Display panel, preparation method of display panel and display device

Abstract

The invention discloses a display panel, a preparation method of the display panel and a display device. The display panel comprises a substrate, an isolation structure, a light-emitting layer, a first electrode layer and a packaging part. When the light-emitting layer is prepared, the light-emitting layer generates a large fall on the edge of the isolation structure and is difficult to connect, so that the light-emitting layer is broken, the light-emitting layer is broken to form the light-emitting units which are mutually disconnected and located in the isolation opening, a precise mask plate does not need to be adopted, development and use of the precise mask plate can be reduced, and the preparation cost is reduced. At least part of the packaging part comprises a first sub-layer, a protective layer and a second sub-layer, and the first sub-layer, the protective layer and the second sub-layer are of a three-layer structure, so that the packaging part has larger thickness, the packaging capability and the anti-etching capability of the packaging part are improved, and the light-emitting units with different light-emitting colors are prepared step by step; in the prior art, over-etching damage is easily caused to a packaging part corresponding to a prepared light-emitting unit, so that the prepared light-emitting unit is etched and dark spots are generated.

Description

Technical Field

[0001] The present application relates to the field of display, and in particular to a display panel, a method for preparing a display panel, and a display device. Background Art

[0002] Organic Light Emitting Diode (OLED) and flat-panel display devices based on technologies such as Light Emitting Diode (LED) have been widely used in various consumer electronic products such as mobile phones, televisions, laptops, desktop computers, etc. due to their advantages such as high image quality, power saving, thin body and wide application range, becoming the mainstream of display devices.

[0003] In the process of traditional display panel preparation, the graphicization of luminous pixels is usually achieved through a fine metal mask (FMM). FMM technology is mature and has rich experience in mass production. However, FMM technology also has problems such as limited accuracy, high development cost, and long development cycle. The fine metal mask-free technology eliminates the limitations of traditional OLED processes on display screen size, resolution, and other screen performance, and has the advantages of high performance, full-domain size, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A record the relevant content of the fine metal mask-free technology for reference.

[0004] However, the process performance of current OLED display products needs to be improved. Summary of the invention

[0005] The embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device, aiming to improve the process performance of OLED display products.

[0006] A first aspect of the present application provides a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit at least partially located in the isolation openings; a first electrode layer located on a side of the light-emitting layer away from the substrate, the first electrode layer comprising a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; a packaging portion located on a side of the first electrode layer away from the substrate, at least a portion of the packaging portion being located in the isolation openings, the packaging portion being used to package the light-emitting unit, wherein at least a portion of the packaging portion comprises a first sublayer, a protective layer, and a second sublayer stacked in sequence in a direction away from the substrate, a first recessed space is formed on a side of the isolation structure, the protective layer at least comprises an extending portion, and the extending portion is located in the first recessed space.

[0007] According to an implementation of the first aspect of the present application, the first sub-layer encloses a second concave space at the first concave space, and the protruding portion is located in the second concave space.

[0008] According to any of the aforementioned embodiments of the first aspect of the present application, the second sublayer contacts the first sublayer on the circumferential side and encloses a closed space, the protective layer is located in the closed space, and the orthographic projection of the light-emitting unit corresponding to the protective layer on the substrate is located within the orthographic projection of the protective layer on the substrate.

[0009] According to any of the aforementioned embodiments of the first aspect of the present application, at least a portion of the first electrode is in contact with the isolation structure on one side in the first direction, and is spaced apart from the isolation structure on the other side.

[0010] According to any of the aforementioned embodiments of the first aspect of the present application, the extending portion is located in the second recessed space close to the isolation structure on the other side in the first direction; and / or the extending portion fills the second recessed space close to the isolation structure on one side in the first direction.

[0011] According to any of the aforementioned embodiments of the first aspect of the present application, the first electrode includes a first section and a second section that are interconnected, the orthographic projection of the second section on the substrate is located within the orthographic projection of the isolation structure on the substrate, and the thickness of the first section is greater than or equal to the thickness of the second section.

[0012] According to any of the aforementioned embodiments of the first aspect of the present application, the orthographic projection of at least part of the second section on the substrate is located within the orthographic projection of the protective layer on the substrate; and / or, the orthographic projection of part of the second section located on the other side of the first section in the first direction is located within the orthographic projection of the protective layer on the substrate; and / or, the first electrode is spaced from the isolation structure on the other side of the first direction to form a gap, and the orthographic projection of at least part of the gap on the substrate is located within the orthographic projection of the protective layer on the substrate; and / or, the minimum distance between the surface of the protective layer facing away from the substrate and the substrate is a first distance, the first sublayer includes a first subsection located on the side of the second section facing away from the substrate and in contact with the second section, the maximum distance between the surface of the first subsection facing away from the substrate and the substrate is a second distance, and the first distance is greater than the second distance.

[0013] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the isolation opening includes a first isolation opening and a second isolation opening, the first light-emitting unit is located in the first isolation opening, and the second light-emitting unit is located in the second isolation opening, and in at least one of the first isolation opening and the second isolation opening, the encapsulation portion includes a first sublayer, a protective layer, and a second sublayer stacked in sequence in a direction away from the substrate, the light-emitting colors of the first light-emitting unit and the second light-emitting unit are different, the material of the protective layer includes an organic material, and the materials of the first sublayer and the second sublayer include an inorganic material.

[0014] According to any of the aforementioned embodiments of the first aspect of the present application, the thickness of the packaging part corresponding to the first isolation opening is greater than or equal to the thickness of the packaging part corresponding to the second isolation opening; and / or the thickness of the protective layer in the first isolation opening is greater than the thickness of the protective layer in the second isolation opening.

[0015] According to any of the aforementioned embodiments of the first aspect of the present application, the light-emitting unit also includes a third light-emitting unit, the isolation opening also includes a third isolation opening, the third light-emitting unit is located in the third isolation opening, and in the third isolation opening, the packaging part corresponding to the third light-emitting unit includes a first sublayer and a second sublayer that are stacked and fully contacted, the light-emitting colors of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit are different, and the thickness of the packaging part corresponding to the third isolation opening is less than the thickness of the packaging part corresponding to the first isolation opening and the second isolation opening.

[0016] According to any of the aforementioned embodiments of the first aspect of the present application, in the same packaging part, the thickness of the first sub-layer is greater than or equal to the thickness of the second sub-layer; and / or the thickness of the protective layer is greater than or equal to the thickness of the first sub-layer, and / or the thickness of the protective layer is greater than or equal to the thickness of the second sub-layer.

[0017] According to any of the aforementioned embodiments of the first aspect of the present application, the display panel also includes: a pixel definition layer located on one side of the substrate, the pixel definition layer including a pixel defining portion and a pixel opening formed by the pixel defining portion, and the pixel opening and the isolation opening are connected; the display panel also includes a second electrode located between the substrate and the light-emitting unit, and at least a portion of the second electrode is exposed by the pixel opening.

[0018] According to any of the aforementioned embodiments of the first aspect of the present application, the isolation structure includes a first layer and a second layer located on the side of the first layer facing away from the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the second layer on the substrate; the first layer includes a conductive material; and / or the second layer includes a conductive material or an insulating material; and / or the first layer and the second layer both include metal materials, and the materials of the first layer and the second layer are different; and / or the isolation structure also includes a third layer located on the side of the first layer facing the substrate, and the orthographic projection of the first layer on the substrate is located within the orthographic projection of the third layer on the substrate.

[0019] According to a second aspect of the present application, there is provided a display panel, comprising: a substrate; an isolation structure located on one side of the substrate, the isolation structure enclosing a plurality of isolation openings; a light-emitting layer located on one side of the substrate, the light-emitting layer comprising a light-emitting unit at least partially located in the isolation openings; a first electrode layer located on a side of the light-emitting layer away from the substrate, the first electrode layer comprising a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; an encapsulation portion located on a side of the light-emitting layer away from the substrate, at least a portion of the encapsulation portion being located in the isolation openings, the encapsulation portion being used to encapsulate the light-emitting unit, wherein at least a portion of the encapsulation portion comprises a first sublayer, a protective layer, and a second sublayer stacked in sequence in a direction away from the substrate, a first recessed space being formed on a side of the isolation structure, the protective layer at least comprising an extension portion, the first sublayer enclosing a second recessed space at the first recessed space, the extension portion being located in the second recessed space, and in the same encapsulation portion, a thickness of the first sublayer is greater than or equal to a thickness of the second sublayer.

[0020] An embodiment of a third aspect of the present application provides a method for preparing a display panel, the method comprising: An isolation structure is prepared on the substrate, wherein the isolation structure encloses a plurality of isolation openings, and the isolation openings include a first isolation opening; A first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer and a third material layer are prepared in sequence on a substrate, and the first light-emitting material layer, the first electrode material layer, the first material layer, the second material layer and the third material layer are patterned to form a first light-emitting unit, a first sub-electrode and a first packaging portion that are at least partially located within the first isolation opening, the first packaging portion comprising a first sub-layer, a protective layer and a second sub-layer stacked in sequence in a direction away from the substrate, a first recessed space is formed on a side of the isolation structure, the protective layer at least comprises an extending portion, and the extending portion is located within the first recessed space.

[0021] According to an embodiment of the third aspect of the present application, the steps of sequentially preparing a first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer and a third material layer on a substrate include: A first light-emitting material layer, a first electrode material layer and a first material layer are sequentially prepared on the substrate, wherein the first material layer is recessed in the first isolation opening toward the substrate to form a first groove; Preparing a fluid material layer in the first groove and curing the fluid material layer to form a second material layer located in the first groove; A third material layer is prepared on a side of the second material layer facing away from the substrate.

[0022] According to any of the aforementioned embodiments of the third aspect of the present application, the second sub-layer contacts the first sub-layer on the circumferential side and encloses a closed space, and the protective layer is located in the closed space; and / or, the material of the fluid material layer includes organic material; and / or, the material of the fluid material layer includes at least one of PLN, MLA, OC, PR, and IJP; and / or, the material of the first material layer includes inorganic material; and / or, the material of the second material layer includes organic material; and / or, the material of the third material layer includes inorganic material.

[0023] According to any of the aforementioned embodiments of the third aspect of the present application, the isolation structure further includes a second isolation opening, and after the step of forming a first light-emitting unit, a first sub-electrode, and a first encapsulation portion that are at least partially located in the first isolation opening, the method includes: A second light-emitting material layer, a second electrode material layer, and a second packaging material layer are prepared on the substrate, and the second light-emitting material layer, the second electrode material layer, and the second packaging material layer are patterned to form a second light-emitting unit, a second sub-electrode, and a second packaging part that are at least partially located within the second isolation opening, and the second packaging part includes a first sub-layer, a protective layer, and a second sub-layer stacked in sequence in a direction away from the substrate.

[0024] According to any of the aforementioned embodiments of the third aspect of the present application, the isolation structure further includes a third isolation opening, and after the step of forming a second light-emitting unit, a second sub-electrode, and a second encapsulation portion at least partially located in the second isolation opening, the method includes: A third light-emitting material layer, a third electrode material layer and a third encapsulation material layer are prepared on the substrate, and the third light-emitting material layer, the third electrode material layer and the third encapsulation material layer are patterned to form a third light-emitting unit, a third sub-electrode and a third encapsulation part that are at least partially located in the third isolation opening, and the material of the third encapsulation part includes an inorganic material.

[0025] An embodiment of a fourth aspect of the present application provides a display device, which includes a display panel of any of the above-mentioned embodiments, or a display panel prepared by a preparation method of any of the above-mentioned embodiments.

[0026] According to the display panel of the embodiment of the present application, the display panel includes a substrate, an isolation structure, a light-emitting layer, a first electrode layer and an encapsulation part. When preparing the light-emitting layer, the light-emitting layer has a large drop at the edge of the isolation structure, which is difficult to connect, thereby breaking. The light-emitting layer breaks to form light-emitting units that are disconnected from each other and located in the isolation opening. There is no need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. The encapsulation part is used to encapsulate the light-emitting unit to increase the service life of the light-emitting unit. At least part of the encapsulation part includes a first sublayer, a protective layer and a second sublayer. The first sublayer, the protective layer and the second sublayer have a three-layer structure, so that the encapsulation part has a larger thickness, improves the encapsulation ability and anti-etching ability of the encapsulation part, and the isolation structure is recessed in the direction away from the isolation opening to form a first concave space, and the protective layer at least includes an extension part, which is located in the first concave space, improves the step-by-step preparation of light-emitting units of different luminous colors, and when the light-emitting unit is prepared later, it is easy to cause over-engraving damage to the encapsulation part corresponding to the light-emitting unit that has been prepared first, resulting in the etching of the light-emitting unit prepared first, resulting in the problem of dark spots, and improving the process performance of the display panel. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Other features, objects and advantages of the present application will become more apparent by reading the following detailed description of non-limiting embodiments with reference to the accompanying drawings, in which the same or similar reference numerals represent the same or similar features and the accompanying drawings are not drawn to scale.

[0028] Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application; Figure 2 is a partial top view schematic diagram of a display panel provided in an embodiment of the present application; Figure 3 is a partial cross-sectional view of a display panel in another embodiment; Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment; Figure 7 is a flow chart of a method for preparing a display panel provided in an embodiment of the present application; Figures 8 to 14 This is a diagram of a preparation process of a display panel provided in an embodiment of the present application.

[0029] Description of reference numerals: 10. Display panel; 100. Substrate; 200, isolation structure; 210, first layer; 220, second layer; 230, third layer; 240, isolation opening; 241, first isolation opening; 242, second isolation opening; 243, third isolation opening; 300, light-emitting layer; 310, light-emitting unit; 311, first light-emitting unit; 312, second light-emitting unit; 313, third light-emitting unit; 400, first electrode layer; 410, first electrode; 411, first subdivision; 412, second subdivision; 420, gap; 500, pixel definition layer; 510, pixel definition portion; 520, pixel opening; 530, second electrode; 601, first material layer; 601a, first groove; 602, second material layer; 603, third material layer; 604, fourth material layer; 605, fifth material layer; 606, sixth material layer; 610, encapsulation part; 611, first encapsulation part; 612, second encapsulation part; 613, third encapsulation part; 620, first sublayer; 630, protective layer; 631, extension part; 640, second sublayer; 650, first concave space; 660, second concave space; D1, first distance; D2, second distance; X, first direction. DETAILED DESCRIPTION

[0030] The features and exemplary embodiments of various aspects of the present application will be described in detail below. In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present application and are not configured to limit the present application. For those skilled in the art, the present application can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present application by illustrating the examples of the present application.

[0031] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0032] It should be understood that when describing the structure of a component, when a layer or a region is referred to as being "on" or "over" another layer or another region, it may mean that it is directly on the other layer or another region, or that other layers or regions are included between it and the other layer or another region. Moreover, if the component is turned over, the layer or a region will be "below" or "beneath" another layer or another region.

[0033] Embodiments of the present application provide a display panel, a method for manufacturing a display panel, and a display device. Embodiments of the display panel, the method for manufacturing a display panel, and the display device will be described below in conjunction with the accompanying drawings.

[0034] An embodiment of the present application provides a display panel, which may be an organic light emitting diode (OLED) display panel.

[0035] See also Figures 1 to 3 , Figure 1 is a partial cross-sectional view of a display panel provided in an embodiment of the present application; Figure 2 is a partial top view schematic diagram of a display panel provided in an embodiment of the present application; Figure 3 is a partial cross-sectional view of a display panel in another embodiment.

[0036] like Figures 1 to 3As shown, the first embodiment of the present application provides a display panel 10, which includes: a substrate 100; an isolation structure 200, which is located on one side of the substrate 100, and the isolation structure 200 encloses a plurality of isolation openings 240; a light-emitting layer 300, which is located on one side of the substrate 100, and the light-emitting layer 300 includes a light-emitting unit 310 at least partially located in the isolation openings 240; a first electrode layer 400, which is located on a side of the light-emitting layer 300 away from the substrate 100, and the first electrode layer 400 includes a plurality of first electrodes 410 located in the plurality of isolation openings 240, and the first electrode layer 400 includes a plurality of first electrodes 410 located in the plurality of isolation openings 240. The pole 410 is electrically connected to the isolation structure 200; the encapsulation portion 610 is located on the side of the light-emitting layer 300 away from the substrate 100, and at least part of the encapsulation portion 610 is located in the isolation opening 240. The encapsulation portion 610 is used to encapsulate the light-emitting unit 310, wherein at least part of the encapsulation portion 610 includes a first sublayer 620, a protective layer 630 and a second sublayer 640 stacked in sequence in a direction away from the substrate 100, and a first recessed space 650 is formed on the side of the isolation structure 200, and the protective layer 630 includes at least an extending portion 631, and the extending portion 631 is located in the first recessed space 650.

[0037] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first electrode layer 400 and a packaging unit 610. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large drop at the edge of the isolation structure 200, which is difficult to connect, and thus breaks. The light-emitting layer 300 breaks to form light-emitting units 310 that are disconnected from each other and located in the isolation opening 240. There is no need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. The packaging unit 610 is used to package the light-emitting unit 310 to increase the service life of the light-emitting unit 310. At least part of the encapsulation part 610 includes a first sublayer 620, a protective layer 630 and a second sublayer 640. The three-layer structure of the first sublayer 620, the protective layer 630 and the second sublayer 640 makes the encapsulation part 610 have a larger thickness, thereby improving the encapsulation ability and etching resistance of the encapsulation part 610. The isolation structure 200 is recessed in a direction away from the isolation opening 240 to form a first recessed space 650. The protective layer 630 includes at least an extension portion 631, and the extension portion 631 is located in the first recessed space 650, thereby improving the step-by-step preparation of light-emitting units 310 with different light-emitting colors. When the light-emitting unit 310 is prepared later, the encapsulation part 610 corresponding to the light-emitting unit 310 that has been prepared first is easily damaged by over-engraving, resulting in the etching of the light-emitting unit 310 that has been prepared first, resulting in the problem of dark spots, thereby improving the process performance of the display panel 10.

[0038] The isolation structure 200 is recessed in a direction away from the isolation opening 240 to form a first recessed space 650, and the protection layer 630 includes at least an extending portion 631, and the extending portion 631 is located in the first recessed space 650. The extending portion 631 fills the first recessed space 650 to prevent the weak portions of the encapsulation portion 610 and the first electrode 410 exposed by the first recessed space 650 from being easily etched, thereby preventing the light-emitting unit 310 prepared first from being etched.

[0039] Optionally, the first sublayer 620 forms a second concave space 660 at the first concave space 650, and the extending portion 631 is located in the second concave space 660. The extending portion 631 fills the second concave space 660 to prevent the weak portions of the encapsulation portion 610 and the first electrode 410 exposed by the second concave space 660 from being easily etched, thereby preventing the light-emitting unit 310 prepared first from being etched.

[0040] Optionally, the second sublayer 640 is in contact with the first sublayer 620 at the circumferential side and encloses to form a closed space, the protective layer 630 is located in the closed space, and the orthographic projection of the light-emitting unit 310 corresponding to the protective layer 630 on the substrate 100 is located within the orthographic projection of the protective layer 630 on the substrate 100. The second sublayer 640 is in contact with the first sublayer 620 at the circumferential side and encloses to form a closed space, the protective layer 630 is located in the closed space, and the protective layer 630 is closed and surrounded by the first sublayer 620 and the second sublayer 640, thereby preventing the protective layer 630 from being exposed, and the protective layer 630 is easily etched away in the subsequent etching process, resulting in the etching of the light-emitting unit 310 prepared first, resulting in the problem of dark spots.

[0041] The isolation structure 200 separates the first electrode layer 400 to form mutually spaced first electrodes 410 . The mutually spaced first electrodes 410 are electrically connected through the isolation structure 200 to ensure normal light emission of the light emitting unit 310 .

[0042] The light emitting unit 310 corresponding to the protection layer 630 refers to the light emitting unit 310 located in the same isolation opening 240 as the protection layer 630 .

[0043] See also Figure 4 , Figure 4 is a partial cross-sectional view of a display panel in yet another embodiment.

[0044] like Figure 4 As shown, in some optional embodiments, at least part of the first electrode 410 is in contact with the isolation structure 200 on one side in the first direction X, and is spaced apart from the isolation structure 200 on the other side (eg Figure 4 (large dashed box in the figure).

[0045] In these optional embodiments, by controlling the evaporation process, the first electrode 410 is offset during evaporation, one side of the first electrode 410 overlaps with the isolation structure 200, and the other side is spaced from the isolation structure 200, so that the first electrode 410 has a larger overlapping area with the isolation structure 200 on one side, thereby improving the overlapping effect between the first electrode 410 and the isolation structure 200. Specifically, in order to achieve single-sided overlapping of the first electrode 410, when evaporating the material of the first electrode 410, a single evaporation is performed to form the first electrode 410 that overlaps with the isolation structure 200 on one side, and the overlapping area between the first electrode 410 on the overlapping side and the isolation structure 200 is increased, thereby simplifying the preparation process. When the first electrode 410 overlaps the isolation structure 200 on one side and is spaced from the isolation structure 200 on the other side, the light-emitting unit 310 is easily exposed from the gap 420 between the first electrode 410 and the isolation structure 200 on the side where the first electrode 410 is spaced from the isolation structure 200. In subsequent processes, this part of the light-emitting unit 310 is more likely to be damaged by etching and thus fail. Therefore, the light-emitting unit 310 is encapsulated and protected by a three-layer encapsulation layer of a first sublayer 620, a protective layer 630, and a second sublayer 640, which can improve the problem of dark spots caused by the light-emitting unit 310 being easily damaged by etching.

[0046] Optionally, the extending portion 631 is located in the second recessed space 660 close to the isolation structure 200 on the other side in the first direction X. That is, the extending portion 631 is arranged in the second recessed space 660 on the non-overlapping side of the first electrode 410. Since the light-emitting unit 310 is more susceptible to etching damage after the encapsulation portion 610 is etched on the non-overlapping side of the first electrode 410, the extending portion 631 is filled in the second recessed space 660 on the non-overlapping side to form etching protection for the non-overlapping side.

[0047] Optionally, the protruding portion 631 fills up the second concave space 660 close to the isolation structure 200 on the other side in the first direction X, so as to further improve the etching protection effect of the protruding portion 631 .

[0048] Optionally, the extending portion 631 fills the second concave space 660 close to the isolation structure 200 on one side in the first direction X, so that the second concave spaces 660 on both sides in the first direction X are filled with the extending portion 631, further improving the etching protection effect of the extending portion 631. Optionally, the extending portion 631 fills the second concave space 660.

[0049] There are many ways to set the substrate 100. For example, the substrate 100 may include a substrate and an array substrate arranged on the substrate. Alternatively, the substrate 100 is the substrate. Alternatively, the substrate 100 includes a buffer layer and a support plate on a side away from the substrate.

[0050] like Figure 3As shown, in some optional embodiments, the light-emitting unit 310 includes a first light-emitting unit 311 and a second light-emitting unit 312, the isolation opening 240 includes a first isolation opening 241 and a second isolation opening 242, the first light-emitting unit 311 is located in the first isolation opening 241, and the second light-emitting unit 312 is located in the second isolation opening 242, and in at least one of the first isolation opening 241 and the second isolation opening 242, the encapsulation part 610 includes a first sublayer 620, a protective layer 630, and a second sublayer 640 sequentially stacked in a direction away from the substrate 100. This embodiment takes the first light-emitting unit 311 as an example, and the second light-emitting unit 312 is prepared later.

[0051] In these optional embodiments, when the packaging part 610 within the first isolation opening 241 includes a first sublayer 620, a protective layer 630 and a second sublayer 640, the three-layer packaging part 610 has better etching resistance, forming etching protection for the first light-emitting unit 311, so as to improve the preparation of the second light-emitting unit 312 and the corresponding packaging part 610 after the preparation of the first light-emitting unit 311 and the corresponding packaging part 610 is completed. The preparation process of the second light-emitting unit 312 and the corresponding packaging part 610 involves an etching process, which can easily cause over-etching of the packaging part 610 corresponding to the first light-emitting unit 311, resulting in etching damage to the first light-emitting unit 311 and the generation of dark spots. When the encapsulation part 610 in the second isolation opening 242 includes the first sublayer 620, the protective layer 630 and the second sublayer 640, the three-layer structure of the encapsulation part 610 has better anti-etching ability, forming etching protection for the second light-emitting unit 312, so as to improve the problem that the encapsulation part 610 corresponding to the second light-emitting unit 312 is easily over-etched during the subsequent preparation of the light-emitting unit 310, resulting in etching damage to the second light-emitting unit 312 and the generation of dark spots. Optionally, the encapsulation part 610 in the first isolation opening 241 and the second isolation opening 242 both include the first sublayer 620, the protective layer 630 and the second sublayer 640 to improve the etching protection ability for the first light-emitting unit 311 and the second light-emitting unit 312.

[0052] Optionally, the first light emitting unit 311 and the second light emitting unit 312 emit different colors. For example, the first light emitting unit 311 emits red light, and the second light emitting unit 312 emits green light.

[0053] In some optional embodiments, the material of the protective layer 630 includes an organic material. For example, the material of the protective layer 630 includes one or more of OC optical glue, microlens array (MLA), inkjet printing material (IJP), planarization material (PLN), and PR photoresist (Positive Resist, PR).

[0054] In these optional embodiments, the protective layer 630 of organic material has better leveling effect and filling ability. After the first sub-layer 620 is prepared, the protective layer 630 is prepared on the first sub-layer 620, so that the encapsulation part 610 has a large thickness at each position in the isolation opening 240, avoiding the problem of weak thickness area, which is easy to be over-engraved in the subsequent process, resulting in damage to the light-emitting unit 310. The material of the protective layer 630 can also be other materials that can play a protective role and can transmit light.

[0055] Optionally, the material of the first sublayer 620 and the second sublayer 640 includes an inorganic material. The inorganic material has good compactness and good barrier capability against water and oxygen, thereby improving the encapsulation effect of the encapsulation part 610 .

[0056] Optionally, the orthographic projection of the light emitting unit 310 on the substrate 100 is located within the orthographic projection of the protection layer 630 on the substrate 100 , thereby improving the etching protection effect of the protection layer 630 on the light emitting unit 310 .

[0057] In some optional embodiments, the thickness of the packaging portion 610 corresponding to the first isolation opening 241 is greater than or equal to the thickness of the packaging portion 610 corresponding to the second isolation opening 242 .

[0058] The packaging part 610 corresponding to the first isolation opening 241 refers to the packaging part 610 partially located in the first isolation opening 241. The packaging part 610 corresponding to the second isolation opening 242 refers to the packaging part 610 partially located in the second isolation opening 242. The thickness of the packaging part 610 refers to the size of the packaging part 610 in the thickness direction of the display panel 10.

[0059] In these optional embodiments, the thickness of the packaging portion 610 corresponding to the first isolation opening 241 is greater, so that the packaging portion 610 corresponding to the first isolation opening 241 has better etching resistance. For example, the light-emitting unit 310 is prepared three times, namely, the first light-emitting unit 311, the second light-emitting unit 312 and the third light-emitting unit 313. In the preparation processes of the second light-emitting unit 312 and the third light-emitting unit 313, etching damage will be caused to the first light-emitting unit 311 and the corresponding packaging portion 610. Therefore, the packaging portion 610 corresponding to the first isolation opening 241 has a greater thickness, thereby having the ability to resist etching damage in the preparation processes of the second light-emitting unit 312 and the third light-emitting unit 313, so as to improve the problem that the first light-emitting unit 311 is etched and damaged, resulting in dark spots in the display panel 10.

[0060] In some optional embodiments, the thickness of the protective layer 630 in the first isolation opening 241 is greater than the thickness of the protective layer 630 in the second isolation opening 242. The thickness of the protective layer 630 refers to the size of the protective layer 630 in the thickness direction of the display panel 10.

[0061] In these optional embodiments, the thickness of the protective layer 630 in the first isolation opening 241 is set to be larger, so that the overall thickness of the packaging part 610 corresponding to the first isolation opening 241 is larger, thereby having the ability to resist etching damage in the preparation process of the second light-emitting unit 312 and the third light-emitting unit 313, so as to improve the problem of etching damage to the first light-emitting unit 311, resulting in dark spots in the display panel 10.

[0062] Optionally, the thickness of the first sub-layer 620 of each packaging part 610 is equal, and the first sub-layer 620 of each packaging part 610 can be prepared synchronously.

[0063] Optionally, the second sub-layers 640 of each packaging part 610 have the same thickness, and the second sub-layers 640 of each packaging part 610 can be prepared synchronously.

[0064] In some optional embodiments, the light-emitting unit 310 further includes a third light-emitting unit 313, the isolation opening 240 further includes a third isolation opening 243, the third light-emitting unit 313 is located in the third isolation opening 243, and in the third isolation opening 243, the encapsulation portion 610 corresponding to the third light-emitting unit 313 includes a first sublayer 620 and a second sublayer 640 that are stacked and fully contacted. The first sublayer 620 and the second sublayer 640 are fully in contact, which means that the surface of the first sublayer 620 facing the second sublayer 640 is in contact with the second sublayer 640, and no other film layer is arranged between the first sublayer 620 and the second sublayer 640.

[0065] In these optional embodiments, the packaging part 610 corresponding to the third isolation opening 243 includes only the first sublayer 620 and the second sublayer 640, and there is no need to set the protective layer 630, thereby reducing the material usage of the protective layer 630 and reducing the cost. Since the third light-emitting unit 313 and its corresponding packaging part 610 are prepared last and will not be damaged by etching, there is no need to set the protective layer 630 to improve the etching resistance of the packaging part 610 corresponding to the third light-emitting unit 313.

[0066] Optionally, the first light emitting unit 311, the second light emitting unit 312 and the third light emitting unit 313 have different light emitting colors. For example, the first light emitting unit 311 has a red light emitting color, the second light emitting unit 312 has a green light emitting color, and the third light emitting unit 313 has a blue light emitting color.

[0067] In some optional embodiments, the thickness of the packaging portion 610 corresponding to the third isolation opening 243 is smaller than the thickness of the packaging portion 610 corresponding to the first isolation opening 241 and the second isolation opening 242 .

[0068] In these optional embodiments, the thickness of the packaging portion 610 corresponding to the first isolation opening 241 and the second isolation opening 242 is set to be larger, so as to have the ability to resist etching damage in the subsequent preparation process of the light-emitting unit 310, so as to improve the problem that the first light-emitting unit 311 and the second light-emitting unit 312 are damaged by etching, resulting in dark spots in the display panel 10.

[0069] In some optional embodiments, in the same packaging portion 610 , the thickness of the first sub-layer 620 is greater than or equal to the thickness of the second sub-layer 640 .

[0070] In these optional embodiments, since the first sub-layer 620 is prepared first, after the preparation of the first sub-layer 620, it is easily affected by the etching in the subsequent process. The thickness of the first sub-layer 620 is set to be larger, so that the etching resistance of the first sub-layer 620 is improved, which can improve the problem that the thickness of the first sub-layer 620 is too thin, resulting in the first sub-layer 620 being over-etched in the subsequent process, the light-emitting unit 310 being exposed and damaged by etching, and the display panel 10 having dark spots.

[0071] In some optional embodiments, the thickness of the protective layer 630 is greater than or equal to the thickness of the first sub-layer 620 , and / or the thickness of the protective layer 630 is greater than or equal to the thickness of the second sub-layer 640 .

[0072] In these optional embodiments, the thickness of the protective layer 630 is greater than the thickness of the first sublayer 620 or the second sublayer 640, that is, the protective layer 630 has a greater thickness, and the encapsulation part 610 has better etching resistance, thereby forming etching protection for the light-emitting unit 310, so as to improve the problem that when the subsequent light-emitting unit 310 is prepared, the encapsulation part 610 corresponding to the previously prepared light-emitting unit 310 is easily over-etched, resulting in etching damage to the light-emitting unit 310 and the generation of dark spots.

[0073] like Figure 4 As shown, in some optional embodiments, the first electrode 410 includes a first section 411 and a second section 412 that are interconnected, the orthographic projection of the second section 412 on the substrate 100 is located within the orthographic projection of the isolation structure 200 on the substrate 100, and the thickness of the first section 411 is greater than or equal to the thickness of the second section 412.

[0074] In these optional embodiments, the first section 411 has a greater thickness, so that the first section 411 has better etching resistance, thereby avoiding the problem that the first section 411 is etched and fails in subsequent processes.

[0075] Optionally, at least part of the orthographic projection of the second section 412 on the substrate 100 is located within the orthographic projection of the protective layer 630 on the substrate 100, and the protective layer 630 covers at least part of the area where the second section 412 is located to form etching protection for the first electrode 410 in the weak thickness area.

[0076] Optionally, the portion of the second section 412 located on the other side of the first section 411 in the first direction X is located within the orthographic projection of the protective layer 630 on the substrate 100, and the portion of the second section 412 adjacent to the spaced isolation structure 200 is covered and protected by the protective layer 630 to form etching protection for this portion of the second section 412.

[0077] Optionally, the first electrode 410 is separated from the isolation structure 200 on the other side of the first direction X to form a gap 420, and at least part of the gap 420 is located within the projection of the protective layer 630 on the substrate 100. Since the first electrode 410 does not form an etching barrier in the area where the gap 420 is located, when the packaging part 610 is etched through at this position, the underlying film layer is easily etched and damaged. Therefore, a protective layer 630 is set to cover the area where the gap 420 is located to form etching protection for the area where the gap 420 is located, thereby improving the problem that the underlying film layer is easily etched and damaged.

[0078] See also Figure 5 , Figure 5 is a partial cross-sectional view of a display panel in yet another embodiment.

[0079] like Figure 5 As shown, optionally, the minimum distance between the surface of the protective layer 630 on the side facing away from the substrate 100 and the substrate 100 is a first distance D1, the first sub-layer 620 includes a first sub-portion located on the side of the second sub-portion 412 facing away from the substrate 100 and in contact with the second sub-portion 412, the maximum distance between the surface of the first sub-portion on the side facing away from the substrate 100 and the substrate 100 is a second distance D2, the first distance D1 is greater than the second distance D2, that is, the protective layer 630 is arranged higher than the first sub-portion, so that the protective layer 630 covers the thickness weak area of ​​the first sub-layer 620 on the peripheral side, thereby forming etching protection for the thickness weak area.

[0080] Optionally, the first sub-layer 620 further includes a second sub-portion located on a side of the first sub-portion 411 away from the substrate 100 , the second sub-portion is interconnected with the first sub-portion, and the thickness of the second sub-portion is greater than that of the first sub-portion.

[0081] Optionally, the orthographic projection of the first sub-portion on the substrate 100 coincides with the orthographic projection of the second sub-portion 412 on the substrate 100, and the area where the second sub-portion 412 is located is the area where the first sub-portion is located. This area and the area located on the side of this area facing the isolation structure 200 are both weak thickness areas. The first sub-layer 620 is more easily etched through in the weak thickness area. Therefore, after setting the protective layer 630, the protective layer 630 can fill and protect the weak thickness area to improve the etching resistance of the packaging part 610.

[0082] In some optional embodiments, the display panel 10 further includes: a pixel definition layer 500 located on one side of the substrate 100 , the pixel definition layer 500 including a pixel defining portion 510 and a pixel opening 520 enclosed by the pixel defining portion 510 , and the pixel opening 520 is connected to the isolation opening 240 .

[0083] In these optional embodiments, the pixel defining portion 510 of the pixel defining layer 500 encloses a pixel opening 520 to set the light emitting unit 310 and realize normal light emission of the light emitting unit 310. In addition, the pixel defining portion 510 defines the setting area of ​​each light emitting unit 310 to reduce the cross-color defect between each light emitting unit 310.

[0084] Optionally, the material of the pixel defining portion 510 includes an inorganic material or an organic material.

[0085] Optionally, the display panel 10 further includes a second electrode 530 located between the substrate 100 and the light-emitting unit 310, and at least a portion of the second electrode 530 is exposed by the pixel opening 520 to serve as an electrode of the light-emitting unit 310 to drive the light-emitting unit 310 to emit light. One of the first electrode 410 and the second electrode 530 serves as an anode of the light-emitting unit 310, and the other serves as a cathode of the light-emitting unit 310. In the embodiment of the present application, the first electrode 410 is used as the cathode of the light-emitting unit 310, and the second electrode 530 is used as the anode of the light-emitting unit 310 for illustration.

[0086] In some optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on a side of the first layer 210 facing away from the substrate 100 , and an orthographic projection of the first layer 210 on the substrate 100 is located within an orthographic projection of the second layer 220 on the substrate 100 .

[0087] In these optional embodiments, the isolation structure 200 includes a first layer 210 and a second layer 220 located on the side of the first layer 210 facing away from the substrate 100. The first layer 210 and the second layer 220 are stacked to form the isolation structure 200. The orthographic projection of the first layer 210 arranged close to the substrate 100 on the substrate 100 is located within the orthographic projection of the second layer 220 on the substrate 100. The area of ​​the second layer 220 is larger than the area of ​​the first layer 210. The second layer 220 covers the surface of the first layer 210 close to the second layer 220. At this time, the first layer 210 is recessed relative to the second layer 220 in a direction away from the isolation opening 240. When preparing the light-emitting layer 300, a large step is generated at the edge of the isolation structure 200 of the light-emitting layer 300, and the first layer 210 is concave relative to the second layer 220. The light-emitting layer 300 is difficult to connect at the edge of the isolation structure 200, and thus breaks. The light-emitting layer 300 breaks to form light-emitting units 310 that are disconnected from each other, thereby reducing crosstalk of carriers in the light-emitting layer 300 and improving the display effect of the display panel 10. In addition, the light-emitting unit 310 can be prepared without using a precision mask plate, which can reduce the development and use of precision masks and reduce preparation costs.

[0088] Optionally, the first layer 210 includes a conductive material, for example, the first layer 210 includes a non-metallic conductive material or a metallic conductive material.

[0089] In some optional embodiments, the second layer 220 includes a conductive material or an insulating material.

[0090] In these optional embodiments, the second layer 220 includes a conductive material, for example, the second layer 220 includes a non-metallic conductive material or a metallic conductive material. When the second layer 220 is a non-metallic conductive material or an insulating material, the second layer 220 is difficult to be etched during wet etching of the first layer 210 using an etching solution, so that the first layer 210 is more easily concavely arranged relative to the second layer 220.

[0091] In some optional embodiments, both the first layer 210 and the second layer 220 include metal materials, and the materials of the first layer 210 and the second layer 220 are different.

[0092] In these optional embodiments, when both the first layer 210 and the second layer 220 are made of metal materials, the first layer 210 may be wet-etched with an etching solution, and the etching rate of the second layer 220 may be set to be lower than the etching rate of the first layer 210 by setting the etching solution. Since the etching rate of the first layer 210 is relatively high, when the etching solution is used for wet etching, even if the second layer 220 is etched to a certain extent, the first layer 210 is etched faster, so that the first layer 210 is set concave relative to the second layer 220.

[0093] See also Figure 6 , Figure 6 is a partial cross-sectional view of a display panel in yet another embodiment.

[0094] like Figure 6 As shown, in some optional embodiments, the isolation structure 200 further includes a third layer 230 located on the side of the first layer 210 facing the substrate 100 , and the orthographic projection of the first layer 210 on the substrate 100 is located within the orthographic projection of the third layer 230 on the substrate 100 .

[0095] In these optional embodiments, in order to obtain the first layer 210 with a concave setting, the first layer 210 has a faster etching rate than the second layer 220 and the third layer 230 during the etching process, thereby forming the concave first layer 210. Since the etching rate of the first layer 210 is faster, the waste generated by etching is more likely to enter other positions of the display panel 10, thereby causing adverse effects. After the third layer 230 is set, the first layer 210 can be well attached to the third layer 230, and the generated etching waste falls on the third layer 230, which is easy to clean.

[0096] Optionally, the display panel 10 further includes a second encapsulation layer located on a side of the encapsulation portion 610 facing away from the substrate 100 .

[0097] Optionally, the material of the second encapsulation layer includes organic material.

[0098] Optionally, the display panel 10 further includes a third encapsulation layer located on a side of the second encapsulation layer away from the substrate 100 .

[0099] Optionally, the material of the third encapsulation layer includes an inorganic material.

[0100] Optionally, the light-emitting material layer includes an electron injection layer (EIL), an electron transport layer (ETL), a light-emitting material layer, a hole injection layer (HIL) and a hole transport layer (HTL). The light-emitting unit 310 includes only at least one of the electron injection layer (EIL), the electron transport layer (ETL), the light-emitting material layer, the hole injection layer (HIL) and the hole transport layer (HTL), and does not include structures such as the first electrode 410 and the second electrode 530.

[0101] like Figures 1 to 6As shown, the second embodiment of the present application provides a display panel 10, which includes: a substrate 100; an isolation structure 200, which is located on one side of the substrate 100, and the isolation structure 200 encloses a plurality of isolation openings 240; a light-emitting layer 300, which is located on one side of the substrate 100, and the light-emitting layer 300 includes a light-emitting unit 310 at least partially located in the isolation opening 240; a first electrode layer 400, which is located on a side of the light-emitting layer 300 away from the substrate 100, and the first electrode layer 400 includes a plurality of first electrodes 410 located in the plurality of isolation openings 240, and the first electrodes 410 are electrically connected to the isolation structure 200; and a packaging portion 610, which is located on On the side of the light-emitting layer 300 facing away from the substrate 100, at least part of the encapsulation part 610 is located in the isolation opening 240, and the encapsulation part 610 is used to encapsulate the light-emitting unit 310, wherein at least part of the encapsulation part 610 includes a first sublayer 620, a protective layer 630 and a second sublayer 640 stacked in sequence in a direction away from the substrate 100, and a first recessed space 650 is formed on the side of the isolation structure 200, the first sublayer 620 encloses a second recessed space 660 at the first recessed space 650, and the extending portion 631 is located in the second recessed space 660, and in the same encapsulation part 610, the thickness of the first sublayer 620 is greater than or equal to the thickness of the second sublayer 640.

[0102] According to the display panel 10 of the embodiment of the present application, the display panel 10 includes a substrate 100, an isolation structure 200, a light-emitting layer 300, a first electrode layer 400 and a packaging part 610. When preparing the light-emitting layer 300, the light-emitting layer 300 has a large drop at the edge of the isolation structure 200, which is difficult to connect, and thus breaks. The light-emitting layer 300 breaks to form light-emitting units 310 that are disconnected from each other and located in the isolation opening 240. There is no need to use a precision mask plate, which can reduce the development and use of precision masks and reduce the preparation cost. The packaging part 610 is used to package the light-emitting unit 310 to increase the service life of the light-emitting unit 310. The extension part 631 fills the second recessed space 660 to prevent the weak parts of the packaging part 610 and the first electrode 410 exposed by the second recessed space 660 from being easily etched, resulting in the problem that the light-emitting unit 310 prepared first is etched. Since the first sub-layer 620 is prepared first, it is easily affected by etching in the subsequent process after the preparation of the first sub-layer 620. The thickness of the first sub-layer 620 is set to be larger, so that the etching resistance of the first sub-layer 620 is improved, which can improve the problem that the thickness of the first sub-layer 620 is too thin, resulting in the first sub-layer 620 being over-etched in the subsequent process, the light-emitting unit 310 being exposed and damaged by etching, and the display panel 10 having dark spots.

[0103] In this embodiment, other structures may refer to the aforementioned related descriptions and will not be described in detail here.

[0104] The structural design in this embodiment can be applied to other display panels 10 , and the specific selection can be made according to actual conditions, and this application does not impose any specific restrictions on it.

[0105] See also Figures 1 to 14 , Figure 7 is a flow chart of a method for preparing a display panel provided in an embodiment of the present application; Figures 8 to 14 This is a diagram of a preparation process of a display panel provided in an embodiment of the present application.

[0106] like Figures 1 to 14 As shown, an embodiment of the third aspect of the present application provides a method for preparing a display panel 10, the method comprising: Step S01: preparing an isolation structure 200 on a substrate 100 , wherein the isolation structure 200 encloses a plurality of isolation openings 240 , and the isolation openings 240 include a first isolation opening 241 ; Step S02: Prepare a first light-emitting material layer, a first electrode material layer, a first material layer 601, a second material layer 602 and a third material layer 603 in sequence on the substrate 100, and pattern the first light-emitting material layer, the first electrode material layer, the first material layer 601, the second material layer 602 and the third material layer 603 to form a first light-emitting unit 311, a first sub-electrode and a first packaging part 611 at least partially located in the first isolation opening 241, the first packaging part 611 includes a first sub-layer 620, a protective layer 630 and a second sub-layer 640 stacked in sequence in a direction away from the substrate 100, a first recessed space 650 is formed on the side of the isolation structure 200, the protective layer 630 includes at least an extending portion 631, and the extending portion 631 is located in the first recessed space 650.

[0107] According to the preparation method of the embodiment of the present application, the isolation structure 200 is prepared by step S01. The first light-emitting unit 311, the first sub-electrode and the first packaging part 611 are prepared by step S02. When the first packaging part 611 includes a first sub-layer 620, a protective layer 630 and a second sub-layer 640, the first packaging part 611 of the three-layer structure has better anti-etching ability, forming etching protection for the first light-emitting unit 311, so as to improve the preparation of the second light-emitting unit 312 and the second packaging part 612 after the preparation of the first light-emitting unit 311 and the first packaging part 611 is completed. The preparation process of the second light-emitting unit 312 and the second packaging part 612 contains an etching process, which is easy to cause over-etching of the first packaging part 611, resulting in etching damage to the first light-emitting unit 311 and the generation of dark spots. It can also improve the problem that after the second light-emitting unit 312 and the second packaging unit 612 are prepared, the third light-emitting unit 313 and the third packaging unit 613 are prepared. The preparation process of the third light-emitting unit 313 and the third packaging unit 613 includes an etching process, which easily causes over-etching of the first packaging unit 611, resulting in etching damage to the first light-emitting unit 311 and the generation of dark spots. Among them, the first material layer 601, the second material layer 602 and the third material layer 603 are patterned in sequence to form a first sub-layer 620, a protective layer 630 and a second sub-layer 640. The preparation process of the second material layer 602 can be inkjet printing or a glue coating process.

[0108] Optionally, the steps of sequentially preparing a first light emitting material layer, a first electrode material layer, a first material layer 601, a second material layer 602 and a third material layer 603 on the substrate 100 include: A first light emitting material layer, a first electrode material layer and a first material layer 601 are sequentially prepared on the substrate 100 , and the first material layer 601 is recessed in the first isolation opening 241 toward the substrate 100 to form a first groove 601 a ; A fluid material layer is prepared in the first groove 601 a and the fluid material layer is solidified to form a second material layer 602 located in the first groove 601 a ; A third material layer 603 is prepared on the side of the second material layer 602 facing away from the substrate 100. In these optional embodiments, the second material layer 602 is obtained by forming a fluid material layer (e.g., a wet film) on the first material layer 601 and curing the fluid material layer. Optionally, the material of the fluid material layer includes an organic material. For example, the material of the fluid material layer and the second material layer 602 includes at least one of OCA (Optically Clear Adhesive, OCA), MLA, IJP (Inkjet Printing, IJP), PLN (Planarization Layer, PLN), and PR (Photoresist, PR). Taking OCA as an example, firstly, the glue is mixed: the resin, curing agent and tackifier are mixed in proportion and deaerated; then the coating is carried out to form a film: the release film is coated with a thickness of 25μm-200μm; then the pre-curing is carried out: UV irradiation or thermal curing is carried out to form initial adhesion; then the lamination is carried out: pressurized and bonded to the target layer in a clean room to eliminate bubbles; finally, the final curing is carried out: further UV / thermal curing is carried out to achieve the final bonding strength (>10 N / cm²). Taking IJP as an example, the ink is precisely deposited on the specified area of ​​the substrate (inkjet printing) through a piezoelectric nozzle to form a wet film, which is irradiated with ultraviolet light in an air environment to trigger a cross-linking reaction to form a stable film. Taking PLN as an example, the material is first coated: spin coating (Spin Coating) or slot coating (Slot-Die) film, thickness 1μm -5 μm; then pre-curing: 80℃-120℃ baking to remove solvent, forming a semi-cured layer; then flattening: through thermal reflow (150℃-200℃) or chemical mechanical polishing (CMP), the surface roughness is <1 nm; finally, final curing: UV light or high temperature (250℃) completely cross-linked, hardness reaches more than 3H. Taking PR as an example, the material is first coated and pre-baked: spin coating film (1μm -2μm), 90℃-120℃ baking curing; then exposure and development: exposure through mask (100 mJ / cm²-200 mJ / cm²), alkaline developer removes unexposed areas; finally, post-baking: 210℃-240℃ high temperature treatment to enhance the heat resistance and insulation of the film layer.

[0109] Optionally, the material of the first material layer 601 includes an inorganic material to form a first sub-layer 620 of an inorganic material.

[0110] Optionally, the material of the second material layer 602 includes an organic material to form a protective layer 630 of an organic material.

[0111] Optionally, the material of the third material layer 603 includes an inorganic material to form a second sub-layer 640 of an inorganic material.

[0112] In some optional embodiments, the isolation structure 200 further includes a second isolation opening 242. After step S02, the method includes: A second light-emitting material layer, a second electrode material layer and a second packaging material layer are prepared on the substrate 100, and the second light-emitting material layer, the second electrode material layer and the second packaging material layer are patterned to form a second light-emitting unit 312, a second sub-electrode and a second packaging part 612 that are at least partially located within the second isolation opening 242. The second packaging part 612 includes a first sub-layer 620, a protective layer 630 and a second sub-layer 640 that are stacked in sequence in a direction away from the substrate 100.

[0113] In these optional embodiments, when the second packaging part 612 includes a first sublayer 620, a protective layer 630 and a second sublayer 640, the three-layer structure of the second packaging part 612 has better etching resistance, forming etching protection for the second light-emitting unit 312, so as to improve the preparation of the third light-emitting unit 313 and the third packaging part 613 after the preparation of the second light-emitting unit 312 and the second packaging part 612 is completed. The preparation process of the third light-emitting unit 313 and the third packaging part 613 involves an etching process, which can easily cause over-etching of the second packaging part 612, resulting in etching damage to the second light-emitting unit 312 and the generation of dark spots.

[0114] In some optional embodiments, in the step of preparing a second light-emitting material layer, a second electrode material layer, and a second packaging material layer on the substrate 100, and patterning the second light-emitting material layer, the second electrode material layer, and the second packaging material layer to form a second light-emitting unit 312, a second sub-electrode, and a second packaging portion 612 at least partially located in the second isolation opening 242, the method includes: Preparing a second light emitting material layer and a second electrode material layer on the substrate 100; A fourth material layer 604, a fifth material layer 605 and a sixth material layer 606 are sequentially prepared on the side of the second electrode material layer facing away from the substrate 100; The second light-emitting material layer, the second electrode material layer, the fourth material layer 604 , the fifth material layer 605 and the sixth material layer 606 are patterned to form a second light-emitting unit 312 , a second sub-electrode, a first sub-layer 620 , a protective layer 630 and a second sub-layer 640 at least partially located in the second isolation opening 242 .

[0115] In these optional embodiments, the first sub-layer 620 , the protective layer 630 , and the second sub-layer 640 are prepared with three layers of materials to form a second encapsulation portion 612 with a three-layer structure.

[0116] Optionally, the material of the fourth material layer 604 includes an inorganic material to form a first sub-layer 620 of an inorganic material.

[0117] Optionally, the material of the fifth material layer 605 includes an organic material to form a protective layer 630 of an organic material.

[0118] Optionally, the material of the sixth material layer 606 includes an inorganic material to form a second sub-layer 640 of an inorganic material.

[0119] In some optional embodiments, the isolation structure 200 further includes a third isolation opening 243. After the step of forming a second light emitting unit 312, a second sub-electrode, and a second encapsulation portion 612 at least partially located in the second isolation opening 242, the method includes: A third light-emitting material layer, a third electrode material layer and a third encapsulation material layer are prepared on the substrate 100 and patterned to form a third light-emitting unit 313, a third sub-electrode and a third encapsulation portion 613 at least partially located within the third isolation opening 243.

[0120] In these optional embodiments, the third light-emitting unit 313, the third sub-electrode and the third packaging part 613 are prepared last and will not be damaged by subsequent etching. Therefore, there is no need to set a protective layer 630 in the third packaging part 613 to reduce the material usage of the protective layer 630 and reduce material costs.

[0121] Optionally, the material of the third encapsulation part 613 includes an inorganic material.

[0122] The embodiment of the fourth aspect of the present application also provides a display device, including the display panel 10 of any of the above embodiments, or the display panel 10 prepared by the preparation method of any of the embodiments. Since the display device provided by the embodiment of the fourth aspect of the present application includes the display panel 10 of any of the above embodiments, or the display panel 10 prepared by the preparation method of any of the embodiments, the display device provided by the embodiment of the fourth aspect of the present application has the beneficial effects of the display panel 10 of any of the above embodiments, or the display panel 10 prepared by the preparation method of any of the embodiments, which will not be repeated here.

[0123] The display device in the embodiments of the present application includes but is not limited to mobile phones, personal digital assistants (PDAs), tablet computers, e-books, televisions, access control systems, smart landline phones, consoles, and other devices with display functions.

[0124] According to the embodiments described above, these embodiments do not describe all the details in detail, nor do they limit the invention to the specific embodiments described. Obviously, many modifications and changes can be made based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present application, so that those skilled in the art can make good use of the present application and the modifications based on the present application. The present application is limited only by the claims and their full scope and equivalents.

Claims

1. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure, located on one side of the substrate, the isolation structure encloses a plurality of isolation openings; A light-emitting layer, located on one side of the substrate, the light-emitting layer comprising a light-emitting unit at least partially located in the isolation opening; A first electrode layer, located on a side of the light-emitting layer away from the substrate, the first electrode layer comprising a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; an encapsulation portion, located on a side of the first electrode layer away from the substrate, at least a portion of the encapsulation portion is located in the isolation opening, and the encapsulation portion is used to encapsulate the light-emitting unit, Among them, at least part of the packaging part includes a first sublayer, a protective layer and a second sublayer stacked in sequence in a direction away from the substrate, a first recessed space is formed on the side of the isolation structure, and the protective layer at least includes an extending portion, which is located in the first recessed space.

2. The display panel according to claim 1, characterized in that: The first sub-layer forms a second concave space at the first concave space, and the protruding portion is located in the second concave space.

3. The display panel according to claim 1, characterized in that: The second sublayer contacts the first sublayer on the circumferential side and encloses a closed space, the protective layer is located in the closed space, and the orthographic projection of the light-emitting unit corresponding to the protective layer on the substrate is located within the orthographic projection of the protective layer on the substrate.

4. The display panel according to claim 2, characterized in that: At least part of the first electrode contacts the isolation structure on one side in the first direction, and is spaced apart from the isolation structure on the other side.

5. The display panel according to claim 4, characterized in that: The protruding portion is located in the second concave space close to the isolation structure on the other side in the first direction; And / or, the protruding portion fills up the second recessed space close to the isolation structure on one side in the first direction.

6. The display panel according to claim 4, characterized in that: The first electrode includes a first sub-portion and a second sub-portion connected to each other, the orthographic projection of the second sub-portion on the substrate is located within the orthographic projection of the isolation structure on the substrate, and the thickness of the first sub-portion is greater than or equal to the thickness of the second sub-portion.

7. The display panel according to claim 6, characterized in that: At least a portion of the second sub-portion is located within the orthographic projection of the protective layer on the substrate; And / or, the orthographic projection of a portion of the second subsection located on the other side of the first subsection in the first direction on the substrate is located within the orthographic projection of the protective layer on the substrate; And / or, the first electrode is spaced from the isolation structure at the other side of the first direction to form a gap, and at least a portion of the gap is located within the orthographic projection of the protective layer on the substrate; And / or, the minimum distance between the surface of the protective layer facing away from the substrate and the substrate is a first distance, the first sub-layer includes a first sub-portion located at the side of the second portion facing away from the substrate and in contact with the second portion, the maximum distance between the surface of the first sub-portion facing away from the substrate and the substrate is a second distance, and the first distance is greater than the second distance.

8. The display panel according to claim 1, characterized in that: The light-emitting unit includes a first light-emitting unit and a second light-emitting unit, the isolation opening includes a first isolation opening and a second isolation opening, the first light-emitting unit is located in the first isolation opening, and the second light-emitting unit is located in the second isolation opening, and in at least one of the first isolation opening and the second isolation opening, the encapsulation part includes the first sublayer, the protective layer and the second sublayer stacked in sequence in a direction away from the substrate, the first light-emitting unit and the second light-emitting unit have different light-emitting colors, the material of the protective layer includes an organic material, and the materials of the first sublayer and the second sublayer include an inorganic material.

9. The display panel according to claim 8, characterized in that: The thickness of the packaging portion corresponding to the first isolation opening is greater than or equal to the thickness of the packaging portion corresponding to the second isolation opening; And / or, a thickness of the protection layer in the first isolation opening is greater than a thickness of the protection layer in the second isolation opening.

10. The display panel according to claim 8, characterized in that: The light-emitting unit also includes a third light-emitting unit, and the isolation opening also includes a third isolation opening. The third light-emitting unit is located in the third isolation opening. In the third isolation opening, the packaging part corresponding to the third light-emitting unit includes a first sublayer and a second sublayer that are stacked and fully contacted. The first light-emitting unit, the second light-emitting unit, and the third light-emitting unit have different light-emitting colors, and the thickness of the packaging part corresponding to the third isolation opening is less than the thickness of the packaging part corresponding to the first isolation opening and the second isolation opening.

11. The display panel according to claim 1, characterized in that: In the same encapsulation part, the thickness of the first sub-layer is greater than or equal to the thickness of the second sub-layer; And / or, the thickness of the protective layer is greater than or equal to the thickness of the first sub-layer, and / or, the thickness of the protective layer is greater than or equal to the thickness of the second sub-layer.

12. The display panel according to claim 1, characterized in that: The display panel further includes: A pixel definition layer, located on one side of the substrate, the pixel definition layer comprising a pixel definition portion and a pixel opening formed by the pixel definition portion, the pixel opening being connected to the isolation opening; The display panel further includes a second electrode located between the substrate and the light emitting unit, and at least a portion of the second electrode is exposed by the pixel opening.

13. The display panel according to claim 1, characterized in that: The isolation structure comprises a first layer and a second layer located on a side of the first layer away from the substrate, wherein an orthographic projection of the first layer on the substrate is located within an orthographic projection of the second layer on the substrate; The first layer includes a conductive material; and / or, the second layer comprises a conductive material or an insulating material; and / or, the first layer and the second layer both comprise metal materials, and the materials of the first layer and the second layer are different; And / or, the isolation structure further includes a third layer located on a side of the first layer facing the substrate, and an orthographic projection of the first layer on the substrate is located within an orthographic projection of the third layer on the substrate.

14. A display panel, characterized in that: The display panel comprises: substrate; An isolation structure, located on one side of the substrate, the isolation structure encloses a plurality of isolation openings; A light-emitting layer, located on one side of the substrate, the light-emitting layer comprising a light-emitting unit at least partially located in the isolation opening; A first electrode layer, located on a side of the light-emitting layer away from the substrate, the first electrode layer comprising a plurality of first electrodes located in the plurality of isolation openings, the first electrodes being electrically connected to the isolation structure; an encapsulation portion, located on a side of the first electrode layer away from the substrate, at least a portion of the encapsulation portion is located in the isolation opening, and the encapsulation portion is used to encapsulate the light-emitting unit, Among them, at least part of the packaging part includes a first sublayer, a protective layer and a second sublayer stacked in sequence in a direction away from the substrate, a first concave space is formed on the side of the isolation structure, the protective layer at least includes an extending portion, the first sublayer encloses a second concave space at the first concave space, and the extending portion is located in the second concave space. In the same packaging part, the thickness of the first sublayer is greater than or equal to the thickness of the second sublayer.

15. A method for preparing a display panel, characterized in that: The method comprises: Preparing an isolation structure on a substrate, wherein the isolation structure encloses a plurality of isolation openings, and the isolation openings include a first isolation opening; A first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer and a third material layer are prepared in sequence on the substrate, and the first light-emitting material layer, the first electrode material layer, the first material layer, the second material layer and the third material layer are patterned to form a first light-emitting unit, a first sub-electrode and a first packaging portion that are at least partially located within the first isolation opening, the first packaging portion comprising a first sub-layer, a protective layer and a second sub-layer stacked in sequence in a direction away from the substrate, a first recessed space is formed on the side of the isolation structure, the protective layer at least comprises an extending portion, and the extending portion is located within the first recessed space.

16. The preparation method according to claim 15, characterized in that: The steps of sequentially preparing a first light-emitting material layer, a first electrode material layer, a first material layer, a second material layer and a third material layer on the substrate include: A first light-emitting material layer, a first electrode material layer and a first material layer are sequentially prepared on the substrate, wherein the first material layer is recessed in the first isolation opening toward the substrate to form a first groove; Preparing a fluid material layer in the first groove and curing the fluid material layer to form a second material layer located in the first groove; A third material layer is prepared on a side of the second material layer facing away from the substrate.

17. The preparation method according to claim 16, characterized in that: The second sub-layer is in contact with the first sub-layer at the circumferential side and encloses a closed space, and the protective layer is located in the closed space; And / or, the material of the fluid material layer includes organic material; And / or, the material of the fluid material layer includes at least one of PLN, MLA, OC, PR, and IJP; And / or, the material of the first material layer includes an inorganic material; And / or, the material of the second material layer includes an organic material; and / or, the material of the third material layer includes an inorganic material.

18. The preparation method according to claim 16, characterized in that: The isolation structure further includes a second isolation opening. After the step of forming a first light emitting unit, a first sub-electrode, and a first encapsulation portion that are at least partially located in the first isolation opening, the method includes: A second light-emitting material layer, a second electrode material layer and a second packaging material layer are prepared on the substrate, and the second light-emitting material layer, the second electrode material layer and the second packaging material layer are patterned to form a second light-emitting unit, a second sub-electrode and a second packaging part that are at least partially located within the second isolation opening, and the second packaging part includes a first sub-layer, a protective layer and a second sub-layer stacked in sequence in a direction away from the substrate.

19. The preparation method according to claim 18, characterized in that: The isolation structure further includes a third isolation opening, and after the step of forming a second light emitting unit, a second sub-electrode, and a second encapsulation portion that are at least partially located in the second isolation opening, the method includes: A third light-emitting material layer, a third electrode material layer and a third encapsulation material layer are prepared on the substrate, and the third light-emitting material layer, the third electrode material layer and the third encapsulation material layer are patterned to form a third light-emitting unit, a third sub-electrode and a third encapsulation part that are at least partially located within the third isolation opening, and the material of the third encapsulation part includes an inorganic material.

20. A display device, characterized in that: A display panel comprising any one of claims 1 to 14, or a display panel prepared by the preparation method of any one of claims 15 to 19.

Images