Control system and method for laser processing of flexible materials

Abstract

The invention relates to the technical field of laser processing, in particular to a control system and method for laser processing of flexible materials, and the control system comprises a laser module which comprises N laser emitters; a galvanometer scanning module, wherein the galvanometer scanning module comprises Y galvanometers; the light beam splitting module comprises a light splitting device, the light splitting device divides the laser into a plurality of groups of sampling light beams, processing light beams and redundant light beams, the light splitting device can adjust the energy of the light through signal feedback, and the processing light beams can have the same processing power; the N lasers and the Y scanning galvanometers can be synchronized, so that the problems of splicing traces, missed printing of laser starting / ending points or over-ablation and the like are avoided; and the relative position between the material surface and the laser focus of each sub light path can be locked through the focus tracking module, so that the consistency, the stability and the high quality of the processed pattern are ensured.

Description

Technical Field

[0001] The invention relates to the technical field of laser processing, and in particular to a control system and method for laser processing flexible materials. Background Art

[0002] With the rapid development of flexible electronics, wearable devices and miniaturized precision devices, flexible materials have shown great application potential in consumer electronics, biomedicine, new energy and other fields due to their unique bendability, lightweight characteristics and adaptability to complex surfaces.

[0003] The existing fixed optical processing head or the method of controlling the laser beam for processing through a single scanning galvanometer has a slow processing speed of only <2m / s or <10m / s as the precision of the processed pattern becomes higher and higher, and the processing efficiency is low. In addition, because the flexible material is soft and has a large format, it shakes a lot, resulting in uneven surface flatness. During the processing, the soft shaking may cause different processing effects for each piece, and the processing quality is worrying. Therefore, a control system and method for laser processing of flexible materials are urgently needed to solve the above problems. Summary of the invention

[0004] The purpose of the present invention is to provide a control system and method for laser processing of flexible materials, so as to solve the problem mentioned in the above background technology that as the precision of the processed pattern becomes higher and higher, the existing fixed optical processing head or the method of controlling the laser beam for processing through a single scanning galvanometer makes the processing speed slow, which is only <2m / s or <10m / s, and the efficiency is low. Moreover, when the flexible material is soft and has a large format, the shaking is large, resulting in uneven surface flatness. During the processing, the soft shaking may cause different processing effects of each block, and the processing quality is worrying.

[0005] To improve the above problems, the present invention provides the following technical solutions: a control system and method for laser processing flexible materials. The control system includes a laser module, and the laser module includes N laser emitters; a galvanometer scanning module, and the galvanometer scanning module includes Y galvanometers; a beam splitting module, and the beam splitting module includes a beam splitting device. The beam splitting device divides the laser into several groups of sampling beams, processing beams, and redundant beams. The beam splitting device can adjust the energy of light through signal feedback; an energy feedback and control module, and the energy feedback and control module includes an energy sensor and an energy distribution controller; a beam collection module and a focus tracking module. The beam collection module includes a beam collector, and the beam collector is a central integrated type or a distributed collection type; the energy Pz of the processing beam in each sub-light path is the same, and the energy of each sub-light path is controlled by the energy distribution controller. The energy of the sampling beam is set correspondingly according to the laser energy required in the processing. A standard value range is set for each energy sensor. When the energy sensed by the energy sensor is within the standard value range, the laser processing proceeds at the speed set by the standard process. When the energy value of the sampling beam measured by the energy sensor is less than or greater than the set value range, the beam splitting device will adjust the energy of the sampling beam, processing beam, and redundant beam. The laser energy in the redundant beam is PrN = PtN * Q, and the laser energy in the processing beam is Pz = PtN * (1 - Q). The redundant beam is collected by the beam collection module.

[0006] Preferably, the energy sensor includes a photodiode and a thermal laser measuring instrument.

[0007] Preferably, the energy distribution controller calculates based on the energy feedback of the corresponding sampling beam measured by each energy sensor, and generates a control value to be fed back to the adjustable beam splitting device for adjustment.

[0008] Preferably, the focus tracking module includes a height sensor, and the height sensor measures the distance between the surface of the processed workpiece and the galvanometer to obtain height measurement data.

[0009] Preferably, the focus tracking module further includes a height control component and a focus position shifting component. The height control component can mount the galvanometer on a Z-axis that can be adjusted in height. The Z-axis includes a motor and a guide rail. The focus position shifting component includes at least two lenses, and the lenses are convex lenses or concave lenses.

[0010] Preferably, the height control component and the focus position shifting component can be used in combination or alternatively. The flexible materials to be processed include two-dimensional materials and three-dimensional materials.

[0011] A method for laser processing flexible materials, comprising the following steps: 1) placing the workpiece to be processed on the processing platform to obtain the coordinate system of the workpiece on the platform; 2) the graphic splitter decomposes the overall vector diagram into several sub-vector diagrams, and each corresponding sub-vector diagram is respectively input into a scanning galvanometer; 3) N lasers are triggered synchronously by the main clock signal control card for beam splitting, and the split beams in each group include a sampling beam, a processing beam, and a redundant beam; 4) the sampling beam passes through an energy sensor and reaches the energy distribution controller together with the measured energy measurement data; 5) the program trigger instructions of Y scanning galvanometers are also synchronized by the main clock signal control card, and the processing beam performs laser processing at the position of the galvanometer coordinate system relative to the platform coordinate system, and the focus tracking module adjusts the focusing range of the galvanometer.

[0012] Preferably, there is an overlapping area between two adjacent sub-vector diagrams, and the overlapping area is 1 / 20 - 1 / 5.

[0013] Preferably, after beam splitting, the energy of the sampling beam in each group is 10^(-6)% - 10% of the split energy of this group, and the processing beam is 90% - 99.999999% of the split energy of this group.

[0014] Preferably, the frequency range of the main clock signal control card is 1 MHz - 50 MHz.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: By combining several galvanometers / laser emitters and each system module for operation, when processing high-precision patterns of flexible materials, the soft characteristics of the flexible materials are taken into account, avoiding problems such as splicing marks, missed shots, or uneven surface flatness, optimizing the processing quality, and moreover, the processing efficiency can be improved to > 20 m / s. Description of the Drawings

[0016] Figure 1 It is a schematic diagram of the energy feedback and control module of the present invention;

[0017] Figure 2 It is a diagram of the galvanometer processing steps of the present invention;

[0018] Figure 3 It is a schematic diagram of the beam splitting function of the beam splitting device in Embodiment 1 of the present invention;

[0019] Figure 4 It is a schematic diagram of the change in the laser output power at different rotation angles of the half-wave plate of the present invention;

[0020] Figure 5 It is a schematic diagram of the beam splitting function of the beam splitting device in Embodiment 2 of the present invention;

[0021] Figure 6 It is a schematic diagram of the focus tracking module of the present invention;

[0022] Figure 7 This is an example diagram for processing two-dimensional flexible materials in the present invention;

[0023] Figure 8 This is a schematic diagram for processing three-dimensional flexible materials in the present invention. Specific implementation manners

[0024] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0025] Please refer to Figures 1 to 8 , the present invention provides a technical solution: a control system and method for laser processing of flexible materials, wherein the control system includes a laser module, and the laser module includes N laser emitters; a galvanometer scanning module, and the galvanometer scanning module includes Y galvanometers; a beam splitting module, and the beam splitting module includes a beam splitting device, and the beam splitting device divides the laser into several groups of sampling beams, processing beams and redundant beams, and the beam splitting device can adjust the energy of the light through signal feedback; an energy feedback and control module, and the energy feedback and control module includes an energy sensor and an energy distribution controller; a beam collection module and a focus tracking module, and the beam collection module includes a beam collector, and the beam collector is a central integrated type or a distributed collection type; the energy Pz of the processing beam in each sub-light path is the same, and the energy of each sub-light path is controlled by the energy distribution controller. The energy of the sampling beam is set correspondingly according to the required laser energy during processing. A standard value range is set for each energy sensor. When the energy sensed by the energy sensor is within the standard value range, the laser processing is carried out at the speed set by the standard process. When the energy value of the sampling beam measured by the energy sensor is less than or greater than the set value range, the beam splitting device will adjust the energy of the sampling beam, processing beam and redundant beam. The laser energy in the redundant beam is PrN = PtN * Q, and the laser energy in the processing beam is Pz = PtN * (1 - Q). The redundant beam is collected through the beam collection module.

[0026] Further, the energy sensor includes a photodiode and a thermal laser measuring instrument.

[0027] Furthermore, the energy distribution controller calculates based on the energy feedback of the corresponding sampled light beams measured by each energy sensor, and generates a control value to feedback to the adjustable beam splitting device for adjustment; the laser measurement module (named "energy sensor" in this application) usually uses a photodiode or a thermal conductivity optical power meter. After sampling and beam splitting, the sub-optical path is split into a processing light beam with power Pz and a sampling optical path with Psn = Pt * S1. The energy of the processing light beam in each sub-optical path is the same. The output power of the laser: P = PN * wN%; the power of each sub-light beam after beam splitting: Pt = P * (1:RN); the power of the processing light beam: Pz ≈ Pt (the power in the sampling optical path is extremely small); the power of the sampling light beam: PSN; the sampling sensitivity: SN = ΔPz / ΔPSN; the process-set galvanometer scanning speed: VS; in the above optical path system, the key lies in the fact that the energy Pz of the processing light beam in each sub-optical path is the same, so as to ensure the consistency of the processing quality in the large-format multi-optical path processing system. The energy of each sub-optical path is controlled by the energy distribution controller. For this reason, a standard value range is set for each energy sensor according to the energy of the sampling light beam corresponding to the laser energy required in the processing. When the energy sensed by the energy sensor is within the standard value range, the laser processing is carried out at the speed set by the standard process.

[0028] It should be noted that the system includes N laser emitters, and each laser emitter corresponds to its own maximum rated laser power PN. Through the energy adjustment module inside the laser emitter (usually an analog control current or voltage), the laser output power of each laser emitter is adjusted to be close to or the same. At this time, the output power of the laser is P.

[0029] Along the main optical path of the laser (such as the laser), the laser passes through a beam splitting device and is divided into several sub-optical paths. The beam splitting ratio of the beam splitting device is 1:R1, where R1 is equal to the number of the final corresponding processing light beams of the main optical path. In order to achieve the required beam splitting ratio, the beam splitting device can be composed of a first-stage beam splitting module or multiple-stage beam splitting modules. The common beam splitting methods of a single beam splitting module include a half-wave plate combined with a polarization beam splitter or a polarization beam splitting cube. Among them, the half-wave plate is responsible for adjusting the polarization direction of the laser in the optical path, so that the laser projected onto the polarization beam splitting cube or the polarization beam splitter is split and output in the form of transmission and reflection respectively with an ideal transmission / reflection energy ratio. In order to meet the need for automatic energy feedback adjustment of the sub-light beams, the half-wave plate is usually installed on an electric rotating bracket with position reading feedback.

[0030] Figure 4 shows the change of the laser output power in the transmission optical path under different rotation angles of the half-wave plate. After passing through the beam splitting device, the laser in the main optical path is divided into several sub-lasers, and the energy of each sub-laser is basically the same, which is Pt = P * (1:R1).

[0031] In order to ensure that the energy of the processing beam in each sub-optical path is the same, it is necessary to sample and measure the laser in the sub-optical path through a sampling device on the sampling beam. The sampling device usually consists of an auxiliary optical path and a laser measurement module (named: energy sensor in this application). The function of the auxiliary optical path is to sample a small part of the laser from the sub-optical path and further reduce the intensity of the sampled laser to the effective measurement range (maximum measurement sensitivity) of the laser measurement device. The intensity of the laser sampled from the sub-optical path is usually much smaller than that of the sub-optical path. Depending on the different laser measurement modules used, sampling can be carried out through a beam splitter, a Brewster window plate, and a general window plate, according to the different requirements for the timeliness of real-time feedback control of laser energy in different processing schemes.

[0032] Furthermore, the focus tracking module includes a height sensor that measures the distance between the surface of the processed workpiece and the galvanometer to obtain height measurement data.

[0033] Furthermore, the focus tracking module also includes a height control component. The height control component mounts the galvanometer on the Z-axis that can be adjusted in height. The Z-axis includes a motor and a guide rail. The motor can be a servo motor or a stepper motor, and the guide rail can be a ball screw guide rail or a linear guide rail. Since a relatively heavy load (such as a galvanometer and a field lens) is mounted on the Z-axis, this focus control method is suitable for height responses with low speed and large stroke.

[0034] Furthermore, the focus tracking module also includes a focus position shifting component. The focus position shifting component includes at least two lenses. The lenses are convex mirrors or concave mirrors. The lenses are mounted on an electrically controlled displacement stage. By changing the relative distance between the lenses, the position of the laser focus in the Z direction can be changed. Among them, the electrically controlled displacement stage can be controlled by a linear motor or a voice coil motor. Compared with the focus adjustment method of the height control component, because only lenses with very light weight are mounted on the electrically controlled displacement stage, high-speed focus position adjustment can be carried out. However, since this adjustment method changes the focus position by adjusting the divergence angle of the laser beam, and the change in the divergence angle will affect the focus spot shape to a certain extent, this focus dynamic adjustment method is suitable for height responses with high speed and small stroke, and the adjustment stroke is usually less than + / -3 mm.

[0035] Furthermore, the height control component and the focus position shifting component can be combined or used selectively. The flexible materials to be processed include two-dimensional materials and three-dimensional materials.

[0036] It should be noted that when the device needs to process a two-dimensional flexible material at high speed, the height measurement data of the material surface can be obtained through the height sensor. After the height measurement data is fed back to the height control component, the height control component can control the electrically controlled displacement stage to make adjustments according to the height difference.

[0037] When the device needs to process three-dimensional flexible materials, the material surface can be divided into a large-stroke area and a small-stroke area according to different height changes. If the height change in the small-stroke area is less than the effective processing range of the laser focus, only the adjustment method of the focus position shifting component can be used for the focus control method. If the height change in the small-stroke area is greater than the effective processing range of the laser focus, the height compensation for the large-stroke area needs to be carried out by the focus control method of the height control component, and then the height compensation for the small-stroke area is carried out by the focus control method of the focus position shifting component.

[0038] A method for laser processing flexible materials, comprising the following steps: 1) Place the workpiece to be processed on the processing platform to obtain the coordinate system of the workpiece on the platform; 2) The graphic splitter decomposes the overall vector diagram into several sub-vector diagrams, and each corresponding sub-vector diagram is respectively input into a scanning galvanometer; 3) N lasers are triggered synchronously by the main clock signal control card for beam splitting, and each group of split beams has a sampling beam, a processing beam, and a redundant beam; 4) The sampling beam passes through the energy sensor and reaches the energy distribution controller together with the measured energy measurement data; 5) The program trigger instructions of Y scanning galvanometers are also synchronized by the main clock signal control card. The processing beam performs laser processing at the position of the galvanometer coordinate system relative to the platform coordinate system, and the focus tracking module adjusts the focusing range of the galvanometer.

[0039] Further, there is an overlapping area between two adjacent sub-vector diagrams, and the overlapping area is 1 / 20 - 1 / 5.

[0040] Further, after beam splitting, the energy of the sampling beam in each group is {10^(-6)}% - 10% of the split energy of this group, and the processing beam is 90% - 99.999999% of the split energy of this group. The energy of the sampling beam in each group results in this range according to different energy sensors used.

[0041] Further, the frequency range of the main clock signal control card is 1 MHz - 50 MHz.

[0042] Example 1: As Figure 3As shown, when the power of a certain laser emitter decays, it means that the energy sensed by the energy sensors in all sampling optical paths in the sub-optical path corresponding to this laser generator decays. However, the splitting ratio 1:RN in the splitting device should remain unchanged. At this time, the energy adjustment module inside this laser emitter can be controlled by the energy distribution controller to make the laser output power of this laser equal to that of other lasers. If this laser was operating at 100% power before the power decay, then the laser output powers of all other lasers in the laser module need to be adjusted by the energy distribution controller to match the output power of the laser with power decay. At the same time, the galvanometer needs to automatically reduce the corresponding scanning speed to keep the processing technology quality stable.

[0043] Specifically, for example, when the power of the laser emitter decays, The sampled beam detects a power change: ΔPS1 The sub-beam power is converted through the sampling sensitivity: Pt`≈Pz`=Pz - S1 * ΔPS1 The power of the laser emitter at this time is: P` = Pt` * R1 The output power ratio of other laser generators should be adjusted to: wN` = wN * (P` / P) At this time, the galvanometer scanning speed should be: VS` = VS * (P` / P) When the power of a certain sub-optical path corresponding to a laser emitter decays, for example, the sub-optical path is contaminated, it means that the output power of the laser emitter remains unchanged, and the splitting ratio of the splitting device needs to be adjusted accordingly to keep the laser power of each processing beam the same.

[0044] For example, when the energy of N sub-optical paths of the laser emitter changes, The sampled beam detects a power change: ΔPSN The sub-beam power is converted through the sampling sensitivity: PtN`≈PzN`=Pz - SN * ΔPSN The output power of laser 1 at this time is: P` = ∑PtN` Since the energy ratio of each sub-optical path has changed, the splitting ratios of each stage of the splitting module in the splitting device need to be recalculated according to Figure 3 to adapt to the change in energy ratio.

[0045] The output power ratio of other laser generators should be adjusted to: wN` = wN * (P` / P) After the splitting energy ratio of the laser emitter and the output power adjustment of other laser emitters are completed, the galvanometer scanning speed should be: VS` = VS * (P` / P).

[0046] The cases of laser emitter attenuation or sub-optical path power change have been discussed separately above. In actual situations, the above two cases may occur simultaneously.

[0047] Embodiment 2: As Figure 5 shown, in this embodiment, each laser emitter in the laser module emits the main optical path laser in a form close to the maximum output power. After the main optical path laser passes through the beam splitting module, the energy of the main optical path laser is equally divided according to the number of sub-optical paths, and the laser energy of each sub-optical path is PtN = PN * (1:RN).

[0048] In the sampling link of each sub-optical path, an additional redundant beam will be added. The function of the redundant beam is to supplement part or all of the energy in the redundant beam to the processing beam by adjusting the energy ratio between the redundant beam and the processing beam when the maximum power of the laser emitter decays. Therefore, at the first setting, the laser power PtN in the photon-splitting sub-optical path will allocate a part of the power to the redundant beam according to a certain ratio Q. The range of Q is generally between 5% and 30%. This reserved power ratio generally refers to the decay characteristic of the maximum output power of the laser emitter over time. At this time, the laser energy in the redundant beam is PrN = PtN * Q, and the laser energy in the processing beam is Pz = PtN * (1 - Q). The redundant beam does not participate in laser processing but is collected through the beam collection module to avoid light pollution to the processing environment. The beam collection module includes a beam collector, and the beam collector can be centralized to collect the redundant light of all sub-optical paths; it can also be distributed, and each sub-optical path contains an independent beam collector.

[0049] When the power of the processing beam in a certain sub-optical path decays (the decay of the processing beam power may be caused by the decay of the maximum power of the laser emitter or the pollution of the sub-optical path), such as one of the galvanometer optical paths in the laser emitter: the sampling beam detects a power change: ΔPS1 Sampling beam power: Ps1` = Ps1 - ΔPS1 Power of the processing beam in the galvanometer 1 optical path after attenuation: Pz` = Pz - S1 * ΔPS1 Sub-optical path power: Pt1` = Pz` / (1 - Q) Redundant beam power: Pr1` = Pz` * (Q / (1 - Q)) At this time, by adjusting the Q value, the power of the redundant beam is supplemented to the processing beam to restore the power of the processing beam to Pz. Then the new Q value is: Q` = 1 - (Pz / Pt1`) = 1 - (Pz / Pz`) * (1 - Q) = 1 - (Pz / (Pz - S1 * ΔPS1)) * (1 - Q) The Q value and Q' value can be determined through a functional relationship similar to Figure 5 the input-output ratio.

[0050] Compared with Embodiment 1, by introducing redundant beams, whether the laser decays or the laser power in a single sub-optical path changes, each sub-optical path can achieve the stability of the processing beam power by separately adjusting the ratio between the redundant beam and the sub-beam power. This independent adjustment method eliminates the adjustment coupling between different lasers and different sub-optical paths, simplifies the adjustment control method, and also does not require the matching of the galvanometer scanning speed. Therefore, the overall operation stability of the equipment is increased, which is more suitable for the industrial requirements with high stability requirements for the main line speed during roll-to-roll processing. However, this embodiment requires an additional redundant optical path to be built in each sub-optical path, and since a part of the redundant laser needs to be reserved, the processing beam cannot fully utilize the maximum power provided by the laser emitter.

[0051] Embodiment 3: As Figure 6 shown, when the equipment needs to process a two-dimensional flexible material at high speed (the two-dimensional flexible material means that during the processing movement of the material, the height change on the surface of the material is greater than the effective processing range of the laser focus and less than the focus adjustment stroke of + / - 3 mm), the height measurement data of the material surface can be obtained through a height sensor. After the height measurement data is fed back to the height control component, the height control component can control the electric displacement stage to adjust according to the height difference.

[0052] As Figure 7 shown, the height sensor generally emits a measurement beam to sample and measure the height of the product. Figure 7 Two possible arrangements between the processing beam and the measurement beam are shown in

[0053] . In Example 1, along the processing direction, the measurement beam is in front and the processing beam is behind. After the measurement beam samples the height of the product surface, after a fixed delay, the focus position shifting component adjusts the focus of the processing beam to process the measurement area. In Example 2, the measurement beam and the processing beam irradiate the same position, and the height data feedback by the measurement beam and the adjustment of the focus of the processing beam by the focus position shifting component are almost completed simultaneously. This arrangement breaks through the processing direction limitation of Example 1 and can achieve more flexible height compensation processing in terms of direction. Figure 8, if the height change in the small stroke area is less than the effective processing range of the laser focus, only the adjustment method of the focus position shifting component can be used for the focus control method. If the height change in the small stroke area is greater than the effective processing range of the laser focus, the focus control method of the height control component is required to perform height compensation for the large stroke area, and then the focus control method of the focus position shifting component is used to perform height compensation for the small stroke area.

[0054] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art of this industry should understand that the present invention is not limited by the above embodiments. The above embodiments and the descriptions in the specification are only preferred examples of the present invention and are not used to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. A control system for laser processing flexible materials, characterized in that: include A laser module, wherein the laser module comprises N laser emitters; A galvanometer scanning module, wherein the galvanometer scanning module comprises Y galvanometers; A beam splitting module, the beam splitting module includes a splitting device, the splitting device splits the laser into a plurality of groups of sampling beams, processing beams and redundant beams, and the splitting device can adjust the energy of the light through signal feedback; An energy feedback and control module, the energy feedback and control module comprising an energy sensor and an energy distribution controller; A beam collection module and a focus tracking module, wherein the beam collection module comprises a beam collector, and the beam collector is a centrally integrated type or a distributed collection type; The energy Pz of the processing beam in each sub-optical path is the same. The energy of each sub-optical path is controlled by an energy distribution controller. The sampling beam energy is set accordingly according to the laser energy required in the processing. A standard value range is set for each energy sensor. When the energy sensed by the energy sensor is within the standard value range, the laser processing is carried out at the speed set by the standard process. When the energy sensor measures that the energy value of the sampling beam is less than or greater than the set value range, the spectrometer will adjust the energy of the sampling beam, the processing beam and the redundant beam. The laser energy in the redundant beam is PrN=PtN*Q, and the laser energy in the processing beam is Pz=PtN*(1-Q). The redundant beam is collected by a beam collection module.

2. The control system for laser processing flexible materials according to claim 1, characterized in that: The energy sensor includes a photodiode and a thermal-sensitive laser measuring instrument.

3. The control system for laser processing flexible materials according to claim 1, characterized in that: The energy distribution controller performs calculations based on the energy feedback of the corresponding sampling light beams measured by each energy sensor, and generates a control value which is fed back to the adjustable spectroscopic device for adjustment.

4. The control system for laser processing flexible materials according to claim 1, characterized in that: The focus tracking module includes a height sensor, which measures the distance between the surface of the processed workpiece and the galvanometer to obtain height measurement data.

5. The control system for laser processing flexible materials according to claim 4, characterized in that: The focus tracking module also includes a height control component and a focus position shifting component. The height control component is used to install the galvanometer on a Z-axis that can be adjusted in height. The Z-axis includes a motor and a guide rail. The focus position shifting component includes at least two lenses, which are convex mirrors or concave mirrors.

6. The control system for laser processing flexible materials according to claim 5, characterized in that: The height control component and the focus position shifting component can be used in combination or selectively, and the processed flexible materials include two-dimensional materials and three-dimensional materials.

7. A method for laser processing of flexible materials, characterized in that: The following steps are involved: 1) Place the workpiece on the processing platform and obtain the coordinate system of the workpiece on the platform; 2) The graphic subdivider decomposes the overall vector graph into several sub-vector graphs, and each sub-vector graph is input into a scanning galvanometer; 3) N lasers are triggered and synchronized by the master clock signal control card to perform beam splitting, and each group of beams has a sampling beam, a processing beam and a redundant beam; 4) The sampling beam passes through the energy sensor and arrives at the energy distribution controller together with the measured energy measurement data; 5) The program trigger instructions for Y galvanometer scanning are also synchronized through the master clock signal control card. The processing beam is laser processed based on the position of the galvanometer coordinate system relative to the platform coordinate system, and the focus tracking module is used to adjust the focusing range of the galvanometer.

8. The method for laser processing flexible materials according to claim 7, characterized in that: There is an overlapping area between two adjacent sub-vector maps, and the overlapping area is 1 / 20-1 / 5.

9. The method for laser processing flexible materials according to claim 7, characterized in that: After the beam is split, the energy of the sampling beam in each group is {10^(-6)}%-10% of the energy of the beam in this group, and the processing beam is 90%-99.999999% of the energy of the beam in this group.

10. The method for laser processing flexible materials according to claim 7, characterized in that: The frequency range of the master clock signal control card is 1MHz-50MHz.

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