Laser additive manufacturing quality detection method and device

Abstract

The invention provides a laser additive manufacturing quality detection method and device, and the method comprises the steps: obtaining an electric signal corresponding to an optical signal of a first time period in a laser additive manufacturing process, and the first time period is a time period for machining a target slice layer of a target part in the laser additive manufacturing process; under the condition that the electric signal amplitude corresponding to a first division region in the target slice layer is determined to be in a first threshold range corresponding to the first division region, if a first ratio corresponding to a first target sub-region exists in a plurality of first sub-regions included in the first division region and is not in a preset ratio range, the first target sub-region is determined to be in the first threshold range; and if yes, determining the first target sub-region as an abnormal region. Therefore, the accuracy of laser additive manufacturing quality detection can be improved.

Description

Technical Field

[0001] This application relates to the field of additive manufacturing technology, and particularly relates to a method and device for detecting the quality of laser additive manufacturing. Background Art

[0002] Currently, the quality detection of laser additive manufacturing mainly monitors certain key variables during the additive manufacturing process by collecting these variables, so as to achieve real-time detection of the additive process. As recorded in the Chinese patent with the application number CN202311764353.4, the additive manufacturing quality detection method includes: obtaining the electrical signals corresponding to the optical signals in the first time period during the laser additive manufacturing process, and the industrial control computer constructs at least two trajectory amplitude diagrams based on at least two electrical signals corresponding to at least two optical signals respectively; the industrial control computer divides at least two trajectory amplitude diagrams respectively to obtain a plurality of image block sets; the industrial control computer determines whether there are defects in the areas corresponding to the image blocks in each image block set in the target slice layer based on the electrical signal amplitudes of the image blocks in each image block set. It is beneficial to detect the abnormal areas of the part slice layer in the additive manufacturing process. It mainly calculates the ratio between the eigenvalue corresponding to the sub-region in the divided area of the current slice layer and the eigenvalue corresponding to the divided area first. For example, based on the electrical signal amplitude of each second image block in each image block set and the electrical signal corresponding to the first image block set to which the second image block belongs, the detection result corresponding to each second image block is determined. When the calculated ratio is within a reasonable range, it is determined that the currently selected area is normal; when the calculated ratio is outside a reasonable range, it is determined that the currently selected area is abnormal. And the aforementioned detection method can be called adaptive algorithm detection.

[0003] However, in the case where most of the area in the current divided area is in abnormal printing and only a small part of the area is in normal printing, the signal at the abnormal printing position will bias the eigenvalue corresponding to the current divided area. As a result, when calculating the ratio between the eigenvalue of the subsequent sub-region and the eigenvalue of the current divided area, the ratio between the eigenvalue of the sub-region at the normal printing position and the eigenvalue of the current divided area will not be within a reasonable range, while the ratio between the eigenvalue of the sub-region at the abnormal printing position and the eigenvalue of the current divided area will be within a reasonable range. At this time, the "reverse selection" phenomenon will occur when detecting based on the adaptive algorithm. That is, the normal sub-regions inside the current divided area are judged as abnormal, and the abnormal sub-regions are judged as normal. Therefore, when detecting based on the adaptive algorithm, how to avoid the "reverse selection" phenomenon is a technical problem that urgently needs to be solved in this field. Summary of the Invention

[0004] The present application provides a method and device for quality inspection of laser additive manufacturing. First, judgment is made through a reference value algorithm to achieve comprehensive quality inspection of a first divided area in a target slice layer, and based on an adaptive algorithm for local area quality inspection when the comprehensive quality inspection passes, which can avoid the "reverse selection" phenomenon in detection based on the adaptive algorithm.

[0005] In a first aspect, the present application provides a method for quality inspection of laser additive manufacturing, the method including: Obtain an electrical signal corresponding to an optical signal in a first time period during the laser additive manufacturing process, where the first time period is the time period of processing a target slice layer of a target part during the laser additive manufacturing process; When it is determined that the amplitude of the electrical signal corresponding to the first divided area in the target slice layer is within the first threshold range corresponding to the first divided area, if among multiple first sub-areas included in the first divided area, there is a first ratio corresponding to a first target sub-area that is not within the preset ratio range, then determine the first target sub-area as an abnormal area; Wherein, the first ratio corresponding to the first target sub-area is the ratio between the amplitude of the electrical signal corresponding to the first target sub-area and the amplitude of the electrical signal corresponding to the target area of the first shape in the first divided area, and the first shape is the shape corresponding to the first target sub-area.

[0006] It can be seen that in the embodiments of the present application, by obtaining the optical signal during the laser additive manufacturing process and converting it into an electrical signal, first judgment is made through a reference value algorithm to achieve comprehensive quality inspection of the first divided area in the target slice layer, and based on an adaptive algorithm for local area quality inspection when the comprehensive quality inspection passes. In this way, it can be avoided that when most of the area in the first divided area of the target slice layer is in abnormal printing, the "reverse selection" phenomenon will occur in the detection based on the adaptive algorithm, and the accuracy of the quality inspection of laser additive manufacturing is improved.

[0007] In a feasible example, before determining the first target sub-area as an abnormal area, the method further includes: Determine multiple detection points in the first divided area; For each detection point among the multiple detection points, determine a first area of the first shape with the first position where the detection point is located as the center; Control the detection point to move its position in the first divided area, and determine a second area of the first shape with the second position after the detection point moves its position as the center. The multiple first sub-areas include multiple first areas and multiple second areas.

[0008] In this application, multiple detection points move dispersedly in the first divided area, and a first area and a second area of a first shape are set with the initial position and the moved position of the detection point as the centers respectively. In this way, adaptive algorithm detection is performed based on the first area and the second area, which can avoid the situation that when the first divided area is divided into fixed sub-areas, the defect in the first divided area just lies between multiple first sub-areas, making it difficult to effectively detect the defect, and thus improving the accuracy of laser additive manufacturing quality detection.

[0009] In a feasible example, the first shape includes at least one of the following: square, circle, horizontal rectangle, vertical rectangle.

[0010] In this application, by introducing multiple first shapes, different first shapes can adapt to different types and directions of defects, improving the versatility and adaptability of the detection method. And the combined use of multiple shapes ensures the comprehensive coverage of the entire first divided area, reducing the risk of missing potential defects, so as to achieve the technical effect of improving the accuracy and reliability of laser additive manufacturing quality detection.

[0011] In a feasible example, before controlling the detection point to move its position in the first divided area, the method further includes: Constructing a trajectory amplitude diagram corresponding to the first divided area based on multiple trajectory amplitude lines. The contour of the trajectory amplitude diagram is the same as the contour of the first divided area. The multiple trajectory amplitude lines correspond to the processing trajectories when machining the first divided area of the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the electrical signal during the process of machining the first divided area of the target slice layer; Controlling the detection point to move its position in the first divided area includes: Determining the first direction in which the amplitude gradient between adjacent pixel points of the detection point in the trajectory amplitude diagram is the largest; Determining a first distance according to the magnitude of the amplitude gradient of the detection point in the first direction in the trajectory amplitude diagram. The larger the amplitude gradient in the first direction, the smaller the first distance; Controlling the detection point to move its position in the first divided area based on the first direction and the first distance.

[0012] In this application, through the intelligent movement strategy based on the amplitude gradient, the detection point can more accurately focus on the potential defect area, improving the accuracy and efficiency of detection, while avoiding missing important information, and significantly enhancing the reliability and efficiency of quality detection in the laser additive manufacturing process.

[0013] In a feasible example, controlling the detection point to move its position in the first divided area includes: Control the detection point to move its position multiple times in the first divided area until the position after the movement of the detection point is the first position; and / or control the detection point to move its position multiple times in the first divided area until the union of multiple first sub-areas covers the first divided area.

[0014] In this application, by controlling each detection point to move multiple times until each detection point moves to the initial position, allowing the detection point to return to the initial position can achieve multiple detections of the same area, verify the previous detection results, and reduce the possibility of misjudgment. And by controlling each detection point to move multiple times to ensure that the union of the obtained multiple first areas and multiple second areas covers the first divided area, the reliability of laser additive manufacturing quality detection can be improved.

[0015] In a feasible example, determining the first target sub-area as an abnormal area includes: if there are multiple first target sub-areas and there is an intersection between the multiple first target sub-areas, then determine the area obtained by merging the multiple first target sub-areas as the abnormal area.

[0016] In this application, if there is also an intersection between the multiple first target sub-areas determined from the multiple first areas and the multiple second areas, then the area obtained by merging the multiple first target sub-areas can be determined as the abnormal area. This can not only avoid duplication between multiple abnormal areas but also facilitate directly determining a larger area with a single defect.

[0017] In a feasible example, the optical signal includes at least one of the following: the light output signal of the laser during the laser additive manufacturing process, as well as the laser reflection signal, infrared light signal, and visible light signal.

[0018] In this application, detecting through multiple optical signals can improve the accuracy of detection.

[0019] In a second aspect, this application provides a laser additive manufacturing quality detection device, and the device includes: An acquisition unit, configured to acquire the electrical signal corresponding to the optical signal in the first time period during the laser additive manufacturing process, where the first time period is the time period of the target slice layer of the target part being processed during the laser additive manufacturing process; A processing unit, configured to, when determining that the amplitude of the electrical signal corresponding to the first divided area within the target slice layer is within the first threshold range corresponding to the first divided area, if among the multiple first sub-areas included in the first divided area, there is a first ratio corresponding to a first target sub-area that is not within the preset ratio range, then determine the first target sub-area as an abnormal area; Wherein, the first ratio corresponding to the first target sub-region is the ratio between the amplitude of the electrical signal corresponding to the first target sub-region and the amplitude of the electrical signal corresponding to the target region of the first shape in the first division region, and the first shape is the shape corresponding to the first target sub-region.

[0020] In a feasible example, the processing unit is further configured to: Determine a plurality of detection points in the first division region; For each detection point among the plurality of detection points, determine a first region of the first shape centered at the first position where the detection point is located; Control the detection point to move its position in the first division region, and determine a second region of the first shape centered at the second position after the detection point moves its position. The plurality of first sub-regions include a plurality of first regions and a plurality of second regions.

[0021] In a feasible example, the first shape includes at least one of the following: square, circle, horizontal rectangle, vertical rectangle.

[0022] In a feasible example, the processing unit is further configured to: Construct a trajectory amplitude map corresponding to the first division region based on multiple trajectory amplitude lines. The contour of the trajectory amplitude map is the same as the contour of the first division region. The multiple trajectory amplitude lines correspond to the processing trajectories when machining the first division region of the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the electrical signal during the process of machining the first division region of the target slice layer; In terms of controlling the detection point to move its position in the first division region, the processing unit is specifically configured to: Determine a first direction in the trajectory amplitude map where the amplitude gradient between adjacent pixel points of the detection point is the largest; Determine a first distance according to the magnitude of the amplitude gradient of the detection point in the first direction in the trajectory amplitude map. The larger the amplitude gradient in the first direction, the smaller the first distance; Control the detection point to move its position in the first division region based on the first direction and the first distance.

[0023] In a feasible example, in terms of controlling the detection point to move its position in the first division region, the processing unit is specifically configured to: Control the detection point to move its position in the first division region multiple times until the position after the detection point moves is the first position; and / or control the detection point to move its position in the first division region multiple times until the union of the plurality of first sub-regions covers the first division region.

[0024] In a feasible example, in terms of determining the first target sub-region as an abnormal region, the processing unit is specifically configured to: If there are multiple first target sub-regions and there is an intersection between the multiple first target sub-regions, the region obtained by merging the multiple first target sub-regions is determined as the abnormal region.

[0025] In a feasible example, the processing unit is further configured to: In the case where the amplitude of the electrical signal corresponding to the first division region within the target slice layer is not within the first threshold range corresponding to the first division region, if among the multiple second sub-regions included in the first division region, there is a second target sub-region whose corresponding electrical signal amplitude is not within the second threshold range corresponding to the second target sub-region, the second target sub-region is determined as the abnormal region.

[0026] In a feasible example, the optical signal includes the light output signal of the laser during the laser additive manufacturing process, as well as the laser reflection signal, the infrared light signal, and the visible light signal.

[0027] In a third aspect, the present application provides an electronic device, which includes a processor, a memory, and a communication interface. The processor, the memory, and the communication interface are interconnected and complete communication with each other. The memory stores executable program code. The communication interface is used for wireless communication. The processor is used to retrieve the executable program code stored on the memory and execute some or all of the steps described in any method of the first aspect, for example.

[0028] In a fourth aspect, the present application provides a computer-readable storage medium. Electronic data is stored in the computer-readable storage medium. When the electronic data is executed by a processor, it is used to execute the electronic data to implement some or all of the steps described in the first aspect of the present application.

[0029] In a fifth aspect, the present application provides a computer program product, including a computer program. The computer program is operable to cause a computer to execute some or all of the steps described in the first aspect of the present application. The computer program product can be a software installation package. Description of the Drawings

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0031] Figure 1 It is a schematic structural diagram of a laser additive manufacturing quality detection system provided by an embodiment of the present application; Figure 2 It is a schematic flowchart of a laser additive manufacturing quality detection method provided by an embodiment of the present application; Figure 3 Schematic flowchart of another laser additive manufacturing quality inspection method provided by an embodiment of the present application; Figure 4 Schematic diagram of the structure of multiple detection points provided by an embodiment of the present application; Figure 5 Schematic diagram of the structure of a first shape provided by an embodiment of the present application; Figure 6 Schematic flowchart of yet another laser additive manufacturing quality inspection method provided by an embodiment of the present application; Figure 7 Block diagram of the functional units of a laser additive manufacturing quality inspection device provided by an embodiment of the present application; Figure 8 Block diagram of the functional units of another laser additive manufacturing quality inspection device provided by an embodiment of the present application; Figure 9 Block diagram of the structure of an electronic device provided by an embodiment of the present application. Detailed implementation manners

[0032] In order to enable those skilled in the art to better understand the solutions of the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present application.

[0033] The terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish different objects, rather than to describe a specific order. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps is not limited to the listed steps, but optionally further includes steps not listed, or optionally further includes other steps inherent to these processes, methods, products, or devices.

[0034] Referring to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The phrase appears in various places in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0035] Currently, the quality inspection of laser additive manufacturing mainly relies on adaptive detection algorithms. The principle of the adaptive algorithm is as follows:

[0036] Among them, represents the selected area feature, represents the regional feature, where feature refers to statistical features such as mean and standard deviation. For the currently selected area, if the ratio calculated based on the foregoing formula is within a reasonable range, the currently selected area is considered normal; if the calculated ratio is within an unreasonable range, the currently selected area is considered abnormal. However, in the case where most of the area in the current slice layer is in abnormal printing, only a small part of the area is in normal printing at this time. The signal at the abnormal printing position will pull the characteristic value corresponding to the current slice layer, so that when calculating the ratio between the characteristic value of the selected area at the normal printing position and the characteristic value of the current slice layer, the ratio will not be within a reasonable range, while the ratio between the characteristic value of the selected area at the abnormal printing position and the characteristic value of the current slice layer is within a reasonable range. At this time, the "reverse selection" phenomenon will occur in the adaptive algorithm. That is, the normal area inside the current slice layer is judged as abnormal, and the abnormal area is judged as normal.

[0037] Based on this, the embodiment of the present application provides a method for quality inspection of laser additive manufacturing. First, obtain the electrical signal corresponding to the optical signal in the time period of the target slice layer of the target part being processed during the laser additive manufacturing process, and then perform reference value detection. That is, when it is determined that the amplitude of the layer electrical signal corresponding to the target slice layer is not within the first threshold range, the abnormal area can be directly determined according to the amplitude of the electrical signal in the area of the target slice layer. When it is determined that the amplitude of the layer electrical signal corresponding to the optical signal is within the first threshold range, then determine the abnormal area in the target slice layer through the adaptive algorithm. This can avoid the "reverse selection" phenomenon and improve the accuracy of the quality inspection of laser additive manufacturing.

[0038] Next, Figure 1 the system architecture of the present application will be described: Please refer to Figure 1 , Figure 1 which is a schematic structural diagram of a quality inspection system for laser additive manufacturing provided by an embodiment of the present application. As Figure 1As shown in the figure, the system includes a laser 1, a field lens 2, a scanning galvanometer 3, a beam splitter 4, a sensor module 5, a signal processor 6, and an industrial control computer 7. The sensor module 5 is coaxially installed in the scanning galvanometer system of the laser additive manufacturing equipment. The sensor module 5 is connected to the signal processor 6 through a signal line, the signal processor 6 is connected to the industrial control computer 7 through a signal line, and the signal processor 6 is connected to the control system 8 of the laser additive manufacturing equipment through a signal line.

[0039] In this embodiment, the laser generated by the laser 1 is first transmitted to the sensor module of the laser output signal of the sensor module 5 through the beam splitter 4. At the same time, the laser generated by the laser 1 also enters the forming cavity 9 through the scanning galvanometer 3 and the field lens 2. The light radiation generated during the laser additive manufacturing process is transmitted to the sensor module 5 through the field lens 2, the scanning galvanometer 3, and the beam splitter 4. The sensor module 5 can perform photoelectric conversion and can photoelectrically convert light radiation signals of multiple wavelengths into electrical signals, including visible light (400 - 700nm), laser reflection (1060 - 1070nm), laser output (1060 - 1070nm), and infrared light (>1200nm); the electrical signal is transmitted to the signal processor 6 through a signal line. The signal processor 6 performs relevant processing on the electrical signal, including signal amplification and filtering, etc. After signal processing, it is then transmitted to the industrial control computer 7 through a signal line. The industrial control computer 7 extracts and processes the corresponding characteristic values of the signal, and compares them with the preset upper and lower threshold values and upper and lower proportional threshold values, so as to judge the processing quality of each slice layer during the additive manufacturing process. The industrial control computer 7 transmits the corresponding processing information to the control system 8 of the laser additive manufacturing equipment through the signal line and the signal processor 6, so as to adjust and optimize the process parameters of the additive manufacturing.

[0040] Optionally, the sensor module 5 includes at least one of a laser output signal sensor, a laser reflection signal sensor, a visible light signal sensor, and an infrared light signal sensor.

[0041] The laser wavelength generated by the laser 1 is 1070 - 1070 nm. The sensor module 5 can achieve optoelectronic conversion, specifically through a silicon photoelectric sensor. The sensor module 5 can perform optoelectronic conversion on light of multiple wavelengths, including visible light (400 - 700 nm), laser reflection (915 nm, 1070 nm, etc.), and infrared light (> 1200 nm). The signal processor 6 processes the electrical signals, including signal amplification and filtering, to increase the signal amplitude and reduce the signal noise. The industrial control computer 7 can further filter the signals, and then determine whether there is an abnormal area in the sliced layer of the part based on the collected electrical signals. If there is an abnormal area, obtain the position information of the abnormal area. Transmit the position information of the abnormal area or other information to the control system 8 of the laser additive manufacturing equipment through a signal line and the signal processor 6, so that the control system controls the laser 1 or the laser processing head or other components that control laser welding in the laser welding system to reprocess the abnormal area.

[0042] In laser processing applications, the infrared radiation signal corresponds to the infrared radiation signal in the wavelength range of 1250 nm to 1700 nm. The visible light radiation signal corresponds to the visible light radiation signal in the range of 400 nm to 700 nm. The laser processing reflection signal corresponds to the processing laser reflection signal during actual laser processing. For example, the processing laser wavelengths are 915 nm, 1064 nm, 1070 nm, etc. The wavelength of the processing laser is related to the wavelength of the actually used laser. In some usage environments, the suitable range of the infrared radiation signal can be extended outside the range of 1250 nm to 1700 nm. In some usage environments, the visible light radiation signal can be extended outside the range of 400 nm to 700 nm.

[0043] In this application, the industrial control computer 7 obtains the electrical signal corresponding to the optical signal of the target sliced layer of the processed target part during the laser additive manufacturing process from the signal processor 6, and then performs a reference value detection. That is, when it is determined that the amplitude of the electrical signal corresponding to the first divided area within the target sliced layer is within the first threshold range, the abnormal sub - area in the first divided area is determined through an adaptive algorithm. This can avoid the "reverse selection" phenomenon and improve the accuracy of the quality detection of laser additive manufacturing.

[0044] Based on this, the embodiments of this application provide a method for detecting the quality of laser additive manufacturing. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0045] Embodiment 1, the context framework of the method for detecting the quality of laser additive manufacturing in the embodiments of this application will be described below.

[0046] Please refer to Figure 2 , Figure 2The flowchart shows a method for detecting the quality of laser additive manufacturing provided by an embodiment of the present application. This method is applied to the above industrial control computer, such as Figure 2 shown. The method includes the following steps: Step S201: Obtain the electrical signal corresponding to the optical signal in the first time period during the laser additive manufacturing process.

[0047] During the laser additive manufacturing process, the sliced layer refers to a series of horizontal thin layers obtained by dividing a three-dimensional digital model along the vertical direction (usually the Z-axis). Each layer is a two-dimensional planar contour representing the cross-sectional shape of the part at that height. During processing, the laser melts or sinters the material (such as metal powder) layer by layer according to the contour information of each layer, and finally stacks into a three-dimensional entity. It can be understood that the electrical signal is obtained by the aforementioned sensor module through photoelectric conversion of the optical signal, which reflects the intensity change of the optical signal.

[0048] Optionally, the optical signal includes at least one of the following: the light output signal of the laser during the laser additive manufacturing process, and the laser reflection signal, infrared light signal, and visible light signal.

[0049] Based on this, the electrical signal corresponding to the optical signal may include one or more of the first electrical signal corresponding to the light output signal, the second electrical signal corresponding to the laser reflection signal, the third electrical signal corresponding to the visible light signal, and the fourth electrical signal corresponding to the infrared light signal.

[0050] During the laser additive manufacturing process, the visible light is radiated by the keyhole metal vapor, the infrared light is radiated by the molten pool, the laser reflection light not absorbed by the powder, and the laser light output signal are collected by the sensor module and converted into electrical signals through photoelectric conversion, including: obtaining the corresponding first voltage value through the laser light output signal sensor, obtaining the corresponding second voltage value through the visible light signal sensor, obtaining the corresponding third voltage value through the laser reflection signal sensor, obtaining the corresponding fourth voltage value through the infrared light signal sensor, and respectively performing gain adjustment on the first voltage value, the second voltage value, the third voltage value, and the fourth voltage value to obtain the adjusted output adjusted electrical signal. During the process of processing the target sliced layer of the target part, the first electrical signal corresponding to the light output signal, the second electrical signal corresponding to the laser reflection signal, the third electrical signal corresponding to the visible light signal, and the fourth electrical signal corresponding to the infrared light signal can be obtained in the above manner.

[0051] Step S202: When it is determined that the amplitude of the electrical signal corresponding to the first divided area within the target sliced layer is within the first threshold range corresponding to the first divided area, if among the multiple first sub-areas included in the first divided area, the first ratio corresponding to the first target sub-area is not within the preset ratio range, then the first target sub-area is determined as an abnormal area.

[0052] Among them, the first ratio corresponding to the first target sub-region is the ratio between the amplitude of the electrical signal corresponding to the first target sub-region and the amplitude of the electrical signal corresponding to the target region of the first shape in the first division region, and is used to evaluate the relative signal strength of this region. The first shape is the shape corresponding to the first target sub-region. The target region may refer to the largest region of the first shape in the first division region. The preset ratio range is a reasonable range set in advance and can be determined according to empirical values.

[0053] It can be understood that the electrical signal includes the amplitude, frequency, phase, etc. of the electrical signal. The amplitude of the electrical signal corresponding to a single region described in this application can be determined according to the electrical signal in this single region. The amplitude of the electrical signal corresponding to a single region also includes the amplitude of the electrical signal corresponding to the light output signal, the amplitude of the electrical signal corresponding to the laser reflection signal, the amplitude of the electrical signal corresponding to the visible light signal, and the amplitude of the electrical signal corresponding to the infrared light signal.

[0054] At the same time, the amplitude of the electrical signal of this single region can be the average amplitude of the electrical signal in this single region or determined by weighted summing the amplitudes of the electrical signals of all points in this single region. It should be understood that during one layer of additive manufacturing, the photoelectric sensor collects the amplitude of the electrical signal corresponding to the light signal of the additive manufacturing point at a certain frequency, and for each layer, the amplitudes of the electrical signals corresponding to multiple additive manufacturing points will be collected.

[0055] Step S203, when it is determined that the amplitude of the electrical signal corresponding to the first division region in the target slice layer is not within the first threshold range of the first division region, if among the multiple second sub-regions included in the first division region, there is a second target sub-region whose amplitude of the electrical signal is not within the second threshold range of the second target sub-region, then the second target sub-region is determined as the abnormal region.

[0056] Optionally, the upper and lower limits of the first threshold range are respectively the maximum and minimum values of the amplitude of the electrical signal corresponding to the first division region during the process of processing a defect-free slice layer under the same processing parameters, and the upper and lower limits of the second threshold range are respectively the maximum and minimum values of the amplitude of the electrical signal corresponding to the second sub-region during the process of processing a defect-free slice layer under the same processing parameters.

[0057] Optionally, the first threshold range and the second threshold range can be the same.

[0058] In addition, the first threshold range can also be divided into the first threshold range corresponding to the light output signal, the first threshold range corresponding to the laser reflection signal, the first threshold range corresponding to the visible light signal, and the first threshold range corresponding to the infrared light signal, and the second threshold range is the same by analogy.

[0059] In this step, it is determined that the electrical signal amplitude corresponding to the first divided area does not fall within the first threshold range, including at least one of the following: the electrical signal amplitude corresponding to the light output signal in the first divided area does not fall within the first threshold range corresponding to the light output signal, the electrical signal amplitude corresponding to the laser reflection signal in the first divided area does not fall within the first threshold range corresponding to the laser reflection signal, the electrical signal amplitude corresponding to the visible light signal in the first divided area does not fall within the first threshold range corresponding to the visible light signal, and the electrical signal amplitude corresponding to the infrared light signal in the first divided area does not fall within the first threshold range corresponding to the infrared light signal.

[0060] Similarly, in this step, it is determined that the electrical signal amplitude corresponding to the second sub-area does not fall within the second threshold range corresponding to the second sub-area, including at least one of the following: the electrical signal amplitude of the light output signal corresponding to the second sub-area does not fall within the second threshold range of the light output signal corresponding to the second sub-area, the electrical signal amplitude of the laser reflection signal corresponding to the second sub-area does not fall within the second threshold range of the laser reflection signal corresponding to the second sub-area, the electrical signal amplitude of the visible light signal corresponding to the second sub-area does not fall within the second threshold range of the visible light signal corresponding to the second sub-area, and the electrical signal amplitude of the infrared light signal corresponding to the second sub-area does not fall within the second threshold range of the infrared light signal corresponding to the second sub-area.

[0061] It can be seen that a laser additive manufacturing quality detection method provided in this embodiment, by acquiring the optical signal in the laser additive manufacturing process and converting it into an electrical signal, first judges through the reference value algorithm to realize the comprehensive quality detection of the target slice layer, and then based on the adaptive algorithm for local area quality detection when the comprehensive quality detection passes, solves the limitations of the adaptive algorithm, avoids the anti-selection phenomenon, and improves the accuracy of laser additive manufacturing quality detection.

[0062] Embodiment 2, the laser additive manufacturing quality detection method will be described below in combination with the details of the area selection.

[0063] Please refer to Figure 3 , Figure 3 which is a schematic flowchart of another laser additive manufacturing quality detection method provided by the embodiment of the present application, and this method is applied to the above industrial control computer. As Figure 3 shown, this method includes the following steps: Step S301, acquire the electrical signal corresponding to the optical signal in the first time period during the laser additive manufacturing process.

[0064] Step S302, when it is determined that the electrical signal amplitude corresponding to the first divided area in the target slice layer falls within the first threshold range corresponding to the first divided area, determine multiple detection points in the first divided area.

[0065] Among them, the detection points can be custom small units, which can be generated by computer program simulation or constructed by actual sensors, probes and other devices. Exemplarily, the detection points can include virtual computing units or physical probes, etc. First, a plurality of detection points are dispersed in the target slice layer. Exemplarily, this can be achieved by evenly distributing a plurality of detection points on the target slice layer, ensuring that the initial spacing between the detection points is reasonable to cover the entire slice layer. The number of the plurality of detection points can be determined according to the size of the target slice layer and the sizes of the subsequently defined third region and fourth region. For example, it is determined according to the ratio between the size of the third region and the size of the target slice layer, and / or the ratio between the size of the fourth region and the size of the target slice layer.

[0066] Step S303: For each of the plurality of detection points, determine a first region of a first shape centered at the first position where the detection point is located.

[0067] Among them, first determine a plurality of detection points at different positions in the first division region. Subsequently, a first region with a first shape and size can be delimited centered on each detection point, and the electrical signal characteristic values within each first region are recorded, so that the technical effect of initially screening out local regions that may have problems by defining the first region can be achieved, providing a basis for further refined detection.

[0068] Step S304: Control the detection points to move positions in the first division region, and determine a second region of the first shape centered at the second position after the detection points move positions.

[0069] Among them, the plurality of first sub-regions include a plurality of first regions and a plurality of second regions. The position movement of the detection points can be carried out in the first division region according to certain rules or randomly. After each detection point moves to the corresponding position, a second region of the first shape is determined centered on each detection point, and the electrical signal characteristic values within each second region are recorded.

[0070] Exemplarily, please refer to Figure 4 , Figure 4 which is a schematic structural diagram of a plurality of detection points provided by an embodiment of the present application. As Figure 4 shown, it includes a plurality of detection points 402, and the plurality of detection points 402 are dispersed on the first division region 401, and the plurality of detection points 402 move in the first division region 401 in their respective corresponding directions.

[0071] In this application, by determining multiple detection points in the first divided area and moving them, the first area and the second area of the first shape are set with the initial position and the moved position of the detection point as the centers respectively. In this way, the adaptive algorithm detection is performed according to the first area and the second area, which can avoid the situation that when the first divided area is fixedly divided into sub-areas, the defect in the first divided area just lies between multiple first sub-areas, making it difficult to effectively detect the defect, thus improving the accuracy of the quality detection of laser additive manufacturing.

[0072] Optionally, the first shape includes at least one of the following: square, circle, horizontal rectangle, vertical rectangle.

[0073] It can be understood that the first shape can also be other polygons except the aforementioned square, circle, horizontal rectangle, and vertical rectangle, such as a rhombus. The first shape can be a specific figure used to define the geometric contour of the detection area, and different types of geometric shapes can be set to adapt to different detection requirements.

[0074] A square is a geometric shape with four equal sides and four right angles, suitable for detecting defects with a relatively uniform distribution. It can be obtained by delimiting a square area with a fixed side length centered on the detection point. Exemplarily, this square area can cover a relatively regular area to be detected and is suitable for preliminary screening or large-scale scanning.

[0075] A circle is a geometric shape where all points are equidistant from the center, suitable for scenarios requiring symmetry detection, especially when the defect may be circular or approximately circular. It can be obtained by delimiting a circular area with a fixed radius centered on the detection point. Exemplarily, this circular area can capture radial changes more naturally.

[0076] A horizontal rectangle is a rectangle with an aspect ratio greater than 1 and the long side along the horizontal direction, suitable for detecting defects extending along the horizontal direction, such as interlayer cracks or horizontally expanding pores. It can be obtained by delimiting a rectangle area with the long side along the horizontal direction centered on the detection point. Exemplarily, this rectangle area can capture signal changes along the horizontal direction more effectively.

[0077] A vertical rectangle is a rectangle with an aspect ratio greater than 1 and the long side along the vertical direction, suitable for detecting defects extending along the vertical direction, such as columnar pores or vertical cracks. It can be obtained by delimiting a rectangle area with the long side along the vertical direction centered on the detection point. Exemplarily, this rectangle area can capture signal changes along the vertical direction more effectively.

[0078] Exemplarily, please refer to Figure 5 , Figure 5 which is a schematic structural diagram of a first shape provided by an embodiment of this application, as Figure 5As shown, it respectively includes the first shape of a square, the first shape of a circle, the first shape of a horizontal rectangle, and the first shape of a vertical rectangle.

[0079] In addition, for the first area or the second area set at the position of each detection point before and after each movement in this application, it can be set according to a single first shape among the foregoing multiple first shapes, or can be set according to the foregoing multiple first shapes. For example, at a single position, first set a circular area, calculate the amplitude value of the electrical signal of this circular area, then set a square area, calculate the amplitude value of the electrical signal of this square area, and then set a horizontal rectangle area, and so on. This can enable the areas set for the detection points at a single position to cover a larger range.

[0080] It can be seen that by introducing multiple first shapes, different first shapes can adapt to different types and directions of defects, improving the versatility and adaptability of the detection method, and the combined use of multiple shapes ensures the comprehensive coverage of the entire first divided area, reducing the risk of missing potential defects, thereby achieving the technical effects of improving the accuracy and reliability of laser additive manufacturing quality detection.

[0081] Optionally, before controlling the detection point to move its position in the first divided area, the method further includes: constructing a trajectory amplitude diagram corresponding to the first divided area based on multiple trajectory amplitude lines, the contour of the trajectory amplitude diagram is the same as the contour of the first divided area, the multiple trajectory amplitude lines correspond to the processing trajectories when processing the first divided area of the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the electrical signal during the process of processing the first divided area of the target slice layer; Controlling the detection point to move its position in the first divided area includes: determining the first direction with the largest amplitude gradient between adjacent pixel points of the detection point in the trajectory amplitude diagram; determining the first distance according to the magnitude of the amplitude gradient of the detection point in the first direction in the trajectory amplitude diagram, the larger the amplitude gradient in the first direction, the smaller the first distance; controlling the detection point to move its position in the first divided area based on the first direction and the first distance.

[0082] Among them, the trajectory amplitude line can be a line representing the change of the electrical signal amplitude on each processing trajectory during the processing process. It can be obtained by recording the electrical signal amplitude on each processing trajectory during the processing process. Exemplarily, the trajectory amplitude line can include the change curves of electrical signals such as laser power and molten pool temperature.

[0083] The trajectory amplitude map can be a two-dimensional image obtained by mapping multiple trajectory amplitude lines into an image, and its contour is the same as the contour of the first divided area, reflecting the distribution of electrical signals in the entire first divided area. It can be obtained by mapping these electrical signal amplitudes onto a two-dimensional plane according to the corresponding processing trajectory positions to form multiple trajectory amplitude lines, and integrating all trajectory amplitude lines into a complete trajectory amplitude map to ensure that its contour is consistent with the contour of the target slice layer. Exemplarily, the trajectory amplitude map can be used to intuitively reflect the distribution of electrical signals in the entire first divided area. It can be understood that it can be directly based on the trajectory amplitude map corresponding to the target slice layer.

[0084] In addition, the amplitude gradient refers to the rate of change of the amplitude of the electrical signal between adjacent pixels. It can be obtained by calculating the amplitude difference between adjacent pixels. For example, the amplitude gradient can be used to indicate the drastic degree of signal change in the area. The area where there may be defects often has a larger amplitude gradient.

[0085] The first direction corresponding to each detection point may be the direction with the largest amplitude gradient in the preset area corresponding to the current position of the detection point. Determining the first direction based on the direction with the largest amplitude gradient can ensure that the detection point is focused on the potential defect area.

[0086] The first distance corresponding to each detection point can be determined according to the magnitude of the amplitude gradient corresponding to the first direction. The larger the amplitude gradient, the smaller the first distance; the smaller the amplitude gradient, the larger the first distance, so as to ensure that the detection point can search for potential defects in detail or improve the search efficiency.

[0087] The technical operation of controlling the detection point to move in the first divided area can be achieved by the following sub-steps: 1. Initialization: Set the initial position and state of the detection point. 2. Iterative movement: Update the position of the detection point one by one according to the calculated first direction and first distance. 3. Stop condition: When the detection point reaches the predetermined stop condition (such as the number of moves reaches the upper limit), it stops moving. 4. Re-delineate the area: After each detection point stops moving, the second area of ​​the first shape will be re-delineated with the final position of each detection point as the center.

[0088] In this application, through an intelligent movement strategy based on amplitude gradient, the inspection point can focus more accurately on the potential defect area, improving the accuracy and efficiency of inspection while avoiding missing important information, significantly improving the reliability and efficiency of quality inspection in the laser additive manufacturing process.

[0089] Step S305: If, among the multiple first sub-regions included in the first divided region, there is a first target sub-region whose first ratio is not within the preset ratio range, the first target sub-region is determined as an abnormal region.

[0090] Optionally, determining the first target sub-region as an abnormal region includes: if there are multiple first target sub-regions and there is an intersection between the multiple first target sub-regions, the region obtained by merging the multiple first target sub-regions is determined as the abnormal region.

[0091] Among them, since the aforementioned multiple detection points may move in the first divided region, there may be an intersection between the multiple first regions and the multiple second regions determined before and after the movement. And if there is also an intersection between the multiple first target sub-regions determined from the multiple first regions and the multiple second regions at this time, then the region obtained by merging the multiple first target sub-regions can be determined as the abnormal region. This can not only avoid duplication between multiple abnormal regions, but also facilitate directly determining a larger single defective region.

[0092] Step S306, in the case where the amplitude of the electrical signal corresponding to the first divided region within the target slice layer is not within the first threshold range corresponding to the first divided region, if among the multiple second sub-regions included in the first divided region, there is a second target sub-region whose corresponding electrical signal amplitude is not within the second threshold range corresponding to the second target sub-region, then the second target sub-region is determined as the abnormal region.

[0093] Embodiment 3: Each detection point may move multiple times. Based on this, the method for detecting the quality of laser additive manufacturing will be described below.

[0094] Please refer to Figure 6 , Figure 6 which is a schematic flowchart of another method for detecting the quality of laser additive manufacturing provided by an embodiment of the present application. This method is applied to the above industrial control computer. As Figure 6 shown, this method includes the following steps: Step S601, obtain the electrical signal corresponding to the optical signal in the first time period during the laser additive manufacturing process.

[0095] Step S602, in the case where the amplitude of the electrical signal corresponding to the first divided region within the target slice layer is within the first threshold range corresponding to the first divided region, determine multiple detection points in the first divided region.

[0096] Step S603, for each detection point among the multiple detection points, determine a first region of a first shape with the first position where the detection point is located as the center.

[0097] Step S604a, control the detection point to move its position multiple times in the first divided region until the position after the movement of the detection point is the first position, and after each stop of the movement of the detection point, determine a second region of the first shape with the second position after the position movement of the detection point as the center.

[0098] Among them, first record the initial position (the first position) of each detection point. According to the amplitude gradient in the trajectory amplitude diagram, determine the moving direction and moving distance of each detection point, and perform the first movement. After each movement, update the position of the detection point, and continue to calculate the amplitude gradient based on the new position to determine the next moving direction and moving distance. After each movement, check whether the detection point has returned to its initial position. If it has not returned, continue to move; if it has returned, stop moving. This process ensures that the detection point can return to the origin for repeated detection or verification after completing the detection within a certain range.

[0099] It can be seen that by controlling each detection point to move multiple times until each detection point moves to the initial position, allowing the detection point to return to the initial position can perform multiple detections on the same area, verify the previous detection results, and reduce the possibility of misjudgment.

[0100] Step S604b: Control the detection point to perform multiple position movements in the first divided area until the union of multiple first sub-areas covers the first divided area. And after each stop movement of the detection point, determine the second area of the first shape with the second position after the position movement of the detection point as the center.

[0101] Among them, before each detection point moves, record the first area corresponding to the current position. Subsequently, when controlling each movement of each detection point, the moving direction and moving distance of each detection point can also be determined according to the amplitude gradient in the trajectory amplitude diagram. After a single movement, record the second area corresponding to the second position after the single position movement of each detection point. At the same time, after each movement, it is also necessary to check whether the union of the multiple first areas and multiple second areas of all detection points has completely covered the first divided area. If it has not been completely covered, continue to move; if it has been covered, stop moving to ensure that no possible defective areas are missed. In addition, if each detection point moves randomly, the moving direction and moving distance of each detection point can also be dynamically adjusted according to the situation of the uncovered area during the movement of each detection point to ensure efficient coverage, avoid unnecessary repeated movements, and improve the detection efficiency.

[0102] It can be seen that by controlling the detection point to move multiple times in the first divided area to ensure that the union of the obtained multiple first areas and multiple second areas covers the first divided area, the reliability of the laser additive manufacturing quality detection can be improved.

[0103] Exemplarily, the update formula for the detection point coordinates is as follows:

[0104] In the above formula, ( , ) represents the i-th movement coordinate of the m-th detection point among multiple detection points, represents the (i + 1)-th movement coordinate of the m-th detection point among multiple detection points, represents the distance of each movement of the detection point, represents the maximum amplitude gradient magnitude and direction in the x direction of the pixel where the detection point is located, represents the maximum amplitude gradient magnitude and direction in the y direction of the pixel where the detection point is located.

[0105] It can be understood that either step S604a or step S604b can be selected to execute the steps.

[0106] Step S605, if among the multiple first sub-regions included in the first division region, there is a first ratio corresponding to the first target sub-region that is not within the preset ratio range, then the first target sub-region is determined as an abnormal region.

[0107] Step S606, in the case where the electrical signal amplitude corresponding to the first division region within the target slice layer is not within the first threshold range corresponding to the first division region, if among the multiple second sub-regions included in the first division region, there is an electrical signal amplitude corresponding to the second target sub-region that is not within the second threshold range corresponding to the second target sub-region, then the second target sub-region is determined as an abnormal region.

[0108] It can be seen that in the embodiment of the present application, by acquiring the optical signal during the laser additive manufacturing process and converting it into an electrical signal, first judging through the reference value algorithm to achieve comprehensive quality detection of the target slice layer, and then performing quality detection on the local area based on the adaptive algorithm in the case of passing the comprehensive quality detection. This can avoid the phenomenon of "reverse selection" in the detection based on the adaptive algorithm when most of the area in the target slice layer is in abnormal printing, and improve the accuracy of the quality detection of laser additive manufacturing.

[0109] Consistent with the above-described embodiment, please refer to Figure 7 , Figure 7 is a functional unit composition block diagram of a laser additive manufacturing quality detection device provided by the embodiment of the present application. The laser additive manufacturing quality detection device is the above industrial control computer or a part of the industrial control computer. As Figure 7 shown, the laser additive manufacturing quality detection device 70 includes: An acquisition unit 701, configured to acquire an electrical signal corresponding to the optical signal in the first time period during the laser additive manufacturing process, where the first time period is the time period of processing the target slice layer of the target part during the laser additive manufacturing process; The processing unit 702 is configured to, when determining that the amplitude of the electrical signal corresponding to the first divided region within the target slice layer is within the first threshold range corresponding to the first divided region, if among the multiple first sub-regions included in the first divided region, the first ratio corresponding to the first target sub-region is not within the preset ratio range, determine the first target sub-region as an abnormal region; Wherein, the first ratio corresponding to the first target sub-region is the ratio between the amplitude of the electrical signal corresponding to the first target sub-region and the amplitude of the electrical signal corresponding to the target region of the first shape in the first divided region, and the first shape is the shape corresponding to the first target sub-region.

[0110] In a feasible embodiment, the processing unit 702 is further configured to: Determine multiple detection points in the first divided region; For each detection point among the multiple detection points, determine a first region of the first shape with the first position where the detection point is located as the center; Control the detection point to move its position in the first divided region, and determine a second region of the first shape with the second position after the detection point moves its position as the center. The multiple first sub-regions include multiple first regions and multiple second regions.

[0111] In a feasible embodiment, the first shape includes at least one of the following: square, circle, horizontal rectangle, vertical rectangle.

[0112] In a feasible embodiment, the processing unit 702 is further configured to: Construct a trajectory amplitude diagram corresponding to the first divided region based on multiple trajectory amplitude lines. The contour of the trajectory amplitude diagram is the same as the contour of the first divided region. The multiple trajectory amplitude lines correspond to the processing trajectories when processing the first divided region of the target slice layer, and the amplitude represented by the trajectory amplitude line is the amplitude of the electrical signal during the process of processing the first divided region of the target slice layer; In terms of controlling the detection point to move its position in the first divided region, the processing unit 702 is specifically configured to: Determine a first direction in the trajectory amplitude diagram where the amplitude gradient between adjacent pixel points of the detection point is the largest; Determine a first distance according to the magnitude of the amplitude gradient of the detection point in the first direction in the trajectory amplitude diagram. The larger the amplitude gradient in the first direction, the smaller the first distance; Control the detection point to move its position in the first divided region based on the first direction and the first distance.

[0113] In a feasible embodiment, in terms of controlling the detection point to move its position in the first divided region, the processing unit 702 is specifically configured to: Control the detection point to move its position multiple times within the first divided area until the position after the movement of the detection point is the first position; and / or control the detection point to move its position multiple times within the first divided area until the union of multiple first sub-areas covers the first divided area.

[0114] In a feasible embodiment, in terms of determining the first target sub-area as an abnormal area, the processing unit 702 is specifically configured to: If there are multiple first target sub-areas and there is an intersection between the multiple first target sub-areas, determine the area obtained by merging the multiple first target sub-areas as the abnormal area.

[0115] In a feasible embodiment, the processing unit 702 is further configured to: In the case where the determined electrical signal amplitude corresponding to the first divided area within the target slice layer is not within the first threshold range corresponding to the first divided area, if among the multiple second sub-areas included in the first divided area, there is a second target sub-area whose corresponding electrical signal amplitude is not within the second threshold range corresponding to the second target sub-area, then determine the second target sub-area as the abnormal area.

[0116] In a feasible embodiment, the optical signal includes the light output signal of the laser during the laser additive manufacturing process, as well as the laser reflection signal, the infrared light signal, and the visible light signal.

[0117] It can be understood that since the method embodiment and the device embodiment are different presentation forms of the same technical concept, therefore, the content of the method embodiment part in this application should be synchronously adapted to the device embodiment part, and will not be elaborated here.

[0118] In the case of adopting an integrated unit, as Figure 8 shown, Figure 8 is a block diagram of the functional unit composition of another laser additive manufacturing quality detection device provided by the embodiment of the present application. In Figure 8 , the laser additive manufacturing quality detection device 70 includes: a processing module 812 and a communication module 811. The processing module 812 is used to control and manage the actions of the laser additive manufacturing quality detection device 70. For example, the steps of the acquisition unit 701 and the processing unit 702, and / or used to execute other processes of the technologies described herein. The communication module 811 is used to support the interaction between the laser additive manufacturing quality detection device 70 and other devices. As Figure 8 shown, the laser additive manufacturing quality detection device 70 may further include a storage module 813, and the storage module 813 is used to store the program code and data of the laser additive manufacturing quality detection device 70.

[0119] Among them, the processing module 812 can be a processor or a controller. For example, it can be a Central Processing Unit (CPU), a general-purpose processor, a Digital Signal Processor (DSP), an ASIC, an FPGA, or other programmable logic devices, transistor logic devices, hardware components, or any combination thereof. It can implement or execute various exemplary logical blocks, modules, and circuits described in connection with the disclosure of the present application. The processor can also be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of a DSP and a microprocessor, and so on. The communication module 811 can be a transceiver, an RF circuit, a communication interface, or the like. The storage module 813 can be a memory.

[0120] Among them, all relevant contents of each scenario involved in the above method embodiment can be cited in the function description of the corresponding functional module, and will not be repeated here. The above laser additive manufacturing quality inspection device 70 can execute the above Figure 2 shown laser additive manufacturing quality inspection method.

[0121] The above embodiments can be implemented in whole or in part by software, hardware, firmware, or any other combination. When implemented using software, the above embodiments can be implemented in whole or in part in the form of a computer program product. The computer program product includes one or more computer instructions or computer programs. When the computer instructions or computer programs are loaded or executed on a computer, the processes or functions according to the embodiments of the present application are generated in whole or in part. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable devices. The computer instructions can be stored in a computer-readable storage medium, or transmitted from one computer-readable storage medium to another computer-readable storage medium. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center in a wired or wireless manner. The computer-readable storage medium can be any available medium that the computer can access or a data storage device such as a server or data center that contains one or more collections of available media. The available medium can be a magnetic medium (e.g., a floppy disk, a hard disk, a magnetic tape), an optical medium (e.g., a DVD), or a semiconductor medium. The semiconductor medium can be a solid-state drive.

[0122] Figure 9 is a structural block diagram of an electronic device provided by an embodiment of the present application. As Figure 9As shown in the figure, the electronic device 900 may include one or more of the following components: a processor 901, a memory 902, and a communication interface 903. The processor 901, the memory 902, and the communication interface 903 are interconnected and communicate with each other. The memory 902 may store one or more computer programs, and the one or more computer programs may be configured to implement the methods described in the above embodiments when executed by one or more processors 901.

[0123] The processor 901 may include one or more processing cores. The processor 901 connects various parts within the entire electronic device 900 through various interfaces and lines. By running or executing instructions, programs, code sets, or instruction sets stored in the memory 902, and by calling data stored in the memory 902, the processor 901 performs various functions of the electronic device 900 and processes data. Optionally, the processor 901 may be implemented in at least one of the following hardware forms: Digital Signal Processing (DSP), Field-Programmable Gate Array (FPGA), or Programmable Logic Array (PLA). The processor 901 may integrate one or a combination of a Central Processing Unit (CPU), a Graphics Processing Unit (GPU), and a modem, etc. It can be understood that the above-mentioned modem may not be integrated into the processor 901 and may be implemented separately through a communication chip.

[0124] The memory 902 may include Random Access Memory (RAM) and may also include Read-Only Memory (ROM). The memory 902 is used to store instructions, programs, code, code sets, or instruction sets. The memory 902 may include a program storage area and a data storage area. Among them, the program storage area may store instructions for implementing the operating system, instructions for implementing at least one function (such as touch function, sound playback function, image playback function, etc.), and instructions for implementing the above method embodiments. The data storage area may also store data created during the use of the electronic device 900.

[0125] It can be understood that the electronic device 900 may include more or fewer structural elements than those shown in the above block diagram. For example, it may include a power module, physical buttons, a WiFi (Wireless Fidelity) module, a speaker, a Bluetooth module, sensors, etc., which are not limited herein.

[0126] The above-mentioned electronic device 900 may be an industrial control computer or a part of an industrial control computer.

[0127] An embodiment of the present application provides a computer-readable storage medium. Among them, program data is stored in the computer-readable storage medium. When the program data is executed by a processor, it is used to execute some or all of the steps of any one of the laser additive manufacturing quality inspection methods described in the above method embodiments.

[0128] An embodiment of the present application also provides a computer program product, including a computer program. The computer program is operable to cause a computer to execute some or all of the steps of any one of the laser additive manufacturing quality inspection methods described in the above method embodiments. The computer program product may be a software installation package.

[0129] It should be noted that for any of the method embodiments of the above-mentioned laser additive manufacturing quality inspection methods, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the present application is not limited by the described action sequence, because according to the present application, some steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions involved are not necessarily essential to the present application.

[0130] Although the present application has been described in combination with various embodiments herein, however, in the process of implementing the claimed present application, those skilled in the art can understand and implement other changes of the disclosed embodiments by viewing the drawings, the disclosed content, and the appended claims. In the claims, the word "comprising" does not exclude other components or steps, and "a" or "an" does not exclude a plurality of situations. Certain measures are recited in mutually different dependent claims, but this does not mean that these measures cannot be combined to produce good results.

[0131] Those of ordinary skill in the art can understand that all or part of the steps of the various methods of any of the above-mentioned method embodiments of the laser additive manufacturing quality inspection methods can be completed by instructing relevant hardware through a program. The program can be stored in a computer-readable memory, and the memory may include: a flash drive, a read-only memory (abbreviation: ROM), a random access memory (abbreviation: RAM), a magnetic disk, or an optical disc, etc.

[0132] The above has introduced the embodiments of the present application in detail. Specific examples are used herein to elaborate on the principle and implementation manner of a method and device for laser additive manufacturing quality inspection of the present application. The description of the above embodiments is only used to help understand the method of the present application and its core idea; at the same time, for those of ordinary skill in the art, according to the idea of a method and device for laser additive manufacturing quality inspection of the present application, there will be changes in the specific implementation manner and application scope. In summary, the content of this specification should not be construed as a limitation to the present application.

[0133] This application is described with reference to the flowcharts and / or block diagrams of the methods, hardware products, and computer program products of the embodiments of the present application. It should be understood that each process and / or block in the flowchart and / or block diagram, as well as the combination of processes and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing devices to generate a machine, so that the instructions executed by the processor of the computer or other programmable data processing devices generate a device for implementing the functions specified in Figure 1 one process or multiple processes and / or blocks Figure 1 one block or multiple blocks.

[0134] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer-readable memory generate a manufactured product including an instruction device, and the instruction device implements the functions specified in Figure 1 one process or multiple processes and / or blocks Figure 1 one block or multiple blocks.

[0135] These computer program instructions can also be loaded onto a computer or other programmable data processing device, so that a series of operation steps are executed on the computer or other programmable device to generate a computer-implemented process. Thus, the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in Figure 1 one process or multiple processes and / or blocks Figure 1 one block or multiple blocks.

[0136] It can be understood that any product that is controlled or configured to execute the processing method of the flowchart described in the method embodiments of a method for laser additive manufacturing quality inspection of the present application, such as the terminal of the above flowchart and the computer program product, belongs to the category of related products described in the present application.

[0137] Obviously, those skilled in the art can make various modifications and variations to a laser additive manufacturing quality inspection method and device provided by this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalent technologies, this application also intends to include these modifications and variations.

Claims

1. A laser additive manufacturing quality inspection method, characterized in that: The method comprises: Acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period for processing a target slice layer of a target part during the laser additive manufacturing process; When it is determined that the amplitude of the electrical signal corresponding to the first divided area in the target slice layer is within the first threshold range corresponding to the first divided area, if, among the multiple first sub-areas included in the first divided area, there is a first target sub-area whose first ratio is not within the preset ratio range, the first target sub-area is determined as an abnormal area; Among them, the first ratio corresponding to the first target sub-region is the ratio between the electrical signal amplitude corresponding to the first target sub-region and the electrical signal amplitude corresponding to the target region of the first shape in the first divided area, and the first shape is the shape corresponding to the first target sub-region.

2. The method according to claim 1, characterized in that Before determining the first target sub-region as an abnormal region, the method further includes: Determine a plurality of detection points in the first divided area; For each detection point among the plurality of detection points, determining a first area of ​​the first shape with a first position of the detection point as a center; The detection point is controlled to move in the first divided area, and a second area of ​​the first shape is determined with a second position of the detection point after the movement as the center, and the multiple first sub-areas include multiple first areas and multiple second areas.

3. The method according to claim 2, characterized in that The first shape includes at least one of the following: a square, a circle, a horizontal rectangle, and a vertical rectangle.

4. The method according to claim 2, characterized in that: Before controlling the detection point to move in the first divided area, the method further includes: constructing a trajectory amplitude map corresponding to the first divided area based on a plurality of trajectory amplitude lines, wherein the contour of the trajectory amplitude map is the same as the contour of the first divided area, the plurality of trajectory amplitude lines correspond to processing trajectories when processing the first divided area of ​​the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the electrical signals during the processing of the first divided area of ​​the target slice layer; The controlling the detection point to move in the first divided area includes: Determine a first direction in which the amplitude gradient between adjacent pixels of the detection point is the largest in the trajectory amplitude map; determining a first distance according to a magnitude of an amplitude gradient of the detection point in the first direction in the trajectory amplitude map, wherein the greater the amplitude gradient in the first direction, the smaller the first distance; The detection point is controlled to move in the first divided area based on the first direction and the first distance.

5. The method according to claim 2, characterized in that: The controlling the detection point to move in the first divided area includes: Controlling the detection point to move multiple times in the first divided area until the position of the detection point after the movement is the first position; and / or The detection point is controlled to move multiple times in the first divided area until the union of the multiple first sub-areas covers the first divided area.

6. The method according to claim 2, characterized in that The determining the first target sub-region as an abnormal region includes: If there are multiple first target sub-regions, and there is an intersection between the multiple first target sub-regions, then the region where the multiple first target sub-regions are merged is determined as the abnormal region.

7. The method according to claim 1, characterized in that The method further comprises: When it is determined that the electrical signal amplitude corresponding to the first divided area within the target slice layer is not within the first threshold range corresponding to the first divided area, if among the multiple second sub-areas contained in the first divided area, there is a second target sub-area whose electrical signal amplitude corresponding to the second target sub-area is not within the second threshold range corresponding to the second target sub-area, then the second target sub-area is determined as an abnormal area.

8. The method according to claim 1, characterized in that The optical signal includes at least one of the following: The laser output signal, laser reflection signal, infrared light signal and visible light signal of the laser in the laser additive manufacturing process.

9. A laser additive manufacturing quality detection device, characterized in that: The device comprises: An acquisition unit, configured to acquire an electrical signal corresponding to an optical signal in a first time period during a laser additive manufacturing process, wherein the first time period is a time period for processing a target slice layer of a target part during the laser additive manufacturing process; a processing unit, configured to, when determining that the amplitude of the electrical signal corresponding to the first divided area in the target slice layer is within the first threshold range corresponding to the first divided area, determine the first target sub-area as an abnormal area if, among the plurality of first sub-areas included in the first divided area, a first ratio corresponding to the first target sub-area is not within the preset ratio range; Among them, the first ratio corresponding to the first target sub-region is the ratio between the electrical signal amplitude corresponding to the first target sub-region and the electrical signal amplitude corresponding to the target region of the first shape in the first divided area, and the first shape is the shape corresponding to the first target sub-region.

10. The device according to claim 9, characterized in that The processing unit is further used for: Determine a plurality of detection points in the first divided area; For each detection point among the plurality of detection points, determining a first area of ​​the first shape with a first position of the detection point as a center; The detection point is controlled to move in the first divided area, and a second area of ​​the first shape is determined with a second position of the detection point after the movement as the center, and the multiple first sub-areas include multiple first areas and multiple second areas.

11. The device according to claim 10, characterized in that The first shape includes at least one of the following: a square, a circle, a horizontal rectangle, and a vertical rectangle.

12. The device according to claim 10, characterized in that The processing unit is further used for: constructing a trajectory amplitude map corresponding to the first divided area based on a plurality of trajectory amplitude lines, wherein the contour of the trajectory amplitude map is the same as the contour of the first divided area, the plurality of trajectory amplitude lines correspond to processing trajectories when processing the first divided area of ​​the target slice layer, and the amplitudes represented by the trajectory amplitude lines are the amplitudes of the electrical signals during the processing of the first divided area of ​​the target slice layer; In terms of controlling the detection point to move in the first divided area, the processing unit is specifically used to: Determine a first direction in which the amplitude gradient between adjacent pixels of the detection point is the largest in the trajectory amplitude map; determining a first distance according to a magnitude of an amplitude gradient of the detection point in the first direction in the trajectory amplitude map, wherein the greater the amplitude gradient in the first direction, the smaller the first distance; The detection point is controlled to move in the first divided area based on the first direction and the first distance.

13. The device according to claim 10, characterized in that In terms of controlling the detection point to move in the first divided area, the processing unit is specifically configured to: Controlling the detection point to move multiple times in the first divided area until the position of the detection point after the movement is the first position; and / or The detection point is controlled to move multiple times in the first divided area until the union of the multiple first sub-areas covers the first divided area.

14. The device according to claim 10, characterized in that In terms of determining the first target sub-region as an abnormal region, the processing unit is specifically configured to: If there are multiple first target sub-regions, and there is an intersection between the multiple first target sub-regions, then the region where the multiple first target sub-regions are merged is determined as the abnormal region.

15. The device according to claim 9, characterized in that The processing unit is further used for: When it is determined that the electrical signal amplitude corresponding to the first divided area within the target slice layer is not within the first threshold range corresponding to the first divided area, if among the multiple second sub-areas contained in the first divided area, there is a second target sub-area whose electrical signal amplitude corresponding to the second target sub-area is not within the second threshold range corresponding to the second target sub-area, then the second target sub-area is determined as an abnormal area.

16. The device according to claim 9, characterized in that The optical signal includes an output light signal of a laser in the laser additive manufacturing process, as well as a laser reflection signal, an infrared light signal and a visible light signal.

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