Optical module

Abstract

The invention provides an optical module. The optical module comprises a substrate, a tube shell, a laser chip, a bracket and a wavelength conversion device, the tube shell is arranged on the substrate, a containing space is formed in the tube shell, and the tube shell is provided with a light inlet window. The laser chip is arranged in the tube shell and located in the containing space. The support is arranged on the substrate and provided with a light transmitting opening. The wavelength conversion device is arranged at the light-transmitting opening, and the light-transmitting opening and the light-transmitting window are both located on the path of the exciting light. The laser chip is arranged on the tube shell, the wavelength conversion device is arranged on the support, the support and the tube shell are both arranged on the substrate, heat generated by the laser chip can be transmitted to the substrate through the tube shell for heat dissipation, and heat generated by the wavelength conversion device can be transmitted to the substrate through the support for heat dissipation. The laser chip and the wavelength conversion device dissipate heat through different heat dissipation channels, the heat dissipation efficiency of the optical module is improved, the possibility of damage caused by long-time use of the optical module is reduced, and then the service life of the optical module can be prolonged.

Description

Technical Field

[0001] The present application relates to the technical field of projection devices, and more particularly, to an optical module. Background Art

[0002] The optical module emits excitation light through a laser chip to excite phosphor to generate fluorescence, which is mixed with the laser to generate white light. This is conducive to the miniaturization and integration of laser lighting and is applicable to fields such as flashlights and laser vehicle lamp lighting.

[0003] When the laser chip emits excitation light for a long time, the temperature of the laser chip will become too high. At the same time, when the excitation light irradiates the phosphor of the wavelength conversion device for a long time, the temperature of the wavelength conversion device will also increase accordingly, which will cause the temperature of the entire optical module to be at a relatively high level.

[0004] The existing optical module integrates the laser chip and the wavelength conversion device together, resulting in poor heat dissipation efficiency of the entire optical module and prone to damage of the optical module after long-term use. Summary of the Invention

[0005] An optical module is proposed in an embodiment of the present application to at least partially solve the above problems.

[0006] The embodiment of the present application is implemented through the following technical solutions.

[0007] The embodiment of the present application provides an optical module, including: a substrate, a housing, a laser chip, a bracket, and a wavelength conversion device. The housing is disposed on the substrate, an accommodation space is formed inside the housing, and the housing is provided with a light-transmitting window. The laser chip is disposed in the housing and located in the accommodation space, and is used to emit excitation light toward the light-transmitting window. The bracket is disposed on the substrate, and the bracket is provided with a light-transmitting opening. The wavelength conversion device is disposed at the light-transmitting opening, and both the light-transmitting opening and the light-transmitting window are located on the path of the excitation light. The wavelength conversion device is used to receive the excitation light transmitted through the light-transmitting window and convert it into stimulated light.

[0008] In some embodiments, the optical module further includes: a light guiding element, which is disposed in the housing and located in the accommodation space, and is used to guide the excitation light to enter the wavelength conversion device through the light-transmitting window.

[0009] In some embodiments, the light guiding element is a hemispherical lens, and the excitation light emitted by the laser chip is focused on the wavelength conversion device after passing through the light guiding element.

[0010] In some embodiments, a plurality of laser chips are provided, and the number of the light guiding elements corresponds one-to-one to the number of the laser chips. After the excitation light emitted by the plurality of laser chips passes through the light guiding elements, it obliquely enters the same area of the wavelength conversion device.

[0011] In some embodiments, the substrate includes a support layer and a circuit layer. The support layer is provided with a groove, and the package, the laser chip, and the bracket are disposed on the support layer. The circuit layer is disposed in the groove and is electrically connected to the laser chip.

[0012] In some embodiments, the package includes a base body, a dam, a cover plate, a first circuit layer, and a second circuit layer. The dam includes a connecting portion and a surrounding portion. The connecting portion is connected to the base body, and the connecting portion and the surrounding portion are perpendicularly arranged. The connecting portion has a first surface facing the accommodation space and a second surface opposite to the first surface. The connecting portion is provided with an electrical conduction hole that penetrates the first surface and the second surface. The cover plate is connected to the surrounding portion and is opposite to the base body, and the light transmission window is disposed on the cover plate. The first circuit layer is disposed on the first surface and is electrically connected to the laser chip. The second circuit layer is disposed on the second surface, and the first circuit layer and the first circuit layer are electrically connected by a wire passing through the electrical conduction hole, and the second circuit layer is electrically connected to the circuit layer.

[0013] In some embodiments, the connecting portion is provided with a connecting groove, and the base body is embedded in the connecting groove.

[0014] In some embodiments, a thermal conductive silicone grease is provided between the bracket and the support layer.

[0015] In some embodiments, the optical module further includes a thermistor, and the thermistor is disposed on the circuit layer and is electrically connected to the circuit layer.

[0016] In some embodiments, the optical module further includes a light collecting lens, and the light collecting lens is disposed on the bracket and is spaced apart from the wavelength conversion device. The excitation light emitted by the laser chip is collected by the light collecting lens after passing through the wavelength conversion device.

[0017] In some embodiments, the bracket has a mounting groove, and a notch is formed on the bottom surface of the mounting groove to form the light transmission opening, and the wavelength conversion device is embedded in the mounting groove.

[0018] In some embodiments, the bottom surface of the wavelength conversion device abuts against the bottom wall of the mounting groove, and at least a part of the side surface of the wavelength conversion device abuts against the side wall of the mounting groove.

[0019] In some embodiments, the optical module further includes: a heat sink disposed on a surface of the substrate away from the package.

[0020] In the optical module provided by the embodiment of the present application, the laser chip is disposed in the package, and the wavelength conversion device is disposed on the bracket. Both the bracket and the package are disposed on the substrate. The heat generated by the laser chip can be transferred to the substrate through the package for heat dissipation, and the heat generated by the wavelength conversion device can be transferred to the substrate through the bracket for heat dissipation. The laser chip and the wavelength conversion device dissipate heat through different heat dissipation channels, which helps to improve the heat dissipation efficiency of the optical module, reduces the possibility of damage caused by long-term use of the optical module, and thus can improve the service life of the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without creative efforts.

[0022] Figure 1 FIG. 1 shows a schematic structural diagram of an optical module provided by an embodiment of the present application;

[0023] Figure 2 FIG. 2 shows a schematic structural diagram of another optical module provided by an embodiment of the present application;

[0024] Figure 3 FIG. 3 shows a schematic structural diagram of a package and a laser chip provided by an embodiment of the present application.

[0025] Reference numerals: optical module 1, substrate 10, support layer 110, groove 111, circuit layer 120, package 20, accommodation space 210, light-transmitting window 220, base body 230, dam 240, connecting portion 241, first surface 241a, second surface 241b, electrical conduction hole 241c, connecting groove 241d, enclosing portion 242, cover plate 250, first circuit layer 260, second circuit layer 270, laser chip 30, bracket 40, light-transmitting opening 410, wavelength conversion device 50, light guiding element 60, thermal conductive silicone grease 70, thermistor 80, light receiving lens 90, heat sink 100, heat dissipation fin 200. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0026] To enable those skilled in the art to better understand the solution of the present invention, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0027] The technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0028] The optical module emits excitation light through a laser chip to excite the phosphor to generate fluorescence, which is mixed with the laser to generate white light, facilitating the miniaturization and integration of laser lighting and being applicable to fields such as flashlights and laser vehicle lamp lighting.

[0029] When the laser chip emits excitation light for a long time, the temperature of the laser chip will become too high. At the same time, when the excitation light irradiates the phosphor of the wavelength conversion device for a long time, the temperature of the wavelength conversion device will also increase accordingly, which will cause the temperature of the entire optical module to be at a relatively high level.

[0030] In the existing optical module, the laser chip and the wavelength conversion device are integrated in the same packaging structure. For example, common transistor outline (TO) packaging structures and surface mounted devices (SMD) packaging structures. The laser chip and the wavelength conversion device are in contact with the outer shell of the packaging structure at different positions, and the generated heat is conducted to the outer shell. Eventually, all of this heat is conducted to an area such as the bottom of the outer shell and then dissipated through a heat sink, resulting in excessive heat concentration on the packaging structure and poor heat dissipation efficiency of the entire optical module. It is prone to damage of the optical module after long-term use.

[0031] Based on the above technical problems, the present application proposes an optical module 1. Please refer to Figure 1 , Figure 1 which shows a schematic structural diagram of an optical module 1 provided by an embodiment of the present application. The optical module 1 may include: a substrate 10, a housing 20, a laser chip 30, a bracket 40, and a wavelength conversion device 50.

[0032] The substrate 10 can be used as a heat dissipation base. In this embodiment, the substrate 10 can be made of a material with good heat dissipation performance, such as copper, aluminum, graphene, or silica gel, etc. There is no limitation here. In the embodiments of the present application, the substrate 10 is taken as an example of a copper substrate for elaboration.

[0033] Further, please refer to Figure 2, the substrate 10 may include: a support layer 110 and a circuit layer 120. The support layer 110 can be used to support the circuit layer 120 and other components in the optical module 1. Specifically, the housing 20, the laser chip 30, and the bracket 40 are disposed on the support layer 110. In addition, the support layer 110 may further be provided with a groove 111.

[0034] The circuit layer 120 may be disposed in the groove 111. The circuit layer 120 is electrically connected to the laser chip 30. After the laser chip 30 is powered on, it can emit excitation light.

[0035] In addition, the optical module 1 may further include a thermistor 80. The thermistor 80 may be disposed on the circuit layer 120 and electrically connected to the circuit layer 120. The thermistor 80 can be used to detect the temperature of the substrate 10 in real time, so that the user can control the temperature of the substrate 10 in real time, and further facilitate the control and adjustment of the optical effect of the optical module 1 affected by temperature.

[0036] The housing 20 may be disposed on the substrate 10. An accommodation space 210 is formed inside the housing 20. The housing 20 is provided with a light-transmitting window 220. It should be noted that the specific structure of the housing 20 is not limited in the embodiments of the present application. For example, it may be a square structure shown in the figure. In addition, the specific material of the housing 20 is not limited in the embodiments of the present application. For example, in this embodiment, the housing 20 may be made of aluminum nitride ceramic. Aluminum nitride ceramic is a high-performance ceramic material with excellent thermal conductivity and dielectric properties, and at the same time has the characteristic of high hardness. Using aluminum carbide ceramic as the material of the housing 20 helps to improve the structural stability of the housing 20. In some other embodiments, the housing 20 may also be made of materials such as diamond, silver, and copper. Diamond is the best thermal conductor in nature. The diamond atom consists of a simple carbon skeleton and is an ideal molecular structure for effective heat transfer. Silver is a relatively cheap and abundant thermal conductor and has good ductility. Copper has a high melting point and a medium corrosion rate, which can minimize energy loss during heat transfer. The specific material of the housing 20 can be selected according to the actual situation.

[0037] In addition, in some embodiments, a coating may be provided on the surface of the housing 20 to further improve the heat conduction efficiency of the housing 20. The above coatings may include but are not limited to: diamond-like coating, alumina coating, hexagonal boron nitride coating, and beryllium oxide, etc., which can be specifically selected according to the actual situation.

[0038] Specifically, please refer to Figure 3 , in one embodiment, the housing 20 may include: a base body 230, a dam 240, a cover plate 250, a first circuit layer 260, and a second circuit layer 270.

[0039] The base 230 can be used to carry the laser chip 30, the light guiding element 60 and other elements disposed in the internal space. The base 230 can be welded on the substrate 10, for example, a solder with thermal conductivity can be used for welding to improve the stability of the connection between the tube shell 20 and the substrate 10, and can also promote heat transfer between the tube shell 20 and the substrate 10, so as to facilitate heat dissipation of the laser chip 30. The embodiment of the present application does not limit the specific structure of the base 230. For example, in this embodiment, the base 230 can be a bar structure as shown in the figure.

[0040] The dam 240 can be connected to the base 230 and surrounded by the base 230. In this embodiment, the dam 240 can include: a connecting portion 241 and a blocking portion 242. The connecting portion 241 and the blocking portion 242 are arranged perpendicular to each other. The connecting portion 241 can be connected to the base 230. Specifically, the connecting portion 241 can be provided with a connecting groove 241d, and the base 230 can be embedded in the connecting groove 241d. It should be noted that the embodiment of the present application does not limit the connection method between the connecting portion 241 and the base 230, for example, it can be bonding, clamping or interference connection.

[0041] The connecting portion 241 has a first surface 241 a facing the receiving space 210 and a second surface 241 b opposite to the first surface 241 a . The connecting portion 241 defines an electrical conduction hole 241 c , which passes through the first surface 241 a and the second surface 241 b .

[0042] The cover plate 250 is connected to the enclosure portion 242 and is opposite to the base 230. The light-transmitting window 220 is arranged on the cover plate 250. In one embodiment, the cover plate 250 can be set as a transparent structure, and the entire cover plate 250 can be used as the light-transmitting window 220, which can simplify the production difficulty of the cover plate 250.

[0043] Please continue reading Figure 3 In one embodiment, the first circuit layer 260 can be disposed on the first surface 241a and electrically connected to the laser chip 30, the second circuit layer 270 can be disposed on the second surface 241b, the first circuit layer 260 and the first circuit layer 260 are electrically connected via a wire passing through the electrical conduction hole 241c, and the second circuit layer 270 is electrically connected to the circuit layer 120.

[0044] It should be noted that, in other embodiments, the first circuit layer 260, the second circuit layer 270 and the electrical conduction holes 241c may also be disposed on the substrate 230, and may be specifically disposed according to actual conditions, and are not limited here.

[0045] Further, in one embodiment, the accommodation space 210 formed inside the housing 20 may be a closed space, which can prevent impurities such as dust in the external environment from entering the accommodation space 210, and is beneficial to ensuring the normal and stable operation of the laser chip 30 inside the housing 20.

[0046] The laser chip 30 may be disposed in the housing 20 and located inside the accommodation space 210 for emitting excitation light toward the light-transmitting window 220. The specific form of the laser chip 30 is not limited in the embodiments of the present application. For example, the laser chip 30 may be directly bonded to the inner surface of the housing 20, etc.

[0047] In some embodiments, the optical module 1 may further include a heat sink. The heat sink may be disposed on the base body 230, and the laser chip 30 may be disposed on the heat sink, for example, may be attached to the heat sink.

[0048] The heat sink may be made of aluminum nitride ceramic material. Aluminum nitride ceramic has good thermal conductivity. A heat sink is disposed between the laser chip 30 and the base body 230, which can be used to efficiently conduct the heat generated by the operation of the laser chip 70 to the housing 20 to improve the heat dissipation efficiency.

[0049] In addition, in some embodiments, the surface of the heat sink may be an inclined plane, which can also play a role in changing the position and direction of the laser light emitted by the laser chip 30. The height and shape of the heat sink are not limited in the embodiments of the present application and may be specifically set according to actual situations.

[0050] The bracket 40 is disposed on the substrate 10. The bracket 40 can be used to carry the wavelength conversion device 50, and the bracket 40 may be provided with a light-transmitting opening 410. It can be understood that the specific structure and material of the bracket 40 are also not limited in the embodiments of the present application. For example, it may use the same material as the substrate 10. For details, please refer to the foregoing and will not be elaborated here. At the same time, the connection manner between the bracket 40 and the substrate 10 is not limited in the embodiments of the present application either. For example, it may be bonding or the threaded connection shown in the figure, etc.

[0051] Specifically, please continue to refer to Figure 1 , in this embodiment, the bracket 40 may have a mounting groove, and the wavelength conversion device 50 may be embedded in the mounting groove. A notch may be provided on the bottom surface of the mounting groove to form the light-transmitting opening 410. Further, the bottom surface of the wavelength conversion device 50 may be in contact with the bottom wall of the mounting groove, and at least part of the side wall of the wavelength conversion device 50 may be in contact with the side wall of the mounting groove, which can increase the contact area between the wavelength conversion device 50 and the bracket 40, contribute to improving the heat transfer between the wavelength conversion device 50 and the bracket 40, and thus facilitate improving the heat dissipation efficiency of the wavelength conversion device 50.

[0052] The wavelength conversion device 50 can be disposed at the light-transmitting opening 410 and correspond to the light-transmitting window 220. That is to say, both the light-transmitting opening 410 and the light-transmitting window 220 are located on the path of the excitation light. The wavelength conversion device 50 is used to receive the excitation light passing through the light-transmitting window 220 and convert it into stimulated light. The embodiments of the present application do not limit the specific structure of the wavelength conversion device 50. For example, in this embodiment, the wavelength conversion device 50 can be a phosphor sheet, a grating wavelength meter, a spectrometer, a color wheel, etc., and can be specifically set according to actual situations.

[0053] Please refer to again Figure 2 , further, in some embodiments, a thermal conductive silicone grease 70 can be provided between the bracket 40 and the support layer 110. The thermal conductive silicone grease 70 can further accelerate the heat exchange between the bracket 40 and the substrate 10, and thus can accelerate the heat dissipation of the wavelength conversion device 50.

[0054] Exemplarily, in this embodiment, the wavelength conversion device 50 can adopt a phosphor sheet. The phosphor sheet has high conversion efficiency and a compact structure, and at the same time has characteristics such as strong selectivity and good stability, which helps to maintain good stability during long-term use.

[0055] In a more specific embodiment, the phosphor sheet can be composed of a matrix, an activator, a light-emitting layer, a functional layer, etc. The matrix is the base of the phosphor, usually some low-energy compounds, such as silicates, oxides, etc. The role of the matrix is to provide a stable environment for the activator and a reflection interface for the excitation light. The activator and the light-emitting layer can be disposed on the matrix. The activator is the key component for the phosphor to emit light, usually some high-energy compounds, such as halides of alkali metals and alkaline earth metals, etc. The light-emitting layer is the light-emitting region of the phosphor, usually formed by mixing the activator and the matrix in a certain proportion. The thickness and proportion of the light-emitting layer have a great influence on the light-emitting performance of the phosphor.

[0056] The functional layer can be an electron transport layer, a hole transport layer, a protective layer, etc. The electron transport layer is usually some materials with high conductivity and thermal stability, such as oxides, nitrides, etc. The role of the electron transport layer is to transfer the excited electrons to the light-emitting layer, thereby generating fluorescence. The hole transport layer is usually some materials with high thermal stability and chemical stability, such as nitrides, silicides, etc. The role of the hole transport layer is to transfer the holes in the light-emitting layer to the light-emitting layer, thereby realizing light emission. The protective layer is usually some materials with high thermal stability and chemical stability, such as silicides, nitrides, etc. The role of the protective layer is to protect the phosphor from environmental factors and extend the service life of the phosphor.

[0057] The optical module 1 provided by the embodiment of the present application, by arranging the laser chip 30 in the package 20 and arranging the wavelength conversion device 50 on the bracket 40, both the bracket 40 and the package 20 are arranged on the substrate 10. The heat generated by the laser chip 30 can be transferred to the substrate 10 through the package 20 for heat dissipation, and the heat generated by the wavelength conversion device 50 can be transferred to the substrate 10 through the bracket 40 for heat dissipation. The laser chip 30 and the wavelength conversion device 50 dissipate heat through different heat dissipation channels, which helps to improve the heat dissipation efficiency of the optical module 1, reduces the possibility of damage caused by long-term use of the optical module 1, and thus can improve the service life of the optical module 1.

[0058] Further, please continue to refer to Figure 2 , in some embodiments, the optical module 1 may further include: a light guiding element 60. The light guiding element 60 is arranged in the package 20 and located in the accommodation space 210, and is used to guide the excitation light to enter the wavelength conversion device 50 through the light transmissive window 220. The arrangement of the light guiding element 60 can make the specific setting position of the laser chip 30 more flexible.

[0059] Specifically, in this embodiment, the light guiding element 60 may be a hemispherical lens. The hemispherical lens can focus the light spot of the light emitted by the laser chip 30, making the light spot at the convergence point smaller. Specifically, it can make the light spot of the excitation light incident on the wavelength conversion device 50 smaller, thereby increasing the central brightness of the emitted light.

[0060] Specifically, the hemispherical lens can be arranged such that the plane of the hemispherical lens is a reflective surface and is inclined relative to the upper surface of the base body 230. A part of the hemispherical surface in the hemispherical lens faces the laser chip 30 to receive the laser beam from the laser chip 30, and another part of the hemispherical surface of the hemispherical lens faces the light transmissive window 220 of the cover plate 250. In this way, the laser beam enters the interior of the hemispherical lens through a part of the hemispherical surface of the hemispherical lens and refracts, then reflects through the plane of the hemispherical lens to change the traveling direction, and finally exits through another part of the hemispherical lens towards the light transmissive window 220 of the cover plate 250 and refracts again. Since the laser beam refracts twice on the hemispherical surface of the hemispherical lens, it is equivalent to the hemispherical lens acting on the laser beam like a spherical lens, that is, changing the originally divergent laser beam into a convergent laser beam. The convergence point of the laser beam can be set on the wavelength conversion device 50 to increase the central brightness of the emitted light.

[0061] It should be noted that the number of laser chips 30 is not limited in the embodiments of the present application. For example, multiple laser chips 30 can be provided. When multiple laser chips 30 are provided, multiple light guiding elements 60 can also be provided, and the laser chips 30 and the light guiding elements 60 are in one-to-one correspondence. After the excitation light emitted by the multiple laser chips 30 passes through the light guiding elements, it obliquely enters the same area of the wavelength conversion device, which can further improve the brightness and clarity of the emitted light.

[0062] Please continue to refer to Figure 2 , in one implementation, the optical module 1 may further include: a light collecting lens 90. The light collecting lens 90 is disposed on the bracket 40 and is spaced apart from the wavelength conversion device 50. The excitation light emitted by the laser chip 30 is collected by the light collecting lens 90 after passing through the wavelength conversion device 50.

[0063] Exemplarily, a lens groove can be provided on the bracket 40, and the light collecting lens 90 can be disposed in the lens groove. In some implementations, the bracket 40 can also be supported by a flexible material, and the light collecting lens 90 can be disposed in the lens groove by an interference connection method, which can facilitate the replacement of different light collecting lenses 90 according to different usage scenarios.

[0064] In addition, please continue to refer to Figure 2 , in some implementations, the optical module 1 may further include: a heat sink 100. The heat sink 100 can be disposed on the surface of the substrate 10 away from the package 20. The specific structure of the heat sink 100 is not limited in the embodiments of the present application. For example, in this embodiment, the heat sink 100 can have multiple heat dissipation fins 200 to assist in heat dissipation. The specific material of the heat sink 100 is not limited in the embodiments of the present application either. For example, it can be a steel material, an aluminum material, a copper material, a copper-aluminum composite material, or stainless steel, etc., and can be specifically set according to actual situations.

[0065] In summary, for the optical module 1 provided by the embodiments of the present application, by disposing the laser chip 30 in the package 20 and disposing the wavelength conversion device 50 on the bracket 40, both the bracket 40 and the package 20 are disposed on the substrate 10. The heat generated by the laser chip 30 can be transferred to the substrate 10 through the package 20 for heat dissipation, and the heat generated by the wavelength conversion device 50 can be transferred to the substrate 10 through the bracket 40 for heat dissipation. The laser chip 30 and the wavelength conversion device 50 dissipate heat through different heat dissipation channels, which helps to improve the heat dissipation efficiency of the optical module 1, reduces the possibility of damage caused by long-term use of the optical module 1, and thus can improve the service life of the optical module 1.

[0066] In the present invention, unless otherwise clearly specified or defined, terms such as "installation" and "connection" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, an integral connection, or a transmission connection; it may be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0067] In addition, terms such as "first" and "second" are only used for distinguishing descriptions and cannot be understood as specific references or special structures. The description of "some embodiments" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In the present invention, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in the present invention and the features of different embodiments or examples.

[0068] The above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the various embodiments of the present invention, and should all be included in the protection scope of the present invention.

Claims

1. An optical module, characterized in that, it includes: a substrate; a package, the package is disposed on the substrate, an accommodation space is formed inside the package, and the package is provided with a light-transmitting window; a laser chip, the laser chip is disposed in the package and located in the accommodation space, and is configured to emit excitation light towards the light-transmitting window; a bracket, the bracket is disposed on the substrate, and the bracket is provided with a light-transmitting opening; and a wavelength conversion device, the wavelength conversion device is disposed at the light-transmitting opening, both the light-transmitting opening and the light-transmitting window are located on the path of the excitation light, and the wavelength conversion device is configured to receive the excitation light transmitted through the light-transmitting window and convert it into stimulated emission light.

2. The optical module according to claim 1, characterized in that, the optical module further includes: a light guiding element, the light guiding element is disposed in the package and located in the accommodation space, and is configured to guide the excitation light to be incident on the wavelength conversion device through the light-transmitting window.

3. The optical module according to claim 2, characterized in that, the light guiding element is a hemispherical lens, and after the excitation light emitted by the laser chip passes through the light guiding element, it is focused on the wavelength conversion device.

4. The optical module according to claim 3, characterized in that, a plurality of laser chips are provided, the number of the light guiding elements corresponds to the number of the laser chips one by one, and after the excitation light emitted by the plurality of laser chips passes through the light guiding elements, it is obliquely incident on the same area of the wavelength conversion device.

5. The optical module according to claim 1, characterized in that, the substrate includes: a support layer, the support layer is provided with a groove, and the package, the laser chip and the bracket are disposed on the support layer; and a circuit layer, the circuit layer is disposed in the groove, and the circuit layer is electrically connected to the laser chip.

6. The optical module according to claim 5, characterized in that, the package includes: a base body; a dam, the dam includes a connecting portion and a surrounding portion, the connecting portion is connected to the base body, the connecting portion and the surrounding portion are perpendicularly arranged, the connecting portion has a first surface facing the accommodation space and a second surface opposite to the first surface, and the connecting portion is provided with an electrical conduction hole, and the electrical conduction hole penetrates through the first surface and the second surface; a cover plate, the cover plate is connected to the surrounding portion and is opposite to the base body, and the light-transmitting window is disposed on the cover plate; a first circuit layer, the first circuit layer is disposed on the first surface and is electrically connected to the laser chip; and a second circuit layer, the second circuit layer is disposed on the second surface, the first circuit layer and the first circuit layer are electrically connected through a wire disposed in the electrical conduction hole, and the second circuit layer is electrically connected to the circuit layer.

7. The optical module according to claim 6, characterized in that, the connecting portion is provided with a connecting groove, and the base body is embedded in the connecting groove.

8. The optical module according to claim 5, characterized in that, a thermal conductive silicone grease is provided between the bracket and the support layer.

9. The optical module according to claim 5, wherein, the optical module further includes: a thermistor, the thermistor is disposed on the circuit layer and electrically connected to the circuit layer.

10. The optical module according to claim 1, wherein, the optical module further includes: a light-receiving lens, the light-receiving lens is disposed on the bracket and is spaced apart from the wavelength conversion device, and the excitation light emitted by the laser chip is collected by the light-receiving lens after passing through the wavelength conversion device.

11. The optical module according to claim 1, wherein, the bracket has a mounting groove, a notch is formed on the bottom surface of the mounting groove to form the light-transmitting opening, and the wavelength conversion device is embedded in the mounting groove.

12. The optical module according to claim 11, wherein, the bottom surface of the wavelength conversion device abuts against the bottom wall of the mounting groove, and at least a part of the side surface of the wavelength conversion device abuts against the side wall of the mounting groove.

13. The optical module according to claim 1, wherein, the optical module further includes: a heat sink, the heat sink is disposed on the surface of the substrate away from the tube housing.

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