Die cutting process, combined structure double-sided adhesive tape production process and combined structure double-sided adhesive tape

Abstract

The invention discloses a die cutting technology, a composite structure double-faced adhesive tape production technology and a composite structure double-faced adhesive tape, and relates to the field of die cutting machining.The die cutting technology comprises the steps that a main supporting film and a release film are sequentially stacked, and a first combined film is obtained; the first combined film is placed on a first conveying assembly; the adhesive tape layer is arranged over the first combined film through a second conveying assembly; according to a preset first step pitch, the first transmission assembly is adjusted; according to a preset second step pitch, the second conveying assembly is adjusted, the first conveying assembly drives the first combined film to move in the first direction according to the first step pitch, the second conveying assembly drives the adhesive tape layer to move in the first direction according to the second step pitch, and the second step pitch is smaller than the first step pitch; the adhesive tape layer is subjected to adhesive block die cutting operation through the die cutting machine, so that the adhesive blocks are formed on the first combined film, the adhesive tape layer and the first combined film are set to be different in synchronization distance, then the utilization rate of the adhesive tape layer is increased, and the production cost is reduced.

Description

Technical Field

[0001] This application relates to the field of die-cutting processing, and particularly relates to a die-cutting process, a production process of a composite structure double-sided adhesive, and a composite structure double-sided adhesive. Background Art

[0002] In the prior art, for the production of composite structure double-sided adhesive products, usually after attaching the double-sided adhesive to the release film, the double-sided adhesive is then waste-discharged according to the size of the adhesive blocks to be retained, that is, the unnecessary parts are cut and removed. However, in this way, the waste removed between the double-sided adhesive blocks is difficult to be reused again, resulting in a large waste and increasing the production cost. Summary of the Invention

[0003] This application aims to solve at least one of the technical problems existing in the prior art. For this purpose, this application provides a die-cutting process, a production process of a composite structure double-sided adhesive, and a composite structure double-sided adhesive, which can make the most of the tape layer through an asynchronous die-cutting process, avoid excessive waste of materials, and reduce the production cost.

[0004] The die-cutting process according to the first aspect embodiment of this application includes:

[0005] Stack the main carrier film and the release film in sequence to obtain a first composite film;

[0006] Place the first composite film on a first transmission component;

[0007] Set the tape layer directly above the first composite film through a second transmission component, wherein there is a gap between the tape layer and the first composite film;

[0008] Adjust the first transmission component according to a preset first step distance; and adjust the second transmission component according to a preset second step distance, wherein the first transmission component drives the first composite film to move in a first direction according to the first step distance, and the second transmission component drives the tape layer to move in the first direction according to the second step distance, and the second step distance is smaller than the first step distance;

[0009] Perform a die-cutting operation on the tape layer through a die-cutting machine to form adhesive blocks on the first composite film.

[0010] According to the die-cutting process of the embodiments of the present application, it has at least the following beneficial effects: By setting different pitches for the first transmission component and the second transmission component, and the second pitch is smaller than the first pitch. That is, when the first composite film moves from one die-cutting point to another die-cutting point, the tape layer does not need to move the same distance, but only needs to move to a position where the next adhesive block can be die-cut. That is, on the tape layer, the intervals between the positions where adjacent two adhesive blocks are cut are very short, reducing the generation of waste materials, thereby achieving the full utilization of the tape layer, further reducing the waste of materials, and then reducing the production cost. And the tape layer is placed directly above the first composite film, and there is a certain gap between the two to prevent the situation of glue overflow and sticking back to the die during die-cutting, which affects the waste discharging effect. At the same time, since the tape layer is suspended above the first composite film and is not attached to the release film, the operation of cutting and removing the waste is also omitted.

[0011] According to some embodiments of the present application, before laminating the main support film and the release film in sequence to obtain the first composite film, it further includes:

[0012] Performing a cleaning operation on the release film through a cleaning device;

[0013] Performing a positioning hole cutting operation on the release film through the die-cutting machine to obtain positioning holes, and the positioning holes are used to limit the release film during die-cutting operations.

[0014] According to some embodiments of the present application, the die-cutting operation of the adhesive blocks on the tape layer through the die-cutting machine to form the adhesive blocks on the first composite film includes:

[0015] Replacing the die-cutting knife plate of the die-cutting machine according to the shape of the required adhesive blocks;

[0016] Aligning the positioning holes with the positioning posts of the die-cutting machine.

[0017] According to some embodiments of the present application, after aligning the positioning holes with the positioning posts of the die-cutting machine, it further includes:

[0018] Performing a die-cutting operation on the tape layer through the die-cutting machine to obtain the adhesive blocks and the waste tape, and pressing the adhesive blocks onto the first composite film through the die-cutting machine, wherein the width of the adhesive blocks in the first direction is less than the second pitch, and the difference between the width of the adhesive blocks in the first direction and the second pitch is 0.1 mm to 0.5 mm;

[0019] Performing a winding operation on the waste tape through a winding device.

[0020] According to some embodiments of the present application, the setting of the tape layer directly above the first composite film through the second transmission component includes:

[0021] Suspend the tape directly above the first combined film through the second transmission component, where the gap between the tape and the first combined film is smaller than the distance that the die-cutting machine can move in the vertical direction;

[0022] Keep the tape in a taut state through the second transmission component.

[0023] According to some embodiments of the present application, after the die-cutting machine performs the glue block die-cutting operation on the tape layer so that glue blocks are formed on the first combined film, it further includes:

[0024] After the glue block die-cutting operation is completed, align the positioning holes with the positioning posts of the die-cutting machine;

[0025] Perform an avoidance hole cutting operation on the first combined film through the die-cutting machine.

[0026] According to some embodiments of the present application, after the die-cutting machine performs the avoidance hole cutting operation on the first combined film, it further includes:

[0027] Perform an outer shape cutting operation on the release film of the first combined film through the die-cutting machine to obtain a second combined film;

[0028] Wind up the second combined film through the winding device.

[0029] According to some embodiments of the present application, the step of stacking the main support film and the release film in sequence to obtain the first combined film includes:

[0030] Stack the main support film and the release film in sequence, where an adhesive is filled between the main support film and the release film;

[0031] Perform a pressing operation on the main support film and the release film through a laminating machine to obtain the first combined film.

[0032] According to the production process of the combined structure double-sided tape in the second aspect of the present application, it includes:

[0033] The die-cutting process described in the first aspect of the embodiments of the present application.

[0034] According to the combined structure double-sided tape in the third aspect of the embodiments of the present application, it includes:

[0035] Prepared by the production process of the combined structure double-sided tape described in the second aspect of the embodiments of the present application.

[0036] The additional aspects and advantages of the present application will be partially given in the following description, partially become obvious from the following description, or be understood through the practice of the present application. Description of the Drawings

[0037] The above and / or additional aspects and advantages of the present application will become apparent and be readily understood from the description of the embodiments in conjunction with the following drawings, where:

[0038] Figure 1 is a flowchart of the steps of the die-cutting process according to an embodiment of the present application;

[0039] Figure 2 is a schematic diagram of the die-cutting operation of the rubber block according to an embodiment of the present application;

[0040] Figure 3 is a schematic diagram of the double-sided adhesive combination structure obtained after the die-cutting process according to an embodiment of the present application. Detailed implementation manners

[0041] The embodiments of the present application will be described in detail below. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for explaining the present application and should not be construed as a limitation of the present application.

[0042] In the description of the present application, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. This is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation of the present application.

[0043] In the description of the present application, the meaning of "several" is one or more, the meaning of "multiple" is more than two, "greater than", "less than", "exceeding", etc. are understood as not including the recited number, and "above", "below", "within", etc. are understood as including the recited number. If there is a description of "first" and "second", it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0044] In the description of the present application, unless otherwise clearly defined, words such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present application in combination with the specific content of the technical solution.

[0045] Currently, in the prior art, for the production of a combined structure double-sided adhesive product, usually after attaching the double-sided adhesive to the release film, waste removal treatment is performed on the double-sided adhesive according to the size of the adhesive blocks to be retained, that is, cutting and removing the unnecessary parts. Since the waste removal treatment is carried out after attaching the double-sided adhesive to the release film, the double-sided adhesive and the release film essentially run synchronously, resulting in the area where the double-sided adhesive is utilized being only the part of the release film where the adhesive blocks need to be attached, thereby causing serious waste of the double-sided adhesive material, increasing the production cost. At the same time, since the double-sided adhesive is attached to the release film, when cutting and removing the residual waste of the double-sided adhesive, the overflow glue of the double-sided adhesive may contaminate the blade of the cutting machine, or there may still be some overflow glue remaining on the release film, affecting the product appearance and reducing the production efficiency.

[0046] Based on this, the present application proposes a die-cutting process, a production process for a combined structure double-sided adhesive, and a combined structure double-sided adhesive, aiming to improve the utilization rate of the tape layer and reduce the production cost by setting different step distances for the tape layer and the first combined film.

[0047] In the first aspect of the embodiments of the present application, a die-cutting process is proposed. Refer to Figure 1 , Figure 1 which is the step flow chart of the die-cutting process of the embodiments of the present application. Figure 1 The schematic process steps include but are not limited to steps S101 to S105.

[0048] Step S101: Stack the main carrier film and the release film in sequence to obtain the first combined film.

[0049] Step S102: Place the first combined film on the first transmission component.

[0050] Step S103: Set the tape layer directly above the first combined film through the second transmission component, wherein there is a gap between the tape layer and the first combined film.

[0051] Step S104: Adjust the first transmission component according to the preset first step distance; and adjust the second transmission component according to the preset second step distance. Among them, the first transmission component drives the first combined film to move along the first direction according to the first step distance, and the second transmission component drives the tape layer to move along the first direction according to the second step distance, and the second step distance is less than the first step distance.

[0052] Step S105: Perform die-cutting operation on the tape layer through a die-cutting machine to form adhesive blocks on the first combined film.

[0053] Steps S101 to S105 shown in the embodiments of the present application refer to Figure 1 and Figure 2, in this embodiment, the tape layer is disposed above the first composite film with a gap therebetween, which facilitates preventing waste from remaining on the first composite film when the die-cutting machine performs die-cutting operations on the tape layer, and thus manual removal of the remaining waste is required. By setting the first pitch and the second pitch, the transportation of the tape layer and the first composite film is in an asynchronous state. Among them, the first pitch is the distance between two adjacent positions on the first composite film where the adhesive blocks need to be pasted, and the second pitch is the distance between two adjacent die-cut adhesive block positions on the tape layer. The inconsistency between the first pitch and the second pitch enables the second pitch not to change following the change of the first pitch, that is, the second pitch can always be maintained at the minimum value, which promotes the least amount of waste remaining after the adhesive block die-cutting operation on the tape layer, thereby improving the material usage rate and reducing the production cost.

[0054] According to the die-cutting process of the embodiments of the present application, it has at least the following beneficial effects: By setting different pitches for the first transmission component and the second transmission component, and the second pitch is smaller than the first pitch, that is, when the first composite film moves from one die-cutting point to another die-cutting point, the tape layer does not need to move the same distance, but only needs to move to a position where the next adhesive block can be die-cut. That is, on the tape layer, the intervals between the positions where two adjacent adhesive blocks are cut are very short, reducing the generation of waste, thereby realizing the full utilization of the tape layer, further reducing the waste of materials, and thus reducing the production cost. The tape layer is placed directly above the first composite film and there is a certain gap between them to prevent the situation of glue overflowing and sticking back to the die during die-cutting, which affects the waste discharge effect. At the same time, since the tape layer is suspended above the first composite film and is not attached to the release film, the operation of cutting and removing waste is also omitted.

[0055] In some embodiments, before step S101, it may further include but is not limited to steps S201 to S202.

[0056] Step S201, performing a cleaning operation on the release film through a cleaning device.

[0057] Step S202, performing a positioning hole cutting operation on the release film through a die-cutting machine to obtain positioning holes, and the positioning holes are used for limiting the release film during die-cutting operations.

[0058] In step S201 of some embodiments, the release film is separately placed in the cleaning device for cleaning treatment.

[0059] In step S202 of some embodiments, the die-cutting machine cuts positioning holes on both sides of the release film along the first direction on the release film.

[0060] In the embodiments of the present application, steps S201 to S202 can clean the release film, removing dust and stains on the release film, facilitating subsequent operations. Positioning holes are cut on the release film, and the size of the positioning holes is adapted to the cross-section of the positioning posts of the die-cutting machine. Thus, when subsequent die-cutting operations are performed, the positioning posts of the die-cutting machine first pass through the positioning holes to limit the release film, and then the die-cutting operation is carried out, which helps prevent the deviation of the position of the release film during the die-cutting operation.

[0061] In some embodiments, step S101 may include but is not limited to steps S301 to S302.

[0062] Step S301: Stack the main support film and the release film in sequence, with an adhesive filled between the main support film and the release film.

[0063] Step S302: Perform a lamination operation on the main support film and the release film through a laminating machine to obtain a first combined film.

[0064] Steps S301 to S302 shown in the embodiments of the present application

[0065] In step S301 of some embodiments, place the main support film horizontally, evenly apply the adhesive on the main support film, and then stack the release film on the main support film.

[0066] In step S302 of some embodiments, perform a lamination operation on the stacked main support film and release film through a laminating machine to obtain a first combined film.

[0067] Steps S301 to S302 shown in the embodiments of the present application. Filling the adhesive can make the combination of the main support film and the release film more stable, facilitating subsequent operations.

[0068] In step S102 of some embodiments, place the first combined film horizontally on the first transmission component, where the first transmission component is a step conveyor.

[0069] In some embodiments, step S103 may include but is not limited to steps S401 to S402.

[0070] Step S401: Suspend the tape directly above the first combined film through the second transmission component, where the gap between the tape and the first combined film is less than the distance that the die-cutting machine can move in the vertical direction.

[0071] Step S402: Keep the tape in a taut state through the second transmission component.

[0072] In step S401 of some embodiments, refer to Figure 2, the tape layer is suspended directly above the first composite film by the second transmission component. At the same time, the extreme position where the die-cutting machine moves downward should be able to contact the first composite film.

[0073] In step S402 of some embodiments, both ends of the tape layer are stretched by the second transmission component, causing the tape layer to be in a straightened state.

[0074] In steps S401 to S402 shown in the embodiments of the present application, the gap between the tape and the first composite film is smaller than the distance that the die-cutting machine can move in the vertical direction, so that after the die-cutting machine cuts out the adhesive blocks, it can squeeze the adhesive blocks in the direction of the first composite film to a certain extent, making the die-cut adhesive blocks not easy to fall off. And the tape layer remains in a straightened state, which is more convenient for subsequent die-cutting operations and makes the die-cut adhesive blocks more beautiful.

[0075] In step S104 of some embodiments, according to the requirements of the product, a second pitch is set, and then the pitch parameters of the second transmission component are adjusted according to the second pitch, that is, the transmission rate, the pause interval, etc. Set the first pitch to a suitable distance, which can improve the utilization rate without causing unnecessary influence on subsequent die-cutting operations. Then, adjust the pitch parameters of the first transmission component according to the first pitch, where the first pitch is smaller than the second pitch, so as to realize the full utilization of the material.

[0076] In some embodiments, step S105 may include but is not limited to steps S501 to S502.

[0077] Step S501, replace the die-cutting plate of the die-cutting machine according to the shape of the required adhesive blocks.

[0078] Step S502, align the positioning holes with the positioning posts of the die-cutting machine.

[0079] In step S501 of some embodiments, replace the die-cutting plate of the die-cutting machine according to the requirements of the product.

[0080] In step S502 of some embodiments, align the positioning holes with the positioning posts of the die-cutting machine so that the positioning posts are directly above the positioning holes.

[0081] In steps S501 to S502 shown in the embodiments of the present application, replacing the die-cutting plate makes the application range wider, and aligning the positioning posts with the positioning holes prevents the first composite film from shifting, resulting in the produced product not meeting the expectations.

[0082] In some embodiments, after step S502, it may further include but is not limited to steps S503 to S504.

[0083] Step S503: Perform die-cutting operation on the tape layer by a die-cutting machine to obtain adhesive blocks and waste tape, and press the adhesive blocks onto the first composite film by the die-cutting machine. Herein, the width of the adhesive block along the first direction is less than the second pitch, and the difference between the width of the adhesive block along the first direction and the second pitch is 0.1 mm to 0.5 mm.

[0084] Step S504: Perform winding operation on the waste tape by a winding device.

[0085] In step S503 of some embodiments, refer to Figure 2 : Perform die-cutting on the tape layer by a die-cutting machine, causing the tape layer to be separated into waste tape and adhesive blocks. The adhesive blocks are die-cut onto the first composite film. Meanwhile, the die-cutting machine presses the die-cut adhesive blocks onto the first composite film in one go, and the waste tape continues to be conveyed.

[0086] In step S504 of some embodiments, the winding device is a winding reel, and the waste tape is wound onto the winding device.

[0087] Steps S503 to S504 shown in the embodiments of the present application, refer to Figure 2 : The width of the adhesive block along the first aspect is 0.1 mm to 0.5 mm less than the first pitch, and the waste width between two adjacent adhesive blocks is 0.1 mm to 0.5 mm, so as to improve the utilization rate of the tape layer. The winding operation of the waste tape is carried out simultaneously with the die-cutting operation of the tape layer, which not only promotes the improvement of production efficiency but also avoids the adhesion of the waste tape.

[0088] It should be noted that: If multiple groups of different adhesive blocks are to be die-cut on the first composite film, then after step S504, jump to step S102.

[0089] In some embodiments, after step S105, it may further include but is not limited to steps S601 to S602.

[0090] Step S601: After the die-cutting operation of the adhesive blocks is completed, align the positioning holes with the positioning posts of the die-cutting machine again.

[0091] Step S602: Perform avoidance hole cutting operation on the first composite film by the die-cutting machine.

[0092] In step S601 of some embodiments, realign the positioning holes with the positioning posts of the die-cutting machine, replace the cutting knife plate of the die-cutting machine, and adjust the cutting depth and cutting rate of the die-cutting machine.

[0093] In step S602 of some embodiments, refer to Figure 3 : The die-cutting machine performs avoidance hole cutting operation on the release film of the first composite film, thereby forming avoidance holes on the release film.

[0094] Steps S601 to S602 shown in the embodiments of the present application make the application range of the produced finished products wider by performing a cutting operation on the release film to create avoidance holes.

[0095] In some embodiments, after step S602, it may further include but is not limited to steps S603 to S604.

[0096] Step S603: Perform a cutting operation on the outer shape of the release film of the first combined film through a die-cutting machine to obtain a second combined film.

[0097] Step S604: Perform a winding operation on the second combined film through a winding device.

[0098] In step S603 of some embodiments, refer to Figure 3 , and adjust the die-cutting machine according to actual requirements to perform a cutting operation on the outer shape of the release film through the die-cutting machine.

[0099] In step S604 of some embodiments, wind the second combined film after the cutting operation on the outer shape of the release film.

[0100] Steps S603 to S604 shown in the embodiments of the present application cut the outer shape of the release film to make its application range wider, and at the same time, winding the second combined film makes it more convenient to store.

[0101] The following die-cutting process according to the present application, refer to Figure 1 、 Figure 2 and Figure 3 , and the specific process implementation flow is given:

[0102] Obtain the main carrier film and the release film. Clean the release film through cleaning to remove dust and stains on the release film. Then, use a die-cutting machine to cut positioning holes on the release film to limit the release film during die-cutting. Apply an adhesive evenly on one side of the main carrier film, then laminate the release film onto the side of the main carrier film coated with the adhesive, and then perform a pressing operation through a laminating machine to obtain a first combined film. Place the first combined film on the first transmission component, where the first transmission component is a stepping conveyor, and suspend the tape layer straight above the first combined film. The tape layer is a double-sided adhesive layer to ensure that the waste tape does not contact the first combined film, effectively avoiding the adhesion between the waste tape and the first combined film. Set the first step distance according to the distance between two adjacent adhesive blocks that need to be adhered to the release film. Adjust the step distance parameter of the first transmission component according to the first step distance, and start the first transmission component. Set the second step distance according to the width of the adhesive block along the first direction required, and adjust the step distance parameter of the second transmission component according to the second step distance. Here, the second step distance is less than the first step distance, the width of the adhesive block along the first direction is less than the second step distance, and the difference between the width of the adhesive block along the first direction and the second step distance is 0.5 mm, so as to make the best use of the tape layer and reduce waste. According to the size and shape of the required adhesive blocks, replace the die-cutting knife plate of the die-cutting machine, align the positioning posts of the die-cutting machine with the positioning holes on the release film, and then synchronously start the die-cutting machine, the first transmission component, and the second transmission component. Perform die-cutting operations on the tape layer through the die-cutting machine to separate the tape layer into adhesive blocks and waste tapes. The waste tape continues to be transmitted along the first direction until it is wound by a winding device, while the adhesive blocks are die-cut onto the first combined film. Then, wind the first combined film after the adhesive block die-cutting operation. Next, place the first combined film back on the first transmission component, adjust the cutting depth and rate of the die-cutting machine, replace the die-cutting knife plate, align the positioning posts of the die-cutting machine with the positioning holes on the release film, and then simultaneously start the die-cutting machine and the first transmission component. Perform a cutout hole cutting operation on the release film on the first combined film through the die-cutting machine as required, thereby forming cutout holes on the release film. Then, according to the need, adjust the cutting depth and rate of the die-cutting machine, replace the die-cutting knife plate, and cut the shape of the release film to obtain a second combined film. Finally, wind the second combined film through a winding component.

[0103] According to the production process of the combined - structure double - sided adhesive of the second aspect of the present application, it has at least the following beneficial effects: By setting different step distances for the first transmission component and the second transmission component, and the second step distance is smaller than the first step distance. That is, when the first combined film moves from one die - cutting point to another die - cutting point, the tape layer does not need to move the same distance, but only needs to move to the position where the next adhesive block can be die - cut. That is, on the tape layer, the intervals between the cutting positions of adjacent two adhesive blocks are very short, reducing the generation of waste materials, thereby achieving the full utilization of the tape layer, further reducing material waste, and then reducing the production cost. And the tape layer is placed directly above the first combined film, and there is a certain gap between the two, in order to prevent the situation of glue overflowing and sticking back to the die - cutter during die - cutting, which affects the waste - discharging effect. At the same time, since the tape layer is suspended above the first combined film and is not attached to the release film, the operation of cutting and removing waste materials is also omitted. By introducing the die - cutting process of the present application, the material utilization rate is improved and the production cost is reduced.

[0104] The combined - structure double - sided adhesive according to the third - aspect embodiment is prepared by the production process of the combined - structure double - sided adhesive of the second - aspect embodiment.

[0105] The embodiments described in the embodiments of the present application are for more clearly explaining the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided by the embodiments of the present application. Those skilled in the art know that with the evolution of technology and the emergence of new application scenarios, the technical solutions provided by the embodiments of the present application are equally applicable to similar technical problems.

[0106] Those skilled in the art can understand that the technical solutions shown in the figures do not constitute a limitation on the embodiments of the present application, and may include more or fewer steps than those shown in the figures, or combine certain steps, or different steps.

[0107] The device embodiments described above are merely illustrative. The units described as separate components may or may not be physically separated, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the modules can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0108] Those of ordinary skill in the art can understand that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices can be implemented as software, firmware, hardware and their appropriate combinations.

[0109] In the description of the present application and the above-mentioned accompanying drawings, terms such as "first", "second", "third", "fourth", etc. (if any) are used to distinguish similar objects and do not necessarily describe a specific order or sequence. It should be understood that the data used in this way can be interchanged under appropriate circumstances so that the embodiments of the present application described herein can be implemented in an order different from those illustrated or described herein. In addition, the terms "comprising" and "having" and any variations thereof are intended to cover non-exclusive inclusion. For example, a process, method, system, product or device that comprises a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products or devices.

[0110] It should be understood that in the present application, "at least one (item)" means one or more, and "a plurality" means two or more. "And / or" is used to describe the association relationship of associated objects and indicates that three relationships can exist. For example, "A and / or B" can mean: only A exists, only B exists, and both A and B exist at the same time. Among them, A and B can be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. "At least one (one) of the following" or a similar expression means any combination of these items, including any combination of single items (ones) or plural items (ones). For example, at least one (one) of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0111] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the above-mentioned division of units is only a logical function division, and there can be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection to each other can be through some interfaces, and the indirect coupling or communication connection of devices or units can be in an electrical, mechanical or other form.

[0112] The units described above as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they can be located in one place or distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0113] In addition, in each embodiment of the present application, the functional units can be integrated into one processing unit, or each unit can exist physically alone, or two or more units can be integrated into one unit. The above integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0114] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium and includes multiple instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in each embodiment of the present application. The foregoing storage medium includes: various media such as USB flash drives, mobile hard disks, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical discs that can store programs.

[0115] The preferred embodiments of the embodiments of the present application have been described above with reference to the accompanying drawings, and thus do not limit the scope of the rights of the embodiments of the present application. Any modification, equivalent replacement, and improvement made by those skilled in the art without departing from the scope and essence of the embodiments of the present application shall be within the scope of the rights of the embodiments of the present application.

Claims

1. A die cutting process, characterized in that: The process comprises: The main support film and the release film are stacked in sequence to obtain a first combined film; placing the first composite membrane on a first transmission assembly; Placing the adhesive tape layer directly above the first combined film by a second transmission component, wherein there is a gap between the adhesive tape layer and the first combined film; The first transmission component is adjusted according to a preset first step; and the second transmission component is adjusted according to a preset second step, wherein the first transmission component drives the first combined film to move along the first direction according to the first step, and the second transmission component drives the tape layer to move along the first direction according to the second step, and the second step is smaller than the first step; The adhesive tape layer is subjected to an adhesive block die-cutting operation by a die-cutting machine, so that an adhesive block is formed on the first composite film.

2. The die-cutting process according to claim 1, characterized in that: Before the main support film and the release film are sequentially stacked to obtain the first combined film, the method further comprises: Performing a cleaning operation on the release film by using a cleaning device; The die-cutting machine performs a positioning hole cutting operation on the release film to obtain a positioning hole, and the positioning hole is used to limit the release film during the die-cutting operation.

3. The die-cutting process according to claim 2, characterized in that: The step of performing a block die-cutting operation on the adhesive tape layer by a die-cutting machine so as to form a block on the first composite film comprises: According to the required shape of the rubber block, the die-cutting blade of the die-cutting machine is replaced; Align the locating holes with the locating posts of the die cutter.

4. The die-cutting process according to claim 3, characterized in that: After aligning the positioning hole with the positioning column of the die-cutting machine, the method further includes: Performing a block die-cutting operation on the tape layer by the die-cutting machine to obtain the block and the waste tape, and pressing the block onto the first composite film by the die-cutting machine, wherein the width of the block along the first direction is smaller than the second step distance, and the width of the block along the first direction differs from the second step distance by 0.1 mm to 0.5 mm; The waste tape is wound up by a winding device.

5. The die-cutting process according to claim 1, characterized in that: The step of placing the adhesive tape layer directly above the first combined film by the second transmission component comprises: The adhesive tape is suspended in the air and placed just above the first combined film by a second transmission component, wherein the gap between the adhesive tape and the first combined film is smaller than the distance that the die-cutting machine can move in the vertical direction; The adhesive tape is kept in a straight state by a second transmission component.

6. The die cutting process according to claim 4, characterized in that: After the adhesive tape layer is subjected to an adhesive block die-cutting operation by a die-cutting machine so that an adhesive block is formed on the first composite film, the method further comprises: When the die-cutting operation of the rubber block is completed, the positioning hole is aligned with the positioning column of the die-cutting machine; The first composite film is subjected to a position avoidance hole cutting operation by the die-cutting machine.

7. The die cutting process according to claim 6, characterized in that: After the die-cutting machine performs the avoidance hole cutting operation on the first composite film, the method further includes: Performing a release film shape cutting operation on the first composite film by the die-cutting machine to obtain a second composite film; The second composite film is rolled up by the rolling device.

8. The die cutting process according to claim 1, characterized in that: The method of sequentially laminating the main support film and the release film to obtain a first composite film comprises: stacking a main support film and a release film in sequence, wherein an adhesive is filled between the main support film and the release film; The main support film and the release film are pressed together by a laminating machine to obtain the first combined film.

9. A production process of a combined structure double-sided adhesive tape, characterized in that: The process comprises: The die-cutting process according to any one of claims 1 to 8.

10. A combined structure double-sided adhesive tape, characterized in that: include: The combined structure double-sided adhesive tape is prepared by the combined structure double-sided adhesive tape production process described in claim 9.

Images