Automatic high-compatibility chip test equipment

Abstract

The invention discloses automatic high-compatibility chip testing equipment, and relates to the technical field of chip manufacturing. The chip testing equipment comprises a chip testing equipment body, a testing chamber is arranged in the chip testing equipment body, an electric sliding door is fixedly mounted on one side of the testing chamber, and a plurality of Y bearing brackets which are uniformly distributed are fixedly mounted in the testing chamber; the tops of the Y bearing brackets are fixedly provided with a plurality of uniformly distributed single test benches, and the tops of the single test benches are fixedly provided with power-on sockets. According to the chip stability testing device, batch testing of chip stability can be achieved, testing efficiency is improved, enough sample size can be provided, reliability of testing data is guaranteed, meanwhile, the whole testing process is highly automatic, conveying components such as a circuit board base and a feeding transverse frame and testing components such as an adapter plug are all replaceable modules, and the testing efficiency is greatly improved. The high compatibility of the chip testing equipment body during testing is ensured, and testing of chips of different models is facilitated.

Description

Technical Field

[0001] The present invention relates to the technical field of chip manufacturing, and in particular to an automated and highly compatible chip testing device. Background Art

[0002] In the rapid development and technological progress of the information age, chips, as the core component of electronic devices, undertake huge data storage and processing tasks. Due to changes in environmental conditions and various challenges brought about by long-term current use, ensuring the stability and reliability of chips has become an urgent need in scientific research and industry. With the continuous upgrading of electronic equipment and the diversification of application scenarios, chips need to operate in more extreme and changeable environments. Factors such as high temperature, low temperature, humidity, and mechanical vibration will have an adverse effect on the performance of chips.

[0003] During the chip manufacturing process, it is necessary to test the stability of the chip under different temperature and humidity environments. The current testing equipment is often set up in a confined space. The chip is loaded on a circuit board and placed in the equipment for power-on testing. However, the current chip testing equipment has the problem of low compatibility. The same set of equipment can generally only test specified models of chips. If other models of chips need to be tested, a lot of modification and debugging are required. For this reason, an automated and highly compatible chip testing equipment is proposed. Summary of the invention

[0004] The purpose of the present invention is to solve the problem of low compatibility of current chip testing equipment. Generally, the same set of equipment can only test chips of specified models. If other types of chips need to be tested, a lot of modifications and debugging are required. The present invention provides an automated and highly compatible chip testing equipment.

[0005] In order to achieve the above-mentioned purpose, the present invention specifically adopts the following technical solutions: An automated and highly compatible chip testing device comprises a chip testing device body, wherein a testing chamber is arranged inside the chip testing device body, an electric sliding door is fixedly installed on one side of the testing chamber, a plurality of evenly distributed Y-bearing brackets are fixedly installed inside the testing chamber, a plurality of evenly distributed single-body testing tables are fixedly installed on the top of the Y-bearing brackets, a power-on socket is fixedly installed on the top of the single-body testing tables, a transfer plug is plugged on the top of the power-on socket, a conveyor is arranged on one side of the chip testing device body, and a plurality of evenly distributed chip carriers are placed on the top of the conveyor; The chip carrier includes a circuit board base placed on the top of the conveyor, a test circuit board is placed on the top of the circuit board base, a chip to be tested and a power-on plug are fixedly installed on the top of the test circuit board, the power-on plug is adapted to the adapter plug, two circuit board cards are fixedly installed on the top of the circuit board base, the two circuit board cards are distributed on both sides of the test circuit board, a loading test assembly is arranged on one side of the chip test equipment body, and a loading cross frame for loading a plurality of chip carriers is arranged between the chip test equipment body and the loading test assembly: The loading and testing assembly includes a pushing unit and a transfer unit. The pushing unit is used to push the plurality of chip carriers away from the conveyor and integrate them on the loading horizontal rack. The transfer unit is used to sequentially deliver the plurality of loading horizontal racks into the test chamber for testing.

[0006] Furthermore, the pushing unit includes two equipment suspension frames fixedly installed on one side of the conveyor, a horizontally arranged loading electric push rod is fixedly installed on the top of the equipment suspension frame close to the chip testing equipment body, a pushing frame is fixedly installed on the telescopic end of the loading electric push rod, a pushing plate is fixedly installed on the bottom of the pushing frame, and the height of the pushing plate corresponds to the height of the test circuit board, a transfer platform is arranged between the chip testing equipment body and the conveyor, a transition plate is fixedly installed on the top of the transfer platform, the transition plate is located between the conveyor and the test chamber, and an X-axis A linear module, a loading support bracket is fixedly installed on the top of the driving end of the X-axis linear module, the loading cross frame is placed on the top of the loading support bracket, a plurality of evenly distributed loading troughs are opened on the top of the loading cross frame, the loading troughs are adapted to the test circuit board, the sides of the loading troughs close to the conveyor are provided with feed guide chute, the spacing between any two adjacent loading troughs is equal to the spacing between any two adjacent Y-bearing brackets, a plurality of evenly distributed first transfer positioning blocks are fixedly installed on the top of the loading support bracket, a plurality of positioning sockets adapted to the first transfer positioning blocks are opened on the top of the loading cross frame.

[0007] Furthermore, the transfer unit includes a first support frame arranged on one side of the chip testing equipment body, a second support frame is fixedly installed on the side wall of the chip testing equipment body, a Y-axis linear module is fixedly installed between the first support frame and the second support frame, a vertically arranged lifting mechanical arm is fixedly installed at the bottom of the driving end of the Y-axis linear module, a lifting cross bar is fixedly installed at the bottom of the telescopic end of the lifting mechanical arm, L-shaped transfer rods are fixedly installed at the bottom of both ends of the lifting cross bar, and a second transfer positioning block adapted to the feed guide chute is fixedly installed at the top of one end of the L-shaped transfer rod facing the test chamber.

[0008] Furthermore, a plurality of evenly distributed guide plate fixing holes are provided on the top of the transition plate, two symmetrically arranged sled-shaped guide plates are screwed and fixed on the top of the transition plate, the pushing plate corresponds to the position between the two sled-shaped guide plates, and the bent end of the sled-shaped guide plate faces the pushing plate.

[0009] Furthermore, a guide slide bar is fixedly installed on the top of the single-body test bench, a plurality of evenly distributed guide grooves are provided on the bottom of the feeding cross frame, the guide grooves are matched with the guide slide bars, a fastening suspension frame is fixedly installed on one side of the pushing frame, a horizontally arranged fastening rod is fixedly installed on the bottom end of the fastening suspension frame, the fastening rod is matched with the guide slide grooves, and an avoidance groove matched with the fastening rod is provided on the top of the feeding support frame.

[0010] Furthermore, a positioning plate is fixedly installed on one side of the driving end of the electric sliding door, and the positioning plate is located inside the test chamber. A plurality of evenly distributed positioning rods are fixedly installed on the bottom of the positioning plate, and the positioning rods are adapted to the feed guide chute.

[0011] Furthermore, a photoelectric sensor is fixedly mounted on the top of another of the equipment suspension racks, and the height of the photoelectric sensor is consistent with the height of the chip carrier.

[0012] Furthermore, a side of the positioning hole facing away from the chip testing equipment body is provided with a pushing inclined groove, and a side of the positioning rod facing the electric sliding door is provided with a pushing guide angle.

[0013] The beneficial effects of the present invention are as follows: 1. The present invention can realize batch testing of chip stability, which not only improves the test efficiency, but also provides sufficient sample volume for testing a chip, ensuring the reliability of test data. At the same time, the entire test process is highly automated, and the circuit board base, feeding cross frame and other transportation components and adapter plugs and other test components are all replaceable modules, ensuring the strong compatibility of the chip test equipment during testing, and facilitating the testing of chips of different models; 2. The present invention sets a pushing unit so that the loading horizontal frame is placed on the loading support frame, so that the first transfer positioning block is docked with multiple positioning sockets respectively, and the X-axis linear module carries the loading horizontal frame to move between the test room and the conveyor, and then the loading electric push rod pushes the chip carrier into the loading trough, and then the X-axis linear module and the conveyor run again until all the loading troughs on the loading horizontal frame are loaded with chip carriers, so as to realize the automatic integration of scattered chip carriers, and facilitate the transfer unit to send the fully loaded loading horizontal frame into the test room for power-on; 3. The present invention sets a transfer unit so that the Y-axis linear module drives two L-shaped transfer rods to move below the loading horizontal frame, sends the loading horizontal frame into the test chamber and places it on the guide slide bar. At this time, the loading horizontal frame continues to move along the Y-axis direction, so that the power-on plug is inserted into each adapter plug, so as to realize automatic power connection between the loading horizontal frame and the chip carrier. When the test is completed, the transfer unit can be reversely operated to take out each loading horizontal frame and place it on the loading support frame for reverse transmission, and the robot arm performs unloading to realize automatic chip recovery; 4. The present invention provides a sled-shaped guide plate, so that when the feeding electric push rod drives the pushing plate to push the chip carrier, the chip carrier will enter between the bent ends of the two sled-shaped guide plates, and accurately enter the feeding slot on the feeding cross frame under the guidance of the sled-shaped guide plates. The sled-shaped guide plates on both sides can effectively prevent the chip carrier from being offset during the pushing process. At the same time, the sled-shaped guide plate can be replaced with the guide plate fixing hole by bolts to cope with different models of chip carriers; 5. The present invention sets a guide slide bar so that after the loading cross frame is placed on the single test bench, the guide slide groove at the bottom of the loading cross frame will dock with the guide slide bar, so that the loading cross frame can only move along the Y axis without offset, ensuring the accuracy of docking between the adapter plug and the power-on plug. At the same time, when the chip carrier is pushed into the loading trough, the push frame will drive the fastening rod to be inserted into one of the guide slide grooves at the bottom of the loading cross frame first, and the auxiliary X-axis linear module will limit the loading cross frame, further ensuring that the chip carrier can smoothly enter the loading trough; 6. The present invention sets positioning rods, so that after multiple loading cross frames loaded with chip carriers are placed in the test room, the electric sliding door will be closed, and the driving end of the electric sliding door will drive multiple positioning rods to descend through the positioning pressure plate until the multiple positioning rods are respectively inserted into the positioning holes on each loading cross frame, and the loading cross frame is limited, so that the loading cross frame cannot move along the Y axis on the single test table, thereby ensuring the stability of the test circuit board and the power-on plug; 7. The present invention provides a push-in chute and a push-in guide angle, so that when the loading horizontal frame is placed on the single-unit test bench, if the loading horizontal frame retreats, when the positioning rod descends, the push-in guide angle on one side of the bottom end of the positioning rod will contact the push-in chute on the top of the positioning plug hole, and then under the guiding action of the inclined surfaces of the two, the loading horizontal frame moves a small distance toward the position of the test circuit board, so that the plugging of the test circuit board and the power-on plug is more stable and firm, avoiding the test result being affected by the poor contact of the plug after the chip is powered on; 8. The present invention sets a photoelectric sensor so that the photoelectric sensor can always detect the chip carriers that can be transmitted by the conveyor. When the photoelectric sensor detects that a chip carrier passes by, the photoelectric sensor calculates the time required for the next chip carrier to arrive, thereby obtaining the distance between the two chip carriers, and then feeding back to the conveyor to correct the single transmission time and speed of the conveyor, ensuring that the position deviation between the chip carrier and the pushing unit is within a controllable range, thereby ensuring the accuracy of chip carrier transportation. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the Y-bearing bracket and the single-body test bench of the present invention; Figure 3 It is a schematic diagram of the three-dimensional structure of the conveyor and the material pushing unit of the present invention; Figure 4 The present invention Figure 3 Schematic diagram of the structure at A in the middle; Figure 5 It is a schematic diagram of the three-dimensional structure of the circuit board base and the test circuit board of the present invention; Figure 6 It is a schematic diagram of the three-dimensional structure of the X-axis linear module and the loading support frame of the present invention; Figure 7 This is a schematic diagram of the three-dimensional structure of the horizontal loading rack of the present invention from the first perspective; Figure 8 This is a schematic diagram of the three-dimensional structure of the horizontal loading rack of the present invention from a second viewing angle; Fig. 9 It is a schematic diagram of the three-dimensional structure of the transfer unit of the present invention; Fig.10 It is a schematic diagram of the three-dimensional structure of the electric sliding door and the positioning pressure plate of the present invention in the first perspective; Fig.11 It is a schematic diagram of the third perspective structure of the electric sliding door and the positioning plate of the present invention; Figure numerals: 1. Chip test equipment body; 2. Electric sliding door; 3. Y-bearing bracket; 4. Single-unit test bench; 5. Power socket; 6. Adapter plug; 7. Conveyor; 8. Circuit board base; 9. Test circuit board; 10. Chip to be tested; 11. Circuit board card; 12. Power plug; 13. Equipment suspension frame; 14. Loading electric push rod; 15. Pushing frame; 16. Pushing plate; 17. Transfer table; 18. Transition plate; 1801. Guide plate fixing hole; 19. Sled guide plate; 20. X-axis linear module; 21. Loading support bracket; 2101 , avoidance groove; 22, the first transfer positioning block; 23, loading cross frame; 2301, loading trough; 2302, feed guide inclined groove; 2303, positioning socket; 2304, pushing inclined groove; 2305, guide slide; 24, first support frame; 25, second support frame; 26, Y-axis linear module; 27, lifting robot arm; 28, L-shaped transfer rod; 29, second transfer positioning block; 30, positioning pressure plate; 31, positioning plug rod; 3101, pushing guide angle; 32, photoelectric sensor; 33, guide slide; 34, fastening suspension frame; 35, fastening plug rod. DETAILED DESCRIPTION

[0015] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings here can be arranged and designed in various different configurations.

[0016] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the invention claimed for protection, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings. In addition, the terms "first", "second", etc. are only used to distinguish the description and cannot be understood as indicating or implying relative importance.

[0018] In the description of the embodiments of the present invention, it should be noted that the terms "inside", "outside", "upper", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is usually placed when used. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0019] like Figures 1 to 11 As shown, an automated and highly compatible chip testing device includes a chip testing device body 1, such as Figure 1 As shown, a test chamber is provided inside the chip test equipment body 1, an electric sliding door 2 is fixedly installed on one side of the test chamber, and a plurality of evenly distributed Y-bearing brackets 3 are fixedly installed inside the test chamber, as shown in FIG. Figure 2 As shown, a plurality of evenly distributed single test benches 4 are fixedly mounted on the top of the Y-bearing bracket 3, a power socket 5 is fixedly mounted on the top of the single test bench 4, and a switching plug 6 is plugged into the top of the power socket 5, as shown in FIG. Figure 1 As shown, a conveyor 7 is provided on one side of the chip testing device body 1, and a plurality of evenly distributed chip carriers are placed on the top of the conveyor 7. In this embodiment, Figure 3 As shown, a positioning frame is printed on the surface of the conveyor belt of the conveyor 7 to facilitate the staff or the robot arm to place the chip carrier; like Figure 5 As shown, the chip carrier includes a circuit board base 8 placed on the top of the conveyor 7, a test circuit board 9 is placed on the top of the circuit board base 8, a chip to be tested 10 and a power-on plug 12 are fixedly installed on the top of the test circuit board 9, and the power-on plug 12 is adapted to the adapter plug 6. In this embodiment, the circuit board base 8 and the test circuit board 9 are placed on the conveyor 7 so that the power-on plug 12 faces the position of the chip testing device body 1. Two circuit board cards 11 are fixedly installed on the top of the circuit board base 8. The two circuit board cards 11 are distributed on both sides of the test circuit board 9. In this embodiment, multiple circuit board cards 11 are provided on both sides of the top of the circuit board base 8. The circuit board 11 is mounted on the circuit board base 8 through bolts and the mounting holes. The positions of the two circuit board 11 can be changed according to different types of test circuit boards 9 to fix different test circuit boards 9. A loading test component is arranged on one side of the chip test equipment body 1. A loading cross frame 23 for loading multiple chip carriers is arranged between the chip test equipment body 1 and the loading test component. In this embodiment, the Y-bearing brackets 3 are all parallel to the Y-axis direction, and multiple Y-bearing brackets 3 are evenly arranged along the X-axis direction. The conveyor 7 is transported along the X-axis direction, and the loading cross frame 23 is parallel to the X-axis direction: The loading test assembly includes a pushing unit and a transfer unit. The pushing unit is used to push multiple chip carriers off the conveyor 7 and integrate them on the loading horizontal frame 23. The transfer unit is used to sequentially send multiple loading horizontal frames 23 into the test room for testing. Specifically, when the automated and highly compatible chip testing equipment is in use, the test circuit board 9 is first placed on the circuit board base 8 in sequence by a human, and the circuit board card 11 is installed on both sides of the test circuit board 9 for fixing. Then, the test circuit board loaded with the chip to be tested 10 is placed on the test room by a human or a robotic arm. The plate 9, that is, the chip carrier is evenly placed on the conveyor 7, so that the conveyor 7 transfers the chip carrier, and then the loading horizontal frame 23 is placed between the test room and the conveyor 7. When the chip carrier is transported to one side of the loading horizontal frame 23, the pushing unit sequentially sends multiple chip carriers to the loading horizontal frame 23. At this time, the electric sliding door 2 is opened, and the transfer unit sends the loading horizontal frame 23 filled with chip carriers to the inside of the test room, and places the loading horizontal frame 23 on the innermost group of power-on sockets 5 arranged along the X-axis direction, and then drives the loading horizontal frame 23. Move inward so that the adapter plugs 6 on the top of each single test bench 4 are respectively plugged into the power-on plugs 12 on each test circuit board 9, so that the test circuit board 9 is connected to the test circuit inside the chip test equipment body 1. Then the transfer unit is reset and the empty loading cross frame 23 is replaced. The loading test assembly repeats the above operation so that multiple loading cross frames 23 are loaded in the test chamber. Finally, the electric sliding door 2 is closed, and each test circuit board 9 starts to be powered on for testing. The chip test equipment body 1 controls the temperature, humidity, air pressure and other environmental factors inside the test chamber to test the functional states of multiple chips 10 to be tested under different environments, thereby realizing batch testing of chip stability, which not only improves the test efficiency, but also provides sufficient sample volume for the test of a chip to ensure the reliability of the test data. At the same time, the entire test process is highly automated, and the circuit board base 8, the loading cross frame 23 and other transportation components and the adapter plug 6 and other test components are all replaceable modules, which ensures the strong compatibility of the chip test equipment body 1 during testing and facilitates the testing of chips of different models.

[0020] like Figure 3 As shown, the pusher unit includes two equipment suspension frames 13 fixedly mounted on one side of the conveyor 7, and a horizontally arranged loading electric push rod 14 is fixedly mounted on the top of the equipment suspension frame 13 close to the chip testing equipment body 1. Figure 4 As shown, a push frame 15 is fixedly installed at the telescopic end of the feeding electric push rod 14, and a push plate 16 is fixedly installed at the bottom of the push frame 15. The height of the push plate 16 corresponds to the height of the test circuit board 9, as shown in FIG. Figure 1 As shown, a transfer platform 17 is provided between the chip testing equipment body 1 and the conveyor 7, and a transition plate 18 is fixedly installed on the top of the transfer platform 17. The transition plate 18 is located between the conveyor 7 and the test chamber. Figure 6As shown, an X-axis linear module 20 is fixedly installed on the top of the transfer platform 17, a loading support frame 21 is fixedly installed on the top of the driving end of the X-axis linear module 20, and a loading cross frame 23 is placed on the top of the loading support frame 21, as shown in FIG. Figure 7 As shown, a plurality of evenly distributed loading slots 2301 are provided on the top of the loading cross frame 23, and the loading slots 2301 are adapted to the test circuit board 9. A feed guide chute 2302 is provided on the side of the loading slot 2301 close to the conveyor 7. The distance between any two adjacent loading slots 2301 is equal to the distance between any two adjacent Y-bearing brackets 3. A plurality of evenly distributed first transfer positioning blocks 22 are fixedly installed on the top of the loading support bracket 21, and a plurality of positioning sockets 2303 adapted to the first transfer positioning blocks 22 are provided on the top of the loading cross frame 23; specifically, by arranging a pushing unit, during loading, the loading cross frame 23 is placed on the loading support bracket 21, so that the first transfer positioning blocks 22 are respectively docked with the plurality of positioning sockets 2303, and the X-axis linear module 20 drives the loading support bracket 21 to carry the loading cross frame 23. The rack 23 moves to between the test chamber and the conveyor 7, and makes the position of the first loading slot 2301 on the loading horizontal rack 23 correspond to the position of the pushing plate 16. At this time, the X-axis linear module 20 and the conveyor 7 are both stopped, and then the loading electric push rod 14 drives the pushing plate 16 to push the chip carrier on the conveyor 7, so that the chip carrier passes through the transition plate 18 and moves to the loading horizontal rack 23, and finally enters the loading slot 2301 under the guidance of the feed guide chute 2302 for loading. After that, the X-axis linear module 20 and the conveyor 7 are operated again, so that the second group of loading slots 2301 correspond to the chip carrier, and the above operation is repeated until all the loading slots 2301 on the loading horizontal rack 23 are loaded with chip carriers, realizing the automatic integration of scattered chip carriers, and facilitating the transfer unit to send the fully loaded loading horizontal rack 23 into the test chamber for power-on.

[0021] like Figure 1 As shown, the transfer unit includes a first support frame 24 disposed on one side of the chip testing device body 1, such as Fig. 9As shown, a second support frame 25 is fixedly installed on the side wall of the chip testing equipment body 1, a Y-axis linear module 26 is fixedly installed between the first support frame 24 and the second support frame 25, a vertically arranged lifting mechanical arm 27 is fixedly installed at the bottom of the driving end of the Y-axis linear module 26, a lifting cross bar is fixedly installed at the bottom of the telescopic end of the lifting mechanical arm 27, and L-shaped transfer rods 28 are fixedly installed at the bottom of both ends of the lifting cross bar. In this embodiment, a plurality of assembly holes are also opened at both ends of the lifting cross bar, and two L-shaped transfer rods 28 are installed on the two ends of the lifting cross bar through bolts and assembly holes, so as to facilitate the change of the position of the L-shaped transfer rod 28, and a second transfer positioning block 29 adapted to the feed guide chute 2302 is fixedly installed on the top of the end of the L-shaped transfer rod 28 facing the test chamber; specifically, by setting a transfer unit, when the loading cross frame 23 is loaded with chip carriers, the electric sliding door 2 is opened, and the Y-axis linear module 26 is moved by the lifting mechanical arm 27 and the lifting cross bar drive the two L-shaped transfer rods 28 to move under the two ends of the loading cross frame 23, and then the lifting mechanical arm 27 drives the two L-shaped transfer rods 28 to lift, so that the first transfer positioning block 22 is inserted into two of the positioning sockets 2303, and then the L-shaped transfer rod 28 pushes and lifts the loading cross frame 23 and sends it into the test room, and then places the loading cross frame 23 on multiple guide slides 33. At this time, the Y-axis linear module 26 continues to drive the loading cross frame 23 to move along the Y-axis direction, so that the loading cross frame 23 is close to the side wall of the guide slide 33. At this time, the power-on plug 12 on the test circuit board 9 will be respectively inserted into each adapter plug 6 to realize automatic power connection between the loading cross frame 23 and the chip carrier. Finally, the transfer unit is reset and waits for the transfer of the next loading cross frame 23. When the test is completed, the transfer unit can be operated in reverse to take out each loading cross frame 23 and place it on the loading support frame 21 for reverse transmission, and the robot arm is used to unload the material to realize automatic chip recovery.

[0022] like Figure 4 As shown, a plurality of evenly distributed guide plate fixing holes 1801 are provided on the top of the transition plate 18, and two symmetrically arranged sled-shaped guide plates 19 are screwed and fixed on the top of the transition plate 18, and the pushing plate 16 corresponds to the position between the two sled-shaped guide plates 19, and the bent end of the sled-shaped guide plate 19 faces the pushing plate 16; specifically, by setting the sled-shaped guide plate 19, when the loading electric push rod 14 drives the pushing plate 16 to push the chip carrier, the chip carrier will enter between the bent ends of the two sled-shaped guide plates 19, and accurately enter the loading groove 2301 on the loading cross frame 23 under the guiding action of the sled-shaped guide plates 19, the sled-shaped guide plates 19 on both sides can effectively prevent the chip carrier from being offset during the pushing process, and at the same time, the sled-shaped guide plate 19 can be replaced with the guide plate fixing holes 1801 by bolts to cope with different types of chip carriers.

[0023] like Figure 2As shown, a guide slide bar 33 is fixedly installed on the top of the single test bench 4. Figure 8 As shown, the bottom of the loading cross frame 23 is provided with a plurality of evenly distributed guide slots 2305, and the guide slots 2305 are adapted to the guide slide bars 33, as shown in FIG. Figure 4 As shown, a fastening hanger 34 is fixedly installed on one side of the push frame 15, and a horizontally arranged fastening rod 35 is fixedly installed on the bottom end of the fastening hanger 34. The fastening rod 35 is adapted to the guide slot 2305, as shown in FIG. Figure 6 As shown, an avoidance groove 2101 adapted to the fastening rod 35 is opened on the top of the loading support frame 21; specifically, by setting the guide slide 33, after the loading cross frame 23 is placed on the single-body test bench 4, the guide slide 2305 at the bottom of the loading cross frame 23 will dock with the guide slide 33, so that the loading cross frame 23 can only move along the Y-axis without causing deviation, ensuring the accuracy of the docking of the adapter plug 6 and the power-on plug 12. At the same time, when the chip carrier is pushed into the loading groove 2301, the movable pushing frame 15 will drive the fastening rod 35 to be inserted into one of the guide slides 2305 at the bottom of the loading cross frame 23 through the first support frame 24, and the auxiliary X-axis linear module 20 will limit the loading cross frame 23, further ensuring that the chip carrier can smoothly enter the loading groove 2301.

[0024] like Fig.10 As shown, a positioning plate 30 is fixedly installed on one side of the driving end of the electric sliding door 2, and the positioning plate 30 is located inside the test chamber, such as Fig.11 As shown, a plurality of evenly distributed positioning rods 31 are fixedly installed at the bottom of the positioning pressure plate 30, and the positioning rods 31 are adapted to the feed guide chute 2302; specifically, by setting the positioning rods 31, after a plurality of loading cross frames 23 loaded with chip carriers are placed in the test chamber, the electric sliding door 2 will be closed, and the driving end of the electric sliding door 2 will drive the plurality of positioning rods 31 to descend through the positioning pressure plate 30 until the plurality of positioning rods 31 are respectively inserted into the positioning holes 2303 on each loading cross frame 23, thereby limiting the loading cross frame 23, so that the loading cross frame 23 cannot move along the Y-axis on the single test bench 4, thereby ensuring the stability of the connection between the test circuit board 9 and the power-on plug 12.

[0025] like Figure 3As shown, a photoelectric sensor 32 is fixedly installed on the top of another equipment suspension frame 13, and the height of the photoelectric sensor 32 is consistent with the height of the chip carrier; specifically, by setting the pushing inclined groove 2304 and the pushing guide angle 3101, when the loading cross frame 23 is placed on the single test bench 4, if the loading cross frame 23 retreats to a certain extent, the connection between the test circuit board 9 and the power-on plug 12 is not firm, and at this time, multiple positioning rods 31 drop with the fall of the electric sliding door 2, and when the positioning socket 2303 on the retreating loading cross frame 23 is connected with the positioning rod 31, the pushing guide angle 3101 on one side of the bottom end of the positioning rod 31 will contact the pushing inclined groove 2304 at the top of the positioning socket 2303, and then under the guiding action of the inclined surfaces of the two, the loading cross frame 23 moves a small distance toward the position of the test circuit board 9, thereby making the connection between the test circuit board 9 and the power-on plug 12 more stable and firm, avoiding the test result being affected by poor contact of the plug after the chip is powered on.

[0026] like Figure 7 As shown, the side of the positioning hole 2303 away from the chip testing device body 1 is provided with a push inclined slot 2304, as shown in FIG. Fig.11 As shown, the positioning rod 31 is provided with a push guide angle 3101 on the side facing the electric sliding door 2; specifically, by setting the photoelectric sensor 32, the photoelectric sensor 32 will always detect the chip carriers that can be transmitted by the conveyor 7. When the photoelectric sensor 32 detects that a chip carrier passes by, the photoelectric sensor 32 will calculate the time required for the next chip carrier to arrive, thereby obtaining the distance between the two chip carriers, and then feedback to the conveyor 7 to correct the single transmission time and speed of the conveyor 7, ensuring that the position deviation of the chip carrier and the pushing unit is within a controllable range, thereby ensuring the accuracy of the chip carrier transportation.

[0027] In summary: before the test: first manually place the test circuit board 9 on the circuit board base 8 in sequence, and install the circuit board card 11 on both sides of the test circuit board 9 to fix it, then manually or by a robotic arm, evenly place the test circuit board 9 loaded with the chip 10 to be tested, that is, the chip carrier on the conveyor 7, so that the conveyor 7 transmits the chip carrier, and then place the loading cross frame 23 on the loading support frame 21, so that the first transfer positioning block 22 is respectively connected with the multiple positioning sockets 2303, and the X-axis linear module 20 drives the loading support frame 21 to carry the loading cross frame 23 to move to the test room and the conveyor 7. The X-axis linear module 20 and the conveyor 7 are both stopped, and then the loading electric push rod 14 drives the pushing plate 16 to push the chip carrier on the conveyor 7, so that the chip carrier passes through the transition plate 18 and moves to the loading horizontal frame 23, and finally enters the loading trough 2301 under the guidance of the feed guide chute 2302 for loading, and then the X-axis linear module 20 and the conveyor 7 are operated again, so that the second group of loading troughs 2301 correspond to the chip carrier, and the above operation is repeated until the chip carrier on the loading horizontal frame 23 is Some loading troughs 2301 are loaded with chip carriers to realize the automatic integration of scattered chip carriers. At this time, the electric sliding door 2 is opened, and the Y-axis linear module 26 drives the two L-shaped transfer rods 28 to move to the bottom of the two ends of the loading horizontal frame 23 through the lifting mechanical arm 27 and the lifting cross bar. Then the lifting mechanical arm 27 drives the two L-shaped transfer rods 28 to lift, so that the first transfer positioning block 22 is inserted into two of the positioning sockets 2303. After that, the L-shaped transfer rod 28 pushes and lifts the loading horizontal frame 23 and sends it into the test room, and then the loading horizontal frame 23 is placed on multiple guide slides 33. At this time, the Y-axis linear module 26 continues The loading frame 23 is then driven to move along the Y-axis direction, so that the loading frame 23 is close to the side wall of the guide slide bar 33. At this time, the power-on plugs 12 on the test circuit board 9 are respectively inserted into the adapter plugs 6, so that the test circuit board 9 is connected to the test circuit inside the chip test equipment body 1, and the loading frame 23 and the chip carrier are automatically powered on. Finally, the transfer unit is reset to wait for the transfer of the next loading frame 23. After that, the transfer unit is reset and the empty loading frame 23 is re-placed. The loading test assembly repeats the above operation to load multiple loading frames 23 in the test chamber, and finally the electric sliding door 2 is closed; During the test: each test circuit board 9 starts to be powered on for testing, the chip test equipment body 1 controls the temperature, humidity, air pressure and other environmental factors inside the test room, and tests the functional status of multiple chips 10 under different environments, thereby realizing batch testing of chip stability; After the test: After the test is finished, the transfer unit can be operated in reverse, and each loading horizontal frame 23 can be taken out and placed on the loading support frame 21 for reverse transmission, and the robot arm can unload the chips to realize the automatic recovery of the chips.

[0028] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The above embodiments and descriptions only describe the principles of the present invention. The present invention may be subject to various changes and improvements without departing from the spirit and scope of the present invention. These changes and improvements fall within the scope of the present invention. The scope of protection claimed by the present invention is defined by the attached claims and their equivalents.

Claims

1. An automated and highly compatible chip testing device, characterized in that: The chip testing device comprises a chip testing device body (1), wherein a testing chamber is arranged inside the chip testing device body (1), an electric sliding door (2) is fixedly installed on one side of the testing chamber, a plurality of evenly distributed Y-bearing brackets (3) are fixedly installed inside the testing chamber, a plurality of evenly distributed single-unit testing tables (4) are fixedly installed on the top of the Y-bearing brackets (3), a power-on socket (5) is fixedly installed on the top of the single-unit testing tables (4), a switching plug (6) is plugged into the top of the power-on socket (5), a conveyor (7) is arranged on one side of the chip testing device body (1), and a plurality of evenly distributed chip carriers are placed on the top of the conveyor (7); The chip carrier comprises a circuit board base (8) placed on the top of the conveyor (7), a test circuit board (9) is placed on the top of the circuit board base (8), a chip to be tested (10) and a power-on plug (12) are fixedly mounted on the top of the test circuit board (9), the power-on plug (12) is adapted to the adapter plug (6), two circuit board cards (11) are fixedly mounted on the top of the circuit board base (8), the two circuit board cards (11) are distributed on both sides of the test circuit board (9), a loading test assembly is arranged on one side of the chip test device body (1), and a loading cross frame (23) for loading a plurality of chip carriers is arranged between the chip test device body (1) and the loading test assembly: The loading test assembly comprises a pushing unit and a transfer unit, wherein the pushing unit is used to push the plurality of chip carriers off the conveyor (7) and integrate them onto the loading horizontal rack (23), and the transfer unit is used to sequentially deliver the plurality of loading horizontal racks (23) into the test chamber for testing.

2. The automated and highly compatible chip testing device according to claim 1, characterized in that: The pushing unit comprises two equipment suspension frames (13) fixedly mounted on one side of the conveyor (7); a horizontally arranged loading electric push rod (14) is fixedly mounted on the top of the equipment suspension frame (13) close to the side of the chip testing equipment body (1); a pushing frame (15) is fixedly mounted on the telescopic end of the loading electric push rod (14); a pushing plate (16) is fixedly mounted on the bottom of the pushing frame (15); the height of the pushing plate (16) corresponds to the height of the test circuit board (9); a transfer platform (17) is arranged between the chip testing equipment body (1) and the conveyor (7); a transition plate (18) is fixedly mounted on the top of the transfer platform (17); the transition plate (18) is located between the conveyor (7) and the test chamber; an X-axis linear module (20) is fixedly mounted on the top of the transfer platform (17); A loading support bracket (21) is fixedly mounted on the top of the driving end of the X-axis linear module (20), the loading cross frame (23) is placed on the top of the loading support bracket (21), a plurality of evenly distributed loading troughs (2301) are provided on the top of the loading cross frame (23), the loading troughs (2301) are matched with the test circuit board (9), a feeding guide chute (2302) is provided on the side of the loading trough (2301) close to the conveyor (7), the spacing between any two adjacent loading troughs (2301) is equal to the spacing between any two adjacent Y-bearing brackets (3), a plurality of evenly distributed first transfer positioning blocks (22) are fixedly mounted on the top of the loading support bracket (21), and a plurality of positioning sockets (2303) matched with the first transfer positioning blocks (22) are provided on the top of the loading cross frame (23).

3. The automated and highly compatible chip testing device according to claim 2, characterized in that: The transfer unit comprises a first support frame (24) arranged on one side of the chip testing device body (1), a second support frame (25) is fixedly installed on the side wall of the chip testing device body (1), a Y-axis linear module (26) is fixedly installed between the first support frame (24) and the second support frame (25), a vertically arranged lifting mechanical arm (27) is fixedly installed at the bottom of the driving end of the Y-axis linear module (26), a lifting cross bar is fixedly installed at the bottom of the telescopic end of the lifting mechanical arm (27), L-shaped transfer rods (28) are fixedly installed at the bottom of both ends of the lifting cross bar, and a second transfer positioning block (29) adapted to the feed guide chute (2302) is fixedly installed at the top of one end of the L-shaped transfer rod (28) facing the test chamber.

4. The automated and highly compatible chip testing device according to claim 2, characterized in that: The top of the transition plate (18) is provided with a plurality of evenly distributed guide plate fixing holes (1801), and two symmetrically arranged sled-shaped guide plates (19) are screwed and fixed to the top of the transition plate (18), the pushing plate (16) corresponds to a position between the two sled-shaped guide plates (19), and a bent end of the sled-shaped guide plate (19) faces the pushing plate (16).

5. The automated and highly compatible chip testing device according to claim 2, characterized in that: A guide slide bar (33) is fixedly installed on the top of the single test bench (4), a plurality of evenly distributed guide grooves (2305) are provided on the bottom of the loading cross frame (23), and the guide grooves (2305) are compatible with the guide slide bar (33). A fastening suspension frame (34) is fixedly installed on one side of the pushing frame (15), and a horizontally arranged fastening plug rod (35) is fixedly installed at the bottom end of the fastening suspension frame (34), and the fastening plug rod (35) is compatible with the guide slide groove (2305). The top of the loading support frame (21) is provided with an avoidance groove (2101) compatible with the fastening plug rod (35).

6. The automated and highly compatible chip testing device according to claim 2, characterized in that: A positioning platen (30) is fixedly mounted on one side of the driving end of the electric sliding door (2), the positioning platen (30) being located inside the test chamber, and a plurality of evenly distributed positioning rods (31) are fixedly mounted on the bottom of the positioning platen (30), the positioning rods (31) being compatible with the feed guide chute (2302).

7. The automated and highly compatible chip testing device according to claim 2, characterized in that: A photoelectric sensor (32) is fixedly mounted on the top of another device suspension frame (13), and the height of the photoelectric sensor (32) is consistent with the height of the chip carrier.

8. The automated and highly compatible chip testing device according to claim 6, characterized in that: The side of the positioning hole (2303) facing away from the chip testing device body (1) is provided with a push-in inclined groove (2304), and the side of the positioning rod (31) facing the electric sliding door (2) is provided with a push-in guide angle (3101).

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