A method, system, device and medium for visual analysis of assembly hole structural characteristics based on adjacency matrix

Abstract

The present invention relates to the technical field of digital assembly processes, and in particular to a method, system, device and medium for visually analyzing assembly hole structural characteristics based on an adjacency matrix. The method first obtains an assembly attribute information table, constructs a contact-based adjacency matrix, and establishes a description model for the assembly hole structural characteristics. Secondly, the attribute information table obtains the number and spatial positions of the assembly holes, and then analyzes the assembly relationship between the parts in the assembly. Finally, the assembly hole structural characteristics of different positions and assembly relationships in the assembly are displayed in a three-dimensional environment, and a three-dimensional visualization analysis environment for assembly hole structural characteristics is constructed. The method breaks away from the traditional mode that heavily relies on visual recognition, realizes automatic analysis and intuitive display of assembly hole structural characteristics, improves the process preparation efficiency of process personnel, and reduces the probability of misidentification and erroneous recognition.

Description

Technical Field

[0001] The present invention relates to the technical field of digital assembly process design, and in particular to a method, system, equipment and medium for visually analyzing assembly hole structural characteristics based on an adjacency matrix. Background Art

[0002] Digital assembly process design technology is currently widely used in complex product assembly process design. This multi-system approach integrates manufacturing process management systems with modules such as data management, assembly simulation, and a typical knowledge base. This intuitively and clearly demonstrates assembly process design intent and improves product assembly quality. However, most current digital assembly process design systems focus on assembly plans, assembly sequences, and assembly simulation. They lack auxiliary process design technologies for hole locations, which can be used to determine assembly process parameters based on stackup characteristics.

[0003] Aircraft assembly is a crucial step in aircraft manufacturing. Influenced by factors such as structural characteristics and rigidity, the aircraft assembly process typically utilizes connection methods such as screwing and riveting to assemble components into parts or products. During the assembly phase, process preparation personnel use 3D design data as a manufacturing basis to construct process models and related process information. Identifying and analyzing structural characteristics such as the standard part grades used for assembly holes and stacking information is fundamental for process personnel to familiarize themselves with product structures and prepare process documentation. However, aircraft structures typically contain over millions of standard parts, distributed across a wide range of locations. Not only are the number of standard parts large, but the types of standard parts are also diverse, and the assembly methods for these parts vary. Visual inspection, which is typically the primary method, is unable to meet the current efficiency and accuracy requirements for process preparation. Summary of the Invention

[0004] In response to the problem that the visual inspection-based method during the assembly of the above-mentioned aircraft is difficult to meet the current requirements for efficiency and accuracy of process preparation, the present invention proposes a method, system, equipment and medium for visual analysis of assembly hole structural characteristics based on an adjacency matrix; a description model of the assembly hole structural characteristics is established in advance, the assembly relationship between the parts in the assembly is analyzed, and finally the assembly hole structural characteristics of different positions and assembly relationships in the assembly are displayed in a three-dimensional environment, thereby constructing a convenient and efficient three-dimensional assembly hole characteristic analysis environment for process personnel; it breaks away from the traditional model that heavily relies on visual recognition, realizes automatic analysis and intuitive display of assembly hole structural characteristics, improves the process preparation efficiency of process personnel, and reduces the probability of misidentification and wrong recognition.

[0005] The specific implementation contents of the present invention are as follows:

[0006] A visualization analysis method for assembly hole structural characteristics based on the adjacency matrix is proposed. First, the assembly attribute information table is obtained, and a contact-based adjacency matrix is constructed to establish a description model for the assembly hole structural characteristics. Secondly, the number and spatial position of the assembly holes are obtained from the attribute information table. Then, the assembly relationship between the parts in the assembly is analyzed. Finally, the structural characteristics of the assembly holes at different positions and different assembly relationships in the assembly are displayed in a three-dimensional environment, constructing a three-dimensional visualization analysis environment for the assembly hole structural characteristics.

[0007] In order to better implement the present invention, the method for visually analyzing assembly hole structural characteristics based on the adjacency matrix specifically includes the following steps:

[0008] Step S1: export the attribute information table of each subassembly in the assembly and construct the contact-based zero-part undirected adjacency matrix;

[0009] Step S2: According to the attribute information table, obtain the number and spatial position of the assembly holes;

[0010] Step S3: analyzing the structural characteristics of the assembly holes according to the undirected adjacency matrix of the standard part, and obtaining the material characteristics of the assembly holes in combination with the number and spatial position of the assembly holes;

[0011] Step S4: Constructing a three-dimensional visualization analysis environment for the structural features of the assembly hole based on the structural characteristics and material characteristics of the assembly hole.

[0012] In order to better implement the present invention, further, step S1 specifically includes the following steps:

[0013] Step S11: Call the CAD secondary development plug-in to analyze the assembly T and export the sub-assembly T in the assembly T k Basic attribute information;

[0014] Step S12: Based on the assembly set V, the undirected contact relationship graph edge set E, and the number of sub-assemblies i, call CAD interference analysis to construct a contact-based zero-part undirected adjacency matrix.

[0015] In order to better implement the present invention, further, the basic attribute information in step S11 includes drawing number, name, embodiment number, assembly path, type, material, and axis;

[0016] The drawing number is subassembly T k Part number;

[0017] The name is subassembly T k terminology;

[0018] The embodiment number is subassembly T k The name of the embodiment;

[0019] The assembly path is the top parent node to the subassembly T in the CATIA structure tree k The structure tree path is separated by " / ";

[0020] The type is subassembly T k The classification can be divided into parts, connectors and matching parts;

[0021] The material mentioned is the "material brand" in the custom properties;

[0022] The axis is a subassembly T of type "connector" k , the endpoint coordinates of the axis are separated by “,”.

[0023] In order to better implement the present invention, further, step S2 specifically includes the following steps:

[0024] Step S21: According to the attribute information table of the subassembly, obtain the subassembly of type "connector", and count the number M of subassemblies of type "connector" and related attribute information to obtain the number M of assembly holes;

[0025] Step S22: According to the assembly T k The axis data of the attribute information obtains the spatial position of the assembly hole;

[0026] Step S23: Based on the number M and spatial positions of the assembly holes, the subassembly of the type "connector" is equivalent to an embodiment of the assembly hole, and a mapping relationship between the assembly hole and the subassembly is established.

[0027] In order to better implement the present invention, further, step S3 specifically includes the following steps:

[0028] Step S31: obtaining M vertices corresponding to the subassembly whose structural characteristic type is "connector";

[0029] Step S32: Get the vertices that the m-th vertex vt touches, and obtain a set Nt, Nt={j∈V|Atj=1};

[0030] Step S33: The number of set Nt is used as the number of stacking layers, and the sub-assemblies corresponding to set Nt are used as stacking parts. The number of stacking layers and the stacking parts together constitute the structural characteristics of the assembly hole; according to the attribute information of set Nt and the corresponding sub-assembly, the material of each stacking part is obtained to constitute the material characteristics of the assembly hole.

[0031] In order to better implement the present invention, further, the specific operation of step S4 is: display the structural characteristics and material characteristics of the M assembly holes obtained in step S33 in a three-dimensional environment, construct a three-dimensional visualization analysis environment for the structural characteristics of the assembly holes, and construct text annotations at the starting point of the sub-assembly axis corresponding to the assembly holes.

[0032] Based on the above-mentioned assembly hole structural characteristic visualization analysis method based on the adjacency matrix, in order to better realize the present invention, a system for visual analysis of assembly hole structural characteristics based on the adjacency matrix is further proposed, which is used to execute the above-mentioned assembly hole structural characteristic visualization analysis method based on the adjacency matrix; the system comprises an acquisition unit, a statistics unit, a preprocessing unit, and a construction unit;

[0033] The acquisition unit is used to obtain the assembly attribute information table, construct a contact-based adjacency matrix, and establish a description model of the assembly hole structure characteristics;

[0034] The statistical unit is used to obtain the number and spatial positions of the assembly holes from the attribute information table;

[0035] The pre-processing unit is used to analyze the assembly relationship between the parts in the assembly;

[0036] The construction unit is used to display the structural characteristics of assembly holes at different positions and in different assembly relationships in an assembly in a three-dimensional environment, and to construct a three-dimensional visualization analysis environment oriented to the structural characteristics of the assembly holes.

[0037] Based on the above-mentioned adjacency matrix-based visualization analysis method for assembly hole structural characteristics, in order to better realize the present invention, an electronic device is further proposed, including a memory and a processor; a computer program is stored on the memory; when the computer program is executed on the processor, the above-mentioned adjacency matrix-based visualization analysis method for assembly hole structural characteristics is implemented.

[0038] Based on the above-mentioned adjacency matrix-based visualization analysis method for assembly hole structural characteristics, in order to better realize the present invention, a computer-readable storage medium is further proposed, on which computer instructions are stored; when the computer instructions are executed on the above-mentioned electronic device, the above-mentioned adjacency matrix-based visualization analysis method for assembly hole structural characteristics is implemented.

[0039] The present invention has the following beneficial effects:

[0040] The present invention displays the structural characteristics of assembly holes in different positions and assembly relationships in an assembly in a three-dimensional environment, thereby constructing a convenient and efficient three-dimensional assembly hole characteristic analysis environment for process personnel; breaking away from the traditional model that heavily relies on visual recognition, the present invention realizes the automatic analysis and intuitive display of the structural characteristics of assembly holes, improves the process preparation efficiency of process personnel, and reduces the probability of misidentification and incorrect recognition. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 This is a schematic block diagram of the construction process of the visual analysis of the assembly hole structural characteristics provided by the present invention.

[0042] Figure 2 This is a diagram of an embodiment of the assembly hole provided by the present invention.

[0043] Figure 3 This is a three-dimensional visualization display effect diagram of the assembly hole provided by the present invention. DETAILED DESCRIPTION

[0044] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. It should be understood that the described embodiments are only part of the embodiments of the present invention, not all of the embodiments, and therefore should not be regarded as limiting the scope of protection. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technical personnel in this field without making creative work are within the scope of protection of the present invention.

[0045] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "disposed," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0046] Example 1:

[0047] This embodiment proposes a method for visual analysis of assembly hole structural characteristics based on an adjacency matrix. First, an assembly attribute information table is obtained, and a contact-based adjacency matrix is constructed to establish a description model of the assembly hole structural characteristics. Secondly, the attribute information table is used to obtain the number and spatial positions of the assembly holes. Then, the assembly relationship between the parts in the assembly is analyzed. Finally, the assembly hole structural characteristics of different positions and assembly relationships in the assembly are displayed in a three-dimensional environment, and a three-dimensional visualization analysis environment for assembly hole structural features is constructed.

[0048] Working principle: A description model of the assembly hole structural characteristics is established in advance, the assembly relationship between the parts in the assembly is analyzed, and finally the assembly hole structural characteristics of different positions and assembly relationships in the assembly are displayed in a three-dimensional environment, building a convenient and efficient three-dimensional assembly hole characteristic analysis environment for process personnel; getting rid of the traditional model that heavily relies on visual recognition, realizing the automatic analysis and intuitive display of the assembly hole structural characteristics, improving the process preparation efficiency of process personnel, and reducing the probability of misidentification and wrong recognition.

[0049] Example 2:

[0050] This embodiment is based on the above embodiment 1. Figure 1 As shown, the detailed description is given in the form of steps.

[0051] The assembly hole structural characteristic visualization analysis method based on the adjacency matrix specifically comprises the following steps:

[0052] Step S1: Export the attribute information table of each subassembly in the assembly and construct the contact-based undirected adjacency matrix of the zero standard parts.

[0053] The step S1 specifically includes the following steps:

[0054] Step S11: Call the CAD secondary development plug-in to analyze the assembly T and export the sub-assembly T in the assembly T k Basic attribute information.

[0055] In order to better implement the present invention, further, the basic attribute information in step S11 includes drawing number, name, embodiment number, assembly path, type, material, and axis;

[0056] The drawing number is subassembly T k Part number;

[0057] The name is subassembly T k terminology;

[0058] The embodiment number is subassembly T k The name of the embodiment;

[0059] The assembly path is the top parent node to the subassembly T in the CATIA structure tree k The structure tree path is separated by " / ";

[0060] The type is subassembly T k The classification can be divided into parts, connectors and matching parts;

[0061] The material mentioned is the "material brand" in the custom properties;

[0062] The axis is a subassembly T of type "connector" k , the endpoint coordinates of the axis are separated by “,”.

[0063] Step S12: Based on the assembly set V, the undirected contact relationship graph edge set E, and the number of sub-assemblies i, call CAD interference analysis to construct a contact-based zero-part undirected adjacency matrix.

[0064] Step S2: According to the attribute information table, the number and spatial positions of the assembly holes are obtained.

[0065] The step S2 specifically includes the following steps:

[0066] Step S21: According to the attribute information table of the subassembly, obtain the subassembly of type "connector", and count the number M of subassemblies of type "connector" and related attribute information to obtain the number M of assembly holes;

[0067] Step S22: According to the assembly T k The axis data of the attribute information obtains the spatial position of the assembly hole;

[0068] Step S23: Based on the number M and spatial positions of the assembly holes, the subassembly of the type "connector" is equivalent to an embodiment of the assembly hole, and a mapping relationship between the assembly hole and the subassembly is established.

[0069] Step S3: Analyze the structural characteristics of the assembly holes according to the undirected adjacency matrix of the standard part, and obtain the material characteristics of the assembly holes in combination with the number and spatial position of the assembly holes.

[0070] The step S3 specifically includes the following steps:

[0071] Step S31: obtaining M vertices corresponding to the subassembly whose structural characteristic type is "connector";

[0072] Step S32: Get the vertices that the m-th vertex vt touches, and obtain a set Nt, Nt={j∈V|Atj=1};

[0073] Step S33: The number of set Nt is used as the number of stacking layers, and the sub-assemblies corresponding to set Nt are used as stacking parts. The number of stacking layers and the stacking parts together constitute the structural characteristics of the assembly hole; according to the attribute information of set Nt and the corresponding sub-assembly, the material of each stacking part is obtained to constitute the material characteristics of the assembly hole.

[0074] Step S4: Constructing a three-dimensional visualization analysis environment for the structural features of the assembly hole based on the structural characteristics and material characteristics of the assembly hole.

[0075] The specific operation of step S4 is: displaying the structural characteristics and material characteristics of the M assembly holes obtained in step S33 in a three-dimensional environment, constructing a three-dimensional visualization analysis environment for the structural characteristics of the assembly holes, and constructing text annotations at the starting points of the sub-assembly axes corresponding to the assembly holes.

[0076] Working principle: This embodiment breaks away from the traditional mode that relies heavily on visual recognition, realizes the automatic analysis and intuitive display of the structural characteristics of the assembly hole, improves the process preparation efficiency of the process personnel, and reduces the probability of misidentification and wrong identification.

[0077] The rest of this embodiment is the same as that of the above-mentioned embodiment 1, and therefore will not be described in detail.

[0078] Example 3:

[0079] This embodiment is based on any one of the above embodiments 1 to 2. Figure 1 、 Figure 2 、 Figure 3 As shown, a specific embodiment is described in detail.

[0080] Step S1: Input the attribute information table and contact-based adjacency matrix of each subassembly in assembly T.

[0081] The attribute information table uses the CAD secondary development plug-in to analyze the assembly and export the basic attribute information of each subassembly in the assembly. The assembly T has a total of i subassemblies, and the kth subassembly Tk has multiple attribute information, including: drawing number, name, embodiment number, assembly path, type, material, and axis.

[0082] This embodiment is specifically explained using the assembly in CATIA as an example. The drawing number is the part number of the subassembly Tk; the name is the term of the subassembly Tk; the embodiment number is the embodiment name of the subassembly Tk; the assembly path is the structure tree path from the top-level parent node to the subassembly Tk in the CATIA structure tree, which is separated by " / "; the type is the classification of the subassembly Tk, which can be divided into parts, connectors, and mating parts; the part is a non-standard subassembly Tk, the connector is a standard part that plays a penetrating role and provides fastening force, and the mating part is a standard part used to receive the fastening force of the part; the material is the "material brand" in the custom properties; the axis is the subassembly Tk of type "connector", and the endpoint coordinates of the axis are separated by ",".

[0083] The adjacency matrix uses the interference analysis built into the CAD software to construct an undirected adjacency matrix of contact-based parts. The values in the matrix represent the assembly relationship, usually 1 for physical contact and 0 for no physical contact.

[0084] The adjacency matrix A is used to represent an undirected contact graph G = (V, E), where V is the set of subassemblies and E is the set of edges. In one embodiment, the adjacency matrix A is an i*i symmetric matrix, where i is the number of subassemblies. If vertices vp and vq are in contact, then Apq = Aqp = 1; otherwise, Apq = Aqp = 0.

[0085] Step S2: Count the number and spatial positions of the assembly holes.

[0086] Each subassembly of the "connector" type is equivalent to an assembly hole, establishing a mapping relationship between assembly holes and subassemblies. Based on the subassembly's attribute information table, subassemblies of the "connector" type are selected. The number M of subassemblies that meet these conditions and their associated attribute information are counted. This indicates that the number of assembly holes is M. Their spatial positions can be determined by analyzing the axis data in the Tk attribute information.

[0087] Step S3: Preprocess the data of the adjacency matrix; data preprocessing mainly involves analyzing the structural characteristics of the assembly holes in the adjacency matrix for the M assembly holes, and then obtaining the material characteristics of the assembly holes in combination with the attribute information table. First, obtain the M vertices corresponding to the subassembly whose structural characteristic type is "connector". For the mth vertex, obtain all vertices contacted by the vertex vt to obtain the set Nt, Nt={j∈V|Atj=1}, which contains all vertices adjacent to the vertex vt. The number of sets Nt is the number of stacking layers, and the subassemblies corresponding to the set Nt are the stacking parts. The number of stacking layers and the stacking parts together constitute the structural characteristics of the assembly hole. Then, the set Nt is combined with the attribute information of the corresponding subassembly to obtain the material of each stacking part to form the material characteristics of the assembly hole.

[0088] Step S4: Construct a 3D visualization analysis environment for the structural features of the assembly holes; display the structural and material properties of the M assembly holes obtained in step S3 in a 3D environment for visualization analysis by process personnel. This embodiment is based on the CAITA software, and a text annotation is constructed at the starting point of the subassembly axis corresponding to each assembly hole.

[0089] The text content is as follows: the drawing number of the connector, the number of layers, the parts of the layers, and the materials of the layers. Please see the attached figure for details.

[0090] The rest of this embodiment is the same as any of the above-mentioned embodiments 1 and 2, and thus will not be described in detail.

[0091] Example 4:

[0092] This embodiment, based on any one of the above embodiments 1 to 3, proposes a visual analysis system for assembly hole structural characteristics based on an adjacency matrix, which is used to execute the above-mentioned visual analysis method for assembly hole structural characteristics based on an adjacency matrix; the system includes an acquisition unit, a statistics unit, a preprocessing unit, and a construction unit;

[0093] The acquisition unit is used to obtain the assembly attribute information table, construct a contact-based adjacency matrix, and establish a description model of the assembly hole structure characteristics;

[0094] The statistical unit is used to obtain the number and spatial positions of the assembly holes from the attribute information table;

[0095] The pre-processing unit is used to analyze the assembly relationship between the parts in the assembly;

[0096] The construction unit is used to display the structural characteristics of assembly holes at different positions and in different assembly relationships in an assembly in a three-dimensional environment, and to construct a three-dimensional visualization analysis environment oriented to the structural characteristics of the assembly holes.

[0097] This embodiment also proposes an electronic device, including a memory and a processor; the memory stores a computer program; when the computer program is executed on the processor, the above-mentioned adjacency matrix-based assembly hole structure characteristic visualization analysis method is implemented.

[0098] This embodiment further provides a computer-readable storage medium having computer instructions stored thereon. When the computer instructions are executed on the electronic device described above, the above-mentioned adjacency matrix-based visual analysis method for assembly hole structural characteristics is implemented.

[0099] The rest of this embodiment is the same as any one of the above-mentioned embodiments 1 to 3, and thus will not be described in detail.

[0100] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Any simple modification or equivalent change made to the above embodiment based on the technical essence of the present invention shall fall within the scope of protection of the present invention.

Claims

1. A visual analysis method for assembly hole structural characteristics based on adjacency matrix, characterized in that: First, the assembly attribute information table is obtained, and a contact-based adjacency matrix is constructed to establish a description model for the structural characteristics of assembly holes. Then, the number and spatial position of assembly holes are obtained from the attribute information table. Then, the assembly relationship between the parts in the assembly is analyzed. Finally, the structural characteristics of assembly holes at different positions and different assembly relationships in the assembly are displayed in a three-dimensional environment, and a three-dimensional visualization analysis environment for assembly hole structural characteristics is constructed. The visual analysis method of assembly hole structural characteristics based on the adjacency matrix specifically includes the following steps: Step S1: export the attribute information table of each subassembly in the assembly and construct the contact-based zero-part undirected adjacency matrix; Step S2: Obtain the number and spatial positions of the assembly holes according to the attribute information table; Step S3: analyzing the structural characteristics of the assembly holes according to the undirected adjacency matrix of the standard part, and obtaining the material characteristics of the assembly holes in combination with the number and spatial position of the assembly holes; Step S4: constructing a three-dimensional visualization analysis environment for the structural characteristics of the assembly hole according to the structural characteristics and material characteristics of the assembly hole; Step S1 specifically includes the following steps: Step S11: Call the CAD secondary development plug-in to analyze the assembly T and export the sub-assembly T in the assembly T k Basic attribute information; Step S12: Based on the assembly set V, the undirected contact relationship graph edge set E, and the number of sub-assemblies i, call CAD interference analysis to construct a contact-based zero-part undirected adjacency matrix; The basic attribute information in the assembly attribute information table includes drawing number, name, embodiment number, assembly path, type, material, axis; the drawing number is the subassembly T k The part number of the subassembly T k The embodiment number is a subassembly T k The assembly path is the top parent node to the subassembly T in the CATIA structure tree. k The structure tree path is divided by " / "; the type is subassembly T k The classification is divided into parts, connectors, and mating parts; the material is the "material brand" in the custom attribute; the axis is the subassembly type of "connector" T k , the endpoint coordinates of the axis are divided by ",".

2. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 1, characterized in that: The step S2 specifically includes the following steps: Step S21: According to the attribute information table of the subassembly, obtain the subassembly of type "connector", and count the number M of subassemblies of type "connector" and related attribute information to obtain the number M of assembly holes; Step S22: According to the assembly T k The axis data of the attribute information obtains the spatial position of the assembly hole; Step S23: Based on the number M and spatial positions of the assembly holes, the subassembly of the type "connector" is equivalent to an embodiment of the assembly hole, and a mapping relationship between the assembly hole and the subassembly is established.

3. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 2, characterized in that: The step S3 specifically includes the following steps: Step S31: obtaining M vertices corresponding to the subassembly whose structural characteristic type is "connector"; Step S32: Get the vertices that the m-th vertex vt touches, and obtain a set Nt, Nt={j∈V|Atj=1}; Step S33: The number of set Nt is used as the number of stacking layers, and the sub-assemblies corresponding to set Nt are used as stacking parts. The number of stacking layers and the stacking parts together constitute the structural characteristics of the assembly hole; according to the attribute information of set Nt and the corresponding sub-assembly, the material of each stacking part is obtained to constitute the material characteristics of the assembly hole.

4. The method for visual analysis of assembly hole structural characteristics based on adjacency matrix according to claim 3, characterized in that: The specific operation of step S4 is: displaying the structural characteristics and material characteristics of the M assembly holes obtained in step S33 in a three-dimensional environment, constructing a three-dimensional visualization analysis environment for the structural characteristics of the assembly holes, and constructing text annotations at the starting points of the sub-assembly axes corresponding to the assembly holes.

5. A visual analysis system for assembly hole structural characteristics based on an adjacency matrix, used to execute the visual analysis method for assembly hole structural characteristics based on an adjacency matrix according to claim 1; characterized in that: Including acquisition unit, statistics unit, pre-processing unit and construction unit; The acquisition unit is used to obtain the assembly attribute information table, construct a contact-based adjacency matrix, and establish a description model of the assembly hole structure characteristics; The statistical unit is used to obtain the number and spatial positions of the assembly holes from the attribute information table; The pre-processing unit is used to analyze the assembly relationship between the parts in the assembly; The construction unit is used to display the structural characteristics of assembly holes at different positions and in different assembly relationships in an assembly in a three-dimensional environment, and to construct a three-dimensional visualization analysis environment oriented to the structural characteristics of the assembly holes.

6. An electronic device, characterized in that: The method comprises a memory and a processor; a computer program is stored in the memory; when the computer program is executed on the processor, the method for visually analyzing the structural characteristics of an assembly hole based on an adjacency matrix as described in any one of claims 1 to 4 is implemented.

7. A computer-readable storage medium, characterized in that The computer-readable storage medium stores computer instructions; when the computer instructions are executed on the electronic device according to claim 6, the assembly hole structure characteristic visualization analysis method based on the adjacency matrix according to any one of claims 1 to 4 is implemented.

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