Processor unit, processor system and electronic device

Abstract

The present application discloses a processor unit, a processor system and an electronic device, which relates to the technical field of electronic devices, and includes a mainboard, the front of which is provided with an accessory mounting slot; a computing module, which is integrated on the back of the mainboard; a heat dissipation module, which is provided in a one-to-one correspondence with the mainboard and the computing module, and the heat dissipation module is provided on the back of the mainboard, and the projection of the heat dissipation module on the mainboard at least partially overlaps with the projection of the computing module on the mainboard; a bus, which is connected to the mainboard and is used to supply power to the mainboard. When a single processor unit is damaged or needs to be replaced, only the damaged or replaced processor unit needs to be disassembled and assembled, which does not affect the normal use of other processor units, nor does it affect other processor units, thereby improving the service maintenance efficiency. In addition, an independent heat dissipation module is configured in a single processor unit, and the heat dissipation modules of the processor units can be controlled separately, thereby improving the heat dissipation efficiency and reducing losses.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a processor unit, a processor system, and an electronic device. Background Art

[0002] With the rapid development of information technology, servers are increasingly being used in data centers, cloud computing, and other fields. The performance and stability of the computing units (GPUs, CPUs, and XPUs) in servers, as core components, directly impact the operation of the entire server. As the demand for server computing power continues to increase, the number of computing units will also continue to grow.

[0003] Traditional electronic devices often integrate several CPUs onto a single motherboard, making spatial arrangement difficult and wiring difficult and complex. Furthermore, CPU damage requires the removal of numerous peripheral components, significantly increasing maintenance costs and making upgrades or replacements difficult. Furthermore, the need for centralized CPU cooling often necessitates large heat dissipation structures, leading to bloated internal space and poor utilization. This compromises heat dissipation efficiency and results in unnecessary losses. Summary of the Invention

[0004] The present application provides a processor unit, a processor system, and an electronic device to at least solve the problems of difficulty in maintaining and replacing processors and low space utilization in traditional electronic devices in the related art.

[0005] The present application provides a processor unit, comprising: a mainboard, wherein the front side of the mainboard is provided with an accessory mounting slot;

[0006] A computing module, integrated on the back of the mainboard;

[0007] a heat dissipation module, disposed on the back of the mainboard, wherein a projection of the heat dissipation module on the mainboard at least partially overlaps with a projection of the computing module on the mainboard;

[0008] There are two buses, each of which is a positive bus and a negative bus. The positive bus and the negative bus are respectively connected to the mainboard for supplying power to the mainboard.

[0009] In some embodiments, two mounting grooves are provided on a side of the heat dissipation module away from the mainboard. The two mounting grooves are arranged in parallel and are respectively arranged at two opposite edges of the heat dissipation module; the two busbars are respectively embedded in the two mounting grooves.

[0010] In some embodiments, the busbar is provided with a conductive column, the busbar is provided with a through hole, and the conductive column passes through the through hole to be electrically connected to the mainboard.

[0011] In some embodiments, the heat dissipation module includes a liquid cooling plate and a medium flow channel arranged in the liquid cooling plate. A water inlet and a water outlet are provided on the side wall of the liquid cooling plate. The water inlet is connected to one end of the medium flow channel, and the water outlet is connected to the other end of the medium flow channel.

[0012] In some embodiments, a voltage regulating module is further included. The voltage regulating module is integrated on the back of the mainboard and located on at least one side of the computing module, and is used to regulate the power supply voltage of the mainboard.

[0013] In some embodiments, the computing module is packaged on the mainboard using ball welding.

[0014] The present application also provides a processor system, comprising at least two processor units as described above, wherein the at least two processor units are arranged in a matrix, and the buses between the processor units are connected via conductive connectors.

[0015] In some embodiments, the conductive connection member is located below the processor unit, and the conductive connection member connects the processor units in series.

[0016] In some embodiments, the processor system includes M columns of processor modules, each column of the processor modules includes N processor units, and the conductive connection includes a first connection, a second connection, and a third connection;

[0017] Both M and N are positive integers greater than or equal to 1, and M and N are not equal to 1 at the same time;

[0018] When M=1 and N≥2, the positive busbars of the N processor units are connected in series via the first connector, and the negative busbars of the N processor units are connected in series via the second connector;

[0019] When M≥2 and N=1, the positive busbars and the negative busbars of the two processor units in two adjacent columns of the processor modules are connected in series via a third connecting member;

[0020] When M≥2 and N≥2, the positive busbars of the N processor units in at least one column of the processor modules are connected in series via the first connecting member, the negative busbars of the N processor units in each of the remaining columns of the processor modules are connected in series via the second connecting member, and the positive busbars and negative busbars of two processor units arranged opposite to each other in two adjacent columns of the processor modules are respectively connected in series via the third connecting member.

[0021] In some embodiments, the first connector includes a first main connection line and N first branch connection lines, the N first branch connection lines are arranged at intervals along the length direction of the first main connection line on a side of the first main connection line facing the processor unit, and the N first branch connection lines are electrically connected to the positive bus bars on the N processor units in the processor module in a one-to-one correspondence;

[0022] The second connecting member includes a second connecting main line and N second connecting branch lines, the N second connecting branch lines are arranged at intervals along the length direction of the second connecting main line on a side of the second connecting main line facing the processor unit, and the N second connecting branch lines are electrically connected to the negative bus bars on the N processor units in the processor module in a one-to-one correspondence;

[0023] The number of the third connectors is (M-1)×2N, and the third connectors are used to electrically connect the positive busbars of two processor units disposed opposite to each other in adjacent columns, and to electrically connect the negative busbars of two processor units disposed opposite to each other in adjacent columns.

[0024] In some embodiments, the heat dissipation modules in the M×N processor units are connected in series, or the heat dissipation modules in at least some of the processor units are connected in parallel.

[0025] In some embodiments, when M=1, N≥2, or when M≥2, N=1, the heat dissipation modules of each of the processor units are connected in series through connecting pipes, or the heat dissipation modules of at least some of the processor units are connected in parallel through the connecting pipes.

[0026] In some embodiments, when M≥2, N≥2,

[0027] The heat dissipation modules of the processor units in the same column are connected in series with each other through the connecting pipes, and are then connected in series or in parallel with the heat dissipation modules of the processor units in adjacent columns through the connecting pipes;

[0028] Alternatively, the heat dissipation modules of the processor units in the same row are connected in series with each other through the connecting pipes, and then connected in series or in parallel with the heat dissipation modules of the processor units in adjacent rows through the connecting pipes.

[0029] In some embodiments, a high-speed connector is further provided on the front of the mainboard, and communication connection between the processor units is achieved through the high-speed connector.

[0030] The present application also provides an electronic device, comprising: a processor system as described in any one of the above items.

[0031] Through the present application, since the processor is made into an independent processor unit, each processor unit includes a mainboard, a computing module, a heat dissipation module and a bus for power supply. For a single processor unit, it can realize the function of a central processing unit and realize independent power supply and heat dissipation. The computing module is integrated into the back of the mainboard, and the space on the back of the mainboard is utilized. On the basis of not affecting the installation of other peripheral components, the space occupied by the front of the mainboard is reduced, and more configuration units can be added to the front of the mainboard to improve the computing efficiency of the electronic device. When a single processor unit is damaged or needs to be replaced, it is only necessary to disassemble and assemble the damaged or replaced processor unit, which does not affect the normal use of other processor units and will not affect other processor units, thereby improving the service maintenance efficiency. In addition, an independent heat dissipation module is configured in the single processor unit, and the heat dissipation module of each processor unit can be controlled separately, thereby improving the heat dissipation efficiency and reducing losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0033] Figure 1 A schematic structural diagram of a mainboard, a heat dissipation module, and an accessory mounting slot in a processor unit provided in an embodiment of the present application;

[0034] Figure 2 A schematic diagram of the structure of a processor unit provided in an embodiment of the present application;

[0035] Figure 3 An exploded diagram of a processor unit provided in an embodiment of the present application;

[0036] Figure 4 A cross-sectional view of a processor unit provided in an embodiment of the present application;

[0037] Figure 5 A schematic diagram of the structure of the heat dissipation module provided in an embodiment of the present application;

[0038] Figure 6 A schematic diagram of the structure of the bus provided in an embodiment of the present application;

[0039] Figure 7 A schematic diagram of the structure of a processor system provided in an embodiment of the present application;

[0040] Figure 8 A schematic diagram of the back structure of a processor system provided in an embodiment of the present application.

[0041] The above drawings include the following reference numerals:

[0042] 1. Mainboard; 101. Connection hole;

[0043] 2. Accessory mounting slot;

[0044] 3. Computing module; 301. Solder ball;

[0045] 4. Voltage regulation module;

[0046] 5. Heat dissipation module; 51. Liquid cooling plate; 52. Medium flow channel; 501. Through hole; 511. Mounting groove; 521. Water inlet; 522. Water outlet;

[0047] 6. Busbar; 61. Positive busbar; 62. Negative busbar; 601. Conductive column;

[0048] 10. Processor unit; 20. Conductive connector; 30. Liquid cooling device; 40. Connecting pipe; 50. Power supply; 201. First connector; 202. Second connector; 203. Third connector. DETAILED DESCRIPTION

[0049] The following will be combined with the accompanying drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0050] It should be noted that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "back," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like, indicating positions or relationships, are based on the positions or relationships shown in the accompanying drawings and are intended solely for ease of description and simplification of the present application. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limiting the present application. The terms "mounted," "connected," and "connected" should be interpreted broadly, and may include, for example, fixed, removable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediary; and internal communication between two components. The terms "parallel," "perpendicular," and "equal" encompass the described conditions and conditions similar to the described conditions, provided that the range of the similar conditions is within an acceptable range of deviation, as determined by a person of ordinary skill in the art taking into account the measurement in question and the errors associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes both absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism may be, for example, within 5°; "perpendicular" includes both absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity may also be, for example, within 5°. "Equal" includes both absolute equality and approximate equality, where the acceptable deviation range for approximate equality may be, for example, that the difference between the two is less than or equal to 5% of either. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0051] In order to enable those skilled in the art to better understand the present application, the present application is further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0052] like Figures 1 to 6 As shown, an embodiment of the present application provides a processor unit 10, including:

[0053] Motherboard 1 is a motherboard specifically developed for electronic equipment applications requiring high stability, high performance, and high compatibility. Multiple accessory mounting slots 2 are provided on the front of motherboard 1. These slots are used to accommodate various pluggable accessories for computing module 3, such as hard drives, memory circuit boards, PCIe cards, and connectors. This application uses memory as an example, and the corresponding accessory mounting slots 2 are memory slots.

[0054] In some embodiments of the present application, the mainboard 1 is in the form of a printed circuit board, that is, a PCB board.

[0055] Memory, also known as internal storage, temporarily stores processor data and data exchanged with external storage devices like hard drives. It bridges the gap between the processor and the outside world and is an integral part of the entire computing unit. Memory acts as a buffer between the computing module 3 and the hard drive, serving as temporary storage for data. Programs are dispatched to memory during execution, and data is automatically released from memory when the electronic device or program is shut down.

[0056] The memory module is a computer component that can be addressed by the computing module 3 via the bus and read and write operations. Historically, the memory module served as an extension of the main memory in personal computers. With the continuous advancement of computer software and hardware technology, the memory module has become the entire read-write memory. When we talk about the size of computer memory (RAM), we are referring to the total capacity of the memory module.

[0057] Memory modules are essential components of computers. The computing module 3 accesses memory through the data bus. Historically, main memory existed on the motherboard 1, with the memory modules acting as an extension of that memory. However, today's computers lack main memory, requiring the computing module 3 to rely entirely on memory modules. All content in external memory must be accessed through memory.

[0058] A memory slot is a slot for inserting memory sticks. The supported memory type and capacity are determined by the memory slot. There are typically at least two memory slots, and a maximum of four, six, or eight. More memory slots allow for the insertion of multiple memory sticks; some chipsets and systems can support 32GB or more. Dual-channel memory requires that memory sticks of the same color be inserted; improper insertion will not enable dual-channel memory. Some electronic devices are designed with fewer memory slots due to cost constraints.

[0059] The processor unit 10 also includes a computing module 3, which includes at least one of a graphics processing unit (GPU), a central processing unit (CPU), or an extensible processing unit (XPU). As the computing and control core of the computer system, computing module 3 is the final execution unit for information processing and program execution. Its primary function is to interpret computer instructions and process data in computer software. Computing module 3 is the core component in the computer responsible for reading, decoding, and executing instructions. Computing module 3 primarily consists of two parts: a controller and an arithmetic unit, as well as a cache memory and a data and control bus that connects them. Computing module 3 is integrated on the back of the motherboard 1. Specifically, computing module 3 and accessory mounting slot 2 are located on opposite sides of the motherboard 1, separating the computing module 3 (which generates the most heat) from accessories (which generate less heat) on the motherboard 1.

[0060] The processor unit 10 also includes a heat dissipation module 5, which is arranged in a one-to-one correspondence with the motherboard 1 and the computing module 3. The heat dissipation module 5 is arranged on the side of the computing module 3 facing away from the motherboard 1, and the projection of the heat dissipation module 5 on the motherboard 1 at least partially overlaps with the projection of the computing module 3 on the motherboard 1; the heat dissipation module 5 is used to dissipate heat from the computing module 3; the heat dissipation module 5 can adopt air cooling or liquid cooling. Taking liquid cooling as an example, in some embodiments of the present application, the heat dissipation module 5 adopts a liquid cooling plate 51, and a medium flow channel 52 for the circulation of the heat dissipation medium is formed in the liquid cooling plate 51. The liquid cooling plate 51 is fitted with the computing module 3 to dissipate heat from the computing module 3, so as to keep the computing module 3 at a suitable operating temperature and avoid overheating that affects the performance of the computing module 3.

[0061] The processor unit 10 also includes a bus 6, which is connected to the motherboard 1 and provides power to the motherboard. Bus 6 is a relay station on the motherboard 1 that gathers all data and transmits it. Generally, the system uses bus 6 to install various interface cards and transmit various data to the devices connected to the interface cards. This bus is also called a bus. A bus can serve multiple components. Its basic operating principle is that the sending component sends information to the bus in a time-sharing manner, and the bus then sends this information simultaneously to the receiving components. Which component receives the information is determined by a control signal generated by decoding the device address provided by the computing module 3. In the field of electrical engineering, bus 6 (also known as busbar, bus bar, etc.) is generally used to connect multiple electrical lines. Using bus 6 to power the motherboard 1 reduces the number of power supply cables 50 connected, saving internal space in the electronic device.

[0062] Compared to traditional electronic devices, the processor unit 10 of the embodiment of the present application uses a heat dissipation module 5 to directly contact the computing module 3, without the need for additional heat conduction pipes. Through the present application, since the processor is made into an independent processor unit 10, each processor unit 10 includes a motherboard 1, a computing module 3, a heat dissipation module 5 and a bus 6 for power supply. For a single processor unit 10, it can realize the function of a central processor and realize independent power supply and heat dissipation. The computing module 3 is integrated into the back of the motherboard 1, utilizing the space on the back of the motherboard 1. On the basis of not affecting the installation of other peripheral components, the space occupied by the front of the motherboard 1 is reduced, and more configuration units can be added to the front of the motherboard 1, thereby improving the computing efficiency of the electronic device. When a single processor unit 10 is damaged or needs to be replaced, only the damaged or replaced processor unit 10 needs to be disassembled and assembled, which does not affect the normal use of other processor units 10, nor does it affect other processor units 10, thereby improving the service maintenance efficiency. In addition, an independent heat dissipation module 5 is configured in the single processor unit 10, and the heat dissipation module 5 of each processor unit 10 can be controlled separately, thereby improving the heat dissipation efficiency and reducing the loss.

[0063] like Figure 3 As shown, in some embodiments of the present application, the computing module 3 utilizes a ball solder package. The computing module 3 includes a central processing unit (CPU) chip and a substrate. Ball solder packaging achieves electrical connection to the motherboard 1 by arranging spherical solder joints (solder balls 301) on the bottom of the chip. Solder balls 301 are arranged in an array on the bottom surface of the chip. Solder balls 301 replace traditional pins, providing higher I / O density and shorter signal paths. Solder balls 301 are typically made of a high-melting-point alloy (such as tin-lead alloy or lead-free solder) and form a reliable connection to the pads on the motherboard 1 through a reflow soldering process. Ball solder packaging allows for more I / O pins to be arranged within a limited space, meeting the high-speed data transmission requirements of modern computing modules 3. The short, thick solder ball 301 path reduces inductance and resistance, improving signal integrity and reducing signal latency. The large contact area between the solder balls 301 and the PCB enhances thermal conductivity, effectively reducing the operating temperature of the computing module 3 when used with a heat sink or heat dissipation module 5. The array of solder balls 301 provides uniform mechanical support, reducing the risk of connection failure due to thermal stress or mechanical vibration.

[0064] In some embodiments of the present application, the projection area of ​​the computing module 3 on the mainboard 1 is smaller than or equal to the area of ​​the mainboard 1 , so that the computing module 3 can be stably connected to the mainboard 1 in terms of communication and mechanical connection.

[0065] like Figure 2As shown, in some embodiments of the present application, the processor unit 10 further includes a voltage regulating module 4, which is integrated on the back of the motherboard 1 and is used to regulate the power supply voltage of the motherboard 1. Specifically, the voltage regulating module 4 includes a VR (Voltage Regulator) chip, which is integrated on the back of the motherboard 1 and is located on at least one side of the computing module 3. In some embodiments of the present application, one processor unit 10 is configured with two voltage regulating modules 4, and the two voltage regulating modules 4 are symmetrically arranged on both sides of the computing module 3. Of course, the number of voltage regulating modules 4 can also be 3, 4 or more, and the specific number is selected according to the power consumption of the computing module 3. When the power consumption of the computing module 3 is relatively small, there can also be one voltage regulating module 4.

[0066] In some embodiments of the present application, the voltage regulator module 4 is located between the heat dissipation module 5 and the motherboard 1. After the voltage regulator module 4 is installed, the outer surface of the voltage regulator module 4 does not protrude beyond the outer surface of the computing module 3. In other words, after the heat dissipation module 5 is installed, the heat dissipation module 5 and the outer surface of the computing module 3 are aligned, and can be aligned with the outer surface of the voltage regulator module 4 or with a gap between them. This ensures that heat dissipation is preferentially provided to the computing module 3.

[0067] For example, a first escape groove can be provided on the back of the motherboard 1, and a second escape groove can be provided at a corresponding position of the heat dissipation module 5. The computing module 3 is embedded in the first escape groove and protrudes from the back of the motherboard 1, and the portion of the computing module 3 protruding from the back of the motherboard 1 is correspondingly embedded in the second escape groove. This allows the heat dissipation module 5 to fit both the computing module 3 and the voltage regulation module 4, thereby simultaneously cooling and dissipating heat for the computing module 3 and the voltage regulation module 4.

[0068] In some embodiments of the present application, the projection of the heat dissipation module 5 on the mainboard 1 is greater than or equal to the area of ​​the mainboard 1. The heat dissipation module 5 can cool and dissipate heat for the computing module 3 and other accessories installed on the back of the mainboard 1. Setting the size of the heat dissipation module 5 to be greater than or equal to the size of the mainboard 1 and targetedly cooling and dissipating the structure installed on the back of the mainboard 1 can improve the heat dissipation effect of the heat dissipation module 5.

[0069] In some embodiments of the present application, a mounting groove 511 is provided on a surface of the heat dissipation module 5 facing away from the motherboard 1, and the bus 6 is embedded in the mounting groove 511. The heat dissipation module 5 is made of an insulating material or has an insulating layer on its surface to prevent electrical conduction with the bus 6. The mounting groove 511 is provided in a location on the heat dissipation module 5 where the medium flow channel 52 is absent, enabling the embedded installation of the bus 6. This reduces the overall space occupied by the processor unit 10, thereby reducing the size of a single processor unit 10 and increasing the number of processor units 10 that can be assembled within a fixed space, thereby improving the overall performance of the electronic device.

[0070] like Figure 6 As shown, in some embodiments of the present application, the busbar 6 is provided with a conductive post 601, which is used to achieve electrical connection between the busbar 6 and the mainboard 1, thereby achieving power supply to the mainboard 1. Specifically, a through hole 501 is provided on the heat dissipation module 5, and the through hole 501 penetrates the heat dissipation module 5 along the thickness direction of the heat dissipation module 5. The through hole 501 is opened at a position where there is no liquid cooling channel, and a connection hole 101 is provided at a corresponding position of the mainboard. The conductive post 601 on the busbar 6 passes through the through hole 501 and is electrically connected to the connection hole 101 of the mainboard 1. The conductive post 601 is connected to the circuit on the surface of the mainboard 1 by welding to achieve electrical connection between the busbar 6 and the mainboard 1, thereby enabling the busbar 6 to provide power to the mainboard 1.

[0071] The setting of the conductive column 601 not only realizes the electrical connection between the bus 6 and the mainboard 1, but also sets a through hole 501 on the heat dissipation module 5, and the conductive column 601 passes through the through hole 501 accordingly. Not only is the conductive column 601 designed to be avoided on the heat dissipation module 5, but after the conductive column 601 is connected to the mainboard 1, it can also play a role in fixing the heat dissipation module 5, thereby reducing or even eliminating the fasteners used to fix the heat dissipation module 5.

[0072] In some embodiments of the present application, in addition to securing the heat dissipation module 5 by means of the conductive posts 601 and the through-holes 501, the heat dissipation module 5 can also be secured to the motherboard 1 using fasteners such as bolts, or by means of snap-fit ​​connections between the heat dissipation module 5 and the motherboard 1 using snap-fit ​​slots on the heat dissipation module 5. This connection method not only effectively secures the heat dissipation module 5 but also facilitates disassembly of the heat dissipation module 5. This facilitates disassembly and inspection of a single processor unit 10 when a processor unit 10 malfunctions or requires maintenance. It also facilitates repairs when components of the processor unit 10 are damaged.

[0073] like Figure 3 and Figure 5As shown, in some embodiments of the present application, the edge of the lower surface of the heat dissipation module 5 is recessed upward to form a mounting groove 511. There are two mounting grooves 511, which are provided at two opposite edges of the heat dissipation module 5. There are two busbars 6, which are a positive busbar 61 and a negative busbar 62, respectively. The two busbars 6 are correspondingly provided in the two mounting grooves 511. Specifically, the outer contour of the longitudinal section of the heat dissipation module 5 is provided in a "convex" shape, that is, mounting grooves 511 are formed at two opposite edges of the lower surface of the heat dissipation module 5. The size of the mounting grooves 511 matches the size of the busbar 6, so that when the busbar 6 is embedded in the mounting grooves 511, the outer surface of the busbar 6 is flush with the outer surface of the heat dissipation module 5.

[0074] The two bus bars 6 are electrically connected to the mainboard 1 respectively, thereby forming a first power supply circuit in the processor unit 10 .

[0075] In some embodiments of the present application, the heat dissipation module 5 includes a liquid cooling plate 51 and a medium flow channel 52 provided in the liquid cooling plate 51 , and the medium flow channel 52 is bent in the liquid cooling plate 51 .

[0076] Exemplarily, the medium flow channel 52 within the liquid cooling plate 51 is configured to be curved in an S-shape, thereby extending the flow path and flow time of the heat dissipation medium within the heat spreader. Specifically, considering that the heat dissipation module 5 only provides liquid cooling to the computing module 3, to avoid wasting cooling energy, in some embodiments of the present application, the degree of tortuosity of the medium flow channel 52 varies from location to location, with greater tortuosity at locations corresponding to the respective second avoidance slots. This allows the majority of the cooling energy of the heat dissipation medium to be concentrated at locations corresponding to the second avoidance slots, thereby dissipating heat to the computing module 3.

[0077] In some embodiments of the present application, a water inlet 521 and a water outlet 522 are provided on the side wall of the heat dissipation module 5. The water inlet 521 is connected to one end of the medium flow channel 52, while the water outlet 522 is connected to the other end of the medium flow channel 52. External heat dissipation medium can enter the heat dissipation channel through the water inlet 521, absorb heat, and then flow out of the water outlet 522. The flow of the heat dissipation medium in the medium flow channel 52 enables heat exchange between the heat dissipation medium and the computing module 3, thereby achieving cooling and heat dissipation of the computing module 3.

[0078] In addition, if Figure 7 and Figure 8 As shown, an embodiment of the present application further provides a processor system, comprising at least two processor units 10 , wherein the at least two processor units 10 are arranged in a matrix, and the power supply between adjacent processor units 10 is connected via a conductive connector 20 .

[0079] Specifically, the number and type of processor units 10 can be selected according to actual needs. Different processor units 10 are configured with different computing modules 3 and have different functions, thus forming different types of processor units 10. The sizes of various types of processor units 10 are kept as consistent as possible to facilitate the layout of each processor unit 10 when forming a processor system.

[0080] In some embodiments of the present application, the processor system includes M columns of processor modules, each column of processor modules includes N processor units, and the conductive connector includes a first connector 201, a second connector 202, and a third connector 203; M and N are both positive integers greater than or equal to 1, and M and N are not equal to 1 at the same time;

[0081] When M=1 and N≥2, the positive busbars 61 of the N processor units 10 are connected in series via the first connector 201, and the negative busbars 62 of the N processor units 10 are connected in series via the second connector 202. In other words, there is only one column in the rectangular array, which contains N processor units 10. The positive busbars 61 of the N processor units 10 are connected in series via the first connector 201, and the negative busbars 62 of the N processor units 10 are connected in series via the second connector 202.

[0082] When M ≥ 2 and N = 1, the positive busses 61 and the negative busses 62 of two processor units 10 in two adjacent columns of processor modules are connected in series via the third connector 203. That is, there are M columns in the rectangular array, each column containing one processor unit 10, and M processor units 10 forming a row. The positive busses 61 of these M processor units 10 are connected in series via the third connector 203, and the negative busses 62 are also connected in series via the third connector 203.

[0083] When M≥2 and N≥2, the positive buses 61 of the N processor units 10 in at least one column of processor modules are connected in series via the first connector 201, the negative buses 62 of the N processor units 10 in each of the remaining columns of processor modules are connected in series via the second connector 202, and the positive buses 61 and the negative buses 62 of the two processor units 10 arranged opposite to each other in two adjacent columns of processor modules are connected in series respectively via the third connector 203. Taking M=2, N=4 as an example, there are two columns, each column contains 4 processor units 10, the positive busbars 61 of the 4 processor units 10 in the first column are connected in series through the first connector 201, the negative busbars 62 of the 4 processor units 10 in the second column are connected in series through the second connector 202, the positive busbars 61 of the first row of the first column and the positive busbars 61 of the first row of the second column are connected in series through the third connector 203, and the negative busbars 62 of the first row of the first column and the negative busbars 62 of the first row of the second column are connected in series. The negative bus 62 of the processor units 10 in the first row is connected in series through the third connecting member 203; similarly, the positive bus 61 of the processor units 10 in the second row of the first column is connected in series with the positive bus 61 of the processor units 10 in the second row of the second column through the third connecting member 203, and the negative bus 62 of the processor units 10 in the second row of the first column is connected in series with the negative bus 62 of the processor units 10 in the first row of the second column through the third connecting member 203; and so on, until the processor units 10 in the first column are electrically connected accordingly with the processor units 10 in the second column.

[0084] Furthermore, the first connector 201 includes a first main connection line and N first branch connection lines. The N first branch connection lines are arranged at intervals along the length direction of the first main connection line on the side of the first main connection line facing the processor unit, and the N first branch connection lines are electrically connected to the positive bus bars 61 on the N processor units in the processor module in a one-to-one correspondence.

[0085] The second connecting member 202 includes a second main connecting line and N second branch connecting lines. The N second branch connecting lines are arranged at intervals along the length direction of the second main connecting line on a side of the second main connecting line facing the processor unit, and the N second branch connecting lines are electrically connected to the negative bus bars 62 on the N processor units 10 in the processor module in a one-to-one correspondence.

[0086] The number of third connectors 203 is (M-1)×2N. The third connectors 203 are used to electrically connect the positive busbars 61 of two processor units disposed opposite to each other in adjacent columns, and to electrically connect the negative busbars 62 of two processor units disposed opposite to each other in adjacent columns.

[0087] At least two processor units 10 are arranged in a matrix, which means that multiple processor units 10 are arranged in rows and columns on a horizontal plane, such as Figure 8 As shown, taking eight processor units 10 as an example, each row of four processor units 10 is arranged in a row along a first direction, and two rows of processor units 10 are arranged in two columns along a second direction, with the first and second directions arranged perpendicularly. The positive busbars 61 of the four processor units 10 in one column are connected in series via a first connector 201, and the negative busbars 62 of the four processor units 10 in the other column are connected in series via a second connector 202. The positive busbars 61 of two processor units arranged opposite each other in the two columns are connected in series via a third connector 203, and the negative busbars 62 are also connected in series via a third connector 203, thereby achieving series connection between the processors. The first connector 201 and the second connector 202 are connected to the positive busbars 61 and negative busbars 62 of two adjacent processor units 10 in a bridging manner. The two columns of processor units 10 are connected together in the bridging direction via the third connector 203, thereby enabling power supply to multiple processor units 10 through a single power supply 50.

[0088] The conductive connector 20 can be made of a cable or a conductive metal. The conductive metal is made of a hard metal material and is installed between the bus bars 6 of the two processor units 10. This arrangement not only reduces the use of cables, but also strengthens the connection structure between the two processor units 10, thereby supporting the processor units 10. At the same time, in order to optimize the design of the conductive metal, in some embodiments of the present application, an insulating layer is provided on the outer surface of the conductive metal.

[0089] The processor units 10 are made into a detachable structure. When one or more processor units 10 are damaged, they can be disassembled and maintained conveniently and quickly, which greatly reduces the maintenance difficulty of the processor structure and will not affect the normal operation of other processor units 10.

[0090] The conductive connector 20 is arranged below the processor unit 10 and connected between each processor unit 10. The conductive connector 20 electrically connects each processor unit 10 together and forms an integral power supply circuit together with the first power supply circuit. Power supply to multiple processor units 10 can be achieved through a power supply 50.

[0091] In some embodiments of the present application, each processor unit 10 further includes a high-speed connector, and adjacent processor units 10 are connected to each other via the high-speed connector. Specifically, each processor unit 10 is provided with a high-speed connector. When different processor units 10 need to be interconnected, the high-speed connectors on the respective processor units 10 are connected together via cables to achieve interconnection between the different processor units 10. The processor can also realize the connection of the data bus, address bus, and control bus between the computing module 3 and the memory in a single processor unit 10.

[0092] A high-speed connector is a key component used for signal transmission within or between electronic devices, specifically designed to transmit high-frequency signals. In some embodiments of the present application, the plug interface of the high-speed connector is arranged vertically upward to facilitate the vertical insertion of various cables.

[0093] That is to say, the high-speed connector can not only realize the connection between the computing module 3 and the memory in each processor unit 10, but also realize the connection between different processor units 10 through the connection of cables.

[0094] The medium flow channels 52 between each processor unit 10 can be interconnected through a connecting pipe 40. The processor units 10 can be connected in series or in parallel, or the processor units 10 in each column can be connected in series and then in parallel with the adjacent columns. In some embodiments of the present application, a water collector and water distributor can be added. The water collector and water distributor is mainly used to centrally provide heat dissipation medium and to control the diversion of the heat dissipation medium. Specifically, the water collector and water distributor are divided into a liquid inlet controller and a liquid return controller, and multiple through holes are provided on the liquid inlet controller and the liquid return controller. Among them, the water inlet 521 of each liquid cooling plate 51 is connected to each through hole on the liquid inlet controller so that the heat dissipation liquid can flow to each heat dissipation module 5 at the same time after being diverted by the liquid inlet controller; the water outlet 522 of each heat dissipation module 5 is connected to each through hole on the liquid return controller so that the coolant after absorbing heat in each heat dissipation module 5 can flow back to the liquid return controller respectively, and be sent to the liquid cooling device 30 for cooling and heat dissipation before being circulated back to the heat dissipation module 5.

[0095] In some embodiments of the present application, the heat dissipation modules 5 in the M×N processor units 10 are sequentially connected in series, or the heat dissipation modules 5 in at least some of the processor units 10 are connected in parallel. In other words, the heat dissipation modules 5 in the M×N processor units 10 can be connected in series or in parallel regularly, or can be connected in series or in parallel irregularly. The heat dissipation module 5 in one processor unit 10 can be connected in series or in parallel with the heat dissipation modules 5 in the same column, or can be connected in series or in parallel with the heat dissipation modules 5 in the same row.

[0096] Specifically, when M=1 and N≥2, or when M≥2 and N=1, the heat dissipation modules 5 of the processor units 10 are sequentially connected in series via the connecting pipes 40, or at least some of the heat dissipation modules 5 of the processor units 10 are connected in parallel via the connecting pipes 40. In other words, when there is only one row or one column, the heat dissipation modules 5 of the processor units 10 in the row or column are sequentially connected in series via the connecting pipes 40, or some are connected in series and then in parallel with others, or all are connected in parallel.

[0097] In some embodiments of the present application, when M≥2, N≥2,

[0098] The heat dissipation modules 5 of the processor units 10 in the same column are connected in series with each other through the connecting pipes 40 , and are then connected in series or in parallel with the heat dissipation modules 5 of the processor units 10 in adjacent columns through the connecting pipes 40 ;

[0099] Alternatively, the heat dissipation modules 5 of the processor units 10 in the same row are connected in series via the connecting pipes 40 , and then connected in series or in parallel with the heat dissipation modules 5 of the processor units 10 in adjacent rows via the connecting pipes 40 .

[0100] That is to say, the heat dissipation modules 5 of the processor units 10 in each column are connected in series through the connecting pipes 40, and then connected in parallel or in series with the heat dissipation modules 5 of the processor units 10 in the adjacent column that have been connected in series; or, the heat dissipation modules 5 of the processor units 10 in the same row are first connected in series with each other through the connecting pipes 40, and then connected in series or in parallel with the heat dissipation modules 5 of the processor units 10 in the adjacent row that have been connected in series.

[0101] For example, in some embodiments of the present application, the first end of the first column of processor units 10 is provided with a first water inlet and a first water outlet, and the second end is provided with a second water inlet and a second water outlet, the first water inlet is connected to the second water outlet, and the first water outlet is connected to the second water inlet, the first end of the second column of processor units 10 has a third water inlet and a third water outlet, and the second end has no water inlet and water outlet, the heat dissipation medium enters from the third water inlet and flows out from the third water outlet through the medium flow channel, wherein the first end of the second column of processor units 10 is arranged opposite to the second end of the first column of processor units 10, the second water outlet is connected to the third water inlet, and the third water outlet is connected to the second water inlet, thereby realizing the series connection of the medium flow channels of the first column of processor units 10 and the second column of processor units 10, and the first water outlet of the first column of processor units 10 is connected to the first water inlet of the adjacent processor unit 10, realizing the series connection of the medium flow channels of each processor unit in a column. In this way, the heat dissipation medium can be provided to each processor unit 10 in sequence through a liquid cooling device 30. Specifically, the water outlet of the liquid cooling device 30 is connected to the first water inlet of the first processor unit in the first column, and the heat dissipation medium enters the first processor unit in the first column from the first water inlet, and then enters the first processor unit in the second column through the second water outlet and the third water inlet, and then returns to the first processor unit in the first column through the third water outlet and the second water inlet, and then enters the second processor unit 10 in the first column through the first water outlet. In this order, the heat dissipation medium can flow through each processor unit 10 in turn to achieve cooling and heat dissipation of each processor unit 10.

[0102] In some embodiments of the present application, an electronic device is further provided, which includes the processor system of the above embodiment. Using this processor structure, different numbers and types of processor units 10 can be reasonably configured according to the needs of the electronic device to meet the diverse needs of the electronic device.

[0103] In addition to the various hardware configurations mentioned above, electronic devices may also include a hard drive, cooling fan, optical drive, disk array card, network card, power supply 50, and chassis. A hard drive is a memory device that can permanently store data. Common hard drives include 300GB, 500GB, 1TB, 3TB, and 4TB. Hard drives are divided into mechanical hard drives and solid-state drives. A disk array card provides redundancy, or backup, by combining multiple hard drives. This ensures that data is not lost even if several hard drives fail.

[0104] An electronic device fan can also be provided. The function of the electronic device fan is to speed up the air flow speed on the surface of the heat sink to increase the heat exchange speed between the heat sink and the air. As one of the two important components of the air-cooled heat dissipation module 5, the performance of the fan often plays a certain decisive role in the effect and service life of the electronic device heat dissipation module 5. The network card is also called a network controller. Network connection is the most important part for any electronic device. The network controller is responsible for managing the input and data flow from the client (other computers) in the office. Because electronic devices usually have more devices than ordinary desktop computers, they have higher requirements for the power supply 50 (generally 300 watts). If the electronic device houses many disk drives, it may require a larger power supply 50. The electronic device chassis usually has additional functions that ordinary chassis or medium-sized tower chassis do not have to ensure that the electronic device can operate normally and continuously for a long time.

[0105] The electronic device provided in the embodiment of the present invention can be a website server, database server, file server, middleware application server, log server, monitoring server, program version control server, virtual machine server, mail server, print server, domain control server, multimedia server, communication server) electronic device, etc. The embodiment of the present invention does not impose specific restrictions on the application type of the electronic device.

[0106] The above is a detailed introduction to a processor unit, a processor system, and an electronic device provided by the present application. Specific examples are used herein to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only intended to help understand the method and core ideas of the present application. It should be pointed out that, for those skilled in the art, without departing from the principles of the present application, several improvements and modifications may be made to the present application, and these improvements and modifications also fall within the scope of protection of the claims of the present application.

Claims

1. A processor system, characterized in that: The device comprises at least two processor units, wherein the at least two processor units are arranged in a matrix, and the bus bars between the processor units are connected via a conductive connector; The processor unit comprises: A mainboard, wherein the front side of the mainboard is provided with an accessory mounting slot; A computing module, integrated on the back of the mainboard; a heat dissipation module, disposed on the back of the mainboard, wherein a projection of the heat dissipation module on the mainboard at least partially overlaps with a projection of the computing module on the mainboard; busbars, wherein the number of the busbars is two, the two busbars are respectively a positive busbar and a negative busbar, and the positive busbar and the negative busbar are respectively electrically connected to the mainboard for supplying power to the mainboard; The heat dissipation module is arranged in a one-to-one correspondence with the mainboard and the computing module.

2. The processor system according to claim 1, wherein: Two mounting grooves are provided on a side of the heat dissipation module away from the mainboard. The two mounting grooves are arranged in parallel and are respectively arranged at two opposite edges of the heat dissipation module; the two busbars are respectively embedded in the two mounting grooves.

3. The processor system according to claim 2, wherein: The busbar is provided with a conductive column, the heat dissipation module is provided with a through hole, and the conductive column passes through the through hole to be electrically connected to the mainboard.

4. The processor system according to claim 1, wherein: The heat dissipation module includes a liquid cooling plate and a medium flow channel arranged in the liquid cooling plate. A water inlet and a water outlet are provided on the side wall of the liquid cooling plate. The water inlet is connected to one end of the medium flow channel, and the water outlet is connected to the other end of the medium flow channel.

5. The processor system according to claim 1, wherein: It also includes a voltage regulating module, which is integrated on the back of the mainboard and located on at least one side of the computing module, and is used to regulate the power supply voltage of the mainboard.

6. The processor system according to claim 1, wherein: The computing module is packaged on the mainboard by ball welding.

7. The processor system according to claim 1, wherein: The conductive connecting member is located below the processor unit, and the conductive connecting member connects the processor units in series.

8. The processor system according to claim 7, wherein: The processor system includes M columns of processor modules, each column of the processor modules includes N processor units, and the conductive connecting member includes a first connecting member, a second connecting member, and a third connecting member; Both M and N are positive integers greater than or equal to 1, and M and N are not equal to 1 at the same time; When M=1 and N≥2, the positive busbars of the N processor units are connected in series via the first connector, and the negative busbars of the N processor units are connected in series via the second connector; When M≥2 and N=1, the positive busbars and the negative busbars of the two processor units in two adjacent columns of the processor modules are connected in series via a third connecting member; When M≥2 and N≥2, the positive busbars of the N processor units in at least one column of the processor modules are connected in series via the first connecting member, the negative busbars of the N processor units in each of the remaining columns of the processor modules are connected in series via the second connecting member, and the positive busbars and negative busbars of two processor units arranged opposite to each other in two adjacent columns of the processor modules are respectively connected in series via the third connecting member.

9. The processor system according to claim 8, wherein: The first connecting member includes a first connecting main line and N first connecting branch lines, the N first connecting branch lines are arranged at intervals along the length direction of the first connecting main line on a side of the first connecting main line facing the processor unit, and the N first connecting branch lines are electrically connected to the positive bus bars on the N processor units in the processor module in a one-to-one correspondence; The second connecting member includes a second connecting main line and N second connecting branch lines, the N second connecting branch lines are arranged at intervals along the length direction of the second connecting main line on a side of the second connecting main line facing the processor unit, and the N second connecting branch lines are electrically connected to the negative bus bars on the N processor units in the processor module in a one-to-one correspondence; The number of the third connectors is (M-1)×2N, and the third connectors are used to electrically connect the positive busbars of two processor units disposed opposite to each other in adjacent columns, and to electrically connect the negative busbars of two processor units disposed opposite to each other in adjacent columns.

10. The processor system according to claim 8, wherein: The M The heat dissipation modules in the processor units are connected in series in sequence, or the heat dissipation modules in at least some of the processor units are connected in parallel.

11. The processor system according to claim 10, wherein: When M=1 and N≥2, or when M≥2 and N=1, the heat dissipation modules of the processor units are connected in series in sequence through connecting pipes, or the heat dissipation modules of at least some of the processor units are connected in parallel through the connecting pipes.

12. The processor system according to claim 10, wherein: When M≥2, N≥2, The heat dissipation modules of the processor units in the same column are connected in series with each other through connecting pipes, and are then connected in series or in parallel with the heat dissipation modules of the processor units in adjacent columns through the connecting pipes; Alternatively, the heat dissipation modules of the processor units in the same row are connected in series with each other through the connecting pipes, and then connected in series or in parallel with the heat dissipation modules of the processor units in adjacent rows through the connecting pipes.

13. The processor system according to claim 1, wherein: A high-speed connector is also provided on the front of the mainboard, and communication connection is achieved between the processor units via the high-speed connector.

14. An electronic device, characterized in that: Comprising a processor system as claimed in any one of claims 1 to 13.

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