Topological metamaterial components

Abstract

This application relates to the field of magnetic resonance imaging (MRI) technology and provides a topological metamaterial component for improving imaging quality. The component includes: multiple topological circuit pieces arranged in a rotating manner to form a hollow structure; each topological circuit piece includes: a substrate, multiple first conductive sheets, multiple second conductive sheets, multiple first capacitors, and multiple second capacitors. The multiple first conductive sheets, multiple second conductive sheets, multiple first capacitors, and multiple second capacitors are all disposed on the substrate, forming multiple closed loops; wherein the first capacitors are connected in series, and the second capacitors are connected in series; each closed loop includes one first conductive sheet, one second conductive sheet, one first capacitor, and one second capacitor, and adjacent closed loops share one or more first conductive sheets than second conductive sheets.

Description

Technical Field

[0001] This application relates to the field of magnetic resonance technology, specifically to a topological metamaterial component. Background Technology

[0002] Magnetic resonance imaging (MRI), as a core technology in modern medical diagnosis, is widely used in many key fields such as neuroscience, angiology, and oncology. In the MRI imaging process, the use of MRI coils is crucial for improving image quality and efficiency. By exciting and detecting magnetic resonance signals, MRI coils significantly enhance the quality and speed of imaging.

[0003] However, traditional MRI coil designs, such as birdcage coils and phase array coils, are primarily based on the principle of local field enhancement, which to some extent limits signal propagation. This leads to signal attenuation and a decrease in the signal-to-noise ratio as the coil approaches the MRI system, thus affecting image quality. Furthermore, as active devices, traditional MRI coils require wired connections and rely on specific software operation, reducing their portability and flexibility. Summary of the Invention

[0004] The above description is merely an overview of some embodiments of the technical solutions in this specification. In order to better understand the technical means of some embodiments of this specification and to implement them in accordance with the content of the specification, and to make the above and other objects, features and advantages of some embodiments of this specification more apparent and understandable, specific implementation methods of some embodiments of this specification are given below.

[0005] To address the aforementioned technical problems, this application provides a topological metamaterial component, comprising: a plurality of topological circuit pieces arranged in a rotating manner to form a hollow structure; wherein each topological circuit piece includes:

[0006] The substrate, multiple first conductive sheets, multiple second conductive sheets, multiple first capacitors, and multiple second capacitors are all disposed on the substrate, forming multiple closed loops; wherein,

[0007] The first capacitor is connected in series, and the second capacitor is connected in series.

[0008] Each closed loop includes a first conductive sheet, a second conductive sheet, a first capacitor, and a second capacitor. Adjacent closed loops share either the first conductive sheet or the second conductive sheet, with one more first conductive sheet than second conductive sheet.

[0009] Furthermore, the aforementioned topological metamaterial component also includes: an inner cylinder, with the topological circuit piece fixed to the outer side of the inner cylinder.

[0010] Furthermore, the topology circuit piece is arranged along the tangential direction of the outer surface of the inner cylinder.

[0011] Furthermore, the aforementioned topological metamaterial component also includes: an outer cylinder, with the topological circuit chip fixedly connected to the outer cylinder.

[0012] Furthermore, a first slot is provided on the inner side of the outer cylinder, and the topology circuit chip is inserted into the first slot.

[0013] Furthermore, the aforementioned topological metamaterial component also includes: an end cap, with a second slot provided on the inner side of the end cap, into which the topological circuit chip is inserted.

[0014] Furthermore, the aforementioned topology circuit chip includes multiple bends.

[0015] Furthermore, the width of the first conductive sheet is smaller than the width of the second conductive sheet.

[0016] Furthermore, the widths of the first conductive sheet and the second conductive sheet are determined based on the inductance of the closed circuit to which the first conductive sheet and the second conductive sheet belong.

[0017] Furthermore, the number of closed loops in the topology chip is even.

[0018] Furthermore, the coupling strength between the topology chips is determined based on the distance between the topology chips.

[0019] Furthermore, the second slot includes multiple interconnected bends that mate with multiple bends.

[0020] Furthermore, the coupling strength between the topology chips is determined based on the bending angle of the topology chips.

[0021] In this way, the topological metamaterial component provided in this application can construct pseudo-two-dimensional pseudo-topological boundary states by stacking topological circuit chips, overcoming the problem of signal attenuation when approaching the MRI system, improving the signal-to-noise ratio of the image, and thus improving imaging quality. Furthermore, the topological metamaterial component requires no power supply, no connection to the instrument via wires, and no software support, allowing it to be used directly on the MRI scanner, improving its portability and flexibility. In addition, by selecting suitable raw materials for the topological metamaterial component, its mass can be reduced, further enhancing its portability. Attached Figure Description

[0022] To more clearly illustrate some embodiments or technical solutions in the prior art of this specification, the accompanying drawings used in the description of the embodiments or prior art will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments recorded in this specification. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a structural schematic diagram of a topological metamaterial component provided in an embodiment of this application;

[0024] Figure 2 This is a schematic diagram of the structure of a topology circuit chip provided in an embodiment of this application;

[0025] Figure 3 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0026] Figure 4 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0027] Figure 5 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0028] Figure 6 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0029] Figure 7 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0030] Figure 8 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0031] Figure 9 This is a schematic diagram of the structure of an end cap provided in an embodiment of this application;

[0032] Figure 10 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0033] Figure 11 A schematic diagram of another topological metamaterial component provided in this application embodiment;

[0034] Figure 12 This is a schematic diagram of the structure of a bracket provided in an embodiment of this application;

[0035] Figure 13 This is a schematic diagram of another type of support provided in an embodiment of this application;

[0036] Figure 14 This is a schematic diagram of another type of support provided in an embodiment of this application;

[0037] Figure 15 A partial structural diagram of a topology circuit chip provided in an embodiment of this application;

[0038] Figure 16 A partial structural diagram of another topology circuit chip provided in an embodiment of this application;

[0039] Figure 17 A partial structural diagram of another topology circuit chip provided in an embodiment of this application;

[0040] Figure 18 A partial structural diagram of another topology circuit chip provided in an embodiment of this application;

[0041] Figure 19 A partial structural diagram of another topology circuit chip provided in an embodiment of this application;

[0042] Figure 20 A schematic diagram of a process for determining inductance provided in an embodiment of this application;

[0043] Figure 21 This is a schematic diagram of a topological insulator circuit provided in an embodiment of this application;

[0044] Figure 22 A schematic diagram of magnetic field strength provided for an embodiment of this application;

[0045] Figure 23 This is a schematic diagram of the architecture of a magnetic resonance system provided in an embodiment of this application. Detailed Implementation

[0046] To enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in some embodiments of this specification will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this specification, and not all embodiments. Based on some embodiments in this specification, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this specification.

[0047] The serial numbers assigned to components in this document, such as "first" and "second," are used solely to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are used solely for the convenience of describing this application and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0048] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0049] As described in the background section, traditional magnetic resonance imaging coil designs, such as birdcage coils and phase array coils, are primarily based on the principle of local field enhancement. This limits signal propagation to some extent, leading to signal attenuation and a decrease in the signal-to-noise ratio when the coil approaches the MRI system, thus affecting image quality. Furthermore, as active devices, traditional MRI coils require wire connections and rely on specific software operation, reducing their portability and flexibility.

[0050] For example, in practical use, birdcage coils require a power supply circuit and wired connection to operate. Furthermore, switching between the transmitting and receiving modes of the birdcage coil depends on the T / R switch in the MR imager, requiring corresponding software support. In addition, due to its large inner diameter, the birdcage coil is located far from the patient's surface during use, resulting in weak signal coupling, a low signal-to-noise ratio, poor imaging quality, and the inability to achieve long-distance wireless signal transmission.

[0051] Another example is that while phase array coils offer superior imaging speed and quality compared to birdcage coils, they still don't achieve the same level of imaging performance. Furthermore, in practical applications, phase array coils also require a power supply circuit and wired connections to operate. Additionally, a single phase array coil can only observe one area; multiple coils are needed to observe multiple areas, and long-distance wireless signal transmission is not possible. Moreover, the manufacturing process for phase array coils is relatively complex, requiring specific designs for different brands, resulting in low manufacturing efficiency.

[0052] Based on this, this application provides a topological metamaterial component that avoids signal attenuation when traditional coils are near an MRI system, thereby ensuring imaging quality. Furthermore, the topological metamaterial component provided in this application requires no wire connections and does not rely on specific software, improving portability and flexibility.

[0053] Figure 1 This application illustrates a topological metamaterial component provided in an embodiment, such as... Figure 1 As shown, the topological metamaterial component includes: multiple topological circuit pieces 10, which are arranged in a rotating manner to form a hollow structure 20; wherein, as... Figure 2 As shown, each topology chip 10 includes:

[0054] A substrate 110, a plurality of first conductive sheets 120, a plurality of second conductive sheets 130, a plurality of first capacitors 140, and a plurality of second capacitors 150 are disposed on the substrate 110. The plurality of first conductive sheets 120, the plurality of second conductive sheets 130, the plurality of first capacitors 140, and the plurality of second capacitors 150 form a plurality of closed loops; wherein,

[0055] The first capacitor 140 is connected in series, and the second capacitor 150 is connected in series.

[0056] Each closed loop includes a first conductive sheet 120, a second conductive sheet 130, a first capacitor 140, and a second capacitor 150. Adjacent closed loops share either the first conductive sheet 120 or the second conductive sheet 130, with one more first conductive sheet 120 than the second conductive sheet 130.

[0057] Specifically, such as Figure 1As shown, multiple topology circuit pieces 10 are arranged in a rotating manner to form a hollow structure 20. The hollow structure 20 is determined by the rotational arrangement of the topology circuit pieces 10. For example, the multiple topology circuit pieces 10 are arranged in a rotating manner to form a cylindrical hollow structure 20. Alternatively, the multiple topology circuit pieces 10 are arranged in a rotating manner to form a rectangular hollow structure 20. Or, the multiple topology circuit pieces 10 are arranged in a rotating manner to form an irregularly shaped hollow structure 20.

[0058] In some embodiments, the number of topological circuit pieces 10 in the topological metamaterial component can be set according to actual conditions. For example, in practical applications, the effect of the corresponding topological metamaterial component can be tested by controlling different numbers of topological circuit pieces 10, and a suitable number of topological circuit pieces 10 can be selected. For example, the number of topological circuit pieces 10 can be 12, 14, 16, etc.

[0059] It should be noted that multiple topology circuit pieces 10 can be fixed to each other to achieve a rotational arrangement effect. For example, adjacent topology circuit pieces 10 can be fixed with insulating material to improve the stability of the topological metamaterial component. Alternatively, corresponding components can be added to assist in fixing the topology circuit pieces 10 to improve the stability of the topological metamaterial component, as described below.

[0060] In some embodiments, such as Figure 3 The diagram shown is a top view of the topological metamaterial component. The topological metamaterial component also includes an inner cylinder 30, and a topological circuit piece 10 is fixed to the outer side of the inner cylinder.

[0061] The topology circuit piece 10 is arranged along the tangential direction of the outer surface of the inner cylinder 30. For example... Figure 3 As shown, Figure 3 In the middle, the topology circuit piece 10 is fixed on the outer side of the inner cylinder 30. The topology circuit piece 10 is arranged along the tangential direction of the outer side of the inner cylinder 30, and the area in the inner cylinder 30 coincides with the hollow structure 20.

[0062] Understandable, Figure 3 The inner cylinder 30 is cylindrical, and the topology circuit pieces 10 can be arranged along the tangent direction of the outer surface of the inner cylinder 30. In fact, the inner cylinder 30 can also be other shapes. While ensuring that the topology circuit pieces 10 are arranged in a rotating manner to form a hollow structure 20, the topology circuit pieces 10 can also be arranged in other directions.

[0063] For example, Figure 4 The topological metamaterial component shown has a topological circuit piece 10 fixed to the outer side of the inner cylinder 30. The topological circuit piece 10 includes multiple bending portions, exhibiting corresponding bending states.

[0064] In some embodiments, the topological metamaterial component further includes an outer cylinder, to which the topological circuit chip is fixedly connected.

[0065] The outer cylinder has a first slot on its inner side, into which the topology circuit chip is inserted. The topology circuit chip can be fixedly connected by the outer cylinder alone, or it can be fixedly connected by both the outer and inner cylinders.

[0066] For example, Figure 5 The topological metamaterial component shown (topological circuit piece not shown) has an outer cylinder 40 and an inner cylinder 30 that jointly fix the topological circuit piece. Both the outer cylinder 40 and the inner cylinder 30 are cylindrical. A first slot 410 is provided on the inner side of the outer cylinder 40, into which the topological circuit piece can be inserted to fix it. In addition, the outer cylinder 40 includes multiple fastening parts 420 for fastening and fixing with other components (such as the end cap shown below). Specifically, as... Figure 6 The topological metamaterial component shown has a topological circuit chip 10 inserted into the first slot 410, and the topological circuit chip 10 is arranged along the tangential direction of the outer side of the inner cylinder 30.

[0067] Another example, such as Figure 7 The topological metamaterial component shown has an outer cylinder 40 and an inner cylinder 30 that together fix the topological circuit piece. Both the outer cylinder 40 and the inner cylinder 30 are cylindrical. A first slot 410 is provided on the inner side of the outer cylinder 40, and the topological circuit piece is inserted into the first slot 410 to fix the topological circuit piece. Figure 7 In the middle, the topology circuit piece 10 is in a bent state, including multiple bent parts.

[0068] In some embodiments, the topological metamaterial component further includes: an end cap, the inner side of which is provided with a second slot, into which the topological circuit chip is inserted. It is understood that the inner cylinder, outer cylinder, and end cap can each be used individually to fix the topological circuit chip, or they can work together to fix the topological circuit chip.

[0069] For example, Figure 8 The topological metamaterial component shown (topological circuit piece not shown) has an end cap 50 and an inner cylinder 30 that together fix the topological circuit piece. The end cap 50 is circular, and the inner cylinder 30 is cylindrical. A second slot 510 is provided on the inner side of the end cap 50, and the topological circuit piece is inserted into the second slot 510 to fix the topological circuit piece. Figure 8 In the inner cylinder 30, the second slot 510 of the end cap 50 is arranged along the tangential direction of the outer surface of the inner cylinder 30, so that the topology circuit piece can be arranged along the tangential direction of the outer surface of the inner cylinder 30. In addition, the end cap 50 includes a plurality of fastening portions 520, which can be fastened and fixedly connected with the fastening portions of the outer cylinder. For example, as shown... Figure 9 As shown, the end cap 50 includes a plurality of fastening portions 520. The end cap 50 is fastened to the outer cylinder 40 via the fastening portions 520.

[0070] Another example, such as Figure 10 The topological metamaterial component shown (topological circuit piece not shown) has an end cap 50 and an inner cylinder 30 that together fix the topological circuit piece. The end cap 50 is circular, and the inner cylinder 30 is cylindrical. A second slot 510 is provided on the inner side of the end cap 50, and the topological circuit piece is inserted into the second slot 510 to fix the topological circuit piece. The second slot 510 of the end cap 50 includes multiple interconnected bending grooves (such as... Figure 10 The topology circuit chip (5101, 5102, and 5103) is configured such that when it is inserted into the second slot 510, it includes multiple bends to present a corresponding bend. The multiple interconnected bends in the second slot 510 engage with the multiple bends of the topology circuit chip.

[0071] In some embodiments, such as Figure 11 The topological metamaterial component shown (topological circuit piece not shown) has an inner cylinder 30, an outer cylinder 40, and an end cap 50 that can work together to fix the topological circuit piece.

[0072] Figure 12 This diagram illustrates the structure of a support provided in an embodiment of this application. The topology circuit chip can be first fixed to the support, and then the support can be fixed to the first slot of the outer cylinder and / or the second slot of the end cap to further improve the stability of the topological metamaterial component. For example, when using... Figure 12 In the case of the bracket shown, the topology circuit pieces are arranged along the tangential direction of the outer surface of the inner cylinder. For example, as... Figure 13 as well as Figure 14 The diagram shown is a structural schematic of the bracket provided in an embodiment of this application. The bracket includes multiple bends, the bending angle of which can be 60 degrees, or the bracket can be arc-shaped so that the topology circuit chip can also include multiple bends.

[0073] It is understood that the main function of the inner cylinder, outer cylinder, end cap, and support is to fix the topology circuit pieces, allowing multiple topology circuit pieces to be stacked or rotated in different ways. This enables the interaction between the multiple topology circuit pieces to form a strong coupling, constructing a two-dimensional pseudo-topological boundary state and overcoming the signal attenuation problem when the signal approaches the MRI system. Therefore, this application does not limit the materials used for the inner cylinder, outer cylinder, end cap, and support without affecting the effectiveness of the topology metamaterial component. For example, plastic can be used as the raw material for the outer cylinder, end cap, and support. Furthermore, the size of the inner cylinder, outer cylinder, end cap, and support should be determined according to the size of the topology circuit pieces. In addition, the main function of the end cap is to fasten with the outer cylinder. This application does not limit the design method or quantity of its fastening assembly, as long as the fastening effect of the fastening assembly is ensured.

[0074] In some embodiments, when the topology circuit pieces are arranged tangentially along the outer surface of the inner cylinder, the coupling strength between the topology circuit pieces is determined based on the distance between them. The coupling strength is positively correlated with the distance between the topology circuit pieces, especially those closer to the inner cylinder, where the coupling strength is strongest. This causes the diagonal element at the top left corner of the circuit model of the topological insulator circuit corresponding to the topology circuit piece to deviate from a pre-designed value, resulting in the splitting of the topological boundary states. Ultimately, this achieves the construction of pseudo-two-dimensional semi-infinite topological boundary states, overcoming the signal attenuation problem when the signal approaches the system.

[0075] It should be noted that when the topology circuit chip is positioned tangentially to the outer surface of the inner cylinder, the chip does not bend, thus requiring less flexibility. Therefore, when selecting materials for the topology circuit chip, a high-hardness composite material like FR-4 can be chosen as the raw material for the substrate.

[0076] In some embodiments, when the topology includes multiple bends, the coupling strength between the topology sheets is determined based on the bending angle of the topology sheets. By adjusting the bending angle of the topology sheets to adjust the coupling strength between them, a quasi-two-dimensional dual-topology boundary state at a single frequency can be achieved to overcome the signal attenuation problem when the signal approaches the MRI system.

[0077] It should be noted that when the topology includes multiple bends, the topology becomes curved, requiring a high degree of flexibility. Therefore, when selecting materials for the topology, flexible printed circuit boards with lower rigidity can be chosen as the raw material for the substrate.

[0078] like Figure 2 The diagram shown is a structural schematic of a topology circuit chip provided in an embodiment of this application. First conductive sheets 120 and second conductive sheets 130 are arranged alternately in a one-dimensional direction on a substrate 110. Multiple first conductive sheets 120 are connected in parallel, multiple second conductive sheets 130 are connected in parallel, and multiple first conductive sheets 120 and multiple second conductive sheets 130 are connected in parallel. The first conductive sheets 120 and second conductive sheets 130 are made of conductive materials. For example, the conductive material can be a non-magnetic metal, specifically gold, silver, or copper. Alternatively, the conductive material can be a non-magnetic or weakly magnetic material, specifically graphite or related materials. The specific materials of the first conductive sheets 120 and second conductive sheets 130 can be determined according to actual conditions. In actual manufacturing, the first conductive sheets 120 and second conductive sheets 130 can be manufactured using the same material, or the first conductive sheets 120 and second conductive sheets 130 can be manufactured using different materials.

[0079] In some embodiments, the substrate 110 is made of an insulating material. In practical applications, the appropriate insulating material can be selected to manufacture the substrate 110 according to the hardness requirements of the topology circuit chip. For example, if the hardness requirement of the topology circuit chip is high, FR-4 composite material can be selected as the raw material to manufacture the substrate 110. Correspondingly, if the hardness requirement of the topology circuit chip is low, flexible printed circuit board (FPC) can be selected as the raw material to manufacture the substrate 110.

[0080] In some embodiments, the first capacitor 140 and the second capacitor 150 have the same capacitance value, and are disposed in the gap between the first conductive sheet 120 and the second conductive sheet 130. The first capacitor 140 and the second capacitor 150 can be connected to the first conductive sheet 120 and the second conductive sheet 130 by soldering. It should be noted that in this application, the first capacitor 140 and the second capacitor 150 are the same capacitor, and their positions can be interchanged without affecting the actual effect of the topology circuit.

[0081] In some embodiments, the first conductive piece 120 in the topology circuit piece is one more than the second conductive piece 130. There is a first conductive piece 120 at each end of the topology circuit piece. The width of the first conductive piece 120 is less than the width of the second conductive piece 130, and the length of the first conductive piece 120 is equal to the length of the second conductive piece 130.

[0082] For example, the width of the first conductive sheet 120 is smaller than the width of the second conductive sheet 130. Specifically, the width of the first conductive sheet 120 can be 2 mm, the width of the second conductive sheet 130 can be 20 mm, and the interval between the first conductive sheet 120 and the second conductive sheet 130 can be 10 mm.

[0083] In some embodiments, one end of the second conductive sheet 130 is connected between adjacent first capacitors 140 and the other end is connected between adjacent second capacitors 150; one end of the first conductive sheet 120 in the middle of the topology circuit sheet is connected between adjacent first capacitors 140 and the other end is connected between adjacent second capacitors 150.

[0084] For example, such as Figure 15 The diagram shown is a partial structural diagram of the middle part of the topology circuit chip provided in this application. Figure 15 It includes two first conductive plates 120, one second conductive plate 130, four first capacitors 140, and four second capacitors 150. Figure 15 The two first conductive pieces 120 in the circuit are not located at either end of the topology circuit piece. It can be seen that... Figure 15One end of the first conductive sheet 120 is connected between adjacent first capacitors 140, and the other end is connected between adjacent second capacitors 150. One end of the second conductive sheet 130 is connected between adjacent first capacitors 140, and the other end is connected between adjacent second capacitors 150.

[0085] Another example, such as Figure 16 The diagram shown is a partial structural diagram of one end of the topology circuit chip provided in an embodiment of this application. Figure 16 The circuit includes two first conductive plates, namely first conductive plate 120A and first conductive plate 120B, one second conductive plate 130, three first capacitors 140, and three second capacitors 150. First conductive plate 120A is not located at either end of the topology circuit, while first conductive plate 120B is located at both ends of the topology circuit. It can be seen that one end of first conductive plate 120A is connected between adjacent first capacitors 140, and the other end is connected between adjacent second capacitors 150. One end of first conductive plate 120B is connected to only one first capacitor 140, and the other end is connected to only one second capacitor 150. One end of second conductive plate 130 is connected between adjacent first capacitors 140, and the other end is connected between adjacent second capacitors 150.

[0086] In some embodiments, the number of closed loops in the topology chip is even. Figure 2 The topology circuit chip shown has a total of 18 closed loops. Correspondingly, the sum of the number of the first conductive sheet 120 and the second conductive sheet 130 in the topology circuit chip is an odd number. Figure 2 It has a total of 18 closed circuits, 10 first conductive plates 120 and 9 second conductive plates 130.

[0087] For example, such as Figure 17 The diagram shown is a partial structural diagram of the topology circuit chip provided in an embodiment of this application. Figure 17 It includes a first conductive sheet 120, a second conductive sheet 130, a first capacitor 140, and a second capacitor 150, and these four components form a closed circuit. Another example is... Figure 18 As shown, Figure 18 It includes two first conductive sheets 120, one second conductive sheet 130, two first capacitors 140, and two second capacitors 150. These six components form two adjacent closed loops, and the adjacent closed loops share one second conductive sheet 130. Another example is... Figure 19 As shown, Figure 19 It includes one first conductive sheet 120, two second conductive sheets 130, two first capacitors 140 and two second capacitors 150. The above six components form two adjacent closed loops, and the adjacent closed loops share one first conductive sheet 120.

[0088] In some embodiments, the widths of the first conductive sheet and the second conductive sheet are determined based on the inductance of the closed loop to which the first conductive sheet and the second conductive sheet belong.

[0089] For example, the widths of the first conductive sheet and the second conductive sheet are specifically determined according to the following formula:

[0090]

[0091] Where L is the inductance of the closed loop to which the first or second conductive sheet belongs, μ0 is the permeability of free space, w is the width of the first or second conductive sheet, and l is the length of the first or second conductive sheet. Thus, given the inductance of the closed loop to which the first or second conductive sheet belongs, its length can be determined based on this inductance. It can be understood that, using the above formula, given the inductance of the closed loop to which the first or second conductive sheet belongs, not only its width but also its length can be determined.

[0092] It should be noted that the inductance of the closed circuit to which the first conductive sheet or the second conductive sheet belongs can be obtained in a variety of ways. This application provides a method for determining the inductance of the closed circuit to which the first conductive sheet or the second conductive sheet belongs, as described below. This application does not limit how to obtain the inductance of the closed circuit to which the first conductive sheet or the second conductive sheet belongs. In actual use, an appropriate method can be selected according to the actual situation.

[0093] Specifically, such as Figure 20 As shown, the inductance of the closed circuit to which the first or second conductive sheet belongs can be determined according to the following steps:

[0094] S101. Obtain the circuit model of the pre-constructed topological insulator circuit.

[0095] Among them, the topological insulator circuit is the circuit corresponding to the topological circuit chip. For example... Figure 21 The diagram shown is a structural schematic of a topological insulator circuit provided in an embodiment of this application. The technical solution provided in this application can be applied to, for example... Figure 21 The illustrated topological insulator circuit. Specifically, as shown... Figure 21 As shown, the topological insulator circuit includes multiple inductors L v Multiple inductors L w And multiple capacitors 2C, multiple inductors L v Multiple inductors L wMultiple capacitors 2C form multiple first closed loops and multiple second closed loops, with adjacent first closed loops and second closed loops sharing a single inductor. The topological insulator circuit includes multiple first closed loops and second closed loops. The first closed loop is the closed loop belonging to the first conductive piece 120 in the topological circuit chip, and the second closed loop is the closed loop belonging to the second conductive piece 130.

[0096] An exemplary circuit model of a topological insulator circuit is shown below:

[0097]

[0098] Among them, Z v The coupling strength of the quasi-particle in the first closed loop, also known as the coupling strength of the first closed loop, Z w Z1 is the coupling strength of the quasi-particle in the second closed loop, also known as the coupling strength of the second closed loop; Z2 is the in-situ energy of the quasi-particle in the first closed loop, also known as the in-situ energy of the first closed loop; and Z3 is the in-situ energy of the quasi-particle in the second closed loop, also known as the in-situ energy of the second closed loop.

[0099] S102. Determine the in-situ energy of the first closed loop and the in-situ energy of the second closed loop based on the circuit model, the coupling strength of the first closed loop, and the coupling strength of the second closed loop.

[0100] In some embodiments, the in-situ energy of the first closed loop is determined based on the circuit model, the coupling strength of the first closed loop, the coupling strength of the second closed loop, and the first balancing parameter.

[0101] The first balancing parameter is determined based on the angular frequency and capacitance of the topological insulator circuit. For example, the first in-situ energy is determined according to the following formula:

[0102] Z1 = Z v +Z w +2×Z A

[0103]

[0104] In the above formula, Z A Let j be the first balancing parameter, ω be the angular frequency of the topological insulator circuit, and C be the capacitance of the topological insulator.

[0105] In some embodiments, the in-situ energy of the second closed loop is determined based on the circuit model, the coupling strength of the first closed loop, the coupling strength of the second closed loop, and the second balancing parameter.

[0106] The second balancing parameter is determined based on the angular frequency and capacitance of the topological insulator circuit. For example, the second in-situ energy is determined according to the following formula:

[0107] Z2 = Z v +Z w +2×Z B

[0108]

[0109] In the above formula, Z B Let be the first balancing parameter, j be a complex number, ω be the angular frequency of the topological insulator circuit, and C be the capacitance of the topological insulator circuit.

[0110] S103. Determine the inductance of the first closed loop and the inductance of the second closed loop based on the in-situ energy of the first closed loop and the in-situ energy of the second closed loop.

[0111] In some embodiments, the inductance of the first closed loop and the inductance of the second closed loop satisfy the following conditions:

[0112] Z1 = Z v +Z w +2×Z A

[0113] Z2 = Z v +Z w +2×Z B

[0114] Z1 = Z2 = 0

[0115]

[0116] Z v =jωL v -j / ωC v

[0117] Z w =jωL w -j / ωC w

[0118] Among them, L v Let C be the inductance of the first closed circuit. v Let L be the capacitance of the first closed circuit. w C is the inductance of the second closed circuit. w This is the capacitor of the second closed circuit. It can be seen that the first balancing parameter Z... A With the second balancing parameter Z B It is mainly used to ensure that the in-situ energy of the first closed loop is equal to that of the second closed loop, so as to facilitate the calculation of circuit parameters.

[0119] For example, taking a 1.5T magnetic resonance system for the human wrist joint as an example, the operating frequency of the topological insulator circuit of this magnetic resonance system is 64MHz, and the ratio of the coupling strength of the first closed loop to the coupling strength of the second closed loop of the topological insulator circuit is set to 0.26. Based on the relevant content described above, the inductance of the first closed loop and the inductance of the second closed loop are determined. Further, based on the inductance of the first and second closed loops, the width of the first conductive piece in the corresponding topological circuit chip of the topological insulator circuit is determined to be 2mm, the width of the second conductive piece is 20mm, and the lengths of the first and second conductive pieces are also determined.

[0120] After determining the aforementioned parameters, the topology circuit chip can be manufactured accordingly. Specifically, copper can be selected as the material for manufacturing the first and second conductive sheets. Four first conductive sheets and three second conductive sheets are manufactured, with a spacing of 10mm between them. A 39pF non-magnetic capacitor is selected as both the first and second capacitors. Finally, the corresponding topology circuit chip is obtained through a processing procedure. It should be noted that the spacing between the first and second conductive sheets can be set according to actual conditions. Without considering the length limitation of the topology circuit chip, there is a positive correlation between the spacing between the first and second conductive sheets and the performance of the topology circuit chip.

[0121] like Figure 22 As shown, Figure 22 Figure A in the diagram is a schematic diagram of the magnetic field strength when it is not applied to the topological metamaterial component provided in this application. Figure 22 Figure B in the diagram illustrates the magnetic field strength when the topological metamaterial component provided in this application is used. The slots of the end caps of the topological metamaterial component are arranged along the tangent of the inner circle. Figure 22 Figure C in the diagram illustrates the magnetic field strength when the topological metamaterial component provided in this application is used. The slots of the end caps of the topological metamaterial component exhibit a bending angle. It can be seen that without the topological metamaterial component, energy attenuation is severe. However, with the topological metamaterial component, energy attenuation is not significant.

[0122] like Figure 23 The diagram shown is a schematic of the architecture of a magnetic resonance imaging (MRI) system provided in an embodiment of this application. The system includes a topological metamaterial component 100 and a detection system 200. In practical applications, the topological metamaterial component 100 can be directly placed on the detection system 200. By stacking topological circuit chips, a two-dimensional pseudo-topological boundary state can be constructed, overcoming the problem of signal attenuation when the signal approaches the MRI system.

[0123] In this way, the topological metamaterial component provided in this application can construct pseudo-two-dimensional pseudo-topological boundary states by stacking topological circuit chips, overcoming the problem of signal attenuation when approaching the MRI system, improving the signal-to-noise ratio of the image, and thus improving imaging quality. Furthermore, the topological metamaterial component requires no power supply, no connection to the instrument via wires, and no software support, allowing it to be used directly on the MRI scanner, improving its portability and flexibility. In addition, by selecting suitable raw materials for the topological metamaterial component, its mass can be reduced, further enhancing its portability.

[0124] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0125] Furthermore, those skilled in the art can combine and integrate the different embodiments or examples described herein, as well as the features of those embodiments or examples, without contradiction. Additionally, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "N" means at least two, such as two, three, etc., unless otherwise explicitly specified.

Claims

1. A topological metamaterial component, characterized in that, include: Multiple topology circuit chips are arranged in a rotating manner to form a hollow structure; wherein each topology circuit chip includes: The system comprises a substrate, a plurality of first conductive sheets, a plurality of second conductive sheets, a plurality of first capacitors, and a plurality of second capacitors. The plurality of first conductive sheets, the plurality of second conductive sheets, the plurality of first capacitors, and the plurality of second capacitors are all disposed on the substrate, and the plurality of first conductive sheets, the plurality of second conductive sheets, and the plurality of first capacitors and second capacitors form a plurality of closed loops. The first capacitor is connected in series, and the second capacitor is connected in series. Each closed loop includes a first conductive sheet, a second conductive sheet, a first capacitor, and a second capacitor. Adjacent closed loops share either the first conductive sheet or the second conductive sheet, with one more first conductive sheet than the second conductive sheet.

2. The topological metamaterial component according to claim 1, characterized in that, Also includes: The inner cylinder has the topology circuit piece fixed to its outer surface.

3. The topological metamaterial component according to claim 2, characterized in that, The topology circuit chip is arranged along the tangential direction of the outer surface of the inner cylinder.

4. The topological metamaterial component according to claim 2, characterized in that, Also includes: The outer cylinder, the topology circuit chip is fixedly connected to the outer cylinder.

5. The topological metamaterial component according to claim 4, characterized in that, The inner side of the outer cylinder is provided with a first slot, and the topology circuit chip is inserted into the first slot.

6. The topological metamaterial component according to any one of claims 1 to 5, characterized in that, Also includes: An end cap, the inner side of which is provided with a second slot, into which the topology circuit chip is inserted.

7. The topological metamaterial component according to claim 6, characterized in that, The topology circuit chip includes multiple bends.

8. The topological metamaterial component according to claim 1, characterized in that, The width of the first conductive sheet is smaller than the width of the second conductive sheet.

9. The topological metamaterial component according to claim 1, characterized in that, The widths of the first conductive sheet and the second conductive sheet are determined based on the inductance of the closed circuit to which the first conductive sheet and the second conductive sheet belong.

10. The topological metamaterial component according to claim 1, characterized in that, The number of closed loops in the topology chip is even.

11. The topological metamaterial component according to claim 3, characterized in that, The coupling strength between the topology chips is determined based on the distance between the topology chips.

12. The topological metamaterial component according to claim 7, characterized in that, The second slot includes a plurality of connected bending grooves that mate with the plurality of bending portions.

13. The topological metamaterial component according to claim 7, characterized in that, The coupling strength between the topology circuit pieces is determined based on the bending angle of the topology circuit pieces.

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