Beta-Ga2O3 Schottky barrier diode with SEB resistance

Abstract

The invention discloses a beta-Ga2O3 Schottky barrier diode with SEB resistance, and particularly relates to the technical field of Schottky barrier diodes, which comprises a Schottky barrier diode body, a fixing mechanism and a heat dissipation assembly, the Schottky barrier diode body comprises a connecting main body and connecting pins; the material of the connection main body is beta-Ga2O3; the heat dissipation assembly is arranged on the connecting main body; the heat dissipation assembly comprises a heat dissipation groove and an extension groove; a plurality of heat dissipation grooves are uniformly formed in the connecting main body; extension grooves are uniformly formed in the heat dissipation grooves; according to the Schottky barrier diode, the beta-Ga2O3 material is selected as the main manufacturing material of the Schottky barrier diode body, the SEB resistance of the Schottky barrier diode body can be preliminarily improved, the heat dissipation path of the Schottky barrier diode body can be prolonged through the heat dissipation grooves, the SEB resistance of the Schottky barrier diode body is improved again, and the SEB resistance of the Schottky barrier diode body is improved through the extension grooves. The heat dissipation path of the Schottky barrier diode body can be lengthened, and the anti-SEB capability of the Schottky barrier diode body is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of Schottky barrier diodes, and more specifically, to a β-GaS diode having SEB resistance. 2 O 3 Schottky barrier diode. Background Art

[0002] Schottky barrier diode (SBD for short) is a rectifying device formed based on the contact between metal and semiconductor. It has significant advantages such as low forward voltage drop, high-speed switching, low noise and low power consumption. Its working principle is based on the formation of Schottky barrier and thermal emission of electrons. 2 O 3 It is an emerging wide-bandgap semiconductor material with a direct energy gap of about 4.8 electron volts and a high breakdown field strength, which makes it perform well in high-temperature and high-power applications.

[0003] The Schottky barrier diode provided by the Chinese utility model patent with publication number CN209282208U includes: a semiconductor substrate; a passivation layer; a dielectric layer, which is arranged on the passivation layer and covers the bottom of the first anode contact hole and the bottom of the second anode contact hole, the first anode contact hole and the second anode contact hole penetrate the passivation layer and extend into the interior of the semiconductor substrate; an anode, including a first anode part, a second anode part and a third anode part extending into the interior of the semiconductor substrate, the third anode contact hole penetrates the dielectric layer and the passivation layer and extends into the interior of the semiconductor substrate, the third anode contact hole is located between the first anode contact hole and the second anode contact hole; and a first cathode and a second cathode. The Schottky barrier diode of the utility model embodiment can optimize the device structure, be compatible with the CMOS process line, and reduce reverse leakage.

[0004] In order to improve the withstand voltage performance and low on-resistance performance of Schottky barrier diodes, β-Ga 2 O 3 As the main manufacturing material of Schottky barrier diodes, the existing Schottky barrier diodes have poor SEB resistance, which causes the Schottky barrier diodes to be easily damaged or degraded when exposed to high-energy particle radiation, which has a negative impact on the normal operation and performance of the circuit, thereby affecting the use effect of the Schottky barrier diodes. Summary of the invention

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a β-Ga with SEB resistance. 2 O 3Schottky barrier diode, the technical problem to be solved by the present invention is: the Schottky barrier diode has poor SEB resistance, which causes the Schottky barrier diode to be easily damaged or degraded when irradiated by high-energy particles, which has a negative impact on the normal operation and performance of the circuit, thereby affecting the use effect of the Schottky barrier diode.

[0006] To achieve the above object, the present invention provides the following technical solution: a β-Ga 2 O 3 The Schottky barrier diode comprises a Schottky barrier diode body, a fixing mechanism and a heat dissipation component; the Schottky barrier diode body comprises a connecting body and a connecting pin; the connecting body is made of β-Ga 2 O 3 ; The three connecting pins are arranged on the connecting body in a linear array through a fixing mechanism; the heat dissipation component is arranged on the connecting body; the heat dissipation component includes a heat dissipation slot and an extension slot; a plurality of heat dissipation slots are opened on the connecting body in a linear array; extension slots are evenly opened in the heat dissipation slots.

[0007] As a further solution of the present invention: the heat dissipation groove is a wave-shaped structure.

[0008] As a further solution of the present invention: the extension groove is an arched structure, and the arched end of the extension groove is arranged away from the heat dissipation groove.

[0009] As a further solution of the present invention: the fixing mechanism includes a connecting assembly; the connecting assembly includes a connecting groove, a connecting block, a movable groove, a through-hole groove, a wedge-shaped groove, an elastic plate and a wedge-shaped block; a plurality of connecting grooves are provided on the connecting body in a linear array; the connecting block is inserted into the connecting groove, and the end of the connecting block passes through the connecting groove and is fixedly connected to the connecting foot; a plurality of movable grooves are provided on the connecting body in a linear array; a plurality of through-hole grooves are provided in an annular array in the connecting groove and are connected to the movable groove; a plurality of wedge-shaped grooves are provided on the connecting block in an annular array; the elastic plate is fixed in the through-hole groove and there is a gap between the elastic plate and the through-hole groove; the wedge-shaped block is fixed on the side of the elastic plate close to the connecting block and is engaged with the wedge-shaped groove.

[0010] As a further solution of the present invention: the elastic plate and the wedge block are both arc-shaped structures, the cross section of the wedge block is a triangular structure, the inclined surface of the wedge block is arranged along the vertical direction, and the shape of the wedge block is adapted to the shape of the wedge groove.

[0011] As a further solution of the present invention: the fixing mechanism also includes a movable component; the movable component includes a movable ring and a spring; the movable ring is slidably arranged in the movable groove, and the inner wall of the movable ring contacts the outer surface of the elastic plate; the two ends of the spring are respectively fixedly connected to the inner wall of the movable groove and the movable ring.

[0012] As a further solution of the present invention: the movable component also includes an extrusion groove and an extrusion block; a plurality of extrusion grooves are opened on the connecting body in a linear array, and the extrusion grooves are connected to the movable groove; the extrusion block is slidably arranged in the extrusion groove and fixedly connected to the movable ring.

[0013] As a further solution of the present invention: the extrusion block is an L-shaped structure with a small upper part and a large lower part, and the shape of the extrusion block is adapted to the shape of the extrusion groove.

[0014] As a further solution of the present invention: it also includes a guide component; the guide component is arranged on the connecting block.

[0015] As a further solution of the present invention: the guide assembly includes a guide groove and a guide block; a plurality of guide grooves are provided in a ring array in the connecting groove; the guide block is slidably arranged in the guide groove and fixedly connected to the connecting block.

[0016] The beneficial effects of the present invention are:

[0017] 1. The present invention sets a heat dissipation component and selects β-Ga 2 O 3 The material is used as the main manufacturing material of the Schottky barrier diode body, which can preliminarily improve the anti-SEB ability of the Schottky barrier diode body. In addition, by setting the heat dissipation groove, the heat dissipation path of the Schottky barrier diode body can be extended, which further improves the anti-SEB ability of the Schottky barrier diode body. By setting the extension groove, the heat dissipation path of the Schottky barrier diode body can be lengthened, which further improves the anti-SEB ability of the Schottky barrier diode body. Compared with the prior art, the present invention can significantly improve the anti-SEB ability of the Schottky barrier diode body by setting multiple anti-SEB capabilities.

[0018] 2. The present invention sets a connecting component and a guide component, and pulls the connecting foot downward to make the connecting block slide downward in the connecting groove, and makes the guide block slide downward in the guide groove, so that the inner wall of the wedge-shaped groove squeezes the inclined surface of the wedge-shaped block, and the elastic plate is deformed by force, so that the elastic plate drives the wedge-shaped block to tilt in the through-hole groove until the wedge-shaped block contacts the circumferential surface of the connecting block. At this time, the elastic plate no longer tilts until the connecting block moves out of the connecting groove, and the connecting foot can be conveniently disassembled and installed, thereby reducing the use cost.

[0019] 3. The present invention sets a movable component, which can make the movable ring slide in the movable groove under the elastic force of the spring, and make the extrusion block slide in the extrusion groove until the inner wall of the movable ring contacts the outer surface of the elastic plate. The position of the elastic plate can be restricted to avoid the loose connection between the wedge block and the wedge groove under the action of external force, thereby improving the stability of the connection foot position. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0021] Figure 2 It is a rear view of the overall structure of the present invention;

[0022] Figure 3 It is a cross-sectional view of the overall structure of the present invention;

[0023] Figure 4 is a cross-sectional view of the connection body of the present invention;

[0024] Figure 5 It is a schematic diagram of the partial structure disassembly of the present invention;

[0025] Figure 6 For the present invention Figure 2 The enlarged schematic diagram at A in the middle;

[0026] Figure 7 For the present invention Figure 3 The enlarged schematic diagram of point B in the middle;

[0027] Figure 8 For the present invention Figure 4 Enlarged schematic diagram at point C in the middle.

[0028] In the figure:

[0029] 1. Schottky barrier diode body; 2. Fixing mechanism; 3. Heat dissipation component; 4. Connecting component; 5. Movable component; 6. Guide component;

[0030] 101, connecting the main body; 102, connecting the feet;

[0031] 301, heat dissipation slot; 302, extension slot;

[0032] 401, connecting groove; 402, connecting block; 403, movable groove; 404, through-hole groove; 405, wedge-shaped groove; 406, elastic plate; 407, wedge-shaped block;

[0033] 501, movable ring; 502, spring; 503, extrusion groove; 504, extrusion block;

[0034] 601. Guide groove; 602. Guide block. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0036] like Figures 1 to 8 As shown, the present invention provides a β-Ga with SEB resistance 2 O 3 The Schottky barrier diode comprises a Schottky barrier diode body 1, a fixing mechanism 2 and a heat dissipation component 3; the Schottky barrier diode body 1 comprises a connecting body 101 and a connecting pin 102; the connecting body 101 is made of β-Ga 2 O 3 ; Three connecting pins 102 are arranged on the connecting body 101 in a linear array through a fixing mechanism 2; the heat dissipation component 3 is arranged on the connecting body 101; the heat dissipation component 3 includes a heat dissipation slot 301 and an extension slot 302; three heat dissipation slots 301 are opened in a linear array on the connecting body 101; the extension slots 302 are evenly opened in the heat dissipation slots 301; the heat dissipation slots 301 are of a wavy structure; the extension slots 302 are of an arched structure, and the arched end of the extension slot 302 is arranged away from the heat dissipation slot 301.

[0037] The present invention provides a heat dissipation component 3 and selects β-Ga 2 O 3 The material is used as the main manufacturing material of the Schottky barrier diode body 1, which can preliminarily improve the anti-SEB ability of the Schottky barrier diode body 1. In addition, by setting the heat dissipation groove 301, the heat dissipation path of the Schottky barrier diode body 1 can be extended, which further improves the anti-SEB ability of the Schottky barrier diode body 1. By setting the extension groove 302, the heat dissipation path of the Schottky barrier diode body 1 can be lengthened, which further improves the anti-SEB ability of the Schottky barrier diode body 1. Compared with the prior art, the present invention can significantly improve the anti-SEB ability of the Schottky barrier diode body 1 by setting multiple anti-SEB capabilities.

[0038] As a preferred embodiment, the fixing mechanism 2 includes a connecting assembly 4; the connecting assembly 4 includes a connecting groove 401, a connecting block 402, a movable groove 403, a through-hole groove 404, a wedge-shaped groove 405, an elastic plate 406 and a wedge-shaped block 407; three connecting grooves 401 are opened in a linear array on the connecting body 101; the connecting block 402 is inserted into the connecting groove 401, and the end of the connecting block 402 passes through the connecting groove 401 and is fixedly connected to the connecting foot 102; three movable grooves 403 are opened in a linear array on the connecting body 101; the connecting groove 401 is opened in a circular array There are three through-hole grooves 404 connected to the movable groove 403; three wedge-shaped grooves 405 are formed in a circular array on the connecting block 402; the elastic plate 406 is fixed in the through-hole groove 404 and there is a gap between the through-hole groove 404; the wedge-shaped block 407 is fixed on the side of the elastic plate 406 close to the connecting block 402 and is engaged with the wedge-shaped groove 405; the elastic plate 406 and the wedge-shaped block 407 are both arc-shaped structures, the cross section of the wedge-shaped block 407 is a triangular structure, the inclined surface of the wedge-shaped block 407 is arranged in the vertical direction, and the shape of the wedge-shaped block 407 is adapted to the shape of the wedge-shaped groove 405;

[0039] It also includes a guide assembly 6; the guide assembly 6 is arranged on the connecting block 402; the guide assembly 6 includes a guide groove 601 and a guide block 602; three guide grooves 601 are opened in a circular array in the connecting groove 401; the guide block 602 is slidably inserted into the guide groove 601 and fixedly connected to the connecting block 402.

[0040] The present invention sets a connecting component 4 and a guiding component 6, and pulls the connecting foot 102 downward to make the connecting block 402 slide downward in the connecting groove 401, and makes the guiding block 602 slide downward in the guiding groove 601, so that the inner wall of the wedge-shaped groove 405 squeezes the inclined surface of the wedge-shaped block 407, so that the elastic plate 406 is deformed by force, and the elastic plate 406 drives the wedge-shaped block 407 to tilt in the through-hole groove 404 until the wedge-shaped block 407 contacts the circumferential surface of the connecting block 402. At this time, the elastic plate 406 no longer tilts until the connecting block 402 moves out of the connecting groove 401, and the connecting foot 102 can be easily disassembled and installed, thereby reducing the use cost.

[0041] As a preferred embodiment, the fixing mechanism 2 also includes a movable component 5; the movable component 5 includes a movable ring 501, a spring 502, an extrusion groove 503 and an extrusion block 504; the movable ring 501 is slidably arranged in the movable groove 403, and the inner wall of the movable ring 501 contacts the outer surface of the elastic plate 406; the two ends of the spring 502 are respectively fixedly connected to the inner wall of the movable groove 403 and the movable ring 501; three extrusion grooves 503 are opened in a linear array on the connecting body 101, and the extrusion grooves 503 are connected to the movable groove 403; the extrusion block 504 is slidably penetrated in the extrusion groove 503 and is connected to the movable ring 501 is fixedly connected; the extrusion block 504 is an L-shaped structure with a small upper part and a large lower part, and the shape of the extrusion block 504 is adapted to the shape of the extrusion groove 503, so as to increase the contact area between the extrusion block 504 and the user's hand or the tool used, thereby facilitating the extrusion block 504 to slide in the extrusion groove 503; when the wedge block 407 contacts the circumferential surface of the connecting block 402, the elastic plate 406 does not contact the inner wall of the movable groove 403; when the top surface of the connecting block 402 contacts the inner top wall of the connecting groove 401, the wedge block 407 is clamped with the wedge groove 405, and the connecting foot 102 contacts the connecting body 101.

[0042] The present invention sets a movable component 5, under the elastic force of the spring 502, the movable ring 501 can slide in the movable groove 403, and the extrusion block 504 can slide in the extrusion groove 503 until the inner wall of the movable ring 501 contacts the outer surface of the elastic plate 406. The position of the elastic plate 406 can be restricted to avoid the loose connection between the wedge block 407 and the wedge groove 405 due to the action of external force, thereby improving the stability of the position of the connecting foot 102.

[0043] The Schottky barrier diode body 1 is a conventional instrument, and its working principle, size and model are irrelevant to the problem solved by the present application, so no further description will be given. The control method of the present invention is controlled by a controller, and the control circuit of the controller can be realized by simple programming by technicians in this field. The provision of power is also common knowledge in this field, and the present invention is mainly used to protect mechanical devices, so the present invention will no longer explain the control method and circuit connection in detail.

[0044] Working principle of the present invention: by selecting β-Ga 2 O 3 The material is used as the main manufacturing material of the Schottky barrier diode body 1, which can preliminarily improve the SEB resistance of the Schottky barrier diode body 1. In addition, by providing the heat dissipation groove 301, the heat dissipation path of the Schottky barrier diode body 1 can be extended, and the SEB resistance of the Schottky barrier diode body 1 can be further improved. By providing the extension groove 302, the heat dissipation path of the Schottky barrier diode body 1 can be lengthened, and the SEB resistance of the Schottky barrier diode body 1 can be further improved.

[0045] When the connecting foot 102 is damaged, the extrusion block 504 is squeezed to make the extrusion block 504 slide in the extrusion groove 503, so that the movable ring 501 slides in the movable groove 403, and the spring 502 is forced to contract until the top surface of the extrusion block 504 contacts the inner top wall of the extrusion groove 503. At this time, the inner wall of the movable ring 501 is no longer in contact with the outer surface of the elastic plate 406. Then, the damaged connecting foot 102 is moved downward, so that the connecting block 402 slides downward in the connecting groove 401, and the guide block 602 slides downward in the guide groove 601. , so that the inner wall of the wedge groove 405 squeezes the inclined surface of the wedge block 407, so that the elastic plate 406 is deformed by force, so that the elastic plate 406 drives the wedge block 407 to tilt in the through hole groove 404, until the wedge block 407 contacts the circumferential surface of the connecting block 402. At this time, the elastic plate 406 no longer tilts until the connecting block 402 moves out of the connecting groove 401, that is, the disassembly of the connecting foot 102 is completed. At this time, under the elastic action of the elastic plate 406, the elastic plate 406 drives the wedge block 407 to restore to its original shape, and then , take out the intact connecting foot 102, insert the connecting block 402 into the connecting groove 401, and slide the guide block 602 upward in the guide groove 601, so that the connecting block 402 squeezes the inclined surface of the wedge block 407, so that the elastic plate 406 is deformed by force, and the elastic plate 406 drives the wedge block 407 to tilt in the through hole groove 404 until the wedge block 407 contacts the circumferential surface of the connecting block 402. At this time, the elastic plate 406 no longer tilts until the wedge block 407 contacts the inner wall of the wedge groove 405. At this time, the elastic plate Under the elastic action of 406, the elastic plate 406 will drive the wedge block 407 to tilt in the opposite direction until the top surface of the connecting block 402 contacts the inner top wall of the connecting groove 401. At this time, the extrusion block 504 is released, and under the elastic force of the spring 502, the movable ring 501 will slide in the opposite direction in the movable groove 403, causing the extrusion block 504 to slide in the opposite direction in the extrusion groove 503 until the spring 502 returns to its original shape. At this time, the inner wall of the movable ring 501 contacts the outer surface of the elastic plate 406, and the installation of the connecting foot 102 is completed.

[0046] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, which may refer to mechanical connection or electrical connection, or internal communication between two components, or direct connection. "upper", "lower", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may change;

[0047] Secondly: In the drawings of the embodiments disclosed in the present invention, only the structures related to the embodiments disclosed in the present invention are involved, and other structures can refer to the general design. In the absence of conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0048] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A β-Ga2O3 Schottky barrier diode with SEB resistance, characterized in that: The invention comprises a Schottky barrier diode body (1), a fixing mechanism (2) and a heat dissipation component (3); the Schottky barrier diode body (1) comprises a connection body (101) and connection pins (102); the connection body (101) is made of β-Ga2O3; three connection pins (102) are arranged on the connection body (101) in a linear array through the fixing mechanism (2); the heat dissipation component (3) is arranged on the connection body (101); the heat dissipation component (3) comprises a heat dissipation slot (301) and an extension slot (302); a plurality of heat dissipation slots (301) are arranged on the connection body (101) in a linear array; and the extension slots (302) are evenly arranged in the heat dissipation slots (301).

2. A β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 1, characterized in that: The heat dissipation groove (301) is a wave-shaped structure.

3. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 2, characterized in that: The extension groove (302) is an arched structure, and the arched end of the extension groove (302) is arranged away from the heat dissipation groove (301).

4. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 1, characterized in that: The fixing mechanism (2) comprises a connecting assembly (4); the connecting assembly (4) comprises a connecting groove (401), a connecting block (402), a movable groove (403), a through-hole groove (404), a wedge-shaped groove (405), an elastic plate (406) and a wedge-shaped block (407); a plurality of connecting grooves (401) are provided on the connecting body (101) in a linear array; the connecting block (402) is inserted into the connecting groove (401), and an end of the connecting block (402) passes through the connecting groove (401) and is fixedly connected to the connecting foot (102); the connecting A plurality of movable grooves (403) are provided in a linear array on the main body (101); a plurality of through-hole grooves (404) are provided in an annular array in the connection groove (401) and are connected to the movable groove (403); a plurality of wedge-shaped grooves (405) are provided in an annular array on the connection block (402); the elastic plate (406) is fixed in the through-hole groove (404) and a gap is formed between the elastic plate (406) and the through-hole groove (404); the wedge-shaped block (407) is fixed on a side of the elastic plate (406) close to the connection block (402) and is engaged with the wedge-shaped groove (405).

5. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 4, characterized in that: The elastic plate (406) and the wedge block (407) are both arc-shaped structures. The cross section of the wedge block (407) is a triangular structure. The inclined surface of the wedge block (407) is arranged in the vertical direction, and the shape of the wedge block (407) is adapted to the shape of the wedge groove (405).

6. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 4, characterized in that: The fixing mechanism (2) further comprises a movable component (5); the movable component (5) comprises a movable ring (501) and a spring (502); the movable ring (501) is slidably arranged in the movable groove (403), and the inner wall of the movable ring (501) contacts the outer surface of the elastic plate (406); the two ends of the spring (502) are respectively fixedly connected to the inner wall of the movable groove (403) and the movable ring (501).

7. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 6, characterized in that: The movable component (5) further comprises an extrusion groove (503) and an extrusion block (504); a plurality of extrusion grooves (503) are provided on the connecting body (101) in a linear array, and the extrusion grooves (503) are connected to the movable groove (403); the extrusion block (504) is slidably arranged in the extrusion groove (503) and is fixedly connected to the movable ring (501).

8. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 7, characterized in that: The extrusion block (504) is an L-shaped structure with a small upper portion and a large lower portion, and the shape of the extrusion block (504) is adapted to the shape of the extrusion groove (503).

9. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 4, characterized in that: It also includes a guide component (6); the guide component (6) is arranged on the connecting block (402).

10. The β-Ga2O3 Schottky barrier diode with SEB resistance according to claim 9, characterized in that: The guide assembly (6) comprises a guide groove (601) and a guide block (602); a plurality of guide grooves (601) are provided in a ring array in the connection groove (401); the guide block (602) is slidably arranged in the guide groove (601) and is fixedly connected to the connection block (402).

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