Fan module and electronic equipment

Abstract

The embodiment of the invention provides a fan module and electronic equipment. The fan module and the electronic equipment are used for solving the problem that the thickness of the electronic equipment is large in the prior art. The electronic equipment comprises a shell, a fan shell and a fan body. The shell comprises a first structural part and a second structural part, and the second structural part is arranged around the edge of the first structural part. The fan body is covered with the fan shell, the first part of the fan shell and the first structural part jointly form a flat plate structure, the flat plate structure and the second structural part jointly define an installation space, and the fan body is located in the installation space. The first part of the fan shell comprises a first surface, the first structural part comprises a second surface, the first surface and the second surface are both located on the side, away from the installation space, of the appearance flat plate, and the second surface and the first surface are located in the same plane, so that the assembly distance between the fan shell and the first structural part can be reduced; and the thickness of the electronic equipment is reduced.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic products, and in particular, to a fan module and an electronic device. Background Art

[0002] With the progress of technology, current electronic devices are developing towards the direction of multi-function, high speed, and small size. The integration of some chips in electronic devices, such as system on chip (SOC), is getting higher and higher, and the amount of computation in the data processing process is also increasing. As a result, the working heat generated by the processor per unit area will increase significantly, becoming a high-heat-generating component. The working heat of this high-heat-generating component will affect the performance and lifespan of the processor and other components in the electronic device.

[0003] Currently, the heat dissipation technology adopted by electronic devices is mainly an air-cooled heat dissipation device combined with a heat dissipation component and a fan, which can improve the heat dissipation capacity of the whole machine. However, the thickness of the electronic device using the air-cooled heat dissipation device is relatively large, which is not conducive to the thin and light design of the electronic device. Summary of the Invention

[0004] The embodiments of the present application provide a fan module and an electronic device, which are used to solve the problem that the thickness of the electronic device in the related technology is relatively large and it is not conducive to the thin and light design of the electronic device.

[0005] To achieve the above object, the embodiments of the present application provide the following solutions:

[0006] On the one hand, a fan module is provided, which includes a housing, a fan housing, and a fan body. The housing includes a first structural member and a second structural member, and the second structural member is disposed around the edge of the first structural member. The fan housing covers the outside of the fan body. The fan housing includes a first part and a second part. The first part and the first structural member together form a flat structure, and the flat structure and the second structural member together enclose an installation space. The fan body and the second part are located in the installation space. Here, the "flat structure" can be used as the main body appearance board of the electronic device or a part of the main body middle frame. Here, the statement that "the first part and the first structural member together form a flat structure" can be understood as that the first part and the first structural member are integrally formed, and the integrally formed structure is the flat structure, or the first part is connected to the first structural member so that the connected first part and first structural member together form a flat structure, where there may be a certain assembly gap or assembly step difference between the first part and the first structural member.

[0007] The first part includes a first surface, and the first structural member includes a second surface. Both the first surface and the second surface are located on the side of the appearance flat plate facing away from the installation space, and the second surface and the first surface are in the same plane. Here, the "plane" can be understood as having an absolutely flat surface or an approximately flat surface. Among them, the approximately flat surface can have slight undulations, and the acceptable deviation range of the approximately flat surface can be, for example, within 5%. Through the above settings, the first part and the first structural member form a flat plate structure, which is beneficial to reducing the assembly spacing between the fan housing and the first structural member, as well as the space occupied by the fan housing in the installation space, and thus is beneficial to reducing the thickness of the electronic device and facilitating the realization of the thin and light of the electronic device.

[0008] In some implementation manners, the fan body includes a shaft seat, fan blades, and a stator assembly. The shaft seat is connected to the first part, the stator assembly is connected to the shaft seat, the fan blades are rotatably connected to the shaft seat, and the fan blades include magnetic elements. The fan housing further includes a communication hole, and the electronic device further includes a circuit board. The circuit board is located in the installation space, extends into the fan housing through the communication hole, and is electrically connected to the stator assembly. Through the above settings, the main board can control the circuit board to supply power to the stator coil, and a rotating electromagnetic field is generated after the stator coil is energized.

[0009] In some implementation manners, the side of the first part close to the installation space has a convex structure. The side of the convex structure close to the installation space has a first sub-surface, and the first sub-surface is arranged opposite to the first surface. The first sub-surface is recessed toward the side close to the first surface to form an installation groove, and the shaft seat is installed in the installation groove. Through the above settings, the fan body can be installed on the first part through the convex structure, and by locally increasing the thickness of the first part, the connection strength of the fan body is improved.

[0010] In some implementation manners, the first sub-surface is parallel to the first surface and perpendicular to the rotation axis of the fan blades. Through the above settings, it is avoided that the fan blades interfere with the first sub-surface during rotation, which is beneficial to improving the phenomenon of the fan blades being scratched.

[0011] In some implementation manners, the first part further includes a second sub-surface adjacent to the convex structure. The second sub-surface is arranged opposite to the first surface, the second sub-surface is parallel to the first surface, and perpendicular to the rotation axis of the fan blades. Through the above settings, it is avoided that the fan blades interfere with the first sub-surface during rotation, which is beneficial to improving the phenomenon of the fan blades being scratched. And, through the above settings, it is also beneficial to ensure the volume of the installation space surrounded by the first part, the first structural member, and the second structural member, and increase the installation space.

[0012] In some implementations, one side of the first structural member adjacent to the installation space has a third sub-surface, the third sub-surface is disposed opposite to the second surface, and at least part of the third sub-surface and at least part of the second sub-surface are located in the same plane. Through the above arrangement, it is beneficial to improve the regularity of the first structural member, which is conducive to further ensuring the volume of the installation space enclosed by the first part, the first structural member, and the second structural member, and increasing the installation space.

[0013] In some implementations, the circuit board includes a first board portion, a second board portion, and a bending portion. The first board portion is connected to the first sub-surface, the second board portion is connected to the second sub-surface and passes through the communication hole, and the bending portion is connected between the first board portion and the second board portion. Through the above arrangement, the circuit board can be installed on the first part, and the space occupied by the circuit board in the installation space can be reduced. Moreover, the second board portion can also pass through the communication hole so that the second board portion can extend out of the fan housing through the communication hole and be electrically connected to the main board of the electronic device.

[0014] In some implementations, the first part and the first structural member are an integral structure. By setting the first part and the first structural member as an integral structure, it is beneficial to improve the connection strength between the first part and the bracket of the first structural member.

[0015] In some implementations, the second part includes a frame and a cover plate. The frame is located between the first part and the cover plate, the frame surrounds the edges of the first part and the cover plate, and the frame and the cover plate are an integral structure. By setting the frame and the cover plate as an integral structure, it is beneficial to improve the connection strength between the frame and the cover plate, thereby improving the overall structural strength of the second part. At the same time, the frame and the cover plate being an integral structure is also beneficial to improving the sealing performance between the frame and the cover plate, which is conducive to the second part and part of the first part forming a closed air outlet channel, preventing air from flowing back, and improving the heat dissipation capacity of the fan assembly.

[0016] In some implementations, the frame is detachably connected to one side of the first structural member adjacent to the installation space; the fan module further includes a sealing structure, and the sealing structure is located between the first part and the frame. Through the above arrangement, it is beneficial to the second part and part of the first part forming a closed air outlet channel, preventing air from flowing back, and improving the heat dissipation capacity of the fan assembly.

[0017] In some implementations, one side of the first part adjacent to the installation space further has a concave structure. The concave structure and the frame jointly enclose a communication hole, part of the sealing structure is located in the communication hole, and the circuit board is located between the sealing structure and the concave structure. Through the above arrangement, the sealing effect between the circuit board and the frame can be improved. At the same time, compared with setting the circuit board between the sealing structure and the frame, setting the circuit board between the sealing structure and the concave structure is beneficial to avoiding the frame pressing and damaging the circuit board.

[0018] In some implementations, the first structural member has a mounting opening extending therethrough, and at least a portion of the first portion is located in the mounting opening. Through the above arrangement, the first structural member and the first portion have a common flat plate structure, which is conducive to reducing the assembly distance between the fan housing and the first structural member, as well as the thickness of a portion of the first structural member, thereby helping to reduce the thickness of the electronic device and making the electronic device thinner and lighter.

[0019] In some implementations, the first structural member includes a bottom plate and a lap block, the bottom plate has a mounting opening extending therethrough, the bottom plate has a second surface on a side facing away from the mounting space, the bottom plate also has a side surface adjacent to the second surface, and the side surface surrounds the mounting opening. The lap block is connected to a side of the bottom plate close to the mounting space, the lap block extends beyond the side surface in a direction parallel to the second surface and from the side surface to the rotation axis of the fan blade, the surface where the lap block is adjacent to the side surface is a lap surface, and the lap surface contacts a side of the first portion close to the mounting space.

[0020] In some implementations, part of the bottom plate and part of the first part together constitute a welding block, and the side of the welding block facing away from the installation space has a third surface, and at least part of the third surface, at least part of the first surface, and at least part of the second surface are located in the same plane. Through the above arrangement, the overlap block can limit the first part and prevent the first part from moving toward the installation space. At the same time, since the overlap block is connected to the side of the bottom plate close to the installation space, when the fan housing is installed, the fan housing can be extended from the outside of the shell into the installation space, and the first part is in contact with the overlap surface, which facilitates the installation and fixation of the fan housing.

[0021] In some implementations, the second part includes a frame and a cover plate, the frame is located between the first part and the cover plate, the frame is arranged around the edge of the cover plate, and there is a preset distance between the frame and the side surface in a direction parallel to the second surface and pointing from the side surface to the rotation axis of the fan blade. The above arrangement is conducive to ensuring the distance between the welding position and the frame, avoiding the high temperature during the welding process from affecting the frame, and is conducive to improving the structural reliability of the frame.

[0022] In some implementations, the fan module may further include a decorative layer, which is located on a side of the bottom plate and the first portion away from the installation space. The decorative layer is provided to improve the aesthetics of the appearance of the electronic device. In an embodiment where a portion of the bottom plate and a portion of the first portion together constitute a welding block, the decorative layer also covers the welding block to prevent the welding block from being exposed, which is conducive to further improving the aesthetics of the electronic device.

[0023] On the one hand, an electronic device is provided, including a main board and the fan module in any of the above embodiments, and the main board is connected to the fan body of the fan module. The electronic device provided by the embodiment of the present application includes the fan module as described above, so it has all the above beneficial effects, which will not be repeated here. Description of the Drawings

[0024] Figure 1 It is a cross-sectional view of an electronic device in some embodiments;

[0025] Figure 2 It is a structural diagram of a fan module in some embodiments;

[0026] Figure 3 It is a cross-sectional view of an electronic device provided by an embodiment of the present application;

[0027] Figure 4 It is a cross-sectional view of a fan module provided by an embodiment of the present application;

[0028] Figure 5 It is Figure 4 a cross-sectional view of the flat plate structure in the electronic device in;

[0029] Figure 6 It is Figure 4 a partial enlarged view of part A in the electronic device in;

[0030] Figure 7 It is a cross-sectional view of another electronic device provided by an embodiment of the present application;

[0031] Figure 8 It is a cross-sectional view of another fan module provided by an embodiment of the present application;

[0032] Figure 9 It is Figure 8 a cross-sectional view of the first structural member in the electronic device in;

[0033] Figure 10 It is Figure 8 a cross-sectional view of the first part in the electronic device in;

[0034] Figure 11 It is a cross-sectional view of a first structural member before welding provided by an embodiment of the present application;

[0035] Figure 12 It is a cross-sectional view of a first part lapped on a first structural member provided by an embodiment of the present application;

[0036] Figure 13 It is a cross-sectional view of a first part and a first structural member after welding provided by an embodiment of the present application;

[0037] Figure 14A cross-sectional view after grinding of a first part and a first structural member provided by an embodiment of the present application;

[0038] Figure 15 A cross-sectional view after spraying a decorative layer on the surfaces of a first part and a first structural member provided by an embodiment of the present application. Detailed implementation manners

[0039] Next, the technical solutions in the embodiments of the present application will be described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments.

[0040] Hereinafter, terms such as "first" and "second" are only for convenience of description, and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0041] In the embodiments of the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present related concepts in a specific manner.

[0042] In the embodiments of the present application, direction indicators such as up, down, left, right, front and back used to explain the structures and movement directions of different components in the present application are relative. When the components are in the positions shown in the figures, these indicators are appropriate. However, if the description of the positions of the components changes, then these direction indicators will also change accordingly.

[0043] Here, "parallel" and "perpendicular" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, where the acceptable deviation range for approximate parallel can be, for example, within 5% deviation; similarly, "perpendicular" includes absolute perpendicular and approximate perpendicular, where the acceptable deviation range for approximate perpendicular can be, for example, within 5% deviation.

[0044] Embodiments of the present application provide an electronic device. Among them, the electronic device can be a terminal product such as a mobile phone, a tablet computer (pad), a television, a smart wearable product (for example, a smart watch, a smart bracelet), a vehicle-mounted computer, etc. Embodiments of the present application do not impose special restrictions on the specific form of the above-mentioned electronic device.

[0045] In some embodiments, the electronic device can be a 2-in-1 computer, that is to say, the electronic device can be used both as an ordinary tablet computer and as a notebook computer, so as to meet different usage requirements. Figure 1 It is a cross-sectional view of the electronic device 1' in some embodiments. As Figure 1 shown, the electronic device 1' may include a housing 11. The housing 11 may include, for example, a first structural member 111 and a second structural member 112. The second structural member 112 may be disposed around the edge of the first structural member 111. For example, the first structural member 111 may be generally in the shape of a rectangular flat plate, and the second structural member 112 may be a flat plate structure disposed along the edge of the rectangular flat plate. The first structural member 111 and the second structural member 112 may enclose a box structure.

[0046] In some embodiments of the present application, the first structural member 111 and the second structural member 112 may be an integral structure and jointly form the outer shell of the electronic device 1'. For example, the materials of the first structural member 111 and the second structural member 112 may include metals such as magnesium alloy, stainless steel, etc. The first structural member 111 and the second structural member 112 may be integrally formed by a stamping process. In addition, the materials of the first structural member 111 and the second structural member 112 may also include plastics, glass, ceramics, etc. Embodiments of the present application do not specifically limit the materials of the first structural member 111 and the second structural member 112.

[0047] In some embodiments, the electronic device 1' may further include a display module 20 mounted on the second structural member 112. Among them, the display module 20 is used to display images. The display module 20 has a display surface for displaying images and a back surface away from the display panel. The back surface of the display module 20 may face the first structural member 111.

[0048] In some embodiments of the present application, the display module 20 may be a liquid crystal display module. In this case, the display module 20 includes a liquid crystal display (LCD) and a backlight module (BLU) located on the back of the liquid crystal display (away from the side surface b1 of the LCD for displaying images). The BLU can provide a light source to the liquid crystal display so that each sub-pixel in the liquid crystal display can emit light to achieve image display. Alternatively, in some other embodiments of the present application, the display module 20 may be an organic light-emitting diode (OLED) display screen. Since an electroluminescent layer is provided in each sub-pixel of the OLED display screen, the OLED display screen can achieve self-luminescence after receiving the working voltage. In this case, the above-mentioned BLU does not need to be provided in the display module 20 with an OLED display screen.

[0049] Based on the above structure, the first structural member 111, the second structural member 112, and the display module 20 can enclose an installation space 101 for accommodating electronic components. The electronic components may include sensors, cameras, microphones, batteries, and so on. Of course, the electronic components in the electronic device 1' are not limited to the above several examples.

[0050] In some embodiments, the electronic device 1' may further include a main board 80 installed in the installation space 101 and a heating element 81 installed on the main board 80. The heating element 81 may be a system on chip (SOC), a central processing unit (CPU), or a graphics processing unit (GPU). Among them, the main board 80 may be a printed circuit board (PCB). Other components, such as capacitors, may also be installed on the main board 80, which is not limited in the embodiments of the present application. The above-mentioned main board 80 is electrically connected to the driving circuit on the display module 20, so that the display module 20 can be controlled to display images through the processor on the PCB.

[0051] On this basis, in order to ensure the heat dissipation efficiency of the above-mentioned heating element 81, the heat dissipation technology adopted by the electronic device 1' is mainly an air-cooled heat dissipation device combined with a heat dissipation component and a fan module 30'.

[0052] In some embodiments, a heat dissipation component may be disposed on one side of the heating element 81. The heat dissipation component may include a metal heat conducting plate 82 and a heat dissipation device 83. The metal heat conducting plate 82 may be located between the heating element 81 and the heat dissipation device 83. The heat dissipation device 83 may be, for example, a vapor chamber (VC) radiator using the vapor chamber heat dissipation technology. Through the above arrangement, the heat dissipation device 83 can efficiently conduct the heat of the heating element 81 into the installation space 101, thereby preventing the temperature of the heating element 81 from being too high.

[0053] In some embodiments, as Figure 1 shown, the electronic device 1' may further include a fan module 30'. Figure 2 FIG. is a structural diagram of the fan module 30' in some embodiments. Combining Figure 2 shown, the fan module 30' may include a fan housing 32 and a fan body 31. The fan housing 32 may cover the outside of the fan body 31 so that the fan housing 32 can protect the fan body 31. Among them, the fan housing 32 has an air inlet opening M and an air outlet opening N. The air inlet opening M may communicate with the installation space 101, and the air outlet opening N communicates with the external environment. Through the above arrangement, the airflow carrying heat can enter the fan housing 32 through the air inlet opening M of the fan housing 32 and be discharged into the external space through the air outlet opening N, thereby conducting the heat from the heat dissipation component outside the electronic device 1'.

[0054] In some embodiments, the fan module 30' may be installed in the installation space 101. Exemplarily, the air inlet of the fan housing 32 may be located on the side close to the display module 20 so that there is a certain distance between the fan module 30' and the display module 20 (i.e., Figure 1 d2 in). Based on the above structure, the fan housing 32 may be connected to the first structural member 111 through a threaded fastener such as a bolt so that there is also a certain assembly distance between the fan housing 32 and the first structural member 111 (i.e., Figure 1 d4 in).

[0055] To ensure the heat dissipation efficiency inside the electronic device 1', it is usually necessary to ensure the thickness of the fan module 30' provided inside the electronic device 1' (i.e., Figure 1 d3 in), and at the same time, it is also necessary to ensure the distance between the display module 20 and the fan module 30' (i.e., Figure 1 d2 in). The thickness of the electronic device 1' may include the thickness of the display module 20 (i.e., Figure 1 d1 in), the distance between the display module 20 and the fan module 30' (i.e., Figure 1 d2 in), the thickness of the fan module 30' (i.e., Figure 1the distance between the fan module 30' and the first structural member 111 (i.e., d3 in Figure 1 ), the distance between the fan module 30' and the first structural member 111 (i.e., d4 in Figure 1 ), and the thickness of the first structural member 111 (i.e., d5 in Figure 1 ). However, in the above installation method of the fan module 30', the thickness of the electronic device 1' is relatively large, making it difficult for the electronic device 1' to ensure thinness and lightness. Here, the "thickness" can be understood as the dimension in the direction perpendicular to the display surface of the display module 20.

[0056] Figure 3 FIG. is a structural diagram of an electronic device 1 provided by an embodiment of the present application. Figure 4 FIG. is a cross-sectional view of a fan module 30 provided by an embodiment of the present application. Referring to Figure 3 and Figure 4 shown, in view of this, in the electronic device 1 provided by an embodiment of the present application, the fan housing 32 may include a first part 321 and a second part 322. The first part 321 is connected to the first structural member 111, and the first part 321 and the first structural member 111 together form a flat structure 13. Here, the "flat structure 13" may serve as the main body appearance board of the electronic device 1 or a part of the main body middle frame. Here, "the first part 321 and the first structural member 111 together form a flat structure 13" can be understood as that the first part 321 and the first structural member 111 are integrally formed, and the integrally formed structure is the flat structure 13, or the first part 321 is connected to the first structural member 111 so that the connected first part 321 and first structural member 111 together form a flat structure 13, where there may be a certain assembly gap or assembly step difference between the first part 321 and the first structural member 111. Exemplarily, the first part 321 may be generally flat, and the structure of the first structural member 111 may also be generally flat. The above two flat plates are connected together so that the first part 321 and at least part of the first structural member 111 together form a flat structure 13.

[0057] Continuing to refer to Figure 3 , the flat structure 13 and the second structural member 112 may jointly enclose an installation space 101. The fan body 31 may be located in the installation space 101, and the second part 322 is located in the installation space 101. Exemplarily, the flat structure 13 and the second structural member 112 jointly enclose a groove, and the space in the groove is the installation space 101. In an embodiment where the electronic device 1 further includes a display module 20, the display module 20 may block the groove, that is, the display module 20, the flat structure 13, and the second structural member 112 jointly enclose the installation space 101.

[0058] Among them, referring to Figure 4, the first part 321 includes a first surface a1, and the first structural member 111 includes a second surface a2. The first surface a1 and the second surface a2 are located on the side of the flat plate structure 13 away from the installation space 101, and the second surface a2 and the first surface a1 are located in the same plane. Here, "the second surface a2 and the first surface a1 are located in the same plane" can be understood as that part of the second surface a2 can be located in the same plane as the first surface a1; or, part of the second surface a2 and part of the first surface a1 are located in the same plane; or, the second surface a2 and part of the first surface a1 are located in the same plane. Here, "plane" can be understood as having an absolutely flat surface or an approximately flat surface, wherein the approximately flat surface may have slight undulations, and the acceptable deviation range of the approximate flatness may be, for example, a deviation within 5%. Through the above arrangement, the first part 321 and the first structural member 111 constitute the flat plate structure 13, which is conducive to reducing the assembly spacing between the fan housing 32 and the first structural member 111 (that is, Figure 1 d4) in the figure, and the space occupied by the fan housing 32 in the installation space 101, which is beneficial to reducing the thickness of the electronic device 1 and facilitating the thinning of the electronic device 1.

[0059] In the present application embodiment, combined Figure 2 and Figure 4 As shown, the second part 322 may include a frame 3221 and a cover plate 3223, wherein the frame 3221 may be located between the first part 321 and the cover plate 3223, and the frame 3221 is arranged around the edge of the cover plate 3223. Exemplarily, the frame 3221 may be arranged around the edge of the first part 321, so that the first part 321, the frame 3221 and the cover plate 3223 enclose an accommodating space 103, and the fan body 31 is located in the accommodating space 103.

[0060] Among them, combined Figure 2 and Figure 4As shown, the second part 322 is sealed and connected to a part of the first part 321, the second part 322 has an air inlet opening M, and the second part 322 and the first part 321 surround an air outlet opening N. Exemplarily, the first part 321 and the cover plate 3223 can be substantially circular flat plates, and the first part 321 and the cover plate 3223 are arranged opposite to each other, and the frame 3221 can be arranged along a part of the edge of the first part 321 and the cover plate 3223, that is, the frame 3221, the first part 321 and the cover plate 3223 can jointly surround an opening, which is the air outlet opening N. At the same time, the cover plate 3223 can have an air inlet opening M. Through the above arrangement, the gas in the installation space 101 can enter the accommodating space 103 through the air inlet opening M, and be blown to the external environment through the air outlet opening N. Since the second part 322 and part of the first part 321 are sealed and connected, it is beneficial for the second part 322 and part of the first part 321 to form a closed air outlet channel, thereby preventing air backflow and improving the heat dissipation capacity of the fan assembly.

[0061] Continue to refer to Figure 4 The fan body 31 may include a shaft seat 315, fan blades 311 and a stator assembly 313, the shaft seat 315 is connected to the first part 321, the stator assembly 313 is connected to the shaft seat 315, and the fan blades 311 are rotatably connected to the shaft seat 315.

[0062] Exemplarily, the shaft seat 315 may include a mounting seat 3151, a rotating shaft 3152, and a rotating bearing 3153, wherein the mounting seat 3151 may be mounted on the first portion 321, and the end of the mounting seat 3151 away from the first portion 321 has a groove 3150, the rotating shaft 3152 and the rotating bearing 3153 are located in the groove 3150, and the rotating bearing 3153 is connected between the rotating shaft 3152 and the groove wall of the groove 3150. For example, the rotating shaft 3152 may be interference fit with the inner ring of the rotating bearing 3153, and the groove wall of the groove 3150 may be interference fit with the outer ring of the rotating bearing 3153. Through the above configuration, the rotating shaft 3152 can rotate relative to the mounting seat 3151.

[0063] In some embodiments, the shaft seat 315 may further include a wear-resistant pad 3155, which is located between the rotating shaft 3152 and the bottom of the groove 3150. The material of the wear-resistant pad 3155 may include, for example, peek (polyether ether ketone). By providing the wear-resistant pad 3155, it is beneficial to avoid the wear of the rotating shaft 3152 on the mounting seat 3151. In some embodiments, the shaft seat 315 may further include an oil seal cover 3154, which is sealingly connected between the rotating shaft 3152 and the mounting seat 3151. It can be understood that usually lubricating oil or grease is filled in the groove 3150 to reduce the frictional resistance during the rotation of the rotating shaft 3152. By providing the oil seal cover 3154, it is beneficial to prevent the lubricating oil or grease in the groove 3150 from leaking, thereby avoiding contaminating the fan body 31.

[0064] In some embodiments, the stator assembly 313 may be, for example, a stator coil, and the stator coil may be sleeved on the shaft seat 315. Correspondingly, the electronic device 1 may further include a circuit board 70, which is located in the installation space 101. Correspondingly, the fan housing 32 may further include a communication hole 104, and the circuit board 70 extends into the installation space 101 through the communication hole 104 and is electrically connected to the stator assembly 313. And, in combination Figure 1 , the circuit board 70 may also be electrically connected to the main board 80 in the electronic device 1'. Exemplarily, the circuit board 70 may be electrically connected to the stator assembly 313 through metal leads. Through the above arrangement, the main board 80 can control the circuit board 70 to supply power to the stator coil, and the stator coil generates a rotating electromagnetic field after being energized.

[0065] Based on the above structure, the fan blade 311 may be connected to the rotating shaft 3152, and the fan blade 311 includes a magnetic element so that the fan blade 311 can rotate relative to the shaft seat 315. For example, the central axis of the rotating shaft 3152 may be the rotation axis L of the fan blade 311. Among them, the fan blade 311 may include a plurality of blades, and the blades may be forward-inclined blades, or the blades may also be backward-inclined blades. The magnetic element may be, for example, a permanent magnetic ring. When the stator coil is energized, the permanent magnetic ring is mutually repelled by the rotating electromagnetic field to push, so that when the fan blade 311 rotates relative to the shaft seat 315, the space in the installation space 101 enters the accommodation space 103 through the air inlet opening M, and the air flow flows to the air outlet opening N under the drive of the blades and is discharged from the air outlet opening N.

[0066] It can be understood that the shapes of the above shaft seat 315 and the stator coil can be designed according to the actual movement requirements of the fan blade 311, and the embodiments of the present application do not limit this. And, other structures may also be included in the above fan body 31, and the driving method of the fan blade 311 is not limited to the mutual repulsion between magnetic elements. The embodiments of the present application do not limit the specific structure of the fan body 31 and the driving method of the fan blade 311.

[0067] Figure 5 is Figure 4 a cross-sectional view of the flat structure 13 in the electronic device 1 in Figure 4 and Figure 5 As shown in combination with

[0068] In some embodiments, one side of the first part 321 close to the installation space 101 has a convex structure 131. One side of the convex structure 131 close to the installation space 101 has a first sub-surface 1311. The first sub-surface 1311 is disposed opposite to the first surface a1. The first sub-surface 1311 is recessed toward the side close to the first surface a1 to form a mounting groove 1313. The shaft seat 315 is installed in the mounting groove 1313. Exemplarily, the convex structure 131 may be generally in a cylindrical structure, and the upper surface of the cylindrical structure is the first sub-surface 1311. The shape of the mounting groove 1313 may be correspondingly set according to the shape of the mounting seat 3151 of the shaft seat 315, so that the mounting seat 3151 of the shaft seat 315 can be installed in the mounting groove 1313. In some examples, the material of the mounting seat 3151 may include metals, such as copper, aluminum, stainless steel, and the like. For example, when the materials of both the first part 321 and the mounting seat 3151 are metals, the mounting seat 3151 can be riveted in the mounting groove 1313 of the first part 321, and glue can be added between the mounting seat 3151 and the mounting groove 1313 to further increase the connection strength between the mounting seat 3151 and the first part 321. Through the above settings, the fan body 31 can be installed on the first part 321 through the convex structure 131, and by locally increasing the thickness of the first part 321, the connection strength of the fan body 31 is improved.

[0069] In some embodiments, the first sub-surface 1311 may be parallel to the first surface a1 and perpendicular to the rotation axis L of the fan blade 311. Exemplarily, the fan blade 311 can rotate relative to the rotating shaft 3152, and the center line of the rotating shaft 3152 is the rotation axis L of the fan blade 311. The first sub-surface 1311 may be perpendicular to the center line of the rotating shaft 3152, that is, the first sub-surface 1311 may be perpendicular to the rotation axis L of the fan blade 311. Through the above settings, it is possible to avoid interference between the fan blade 311 and the first sub-surface 1311 during rotation, which is beneficial to improving the phenomenon of the fan blade 311 being scratched.

[0070] In some embodiments, the first portion 321 may further include a second sub-surface 1315 adjacent to the convex structure 131. The second sub-surface 1315 is disposed opposite to the first surface a1, parallel to the first surface a1, and perpendicular to the rotation axis L of the fan blade 311. Exemplarily, the second sub-surface 1315 may surround the edge of the convex structure 131. The distance between the second sub-surface 1315 and the first surface a1 is less than the distance between the first sub-surface 1311 and the first surface a1. Through the above arrangement, it is possible to avoid interference between the fan blade 311 and the first sub-surface 1311 during rotation, which is beneficial to improving the phenomenon of rubbing of the fan blade 311. Moreover, through the above arrangement, it is also beneficial to ensure the volume of the installation space 101 surrounded by the first portion 321, the first structural member 111, and the second structural member 112, and increase the installation space 101.

[0071] In some examples, the flatness of the second sub-surface 1315 may be less than or equal to 0.2 mm. For example, the flatness of the second sub-surface 1315 may be 0.1 mm, 0.15 mm, or 0.2 mm. Here, the "flatness" may be understood as the deviation value of the uneven height of the actual plane of the second sub-surface 1315 relative to the ideal plane. By defining the flatness of the second sub-surface 1315, it is beneficial to further improve the flatness effect of the second sub-surface 1315 and further avoid interference between the fan blade 311 and the second sub-surface 1315 during rotation.

[0072] In some embodiments, one side of the first structural member 111 close to the installation space 101 may have a third sub-surface 1321. The third sub-surface 1321 is disposed opposite to the second surface a2, and at least part of the third sub-surface 1321 and at least part of the second sub-surface 1315 are located in the same plane. Here, "at least part of the third sub-surface 1321 and at least part of the second sub-surface 1315 are located in the same plane" may be understood as that part of the third sub-surface 1321 may be in the same plane as the second sub-surface 1315; or, part of the third sub-surface 1321 and part of the second sub-surface 1315 are in the same plane; or, the third sub-surface 1321 and part of the second sub-surface 1315 are in the same plane. Here, the "plane" may be understood as having an absolutely flat surface or an approximately flat surface, where the approximately flat surface may have slight undulations, and the acceptable deviation range of the approximately flat surface may be, for example, within 5%.

[0073] As described in the above embodiments, the second sub-surface 1315 may be parallel to the first surface a1. Since at least a part of the third sub-surface 1321 and at least a part of the second sub-surface 1315 are in the same plane, and at least a part of the first surface a1 and at least a part of the second surface a2 are in the same plane, at least a part of the third sub-surface 1321 may be parallel to the second surface a2, which is beneficial to improving the regularity of the first structural member 111, and is beneficial to further ensuring the volume of the installation space 101 enclosed by the first part 321, the first structural member 111, and the second structural member 112, and increasing the installation space 101.

[0074] In some examples, the flatness of the third sub-surface 1321 may be less than or equal to 0.2 mm. For example, the flatness of the third sub-surface 1321 may be 0.1 mm, 0.15 mm, or 0.2 mm. Here, the "flatness" can be understood as the deviation value of the uneven height of the actual plane of the third sub-surface 1321 relative to the ideal plane. By limiting the flatness of the third sub-surface 1321, it is beneficial to further improve the flatness effect of the third sub-surface 1321 and further improve the regularity of the first structural member 111.

[0075] Based on the above structure, the circuit board 70 may include a first board portion 71, a second board portion 72, and a bending portion 73. The first board portion 71 may be connected to the first sub-surface 1311, the second board portion 72 may be connected to the second sub-surface 1315, and the bending portion 73 may be connected between the first board portion 71 and the second board portion 72. Exemplarily, the circuit board 70 may be a flexible printed circuit (FPC). The first board portion 71 may be adhered to the first sub-surface 1311, the second board portion 72 may be adhered to the second sub-surface 1315, and the bending portion 73 may be adhered to the peripheral surface of the protruding structure 131 and connected between the first board portion 71 and the second board portion 72. Through the above settings, the circuit board 70 can be installed on the first part 321 and can also reduce the space occupied by the circuit board 70 in the installation space 101. Moreover, the second board portion 72 can also pass through the communication hole 104 so that the second board portion 72 can extend out of the fan housing 32 through the communication hole 104 and be electrically connected to the main board 80 of the electronic device 1.

[0076] In some embodiments, with continued reference to Figure 4 , the first part 321 and the first structural member 111 may be an integral structure. For example, the first part 321 and the second structural member 112 may be an integral metal plate. The material of the metal plate may include, for example, magnesium alloy, stainless steel, etc. By setting the first part 321 and the first structural member 111 as an integral structure, it is beneficial to improve the connection strength between the first part 321 and the first structural member 111 brackets.

[0077] Among them, the surface of the metal plate can be machined by a computer numerical control (CNC) machine tool through face milling. For example, through face milling, the second sub-surface 1315 of the first part 321 and the third sub-surface 1321 of the first structural member 111 can be located in the same plane, and this plane is parallel to the plane where the first surface a1 and the second surface a2 are located. At the same time, through face milling, the first sub-surface 1311 of the first part 321 can also be parallel to the plane where the first surface a1 and the second surface a2 are located. Additionally, by increasing the milling depth, a groove can be milled on the first sub-surface 1311. In some implementation manners, the flatness of the milled first sub-surface 1311, second sub-surface 1315, and third sub-surface 1321 can be adjusted by adjusting the accuracy of face milling.

[0078] As described in the above embodiments, with reference to Figure 4 , the second part 322 may include a frame 3221 and a cover plate 3223. Based on the above structure, the frame 3221 and the cover plate 3223 may be an integral structure. For example, the frame 3221 and the cover plate 3223 may be an integral structure formed by pressing a single metal plate. By setting the frame 3221 and the cover plate 3223 as an integral structure, it is beneficial to improve the connection strength between the frame 3221 and the cover plate 3223, and thus improve the overall structural strength of the second part 322. At the same time, since the frame 3221 and the cover plate 3223 are an integral structure, it is also beneficial to improve the sealing performance between the frame 3221 and the cover plate 3223, which is conducive to forming a closed air outlet channel between the second part 322 and a part of the first part 321, preventing air from flowing back, and improving the heat dissipation capacity of the fan assembly.

[0079] Moreover, when the frame 3221 and the cover plate 3223 are an integral metal structure, on the premise of ensuring the overall structural strength of the second part 322, it is also beneficial to reduce the thickness of the second part 322, and thus beneficial to reduce the space occupied by the fan module 30 in the electronic device 1, improving the space utilization rate in the electronic device 1.

[0080] In some embodiments, the frame 3221 is detachably connected to one side of the first structural member 111 close to the installation space 101. Exemplarily, in combination with Figure 4 and Figure 5As shown, on one side of the first structural member 111 close to the installation space 101, there may be an installation boss 132, and the installation boss 132 and the frame 3221 may be threadedly connected. Exemplarily, the installation boss 132 may be disposed on the third sub-surface 1321 of the first structural member 111. The installation boss 132 may have a counterbore 1323, and the inner wall of the counterbore 1323 may have internal threads. Correspondingly, the frame 3221 may also have a threaded hole disposed opposite to the counterbore 1323. Threaded fasteners such as bolts may pass through the threaded hole and the counterbore 1323 to threadedly connect the installation boss 132 and the frame 3221. Through the above arrangement, a detachable connection between the frame 3221 and the first structural member 111 can be achieved, facilitating the replacement or repair of the fan body 31 at any time.

[0081] Of course, in the embodiment of the present application, the frame 3221 and the cover plate 3223 may also be two independent structures, and the frame 3221 and the cover plate 3223 may be connected together by welding or bonding.

[0082] Based on the above structure, referring to Figure 4 As shown, the fan module 30 may further include a sealing structure 34, and the sealing structure 34 may be located between the first part 321 and the frame 3221. Among them, the sealing structure 34 may include a sealing ring, sealant, etc. As described in the above embodiment, the frame 3221 may be disposed along part of the edges of the first part 321 and the cover plate 3223. Correspondingly, the sealing structure 34 may also be disposed around part of the edges of the first part 321 and the frame 3221 to achieve a sealed connection between the frame 3221 and part of the first part 321, which is beneficial for the second part 322 and part of the first part 321 to form a closed air outlet channel, preventing air from flowing back and improving the heat dissipation capacity of the fan assembly.

[0083] Figure 6 For Figure 4 the partial enlarged view of the A position in the electronic device 1 in Figure 6 As shown, in some embodiments, on one side of the first part 321 close to the installation space 101, there is also a recessed structure 135, and the recessed structure 135 and the frame 3221 jointly enclose a communication hole 104. Among them, part of the second sub-surface 1315 may be recessed towards the direction close to the first surface a1 to form the recessed structure 135. For example, a groove may be machined on part of the second sub-surface 1315 by face milling, and this groove is the recessed structure 135. As described in the above embodiment, the second board portion 72 of the circuit board 70 may also be bent towards the direction close to the recessed structure 135 and pass through the communication hole 104. Through the above arrangement, the circuit board 70 can extend into the fan housing 32 through the communication hole 104 and be electrically connected to the stator assembly 313.

[0084] As described in the above embodiments, the sealing structure 34 is located between the frame 3221 and the first part 321. Part of the sealing structure 34 may be located between the frame 3221 and the recessed structure 135, that is, part of the sealing structure 34 may be located within the communication hole 104, and the circuit board 70 may be located between the sealing structure 34 and the recessed structure 135. Through the above arrangement, the sealing effect between the circuit board 70 and the frame 3221 is improved. At the same time, compared with setting the circuit board 70 between the sealing structure 34 and the frame 3221, setting the circuit board 70 between the sealing structure 34 and the recessed structure 135 helps to prevent the frame 3221 from pressing and damaging the circuit board 70.

[0085] In some examples, the fan module 30 may further include a sealing layer 35. The sealing layer 35 may be located between the second board portion 72 of the circuit board 70 and the recessed structure 135, and between the second board portion 72 of the circuit board 70 and the sealing structure 34. The material of the sealing layer 35 may include, for example, foam. By providing the sealing layer 35, it is beneficial to further improve the sealing effect between the circuit board 70 and the communication hole 104, and it is beneficial for the second part 322 and part of the first part 321 to form a closed air outlet channel, preventing air from flowing back and improving the heat dissipation capacity of the fan assembly.

[0086] Figure 7 This is a structural diagram of another electronic device 1 provided by an embodiment of the present application. Figure 8 This is a structural diagram of another fan module 30 provided by an embodiment of the present application. As Figure 7 and Figure 8 shown, in some embodiments, the first structural member 111 may have an installation opening 137 penetrating therethrough, and at least part of the first part 321 may be located within the installation opening 137. Among them, the shape of the installation opening 137 may be set accordingly according to the shape of the first part 321. For example, the installation opening 137 may be a circular opening. Correspondingly, the cross-sectional shape of the first part 321 in a plane parallel to the first surface a1 may be circular, so that at least part of the first part 321 can be located within the installation opening 137. Here, "at least part of the first part 321 can be located within the installation opening 137" can be understood as that when the thickness of the first part 321 is less than or equal to the thickness of the first structural member 111, the first part 321 is located within the installation opening 137; when the thickness of the first part 321 is greater than the thickness of the first structural member 111, part of the first part 321 protrudes from the installation opening 137, and part of the first part 321 is located within the installation opening 137.

[0087] Based on the above structure, during the installation process of the fan module 30 in the embodiments of the present application, the fan body 31 can be first installed in the fan housing 32, and the fan housing 32 can be installed on the first structural member 111, with the first part 321 located within the installation opening 137 of the first structural member 111, so that the first part 321 and the first structural member 111 together form the flat structure 13. Among them, the first part 321 and the first structural member 111 can be welded together, or the first part 321 and the first structural member 111 can also be bonded together. The embodiments of the present application do not specifically limit the connection manner between the first part 321 and the first structural member 111.

[0088] In summary, at least a part of the first part 321 can be located within the installation opening 137, so that the first structural member 111 and the first part 321 together form the flat structure 13, which is beneficial to reducing the assembly spacing between the fan housing 32 and the first structural member 111, as well as the thickness of part of the first structural member 111, and thus is beneficial to reducing the thickness of the electronic device 1 and facilitating the realization of the thin and light of the electronic device 1.

[0089] As Figure 8 shown, in the embodiments of the present application, the frame 3221 and the cover plate 3223 in the second part 322 can be two independent structures, and can be sequentially assembled on the first part 321 to form the fan housing 32. For example, the frame 3221 can be formed on the first part 321 by an injection molding process, and the frame 3221 can be arranged around the edge of the first part 321. The frame 3221 formed by the injection molding process has good sealing performance and connection strength with the first part 321. After the frame 3221 is formed, the cover plate 3223 can be bonded to the side of the frame 3221 facing away from the first part 321 to form the fan housing 32. Among them, when the frame 3221 is formed on the first part 321 by an injection molding process, the structure of the injection mold can be adjusted so that the formed frame 3221 has a communication hole 104, so that the circuit board 70 can extend into the fan housing 32 through the communication hole 104 and be electrically connected to the stator assembly 313.

[0090] Of course, in some other embodiments, the frame 3221 and the cover plate 3223 can also be an integral structure, and the embodiments of the present application do not specifically limit this.

[0091] Figure 9 For Figure 8 is the cross-sectional view of the first structural member 111 in the electronic device 1 in Figure 10 For Figure 8 is the cross-sectional view of the first part 321 in the electronic device 1 in Figure 8 、 Figure 9 And Figure 10As shown, in some embodiments, the first structural member 111 may include a bottom plate 1113 and a lapping block 1115. The bottom plate 1113 has a mounting opening 137 therethrough. The side of the bottom plate 1113 facing away from the mounting space 101 has a second surface a2. The bottom plate 1113 also has a side surface b1 adjacent to the second surface a2. The side surface b1 encloses the mounting opening 137. The lapping block 1115 is connected to the side of the bottom plate 1113 close to the mounting space 101. In a direction parallel to the second surface a2 and pointing from the side surface b1 towards the rotation axis L of the fan blade 311 (such as the X direction in Figure 9 ), the lapping block 1115 extends beyond the side surface b1.

[0092] Exemplarily, the bottom surface of the bottom plate 1113 may be the second surface a2, and the top surface of the bottom plate 1113 is the surface on the side of the bottom plate 1113 close to the mounting space 101. The lapping block 1115 may be connected to the top surface of the bottom plate 1113. Wherein, the mounting opening 137 may be a circular opening, that is, the side surface b1 enclosing the mounting opening 137 may be an annular surface. Correspondingly, the cross-sectional shape of the lapping block 1115 in a plane parallel to the second surface a2 may be annular, and the central axis of the lapping block 1115 may coincide with the central axis of the mounting opening 137. Moreover, the central axis of the mounting opening 137 may also coincide with the rotation axis L of the fan blade 311. In a direction parallel to the second surface a2 and pointing from the side surface b1 towards the rotation axis L of the fan blade 311 (such as the X direction in Figure 9 ), the distance D1 between the lapping block 1115 and the rotation axis L of the fan blade 311 is less than the distance D2 between the side surface b1 and the rotation axis L of the fan blade 311, so that the lapping block 1115 extends beyond the side surface b1.

[0093] Based on the above settings, the surface of the lapping block 1115 adjacent to the side surface b1 is a lapping surface b2, and the lapping surface b2 contacts the side of the first part 321 close to the mounting space 101. Exemplarily, the first part 321 may further include a fourth sub-surface 1317. The fourth sub-surface 1317 is located on the side of the first part 321 close to the mounting space 101 and on the side of the second sub-surface 1315 away from the first sub-surface 1311. Wherein, the fourth sub-surface 1317 may be parallel to the first surface a1, and the distance D4 between the fourth sub-surface 1317 and the first surface a1 may be less than the distance D3 between the second sub-surface 1315 and the first surface a1. The fourth sub-surface 1317 may contact the lapping block 1115, so that the lapping block 1115 can limit the first part 321 and prevent the first part 321 from moving towards the mounting space 101.

[0094] Meanwhile, since the overlapping block 1115 is connected to the side of the bottom plate 1113 close to the installation space 101, when the fan housing 32 is installed, the fan housing 32 can extend from the outside of the housing 11 into the installation space 101, and the first part 321 can be in contact with the overlapping surface b2, which is convenient for installing and fixing the fan housing 32.

[0095] Of course, in some other embodiments, the first part 321 may further omit the fourth sub-surface 1317, and the second sub-surface 1315 of the first part 321 may be in contact with the overlapping block 1115. Alternatively, in some other embodiments, the overlapping block 1115 may also be connected to the second surface a2 of the bottom plate 1113, and the embodiments of the present application do not specifically limit this.

[0096] In some embodiments, with continued reference to Figure 8 , a part of the bottom plate 1113 and a part of the first part 321 together form a welding block 139. The side of the welding block 139 facing away from the installation space 101 has a third surface a3, and at least part of the third surface a3, at least part of the first surface a1, and at least part of the second surface a2 are located in the same plane. Exemplarily, the materials of the bottom plate 1113 and the first part 321 may include metal. The part of the second surface a2 of the bottom plate 1113 and the part of the first surface a1 of the first part 321 are welded together through a welding process, so that a part of the bottom plate 1113 and a part of the first part 321 together form the welding block 139. Through the above arrangement, the bottom plate 1113 and the first part 321 are welded together, which is beneficial to improving the connection strength between the bottom plate 1113 and the first part 321. Meanwhile, since the third surface a3 of the welding block 139 can be formed by welding the part of the second surface a2 of the bottom plate 1113 and the part of the first surface a1 of the first part 321, during the welding process, the operation can be carried out outside the housing 11, which is beneficial to increasing the operation space during the welding process and reducing the welding difficulty. And at least part of the third surface a3, at least part of the first surface a1, and at least part of the second surface a2 are located in the same plane, which is also beneficial to further improving the flatness of the housing 11 and the aesthetics of the housing 11.

[0097] In some embodiments, in a direction parallel to the second surface a2 and pointing from the side surface b1 to the rotation axis L of the fan blade 311 (such as Figure 8In the X direction (as shown in the figure), there is a preset distance H between the frame 3221 and the side surface b1. It can be understood that during the process of welding the bottom plate 1113 and the first part 321 together, the contact surface between the bottom plate 1113 and the first part 321 is usually welded. Based on the above embodiments, that is, the side surface b1 of the bottom plate 1113 and the peripheral surface of the first part 321 are welded. By adjusting the preset distance H between the frame 3221 and the side surface b1, it is beneficial to ensure the distance between the welding position and the frame 3221, avoid the influence of the high temperature during the welding process on the frame 3221, and is beneficial to improving the structural reliability of the frame 3221.

[0098] Exemplarily, in the direction parallel to the second surface a2 and pointing from the side surface b1 to the rotation axis L of the fan blade 311 (such as Figure 8 the X direction shown in the figure), the preset distance H between the frame 3221 and the side surface b1 can be greater than or equal to 10 cm. For example, the preset distance H between the frame 3221 and the side surface b1 can be 10 cm, 12 cm or 14 cm. Among them, when the preset distance H approaches 10 cm, it is beneficial to increase the volume of the fan module 30 and is beneficial to ensuring the heat dissipation performance of the electronic device 1. As the preset distance H increases, the influence of the welding process on the frame 3221 becomes smaller, which is beneficial to further improving the reliability of the frame 3221; at the same time, the volume occupied by the fan module 30 in the installation space 101 is smaller, which is beneficial to improving the space utilization rate of the installation space 101. In some embodiments, the electronic device 1 may further include a decorative layer 60, and the decorative layer 60 may be located on the side of the bottom plate 1113 and the first part 321 facing away from the installation space 101. Exemplarily, the decorative layer 60 may be a plate layer structure adhered to the bottom plate 1113 and the first part 321, or the decorative layer 60 may also be a coating structure sprayed on the surface of the first part 321 of the bottom plate 1113. By providing the decorative layer 60, it is beneficial to improve the aesthetics of the appearance of the electronic device 1. In the embodiments where a part of the bottom plate 1113 and a part of the first part 321 jointly form the welding block 139, the decorative layer 60 also covers the welding block 139, avoiding the exposure of the welding block 139, which is beneficial to further improving the aesthetics of the electronic device 1.

[0099] Next, refer to Figures 11 to 14 to briefly describe the installation process between the first part 321 of the fan housing 32 and the first structural member 111 of the housing 11 in the embodiments of the present application.

[0100] Figure 11 is a cross-sectional view before welding of a first structural member 111 provided by an embodiment of the present application. As shown in Figure 11As shown, the bottom plate 1113 of the first structural member 111 further has a first welding boss 1117 protruding toward the side away from the installation space 101 , the first welding boss 1117 may be adjacent to the side surface b1 , and the surface of the first welding boss 1117 facing the installation opening 137 may be coplanar with the side surface b1 .

[0101] Figure 12 The cross-sectional view of a first portion 321 provided in an embodiment of the present application after being overlapped with the first structural member 111. Figure 12 As shown, the first portion 321 further has a second welding boss 1319 protruding toward a side away from the installation space 101 , and the second welding boss 1319 is in contact with the first welding boss 1117 .

[0102] Figure 13 This is a cross-sectional view of a first portion 321 and a first structural member 111 after welding provided in an embodiment of the present application. Figure 13 As shown, an automated laser welding process can be used to weld the contacting surfaces of the first structural member 111 and the first part 321 so that the first structural member 111 and the first part 321 are connected together. Exemplarily, after welding, the first welding boss 1117 and the second welding boss 1319 are recessed in the direction close to the installation space 101. Among them, the automated laser welding process has the advantages of fast welding speed, uniform welds and no cracking. During the automated laser welding process, if there is micro-deformation in the weld, the residual stress of the welding can be removed by laser engraving. Of course, in the embodiment of the present application, other welding processes can also be used to weld the first structural member 111 and the first part 321 together, and the embodiment of the present application does not specifically limit this.

[0103] Figure 14 This is a cross-sectional view of a first portion 321 and a first structural member 111 after grinding provided in an embodiment of the present application. Figure 14 As shown, after the first structural member 111 and the first part 321 are welded together, a side surface b1 of the first structural member 111 and the first part 321 facing away from the installation space 101 can be ground to form a first surface a1, a second surface a2 and a third surface a3 located in the same plane, wherein the first surface a1 is the surface of the first part 321 facing away from the installation space 101, the second surface a2 is the surface of the first structural member 111 facing away from the installation space 101, and the third surface a3 is the surface of the welding block 139 facing away from the installation space 101.

[0104] In some examples, grinding can be performed multiple times to ensure the flatness of the first surface a1, the second surface a2, and the third surface a3. For example, a first grinding operation can be carried out first, using a coarse grinding wheel to remove the oxides on the first welding boss 1117, the second welding boss 1319, the surface of the first structural member 111, and the surface of the first part 321. After the first grinding operation, a second grinding operation can be carried out, using a fine grinding wheel to grind the first structural member 111, the welding block 139, and the first part 321 to be flat. After the second grinding operation, a third grinding operation can be carried out, and a grinding wheel can be used to make the surface delicate.

[0105] Figure 15 The figure is a cross-sectional view of a first part 321 and a first structural member 111 provided by an embodiment of the present application after a decorative layer 60 is sprayed on their surfaces. As Figure 15 shown, after grinding the surfaces b1 on the sides of the first structural member 111 and the first part 321 facing away from the installation space 101, a spraying process can be used to form the decorative layer 60. Among them, multiple sprays can be carried out to ensure the reliability of the decorative layer 60. For example, a primer coating, a midcoat coating, and a topcoat coating can be sprayed in sequence through a three-spraying process. Among them, the primer coating is used to enhance the adhesion of the decorative layer 60, the midcoat coating is used to achieve the coloring effect, and the topcoat coating is used to play a protective role.

[0106] In some embodiments, continue to refer to Figure 15 , during the process of assembling the first structural member 111 and the first part 321 together, a protective cover 50 can also be provided on the fan module 30. The protective cover 50 is connected to the side of the first structural member 111 close to the installation space 101 and covers the outside of the second part 322 of the fan housing 32. Exemplarily, the protective cover 50 can include a cover body, and a vacuum cavity is provided inside the cover body. The material of the cover body can be a metal such as stainless steel. Through the above settings, during the process of forming the decorative layer 60 using the spraying process, it can be avoided that the paint splashes onto the second part 322. And, during the process of welding the first structural member 111 and the first part 321 together using the welding process, this protective cover 50 can also be used, which is beneficial to avoiding the baking temperature from affecting the performance of the second part 322 and the fan body 31 and improving the reliability of the fan module 30.

[0107] The above description is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by those skilled in the art within the technical scope disclosed in the present application should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A fan module, It is characterized in that include: The housing comprises a first structural member and a second structural member, wherein the second structural member is arranged around an edge of the first structural member; A fan housing and a fan body, wherein the fan housing is arranged outside the fan body, the fan housing comprises a first part and a second part, the first part and the first structural member together form a flat plate structure, the flat plate structure and the second structural member together enclose an installation space, and the fan body and the second part are located in the installation space; The first portion includes a first surface, the first structural member includes a second surface, the first surface and the second surface are both located on a side of the flat plate structure away from the installation space, and the second surface and the first surface are located in the same plane.

2. The fan module according to claim 1, It is characterized in that The fan body comprises a shaft seat, a fan blade and a stator assembly, the shaft seat is connected to the first part, the stator assembly is connected to the shaft seat, the fan blade is rotatably connected to the shaft seat, and the fan blade comprises a magnetic element; The fan housing further includes a connecting hole, and the electronic device further includes a circuit board. The circuit board is located in the installation space, extends into the fan housing through the connecting hole, and is electrically connected to the stator assembly.

3. The fan module according to claim 2, It is characterized in that The first part has a protruding structure on a side close to the installation space, and the protruding structure has a first sub-surface on a side close to the installation space. The first sub-surface is arranged opposite to the first surface, and the first sub-surface is recessed toward the side close to the first surface to form an installation groove, and the shaft seat is installed in the installation groove.

4. The fan module according to claim 3, It is characterized in that The first sub-surface is parallel to the first surface and perpendicular to the rotation axis of the fan blade.

5. The fan module according to claim 3 or 4, It is characterized in that The first portion also includes a second sub-surface adjacent to the protruding structure, the second sub-surface is arranged opposite to the first surface, the second sub-surface is parallel to the first surface, and is perpendicular to the rotation axis of the fan blade.

6. The fan module according to claim 5, It is characterized in that The first structural member has a third sub-surface on one side close to the installation space. The third sub-surface is arranged opposite to the second surface, and the third sub-surface and the second sub-surface are located in the same plane.

7. The fan module according to claim 6, It is characterized in that The circuit board includes a first board portion, a second board portion and a bending portion, the first board portion is connected to the first sub-surface, the second board portion is connected to the second sub-surface and is penetrated in the connecting hole, and the bending portion is connected between the first board portion and the second board portion.

8. The fan module according to any one of claims 2 to 7, It is characterized in that The first portion and the first structural member are an integral structure.

9. The fan module according to claim 8, It is characterized in that The second part includes a frame and a cover plate, wherein the frame is located between the first part and the cover plate, the frame is arranged around the edges of the first part and the cover plate, and the frame and the cover plate are an integral structure.

10. The fan module according to claim 9, It is characterized in that The frame is detachably connected to a side of the first structural member close to the installation space; the fan module also includes a sealing structure, which is located between the first part and the frame.

11. The fan module according to claim 10, It is characterized in that The first part also has a recessed structure on one side close to the installation space. The recessed structure and the frame together enclose the connecting hole. Part of the sealing structure is located in the connecting hole. The circuit board is located between the sealing structure and the recessed structure.

12. The fan module according to any one of claims 2 to 11, It is characterized in that The first structural member has a penetrating installation opening, and at least a portion of the first portion is located in the installation opening.

13. The fan module according to claim 12, It is characterized in that The first structural member includes a bottom plate and a bridging block, the bottom plate having the installation opening extending therethrough, the bottom plate having the second surface on a side facing away from the installation space, and the bottom plate further having a side surface adjacent to the second surface, the side surface enclosing the installation opening; The overlapping block is connected to a side of the base plate close to the installation space. In a direction parallel to the second surface and pointing from the side surface to the rotation axis of the fan blade, the overlapping block extends beyond the side surface. The surface adjacent to the side surface of the overlapping block is a overlapping surface, and the overlapping surface is in contact with a side of the first part close to the installation space.

14. The fan module according to claim 13, It is characterized in that A portion of the bottom plate and a portion of the first portion together form a welding block, and a side of the welding block facing away from the installation space has a third surface, and the third surface, the first surface and the second surface are located in the same plane.

15. The fan module according to claim 14, It is characterized in that The second part includes a frame and a cover plate, wherein the frame is located between the first part and the cover plate, and the frame is arranged around the edge of the cover plate. In a direction parallel to the second surface and pointing from the side surface to the rotation axis of the fan blade, there is a preset distance between the frame and the side surface.

16. The fan module according to any one of claims 13 to 15, It is characterized in that The electronic device may further include a decoration layer, wherein the decoration layer is located on a side of the bottom plate and the first portion facing away from the installation space.

17. An electronic device, It is characterized in that It comprises a mainboard and a fan module as described in any one of claims 1 to 16 above, wherein the mainboard is connected to a fan body of the fan module.

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