Refrigerator with semiconductor anti-condensation structure
By adopting a semiconductor anti-condensing structure in the refrigerator and using the heat transfer characteristics of the semiconductor module, the problem of beam condensing in the refrigerator is solved, and the effect of energy saving and service life is achieved.
Patent Information
- Application Number
- CN202510450856.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-11
- Publication Date
- 2025-06-06
AI Technical Summary
The beams in existing refrigerators are prone to condensation, which leads to additional energy consumption of refrigerant and affects service life.
The semiconductor anti-condensing structure is adopted, and the semiconductor module utilizes the Pallet effect of the semiconductor refrigeration sheet to achieve heat transfer between the cold end and the hot end. The cold end accelerates the condenser heat dissipation, and the hot end heats the door frame and the middle beam to prevent condensation.
No additional refrigerant heating door frame is required to save energy and improve the energy efficiency and service life of the refrigerator.
Smart Images
Figure CN120101383A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of household appliances, and more specifically to a refrigerator with a semiconductor anti-condensation structure. Background Art
[0002] As a necessary refrigeration device for modern families, the working principle of refrigerators is based on the compression refrigeration cycle. This cycle includes four core processes: compression, condensation, expansion and evaporation: the refrigerant is compressed into a high-temperature and high-pressure gas in the compressor, and then exchanges heat with the outside air through the condenser, releasing heat and condensing into a high-pressure liquid. Next, the refrigerant enters the evaporator through the expansion valve, and the sudden drop in pressure causes it to quickly evaporate into a low-temperature and low-pressure gas, absorbing the heat inside the refrigerator, thereby achieving a cooling effect. The refrigeration methods of refrigerators are mainly divided into direct cooling and air cooling. The former achieves cooling through natural convection, while the latter enhances the uniformity of cooling through forced circulation.
[0003] Condensation is a phenomenon in which high-temperature and high-humidity gas liquefies into liquid on the surface of a low-temperature object when it reaches the dew point temperature. The temperature inside the refrigerator is much lower than the temperature outside the refrigerator. When the cold air inside the refrigerator diffuses outside the refrigerator, the temperature of the refrigerator surface and door body is lowered. When it encounters high-temperature and high-humidity air, it condenses into dew, resulting in condensation. This not only affects the appearance of the refrigerator, but also reduces the service life of the refrigerator.
[0004] Existing anti-condensation technology usually introduces high-temperature and high-pressure refrigerant into the anti-condensation pipe, transfers heat through the pipe wall to heat the door frame and the middle beam, thereby inhibiting the formation of condensation. However, since it is impossible to ensure that the outer wall of the anti-condensation pipe can effectively contact each section of the middle beam, the middle beam in the existing technology is still prone to condensation. In severe cases, water droplets will flow along the middle beam to the floor, affecting the normal use of users. At the same time, the refrigerant not only needs to cool the food in the refrigerator, but also has the function of heating the door frame and increasing the surrounding temperature, which additionally increases the energy consumption of the refrigerator. Summary of the invention
[0005] In order to solve the problem that condensation is still easy to occur in the existing anti-condensation pipe in the middle beam of the refrigerator, resulting in the refrigerant additionally increasing the energy consumption of the refrigerator.
[0006] The present application provides a refrigerator with a semiconductor anti-condensation structure, comprising: a refrigeration module, a semiconductor module, a compressor compartment and an anti-condensation module;
[0007] The refrigeration module includes a condenser, which is arranged inside the compressor compartment, and the compressor compartment is also provided with a condensing fan;
[0008] The semiconductor module comprises: a semiconductor refrigeration sheet, a heat dissipation block, a refrigeration block, a heat dissipation fan and thermal conductive silicone grease;
[0009] The cold end of the semiconductor refrigeration sheet is located inside the compressor compartment, and the refrigeration block is arranged between the condensing fan and the condenser;
[0010] The cold end of the semiconductor refrigeration sheet is connected to the refrigeration block through the thermal grease, the hot end of the semiconductor refrigeration sheet is connected to the heat dissipation block through the thermal grease, and the heat dissipation fan is fixed to the side of the heat dissipation block by screws;
[0011] The anti-condensation module comprises: an air supply duct and an air return duct;
[0012] One end of the air supply duct is connected to the cooling fan, and the other end extends to the middle beam and the door frame of the refrigerator. The return air duct surrounds the middle beam and forms a closed loop with the air supply duct.
[0013] In a feasible implementation, the refrigeration module further includes: a compressor, an evaporator and a capillary tube;
[0014] The compressor is arranged inside the compressor compartment and on a side close to the condensing fan;
[0015] The outlet of the evaporator is connected to the inlet of the compressor through a return air pipe, the outlet of the compressor is connected to the inlet of the condenser through a pipeline, and the outlet of the condenser is connected to the inlet of the evaporator through the capillary tube to form a closed cycle.
[0016] In a feasible implementation, the semiconductor cooling sheet is composed of P-type semiconductor particles and N-type semiconductor particles arranged alternately, and connected to the copper guide bar through a ceramic substrate;
[0017] The P-type semiconductor particles, N-type semiconductor particles, copper guide bars and ceramic substrate are fixed by sintering and soldering processes.
[0018] In a feasible implementation, the semiconductor module further includes: a foam pad;
[0019] The foam pad is fixed to the top of the compressor compartment by screws and is located between the cold end of the semiconductor refrigeration plate and the refrigeration block. The foam pad is made of polyurethane foam.
[0020] In a feasible implementation, the thermally conductive silicone grease is filled in the gap between the hot end of the semiconductor refrigeration plate and the heat sink block, and in the gap between the cold end of the semiconductor refrigeration plate and the refrigeration blocks.
[0021] In a feasible implementation, the refrigeration block is fixed to the inside of the compressor compartment by screws, the condensing fan is fixed to the inside of the compressor compartment by a bracket, and the refrigeration block is aligned with the air inlet of the condensing fan.
[0022] In a feasible implementation, the inlet of the air supply duct is connected to the air outlet of the cooling fan, the air supply duct is arranged around the center beam and door frame of the refrigerator, and the outlet of the air supply duct faces the inner wall of the center beam and the door frame.
[0023] In a feasible implementation, the inlet of the return air duct is located below the center beam, the outlet of the return air duct is connected to the air inlet of the cooling fan, and forms a closed air duct cycle with the air supply duct.
[0024] In a feasible implementation, the heat dissipation block is made of aluminum alloy and is provided with a serpentine heat dissipation channel inside. The inlet of the heat dissipation channel is connected to the air outlet of the heat dissipation fan, and the outlet of the heat dissipation channel is connected to the inlet of the air supply duct.
[0025] In a feasible implementation, the refrigeration block is a copper rectangular parallelepiped structure with heat dissipation fins on the surface, and the extension direction of the heat dissipation fins is parallel to the airflow direction of the condensing fan.
[0026] As can be seen from the above content, the present application provides a refrigerator with a semiconductor anti-condensation structure, which utilizes the characteristics of semiconductors that can both cool and heat. The hot end uses a heat dissipation fan to heat the center beam and door frame through the air supply duct, and the cold end uses a condensing fan to directly dissipate heat from the condenser. Semiconductor refrigeration has a simple structure, low noise, and low price. It does not require the use of high-temperature refrigerants to heat the refrigerator center beam and door frame, thereby improving the energy-saving effect of the refrigerator. The design of the semiconductor module and the anti-condensation module improves the energy efficiency and service life of the refrigerator. BRIEF DESCRIPTION OF THE DRAWINGS
[0027] The accompanying drawings herein are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the implementation of the present invention, and together with the specification are used to explain the principles of the embodiments of the present invention. Obviously, the accompanying drawings described below are only some embodiments of the implementation of the present invention, and for ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without creative work.
[0028] Figure 1 is a front cross-sectional view of a door of a refrigerator with a semiconductor anti-condensation structure shown in an embodiment of the present application;
[0029] Figure 2 is a schematic diagram of the side structure of the anti-condensation module shown in the embodiment of the present application;
[0030] Figure 3 is a front structural schematic diagram of an anti-condensation module shown in an embodiment of the present application;
[0031] Figure 4It is a schematic diagram of the structure of a semiconductor module shown in an embodiment of the present application.
[0032] Description of Figure Numbers:
[0033] 100-refrigeration module; 200-semiconductor module; 300-compressor compartment; 400-anti-condensation module; 500-middle beam; 600-door frame; 110-compressor; 120-condenser; 210-semiconductor refrigeration plate; 220-heat sink; 230-refrigeration block; 240-cooling fan; 250-foam pad; 310-condensing fan; 410-supply air duct; 420-return air duct. DETAILED DESCRIPTION
[0034] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that the embodiments of the present invention will be more comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the implementation of the embodiments of the present invention.
[0035] The working principle of the refrigerator is based on the compression refrigeration cycle, and heat transfer is achieved through the state changes of the refrigerant in the four processes of compression, condensation, expansion, and evaporation. However, since the temperature inside the refrigerator is much lower than the external environment, the cold air diffuses outward through the door seal and the box body, causing the surface temperature to drop. When it comes into contact with high-temperature and high-humidity air, condensation is very likely to form. Condensation may cause safety hazards such as electrical failures, metal corrosion, and reduced insulation performance. The core of the existing active anti-condensation technology is to build an anti-condensation tube into the door frame or the middle beam, and use high-temperature and high-pressure refrigerant to heat the surface to inhibit condensation. However, there are still two problems with the existing technology. On the one hand, the linear contact structure between the anti-condensation tube and the middle beam is difficult to ensure effective heat transfer over the entire area, and condensation or even dripping may still occur in local areas; on the other hand, the refrigerant provides additional anti-condensation heating while taking on the refrigeration task, resulting in increased system energy consumption and reduced energy efficiency.
[0036] In order to solve the above problems, the present application embodiment proposes a refrigerator with a semiconductor anti-condensation structure, referring to Figure 1-Figure 4 As shown, it includes a refrigeration module 100 , a semiconductor module 200 , a compressor compartment 300 and an anti-condensation module 400 .
[0037] The refrigeration module 100 is located inside the refrigerator body and includes components such as an evaporator, a compressor 110, and a condenser 120. The semiconductor module 200 is located on the top of the compressor compartment 300 and is fixed by screws. The compressor compartment 300 is located at the bottom of the refrigerator body and is equipped with a compressor 110, a condenser 120, and a condensing fan 310. The anti-condensation module 400 includes an air supply duct 410 and a return air duct 420, which are arranged near the freezer compartment of the refrigerator and connected to the semiconductor module 200.
[0038] The refrigeration module 100 is responsible for the refrigeration cycle of the refrigerator. The compressor 110 compresses the refrigerant into a high-temperature and high-pressure gas, the condenser 120 cools it into a liquid, and the evaporator absorbs the heat inside the refrigerator to achieve refrigeration.
[0039] The cold end of the semiconductor refrigeration sheet 210 is located inside the compressor compartment 300 and is connected to the refrigeration block 230 through thermal grease. The hot end of the semiconductor refrigeration sheet 210 is connected to the heat sink 220 through thermal grease, and the heat sink fan 240 is fixed to the side of the heat sink 220 by screws.
[0040] One end of the air supply duct 410 is connected to the air outlet of the cooling fan 240, and the other end extends to the refrigerator middle beam 500 and the door frame 600. The return air duct 420 surrounds the middle beam 500 and forms a closed loop with the air supply duct 410.
[0041] The semiconductor module 200 utilizes the Peltier effect of the semiconductor cooling sheet 210 to achieve heat transfer between the cold end and the hot end. The cold end absorbs the heat near the condenser 120 through the cooling block 230 to accelerate the heat dissipation of the condenser; the hot end transfers the heat to the air supply duct 410 through the heat dissipation block 220 and the heat dissipation fan 240 to heat the door frame 600 and the center beam 500.
[0042] Specifically, when the refrigerator is running, the compressor 110 is started, and the refrigerant circulates in the refrigeration module 100 to achieve refrigeration inside the refrigerator. At the same time, the semiconductor module 200 is started, and the cold end of the semiconductor refrigeration sheet 210 absorbs the heat near the condenser 120, and transfers it to the condenser 120 through the refrigeration block 230 to accelerate its heat dissipation. The heat generated by the hot end of the semiconductor refrigeration sheet 210 is transferred to the air supply duct 410 through the heat dissipation block 220 and the heat dissipation fan 240, and then sent to the door frame 600 and the middle beam 500, and condensation is prevented by heating the surface of the door frame 600 and the middle beam 500.
[0043] This embodiment simplifies the anti-condensation structure and improves the anti-condensation effect through the design of the semiconductor module 200 and the anti-condensation module 400. The semiconductor module 200 is used to simultaneously achieve the heat dissipation of the condenser 120 and the anti-condensation of the door frame 600 and the middle beam 500, without the need to use additional refrigerant to heat the door frame, thus saving energy. The energy efficiency and service life of the refrigerator are improved.
[0044] In some embodiments of the present application, the refrigeration module 100 further includes a compressor 110, an evaporator and a capillary tube. The compressor 110 is arranged inside the compressor compartment 300, close to one side of the condensing fan 310. The evaporator is located inside the refrigerator body and is connected to the refrigerating chamber and the freezing chamber. The capillary tube connects the outlet of the condenser 120 and the inlet of the evaporator.
[0045] The outlet of the evaporator is connected to the inlet of the compressor 110 through a return air pipe. The outlet of the compressor 110 is connected to the inlet of the condenser 120 through a pipeline. The outlet of the condenser 120 is connected to the inlet of the evaporator through a capillary tube to form a closed cycle.
[0046] Specifically, the evaporator is a heat absorbing component, which evaporates the low-temperature and low-pressure liquid from the capillary tube into a low-temperature and low-pressure gas through heat exchange with the external environment; the return pipe is used to transport the refrigerant from the evaporator to the compressor. The compressor 110 is used to compress the low-temperature steam from the evaporator into a high-temperature and high-pressure gas and drive the continuous flow of the refrigerant liquid and steam; the condenser 120 is a heat dissipation component, which cools the high-temperature and high-pressure gas from the compressor 110 into a high-temperature and high-pressure liquid through heat exchange with the external environment; the capillary tube is a resistance component, which converts the high-temperature and high-pressure liquid into a low-temperature and low-pressure liquid through resistance throttling.
[0047] It is understandable that, in some embodiments, the refrigeration module 100 may further include a filter, and the filter is used to absorb moisture, impurities, etc. in the refrigerant and system pipes to keep the system dry and clean.
[0048] Furthermore, when the refrigerator is running, the compressor 110 starts, compresses the refrigerant into high-temperature and high-pressure gas, and delivers it to the condenser 120. Under the action of the condensing fan 310, the condenser 120 cools the high-temperature and high-pressure gas into liquid, and delivers it to the evaporator through the capillary tube. The evaporator absorbs the heat inside the refrigerator, evaporates the refrigerant into gas, and then returns to the compressor 110 through the return pipe, completing the refrigeration cycle.
[0049] This embodiment improves the refrigeration efficiency of the refrigerator by designing and connecting the compressor 110, the condenser 120, the evaporator and the capillary tube. The synergy of the refrigeration module 100, the semiconductor module 200 and the anti-condensation module 400 further improves the energy efficiency and service life of the refrigerator.
[0050] In some embodiments of the present application, the semiconductor cooling sheet 210 is composed of P-type semiconductor particles and N-type semiconductor particles arranged alternately, and is connected to the copper guide bar through a ceramic substrate.
[0051] In the semiconductor refrigeration sheet 210, the P-type semiconductor material has a positive thermoelectric potential due to insufficient electrons, while the N-type semiconductor material has excess electrons and a negative thermoelectric potential. The semiconductor particles are connected by copper guide bars to form a complete circuit. The copper guide bars have good electrical conductivity, ensuring that the current flows smoothly between the semiconductor particles. The entire structure is clamped by two ceramic substrates, which have good insulation and thermal conductivity properties, ensuring electrical isolation between the semiconductor particles and the copper guide bars, while effectively conducting heat away from the hot end.
[0052] The P-type semiconductor particles, N-type semiconductor particles, copper guide bars and ceramic substrates are fixed by sintering and soldering processes. The sintering process uses high temperature to melt the surface of the materials and bond them together, while soldering uses low-melting-point brazing materials to fill the gaps and form strong mechanical and electrical connections.
[0053] When direct current passes through a thermocouple composed of P-type and N-type semiconductor materials, heat transfer occurs at the junction of the two semiconductors. The junction where the current flows from the N-type semiconductor to the P-type semiconductor absorbs heat and forms a cold end; the junction where the current flows from the P-type semiconductor to the N-type semiconductor releases heat and forms a hot end.
[0054] The semiconductor refrigeration chip 210 uses the Peltier effect to achieve cooling or heating. When a DC power supply provides electrical energy to the semiconductor refrigeration chip 210, current flows between semiconductor particles, generating heat transfer. By adjusting the direction and magnitude of the current, the cooling or heating effect of the semiconductor refrigeration chip 210 can be controlled. The heat at the cold end is absorbed and transferred to the hot end, and the heat at the hot end is conducted to the external environment through a heat dissipation device such as a ceramic substrate.
[0055] Specifically, when the refrigerator in this embodiment is in operation, the semiconductor module 200 is started, and direct current passes through the semiconductor cooling sheet 210. According to the Peltier effect, the cold end of the semiconductor cooling sheet 210 absorbs the heat near the condenser 120, and transfers it to the condenser 120 through the cooling block 230, thereby accelerating the heat dissipation. At the same time, the heat generated by the hot end of the semiconductor cooling sheet 210 is transferred to the air supply duct 410 through the heat dissipation block 220 and the heat dissipation fan 240.
[0056] In this embodiment, the cooling and heating efficiency of the semiconductor refrigeration sheet 210 is improved by the alternating arrangement of the P-type semiconductor particles and the N-type semiconductor particles and the connection of the ceramic substrate and the copper guide strip. The synergistic effect of the semiconductor refrigeration sheet 210, the refrigeration module 100 and the anti-condensation module 400 further improves the energy efficiency and service life of the refrigerator. Compared with traditional refrigeration technology, the semiconductor refrigeration sheet 210 has the advantages of no refrigerant, no pollution source, no moving parts, small size, light weight, high reliability, long life, and easy control. At the same time, the semiconductor refrigeration sheet 210 can both cool and heat, and cooling and heating can be quickly switched, which is very flexible and convenient to use.
[0057] In some embodiments of the present application, the semiconductor module 200 further includes a foam pad 250. The foam pad 250 is located between the cold end of the semiconductor refrigeration sheet 210 and the refrigeration block 230, and is fixed to the top of the compressor compartment 300 by screws. The foam pad 250 is fixed to the top of the compressor compartment 300 by screws, and is located between the cold end of the semiconductor refrigeration sheet 210 and the refrigeration block 230.
[0058] The foam pad 250 has lightness, cushioning and heat insulation properties, and can reduce the heat transfer loss between the cold end of the semiconductor cooling sheet 210 and the cooling block 230. At the same time, the foam pad 250 can also fix the semiconductor cooling sheet 210 and the cooling block 230, thereby improving the stability of the semiconductor module 200.
[0059] After the semiconductor module 200 is powered on, the cold end of the semiconductor cooling sheet 210 generates cold energy. The cold energy is transferred to the cooling block 230 through the foam pad 250, and then to the air near the condenser 120, accelerating the heat dissipation of the condenser. At the same time, the foam pad 250 can also reduce the transmission loss of cold energy to other parts of the semiconductor module 200, thereby improving the energy efficiency of the semiconductor module 200.
[0060] In some embodiments of the present application, thermal grease is filled in the gap between the hot end of the semiconductor refrigeration sheet 210 and the heat sink 220 , and in the gap between the cold end of the semiconductor refrigeration sheet 210 and the refrigeration block 230 .
[0061] Thermal grease is a highly thermally conductive insulating silicone material. It is made of organic silicone as the main raw material and added with materials that are heat-resistant and have excellent thermal conductivity. It is specifically used for heat conduction between electronic components (such as CPU, GPU, power amplifier, etc.) and heat sinks to ensure that the equipment maintains stable electrical performance during long-term high-load operation.
[0062] Thermal grease has good thermal conductivity. By filling the gaps between the semiconductor cooling sheet 210 and the heat sink 220 and the cooling block 230, it replaces the air with poor thermal conductivity to form a continuous heat conduction channel, significantly improving the thermal conduction efficiency. It also has good electrical insulation to avoid the risk of short circuit. Thermal grease is resistant to water, ozone, and weather aging. It does not solidify or separate oil after long-term use. It remains in a grease state and can form a protective layer on the surface of the semiconductor cooling sheet to block dust and moisture erosion.
[0063] Furthermore, the thermal grease can also play a fixing role to prevent the semiconductor cooling sheet 210 from moving relative to the heat sink block 220 and the cooling block 230 .
[0064] In conventional semiconductor modules, the heat conduction efficiency between the semiconductor cooling sheet and the heat sink and the cooling block is low, and the stability is poor. This embodiment improves the heat conduction efficiency and enhances the stability of the semiconductor module 200 by adding thermal conductive silicone grease.
[0065] In some embodiments of the present application, the refrigeration block 230 is fixed to the inside of the compressor compartment 300 by screws, the condensing fan 310 is fixed to the inside of the compressor compartment 300 by a bracket, and the refrigeration block 230 is aligned with the air inlet of the condensing fan 310. The condensing fan 310 is fixed to the inside of the compressor compartment 300 by a bracket, and the air inlet is aligned with the refrigeration block 230, which can stably blow the air near the condenser 120 to the refrigeration block 230, accelerating the heat dissipation of the condenser.
[0066] The condensing fan 310 is started, and the air near the condenser 120 is blown to the refrigeration block 230, which accelerates the air flow, takes away the heat of the condenser 120, and achieves the heat dissipation effect. Under normal circumstances, the condenser 120 is located in the compressor compartment 300, which is used to convert gas or steam into liquid and transfer the heat in the pipe to the air near the pipe in a very fast way. The working process of the condenser 120 is a heat release process, so the temperature of the condenser 120 is relatively high. Generally, the refrigerator dissipates heat from the condenser 120 only through the fan. Since it is natural wind and the space of the compressor compartment 300 is small, it takes a long time to achieve the expected effect. However, this embodiment improves the heat dissipation efficiency of the condenser 120 by optimizing the structure and connection relationship of the refrigeration block 230 and the condensing fan 310.
[0067] In some embodiments of the present application, the inlet of the air supply duct 410 is connected to the outlet of the heat dissipation fan 240, and the air supply duct 410 is arranged around the middle beam 500 and the door frame 600 of the refrigerator. The outlet of the air supply duct 410 faces the inner wall of the middle beam 500 and the door frame 600, and the heat discharged by the heat dissipation fan 240 is transported to the middle beam 500 and the door frame 600 to heat their surfaces and prevent condensation. The air supply duct 410 is arranged around the middle beam 500 and the door frame 600, so that their surfaces can be evenly heated to improve the anti-condensation effect.
[0068] In some embodiments of the present application, the return air duct 420 is located near the freezer compartment of the refrigerator and is arranged around the middle beam 500. The inlet of the return air duct 420 is located below the middle beam 500, and the outlet is connected to the air inlet of the cooling fan 240. The return air duct 420 discharges the air at the middle beam 500 and the door frame 600 to the air inlet of the cooling fan 240, forming a closed air duct cycle. The closed air duct cycle can improve the utilization efficiency of heat and enhance the anti-condensation effect.
[0069] Specifically, the heat dissipation fan 240 discharges the heat of the heat dissipation block 220 to the air supply duct 410. The air supply duct 410 transports the heat to the center beam 500 and the door frame 600 to heat their surfaces. The return air duct 420 discharges the air from the center beam 500 and the door frame 600 to the air inlet of the heat dissipation fan 240, forming a closed air duct cycle.
[0070] In this embodiment, the air at the center beam 500 and the door frame 600 is discharged to the air inlet of the heat dissipation fan 240 through the return air duct 420, forming a closed air duct cycle, improving the utilization efficiency of heat, further enhancing the anti-condensation effect, and improving the energy efficiency and service life of the refrigerator.
[0071] In some embodiments of the present application, the heat sink 220 is made of aluminum alloy and has a serpentine heat dissipation channel inside. The inlet of the heat dissipation channel is connected to the air outlet of the heat dissipation fan 240 , and the outlet of the heat dissipation channel is connected to the inlet of the air supply duct 410 .
[0072] It is understandable that the heat sink 220 made of aluminum alloy has good thermal conductivity and can stably transfer the heat from the hot end of the semiconductor cooling sheet 210 to the cooling fan 240. The serpentine heat dissipation channel can increase the heat dissipation end area, improve the heat dissipation efficiency, and enhance the cooling and heating effect of the semiconductor module 200.
[0073] In some embodiments of the present application, the refrigeration block 230 is a copper rectangular parallelepiped structure with heat dissipation fins on the surface, and the extension direction of the heat dissipation fins is parallel to the airflow direction of the condensing fan 310.
[0074] The copper rectangular parallelepiped structure enables the cooling block 230 to have good thermal conductivity and can stably absorb the coldness of the cold end of the semiconductor cooling plate 210. The heat sink fins can increase the volume of the heat sink end of the cooling block 230 and improve the heat dissipation efficiency. Furthermore, the extension direction of the heat sink fins is parallel to the air flow direction of the condensing fan 310, which can stably blow the air near the condenser 120 to the cooling block 230 to accelerate the heat dissipation of the condenser.
[0075] According to the above embodiments, the refrigerator with a semiconductor anti-condensation structure of this embodiment realizes the heat dissipation of the condenser and the anti-condensation of the door frame and the middle beam through the synergistic effect of the semiconductor module, the anti-condensation module and the compressor compartment module. The semiconductor module uses the Peltier effect of the semiconductor refrigeration sheet to realize the heat transfer between the cold end and the hot end. The cold end accelerates the heat dissipation of the condenser, and the hot end heats the door frame and the middle beam. The anti-condensation module transports heat to the door frame and the middle beam through the design of the supply air duct and the return air duct, heats their surface and prevents condensation. The compressor compartment module realizes the circulation of the refrigerant and the heat dissipation of the condenser through the design of the compressor, condenser and condensing fan.
[0076] The refrigerator with the semiconductor anti-condensation structure of this embodiment uses the semiconductor module to simultaneously achieve heat dissipation of the condenser and anti-condensation of the door frame and the middle beam, without the need to use additional refrigerant to heat the door frame, thus saving energy. The design of the semiconductor module and the anti-condensation module improves the energy efficiency and service life of the refrigerator. The synergistic effect of the semiconductor module, the anti-condensation module and the compressor compartment module further improves the refrigeration efficiency and anti-condensation effect of the refrigerator.
[0077] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the disclosure herein. This application is intended to cover any variations, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.
Claims
1. A refrigerator with a semiconductor anti-condensation structure, characterized in that: include: A refrigeration module (100), a semiconductor module (200), a compressor compartment (300) and an anti-condensation module (400); The refrigeration module (100) comprises a condenser (120), wherein the condenser (120) is arranged inside the compressor compartment (300), and the compressor compartment (300) is also provided with a condensing fan (310); The semiconductor module (200) comprises: a semiconductor cooling sheet (210), a heat dissipation block (220), a cooling block (230), a heat dissipation fan (240) and thermally conductive silicone grease; The cold end of the semiconductor refrigeration sheet (210) is located inside the compressor compartment (300), and the refrigeration block (230) is arranged between the condensing fan (310) and the condenser (120); The cold end of the semiconductor refrigeration sheet (210) is connected to the refrigeration block (220) via the thermally conductive silicone grease, the hot end of the semiconductor refrigeration sheet (210) is connected to the heat dissipation block (230) via the thermally conductive silicone grease, and the heat dissipation fan (240) is fixed to the side of the heat dissipation block (220) via screws; The anti-condensation module (400) comprises: an air supply duct (410) and an air return duct (420); One end of the air supply duct (410) is connected to the cooling fan (240), and the other end extends to the refrigerator center beam (500) and the door frame (600); the return air duct (420) surrounds the center beam (500) and forms a closed loop with the air supply duct (410).
2. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The refrigeration module (100) further includes: a compressor (110), an evaporator and a capillary tube; The compressor (110) is arranged inside the compressor compartment (300) and on a side close to the condensing fan (310); The outlet of the evaporator is connected to the inlet of the compressor (110) via a return air pipe, the outlet of the compressor (110) is connected to the inlet of the condenser (120) via a pipeline, and the outlet of the condenser (120) is connected to the inlet of the evaporator via the capillary tube to form a closed loop.
3. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The semiconductor refrigeration sheet (210) is composed of P-type semiconductor particles and N-type semiconductor particles arranged alternately, and is connected to the copper guide bar via a ceramic substrate; The P-type semiconductor particles, N-type semiconductor particles, copper guide bars and ceramic substrate are fixed by sintering and soldering processes.
4. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The semiconductor module (200) further comprises: a foam pad (250); The foam pad (250) is fixed to the top of the compressor compartment (300) by means of screws and is located between the cold end of the semiconductor refrigeration sheet (210) and the refrigeration block (230); the foam pad (250) is made of polyurethane foam.
5. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The thermally conductive silicone grease (205) is filled in the gap between the hot end of the semiconductor refrigeration sheet (210) and the heat dissipation block (220), and in the gap between the cold end of the semiconductor refrigeration sheet (210) and the refrigeration block (230).
6. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The refrigeration block (230) is fixed to the inside of the compressor compartment (300) by means of screws, and the condensing fan (310) is fixed to the inside of the compressor compartment (300) by means of a bracket, and the refrigeration block (230) is aligned with the air inlet of the condensing fan (310).
7. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The inlet of the air supply duct (410) is connected to the air outlet of the heat dissipation fan (240), the air supply duct (410) is arranged around the center beam (500) and the door frame (600) of the refrigerator, and the outlet of the air supply duct (410) faces the inner wall of the center beam (500) and the door frame (600).
8. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The inlet of the return air duct (420) is located below the center beam (500), and the outlet of the return air duct (420) is connected to the air inlet of the cooling fan (240), and forms a closed air duct cycle with the air supply duct (410).
9. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The heat dissipation block (220) is made of aluminum alloy and is provided with a serpentine heat dissipation channel inside. The inlet of the heat dissipation channel is connected to the air outlet of the heat dissipation fan (240), and the outlet of the heat dissipation channel is connected to the inlet of the air supply duct (410).
10. The refrigerator with semiconductor anti-condensation structure according to claim 1, characterized in that: The refrigeration block (230) is a copper rectangular parallelepiped structure with heat dissipation fins provided on its surface, wherein the extension direction of the heat dissipation fins is parallel to the airflow direction of the condensing fan (310).