Silicon steel sheet laser cutting device

Abstract

The invention relates to the technical field of laser cutting, in particular to a silicon steel sheet laser cutting device which comprises a rack, a cutting mechanism, a supporting mechanism and a collecting mechanism. Wherein the cutting mechanism is arranged on the rack; the supporting mechanism comprises an adjusting assembly and a plurality of supporting assemblies, the adjusting assembly is arranged on the rack, the multiple supporting assemblies are movably connected to the rack and connected with the adjusting assembly, the supporting assemblies are located below the cutting mechanism, the supporting assemblies are used for supporting plates, and the adjusting assembly is arranged on the rack. The adjusting assembly is used for adjusting the distance between the multiple supporting assemblies. The collecting mechanism is arranged below the multiple supporting assemblies. The device has the effect of improving the production efficiency.

Description

Technical Field

[0001] The present application relates to the technical field of laser cutting, and in particular to a silicon steel sheet laser cutting device. Background Art

[0002] At present, silicon steel sheets, as an important soft magnetic material, are widely used in motors, transformers and other fields. Their processing quality directly affects the energy efficiency and reliability of electromagnetic devices. For the processing of silicon steel sheets, the industry mainly uses stamping technology, which completes the material shaping through customized carbide or high-speed steel molds and presses, and uses CNC wire cutting technology to realize complex graphics processing. However, the stamping process has significant limitations: the mold development cycle is long and the cost is high, which is difficult to adapt to the needs of small batches and multiple batches of orders. In addition, the mold wear caused by repeated stamping will cause the proliferation of workpiece burrs and dimensional tolerance deviation (typical deviation is more than ±0.1mm), which seriously affects the assembly accuracy of the laminated core. Therefore, laser cutting technology is used in the processing of some silicon steel sheets. Laser cutting is a processing method that uses a high-energy-density laser beam to irradiate the workpiece to melt or vaporize the irradiated area, thereby realizing cutting. It has the advantages of high processing accuracy, good incision quality, strong flexibility and high degree of automation.

[0003] Regarding the above-mentioned related technologies: the waste materials cut by laser cutting tend to accumulate on the cutting table, and post-processing methods such as mechanical scraping are required to clean the waste materials, which will increase the production steps and further reduce the production efficiency. Summary of the invention

[0004] In order to improve production efficiency, the present application provides a silicon steel sheet laser cutting device.

[0005] The present application provides a silicon steel sheet laser cutting device, which adopts the following technical solution: A silicon steel sheet laser cutting device, comprising: frame; A cutting mechanism, arranged on the frame; A support mechanism, comprising an adjustment component and a plurality of support components, wherein the adjustment component is arranged on the frame, and the plurality of support components are respectively movably connected to the frame and respectively connected to the adjustment component, the support component is located below the cutting mechanism, the support component is used to support the plate, and the adjustment component is used to adjust the spacing between the plurality of support components; The collecting mechanism is arranged below the plurality of supporting assemblies.

[0006] By adopting the above technical solution, efficient and accurate cutting of special sheet materials is achieved. Specifically, the frame provides a stable support base for the entire device, ensuring the stability of the various components when working together. The cutting mechanism is arranged on the frame and can accurately perform laser cutting actions. The adjustment component can flexibly adjust the spacing between multiple support components according to plates of different specifications to meet diverse cutting needs, and the support component can continue to firmly support the uncut part during the cutting process to prevent the plate from deforming due to its own gravity and ensure cutting accuracy. In addition, the waste cut off the plate can fall into the collection mechanism from the gap between adjacent support components, and the work surface can be kept clean without the need for additional cleaning steps, thereby improving the overall production efficiency and ensuring the continuity and environmental friendliness of production.

[0007] Optionally, the support assembly includes a support plate and an adsorption member embedded in the support plate, the support plate is slidably disposed on the frame and is located below the cutting mechanism, the support plate is connected to the adjustment assembly, the adjustment assembly is used to adjust the spacing between multiple support plates, and the adsorption member is used to attract the plate.

[0008] By adopting the above technical solution, the adjustment component can flexibly adjust the spacing between multiple support plates to meet the cutting needs of plates of different sizes. And the adsorbent embedded in the support plate can firmly adsorb the plate during the cutting process to ensure that it is stable and immobile, effectively preventing the displacement of the plate caused by vibration or external force, and improving the cutting accuracy and stability. At the same time, this design allows the support structure to be dynamically adjusted according to actual needs, which not only ensures good support for the cutting area, but also avoids the problem of waste accumulation, and improves the overall production efficiency and processing quality.

[0009] Optionally, the adjustment component includes a lifting drive member and an adjustment plate, the lifting drive member is arranged on the frame, the adjustment plate is slidably arranged on the frame and connected to the lifting drive member, a guide groove is provided on the adjustment plate, the number of the guide grooves is equal to the number of the support plates, a plurality of the guide grooves are radially arranged with the lower ends converged and the upper ends divergent, and the plurality of guide grooves are equidistantly arranged in the groove body positions on the same cross section, a slider is provided on the support plate, and the slider is slidably inserted in the guide groove.

[0010] By adopting the above technical solution, multiple guide grooves are arranged radially with the lower end converged and the upper end divergent, so that when the lifting drive can drive the adjustment plate to move up and down, the support plate will be affected by the inner wall of the guide groove through the slider, so that the spacing between the multiple support plates can be automatically adjusted. This design not only realizes the effective support of plates of different widths, but also can flexibly change the support position as needed to ensure the stability of the cutting area. At the same time, the precise control of the spacing between the support plates helps to reduce the vibration and deformation of the material during cutting, and further improves the cutting accuracy and quality. In addition, the automatic adjustment function simplifies the operation process, improves production efficiency, and meets the needs of diversified sheet processing.

[0011] Optionally, a roller is provided at one end of the support plate away from the adjustment component, a slide groove is provided on the frame, and a plurality of rollers are respectively arranged in the slide groove.

[0012] By adopting the above technical solution, a roller is set at one end of the support plate away from the adjustment component, and a slide groove is opened on the frame, so that multiple rollers are respectively set in the slide groove. This design can effectively reduce the friction resistance when the support plate moves, ensuring that the support plate runs smoothly when adjusting the spacing. At the same time, with the cooperation of the roller and the slide groove, the position of the support plate can be accurately controlled to improve the accuracy of the support plate spacing adjustment. On this basis, the structure can also extend the service life of the equipment and reduce the maintenance frequency, thereby improving the working efficiency and stability of the entire cutting device.

[0013] Optionally, a receiving groove is provided on the frame, a limiting component is arranged in the receiving groove, the limiting component is located on the side of the support plate away from the adjustment component, and when the adsorption component is working, the limiting component limits the multiple support plates.

[0014] By adopting the above technical solution, when the adsorbent is working, the limit assembly can effectively limit the position of multiple support plates to ensure that they remain stable during the process of adsorbing the plate. This design not only improves the positioning accuracy of the support plate on the plate, but also prevents the displacement of the support plate caused by external vibration or other interference factors. At the same time, since the limit assembly only works when the adsorbent is working, it does not affect the adjustment function of the support plate in other operating states, thereby realizing an organic combination of flexible adjustment and precise fixation, and improving the working reliability and processing quality of the entire cutting device.

[0015] Optionally, the limit assembly includes a limit plate and an elastic member, one end of the limit plate is slidably arranged in the accommodating groove, the other end of the limit plate extends above the plurality of support plates and is provided with anti-slip grooves, the elastic member is arranged in the accommodating groove and connected to the limit plate, the elastic member is used to push the limit plate to move in a direction away from the support plate, and the adsorbent can attract the limit plate.

[0016] By adopting the above technical solution, when the spacing between multiple support plates needs to be adjusted, the adsorbent does not work, and the limit plate can be kept away from the support plate under the action of the elastic member, which is conducive to reducing the possibility of the limit plate interfering with the movement of the support plate. And when the adsorbent is started. The adsorbent can adsorb the plate, and at the same time overcome the elastic force of the elastic member to attract the limit plate to move downward, so that the limit plate fits tightly on the surface of multiple support plates, so as to improve the stability of the support plate, effectively prevent the displacement of the support plate caused by external vibration or other interference factors, and ensure the stability and reliability of the entire cutting process to a certain extent.

[0017] Optionally, it includes a cache mechanism, a transfer mechanism and a pushing mechanism, wherein the cache mechanism, the transfer mechanism and the pushing mechanism are respectively arranged on the frame, the pushing mechanism is arranged close to the supporting assembly, the transfer mechanism is used to transfer the plate between the cache mechanism and the pushing mechanism, and the pushing mechanism is used to push the plate to be processed onto the supporting assembly.

[0018] By adopting the above technical solution, the cache mechanism can temporarily store the plates to be processed to ensure the continuity and stability of the production process. The transfer mechanism is responsible for efficiently transferring the plates between the cache mechanism and the push mechanism, realizing automated material flow and reducing errors and time waste caused by manual intervention. The push mechanism accurately pushes the plates to be processed onto the support assembly, ensuring the accuracy of plate positioning and providing good basic conditions for subsequent laser cutting. The synergistic effect of this series of mechanisms not only improves the automation level of the entire device, but also effectively improves production efficiency and product quality, reduces production costs, and reduces safety hazards and defective product rates that may be caused by manual operation.

[0019] Optionally, the pushing mechanism includes a pushing platform, a pushing drive and a pushing plate. The pushing platform is arranged on the frame and close to the supporting assembly. A storage area is arranged at one end of the pushing platform close to the supporting assembly. The pushing drive is arranged on the pushing platform. The pushing plate is slidably arranged on the pushing platform and connected to the pushing drive. The pushing drive is used to drive the pushing plate to approach or move away from the storage area.

[0020] By adopting the above technical solution, the transfer mechanism can transfer the plates to be processed stored on the buffer mechanism to the storage area for temporary storage, and take away the plates that have been processed on the support assembly. At this time, the push drive can push the plates to be processed to move, so as to accurately push the plates in the storage area to the support assembly for fixing and cutting. This design effectively reduces the downtime of the cutting mechanism, thereby helping to improve production efficiency.

[0021] Optionally, an electromagnet is embedded in the push plate.

[0022] By adopting the above technical solution, an electromagnet is embedded in the push plate, which can generate adsorption force on the plate during the pushing process, ensure the stability of the plate during the pushing process, and avoid position deviation caused by vibration or external force. In addition, this design does not require additional physical clamping devices, simplifies the equipment structure, reduces the failure rate, and helps to achieve an efficient and stable plate processing process.

[0023] Optionally, a visual element is provided on the frame, and the visual element is used to detect the position of the plate on the supporting mechanism.

[0024] By adopting the above technical solution and setting up visual elements on the frame, the position of the plate on the support mechanism can be accurately detected. This ensures that the plate is accurately identified and positioned before cutting, avoiding processing errors caused by position deviation. As a result, not only the accuracy of plate cutting is improved, but also the stability and reliability of the entire production process are enhanced, further ensuring the high-quality output of the product. At the same time, this precise position detection helps to optimize subsequent cutting path planning and improve overall production efficiency.

[0025] In summary, the present application includes at least one of the following beneficial technical effects: 1. Through the cooperation of the cutting mechanism, the adjustment component, the support component and the collection mechanism, the spacing between the multiple support components can be flexibly adjusted according to the plates of different specifications to meet the diverse cutting requirements. At the same time, the waste cut from the plates can fall into the collection mechanism from the gaps between the adjacent support components, and the work surface can be kept clean without additional cleaning steps, thereby improving the overall production efficiency; 2. Through the cooperation between the support plate and the adsorption part, the plate can be stably adsorbed during the cutting process to effectively prevent the displacement of the plate caused by vibration or external force, thereby improving the cutting accuracy and stability; 3. Through the cooperation between the limit plate and the elastic part, when the adsorption part is working, the limit plate can be attached to the surface of the support plate to limit the support plate, so that the support plate can stably support the plate. At the same time, when the adsorption part is not working, the elastic part can push the limit plate to keep away from the support plate to facilitate the adjustment of the position of the support plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the overall structure of a silicon steel sheet laser cutting device in Example 1 of the present application.

[0027] Figure 2 It is a schematic diagram of the structure of the adjustment component in Example 1 of the present application.

[0028] Figure 3It is a structural schematic diagram of the support mechanism in Example 1 of the present application.

[0029] Figure 4 It is a side view of a silicon steel sheet laser cutting device in Example 1 of the present application.

[0030] Figure 5 is along Figure 4 Cross-sectional view along line BB.

[0031] Figure 6 yes Figure 1 A partial enlarged view of point A in the middle.

[0032] Figure 7 It is a schematic diagram of the overall structure of a silicon steel sheet laser cutting device in Example 2 of the present application.

[0033] Description of reference numerals: 1. Frame; 11. Slide; 12. Accommodating slot; 13. Limiting assembly; 131. Limiting plate; 1311. Anti-slip pattern; 132. Elastic member; 14. Visual element; 2. Cutting mechanism; 21. Three-axis driving assembly; 22. Laser cutting head; 3. Supporting mechanism; 31. Adjusting assembly; 311. Lifting driving member; 312. Adjusting plate; 3121. Guide slot; 32. Supporting assembly; 321. Supporting plate; 3211. Sliding block; 3212. Roller; 322. Adsorption member; 4. Collecting mechanism; 5. Plate; 6. Cache mechanism; 7. Transfer mechanism; 8. Pushing mechanism; 81. Pushing table; 811. Storage area; 82. Pushing driving member; 83. Pushing plate; 831. Electromagnet. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-7 This application is described in further detail.

[0035] The embodiment of the present application discloses a silicon steel sheet laser cutting device.

[0036] It should be noted that, in the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0037] Example 1 Reference Figure 1A silicon steel sheet laser cutting device comprises a frame 1, a cutting mechanism 2, a supporting mechanism 3 and a collecting mechanism 4. The cutting mechanism 2, the supporting mechanism 3 and the collecting mechanism 4 are respectively mounted on the frame 1, and the collecting mechanism 4 is located below the supporting mechanism 3. The supporting mechanism 3 is used to support a plate 5, so that the cutting mechanism 2 can cut the plate 5, and the waste cut from the plate 5 can fall into the collecting mechanism 4, so that the work surface can be kept clean without additional cleaning steps, thereby improving the overall production efficiency.

[0038] The cutting mechanism 2 includes a three-axis driving assembly 21 and a laser cutting head 22 mounted on the three-axis driving assembly 21. The three-axis driving assembly 21 is mounted on the frame 1, and the three-axis driving assembly 21 can drive the laser cutting head 22 to move, so that the laser cutting head 22 can accurately cut the plate 5.

[0039] In the embodiment of the present application, a laser cutting head 22 is used to cut the plate 5. Its high-energy-density laser beam can quickly melt or vaporize the irradiated area of ​​the silicon steel sheet, thereby forming a high-quality incision. Compared with stamping processing, it can achieve the characteristics of high processing accuracy, good incision quality, strong flexibility, fast cutting speed, high degree of automation and more environmental protection.

[0040] It should be noted that the specific structure and working principle of the three-axis driving assembly 21 and the laser cutting head 22 are conventional technical means for those skilled in the art, and therefore, they will not be described in detail in the embodiments of the present application.

[0041] Reference Figure 1 The support mechanism 3 includes an adjustment component 31 and a plurality of support components 32. The adjustment component 31 is arranged on the frame 1, and each support component 32 is movably connected to the frame 1 and is respectively connected to the adjustment component 31. The support component 32 is located directly below the cutting mechanism 2 and is responsible for supporting the cut plate 5. The adjustment component 31 is used to dynamically adjust the spacing between the plurality of support components 32.

[0042] The adjustment assembly 31 includes a lifting drive member 311 and an adjustment plate 312. The lifting drive member 311 is mounted on the frame 1, and the adjustment plate 312 is slidably disposed on the frame 1 and fixedly connected to the lifting drive member 311. In this embodiment, the lifting drive member 311 is a cylinder, so that the lifting drive member 311 is used to drive the adjustment plate 312 to move up and down. In other embodiments, the lifting drive member 311 can also be designed as a motor screw structure.

[0043] Reference Figure 2 and Figure 3A plurality of guide grooves 3121 are provided on the surface of the adjustment plate 312, the number of the guide grooves 3121 matches the number of the support components 32, and the plurality of guide grooves 3121 are arranged radially with the lower ends converged and the upper ends divergent, and the groove positions of the plurality of guide grooves 3121 on the same cross section are equidistantly arranged.

[0044] Reference Figure 1 and Figure 3 The support assembly 32 includes a support plate 321 and an adsorbent 322 embedded in the support plate 321. The support plate 321 is located below the laser cutting head 22, and the plurality of support plates 321 are parallel to each other. A slider 3211 is fixedly connected to one end of the support plate 321, and a roller 3212 is rotatably connected to the other end of the support plate 321. A slider 3211 is slidably inserted in a guide groove 3121. In this embodiment, the cross section of the slider 3211 is circular, so that the slider 3211 can slide smoothly in the guide groove 3121.

[0045] A slide groove 11 is opened on the frame 1 along the arrangement direction of the multiple support plates 321, and multiple rollers 3212 are respectively inserted in the slide groove 11. The rollers 3212 can slide in the slide groove 11, so that it is convenient to use the rollers 3212 and the sliders 3211 to stably support the support plates 321, and effectively reduce the friction resistance when the support plates 321 move, ensuring that the support plates 321 run smoothly when adjusting the spacing.

[0046] In other embodiments, the roller 3212 may be replaced by a slider 3211 to ensure stable support for the support plate 321 .

[0047] When it is necessary to adjust the spacing between the multiple support plates 321, the lifting drive 311 works to drive the adjustment plate 312 to rise and fall, so that the inner wall of the guide groove 3121 can exert a force on the slider 3211 to drive the support plate 321 to move, thereby facilitating the adjustment of the spacing between the multiple support plates 321 to achieve effective support for plates 5 of different widths, and can also flexibly change the support position as needed to ensure the stability of the cutting area.

[0048] Reference Figure 1 and Figure 3 In this embodiment, the adsorption member 322 is an electromagnet. When the plate 5 is placed on the plurality of support plates 321, the adsorption member 322 is powered on to adsorb the plate 5, so that the plate 5 is not easily displaced during the cutting process, so as to improve the cutting accuracy and stability. When the plate 5 is cut, the adsorption member 322 is powered off to facilitate the removal of the plate 5 from the support plate 321. It should be noted that in this embodiment, the plate 5 refers to the silicon steel sheet to be processed.

[0049] In other embodiments, the adsorption member 322 may also be configured as a negative pressure fan, and a negative pressure air outlet is provided on the support plate 321 so as to utilize the negative pressure generated by the negative pressure fan to adsorb the plate 5 .

[0050] Reference Figure 4 and Figure 5 The frame 1 is provided with a receiving groove 12 , and a limiting component 13 is arranged in the receiving groove 12 . When the adsorption member 322 is working, the limiting component 13 limits the plurality of support plates 321 .

[0051] Reference Figure 5 and Figure 6 The limiting assembly 13 includes a limiting plate 131 and an elastic member 132. One end of the limiting plate 131 is slidably disposed in the receiving groove 12, and the other end of the limiting plate 131 extends above the plurality of support plates 321, and an end of the limiting plate 131 extending above the support plates 321 is provided with an anti-slip pattern 1311.

[0052] In this embodiment, the limiting plate 131 is T-shaped, and the receiving groove 12 is adapted to the limiting plate 131 , so that the limiting plate 131 is not easy to separate from the receiving groove 12 , and the limiting plate 131 is made of metal material to facilitate the adsorption member 322 to attract the limiting plate 131 .

[0053] The elastic member 132 is disposed in the receiving groove 12 and connected to the limiting plate 131. In this embodiment, the elastic member 132 is a spring, so that the elastic member 132 can be used to push the limiting plate 131 to move away from the supporting plate 321.

[0054] When the spacing between the plurality of support plates 321 needs to be adjusted, the adsorption member 322 does not work, and the limiting plate 131 can remain away from the support plate 321 under the action of the elastic member 132, thereby helping to reduce the possibility of the limiting plate 131 interfering with the movement of the support plate 321.

[0055] When the adsorption member 322 is started, the adsorption member 322 can not only adsorb the plate 5, but also overcome the elastic force of the elastic member 132 to attract the limiting plate 131 to move downward, so that the anti-slip groove 1311 on the limiting plate 131 fits tightly against the surface of the multiple support plates 321 to limit the movement of the multiple support plates 321, improve the stability of the support plates 321, and effectively prevent the displacement of the support plates 321 caused by external vibration or other interference factors, thereby ensuring that the entire cutting process is smooth and reliable to a certain extent.

[0056] Reference Figure 1In this embodiment, the collecting mechanism 4 includes a collecting box, the upper part of which is open, and the collecting box is located below the plurality of supporting plates 321, so that the waste cut from the plate 5 can fall into the collecting box from the gaps between the adjacent supporting plates 321, and the work surface can be kept clean without additional cleaning steps, thereby improving the overall production efficiency. In other embodiments, a suction fan can also be provided in the collecting mechanism 4 to better allow the waste to enter the collecting box.

[0057] Reference Figure 1 A visual element 14 is installed on the frame 1, and the visual element 14 is arranged close to the support plate 321, so that the visual element 14 can be used to accurately detect the position of the plate 5 on the support plate 321, so as to ensure that the plate 5 is accurately identified and positioned before cutting, and avoid processing errors caused by position deviation. In this embodiment, the visual element 14 is a camera.

[0058] The implementation principle of a silicon steel sheet laser cutting device in an embodiment of the present application is as follows: when the silicon steel sheet needs to be cut, the lifting drive 311 is first started, the lifting drive 311 drives the adjustment plate 312 to rise and fall, and the adjustment plate 312 drives the multiple support plates 321 to move, so as to adjust the spacing between the multiple support plates 321 to a suitable value. Then the silicon steel sheet is placed on the multiple support plates 321, and the adsorption member 322 is energized, and the adsorption member 322 simultaneously adsorbs the silicon steel sheet and the limit plate 131, so that the anti-slip pattern 1311 on the limit plate 131 fits with the multiple support plates 321. At this time, the multiple support plates 321 can stably support the silicon steel sheet. Next, the three-axis drive assembly 21 drives the laser cutting head 22 to move to the designated area, so that the laser cutting head 22 can be used to complete the cutting of the silicon steel sheet. Finally, the adsorption member 322 is powered off to facilitate the removal of the processed silicon steel sheet from the support plate 321, and the cut waste will fall into the collection box under the action of gravity without the need for additional cleaning steps.

[0059] Example 2 Reference Figure 7 The difference between this embodiment and the first embodiment is that a buffer mechanism 6, a transfer mechanism 7 and a pushing mechanism 8 are installed on the frame 1.

[0060] The cache mechanism 6 is located on a side of the three-axis driving assembly 21 away from the support plate 321 . The cache mechanism 6 includes at least two material trays, and the plurality of material trays are respectively used to store silicon steel sheets to be processed and silicon steel sheets that have been processed.

[0061] The transfer mechanism 7 is located between the buffer mechanism 6 and the three-axis driving assembly 21. In this embodiment, the transfer mechanism 7 is a mechanical arm, so that the transfer mechanism 7 is convenient for transferring the silicon steel sheet.

[0062] It should be noted that the specific structure and working principle of the buffer mechanism 6 and the transfer mechanism 7 are conventional technical means for those skilled in the art, and therefore, they will not be described in detail in the embodiments of the present application.

[0063] Reference Figure 7 The pushing mechanism 8 includes a pushing platform 81, a pushing driving member 82 and a pushing plate 83. The pushing platform 81 is installed on the frame 1 and is arranged close to the support plate 321, and the pushing platform 81 is located on the side of the three-axis driving assembly 21 away from the transfer mechanism 7.

[0064] A material storage area 811 is provided at one end of the pushing platform 81 close to the supporting plate 321 , and the material storage area 811 is used to store silicon steel sheets to be processed.

[0065] The push drive 82 is mounted on the push platform 81, and the push plate 83 is slidably disposed on the push platform 81 and fixedly connected to the push drive 82. In this embodiment, the push drive 82 is a cylinder, so that the push drive 82 can be used to drive the push plate 83 to approach or move away from the storage area 811.

[0066] In this embodiment, the push plate 83 is embedded with an electromagnet 831, which can generate an adsorption force on the silicon steel sheet during the pushing process, ensure the stability of the silicon steel sheet during the pushing process, and avoid position deviation caused by vibration or external force. In addition, this design does not require an additional physical clamping device, simplifies the equipment structure, reduces the failure rate, and helps to achieve an efficient and stable silicon steel sheet processing process.

[0067] Reference Figure 7 When the silicon steel sheet needs to be cut, the push drive 82 drives the push plate 83 to move, and the push plate 83 pushes the silicon steel sheet to be processed onto the multiple support plates 321 and then returns to its original position. At this time, the transfer mechanism 7 transfers the new silicon steel sheet to be processed from the buffer mechanism 6 to the storage area 811. And when the silicon steel sheet is processed, the transfer mechanism 7 transfers the silicon steel sheet from the support plate 321 to the buffer mechanism 6 for storage. This design effectively reduces the downtime of the overall device, which is conducive to improving production efficiency.

[0068] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A silicon steel sheet laser cutting device, characterized in that: include: Rack(1); A cutting mechanism (2) arranged on the frame (1); A support mechanism (3), comprising an adjustment component (31) and a plurality of support components (32), wherein the adjustment component (31) is arranged on the frame (1), the plurality of support components (32) are respectively movably connected to the frame (1) and are respectively connected to the adjustment component (31), the support component (32) is located below the cutting mechanism (2), the support component (32) is used to support the plate (5), and the adjustment component (31) is used to adjust the spacing between the plurality of support components (32); The collecting mechanism (4) is arranged below the plurality of supporting components (32).

2. The silicon steel sheet laser cutting device according to claim 1, characterized in that: The support assembly (32) comprises a support plate (321) and an adsorption member (322) embedded in the support plate (321); the support plate (321) is slidably disposed on the frame (1) and is located below the cutting mechanism (2); the support plate (321) is connected to the adjustment assembly (31); the adjustment assembly (31) is used to adjust the spacing between a plurality of the support plates (321); and the adsorption member (322) is used to attract the plate (5).

3. The silicon steel sheet laser cutting device according to claim 2, characterized in that: The adjustment component (31) comprises a lifting drive member (311) and an adjustment plate (312); the lifting drive member (311) is arranged on the frame (1); the adjustment plate (312) is slidably arranged on the frame (1) and connected to the lifting drive member (311); a guide groove (3121) is provided on the adjustment plate (312); the number of the guide grooves (3121) is equal to the number of the support plate (321); a plurality of the guide grooves (3121) are arranged radially with the lower ends converged and the upper ends divergent; and the plurality of the guide grooves (3121) are equidistantly arranged at the groove body positions on the same cross section; a slider (3211) is provided on the support plate (321); the slider (3211) is slidably inserted in the guide groove (3121).

4. The silicon steel sheet laser cutting device according to claim 2, characterized in that: A roller (3212) is provided at one end of the support plate (321) away from the adjustment assembly (31), a slide groove (11) is provided on the frame (1), and a plurality of rollers (3212) are respectively arranged in the slide groove (11).

5. The silicon steel sheet laser cutting device according to claim 2, characterized in that: The frame (1) is provided with a receiving groove (12), and a limiting component (13) is arranged in the receiving groove (12). The limiting component (13) is located on a side of the support plate (321) away from the adjustment component (31). When the adsorption member (322) is working, the limiting component (13) limits the plurality of support plates (321).

6. The silicon steel sheet laser cutting device according to claim 5, characterized in that: The limiting assembly (13) comprises a limiting plate (131) and an elastic member (132); one end of the limiting plate (131) is slidably disposed in the receiving groove (12); the other end of the limiting plate (131) extends above the plurality of support plates (321) and is provided with anti-slip grooves (1311); the elastic member (132) is disposed in the receiving groove (12) and connected to the limiting plate (131); the elastic member (132) is used to push the limiting plate (131) to move in a direction away from the support plate (321); and the adsorption member (322) is capable of attracting the limiting plate (131).

7. The silicon steel sheet laser cutting device according to claim 1, characterized in that: The machine comprises a buffer mechanism (6), a transfer mechanism (7) and a push mechanism (8), wherein the buffer mechanism (6), the transfer mechanism (7) and the push mechanism (8) are respectively arranged on the frame (1), the push mechanism (8) is arranged close to the support assembly (32), the transfer mechanism (7) is used for transferring the plate (5) between the buffer mechanism (6) and the push mechanism (8), and the push mechanism (8) is used for pushing the plate (5) to be processed onto the support assembly (32).

8. The silicon steel sheet laser cutting device according to claim 7, characterized in that: The pushing mechanism (8) comprises a pushing platform (81), a pushing driving member (82) and a pushing plate (83); the pushing platform (81) is arranged on the frame (1) and close to the supporting assembly (32); a material storage area (811) is arranged at one end of the pushing platform (81) close to the supporting assembly (32); the pushing driving member (82) is arranged on the pushing platform (81); the pushing plate (83) is slidably arranged on the pushing platform (81) and connected to the pushing driving member (82); the pushing driving member (82) is used to drive the pushing plate (83) to approach or move away from the material storage area (811).

9. The silicon steel sheet laser cutting device according to claim 8, characterized in that: The push plate (83) is embedded with an electromagnet (831).

10. The silicon steel sheet laser cutting device according to claim 1, characterized in that: The frame (1) is provided with a visual element (14), and the visual element (14) is used to detect the position of the plate (5) on the supporting mechanism (3).

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