Heat treatment device

Abstract

A heat treatment apparatus according to an embodiment of the present disclosure may include: a chamber; the heating plates are stacked into a plurality of layers in the cavity; and a support table supporting an object to be processed on one surface of the heating plate, in which the heating plate may include: a main frame including an internal space; the main heater is positioned in the inner space and extends along the length direction of the main frame; and a tube located in the internal space, located outside the main heater in the width direction of the main frame, and extending from one surface of the internal space toward the other surface facing the one surface.

Description

Technical Field

[0001] The present disclosure relates to a heat treatment device. Background Art

[0002] Large-area solar cells, semiconductor substrates, or flat panel display substrates are manufactured through various heat treatment processes. The heat treatment process is performed by stacking the substrates in multiple layers on a heating plate provided in a heat treatment device and then heating them to crystallize or phase-change the film deposited on the substrates.

[0003] As the size and weight of substrates to be heat treated increase, and the temperature required for the heat treatment process increases, the problem of heating plate bending occurs in the heat treatment process. The bending of the heating plate not only adversely affects the quality of the heat treatment, but also has the potential to damage the substrate itself.

[0004] The information in the background technology above is intended to help enhance understanding of the background of the invention and therefore it may contain information that does not constitute prior art.

[0005] Prior art literature Patent Literature (Patent Document 1) Korean Patent Publication No. KR2015-0129914A Summary of the invention

[0006] The heat treatment apparatus according to the embodiment of the present disclosure may provide a heat treatment apparatus in which a heating plate can be prevented from bending during a high-temperature heat treatment process and the heat treatment quality can be improved.

[0007] However, the technical problems that the embodiments of the present disclosure are intended to solve are not limited to the above-mentioned technical problems, and those skilled in the art can clearly understand other technical problems not mentioned through the following description of the invention.

[0008] According to an embodiment of the present disclosure, a heat treatment device may include: a chamber; a heating plate stacked in multiple layers in the chamber; and a support table supporting a treatment object on one surface of the heating plate, wherein the heating plate may include: a main frame including an internal space; a main heater located in the internal space and extending along the length direction of the main frame; and a pipe located in the internal space, located on the outside of the main heater in the width direction of the main frame, and extending from one surface of the internal space toward another surface facing the one surface.

[0009] In the pipe, one side may be in contact with one surface of the inner space, the other side is connected to the other surface of the inner space through a fastening member, and the other side of the pipe is spaced apart from the other surface of the inner space.

[0010] The distance from the center of the main frame to the center of the pipe is d2, the distance from the center of the main frame to one end is d1, d2 can be greater than 60% and less than 90% of d1, and the width of the pipe is d3, and d3 can be greater than 10% and less than 30% of d1.

[0011] The main frame may further include a sensor located at a central portion of the internal space, the main heater being spaced apart from the sensor and located outside the sensor, and the pipe being located further outside the sensor than the main heater.

[0012] In a width direction of the main frame, a pair of the main heaters may be located between a pair of the pipes, and the sensor may be located between the pair of the main heaters.

[0013] The height of the pipe is h2, the height of the main frame is h1, and h2 can be greater than 70% and less than 95% of h1. The distance from the upper surface of the internal space to the center of the main heater is h3, and h3 can be greater than 65% and less than 95% of h1.

[0014] The main frame may include: a first guide member, located in the internal space, extending along the length direction of the main frame, for the main heater to be inserted; a second guide member, located in the center of the internal space, extending along the length direction of the main frame, for the sensor to be inserted; a first support member, extending from the upper surface of the internal space and contacting the first guide member; and a second support member, extending from the upper surface of the internal space and contacting the second guide member.

[0015] The first guide and the second guide may be in contact with a lower surface of the internal space, and a center of each of the first guide and the second guide may be located downward from the center in a height direction of the main frame.

[0016] The main frame may further include an oxide coating layer on at least a portion of an outer side surface.

[0017] The main frame may include the oxide coating layer on the upper surface, the lower surface and one or more side surfaces facing the processing object, and the oxide coating layer may include Al 2 O 3 , and the thickness can be less than 10um. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The following drawings in this specification exemplarily describe the present invention, which, combined with the following description of the invention, can improve the understanding of the technical concept of the present invention. The interpretation of the present invention is not limited to the description in the drawings.

[0019] Figure 1 A heat treatment device according to an embodiment of the present disclosure is shown.

[0020] Figure 2 The interior of a heat treatment device according to an embodiment of the present disclosure is shown.

[0021] Figure 3 A heat treatment area of ​​a heat treatment device according to an embodiment of the present disclosure is shown.

[0022] Figure 4 A heating plate and a primary heater and a sensor are shown according to an embodiment of the present disclosure.

[0023] Figure 5 The interior of a heating plate according to an embodiment of the present disclosure is shown.

[0024] Figure 6 Zoom in to show Figure 2 VI in.

[0025] Figure 7 A coating layer coated on a heating plate according to an embodiment of the present disclosure is shown.

[0026] Description of Reference Numerals 10: Heat treatment device 100: Chamber 200: Heating plate 300: Main heater 400: Sensor 500: Support table DETAILED DESCRIPTION

[0027] By referring to the content of the invention and the accompanying drawings, the embodiments of the present disclosure can be understood. The described embodiments can have various modifications and be implemented in different forms, and are not limited to the embodiments described in this specification. In addition, a part or the whole of each feature of the various embodiments of the present disclosure can be combined with each other. Each embodiment can be implemented separately or in association with each other. The described embodiments are provided as examples to make the present disclosure complete and comprehensive, and are intended to fully convey the technical concept of the present disclosure to those skilled in the art to which the present disclosure belongs. The present disclosure can be replaced in all modifications, equivalents, and the technical concept and technical scope of the present invention. Therefore, unnecessary processes, elements and techniques for those skilled in the art will not be described to achieve a complete understanding of the embodiments of the present disclosure.

[0028] Throughout the drawings and the entire specification, the same reference numerals, characters or combinations thereof refer to the same constituent elements, and thus repeated descriptions are omitted unless otherwise specified. In addition, in order to clearly describe the present invention, parts irrelevant to the description are omitted.

[0029] The relative sizes of elements, layers, and regions in the drawings may be exaggerated for clarity. Hatching and / or shading used in the drawings is generally used to clearly indicate the boundaries between adjacent elements. Therefore, the presence or absence of hatching or shading does not indicate a preferred form or requirement for a particular material, material property, size, proportion, commonality between graphic elements, and / or other features, attributes, etc. of an element (unless otherwise defined).

[0030] Various embodiments are described herein with reference to embodiments and / or cross-sectional examples as schematic examples of intermediate structures. Thus, for example, the figures may vary depending on manufacturing techniques and / or tolerance results. In addition, the specific structural descriptions or functional descriptions in this specification are merely examples of embodiments described in accordance with the present invention. Therefore, the embodiments in this specification should not be interpreted as being limited to the shapes of the regions shown, and include shape differences caused, for example, by manufacturing.

[0031] The regions shown in the drawings are schematic in nature, and their shapes are not intended to limit or schematically illustrate the actual shapes of the device regions. In addition, as recognized by those skilled in the art, the described embodiments can be modified in various ways without exceeding the technical concept or scope of the present disclosure.

[0032] A variety of specific details will be presented in the specification to provide a complete understanding of the various embodiments. However, the various embodiments can be implemented without including such specific details or with at least one specific detail. For another example, known structures and devices are shown in block diagram form to avoid unnecessary obscurity of the various embodiments.

[0033] As shown in the drawings, in order to describe the relationship of an element or other elements or features other than features, spatially relative terms such as "below", "above", "lower", "upper", etc. will be used for ease of description. Spatially relative terms are intended to include various directions other than the directions shown and the device is in use or in operation. For example, when the device in the drawings is turned over, other elements or features described as "below" or "lower" are facing "above" other elements or features. Therefore, "below" and "lower" as exemplary terms can both include upper and lower directions. The device can be oriented in other directions (for example, rotated 90 degrees or in other directions), and the spatially relative descriptions used in this specification should be interpreted accordingly. Similarly, when describing that a first part is arranged "above" a second part, it means that the first part is arranged on the upper side or lower side of the second part.

[0034] In addition, the expression "observed from a plane" refers to observing an object from above, and the expression "schematic cross-sectional view" refers to taking a schematic cross-section after vertically cutting an object. The term "viewed from the side" means that the first object can be above, below or on the side of the second object, and vice versa. In addition, the terms "overlap" or "overlap" can include layers, laminations, surfaces, extensions, covering or partial coverings, or any other appropriate terms understood and understood by technicians in the field. The expression "non-overlapping" can include the meaning of "away from" or "separated from" and other appropriate equivalents recognized and understood by technicians in the field. The terms "face" and "surface" can refer to the first object and the second object being directly or indirectly opposite. When there is a third object between the first object and the second object, the first object and the second object are facing each other but can be understood as indirectly opposite.

[0035] When describing an element, layer, region or constituent element as "formed", "connected" or "combined" on other elements, layers, regions or constituent elements, it may refer to direct formation, connection or combination with elements, layers, regions or constituent elements, or formation, connection or combination with other elements, layers, regions or constituent elements, or indirect formation, connection or combination with other elements, layers, regions or constituent elements. In addition, "formed", "connected" or "joined" may be a general term for direct or indirect combination or connection of elements, layers, regions or constituent elements, as well as integral or non-integrated combination or connection, to indicate the presence of at least one element, layer, region or constituent element. For example, when describing an element, layer, region or constituent element as "electrically connected" or "electrically coupled" with other elements, layers, regions or constituent elements, it may refer to direct electrical connection or electrical coupling with other elements, layers, regions or constituent elements, or the presence of other elements, layers, regions or constituent elements. However, "direct connection" or "direct coupling" refers to a constituent element being directly connected or coupled with other constituent elements in the absence of intermediate constituent elements, or being located on other constituent elements. In addition, in this specification, when a part of a layer, film, region, guide plate, etc. is formed on another part, the formation direction is not limited to the top, and includes the part being formed on the side or below. In contrast, when a part of a layer, film, region, guide plate, etc. is formed "below" another part, it includes not only that the part is "directly below" another part, but also that there is another part between one part and another part. On the other hand, other expressions such as "between", "between", "adjacent to" and "close to" that describe the relationship between constituent elements can be interpreted similarly. In addition, when describing that an element or layer is "between" two elements or layers, it can be the only element between the two elements or layers, or other elements can exist between them.

[0036] For the purpose of this specification, expressions such as "at least one" or "any one" do not limit the order of the individual elements. For example, "at least one of X, Y, and Z", "at least one of X, Y, or Z", "at least one selected from the group consisting of X, Y, and Z" may include X alone, Y alone, Z alone, any combination of two or more of X, Y, and Z. Similarly, expressions such as "at least one of A and B" and "at least one of A or B" may include A, B, or A and B. The term "and / or" in this specification generally includes all combinations of one or more related items. For example, and Z "A and / or B" may include A, B, or A and B.

[0037] The terms "first", "second", "third" and the like may be used herein to describe various elements, constituent elements, regions, layers and / or cross-sections, but such elements, constituent elements, regions, layers and / or cross-sections are not limited thereto. These terms are used to distinguish an element, constituent element, region, layer or cross-section from other elements, constituent elements, regions, layers or cross-sections. Therefore, without departing from the technical concept and scope of the present invention, the first element, constituent element, region, layer or cross-section described below may be referred to as the second element, constituent element, region, layer or cross-section. Describing an element as a "first" element may not require or imply the presence of a second element or other elements. In order to distinguish different categories or groups of elements, the terms "first", "second" and the like may be used in this specification. In order to make a clear statement, the terms "first" and "second" and the like may refer to "first category (or first group)", "second category (or second group)" and the like, respectively.

[0038] The terms used in this application are only used to describe specific embodiments and are not intended to limit the present invention. As used in this specification, singular expressions are intended to include plural expressions, and plural expressions are also intended to include singular expressions, unless the context clearly describes otherwise. When used in this specification, the terms "including", "having", and "having" indicate that the presence of a feature, an entirety, or a step is specified. These statements do not exclude the presence or addition of one or more other functions, steps, operations, constituent elements, and / or combinations thereof.

[0039] If one or more embodiments can be implemented differently, the specific process order may be performed differently from the described order. For example, two processes described in succession may be performed substantially simultaneously or in the reverse order of the described order.

[0040] The terms "substantially," "about," "approximately," and the like are used as terms of approximation rather than terms of degree, and refer to a range that satisfies the inherent variation of a measured or calculated value (e.g., the range of variation due to the limitations of the measurement system). For example, "about" can mean within one or more standard deviations or within ±30%, ±20%, ±10%, or ±5% of a specified value.

[0041] All terms used herein, including technical or scientific terms, have the same meaning as those commonly understood by those skilled in the art, unless otherwise defined. Commonly used terms (e.g., terms defined in dictionaries) should be interpreted as having a meaning consistent with their meaning in the relevant technical field and / or the context of this specification, and should not be interpreted in an idealized or overly formal sense, unless otherwise defined.

[0042] Figure 1 A heat treatment device 10 according to an embodiment of the present disclosure is shown. Figure 2 The interior of the heat treatment device 10 according to the embodiment of the present disclosure is shown. Figure 3 1 shows a heat treatment area HA of a heat treatment device 10 according to an embodiment of the present disclosure, Figure 4 2 shows a heating plate 200, a main heater 300 and a sensor 400 according to an embodiment of the present disclosure. Figure 5 2 shows the interior of the heating plate 200 according to an embodiment of the present disclosure, Figure 6 Zoom in to show Figure 2 VI in, Figure 7 A coating layer CL coated on the heating plate 200 according to an embodiment of the present disclosure is shown.

[0043] The heat treatment device 10 can perform heat treatment on a processing object P such as a semiconductor substrate, a solar cell, or a display substrate. The heat treatment device 10 can heat the processing objects P along a direction (for example, the height direction or the height direction of the heat treatment device 10) inside. Figure 1 The heat treatment device 10 can make the film deposited on the processing object P change phase or crystallize by heat-treating the processing object P at 200° C. to 500° C. For example, the heat treatment device 10 can perform high-temperature heat treatment at 350° C. or higher. The processing object P can be in the shape of a flat plate (for example, a rectangle) with a thickness.

[0044] The heat treatment apparatus 10 may include a chamber 100 , a heating plate 200 , a main heater 300 , a sensor 400 , a support table 500 , and an auxiliary heater 600 .

[0045] The chamber 100 can store and support the processing object P. For example, the chamber 100 has a hollow box shape, and a plurality of processing objects P can exist inside. The plurality of processing objects P can be arranged in the chamber 100 along the height direction of the heat treatment device 10 (for example, Figure 1 The Z-axis direction) is spaced apart and one is positioned on each layer.

[0046] The chamber 100 may include an inner wall 110 and an accommodation space 120 .

[0047] The inner wall 110 is a portion between the outer side of the chamber 100 and the accommodation space 120, and may include a corrosion-resistant and / or heat-resistant material. For example, the inner wall 110 may include a refractory brick or a heat-resistant alloy. For example, the inner wall 110 may include at least one of a nickel alloy such as aluminum, titanium, zirconium, tantalum, niobium, inconel, or Hastelloy, a titanium alloy, a cobalt alloy, or Si-DLC. The inner wall 110 may include an appropriate material and have a thickness to prevent the heat of the accommodation space 120 of the chamber 100 from being transferred to the outside.

[0048] The main heater 300 may pass through the inner wall 110. For example, Figure 2 As shown, the main heater 300 is inserted into the receiving space 120 through the inner wall 110, thereby entering the heating plate 200, and can be inserted into the reverse inner wall 110. In addition, the sensor 400 can also enter the heating plate 200 through the inner wall 110. The main heater 300 and the sensor 400 can be connected to an external controller and power supply through an adapter or the like.

[0049] The accommodation space 120 supports the processing object P, and may be a space where heat treatment is performed on the processing object P. The accommodation space 120 is partitioned by the inner wall 110 , and the heating plate 200 , the support table 500 , and the auxiliary heater 600 may be located in the accommodation space 120 .

[0050] The heating plate 200 can perform heat treatment by heating the treatment object P. The heating plates 200 are arranged in a plurality in different directions and can heat adjacent treatment objects P. For example, the heating plate 200 and the treatment object P can be positioned side by side and can heat the treatment object P located below and / or above the heating plate 200. The heating plate 200 has a plurality of heating plates 200 arranged in a direction (e.g., Figure 2 The heating plate 200 may be a long shape in the Y-axis direction of the heating plate 200 and may be a square tube with a hollow interior. The heating plate 200 may be divided into a heat treatment area HA for heat treatment of the treatment object P. The heat treatment area HA is an area for heat treatment of the treatment object P by a plurality of heating plates 200 and a plurality of auxiliary heaters 600, and may be divided into the accommodation space 120.

[0051] A plurality of heating plates 200 may be positioned in the chamber 100. For example, Figure 1 As shown, the heating plate 200 can be arranged in the accommodation space 120 along the length direction of the heat treatment device 10 (for example, Figure 1 The heating plates 200 may be arranged in a plurality along the height direction of the heat treatment device 10 (eg, Figure 1 The plurality of heating plates 200 arranged in one layer (for example, a plurality of heating plates 200 arranged along the length direction of the heat treatment apparatus 10) can heat the upper surface and / or lower surface of the adjacent processing object P. The number of heating plates 200 arranged in one layer is not particularly limited and may vary according to the size of the processing object P. For example, the number of heating plates 200 arranged in one layer may be 2 to 20. Figure 1 and Figure 2 Six layers of heating plates 200 are shown, but the number of layers of heating plates 200 may be less than or equal to 5 or greater than or equal to 7. The number of layers of heating plates 200 may vary depending on the number of processing objects P, the capacity of the heat treatment apparatus 10, and the like.

[0052] The main heater 300 and the sensor 400 may be positioned in the heating plate 200 . The processing object P may be positioned above the heating plate 200 . For example, a support table 500 may be positioned above the heating plate 200 , and the support table 500 may support the processing object P. The heating plate 200 may be connected to an auxiliary heater 600 .

[0053] The heating plate 200 may include a main frame 210 , a first guide 220 , a second guide 230 , a pipe 240 , a first support 250 , a second support 260 , and a fastening member 270 .

[0054] The main frame 210 may support other components of the heating plate 200 (e.g., the first guide 220, the second guide 230, the pipe 240, the first support 250, the second support 260, the fastening member 270, etc.), the heating plate 200, and the sensor 400. The main frame 210 forms the exterior of the heating plate 200, and the main heater 300 inserted therein heats the treatment object P by heating the heating plate 200. For example, the main frame 210 may include an aluminum material.

[0055] The main frame 210 may include an inner space 211 .

[0056] The inner space 211 is an empty inner space of the main frame 210, which can support the first guide 220, the second guide 230, the pipe 240, the first support 250, the second support 260, and the fastening member 270. The inner space 211 may include a first surface 2111, a second surface 2112, a third surface 2113, and a fourth surface 2114. The first surface 2111 is located above the inner space 211, and can support the pipe 240, the first support 250, and the second support 260. The second surface 2112 faces the first surface 2111 and can be located below the inner space 211. The first guide 220 and the second guide 230 can be positioned on the second surface 2112. In addition, the fastening member 270 can be inserted through the second surface 2112 and connected to the pipe 240. The third surface 2113 and the fourth surface 2114 are surfaces connecting the first surface 2111 and the second surface 2112, and may be located on both sides of the inner space 211 (eg, Figure 5 in the X-axis direction).

[0057] The first guide 220 is located in the inner space 211 and can support the main heater 300. The first guide 220 is located on the second surface 2112 of the inner space 211 and can have a circular tube shape to surround the main heater 300. The first guide 220 is disposed along the length direction of the heating plate 200 (eg, Figure 4 The first guide 220 extends in the Y-axis direction of the main frame 210, and the main heater 300 may be inserted therein. The first guide 220 is spaced apart from the center of the main frame 210, and may be located between the second guide 230 and the pipe 240. The first guide 220 may be located below rather than at the center in the height direction of the main frame 210, and may be connected to the first support 250. That is, the center of the first guide 220 may be located downwardly in the height direction of the main frame 210.

[0058] There may be a plurality of first guide members 220. The number of first guide members 220 may be the same as the number of main heaters 300. Figure 5 As shown, there may be two first guide members 220. The two first guide members 220 face each other and the second guide member 230 is located in the middle, and the two first guide members 220 may be symmetrically positioned. Therefore, the sensor 400 may be located between the two main heaters 300. The inner diameter of the first guide member 220 may be equal to or smaller than the diameter of the main heater 300.

[0059] The second guide 230 is located in the inner space 211 and can support the sensor 400. The second guide 230 is located on the second surface 2112 of the inner space 211 and can have a circular tube shape to surround the sensor 400. The second guide 230 is disposed along the length direction of the heating plate 200 (eg, Figure 4 The second guide member 230 may extend in the Y-axis direction of the heating plate 200, and the sensor 400 may be inserted therein. Figure 5 The second guide member 230 may be located at the center of the main frame 210 in the X-axis direction and may be located between the two first guide members 220. The second guide member 230 may be located at the bottom rather than the center in the height direction of the main frame 210 and may be connected to the second support member 260. That is, the center of the second guide member 230 may be located downward in the height direction of the main frame 210.

[0060] Figure 5 The inner diameter of the second guide 230 is shown to be greater than that of the first guide 220, but the second guide 230 may have an inner diameter less than or equal to the diameter of the sensor 400. The inner diameter of the second guide 230 may be less than or equal to that of the first guide 220.

[0061] The pipe 240 may be located in the inner space 211 and prevent the heating plate 200 from sagging during the heat treatment process. Figure 5 As shown, the pipe 240 can be extended along the width direction of the heating plate 200 (for example, Figure 5 The tube 240 is located in the X-axis direction and opposite to the outer sides of the first guide 220 and the second guide 230. One side of the tube 240 (e.g., the upper surface of the tube 240) can be connected to the first surface 2111, and the other side (e.g., the lower surface of the tube 240) can be connected to the second surface 2112. One side of the tube 240 can be in contact with the first surface 2111, and the other side can be indirectly connected to the second surface 2112 while being separated from it. For example, Figure 5 As shown, the upper surface of the pipe 240 can be in contact with the first surface 2111 (for example, attached by welding, etc.), and the lower surface can be separated from the second surface 2112 by the same distance as the interval C, and connected to the second surface 2112 by a fastening component 270 such as a bolt.

[0062] A plurality of fastening members 270 are arranged along the length direction of the tube 240 and fastened to the tube 240 through the second surface 2112. That is, the height of the tube 240 may be less than the height of the internal space 211 (the distance between the first surface 2111 and the second surface 2112). Therefore, one side of the tube 240 contacts one surface (e.g., the first surface 2111) of the internal space 211, and the other side is connected to the other surface (e.g., the second surface 2112) of the internal space 211 through the fastening member 270, while the other side of the tube 240 may be separated from the other surface of the internal space 211. The tube 240 may be located in the internal space 211, which is positioned outside the main heater 300 in the width direction of the main frame 210, and extends from one surface (e.g., the first surface 2111) of the internal space 211 toward the other surface (e.g., the second surface 2112) facing the one surface.

[0063] The pipe member 240 has a square tube shape with a hollow interior and can extend in the length direction of the heating plate 200 (for example, Figure 4 The pipe member 240 may simultaneously support different surfaces of the main frame 210, thereby preventing the main frame 210 from sagging (eg, preventing the center portion of the main frame 210 in the length direction from sagging downward).

[0064] There may be a plurality of pipes 240. For example, Figure 5 As shown, the two pipe members 240 may be positioned symmetrically about the center in the width direction of the main frame 210. One pipe member 240 is located between the third surface 2113 and any first guide member 220 adjacent to the third surface 2113, and the other pipe member 240 is located between the fourth surface 2114 and another first guide member 220 adjacent to the fourth surface 2114.

[0065] The first support 250 may be connected to the inner space 211 and the first guide 220. For example, one side (e.g., the upper end) of the first support 250 may be connected to the first surface 2111, and the other side (e.g., the lower end) may be in contact with the top of the first guide 220. The first support 250 supports the inner space 211 and the first guide 220, thereby improving the rigidity of the main frame 210, thereby preventing the main frame 210 (heating plate 200) from sagging. For example, the first support 250 may have a plate shape extending in the length direction of the heating plate 200. The first support 250 may extend straight downward (e.g., in the Z-axis direction) from the first surface 2111. There may be a plurality of first supports 250. For example, the first support 250 is equipped with the same number as the first guide 220, and it may be equipped with 2. Each first support 250 may be located on a vertical line extending from the center of each first guide 220.

[0066] The second support 260 may be connected to the inner space 211 and the first guide 220. For example, one side (e.g., the upper end) of the second support 260 may be connected to the first surface 2111, and the other side (e.g., the lower end) may be in contact with the upper side of the second support 260. The second support 260 supports the inner space 211 and the second guide 230, thereby improving the rigidity of the main frame 210, thereby preventing the main frame 210 (heating plate 200) from sagging. For example, the second support 260 may have a plate shape extending in the length direction of the heating plate 200. The second support 260 may extend straight downward (e.g., in the Z-axis direction) from the first surface 2111. For example, the second support 260 is provided in the same number as the second guide 230, and one may be provided. The second support 260 may be located on a vertical line extending from the center of the second guide 230.

[0067] In the width direction of the main frame 210 (for example, Figure 5 In the X-axis direction of the main frame 210, the distance from the center to one end may be d1. In the width direction of the main frame 210, the distance from the center to the center of the pipe 240 may be d2. d2 may be greater than or equal to 60% and less than or equal to 90% of d1. When d2 is less than 60% of d1, it is not possible to effectively prevent the edge area of ​​the main frame 210 (heating plate 200) in the width direction from sagging, and when d2 is greater than 90% of d1, it is not possible to effectively prevent the center of the main frame 210 (heating plate 200) in the width direction from sagging. For example, d2 may be greater than or equal to 65% and less than or equal to 85% of d1.

[0068] The width of the pipe 240 may be d3. d3 may be greater than or equal to 10% and less than or equal to 30% of d1. When d3 is less than 10% of d1, the effect of the pipe 240 in preventing sagging is not sufficient, and when d3 is greater than 30% of d1, the proportion of the pipe 240 in the internal space 211 is too large, so it may interfere with the main heater 300, the sensor 400 or other areas of the internal space 211. In addition, when interfered by the sensor 400 and the pipe 240, it may be difficult to control the temperature of the main heater 300. For example, d3 may be greater than or equal to 15% and less than or equal to 25% of d1.

[0069] The distance from the center of the main frame 210 in the width direction to the center of the first guide 220 (or, the distance to the first support 250) may be d4. d4 may be greater than or equal to 50% and less than or equal to 70% of d1. When d4 is less than 50% of d1, the first guide 220 and the main heater 300 inserted into the first guide 220 may interfere with each other due to being too close to the second guide 230 and the sensor 400. When d4 is greater than 70% of d1, the first guide 220 and the main heater 300 inserted into the first guide 220 may interfere with each other due to being too close to the pipe 240, and the distance between the first support 250 and the second support 260 is too far, which may cause the main frame 210 (heating plate 200) to sag therebetween. For example, d4 may be greater than or equal to 55% and less than or equal to 65% of d1.

[0070] The distance from the first support 250 to the center portion of the pipe 240 may be d5. d5 may be greater than or equal to 15% and less than or equal to 30% of d1. When d5 is less than 15% of d1, the first guide 220 and the main heater 300 inserted into the first guide 220 may interfere with each other due to being too close to the pipe 240. When d5 is greater than 30% of d1, the first guide 220 and the main heater 300 inserted into the first guide 220 may interfere with each other due to being too close to the second guide 230 and the sensor 400. For example, d5 may be greater than or equal to 20% and less than or equal to 25% of d1.

[0071] The distance from the center of the pipe 240 to the side of the inner space 211 (e.g., the third surface 2113 or the fourth surface 2114) may be d6. d6 may be greater than or equal to 10% and less than or equal to 30% of d1. When d6 is less than 10% of d1, the pipe 240 is too close to the side of the inner space 211, thereby failing to effectively prevent the center of the main frame 210 (heating plate 200) in the width direction from sagging. When d6 is greater than 30% of d1, the pipe 240 may interfere with each other due to being too close to the first guide 220 and the main heater 300 inserted into the first guide 220. For example, d6 may be greater than or equal to 15% and less than or equal to 25% of d1.

[0072] The height of the main frame 210 may be h1. The height of the pipe 240 may be h2. Among them, the height h1 may be the height between the outer sides including the thickness of the main frame 210. The height h2 may be the height between the outer sides including the thickness of the pipe 240. h2 may be greater than or equal to 70% and less than or equal to 95% of h1. When h2 is less than 70% of h1, the interval C between the pipe 240 and the second surface 2112 is too large, thereby increasing the size of the fastening member 270, and the connection between the pipe 240 and the second surface 2112 is unstable due to the fastening member 270. When h2 is greater than 95% of h1, the heating plate 200 expands during the heat treatment process, thereby friction may occur between the pipe 240 and the main frame 210. For example, h2 may be greater than or equal to 75% and less than or equal to 90% of h1.

[0073] The height from the center of the first guide 220 (or the center of the main heater 300) to the first surface 2111 may be h3. h3 may be greater than or equal to 65% and less than or equal to 95% of h1. When h3 is less than 65% of h1, it may be difficult to control the temperature of the lower surface of the main frame 210 facing the upper surface of the processing object P. When h3 is greater than 95% of h1, the main heater 300 is too close to the lower surface of the main frame 210, so that a temperature deviation may occur between the upper and lower surfaces of the main frame 210, making it difficult to control the temperature of the heating plate 200. For example, h3 may be greater than or equal to 70% and less than or equal to 90% of h1.

[0074] The height from the center of the second guide 230 (or the center of the sensor 400) to the first surface 2111 may be h4. h4 may be greater than or equal to 55% and less than or equal to 85% of h1. When h4 is less than 55% of h1, the size of the sensor 400 increases to correspond to the size of the second guide 230 and the second guide 230, and the gap between the sensor 400 and the second guide 230 increases, so it may be difficult to determine the position of the sensor 400. In addition, the interval between the sensor 400 and the lower surface of the main frame 210 increases, so it may be difficult to control the temperature of the lower surface of the main frame 210. When h4 is greater than 85% of h1, the sensor 400 is too close to the lower surface of the main frame 210, so it may cause a temperature deviation between the upper and lower surfaces of the main frame 210, and it is difficult to control the temperature of the heating plate 200. For example, h4 may be greater than or equal to 60% and less than or equal to 80% of h1.

[0075] The pipe fitting 240 may include a material different from that of the rest of the heating plate 200. The main frame 210 and the pipe fitting 240 may include materials different from each other. For example, among the components of the main frame 210, at least the upper surface and the lower surface (hereinafter referred to as the "heating surface") of the processing object P facing the main frame 210, or the first surface 2111, the second surface 2112 of the internal space 211, and the pipe fitting 240 may include different materials. The 0.2% yield strength (0.2% offset) of the pipe fitting 240 may be less than the 0.2% yield strength of the heating surface of the main frame 210. For example, when the 0.2% yield strength of the pipe fitting 240 is less than 55% of the 0.2% yield strength of the heating surface of the main frame 210, the relative strength of the pipe fitting 240 to the main frame 210 is too small, so it may be difficult to achieve the effect of preventing the heating plate 200 from sagging. For example, the 0.2% yield strength of the pipe 240 may be greater than or equal to 65% of the 0.2% yield strength of the heating surface of the main frame 210 .

[0076] The tensile strength of the pipe fitting 240 may be greater than the tensile strength of the heating surface of the main frame 210. For example, the tensile strength of the pipe fitting 240 may be 1.5 times or more of the tensile strength of the heating surface of the main frame 210. For example, when the tensile strength of the pipe fitting 240 is less than 1.5 times the tensile strength of the heating surface of the main frame 210, the pipe fitting 240 may break during the heat treatment process. For example, the tensile strength of the pipe fitting 240 may be 1.65 times or more of the tensile strength of the heating surface of the main frame 210.

[0077] The hardness of the pipe fitting 240 may be greater than the hardness of the heating surface of the main frame 210. For example, the hardness of the pipe fitting 240 may be greater than the hardness of the heating surface of the main frame 210 and less than 15 times the hardness of the heating surface. When the hardness of the pipe fitting 240 is less than the hardness of the heating surface of the main frame 210, the pipe fitting 240 may be damaged during the heat treatment process or the process of setting the heating plate. When the hardness of the pipe fitting 240 is greater than 15 times the hardness of the heating surface of the main frame 210, the friction between the pipe fitting 240 and the main frame 210 may increase the degree of damage to the main frame 210. For example, the hardness of the pipe fitting 240 may be greater than the hardness of the heating surface of the main frame 210 and less than 13 times the hardness of the heating surface.

[0078] The thermal expansion coefficient of the pipe fitting 240 may be smaller than the thermal expansion coefficient of the heating surface of the main frame 210. For example, the thermal expansion coefficient of the pipe fitting 240 may be greater than or equal to 55% and less than or equal to 80% of the thermal expansion coefficient of the heating surface of the main frame 210. When the thermal expansion coefficient of the pipe fitting 240 is less than 55% of the thermal expansion coefficient of the heating surface of the main frame 210, a gap is likely to occur between the pipe fitting 240 and the main frame 210 due to the difference in thermal expansion coefficients in the high-temperature heat treatment process, and it is difficult for the pipe fitting 240 to accurately prevent the heating plate 200 from sagging. When the thermal expansion coefficient of the pipe fitting 240 is greater than 80% of the thermal expansion coefficient of the heating surface of the main frame 210, friction between the pipe fitting 240 and the main frame 210 may occur within a specific temperature range. The thermal expansion coefficient of the pipe fitting 240 may be greater than or equal to 60% and less than or equal to 75% of the thermal expansion coefficient of the main frame 210.

[0079] The thermal conductivity of the pipe fitting 240 may be less than the thermal conductivity of the heating surface of the main frame 210. The thermal conductivity of the pipe fitting 240 may be less than or equal to 5% or greater than or equal to 20% of the thermal conductivity of the heating surface of the main frame 210. When the thermal conductivity of the pipe fitting 240 fails to meet the above range, the proportion of heat generated from the main heater 300 and transferred to the pipe fitting 240 increases, which may cause heat loss on the heating surface of the main frame 210. The thermal conductivity of the pipe fitting 240 may be less than or equal to 5% or greater than or equal to 15% of the thermal conductivity of the heating surface of the main frame 210.

[0080] By satisfying the above-mentioned material, tensile strength, hardness, thermal expansion coefficient and thermal conductivity in the heating surface of the main frame 210, the pipe 240 can effectively support the main frame 210 (heating plate 200) during the high-temperature heat treatment process and prevent the main frame 210 from sagging. In addition, the pipe 240 or the main frame 210 can be prevented from being damaged during the heat treatment process.

[0081] For example, the pipe 240 may include SUS316L, and the rest of the heating plate 200 or the heating surface of the main frame 210 may include AL6063. The 0.2% yield strength of the pipe 240 may be greater than or equal to 175 N / mm2, the tensile strength may be greater than or equal to 480 N / mm2, the hardness (Hv) may be less than or equal to 200, the thermal expansion coefficient may be 15.9 W / m℃ (20℃ to 100℃), and the thermal conductivity may be 16.3 W / m℃ (100℃). The 0.2% yield strength of the heating surface of the main frame 210 may be greater than or equal to 243 N / mm2, the tensile strength may be greater than or equal to 263 N / mm2, the hardness (Hv) may be greater than or equal to 17 and less than or equal to 23, the thermal expansion coefficient may be 23.4 W / m℃ (20℃ to 100℃), and the thermal conductivity may be 238 W / m℃ (100℃).

[0082] The heating plate 200 may include a coating layer CL. For example, the coating layer CL may be located on at least one surface of the main frame 210. The coating layer CL may be located on the outer side of the main frame 210 and prevent the heating plate 200 from being damaged during the heat treatment process. The coating layer CL includes an oxide film, for example, Al 2 O 3 The coating layer CL may include Al 2 O 3 Anodic oxide film. The coating layer CL may have a thickness of 10 μm or less. For example, the coating layer CL may have a thickness of 2 μm or more and 7 μm or less.

[0083] The coating layer CL may be located on an upper surface 212 and a lower surface 213 of the main frame 210 facing the main frame 210. In addition, the coating layer CL may be located on a left side surface 214 and a right side surface 215.

[0084] Since the coating layer CL is disposed on at least one outer side of the main frame 210, the heating plate 200 may have excellent reliability and improved heating characteristics in a high temperature process environment. In addition, the heating plate 200 may have improved reliability in repeated processes.

[0085] The main heater 300 can heat the object P by heating the heating plate 200. For example, the main heater 300 can be inserted into the interior of the heating plate 200, thereby heating the heating plate 200. A portion of the main heater 300 can be inserted into the interior of the heating plate 200 (for example, the main frame 210), and another portion can pass through the inner wall 110 and pass through the accommodation space 120. For example, the main heater 300 can be inserted into the first guide 220. There can be a plurality of main heaters 300. For example, two main heaters 300 can be respectively inserted into two first guides 220.

[0086] For example, the main heater 300 may be a round heating wire that generates heat when an electric current is supplied. The main heater 300 may include a metal such as iron, chromium, aluminum, nickel, or tungsten, or silicon, carbon, or the like. The main heater 300 is connected to a power source supplied from the outside, and the temperature may be adjusted by adjusting the power supplied based on the temperature detected by the sensor 400. For example, the main heater 300 may be heated to 200°C to 600°C. The upper surface and / or lower surface of the heating plate 200 heated by the main heater 300 may heat the processing object P.

[0087] The sensor 400 may measure the temperature of the heating plate 200 (e.g., the main frame 210 or the internal space 211) or the main heater 300. For example, the sensor 400 may be a thermocouple that measures the temperature of the heating plate 200 or the main heater 300 and transmits it to the controller. The controller may adjust the temperature of the main heater 300 based on the temperature detected by the sensor 400. For example, the sensor 400 may be inserted into the interior of the heating plate 200. A portion of the sensor 400 may be inserted into the interior of the heating plate 200 (e.g., the main frame 210), and another portion may pass through the inner wall 110 and pass through the accommodation space 120. For example, the sensor 400 may be inserted into the second guide 230.

[0088] The support table 500 may be connected to the heating plate 200 and support the processing object P. For example, Figure 2 As shown, the support table 500 may be located on the upper surface of the heating plate 200 and in contact with the processing object P. The support table 500 separates the upper surface and / or lower surface of the heating plate 200 from the processing object P to prevent the processing object P from directly contacting the heating plate 200, and supports the processing object P so that it shakes during the heat treatment process. The support table 500 may extend in a direction intersecting the heating plate 200 (for example, the width direction of the heating plate 200 or the X-axis direction). There may be a plurality of support tables 500. For example, as shown in FIG. Figure 2 As shown, a plurality of support tables 500 may be spaced apart and positioned side by side along the length direction of the heating plate 200. The figure shows a total of 8 support tables 500, but the number is not limited to 8, and the number of support tables 500 may be 7 or less, or 9 or more.

[0089] The support table 500 may be positioned for each heating plate 200. Alternatively, the support table 500 may be positioned for each layer of the heating plate 200. For example, a plurality of (e.g., 8) support tables 500 may be positioned for each heating plate 200. Alternatively, a plurality of (e.g., 8) support tables 500 may be positioned in each layer of one heating plate 200 composed of a plurality of heating plates 200, and each support member may have a length corresponding to the width of the layer of one heating plate 200.

[0090] The support table 500 may include a base 510 and contact pins 520 .

[0091] The base 510 may be connected to the heating plate 200. For example, Figure 6As shown, the base 510 may be in contact with the upper surface of the heating plate 200. The contact pin 520 may protrude from the upper side of the base 510, and the contact pin 520 supports the processing object P. The contact pin 520 may protrude toward the lower surface of the processing object P and make point contact with the processing object P. The contact pin 520 makes point contact with the processing object P, thereby reducing the contact area between the contact pin 520 and the processing object P, thereby minimizing the loss of the heating area of ​​the heating plate 200 caused by the contact pin 520.

[0092] The auxiliary heater 600 can heat the processing object P together with the main heater 300. The auxiliary heater 600 can divide the heat treatment area HA for heating the processing object P together with the main heater 300. For example, the auxiliary heater 600 can heat the side surface of the processing object P (for example, Figure 6 For example, the auxiliary heater 600 may be connected to the bottom of the heating plate 200. When a plurality of heating plates 200 are arranged side by side in a layer, the auxiliary heater 600 may heat each heating plate 200 in the width direction (for example, Figure 3 Alternatively, the auxiliary heater 600 may be connected to the inner wall 110.

[0093] A plurality of auxiliary heaters 600 may be positioned for one heating plate 200. For example, Figure 2 As shown, two auxiliary heaters 600 may be positioned for each heating plate 200 and arranged along the length direction of the heating plate 200 (eg, Figure 2 The main heater 300 is located above and below the processing object P and the two auxiliary heaters 600 located on both sides of the processing object P can heat the processing object P together. The auxiliary heater 600 may include a heating wire, similar to the main heater 300.

[0094] As described above, the present invention is described with reference to the embodiments shown in the accompanying drawings, but they are exemplary. Those skilled in the art fully understand that various modifications can be made through the embodiments and other equivalent embodiments can be realized. Therefore, the true technical protection scope of the present invention should be determined by the claims.

[0095] The heating plate in the heat treatment apparatus according to the embodiment of the present disclosure can avoid bending during a high-temperature heat treatment process and improve the heat treatment quality.

[0096] The heat treatment device according to the embodiment of the present disclosure can effectively prevent the central portion and both end portions of the heating plate in the length direction from sagging during a high-temperature heat treatment process.

[0097] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this description. Therefore, the inventive concept is not limited to these embodiments, but is limited to the broader scope of the appended claims, and various obvious modifications and equivalent arrangements will be apparent to those of ordinary skill in the art.

Claims

1. A heat treatment device, comprising: Chamber; Heating plates, stacked in multiple layers within the chamber; as well as a support table for supporting the object to be processed on a surface of the heating plate, Wherein, the heating plate comprises: The main frame, including the interior space; a main heater, located in the inner space and extending along the length direction of the main frame; and A pipe member is located in the inner space, is located outside the main heater in the width direction of the main frame, and extends from one surface of the inner space toward another surface facing the one surface.

2. The heat treatment device according to claim 1, wherein: In the pipe, one side contacts one surface of the inner space, the other side is connected to the other surface of the inner space through a fastening member, and the other side of the pipe is separated from the other surface of the inner space.

3. The heat treatment device according to claim 1, wherein: The distance from the center of the main frame to the center of the pipe is d2, and the distance from the center of the main frame to one end is d1, and d2 is greater than 60% and less than 90% of d1. The width of the pipe is d3, and d3 is greater than 10% and less than 30% of d1.

4. The heat treatment device according to claim 1, wherein: The main frame further includes a sensor, which is located at the center of the internal space. The main heater is separated from the sensor and located outside the sensor, The tube is located further outboard of the sensor than the primary heater.

5. The heat treatment device according to claim 4, wherein: In the width direction of the main frame, a pair of the main heaters are located between a pair of the pipes, and the sensor is located between the pair of the main heaters.

6. The heat treatment device according to claim 4, wherein: The height of the pipe is h2, the height of the main frame is h1, and h2 is greater than 70% and less than 95% of h1. A distance from the upper surface of the internal space to the center of the main heater is h3, and h3 is 65% to 95% or less of h1.

7. The heat treatment device according to claim 4, wherein: The main framework includes: a first guide member, located in the inner space, extending along the length direction of the main frame, for the main heater to be inserted into; A second guide, located in the center of the internal space, extending along the length direction of the main frame, for the sensor to be inserted; a first support member extending from an upper surface of the inner space to contact the first guide member; and The second support member extends from the upper surface of the inner space and contacts the second guide member.

8. The heat treatment device according to claim 7, wherein: The first guide member and the second guide member are in contact with a lower surface of the inner space, The center of each of the first guide and the second guide is located downward from the center in the height direction of the main frame.

9. The heat treatment device according to claim 1, wherein: The main frame further includes an oxide-containing coating layer on at least a portion of the outer side surface.

10. The heat treatment device according to claim 9, wherein: The main frame includes the coating layer on the upper surface, the lower surface and one or more side surfaces facing the processing object. The coating layer includes Al2O3 and has a thickness of less than 10 um.

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