High-performance manganese-zinc SMD chip inductor and production process thereof

Abstract

The invention discloses a high-performance manganese-zinc SMD chip inductor and a production process thereof, and relates to the technical field of SMD chip inductors, the high-performance manganese-zinc SMD chip inductor comprises an electrode plate, a magnetic core column is fixedly connected to the middle position of the upper surface of the electrode plate, a printing plate is fixedly connected to the upper end of the magnetic core column, two embedded holes are formed in the upper surfaces of the two ends of the electrode plate, and the two embedded holes are communicated with the printing plate. The inner walls of the two sides of each embedded hole are each provided with a plurality of position stabilizing protruding blocks, and a coil is wound around the outer portion of the magnetic core column. According to the device, through the arranged power connection assembly, two positioning clamping blocks can be driven to move in opposite directions by extruding two finger plates, and when the two positioning clamping blocks are fully separated from an inner cavity of a clamping groove, separation of an electrode plate and a tin plate can be rapidly completed by pulling a printing plate upwards at the moment, so that disassembly of a chip inductor is rapidly completed; and in addition, the risk that workers are scalded is effectively reduced through the dismounting mode, and the safety of the chip inductor in the using process is effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of related SMD chip inductors, and specifically to a high-performance Mn-Zn SMD chip inductor and its production process. Background Art

[0002] A chip inductor is an electromagnetic induction component wound with an insulated wire (such as enameled wire, cotton-covered wire, plastic-coated wire, etc.) on an insulating skeleton or magnetic core. It belongs to a commonly used inductor component. The function of a chip inductor can pass direct current and block alternating current, isolate, filter alternating current signals, or form a resonant circuit with capacitors, resistors, etc. Any current in the circuit of the chip inductor will generate a magnetic field, and the magnetic flux of the magnetic field acts on the circuit again.

[0003] Currently, most of the existing Mn-Zn SMD chip inductors weld the two ends of the coil on the tin plate and then weld the tin plate on the circuit board. In this way, when the chip inductor is damaged, it is inconvenient to replace the coil, and the entire chip inductor component needs to be replaced, resulting in a waste of resources and an increase in the use cost. Moreover, due to the small size of the existing chip inductors, it is inconvenient to align the soldering tin plate with the solder pads on the circuit board during soldering, increasing the soldering difficulty. This leads to a reduction in soldering efficiency, and when the entire soldered chip inductor is damaged, it is inconvenient to disassemble. It is necessary to melt the tin with a soldering iron. When replacing, it is also necessary to solder the chip inductor on the circuit board with a soldering iron, which increases the number of times the staff uses the soldering iron, thus increasing the risk of scalding the staff. Summary of the Invention

[0004] To solve the defects existing in the prior art, the present invention provides a high-performance Mn-Zn SMD chip inductor and its production process.

[0005] To solve the above technical problems, the present invention provides the following technical solutions:

[0006] A high-performance Mn-Zn SMD chip inductor of the present invention includes an electrode plate. A magnetic core column is fixedly connected to the middle position of the upper surface of the electrode plate, and the magnetic core column is made of Mn-Zn material. A printed board is fixedly connected to the upper end of the magnetic core column. Two embedded holes are opened on the upper surface at both ends of the electrode plate. A plurality of stabilizing protrusions are provided on both inner walls of each embedded hole. A coil is wound around the outside of the magnetic core column;

[0007] A power connection component is arranged inside each of the embedded holes for connecting the two ends of the coil, and an auxiliary component is arranged at the middle position of the lower surface of the electrode plate for assisting in the soldering positioning of the chip inductor.

[0008] As a preferred technical solution of the present invention, the electrical connection component includes two strong metal blocks, and the two strong metal blocks are respectively inserted into the interiors of the two embedded holes. A plurality of electrical connection heads with opposite slots are fixedly connected to the upper surfaces of the two strong metal blocks, and the diameter of the inner cavity of each electrical connection head increases sequentially from front to back.

[0009] As a preferred technical solution of the present invention, two positioning blocks are fixedly connected to the upper surfaces of the two strong metal blocks near one end, and clamping grooves are formed on the opposite surfaces of the two front and rear positioning blocks.

[0010] As a preferred technical solution of the present invention, two inner content grooves are formed on the upper surfaces of the front end and the rear end of the electrode plate.

[0011] As a preferred technical solution of the present invention, two inner fixing columns are fixedly connected to the inner walls of the two inner content grooves. An outer fixing sleeve is sleeved on the outer part of each end of the two inner fixing columns away from each other, and a support spring is sleeved on the outer part of each end of the two inner fixing columns close to each other.

[0012] As a preferred technical solution of the present invention, a positioning block is fixedly connected to the top of each outer fixing sleeve, and a finger plate is fixedly connected to the surface of each positioning block away from the magnetic core column.

[0013] As a preferred technical solution of the present invention, an electrical connection tin plate is fixedly connected to the bottom of each strong metal block. The electrical connection tin plate is mainly composed of copper, tin and zinc, and alloy elements such as lead and magnesium are incorporated.

[0014] As a preferred technical solution of the present invention, the auxiliary component includes a lower embedded groove. The lower embedded groove is formed at the middle position of the lower surface of the electrode plate. A lower receiving tube is embedded in the lower embedded groove. A lower rotating column is inserted into the inner cavity at the lower end of the lower receiving tube, and a positioning spring is fixedly connected to the upper surface of the inner cavity of the lower embedded groove.

[0015] As a preferred technical solution of the present invention, a rubber plate is fixedly connected to the lower end of the lower rotating column, and an anti-adhesive film is bonded to the lower surface of the rubber plate.

[0016] A production process includes the following steps:

[0017] S1: First, produce an inductor skeleton with embedded holes. The inductor skeleton includes an electrode plate, a magnetic core column and a printed circuit board, and staggered stabilizing protrusions are left in the embedded holes;

[0018] S2: Then, insert the strong metal blocks into the interiors of the embedded holes respectively. When installing the strong metal blocks, it is necessary to pre-squeeze the two finger plates and ensure that the electrical connection tin plate contacts the bottom of the electrode plate, so as to ensure that the upper surface of the strong metal block is horizontal with the upper surface of the electrode plate;

[0019] S3: First, loosen the two finger plates at the front and back. Then, the elastic force of the support spring will push the positioning block into the internal card slot on the positioning block. At this time, the installation and positioning of the electrically connected tin plate are completed.

[0020] S4: First, wind the copper wire around the outside of the magnetic core column to form a coil. Then, insert the two ends on both sides of the coil into the corresponding diameter of the internal electrically connected head respectively. At this time, ensure that the circuit of the electrically connected tin plate is unblocked.

[0021] S5: At this time, use the encapsulation material to seal the coil and the magnetic core column, thereby forming the final encapsulated product of the chip inductor coil.

[0022] S6: Tear off the anti-adhesive film at the bottom of the adhesive plate, and then adhere the bottom of the adhesive plate between the two solder joints on the circuit board. At this time, the position correspondence between the electrically connected tin plate and the solder joints can be initially determined.

[0023] S7: During welding, first control the rotation of the electrode plate and ensure that the positions of the electrically connected tin plate and the solder joints on the circuit board are fully corresponding. Then, start the welding device to quickly weld the high-performance Mn-Zn SMD chip inductor on the circuit board. At this time, the installation of the high-performance Mn-Zn SMD chip inductor is fully completed.

[0024] The beneficial effects of the present invention are as follows:

[0025] 1. For this high-performance Mn-Zn SMD chip inductor, through the provided electrically connected component, first squeezing the two finger plates can drive the two positioning blocks to move in opposite directions. When the two positioning blocks are fully separated from the inner cavity of the card slot, at this time, pulling up the printed board can quickly complete the separation of the electrode plate and the electrically connected tin plate, so as to quickly complete the disassembly of the chip inductor. Moreover, this disassembly method effectively reduces the risk of scalding for the staff, effectively improves the safety during the use of the chip inductor. Then, clamp the new chip inductor outside the strong metal block. At this time, loosen the two finger plates, and the elastic force of the support spring will push the two outer sleeves to move in opposite directions. The two outer sleeves moving in opposite directions can drive the two positioning blocks to move in opposite directions. When the two positioning blocks fully move into the inner cavity of the card slot, at this time, the positioning connection between the electrode plate and the electrically connected tin plate is quickly completed. At the same time, the quick replacement of the chip inductor is effectively completed. Moreover, the replacement method is convenient and fast, and further improves the practicality of the chip inductor.

[0026] 2. For this high-performance Mn-Zn SMD chip inductor, through the set auxiliary components, first tear off the anti-sticking film, and then adhere the rubber plate between two welding feet on the circuit board, thus initially completing the welding positioning of the chip inductor. Finally, controlling the rotation of the electrode plate can drive the rotation of the current-carrying tin plate. When the current-carrying tin plate rotates to directly above the two welding feet, the welding positioning of the chip inductor is completed for the second time, thereby effectively improving the welding efficiency of the staff.

[0027] 3. For this high-performance Mn-Zn SMD chip inductor, through the set stability bumps and current-carrying connectors, first, the stability bumps can improve the stability of the installation of the strong metal blocks, effectively preventing the strong metal blocks from shaking after installation. Then, the current-carrying connectors can be connected to coils with different diameters, thereby enabling the chip inductor to adapt to different usage requirements, and further improving the practicality of the Mn-Zn SMD chip inductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The drawings are used to provide a further understanding of the present invention and form a part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation to the present invention.

[0029] In the drawings:

[0030] Figure 1 is a schematic structural diagram of a high-performance Mn-Zn SMD chip inductor of the present invention;

[0031] Figure 2 is a front view of a high-performance Mn-Zn SMD chip inductor of the present invention;

[0032] Figure 3 is a schematic structural diagram of a high-performance Mn-Zn SMD chip inductor from the right side view of the present invention;

[0033] Figure 4 is a schematic structural diagram of a high-performance Mn-Zn SMD chip inductor from the bottom view of the present invention;

[0034] Figure 5 is an exploded view of a partial structure of the current-carrying component of a high-performance Mn-Zn SMD chip inductor of the present invention;

[0035] Figure 6 is a front cross-sectional view of a high-performance Mn-Zn SMD chip inductor of the present invention;

[0036] Figure 7 is a high-performance Mn-Zn SMD chip inductor of the present invention Figure 6 schematic structural diagram from the bottom view;

[0037] Figure 8 is a side cross-sectional view of a high-performance Mn-Zn SMD chip inductor of the present invention;

[0038] Figure 9 is a perspective view of a high-performance Mn-Zn SMD chip inductor of the present invention Figure 8 ;

[0039] Figure 10 is a schematic diagram of the connection structure between the strong metal block and the electrical connection head of a high-performance Mn-Zn SMD chip inductor of the present invention

[0040] Figure 11 is a Figure 10 schematic diagram of the structure from the lower perspective of a high-performance Mn-Zn SMD chip inductor of the present invention

[0041] Figure 12 is an enlarged view of Figure 5 position A in a high-performance Mn-Zn SMD chip inductor of the present invention

[0042] Figure 13 is an enlarged view of Figure 7 position B in a high-performance Mn-Zn SMD chip inductor of the present invention

[0043] Figure 14 is an enlarged view of Figure 9 position C in a high-performance Mn-Zn SMD chip inductor of the present invention

[0044] In the figure: 1, electrode plate; 2, magnetic core column; 3, printed board; 4, embedded hole; 5, stabilizing bump; 6, coil; 7, electrical connection component; 701, strong metal block; 702, electrical connection head; 703, positioning block; 704, card slot; 705, content slot; 706, inner fixing column; 707, outer fixing sleeve; 708, support spring; 709, positioning block; 710, finger plate; 711, electrical connection tin plate; 8, auxiliary component; 801, lower embedded groove; 802, lower containing tube; 803, lower rotating column; 804, positioning spring; 805, rubber plate; 806, anti-adhesive film Specific Embodiment

[0045] The following is a description of the preferred embodiments of the present invention with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only for the purpose of illustrating and explaining the present invention, and are not intended to limit the present invention

[0046] Embodiment: As Figures 1-14As shown in the figure, a high-performance manganese-zinc SMD chip inductor of the present invention includes an electrode plate 1. In the middle position of the upper surface of the electrode plate 1, a magnetic core column 2 is fixedly connected, and the magnetic core column 2 is made of manganese-zinc material. The upper end of the magnetic core column 2 is fixedly connected with a printed board 3. On the upper surface at both ends of the electrode plate 1, two embedded holes 4 are opened. On both inner walls of each embedded hole 4, a plurality of stabilizing bumps 5 are provided. A coil 6 is wound around the outside of the magnetic core column 2; a connecting electrical component 7 is arranged inside each of the embedded holes 4 for connecting the two ends of the coil 6. At the middle position of the lower surface of the electrode plate 1, an auxiliary component 8 is arranged for assisting in the welding positioning of the chip inductor.

[0047] The connecting electrical component 7 includes two strong metal blocks 701, which are respectively inserted into the two embedded holes 4. On the upper surfaces of the two strong metal blocks 701, a plurality of connecting electrical heads 702 with opposite slots are fixedly connected, and the diameter of the inner cavity of each connecting electrical head 702 increases sequentially from front to back. On the upper surfaces of the two strong metal blocks 701 near one end, two positioning blocks 703 are fixedly connected. On the opposite surfaces of the two front and rear positioning blocks 703, clamping grooves 704 are opened. On the upper surfaces of the front end and the rear end of the electrode plate 1, two inner cavities 705 are opened. On the inner walls of the two inner cavities 705, two inner fixing columns 706 are fixedly connected. On the outside of the far ends of the two inner fixing columns 706 away from each other, an outer fixing sleeve 707 is sleeved. On the outside of the near ends of the two inner fixing columns 706 close to each other, a supporting spring 708 is sleeved. On the top of each outer fixing sleeve 707, a positioning block 709 is fixedly connected. On the surface of each positioning block 709 away from the magnetic core column 2, a finger plate 710 is fixedly connected. On the bottom of each strong metal block 701, a connecting electrical tin plate 711 is fixedly connected. The connecting electrical tin plate 711 is mainly composed of copper, tin and zinc, and is fused with alloy elements such as lead and magnesium.

[0048] Among them, first, squeezing the two finger plates 710 can drive the two positioning blocks 709 to move in opposite directions. When the two positioning blocks 709 are fully separated from the inner cavity of the clamping groove 704, pulling up the printed board 3 at this time can quickly complete the separation of the electrode plate 1 from the connecting electrical tin plate 711, so as to quickly complete the disassembly of the chip inductor. Moreover, this disassembly method effectively reduces the risk of scalding for the staff and effectively improves the safety of the chip inductor during use. Then, a new chip inductor is clamped outside the strong metal block 701. At this time, releasing the two finger plates 710, the elastic force of the supporting spring 708 will push the two outer fixing sleeves 707 to move in opposite directions. The two outer fixing sleeves 707 moving in opposite directions can drive the two positioning blocks 709 to move in opposite directions. When the two positioning blocks 709 fully move into the inner cavity of the clamping groove 704, the positioning connection between the electrode plate 1 and the connecting electrical tin plate 711 is quickly completed at this time. At the same time, the quick replacement of the chip inductor is effectively completed, and the replacement method is convenient and fast, which further improves the practicability of the chip inductor.

[0049] The auxiliary component 8 includes a lower embedding groove 801, which is opened at the middle position of the lower surface of the electrode plate 1. A lower accommodating tube 802 is embedded in the interior of the lower embedding groove 801. A lower rotating column 803 is inserted into the inner cavity at the lower end of the lower accommodating tube 802. A positioning spring 804 is fixedly connected to the upper surface of the inner cavity of the lower embedding groove 801. A rubber plate 805 is fixedly connected to the lower end of the lower rotating column 803. An anti-sticking film 806 is adhered to the lower surface of the rubber plate 805.

[0050] Among them, first tear off the anti-sticking film 806, and then adhere the rubber plate 805 between two welding feet on the circuit board, thus initially completing the welding positioning of the chip inductor. Finally, controlling the rotation of the electrode plate 1 can drive the connection tin plate 711 to rotate. When the connection tin plate 711 rotates to directly above the two welding feet, at this time, the welding positioning of the chip inductor is completed for the second time, thereby effectively improving the welding efficiency of the staff; through the arranged positioning spring 804, the positioning spring 804 can prompt the lower rotating column 803 to have the function of rotation and the function of expansion and contraction, so as to facilitate the docking of the connection tin plate 711 with the welding feet on the circuit board.

[0051] During operation, first squeezing the two finger plates 710 can drive the two positioning blocks 709 to move in opposite directions. When the two positioning blocks 709 are fully separated from the inner cavity of the clamping groove 704, at this time, pulling up the printed board 3 can quickly complete the separation of the electrode plate 1 and the connection tin plate 711, so as to quickly complete the disassembly of the chip inductor, and this disassembly method effectively reduces the risk of the staff being scalded and effectively improves the safety of the chip inductor during use. Then, clamp the new chip inductor outside the strong metal mounting block 701. At this time, release the two finger plates 710, and the elastic force of the support spring 708 will push the two outer fixing sleeves 707 to move in opposite directions. The two outer fixing sleeves 707 moving in opposite directions can drive the two positioning blocks 709 to move in opposite directions. When the two positioning blocks 709 fully move into the inner cavity of the clamping groove 704, at this time, the positioning connection between the electrode plate 1 and the connection tin plate 711 is quickly completed, and at the same time, the quick replacement of the chip inductor is effectively completed;

[0052] During welding, first tear off the anti-sticking film 806, and then adhere the rubber plate 805 between two welding feet on the circuit board, thus initially completing the welding positioning of the chip inductor. Finally, controlling the rotation of the electrode plate 1 can drive the connection tin plate 711 to rotate. When the connection tin plate 711 rotates to directly above the two welding feet, at this time, the welding positioning of the chip inductor is completed for the second time.

[0053] A production process includes the following steps:

[0054] S1: First, produce an inductor skeleton with an embedded hole 4. The inductor skeleton includes an electrode plate 1, a magnetic core column 2, and a printed circuit board 3, and staggered stabilizing bumps 5 are left in the embedded hole 4;

[0055] S2: Then, insert the strong metal mounting blocks 701 into the inside of the embedded hole 4 respectively. When installing the strong metal mounting blocks 701, it is necessary to pre-squeeze the two finger plates 710 in advance and ensure that the connecting tin plate 711 contacts the bottom of the electrode plate 1, so as to determine that the upper surface of the strong metal mounting block 701 is horizontal with the upper surface of the electrode plate 1;

[0056] S3: First, release the two finger plates 710 at the front and rear, and then the elastic force of the support spring 708 will push the positioning block 709 into the inside of the card slot 704 on the positioning mounting block 703. At this time, the installation and positioning of the connecting tin plate 711 are completed;

[0057] S4: First, wind the copper wire around the outside of the magnetic core column 2 to form a coil 6, and then insert the two ends on both sides of the coil 6 into the inside of the connecting electrical heads 702 with corresponding diameters respectively. At this time, ensure that the circuit of the connecting tin plate 711 is unblocked;

[0058] S5: At this time, use the encapsulation material to seal the coil 6 and the magnetic core column 2, thereby forming the final encapsulated product of the surface mount inductor coil;

[0059] S6: Tear off the anti-adhesive film 806 at the bottom of the glue plate 805, and then adhere the bottom of the glue plate 805 between the two solder joints on the circuit board. At this time, the position correspondence between the connecting tin plate 711 and the solder joints can be initially determined;

[0060] S7: During welding, first control the rotation of the electrode plate 1 and ensure that the position of the connecting tin plate 711 fully corresponds to the solder joints on the circuit board, and then start the welding device to quickly weld the high-performance manganese-zinc SMD surface mount inductor to the circuit board. At this time, the installation of the high-performance manganese-zinc SMD surface mount inductor is fully completed.

[0061] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not used to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A high-performance manganese zinc SMD chip inductor, comprising an electrode plate (1), characterized in that: A magnetic core column (2) is fixedly connected to the middle of the upper surface of the electrode plate (1), and the magnetic core column (2) is made of manganese zinc. A printed board (3) is fixedly connected to the upper end of the magnetic core column (2). Two embedded holes (4) are provided on the upper surface of both ends of the electrode plate (1), and a plurality of stabilizing protrusions (5) are provided on the inner walls of both sides of each embedded hole (4). A coil (6) is wound around the outside of the magnetic core column (2); The inner part of the embedded hole (4) is provided with an electrical connection component (7) for connecting the two ends of the coil (6), and the middle part of the lower surface of the electrode plate (1) is provided with an auxiliary component (8) for assisting the welding positioning of the chip inductor.

2. A high performance manganese zinc SMD chip inductor according to claim 1, characterized in that: The electrical connection component (7) comprises two strong metal blocks (701), the two strong metal blocks (701) are respectively inserted into the inside of the two embedded holes (4), and the upper surfaces of the two strong metal blocks (701) are fixedly connected with a plurality of electrical connection heads (702) opposite to the slots, and the diameter of the inner cavity of each electrical connection head (702) increases from front to back.

3. A high performance manganese zinc SMD chip inductor according to claim 2, characterized in that: The upper surfaces of the two strong metal blocks (701) close to one end are fixedly connected to two positioning blocks (703), and the opposite sides of the two front and rear positioning blocks (703) are provided with a clamping slot (704).

4. A high performance manganese zinc SMD chip inductor according to claim 3, characterized in that: Two content grooves (705) are provided on the upper surfaces of the front and rear ends of the electrode plate (1).

5. A high performance manganese zinc SMD chip inductor according to claim 4, characterized in that: Two inner fixed columns (706) are fixedly connected to the inner walls of the two content grooves (705); an outer fixed sleeve (707) is sleeved on the outer sides of the two inner fixed columns (706) away from each other, and a supporting spring (708) is sleeved on the outer sides of the two inner fixed columns (706) close to each other.

6. A high performance manganese zinc SMD chip inductor according to claim 5, characterized in that: The top of each outer fixing sleeve (707) is fixedly connected to a positioning block (709), and the side of each positioning block (709) away from the magnetic core column (2) is fixedly connected to a finger plate (710).

7. A high performance manganese zinc SMD chip inductor according to claim 6, characterized in that: The bottom of each strong metal block (701) is fixedly connected to an electrical tin plate (711), wherein the electrical tin plate (711) is mainly composed of copper, tin and zinc, and is fused with alloy elements such as lead and magnesium.

8. A high performance manganese zinc SMD chip inductor according to claim 7, characterized in that: The auxiliary component (8) comprises a lower embedded groove (801), the lower embedded groove (801) is opened in the middle position of the lower surface of the electrode plate (1), a lower containing tube (802) is embedded in the lower embedded groove (801), a lower rotating column (803) is inserted into the inner cavity of the lower end of the lower containing tube (802), and a positioning spring (804) is fixedly connected to the upper surface of the inner cavity of the lower embedded groove (801).

9. A high performance manganese zinc SMD chip inductor according to claim 8, characterized in that: The lower end of the lower rotating column (803) is fixedly connected with a rubber plate (805), and the lower surface of the rubber plate (805) is bonded with an anti-sticking film (806).

10. A production process, applied to a high-performance manganese zinc SMD chip inductor as claimed in any one of claims 1 to 9, characterized in that: The following steps are involved: S1: firstly produce an inductor skeleton with an embedded hole (4), the inductor skeleton comprising an electrode plate (1), a magnetic core column (2) and a printed board (3), and leave staggered stabilizing bumps (5) in the embedded hole (4); S2: insert the strong metal blocks (701) into the inner holes (4) respectively. When installing the strong metal blocks (701), it is necessary to pre-press the two finger plates (710) and ensure that the connecting tin plate (711) is in contact with the bottom of the electrode plate (1), so as to ensure that the upper surface of the strong metal blocks (701) is in a horizontal state with the upper surface of the electrode plate (1); S3: First, release the two finger plates (710) at the front and rear, and then the elastic force of the support spring (708) will push the positioning block (709) into the slot (704) on the positioning block (703), and the installation and positioning of the electrical connection tin plate (711) is completed; S4: First, the copper wire is wound around the outside of the magnetic core column (2) to form a coil (6), and then the two ends of the coil (6) are respectively inserted into the inside of the electrical connection head (702) of the corresponding diameter, and at this time, the circuit of the electrical connection tin plate (711) is ensured to flow; S5: At this time, the coil (6) and the magnetic core column (2) are sealed with packaging materials to form a final SMD inductor coil packaging product; S6: tear off the anti-adhesive film (806) on the bottom of the rubber sheet (805), and then adhere the bottom of the rubber sheet (805) between two solder joints on the circuit board. At this time, it can be preliminarily determined that the position of the connecting solder plate (711) corresponds to the solder joint; S7: During welding, first control the rotation of the electrode plate (1) and ensure that the position of the solder joint (711) is fully aligned with the solder joint position on the circuit board. Then, start the welding device to quickly weld the high-performance manganese zinc SMD chip inductor to the circuit board. At this point, the installation of the high-performance manganese zinc SMD chip inductor is fully completed.

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