Upper packaging device of blow molding machine and blow molding machine

Abstract

The invention discloses an upper packaging device of a blow molding machine and the blow molding machine, the upper packaging device comprises a frame, a packaging module, inclined strut mechanisms and a displacement mechanism, the inclined strut mechanisms are symmetrically arranged on the two sides of the packaging module, and each inclined strut mechanism comprises a supporting rod and a first driving part used for driving the supporting rod to move in the packaging area in the vertical direction; wherein the end portions of the supporting rods are higher than the upper end faces of the wrapping and sealing plates, receding notches are formed in the sides, facing the wrapping and sealing area, of the wrapping and sealing plates, and when the two wrapping and sealing plates move in the opposite directions to wrap and seal a parison, the two receding notches define a guide space for the supporting rods to slide. By arranging the inclined strut mechanism, the parison inserted into the parison is tensioned in the packaging process, so that swing of the lower part of the parison is reduced, and the packaging effect of the packaging module on the parison during packaging operation is improved.

Description

Technical Field

[0001] The present application relates to the technical field of blow molding machines, and in particular to a packaging device on a blow molding machine and a blow molding machine. Background Art

[0002] Blow molding is a type of molding process. It is a process in which a tubular plastic parison obtained by extrusion or injection molding of a thermoplastic material is placed in a split mold while hot. Compressed air is continuously introduced into the parison before and after mold closing, so that the plastic parison is inflated and closely attached to the inner wall of the mold. After cooling and demolding, various hollow or flat plastic products are obtained. In order to keep the parison inflated better before and after mold closing, one side of the parison is usually encapsulated so that one side of the parison is closed and compressed air is introduced at this time to achieve a better inflation effect.

[0003] In the prior art, the encapsulation time is divided into upper encapsulation and lower encapsulation. The upper encapsulation refers to the sealing of one side of the parison when it is extruded from the die head but not yet to the mold. At this time, the introduction of compressed air can better maintain the inflated state of the parison. The lower encapsulation refers to the encapsulation of the parison after it is extruded from the die head, passes through the mold and descends to the specified position. In the molding process of large-sized products, when the lower encapsulation process is adopted, the quality of the parison will increase with the gradual extrusion, which may cause the lower edge area of ​​the parison to swing or stick, so that the compressed air blown out from the die head cannot always keep the inflated state of the parison well, affecting the molding quality, resulting in the larger the size of the product, the more difficult it is to use the blow molding process. Although the upper encapsulation process can solve the problem of swinging or sticking in the lower edge area of ​​the parison, it is only suitable for the molding of small-sized products.

[0004] For example, the utility model patent with the authorization announcement number CN207594302U discloses a "sealing device for a blow molding machine", which is a common upper sealing structure. It mainly drives the two sealing plates to rotate and open around the rotating shaft through the cylinder linkage gear assembly, and the parison is sealed when the two sealing plates merge. In this structure, due to the existence of the rotation radius of the sealing plate, when blow molding large-sized products, the merging time of the two sealing plates also increases, and the temperature of the parison will drop rapidly after being extruded from the die head. The efficiency of sealing directly affects the quality of molding, so upper sealing devices similar to the above structure are generally used for the molding of small-sized products. Summary of the invention

[0005] In order to be applicable to the encapsulation operation during the molding process of large-sized products, the first object of the present application is to provide an encapsulation device on a blow molding machine.

[0006] The present application provides a sealing device on a blow molding machine using the following technical solution: A sealing device on a blow molding machine, comprising: Frame; The encapsulation module is slidably connected to the frame. The encapsulation module includes two encapsulation plates and a synchronization mechanism for driving the two encapsulation plates to move towards / away from each other in the horizontal direction. There is a gap between the two encapsulation plates to form an encapsulation area for the parison to pass through; The diagonal bracing mechanism is symmetrically arranged on both sides of the encapsulation module. The diagonal bracing mechanism includes a strut and a first driving member for driving the strut to move vertically within the encapsulation area; and The displacement mechanism is connected to the diagonal bracing mechanism for driving the two diagonal bracing mechanisms to move towards / away from each other; Wherein, the end of the strut is higher than the upper end surface of the encapsulation plate. A relief notch is provided on the side of the encapsulation plate facing the encapsulation area. When the two encapsulation plates move towards each other to encapsulate the parison, the two relief notches enclose a guiding space for the strut to slide.

[0007] By adopting the above technical solution, after the parison is extruded from the die head and enters the encapsulation area, the two encapsulation plates move towards the parison side under the drive of the synchronization mechanism. During the displacement of the encapsulation plates, the strut of the diagonal bracing mechanism enters the parison and moves towards the inner surface of the parison under the drive of the displacement mechanism, and finally tightens the two ends of the lower edge of the parison, which can reduce the swing of the parison after extrusion. Subsequently, the two encapsulation plates squeeze the parison in the horizontal direction to complete the encapsulation operation, realizing the encapsulation of large-sized products. Secondly, the end of the strut is higher than the upper end surface of the encapsulation plate. When encapsulating the parison as much as possible, the encapsulation position is close to the lower edge, which can reduce the cutting area of the material and improve the material utilization rate.

[0008] Preferably, a heat medium flow channel for the heat medium to flow is provided in the encapsulation plate.

[0009] By adopting the above technical solution, after the material is extruded from the die head, the extrusion temperature is often around 200°. The encapsulation plate uses the heat medium flow channel provided for the heat medium to flow, which can make the encapsulation plate itself have a certain temperature. The surface temperature of the parison will drop rapidly after extrusion, and the encapsulation plate with a certain temperature can also reduce the heat loss during the encapsulation process of the parison and improve the quality of subsequent molding.

[0010] Preferably, the encapsulation module further includes a secondary encapsulation assembly. The secondary encapsulation assembly includes: An encapsulation wheel; and A second driving member for driving the encapsulation wheel to roll along the traveling direction perpendicular to the encapsulation plate; Wherein, the encapsulating plate is provided with a cam track on one side, the cam track is placed below the upper end surface of the encapsulating plate and the length of the cam track is greater than the maximum spacing between the two support rods, the encapsulating wheel is rollingly connected to the cam track, and the cam track includes an encapsulating section and at least one descending section connected to the encapsulating section; when the encapsulating wheel rolls on the encapsulating section, the encapsulating wheel protrudes from the side of the encapsulating plate, and when the encapsulating wheel is placed in the descending section, the cross-section of the encapsulating wheel is within the forward projection of the encapsulating plate.

[0011] By adopting the above technical solution, the secondary encapsulation component can perform secondary encapsulation on the preform to improve the encapsulation quality. Secondly, during the secondary encapsulation process, the second driving member is used to drive the encapsulation wheel to roll on the cam track to achieve the encapsulation of the preform. When the encapsulation wheel is placed in the encapsulation section, the side plate of the encapsulation wheel protruding from the encapsulation plate can extrude the preform for encapsulation. At the same time, the protruding setting of the encapsulation wheel can provide an extrusion force greater than that of the encapsulation plate on the preform, which can be used for encapsulation operations when the number of preform layers is large and the thickness is large; at the same time, because the cam track is lower than the upper end surface of the encapsulation plate, the secondary encapsulation position on the preform is lower than the first encapsulation of the preform by the encapsulation plate, and the secondary encapsulation is lower than the position of the primary encapsulation to achieve double encapsulation of the preform instead of superimposed encapsulation. , better improve the encapsulation effect, and the length of the cam track should be greater than the maximum distance between the two struts. This design is due to the fact that when the struts are tightening the parison, some clearance gaps are opened on the encapsulation plates to avoid interference with the struts, resulting in the parison not being encapsulated at the strut position when the two encapsulation plates are performing the first encapsulation, and the travel distance of the encapsulation wheel during the second encapsulation is greater than the maximum distance between the two struts. Then, when the struts are retracted, the encapsulation wheel can also encapsulate the strut position that was not encapsulated during the first encapsulation operation, thereby better improving the encapsulation effect and allowing the parison to be better inflated when compressed air is introduced.

[0012] Preferably, the secondary encapsulation component further comprises: A swing arm, two ends of which are rotatably connected to the second driving member and the encapsulating wheel respectively; and The elastic member is connected to the swing arm and always forces the swing arm to have a movement tendency of moving toward a side away from the enclosed area.

[0013] By adopting the above technical solution, when the encapsulating wheel moves on the cam track, the elastic member can realize floating adjustment of the encapsulating wheel. When moving from the descending section to the encapsulating section, the elastic potential energy of the elastic member is overcome, and one end of the swing arm swings toward the side of the encapsulating area to realize the switching of the traveling track of the encapsulating wheel; and when the encapsulating section reaches the descending section, the elastic member can be used to drive the encapsulating wheel to be hidden in the forward projection area of ​​the encapsulating plate without affecting the one-time encapsulation operation of the two encapsulating plates.

[0014] Preferably, the encapsulation wheel comprises: Wheels; and An eccentric shaft, and the wheel part is rotatably connected to the eccentric shaft; Wherein, when the eccentric shaft rotates, the wheel part moves towards / away from one side of the encapsulation area.

[0015] By adopting the above technical solution, the setting of the eccentric shaft enables the distance that the wheel part protrudes from the side of the encapsulation plate to be adjustable, and different wheel part protrusion distances can be adaptively selected for preforms with different wall thicknesses.

[0016] Preferably, it further includes a driving mechanism for driving the encapsulation module to slide on the frame, and the driving mechanism includes: A driving motor, mounted on the frame; A driving shaft, connected to the driving motor; A transmission component, connected to the encapsulation plate, and the transmission component includes a driving pulley, a guiding pulley, a tensioning pulley and a synchronous belt; Wherein, the driving pulley is connected to the driving shaft, the synchronous belt meshes with the driving pulley, the guiding pulley and the tensioning pulley, and both ends of the synchronous belt are fixed to both ends of the encapsulation module.

[0017] By adopting the above technical solution, the driving motor drives the driving shaft to rotate, the rotation of the driving shaft drives the synchronous belt to rotate through the driving pulley, and both ends of the synchronous belt are connected to the encapsulation plate, thereby realizing the sliding of the encapsulation module on the frame, and further realizing the intermittent encapsulation of the double die heads, improving the production efficiency.

[0018] Preferably, the synchronization mechanism includes: A third driving member, one end of the third driving member is connected to one of the encapsulation plates; Two racks, respectively corresponding to and connected to one of the encapsulation plates; and A synchronous gear, meshing between the two racks, for driving one of the racks to move towards / away from the other rack.

[0019] By adopting the above technical solution, when the third driving member drives one of the encapsulation plates to move, the encapsulation plate also synchronously drives one of the racks to displace, and the displacement of one of the racks drives the opposite displacement of the other rack through the synchronous gear, thereby realizing the movement of the two encapsulation plates towards / away from each other, and the synchronization structure is relatively simple.

[0020] Preferably, a heating wire is arranged inside the support rod.

[0021] By adopting the above technical solution, the heating wire can keep the support rod at a certain temperature. Since the temperature of the preform after being extruded from the die head is generally about 200 °C, the surface temperature will drop rapidly after extrusion. When the support rod tightens the preform, due to the surface temperature, the temperature loss of the preform within the range of the support rod can be reduced, improving the encapsulation effect.

[0022] Preferably, the displacement mechanism includes a fourth driving member, and the fourth driving member is connected to the diagonal bracing mechanism.

[0023] By adopting the above technical solution, the movement of the diagonal bracing mechanism can realize the tensioning operation of the mandrel on the parison.

[0024] In order to be applicable to the encapsulation operation in the forming process of large-sized products, the second object of the present application is to provide a blow molding machine.

[0025] The blow molding machine provided by the present application adopts the following technical solutions: A blow molding machine includes the above-mentioned upper encapsulation device of the blow molding machine.

[0026] By adopting the above technical solution, before encapsulation, the parison first uses the two mandrels in the diagonal bracing mechanism to realize the tensioning of the lower edge and reduce the swing, and combines the horizontal opposite movement of the two encapsulation plates to realize the encapsulation of the parison, thereby realizing the encapsulation of large-sized products.

[0027] In summary, the present application includes at least one of the following beneficial technical effects: 1. By arranging the diagonal bracing mechanism to realize the tensioning of the parison inserted into the parison during the encapsulation process to reduce the swing of the lower part of the parison, and improve the encapsulation effect during the encapsulation operation of the encapsulation module on the parison; 2. By providing a relief notch on the encapsulation plate, the height difference between the encapsulation plate and the mandrel can be reduced, so that the encapsulation position can be as close as possible to the lower edge range of the parison during the extrusion of the die head, reducing the waste after forming and improving the material utilization rate; 3. By adding a secondary encapsulation component, and the secondary encapsulation position is lower than the primary encapsulation position of the encapsulation plate, thereby realizing the double encapsulation of the upper and lower arrangements of the parison, better improving the encapsulation effect, and the secondary encapsulation can encapsulate the area that is not encapsulated at the mandrel position during the primary encapsulation; 4. By adjusting the radial distance of the encapsulation wheel, the distance that the wheel protrudes from the side of the encapsulation plate is adjusted, so as to be applicable to the encapsulation of parisons with different wall thicknesses. Description of the Drawings

[0028] Figure 1 It is a schematic structural diagram of the upper encapsulation device of the blow molding machine in Embodiment 1; Figure 2 It is a schematic structural diagram mainly showing the encapsulation module in Embodiment 1; Figure 3 It is a schematic connection diagram mainly showing the connection between the driving mechanism and the encapsulation plate in Embodiment 1; Figure 4 It is a schematic structural diagram mainly showing the synchronization mechanism in Embodiment 1; Figure 5It is a schematic structural diagram mainly showing the heat-conducting runner inside the encapsulation plate in the first embodiment; Figure 6 It is a schematic diagram showing the positional relationship between the support rod and the encapsulation plate in the vertical direction in the first embodiment; Figure 7 It is a schematic structural diagram mainly showing the secondary encapsulation assembly in the first embodiment; Figure 8 It is a schematic connection diagram of the secondary encapsulation assembly on the cam track in the first embodiment; Figure 9 It is a schematic connection diagram between the encapsulation wheel and the swing arm in the first embodiment; Figure 10 It is a schematic diagram of the preform in the unencapsulated state in the first embodiment; Figure 11 It is a schematic diagram of the preform in the fully encapsulated state in the first embodiment; Figure 12 It is a schematic diagram of the preform in the state of secondary encapsulation in the first embodiment; Figure 13 It is a schematic diagram of the preform in the state of completed secondary encapsulation in the first embodiment.

[0029] Explanation of reference numerals: 10, frame; 11, first guide rail; 20, encapsulation module; 21, encapsulation area; 22, encapsulation plate; 221, relief notch; 222, inlet runner; 223, outlet runner; 224, first joint; 225, second joint; 23, cam track; 231, encapsulation section; 232, downward section; 233, parallel standby section; 24, synchronization mechanism; 241, third driving member; 242, rack; 243, synchronization gear; 25, second slider; 26, second guide rail; 27, mounting plate; 30, diagonal support mechanism; 31, first driving member; 32, support rod; 40, driving mechanism; 41, driving motor; 42, driving shaft; 43, driving pulley; 44, tensioning pulley; 45, guiding pulley; 46, synchronous belt; 50, displacement mechanism; 51, fourth driving member; 60, secondary encapsulation assembly; 61, second driving member; 62, lead screw; 63, nut slider; 64, connecting seat; 65, swing arm; 66, encapsulation wheel; 661, wheel part; 662, eccentric section; 663, optical axis section; 664, threaded section; 665, wrench hole; 666, locking nut; 67, rotating shaft; 68, elastic member; 69, fixed shaft; 70, preform. Detailed implementation manners

[0030] The present application will be further described in detail below with reference to the accompanying drawings.

[0031] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly on the other element or there can also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only implementation.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. Embodiment 1

[0033] Figure 1 With Figure 2 FIG. shows a structural schematic of an encapsulation device on a blow molding machine, which is installed on the frame of the blow molding machine and is specifically located in the vertical distance between the die head and the mold of the blow molding machine. The upper encapsulation device includes a frame 10, an encapsulation module 20 slidably connected to the frame 10, and a driving mechanism 40 for driving the encapsulation module 20 to slide on the frame 10.

[0034] In this embodiment, in order to achieve the spaced encapsulation of the two die heads when the encapsulation module 20 slides on the frame 10, the length of the frame 10 is greater than the length of the encapsulation module 20. The encapsulation module 20 mainly includes two encapsulation plates 22 and a synchronization mechanism 24 for driving the two encapsulation plates 22 to move towards or away from each other in the horizontal direction. The distance between the two encapsulation plates 22 is the encapsulation area 21. During the encapsulation process, the die head is placed above the encapsulation area 21, and the lower edge of the parison 70 gradually enters the encapsulation area 21 after being extruded from the die head. The movement of the two encapsulation plates 22 towards or away from each other expands or contracts the encapsulation area 21. When the encapsulation area 21 is reduced and the two encapsulation plates 22 squeeze the parison 70 to achieve the encapsulation operation of the parison 70.

[0035] Combined with Figure 3 , the encapsulation module 20 further includes second sliders 25 provided on the encapsulation plates 22. The two second sliders 25 are slidably connected to a second guide rail 26 spanning between the two encapsulation plates 22. One end surface of the second guide rail 26 is connected with two mounting plates 27, and first sliders (not shown in the figure) are provided on the two mounting plates 27. The first sliders are slidably connected to the first guide rail 11 on the frame 10.

[0036] The driving mechanism 40 includes a driving motor 41 installed on one side of the frame 10. The driving motor 41 is connected to a driving shaft 42, and two driving pulleys 43 arranged at intervals are provided on the driving shaft 42. The driving mechanism 40 further includes a tensioning pulley 44 and a plurality of guiding pulleys 45 installed on one side of the frame 10. A synchronous belt 46 is meshed and installed on the driving pulley 43, the tensioning pulley 44 and the guiding pulleys 45. The two ends of the synchronous belt 46 are respectively connected to two corresponding mounting plates 27 on the encapsulation plate 22. Thus, when the driving motor 41 works, the driving pulley 43 drives the synchronous belt 46 to rotate, thereby realizing the sliding of the entire encapsulation module 20 on the frame 10.

[0037] Combined with Figure 4 , the upper encapsulation device further includes a displacement mechanism 50 connected to the encapsulation module 20 and a diagonal bracing mechanism 30 connected to the displacement mechanism 50. The diagonal bracing mechanism 30 includes a first driving member 31 and a strut 32 connected to the first driving member 31. The strut 32 is placed in the encapsulation area 21 and can be driven by the first driving member 31 to displace in a direction perpendicular to the encapsulation area 21. The displacement mechanism 50 includes a fourth driving member 51. The fourth driving member 51 is connected to the first driving member 31 to realize the horizontal displacement of the first driving member 31. The fourth driving member 51 is installed below the second guide rail 26. The horizontal displacement direction of the first driving member 31 is perpendicular to the second guide rail 26, that is, perpendicular to the direction of the approaching or separating movement of the two encapsulation plates 22. Both the displacement mechanism 50 and the diagonal bracing mechanism 30 are provided with two sets and are symmetrically arranged. Thus, the two first driving members 31 can move towards or away from each other.

[0038] Two sets of synchronous mechanisms 24 are also provided and are respectively installed above the fourth driving member 51. Specifically, the synchronous mechanism 24 includes a third driving member 241, two racks 242, and a synchronous gear 243 meshed with the two racks 242. One end of the third driving member 241 is connected to one of the encapsulation plates 22. One ends of the two racks 242 are respectively connected to the two encapsulation plates 22 correspondingly. The synchronous gear 243 is meshed between the two racks 242. The rotation of the synchronous gear 243 can drive the two racks 242 to move towards or away from each other, thereby realizing the approaching or separating movement of the two encapsulation plates 22. More specifically, when the third driving member 241 drives one of the encapsulation plates 22 to displace relative to the other encapsulation plate 22, the rack 242 connected to the one encapsulation plate 22 displaces, the rack 242 drives the synchronous gear 243 to rotate, and the rotation of the synchronous gear 243 drives the other rack 242 to move, thereby driving the displacement of the other encapsulation plate 22.

[0039] Refer to Figure 5, a heat conduction runner is provided in the encapsulation plate 22. The heat conduction runner includes an inlet runner 222 and an outlet runner 223 communicating with the inlet runner 222. One end of the inlet runner 222 is connected with a first connector 224, and one end of the outlet runner 223 is connected with a second connector 225. The other ends of the inlet runner 222 and the outlet runner 223 are blocked by plugs. Hoses are connected to both the first connector 224 and the second connector 225. The hoses allow the heat medium to flow and be input into the encapsulation plate 22 while completing the circulation. The heat medium can be gas or fluid. The setting of the heat conduction runner enables the encapsulation plate 22 to have a certain temperature.

[0040] Refer to Figure 6 , in the vertical direction, the end of the support rod 32 is higher than the upper end surface of the encapsulation plate 22, and there is a height difference H between the two. The support rod 32 is connected to the first driving member 31 by threaded connection or other connection means. A heating wire is provided inside the support rod 32, so that the support rod 32 also has a certain temperature. At the same time, two relief notches 221 are spaced apart on one side wall of the encapsulation plate 22 facing the encapsulation area 21. The relief notches 221 allow the support rod 32 to pass through and a certain horizontal displacement occurs within the relief notches 221.

[0041] Combined with Figure 7 and Figure 8 , the encapsulation module 20 further includes a secondary encapsulation assembly 60. The secondary encapsulation assembly 60 is installed on the lower section of the encapsulation plate 22 and mainly includes a second driving member 61 and an encapsulation wheel 66 connected to the second driving member 61. A cam track 23 is provided on one side of the lower end surface of the encapsulation plate 22, and the cam track 23 is below the upper end surface of the encapsulation plate 22. The encapsulation wheel 66 can roll on the cam track 23 driven by the second driving member 61.

[0042] The secondary encapsulation assembly 60 further includes a lead screw 62 connected to the second driving member 61 and a nut slider 63 threadedly connected to the lead screw 62. The other end of the lead screw 62 is rotatably connected to the side wall of the encapsulation plate 22 and rotates in place driven by the second driving member 61. The nut slider 63 can slide along the length direction of the encapsulation plate 22 under the rotation of the lead screw 62.

[0043] One side of the nut slider 63 is also connected with a connecting seat 64. One side of the connecting seat 64 is connected with a swing arm 65. One end of the swing arm 65 is rotatably connected to the encapsulation wheel 66. The swing arm 65 is rotatably connected to the connecting seat 64 through a rotating shaft 67. A fixed shaft 69 is also provided on the connecting seat 64, and an elastic member 68 is provided on the fixed shaft 69. The two ends of the elastic member 68 are respectively connected to the nut slider 63 and the swing arm 65. Specifically, the elastic member 68 is a spring piece or a torsion spring. Under the action of the elastic member 68, the end of the swing arm 65 connected to the encapsulation wheel 66 always has a tendency to move away from the encapsulation area 21, which enables the encapsulation wheel 66 to always fit the surface of the cam track 23.

[0044] Combined with Figure 9 , the encapsulation wheel 66 includes a wheel portion 661 made of a material with high temperature resistance and elasticity, such as silicone rubber, fluororubber, etc. Such a material can maintain elasticity within a temperature range of -60° to 250°, and thus can be applicable to the temperature of the heated encapsulation plate 22 and the temperature carried by the parison 70 itself during the encapsulation operation. The wheel portion 661 is connected to an eccentric shaft, and the eccentric shaft passes through the swing arm 65 and is connected to a locking nut 666. The wheel portion 661 is limited by the locking nut 666 against the swing arm 65.

[0045] The eccentric shaft includes an eccentric section 662, a smooth shaft section 663, and a threaded section 664 that are integrally connected. The wheel portion 661 is rotatably connected to the eccentric section 662, the smooth shaft section 663 is rotatably connected to the mounting hole of the swing arm 65, and the locking nut 666 is threadedly connected to the threaded section 664. A wrench hole 665 is also provided on the end face of the eccentric section 662, which is convenient for the connection of manual or electric tools to drive the eccentric shaft to rotate. When the eccentric shaft rotates, due to the setting of the eccentric section 662, the wheel portion 661 can move radially away from or close to the encapsulation area 21. With the setting of the swing arm 65 combined with the elastic member 68, when the wheel portion 661 adjusts the distance radially, it can always be in contact with the surface of the cam track 23.

[0046] The cam track 23 includes a continuously provided encapsulation section 231 and downward sections 232 connected to both sides of the encapsulation section 231. The downward sections 232 are also connected to parallel standby sections 233. When the wheel portion 661 is placed on the encapsulation section 231, the wheel portion 661 protrudes from the side of the encapsulation plate 22 to form a distance A, and this distance A can change when the wheel portion 661 adjusts the distance, so as to be applicable to the extrusion encapsulation of parisons 70 with different wall thicknesses. When the wheel portion 661 is placed on the downward section 232 or the parallel standby section 233, the wheel portion 661 is within the projection in the positive direction of the encapsulation plate 22, that is, the wheel portion 661 does not protrude from the side wall of the encapsulation plate 22.

[0047] Combined with Figures 10 to 13 , when the present upper encapsulation device encapsulates the parison 70, the entire encapsulation module 20 is driven by the driving mechanism 40 to be placed below the die head in advance. While the parison 70 is extruded from the die head, the synchronization mechanism 24 acts to drive the two encapsulation plates 22 to gradually move towards the parison 70 side in an opposite direction. The diagonal bracing mechanism 30 first moves in an opposite direction under the drive of the displacement mechanism 50 and is placed below the opening of the parison 70. The diagonal bracing mechanism 30 acts to drive the strut 32 to move towards the parison 70 side. Subsequently, the displacement mechanism 50 drives the diagonal bracing mechanism 30 to move in the reverse direction, and the parison 70 is gradually expanded and tightened under the drive of the two struts 32.

[0048] Subsequently, the two wrapping plates 22 continue to move towards each other and squeeze the parison 70, causing the lower edge portions of the parison 70 to adhere to each other to achieve wrapping. At this time, since one side of the parison 70 is wrapped after the compressed air is blown out from the die head, the portion of the parison 70 from the lower edge to the die head can be maintained in a blown state. At this time, a wrapping operation of the two wrapping plates 22 on the parison 70 is completed.

[0049] Immediately afterwards, the diagonal bracing mechanism 30 resets, and the two struts 32 disengage from the parison 70. However, the two wrapping plates 22 still remain in contact with the parison 70. The second driving member 61 operates to drive the wheel portions 661 to move along the cam track 23, and gradually roll from the parallel standby section 233 on one side to the downward section 232 and finally roll onto the wrapping section 231. While the two wheel portions 661 are rolling on the wrapping section 231, a secondary wrapping of the parison 70 is achieved, and the unwrapped positions of the struts 32 are wrapped. After the secondary wrapping is completed, the wheel portions 661 can be in the parallel standby section 233 on the other side of the cam track 23, or the second driving member 61 operates in the reverse direction to achieve the reciprocating wrapping of the wheel portions 661. The number of reciprocations can be selected according to the wall thickness and material of the parison 70. After the secondary wrapping is completed, the two wrapping plates 22 are separated, and the parison 70 continues to be extruded downward for forming operations. Embodiment 2

[0050] A blow molding machine includes the upper wrapping device of the blow molding machine in Embodiment 1.

[0051] The above are all the preferred embodiments of this application. The protection scope of this application is not limited by this. Therefore, all equivalent changes made according to the structure, shape, and principle of this application should be covered within the protection scope of this application.

Claims

1. A sealing device on a blow molding machine, characterized in that: include: Frame (10); An encapsulation module (20) is slidably connected to the frame (10), the encapsulation module (20) comprising two encapsulation plates (22) and a synchronization mechanism (24) for driving the encapsulation plates (22) to move toward or away from each other in a horizontal direction, the two encapsulation plates (22) being spaced apart to form an encapsulation area (21) for the parison (70) to pass through; A diagonal support mechanism (30) is symmetrically arranged on both sides of the encapsulation module (20), the diagonal support mechanism (30) comprising a support rod (32) and a first driving member (31) for driving the support rod (32) to move in a vertical direction within the encapsulation area (21); and A displacement mechanism (50) connected to the diagonal support mechanism (30) and used to drive the two diagonal support mechanisms (30) to move toward or away from each other; The end of the support rod (32) is higher than the upper end surface of the encapsulation plate (22), and a clearance notch (221) is provided on one side of the encapsulation plate (22) facing the encapsulation area (21); when the two encapsulation plates (22) move towards each other to encapsulate the parison (70), the two clearance notches (221) enclose a guide space for the support rod (32) to slide.

2. The encapsulation device on the blow molding machine according to claim 1, characterized in that: A heat conduction channel for the flow of heat medium is provided in the encapsulation plate (22).

3. The encapsulation device on the blow molding machine according to claim 1, characterized in that: The encapsulation module (20) further comprises a secondary encapsulation component (60), wherein the secondary encapsulation component (60) comprises: an encapsulation wheel (66); and a second driving member (61) for driving the encapsulating wheel (66) to roll along a direction perpendicular to the travel direction of the encapsulating plate (22); The encapsulating plate (22) is provided with a cam track (23) on one side, the cam track (23) is located below the upper end surface of the encapsulating plate (22) and the length of the cam track (23) is greater than the maximum spacing between the two support rods (32), the encapsulating wheel (66) is rollingly connected to the cam track (23), the cam track (23) comprises an encapsulating section (231) and at least one descending section (232) connected to the encapsulating section (231); when the encapsulating wheel (66) rolls on the encapsulating section (231), the encapsulating wheel (66) protrudes from the side surface of the encapsulating plate (22), and when the encapsulating wheel (66) is located on the descending section (232), the cross section of the encapsulating wheel (66) is within the forward projection of the encapsulating plate (22).

4. The encapsulation device on the blow molding machine according to claim 3, characterized in that: The secondary encapsulation component (60) further comprises: a swing arm (65), wherein two ends of the swing arm (65) are rotatably connected to the second driving member (61) and the sealing wheel (66); and The elastic member (68) is connected to the swing arm (65) and always forces the swing arm (65) to have a movement tendency to move toward a side away from the encapsulation area (21).

5. The encapsulation device on the blow molding machine according to claim 3, characterized in that: The encapsulation wheel (66) comprises: Wheel portion (661); and An eccentric shaft, the wheel portion (661) being rollingly connected to the eccentric shaft; Wherein, when the eccentric shaft rotates, the wheel portion (661) moves towards or away from one side of the encapsulation area (21).

6. The encapsulation device on the blow molding machine according to claim 1, characterized in that: It also includes a driving mechanism (40) for driving the encapsulation module (20) to slide on the frame (10), the driving mechanism (40) comprising: A driving motor (41) is mounted on the frame (10); A driving shaft (42) connected to the driving motor (41); A transmission assembly connected to the encapsulation plate (22), the transmission assembly comprising a driving pulley (43), a guide pulley (45), a tensioning pulley (44) and a synchronous belt (46); The driving pulley (43) is connected to the driving shaft (42), the synchronous belt (46) is meshed with the driving pulley (43), the guide pulley (45) and the tensioning pulley (44), and the two ends of the synchronous belt (46) are fixed to the two ends of the encapsulation module (20).

7. The encapsulation device on the blow molding machine according to claim 1, characterized in that: The synchronization mechanism (24) comprises: A third driving member (241), one end of the third driving member (241) being connected to one of the encapsulation plates (22); Two racks (242) are provided and are respectively connected to one of the encapsulation plates (22); and The synchronous gear (243) is meshed between the two racks (242) and is used to drive one rack (242) to move toward or away from the other rack (242).

8. The encapsulation device on the blow molding machine according to claim 1, characterized in that: A heating wire is arranged inside the support rod (32).

9. The encapsulation device on the blow molding machine according to claim 1, characterized in that: The displacement mechanism (50) comprises a fourth driving member (51), and the fourth driving member (51) is connected to the diagonal support mechanism (30).

10. A blow molding machine, characterized in that: It comprises a sealing device on a blow molding machine as described in any one of claims 1-9.

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