Dual-stage splash monitoring system, method, and computer-readable medium

Abstract

The present application discloses a dual-stage liquid splash monitoring system, method, and computer-readable medium. The dual-stage liquid splash monitoring system includes a protective cover, a wafer clamp, a liquid supply unit, a visual acquisition unit, a sensor unit, and a control unit. The protective cover has an opening and a receiving chamber. The wafer clamp is located in the receiving chamber and is used to drive the wafer to rotate. The liquid supply unit is used to supply chemical liquid to the wafer in the receiving chamber through the opening. The visual acquisition unit is used to collect first liquid splash data of the chemical liquid in the collection area including the opening. The sensor unit includes a first detection module for detecting second liquid splash data of the chemical liquid splashed outside the receiving chamber through the opening. The control unit is respectively connected to the visual acquisition unit and the sensor unit for performing different levels of control operations based on the first liquid splash data and the second liquid splash data. The present application can realize dual-stage liquid splash monitoring, reduce wafer scrap, and thus reduce costs, thereby significantly improving economic benefits.

Description

Technical Field

[0001] The present application relates to the field of semiconductor manufacturing technology, and in particular to a dual-stage splash monitoring system, a dual-stage splash monitoring method, and a computer-readable medium storing computer program code. Background Art

[0002] In the wet process, a single-wafer, high-temperature SPM (sulfuric acid hydrogen peroxide mixture) cleaning system is used to supply SPM chemical liquid to the wafer surface to remove organic matter and etching residues. The single-wafer, high-temperature SPM cleaning system consists of a protective cover, a wafer clamp, and a liquid supply unit. The protective cover has an opening and a receiving cavity. The wafer clamp is located in the receiving cavity and is used to drive the wafer to rotate. The liquid supply unit is used to supply chemical liquid to the wafer in the receiving cavity through the opening, thereby performing the high-temperature SPM cleaning process on the wafer.

[0003] During the high-temperature SPM cleaning process, the chemical liquid on the wafer will be thrown toward the protective cover under the action of centrifugal force and will be collected by the protective cover and then discharged. Some of the chemical liquid may splash outside the containing cavity of the protective cover, including but not limited to splashing onto the top opening of the protective cover and the liquid supply unit. During the process, the chemical liquid accumulated at the top opening of the protective cover and the liquid supply unit will fall onto the wafer surface due to the up and down movement of the protective cover or the swing of the liquid supply unit. The splashed chemical liquid will cause the wafer surface to be contaminated by particles, resulting in the problem of wafer scrapping. Summary of the Invention

[0004] The purpose of this application is to solve the problem in the prior art of how to monitor liquid splashing to reduce wafer scrapping.

[0005] To solve the above problems, the first aspect of the present application proposes a dual-stage splash monitoring system, comprising:

[0006] A protective cover having an opening and a receiving cavity;

[0007] A wafer clamp is located in the accommodating cavity and is used to drive the wafer to rotate;

[0008] a liquid supply unit, configured to supply chemical liquid to the wafer in the accommodation cavity through the opening;

[0009] A visual collection unit, configured to collect first splashing data of the chemical liquid in a collection area including the opening;

[0010] The sensor unit includes a first detection module for detecting second splashing data of the chemical liquid splashing out of the accommodating chamber through the opening; and

[0011] The control unit is communicatively connected to the vision acquisition unit and the sensor unit respectively, and is used to perform different levels of control operations based on the first splashing data and the second splashing data.

[0012] A second aspect of the present application provides a dual-stage splash monitoring method, comprising the following steps:

[0013] supplying chemical liquid to the wafer rotating in the receiving chamber of the protective cover;

[0014] collecting first splashing data of the chemical liquid in a collection area including an opening of the protective cover by a visual collection unit;

[0015] detecting, by the sensor unit, second liquid splashing data of the chemical liquid splashing out of the accommodation chamber through the opening;

[0016] Based on the first splash data and the second splash data, different levels of control operations are performed.

[0017] A third aspect of the present application provides a computer-readable medium storing computer program code, which implements the above-mentioned dual-stage splash monitoring method when executed by a processor.

[0018] The present application detects the splashing of chemical liquid during the process by providing a visual acquisition unit and a sensor unit. The visual acquisition unit collects first splashing data of the chemical liquid in the acquisition area including the opening of the protective cover, and the first detection module of the sensor unit detects second splashing data of the chemical liquid splashing out of the receiving chamber through the opening. The two-stage detection device composed of the visual acquisition unit and the sensor unit performs synchronous detection with high detection accuracy. In addition, when one of the visual acquisition unit and the sensor unit fails, the other can perform detection and send the detected splashing data to the control unit. The control unit promptly executes different levels of control operations, reducing the problem of wafer scrapping, thereby reducing costs and significantly improving economic benefits.

[0019] Other features and corresponding beneficial effects of the present application are described in the latter part of the specification, and it should be understood that at least some of the beneficial effects become obvious from the description in the specification of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the chamber structure of a wet process equipment according to an embodiment;

[0021] Figure 2a A schematic cross-sectional view of a dual-stage liquid splash monitoring system according to an embodiment of the present application;

[0022] Figure 2b for Figure 2a A partial enlarged view of part A;

[0023] Figure 3 A schematic top view of a dual-stage liquid splash monitoring system according to an embodiment of the present application;

[0024] Figure 4 A schematic top view of a dual-stage liquid splash monitoring system according to another embodiment of the present application; and

[0025] Figure 5 Schematic diagram of the flow of a dual-stage liquid splash monitoring method according to an embodiment of the present application. DETAILED DESCRIPTION

[0026] The following describes the embodiments of the present application through specific examples. Those skilled in the art can easily understand the other advantages and effects of the present application from the content disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present application. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0027] Figure 1 The figure is a schematic diagram of the chamber structure of a wet process equipment of an embodiment. Taking the wet process equipment as a high-temperature SPM cleaning equipment as an example, the reasons for splashing during the process and the problems caused by splashing are explained. The reasons for splashing are: 1. The SPM chemical liquid easily crystallizes on the clamping pin 21' of the wafer clamp, causing the clamping pin 21' to get stuck, resulting in the clamping pin 21' being unable to fully clamp the wafer 70', and the wafer 70' slipping and causing the chemical liquid to splash. 2. The SPM chemical liquid is not fully mixed, and chemical liquid splashes when it is supplied to the surface of the wafer 70'. 3. The wafer clamp is affected by the parts processing accuracy and assembly accuracy in the process of driving the wafer 70' to rotate, causing vibration, resulting in chemical liquid splashing. Problems caused by splashing: 1. When chemical liquid splashes from the containment chamber 12' of the protective cover 10' into the chamber 80', it accumulates at the top opening of the protective cover 10'. When the chamber 80' is continuously evacuated to remove the acid gas in the chamber 80', the chemical liquid accumulated at the top opening of the protective cover 10' will form crystals. When the protective cover 10' is raised or lowered, the crystals or chemical liquid at the top opening of the protective cover 10' can easily rebound onto the surface of the wafer 70', causing particle contamination of the surface of the wafer 70'. 2. When the splashing is severe or the chamber 80' is not fully evacuated, the chamber 80' is continuously exposed to an acidic gas atmosphere, which can corrode the surface of the wafer 70'. Third, the splashed chemical liquid will accumulate in the liquid supply unit 30'. When the liquid supply unit 30' is swung over the wafer 70' for the next process, the chemical liquid accumulated in the liquid supply unit 30' will fall onto the surface of the wafer 70', causing the surface of the wafer 70' to be contaminated by particles.

[0028] To address the above problems caused by splashing, this application proposes a dual-stage splash monitoring system. The dual-stage splash monitoring system proposed in this application is suitable for high-temperature SPM cleaning equipment, or other wet cleaning and etching equipment that requires splashing detection.

[0029] Figure 2a Schematic diagram of the cross-sectional structure of a dual-stage splash monitoring system according to an embodiment of the present application. Figure 3 Schematic diagram of the top view of a dual-stage splash monitoring system according to an embodiment of the present application.

[0030] refer to Figure 2a and Figure 3 The dual-stage splash monitoring system includes a protective cover 10, a wafer clamp 20, a liquid supply unit 30, a visual acquisition unit 40, a sensor unit 50 and a control unit 60. The protective cover 10 has an opening 11 and a accommodating chamber 12. The wafer clamp 20 is located in the accommodating chamber 12 and is used to drive the wafer 70 to rotate. The liquid supply unit 30 is used to supply chemical liquid to the wafer 70 in the accommodating chamber 12 through the opening 11 to perform a cleaning process on the wafer 70. The protective cover 10 has at least one, and during the process, at least one protective cover 10 is raised to a predetermined position to collect the chemical liquid on the surface of the wafer 70 that is thrown out of the wafer 70 due to centrifugal force. The wafer clamp 20 has a clamping pin 21 for clamping and releasing the wafer 70. The liquid supply unit 30 includes a swing arm 31 and a nozzle 32. The first end of the swing arm 31 is connected to the nozzle 32. The first end of the swing arm 31 rotates about the second end of the swing arm 31 to drive the nozzle 32 to rotate above the wafer 70 or outside the receiving chamber 12. The visual acquisition unit 40 is used to collect first splash data of the chemical liquid in the collection area including the opening 11 of the protective cover 10. The sensor unit 50 includes a first detection module for detecting second splash data of the chemical liquid splashed outside the receiving chamber 12 through the opening 11. The control unit 60 is respectively connected to the visual acquisition unit 40 and the sensor unit 50 for performing different levels of control operations based on the first splash data and the second splash data.

[0031] In the embodiment of the present application, a visual acquisition unit 40 and a sensor unit 50 are provided to detect splashing of chemical liquid during the process. The visual acquisition unit 40 collects first splashing data of the chemical liquid in the collection area including the opening 11 of the protective cover 10, and the first detection module of the sensor unit 50 detects second splashing data of the chemical liquid splashing out of the accommodating chamber 12 through the opening 11. The two-stage detection device composed of the visual acquisition unit 40 and the sensor unit 50 performs synchronous detection with high detection accuracy. In addition, when one of the visual acquisition unit 40 and the sensor unit 50 fails, the other can perform detection and send the detected splashing data to the control unit 60. The control unit 60 promptly executes different levels of control operations, reducing the problem of wafer 70 being scrapped, thereby reducing costs and significantly improving economic benefits.

[0032] refer to Figure 2a and Figure 3 In some embodiments, the first splashing data and the second splashing data both include splashing duration and splashing times, and the splashing preset value includes a duration preset value and a number preset value. The different levels of control operations performed by the control unit 60 include primary control operations and secondary control operations, and the primary control operation is higher than the secondary control operation. The primary control operation includes: the control unit 60 issues a primary alarm signal and stops the current process on the wafer 70. The secondary control operation includes: the control unit 60 issues a secondary alarm signal and stops the next process after the current process on the wafer 70 is completed.

[0033] Specifically, when the first splash data or the second splash data is greater than or equal to the corresponding splash preset value, the first level control operation is performed.

[0034] If the splashing duration is greater than or equal to the preset duration, the first-level control operation is executed;

[0035] If the number of splashing times is greater than or equal to the preset value, the first-level control operation will be executed.

[0036] In response to the at least one liquid splash detection result, the control unit 60 performs a primary control operation.

[0037] When the first splash data or the second splash data is less than the corresponding splash preset value, the secondary control operation is performed.

[0038] If the splashing duration is less than the preset duration, the secondary control operation will be executed;

[0039] If the number of splashing times is less than the preset value, the secondary control operation will be executed.

[0040] In response to at least one splash detection result, the control unit 60 performs a secondary control operation. The splash preset value corresponding to the first splash data and the splash preset value corresponding to the second splash data can be the same or different, and can be determined and adjusted according to actual process requirements.

[0041] Figure 2b for Figure 2a A partial enlarged view of part A in the middle. Figure 2b The dotted arrows in the figure represent the splashing chemical liquid. Figure 2b When the visual acquisition unit 40 and the sensor unit 50 detect that the first or second splash data is greater than or equal to the corresponding splash preset value, the splashed chemical liquid will carry the dirty chemical liquid and crystals that have been used to clean the surface of the wafer 70 at the top opening 11 of the protective cover 10 back to the surface of the wafer 70, causing wafer defects, so it is necessary to perform a primary control operation. When the visual acquisition unit 40 and the sensor unit 50 detect that the first or second splash data is less than the corresponding splash preset value, it can be considered that the first or second splash data is within the acceptable range of process requirements, and the liquid film covering the surface of the wafer 70 can basically block the impact of the splash on the surface of the wafer 70, so a secondary control operation is performed. It can be understood that the collection area including the opening 11 of the protective cover 10 also includes a liquid supply unit 30, and the liquid supply unit 30 is above the wafer 10. Therefore, when the visual collection unit 40 and the sensor unit 50 detect that the first splashing data or the second splashing data is greater than or equal to the corresponding splashing preset value, the splashing chemical liquid will also bring the dirty chemical liquid and crystals on the surface of the wafer 70 that have been cleaned on the liquid supply unit 30 back to the surface of the wafer 70, causing wafer defects.

[0042] In some embodiments, in the first-level control operation, the control unit 60 sends a first-level alarm signal and stops the current process, and then immediately supplies a rinse liquid to the surface of the wafer 70 for rinsing, and then dries the wafer 70 to protect the wafer 70. Finally, the operator performs maintenance to avoid affecting the next wafer. For example, when the chemical liquid used in the process is a hydrofluoric acid solution, deionized water is sprayed on the surface of the wafer 70 for rinsing, and then dried. When the chemical liquid used in the process is an SPM solution, hydrogen peroxide is first sprayed on the surface of the wafer 70, then rinsed with deionized water, and finally dried.

[0043] In the secondary control operation, the control unit 60 issues a secondary alarm signal and requires the operator to perform maintenance after the current process is completed to prevent the next wafer from being affected.

[0044] In some embodiments, the visual acquisition unit 40 includes a high-speed camera that can dynamically monitor splashing liquid. The high-speed camera captures the movement of the splashing chemical liquid at an extremely high frame rate (e.g., thousands of frames per second or even higher) and generates a video. By analyzing the video, the duration and number of splashes can be calculated.

[0045] In some embodiments, the first detection module of the sensor unit 50 includes a photoelectric liquid sensor, a capacitive sensor, a pressure sensor, or an ultrasonic sensor. For example, a photoelectric liquid sensor detects the presence of chemical liquid through a photoelectric effect (such as light scattering or absorption). When chemical liquid splashes into the detection area of the photoelectric liquid sensor, it changes the propagation path or intensity of light. The photoelectric liquid sensor calculates the duration and number of splashes by detecting these changes, such as changes in light intensity. A capacitive sensor senses chemical liquid by detecting changes in capacitance. When chemical liquid splashes onto the surface of the capacitive sensor, it changes the capacitance value of the capacitive sensor. The capacitive sensor can calculate the duration and number of splashes by detecting the frequency and duration of changes in the capacitance value.

[0046] refer to Figure 2a and Figure 3 In some embodiments, the dual-stage splash monitoring system further includes a chamber 80, wherein the protective cover 10, the wafer holder 20, and the liquid supply unit 30 are all located in the chamber 80. The visual acquisition unit 40 is disposed in the chamber 80 and is located obliquely above the opening 11 of the protective cover 10. The structure of the sensor unit 50 can be a patch type, mounted on the side wall 81 of the chamber 80, preferably, as shown in FIG. Figure 2a The sensor unit 50 is arranged on the upper part of the side wall 81 of the chamber 80, which is conducive to detecting the splashing of the chemical liquid in the accommodating chamber 12 through the opening 11 to the outside of the accommodating chamber 12. Among them, because the side wall 81 of the chamber 80 is provided with a wafer transfer door (not shown) for transferring the wafer 70, when installing the sensor unit 50 and the visual acquisition unit 40, consideration should be given to avoiding the wafer transfer door. Figure 3 In the example shown, there are multiple sensor units 50 , which are spaced apart and distributed on three side walls 81 of the chamber 80 , and the vision acquisition unit 40 is provided on the fourth side wall 81 . Figure 4 This is a schematic top view of the structure of a dual-stage splash monitoring system according to another embodiment of the present application; Figure 4 In the example shown, the sensor units 50 are distributed in a ring shape on the four side walls 81 of the chamber 80 , and the vision acquisition unit 40 is disposed on one of the side walls 81 .

[0047] refer to Figure 2aIn some embodiments, the collection area of the visual acquisition unit 40 also includes the top wall 82 of the chamber 80 located directly above the opening 11 of the protective cover 10. The visual acquisition unit 40 is further configured to collect first gas condensation data on the top wall 82, and the control unit 60 is further configured to execute corresponding control operations based on the first gas condensation data. When the first gas condensation data indicates condensation, a primary control operation is executed. Gases generated during the actual process, such as acidic gases, tend to rise and concentrate primarily on the top wall 82. If the first gas condensation data indicates condensation, this indicates at least a high amount of acidic gas above the wafer 70 and that it has not been extracted from the chamber 80. The acidic gas will corrode the surface of the wafer 70, causing wafer defects, so a primary control operation is executed. In this embodiment, during the primary control operation, the control unit 60 issues a primary alarm signal, halts the current process, and immediately supplies rinse fluid to the surface of the wafer 70 for rinsing. The wafer 70 is then dried to protect it. Finally, an operator performs maintenance on the top wall 82 of the chamber 80. Liquid droplets formed by gas condensation may not drip directly. Prompt maintenance of the top wall 82 of the chamber 80 by the operator can eliminate the possibility of these droplets falling onto the surface of the next wafer. For example, if the visual acquisition unit 40 includes a high-speed camera, the high-speed camera can record the formation process of gas condensation or its dynamic behavior (such as the rolling or sliding of the droplets on the top wall 82) at an extremely high frame rate (e.g., thousands of frames per second or even higher) to infer the state of the condensation.

[0048] In some embodiments, the collection area of the visual collection unit 40 further includes the swing arm 31 of the liquid supply unit 30. The visual collection unit 40 can detect the splashing data and gas condensation data on the swing arm 31.

[0049] In some embodiments, the sensor unit 50 further includes at least one second detection module for detecting second gas condensation data and / or gas concentration data in the chamber 80, and the control unit 60 is further configured to perform corresponding control operations based on the second gas condensation data and / or gas concentration data. When the second gas condensation data indicates condensation, a primary control operation is performed. Gases generated during the actual process, such as acidic gases, will rise and, in addition to being concentrated on the top wall 82, will also be distributed on the side walls of the chamber 80. If the second gas condensation data is detected as condensed, it indicates that the amount of acidic gas in the chamber 80 is large and has not been extracted from the chamber 80. The acidic gas will corrode the surface of the wafer 70, causing wafer defects, so a primary control operation is performed. When the gas concentration data reaches the preset concentration value, the gas concentration data is within the acceptable range of the process requirements, and it can be considered that no condensation has occurred, and a secondary control operation is performed. The preset concentration value can be determined and adjusted according to the actual process requirements.

[0050] In some embodiments, the second detection module for detecting second gas condensation data may be a humidity sensor or a resistive sensor. The humidity sensor determines whether gas condensation has occurred by detecting the water vapor content in chamber 80. When water vapor in the gas condenses on the sensitive material of the resistive sensor, the sensitive material absorbs the moisture, causing its resistance value to change. The resistive sensor detects the presence of gas condensation based on this change in resistance. The second detection module for detecting gas concentration data may be a gas concentration sensor. By detecting the second gas condensation data or gas concentration data in chamber 80, the acidic gas atmosphere in chamber 80 can be promptly prevented from affecting the surface of wafer 70.

[0051] According to the foregoing, the visual acquisition unit 40 is used to realize dynamic monitoring of the splashing chemical liquid, and the sensor unit 50 is used to realize static monitoring of the splashing chemical liquid. By combining dynamic monitoring and static monitoring, once in response to one or more of the first splashing liquid data being greater than or equal to the corresponding splashing liquid preset value, the first splashing liquid data being less than the splashing liquid preset value, the second splashing liquid data being greater than or equal to the corresponding splashing liquid preset value, the second splashing liquid data being less than the splashing liquid preset value, the first gas condensation data being condensed, the second gas condensation data being condensed, and the gas concentration data reaching the concentration preset value, the control unit 60 promptly executes different levels of control operations to reduce the scrapping of the wafer 70, thereby reducing costs and significantly improving economic benefits.

[0052] In addition, it can prevent a large amount of chemical liquid from splashing into the chamber 80 and flowing into the drainage pipe to cause an exothermic reaction, resulting in rupture of parts such as the drainage pipe, causing chemical liquid leakage and creating safety risks.

[0053] Figure 5 Schematic diagram of the flow of a dual-stage liquid splash monitoring method according to an embodiment of the present application.

[0054] refer to Figure 5 , this application also proposes a two-stage splash monitoring method, comprising the following steps:

[0055] Supplying chemical liquid to the wafer 70 rotating in the receiving chamber 12 of the protective cover 10;

[0056] Collecting first splashing data of the chemical liquid in the collection area including the opening 11 of the protective cover 10 through the visual collection unit 40;

[0057] Detecting second splash data of the chemical liquid splashing out of the receiving chamber 12 through the opening 11 by the sensor unit 50;

[0058] Based on the first splash data and the second splash data, different levels of control operations are performed.

[0059] It should be understood that the specific process of each module executing the above corresponding steps has been described in detail in the above system embodiment, and for the sake of brevity, it will not be repeated here.

[0060] It should also be understood that the division of modules in the embodiments of the present application is illustrative and is merely a logical functional division. In actual implementation, other division methods may be used. Furthermore, the functional modules in the various embodiments of the present application may be integrated into a single processor, or may exist physically separately, or two or more modules may be integrated into a single module. The aforementioned integrated modules may be implemented in the form of hardware or software functional modules.

[0061] The present application also proposes a computer-readable medium storing computer program code, which implements the aforementioned dual-stage splash monitoring method when executed by a processor.

[0062] When the dual-stage splash monitoring method is implemented as a computer program, it can also be stored in a computer-readable storage medium as an article of manufacture. For example, a computer-readable storage medium can include, but is not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic strips), optical disks (e.g., compact disks (CDs), digital versatile disks (DVDs)), smart cards, and flash memory devices (e.g., electrically erasable programmable read-only memories (EPROMs), cards, sticks, key drives). In addition, the various storage media described herein can represent one or more devices and / or other machine-readable media for storing information. The term "machine-readable medium" can include, but is not limited to, wireless channels and various other media (and / or storage media) that can store, contain, and / or carry code and / or instructions and / or data.

[0063] It should be understood that the embodiments described above are merely illustrative. The embodiments described herein may be implemented in hardware, software, firmware, middleware, microcode, or any combination thereof. For hardware implementation, the processor may be implemented within one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, and / or other electronic units designed to perform the functions herein, or a combination thereof.

[0064] Some aspects of this application may be implemented entirely in hardware, entirely in software (including firmware, resident software, microcode, etc.), or a combination of hardware and software. These hardware and software components may be referred to as "data blocks," "modules," "engines," "units," "components," or "systems." A processor may be one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), processors, controllers, microcontrollers, microprocessors, or combinations thereof. Furthermore, various aspects of this application may be embodied as computer products embodied in one or more computer-readable media, including computer-readable program code. For example, computer-readable media may include, but are not limited to, magnetic storage devices (e.g., hard disks, floppy disks, magnetic tapes), optical disks (e.g., compact disks, digital versatile disks, DVDs), smart cards, and flash memory devices (e.g., cards, sticks, key drives, etc.).

[0065] A computer-readable medium may include a propagated data signal embodying computer program code, for example, in baseband or as part of a carrier wave. The propagated signal may be in a variety of forms, including electromagnetic, optical, etc., or a suitable combination thereof. A computer-readable medium may be any computer-readable medium other than a computer-readable storage medium that can be connected to an instruction execution system, apparatus, or device to communicate, propagate, or transmit the program for use. The program code on the computer-readable medium may be transmitted via any suitable medium, including radio, cable, fiber optic cable, radio frequency signal, or similar medium, or any combination of the above.

[0066] The above embodiments are merely illustrative of the principles and effects of this application and are not intended to limit this application. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of this application. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical concepts disclosed in this application shall be covered by the claims of this application.

Claims

1. A dual-stage splash monitoring system, characterized in that: include: A protective cover having an opening and a receiving cavity; A wafer clamp, located in the accommodating cavity, and used to drive the wafer to rotate; a liquid supply unit, configured to supply chemical liquid to the wafer in the accommodating cavity through the opening; A visual collection unit, configured to collect first splashing data of the chemical liquid in a collection area including the opening; The sensor unit includes a first detection module for detecting second splashing data of the chemical liquid splashed outside the containing cavity through the opening; as well as A control unit is communicatively connected to the visual acquisition unit and the sensor unit, and is used to perform different levels of control operations based on the first splashing data and the second splashing data.

2. The dual-stage splash monitoring system according to claim 1, characterized in that: The control unit performs different levels of control operations based on the first splash data and the second splash data, including: When the first splashing data or the second splashing data is greater than or equal to the corresponding splashing preset value, performing a primary control operation; When the first splashing data or the second splashing data is smaller than the corresponding splashing preset value and is within an acceptable range of process requirements, performing a secondary control operation; The level of the primary control operation is higher than the level of the secondary control operation.

3. The dual-stage splash monitoring system according to claim 2, characterized in that: The first splashing data and the second splashing data both include splashing duration and splashing times, and the splashing preset value includes a duration preset value and a number preset value.

4. The dual-stage splash monitoring system according to claim 2, characterized in that: The first-level control operation includes: the control unit issuing a first-level alarm signal and stopping the current process on the wafer; The secondary control operation includes: the control unit sends a secondary alarm signal, and stops processing the next wafer after the current process on the wafer is completed.

5. The dual-stage splash monitoring system according to claim 1, characterized in that: Also includes: The protective cover, the wafer clamp, the liquid supply unit, the visual acquisition unit and the sensor unit are all located in the chamber.

6. The dual-stage splash monitoring system according to claim 5, characterized in that: The collection area also includes a top wall of the chamber located directly above the opening, the visual collection unit is further used to collect first gas condensation data on the top wall, and the control unit is further used to perform corresponding control operations based on the first gas condensation data.

7. The dual-stage splash monitoring system according to claim 6, characterized in that: The control unit performing a corresponding control operation based on the first gas condensation data includes: When the first gas condensation data indicates condensation, a primary control operation is performed.

8. The dual-stage splash monitoring system according to claim 5, characterized in that: The sensor unit further includes at least one second detection module for detecting second gas condensation data and / or gas concentration data in the chamber, and the control unit is further configured to perform corresponding control operations based on the second gas condensation data and / or the gas concentration data.

9. The dual-stage splash monitoring system according to claim 8, characterized in that: The control unit performing corresponding control operations based on the second gas condensation data and / or the gas concentration data includes: When the second gas condensation data indicates that the gas has been condensed, performing a primary control operation; When the gas concentration data reaches a preset concentration value, a secondary control operation is performed.

10. The dual-stage splash monitoring system according to claim 9, characterized in that: The first-level control operation includes: the control unit issuing a first-level alarm signal and stopping the current process on the wafer; The secondary control operation includes: the control unit sends a secondary alarm signal, and stops processing the next wafer after the current process on the wafer is completed.

11. A dual-stage splash monitoring method, characterized in that: The following steps are involved: supplying chemical liquid to the wafer rotating in the receiving chamber of the protective cover; collecting first splashing data of the chemical liquid in a collection area including the opening of the protective cover by a visual collection unit; detecting, by a sensor unit, second splash data of the chemical liquid splashed out of the receiving chamber through the opening; Based on the first splash data and the second splash data, different levels of control operations are performed.

12. A computer-readable medium storing computer program code, characterized in that: The computer program code, when executed by a processor, implements the dual-stage splash monitoring method of claim 11 .

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