Semiconductor lens processing method and processing device

Abstract

The present invention discloses a semiconductor lens processing method and processing device. Based on the processing capability of a machine tool, the minimum consumed thickness of the lens edge when the machine tool processes the concave and convex surfaces of the semiconductor lens to a surface that meets the lens appearance requirements is obtained respectively; based on the minimum consumed thickness of the lens edge and the concave and convex curvatures of the semiconductor lens, the lens center consumed thickness corresponding to the minimum consumed thickness of the lens edge is determined, so that in the fine grinding stage, the corresponding center thickness margin can be reserved according to the processing requirements of the concave and convex surfaces of the semiconductor lens, and the synchronous control of the lens appearance and the lens center thickness is achieved, thereby ensuring the quality of the processed semiconductor lens, avoiding the situation where the lens appearance and the center thickness are misaligned to meet the requirements, resulting in the need for secondary correction of the semiconductor lens or the lens being scrapped, and improving the lens processing efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor lens processing, and in particular to a semiconductor lens processing method and processing device. Background Art

[0002] Calcium fluoride crystals, due to their unique optical properties, such as low dispersion and low refractive index, are widely used in the manufacture of various optical components, including lenses, prisms, windows, and substrates for optical coatings. Their wide transmission wavelength range, from the ultraviolet (approximately 157 nanometers) to the far infrared (approximately 8-10 microns), even reaching as low as 12 microns, makes them widely used in high-precision optical systems, including UV lithography, infrared optical systems, high-power lasers, and other military and aerospace applications. This is particularly important when cold-working optical components and substrates to achieve high-precision dimensions and appearance. Due to the unique characteristics of the material during cold working, including its low hardness, fragility, and temperature sensitivity, strict control of appearance and thickness is crucial during the processing, indirectly resulting in highly precise lens dimensions.

[0003] Usually, when cold processing and polishing lenses, a certain amount of lens redundant thickness is consumed to achieve other index requirements and appearance. Generally, the thickness of the lens is measured at the center. However, the consumption relationship between the edge and the center thickness cannot be accurately calculated, resulting in uncertainty in the consumption of the entire curvature surface of the lens. The lens appearance and thickness are misaligned to meet the requirements, resulting in the need for repeated corrections to the lens, affecting processing efficiency. In severe cases, the thickness of the lens is scrapped. Summary of the Invention

[0004] Technical purpose: In view of the shortcomings of existing semiconductor lens processing, the present invention discloses a semiconductor lens processing method and processing device that simultaneously ensures the lens processing thickness and appearance and improves the lens processing efficiency.

[0005] Technical solution: To achieve the above technical objectives, the present invention adopts the following technical solution:

[0006] A method for processing a semiconductor lens comprises the following steps:

[0007] S01. Based on the processing capability of the machine tool, obtain the minimum consumed thickness of the lens edge when the machine tool polishes the concave and convex surfaces of the semiconductor lens to a surface that meets the lens appearance requirements;

[0008] S02. Determine the center thickness of the lens corresponding to the minimum edge thickness of the lens and the curvature of the concave and convex surfaces of the semiconductor lens based on the minimum edge thickness of the lens and the curvature of the concave and convex surfaces of the semiconductor lens. The center thickness of the lens is the change in center thickness of the semiconductor lens caused by polishing the concave or convex surface of the semiconductor lens to meet the appearance requirements of the lens.

[0009] S03, determining the processing size of the semiconductor lens in the pre-polishing fine grinding process according to the determined lens center consumption thickness;

[0010] S04. After the fine grinding is completed, the concave and convex surfaces of the semiconductor lens are polished using a machine tool to make the center thickness of the lens meet the requirements while completing the surface shape and appearance processing of the semiconductor lens.

[0011] Preferably, in step S02 of the present invention, the process of determining the lens center consumption thickness corresponding to the minimum consumption thickness of the lens edge includes: establishing a semiconductor lens contour model according to the concave curvature, convex curvature and lens diameter of the semiconductor lens, and processing the minimum consumption thickness of the lens edge corresponding to the concave and convex surfaces of the semiconductor lens by machine tools, translating the concave and convex surfaces of the semiconductor lens contour along the central axis direction of the lens so that the spacing between the corresponding contour lines before and after the translation reaches the corresponding minimum consumption thickness value of the lens edge, and obtaining the lens center position distance based on the contour line positions before and after the translation. The lens center position distance on the semiconductor contour is the lens center consumption thickness.

[0012] Preferably, the semiconductor lens contour model of the present invention uses a cross-sectional contour line at the center of the semiconductor lens.

[0013] Preferably, in step S03 of the present invention, when determining the processing size of the semiconductor lens in the fine grinding process, the center thickness of the semiconductor lens after fine grinding is made to be the sum of the target center thickness and the lens center consumed thickness.

[0014] The present invention discloses a semiconductor lens processing device, which uses the above-mentioned semiconductor lens processing method to perform lens processing, including a concave grinding tool and a convex grinding tool for grinding and polishing the concave and convex surfaces of the semiconductor lens. The concave grinding tool and the convex grinding tool are respectively connected to the main shaft of the machine tool through corresponding handles. A clamp for clamping and fixing the semiconductor lens is correspondingly arranged above the concave grinding tool and the convex grinding tool. The semiconductor lens is finely ground and polished by replacing the material between the matching surface of the semiconductor lens and the corresponding grinding tool. The material includes diamond pellets with different particle sizes and polyurethane polishing material.

[0015] Preferably, the clamp of the present invention includes a convex clamp and a concave clamp, each of which has a clamping groove that matches the clamping surface of the semiconductor lens, and a pressure mechanism is provided on the side of the convex clamp and the concave clamp facing away from the semiconductor lens to apply pressure to the corresponding clamp to press the semiconductor lens.

[0016] Preferably, the pressure mechanism of the convex clamp of the present invention uses an iron stylus in combination with a V-shaped groove opened in the center of the back of the convex clamp to press the convex clamp, and the opening position of the V-shaped groove corresponds to the central axis position of the semiconductor lens clamped by the convex clamp.

[0017] Preferably, the pressure mechanism of the concave clamp of the present invention includes a pressure head coaxially arranged with the center of the concave clamp, a pressure head groove is arranged on the side of the pressure head close to the concave clamp, and the concave clamp is provided with a protrusion corresponding to the mating surface with the pressure head groove for maintaining the coaxial state of the pressure head and the concave clamp, and a rubber ring is provided between the mating surface of the protrusion and the pressure head groove for filling and sealing.

[0018] Beneficial effects: The semiconductor lens processing method and processing device disclosed in the present invention have the following beneficial effects:

[0019] 1. The present invention determines the minimum consumed thickness of the lens edge for semiconductor lens processing based on the processing capability of the machine tool, and determines the influence of the polishing processing of the lens surface shape on the center thickness of the semiconductor lens based on the minimum consumed thickness of the lens edge, so that in the fine grinding stage, the corresponding center thickness margin can be reserved according to the processing requirements of the concave and convex surfaces of the semiconductor lens, and the synchronous control of the lens appearance and the center thickness of the lens is achieved, thereby ensuring the quality of the processed semiconductor lens, avoiding the situation where the appearance and center thickness are misaligned to meet the requirements, resulting in the need for secondary correction of the semiconductor lens or the lens being scrapped, and improving the lens processing efficiency; the misalignment meeting the requirements means that only one of the appearance and center thickness of the semiconductor lens meets the requirements, that is, when the lens appearance is processed to the required accuracy, the center thickness of the semiconductor lens deviates from the design value, or when polishing is performed according to the center thickness of the semiconductor lens, the surface accuracy of the polishing does not meet the appearance requirements of the semiconductor lens.

[0020] 2. The present invention establishes a semiconductor lens contour model and moves the contour line according to the required minimum consumption thickness of the lens edge, so as to intuitively obtain the accurate center consumption thickness, providing an accurate data source for semiconductor lens processing. At the same time, there is no need to perform complex calculations, and it is only necessary to adjust the corresponding contour model parameters according to the processing requirements of the semiconductor lens and the processing capabilities of the machine tool.

[0021] 3. The semiconductor processing device of the present invention uses a grinding tool to perform fine grinding and polishing of the concave and convex surfaces of the semiconductor lens. Using the same grinding tool can ensure the consistency of the surface shape of the semiconductor lens processed in the fine grinding stage and the polishing stage, thereby facilitating the control of the polishing amount of the lens surface.

[0022] 4. The convex fixture and the concave fixture of the present invention are both provided with grooves matching the corresponding semiconductor lens surface shape, which can ensure the stability of the lens position during lens processing, thereby ensuring the coaxiality of the concave and convex surfaces of the semiconductor lens after processing.

[0023] 5. The pressure mechanism of the concave fixture of the present invention utilizes the pressure head groove of the pressure head to cooperate with the protrusion of the concave fixture, and fills the rubber ring to ensure the stability of the matching surface, which can ensure the stable movement of the lens during lens processing and ensure the processing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for describing the embodiments or the prior art.

[0025] Figure 1 This is a schematic diagram of processing a semiconductor lens using a concave grinding tool according to the present invention;

[0026] Figure 2 This is a schematic diagram of processing a semiconductor lens using a convex grinding tool according to the present invention;

[0027] Figure 3 This is a structural diagram of the semiconductor lens of the present invention;

[0028] Among them, 1- semiconductor lens, 2- concave grinding tool, 3- convex grinding tool, 4- handle, 5- convex fixture, 6- concave fixture, 7- iron pen, 8- V-shaped groove, 9- pressure head, 10- pressure head groove, 11- protrusion, 12- rubber ring. DETAILED DESCRIPTION

[0029] Reference will now be made in detail to the embodiments of the present disclosure, one or more examples of which are set forth herein below. Each embodiment and example is provided by way of explanation of the apparatus, composition, and materials of the present disclosure, and is not intended to be limiting. On the contrary, the following description provides a convenient illustration of exemplary embodiments for implementing the present disclosure. In fact, it will be apparent to those skilled in the art that various modifications and variations can be made within the teachings of the present disclosure without departing from the scope or spirit of the present disclosure.

[0030] The present invention discloses a method for processing a semiconductor lens, comprising the steps of:

[0031] S01. Based on the processing capability of the machine tool, obtain the minimum consumed thickness of the lens edge when the machine tool polishes the concave and convex surfaces of the semiconductor lens to a surface that meets the lens appearance requirements;

[0032] The processing capacity of the machine tool is to use the machine tool to polish the concave and convex surfaces of the semiconductor lens according to the surface processing requirements of the semiconductor lens to achieve the lens grinding amount required for the corresponding processing requirements, which depends on the maximum damage layer caused to the lens surface by the previous fine grinding process. Since the edge position of the lens has the smallest processing amount, the present invention uses the consumed thickness at the edge position of the lens to characterize the lens grinding amount; the machine tool uses the lens edge thickness change corresponding to the minimum grinding amount that can achieve the processing requirements of the corresponding semiconductor lens as the minimum consumed thickness of the lens edge. Generally, the machine tool directly uses the maximum damaged layer depth of the lens surface during fine grinding.

[0033] S02. Based on the minimum consumed thickness of the lens edge and the concave and convex curvatures of the semiconductor lens, determine the lens center consumed thickness corresponding to the minimum consumed thickness of the lens edge. The lens center consumed thickness is the change in the semiconductor lens center thickness caused by polishing the concave or convex surface of the semiconductor lens to meet the lens appearance requirements.

[0034] The last step in the surface processing of the semiconductor lens is the polishing process. The concave and convex curvatures of the semiconductor lens will not change before and after polishing. Therefore, the corresponding change in the center position of the lens can be obtained based on the movement of the concave and convex contour lines of the semiconductor lens caused by polishing. This change is the consumed thickness of the lens center caused by polishing the concave and convex surfaces of the semiconductor lens.

[0035] In an embodiment of the present invention, in order to conveniently determine the center consumption thickness of the lens and meet the processing requirements of different types of processing machines for semiconductor lenses, the process of the present invention for determining the center consumption thickness of the lens corresponding to the minimum consumption thickness of the lens edge includes: establishing a semiconductor lens contour model according to the concave curvature, convex curvature and lens diameter of the semiconductor lens, and according to the minimum consumption thickness of the lens edge corresponding to the concave and convex surfaces of the semiconductor lens processed by the machine tool, translating the concave and convex surfaces of the semiconductor lens contour along the central axis direction of the lens so that the spacing between the corresponding contour lines before and after the translation reaches the corresponding minimum consumption thickness value of the lens edge, and obtaining the lens center position distance based on the contour line position before and after the translation. The lens center position distance on the semiconductor contour is the lens center consumption thickness.

[0036] The establishment of the semiconductor lens contour model can be carried out using existing mature drawing software, and there is no need to generate a complete semiconductor lens model. It is only necessary to use the cross-sectional contour line of the center of the semiconductor lens to confirm the center consumption thickness of the lens. After the semiconductor lens contour model is established, the corresponding minimum consumption thickness of the lens edge can be directly input to adapt to various machine tools with different processing capabilities, and the processing parameters of the fine grinding stage can be adjusted accordingly to ensure that sufficient margin is provided for polishing, so as to achieve synchronous control of the appearance and center thickness of the semiconductor lens.

[0037] S03. Determine the processing size of the semiconductor lens in the fine grinding process before polishing according to the determined lens center consumed thickness; make the center thickness of the semiconductor lens after fine grinding the sum of the target center thickness and the lens center consumed thickness.

[0038] S04. After the fine grinding is completed, the concave and convex surfaces of the semiconductor lens are polished using a machine tool. After the concave and convex surfaces of the semiconductor lens are polished, the center thickness of the semiconductor lens simultaneously meets the requirements while meeting the lens appearance requirements; while the center thickness of the lens meets the requirements, the surface appearance processing of the semiconductor lens is completed.

[0039] In order to realize the above processing method, the present invention also discloses a semiconductor lens processing device, which uses the above semiconductor lens processing method to process the lens, such as Figure 1-Figure 3 As shown, it includes a concave grinding tool 2 and a convex grinding tool 3 for grinding and polishing the concave and convex surfaces of a semiconductor lens 1. The concave grinding tool 2 and the convex grinding tool 3 are respectively connected to the machine tool spindle through corresponding handles 4. A clamp for clamping and fixing the semiconductor lens 1 is correspondingly arranged above the concave grinding tool 2 and the convex grinding tool 3. The semiconductor lens is finely ground and polished by replacing the material between the matching surface of the semiconductor lens 1 and the corresponding grinding tool. The material includes diamond pellets of different particle sizes and polyurethane polishing materials. In the fine grinding stage, 1200# diamond pellets and 1800# diamond pellets are used successively for fine grinding of the semiconductor lens. In the polishing stage, polyurethane polishing materials or other materials capable of polishing the lens surface are used for polishing.

[0040] The processing device of the present invention uses the same grinding tool to process the concave and convex surfaces of the semiconductor lens in the fine grinding and polishing stages, which can ensure that the curvature of the semiconductor lens is not affected by the replacement of the grinding tool or processing equipment during the transition from fine grinding to polishing, thereby maintaining the consistency of the two processes. The lens surface shape is only affected by the grinding amount, and the curvature deviation caused by the fine grinding and polishing processes will not affect the final control accuracy of the center thickness of the semiconductor lens.

[0041] The fixture of the present invention includes a convex fixture 5 and a concave fixture 6, each of which has a clamping groove that matches the clamping surface of the semiconductor lens 1. A pressure mechanism is provided on the side of the convex fixture 5 and the concave fixture 6 facing away from the semiconductor lens 1 to apply pressure to the corresponding fixture to press the semiconductor lens 1. The fixture of the present invention maintains stable compression and fixation of the semiconductor lens during processing by providing a clamping groove, fully ensuring the consistency of the processing axes of the concave and convex surfaces of the semiconductor lens.

[0042] The pressure mechanism of the convex clamp 5 uses an iron stylus 7 in conjunction with a V-shaped groove 8 opened at the center of the back of the convex clamp 5 to press the convex clamp 5. The opening position of the V-shaped groove 8 corresponds to the central axis position of the semiconductor lens 1 clamped by the convex clamp 5.

[0043] The pressure mechanism of the concave clamp 6 includes a pressure head 9 coaxially arranged with the center of the concave clamp 6, and a pressure head groove 10 is provided on the side of the pressure head 9 close to the concave clamp 6. The concave clamp 6 is provided with a protrusion 11 corresponding to the mating surface with the pressure head groove 10 for maintaining the coaxial state of the pressure head 9 and the concave clamp 6, and a rubber ring 12 is provided between the mating surface of the protrusion 11 and the pressure head groove 10 for filling.

[0044] The lens processing method of the present invention is described below using a specific processing example.

[0045] Assume that the diameter of the semiconductor lens is Φ=468.01, R1=267.46, R2=237.96, h=80.62, all units are millimeters.

[0046] R1 is the curvature radius corresponding to the concave curvature of the semiconductor lens, R2 is the curvature radius corresponding to the convex curvature of the semiconductor lens, and h is the center thickness of the semiconductor lens.

[0047] When the polishing removal thickness allowance h1.2=0.03 of the edge thickness of R1=267.46 is set, the center removal thickness allowance h1.1=0.05, where the value of h1.2 depends on the maximum damage layer depth of the grinding tool on the curvature surface of the semiconductor lens during fine grinding.

[0048] Assuming R2 = 237.96, the edge polishing removal thickness allowance h2.2 = 0.03, and the center removal thickness allowance h2.1 = 0.18. The center thickness consumption of the lens is 0.05 + 0.18 = 0.23. When the finished lens thickness is h = 80.62, the thickness of the lens before polishing is h = 80.62 + 0.23 = 80.85.

[0049] In an embodiment of the present invention, the thickness allowances removed during polishing of the concave and convex surfaces of the semiconductor lens are set to be consistent, but this does not limit the equivalence between the concave thickness allowance and the convex thickness allowance. Those skilled in the art should know that in actual processing, the thickness allowances that need to be removed during polishing may be different due to the different grinding tools used for processing the concave and convex surfaces of the semiconductor lens. The numerical values of h1.2 and h2.2 can be adjusted according to the actual situation, which does not affect the implementation of the solution of the present invention.

[0050] During the fine grinding process, the fine grinding process must be controlled based on the lens blank's dimensions, ensuring that the finished semiconductor lens product meets the lens size requirements calculated above. Controlling the amount of fine grinding for the lens's curvature is a mature technology; it only requires controlling the amount of fine grinding for the concave and convex surfaces of the semiconductor lens. This will not be discussed further in this disclosure. The preferred processing device of the present invention avoids using different grinding tools during the fine grinding and polishing processes, resulting in deviations in the curvature of the lens surface between the two processes, which could affect the final control accuracy of the semiconductor lens's center thickness.

[0051] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for processing a semiconductor lens, characterized in that: Including steps: S01. Based on the processing capability of the machine tool, obtain the minimum consumed thickness of the lens edge when the machine tool polishes the concave and convex surfaces of the semiconductor lens to a surface that meets the lens appearance requirements; S02. Determine the center thickness of the lens corresponding to the minimum edge thickness of the lens and the curvature of the concave and convex surfaces of the semiconductor lens based on the minimum edge thickness of the lens and the curvature of the concave and convex surfaces of the semiconductor lens. The center thickness of the lens is the change in center thickness of the semiconductor lens caused by polishing the concave or convex surface of the semiconductor lens to meet the appearance requirements of the lens. S03, determining the processing size of the semiconductor lens in the pre-polishing fine grinding process according to the determined lens center consumption thickness; S04. After fine grinding is completed, the concave and convex surfaces of the semiconductor lens are polished using a machine tool to ensure that the center thickness of the lens meets the requirements while completing the surface shape and appearance processing of the semiconductor lens; In step S02, the process of determining the lens center consumption thickness corresponding to the minimum consumption thickness of the lens edge includes: establishing a semiconductor lens contour model according to the concave curvature, convex curvature and lens diameter of the semiconductor lens; according to the minimum consumption thickness of the lens edge corresponding to the concave and convex surfaces of the semiconductor lens processed by a machine tool, translating the concave and convex surfaces of the semiconductor lens contour along the central axis of the lens so that the spacing between the corresponding contour lines before and after the translation reaches the corresponding minimum consumption thickness value of the lens edge; and obtaining the lens center position distance based on the contour line positions before and after the translation. The lens center position distance on the semiconductor contour is the lens center consumption thickness; In step S03 , when determining the processing size of the semiconductor lens in the fine grinding process, the center thickness of the semiconductor lens after fine grinding is made to be the sum of the target center thickness and the consumed thickness of the lens center.

2. The method for processing a semiconductor lens according to claim 1, wherein: The semiconductor lens outline model uses a cross-sectional outline with the center of the semiconductor lens.

3. A semiconductor lens processing device, using the semiconductor lens processing method according to any one of claims 1-2, characterized in that: The processing device comprises a concave grinding tool (2) and a convex grinding tool (3) for grinding and polishing the concave surface and convex surface of a semiconductor lens (1); the concave grinding tool (2) and the convex grinding tool (3) are respectively connected to a machine tool spindle via corresponding handles (4); a clamp for clamping and fixing the semiconductor lens (1) is correspondingly arranged above the concave grinding tool (2) and the convex grinding tool (3); and the semiconductor lens (1) is finely ground and polished by replacing the material between the matching surface of the semiconductor lens (1) and the corresponding grinding tool, wherein the material comprises diamond pellets of different particle sizes and polyurethane polishing material.

4. The semiconductor lens processing device according to claim 3, characterized in that: The clamp comprises a convex clamp (5) and a concave clamp (6), each of the convex clamp (5) and the concave clamp (6) having a clamping groove matched with a clamping surface of the semiconductor lens (1), and a pressure mechanism for applying pressure to the corresponding clamp to press the semiconductor lens (1) is provided on the side of the convex clamp (5) and the concave clamp (6) facing away from the semiconductor lens (1).

5. The semiconductor lens processing device according to claim 4, characterized in that: The pressure mechanism of the convex clamp (5) uses an iron stylus (7) in conjunction with a V-shaped groove (8) provided at the center of the back of the convex clamp (5) to press the convex clamp (5), and the opening position of the V-shaped groove (8) corresponds to the central axis position of the semiconductor lens (1) clamped by the convex clamp (5).

6. The semiconductor lens processing device according to claim 4, characterized in that: The pressure mechanism of the concave clamp (6) includes a pressure head (9) coaxially arranged with the center of the concave clamp (6); a pressure head groove (10) is provided on a side of the pressure head (9) close to the concave clamp (6); a protrusion (11) for maintaining the coaxial state of the pressure head (9) and the concave clamp (6) is provided on the mating surface of the concave clamp (6) and the pressure head groove (10); and a rubber ring (12) is provided between the mating surface of the protrusion (11) and the pressure head groove (10) for filling and sealing.

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