate and partially / completely covers the first mark, and a second mark is provided on the surface of the protective base plate away from the support plate; and at least one work panel, which is placed on the surface of the protective base plate facing the tool head and partially covers the second mark, and each work panel has a different third mark on the surface of the work panel away from the protective base plate. The method specifically includes the following steps:

[0133] Step 501: Acquire an image of the processing platform using a camera.

[0134] Step 502: The image is detected to include a second identifier and a third identifier, and the second identifier and the third identifier meet the preset position requirements. Based on the image, the color data and / or processing mark ratio of the work panel are determined.

[0135] The preset position requirement is that the second working panel is set on the protective base plate, and each second hollow area coincides with the area where each second mark is located. At this time, the type of the working panel matches the type of working panel required by the object to be processed and the placement position is correct.

[0136] The color data can include color distribution, total color variance of the adhesive panel, etc. Since the work panel does not have scratches or other processing marks when it is not in use, the proportion of processing marks on the entire work panel can be determined by identifying processing marks. It should be noted that the work panel is a consumable, and its adhesiveness will gradually decrease with use. In some cases, although the initial adhesiveness of the work panel meets the adhesiveness required for the object to be processed, it may become insufficient to adhere to the object during use, so it needs to be replaced in time. Determining the color and / or processing mark ratio of the work panel through images can provide data reference for subsequent prompts.

[0137] Step 503: Determine the adhesiveness of the work panel based on the color data and / or the proportion of processing marks on the work panel.

[0138] Specifically, a mapping relationship can be pre-established between the color distribution of the work panel under different viscosities and the variance of the total viscosity of the board. For example, the RGB value of 100% viscosity is (0,0,0), the RGB value of 50% viscosity is (128,128,128), and so on. As the color gradually fades, the viscosity gradually decreases. This will not be elaborated further here. Similarly, a mapping relationship can be established between the proportion of machining marks on the work panel under different viscosities. The higher the proportion of machining marks, the lower the viscosity, and vice versa.

[0139] The stickiness of the work panel can be estimated by combining color data and / or the proportion of processing marks, thereby providing data support for whether to provide a prompt later.

[0140] Step 504: If the viscosity of the working panel is less than a preset viscosity threshold, a message is sent indicating that the viscosity of the working panel does not support the processing of the object to be processed.

[0141] The system can generate and display a seventh prompt message, which is used to remind users that the viscosity of the work panel does not support the processing of the object to be processed. The preset viscosity threshold can be determined based on the minimum viscosity required by the object to be processed.

[0142] As can be seen, through the above-described processing platform, the method for identifying the placement state of the processing platform, and the storage medium, the processing platform is suitable for processing equipment, the processing equipment includes a tool head and a camera, and the tool head and the processing platform are movable relative to each other; the processing platform is used to carry the object to be processed; wherein, the processing platform includes: a support plate, which is connected to the processing equipment in a transmission manner; and the surface of the support plate facing the camera is provided with a first mark; a protective base plate, which is placed on the surface of the support plate and partially / completely covers the first mark, and the protective base plate is provided with a second mark on the surface away from the support plate; at least one working panel, which is placed on the surface of the protective base plate facing the tool head and partially covers the second mark, and each working panel is provided with a different third mark on the surface away from the protective base plate; the method includes: acquiring an image of the processing platform through the camera; detecting whether the image simultaneously includes the second mark and the third mark; if the image simultaneously includes the second mark and the third mark, controlling the tool head to process the object to be processed. This method can automatically detect whether the current placement state of the processing platform is correct without increasing the hardware architecture, greatly reducing costs while ensuring detection accuracy. Meanwhile, after confirming that the processing platform is correctly positioned, the adhesiveness of the work panel is identified, and a timely prompt is given when the adhesiveness of the panel is determined to be insufficient, so that the user can replace the work panel in time to prevent abnormalities in processing and greatly improve the safety of processing.

[0143] For steps not detailed above, please refer to Figure 3 The steps of the Chinese method will not be elaborated here.

[0144] The above primarily describes the solutions of the embodiments of this application from the perspective of the method execution process. It is understood that, in order to achieve the above functions, the electronic device includes corresponding hardware structures and / or software modules for executing each function. Those skilled in the art should readily recognize that, in conjunction with the units and algorithm steps of the various examples described in the embodiments provided herein, this application can be implemented in hardware or a combination of hardware and computer software. Whether a function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0145] This application embodiment can divide the electronic device into functional units according to the above method example. For example, each function can be divided into a separate functional unit, or two or more functions can be integrated into one processing unit. The integrated unit can be implemented in hardware or as a software functional unit. It should be noted that the unit division in this application embodiment is illustrative and only represents one logical functional division. In actual implementation, there may be other division methods.

[0146] This application also provides a computer storage medium storing a computer program for electronic data interchange, which causes a computer to perform some or all of the steps of any of the methods described in the above method embodiments, wherein the computer includes an electronic device.

[0147] This application also provides a computer program product, which includes a non-transitory computer-readable storage medium storing a computer program operable to cause a computer to perform some or all of the steps of any of the methods described in the above method embodiments. The computer program product may be a software installation package, and the computer may include an electronic device.

[0148] It should be noted that, for the sake of simplicity, the above embodiments are all described as a series of actions. Those skilled in the art should understand that this application is not limited to the described order of actions, as some steps in the embodiments of this application can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions, steps, modules, or units involved are not necessarily essential to the embodiments of this application.

[0149] In the above embodiments, the descriptions of each embodiment in this application have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0150] The steps of the methods or algorithms described in the embodiments of this application can be implemented in hardware or by a processor executing software instructions. The software instructions can consist of corresponding software modules, which can be stored in RAM, flash memory, ROM, EPROM, electrically erasable programmable read-only memory (EEPROM), registers, hard disk, portable hard disk, read-only optical disk (CD-ROM), or any other form of storage medium well known in the art. An exemplary storage medium is coupled to a processor, enabling the processor to read information from and write information to the storage medium. Of course, the storage medium can also be a component of the processor. The processor and storage medium can reside in an ASIC. Furthermore, the ASIC can reside in a terminal device or management device. Alternatively, the processor and storage medium can exist as discrete components in the terminal device or management device.

[0151] Those skilled in the art will recognize that, in one or more of the examples above, the functions described in the embodiments of this application can be implemented, in whole or in part, by software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, in the form of a computer program product. This computer program product includes one or more computer instructions. When these computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media can be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., digital video discs (DVDs)), or semiconductor media (e.g., solid-state disks (SSDs)).

[0152] The modules / units included in the various devices and products described in the above embodiments can be software modules / units, hardware modules / units, or a combination of both. For example, for devices and products applied to or integrated into a chip, all modules / units can be implemented using hardware methods such as circuits, or at least some modules / units can be implemented using software programs that run on a processor integrated within the chip, while the remaining (if any) modules / units can be implemented using hardware methods such as circuits. For devices and products applied to or integrated into a chip module, all modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components of the chip module, or at least some modules / units can be implemented using hardware methods such as circuits. The implementation is achieved through a software program that runs on a processor integrated within the chip module. The remaining modules / units (if any) can be implemented using hardware methods such as circuits. For various devices and products applied to or integrated into terminal equipment, each of their modules / units can be implemented using hardware methods such as circuits. Different modules / units can be located in the same component (e.g., chip, circuit module, etc.) or different components within the terminal equipment. Alternatively, at least some modules / units can be implemented using a software program that runs on a processor integrated within the terminal equipment, while the remaining modules / units (if any) can be implemented using hardware methods such as circuits.

[0153] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above descriptions are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A processing platform, characterized in that, The processing platform is suitable for processing equipment, which includes a tool head and a camera. The tool head and the processing platform are movable relative to each other. The processing platform is used to carry the object to be processed. The processing platform includes: A support plate is connected to the processing equipment; and the surface of the support plate facing the camera is provided with a first mark. A protective base plate is placed on the surface of the support plate and partially / completely covers the first mark, and the protective base plate has a second mark on the surface away from the support plate; At least one working panel is provided for placement on the surface of the protective base plate facing the tool head and partially covering the second mark, and each working panel has a different third mark on the surface away from the protective base plate.

2. The processing platform according to claim 1, characterized in that, The protective base plate and the at least one working panel are stacked along the thickness direction of the working panel; The working panel has a cutout in the projection area of ​​the second mark, and the projection area is the area in which the second mark is projected onto the working panel along the thickness direction of the working panel.

3. The processing platform according to claim 1, characterized in that, The third identifier is disposed within the projection area of ​​the second identifier, the projection area being the area where the second identifier is projected onto the working panel along the thickness direction of the working panel.

4. The processing platform according to any one of claims 1-3, characterized in that, The support plate includes four vertices, and the support plate has the first mark in each of the four vertex regions.

5. The processing platform according to any one of claims 1-3, characterized in that, The protective base plate includes four sides, and the second mark is provided on each of three of the sides.

6. The processing platform according to any one of claims 1-3, characterized in that, The work panel includes four sides, and the third identifier is provided on each of three of the sides.

7. The processing platform according to any one of claims 1-3, characterized in that, The tool head includes a cutting module, and the at least one working panel includes a panel for attaching the object to be processed.

8. A method for identifying the placement state of a processing platform, characterized in that, The processing platform is suitable for processing equipment, which includes a tool head and a camera. The tool head and the processing platform are movable relative to each other. The processing platform is used to carry the object to be processed. The processing platform includes: a support plate, which is connected to the processing equipment; and a first mark is provided on the surface of the support plate facing the camera; a protective base plate, which is placed on the surface of the support plate and partially / completely covers the first mark, and a second mark is provided on the surface of the protective base plate away from the support plate; and at least one work panel, which is placed on the surface of the protective base plate facing the tool head and partially covers the second mark, and each work panel has a different third mark on the surface of the protective base plate away from the protective base plate. The method includes: The camera captures an image of the processing platform. The system detects whether the image simultaneously includes the second identifier and the third identifier. If the image simultaneously includes the second identifier and the third identifier, the system controls the tool head to process the object to be processed.

9. The method according to claim 8, characterized in that, The method further includes: If the image is missing the second identifier or the third identifier, a prompt message is generated.

10. The method according to claim 8, characterized in that, The tool head includes a cutting module, and the at least one working panel includes a panel for adhering the object to be processed; each working panel has a different adhesion capability. The method further includes: Obtain the material information of the object to be processed; the material information indicates the adhesion capability of the work panel corresponding to the object to be processed. Based on the material information of the object to be processed, it is detected whether the work panel corresponding to the third identifier matches the work panel required by the object to be processed. If so, the tool head is controlled to process the object to be processed.

11. The method according to claim 8, characterized in that, The camera is fixedly mounted on the body of the processing equipment, facing the support plate.

12. The method according to claim 8, characterized in that, The protective base plate and the at least one working panel are stacked along the thickness direction of the working panel; The working panel has a cutout in the projection area of ​​the second mark, and the projection area is the area in which the second mark is projected onto the working panel along the thickness direction of the working panel.

13. The method according to claim 8, characterized in that, The third identifier is disposed within the projection area of ​​the second identifier, the projection area being the area where the second identifier is projected onto the working panel along the thickness direction of the working panel.

14. The method according to any one of claims 8-13, characterized in that, The support plate includes four vertices, and the support plate has the first mark in each of the four vertex regions.

15. The method according to any one of claims 8-13, characterized in that, The protective base plate includes four sides, and the second mark is provided on each of three of the sides.

16. The method according to any one of claims 8-13, characterized in that, The work panel includes four sides, and the third identifier is provided on each of three of the sides.

17. The method according to claim 8, characterized in that, After acquiring an image of the processing platform via the camera, the method further includes: If the image is detected to include only the first identifier, the state of the processing platform is determined to be that the protective base plate and the working panel are not placed on the surface of the support plate.

18. The method according to claim 8, characterized in that, After acquiring an image of the processing platform via the camera, the method further includes: If the image is detected to include only the second identifier or to include both the first and second identifiers, the processing platform is determined to be in a state where the protective base plate is placed on the surface of the support plate.

19. The method according to claim 8, characterized in that, The first identifier is located within the projection area of ​​the working panel projected onto the thickness direction of the support plate; After acquiring an image of the processing platform via the camera, the method further includes: If the image is detected to contain only the third identifier, the state of the processing platform is determined to be that the work panel is placed on the surface of the support plate.

20. The method according to claim 8, characterized in that, Different third identifiers represent different types of work panels placed on the surface of the protective base plate.

21. The method according to claim 8, characterized in that, After acquiring an image of the processing platform via the camera, the method further includes: If the image is detected to include the second identifier and the third identifier and the second identifier and the third identifier meet the preset position requirements, the color data and / or processing mark ratio of the work panel are determined according to the image; The adhesiveness of the work panel is determined based on the color data and / or the proportion of machining marks on the work panel. If the viscosity of the working panel is less than a preset viscosity threshold, a message will be displayed indicating that the viscosity of the working panel does not support the processing of the object to be processed.

22. A processing device, characterized in that, The processing equipment includes a tool head, a camera, and a processing platform as described in any one of claims 1-7, wherein the tool head and the processing platform are movable relative to each other; the processing equipment further includes a processor for performing the method as described in any one of claims 8-21.

23. A computer storage medium, characterized in that, The computer storage medium stores a computer program, the computer program including program instructions, which, when executed by a processor, cause the processor to perform the method as described in any one of claims 8-21.

Images