Reaction cavity pressure control method and device, electronic equipment and storage medium

Abstract

The invention relates to a general control or regulation system, in particular to a reaction cavity pressure control method and device, electronic equipment and a storage medium, and the method comprises the steps: after the air pressure in a reaction cavity is reduced to a preset bottom pressure, a difference value between the current air pressure in the reaction cavity and a preset target air pressure is used as a reference; the opening degree of the first butterfly valve is adjusted, and the opening degree of the second butterfly valve is adjusted based on the opening degree of the first butterfly valve, so that a cascade control system for active control over the first butterfly valve and driven control over the second butterfly valve is formed, the opening degree changes of the first butterfly valve and the second butterfly valve are synchronous, and the situation that due to air flow changes, the air flow changes is avoided. The problem of film forming quality deviation caused by the fact that gas in the cavity cannot flow in the preset direction due to inconsistent opening angles caused by the fact that the two butterfly valves independently control the two exhaust pipelines respectively is solved, and the pressure stability in the reaction cavity is improved.

Description

Technical Field

[0001] The present invention relates to a general control or regulation system, and in particular to a reaction chamber pressure control method, device, electronic equipment and storage medium. Background Art

[0002] Atomic layer deposition (ALD) equipment is an advanced technology device used for thin film preparation. It can control the growth of thin films on the surfaces of various materials with atomic-level precision. Specifically, the ALD equipment constructs thin films layer by layer by alternately introducing two different precursor gases into the reaction chamber to perform self-limiting chemical reactions on the substrate surface.

[0003] In the related art, usually by Figure 1 The reaction chamber structure shown in the figure is used to prepare a thin film. The specific process includes placing a substrate on a workpiece disk, introducing precursor A into the reaction chamber to form a single adsorption layer on the surface of the substrate; using an inert gas to purge the unadsorbed precursor molecules and byproducts and discharge them from the reaction chamber; introducing precursor B to react chemically with the adsorbed precursor A to generate an atomic layer of thin film; using an inert gas to purge the unreacted precursor B molecules and byproducts and discharge them from the reaction chamber; and alternately introducing precursors A and B to deposit thin films layer by layer until the desired thickness is reached. Because the entire process has undergone two ventilation and two purge processes to complete one thin film deposition, this control method has low thin film deposition efficiency, consumes a lot of reaction gas, and has a high cost.

[0004] In order to improve the preparation efficiency, the related technology proposes a spatial ALD process. Specifically, the reaction chamber is divided into three inputs, and the first precursor, the second precursor and the inert gas are respectively input into the reaction chamber by three input pipes, wherein the inert gas forms an air curtain between the first precursor and the second precursor to prevent the two precursors from mixing with each other. Correspondingly, in the spatial ALD process, the workpiece disk is set to a rotatable form, and the rotating workpiece disk drives the wafer to pass through the precursor A area, the purge area, and the precursor B area in sequence, and each rotation completes a film deposition cycle. The precursor A area, the purge area, and the precursor B area are distributed along the circumference of the reaction chamber cover in a certain form, and a continuous air intake method is used to provide precursor and purge processing functions for wafers passing through the corresponding areas. The wafer that has completed the coating will be transferred out of the reaction chamber, and then the uncoated wafer will be transferred into the reaction chamber and placed on the workpiece disk to start the next thin film deposition process.

[0005] In the process of thin film preparation, it is usually necessary to control the pressure in the reaction chamber to a near-vacuum state in order to achieve the quality of thin film preparation. However, due to the influence of different gas injections and temperature changes in the spatial preparation process, the air pressure in the reaction chamber fluctuates greatly. Therefore, how to improve the air pressure stability in the reaction chamber is an urgent problem to be solved. Summary of the invention

[0006] In view of this, an embodiment of the present invention provides a reaction chamber pressure control method, device, electronic device and storage medium to achieve stable control of the reaction chamber pressure.

[0007] According to one aspect of the present invention, a reaction chamber pressure control method is provided, the method being applied to a reaction chamber of a space-type atomic deposition device, the reaction chamber comprising a first precursor region, a second precursor region, and a gas curtain formed by an inert gas, the gas curtain being used to isolate the first precursor region from the second precursor region, the method comprising: In the position control mode, the openings of the first butterfly valve and the second butterfly valve are controlled to be in a fully open state, so as to evacuate the reaction chamber through the first air pump and the second air pump, so that the pressure in the reaction chamber reaches a preset bottom pressure; the first butterfly valve is used to control the exhaust pipeline in the first precursor area, and the second butterfly valve is used to control the exhaust pipeline in the second precursor area; When the pressure in the reaction chamber reaches a preset bottom pressure, based on the difference between the current air pressure in the reaction chamber and a preset target air pressure, adjusting the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump so that the pressure in the reaction chamber is maintained at the target air pressure; The opening degree of the second butterfly valve is adjusted based on the opening degree of the first butterfly valve, so that the gas pressure in the reaction chamber is maintained at the target gas pressure.

[0008] In a possible embodiment, the reaction chamber further includes a vacuum gauge, and the vacuum gauge is used to measure the pressure in the reaction chamber. The method further includes: In the case where the pressure in the reaction chamber exceeds a preset pressure range, returning to the step of adjusting the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure, so that the pressure in the reaction chamber is maintained at the target air pressure, wherein the preset pressure range is determined based on the target air pressure and a preset variation coefficient.

[0009] In a possible embodiment, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure includes: Calculating the difference between the current gas pressure in the reaction chamber and the target gas pressure as a first target control variable; Calculating a first target opening of the first butterfly valve based on the first target control amount by using fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a first proportional coefficient, a first integral coefficient and a first differential coefficient; Opening the first butterfly valve to the first target opening to adjust the pumping rate of the first air pump; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve comprises: Calculating a difference between the first target opening and the current opening of the second butterfly valve as a second target control variable; Calculating the second target opening of the second butterfly valve based on the second target control quantity by using the fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a second proportional coefficient, a second integral coefficient and a second differential coefficient; The second butterfly valve is opened to the second target opening to adjust the pumping rate of the second air pump.

[0010] In a possible embodiment, based on the difference between the current air pressure in the reaction chamber and the preset target air pressure, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump includes: in the pressure control mode, calculating the first target opening of the first butterfly valve by the following formula:

[0011] in, is the first target opening, is the first differential coefficient, is the difference between the current air pressure and the target air pressure, T i1 is the first integration time, the first integration coefficient K i1 = , T d1 is the first differential time, the first differential coefficient K d1 = ; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve includes: calculating a second target opening of the second butterfly valve by the following formula:

[0012] in, is the second target opening, is the second differential coefficient, is the difference between the first target opening and the current opening of the second butterfly valve, T i2 is the second integration time, the second integration coefficient K i2 = , T d2 is the second differential time, the second differential coefficient K d2 = .

[0013] According to another aspect of the present invention, a reaction chamber pressure control device is provided, the device comprising a vacuum gauge, a first exhaust pipeline and a second exhaust pipeline; The vacuum gauge is connected to the reaction chamber and is used to measure the gas pressure in the reaction chamber. The first exhaust pipeline is connected to the first precursor area of ​​the reaction chamber, and the second exhaust pipeline is connected to the second precursor area of ​​the reaction chamber. The first exhaust pipeline includes a first butterfly valve controller, a first butterfly valve, and a first dry pump. The first dry pump is used to extract gas from the reaction chamber, and the first butterfly valve is used to control the exhaust rate of the first dry pump. The second exhaust pipeline includes a second butterfly valve controller, a second butterfly valve, and a second dry pump. The second dry pump is used to extract gas from the reaction chamber, and the second butterfly valve is used to control the exhaust rate of the second dry pump. The first butterfly valve and the second butterfly valve are used to evacuate the reaction chamber through the first air pump and the second air pump when the opening is in a fully opened state, so that the pressure in the reaction chamber reaches a preset bottom pressure; The first butterfly valve controller is used to adjust the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and a preset target air pressure, so that the pressure in the reaction chamber is maintained at the target air pressure; The second butterfly valve controller is used to adjust the opening of the second butterfly valve based on the opening of the first butterfly valve, so that the gas pressure in the reaction chamber is maintained at the target gas pressure.

[0014] In a possible embodiment, the first butterfly valve controller is further used to, when the pressure in the reaction chamber exceeds a preset pressure range, return a difference between the current air pressure in the reaction chamber and a preset target air pressure, and adjust the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump so that the pressure in the reaction chamber is maintained at the target air pressure, wherein the preset pressure range is determined based on the target air pressure and a preset variation coefficient.

[0015] In a possible embodiment, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure includes: Calculating the difference between the current gas pressure in the reaction chamber and the target gas pressure as a first target control variable; Calculating a first target opening of the first butterfly valve based on the first target control amount by using fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a first proportional coefficient, a first integral coefficient and a first differential coefficient; Opening the first butterfly valve to the first target opening to adjust the pumping rate of the first air pump; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve comprises: Calculating a difference between the first target opening and the current opening of the second butterfly valve as a second target control variable; Calculating the second target opening of the second butterfly valve based on the second target control quantity by using the fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a second proportional coefficient, a second integral coefficient and a second differential coefficient; The second butterfly valve is opened to the second target opening to adjust the pumping rate of the second air pump.

[0016] In a possible embodiment, based on the difference between the current air pressure in the reaction chamber and the preset target air pressure, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump includes: in the pressure control mode, calculating the first target opening of the first butterfly valve by the following formula:

[0017] in, is the first target opening, is the first differential coefficient, is the difference between the current air pressure and the target air pressure, T i1is the first integration time, the first integration coefficient K i1 = , T d1 is the first differential time, the first differential coefficient K d1 = ; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve includes: calculating a second target opening of the second butterfly valve by the following formula:

[0018] in, is the second target opening, is the second differential coefficient, is the difference between the first target opening and the current opening of the second butterfly valve, T i2 is the second integration time, the second integration coefficient K i2 = , T d2 is the second differential time, the second differential coefficient K d2 = .

[0019] According to another aspect of the present invention, there is provided an electronic device, comprising: Processor; and Memory for storing programs, Wherein, the program includes instructions, and when the instructions are executed by the processor, the processor executes any of the above-mentioned reaction chamber pressure control methods.

[0020] According to another aspect of the present invention, a non-transitory computer-readable storage medium storing computer instructions is provided, wherein the computer instructions are used to enable a computer to execute any of the above-mentioned reaction chamber pressure control methods.

[0021] One or more technical solutions provided in the embodiments of the present invention, after the air pressure in the reaction chamber is reduced to a preset bottom pressure, use the difference between the current air pressure in the reaction chamber and the preset target air pressure as a reference to adjust the opening of the first butterfly valve, and adjust the opening of the second butterfly valve based on the opening of the first butterfly valve, forming a cascade control system in which the first butterfly valve is actively controlled and the second butterfly valve is passively controlled, so that the opening changes of the first butterfly valve and the second butterfly valve are synchronized, avoiding the inconsistent opening angles caused by the two butterfly valves independently controlling the two exhaust pipes due to changes in airflow, thereby avoiding the problem of being unable to form stable and fixed inlet and exhaust channels due to changes in airflow caused by the two butterfly valves independently controlling the two exhaust pipes, thereby improving the pressure stability in the reaction chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Further details, features and advantages of the invention are disclosed in the following description of exemplary embodiments in conjunction with the accompanying drawings, in which: Figure 1 A schematic diagram of the structure of the ALD preparation process used in the related art; Figure 2 A schematic flow chart of a reaction chamber pressure control method provided by an embodiment of the present invention; Figure 3 A control logic diagram of the butterfly valve opening of the reaction chamber pressure control method provided by an embodiment of the present invention; Figure 4 A schematic diagram of the structure of a reaction chamber pressure control device provided by an embodiment of the present invention; Figure 5 Another schematic flow chart of a reaction chamber pressure control method provided by an embodiment of the present invention; Figure 6 A block diagram of an exemplary electronic device that can be used to implement an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0023] Embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein, which are instead provided for a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0024] It should be understood that the various steps described in the method embodiments of the present invention may be performed in different orders and / or in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present invention is not limited in this respect.

[0025] The term "including" and its variations used in this document are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". Relevant definitions of other terms will be given in the following description. It should be noted that the concepts of "first", "second", etc. mentioned in the present invention are only used to distinguish different devices, modules or units, and are not used to limit the order or interdependence of the functions performed by these devices, modules or units.

[0026] It should be noted that the modifications of "one" and "plurality" mentioned in the present invention are illustrative rather than restrictive, and those skilled in the art should understand that, unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0027] The names of the messages or information exchanged between multiple devices in the embodiments of the present invention are only used for illustrative purposes, and are not used to limit the scope of these messages or information.

[0028] In the spatial ALD preparation process, the reaction chamber needs to be in a near-vacuum environment and needs to be stably maintained at a given temperature and pressure state. Since precursor A and precursor B need to be isolated by the air curtain formed by the purge gas during the process and cannot be mixed, the exhaust system needs to have two exhaust outlets to discharge precursor A and precursor B from the chamber through different outlets. The chamber pressure needs to be controlled simultaneously through these two exhaust outlets to maintain the stability of the chamber pressure during the process.

[0029] In the related technology, the pressure of the reaction chamber is usually controlled by independently controlling two exhaust pipes. However, due to the difference in the intake volume of the two precursors and the inert gas, the air pressure in the chamber may be uneven. Due to the coupling of the two precursor areas, when the two exhaust pipes control the exhaust in the corresponding precursor area based on the exhaust volume calculated based on the air pressure in a single precursor area, it is easy for the two exhaust pipes to affect each other, resulting in the inability of precursor A and precursor B to form stable and fixed intake and exhaust channels, thereby affecting the film formation quality.

[0030] Based on this, the embodiments of the present invention provide a reaction chamber pressure control method, device, electronic device and storage medium. The reaction chamber pressure control method provided by the embodiments of the present invention can be applied to any electronic device with reaction chamber pressure control capability, such as a computer, a server or a mobile terminal, etc. In a possible embodiment, the reaction chamber pressure control method can be applied to a butterfly valve controller of a spatial ALD device.

[0031] In a possible embodiment, the reaction chamber pressure control method provided in the embodiment of the present invention can be applied to a spatial ALD process, wherein the reaction chamber in the ALD device includes a first precursor region, a second precursor region, and a gas curtain formed by an inert gas, wherein the gas curtain is used to isolate the first precursor region from the second precursor region. The scheme of the present invention is described below with reference to the accompanying drawings: like Figure 2 As shown, Figure 2 A flow chart of a reaction chamber pressure control method provided in an embodiment of the present invention may include the following steps: S201, in the position control mode, the openings of the first butterfly valve and the second butterfly valve are controlled to be in a fully open state, so as to evacuate the reaction chamber through the first air pump and the second air pump, so that the pressure in the reaction chamber reaches a preset bottom pressure; the first butterfly valve is used to control the exhaust pipeline in the first precursor area, and the second butterfly valve is used to control the exhaust pipeline in the second precursor area; S202: When the pressure in the reaction chamber reaches a preset bottom pressure, based on the difference between the current air pressure in the reaction chamber and a preset target air pressure, adjusting the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump so that the pressure in the reaction chamber is maintained at the target air pressure; S203: Adjust the opening of the second butterfly valve based on the opening of the first butterfly valve, so that the gas pressure in the reaction chamber is maintained at the target gas pressure.

[0032] By applying the embodiment of the present invention, after the air pressure in the reaction chamber is reduced to a preset bottom pressure, the difference between the current air pressure in the reaction chamber and the preset target air pressure is used as a reference to adjust the opening of the first butterfly valve, and the opening of the second butterfly valve is adjusted based on the opening of the first butterfly valve, forming a cascade control system in which the first butterfly valve is actively controlled and the second butterfly valve is passively controlled, so that the opening changes of the first butterfly valve and the second butterfly valve are synchronized, thereby avoiding the problem of the two butterfly valves independently controlling the two exhaust pipes due to changes in airflow, thereby avoiding the problem of the two butterfly valves independently controlling the two exhaust pipes and being unable to form stable and fixed inlet and exhaust channels due to changes in airflow, thereby improving the pressure stability in the reaction chamber.

[0033] The above S201-S203 are exemplarily described below: When the reaction chamber is not undergoing thin film preparation, the internal pressure is usually atmospheric pressure. In order to create an ALD process preparation environment, the pressure in the reaction chamber needs to be reduced to a vacuum state. The vacuum state is usually 0 pressure, but due to actual process limitations, the pressure in the vacuum state can be set to close to 0 pressure, such as 4 mTorr.

[0034] In a possible embodiment, the openings of the first butterfly valve and the second butterfly valve can be adjusted to the maximum opening, that is, the first butterfly valve and the second butterfly valve are controlled to be in a fully open state, so as to pump the air pressure in the reaction chamber to a preset bottom pressure as quickly as possible, and the preset bottom pressure is the air pressure value corresponding to the above-mentioned vacuum state. Specifically, the first dry pump can be controlled by the first butterfly valve, and the second dry pump can be controlled by the second butterfly valve to extract the gas in the reaction chamber. The control here means that the first butterfly valve and the second butterfly valve control the first dry pump and the second dry pump by controlling the gas flow in the exhaust pipeline.

[0035] In a possible embodiment, in order to avoid a too fast pressure reduction rate at the beginning of air extraction, a gate valve and a bypass valve can be set in the two exhaust pipelines. The gate valve and the bypass valve are installed in parallel, and the gate valve and the bypass valve are installed in series with the butterfly valve in the exhaust pipeline, and are used to control the dry pump exhaust together with the butterfly valve.

[0036] The above-mentioned gate valve and bypass valve have different openings. The opening of the valve refers to the distance or angle that the valve core or valve plate moves relative to the closed position, which determines the amount of fluid flowing through the valve. The larger the opening, the greater the amount of fluid flowing through the valve per unit time. Exemplarily, the opening of the above-mentioned gate valve is greater than the opening of the bypass valve. As a possible way, when starting to pump air, the openings of the first butterfly valve and the second butterfly valve can be first set to the maximum opening, and the two bypass valves can be opened at the same time, so that the dry pump extracts the gas in the reaction chamber according to the opening of the bypass valve. When the air pressure in the reaction chamber is reduced to the first preset air pressure, the two bypass valves are closed, and the two gate valves are opened to use a larger opening to control the two dry pumps to extract the gas in the reaction chamber. The above-mentioned first preset air pressure can be set according to the actual application scenario, and the first preset air pressure is usually greater than the preset bottom pressure.

[0037] Through the above technical solution, gas is first extracted using a valve with a smaller opening, and then gas is extracted using a valve with a larger opening, thereby avoiding damage to devices that may be caused by a too fast rate of decrease in the reaction chamber pressure.

[0038] In a possible embodiment, when the air pressure in the reaction chamber is reduced to a preset bottom pressure, the opening of the first butterfly valve can be controlled based on the preset target air pressure and the current air pressure in the reaction chamber. The air pressure in the reaction chamber can be measured by a vacuum gauge connected to the reaction chamber. The vacuum gauge is also called a vacuum gauge, which is an instrument for measuring vacuum or air pressure. The target air pressure may be set according to actual process requirements, such as 3mTorr. The target air pressure may be sent from the upper computer to the lower computer, and from the lower computer to the first butterfly valve controller, so that the first butterfly valve controller controls the opening of the first butterfly valve based on the target air pressure. The lower computer may be a programmable logic controller (PLC).

[0039] In a possible embodiment, different working modes can be set for the first butterfly valve controller and the second butterfly valve controller. For example, the above S201 can be set to be performed in the position control mode. Before executing S202-S203, the working mode of the first butterfly valve controller can be set to the pressure control mode ControMode=Pressure, and the working mode of the second butterfly valve controller can be set to the position control mode ControlMode=Position, so as to distinguish it from other possible working modes. The above other possible working modes may include manual adjustment, adjustment of the opening to the maximum, etc. The above first butterfly valve controller is used to control the opening of the first butterfly valve, and the second butterfly valve controller is used to control the opening of the second butterfly valve.

[0040] In a possible embodiment, the difference between the target air pressure and the current air pressure can be used as the target control amount, and the opening of the first butterfly valve can be controlled based on the target control amount through an automatic control algorithm. Exemplarily, the difference between the current air pressure in the reaction chamber and the target air pressure can be calculated as the first target control amount; Calculating the first target opening of the first butterfly valve based on the first target control quantity by using fuzzy control and PID adjustment algorithm (proportional-integral-differential adjustment algorithm), wherein the PID adjustment algorithm includes a first proportional coefficient, a first integral coefficient and a first differential coefficient; The first butterfly valve is opened to the first target opening to adjust the pumping rate of the first air pump.

[0041] In a possible embodiment, the parameters in the above PID adjustment algorithm can be obtained by fuzzy control. Fuzzy control is a method of obtaining a fuzzy subset by defining an input subset, an output subset and a corresponding membership function, and the fuzzy subset includes an input and a target output. Exemplarily, the PID parameters corresponding to the first target control amount can be obtained based on the corresponding relationship between the historical air pressure difference and the PID parameters, and the membership function. The above membership function can be selected according to the actual application scenario, such as a trapezoidal membership function, a Gaussian membership function, etc.

[0042] In a possible embodiment, the first target opening of the first butterfly valve may be calculated by the following formula:

[0043] in, is the first target opening, is the first differential coefficient, is the difference between the current air pressure and the target air pressure, T i1 is the first integration time, the first integration coefficient K i1 = , T d1 is the first differential time, the first differential coefficient K d1 = .

[0044] In a possible embodiment, after obtaining the first target opening of the first butterfly valve, the first dry pump can be controlled according to the first target opening. Specifically, after obtaining the first target opening, the first butterfly valve controller can set the opening of the first butterfly valve to the first target opening. At the same time, the first butterfly valve controller can send the first target opening to the lower computer, and the lower computer sends the first target opening to the second butterfly valve controller, and the second butterfly valve controller calculates the opening of the second butterfly valve based on the first target opening and the current opening of the second butterfly valve. After the air pressure in the reaction chamber is pumped to the preset bottom pressure, the opening of the second butterfly valve can be set to an arbitrary value, so the current opening of the second butterfly valve can also be an arbitrary value.

[0045] The calculation method of the opening of the second butterfly valve is the same as the calculation process of the opening of the first butterfly valve, only the control quantity is different, so only a brief explanation is given here without further elaboration.

[0046] In a possible embodiment, a difference between the first target opening and the current opening of the second butterfly valve may be calculated as the second target control amount; Calculating the second target opening of the second butterfly valve based on the second target control quantity by using the fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a second proportional coefficient, a second integral coefficient and a second differential coefficient; The second butterfly valve is opened to the second target opening to adjust the pumping rate of the second air pump.

[0047] In a possible embodiment, adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve may include calculating a second target opening of the second butterfly valve by the following formula:

[0048] in, is the second target opening, is the second differential coefficient, is the difference between the first target opening and the current opening of the second butterfly valve, T i2 is the second integration time, the second integration coefficient K i2 = , T d2 is the second differential time, the second differential coefficient K d2 = The PID parameters used to calculate the opening of the second butterfly valve may be the same as or different from the PID parameters used to calculate the opening of the first butterfly valve, and the present invention does not make any specific limitation thereto.

[0049] In a possible embodiment, the above method may also include: when the pressure in the reaction chamber exceeds a preset pressure range, returning the difference between the current air pressure in the reaction chamber and the preset target air pressure, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump so that the pressure in the reaction chamber is maintained at the target air pressure, wherein the preset pressure range is determined based on the target air pressure and a preset variation coefficient.

[0050] Exemplarily, the above pressure range may be P SP ±εP SP , where Psp is the target gas pressure, and ε is a preset coefficient in the range of (0,1). The specific value of the coefficient can be determined according to the process requirements. SP -P VG (t)|-| εP SP When |>0, you can adjust it again through the above steps.

[0051] As the ALD process proceeds, pressure disturbances will occur in the reaction chamber. These disturbances usually come from the temperature change of the reaction chamber ΔT=T(t2)-T(t1) and the flow change of the gas in the reaction chamber ΔQ=Q 进气 -Q 排气 The changes caused by these two disturbance factors will be reflected in the current pressure change of the reaction chamber Δp(t)=αΔT+βΔQ (α, β are the conversion coefficients of temperature and flow rate to pressure change respectively), and the measured value P of the pressure detection device VG will be VG The feedback is sent to the first butterfly valve controller, and the first butterfly valve controller can respond quickly based on the real-time pressure value in the reaction chamber and adjust the opening of the first butterfly valve and the second butterfly valve to achieve a dynamic stability effect that meets the process reaction requirements.

[0052] like Figure 3 As shown, Figure 3 A logic diagram of butterfly valve opening control of a reaction chamber pressure control method provided by an embodiment of the present invention; First, based on the current pressure P in the reaction chamber measured by the vacuum gauge VG With the preset target pressure P SP The difference between them is taken as the first target control quantity P(t), and the PID parameters are obtained based on the first target control quantity by using the fuzzy control method. Based on the PID parameters, the adaptive PID adjustment is performed according to the first target control quantity to obtain the opening angle P of the butterfly valve 1. 1 .

[0053] After the opening angle of the butterfly valve 1 is obtained, the opening angle P 1 And the current opening angle P of butterfly valve 2 2 The difference between them is used as the second target control quantity P(t), and the PID control parameter is obtained based on the second target control quantity by using the fuzzy control method. Based on the PID control parameter, the adaptive PID adjustment is performed according to the second target control quantity to obtain the opening angle P of the butterfly valve 2. 2 .

[0054] During the ALD process, there will be changes in the temperature of the vacuum reaction chamber △T and the quality and flow rate of the process gas △Q, which will cause changes in the gas pressure in the reaction chamber. The vacuum gauge can measure the pressure in the reaction chamber according to the sampling period. When the pressure exceeds the preset range, the opening of the two butterfly valves can be recalculated based on the above control logic.

[0055] like Figure 4 As shown, Figure 4 Schematic diagram of a reaction chamber pressure control device provided in an embodiment of the present invention; the reaction chamber includes an air inlet for precursor A, an air inlet for inert gas (purge gas), and an air inlet for precursor A, and each air inlet includes a mass flow controller MFC. The reaction chamber includes a precursor A region and a precursor B region, and the inert gas forms an air curtain between the precursor A region and the precursor B region.

[0056] The reaction chamber pressure control device comprises a vacuum gauge VG, a lower computer PLC, a first exhaust pipe, a second exhaust pipe and an exhaust gas treatment device. The vacuum gauge is connected to the reaction chamber and is used to measure the gas pressure in the reaction chamber.

[0057] The first exhaust pipe is connected to the precursor A region, and the first exhaust pipe includes a gate valve 1, a bypass 1, a butterfly valve 1, a butterfly valve controller BV1, a butterfly valve 1, and a dry pump 1. The second exhaust pipe is connected to the precursor B region, and the second exhaust pipe includes a gate valve 2, a bypass 2, a butterfly valve 2, a butterfly valve controller BV2, a butterfly valve 2, and a dry pump 2.

[0058] based on Figure 4 The device structure diagram shown in Figure 5 , Figure 5 Another flow chart of a reaction chamber pressure control method provided in an embodiment of the present invention may include the following steps: S501, set the pressure to a given value P through the host computer SP The pressure set value sent to the PLC is the above-mentioned target pressure value.

[0059] S502, PLC obtains Psp and pressure control instructions, and sends the pressure instructions to the butterfly valve controller BV1, so that BV1 works in the pressure control mode.

[0060] S503, the butterfly valve controller BV1 collects the current pressure signal P of the chamber through the vacuum gauge VG connected to the chamber VG .

[0061] S504, based on P VG Determine whether the current chamber pressure reaches the bottom pressure. If so, execute S505; if not, return to S503.

[0062] S505, start the pressure control mode. Specifically, the butterfly valve 1 starts the pressure control through the adaptive pressure control mode of the butterfly valve controller BV1, and controls the chamber pressure by adjusting the opening angle of the butterfly valve.

[0063] S506, BV1 feeds back the real-time opening angle value P1 of butterfly valve 1 to the lower computer controller PLC through the lower computer bus system, and the lower computer sends the opening angle value P1 to the butterfly valve controller of butterfly valve 2.

[0064] S507, the butterfly valve controller BV2 turns on the position control mode. After receiving the current opening angle value P1 of the butterfly valve 1 and the position control start instruction sent by the lower computer controller PLC, it turns on the position control of the butterfly valve 2 and adjusts the opening angle P2 of the butterfly valve 2 according to the current opening angle value of the butterfly valve 1.

[0065] S508, determine whether P1 is equal to P2, if so, execute S509, if not, return to S507.

[0066] S509: Determine whether the current chamber pressure value is equal to the required value P given by the process. SP If yes, then the process ends; if no, then it returns to S503.

[0067] The embodiment of the present invention adopts a cascade control system solution consisting of main butterfly valve pressure control (Pressure) + slave butterfly valve position control (Position), thereby achieving stable control of chamber pressure and avoiding the technical difficulties that need to be achieved in the dual butterfly valve simultaneous pressure control solution. It can quickly respond to changes in chamber pressure and temperature and keep the process gas flow in a relatively stable state, which helps to improve the overall PM cycle of the system, thereby improving the efficiency of process film formation and reducing the consumption of process gas.

[0068] Based on the same inventive concept, the embodiment of the present invention also provides a reaction chamber pressure control device, which can be applied to a space-type atomic deposition device, referring to Figure 4, the device comprises a vacuum gauge, a first exhaust pipeline and a second exhaust pipeline; The vacuum gauge is connected to the reaction chamber and is used to measure the gas pressure in the reaction chamber. The first exhaust pipeline is connected to the first precursor area of ​​the reaction chamber, and the second exhaust pipeline is connected to the second precursor area of ​​the reaction chamber. The first exhaust pipeline includes a first butterfly valve controller, a first butterfly valve, and a first dry pump. The first dry pump is used to extract gas from the reaction chamber, and the first butterfly valve is used to control the exhaust rate of the first dry pump. The second exhaust pipeline includes a second butterfly valve controller, a second butterfly valve, and a second dry pump. The second dry pump is used to extract gas from the reaction chamber, and the second butterfly valve is used to control the exhaust rate of the second dry pump. The first butterfly valve and the second butterfly valve are used to evacuate the reaction chamber through the first air pump and the second air pump when the opening is in a fully opened state, so that the pressure in the reaction chamber reaches a preset bottom pressure; The first butterfly valve controller is used to adjust the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and a preset target air pressure, so that the pressure in the reaction chamber is maintained at the target air pressure; The second butterfly valve controller is used to adjust the opening of the second butterfly valve based on the opening of the first butterfly valve, so that the gas pressure in the reaction chamber is maintained at the target gas pressure.

[0069] In a possible embodiment, the first butterfly valve controller is further used to, when the pressure in the reaction chamber exceeds a preset pressure range, return a difference between the current air pressure in the reaction chamber and a preset target air pressure, and adjust the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump so that the pressure in the reaction chamber is maintained at the target air pressure, wherein the preset pressure range is determined based on the target air pressure and a preset variation coefficient.

[0070] In a possible embodiment, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure includes: Calculating the difference between the current gas pressure in the reaction chamber and the target gas pressure as a first target control variable; Calculating a first target opening of the first butterfly valve based on the first target control amount by using fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a first proportional coefficient, a first integral coefficient and a first differential coefficient; Opening the first butterfly valve to the first target opening to adjust the pumping rate of the first air pump; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve comprises: Calculating a difference between the first target opening and the current opening of the second butterfly valve as a second target control variable; Calculating the second target opening of the second butterfly valve based on the second target control quantity by using the fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a second proportional coefficient, a second integral coefficient and a second differential coefficient; The second butterfly valve is opened to the second target opening to adjust the pumping rate of the second air pump.

[0071] In a possible embodiment, based on the difference between the current air pressure in the reaction chamber and the preset target air pressure, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump includes: in the pressure control mode, calculating the first target opening of the first butterfly valve by the following formula:

[0072] in, is the first target opening, is the first differential coefficient, is the difference between the current air pressure and the target air pressure, T i1 is the first integration time, the first integration coefficient K i1 = , T d1 is the first differential time, the first differential coefficient K d1 = ; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve includes: calculating a second target opening of the second butterfly valve by the following formula:

[0073] in, is the second target opening, is the second differential coefficient, is the difference between the first target opening and the current opening of the second butterfly valve, T i2 is the second integration time, the second integration coefficient K i2 = , T d2 is the second differential time, the second differential coefficient K d2 = .

[0074] Among them, the collection, storage, use, processing, transmission, provision and disclosure of user personal information involved in the present invention are in compliance with the provisions of relevant laws and regulations and do not violate public order and good morals.

[0075] The exemplary embodiment of the present invention further provides an electronic device, comprising: at least one processor; and a memory connected to the at least one processor in communication. The memory stores a computer program that can be executed by the at least one processor, and the computer program is used to enable the electronic device to perform a method according to an embodiment of the present invention when executed by the at least one processor.

[0076] Exemplary embodiments of the present invention also provide a non-transitory computer-readable storage medium storing a computer program, wherein the computer program, when executed by a processor of a computer, is used to cause the computer to perform a method according to an embodiment of the present invention.

[0077] An exemplary embodiment of the present invention further provides a computer program product, comprising a computer program, wherein when the computer program is executed by a processor of a computer, the computer is used to enable the computer to perform a method according to an embodiment of the present invention.

[0078] refer to Figure 6 , a block diagram of an electronic device 600 that can be used as a server or client of the present invention will now be described, which is an example of a hardware device that can be applied to various aspects of the present invention. The electronic device is intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present invention described and / or required herein.

[0079] like Figure 6 As shown, the electronic device 600 includes a computing unit 601, which can perform various appropriate actions and processes according to a computer program stored in a ROM 602 or a computer program loaded from a storage unit 608 into a RAM 603. In the RAM 603, various programs and data required for the operation of the electronic device 600 can also be stored. The computing unit 601, the ROM 602, and the RAM 603 are connected to each other via a bus 604. An I / O interface 605 is also connected to the bus 604.

[0080] A plurality of components in the electronic device 600 are connected to the I / O interface 605, including: an input unit 606, an output unit 607, a storage unit 608, and a communication unit 609. The input unit 606 may be any type of device capable of inputting information to the electronic device 600, and the input unit 606 may receive input digital or character information, and generate key signal inputs related to user settings and / or function control of the electronic device. The output unit 607 may be any type of device capable of presenting information, and may include, but is not limited to, a display, a speaker, a video / audio output terminal, a vibrator, and / or a printer. The storage unit 608 may include, but is not limited to, a disk, an optical disk. The communication unit 609 allows the electronic device 600 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks, and may include, but is not limited to, a modem, a network card, an infrared communication device, a wireless communication transceiver, and / or a chipset, such as a Bluetooth™ device, a WiFi device, a WiMax device, a cellular communication device, and / or the like.

[0081] The computing unit 601 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 601 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 601 performs the various methods and processes described above. For example, in some embodiments, any of the above-described reaction chamber pressure control methods may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 608. In some embodiments, part or all of the computer program may be loaded and / or installed on the electronic device 600 via the ROM 602 and / or the communication unit 609. In some embodiments, the computing unit 601 may be configured to perform any of the above-described reaction chamber pressure control methods by any other appropriate means (e.g., by means of firmware).

[0082] The program code for implementing the method of the present invention can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer or other programmable data processing device, so that the program code, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The program code can be executed entirely on the machine, partially on the machine, partially on the machine as a stand-alone software package and partially on a remote machine, or entirely on a remote machine or server.

[0083] In the context of the present invention, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or equipment, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0084] As used herein, the terms "machine-readable medium" and "computer-readable medium" refer to any computer program product, apparatus, and / or device (e.g., disk, optical disk, memory, programmable logic device (PLD)) for providing machine instructions and / or data to a programmable processor, including a machine-readable medium that receives machine instructions as a machine-readable signal. The term "machine-readable signal" refers to any signal for providing machine instructions and / or data to a programmable processor.

[0085] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0086] The systems and techniques described herein may be implemented in a computing system that includes back-end components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes front-end components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such back-end components, middleware components, or front-end components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), and the Internet.

[0087] A computer system may include clients and servers. Clients and servers are generally remote from each other and usually interact through a communication network. The relationship of client and server is generated by computer programs running on respective computers and having a client-server relationship to each other.

Claims

1. A reaction chamber pressure control method, characterized in that: The method is applied to a reaction chamber of a space-type atomic deposition device, wherein the reaction chamber includes a first precursor region, a second precursor region, and a gas curtain formed by an inert gas, wherein the gas curtain is used to isolate the first precursor region from the second precursor region, and the method includes: In the position control mode, the openings of the first butterfly valve and the second butterfly valve are controlled to be in a fully open state, so as to evacuate the reaction chamber through the first air pump and the second air pump, so that the pressure in the reaction chamber reaches a preset bottom pressure; the first butterfly valve is used to control the exhaust pipeline in the first precursor area, and the second butterfly valve is used to control the exhaust pipeline in the second precursor area; When the pressure in the reaction chamber reaches the preset bottom pressure, based on the difference between the current air pressure in the reaction chamber and the preset target air pressure, adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump so that the pressure in the reaction chamber is maintained at the target air pressure; The opening degree of the second butterfly valve is adjusted based on the opening degree of the first butterfly valve, so that the gas pressure in the reaction chamber is maintained at the target gas pressure.

2. The method according to claim 1, characterized in that: The reaction chamber also includes a vacuum gauge, which is used to measure the pressure in the reaction chamber. The method also includes: In the case where the pressure in the reaction chamber exceeds a preset pressure range, returning to the step of adjusting the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure, so that the pressure in the reaction chamber is maintained at the target air pressure, wherein the preset pressure range is determined based on the target air pressure and a preset variation coefficient.

3. The method according to claim 1, characterized in that The adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure includes: Calculating the difference between the current gas pressure in the reaction chamber and the target gas pressure as a first target control variable; Calculating a first target opening of the first butterfly valve based on the first target control amount by using fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a first proportional coefficient, a first integral coefficient and a first differential coefficient; Opening the first butterfly valve to the first target opening to adjust the pumping rate of the first air pump; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve comprises: Calculating a difference between the first target opening and the current opening of the second butterfly valve as a second target control variable; Calculating the second target opening of the second butterfly valve based on the second target control quantity by using the fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm also includes a second proportional coefficient, a second integral coefficient and a second differential coefficient; The second butterfly valve is opened to the second target opening to adjust the pumping rate of the second air pump.

4. The method according to claim 3, characterized in that The step of adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure comprises: in the pressure control mode, calculating the first target opening of the first butterfly valve by the following formula: in, is the first target opening, is the first differential coefficient, is the difference between the current air pressure and the target air pressure, T i1 is the first integration time, the first integration coefficient K i1 = , T d1 is the first differential time, the first differential coefficient K d1 = ; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve includes: calculating a second target opening of the second butterfly valve by the following formula: in, is the second target opening, is the second differential coefficient, is the difference between the first target opening and the current opening of the second butterfly valve, T i2 is the second integration time, the second integration coefficient K i2 = , T d2 is the second differential time, the second differential coefficient K d2 = .

5. A reaction chamber pressure control device, characterized in that: The device includes a vacuum gauge, a first exhaust pipeline and a second exhaust pipeline; The vacuum gauge is connected to the reaction chamber and is used to measure the gas pressure in the reaction chamber. The first exhaust pipeline is connected to the first precursor area of ​​the reaction chamber, and the second exhaust pipeline is connected to the second precursor area of ​​the reaction chamber. The first exhaust pipeline includes a first butterfly valve controller, a first butterfly valve, and a first dry pump. The first dry pump is used to extract gas from the reaction chamber, and the first butterfly valve is used to control the exhaust rate of the first dry pump. The second exhaust pipeline includes a second butterfly valve controller, a second butterfly valve, and a second dry pump. The second dry pump is used to extract gas from the reaction chamber, and the second butterfly valve is used to control the exhaust rate of the second dry pump. The first butterfly valve and the second butterfly valve are used to evacuate the reaction chamber through the first air pump and the second air pump when the opening is in a fully opened state, so that the pressure in the reaction chamber reaches a preset bottom pressure; The first butterfly valve controller is used to adjust the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and a preset target air pressure, so that the pressure in the reaction chamber is maintained at the target air pressure; The second butterfly valve controller is used to adjust the opening of the second butterfly valve based on the opening of the first butterfly valve, so that the gas pressure in the reaction chamber is maintained at the target gas pressure.

6. The device according to claim 5, characterized in that The first butterfly valve controller is also used to, when the pressure in the reaction chamber exceeds a preset pressure range, return a difference between the current air pressure in the reaction chamber and a preset target air pressure, and adjust the opening of the first butterfly valve in a pressure control mode to adjust the pumping rate of the first air pump so that the pressure in the reaction chamber is maintained at the target air pressure, wherein the preset pressure range is determined based on the target air pressure and a preset variation coefficient.

7. The device according to claim 5, characterized in that The adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure includes: Calculating the difference between the current gas pressure in the reaction chamber and the target gas pressure as a first target control variable; Calculating a first target opening of the first butterfly valve based on the first target control amount by using fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a first proportional coefficient, a first integral coefficient and a first differential coefficient; Opening the first butterfly valve to the first target opening to adjust the pumping rate of the first air pump; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve comprises: Calculating a difference between the first target opening and the current opening of the second butterfly valve as a second target control variable; Calculating the second target opening of the second butterfly valve based on the second target control quantity by using the fuzzy control and PID adjustment algorithm, wherein the PID adjustment algorithm includes a second proportional coefficient, a second integral coefficient and a second differential coefficient; The second butterfly valve is opened to the second target opening to adjust the pumping rate of the second air pump.

8. The device according to claim 7, characterized in that The step of adjusting the opening of the first butterfly valve in the pressure control mode to adjust the pumping rate of the first air pump based on the difference between the current air pressure in the reaction chamber and the preset target air pressure comprises: in the pressure control mode, calculating the first target opening of the first butterfly valve by the following formula: in, is the first target opening, is the first differential coefficient, is the difference between the current air pressure and the target air pressure, T i1 is the first integration time, the first integration coefficient K i1 = , T d1 is the first differential time, the first differential coefficient K d1 = ; The adjusting the opening of the second butterfly valve based on the opening of the first butterfly valve includes: calculating a second target opening of the second butterfly valve by the following formula: in, is the second target opening, is the second differential coefficient, is the difference between the first target opening and the current opening of the second butterfly valve, T i2 is the second integration time, the second integration coefficient K i2 = , T d2 is the second differential time, the second differential coefficient K d2 = .

9. An electronic device, comprising: A processor and a memory for storing programs; The program includes instructions, which, when executed by the processor, cause the processor to perform the method according to any one of claims 1 to 4.

10. A non-transitory computer-readable storage medium storing computer instructions, wherein: The computer instructions are used to make a computer execute the method according to any one of claims 1-4.

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