Inductor component

Abstract

Provided is an inductor component capable of improving inductance acquisition efficiency. The inductor component includes: a green body including a first main surface and a second main surface facing each other; a coil, at least a portion of which is provided inside the body, and which is wound in a spiral shape along an axis; and a first external electrode and a second external electrode that are provided outside the body, are electrically connected to the coil, and are disposed such that the axis of the coil is parallel to the first main surface, the coil including: a plurality of first coil wirings that are provided on the first main surface side with respect to the axis, and that are arranged along the axis on a plane parallel to the first main surface; a plurality of second coil wirings provided on the second main surface side with respect to the axis and arranged along the axis on a plane parallel to the second main surface; a plurality of first through wirings extending from the first coil wiring toward the second coil wiring and arranged along the axis; and a plurality of second through wirings extending from the first coil wiring toward the second coil wiring, provided on the opposite side to the first through wiring with respect to the axis, arranged along the axis, and constituting at least a portion of a spiral shape by sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring. The plurality of first coil wirings include an end-most coil wiring located at an end-most position on one side in the axial direction, and the end-most coil wiring has an upper surface located on a first direction side from the second main surface side toward the first main surface side, and an end-most coil wiring located on a second direction side toward the first main surface side when viewed from a direction orthogonal to the first main surface. The first external electrode includes a first side surface and a second side surface located on both sides of a center line along the extension direction of the end coil wiring, and a first portion in contact with at least a portion of the first side surface, a second portion in contact with at least a portion of the upper surface, and a third portion in contact with at least a portion of the second side surface. The first portion, the second portion, and the third portion successively form a protruding portion protruding toward the first direction side.

Description

Technical Field

[0001] The present disclosure relates to an inductor component. Background Art

[0002] Conventionally, as an inductor component, there is a component described in Japanese Patent No. 6652280 (Patent Document 1). The inductor component has a green body, a coil provided in the green body and wound along an axial direction, and a first external electrode and a second external electrode provided on the green body and electrically connected to the coil.

[0003] The coil has a plurality of coil patterns laminated along the axis. The coil patterns adjacent to each other in the axial direction are connected via a conductive through-hole. The coil pattern has a wiring portion extending in a direction orthogonal to the axis, and a pad portion provided at an end of the wiring portion and connected to the conductive through-hole. In order to improve the connectivity between the pad portion and the conductive through-hole, the width of the pad portion is wider than the width of the wiring portion.

[0004] Patent Document 1: Japanese Patent No. 6652280

[0005] However, in the inductor component as described above in the prior art, since the width of the pad portion is wider than the width of the wiring portion, a part of the pad portion is located on the inner side in the radial direction of the coil compared with the wiring portion. Therefore, the inner diameter of the coil becomes smaller, and the acquisition efficiency of the inductance is not necessarily high. Summary of the Invention

[0006] Therefore, the present disclosure provides an inductor component capable of improving the acquisition efficiency of inductance.

[0007] In order to solve the above problems, an inductor component according to an aspect of the present disclosure includes:

[0008] A green body including a first main surface and a second main surface facing each other;

[0009] A coil, at least a part of which is provided inside the green body and wound in a spiral shape along an axis; and

[0010] A first external electrode and a second external electrode, provided outside the green body and electrically connected to the coil,

[0011] The axis of the coil is arranged parallel to the first main surface,

[0012] The coil includes:

[0013] A plurality of first coil wirings, provided on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface;

[0014] A plurality of second coil wirings are provided on the second main surface side with respect to the above-mentioned axis and are arranged along the above-mentioned axis in a plane parallel to the second main surface;

[0015] A plurality of first through wirings extend from the first coil wiring toward the second coil wiring and are arranged along the above-mentioned axis; and

[0016] A plurality of second through wirings extend from the first coil wiring toward the second coil wiring, are provided on the side opposite to the first through wiring with respect to the above-mentioned axis, and are arranged along the above-mentioned axis,

[0017] By sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring in this order, at least a part of the spiral shape is formed.

[0018] The plurality of first coil wirings include a most-terminal coil wiring located at one end of the above-mentioned axis.

[0019] The most-terminal coil wiring has an upper surface on the first direction side facing from the second main surface side toward the first main surface side, and a first side surface and a second side surface that are located on both sides of a center line along the extending direction of the most-terminal coil wiring when viewed from a direction orthogonal to the first main surface.

[0020] The first external electrode includes a first part that contacts at least a part of the first side surface, a second part that contacts at least a part of the upper surface, and a third part that contacts at least a part of the second side surface. The first part, the second part, and the third part are sequentially continuous to form a convex portion that protrudes toward the first direction side.

[0021] According to the above method, the coil includes a first coil wiring, a first through wiring, a second coil wiring, and a second through wiring. By sequentially connecting the first coil wiring, the first through wiring, the second coil wiring, and the second through wiring, at least a part of the spiral shape is formed. Therefore, the inner diameter of the coil can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0022] Moreover, since the first external electrode has a convex portion that protrudes toward the first direction side, the surface area is increased compared to the case where there is no convex portion and it is flat. For example, the fixing strength with connection components such as solder can be improved. In addition, the convex portion of the first external electrode contacts the most-terminal coil wiring, and the first external electrode is directly connected to the most-terminal coil wiring. Thus, the DC resistance (Rdc) can be reduced compared to the case where the first external electrode is connected to the most-terminal coil wiring through, for example, via wirings.

[0023] In one embodiment of the inductor component, preferably,

[0024] The thickness of the first external electrode is thinner than the thickness of the first coil wiring.

[0025] According to the above embodiment, the thickness of the inductor component can be reduced.

[0026] In one embodiment of the inductor component, preferably,

[0027] The green body contains SiO 2 .

[0028] According to the above embodiment, the green body can be provided with insulation and rigidity.

[0029] In one embodiment of the inductor component, preferably,

[0030] The first external electrode is composed of a plurality of conductive layers, and includes a conductive layer made of a material different from that of the conductive layer constituting the outermost coil wiring.

[0031] According to the above embodiment, the first external electrode can be provided with characteristics different from those of the outermost coil wiring.

[0032] In one embodiment of the inductor component, preferably,

[0033] The first external electrode further includes a bottom portion that is continuously provided from the first portion of the convex portion to the side opposite to the second portion and extends in a direction parallel to the first main surface, and a wall portion that is continuously provided from the bottom portion and extends in the first direction.

[0034] According to the above embodiment, the surface area of the first external electrode is further increased, and for example, the fixing strength with connection components such as solder can be further improved.

[0035] In one embodiment of the inductor component, preferably,

[0036] The first external electrode further includes a fourth portion that is separated from the second portion and is located on the first direction side compared to the second portion.

[0037] According to the above embodiment, since the fourth portion located on the first direction side compared to the second portion is further included, the surface area of the first external electrode is further increased, and for example, the fixing strength with connection components such as solder can be further improved.

[0038] In one embodiment of the inductor component, preferably,

[0039] The first main surface has a concave portion,

[0040] The above-mentioned concave portion has a stepped side surface.

[0041] At least a part of the above-mentioned first external electrode is in contact with the above-mentioned side surface and has a shape along the above-mentioned side surface.

[0042] According to the above-mentioned embodiment, the surface area of the first external electrode is further increased, and for example, the fixing strength with connection components such as solder can be further improved.

[0043] Preferably, in one embodiment of the inductor component,

[0044] It further includes an insulator provided on a part of the above-mentioned first main surface.

[0045] At least a part of the above-mentioned first external electrode is continuously in contact with the above-mentioned insulator, the above-mentioned first main surface, and the above-mentioned first side surface of the above-mentioned convex portion.

[0046] According to the above-mentioned embodiment, since the first external electrode can be given an uneven shape, for example, the fixing strength with connection components such as solder can be further improved.

[0047] Preferably, in one embodiment of the inductor component,

[0048] The above-mentioned first coil wiring is provided on the above-mentioned first main surface.

[0049] It further includes an insulator that covers the above-mentioned first coil wiring and has a shape along the shape of the above-mentioned first coil wiring.

[0050] At least a part of the above-mentioned first external electrode is in contact with the above-mentioned insulator and has a shape along the shape of the above-mentioned first coil wiring.

[0051] According to the above-mentioned embodiment, since at least a part of the first external electrode has a shape along the first coil wiring, the surface area of the first external electrode is further increased, and for example, the fixing strength with connection components such as solder can be further improved.

[0052] Preferably, in one embodiment of the inductor component,

[0053] It further includes an organic insulator provided on the above-mentioned first main surface.

[0054] The above-mentioned green body is an inorganic insulator, and when observed from a direction orthogonal to the above-mentioned first main surface, the organic insulator is located inside compared with the outer surface of the inorganic insulator.

[0055] According to the above-described embodiment, since there is an organic insulator, the organic insulator can be easily given fluidity. When covering the first coil wiring with the organic insulator, it is possible to easily fill the organic insulator between adjacent first coil wirings, and the insulation can be improved. In addition, since the organic insulator does not contact the outer surface of the inorganic insulator, when singulating into individual inductor components, the load applied to the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0056] Preferably, in one embodiment of the inductor component,

[0057] When viewed from a direction parallel to the above axis, the first through-wiring and the second through-wiring are not parallel.

[0058] According to the above-described embodiment, the distance between the first through-wiring and the second through-wiring can be increased, the inner diameter of the coil can be increased, and the Q value can be increased.

[0059] Preferably, in one embodiment of the inductor component,

[0060] The green body contains SiO 2 ,

[0061] The first through-wiring contains SiO 2 .

[0062] According to the above-described embodiment, the coefficient of linear expansion of the first through-wiring can be made consistent with the coefficient of linear expansion of the green body, and cracks between the first through-wiring and the green body can be suppressed.

[0063] Preferably, in one embodiment of the inductor component,

[0064] The first through-wiring includes a void portion or a resin portion.

[0065] According to the above-described embodiment, the stress caused by the difference in the coefficient of linear expansion between the first through-wiring and the green body can be absorbed by the void portion or the resin portion, and thus, the stress can be alleviated.

[0066] Preferably, in one embodiment of the inductor component,

[0067] When the first through-wiring is viewed from the direction in which the first through-wiring extends, the first through-wiring has a conductive layer on the outer peripheral side and a non-conductive layer on the inner side of the conductive layer.

[0068] According to the above-described embodiment, when used in a high-frequency band, due to the skin effect, the current mainly flows on the surface of the first through-wiring. Therefore, by providing the conductive layer on the outer peripheral side, the Q value is not reduced. In addition, by providing the non-conductive layer on the inner side, the stress can be alleviated, and the manufacturing cost due to not using a conductor can be reduced.

[0069] In a preferred embodiment of the inductor component,

[0070] The axial length of the above coil is shorter than the inner diameter of the above coil.

[0071] According to the above embodiment, since the coil length is short and the coil inner diameter is large, the Q value can be improved.

[0072] In a preferred embodiment of the inductor component,

[0073] The above first through-wiring extends in a direction orthogonal to the above first main surface,

[0074] The cross-sectional area of at least one of the both end portions in the extending direction of the above first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the above first through-wiring.

[0075] According to the above embodiment, the cross-sectional area of the end portion of the first through-wiring can be increased, and the connectivity with at least one of the first coil wiring and the second coil wiring can be improved. In addition, when forming a hole portion in the green body and filling the hole portion with a conductive material such as electroplating to form the first through-wiring in the hole portion of the green body, it is easy to fill the conductive material on the opening side of the hole portion. Moreover, since the cross-sectional area of the end portion of the first through-wiring is large and the cross-sectional area of the central portion of the first through-wiring is small, it is easy to form the first through-wiring.

[0076] In a preferred embodiment of the inductor component,

[0077] The thickness of the above coil component is 200 μm or less.

[0078] According to the above embodiment, the inductor component can be made thinner.

[0079] In a preferred embodiment of the inductor component,

[0080] When viewed from a direction orthogonal to the above first main surface, the above first external electrode and the above second external electrode are located inside compared with the outer surface of the above green body.

[0081] According to the above embodiment, since the first external electrode and the second external electrode do not contact the outer surface of the green body, when singulating into individual inductor components, the load applied to the first external electrode and the second external electrode can be reduced, and the deformation and peeling of the first external electrode and the second external electrode can be suppressed. Therefore, even if the inductor component is miniaturized, the deformation and peeling of the first external electrode and the second external electrode can be prevented.

[0082] According to the inductor component as one aspect of the present disclosure, the acquisition efficiency of inductance can be improved. Brief Description of the Drawings

[0083] Figure 1 is a schematic bottom view of the inductor component according to the first embodiment, viewed from the bottom side.

[0084] Figure 2 is Figure 1 a sectional view taken along line II-II.

[0085] Figure 3 is Figure 1 a sectional view taken along line III-III.

[0086] Figure 4 is Figure 3 an enlarged view of part A.

[0087] Figure 5A is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0088] Figure 5B is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0089] Figure 5C is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0090] Figure 5D is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0091] Figure 5E is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0092] Figure 5F is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0093] Figure 5G is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0094] Figure 5H is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0095] Figure 5I is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0096] Figure 5J is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0097] Figure 5K is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0098] Figure 5L is a schematic sectional view illustrating a method of manufacturing the inductor component.

[0099] Figure 5M It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0100] Figure 5N It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0101] Figure 5O It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0102] Figure 6A It is a cross-sectional view showing a first modification example of an inductor component.

[0103] Figure 6B It is a cross-sectional view showing a second modification example of an inductor component.

[0104] Figure 6C It is a cross-sectional view showing a third modification example of an inductor component.

[0105] Figure 6D It is a cross-sectional view showing a fourth modification example of an inductor component.

[0106] Figure 6E It is a cross-sectional view showing a fifth modification example of an inductor component.

[0107] Figure 7 It is a schematic bottom view of the inductor component of the second embodiment as viewed from the bottom side.

[0108] Figure 8 It is Figure 7 Cross-sectional view VIII-VIII of

[0109] Figure 9 It is Figure 8 An enlarged view of part A of

[0110] Figure 10A It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0111] Figure 10B It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0112] Figure 10C It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0113] Figure 10D It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0114] Figure 10E It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0115] Figure 10F It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0116] Figure 10G It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0117] Figure 10H It is a schematic cross-sectional view illustrating a method of manufacturing an inductor component.

[0118] Figure 11A It is a schematic cross-sectional view showing a first modification example of the inductor component.

[0119] Figure 11B It is a schematic cross-sectional view showing a second modification example of the inductor component.

[0120] Figure 11C It is a schematic cross-sectional view showing a third modification example of the inductor component. Detailed implementation mode

[0121] Hereinafter, the inductor component as one mode of the present disclosure will be described in detail by the illustrated implementation modes. In addition, the drawings include some schematic drawings, and there are cases where the actual dimensions and ratios are not reflected.

[0122] <First implementation mode>

[0123] Hereinafter, the inductor component 1 of the first implementation mode will be described. Figure 1 It is a schematic bottom view of observing the inductor component 1 from the bottom side. Figure 2 It is Figure 1 Cross-sectional view taken along line II-II. Figure 3 It is Figure 1 Cross-sectional view taken along line III-III. Figure 4 It is Figure 3 An enlarged view of part A. In addition, in Figure 1 , for convenience, the external electrodes are depicted by double-dashed lines. In addition, in Figure 1 , in order to easily understand the structure, the green body 10 is depicted transparently, but it may also be semi-transparent or opaque.

[0124] 1. Outline structure

[0125] The outline structure of the inductor component 1 will be described. The inductor component 1 is, for example, a surface-mounted inductor component for a high-frequency signal transmission circuit. As Figures 1 to 4 shown, the inductor component 1 includes a green body 10, a coil 110 that is disposed at least partially inside the green body 10 and wound in a spiral shape along the axis AX, and a first external electrode 121 and a second external electrode 122 that are disposed outside the green body 10 and electrically connected to the coil 110.

[0126] The green body 10 has a length, a width, and a height. The green body 10 has a first end face 100e1 and a second end face 100e2 on both end sides in the length direction, a first side face 100s1 and a second side face 100s2 on both end sides in the width direction, and a bottom face 100b and a top face 100t on both end sides in the height direction. In other words, the outer surface 100 of the green body 10 includes the first end face 100e1 and the second end face 100e2, the first side face 100s1 and the second side face 100s2, the bottom face 100b, and the top face 100t. The bottom face 100b is an example of the "first main face" described in the claims, and the top face 100t is an example of the "second main face" described in the claims.

[0127] In addition, as shown in the drawings, hereinafter, for convenience of explanation, the length direction (long side direction) of the green body 10 is set as the X direction. The direction from the first end face 100e1 toward the second end face 100e2 is set as the positive X direction, and the direction opposite to the positive X direction is set as the negative X direction. Further, the width direction of the green body 10 is set as the Y direction. The direction from the first side face 100s1 toward the second side face 100s2 is set as the positive Y direction, and the direction opposite to the positive Y direction is set as the negative Y direction. Further, the height direction of the green body 10 is set as the Z direction. The direction from the bottom face 100b toward the top face 100t is set as the positive Z direction, and the direction opposite to the positive Z direction is set as the negative Z direction. The X direction, the Y direction, and the Z direction are mutually orthogonal directions, and when arranged in the order of X, Y, and Z, they form a right-handed system. In addition, in this specification, the direction from the top face 100t side toward the bottom face 100b side is referred to as the first direction D1. The first direction D1 includes not only the direction parallel to the Z direction but also the direction inclined from the direction parallel to the Z direction. In this embodiment, the first direction D1 is the negative Z direction.

[0128] In this specification, the "outer surface 100 of the green body" including the first end face 100e1, the second end face 100e2, the first side face 100s1, the second side face 100s2, the bottom face 100b, and the top face 100t of the green body 10 does not merely mean the face facing the outer peripheral side of the green body 10, but rather the face that forms the boundary between the outside and the inside of the green body 10. In addition, the "above the outer surface 100 of the green body 10" does not refer to an absolute direction such as the vertical above defined in the gravitational direction, but rather refers to the direction toward the outside among the outside and the inside with the outer surface 100 as the boundary, based on the outer surface 100. Therefore, the "above the outer surface 100" is a relative direction determined according to the orientation of the outer surface 100. In addition, for a certain element, "above" includes not only the above separated from the element, that is, the position on the upper side of another object on the element, the upper side position separated by an interval, but also the position directly above in contact with the element (on).

[0129] The axis AX of the coil 110 is arranged to be parallel to the bottom surface 100b. The coil 110 includes a plurality of bottom wirings 11b that are arranged on the bottom surface 100b side with respect to the axis AX and are arranged along the axis AX in a plane parallel to the bottom surface 100b, a plurality of top wirings 11t that are arranged on the top surface 100t side with respect to the axis AX and are arranged along the axis AX in a plane parallel to the top surface 100t, a plurality of first through wirings 13 that extend from the bottom wirings 11b toward the top wirings 11t and are arranged along the axis AX, and a plurality of second through wirings 14 that extend from the bottom wirings 11b toward the top wirings 11t, are arranged on the side opposite to the first through wirings 13 with respect to the axis AX, and are arranged along the axis AX. The plurality of bottom wirings 11b include the outermost coil wiring 11e located on one side in the axis AX direction. In this embodiment, the two bottom wirings 11b located at both ends in the axis AX direction among the plurality of bottom wirings 11b are respectively the outermost coil wiring 11e. By sequentially connecting the bottom wirings 11b, the first through wirings 13, the top wirings 11t, and the second through wirings 14, at least a part of a spiral shape is formed.

[0130] The bottom wiring 11b is an example of the "first coil wiring" described in the claims, and the top wiring 11t is an example of the "second coil wiring" described in the claims. The axis AX refers to the intersection line of the first plane passing through the center between the bottom wiring 11b and the top wiring 11t and the second plane passing through the center between the first through wiring 13 and the second through wiring 14. In other words, the axis AX is a straight line passing through the center of the inner diameter portion of the coil 110. The axis AX of the coil 110 does not have a dimension in a direction orthogonal to the axis AX.

[0131] According to the above structure, the coil 110 includes the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14. By sequentially connecting the bottom wiring 11b, the first through wiring 13, the top wiring 11t, and the second through wiring 14, at least a part of a spiral shape is formed. Therefore, the inner diameter of the coil 110 can be increased, and the acquisition efficiency of inductance can be improved. In addition, by improving the inductance acquisition efficiency, the Q value can be increased.

[0132] Specifically, the pad portion of the conventional inductor component, the bottom surface wiring 11b and the top surface wiring 11t of the present embodiment are the "bearing portions" of the wirings (the conductive through-holes of the conventional inductor component or the first through-wiring 13 and the second through-wiring 14 of the present embodiment) that penetrate the green body, so they are shaped to extend perpendicularly to the direction in which the green body is penetrated. Here, in the structure of the conventional inductor component, since the conductive through-hole extends in the direction parallel to the axis of the coil, the pad portion extends in the direction perpendicular to the axis of the coil, and thus it is likely to form a structure that blocks the magnetic flux generated in the axial direction of the coil.

[0133] In contrast, in the present embodiment, since the first through-wiring 13 and the second through-wiring 14 extend in the direction perpendicular to the axis AX of the coil 110, the bottom surface wiring 11b and the top surface wiring 11t extend in the direction parallel to the axis AX of the coil 110. As a result, the bottom surface wiring 11b and the top surface wiring 11t are less likely to form a structure that blocks the magnetic flux generated in the direction of the axis AX. That is, in the present embodiment, a structure that is less likely to block the magnetic flux can be formed, and the inductance acquisition efficiency and Q value can be improved.

[0134] As Figure 1 and Figure 4 shown, the outermost end coil wiring 11e located on the first end face 100e1 side with respect to the center of the green body 10 in the X direction has an upper surface u located on the first direction D1 side, and a first side surface S1 and a second side surface S2 that are located on both sides with respect to the center line CL along the extending direction of the outermost end coil wiring 11e when viewed from the direction (Z direction) orthogonal to the bottom surface 100b. The first external electrode 121 includes a first portion P1 that contacts at least a part of the first side surface S1 of the outermost end coil wiring 11e, a second portion P2 that contacts at least a part of the upper surface u of the outermost end coil wiring 11e, and a third portion P3 that contacts at least a part of the second side surface S2 of the outermost end coil wiring 11e. The first portion P1, the second portion P2, and the third portion P3 are sequentially continuous to form a convex portion P that protrudes toward the first direction D1 side.

[0135] Similarly, the outermost coil wiring 11e, whose center in the X direction with respect to the green body 10 is located on the second end face 100e2 side, has an upper surface u on the first direction D1 side, and a first side surface S1 and a second side surface S2 that are located on both sides with the center line CL along the extending direction of the outermost coil wiring 11e interposed therebetween when viewed from a direction (Z direction) orthogonal to the bottom face 100b. The second external electrode 122 includes a first portion that contacts at least a part of the first side surface S1 of the outermost coil wiring 11e, a second portion that contacts at least a part of the upper surface u of the outermost coil wiring 11e, and a third portion that contacts at least a part of the second side surface S2 of the outermost coil wiring 11e. The first portion, the second portion, and the third portion are successively continuous to form a convex portion P that protrudes toward the first direction D1 side.

[0136] According to the above structure, since the first external electrode 121 and the second external electrode 122 have the convex portion P that protrudes toward the first direction D1 side, the surface area is increased compared to the case where there is no convex portion P and it is flat. For example, the fixing strength with connection components such as solder can be improved. In addition, the convex portion P of the first external electrode 121 and the second external electrode 122 contacts the outermost coil wiring 11e, and the first external electrode 121 and the second external electrode 122 are directly connected to the outermost coil wiring 11e respectively. Thereby, the DC resistance (Rdc) can be reduced compared to the case where the first external electrode 121 and the second external electrode 122 are respectively connected to the outermost coil wiring 11e through via wirings or the like.

[0137] 2. Structure of each part

[0138] (Inductor component 1)

[0139] Preferably, the volume of the inductor component 1 is 0.08 mm 3 or less, and the size of the long side of the inductor component 1 is 0.65 mm or less. The size of the long side of the inductor component 1 refers to the maximum value among the length, width, and height of the inductor component 1. In this embodiment, it refers to the length in the X direction. According to the above structure, since the volume of the inductor component 1 is small and the long side of the inductor component 1 is also short, the weight of the inductor component 1 is light. Therefore, even if the external electrodes 121 and 122 are small, the required mounting strength can be obtained. In addition, preferably, the thickness of the inductor component 1 is 200 μm or less. Thereby, the inductor component 1 can be made thin.

[0140] Specifically, the dimensions (length (X direction) × width (Y direction) × height (Z direction)) of the inductor component 1 are 0.6 mm × 0.3 mm × 0.3 mm, 0.4 mm × 0.2 mm × 0.2 mm, 0.25 mm × 0.125 mm × 0.120 mm, etc. Additionally, the width and height may not be equal, for example, it may also be 0.4 mm × 0.2 mm × 0.3 mm, etc.

[0141] (green body 10)

[0142] Preferably, the green body 10 contains SiO 2 . Accordingly, insulation and rigidity can be imparted to the green body 10. The green body 10 is composed of, for example, a glass sintered body. The glass sintered body may also contain alumina, which can further improve the strength of the green body.

[0143] For example, a glass sintered body is formed by laminating insulating layers containing multiple glasses. The lamination direction of the multiple insulating layers is the Z direction. That is, the insulating layer is in a layered form with a main surface extending in the XY plane. In addition, in the case of the green body 10, due to firing or the like, the interfaces between the multiple insulating layers may become unclear.

[0144] In addition, for example, the green body 10 may be composed of a glass substrate. The glass substrate may also be a single-layer glass substrate. Since most of the green body is glass, losses such as eddy current loss at high frequencies can be suppressed.

[0145] As Figure 4 shown, a recess C is provided on the bottom surface 100b of the green body 10. Specifically, the recess C is provided such that in each of the two outermost coil wirings 11e, the connection portion with the first external electrode 121 or the second external electrode 122 is exposed from the green body 10. The shape of the recess C when viewed from the Z direction is not particularly limited as long as the above connection portion is exposed from the green body 10, but in this embodiment, it is a rectangular shape.

[0146] (coil 110)

[0147] The coil 110 includes a plurality of bottom surface wirings 11b, a plurality of top surface wirings 11t, a plurality of first through wirings 13, and a plurality of second through wirings 14. The bottom surface wirings 11b, the first through wirings 13, the top surface wirings 11t, and the second through wirings 14 are sequentially connected to form at least a part of the coil 110 wound in the axial direction of the axis AX.

[0148] According to the above structure, since the coil 110 is a so-called spiral-shaped coil 110, in the cross-sectional area orthogonal to the axis AX, the area where the bottom surface wirings 11b, the top surface wirings 11t, the first through wirings 13, and the second through wirings 14 are parallel along the winding direction of the coil 110 can be reduced, and the stray capacitance in the coil 110 can be lowered.

[0149] Here, the spiral shape means that the number of turns of the entire coil is greater than one turn, and the number of turns of the coil in the cross-sectional area orthogonal to the axis is less than one turn. More than one turn means that in the cross-sectional area orthogonal to the axis, the wiring of the coil has a state where, when viewed from the axial direction, there are parts adjacent in the radial direction and parallel in the winding direction. Less than one turn means that in the cross-sectional area orthogonal to the axis, the wiring of the coil does not have a state where, when viewed from the axial direction, there are parts adjacent in the radial direction and parallel in the winding direction.

[0150] The bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b extends in the Y direction while being slightly inclined in the X direction. A plurality of bottom surface wirings 11b are arranged in parallel along the X direction. Here, in the photolithography process, if deformed illumination such as annular illumination or dipole illumination is used, the pattern resolution in a specific direction can be improved, and a finer pattern can be formed. According to the above structure, since the bottom surface wiring 11b extends only in one direction, by using, for example, deformed illumination in the photolithography process, a fine bottom surface wiring 11b can be formed, and the inductor component 1 can be miniaturized.

[0151] As described above, a plurality of bottom surface wirings 11b include the outermost coil wiring 11e at the outermost end on one side in the direction of the axis AX. In this embodiment, one side end of the outermost coil wiring 11e in the extending direction (in other words, the connection part with the first external electrode 121 or the second external electrode 122) is disposed in the recess C provided in the bottom surface 100b of the green body 10 and exposed from the green body 10. Specifically, one end of the two ends of the outermost coil wiring 11e in the extending direction, which is connected to the first external electrode 121 or the second external electrode 122, is disposed in the recess C and exposed from the green body 10. In addition, the entire outermost coil wiring 11e may be disposed in the recess C and exposed from the green body 10. In this case, it is preferable that the first external electrode 121 or the second external electrode 122 contacts the entire exposed surface of the outermost coil wiring 11e (in other words, the entire surface of the first side surface s1, the entire surface of the second side surface s2, and the entire surface of the upper surface u).

[0152] The top surface wiring 11t extends only in one direction. Specifically, the top surface wiring 11t has a shape extending in the Y direction. A plurality of top surface wirings 11t are arranged in parallel along the X direction. According to the above structure, since the top surface wiring 11t extends only in one direction, by using, for example, deformed illumination in the photolithography process, a fine top surface wiring 11t can be formed, and the inductor component 1 can be miniaturized.

[0153] The bottom surface wiring 11b and the top surface wiring 11t are made of a good conductor material such as copper, silver, gold, or their alloys. The bottom surface wiring 11b and the top surface wiring 11t can be either a metal film formed by electroplating, vapor deposition, sputtering, etc., or a metal sintered body formed by coating a conductor paste and sintering it. In addition, the bottom surface wiring 11b and the top surface wiring 11t can also be a multilayer structure in which multiple metal layers are stacked. Preferably, the thickness of the bottom surface wiring 11b and the top surface wiring 11t is 5 μm or more and 50 μm or less.

[0154] The first through-wiring 13 is disposed on the first side surface 100s1 side with respect to the axis AX within the through-hole V of the green body 10, and the second through-wiring 14 is disposed on the second side surface 100s2 side with respect to the axis AX within the through-hole V of the green body 10. The first through-wiring 13 and the second through-wiring 14 extend in directions orthogonal to the bottom surface 100b and the top surface 100t, respectively. Accordingly, the lengths of the first through-wiring 13 and the second through-wiring 14 can be shortened, so that the DC resistance (Rdc) can be suppressed. A plurality of first through-wirings 13 and a plurality of second through-wirings 14 are arranged in parallel along the X direction, respectively.

[0155] Preferably, the first through-wiring 13 contains SiO 2 . Accordingly, in the case where the green body 10 contains SiO 2 , the coefficient of linear expansion of the first through-wiring 13 can be made to coincide with the coefficient of linear expansion of the green body 10, and cracks between the first through-wiring 13 and the green body 10 can be suppressed. The first through-wiring 13 uses, for example, a conductive paste. The conductive material is Ag, Cu, etc. Preferably, the second through-wiring 14 also contains SiO 2 .

[0156] Preferably, at least one of the bottom surface wiring 11b, the top surface wiring 11t, the first through-wiring 13, and the second through-wiring 14 contains a void portion or a resin portion. Accordingly, the stress caused by the difference in the coefficient of linear expansion between the wiring and the green body 10 can be absorbed by the void portion or the resin portion, and the stress can be alleviated. As a method of forming the void portion, for example, a component that burns out by sintering can be used in the material of the wiring, and the void portion can be formed by sintering the wiring. As a method of forming the resin portion, for example, the resin portion can be formed by using a conductive paste in the material of the wiring.

[0157] Preferably, at least one of the bottom surface wiring 11b and the top surface wiring 11t contains SiO 2 . Accordingly, in the case where the green body 10 contains SiO 2 , the coefficient of linear expansion of the wiring can be made to coincide with the coefficient of linear expansion of the green body 10, and cracks between the wiring and the green body 10 can be suppressed.

[0158] (External electrodes 121, 122)

[0159] The first external electrode 121 is connected to the first end portion of the coil 110, and the second external electrode 122 is connected to the second end portion of the coil 110. The first external electrode 121 is disposed on the first end face 100e1 side with respect to the center of the green body 10 in the X direction so as to be exposed from the outer surface 100 of the green body 10. The second external electrode 122 is disposed on the second end face 100e2 side with respect to the center of the green body 10 in the X direction so as to be exposed from the outer surface 100 of the green body 10. As in this embodiment, when the recess C is provided on the bottom face 100b of the green body 10, the outer surface 100 of the green body 10 includes the inner face of the recess C. In addition, in this specification, when referring to the "outside of the green body", the region inside the recess C is also included in this "outside". That is, the region inside the recess C is the outside of the green body 10.

[0160] In addition, the first external electrode 121 may be continuously provided on the bottom face 100b and the first end face 100e1. Accordingly, since the first external electrode 121 is an electrode in a so-called L shape, when the inductor component 1 is mounted on the mounting substrate, solder feet can be formed on the first external electrode 121. Similarly, the second external electrode 122 may be continuously provided on the bottom face 100b and the second end face 100e2.

[0161] The first external electrode 121 has a base layer 121e1 and a plating layer 121e2 covering the base layer 121e1. The base layer 121e1 includes conductive materials such as Cu, Ni, Ti, and combinations thereof, for example. The plating layer 121e2 includes conductive materials such as Ni and Au, for example. Similarly, the second external electrode 122 has a base layer and a plating layer covering the base layer. In addition, the first external electrode 121 and the second external electrode 122 may be formed of a single-layer conductive material.

[0162] The first external electrode 121 is provided so as to cover the entire recess C provided on the bottom face 100b of the green body 10 when viewed from the Z direction. As a result, the first external electrode 121 comes into contact with the entire surface of the first side face S1 of the outermost coil wiring 11e that is exposed from the green body 10, comes into contact with the entire surface of the upper surface u of the outermost coil wiring 11e that is exposed from the green body 10, and comes into contact with the entire surface of the second side face S2 of the outermost coil wiring 11e that is exposed from the green body 10. As a result, the first external electrode 121 has a convex portion P at a position corresponding to the exposed portion of the outermost coil wiring 11e from the green body 10. The first external electrode 121 has a step difference 121s corresponding to the step difference (the first face described later) of the recess C.

[0163] Similarly, the second external electrode 122 is provided so as to cover the entirety of the recess C provided in the bottom surface 100b of the green body 10 when viewed from the Z direction. As a result, the second external electrode 122 comes into contact with the entire surface of the surface of the first side surface S1 of the most-terminal coil wiring 11e that is exposed from the green body 10, comes into contact with the entire surface of the surface of the upper surface u of the most-terminal coil wiring 11e that is exposed from the green body 10, and comes into contact with the entire surface of the surface of the second side surface S2 of the most-terminal coil wiring 11e that is exposed from the green body 10. As a result, the second external electrode 122 has a convex portion P at a position corresponding to the exposed portion of the most-terminal coil wiring 11e from the green body 10. The second external electrode 122 has a step difference 122s corresponding to the step difference of the recess C.

[0164] (Other preferred structures)

[0165] Preferably, as Figure 4 shown, the thickness t1 of the first external electrode 121 in the Z direction is thinner than the thickness t2 of the bottom surface wiring 11b in the Z direction. Here, when the first external electrode 121 is composed of multiple layers, the thickness of the first external electrode 121 refers to the thickness of all the layers. Even if the thickness of the first external electrode 121 is made thinner, the influence on the DC resistance (Rdc) is small. Therefore, according to the above structure, it is possible to reduce the thickness of the inductor component 1 while suppressing an increase in the DC resistance. More preferably, the thickness t1 of the first external electrode 121 is 1 / 2 or less of the thickness t2 of the bottom surface wiring 11b. As a result, it is possible to more effectively reduce the thickness of the inductor component 1. Similarly, the thickness of the second external electrode 122 may also be thinner than the thickness of the bottom surface wiring 11b.

[0166] Preferably, the first external electrode 121 is composed of multiple conductive layers and includes a conductive layer made of a material different from that of the conductive layer constituting the most-terminal coil wiring 11e. Specifically, for example, the most-terminal coil wiring 11e may employ a conductive layer with a relatively high conductivity such as Cu or Ag. The first external electrode 121 may employ, for example, a conductive layer with good adhesion to the most-terminal coil wiring 11e such as Ti, a conductive layer with relatively high electromigration resistance such as Ni, a conductive layer with relatively high corrosion resistance such as Au, a conductive layer with high solder wettability, and the like. According to this structure, it is possible to endow the first external electrode 121 with characteristics different from those of the most-terminal coil wiring 11e. Similarly, the second external electrode 122 may also be composed of multiple conductive layers and include a conductive layer made of a material different from that of the conductive layer constituting the most-terminal coil wiring 11e.

[0167] Preferably, the first external electrode 121 further includes a bottom portion BP1 that is continuously provided from the first portion P1 of the convex portion P toward the side opposite to the second portion P2 and extends in a direction (Y direction) parallel to the bottom surface 100b, and a wall portion WP1 that is continuously provided from the bottom portion BP1 and extends in the first direction D1. According to this structure, the surface area of the first external electrode 121 is further increased, and for example, the fixing strength with connection components such as solder can be further improved. In addition, preferably, the first external electrode 121 further includes a bottom portion BP2 that is continuously provided from the third portion P3 of the convex portion P toward the side opposite to the second portion P2 and extends in a direction parallel to the bottom surface 100b, and a wall portion WP2 that is continuously provided from the bottom portion BP2 and extends in the first direction D1. According to this structure, the surface area of the first external electrode 121 is further increased, and for example, the fixing strength with connection components such as solder can be further improved. Similarly, in the second external electrode 122, it may also further include a bottom portion that is continuously provided from at least one of the first portion and the third portion of the convex portion P toward the side opposite to the second portion and extends in a direction parallel to the bottom surface 100b, and a wall portion that is continuously provided from the bottom portion and extends in the first direction D1.

[0168] Preferably, the first external electrode 121 further includes a fourth portion P4 that is separated from the second portion P2 and is located on the first direction D1 side compared to the second portion P2. Specifically, the fourth portion P4 is a portion of the first external electrode 121 provided on the bottom surface 100b except for the concave portion C. According to this structure, since the fourth portion P4 is further included, the surface area of the first external electrode 121 can be further increased. In addition, since the fourth portion P4 is further included, the shape of the first external electrode 121 between the second portion P2 and the fourth portion P4 can be a concave shape. And since the fourth portion P4 is located on the first direction D1 side compared to the second portion P2, compared with the case where the fourth portion P4 is located on the opposite side (positive Z direction side) of the first direction D1 compared to the second portion P2, the depth of the above concave shape can be increased. As a result, the surface area of the first external electrode 121 can be increased more effectively, and for example, the fixing strength with connection components such as solder can be further improved. Similarly, the second external electrode 122 may also further include a fourth portion that is separated from the second portion and is located on the first direction D1 side compared to the second portion.

[0169] Preferably, the bottom surface 100b has a recess C, and the recess C has a stepped side surface CS. At least a part of the first external electrode 121 is in contact with the side surface CS and has a shape along the side surface CS. Specifically, the side surface CS has a first surface f1 extending along the Z direction, a second surface f2 extending along the Z direction, and a third surface f3 connecting the first surface f1 and the second surface f2 and extending along the XY plane. The first surface f1 is disposed on the opening side of the recess C, and the second surface f2 is disposed on the bottom surface side of the recess C. The width of the first surface f1 in the Y direction is larger than the width of the second surface f2 in the Y direction. The width of the first surface f1 in the X direction is larger than the width of the second surface f2 in the X direction. The first surface f1, the second surface f2, and the third surface f3 constitute the stepped shape of the side surface CS. The number of steps of the stepped shape is not particularly limited. According to this structure, the surface area of the first external electrode 121 can be further increased, for example, the fixing strength with a connecting member such as solder can be further improved. Similarly, at least a part of the second external electrode 122 may also be in contact with the stepped side surface of the recess C and have a shape along the side surface.

[0170] (Method for manufacturing the inductor component 1)

[0171] Next, use Figures 5A to 5O to describe the manufacturing method of the inductor component 1. Figures 5A to 5G , Figure 5I , Figure 5K and Figure 5M are diagrams corresponding to the II-II sectional area of Figure 1 . Figure 5H , Figure 5J , Figure 5L , Figure 5N and Figure 5O are diagrams corresponding to the III-III sectional area of Figure 1 .

[0172] As Figure 5A shown, the first insulating layer 1011 is provided on the base substrate 1000 by printing. The material of the base substrate 1000 is, for example, a glass substrate, a silicon substrate, an alumina substrate, etc., and the material of the first insulating layer 1011 is, for example, a resin such as epoxy resin or polyimide, or an inorganic insulating film such as SiO or SiN.

[0173] As Figure 5B shown, the second insulating layer 1012 is provided on the first insulating layer 1011 by printing. A groove 1012a is provided in the second insulating layer 1012. At this time, the groove 1012a is formed, for example, by a photolithography process. In addition, the groove may also be formed as a printing pattern from the beginning.

[0174] As Figure 5CAs shown, the top surface conductor layer 1011t is provided on the groove 1012a by printing. The material of the top surface conductor layer 1011t is, for example, Ag, Cu, Au, Al, an alloy containing at least one of these elements, solder paste, etc. At this time, for example, the top surface conductor layer 1011t is formed to remain only on the groove 1012a as a printed pattern. In addition, after printing the top surface conductor layer 1011t onto the second insulating layer 1012, the top surface conductor layer 1011t can be made to remain only on the groove 1012a through a photolithography process.

[0175] As Figure 5D shown, the third insulating layer 1013 is provided on the second insulating layer 1012 by printing. The first groove 1013a and the second groove 1013b are provided in the third insulating layer 1013. The first groove 1013a and the second groove 1013b are formed by the same method as Figure 5B the same.

[0176] As Figure 5E shown, the first through-conductor layer 1131 of the first layer is provided in the first groove 1013a by printing, and the second through-conductor layer 1141 of the first layer is provided in the second groove 1013b by printing. The first through-conductor layer 1131 of the first layer and the second through-conductor layer 1141 of the first layer are formed by the same method as Figure 5C the same.

[0177] Repeating the above process, as Figure 5F shown, the fourth insulating layer 1014 is provided on the third insulating layer 1013, and the first through-conductor layer 1132 of the second layer and the second through-conductor layer 1142 of the second layer are respectively provided on two grooves provided in the fourth insulating layer 1014. And, the fifth insulating layer 1015 is provided on the fourth insulating layer 1014, and the first through-conductor layer 1133 of the third layer and the second through-conductor layer 1143 of the third layer are respectively provided on two grooves provided in the fifth insulating layer 1015.

[0178] As Figure 5G shown, the sixth insulating layer 1016 is provided on the fifth insulating layer 1015, and the bottom surface conductor layer 1011b is provided in the groove provided in the sixth insulating layer 1016. The material of the bottom surface conductor layer 1011b is the same as that of the top surface conductor layer 1011t. Figure 5H is the same process as Figure 5G the same. As Figure 5H shown, the groove 1016a is provided in the sixth insulating layer 1016, and the bottom surface conductor layer 1011b is provided in the groove 1016a. The groove 1016a becomes a part of the recess C.

[0179] As Figure 5IAs shown, a seventh insulating layer 1017 is provided on the sixth insulating layer 1016. Next, a groove is formed in the seventh insulating layer 1017 to expose at least the portions of the bottom conductor layer 1011b that are connected to the first and second external electrodes. Figure 5J is the same process as Figure 5I As shown in Figure 5J a groove 1017a is formed in the seventh insulating layer 1017. The groove 1017a forms part of the recess C. In this embodiment, the size of the opening of the groove 1017a is larger than the size of the opening of the groove 1016a. Thereby, a stepped shape can be formed on the side surface of the recess C.

[0180] As shown in Figure 5K the entire laminate is sintered in a furnace at a high temperature (e.g., 500 °C or higher). The first to seventh insulating layers 1011 - 1017 are sintered to form a green body 10, the top conductor layer 1011t is sintered to form the top wiring 11t, the bottom conductor layer 1011b is sintered to form the bottom wiring 11b, the first through-conductor layers 1131 - 1133 of the first to third layers are sintered to form the first through-wiring 13, and the second through-conductor layers 1141 - 1143 of the first to third layers are sintered to form the second through-wiring 14. Therefore, sintering the insulating layers can improve the strength. Additionally, by sintering the conductor layers, unnecessary resin components contained in the conductor layers can be volatilized, and the conductor materials contained in the conductor layers are melted to achieve a high conductivity. The base substrate 1000 can either be peeled off by surface decomposition during sintering, or can be removed mechanically by grinding or the like before and after sintering, or can be removed chemically by etching or the like before and after sintering. Figure 5L is the same process as Figure 5K As shown in Figure 5L by the above sintering, a green body 10 with a recess C provided on the bottom surface 100b is formed.

[0181] As shown in Figure 5M for example, a conductive material such as Cu, Ni, Ti, and their combinations is formed into a film by sputtering, and etched into a specified shape by photolithography to form a base layer 121e1. The specified shape is such that the base layer 121e1 covers at least the inner surface of the recess C. Next, an electroless plating layer 121e2 is formed to cover the base layer 121e1. The electroless plating layer 121e2 is, for example, Ni / Au. Through the above, the external electrodes 121 and 122 are formed. Figure 5N is the same process as Figure 5M As shown in Figure 5NAs shown, the first external electrode 121 is in contact with the exposed portion of the outermost coil wiring 11e from the green body 10, and a convex portion P is formed on the first external electrode 121. Although not shown, the second external electrode 122 is in contact with the exposed portion of the outermost coil wiring 11e from the green body 10, and a convex portion P is formed on the second external electrode 122.

[0182] As Figure 5O shown, singulation is performed along the cutting line D. Thus, as Figure 3 shown, the inductor component 1 is manufactured.

[0183] 3. Modified Example

[0184] (First Modified Example)

[0185] Figure 6A is a diagram corresponding to the III-III sectional area of the first modified example of the inductor component and Figure 1 of. As Figure 6A shown, in the inductor component 1A of the first modified example, the green body 10 is not provided in the region on the positive Y-direction side and the negative Y-direction side compared to the portion of the outermost coil wiring 11e exposed from the green body 10. Accordingly, the first external electrode 121 can be easily brought into contact with the bottom surface 100b of the green body 10.

[0186] (Second Modified Example)

[0187] Figure 6B is a diagram corresponding to the II-II sectional area of the second modified example of the inductor component and Figure 1 of. As Figure 6B shown, in the inductor component 1B of the second modified example, when viewed in the direction parallel to the axis AX of the coil 110, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved.

[0188] Specifically, the first through-wiring 13 and the second through-wiring 14 are bent at the center such that the distance therebetween becomes wider toward the center in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands toward the outside in the radial direction of the coil 110 toward the center in the Z direction. Further, the first through-wiring 13 and the second through-wiring 14 each have a stepped shape along the Z direction. With the above structure, when the first through-wiring 13 and the second through-wiring 14 are formed by laminating a plurality of conductor layers, respectively, the first through-wiring 13 and the second through-wiring 14 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0189] (Third Modified Example)

[0190] Figure 6C This is a diagram corresponding to the II-II sectional area of a third modified example of an inductor component, which is Figure 1 as shown. In the inductor component 1C of the third modified example, when viewed from a direction parallel to the axis AX of the coil 110, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110 can be increased, and the Q value can be improved. Figure 6C Specifically, the first through-wiring 13 and the second through-wiring 14 are inclined such that the distance therebetween is wider on the side of the top surface wiring 11t in the Z direction. In other words, the first through-wiring 13 and the second through-wiring 14 each have a shape that expands more toward the outer side in the radial direction of the coil 110 as it goes further in the Z direction on the top surface wiring 11t. Thus, when the coil 110 is viewed from the direction of the axis AX, it has a trapezoidal shape. With the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a straight line to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0191]

[0192] (Fourth Modified Example)

[0193] Figure 6D This is a diagram corresponding to the II-II sectional area of a fourth modified example of an inductor component, which is Figure 1 as shown. In the inductor component 1D of the fourth modified example, compared with the inductor component 1B of the second modified example shown in Figure 6D it includes a first coil 110A and a second coil 110B. Figure 6B In the first coil 110A, when viewed from a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0194]

[0195] Specifically, the first through-wiring 13 has the same structure as the first through-wiring 13 of the inductor component 1B of the second modified example. On the other hand, the second through-wiring 14 has a straight shape parallel to the Z direction. In other words, the first through-wiring 13 is bent at the center such that the distance between the first through-wiring 13 and the second through-wiring 14 is wider at the center in the Z direction. The first through-wiring 13 has a stepped shape along the Z direction. With the above structure, when the first through-wiring 13 is formed by laminating a plurality of conductor layers, the first through-wiring 13 can be easily formed in a stepped shape by laminating the conductor layers of each layer with a stagger.

[0196] In the second coil 110B, when viewed in a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be widened, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0197] Specifically, the second through-wiring 14 has the same structure as the second through-wiring 14 of the inductor component 1B of the second modification. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is bent at the center such that the interval between the first through-wiring 13 and the second through-wiring 14 is wider at the center in the Z direction. The second through-wiring 14 has a stepped shape along the Z direction. According to the above structure, in the case where the second through-wiring 14 is formed by laminating a plurality of conductor layers, the second through-wiring 14 can be easily formed into a stepped shape by laminating the conductor layers of each layer in a staggered manner.

[0198] (Fifth modification)

[0199] Figure 6E is a diagram showing the II-II sectional area corresponding to the fifth modification of the inductor component Figure 1 As shown in Figure 6E In the inductor component 1E of the fifth modification, compared with the inductor component 1C of the third modification shown in Figure 6C it includes the first coil 110A and the second coil 110B.

[0200] In the first coil 110A, when viewed in a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be widened, the inner diameter of the coil 110A can be increased, and the Q value can be improved.

[0201] Specifically, the first through-wiring 13 has the same structure as the first through-wiring 13 of the inductor component 1C of the third modification. On the other hand, the second through-wiring 14 has a linear shape parallel to the Z direction. In other words, the first through-wiring 13 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 is wider on the top surface wiring 11t side in the Z direction. According to the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed into a linear shape to shorten them, and the DC resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0202] In the second coil 110B, when viewed in a direction parallel to the axis AX, the first through-wiring 13 and the second through-wiring 14 are not parallel. Accordingly, the distance between the first through-wiring 13 and the second through-wiring 14 can be increased, the inner diameter of the coil 110B can be increased, and the Q value can be improved.

[0203] Specifically, the second through-wiring 14 has the same structure as the second through-wiring 14 of the inductor component 1C of the third modified example. On the other hand, the first through-wiring 13 has a linear shape parallel to the Z direction. In other words, the second through-wiring 14 is inclined such that the interval between the first through-wiring 13 and the second through-wiring 14 is wider on the top surface wiring 11t side in the Z direction. According to the above structure, the first through-wiring 13 and the second through-wiring 14 can be formed in a linear shape, and the resistance of the first through-wiring 13 and the second through-wiring 14 can be reduced.

[0204] <Second Embodiment>

[0205] Figure 7 It is a schematic bottom view of a second embodiment of an inductor component as viewed from the bottom side. Figure 8 is Figure 7 the VIII-VIII cross-sectional view. Figure 9 is Figure 8 an enlarged view of part A of. In Figure 7 , for convenience, the insulating layer is omitted and the external electrodes are depicted by a double-dashed line. In addition, in Figure 7 , the green body 10 is depicted transparently in order to easily understand the structure. The second embodiment is mainly different from the first embodiment in the position of the axis of the coil, the orientation of the through-wiring, the material of the green body, the point of providing the insulator, and the structure of the external electrodes. The following describes these different structures. Other structures are the same as those of the first embodiment, and the description thereof is omitted.

[0206] 1. Structure of Each Part

[0207] (Inductor Component 1F)

[0208] As Figure 7 shown, in the inductor component 1F, the axis AX of the coil 110 is perpendicular to the X direction. Specifically, the axis AX is parallel to the Y direction and passes through the center of the green body 10 in the X direction. Accordingly, the interference of the first external electrode 121 and the second external electrode 122 with the magnetic flux of the coil 110 can be reduced, and the acquisition efficiency of the inductance can be improved.

[0209] The length of the coil 110 in the direction of the axis AX is shorter than the inner diameter of the coil 110. Accordingly, the coil length becomes shorter and the inner diameter of the coil becomes larger, so that the Q value can be improved. The inner diameter of the coil means the equivalent circle diameter based on the minimum area of the region surrounded by the coil 110 when viewed through in the direction of the axis AX.

[0210] (Green body 10)

[0211] The green body 10 is an inorganic insulator. Preferably, the material of the green body 10 is glass. Accordingly, since the glass has high insulation, eddy currents can be suppressed and the Q value can be improved. Preferably, the green body 10 contains Si element. Accordingly, the thermal stability of the green body 10 is improved. Therefore, changes in the dimensions of the green body 10 caused by heat can be suppressed, and electrical characteristic deviations can be reduced.

[0212] Preferably, the green body 10 is a single-layer glass plate. Accordingly, the strength of the green body 10 can be ensured. In addition, in the case of a single-layer glass plate, since the dielectric loss is small, the Q value at high frequencies can be improved. In addition, since there is no sintering process like that of a sintered body, deformation of the green body 10 during sintering can be suppressed, so that pattern shift can be suppressed, and an inductor component with a small inductance tolerance can be provided.

[0213] As the material of the single-layer glass plate, from the viewpoint of the manufacturing method, a photosensitive glass plate represented by Foturan II (registered trademark of Schott AG) is preferred. In particular, it is preferred that the single-layer glass plate contains cerium oxide (cerium oxide: CeO 2 ). In this case, the cerium oxide becomes a sensitizer, and processing based on photolithography becomes easier.

[0214] However, the single-layer glass plate can be processed by mechanical processing such as drilling and sandblasting, dry / wet etching processing using a photoresist / metal mask, laser processing, etc., so it can also be a non-photosensitive glass plate. In addition, the single-layer glass plate can be a glass plate obtained by sintering glass paste, or can be formed by a known method such as the float method.

[0215] (Coil 110)

[0216] As Figure 7As shown, the bottom surface wiring 11b extends only in one direction. Specifically, the bottom surface wiring 11b is shaped to extend in the X direction. A plurality of bottom surface wirings 11b are arranged in parallel along the Y direction. The plurality of bottom surface wirings 11b include the outermost coil wiring 11e located on one side in the direction of the axis AX (Y direction). In this embodiment, the two bottom surface wirings 11b located at both ends in the direction of the axis AX among the plurality of bottom surface wirings 11b are respectively the outermost coil wirings 11e. The top surface wiring 11t extends only in one direction. Specifically, the top surface wiring 11t extends in the X direction while being slightly inclined in the Y direction. A plurality of top surface wirings 11t are arranged in parallel along the Y direction.

[0217] The first through-wiring 13 is disposed on the first end face 100e1 side with respect to the axis AX within the through-hole V of the green body 10, and the second through-wiring 14 is disposed on the second end face 100e2 side with respect to the axis AX within the through-hole V of the green body 10. The first through-wiring 13 and the second through-wiring 14 respectively extend in a direction orthogonal to the bottom surface 100b and the top surface 100t. A plurality of first through-wirings 13 and a plurality of second through-wirings 14 are respectively arranged in parallel along the Y direction.

[0218] (Insulator 22)

[0219] As Figure 8 shown, the inductor component 1F has an insulator 22. The insulator 22 covers the bottom surface 100b and the top surface 100t of the green body 10 respectively. In addition, the insulator 22 may be provided only on the bottom surface 100b among the bottom surface 100b and the top surface 1100t.

[0220] The insulator 22 is a component that covers the wiring (bottom surface wiring 11b, top surface wiring 11t), has the functions of protecting the wiring from external force and preventing damage to the wiring, and improving the insulation of the wiring. Preferably, the insulator 22 is an organic insulator. For example, the insulator 22 may be a resin film such as epoxy resin or polyimide that is easy to form. In particular, it is preferable that the insulator 22 is made of a material with a low dielectric constant. Thus, when there is an insulator 22 between the coil 110 and the external electrodes 121 and 122, the stray capacitance formed between the coil 110 and the external electrodes 121 and 122 can be reduced. For example, the insulator 22 can be formed by laminating a resin film such as ABF GX-92 (manufactured by Ajinomoto Fine-Techno Co., Ltd.), or by coating a paste-like resin and performing thermal curing, etc. In addition, the insulator 22 may also be an inorganic film such as an oxide, nitride, or oxynitride of silicon, hafnium, etc. with excellent insulation and thin film properties.

[0221] An opening 22a is provided in the insulator 22 covering the bottom surface 100b to expose the connection portions of the outermost coil wiring 11e that are connected to the external electrodes 121 and 122. The opening 22a is a through-hole that penetrates the insulator 22 in the thickness direction (Z direction). The shape of the opening 22a when viewed from the Z direction is not particularly limited as long as the above-mentioned connection portions of the bottom surface wiring 11b are exposed. In this embodiment, as Figure 7 shown, when viewed from the Z direction, the shape of the opening 22a is large enough compared to the shape of the above-mentioned connection portions of the bottom surface wiring 11b and is similar to the shape of the above-mentioned connection portions.

[0222] Specifically, when viewed from the Z direction, in the outermost coil wiring 11e located on the second side surface 100s2 side with respect to the center of the green body 10, the shape of the connection portion connected to the first external electrode 121 (in other words, the portion of the outermost coil wiring 11e exposed from the insulator 22) is bullet-shaped with a front end portion whose width in the Y direction narrows as it faces the anti-X direction side. Moreover, when viewed from the Z direction, the shape of the opening 22a provided on the side of the first external electrode 121 is bullet-shaped with a front end portion whose width in the Y direction narrows as it faces the anti-X direction side, so as to be large enough compared to the shape of the above-mentioned connection portion and similar to the shape of the above-mentioned connection portion.

[0223] Similarly, when viewed from the Z direction, in the outermost coil wiring 11e located on the first side surface 100s1 side with respect to the center of the green body 10, the shape of the connection portion connected to the second external electrode 122 (in other words, the portion of the outermost coil wiring 11e exposed from the insulator 22) is bullet-shaped with a front end portion whose width in the Y direction narrows as it faces the positive X direction side. Moreover, when viewed from the Z direction, the shape of the opening 22a provided on the side of the second external electrode 122 is bullet-shaped with a front end portion whose width in the Y direction narrows as it faces the positive X direction side, so as to be large enough compared to the shape of the above-mentioned connection portion and similar to the shape of the above-mentioned connection portion. By making the shape of the opening 22a large enough compared to the shape of the above-mentioned connection portion, the above-mentioned connection portion can be more reliably exposed from the insulator 22, and by making the shape of the opening 22a similar to the shape of the above-mentioned connection portion, the etching amount of the insulator 22 can be minimized to ensure the insulation of the wiring.

[0224] (External electrodes 121, 122)

[0225] As Figure 7 , Figure 8 and Figure 9As shown, the first external electrode 121 is arranged to cover the entirety of the opening 22a on the side of the first end face 100e1 when viewed from the Z direction. Thus, the first external electrode 121 includes a first portion P1 that contacts at least a part of the first side surface S1 of the outermost coil wiring 11e, a second portion P2 that contacts at least a part of the upper surface u of the outermost coil wiring 11e, and a third portion P3 that contacts at least a part of the second side surface s2 of the outermost coil wiring 11e. The first portion P1, the second portion P2, and the third portion P3 are sequentially continuous to form a convex portion P protruding toward the first direction D1 side. Specifically, the first external electrode 121 contacts the entire surface of the first side surface S1 of the outermost coil wiring 11e that is exposed from the insulator 22, contacts the entire surface of the upper surface u of the outermost coil wiring 11e that is exposed from the green body 10, and contacts the entire surface of the second side surface S2 of the outermost coil wiring 11e that is exposed from the green body 10. As a result, the first external electrode 121 has a convex portion P at a position corresponding to the exposed portion of the outermost coil wiring 11e from the green body 10.

[0226] Similarly, the second external electrode 122 is arranged to cover the entirety of the opening 22a on the side of the second end face 100e2 when viewed from the Z direction. Thus, the second external electrode 122 includes a first portion that contacts at least a part of the first side surface S1 of the outermost coil wiring 11e, a second portion that contacts at least a part of the upper surface u of the outermost coil wiring 11e, and a third portion that contacts at least a part of the second side surface s2 of the outermost coil wiring 11e. The first portion, the second portion, and the third portion are sequentially continuous to form a convex portion P protruding toward the first direction D1 side. Specifically, the second external electrode 122 contacts the entire surface of the first side surface S1 of the outermost coil wiring 11e that is exposed from the insulator 22, contacts the entire surface of the upper surface u of the outermost coil wiring 11e that is exposed from the green body 10, and contacts the entire surface of the second side surface S2 of the outermost coil wiring 11e that is exposed from the green body 10. As a result, the second external electrode 122 has a convex portion P at a position corresponding to the exposed portion of the outermost coil wiring 11e from the green body 10.

[0227] Preferably, when viewed from the direction (Z direction) orthogonal to the bottom surface 100b, the first external electrode 121 and the second external electrode 122 are located inside compared to the outer surface 100 of the green compact 10. According to this structure, since the first external electrode 121 and the second external electrode 122 do not contact the outer surface 100 of the green compact 10, when singulating into individual inductor components 1F, the load applied to the first external electrode 121 and the second external electrode 122 can be reduced, and deformation and peeling of the first external electrode 121 and the second external electrode 122 can be suppressed. Therefore, even if the inductor component 1F is miniaturized, deformation and peeling of the first external electrode 121 and the second external electrode 122 can be prevented.

[0228] In the inductor component 1F, since the first external electrode 121 and the second external electrode 122 have convex portions P protruding toward the first direction D1 side, the surface area is increased compared to the case where there are no convex portions P and it is flat. For example, the fixing strength with connection components such as solder can be improved. In addition, since the convex portions P of the first external electrode 121 and the second external electrode 122 are in contact with the outermost coil wiring 11e, the first external electrode 121 and the second external electrode 122 can be directly connected to the outermost coil wiring 11e, respectively. Thereby, the DC resistance (Rdc) can be reduced compared to the case where the first external electrode 121 and the second external electrode 122 are connected to the outermost coil wiring 11e through via wirings or the like, for example.

[0229] Preferably, as Figure 9 shown, an insulator 22 provided on a part of the bottom surface 100b is further provided, and at least a part of the first external electrode 121 is continuously in contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P. Specifically, the first external electrode 121 includes a bottom portion BP1 that is continuously provided from the first portion P1 of the convex portion P toward the side opposite to the second portion P2 and extends in a direction parallel to the bottom surface 100b, and a wall portion WP1 that is continuously provided from the bottom portion BP1 and extends in the first direction D1. Moreover, the wall portion WP1, the bottom portion BP1, and the first portion P1 are continuously in contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P.

[0230] In addition, in this embodiment, at least a part of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the convex portion P. Specifically, the first external electrode 121 includes a bottom portion BP2 that is continuously provided from the third portion P3 of the convex portion P in the direction opposite to the second portion P2 and extends in a direction parallel to the bottom surface 100b, and a wall portion WP2 that is continuously provided from the bottom portion BP2 and extends in the first direction D1. Moreover, the wall portion WP2, the bottom portion BP2, and the third portion P3 are in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the convex portion P.

[0231] According to the above structure, since at least a part of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P, an uneven shape can be imparted to the first external electrode 121. Therefore, for example, the fixing strength with a connecting member such as solder can be further increased. In addition, since at least a part of the first external electrode 121 is in continuous contact with the insulator 22, the bottom surface 100b, and the second side surface S2 of the convex portion P, an uneven shape can be further imparted to the first external electrode 121. Therefore, for example, the fixing strength with a connecting member such as solder can be further increased.

[0232] In addition, similarly, at least a part of the second external electrode 122 may be in continuous contact with the insulator 22, the bottom surface 100b, and the first side surface S1 of the convex portion P.

[0233] Preferably, the first external electrode 121 further includes a fourth portion P4 that is separated from the second portion P2 and is located on the first direction D1 side compared to the second portion P2. Specifically, the fourth portion P4 is a portion of the first external electrode 121 provided on the upper surface 22u of the insulator 22. According to this structure, since the fourth portion P4 is further included, the surface area of the first external electrode 121 can be further increased. Similarly, the second external electrode 122 may also further include a fourth portion that is separated from the second portion and is located on the first direction D1 side compared to the second portion.

[0234] (Manufacturing method of the inductor component 1F)

[0235] Next, use Figures 10A to 10H to describe the manufacturing method of the inductor component 1F. Figures 10A to 10H is a diagram corresponding to the VIII-VIII sectional area of Figure 7 .

[0236] As Figure 10A shown, a copper foil 2001 is provided on the base substrate 2000 by printing. The material of the base substrate 2000 is the same as that of the base substrate 1000 in the first embodiment.

[0237] As Figure 10B shown, a glass substrate 2010 that becomes a green body 10 is provided on a base substrate 2000. For example, a jig such as a conductive tape, a pin, or a frame is used to closely attach the base substrate 2000 to the glass substrate 2010. The glass substrate 2010 has a through hole V. The glass substrate 2010 is, for example, a TGV (Through Glass Via) substrate. A TGV substrate is a substrate on which through holes have been formed in advance by laser, photolithography, etc. The glass substrate 2010 can also be, for example, a TSV (Through Silicon Via) substrate, or it can be other than that. In addition, Ti / Cu or other necessary conductive materials can be vapor-deposited on the surface of the glass substrate 2010 in advance by sputtering or the like as seeds.

[0238] As Figure 10C shown, a first through-conductor layer 2013 that becomes a first through-wiring 13 is formed in the through hole V of the glass substrate 2010. Although not shown, a second through-conductor layer that becomes a second through-wiring 14 is similarly formed in the through hole V. Specifically, by supplying power from the copper foil 2001 on the base substrate 2000, the first through-conductor layer 2013 is formed by electrolytic plating in the through hole V of the glass substrate 2010. In addition to this, a seed layer can also be formed on the surface of the glass substrate 2010 and the inner surface of the through hole V by sputtering or the like, and a through-conductor layer can be formed using a filling plating, conformal plating, printing filling method of a conductive paste, etc. based on a known method. When there is unwanted electroplating growth on the surface of the glass substrate 2010, the unwanted portion is removed by grinding, CMP, wet etching (etching), or dry etching.

[0239] As Figure 10D shown, the base substrate 2000 is peeled off from the glass substrate 2010. At this time, the base substrate 2000 can be removed by a mechanical method such as grinding, or it can be removed by a chemical method such as etching.

[0240] As Figure 10E shown, a bottom surface conductor layer 2011b that becomes a bottom surface wiring 11b and a top surface conductor layer 2011t that becomes a top surface wiring 11t are formed on the glass substrate 2010. Specifically, a seed layer (not shown) is provided on the entire surface of the glass substrate 2010, and a patterned photoresist is formed on the seed layer. A copper layer is formed on the seed layer at the opening of the photoresist by electrolytic plating. The photoresist and the seed layer are removed by wet etching or dry etching. Thus, the bottom surface conductor layer 2011b and the top surface conductor layer 2011t patterned into an arbitrary shape are formed. At this time, the bottom surface conductor layer 2011b and the top surface conductor layer 2011t can be formed one by one, or both can be formed simultaneously.

[0241] As Figure 10F shown, an insulating layer 2022 made of an insulator 22 is provided on the top and bottom surfaces of the glass substrate 2010 to cover the conductor layer. At this time, the insulating layer 2022 on the bottom surface side and the insulating layer 2022 on the top surface side can be formed one by one, or both can be formed simultaneously. Thereafter, holes 2022a are provided in the bottom conductor layer 2011b on the bottom surface of the insulating layer 2022 on the bottom surface side by photolithography or laser processing. At this time, the part of the bottom conductor layer 2011b that becomes the connection part connected to the first and second external electrodes is exposed from the insulating layer 2022. The holes 2022a become openings 22a.

[0242] As Figure 10G shown, a first external electrode conductor layer 2121 that becomes the first external electrode 121 is provided on the insulating layer 2022 on the bottom surface side. At this time, the first external electrode conductor layer 2121 is connected to the bottom conductor layer 2011b via the holes 2022a. In addition, the first external electrode conductor layer 2121 contacts the bottom conductor layer 2011b via the holes 2022a to form a convex portion P. Specifically, a Pd catalyst (not shown) is provided on the insulating layer 2022 on the bottom surface side, and Ni and Au plating layers are formed by electroless plating. A patterned photoresist is formed on the plating layer. The plating layer in the opening portion of the photoresist is removed by wet etching or dry etching. Thus, the first external electrode conductor layer 2121 patterned into an arbitrary shape is formed. Alternatively, a seed layer (not shown) is provided on the insulating layer 2022 on the bottom surface side, and a patterned photoresist is formed on the seed layer. Next, the seed layer in the opening portion of the photoresist is removed by wet etching or dry etching. Ni and Au plating layers can also be formed by electroless plating on the remaining seed layer. Although not shown, a second external electrode conductor layer that becomes the second external electrode 122 is similarly provided on the insulating layer 2022 on the bottom surface side.

[0243] As Figure 10H shown, singulation is performed along the dicing line D. Thus, as Figure 8 shown, an inductor component 1F is manufactured.

[0244] 2. Variation

[0245] (First Variation)

[0246] Figure 11A is a diagram corresponding to the VIII - VIII cross-sectional area of the first variation of the inductor component. As Figure 7 shown Figure 11AAs shown, in the inductor component 1G of the first modified example, the first through-wiring 13 extends in a direction orthogonal to the bottom surface wiring 11b, and the cross-sectional area of each of the end portions 13e in the extending direction of the first through-wiring 13 is larger than the cross-sectional area of the central portion 13m in the extending direction of the first through-wiring 13. In other words, in the cross-sectional area of the first through-wiring 13 along the extending direction, the width in the direction orthogonal to the extending direction of the first through-wiring 13 continuously increases from the central portion 13m toward the end portions 13e.

[0247] Accordingly, the cross-sectional area of the end portion 13e of the first through-wiring 13 can be increased, and the connectivity between the first through-wiring 13 and at least one of the bottom surface wiring 11b and the top surface wiring 11t can be improved. In addition, when forming a through-hole V as a hole portion in the green body 10 and filling the through-hole V with a conductive material such as electroplating to form the first through-wiring 13, it is easy to fill the conductive material on the opening side of the through-hole V. Moreover, since the cross-sectional area of the end portion 13e of the first through-wiring 13 is large and the cross-sectional area of the central portion 13m of the first through-wiring 13 is small, it is easy to form the first through-wiring 13.

[0248] In addition, it is sufficient that the cross-sectional area of one end portion 13e of the first through-wiring 13 is larger than the cross-sectional area of the central portion 13m of the first through-wiring 13. Similarly, the cross-sectional area of at least one end portion of the second through-wiring 14 may be larger than the cross-sectional area of the central portion 13m of the first through-wiring 13.

[0249] In addition, in the inductor component 1G of the first modified example, the bottom surface wiring 11b is provided on the bottom surface 100b, and further includes an insulator 22 that covers the bottom surface wiring 11b and has a shape along the shape of the bottom surface wiring 11b. At least a part of the first external electrode 121 is in contact with the insulator 22 and has a shape along the shape of the bottom surface wiring 11b. Specifically, the insulator 22 covers the bottom surface wiring 11b and, when viewed from the Z direction, has a shape extending in the X direction and is a shape along the shape of the bottom surface wiring 11b. In short, the insulator 22 is provided to independently cover each bottom surface wiring 11b. In the region between adjacent bottom surface wirings 11b, the bottom surface 100b is exposed from the insulator 22. Moreover, the portion of the first external electrode 121 other than the convex portion P and the portion in contact with the bottom surface 100b is in contact with the insulator 22 and, when viewed from the Z direction, has a shape extending in the X direction and is a shape along the shape of the bottom surface wiring 11b.

[0250] In addition, the insulator 22 covers the top surface wiring 11t and has a shape extending in the X direction slightly inclined in the Y direction when viewed from the Z direction, and has a shape along the shape of the top surface wiring 11t. In short, the insulator 22 is provided to cover each top surface wiring 11t independently. Thus, the material cost of the insulator 22 can be reduced.

[0251] As a method for forming the insulator 22 having a shape along the shape of the bottom wiring 11b or the top wiring 11t, for example, a method of forming an organic resin or an inorganic insulator on the surface of the bottom wiring 11b or the top wiring 11t using methods such as CVD (Chemical Vapor Deposition), sputtering, and coating can be listed.

[0252] According to the above structure, since at least a portion of the first external electrode 121 is shaped along the shape of the bottom wiring 11b, the surface area of ​​the first external electrode 121 can be further increased, and the fixing strength with a connecting member such as solder can be further improved.

[0253] Similarly, at least a portion of the second external electrode 122 may be in contact with the insulator 22 and may be in a shape along the shape of the bottom surface wiring 11 b .

[0254] (Second Modification)

[0255] Figure 11B is a diagram showing a second modification of the inductor component. Figure 7 The corresponding figure of the VIII-VIII cross-sectional area. Figure 11B As shown in FIG. 1 , in the inductor component 1H of the second modification, compared with the inductor component 1G of the first modification, an insulator 22 is further provided on the entire surface of the bottom surface 100b except for the portion where the bottom wiring 11b is provided and the peripheral portion. The thickness of the insulator 22 in the Z direction is thinner than the thickness of the bottom wiring 11b in the Z direction. According to this structure, the area of ​​the portion of the first external electrode 121 facing the bottom wiring 11b is reduced compared with the first modification, so that the stray capacitance that may be generated between the first external electrode 121 and the bottom wiring 11b can be reduced compared with the first modification. In addition, since the insulator 22 is filled between the adjacent bottom wirings 11b compared with the first modification, the insulation between the adjacent bottom wirings 11b can be ensured compared with the first modification.

[0256] In addition, in the inductor component 1H of the second modification, when the green body 10 is an inorganic insulator and the insulator 22 is an organic insulator, the organic insulator is located inside compared to the outer surface 100 of the inorganic insulator when viewed from the direction orthogonal to the bottom surface 100b. Accordingly, since the organic insulator is provided, fluidity can be easily imparted to the organic insulator. When covering the wiring (bottom surface wiring 11b, top surface wiring 11t) with the organic insulator, the organic insulator can be easily filled between adjacent wirings, and the insulation performance can be improved. In addition, since the organic insulator does not contact the outer surface of the inorganic insulator, when singulating into individual inductor components 1H, the load applied to the organic insulator can be reduced, and deformation and peeling of the organic insulator can be suppressed.

[0257] In addition, in the inductor component 1H of the second modification, compared with the inductor component 1G of the first modification, an insulator 22 is provided on the entire surface of the top surface 100t in a region other than the portion where the top surface wiring 11t is provided and the outer peripheral portion. The thickness of the insulator 22 in the Z direction is thinner than the thickness of the top surface wiring 11t in the Z direction. Thereby, the green body 10 can be protected from the external environment.

[0258] (Third Modification)

[0259] Figure 11C It is a schematic cross-sectional view showing a first through-wiring of a third modification of an inductor component. As Figure 11C shown, in the third modification, the first through-wiring 13 has a conductive layer 13s located on the outer peripheral side and a non-conductive layer 13u located inside the conductive layer 13s when viewed from the direction in which the first through-wiring 13 extends. Accordingly, when used in a high-frequency band, due to the skin effect, the current mainly flows on the surface of the first through-wiring 13, so the Q value is not reduced due to the provision of the conductive layer 13s on the outer peripheral side. In addition, by providing the non-conductive layer 13u inside, stress can be alleviated, and in addition, the manufacturing cost can be reduced by not using a conductor.

[0260] An example of a method for forming the conductive layer 13s and the non-conductive layer 13u will be described. A seed layer is provided on the inner surface of the through-hole V of the green body 10 by sputtering or electroless plating. Then, an electroplated layer is formed on the seed layer by electroplating. In this way, multiple conductive layers 13s such as Ti / Cu / Electrolytic Cu or Pd / Electroless Cu / Electrolytic Cu can be formed on the outer peripheral side of the first through-wiring 13. Thereafter, the inside of the conductive layer 13s is sealed with resin by printing or hot pressing or the like to form a non-conductive layer 13u made of resin. In this way, the current can flow on the surface (conductive layer 13s) of the first through-wiring 13, and stress can be alleviated by the non-conductive layer 13u inside the first through-wiring 13.

[0261] Similarly, the second through-wiring 14 may also have a conductive layer on the outer peripheral side and a non-conductive layer on the inner side of the conductive layer when observed in the direction extending from the second through-wiring 14.

[0262] Furthermore, the present disclosure is not limited to the above-described embodiments, and design changes can be made without departing from the gist of the present disclosure. For example, various combinations of the characteristic points of the first embodiment and the second embodiment can also be made.

[0263] In the above-described embodiment, both the first external electrode and the second external electrode have convex portions, but only either the first external electrode or the second external electrode may have a convex portion. In this case, the external electrode without the convex portion can be connected to the bottom surface wiring via a through-hole wiring provided in the green body, for example.

[0264] The present disclosure includes the following aspects.

[0265] <1> An inductor component, comprising:

[0266] A green body including a first main surface and a second main surface facing each other;

[0267] A coil, at least a part of which is disposed inside the above-described green body and wound in a spiral shape along an axis; and

[0268] A first external electrode and a second external electrode, which are disposed outside the above-described green body and electrically connected to the above-described coil,

[0269] The axis of the above-described coil is arranged parallel to the above-described first main surface,

[0270] The above-described coil includes:

[0271] A plurality of first coil wirings, which are disposed on the first main surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described first main surface;

[0272] A plurality of second coil wirings, which are disposed on the second main surface side with respect to the above-described axis and arranged along the above-described axis in a plane parallel to the above-described second main surface;

[0273] A plurality of first through-wirings, which extend from the above-described first coil wirings toward the above-described second coil wirings and are arranged along the above-described axis; and

[0274] A plurality of second through-wirings, which extend from the above-described first coil wirings toward the above-described second coil wirings, are disposed on the opposite side of the above-described axis from the above-described first through-wirings, and are arranged along the above-described axis,

[0275] The above-described spiral shape is formed by sequentially connecting the above-described first coil wiring, the above-described first through-wiring, the above-described second coil wiring, and the above-described second through-wiring in this order,

[0276] The plurality of above-described first coil wirings include a most-terminal coil wiring at the most-terminal end on one side in the above-described axial direction,

[0277] The above-described most-terminal coil wiring has an upper surface on the first-direction side facing from the second main surface side toward the first main surface side, and a first side surface and a second side surface that are located on both sides with a center line along the extending direction of the above-described most-terminal coil wiring interposed therebetween when viewed in a direction orthogonal to the above-described first main surface,

[0278] The above-described first external electrode includes a first portion that contacts at least a part of the above-described first side surface, a second portion that contacts at least a part of the above-described upper surface, and a third portion that contacts at least a part of the above-described second side surface. The above-described first portion, the above-described second portion, and the above-described third portion are sequentially and continuously connected to form a convex portion that protrudes toward the above-described first direction side.

[0279] <2> The inductor component according to <1>,

[0280] The thickness of the above-described first external electrode is thinner than the thickness of the above-described first coil wiring.

[0281] <3> The inductor component according to <1> or <2>,

[0282] The above-described green compact contains SiO 2 .

[0283] <4> The inductor component according to any one of <1> to <3>,

[0284] The above-described first external electrode is composed of a plurality of conductive layers and includes a conductive layer having a different material from the conductive layer constituting the above-described most-terminal coil wiring.

[0285] <5> The inductor component according to any one of <1> to <4>,

[0286] The above-described first external electrode further includes a bottom portion and a wall portion. The bottom portion is continuously provided from the above-described first portion of the above-described convex portion toward the side opposite to the above-described second portion and extends in a direction parallel to the above-described first main surface. The wall portion is continuously provided from the above-described bottom portion and extends in the above-described first direction.

[0287] <6> The inductor component according to any one of <1> to <5>,

[0288] The first external electrode further includes a fourth portion, which is separated from the second portion and is located on the first direction side compared to the second portion.

[0289] <7> The inductor component according to any one of <1> to <6>,

[0290] The first main surface has a concave portion.

[0291] The concave portion has a stepped side surface.

[0292] At least a part of the first external electrode has a shape that contacts and follows the side surface.

[0293] <8> The inductor component according to any one of <1> to <7>,

[0294] It further includes an insulator provided on a part of the first main surface.

[0295] At least a part of the first external electrode continuously contacts the insulator, the first main surface, and the first side surface of the convex portion.

[0296] <9> The inductor component according to any one of <1> to <8>,

[0297] The first coil wiring is provided on the first main surface.

[0298] It further includes an insulator that covers the first coil wiring and has a shape following the first coil wiring.

[0299] At least a part of the first external electrode contacts the insulator and has a shape following the first coil wiring.

[0300] <10> The inductor component according to any one of <1> to <9>,

[0301] It further includes an organic insulator provided on the first main surface.

[0302] The green body is an inorganic insulator, and the organic insulator is located inside compared to the outer surface of the inorganic insulator when viewed from a direction orthogonal to the first main surface.

[0303] <11> The inductor component according to any one of <1> to <10>,

[0304] When viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel.

[0305] <12> The inductor component according to any one of <1> to <11>

[0306] The green body contains SiO 2 ,

[0307] The first through-wiring contains SiO 2 .

[0308] <13> The inductor component according to any one of <1> to <12>

[0309] The first through-wiring contains a void portion or a resin portion.

[0310] <14> The inductor component according to any one of <1> to <13>

[0311] When viewed in the direction in which the first through-wiring extends, the first through-wiring has a conductive layer on the outer peripheral side and a non-conductive layer on the inner side of the conductive layer.

[0312] <15> The inductor component according to any one of <1> to <14>

[0313] The axial length of the coil is shorter than the inner diameter of the coil.

[0314] <16> The inductor component according to any one of <1> to <15>

[0315] The first through-wiring extends in a direction orthogonal to the first main surface,

[0316] The cross-sectional area of at least one of the both end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

[0317] <17> The inductor component according to any one of <1> to <16>

[0318] The thickness of the inductor component is 200 μm or less.

[0319] <18> The inductor component according to any one of <1> to <17>

[0320] When viewed in a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside compared to the outer surface of the green body.

[0321] Description of reference numerals

[0322] 1. 1A - 1H... Inductor component, 10... Green body, 11b... Bottom surface wiring (first coil wiring), 11t... Top surface wiring (second coil wiring), 11e... Outermost coil wiring, 13... First through-wiring, 13e... End portion, 13m... Central portion, 13s... Conductive layer, 13u... Non-conductive layer, 14... Second through-wiring, 22... Insulator, 22a... Opening, 22u... Upper surface, 100b... Bottom surface (first main surface), 100t... Top surface (second main surface), 100e1... First end face, 100e2... Second end face, 100s1... First side face, 100s2... Second side face, 110... Coil, 121... First external electrode, 121e1... Base layer, 121e2... Plated layer, 122... Second external electrode, 121s, 122s... Step difference, AX... Axis, BP1, BP2... Bottom portion, WP1, WP2... Wall portion, CL... Center line, C... Concave portion, CS... Side face of the concave portion, D1... First direction, f1 - f3... First - third faces, s1, s2... First, second side faces, u... Upper surface, t1, t2... Thickness, P... Convex portion, P1 - P4... First - fourth parts, V... Through-hole.

Claims

1. An inductor component, wherein, it includes: a green body including a first main surface and a second main surface facing each other; a coil, at least a part of which is disposed inside the green body and wound in a spiral shape along an axis; and a first external electrode and a second external electrode, which are disposed outside the green body and electrically connected to the coil, the axis of the coil is arranged parallel to the first main surface, the coil includes: a plurality of first coil wirings, which are disposed on the first main surface side with respect to the axis and arranged along the axis in a plane parallel to the first main surface; a plurality of second coil wirings, which are disposed on the second main surface side with respect to the axis and arranged along the axis in a plane parallel to the second main surface; a plurality of first through wirings, which extend from the first coil wirings toward the second coil wirings and are arranged along the axis; and a plurality of second through wirings, which extend from the first coil wirings toward the second coil wirings, are disposed on the side opposite to the first through wirings with respect to the axis, and are arranged along the axis, by sequentially connecting the first coil wirings, the first through wirings, the second coil wirings, and the second through wirings, at least a part of the spiral shape is formed, the plurality of first coil wirings include a terminal coil wiring at the outermost end on one side in the axial direction, the terminal coil wiring has an upper surface on the first direction side from the second main surface side toward the first main surface side, and a first side surface and a second side surface that are located on both sides of a center line along the extending direction of the terminal coil wiring when viewed from a direction orthogonal to the first main surface, the first external electrode includes a first part that contacts at least a part of the first side surface, a second part that contacts at least a part of the upper surface, and a third part that contacts at least a part of the second side surface, and the first part, the second part, and the third part are sequentially continuous to form a convex portion protruding toward the first direction side.

2. The inductor component according to claim 1, wherein, the thickness of the first external electrode is thinner than the thickness of the first coil wiring.

3. The inductor component according to claim 1 or 2, wherein, The above-mentioned green body contains SiO 2 .

4. The inductor component according to any one of claims 1 to 3, wherein, the first external electrode is composed of a plurality of conductive layers and includes a conductive layer made of a material different from that of the conductive layer forming the terminal coil wiring.

5. The inductor component according to any one of claims 1 to 4, wherein, the first external electrode further includes a bottom portion that is continuously provided from the first part of the convex portion to the side opposite to the second part and extends in a direction parallel to the first main surface, and a wall portion that is continuously provided from the bottom portion and extends in the first direction.

6. The inductor component according to any one of claims 1 to 5, wherein, the first external electrode further includes a fourth part that is separated from the second part and is located on the first direction side compared to the second part.

7. The inductor component according to any one of claims 1 to 6, wherein, the first main surface has a concave portion, the concave portion has a stepped side surface, at least a part of the first external electrode is in contact with the side surface and has a shape along the side surface.

8. The inductor component according to any one of claims 1 to 7, wherein, it further includes an insulator provided on a part of the first main surface, at least a part of the first external electrode is continuously in contact with the insulator, the first main surface, and the first side surface of the convex portion.

9. The inductor component according to any one of claims 1 to 8, wherein, the first coil wiring is provided on the first main surface, it further includes an insulator that covers the first coil wiring and does not have a shape along the shape of the first coil wiring, at least a part of the first external electrode is in contact with the insulator and has a shape along the shape of the first coil wiring.

10. The inductor component according to any one of claims 1 to 9, wherein, it further includes an organic insulator provided on the first main surface, the green body is an inorganic insulator, and the organic insulator is located inside compared to the outer surface of the inorganic insulator when viewed from a direction orthogonal to the first main surface.

11. The inductor component according to any one of claims 1 to 10, wherein, when viewed from a direction parallel to the axis, the first through-wiring and the second through-wiring are not parallel.

12. The inductor component according to any one of claims 1 to 11, wherein, The above-mentioned green body contains SiO 2 , The above-mentioned first through-wiring includes SiO 2 .

13. The inductor component according to any one of claims 1 to 12, wherein, the first through-wiring includes a void portion or a resin portion.

14. The inductor component according to any one of claims 1 to 13, wherein, the first through-wiring has a conductive layer on the outer peripheral side and a non-conductive layer inside the conductive layer when viewed from the extending direction of the first through-wiring.

15. The inductor component according to any one of claims 1 to 14, wherein, the axial length of the coil is shorter than the inner diameter of the coil.

16. The inductor component according to any one of claims 1 to 15, wherein, the first through-wiring extends in a direction orthogonal to the first main surface, the cross-sectional area of at least one of the two end portions in the extending direction of the first through-wiring is larger than the cross-sectional area of the central portion in the extending direction of the first through-wiring.

17. The inductor component according to any one of claims 1 to 16, wherein, the thickness of the inductor component is 200 μm or less.

18. The inductor component according to any one of claims 1 to 17, wherein, when viewed from a direction orthogonal to the first main surface, the first external electrode and the second external electrode are located inside compared to the outer surface of the green body.

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