Integrated circuit chip packaging processing equipment

Abstract

The invention discloses integrated circuit chip packaging processing equipment, and relates to the technical field of chip packaging. Comprising a base, the outer wall of the base is fixedly connected with a servo motor, the output end of the servo motor is fixedly connected with an adjusting screw rod, the outer wall of the adjusting screw rod is in threaded connection with a limiting plate, and the outer wall of the limiting plate is slidably connected with a dividing frame; the outer wall of the limiting device is fixedly connected with the outer wall of the base; the outer wall of the pressing device is in sliding connection with the outer wall of the limiting plate; when a pressed device provided with a contact device is stressed, a guide block slides along a fixed frame, an unfolding device is pushed, a pressing plate is promoted to be unfolded outwards through inclined plane design and limiting of a telescopic rod, it is ensured that the pressing plate makes uniform contact with the surface of a chip, local pressure is prevented from being too large, and packaging reliability is improved; the multi-stage damping rods cooperate with related parts, the buffering effect is achieved when the air cylinder pushes the contact device, and the chip is prevented from being damaged by too large impact force at the pressing moment.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, in particular to an integrated circuit chip packaging processing device. Background Art

[0002] In the production process of integrated circuit chips, the packaging link is crucial, and its quality directly affects the performance, reliability and service life of the chip. However, the current difficulty faced by integrated circuit chip packaging processing is that it is difficult to ensure the stability of the chip pressing operation during the packaging process; when traditional packaging equipment presses the chip, the pressing plate is not in uniform contact with the chip surface. Due to the lack of effective pressure dispersion and adjustment mechanism, the chip is often subjected to excessive pressure locally, which not only easily causes damage to the internal structure of the chip and causes performance failures, but also increases the packaging defect rate. In the packaging of some fine process chips, excessive local pressure may cause the chip and the packaging material to be loosely bonded, resulting in gaps, which in turn affects the stability of the chip and reduces the overall quality and reliability of the chip; when faced with the packaging needs of chips of different sizes, traditional equipment has poor adaptability and is difficult to flexibly adjust the position according to the chip size, limiting the equipment's processing capabilities for chips of various specifications. Summary of the invention

[0003] 1. Technical issues to be resolved

[0004] In view of the deficiencies in the prior art, the present invention provides an integrated circuit chip packaging and processing equipment. The pressure device of the contact device in the equipment has a guide block that slides when subjected to force, and utilizes the inclined surface design and the telescopic rod limiter to push the expansion device to make the pressing plate evenly expand and fully and evenly contact the chip surface, effectively avoiding excessive local pressure, thereby improving the packaging reliability. The buffer device in the pressing device cooperates with related components through a multi-stage damping rod to quickly buffer the pressure at the moment the cylinder pushes the contact device to prevent the chip from being damaged by excessive impact force, thereby ensuring the stability of the packaging process.

[0005] (II) Technical solution

[0006] To achieve the above objectives, the present invention is implemented through the following technical solutions: an integrated circuit chip packaging and processing equipment, including a base, the outer wall of the base is fixedly connected to a servo motor, the output end of the servo motor is fixedly connected to an adjusting screw, the outer wall of the adjusting screw is threadedly connected to a limiting plate, and the outer wall of the limiting plate is slidably connected to a dividing frame; a limiting device, the outer wall of the limiting device is fixedly connected to the outer wall of the base; a pressing device, the outer wall of the pressing device is slidably connected to the outer wall of the limiting plate; the pressing device includes a connecting device, the outer wall of the bottom of the connecting device is symmetrically fixedly connected to a connecting frame, the outer wall of the connecting frame is fixedly connected to a sliding frame, the outer wall of the sliding frame is fixedly connected to a limiting shaft, the outer wall of the connecting device is fixedly connected to a cylinder, the output end of the bottom of the cylinder is fixedly connected to a contact device, and the outer wall of the connecting device is fixedly connected to a buffer device;

[0007] The contact device includes a connecting shell, the side wall inside the connecting shell is fixedly connected to a fixing frame, the side wall inside the fixing frame is fixedly connected to a partition block, the top inside the fixing frame is fixedly connected to a pressure device, and the outer wall of the pressure device is slidably connected to an expansion device. When the pressure device of the contact device is subjected to force, the guide block slides along the fixing frame to push the expansion device. Through the inclined surface design and the telescopic rod limit, the pressing plate is prompted to expand outward to ensure uniform contact with the chip surface, avoid excessive local pressure, and improve packaging reliability.

[0008] Preferably, the outer wall of the connecting shell and the outer wall of the top of the fixed frame are fixedly connected to the output end of the bottom of the cylinder, the outer wall of the limiting shaft is slidably connected to the outer wall of the limiting plate, the side wall of the limiting plate is slidably connected to the outer wall of the base, and the outer wall of the sliding frame is fixedly connected to the inner wall of the base.

[0009] Preferably, the pressure-bearing device includes a bearing plate, the outer wall of the bearing plate is fixedly connected to a guide block, the inner wall of the bearing plate is fixedly connected to a single-stage damping rod, the outer wall of the top of the single-stage damping rod is fixedly connected to a connecting plate, and the outer wall of the top of the connecting plate is fixedly connected to the top of the fixed frame.

[0010] Preferably, the unfolding device includes a fixing bar, an outer wall of the fixing bar is fixedly connected to a telescopic rod, an outer sleeve of the telescopic rod is provided with a compression spring, an end of the telescopic rod away from the fixing bar is fixedly connected to a connecting block, an outer wall at the top of the connecting block is fixedly connected to a slope block, and an outer wall at the bottom of the connecting block is fixedly connected to a pressing plate.

[0011] Preferably, the outer wall of the fixing bar is fixedly connected to the side wall inside the fixing frame, one end of the compression spring is fixedly connected to the outer wall of the fixing bar, the other end of the compression spring is fixedly connected to the outer wall of the connecting block, and the outer surface of the top of the pressing plate is fixedly connected to the outer wall of the bottom of the fixing bar. Through the overall design of the pressing device, from buffering to uniform pressing, the chip packaging process is guaranteed to be stable, the packaging defect rate is reduced, and it helps to improve the chip quality.

[0012] Preferably, the connecting device includes a connecting plate, the inner wall of the connecting plate is fixedly connected to the outer wall of the cylinder through a through hole, the outer wall of the connecting plate is symmetrically provided with movable grooves, the inner wall of the connecting plate is fixedly connected to a fixing cylinder, the buffer device includes a multi-stage damping rod, the outer wall of the multi-stage damping rod is fixedly connected to a push plate, the outer wall of the push plate is fixedly connected to a limiting block, the outer wall of the limiting block is rotatably connected to a rotating rod, the end of the rotating rod away from the limiting block is rotatably connected to the limiting frame, and a buffer device is provided in the pressing device, which cooperates with related components by means of the multi-stage damping rod to play a buffering effect when the cylinder pushes the contact device, thereby preventing the chip from being damaged by excessive impact force at the moment of pressing, and ensuring the stability of chip packaging.

[0013] Preferably, the outer wall of the limit frame is fixedly connected to the output end of the bottom of the cylinder, the outer wall of the multi-stage damping rod is fixedly connected to the inner wall of the fixed cylinder, and the outer wall of the push plate is slidably connected to the inner wall of the connecting plate through a movable groove.

[0014] Preferably, the limiting device includes a fixed block, the outer wall of the fixed block is fixedly connected to a connecting rod, the end of the connecting rod away from the fixed block is fixedly connected to a DC motor, the output end of the DC motor is fixedly connected to a bidirectional screw, the outer wall of the bidirectional screw is threadedly connected to an internal threaded frame, and a limiting groove is provided in the wall of the internal threaded frame.

[0015] Preferably, the outer wall of the fixed block and the outer wall of the connecting rod are fixedly connected to the outer wall of the base, the outer wall of the internally threaded frame is slidably connected to the outer wall of the connecting rod, the outer wall of the internally threaded frame is slidably connected to the outer wall of the base, the outer wall of the DC motor is fixedly connected to the outer wall of the base, the end of the bidirectional screw away from the DC motor is rotatably connected to the inner wall of the fixed block, the outer wall of the internally threaded frame is slidably connected to the outer wall of the dividing frame through a limiting groove, and the position of the dividing frame can be adjusted by cooperating with the limiting device and the limiting plate to adapt to the packaging requirements of chips of different sizes, enhance the versatility of the equipment, enable the equipment to cope with the production of chips of various specifications, and improve production efficiency and equipment utilization.

[0016] (III) Beneficial effects

[0017] The present invention provides an integrated circuit chip packaging and processing device. It has the following beneficial effects:

[0018] (I) The integrated circuit chip packaging and processing equipment is provided with a pressure device of the contact device. When the pressure device is subjected to force, the guide block slides along the fixed frame to push the expansion device. Through the inclined surface design and the telescopic rod limit, the pressing plate is prompted to expand outward to ensure uniform contact with the chip surface, avoid excessive local pressure, and improve packaging reliability.

[0019] (ii) The integrated circuit chip packaging and processing equipment is provided with a buffer device in the pressing device, which cooperates with the related components by means of a multi-stage damping rod to play a buffering role when the cylinder pushes the contact device, thereby preventing the chip from being damaged by excessive impact force at the moment of pressing, and ensuring the stability of chip packaging.

[0020] (III) The integrated circuit chip packaging and processing equipment can adjust the position of the splitting frame through the cooperation of the limiting device and the limiting plate to meet the packaging requirements of chips of different sizes, enhance the versatility of the equipment, enable the equipment to cope with the production of chips of various specifications, and improve production efficiency and equipment utilization.

[0021] (IV) The integrated circuit chip packaging and processing equipment, through the overall design of the pressing device, from buffering to uniform pressing, thereby ensuring the stability of the chip packaging process, reducing the packaging defect rate, and helping to improve the chip quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0023] Figure 2 It is a schematic diagram of the internal structure of the present invention as a whole;

[0024] Figure 3 It is a schematic diagram of the local structure of the limiting plate of the present invention;

[0025] Figure 4 It is a schematic structural diagram of the limiting device of the present invention;

[0026] Figure 5 It is a structural schematic diagram of the pressing device of the present invention;

[0027] Figure 6 It is a schematic diagram of the local structure on the connecting plate of the present invention;

[0028] Figure 7 It is a schematic diagram of the internal structure of the contact device of the present invention;

[0029] Figure 8 It is a structural schematic diagram of the pressure-bearing device of the present invention;

[0030] Fig. 9 It is a structural schematic diagram of the unfolding device of the present invention.

[0031] In the figure: 1, base; 2, limit device; 3, servo motor; 4, adjusting screw; 5, limit plate; 6, pressing device; 7, dividing frame; 21, fixed block; 22, connecting rod; 23, DC motor; 24, bidirectional screw; 25, internal thread frame; 26, limit slot; 61, connecting device; 62, connecting frame; 63, sliding frame; 64, limit shaft; 65, cylinder; 66, contact device; 67, buffer device; 611, connecting plate; 612, through hole; 613, movable slot; 614, fixed cylinder; 661, connecting shell; 662, fixing frame; 663, partition block; 664, pressure device; 665, unfolding device; 671, multi-stage damping rod; 672, push plate; 673, limit block; 674, rotating rod; 675, limit frame; 6641, bearing plate; 6642, guide block; 6643, single-stage damping rod; 6644, connecting plate; 6651, fixing strip; 6652, telescopic rod; 6653, compression spring; 6654, connecting block; 6655, inclined block; 6656, pressing plate. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] See also Figure 1-9 The present invention provides a technical solution: an integrated circuit chip packaging and processing equipment, including a base 1, the outer wall of the base 1 is fixedly connected to a servo motor 3, the output end of the servo motor 3 is fixedly connected to an adjusting screw 4, the outer wall of the adjusting screw 4 is threadedly connected to a limiting plate 5, and the outer wall of the limiting plate 5 is slidably connected to a dividing frame 7; a limiting device 2, the outer wall of the limiting device 2 is fixedly connected to the outer wall of the base 1; a pressing device 6, the outer wall of the pressing device 6 is slidably connected to the outer wall of the limiting plate 5; the pressing device 6 includes a connecting device 61, the outer wall of the bottom of the connecting device 61 is symmetrically fixedly connected to a connecting frame 62, the outer wall of the connecting frame 62 is fixedly connected to a sliding frame 63, the outer wall of the sliding frame 63 is fixedly connected to a limiting shaft 64, the outer wall of the connecting device 61 is fixedly connected to a cylinder 65, the output end of the bottom of the cylinder 65 is fixedly connected to a contact device 66, and the outer wall of the connecting device 61 is fixedly connected to a buffer device 67;

[0034] The contact device 66 includes a connecting shell 661, the side wall inside the connecting shell 661 is fixedly connected to a fixed frame 662, the side wall inside the fixed frame 662 is fixedly connected to a partition block 663, the top inside the fixed frame 662 is fixedly connected to a pressure device 664, and the outer wall of the pressure device 664 is slidably connected to an expansion device 665. When the cylinder 65 is started, its output end pushes the contact device 66 downward, and at the same time, the limit frame 675 drives the rotating rod 674 and the limit block 673 to move, and the push plate 672 slides in the movable groove 613 and drives the multi-stage damping rod 671 to be pushed and squeezed. At this time, the multi-stage damping rod 671 is fixed in the fixed cylinder 614, and the other end is squeezed and contracted to play a buffering role, avoiding excessive impact force at the moment of pressing to damage the chip, thereby ensuring the stability and safety of the pressing process.

[0035] The outer wall of the connecting shell 661 and the outer wall of the top of the fixed frame 662 are fixedly connected to the output end at the bottom of the cylinder 65, the outer wall of the limit shaft 64 is slidably connected to the outer wall of the limit plate 5, the side wall of the limit plate 5 is slidably connected to the outer wall of the base 1, and the outer wall of the sliding frame 63 is fixedly connected to the inner wall of the base 1.

[0036] The pressure-bearing device 664 includes a bearing plate 6641, the outer wall of which is fixedly connected to a guide block 6642, the inner wall of which is fixedly connected to a single-stage damping rod 6643, the outer wall of the top of the single-stage damping rod 6643 is fixedly connected to a connecting plate 6644, the outer wall of the top of the connecting plate 6644 is fixedly connected to the top of the fixed frame 662, when the bearing plate 6641 is subjected to pressure from the packaging part, the guide block 6642 slides along the inner wall of the fixed frame 662 and pushes the unfolding device 665 at the same time, the compression spring 6653 is compressed, and the telescopic rod 6652 contracts, at which time the bearing plate 6641 that moves under pressure will drive the guide block 6642 to move, and the moving guide block 6642 will push the inclined block 6655 to move.

[0037] The unfolding device 665 includes a fixing bar 6651, the outer wall of which is fixedly connected to a telescopic rod 6652, the outer sleeve of the telescopic rod 6652 is provided with a compression spring 6653, the end of the telescopic rod 6652 away from the fixing bar 6651 is fixedly connected to a connecting block 6654, the outer wall of the top of the connecting block 6654 is fixedly connected to a slope block 6655, and the outer wall of the bottom of the connecting block 6654 is fixedly connected to a pressing plate 6656. Under the inclined surface setting and the limitation of the telescopic rod 6652, the slope block 6655 moves outward, and then the connecting block 6654 drives the pressing plate 6656 to unfold outward, so that the pressing plate 6656 can contact the chip surface more evenly, thereby achieving comprehensive and uniform pressing of the chip and effectively avoiding excessive local pressure.

[0038] The outer wall of the fixing bar 6651 is fixedly connected to the side wall inside the fixing frame 662, one end of the compression spring 6653 is fixedly connected to the outer wall of the fixing bar 6651, the other end of the compression spring 6653 is fixedly connected to the outer wall of the connecting block 6654, and the outer surface of the top of the pressing plate 6656 is fixedly connected to the outer wall of the bottom of the fixing bar 6651.

[0039] The connecting device 61 includes a connecting plate 611, the inner wall of the connecting plate 611 is fixedly connected to the outer wall of the cylinder 65 through a through hole 612, the outer wall of the connecting plate 611 is symmetrically provided with movable grooves 613, the inner wall of the connecting plate 611 is fixedly connected to a fixing cylinder 614, and the buffer device 67 includes a multi-stage damping rod 671, the outer wall of the multi-stage damping rod 671 is fixedly connected to a push plate 672, the outer wall of the push plate 672 is fixedly connected to a limiting block 673, the outer wall of the limiting block 673 is rotatably connected to a rotating rod 674, and the rotating rod 674 is away from the limiting block One end of 673 is rotatably connected to the limit frame 675. When the cylinder 65 is started, its output end pushes the contact device 66 downward. At the same time, the limit frame 675 drives the rotating rod 674 and the limit block 673 to move. The push plate 672 slides in the movable groove 613 and drives the multi-stage damping rod 671 to be pushed and squeezed. At this time, the multi-stage damping rod 671 is fixed in the fixed cylinder 614, and the other end is squeezed and contracted to play a buffering role, avoiding excessive impact force at the moment of pressing to cause damage to the chip, thereby ensuring the stability and safety of the pressing process.

[0040] The outer wall of the limit frame 675 is fixedly connected to the output end of the bottom of the cylinder 65 , the outer wall of the multi-stage damping rod 671 is fixedly connected to the inner wall of the fixed tube 614 , and the outer wall of the push plate 672 is slidably connected to the inner wall of the connecting plate 611 through the movable groove 613 .

[0041] The limiting device 2 includes a fixed block 21, the outer wall of the fixed block 21 is fixedly connected to a connecting rod 22, the end of the connecting rod 22 away from the fixed block 21 is fixedly connected to a DC motor 23, the output end of the DC motor 23 is fixedly connected to a bidirectional screw 24, the outer wall of the bidirectional screw 24 is threadedly connected to an internal thread frame 25, and a limiting groove 26 is provided in the wall of the internal thread frame 25. The limiting device 2 cooperates with the movable limiting plate 5 to adjust and limit the position of the dividing frame 7, wherein the fixed block 21 of the limiting device 2 is fixed to the outer wall of the base 1, the connecting rod 22 connects the fixed block 21 and the DC motor 23, and the bidirectional screw 24 at the output end of the DC motor 23 is threadedly connected to the internal thread frame 25. When the DC motor 23 is started, the bidirectional screw 24 rotates to control the internal thread frame 25 to be relatively close or relatively far away, thereby limiting it according to the width of the packaged chip, and by controlling the rotation angle and time of the DC motor 23, it is ensured that the chip is accurately positioned during the packaging process.

[0042] The outer wall of the fixed block 21 and the outer wall of the connecting rod 22 are fixedly connected to the outer wall of the base 1, the outer wall of the internal threaded frame 25 is slidably connected to the outer wall of the connecting rod 22, the outer wall of the internal threaded frame 25 is slidably connected to the outer wall of the base 1, the outer wall of the DC motor 23 is fixedly connected to the outer wall of the base 1, the end of the bidirectional screw 24 away from the DC motor 23 is rotatably connected to the inner wall of the fixed block 21, and the outer wall of the internal threaded frame 25 is slidably connected to the outer wall of the dividing frame 7 through the limit groove 26.

[0043] When in use, the base 1 serves as the basic supporting structure of the entire device, providing a stable installation platform for other devices. The servo motor 3 is fixed to the outer wall of the base 1. When the servo motor 3 is started, its output end drives the adjusting screw 4 to rotate. Since the adjusting screw 4 is threadedly connected to the limit plate 5, and the side wall of the limit plate 5 is slidably connected to the outer wall of the base 1, the limit plate 5 will move smoothly along the vertical direction of the base 1 under the drive of the adjusting screw 4. The position of the limit plate 5 is controlled by this design, and a positioning reference is provided for the subsequent operation of the pressing device 6 and the dividing frame 7. At the same time, the position of the pressing device 6 can be adjusted according to the ratio, which is convenient for pressing processing according to integrated circuit chips of different sizes and packaging requirements, and the pressing position can be flexibly adjusted, thereby improving the versatility and adaptability of the device.

[0044] The limiting device 2 cooperates with the movable limiting plate 5 to adjust and limit the position of the dividing frame 7, wherein the fixed block 21 of the limiting device 2 is fixed to the outer wall of the base 1, the connecting rod 22 connects the fixed block 21 and the DC motor 23, and the bidirectional screw 24 at the output end of the DC motor 23 is threadedly connected with the internal thread frame 25. When the DC motor 23 is started, the bidirectional screw 24 rotates to control the internal thread frame 25 to be relatively close or relatively far away, thereby limiting according to the width of the packaged chip. By controlling the rotation angle and time of the DC motor 23, it is ensured that the chip is accurately positioned during the packaging process, and the consistency of the packaging is improved;

[0045] The pressing device 6 is the working part for realizing the chip packaging pressing operation. The connecting plate 611 of the connecting device 61 is fixedly connected to the outer wall of the cylinder 65 through the through hole 612, and the outer wall of the connecting plate 611 is symmetrically provided with a movable groove 613, and the inner wall is fixed with a fixed cylinder 614. The outer wall of the multi-stage damping rod 671 of the buffer device 67 is fixedly connected to the inner wall of the fixed cylinder 614, and the outer wall of the push plate 672 is slidably connected to the inner wall of the connecting plate 611 through the movable groove 613. The limit block 673 is rotatably connected to the rotating rod 674, and the other end of the rotating rod 674 is rotatably connected to the limit frame 675. The frame 675 is fixedly connected to the output end at the bottom of the cylinder 65. When the cylinder 65 is started, its output end pushes the contact device 66 downward, and at the same time, the limit frame 675 drives the rotating rod 674 and the limit block 673 to move, and the push plate 672 slides in the movable groove 613, and drives the multi-stage damping rod 671 to be pushed and squeezed. At this time, the multi-stage damping rod 671 is fixed in the fixed cylinder 614, and the other end is squeezed and contracted, which will play a buffering role, avoiding excessive impact force at the moment of pressing to cause damage to the chip, ensuring the stability and safety of the pressing process, and improving the quality of chip packaging;

[0046] The contact device 66 directly contacts the chip during the pressing process, and its structural design can achieve uniform pressing of the chip, wherein the connecting shell 661 is fixed to the bottom output end of the cylinder 65, the internal fixed frame 662 fixes the partition block 663, the bearing plate 6641 of the pressure device 664 slides in the fixed frame 662 through the guide block 6642, the single-stage damping rod 6643 and the connecting plate 6644 are connected to the top of the fixed frame 662, the fixing bar 6651 of the unfolding device 665 is fixed to the inner side wall of the fixed frame 662, the telescopic rod 6652 is sleeved with a compression spring 6653, one end of the connecting block 6654 is connected to the telescopic rod 6652, and the other end is connected to the inclined block 6655 and the pressing plate 6656, when the bearing plate 6641 is pressed by the packaging part When the pressure is applied, the guide block 6642 slides along the inner wall of the fixed frame 662 and pushes the expansion device 665. The compression spring 6653 is compressed and the telescopic rod 6652 contracts. At this time, the carrier plate 6641 moved by the pressure will drive the guide block 6642 to move, and the moving guide block 6642 will push the inclined plane block 6655 to move. Under the limitation of the inclined plane setting and the telescopic rod 6652, the inclined plane block 6655 moves outward, and then the connecting block 6654 drives the pressing plate 6656 to expand outward, so that the pressing plate 6656 can contact the chip surface more evenly, thereby achieving comprehensive and uniform pressing of the chip, effectively avoiding packaging defects caused by excessive local pressure, and improving the reliability and stability of chip packaging.

[0047] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0048] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit chip packaging and processing device, comprising a base (1), characterized in that: The outer wall of the base (1) is fixedly connected to a servo motor (3), the output end of the servo motor (3) is fixedly connected to an adjusting screw (4), the outer wall of the adjusting screw (4) is threadedly connected to a limit plate (5), and the outer wall of the limit plate (5) is slidably connected to a dividing frame (7); A limiting device (2), wherein the outer wall of the limiting device (2) is fixedly connected to the outer wall of the base (1); A pressing device (6), wherein the outer wall of the pressing device (6) is slidably connected to the outer wall of the limiting plate (5); The pressing device (6) comprises a connecting device (61), the outer wall of the bottom of the connecting device (61) is symmetrically fixedly connected to a connecting frame (62), the outer wall of the connecting frame (62) is fixedly connected to a sliding frame (63), the outer wall of the sliding frame (63) is fixedly connected to a limiting axis (64), the outer wall of the connecting device (61) is fixedly connected to a cylinder (65), the output end of the bottom of the cylinder (65) is fixedly connected to a contact device (66), and the outer wall of the connecting device (61) is fixedly connected to a buffer device (67); The contact device (66) comprises a connecting shell (661), the inner side wall of the connecting shell (661) is fixedly connected to a fixing frame (662), the inner side wall of the fixing frame (662) is fixedly connected to a partition block (663), the inner top of the fixing frame (662) is fixedly connected to a pressure device (664), and the outer wall of the pressure device (664) is slidably connected to an expansion device (665).

2. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The outer wall of the connecting shell (661) and the outer wall of the top of the fixed frame (662) are fixedly connected to the output end of the bottom of the cylinder (65), the outer wall of the limiting shaft (64) is slidably connected to the outer wall of the limiting plate (5), the side wall of the limiting plate (5) is slidably connected to the outer wall of the base (1), and the outer wall of the sliding frame (63) is fixedly connected to the inner wall of the base (1).

3. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The pressure-bearing device (664) comprises a bearing plate (6641), the outer wall of which is fixedly connected to a guide block (6642), the inner wall of which is fixedly connected to a single-stage damping rod (6643), the outer wall of the top of which is fixedly connected to a connecting plate (6644), and the outer wall of the top of which is fixedly connected to the top of the fixed frame (662).

4. The integrated circuit chip packaging and processing equipment according to claim 3, characterized in that: The unfolding device (665) comprises a fixing bar (6651), the outer wall of which is fixedly connected to a telescopic rod (6652), the outer part of which is sleeved with a compression spring (6653), the end of the telescopic rod (6652) away from the fixing bar (6651) is fixedly connected to a connecting block (6654), the outer wall at the top of the connecting block (6654) is fixedly connected to a slope block (6655), and the outer wall at the bottom of the connecting block (6654) is fixedly connected to a pressing plate (6656).

5. The integrated circuit chip packaging and processing equipment according to claim 4, characterized in that: The outer wall of the fixing bar (6651) is fixedly connected to the side wall inside the fixing frame (662), one end of the compression spring (6653) is fixedly connected to the outer wall of the fixing bar (6651), the other end of the compression spring (6653) is fixedly connected to the outer wall of the connecting block (6654), and the outer surface of the top of the pressing plate (6656) is fixedly connected to the outer wall of the bottom of the fixing bar (6651).

6. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The connecting device (61) comprises a connecting plate (611), the inner wall of the connecting plate (611) being fixedly connected to the outer wall of the cylinder (65) via a through hole (612), the outer wall of the connecting plate (611) being symmetrically provided with movable grooves (613), and the inner wall of the connecting plate (611) being fixedly connected to a fixing cylinder (614).

7. The integrated circuit chip packaging and processing equipment according to claim 6, characterized in that: The buffer device (67) comprises a multi-stage damping rod (671), the outer wall of the multi-stage damping rod (671) is fixedly connected to a push plate (672), the outer wall of the push plate (672) is fixedly connected to a limit block (673), the outer wall of the limit block (673) is rotatably connected to a rotating rod (674), and one end of the rotating rod (674) away from the limit block (673) is rotatably connected to a limit frame (675).

8. The integrated circuit chip packaging and processing equipment according to claim 7, characterized in that: The outer wall of the limit frame (675) is fixedly connected to the output end of the bottom of the cylinder (65), the outer wall of the multi-stage damping rod (671) is fixedly connected to the inner wall of the fixed cylinder (614), and the outer wall of the push plate (672) is slidably connected to the inner wall of the connecting plate (611) via a movable groove (613).

9. The integrated circuit chip packaging and processing equipment according to claim 1, characterized in that: The limiting device (2) comprises a fixed block (21), the outer wall of the fixed block (21) is fixedly connected to a connecting rod (22), one end of the connecting rod (22) away from the fixed block (21) is fixedly connected to a DC motor (23), the output end of the DC motor (23) is fixedly connected to a bidirectional screw rod (24), the outer wall of the bidirectional screw rod (24) is threadedly connected to an internal threaded frame (25), and a limiting groove (26) is provided in the wall of the internal threaded frame (25).

10. The integrated circuit chip packaging and processing equipment according to claim 9, characterized in that: The outer wall of the fixed block (21) and the outer wall of the connecting rod (22) are both fixedly connected to the outer wall of the base (1); the outer wall of the internally threaded frame (25) is slidably connected to the outer wall of the connecting rod (22); the outer wall of the internally threaded frame (25) is slidably connected to the outer wall of the base (1); the outer wall of the DC motor (23) is fixedly connected to the outer wall of the base (1); one end of the bidirectional screw (24) away from the DC motor (23) is rotatably connected to the inner wall of the fixed block (21); and the outer wall of the internally threaded frame (25) is slidably connected to the outer wall of the dividing frame (7) via a limiting groove (26).

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