Electronic equipment

Abstract

The invention discloses electronic equipment, the electronic equipment comprises a shell, a solar module and a functional component, the shell comprises a first shell and a second shell which are rotatably connected, one side, back on to the first shell, of the second shell is provided with a protruding part, and a mounting space is formed in the protruding part; the solar module is arranged in the second shell, the solar module comprises a plurality of branches which are arranged in parallel, each branch comprises a plurality of solar cells, and the solar module and the heating component are provided with a connecting path, so that an electronic component in the solar module electronic equipment transmits electric energy; the functional component is arranged in the second shell, and at least part of the functional component is located in the installation space.

Description

Technical Field

[0001] This application relates to, but is not limited to, the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] With the continuous increase in the power consumption of electronic devices, in order to extend the battery life of electronic devices and reduce the dependence on traditional energy sources, solar modules, as a clean and sustainable energy source, have been gradually introduced into the design of electronic devices. In related technologies, after the solar module is integrated into the electronic device, it will cause the thickness of the electronic device to be too thick, which is contrary to the development trend of the electronic device towards being thinner, lighter, and more portable. Therefore, there is an urgent need to provide an electronic device that can reduce the thickness of the electronic device while meeting the power supply of the solar module. Summary of the Invention

[0003] To solve the above problems, this application provides an electronic device.

[0004] This application provides an electronic device, which includes a housing, a solar module, and functional components. The housing includes a first housing and a second housing that are rotatably connected. A convex portion is provided on the side of the second housing facing away from the first housing, and an installation space is formed inside the convex portion. The solar module is disposed inside the second housing. The solar module includes a plurality of branches connected in parallel, and each branch includes a plurality of solar cells. The solar module has a connection path with a heating component to enable the solar module to transmit electrical energy to the electronic components in the electronic device. The functional components are disposed inside the second housing, and at least a part of the functional components is located in the installation space.

[0005] In a possible implementation manner of this application, the electronic components further include a heating component disposed inside the first housing. The heating component includes a first heating component group, a second heating component group, and a main board. Along the thickness direction of the first housing, the size of the first heating component group is smaller than the size of the second heating component group. The first heating component group is disposed on the main board, and along the thickness direction of the first housing, the second heating component group is disposed offset from the main board.

[0006] In a possible implementation manner of this application, the first housing has a first side wall and a second side wall that are oppositely disposed along a first direction. The first direction is perpendicular to the thickness direction of the first housing. The distance between the main board and the first side wall is smaller than the distance between the main board and the second side wall. Along the first direction, a first accommodation space is formed between the main board and the first side wall for accommodating the second heating component group.

[0007] In a possible implementation manner of the present application, the first housing has a third side wall and a fourth side wall oppositely arranged along the second direction. The first direction, the second direction, and the thickness direction of the first housing are perpendicular to each other pairwise. The first housing is rotatably connected to the second housing through the third side wall. Along the second direction, a second accommodation space is formed between the main board and the fourth side wall for accommodating the second heat generating component group.

[0008] In a possible implementation manner of the present application, heat dissipation holes are provided on the third side wall. Along the second direction, the distance between the main board and the third side wall is less than the distance between the main board and the fourth side wall, and the dimension of the main board along the first direction is greater than the dimension of the main board along the second direction.

[0009] In a possible implementation manner of the present application, the electronic device further includes a heat pipe, and the heat pipe is disposed on the main board to cover the first heat generating component group.

[0010] In a possible implementation manner of the present application, the electronic device includes a rotating shaft structure, a rotating shaft cover, and a conductor. The rotating shaft structure includes a first rotating shaft and a second rotating shaft hinged to each other. The first rotating shaft is connected to the first housing, and the second rotating shaft is connected to the second housing so that the first housing and the second housing are rotatably connected. The rotating shaft cover is disposed around the circumference of the rotating shaft structure. At least one of the first rotating shaft and the second rotating shaft has a groove, and the groove and the rotating shaft cover enclose a wire routing cavity. One end of the conductor is electrically connected to the solar module, and the other end of the conductor is electrically connected to the heating component through the wire routing cavity to transmit electric energy to the heating component.

[0011] In a possible implementation manner of the present application, the electronic device further includes a component that operates by power supply. The electric energy of the solar module is transmitted to the component.

[0012] In a possible implementation manner of the present application, the electronic component includes a display component disposed in the second housing. The display component has a first display area, a second display area, and a third display area. The first display area is configured to display the total power output of the solar module, the second display area is configured to display the reduction in carbon emissions corresponding to the total power output, and the third display area is configured to display the power transmission efficiency of the solar module to the electronic component within a target time period.

[0013] In a possible implementation manner of the present application, the solar module includes a light transmissive layer, a solar cell layer, and a bus bar layer. Along the height direction of the solar module, the light transmissive layer and the bus bar layer are respectively disposed on opposite sides of the solar cell layer. The electric energy generated by the solar cell layer is collected by the bus bar layer and then transmitted to the heating component. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic structural diagram of the electronic device provided by the embodiment of the present application;

[0015] Figure 2 Schematic diagram of the structure inside the first housing (first example);

[0016] Figure 3 Schematic diagram of the structure inside the first housing (second example);

[0017] Figure 4 Schematic diagram of the positions of the first heating component group and the second heating component group in the thickness direction of the first housing;

[0018] Figure 5 For Figure 1 Cross-sectional view taken along A-A in

[0019] Figure 6 Schematic diagram of the positions of the first heat insulation layer and the second heat insulation layer inside the first housing;

[0020] Figure 7 Schematic diagram of the second housing (first perspective);

[0021] Figure 8 Schematic diagram of the second housing (second perspective);

[0022] Figure 9 Schematic diagram of the positions of the solar modules in the thickness direction of the second housing;

[0023] Figure 10 Schematic diagram of the solar module (first example);

[0024] Figure 11 Schematic diagram of the solar module (second example);

[0025] Figure 12 Schematic diagram of the connection between the solar module and the non-energy storage component;

[0026] Figure 13 Schematic diagram of the display component;

[0027] Figure 14 Schematic diagram of the connection between the display component and the charger;

[0028] Figure 15 PI curve diagram of the charger.

[0029] Explanation of reference numerals:

[0030] 1 - Housing; 11 - First housing; 111 - First side wall; 112 - Second side wall; 113 - Third side wall; 114 - Fourth side wall; 12 - Second housing; 121 - Protrusion; 122 - Partition board; 13 - Rotating shaft cover; 14 - First heat insulation layer; 15 - Second heat insulation layer; 16 - Heat pipe; 2 - Electronic components; 21 - First group of heat - generating components; 211 - Central processing unit; 212 - Graphics processing unit; 213 - Charger; 214 - Embedded controller; 22 - Second group of heat - generating components; 221 - Solid - state drive; 222 - Wireless communication module; 223 - Battery module; 23 - Main board; 24 - Non - energy - storage component; 25 - Switching component; 3 - Solar module; 31 - Light - transmissive layer; 32 - Upper electrode grid line layer; 33 - Solar cell layer; 331 - Solar cell; 34 - Lower electrode grid line layer; 35 - Busbar layer; 36 - Reinforcement layer; 37 - Circuit board layer; 4 - Functional component; 5 - Display component; 51 - First display area; 52 - Second display area; 53 - Third display area; 6 - Heat pipe; 7 - Rotating shaft structure; 71 - Groove; 8 - Conductor. Detailed implementation manners

[0031] It should be noted that, without conflict, the embodiments in this application and the technical features in the embodiments can be combined with each other. The detailed description in the specific implementation manners should be understood as an explanatory illustration of the purpose of this application and should not be regarded as an improper limitation of this application.

[0032] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the following will further describe the specific technical solutions of this application in detail with reference to the accompanying drawings in the embodiments of this application. The following embodiments are used to illustrate this application but are not used to limit the scope of this application.

[0033] In the embodiments of this application, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of this application, unless otherwise stated, the meaning of "a plurality" is two or more.

[0034] In addition, in the embodiments of this application, orientation terms such as "upper", "lower", "left", and "right" are defined relative to the orientation of the components shown in the drawings. It should be understood that these directional terms are relative concepts, which are used for relative description and clarification and can change accordingly with the change of the orientation of the components placed in the drawings.

[0035] In the embodiments of the present application, unless otherwise clearly defined and limited, the term "connection" shall be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral one; it can be directly connected or indirectly connected through an intermediate medium.

[0036] In the embodiments of the present application, the term "comprise", "include" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including that element.

[0037] In the embodiments of the present application, words such as "exemplary" or "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.

[0038] In the embodiments of the present application, for the convenience of describing directions, Figure 2 、 Figure 3 、 Figure 4 and Figure 8 are all marked with directions. Among them, the first direction is the length direction of the first housing 11, the second direction is the width direction of the first housing 11, the third direction is the thickness direction of the first housing 11, and the first direction, the second direction and the third direction are perpendicular to each other. The fourth direction is the thickness direction of the second housing 12 and the solar module 3. It should be noted that the direction markings are only used to describe the present application, but not to limit the scope of the present application.

[0039] With the continuous increase in the power consumption of electronic devices, in order to extend the battery life of electronic devices and reduce the dependence on traditional energy sources, the solar module 3, as a clean and sustainable energy source, has been gradually introduced into the design of electronic devices. In the related art, after the solar module 3 is integrated into the interior of an electronic device, it will cause the thickness of the electronic device to be too thick, which is contrary to the development direction of the thinness, lightness and portability of electronic devices.

[0040] To solve the above problems, the embodiments of the present application provide an electronic device. Here, it should be explained that the electronic device mentioned in the embodiments of the present application can be a laptop computer, a mobile phone, or a game console. The embodiments of the present application do not limit this. In one implementable manner provided by the embodiments of the present application, the electronic device can be a laptop computer.

[0041] Referring to Figure 1 、 Figure 2 、 Figure 7 and Figure 8 ,the electronic device includes a housing 1, a solar module 3 and a functional component 4. The housing 1 includes a first housing 11 and a second housing 12 that are rotatably connected. The solar module 3 is disposed within the second housing 12. The solar module 3 includes a plurality of parallel branches, and each branch includes a plurality of solar cells 331. The solar module 3 has a connection path to an electronic component 2 within the electronic device so that the solar module 3 transmits electrical energy to the electronic component 2.

[0042] In an embodiment of the present application, the housing 1 is the external structure of the electronic device, usually made of rigid or flexible materials, and is used to accommodate and protect the internal components of the electronic device. The shape design and material selection of the housing 1 will directly affect the appearance, durability and functionality of the device.

[0043] In an embodiment of the present application, the shape designs of the first housing 11 and the second housing 12 may be the same. For example, the shapes of both the first housing 11 and the second housing 12 are rectangular; or, the shape designs of the first housing 11 and the second housing 12 may also be different. For example, the shape of the first housing 11 is rectangular and the shape of the second housing 12 is circular. The embodiments of the present application do not limit this.

[0044] In an embodiment of the present application, the material of the housing 1 may be metal, such as aluminum alloy, magnesium alloy, stainless steel, etc. Or, the material of the housing 1 may be non-metallic materials such as plastic, glass, etc. The embodiments of the present application do not limit this.

[0045] In an embodiment of the present application, the solar module 3 refers to a component that integrates a plurality of solar cells 331. Its main function is to convert the light energy of sunlight or other light sources into electrical energy to provide clean and sustainable power support for the electronic device.

[0046] In an embodiment of the present application, the functional component 4 refers to a component or module in the electronic device that has a specific function or task. There are various possibilities for the types of the functional component 4. For example, the functional component 4 may include a camera module and a Time-of-Flight (TOF) sensor. The Time-of-Flight sensor can assist the camera module to achieve precise focusing, improve imaging quality, etc.

[0047] In the technical solution provided by the embodiment of the present application, the electronic device includes a housing 1, a solar module 3, and a functional component 4. The housing 1 includes a first housing 11 and a second housing 12 that are rotatably connected. The solar module 3 is disposed in the second housing 12. The solar module 3 includes a plurality of branches connected in parallel, and each branch includes a plurality of solar cells 331. The solar module 3 has a connection path with the electronic components 2 in the electronic device, so that the solar module 3 transmits electric energy to the electronic components 2. Here, the solar module 3 includes a plurality of branches connected in parallel, and each branch includes a plurality of solar cells 331, which can improve the output power of the solar module 3 to meet the requirement of the solar module 3 for transmitting electric energy to the electronic components 2. An installation space is formed in the protruding portion 121. The functional component 4 is disposed in the second housing 12, and at least a part of the functional component 4 is located in the installation space. Here, the functional component 4 can be entirely or partially disposed in the installation space to avoid the solar module 3. In this way, while meeting the installation requirements of the functional component 4 and the solar module 3, the occupied space of the functional component 4 and the solar module 3 in the thickness direction of the second housing 12 can be reduced, which is beneficial to the thin and light design of the second housing 12. Because the housing 1 is the external structure of the electronic device, its size directly determines the overall size of the electronic device. Therefore, the reduction of the thickness of the second housing 12 can reduce the thickness of the electronic device, which is beneficial to improving the portability of the electronic device.

[0048] In the embodiment of the present application, the electronic components 2 further include a heat generating component disposed in the first housing 11. The heat generating component includes a first heat generating component group 21, a second heat generating component group 22, and a main board 23. Along the thickness direction of the first housing 11, the size of the first heat generating component group 21 is smaller than that of the second heat generating component group 22. The first heat generating component group 21 is disposed on the main board 23, and along the thickness direction of the first housing 11, the second heat generating component group 22 is disposed offset from the main board 23.

[0049] In the embodiment of the present application, when the second heat generating component group 22 is disposed offset from the main board 23, the second heat generating component group 22 can be fixed in the first housing 11 through a substrate or directly fixed in the housing through fasteners. The embodiment of the present application does not limit this.

[0050] In the embodiment of the present application, the heat generating component refers to a component that generates heat due to energy loss during operation. For example, in an electronic device, the heat generating component may include a central processing unit 211 (CPU), a graphics processing unit 212 (GPU), a solid state drive 221 (SSD), a wireless communication module 222, a battery module 223, etc. The embodiment of the present application does not limit this.

[0051] In the embodiment of the present application, the main board 23 is a printed circuit board, which is mainly used to provide electrical connection and communication channels for the heat-generating components to ensure that the heat-generating components can work together.

[0052] In the embodiment of the present application, the size of the second heat-generating component group 22 in the thickness direction of the first housing 11 is greater than the size of the first heat-generating component group 21 in the thickness direction of the first housing 11. The first heat-generating component group 21 is arranged on the main board 23, and the second heat-generating component group 22 is arranged in a staggered manner with the main board 23 in the thickness direction of the first housing 11. Compared with the scheme in which the second heat-generating component group 22 is arranged on the main board 23, the overall size of the heat-generating components in the thickness direction of the first housing 11 can be reduced, which is beneficial to the thin and light design of the first housing 11. In addition, the first heat-generating component group 21 is arranged on the main board 23, and the second heat-generating component group 22 is arranged around the edge of the main board 23, which can also disperse the heat-generating components in the first housing 11 to avoid heat source concentration and is beneficial to the heat dissipation of the heat-generating components. In this way, the heat dissipation requirement inside the first housing 11 can be reduced, so that the setting of heat dissipation components (such as heat dissipation fans, water cooling structures, etc.) in the first housing 11 can be reduced, which is beneficial to reducing the volume of the first housing 11. In addition, the solar module 3 and the heat-generating components are respectively arranged in different housings, which can reduce the heat transfer between the solar module 3 and the heat-generating components and reduce the probability of mutual influence between the solar module 3 and the heat-generating components during operation, thereby improving the heat dissipation performance of the electronic device.

[0053] In a possible embodiment of the present application, the maximum height of the second heat-generating component group 22 may be less than or equal to the sum of the heights of the main board 23 and the first heat-generating component group 21. In this way, the maximum height of the heat-generating components is the sum of the heights of the main board 23 and the first heat-generating component group 21, further reducing the size of the heat-generating components in the thickness direction of the first housing 11.

[0054] Refer to Figure 2 and Figure 3 In the embodiment of the present application, the first housing 11 has a first side wall 111 and a second side wall 112 arranged opposite to each other in a first direction, the first direction is perpendicular to the thickness direction of the first housing 11, the distance between the main board 23 and the first side wall 111 is less than the distance between the main board 23 and the second side wall 112, and a first accommodation space is formed between the main board 23 and the first side wall 111 in the first direction for accommodating the second heat-generating component group 22. In this way, the space between the main board 23 and the second side wall 112 can be effectively utilized, improving the utilization rate of the space inside the first housing 11.

[0055] Refer to Figure 2 and Figure 3, in a possible embodiment of the present application, the second heating component may include a solid-state drive 221 and a wireless communication module 222, and both the solid-state drive 221 and the wireless communication module 222 may be disposed in the first accommodation space. Here, both the solid-state drive 221 and the wireless communication module 222 are disposed in the first accommodation space, which can shorten the wiring distance between them and the motherboard 23, not only saving space but also improving signal transmission efficiency and reducing interference.

[0056] Referring to Figure 2 and Figure 3 , in the embodiment of the present application, the first housing 11 has a third side wall 113 and a fourth side wall 114 that are oppositely disposed along the second direction. The first direction, the second direction, and the thickness direction of the first housing 11 are perpendicular to each other pairwise. The first housing 11 is rotatably connected to the second housing 12 through the third side wall 113. Along the second direction, a second accommodation space is formed between the motherboard 23 and the fourth side wall 114 for accommodating the second heating component group 22. In this way, the space between the motherboard 23 and the fourth side wall 114 can be effectively utilized, improving the utilization rate of the space inside the first housing 11.

[0057] Referring to Figure 2 and Figure 3 , in a possible embodiment of the present application, the first heating component group 21 may include a charger 213, and the second heating component group 22 may include a battery module 223. The battery module 223 is disposed in the second accommodation space, and the charger 213 is electrically connected to the solar module 3 and the battery module 223 respectively to transmit the electric energy of the solar module 3 to the battery module 223.

[0058] In another possible embodiment of the present application, the battery module 223 may be disposed in the first accommodation space, and the solid-state drive 221 and the wireless communication module 222 may also be disposed in the second accommodation space. The embodiment of the present application does not limit this.

[0059] In the embodiment of the present application, a heat dissipation hole is provided on the third side wall 113. Along the second direction, the distance between the motherboard 23 and the third side wall 113 is less than the distance between the motherboard 23 and the fourth side wall 114, and the dimension of the motherboard 23 along the first direction is greater than the dimension of the motherboard 23 along the second direction. In this way, the distance between the motherboard 23 and the heat dissipation hole can be shortened in the second direction, optimizing the exhaust path of the hot air and improving the heat dissipation efficiency of the electronic device.

[0060] Referring to Figure 3 , in the embodiment of the present application, the electronic device further includes a heat pipe 16, and the heat pipe 16 is disposed on the motherboard 23 to cover the first heating component group 21. Here, the first heating component group 21 is centrally arranged on the motherboard 23, which can enable the heat pipe 16 with a rated area to cover more heating components, improving the heat dissipation effect of the electronic device.

[0061] Referring to Figure 5 , in the embodiment of the present application, the electronic device includes a rotating shaft structure 7, a rotating shaft cover 13, and a conductor 8. The rotating shaft structure 7 includes a first rotating shaft and a second rotating shaft that are hinged to each other. The first rotating shaft is connected to the first housing 11, and the second rotating shaft is connected to the second housing 12, so that the first housing 11 and the second housing 12 are rotatably connected. The rotating shaft cover 13 is disposed around the circumference of the rotating shaft structure 7. At least one of the first rotating shaft and the second rotating shaft has a groove 71. The groove 71 and the rotating shaft cover 13 enclose a wiring cavity. One end of the conductor 8 is electrically connected to the solar module 3, and the other end of the conductor 8 is electrically connected to the heating component through the wiring cavity to transmit electric energy to the heating component. Here, the first housing 11 and the second housing 12 are rotatably connected through the rotating shaft structure 7. At least one of the first rotating shaft and the second rotating shaft in the rotating shaft structure 7 has a groove 71, which can provide an accommodation space for the arrangement of the conductor 8. In this way, the reserved space between the rotating shaft cover 13 and the rotating shaft structure 7 can be reduced, so that the volume of the rotating shaft cover 13 is reduced. The rotating shaft cover 13 is an external structure at the rotating shaft structure 7, and its size directly determines the thickness at the rotating shaft structure 7. Therefore, the reduction of the volume of the rotating shaft cover 13 can reduce the thickness of the folding area of the electronic device.

[0062] In the embodiment of the present application, the groove 71 may be provided only on the first rotating shaft, or only on the second rotating shaft, or may be provided on both the first rotating shaft and the second rotating shaft at the same time. The embodiment of the present application does not limit this.

[0063] Referring to Figure 6 , in the embodiment of the present application, the electronic device further includes a first heat insulation layer 14 and a second heat insulation layer 15. Along the thickness direction of the first housing 11, the first heat insulation layer 14 and the second heat insulation layer 15 are respectively disposed on opposite sides of the heating component. In this way, on the one hand, the heat generated by the heating component can be reduced from being transferred to the outer surface of the first housing 11, avoiding the user feeling hot when touching, and improving the user experience; on the other hand, the first heat insulation layer 14 and the second heat insulation layer 15 can force the heat to be dissipated through a designed heat dissipation path, avoiding heat dispersion, and helping to improve the heat dissipation efficiency of the electronic device.

[0064] Referring to Figure 12, in the embodiments of the present application, the electronic device further includes components that operate powered by a power supply, and the electric energy of the solar module 3 is transmitted to the components. Here, the components that operate powered by a power supply are the non-energy storage components 24. The non-energy storage components 24 refer to electronic components or modules that do not have energy storage components themselves and require an external power supply to provide electric energy to operate normally, such as the central processing unit 211, the graphics processing unit 212, the solid-state drive 221, etc. The electric energy of the solar module 3 is transmitted to the non-energy storage components 24. On the one hand, the energy storage components and related control circuits can be omitted, reducing the complexity and volume of the system; on the other hand, the solar module 3 directly supplies power to the non-energy storage components 24, reducing the loss of energy during the energy storage and release processes and improving the energy utilization efficiency.

[0065] In the embodiments of the present application, the electronic components 2 in the electronic device may not include the battery module 223, and the solar module 3 directly transmits electric energy to the non-energy storage components 24; or, referring to Figure 12 , the electronic components 2 in the electronic device may include both the battery module 223 and the non-energy storage components 24 at the same time. The solar module 3 is electrically connected to the battery module 223 and the non-energy storage components 24 respectively to transmit electric energy to the battery module 223 and the non-energy storage components 24 respectively.

[0066] In another possible embodiment of the present application, referring to Figure 12 , a switch component 25 may also be provided between the solar module 3 and the battery module 223. When the power generation of the solar module 3 is large, the switch component 25 is closed, and the solar module 3 transmits electric energy to both the battery module 223 and the non-energy storage components 24 at the same time; when the power generation of the solar module 3 is small, the switch component 25 is opened, and the solar module 3 only transmits electric energy to the non-energy storage components 24.

[0067] Referring to Figure 13 , in the embodiments of the present application, the electronic components 2 include a display component 5 disposed in the second housing 12. The display component 5 has a first display area 51, a second display area 52, and a third display area 53. The first display area 51 is configured to display the total power transmission of the solar module 3, the second display area 52 is configured to display the corresponding reduction in carbon emissions of the total power transmission, and the third display area 53 is configured to display the power transmission efficiency of the solar module 3 during the target time period.

[0068] Referring to Figure 14, in the embodiments of the present application, the display component 5 can be electrically connected to the charger 213 through the Embedded Controller (EC) 214 and the Central Processing Unit 211. Here, the charger 213 can monitor the power transmission amount (such as current, voltage, power) and power transmission efficiency in real time, and transmit the data to the embedded controller 214. After receiving the data from the charger 213, the embedded controller 214 processes the data and transmits the processed data to the central processing unit 211, and the central processing unit 211 transmits the received data to the display component 5 for display.

[0069] In the embodiments of the present application, the first display area 51 can display the total power transmission amount of the solar module 3, that is, the total power generation amount of the solar module 3 during the use of the electronic device. In this way, on the one hand, it can enable users to intuitively understand the power generation data, enhance the user's sense of control over the electronic device, and improve the user experience; on the other hand, it can enhance the user's energy conservation awareness and is conducive to green development. In addition, the first display area 51 can also be configured to display a network community, where users can display the total power generation amount of the solar module 3 of their own devices through the network community and rank the total power generation amount of the solar module 3 of the devices of community users through the network community, further improving the user experience and interest.

[0070] In the embodiments of the present application, the second display area 52 is configured to display the carbon emission reduction amount corresponding to the total power transmission amount. In this way, by calculating the carbon emission reduction amount corresponding to the solar power generation amount, the abstract power generation data can be converted into specific environmental benefit indicators to help users understand the actual contribution of solar power generation to mitigating climate change. There are various possible forms of expression for the carbon emission reduction amount corresponding to the total power transmission amount. For example, the carbon emission reduction amount corresponding to the current power generation amount can be directly displayed by a number; or, based on the correspondence between the carbon emission reduction amount corresponding to the current power generation amount and the amount of carbon dioxide absorbed by trees, the carbon emission reduction amount corresponding to the current power generation amount can be converted into the number of trees planted, which can intuitively show the positive impact of solar power generation on the environment.

[0071] In the embodiments of the present application, the third display area 53 is configured to display the power transmission efficiency of the solar module 3 within a target time period. Here, the target time period can be flexibly set according to requirements, which can refer to one hour, one day, or any time period selected according to user needs, and the embodiments of the present application do not limit this. In this way, it can help users understand the short-term changes in power transmission efficiency, identify the laws of power transmission efficiency fluctuations, and optimize the user's energy use strategy. For example, increase the power consumption during the period of high power transmission efficiency and reduce the load during the period of low power transmission efficiency.

[0072] In the embodiments of the present application, there are various possible ways to arrange the display component 5 and the solar module 3 in the second housing 12. For example, along the thickness direction of the second housing 12, the display component 5 and the solar module 3 can be stacked in the second housing 12. Refer to Figure 6 , Figure 7 and Figure 8 , in a possible embodiment of the present application, a partition plate 122 can be provided in the second housing 12. Along the thickness direction of the second housing 12, the display component 5 and the solar module 3 can be respectively arranged on opposite sides of the partition plate 122, and the partition plate 122 can provide support for the display component 5 and the solar module 3. In addition, weight-reducing holes can also be provided on the partition plate 122 to reduce the weight of the electronic device.

[0073] In the embodiments of the present application, there are various possible positions for arranging the first heat-generating component group 21 on the main board 23 along the thickness direction of the first housing 11. For example, along the thickness direction of the first housing 11, the heat-generating components in the first heat-generating component group 21 can be respectively arranged on opposite sides of the main board 23. Refer to Figure 4 , in a possible embodiment of the present application, along the thickness direction of the first housing 11, the heat-generating components in the first heat-generating component group 21 are all arranged on one side of the main board 23. In this way, on the one hand, the stacking layers of the first heat-generating component group 21 and the main board 23 can be reduced, and at the same time, the length and complexity of the internal connection lines on the main board 23 can be reduced, thereby reducing the requirement for the wiring space on the main board 23 and decreasing the dimensions of the first heat-generating component group 21 and the main board 23 along the thickness direction of the first housing 11; on the other hand, the heat-generating components in the first heat-generating component group 21 are concentrated on the same side of the main board 23, and the heat dissipation structure can be more effectively utilized. For example, a heat sink can be used to fully cover the heat-generating components in the first heat-generating component group 21, improving the heat dissipation efficiency of the electronic device, and thus the number of heat dissipation structure designs can be reduced, which helps to reduce the thickness of the electronic device. In addition, the heat-generating components in the first heat-generating component group 21 are all concentrated on the same side of the main board 23, so that the first housing 11 only needs to be provided with a support structure on one side, reducing the requirement for the support structure inside the first housing 11, which helps to reduce the thickness of the first housing 11.

[0074] In the embodiments of the present application, there are various possible structural designs for the solar module 3. For example, refer to Figure 10, along the height direction of the solar module 3, the solar module 3 may include a light-transmitting layer 31, an upper electrode grid line layer 32, a solar cell layer 33, a lower electrode grid line layer 34, a reinforcing layer, and a circuit board layer 37. Here, the main function of the light-transmitting layer 31 is to protect the internal solar cell layer 33 from physical damage (such as scratches and impacts) and environmental erosion (such as rain and dust). The light-transmitting layer 31 needs to have a high light transmittance. For example, tempered glass or polymer film is used to ensure that as much sunlight as possible can reach the solar cell layer 33. The upper electrode grid line layer 32 and the lower electrode grid line layer 34 are respectively located at the top and bottom of the solar cell layer 33 and form ohmic contacts with the top and bottom of the solar cell layer 33 to efficiently collect and export the current generated by the solar cell layer 33 under illumination. The circuit board layer 37 is electrically connected to the upper and lower electrode grid lines 34 by welding or conductive adhesive to form an electrical path and connect multiple solar cells into a circuit. The reinforcing layer is an auxiliary layer between the lower electrode grid line layer 34 and the circuit board layer 37, which is used to improve the mechanical strength and reliability of the connection between the two.

[0075] Referring to Figure 12 , in a possible embodiment of the present application, the solar module 3 includes a light-transmitting layer 31, a solar cell layer 33, and a busbar layer 35. Along the height direction of the solar module 3, the light-transmitting layer 31 and the busbar layer 35 are respectively arranged on opposite sides of the solar cell layer 33. The electric energy generated by the solar cell layer 33 is collected by the busbar layer 35 and then transmitted to the heating component. Here, the busbar layer 35 may include an electrode grid line layer for collecting and exporting the current generated by the solar cell layer 33 under illumination. The light-transmitting layer 31 and the busbar layer 35 are respectively arranged on opposite sides of the solar cell layer 33. On the one hand, it can make the side of the solar cell layer 33 facing the light-transmitting layer 31 unobstructed, so that the incident light can be absorbed by the solar cell to the greatest extent, improving the photoelectric conversion efficiency of the solar module 3. On the other hand, no electrode grid line layer is arranged on the side of the solar cell layer 33 facing the light-transmitting layer 31, which can reduce the amount of packaging material used and the thickness of the packaging layer, making the solar module 3 thinner and lighter.

[0076] In the embodiment of the present application, the solar cell layer 33 includes a plurality of solar cell chips 331, and the busbar layer 35 includes a plurality of parallel-connected busbar branches. The plurality of solar cell chips 331 are evenly distributed on the plurality of busbar branches. Here, the plurality of solar cell chips 331 are evenly distributed on the plurality of busbar branches. On the one hand, it can balance the current output and avoid overloading of a single busbar branch. On the other hand, it helps to optimize the current distribution and thermal management, so that each solar cell chip 331 can operate in the best working state and improve the energy conversion efficiency.

[0077] In the embodiments of the present application, the number of solar cells 331 in the solar cell layer 33 has multiple possibilities. For example, the number of solar cells 331 in the solar cell layer 33 can be 36, or 84, or 100. The embodiments of the present application do not limit this.

[0078] In the embodiments of the present application, along the height direction of the solar module 3, antireflection passivation films (such as silicon nitride films, titanium dioxide films, silicon dioxide films, etc.) can be attached to the opposite sides of the solar cell layer 33, which can reduce reflection loss and surface recombination loss and improve the photoelectric conversion efficiency of the solar cell layer 33.

[0079] In the embodiments of the present application, the number of solar cells 331 and the connection manner between the solar cells 331 are related to the conversion rate of the charger 213. The conversion rate (output efficiency) of the charger 213 refers to the ratio of the charger 213 converting input electrical energy into output electrical energy. When designing the number of solar cells 331 and the connection manner between the solar cells 331, referring to Figure 15 , the PI curve ((Power-Input curve) of the charger 213 can be obtained through experiments first. In the figure, the horizontal axis is the input current and the vertical axis is the output efficiency. The curves of different colors in the figure respectively represent the changes in the output efficiency of the charger 213 under different voltages. Among them, the blue line represents the change in the output power of the charger 213 when the voltage is 11 volts; the red line represents the change in the output power of the charger 213 when the voltage is 9 volts; the gray line represents the change in the output power of the charger 213 when the voltage is 6 volts; the yellow line represents the change in the output power of the charger 213 when the voltage is 4 volts. It can be seen that when the input current is 0.9 A and the input voltage is 9 volts, the output efficiency of the charger 213 can reach 95%. Then, according to the target of an input current of 0.9 A and an input voltage of 9 volts, the number of solar cells 331 and the connection manner between the solar cells 331 are designed. For example, 84 solar cells 331 are used, the output voltage of each solar cell 331 is 0.524 volts, and the output current is 0.225 A. The 84 solar cells 331 are evenly distributed on 4 parallel branches.

[0080] In the embodiments of the present application, for the convenience of installing the solar module 3, when the solar module 3 is installed in the second housing 12, a certain gap is reserved between the edge of the solar cell layer 33 in the solar module 3 and the side wall of the second housing 12, and this gap is opposite to the light-transmitting layer 31 in the solar module 3. To avoid the exposure of this gap, dark printing can be done in the area corresponding to the edge of the solar cell layer 33 and the side wall of the second housing 12 to improve the aesthetics of the electronic device.

[0081] The above are only the preferred embodiments of the present invention and are not intended to limit the protection scope of the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. An electronic device, comprising: A housing, the housing comprising a first housing and a second housing rotatably connected, the second housing having a protrusion on a side facing away from the first housing, and a mounting space formed in the protrusion; A solar module, the solar module is arranged in the second housing, the solar module includes a plurality of branches arranged in parallel, each branch includes a plurality of the solar cells, and the solar module has a connection path with the electronic components in the electronic device, so that the solar module transmits electrical energy to the electronic components; A functional component is disposed in the second shell, and at least a portion of the functional component is located in the installation space.

2. The electronic device according to claim 1, the electronic component also includes a heat-generating component arranged in the first shell, the heat-generating component includes a first heat-generating component group, a second heat-generating component group and a mainboard, along the thickness direction of the first shell, the size of the first heat-generating component group is smaller than the size of the second heat-generating component group, the first heat-generating component group is arranged on the mainboard, and along the thickness direction of the first shell, the second heat-generating component group and the mainboard are offset.

3. The electronic device according to claim 2, the first shell has a first side wall and a second side wall that are oppositely arranged along a first direction, the first direction is perpendicular to the thickness direction of the first shell, the distance between the mainboard and the first side wall is smaller than the distance between the mainboard and the second side wall, and along the first direction, a first accommodating space is formed between the mainboard and the first side wall for accommodating the second heat-generating component group.

4. The electronic device according to claim 3, the first shell has a third side wall and a fourth side wall arranged opposite to each other along the second direction, the first direction, the second direction and the thickness direction of the first shell are perpendicular to each other, the first shell is rotatably connected to the second shell through the third side wall, and along the second direction, a second accommodating space is formed between the mainboard and the fourth side wall for accommodating the second heat-generating component group.

5. The electronic device according to claim 4, wherein the third side wall is provided with heat dissipation holes, and along the second direction, the distance between the mainboard and the third side wall is smaller than the distance between the mainboard and the fourth side wall, and the size of the mainboard along the first direction is larger than the size of the mainboard along the second direction. 6 . The electronic device according to claim 2 , further comprising a vapor chamber, wherein the vapor chamber is disposed on the main board to cover the first heat generating component group.

7. The electronic device according to claim 2 comprises a hinge structure, a hinge cover and a conductor, the hinge structure comprises a first hinge and a second hinge, the first hinge is connected to the first shell, the second hinge is connected to the second shell, so that the first shell and the second shell are rotatably connected, the hinge cover is arranged around the circumference of the hinge structure, at least one of the first hinge and the second hinge has a groove, the groove and the hinge cover together form a wiring cavity, one end of the conductor is electrically connected to the solar module, and the other end of the conductor is electrically connected to the heating component via the wiring cavity to transmit electrical energy to the heating component.

8. The electronic device according to any one of claims 1 to 7, further comprising a component that operates by power supply, and the electric energy of the solar module is transmitted to the component.

9. An electronic device according to any one of claims 1-7, wherein the electronic component includes a display component arranged in the second shell, the display component has a first display area, a second display area and a third display area, the first display area is configured to display the total power transmission of the solar module, the second display area is configured to display the carbon emission reduction corresponding to the total power transmission, and the third display area is configured to display the power transmission efficiency of the solar module to the electronic component within a target time period.

10. An electronic device according to any one of claims 1-7, wherein the solar module comprises a light-transmitting layer, a solar cell layer and a busbar layer, and along the height direction of the solar module, the light-transmitting layer and the busbar layer are respectively arranged on opposite sides of the solar cell layer, and the electric energy generated by the solar cell layer is collected by the busbar layer and transmitted to the heating component.

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