Active circulating phase change refrigeration radiator and notebook computer radiator

Abstract

The invention relates to the technical field of refrigeration and heat dissipation, in particular to an active circulating phase-change refrigeration radiator and a notebook computer radiator, which comprise a phase-change refrigeration and heat dissipation framework, and are characterized in that the phase-change refrigeration and heat dissipation framework is arranged in the phase-change refrigeration and heat dissipation framework; a heat exchange cavity is formed in the phase change refrigeration heat dissipation framework, a base air inlet and a ventilation opening are formed in the heat exchange cavity, and the area, corresponding to the ventilation opening, of the phase change refrigeration heat dissipation framework is a cooling area for containing a device to be cooled. A base heat exchanger used for conducting refrigeration and heat exchange on the heat exchange cavity is further fixedly connected to the phase change refrigeration and heat dissipation framework. The air conditioner is simple in structure, excellent in heat dissipation performance, low in operation noise and small in occupied space of the structure, the heat dissipation base and the outdoor unit heat exchanger are designed in a split mode, hot air exhausted by the outdoor unit heat exchanger is prevented from being sucked again, and the refrigeration efficiency is greatly improved.

Description

Technical Field

[0001] The invention relates to the technical field of refrigeration and heat dissipation, and in particular to an active cycle phase change refrigeration radiator and a notebook computer radiator. Background Art

[0002] Driven by AI technology and the video game industry, the global demand for high-performance computing cards (CPU / GPU) is growing. The upgrade of GPU and CPU not only improves the performance of computers, but also increases their energy consumption. However, as the size of transistors in chips approaches physical limits, it becomes increasingly difficult to improve energy efficiency by reducing the size. This means that in order to achieve higher performance, as shown in the current 40-series or 50-series graphics cards, CPUs and GPUs need to consume more power than before.

[0003] Therefore, future development trends indicate that the power consumption of high-performance CPUs and GPUs will continue to increase, whether in desktops or notebooks. According to Joule's law, the energy consumed by all electronic components on a computer will eventually be converted into internal energy, commonly known as "heat", which makes heat dissipation a key challenge; However, there is no perfect solution to solve the heat dissipation problem of notebook computers in the field of notebook computers.

[0004] Currently, the official cooling solutions of notebook manufacturers include adding copper tubes and increasing fan speed, but both methods have limitations - the former increases the weight of the device, the latter increases the noise level, and neither can be expanded indefinitely.

[0005] The mainstream third-party solutions on the market are divided into forced air radiators and modified water cooling solutions. They each have obvious defects. The former has limited effect due to the influence of ambient temperature, while the latter, although more efficient, is expensive, complicated to install, and has high risks. It is easy to damage the equipment and lose the warranty. Most importantly, it sacrifices portability, making the laptop no different from a desktop computer. Summary of the invention

[0006] In order to solve the above problems, the present invention provides an active cycle phase change refrigeration radiator with a simple structure and reliable refrigeration effect, which effectively solves the shortcomings of the existing heat dissipation technology.

[0007] The present invention discloses an active cycle phase-change cooling radiator, comprising a phase-change cooling and heat dissipation structure, on which a heat exchange cavity is arranged, on which a base air inlet and a vent are arranged, and an area on the phase-change cooling and heat dissipation structure corresponding to the vent is a cooling area for placing a device to be cooled, and a base heat exchanger for cooling and exchanging heat in the heat exchange cavity is fixedly connected to the phase-change cooling and heat dissipation structure; The base heat exchanger is provided with a refrigerant inlet and a refrigerant outlet, the refrigerant inlet is connected to the compressor through a first connecting pipe, the refrigerant outlet is connected to the external heat exchanger through a second connecting pipe, and the external heat exchanger is connected to the compressor; The base radiator is fixedly provided with a base cooling fan which sucks airflow through the base air inlet and the base heat exchanger and blows out cold air toward the vent.

[0008] Preferably, the phase change refrigeration heat dissipation architecture comprises a heat dissipation base, the heat exchange cavity is arranged in the heat dissipation base, and the cooling area is arranged at a position on the top of the heat dissipation base corresponding to the heat exchange cavity.

[0009] Preferably, an annular wind-blocking cushion is fixedly arranged in the refrigeration area on the heat dissipation base, and the vent is located in the annular area of ​​the wind-blocking cushion.

[0010] Preferably, the base heat exchanger is arranged inside the heat exchange cavity and the plug is arranged on the base air inlet, one end of the first connecting tube and the second connecting tube are both located in the heat exchange cavity, and the other ends of the first connecting tube and the second connecting tube pass through the pipe connecting port on the heat dissipation base.

[0011] Preferably, the heat dissipation base comprises a bottom plate, a top plate and an annular side plate sealingly connecting the bottom plate and the top plate; The vents are arranged on the top plate, and the base air inlet is arranged on the bottom plate.

[0012] Preferably, an external fan is also fixedly arranged on the external heat exchanger.

[0013] Preferably, the external heat exchanger is connected to the compressor via a throttling device.

[0014] Preferably, a plurality of vents are provided.

[0015] Preferably, the base heat exchanger is an evaporator, and the external heat exchanger is a condenser.

[0016] A notebook computer radiator is characterized by comprising an active cycle phase change refrigeration radiator, the cooling area is the notebook computer placement area, and the vent is located in the notebook computer placement area.

[0017] The present invention has a simple structure, excellent heat dissipation performance, low operating noise, and a small structural space. The heat dissipation base and the external heat exchanger are split designs, which avoids the hot air discharged from the external heat exchanger from being sucked in again, greatly improving the refrigeration efficiency.

[0018] The present invention combines the split design and the positive pressure cavity design. Through the combination of the three, the user can directly solve the notebook heat dissipation problem without modifying the notebook. Specifically, the present invention includes the following features: Cyclic phase change technology: The present invention utilizes the phase change of the refrigerant in the evaporator and condenser to achieve heat exchange. The cyclic phase change technology effectively reduces the inlet air temperature and significantly improves the heat exchange efficiency, ensuring that the notebook obtains the best cooling effect when running efficiently.

[0019] Split design: The heat sink and the external heat exchanger are split designs. The split design prevents the heat sink from re-inhaling the hot air discharged from the condenser, which not only improves the overall heat dissipation efficiency, but also improves the problem of increased ambient temperature when the notebook is running. In addition, the split design also reduces the impact of the internal rotor vibration on the notebook when the compressor is running, and the longer distance also reduces the impact of the compressor noise.

[0020] Positive pressure cavity design: the present invention has an annular wind-blocking pad fixedly arranged on the top of the heat dissipation base. The laptop computer is placed on the annular wind-blocking pad, so that the laptop computer, the heat dissipation base and the wind-blocking pad form a positive pressure cavity, which minimizes the escape of low-temperature air. Even when the fan runs at a low speed, the heat dissipation air volume required by the laptop computer can be met, thereby achieving a balance between low noise and efficient heat dissipation.

[0021] The present invention achieves excellent heat dissipation performance through the organic combination of the above-mentioned multiple designs and technologies, and effectively solves the problems of insufficient heat dissipation and complex installation existing in traditional heat dissipation solutions. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the structure of the present invention.

[0023] Figure 2 This is a schematic diagram of the present invention after removing the top plate of the heat dissipation base.

[0024] Figure 3 This is a schematic diagram of the location of the left air inlet on the heat dissipation base.

[0025] Figure markings: 1-heat dissipation base, 2-wind-blocking cushion, 3-top plate, 4-first connecting pipe, 5-compressor, 6-external fan, 7-external heat exchanger, 8-base heat dissipation fan, 9-base heat exchanger, 10-base air inlet, 11-pipeline connection port. DETAILED DESCRIPTION

[0026] The present invention is described below in conjunction with the accompanying drawings. Figure 1-3 The present invention discloses an active cycle phase-change cooling radiator, comprising a phase-change cooling and cooling structure, on which a heat exchange cavity is arranged, and on which a base air inlet 10 and a vent are arranged, wherein the area on the phase-change cooling and cooling structure corresponding to the vent is a cooling area for placing a device to be cooled, and the phase-change cooling and cooling structure is also fixedly connected with a base heat exchanger 9 for cooling and exchanging heat in the heat exchange cavity; The base heat exchanger 9 is provided with a refrigerant inlet and a refrigerant outlet, the refrigerant inlet is connected to a compressor 5 via a first connecting pipe 4, and the refrigerant outlet is connected to an external heat exchanger 7 via a second connecting pipe, and the external heat exchanger 7 is connected to the compressor; The base radiator is fixedly provided with a base cooling fan 8 which sucks in airflow, passes through the base air inlet 10 and the base heat exchanger 9, and then blows out cold air toward the vent.

[0027] In one embodiment, the phase change cooling and heat dissipation architecture includes a heat dissipation base 1 , the heat exchange cavity is arranged in the heat dissipation base 1 , and the cooling area is arranged at a position on the top of the heat dissipation base 1 corresponding to the heat exchange cavity.

[0028] In one embodiment, an annular wind-blocking pad 2 is fixedly provided on the top of the heat dissipation base 1, and the vent is located in the annular area of ​​the wind-blocking pad 2. The device to be cooled is placed on the heat dissipation base 1, and the annular wind-blocking pad 2 is filled between the device to be cooled and the heat dissipation base 1, so that a sealed area is formed between the device to be cooled and the heat dissipation base 1, i.e., the annular wind-blocking pad 2. When the base cooling fan 8 blows cold air to the area through the vent, a positive pressure chamber is formed in the area, which is beneficial to improving the heat dissipation efficiency.

[0029] The wind-blocking cushion 2 prevents the low-temperature air in the positive pressure chamber from escaping from all sides, forcing the low-temperature air to enter the device to be cooled from the bottom to exchange heat with the components of the device to be cooled. The temperature difference between the components of the device to be cooled and the low-temperature air is large. Under the same air intake, the heat exchange efficiency of low-temperature air is higher than that of normal temperature air, thereby allowing the device to be cooled to dissipate more heat. The device to be cooled may be a laptop computer.

[0030] In one embodiment, the base heat exchanger 9 is arranged inside the heat exchange cavity and is sealed on the base air inlet 10, one end of the first connecting tube 4 and the second connecting tube are both located in the heat exchange cavity, and the other ends of the first connecting tube 4 and the second connecting tube pass through the pipe connecting port 11 on the heat dissipation base 1.

[0031] In one embodiment, the heat dissipation base 1 includes a bottom plate, a top plate 3 and an annular side plate sealingly connecting the bottom plate and the top plate 3; The vents are arranged on the top plate 3, and the base air inlet 10 is arranged on the bottom plate.

[0032] The ventilation openings are arranged in a plurality.

[0033] The base heat exchanger 9 is an evaporator, and the external heat exchanger 7 is a condenser.

[0034] In one embodiment, an external fan 6 is fixedly mounted on the external heat exchanger 7, and the external fan 6 is used to increase the heat exchange efficiency.

[0035] In one embodiment, the external heat exchanger 7 is connected to the compressor via a throttling device, and the throttling device may be an expansion valve or a capillary tube.

[0036] In one embodiment, a laptop computer radiator includes an active cycle phase change refrigeration radiator, the cooling area is the laptop computer placement area, the vent is located in the laptop computer placement area, and is used to achieve heat dissipation for the laptop computer. As needed, a pad can be set at the bottom of the heat dissipation base 1 to facilitate airflow flowing in from the base air inlet 10.

[0037] In the present invention, the refrigeration radiator performs the refrigeration cycle of the heat dissipation base 1 by using a compressor 5, a condenser, an expansion valve and an evaporator. The refrigeration cycle includes a series of processes, involving compression, condensation, expansion and evaporation, and supplies refrigerant to the conditioned and heat-exchanged air. The compressor 5 compresses the refrigerant gas in a low-temperature and low-pressure state and discharges the refrigerant gas in a high-temperature and high-pressure state. The discharged refrigerant gas flows into the condenser. The condenser condenses the compressed refrigerant into a liquid phase, and the heat is released to the surrounding environment through the condensation process. The throttling device changes the liquid phase refrigerant in a high-temperature and high-pressure state condensed in the condenser into a low-pressure liquid phase refrigerant. The evaporator evaporates the refrigerant expanded in the throttling device and returns the refrigerant gas in a low-temperature and low-pressure state to the compressor 5. The evaporator can achieve a refrigeration effect by utilizing the latent heat of evaporation of the refrigerant to exchange heat with the material to be cooled. In the whole cycle, the heat dissipation base 1 can adjust the air inlet temperature of the laptop computer. The top plate 3 and the wind-blocking cushion 2 of the heat dissipation base 1 cooperate with the laptop to form a positive pressure cavity, forcing the low-temperature air in the positive pressure cavity to enter the bottom of the laptop computer to take away the heat inside the laptop computer.

[0038] The present invention has excellent heat dissipation performance: According to multiple tests, the laptop computer involved in the test is ASUS Magic 4 CPU Intel i7-10875H which unlocks the power consumption wall.

[0039] In terms of cooling: The forced air radiator cools the GPU by 9 degrees Celsius, but does not cool the CPU; The present invention reduces the temperature of the GPU by 15 degrees Celsius and the temperature of the CPU by 2 degrees Celsius; In terms of CPU frequency improvement: the test software is AIDA64 system stability test, The forced air radiator can boost the CPU by 300MHz; The present invention improves the CPU to 700MHz; In terms of CPU performance scoring, the test software is Cinebench R23 and the test method is multi-core running for 10 minutes: The average improvement in performance score for forced-air radiators is about 450 points; The invention improves performance scores by an average of about 1,200 points; The present invention has lower noise: According to measured data, the maximum noise of mainstream forced-air radiators is 58-63 decibels, while according to the specifications of most micro compressors 5, taking Panasonic compressor 56MD030ZBD21 as an example, the noise generated by compressor 5 at the maximum speed of 4500 rpm is 52 decibels. In actual use, it is not necessary to run at the maximum speed, and about 2500 rpm can meet the cooling needs of notebooks, and the noise at this time is much less than 52 decibels; The compressor 5 and the external heat exchanger 7 of the present invention occupy a small space and can be set to a size of about 14cm*14cm*12cm in length, width and height as needed.

[0040] The refrigeration efficiency of the present invention is improved. The heat dissipation base 1, the compressor 5 and the external heat exchanger 7 are of split design, which prevents the hot air discharged from the external heat exchanger 7 from being sucked into the evaporator again, and the refrigeration efficiency will be greatly improved.

[0041] The present invention can realize intelligent control of the cooling range by adjusting the power of the compressor 5 and the rotation speeds of the base fan and the external fan 6 according to the temperature of the GPU and the CPU. The GPU and the CPU do not always work at full load, and the cooling efficiency is reduced when they are idle to achieve energy saving and power saving.

[0042] The invention is beneficial to improving the service life of the notebook By eliminating the problem of heat accumulation, the life of the electronic components inside the notebook will be greatly improved.

[0043] The present invention improves the ambient temperature around the notebook Due to the decrease in inlet air temperature, the outlet air temperature decreases, and the temperature change around the laptop decreases.

Claims

1. An active cycle phase change refrigeration radiator, comprising a phase change refrigeration heat dissipation architecture, characterized in that: The phase-change cooling and heat dissipation structure is provided with a heat exchange cavity, and the heat exchange cavity is provided with a base air inlet and a vent. The area on the phase-change cooling and heat dissipation structure corresponding to the vent is a cooling area for placing the device to be cooled. The phase-change cooling and heat dissipation structure is also fixedly connected with a base heat exchanger for cooling and exchanging heat in the heat exchange cavity; The base heat exchanger is provided with a refrigerant inlet and a refrigerant outlet, the refrigerant inlet is connected to the compressor through a first connecting pipe, the refrigerant outlet is connected to the external heat exchanger through a second connecting pipe, and the external heat exchanger is connected to the compressor; The base radiator is fixedly provided with a base cooling fan which sucks airflow through the base air inlet and the base heat exchanger and blows out cold air toward the vent.

2. An active cycle phase change refrigeration radiator as claimed in claim 1, characterized in that: The phase change refrigeration and heat dissipation architecture includes a heat dissipation base, the heat exchange cavity is arranged in the heat dissipation base, and the cooling area is arranged at a position on the top of the heat dissipation base corresponding to the heat exchange cavity.

3. An active cycle phase change refrigeration radiator as claimed in claim 2, characterized in that: An annular wind-blocking cushion is fixedly arranged in the refrigeration area on the heat dissipation base, and the vent is located in the annular area of ​​the wind-blocking cushion.

4. An active cycle phase change refrigeration radiator as claimed in claim 2, characterized in that: The base heat exchanger is arranged inside the heat exchange cavity and the plug is arranged on the base air inlet, one end of the first connecting tube and the second connecting tube are both located in the heat exchange cavity, and the other ends of the first connecting tube and the second connecting tube pass through the pipe connecting port on the heat dissipation base.

5. An active cycle phase change refrigeration radiator as claimed in claim 2, characterized in that: The heat dissipation base comprises a bottom plate, a top plate and an annular side plate sealingly connecting the bottom plate and the top plate; The vents are arranged on the top plate, and the base air inlet is arranged on the bottom plate.

6. An active cycle phase change refrigeration radiator as claimed in claim 1, characterized in that: An external fan is also fixedly arranged on the external heat exchanger.

7. An active cycle phase change refrigeration radiator as claimed in claim 1, characterized in that: The external heat exchanger is connected to the compressor via a throttling device.

8. An active cycle phase change refrigeration radiator as claimed in claim 1, characterized in that: The ventilation opening is arranged in plurality.

9. An active cycle phase change refrigeration radiator as claimed in claim 1, characterized in that: The base heat exchanger is an evaporator, and the external heat exchanger is a condenser.

10. A notebook computer radiator, characterized in that: It comprises an active cycle phase change refrigeration radiator as described in any one of claims 1 to 9, wherein the cooling area is a laptop computer placement area, and the vent is located in the laptop computer placement area.

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