Dustproof welding device for semiconductor cleaning equipment rack

Abstract

The invention belongs to the technical field of welding equipment, and particularly relates to a dustproof welding device for a semiconductor cleaning equipment rack. The dustproof welding device for the semiconductor cleaning equipment rack comprises a seam wrapping mechanism which is arranged on a pipe clamping mechanism and suitable for enabling gas guide blocks on the two sides of a seam to be in butt joint at the seam, placing the seam in a protective gas cavity formed by the gas guide blocks and an inner sealing blocking piece, and injecting gas into the protective gas cavity through a block bottom gas nozzle; and the welding mechanism is arranged on the pipe clamping mechanism, and is suitable for opening the gas guide block in the welding movement of the joint, enabling a block side gas nozzle of the pushed-aside gas guide block to blow gas, forming a gas film on the pipe wall, forming a welding smoke suction cavity with the pushed-aside gas guide block, burnout the gas valve lead at the ending part of the welding seam, and opening a gas release hole. According to the dustproof welding device, after smoke dust in a welding smoke suction cavity formed by the welding mechanism and the pushed-aside air guide block is generated at a welding spot, the smoke dust cannot break through an air film to contaminate the surface of a workpiece around the welding spot.

Description

Technical Field

[0001] The present invention belongs to the technical field of welding equipment, and particularly relates to a dust-proof welding device for a semiconductor cleaning equipment frame. Background Art

[0002] Semiconductor production uses a dust-free workshop, which involves the issue of the entry of production-related equipment. The cleaning equipment is a type of equipment required in semiconductor production. Publication (Announcement) No. CN117428295B introduces the current common methods for equipment to enter the dust-free workshop. For components such as the cleaning equipment frame, the most straightforward method is to perform welding in the dust-free workshop, either by welding on-site in the dust-free workshop of the semiconductor manufacturer or by welding in the dust-free workshop built by the cleaning equipment manufacturer and then packaging and transporting it to the semiconductor manufacturer.

[0003] When welding in the dust-free workshop, it is necessary to control the welding fumes to prevent them from contacting the already cleaned materials and equipment in the dust-free workshop. Publication (Announcement) No. CN117428295B mentions a method for controlling welding fumes, that is, setting up a welding tent. In actual operation, it is to build an inner dust-free workshop inside the dust-free workshop. However, this method of controlling welding fumes is still like a welding fume purifier, collecting the fumes after they diffuse from the welding point. At this time, the surface of the welded workpiece around the welding point has already come into contact with the fumes, which makes the cleaning equipment frame a dust source after welding. In theory, a buffer room is also required for cleaning when entering the dust-free workshop from the inner dust-free workshop. For this reason, the present application proposes a dust-proof welding device for a semiconductor cleaning equipment frame to solve the problem that in welding situations with dust requirements, the current method of collecting welding fumes after they diffuse from the welding point will make the workpiece a dust source. Summary of the Invention

[0004] The purpose of the present invention is to provide a dust-proof welding device for a semiconductor cleaning equipment frame to solve the technical problem that in welding situations with dust requirements, the current method of collecting welding fumes after they diffuse from the welding point will make the workpiece a dust source.

[0005] To solve the above technical problems, the present invention provides a dust-proof welding device for a semiconductor cleaning equipment frame, comprising: a pipe clamping mechanism adapted to clamp the sub-pipe after embracing it; an inner pipe sealing mechanism disposed on the pipe clamping mechanism and adapted to insert an inner sealing piece into the sub-pipe through the weld joint to be welded, and to make the air valve lead wire extend out and be tightened through the joint when the sub-pipe is spliced with the mother pipe, and close the air vent hole; a joint covering mechanism disposed on the pipe clamping mechanism and adapted to butt the air guide blocks on both sides of the joint at the joint, place the joint in the protective gas cavity formed by the air guide block and the inner sealing piece, and inject gas into the protective gas cavity through the bottom air nozzle of the block; a welding mechanism disposed on the pipe clamping mechanism and adapted to deflect the air guide blocks when moving along the joint for welding, make the side air nozzles of the deflected air guide blocks blow air to form an air film on the pipe wall, and form a welding fume suction cavity with the deflected air guide blocks, and burn off the air valve lead wire at the end of the weld seam to open the air vent hole.

[0006] The beneficial effects of the present invention are as follows. The dust-proof welding device for the semiconductor cleaning equipment frame can clamp the sub-pipe after embracing it through the pipe clamping mechanism, so that the inner pipe sealing mechanism, the joint covering mechanism and the welding mechanism are also arranged on the sub-pipe following the pipe clamping mechanism. Thus, before the sub-pipe is spliced with the mother pipe, the inner sealing piece can be inserted into the sub-pipe through the weld joint to be welded by the inner pipe sealing mechanism. Furthermore, after the sub-pipe is spliced with the mother pipe, the air valve lead wire can be made to extend out through the joint and be tightened, the air vent hole can be closed, and the joint can be covered by the air guide blocks through the joint covering mechanism, so that the joint is placed in the protective gas cavity formed by the air guide block and the inner sealing piece, and gas can be injected into the protective gas cavity through the bottom air nozzle on the air guide block to make the protective gas cavity in a positive pressure state. In this way, when the welding mechanism starts to move along the joint for welding, the welding mechanism can deflect the air guide blocks while moving, make the side air nozzles of the deflected air guide blocks blow air towards the middle joint to form an air film on the pipe wall. At the same time, the protective gas cavity in a positive pressure state can also blow air upwards through the exposed joint, so that the soot in the welding fume suction cavity formed by the welding mechanism and the deflected air guide blocks cannot break through the air film and contaminate the workpiece surface around the welding point after the welding point is generated, and will immediately be drawn away with the flow of the protective gas and will not spread in the welding fume suction cavity. The workpiece surface will not be contaminated with soot, and there will no longer be a problem of soot escaping into the dust-free workshop. The workpiece can be directly welded in the dust-free workshop. At the same time, by providing an air vent hole and an air valve lead wire on the inner sealing piece, when welding reaches the end of the weld seam, the air valve lead wire can be burned off by the welding high temperature to open the air vent hole, so that the protective gas cavity is depressurized, and the protective gas will not blow to the weld pool at the end, ensuring the welding quality. Description of the Drawings

[0007] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the specific embodiments or the prior description. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0008] Figure 1 is the structural schematic of the dust-proof welding device for the frame of the semiconductor cleaning equipment of the present invention Figure 1 ; Figure 2 is the structural schematic of the dust-proof welding device for the frame of the semiconductor cleaning equipment of the present invention Figure 2 ; Figure 3 is the structural schematic of the dust-proof welding device for the frame of the semiconductor cleaning equipment of the present invention Figure 3 ; Figure 4 is the cross-section of the dust-proof welding device for the frame of the semiconductor cleaning equipment of the present invention Figure 1 ; Figure 5 is Figure 4 the enlarged view of the C position in Figure 6 is Figure 3 the enlarged view of the A position in Figure 7 is Figure 3 the enlarged view of the B position in Figure 8 is the schematic diagram when the welding mechanism of the present invention distributes and guides the air guide block Figure 1 ; Figure 9 is the schematic diagram when the welding mechanism of the present invention distributes and guides the air guide block Figure 2 ; Figure 10 is Figure 9 the enlarged view of the D position in Figure 11 is the cross-sectional view when the welding mechanism of the present invention distributes and guides the air guide block; Figure 12 is Figure 11 the enlarged view of the E position in Figure 13 is the schematic diagram when the joint covering mechanism of the present invention covers the joint; Figure 14 is the structural schematic diagram of the pipe clamping mechanism of the present invention; Figure 15 is the structural schematic of the welding head of the present invention Figure 1 ; Figure 16 is the structural schematic of the welding head of the present invention Figure 2 ; Figure 17 It is a schematic diagram when the air vent hole of the inner sealing piece of the present invention is opened; Figure 18 It is a schematic diagram when the welding mechanism of the present invention separates and guides the air guide block Figure 3 ; Figure 19 It is a schematic diagram when the welding mechanism of the present invention separates and guides the air guide block Figure 4 ; In the figure: Pipe clamping mechanism 100, pipe inner sealing mechanism 200, first half frame of pipe clamping 110, second half frame of pipe clamping 120, side clamping rod 130, lower clamping rod 140, first half frame of embracing 150, first half frame of embracing 160, welding half rail 170, inner sealing piece 210, air valve lead 211, air vent hole 212, inner sealing joint surface 213, claw-shaped cover 214, hole cover 215, hole cover spring 216, inner sealing driving part 220, inner sealing connecting rod 230, suction cup 240, lead clamping block 250, joint covering mechanism 300, air guide block 310, bottom air nozzle 311 of the block, side air nozzle 312 of the block, dividing inclined plane 313, butt straight plane 314, air guide block hole 315, air guide block base 320, buffer chamber 321, air guide block spring 322, lower seat body 323, upper seat body 324, sliding butt rod 325, air inlet pipe joint 326, air outlet pipe joint 327, strip-shaped air passage hole of the air pipe 328, covering connecting rod 330, protective gas chamber 400, welding mechanism 500, welding trolley 510, adjusting arm 520, first adjusting rod 521, second adjusting rod 522, welding head telescopic driving part 523, welding head 530, welding needle 531, joint inclined plane 532, front stop block 533, rear stop block 534, suction port 535, suction hole 536, dividing tip 537, suction pipe joint 538, welding fume suction chamber 600, sub-tube 710, mother tube 720. Detailed implementation manners

[0009] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0010] Embodiment As Figure 1 shown, the present invention provides a dust-proof welding device for a semiconductor cleaning equipment frame, including: a pipe clamping mechanism 100, which is adapted to clamp on the sub-tube 710 after embracing the sub-tube 710; combined with Figure 2, an inner tube sealing mechanism 200, which is arranged on the tube clamping mechanism 100 and is suitable for stuffing the inner sealing piece 210 into the sub-tube 710 through the weld joint to be welded, refer to Figure 3 and Figure 4 , and enabling the air valve lead 211 to extend through the joint and be tightened when the sub-tube 710 is spliced with the mother tube 720, and closing the air vent hole 212; return to Figure 1 and Figure 2 , a joint covering mechanism 300, which is arranged on the tube clamping mechanism 100 and is suitable for butting the air guiding blocks 310 on both sides of the joint at the joint, refer to Figure 3 and Figure 4 , placing the joint in the protective gas cavity 400 formed by the air guiding block 310 and the inner sealing piece 210, and injecting gas into the protective gas cavity 400 through the bottom air nozzle 311 of the block; return to Figure 1 and Figure 2 , a welding mechanism 500, which is arranged on the tube clamping mechanism 100, combined with Figure 8 and Figure 9 , and is suitable for separating the air guiding blocks 310 during the movement of welding along the joint, refer to Figure 10 , enabling the side air nozzle 312 of the separated air guiding block 310 to blow air, forming an air film on the tube wall, and forming a welding fume suction cavity 600 with the separated air guiding block 310, combined with Figure 5 and Figure 17 , and burning off the air valve lead 211 at the end of the weld seam and opening the air vent hole 212.

[0011] This dust-proof welding device for the frame of a semiconductor cleaning equipment can clamp the sub-pipe after embracing it through the pipe clamping mechanism 100, so that the inner pipe sealing mechanism 200, the joint covering mechanism 300, and the welding mechanism 500 are also arranged on the sub-pipe following the pipe clamping mechanism 100. Thus, before the sub-pipe is spliced with the mother pipe, the inner sealing flap 210 can be stuffed into the sub-pipe through the inner pipe sealing mechanism 200 via the weld joint to be welded. Furthermore, after the sub-pipe is spliced with the mother pipe, the air valve lead 211 can be extended through the joint and tightened, the air leakage hole 212 can be closed, and the joint can be covered by the air guiding block 310 through the joint covering mechanism 300, so that the joint is placed in the protective gas cavity 400 formed by the air guiding block 310 and the inner sealing flap 210. And the bottom air nozzle 311 on the air guiding block 310 can be used to inject gas into the protective gas cavity 400, making the protective gas cavity 400 in a positive pressure state. In this way, when the welding mechanism 500 starts to move along the joint for welding, the welding mechanism 500 can separate and push aside the air guiding block 310 while moving, so that the side air nozzle 312 of the pushed-aside air guiding block 310 blows air towards the middle joint, forming an air film on the pipe wall. At the same time, the protective gas cavity 400 in a positive pressure state can also blow air upwards through the exposed joint, so that the soot in the welding fume suction cavity 600 formed by the welding mechanism 500 and the pushed-aside air guiding block 310 cannot break through the air film and contaminate the workpiece surface around the welding point after the welding point is generated, and then will be immediately sucked away with the flow of the protective gas and will not diffuse in the welding fume suction cavity 600. The workpiece surface will not be contaminated with soot, and there will no longer be a problem of soot escaping into the dust-free workshop. The workpiece can be directly welded in the dust-free workshop. At the same time, by setting the air leakage hole 212 and the air valve lead 211 on the inner sealing flap 210, when welding reaches the end of the weld seam, the air valve lead 211 can be burned off by the welding high temperature to open the air leakage hole 212, so that the protective gas cavity 400 is depressurized, and the protective gas will not blow to the weld pool during the end, ensuring the welding quality.

[0012] As Figure 1 and Figure 13 shown, the joint covering mechanism 300 may include: a plurality of air guiding block bases 320, which are all connected to the pipe clamping mechanism 100 through the covering connecting rod 330 and are located on both sides of the joint. The frame of the semiconductor cleaning equipment is composed of square pipes and flat plates. In at least one embodiment, there are eight air guiding block bases 320 to meet the covering requirements for the four joints generated when splicing square pipes with square pipes or the four joints generated when splicing square pipes with flat plates. Figure 13 In the figure is the case where the pipe orifice of one square pipe is spliced with the side wall of another square pipe. In this case, there are joints where the surfaces are flush and joints where the surfaces are perpendicular. This welding device can perform dust-free welding for both of these two types of joints, and the welding method will be elaborated below.

[0013] Combined with Figure 13 and Figure 11Each gas guide block base 320 is provided with a buffer bin 321, and the buffer bin 321 is communicated with each gas guide block 310 slidably arranged on the gas guide block base 320. When the gas guide block 310 extends along the pipe wall through the gas guide block spring 322 and docks with the gas guide block 310 extending from the other side of the joint at the joint, the joint is placed in the protective air cavity 400 formed by each gas guide block 310 and the inner sealing baffle 210, combined with Figure 12 and Figure 5 The block bottom air nozzle 311 located above the joint can inject air into the protective air cavity 400 through the joint.

[0014] like Figure 13 and Figure 11 As shown, the air guide block base 320 may include: a lower seat body 323, the top front of which is connected to an upper seat body 324; the buffer bin 321 is arranged in the upper seat body 324, Figure 4 , the covering connecting rod 330 is connected to the lower seat body 323; return to Figure 13 and Figure 11 , a plurality of sliding docking rods 325 are arranged on the lower seat body 323 and are located below the upper seat body 324; the back of the gas guide block 310 is provided with a plug hole corresponding to the sliding docking rod 325, so as to be slidably arranged on the gas guide block base 320; the gas guide block spring 322 is arranged on the lower seat body 323 and connected to the corresponding gas guide block 310. In at least one embodiment, the sliding docking rod 325 is a square rod, and when the gas guide block spring 322 is arranged on the lower seat body 323, the sliding docking rod 325 is circled inside.

[0015] Combination Figure 13 and Figure 7 The front chamfer of the air guide block 310 forms a distribution inclined surface 313 and a docking straight surface 314; the lower part of the docking straight surface 314 is provided with the block side air nozzle 312, reference Figure 8 and Figure 9 , so that when the air guide block 310 is opened, Figure 10 and Figure 12 , blow air close to the pipe wall to form an air film on the pipe wall; return to Figure 13 The bottom surface of the air guide block 310 is provided with the block bottom air nozzle 311, and the block bottom air nozzle 311 is adjacent to the block side air nozzle 312 and communicates with the block side air nozzle 312. Figure 12 and Figure 5 , so that when the air guide block 310 is butted at the joint, the block side air nozzle 312 is connected, it is located above the joint and injects air into the protective air cavity 400 through the joint; Figure 12 , Figure 13 and Figure 11 The block-side air nozzle 312 extends to the interior of the air guide block 310 and communicates with the air guide block channel 315 extending from the top surface of the air guide block 310; Figure 11 andFigure 13 The air guide block channel 315 is connected to the buffer bin 321 through an air pipe. It should be noted that the air pipe is not shown in the drawings.

[0016] like Figure 2 As shown, the welding mechanism 500 may include: a welding carriage 510, which is arranged on the pipe clamping mechanism 100; Figure 14 , an adjusting arm 520, the tail end of which is arranged on the welding carriage 510, and the head end of which is provided with a welding head 530; Figure 15 As shown, the welding pin 531 extends from the bottom surface of the welding head 530, and the bottom surfaces of the left and right sides of the welding pin 531 are chamfered to form a fitting inclined surface 532 adapted to the distribution inclined surface 313, and the front and rear bottom surfaces of the welding pin 531 are respectively provided with a front stopper 533 and a rear stopper 534, and the front stopper 533 and the rear stopper 534 extend to the left and right and are connected to the fitting inclined surface 532; Figure 15 and Figure 12 , a suction port 535 is provided on the fitting slope 532 between the front stopper 533 and the rear stopper 534, and the suction port 535 is connected to the suction channel 536 in the welding head 530; return to Figure 15 , a dividing tip 537 is arranged on the bottom surface of the welding head 530 and is located in front of the front stopper 533, referring to Figure 6 , suitable for the welding head 530 to penetrate between a pair of gas guide blocks 310 butted at the joint when the welding carriage 510 moves. Figure 8 and Figure 9 As shown, the two air guide blocks 310 are pushed away to the left and right sides of the welding pin 531, as shown in FIG. Figure 12 As shown, the distribution slope 313 of the gas guide block 310 is abutted against the fitting slope 532 of the welding head 530, as shown in FIG. Figure 10 As shown, the butt joint straight surface 314 of the air guide block 310 abuts against the front stopper 533 and the rear stopper 534 on the bottom surface of the welding head 530, and the combination Figure 10 and Figure 12 , thereby enclosing the welding smoke suction chamber 600 at the joint, and making the block bottom air nozzle 311 away from the joint and blocked by the tube wall, and the separated block side air nozzle 312 blows air toward the middle joint close to the tube wall, protecting the air cavity 400 from blowing air upward through the joint.

[0017] Combination Figure 3 , Figure 6 and Figure 7 When the joint is produced by flushing the surfaces, when the front side of the air guide block 310 used for such a joint is chamfered, the butt straight surface 314 is slightly higher, such as Figure 15 As shown, the front block 533 and the rear block 534 of the corresponding welding head 530 are in the shape of a square. Figure 10As shown, after the air guiding block 310 is pushed to both left and right sides by the dispensing tip 537, the dispensing inclined surface 313 of the air guiding block 310 can smoothly abut against the fitting inclined surface 532 of the welding head 530, and the docking straight surface 314 of the air guiding block 310 can smoothly abut against the front stop block 533 and the rear stop block 534 on the bottom surface of the welding head 530. Similarly, in combination with Figure 3 and Figure 7 , when the joint is formed by the perpendicularity of surface to surface, when chamfering the front surface of the air guiding block 310 used for such a joint, referring to Figure 18 , the docking straight surface 314 is slightly shorter and the dispensing inclined surface 313 is slightly longer. As shown in Figure 16 and Figure 7 , the front stop block 533 and the rear stop block 534 of the corresponding welding head 530 are triangular, and the two sides are chamfered with angles adapted to the slightly shorter docking straight surface 314. In combination with Figure 7 and Figure 18 , the topmost air guiding block 310 can be pushed apart by the triangular front stop block 533 and rear stop block 534. In combination with Figure 19 , the dispensing inclined surface 313 of the topmost air guiding block 310 can smoothly abut against the fitting inclined surface 532 of the welding head 530, and the docking straight surface 314 of the air guiding block 310 can smoothly abut against the front stop block 533 and the rear stop block 534 on the bottom surface of the welding head 530, so as to also form a welding fume suction cavity 600 at the joint for suction. After that, the welding head 530 can continue to push apart the air guiding block 310 through the dispensing tip 537 by moving downward. In at least one embodiment, as shown in Figure 7 and Figure 18 , the air guiding block 310 at the outermost edge of the joint formed by the flushness of surface to surface can be slightly wider to cover the air guiding block 310 on the joint formed by the perpendicularity of surface to surface, and the four corners of the joint are also covered. Therefore, this welding device can perform dust-free welding on both the joint formed by the flushness of surface to surface and the joint formed by the perpendicularity of surface to surface existing in the welding of the semiconductor cleaning equipment frame.

[0018] As shown in Figure 1 and Figure 2 , the inner sealing mechanism 200 may include: an inner sealing driving member 220, in combination with Figure 14 , which is connected to the pipe clamping mechanism 100 through an inner sealing connecting rod 230 and is located in front of the weld joint; returning to Figure 2 , a suction cup 240, which is arranged on the telescopic rod of the inner sealing driving member 220 and is adapted to suck the inner sealing flap 210; in combination with Figure 5 , the four sides of the inner sealing flap 210 extend backward to form an inner sealing fitting surface 213, in combination with Figure 5 and Figure 17, an air vent hole 212 is formed on the inner baffle 210; a claw-shaped cover 214 is arranged on the front wall of the inner baffle 210 and is located in front of the air vent hole 212; a hole cover 215 is arranged on the air vent hole 212, and the front end is connected to the hole cover spring 216 on the claw-shaped cover 214, and the rear end is connected to the air valve lead 211; in combination Figure 14 and Figure 4 , a lead clamping block 250 is arranged on the covering connecting rod 330, and is adapted to tighten the air valve lead 211 after the inner baffle 210 is inserted into the sub-pipe 710 by the inner baffle driving member 220, referring to Figure 5 , so that the hole cover 215 closes the air vent hole 212 until the welding needle 531 moves to the end of the weld seam and burns off the air valve lead 211, referring to Figure 17 , and the hole cover 215 is pulled away from the air vent hole 212 by the hole cover spring 216.

[0019] As Figure 14 shown, the pipe clamping mechanism 100 may include: a first half-frame 110 of the pipe clamp, which is adapted to be docked with a second half-frame 120 of the pipe clamp placed on the sub-pipe 710 to form a whole frame; the second half-frame 120 of the pipe clamp and the first half-frame 110 of the pipe clamp can be connected by bolts; side clamping rods 130 are respectively penetrated through both side walls of the second half-frame 120 of the pipe clamp, and a lower clamping rod 140 is penetrated through the first half-frame 110 of the pipe clamp; clamping plates are arranged at the pipe clamping ends of the two side clamping rods 130 and the lower clamping rod 140; thus, after the sub-pipe 710 is clamped by other tooling, it can also be assembled and clamped on the sub-pipe 710; clamping plates on the two side clamping rods 130 are respectively provided with a first half-frame 150 for holding and a first half-frame 160 for holding, which are adapted to fit with the sub-pipe 710 when the two side clamping rods 130 and the lower clamping rod 140 clamp the sub-pipe 710; jacks are formed on the first half-frame 150 for holding and the first half-frame 160 for holding to connect the covering connecting rod 330 and the inner baffle connecting rod 230; the covering connecting rod 330 located on one side of the mother pipe 720 after connection can adopt the form of a multi-segment and lockable articulated rod, and the covering connecting rod 330 located on one side of the sub-pipe 710 can adopt a straight rod; a welding half-rail 170 is respectively inserted on the first half-frame 150 for holding and the first half-frame 160 for holding, and the two welding half-rails 170 are butted into a whole rail when the first half-frame 150 for holding and the first half-frame 160 for holding fit with the sub-pipe 710 to arrange the welding trolley 510. In at least one embodiment, a welding trolley 510 is respectively arranged on the four sides of the whole rail formed by butting the two welding half-rails 170 to meet the welding requirements for the four seams generated when splicing a square pipe with a square pipe or the four seams generated when splicing a square pipe with a flat plate.

[0020] As Figure 13As shown in the figure, an air inlet pipe joint 326 and a plurality of air outlet pipe joints 327 are provided on the buffer bin 321, and air pipe strip through holes 328 are formed at the upper seat body 324 in front of the air outlet pipe joints 327. The air inlet pipe joint 326 is used for externally connecting a protective gas source. One end of the air pipe for connecting the air guiding block 310 and the buffer bin 321 can be connected to the air outlet pipe joint 327, and the other end can pass downward through the air pipe strip through hole 328 and be connected to the air guiding block hole 315 on the air guiding block 310.

[0021] As Figure 14 shown in the figure, the adjusting arm 520 may include: a first adjusting rod 521, the tail end of which is arranged on the welding trolley 510; a second adjusting rod 522, which is arranged on the first adjusting rod 521; a welding head telescopic driving member 523, which is arranged at the head end of the second adjusting rod 522, and the welding head 530 is arranged on the telescopic rod of the welding head telescopic driving member 523. Before welding starts, the welding trolley 510 is located at the initial position. At this time, the first adjusting rod 521 and the second adjusting rod 522 are adjusted so that the welding head 530 on the telescopic rod of the welding head telescopic driving member 523 is located outside the corresponding seam. After welding starts, the welding head telescopic driving member 523 makes the welding head 530 extend. As described above, when the seam is generated by the flush of surface and surface, the welding head 530 only needs to extend so that the welding needle 531 is at a height close to the seam. Then, when the welding trolley 510 moves, the distribution tip 537 on the welding head 530 will distribute and guide the air guiding block 310. When the seam is generated by the perpendicularity of surface and surface, the welding head 530 extends not only to make the welding needle 531 at a height close to the seam, but also to separate the front stop block 533 and the rear stop block 534 from the uppermost air guiding block 310. Then, when the welding trolley 510 moves, the distribution tip 537 on the welding head 530 will distribute and guide the air guiding block 310.

[0022] Combined with Figure 15 、 Figure 16 and Figure 11 , the suction hole 536 communicates with the suction pipe joint 538 on the welding head 530. The suction pipe joint 538 is used for externally connecting a suction device.

[0023] The working principle of the dust-proof welding device for the semiconductor cleaning equipment frame will be described as a whole below.

[0024] Refer to Figure 14, first, put the second half frame 120 of the pipe clamp on the sub-pipe 710 clamped by other tooling, then butt the first half frame 110 of the pipe clamp with the second half frame 120 of the pipe clamp to form a complete frame. After that, rotate the lower clamping rods 140 and the side clamping rods 130 on the first half frame 110 and the second half frame 120 of the pipe clamp to complete the clamping of the sub-pipe 710. After clamping, the first half frame 150 for holding and the first half frame 160 for holding also fit with the sub-pipe 710, and the two welded half rails 170 are also butted into a complete rail. Then, insert each covering connecting rod 330 and the inner sealing connecting rod 230, and set the welding trolley 510 on the welded half rail 170. As Figure 1 and Figure 2 shown, place the inner sealing driving part 220 in front of the weld joint to be welded. The inner sealing driving part 220 inserts the inner sealing flap 210 into the sub-pipe 710, makes the inner sealing fitting surface 213 tightly adhere to the inner wall of the sub-pipe 710, and makes the air valve lead wire 211 in a state of being tightened by the lead wire clamping block 250. Then, refer to Figure 3 , splice the sub-pipe 710 with the mother pipe 720 clamped by other tooling. The air valve lead wire 211 extends through the joint and remains in a tightened state when the sub-pipe 710 and the mother pipe 720 are spliced. Combining Figure 13 , place the air guiding block base 320 on both sides of the joint. Each air guiding block 310 on the air guiding block base 320 is butted at the joint. Combining Figure 12 and Figure 5 , at this time, the side air nozzles 312 of the blocks are connected, and the bottom air nozzles 311 of the blocks are located above the joint. The protective gas from the buffer chamber 321 enters the protective gas cavity 400 through the joint, making the protective gas cavity 400 in a positive pressure state. Adjust the first adjusting rod 521 and the second adjusting rod 522 so that the welding head 530 on the telescopic rod of the welding head telescopic driving part 523 is located outside the corresponding joint. After starting welding, the welding head telescopic driving part 523 makes the welding head 530 extend. As described above, when the joint is formed by the surfaces being flush, the welding head 530 only needs to extend so that the welding needle 531 is at a height close to the joint. Then, when the welding trolley 510 moves, the deflecting tip 537 on the welding head 530 will deflect the air guiding block 310. When the joint is formed by the surfaces being perpendicular, the welding head 530 extends so that the welding needle 531 is at a height close to the joint, and also makes the front stop block 533 and the rear stop block 534 deflect the topmost air guiding block 310. Then, when the welding trolley 510 moves, the deflecting tip 537 on the welding head 530 will deflect the air guiding block 310. Combining Figure 10 and Figure 12, a welding fume suction cavity 600 is formed at the joint. At this time, the bottom air nozzle 311 is blocked by the pipe wall after moving away from the joint, and the separated side air nozzle 312 of the guide air block is close to the pipe wall and blows air towards the middle joint, forming an air film on the pipe wall. At the same time, the protective gas cavity 400 in a positive pressure state can also blow air upwards through the exposed joint, so that the soot in the welding fume suction cavity 600 cannot break through the air film and contaminate the workpiece surface around the welding point after the welding point is generated. Then, it will immediately be drawn away with the protective gas flow through the suction port 535 and will not spread in the welding fume suction cavity 600. The workpiece surface will not be contaminated with soot, and there will no longer be a problem of soot escaping into the dust-free workshop. Therefore, welding operations can be directly carried out in the dust-free workshop. At the same time, by providing a vent hole 212 and a gas valve lead 211 on the inner baffle 210, when welding reaches the end of the weld seam, the gas valve lead 211 can be burned off by the welding high temperature to open the vent hole 212, so that the protective gas cavity 400 is depressurized. At the end, the protective gas will not blow onto the weld pool, ensuring the welding quality.

[0025] In summary, when the dust-proof welding device of the semiconductor cleaning equipment frame performs welding, the welding mechanism 500 can separate and guide the air guide block 310 while moving, so that the side air nozzle 312 of the separated air guide block 310 blows air towards the middle joint, forming an air film on the pipe wall. At the same time, the protective gas cavity 400 in a positive pressure state can also blow air upwards through the exposed joint, so that the soot in the welding fume suction cavity 600 formed by the welding mechanism 500 and the separated air guide block 310 cannot break through the air film and contaminate the workpiece surface around the welding point after the welding point is generated. Then, it will immediately be drawn away with the protective gas flow and will not spread in the welding fume suction cavity 600. The workpiece surface will not be contaminated with soot, and there will no longer be a problem of soot escaping into the dust-free workshop. Welding of workpieces can be directly carried out in the dust-free workshop. At the same time, by providing a vent hole 212 and a gas valve lead 211 on the inner baffle 210, when welding reaches the end of the weld seam, the gas valve lead 211 can be burned off by the welding high temperature to open the vent hole 212, so that the protective gas cavity 400 is depressurized. At the end, the protective gas will not blow onto the weld pool, ensuring the welding quality.

[0026] In the embodiments provided in the present application, it should be understood that the disclosed systems and devices can be implemented in other ways. The above-described embodiments are merely illustrative. For example, the division of the mechanisms is only a logical function division, and there may be other division methods in actual implementation. For another example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed.

[0027] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0028] Based on the above inspiration from the ideal embodiments of the present invention, through the above description, those skilled in the art can make various changes and modifications completely within the scope not departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A dust-proof welding device for a semiconductor cleaning equipment frame, characterized in that: include: A pipe clamping mechanism (100) adapted to embrace a sub-pipe and then clamp it on the sub-pipe; The inner tube sealing mechanism (200) is arranged on the tube clamping mechanism (100) and is suitable for inserting the inner sealing baffle (210) into the sub-tube through the welded opening, and allowing the air valve lead wire (211) to extend through the seam and be tightened when the sub-tube and the mother tube are spliced, thereby closing the air leakage hole (212); A seam covering mechanism (300) is arranged on the tube clamping mechanism (100) and is suitable for butting the air guide blocks (310) on both sides of the seam at the seam, placing the seam in a protective air cavity (400) formed by the air guide block (310) and the inner sealing baffle (210), and injecting air into the protective air cavity (400) through a block bottom air nozzle (311); The welding mechanism (500) is arranged on the pipe clamping mechanism (100) and is suitable for separating the air guide block (310) when moving for seam welding, so that the block side air nozzle (312) of the separated air guide block (310) blows air to form an air film on the pipe wall and form a welding fume suction chamber (600) with the separated air guide block (310), and burns off the air valve lead wire (211) at the end of the weld to open the air leakage hole (212).

2. The semiconductor cleaning equipment frame dust-proof welding device according to claim 1, characterized in that: The seam covering mechanism (300) comprises: A plurality of air guide block bases (320), each of which is connected to the tube clamping mechanism (100) via a covering connecting rod (330) and is located on both sides of the joint; Each gas guide block base (320) is provided with a buffer bin (321), and the buffer bin (321) is communicated with each gas guide block (310) slidably arranged on the gas guide block base (320). When the gas guide block (310) extends along the tube wall through the gas guide block spring (322) and butts with the gas guide block (310) extending from the other side of the joint at the joint, and the joint is placed in a protective gas cavity (400) formed by each gas guide block (310) and the inner sealing baffle (210), gas is injected into the protective gas cavity (400) through the block bottom gas nozzle (311).

3. The semiconductor cleaning equipment frame dust-proof welding device according to claim 2, characterized in that: The gas guide block base (320) comprises: A lower seat body (323) whose top front portion is connected to an upper seat body (324); The buffer bin (321) is disposed in the upper seat body (324), and the covering connecting rod (330) is connected to the lower seat body (323); A plurality of sliding docking rods (325) are arranged on the lower seat body (323) and are located below the upper seat body (324); The back side of the air guide block (310) is provided with a plug hole corresponding to the sliding docking rod (325) so as to be slidably arranged on the air guide block base (320); The air guide block spring (322) is arranged on the lower seat body (323) and is connected to the corresponding air guide block (310).

4. The semiconductor cleaning equipment frame dust-proof welding device according to claim 3, characterized in that: The front surface of the air guide block (310) is chamfered to form a distribution inclined surface (313) and a butt straight surface (314); The block side air nozzle (312) is provided at the lower part of the butt joint straight surface (314) so ​​as to blow air close to the pipe wall when the air guide block (310) is opened, thereby forming an air film on the pipe wall; The bottom surface of the air guide block (310) is provided with the block bottom air nozzle (311), and the block bottom air nozzle (311) is adjacent to the block side air nozzle (312) and is in communication with the block side air nozzle (312), so that when the air guide block (310) is butted at a joint, the block side air nozzle (312) is located above the joint and injects air into the protective air cavity (400) through the joint. The block-side air nozzle (312) extends to the interior of the air guide block (310) and communicates with an air guide block channel (315) extending from the top surface of the air guide block (310); The air guide block channel (315) is in communication with the buffer bin (321) via an air pipe.

5. The semiconductor cleaning equipment frame dust-proof welding device according to claim 4, characterized in that: The welding mechanism (500) comprises: A welding carriage (510), which is arranged on the pipe clamping mechanism (100); An adjusting arm (520), the rear end of which is arranged on the welding carriage (510) and the front end of which is provided with a welding head (530); A welding pin (531) extends from the bottom surface of the welding head (530); the bottom surfaces on the left and right sides of the welding pin (531) are chamfered to form a fitting inclined surface (532) adapted to the distribution inclined surface (313); the bottom surfaces on the front and rear sides of the welding pin (531) are respectively provided with a front stopper (533) and a rear stopper (534); and the front stopper (533) and the rear stopper (534) extend to the left and right to be connected to the fitting inclined surface (532); A suction port (535) is provided on the fitting inclined surface (532) between the front stopper (533) and the rear stopper (534), and the suction port (535) is connected to a suction channel (536) in the welding head (530); The distribution tip (537) is arranged on the bottom surface of the welding head (530) and is located in front of the front stopper (533). It is suitable for piercing between a pair of gas guide blocks (310) butted at the joint when the welding head (530) moves with the welding carriage (510), and pushing the two gas guide blocks (310) to the left and right sides of the welding needle (531) respectively, so that the distribution bevel (313) of the gas guide block (310) and the welding head (530) are aligned. The fitting inclined surfaces (532) abut against each other, and the butting straight surface (314) of the air guide block (310) abuts against the front stopper (533) and the rear stopper (534) on the bottom surface of the welding head (530), so as to enclose the welding smoke suction chamber (600) at the joint, and the block bottom air nozzle (311) is blocked by the pipe wall after being away from the joint, and the block side air nozzle (312) is close to the pipe wall to blow air toward the middle joint after being separated, so as to protect the air cavity (400) and blow air upward through the joint.

6. The semiconductor cleaning equipment frame dust-proof welding device according to claim 5, characterized in that: The tube inner sealing mechanism (200) comprises: An inner seal driving member (220), which is connected to the tube clamping mechanism (100) via an inner seal connecting rod (230) and is located in front of the joint to be welded; A suction cup (240), which is arranged on the telescopic rod of the inner sealing driving member (220) and is suitable for sucking the inner sealing baffle (210); The four sides of the inner sealing baffle (210) extend backwards to form an inner sealing fitting surface (213), and the inner sealing baffle (210) is provided with the air leakage hole (212); A claw-shaped cover (214) is arranged on the front wall of the inner sealing baffle (210) and is located in front of the air leakage hole (212); A hole cover (215) is arranged on the air leakage hole (212), with a front end connected to a hole cover spring (216) on the claw-shaped cover (214), and a rear end connected to the air valve lead (211); The lead clamp block (250) is arranged on the covering connecting rod (330) and is suitable for tightening the gas valve lead wire (211) after the inner sealing baffle (210) is inserted into the sub-tube by the inner sealing driving member (220), so that the hole cover (215) closes the air leakage hole (212), until the welding needle (531) moves to the end of the weld to burn the gas valve lead wire (211), and then the hole cover (215) is pulled away from the air leakage hole (212) by the hole cover spring (216).

7. The dust-proof welding device for a semiconductor cleaning equipment frame according to claim 6, characterized in that: The tube clamping mechanism (100) comprises: A first half pipe clamping frame (110) adapted to be joined with a second half pipe clamping frame (120) placed on the sub-pipe material to form a whole frame; Side clamping rods (130) are provided through both side walls of the second half frame (120) of the clamping tube, and a lower clamping rod (140) is provided through the first half frame (110) of the clamping tube. The pipe clamping ends of the two side clamping rods (130) and the lower clamping rod (140) are both provided with clamping plates; The clamping plates of the two side clamping bars (130) are respectively provided with an embracing first half frame (150) and an embracing first half frame (160), which are suitable for fitting with the sub-tube when the two side clamping bars (130) and the lower clamping bar (140) clamp the sub-tube; The embracing first half frame (150) and the embracing first half frame (160) are provided with insertion holes for connecting the covering connecting rod (330) and the inner sealing connecting rod (230); A welding half rail (170) is respectively inserted into the embracing first half frame (150) and the embracing first half frame (160), and the two sections of the welding half rail (170) are butt-jointed to form a whole rail when the embracing first half frame (150) and the embracing first half frame (160) are attached to the sub-pipe, so as to set the welding trolley (510).

8. The dust-proof welding device for a semiconductor cleaning equipment frame according to claim 4, characterized in that: The buffer bin (321) is provided with an air inlet pipe joint (326) and a plurality of air outlet pipe joints (327), and the upper seat body (324) in front of the air outlet pipe joints (327) is provided with air pipe strip-shaped through holes (328).

9. The semiconductor cleaning equipment frame dust-proof welding device according to claim 5, characterized in that: The regulating arm (520) comprises: A first adjusting rod (521), a rear end of which is arranged on the welding carriage (510); A second adjusting rod (522), which is arranged on the first adjusting rod (521); A welding head telescopic driving member (523) is arranged at the head end of the second adjusting rod (522), and the welding head (530) is arranged on the telescopic rod of the welding head telescopic driving member (523).

10. The semiconductor cleaning equipment frame dust-proof welding device according to claim 5, characterized in that: The suction channel (536) is in communication with a suction pipe joint (538) on the welding head (530).

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