Semiconductor process equipment and clamping device thereof

Abstract

The invention discloses semiconductor process equipment and a clamping device thereof, and belongs to the technical field of semiconductor manufacturing. The clamping device comprises a base, a plurality of clamping pieces and a driving mechanism, the clamping pieces are arranged on the base, the driving mechanism is used for driving the clamping pieces to move relative to the base so as to enable the clamping pieces to clamp or release a wafer, the driving mechanism comprises a first magnetic piece, a second magnetic piece and a transmission assembly, the first magnetic piece is located outside the base, and the second magnetic piece is located outside the base. The base is provided with a containing cavity, the second magnetic part and the transmission assembly are both located in the containing cavity, the second magnetic part is connected with the clamping parts through the transmission assembly, and under the condition that the first magnetic part moves relative to the second magnetic part, the second magnetic part drives the clamping parts to move through the transmission assembly. The semiconductor process equipment comprises a process chamber and the clamping device, wherein the clamping device is arranged in the process chamber. Therefore, the base does not need to be provided with a channel, the base is relatively sealed, the clamping piece is not easily influenced by the process environment, and the wafer can be smoothly clamped.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor manufacturing technology, and specifically relates to a semiconductor process equipment and a clamping device thereof. Background Art

[0002] In the field of semiconductor manufacturing technology, during the process of cleaning the wafer, a clamping device clamps the wafer and drives the wafer to rotate, so that the wafer can achieve a relatively good process effect during the process.

[0003] In the related art, the clamping device includes a base, a plurality of clamping members and a driving mechanism. The clamping members and the driving mechanism are both arranged on the base. The driving mechanism is connected to each clamping member to drive each clamping member to move relative to the wafer to achieve the clamping and release of the wafer. Specifically, the driving mechanism includes a lever, a driving gear and a plurality of planetary gears. The driving gear and the planetary gears are located inside the base. The lever extends into the base from the outside of the base and is connected to the driving gear. The driving gear is respectively meshed with each planetary gear, and the planetary gears are connected to the clamping members one by one. In this way, the lever is controlled from the outside of the base, the lever drives the driving gear to rotate, and the driving gear drives each planetary gear and each clamping member to rotate, thereby achieving the clamping and release of the wafer.

[0004] However, the base needs to be provided with a channel for the lever to pass through. Harmful corrosive gases such as water vapor and acid gas generated during the process can easily enter the interior of the base through the channel, causing problems such as jamming of the drive gear and the planetary gear, affecting the clamping and release of the wafer by the clamp. Summary of the invention

[0005] The purpose of the embodiments of the present application is to provide a semiconductor process equipment and a clamping device thereof, which can solve the problem in the related art that the wafer clamping mechanism is easily affected by the process environment, thereby affecting the clamping and releasing of the wafer.

[0006] In a first aspect, an embodiment of the present application provides a clamping device, which is applied to semiconductor process equipment. The clamping device includes a base, a plurality of clamping members, and a driving mechanism. The plurality of clamping members are all arranged on the base. The driving mechanism is used to drive the plurality of clamping members to move relative to the base so that the plurality of clamping members clamp or release the wafer. The driving mechanism includes a first magnetic part, a second magnetic part and a transmission assembly, the first magnetic part is located outside the base, the base is provided with a cavity, the second magnetic part and the transmission assembly are both located in the cavity, the second magnetic part is connected to each of the clamping parts through the transmission assembly, and when the first magnetic part moves relative to the second magnetic part, the second magnetic part drives each of the clamping parts to move through the transmission assembly.

[0007] In a second aspect, an embodiment of the present application further provides a semiconductor process equipment, comprising a process chamber and the above-mentioned clamping device, wherein the clamping device is arranged in the process chamber.

[0008] In an embodiment of the present application, a driving mechanism for driving the movement of the clamping member adopts a magnetic attraction structure, that is, the first magnetic member and the second magnetic member are moved relative to each other so that the two interact with each other to provide a clamping driving force for the clamping member. With this arrangement, the driving mechanism does not need to be provided with structures such as levers and gears, and the base does not need to have channels for transmission members such as levers to pass through. The base is in a relatively sealed state, and harmful corrosive gases such as water vapor and acid gas generated during the process are not easy to enter the interior of the base, thereby preventing the clamping member from being affected by the process environment, which is conducive to the smooth clamping and release of the wafer by the clamping member. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a front view of the clamping device and the wafer when the first magnetic member and the second magnetic member are close to each other as disclosed in the embodiment of the present application; Figure 2 is a front view of the clamping device and the wafer when the first magnetic member and the second magnetic member are away from each other as disclosed in the embodiment of the present application; Figure 3 It is a partial structure of the clamping device disclosed in the embodiment of the present application and a front view of the wafer (excluding the first magnetic member); Figure 4 yes Figure 3 a cross-sectional view of the structure shown; Figure 5 is a schematic diagram of the structure of the clamping device disclosed in the embodiment of the present application; Figure 6 is a top view of a heating plate disclosed in an embodiment of the present application; Figure 7 is a front view of a heating plate disclosed in an embodiment of the present application; Figure 8 is a bottom view of the heating plate disclosed in the embodiment of the present application; Fig. 9 is a front view of the matching structure of the base and the clamping member disclosed in the embodiment of the present application; Fig.10 yes Fig. 9 A cross-sectional view of the base along the AA direction; Fig.11 yes Figure 3 Sectional view at the middle BB; Fig.12 It is one of the partial structural schematic diagrams of the driving mechanism disclosed in the embodiment of the present application; Fig.13 This is the second partial structural schematic diagram of the driving mechanism disclosed in the embodiment of the present application; Fig.14is a top view of a partial structure of a driving mechanism disclosed in an embodiment of the present application; Fig.15 yes Fig.14 Schematic diagram of the local structure in; Fig.16 yes Fig.15 a cross-sectional view of the structure shown; Fig.17 is a schematic diagram of the cooperation between the second magnetic member and the positioning magnetic member disclosed in the embodiment of the present application; Fig.18 This is the third partial structural schematic diagram of the driving mechanism disclosed in the embodiment of the present application; Fig.19 yes Fig.18 a top view of the structure shown; Fig. 20 yes Fig.18 a side view of the structure shown; Fig.21 It is one of the cross-sectional views of the local structure of the driving mechanism disclosed in the embodiment of the present application; Fig. 22 This is the second cross-sectional view of the local structure of the driving mechanism disclosed in the embodiment of the present application; Fig.23 is a schematic diagram of the cooperation between the first guide rail and the first slider disclosed in the embodiment of the present application; Fig.24 It is a schematic diagram of the coordination of the first guide rail, the first slider and the movable support disclosed in the embodiment of the present application; Fig.25 is a front view of a partial structure of a driving mechanism disclosed in an embodiment of the present application; Fig.26 yes Fig.25 Cross-sectional view along CC direction; Fig. 27 This is the fourth partial structural diagram of the driving mechanism disclosed in the embodiment of the present application; Fig.28 This is the fifth partial structural diagram of the driving mechanism disclosed in the embodiment of the present application; Fig.29 is a front view of the matching structure of the moving cam, the sliding member and the clamping member disclosed in the embodiment of the present application; Fig.30 It is one of the matching schematic diagrams of the movable cam, the sliding member and the clamping member disclosed in the embodiment of the present application; Fig.31 This is the second schematic diagram of the cooperation of the moving cam, the sliding member and the clamping member disclosed in the embodiment of the present application; Fig.32 This is the third schematic diagram of the cooperation of the moving cam, the sliding member and the clamping member disclosed in the embodiment of the present application; Fig.33It is one of the structural schematic diagrams of the movable cam disclosed in the embodiment of the present application; Fig.34 This is the second structural schematic diagram of the movable cam disclosed in the embodiment of the present application; Fig.35 is a schematic diagram of the cooperation between the second guide rail and the second slider disclosed in the embodiment of the present application; Fig.36 It is a partial structure of a clamping device disclosed in another embodiment of the present application and a front view of a wafer (excluding the first magnetic member).

[0010] Description of reference numerals: 100-base, 100a-cavity, 100b-clamping channel, 110-frame, 111-rotating support, 1111-bearing, 112-moving support, 1121-second slide rail, 121-first slide rail, 200-clamping member, b-second axis, 300-driving mechanism, 310-first magnetic member, 320-second magnetic member, 321-binding belt, 330-transmission assembly, 331-rotating lever, a-first axis, 332-strip moving member, 3321-top block, 3322-second slider, 333-moving cam, 333a-slide groove, 333b-protrusion, 333c-supporting part, 3331-first slider, 334-sliding member, 335-first elastic member, 336-second elastic member, 337-positioning magnetic member, 338-clamping connecting rod, 3381-fastener, 400-heating plate, 400a-heating area, 410-heating element, 420-telecommunication interface, 430-cooling liquid circulation interface, 500 - rotation drive mechanism, 510 - first permanent magnet, 520 - first electromagnet, 530 - second permanent magnet, 540 - second electromagnet, 600-temperature detection element, 700-Injection parts, S-wafer. DETAILED DESCRIPTION

[0011] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0012] The terms "first", "second", etc. in the specification and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable under appropriate circumstances, so that the embodiments of the present application can be implemented in an order other than those illustrated or described here, and the objects distinguished by "first", "second", etc. are generally of one type, and the number of objects is not limited. For example, the first object can be one or more. In addition, "and / or" in the specification and claims represents at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0013] The semiconductor process equipment and the clamping device thereof provided in the embodiments of the present application are described in detail below through specific embodiments and their application scenarios in combination with the accompanying drawings.

[0014] Please refer to Figure 1-Figure 36 The clamping device disclosed in the embodiment of the present application is applied to semiconductor process equipment. The clamping device is used to clamp a wafer S but is not limited to the wafer S. The shape of the wafer S can be but is not limited to a fin shape. The clamping device includes a base 100, a plurality of clamping members 200 and a driving mechanism 300, wherein the base 100 is a basic component and can be used as an installation base for the plurality of clamping members 200 and the driving mechanism 300.

[0015] Multiple clamping members 200 are all arranged on the base 100, and the driving mechanism 300 is used to drive the multiple clamping members 200 to move relative to the base 100, so that the multiple clamping members 200 clamp or release the wafer S. Optionally, the clamping member 200 can be but is not limited to a clamping rod, and the embodiment of the present application does not limit the specific structure of the clamping member 200. Each clamping member 200 is rotatably arranged on the base 100, and the driving mechanism 300 is used to drive the multiple clamping members 200 to rotate relative to the base 100, so that the multiple clamping members 200 clamp or release the wafer S; or, each clamping member 200 is movably arranged on the base 100, and the driving mechanism 300 is used to drive the multiple clamping members 200 to move relative to the base 100, so that the multiple clamping members 200 clamp or release the wafer S.

[0016] Specifically, refer to Figure 1-Figure 2 as well as Figure 4As shown, the driving mechanism 300 includes a first magnetic member 310, a second magnetic member 320 and a transmission assembly 330, wherein the first magnetic member 310 and the second magnetic member 320 interact with each other to generate power to drive the clamping member 200 to move, and the transmission assembly 330 is used to transmit the power to the clamping member 200. The first magnetic member 310 is located outside the base 100, and the base 100 is provided with a cavity 100a, and the second magnetic member 320 and the transmission assembly 330 are both located in the cavity 100a, that is, the second magnetic member 320 and the transmission assembly 330 are both located inside the base 100. The second magnetic member 320 is connected to each clamping member 200 through the transmission assembly 330, and optionally, the second magnetic member 320 and the transmission assembly 330, and the transmission assembly 330 and the clamping member 200 can be connected by welding, bonding, bolting, etc.

[0017] When the first magnetic member 310 moves relative to the second magnetic member 320, the second magnetic member 320 drives each clamping member 200 to move through the transmission assembly 330. Figure 1 As shown, when the first magnetic member 310 approaches the second magnetic member 320, the interaction force between the first magnetic member 310 and the second magnetic member 320 increases, the second magnetic member 320 moves relative to the base 100, and the second magnetic member 320 drives each clamping member 200 to move through the transmission assembly 330, thereby achieving clamping and release of the wafer S.

[0018] Optionally, the first magnetic member 310 and the second magnetic member 320 may be a strip structure, a block structure, etc. The embodiment of the present application does not limit the specific structure of the first magnetic member 310 and the second magnetic member 320. When the magnetic poles of the first magnetic member 310 and the second magnetic member 320 are the same, when the first magnetic member 310 approaches the second magnetic member 320, the repulsive force between the two increases. When the magnetic poles of the first magnetic member 310 and the second magnetic member 320 are opposite, when the first magnetic member 310 approaches the second magnetic member 320, the attractive force between the two increases.

[0019] In the embodiment of the present application, the driving mechanism 300 that drives the clamping member 200 to move adopts a magnetic attraction structure, that is, the first magnetic member 310 and the second magnetic member 320 move relative to each other so that the two interact with each other to provide a clamping driving force for the clamping member 200. With this arrangement, the driving mechanism 300 does not need to be provided with structures such as levers and gears, and the base 100 does not need to have a channel for the transmission parts such as levers to pass through. The base 100 is in a relatively sealed state, and harmful corrosive gases such as water vapor and acid gas generated during the process are not easy to enter the interior of the base 100, thereby preventing the clamping member 200 from being affected by the process environment, which is conducive to the clamping member 200 to smoothly clamp and release the wafer S.

[0020] In an alternative embodiment, reference Figure 5As shown, each clamping member 200 is rotatably disposed on the base 100 , and each clamping member 200 is provided with an action structure. When the clamping member 200 rotates relative to the base 100 , each action structure directly contacts the edge of the wafer S to clamp and fix the wafer S together.

[0021] The transmission assembly 330 includes a movable cam 333 and a clamping link 338. The movable cam 333 is transmission-connected to the second magnetic member 320. The movable cam 333 is movably disposed on the base 100 along a first direction. The first direction intersects with the rotation axis of the clamping member 200. When the second magnetic member 320 moves, it can drive the movable cam 333 to move along the first direction. Optionally, the movable cam 333 can be movably disposed on the base 100 through a matching first slider 3331 and a first slide rail 121.

[0022] Specifically, refer to Figure 27-Figure 28 as well as Fig.35 As shown, the base 100 is provided with a frame 110, and one of the frame 110 and the movable cam 333 is provided with a first slide rail 121, and the other is provided with a first slider 3331, the first slide rail 121 extends along a first direction, and the first slide rail 121 and the first slider 3331 are slidably matched, so that the matched first slider 3331 and the first slide rail 121 provide guidance for the moving direction of the movable cam 333. Of course, the movable cam 333 can also be movably arranged on the base 100 through other structures; the first direction can be perpendicular to the rotation axis of the clamping member 200, that is, the first direction is a horizontal direction, or the first direction can intersect with the rotation axis of the clamping member 200 but not perpendicular; the clamping link 338 is connected to the clamping member 200, optionally, the clamping link 338 and the clamping member 200 can be connected by a fastener 3381 such as a screw, of course, the two can also be connected by other means.

[0023] refer to Figure 29-Figure 32 As shown, one of the clamping link 338 and the moving cam 333 is provided with a slide groove 333a, and the other is provided with a sliding member 334, the sliding member 334 extends into the slide groove 333a, and the sliding member 334 and the slide groove 333a are slidably matched.

[0024] Specifically, the clamping link 338 is provided with a slide groove 333a, and the moving cam 333 is provided with a sliding member 334; or, the clamping link 338 is provided with a sliding member 334, and the moving cam 333 is provided with a sliding member 334, and optionally, the sliding member 334 can be a cylindrical pin, a square cylindrical pin, etc., and the sliding member 334 and the clamping link 338 can be fixedly connected by welding, bonding, etc. In this way, the second magnetic member 320 can drive the moving cam 333 to move along the first direction, and the moving cam 333 drives the clamping link 338 and the clamping member 200 to rotate through the sliding member 334 and the slide groove 333a. In other words, the moving power of the moving cam 333 is converted into the rotational power of the clamping link 338 and the clamping member 200 through the sliding member 334 and the slide groove 333a.

[0025] With this embodiment, the transmission assembly 330 can convert the moving power into the rotational power of the clamping member 200 by moving the cam 333 and the clamping link 338, as well as the matching sliding member 334 and the slide groove 333a, so that the clamping member 200 can smoothly clamp and release the wafer S.

[0026] Optionally, refer to Fig.10 As shown, along the circumference of the base 100, the base 100 is provided with a plurality of clamping channels 100b at intervals, and the clamping members 200 correspond to the clamping channels 100b one by one. Each clamping member 200 passes through the corresponding clamping channel 100b and extends from the upper end surface of the base 100. Each clamping member 200 can rotate relative to the corresponding clamping channel 100b to clamp and release the wafer S. The rotation axis of each clamping member 200 is parallel to the axis of the base 100, that is, the rotation axis of the clamping member 200 is parallel to the vertical direction; refer to Fig.29 As shown, the rotation axis of the clamping member 200 is the second axis b.

[0027] Of course, in other embodiments, the transmission assembly 330 may also include other structures in addition to the moving cam 333 and the clamping link 338. The specific structure of the transmission assembly 330 is not limited to the above embodiment, and it can convert the moving power provided by the interaction between the first magnetic component 310 and the second magnetic component 320 into rotational power.

[0028] In an optional embodiment, the transmission assembly 330 also includes a first driving member, which is connected to the movable cam 333. The first driving member can be an electric driving member such as a linear module, an electric cylinder, or a pneumatic driving member such as a cylinder. The first driving member drives the movable cam 333 to move in the opposite direction of the first direction to reset the movable cam 333.

[0029] In another embodiment, reference Figure 25-26 as well as Fig.28As shown, the transmission assembly 330 also includes a first elastic member 335, and the first elastic member 335 can be but is not limited to a spring. The first end of the first elastic member 335 is connected to the movable cam 333, and the second end of the first elastic member 335 is connected to the base 100. In the process of the second magnetic member 320 driving the movable cam 333 to move relative to the base 100, the first elastic member 335 produces elastic deformation. When the first magnetic member 310 moves away from the second magnetic member 320, the magnetic force exerted on the second magnetic member 320 gradually disappears. The elastic force generated by the first elastic member 335 is the main driving force. The first elastic member 335 restores the elastic deformation and drives the movable cam 333 to reset in the reverse direction.

[0030] Optionally, the first end of the first elastic member 335 and the movable cam 333 can be connected by welding, bonding, etc., the base 100 is provided with a frame 110, and the second end of the first elastic member 335 and the frame 110 are connected by welding, bonding, etc., so that the first elastic member 335 is indirectly connected to the base 100. Further optionally, referring to Figure 32-Figure 34 As shown, the movable cam 333 is provided with a supporting portion 333 c protruding from the surface of the movable cam 333 , the first end of the first elastic member 335 directly abuts against the supporting portion 333 c , and the second end of the first elastic member 335 directly abuts against the frame 110 .

[0031] With this embodiment, the transmission assembly 330 directly utilizes the elastic force of the first elastic member 335 to drive the movable cam 333 to reset in the opposite direction, without the need to provide an electric drive member or a pneumatic drive member, thereby avoiding the inability to timely drive the movable cam 333 to reset due to power failure or air failure, thereby ensuring that the movable cam 333 is reset smoothly.

[0032] In an optional embodiment, the number of the movable cam 333, the first magnetic member 310 and the second magnetic member 320 are all multiple, and the movable cam 333, the clamping member 200, the first magnetic member 310 and the second magnetic member 320 correspond to each other one by one.

[0033] In another embodiment, reference Fig.13 , Figure 18-Figure 22 As shown, the transmission assembly 330 further includes a strip-shaped moving member 332 , which is movably disposed on the base 100 , and the strip-shaped moving member 332 is transmission-connected to the second magnetic member 320 .

[0034] Optionally, the moving direction of the strip moving member 332 is a first direction, referring to Fig.14 , Figure 18-Figure 20As shown, the frame 110 of the base 100 is provided with a movable support 112, one of the movable support 112 and the strip-shaped moving member 332 is provided with a second slide rail 1121, and the other is provided with a second slider 3322, the second slide rail 1121 extends along the first direction, and the second slide rail 1121 and the second slider 3322 are slidably matched, so that the matched second slider 3322 and the second slide rail 1121 are guided for the moving direction of the strip-shaped moving member 332, of course, the strip-shaped moving member 332 can also be movably arranged on the base 100 through other structures, and the strip-shaped moving member 332 can also move in other directions other than the first direction. Further optionally, the two ends of each strip-shaped moving member 332 are respectively provided with a second slider 3322 and a second slide rail 1121, that is, each strip-shaped moving member 332 corresponds to two groups of matched second sliders 3322 and second slide rails 1121.

[0035] refer to Fig.18 As shown, along the direction in which the strip-shaped moving member 332 extends, both ends of the strip-shaped moving member 332 are provided with top blocks 3321, and the top blocks 3321 correspond to the moving cams 333 one by one. In other words, each strip-shaped moving member 332 corresponds to two moving cams 333 through two top blocks 3321. The second magnetic member 320 can drive the strip-shaped moving member 332 to move, and the strip-shaped moving member 332 acts on the corresponding moving cams 333 through the top blocks 3321, so as to drive at least two moving cams 333 to move along the first direction.

[0036] Optionally, the top block 3321 can be a top rod, or other structures. In short, the top block 3321 protrudes from the surface of the strip-shaped moving part 332 and can act on the corresponding moving cam 333; the top block 3321 can be connected to the strip-shaped moving part 332 by welding, bonding, etc.

[0037] Optionally, refer to Figure 32-Figure 34 As shown, the movable cam 333 is provided with a protrusion 333b, the protrusion 333b protrudes from the surface of the movable cam 333, the top block 3321 acts on the protrusion 333b, and the protrusion 333b and the support portion 333c are respectively located on two opposite sides of the movable cam 333. Further optionally, the movable cam 333, the protrusion 333b, and the support portion 333c can be an integrated structure, or the three can be a split structure.

[0038] In this embodiment, a strip-shaped moving member 332 is added to the transmission assembly 330, and each second magnetic member 320 can drive at least two moving cams 333 to move along the first direction through the strip-shaped moving member 332, which is beneficial to reducing the number of first magnetic members 310 and second magnetic members 320, reducing the number of components of the transmission assembly 330, and helping to simplify the structure of the clamping device.

[0039] In a further embodiment, reference Figure 13-Figure 16 As shown, the transmission assembly 330 also includes a rotating lever 331, which is rotatably disposed on the base 100. Optionally, the frame 110 of the base 100 is provided with two rotating supports 111, and the two ends of the rotating lever 331 are respectively rotatably disposed on the two rotating supports 111. Specifically, the rotating support 111 is provided with an axial hole, and the end of the rotating lever 331 passes through the axial hole, and the rotating lever 331 is rotatably matched with the axial hole. Further, optionally, the transmission assembly 330 also includes a bearing 1111, the bearing 1111 is located in the axial hole, and the bearing 1111 is sleeved on the end of the rotating lever 331, which is conducive to reducing the friction force of the rotating lever 331 during the rotation process.

[0040] The second magnetic member 320 is connected to the rotating lever 331. Optionally, the transmission assembly 330 further includes a strap 321. The second magnetic member 320 and the rotating lever 331 are connected via the strap 321, so that the second magnetic member 320 is fixed relative to the rotating lever 331. Further, optionally, the rotating lever 331 is provided with an embedding groove, and the second magnetic member 320 is disposed in the embedding groove. Of course, the second magnetic member 320 and the rotating lever 331 can also be fixedly connected by welding, bonding, etc.

[0041] The rotating lever 331 is in transmission connection with the strip-shaped moving member 332. The second magnetic member 320 can drive the rotating lever 331 to rotate relative to the base 100, and the rotating lever 331 drives the strip-shaped moving member 332 to move relative to the base 100.

[0042] Optionally, the rotation axis of the rotating lever 331 is the first axis a, the first axis a is parallel to the moving direction of the strip-shaped moving member 332, the rotating lever 331 and the strip-shaped moving member 332 are transmission-coordinated in the spiral direction of the first axis a, and the transmission coordination can be realized specifically through a threaded structure, or the rotation axis of the rotating lever 331 intersects with the moving direction of the strip-shaped moving member 332, the rotating lever 331 and the strip-shaped moving member 332 are transmission-connected through a telescopic rod group, that is, the first end of the telescopic rod group is rotationally connected to the rotating lever 331, and the second end of the telescopic rod group is rotationally connected to the strip-shaped moving member 332, when the rotating lever 331 rotates, the telescopic rod group is driven to move, and the telescopic rod group drives the strip-shaped moving member 332 to move. In short, when the rotating lever 331 rotates around the first axis a, the strip-shaped moving member 332 can move along the first direction. The embodiment of the present application does not limit the transmission structure between the rotating lever 331 and the strip-shaped moving member 332.

[0043] In this embodiment, a rotating lever 331 is added to the transmission assembly 330, and the magnetic force borne by the second magnetic member 320 overcomes the rotational friction of the rotating lever 331, so that the strip moving member 332 can be driven to move by the rotating lever 331. Compared with the solution in which the second magnetic member 320 directly drives the strip moving member 332 to move and needs to overcome the gravity of the strip moving member 332, the magnetic force required to achieve rotation in the embodiment of the present application is smaller, which is beneficial to reducing the volume of the first magnetic member 310 and the second magnetic member 320, and is beneficial to improving sensitivity.

[0044] Of course, in other embodiments, the transmission assembly 330 may not be provided with a rotating lever 331, and the second magnetic member 320 and the strip-shaped moving member 332 may be directly connected. When the first magnetic member 310 approaches the second magnetic member 320, the second magnetic member 320 directly drives the strip-shaped moving member 332 to move relative to the base 100.

[0045] In an optional embodiment, the transmission assembly 330 also includes a second driving member, which is connected to the strip-shaped moving member 332. The second driving member can be an electric driving member such as a linear module, an electric cylinder, or a pneumatic driving member such as a cylinder. The second driving member drives the strip-shaped moving member 332 to move in the opposite direction of the first direction to reset the strip-shaped moving member 332.

[0046] In another embodiment, reference Fig.18 , Figure 20-22 As shown, the transmission assembly 330 also includes a second elastic member 336, and the second elastic member 336 can be but is not limited to a spring. The first end of the second elastic member 336 is connected to the strip movable member 332, and the second end of the second elastic member 336 is connected to the base 100. In the process of the second magnetic member 320 driving the strip movable member 332 to move relative to the base 100, the second elastic member 336 produces elastic deformation. When the first magnetic member 310 moves away from the second magnetic member 320, the magnetic force exerted on the second magnetic member 320 gradually disappears, and the elastic force generated by the second elastic member 336 is the main driving force. The second elastic member 336 restores the elastic deformation and drives the strip movable member 332 to reset in the reverse direction.

[0047] Optionally, the first end of the second elastic member 336 can be connected to the strip-shaped moving member 332 by welding, bonding, etc., the base 100 is provided with a frame 110, and the second end of the first elastic member 335 is connected to the frame 110 by welding, bonding, etc., so that the first elastic member 335 is indirectly connected to the base 100. Further optionally, the first end of the first elastic member 335 directly abuts against the strip-shaped moving member 332, and the second end of the second elastic member 336 directly abuts against the frame 110.

[0048] With this embodiment, the transmission assembly 330 directly utilizes the elastic force of the second elastic member 336 to drive the strip-shaped moving member 332 to reset in the opposite direction, without the need to set up an electric drive member or a pneumatic drive member, thereby avoiding the inability to timely drive the strip-shaped moving member 332 to reset due to power outages or air outages, thereby ensuring that the strip-shaped moving member 332 is reset smoothly.

[0049] In the scheme of this application, reference is made to Fig.17 As shown, the transmission assembly 330 also includes a positioning magnetic member 337, and the positioning magnetic member 337 is connected to the base 100. The first magnetic member 310 and the second magnetic member 320 interact with each other to drive the second magnetic member 320 to move from the first position to the second position. The first position is the initial position of the second magnetic member 320. When the second magnetic member 320 is located at the first position, the distance between the first magnetic member 310 and the second magnetic member 320 is relatively far, and the magnetic force between the two is relatively small or there is no magnetic force; when the second magnetic member 320 is located at the second position, the distance between the first magnetic member 310 and the second magnetic member 320 is relatively close, and the magnetic force between the two is relatively large.

[0050] When the second magnetic member 320 is located at the first position, that is, when the magnetic force between the first magnetic member 310 and the second magnetic member 320 is small or there is no magnetic force, the second magnetic member 320 and the positioning magnetic member 337 are attracted to each other.

[0051] Optionally, the positioning magnetic component 337 can be arranged on the rotating support 111, and the positioning magnetic component 337 and the rotating support 111 can be connected by welding, bonding, etc.; the positioning magnetic component 337 can be an electromagnet, and the positioning magnetic component 337 generates magnetism when power is supplied, or the positioning magnetic component 337 can be a permanent magnet. In short, when the second magnetic component 320 is not subjected to the magnetic force of the first magnetic component 310, the positioning magnetic component 337 can magnetically adsorb the second magnetic component 320.

[0052] In this embodiment, the base 100 is additionally provided with a positioning magnetic component 337, which is used to position the second magnetic component 320 when it is not subjected to magnetic force or the magnetic force subjected to it is small, so as to prevent the second magnetic component 320 from moving randomly due to other forces.

[0053] Of course, in other embodiments, the transmission assembly 330 may not be provided with the positioning magnetic component 337. When the second magnetic component 320 is located at the first position, the second magnetic component 320 can be kept in a fixed position by relying on the friction force between the second magnetic component 320 and the component to which it is connected.

[0054] In an optional embodiment, the number of the transmission assembly 330 , the first magnetic component 310 , and the second magnetic component 320 are all one.

[0055] In another embodiment, along the circumference of the base 100, the transmission assembly 330, the first magnetic member 310 and the second magnetic member 320 are respectively arranged in multiple intervals, and the transmission assembly 330, the first magnetic member 310 and the second magnetic member 320 correspond to each other. Optionally, along the circumference of the base 100, the transmission assembly 330, the first magnetic member 310 and the second magnetic member 320 are respectively arranged in two intervals, the number of the strip-shaped moving members 332 is two, and the number of the moving cam 333, the clamping link 338 and the clamping member 200 are all four.

[0056] With this embodiment, the number of transmission components 330, first magnetic components 310 and second magnetic components 320 is increased, and each group of first magnetic components 310 and second magnetic components 320 drives different clamping components 200 to move through different transmission components 330. Therefore, more clamping components 200 do not need to be provided with driving force by structures such as levers and gears, and the number of channels opened on the base 100 for transmission components such as levers to pass through is smaller, which is beneficial to further improve the sealing performance of the base 100, further prevent harmful corrosive gases such as water vapor and acid gas generated in the process from entering the interior of the base 100, and is more conducive to the clamping component 200 to smoothly clamp and release the wafer S.

[0057] In the scheme of this application, reference is made to Figure 4 and Figure 5 As shown, the clamping device also includes a heating plate 400 and a rotating drive mechanism 500. The heating plate 400 and the rotating drive mechanism 500 are both arranged in the cavity 100a. The heating plate 400 is provided with a heating element 410. The heating element 410 can be a heating rod, a heating wire or other structures. The embodiment of the present application does not limit the specific type of the heating element 410. The heating element 410 is used to heat the wafer S clamped by the clamp 200. Specifically, the heating element 410 is used to heat the back of the wafer S, that is, to heat the bottom surface of the wafer S. Optionally, the cavity 100a can be a circular cavity, and the heating plate 400 is a disc-shaped structure, or the cavity 100a can be a square cavity, and the heating plate 400 is a square disc-mounted structure. The embodiment of the present application does not limit the specific structure of the heating plate 400 and the cavity 100a; the heating plate 400 can be directly placed in the cavity 100a.

[0058] The rotation drive mechanism 500 is connected to the heating plate 400, and is used to adjust the rotation state of the heating plate 400 relative to the base 100. Optionally, the rotation drive mechanism 500 can be a driving source that provides rotational power for a pneumatic motor, an electric motor, etc., and by adjusting the working state of the rotation drive mechanism 500, it is possible to adjust whether the heating plate 400 rotates relative to the base 100, and further adjust the rotation speed and rotation direction of the heating plate 400 relative to the base 100.

[0059] Optionally, refer to Figure 8As shown, the heating plate 400 is provided with a telecommunication interface 420 and a cooling liquid circulation interface 430, wherein the number of the telecommunication interfaces 420 is at least two, which are used to supply power and communicate to the heating element 410, and the number of the cooling liquid circulation interfaces 430 is two, which are used to allow the cooling liquid to flow in and out, respectively. Since the output power of the heating element 410 is relatively high, only the back side of the wafer S is heated, and other components inside the base 100 cannot be baked for a long time, so the cooling liquid is used to cool down other components, thereby reducing the temperature radiation of the heating plate 400 to other components inside the base 100.

[0060] In this embodiment, the clamping device is provided with a heating plate 400, which can heat the wafer S clamped by the clamping device, which is conducive to heating the wafer S to the process temperature, and there is no need to use a heating device other than the clamping device to heat the wafer S. Moreover, in the process of the base 100 driving the wafer S to rotate, the heating plate 400 is driven to rotate relative to the base 100 by the rotary drive mechanism 500, and the rotation state of the heating plate 400 relative to the wafer S can be adjusted, thereby adjusting the degree of heating of a specific area of ​​the wafer S by the heating element 410, which is conducive to improving the heating uniformity of the wafer S.

[0061] In other embodiments, the clamping device may not be provided with the heating plate 400 and the rotation driving mechanism 500 , and when the clamping device clamps the wafer S, other heating devices are used to heat the wafer S.

[0062] In an optional embodiment, the rotation drive mechanism 500 includes a first permanent magnet 510 and a first electromagnet 520 relative to each other, one of the first permanent magnet 510 and the first electromagnet 520 is located in the cavity 100a and is disposed on the side wall of the cavity 100a, and the other is disposed on the side wall of the heating plate 400. Specifically, refer to Figure 6-Figure 8 As shown, the side wall of the heating plate 400 is provided with a first permanent magnet 510, referring to Fig.10 As shown, the side wall of the cavity 100a is provided with a first electromagnet 520; or, the side wall of the heating plate 400 is provided with a first electromagnet 520, and the side wall of the cavity 100a is provided with a first permanent magnet 510. Optionally, the first permanent magnet 510 can be a block structure, a strip structure, etc., and the first electromagnet 520 can be but not limited to an energized coil. In short, the first electromagnet 520 can generate a magnetic field when energized.

[0063] The first electromagnet 520 and the first permanent magnet 510 can interact with each other when the first electromagnet 520 is powered on, so as to drive the heating plate 400 to rotate relative to the base 100. Specifically, when the first electromagnet 520 is in the first powered-on state, the first electromagnet 520 generates a magnetic field, and the first electromagnet 520 interacts with the first permanent magnet 510 to drive the heating plate 400 to rotate relative to the base 100. Optionally, the heating plate 400 is a circular plate, the side wall of the heating plate 400 is provided with the first permanent magnet 510, and the side wall of the cavity 100a is provided with the first electromagnet 520. When the first electromagnet 520 is in the first powered-on state, the power-on direction of the first electromagnet 520 is the first direction, the first electromagnet generates a magnetic field, the first electromagnet 520 and the first permanent magnet 510 repel each other, and the repulsive force between the two has a component force in the tangential direction of the first permanent magnet 510, which is a torsional force, and the heating plate 400 is driven to rotate relative to the base 100 by the torsional force.

[0064] In this embodiment, the rotary drive mechanism 500 adopts a magnetic attraction structure, and provides a rotational driving force for the heating plate 400 through the interaction between the first permanent magnet 510 and the first electromagnet 520. Compared with a complex drive mechanism 300 using a pneumatic motor, an electric motor, etc., the rotary drive mechanism 500 has a simple structure and a small size, which is conducive to reducing the space occupied by the clamping device.

[0065] In a further embodiment, the rotation drive mechanism 500 further includes a second permanent magnet 530 and a second electromagnet 540 opposite to each other, one of which is disposed on the bottom wall of the cavity 100a, and the other is disposed on the bottom wall of the heating plate 400. Figure 8 As shown, the bottom wall of the heating plate 400 is provided with a second permanent magnet 530, referring to Fig.10 As shown, the bottom wall of the cavity 100a is provided with a second electromagnet 540, or the bottom wall of the heating plate 400 is provided with a second electromagnet 540, and the bottom wall of the cavity 100a is provided with a second permanent magnet 530. Optionally, the second permanent magnet 530 can be a block structure, a strip structure, etc., and the second electromagnet 540 can be but not limited to an energized coil. In short, the second electromagnet 540 can generate a magnetic field when energized.

[0066] The second electromagnet 540 and the second permanent magnet 530 can attract each other when the second electromagnet 540 is powered on, so that the heating plate 400 and the base 100 are relatively fixed. Specifically, when the second electromagnet 540 is powered on, the second electromagnet 540 generates a magnetic field, and the second electromagnet 540 and the second permanent magnet 530 attract each other, so that the heating plate 400 and the base 100 are relatively fixed. Optionally, a second permanent magnet 530 is provided on the bottom wall of the heating plate 400, and a second electromagnet 540 is provided on the bottom wall of the heating plate 400. When the second electromagnet 540 is in a power-on state and the first electromagnet is in a second power-on state, the power-on direction of the first electromagnet 520 is a second direction, which is opposite to the power-on direction of the first direction. The second electromagnet 540 and the second permanent magnet 530 are attracted to each other, and the first electromagnet and the first permanent magnet 510 are attracted to each other, so that the heating plate 400 and the base 100 are relatively fixed; or, when the second electromagnet 540 is in a power-on state and the first electromagnet 520 is in a power-off state, only the second electromagnet 540 and the second permanent magnet 530 are attracted to each other, so that the heating plate 400 and the base 100 are relatively fixed.

[0067] In this embodiment, the rotation drive mechanism 500 is further provided with a second electromagnet 540 and a second permanent magnet 530. When the second electromagnet 540 is energized, the magnetic attraction force between the second permanent magnet 530 and the second electromagnet 540 is used to maintain the heating plate 400 and the base 100 rotating at the same speed, thereby preventing the heating plate 400 from rotating relative to the base 100 by inertia.

[0068] In an optional embodiment of the wired communication connection, the number of the first electromagnet 520 and the number of the first permanent magnet 510 are both one.

[0069] In another embodiment, a plurality of first electromagnets 520 and first permanent magnets 510 are respectively arranged at intervals along the circumference of the base 100. Specifically, the first electromagnets 520 and first permanent magnets 510 may be respectively evenly distributed or unevenly distributed along the circumference of the base 100.

[0070] By adopting this embodiment, the number of the first electromagnet 520 and the first permanent magnet 510 is increased, and the interaction force between the first electromagnet 520 and the first permanent magnet 510 is increased, so the rotational driving force provided to the heating plate 400 is greater, which is beneficial to the rapid rotation of the heating plate 400 relative to the base 100, so as to quickly adjust the rotation speed of the heating plate 400, which is beneficial to the rapid temperature control of the wafer S.

[0071] In an optional embodiment, the number of the second electromagnet 540 and the number of the second permanent magnet 530 are both one.

[0072] In another embodiment, a plurality of second electromagnets 540 and second permanent magnets 530 are respectively arranged at intervals along the circumference of the base 100. Specifically, the second electromagnets 540 and second permanent magnets 530 may be respectively evenly distributed or unevenly distributed along the circumference of the base 100.

[0073] With this embodiment, the number of second electromagnets 540 and second permanent magnets 530 is increased, and the magnetic attraction force between the second electromagnets 540 and second permanent magnets 530 is increased, which is more conducive to the relative fixation of the heating plate 400 and the base 100, and the two maintain the same speed rotation, further preventing the heating plate 400 from rotating relative to the base 100 by inertia. In an optional embodiment, the heating disk 400 is provided with a heating area 400a, and a plurality of heating elements 410 are provided in the heating area 400a; or, along the circumference of the heating disk 400, the heating disk 400 is provided with a plurality of heating areas 400a, and each heating area 400a is provided with a heating element 410.

[0074] In another embodiment, reference Figure 6 As shown, along the circumference of the heating disk 400, the heating disk 400 is provided with a plurality of heating areas 400a, each heating area 400a is provided with a plurality of heating elements 410, each heating element 410 extends along the circumference of the heating disk 400, and the plurality of heating elements 410 in the same heating area 400a are arranged at intervals along the radial direction of the heating disk 400. Optionally, the heating elements 410 in different heating areas 400a are powered separately, the heating disk 400 is a disk, each heating element 410 is a sector area, each heating element 410 is an arc structure, the number of heating elements 410 arranged in each heating area 400a is the same or different, and along the radial direction of the heating disk 400 and close to the center of the heating disk 400, the length of each heating element 410 decreases.

[0075] In this embodiment, the heating disk 400 is provided with a plurality of heating areas 400a in the circumferential direction of the heating disk 400, and different heating areas 400a correspond to different areas of the wafer S, respectively, so as to heat different circumferential areas of the wafer S at the same time. Moreover, along the radial direction of the heating disk 400, a plurality of heating elements 410 are arranged at intervals in each heating area 400a. Therefore, the plurality of heating elements 410 in the same heating area 400a heat different radial positions of the wafer S at the same time, which is more conducive to rapid heating of the wafer S and improves the temperature control uniformity of the back side of the wafer S.

[0076] In this embodiment, the number of heating areas 400a is 8.

[0077] Optionally, refer to Fig.36As shown, the clamping device further includes a spraying member 700, which is located above the base 100. The nozzle of the spraying member 700 can spray IPA (Isopropylamine, isopropylamine solution) onto the upper surface of the wafer S clamped by the clamping member 200 to dry the upper surface of the wafer S. Moreover, the spraying member 700 can move from the center of the wafer S to the edge of the wafer S, thereby spraying the isopropylamine solution onto the entire upper surface of the wafer S.

[0078] In summary, the working process of the clamping device in the embodiment of the present application is as follows: the first magnetic member 310 is controlled to approach the second magnetic member 320, the rotating lever 331 is rotated around the first axis a, the rotating lever 331 drives the strip moving member 332 and the moving cam 333 to move along the first direction, the moving cam 333 drives the clamping link 338 and the clamping member 200 to rotate around the second axis b through the sliding member 334 and the slide groove 333a, the clamping member 200 is opened, and a wafer transmission device such as a robot is used to place the wafer S in the area surrounded by the multiple clamping members 200; then the first magnetic member 310 is controlled to move toward the second magnetic member 320, and the wafer S is placed in the area surrounded by the plurality of ... first magnetic member 310 is moved toward the second magnetic member 320. 0 is away from the second magnetic member 320, under the elastic action of the second elastic member 336 and the magnetic attraction of the positioning magnetic member 337, the rotating lever 331 rotates in the opposite direction around the first axis a, the strip moving member 332 and the moving cam 333 move in the opposite direction, the clamping link 338 and the clamping member 200 rotate in the opposite direction around the second axis b to clamp the wafer S, and then the wafer S is processed, and the heating plate 400 rotates at the same speed as the base 100, and the heating element 410, the first electromagnet 520 and the second electromagnet 540 are controlled according to the temperature information detected by the temperature detection element 600.

[0079] When the process is completed, the first magnetic member 310 is controlled to approach the second magnetic member 320, and each clamping member 200 is rotated and opened again, and the wafer transfer device takes away the processed wafer S and puts in the unprocessed wafer S again.

[0080] Based on the clamping device disclosed in the present application, an embodiment of the present application also discloses a semiconductor process equipment, which includes a process chamber and the clamping device in the above embodiment. The process chamber provides a process environment, and the clamping device is arranged in the process chamber to ensure that the wafer S achieves a better process effect during the process.

[0081] Optionally, the semiconductor process equipment may be a single-wafer wet cleaning equipment, and the semiconductor process equipment may be used for a wafer S cleaning process.

[0082] In this embodiment, the clamping device of the semiconductor process equipment adopts a magnetic attraction structure to provide a clamping driving force for the clamping member 200. There is no need to set up structures such as levers and gears, and the base 100 does not need to have a channel for the lever and other transmission parts to pass through. The base 100 is in a relatively sealed state, and harmful corrosive gases such as water vapor and acid gas generated during the process are not easy to enter the interior of the base 100, thereby preventing the clamping member 200 from being affected by the process environment, which is conducive to the clamping member 200 to smoothly clamp and release the wafer S.

[0083] In the scheme of the present application, the clamping device includes a heating plate 400 and a rotating drive mechanism 500. The heating plate 400 and the rotating drive mechanism 500 are both arranged in the cavity 100a. The heating plate 400 is provided with a heating element 410, which is used to heat the wafer S clamped by the clamping member 200. The rotating drive mechanism 500 is connected to the heating plate 400 to drive the heating plate 400 to rotate.

[0084] refer to Fig.36 As shown, the semiconductor process equipment also includes a temperature detection element 600 and a control module. The temperature detection element 600 may be, but is not limited to, a temperature sensor. The temperature detection element 600 is used to detect the temperature of the wafer S. The temperature detection element 600, the heating element 410, and the rotation drive mechanism 500 are respectively connected to the control module for communication. The control module adjusts the heating state of the heating element 410 and the working state of the rotation drive mechanism 500 according to the temperature information detected by the temperature detection element 600, so as to maintain the temperature of the wafer S within a preset temperature range.

[0085] Specifically, during the process, the heating plate 400 rotates at the same speed as the base 100. When the temperature detection element 600 detects that the temperature of a certain area of ​​the wafer S is relatively low, the control module controls the output power of the heating element 410 to increase, and at the same time, adjusts the working state of the rotation drive mechanism 500 to reduce the rotation speed of the heating plate 400, and the heating plate 400 and the base 100 rotate at different speeds, so that the heating element 410 of the heating plate 400 is opposite to the area with a relatively low temperature of the wafer S, so that the heating element 410 fully heats the area, and the temperature of the area quickly rises to a preset temperature range.

[0086] It should be noted that the preset temperature range is a temperature range that is set according to needs.

[0087] Optionally, the rotation drive mechanism 500 may include the first permanent magnet 510 and the first electromagnet 520 as described above, and the second permanent magnet 530 and the second electromagnet 540 as described above, and the first electromagnet 520 and the second electromagnet 540 are respectively connected to the control module for communication. The control module adjusts the power-on state of the first electromagnet 520 and the power-on state of the second electromagnet 540 according to the temperature information detected by the temperature detection element 600, thereby adjusting the working state of the rotation drive mechanism 500.

[0088] Further optionally, the control module and the heating element 410, the control module and the temperature detection element 600, the control module and the first electromagnet 520, and the control module and the second electromagnet 540 can be connected by wired communication through electrical connection lines, or can be connected by wireless communication through Bluetooth or wireless local area network. In short, the control module can control the heating element 410, the first electromagnet 520, and the second electromagnet 540 according to the temperature information detected by the temperature detection element 600.

[0089] The control module may be a temperature controller, or a control device such as a single chip microcomputer or a programmable logic controller, which can control the heating element 410, the first electromagnet 520 and the second electromagnet 540 according to temperature information.

[0090] In this embodiment, a temperature detection element 600 is added to the clamping device, and the heating element 410 and the rotation drive mechanism 500 are automatically controlled according to the temperature information detected by the temperature detection element 600, so as to realize automatic adjustment of the heating temperature and the rotation state of the base 100, thereby directionally heating the wafer S, effectively controlling the temperature of the wafer S, and helping to improve the heating uniformity of the wafer S.

[0091] Of course, in other embodiments, the semiconductor process equipment may not be provided with a control module, that is, the user can adjust the heating state of the heating element 410 and the working state of the rotation drive mechanism 500 according to the detected temperature information.

[0092] The embodiments of the present application are described above in conjunction with the accompanying drawings, but the present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A clamping device, applied to semiconductor process equipment, characterized in that: The clamping device comprises a base (100), a plurality of clamping members (200) and a driving mechanism (300), wherein the plurality of clamping members (200) are all arranged on the base (100), and the driving mechanism (300) is used to drive the plurality of clamping members (200) to move relative to the base (100), so that the plurality of clamping members (200) clamp or release a wafer (S). The driving mechanism (300) comprises a first magnetic member (310), a second magnetic member (320) and a transmission assembly (330); the first magnetic member (310) is located outside the base (100); the base (100) is provided with a cavity (100a); the second magnetic member (320) and the transmission assembly (330) are both located in the cavity (100a); the second magnetic member (320) is connected to each of the clamping members (200) via the transmission assembly (330); when the first magnetic member (310) moves relative to the second magnetic member (320), the second magnetic member (320) drives each of the clamping members (200) to move via the transmission assembly (330).

2. The clamping device according to claim 1, characterized in that: The clamping member (200) is rotatably arranged on the base (100), and the transmission assembly (330) includes a movable cam (333) and a clamping connecting rod (338). The movable cam (333) is transmission-connected to the second magnetic member (320), and the movable cam (333) is movably arranged on the base (100) along a first direction, and the first direction intersects with the rotation axis of the clamping member (200). The clamping connecting rod (338) is connected to the clamping member (200), and one of the clamping connecting rod (338) and the movable cam (333) is provided with a slide groove (333a), and the other is provided with a sliding member (334), and the sliding member (334) extends into the slide groove (333a), and the sliding member (334) and the slide groove (333a) are slidably matched. The second magnetic member (320) can drive the movable cam (333) to move along the first direction, and the movable cam (333) drives the clamping link (338) and the clamping member (200) to rotate via the sliding member (334) and the sliding groove (333a).

3. The clamping device according to claim 2, characterized in that: The transmission assembly (330) further comprises a first elastic member (335), wherein a first end of the first elastic member (335) is connected to the movable cam (333), and a second end of the first elastic member (335) is connected to the base (100), and when the second magnetic member (320) drives the movable cam (333) to move relative to the base (100), the first elastic member (335) generates elastic deformation.

4. The clamping device according to claim 2, characterized in that: There are a plurality of movable cams (333), and the movable cams (333) correspond one to one with the clamping members (200). The transmission assembly (330) further comprises a strip-shaped moving member (332), the strip-shaped moving member (332) being movably disposed on the base (100), the strip-shaped moving member (332) being transmission-connected to the second magnetic member (320), and both ends of the strip-shaped moving member (332) being provided with top blocks (3321) along the extending direction of the strip-shaped moving member (332), the top blocks (3321) corresponding one-to-one with the moving cam (333), The second magnetic member (320) can drive the strip-shaped moving member (332) to move, and the strip-shaped moving member (332) acts on the corresponding moving cam (333) through the top block (3321) to drive at least two of the moving cams (333) to move along the first direction.

5. The clamping device according to claim 4, characterized in that: The transmission assembly (330) further comprises a rotating lever (331), wherein the rotating lever (331) is rotatably disposed on the base (100), the second magnetic member (320) is connected to the rotating lever (331), and the rotating lever (331) is transmission-connected to the strip-shaped moving member (332). The second magnetic member (320) can drive the rotating lever (331) to rotate relative to the base (100), and the rotating lever (331) drives the strip-shaped moving member (332) to move relative to the base (100).

6. The clamping device according to claim 4, characterized in that: The transmission assembly (330) further comprises a second elastic member (336), wherein a first end of the second elastic member (336) is connected to the strip-shaped moving member (332), and a second end of the second elastic member (336) is connected to the base (100), and when the second magnetic member (320) drives the strip-shaped moving member (332) to move relative to the base (100), the second elastic member (336) generates elastic deformation.

7. The clamping device according to claim 1, characterized in that: The transmission assembly (330) further comprises a positioning magnetic member (337), wherein the positioning magnetic member (337) is connected to the base (100), and the first magnetic member (310) interacts with the second magnetic member (320) to drive the second magnetic member (320) to move from a first position to a second position. When the second magnetic member (320) is located at the first position, the second magnetic member (320) is attracted to the positioning magnetic member (337).

8. The clamping device according to claim 1, characterized in that: Along the circumference of the base (100), a plurality of the transmission components (330), the first magnetic components (310) and the second magnetic components (320) are arranged at intervals, and the transmission components (330), the first magnetic components (310) and the second magnetic components (320) correspond to each other one by one.

9. The clamping device according to claim 1, characterized in that: The clamping device further comprises a heating disk (400) and a rotation drive mechanism (500), wherein the heating disk (400) and the rotation drive mechanism (500) are both arranged in the cavity (100a), the heating disk (400) is provided with a heating element (410), and the heating element (410) is used to heat the wafer (S) clamped by the clamping member (200), and the rotation drive mechanism (500) is connected to the heating disk (400), and the rotation drive mechanism (500) is used to adjust the rotation state of the heating disk (400) relative to the base (100).

10. The clamping device according to claim 9, characterized in that: The rotation drive mechanism (500) comprises a first permanent magnet (510) and a first electromagnet (520) which are opposite to each other, one of the first permanent magnet (510) and the first electromagnet (520) being located in the cavity (100a) and arranged on a side wall of the cavity (100a), and the other being arranged on a side wall of the heating plate (400). The first electromagnet (520) and the first permanent magnet (510) can interact with each other when the first electromagnet (520) is energized to drive the heating plate (400) to rotate relative to the base (100).

11. The clamping device according to claim 10, characterized in that: The rotation drive mechanism (500) further comprises a second permanent magnet (530) and a second electromagnet (540) which are opposite to each other, wherein one of the second permanent magnet (530) and the second electromagnet (540) is arranged on the bottom wall of the cavity (100a), and the other is arranged on the bottom wall of the heating plate (400). The second electromagnet (540) and the second permanent magnet (530) can attract each other when the second electromagnet (540) is powered on, so that the heating plate (400) and the base (100) are relatively fixed.

12. The clamping device according to claim 11, characterized in that: Along the circumference of the base (100), a plurality of the first electromagnets (520) and the first permanent magnets (510) are respectively arranged at intervals; And / or, along the circumference of the base (100), a plurality of the second electromagnets (540) and the second permanent magnets (530) are respectively arranged at intervals.

13. The clamping device according to claim 9, characterized in that: The heating disk (400) is provided with a plurality of heating areas (400a) along the circumference of the heating disk (400), each of the heating areas (400a) is provided with a plurality of the heating elements (410), each of the heating elements (410) extends along the circumference of the heating disk (400), and the plurality of heating elements (410) within the same heating area (400a) are arranged at intervals along the radial direction of the heating disk (400).

14. A semiconductor process equipment, characterized in that: It comprises a process chamber and the clamping device according to any one of claims 1 to 13, wherein the clamping device is arranged in the process chamber.

15. The semiconductor process equipment according to claim 14, characterized in that: The clamping device further comprises a heating disk (400) and a rotation drive mechanism (500), wherein the heating disk (400) and the rotation drive mechanism (500) are both arranged in the cavity (100a), the heating disk (400) is provided with a heating element (410), and the heating element (410) is used to heat the wafer (S) clamped by the clamping member (200), and the rotation drive mechanism (500) is connected to the heating disk (400) to drive the heating disk (400) to rotate; The semiconductor process equipment further comprises a temperature detection element (600) and a control module, wherein the temperature detection element (600) is used to detect the temperature of the wafer (S), the temperature detection element (600), the heating element (410) and the rotation drive mechanism (500) are respectively connected to the control module for communication, and the control module is used to adjust the heating state of the heating element (410) and the working state of the rotation drive mechanism (500) according to the temperature information detected by the temperature detection element (600).

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