Silicon wafer column machining and grinding device for semiconductor production

Abstract

The invention discloses a silicon wafer column machining and grinding device for semiconductor production, and relates to the technical field of semiconductor production, the silicon wafer column machining and grinding device comprises a machining plate, a placing plate is fixedly mounted at the top of the machining plate, a linear driving mechanism fixedly penetrates through the top of the machining plate, and a driving motor is fixedly mounted at the top of the moving end of the linear driving mechanism; a loading plate is fixedly mounted at the output end of the driving motor, and a grinding mechanism fixedly penetrates through the end, away from the driving motor, of the loading plate. Wherein the clamping device comprises an electric push rod, a carrying plate, a T-shaped rod, a first spring, a rubber plate, a lifting plate, a first elastic piece, two connecting rods, an arc-shaped strip and a supporting rod, the polishing stability is improved through supporting force applied by the machining plate, then the arc-shaped strip is used for applying pressure to the silicon wafer column, and it is ensured that the silicon wafer column does not deflect in the polishing process, and the polishing effect is not affected.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor production, and specifically provides a silicon crystal cylinder processing and grinding device for semiconductor production. Background Technique

[0002] A silicon wafer is a circular material made of single-crystal silicon. It is the basic material in semiconductor device manufacturing. A crystal cylinder is one form of this material. It is a cylindrical single-crystal silicon formed during the crystal growth process after melting silicon. This cylindrical silicon crystal can be cut into thin slices and then used to manufacture various semiconductor devices.

[0003] The patent with the patent announcement number CN215510588U relates to a silicon crystal cylinder processing device for semiconductor production, including a base. The top of the base is fixedly connected with a transparent cover. When this patent is in use, through the setting of the protective cover, the dust generated during the grinding process can be effectively isolated, avoiding harm to the body of the staff caused by the scattered dust. And through the mutual cooperation between the servo motor, the second threaded rod, the second threaded sleeve, the fixed rod and the T-shaped rod, the position of the grinding disc can be adjusted outside the transparent cover, also avoiding the harm brought by the staff directly operating by hand. Through the mutual cooperation between the clamping plate, the pressing plate, the arc-shaped slot, the anti-slip pad, the first threaded rod and the handwheel, the silicon crystal cylinder is prevented from shaking during the grinding process, affecting the grinding efficiency. And through the mutual cooperation between the side plate and the hydraulic cylinder, by adjusting the distance between the two side plates, silicon crystal cylinders of different lengths can be processed, and the use effect is good.

[0004] In the above patent, it has the function of clamping silicon crystal cylinders of different lengths. Through the cooperation between the first threaded rod and the handwheel, the staff can easily adjust the clamping device to adapt to silicon crystal cylinders of various lengths, which not only simplifies the operation process but also meets various production requirements. However, during the grinding process, the flat clamping plate cannot completely fit the curved surface of the cylindrical silicon crystal cylinder. Due to the limited contact surface, the clamping force received by the silicon crystal cylinder is unevenly distributed, causing the silicon crystal cylinder to shift or vibrate during the grinding process, thus affecting the grinding accuracy. Summary of the Invention

[0005] Aiming at the deficiencies of the prior art, the present invention provides a silicon crystal cylinder processing and grinding device for semiconductor production, which solves the problems raised in the above background technique.

[0006] To achieve the above object, the present invention is realized through the following technical solutions: A silicon crystal cylinder processing and grinding device for semiconductor production, including a processing plate, on the top of which a placement plate is fixedly installed, and a linear driving mechanism is fixedly penetrated through the top of the processing plate. The top of the moving end of the linear driving mechanism is fixedly installed with a driving motor, and the output end of the driving motor is fixedly installed with a loading plate. The end of the loading plate away from the driving motor is fixedly penetrated with a grinding mechanism. A chute is opened on the top of the processing plate, and a clamping device is also included; wherein, the clamping device includes an electric push rod, a carrying plate, a T-shaped rod, a first spring, a rubber plate, a lifting plate, a first elastic sheet, two connecting rods, an arc-shaped strip and a support rod. When the electric push rod is started, the output end of the electric push rod drives the carrying plate to move towards the placement plate, and the movement of the carrying plate drives the T-shaped rod to move towards the placement plate. The electric push rod is fixedly installed on the top of the processing plate, the carrying plate is fixedly installed at the output end of the electric push rod, the T-shaped rod slides through the side of the carrying plate away from the electric push rod, the first spring is arranged between the T-shaped rod and the carrying plate, the rubber plate is fixedly installed on the side of the T-shaped rod away from the carrying plate, the lifting plate slides through the top of the carrying plate, the first elastic sheet is arranged between the lifting plate and the carrying plate, the two connecting rods are fixedly installed on the side of the lifting plate away from the electric push rod, the arc-shaped strip is arranged at both ends of the connecting rod away from the lifting plate, the support rod is fixedly installed at the bottom of the lifting plate, the support rod slides through the bottom of the carrying plate, and a first corrugation is opened on the side of the rubber plate away from the carrying plate. The first corrugation of the rubber plate contacts the silicon crystal cylinder during the movement, and the rubber plate stops moving due to the resistance exerted by the silicon crystal cylinder.

[0007] According to the above technical solution, a first spherical surface is opened at one end of the T-shaped rod close to the lifting plate, and a first inclined surface is opened on the surface of the lifting plate close to the T-shaped rod. The first inclined surface of the lifting plate contacts the first spherical surface during the movement, and the first inclined surface continues to move and moves downward under the resistance exerted by the first spherical surface.

[0008] According to the above technical solution, the arc-shaped strip itself has elasticity. The middle position of the arc-shaped strip stops moving when blocked. The connecting rod moves and stretches both ends of the arc-shaped strip, and the arc-shaped strip deforms under the stretching. An anti-slip groove is opened on the side of the arc-shaped strip close to the rubber plate.

[0009] According to the above technical solution, it further includes a dust-proof device and a locking device; the dust-proof device includes a moving frame, a glass cover, a rectangular plate, a second elastic piece, a contact plate, a limiting plate, a cylindrical block, an elastic piece and a round rod. During the movement of the lifting plate, it contacts the contact plate. When the lifting plate moves, it applies a thrust to the contact plate, and under the influence of the thrust, the contact plate moves towards the placement plate. The moving frame is slidably installed on the top of the chute, the glass cover is fixedly installed inside the moving frame, the rectangular plate is slidably installed on the inner wall of the moving frame, the second elastic piece is arranged between the rectangular plate and the moving frame, the contact plate is fixedly installed at the bottom of the rectangular plate, the limiting plate is fixedly installed on the outer wall of the moving frame, the cylindrical block is fixedly installed on the surface of the rectangular plate, the elastic piece is fixedly installed on the inner wall of the moving frame. When the rectangular plate moves, it drives the cylindrical block to move towards the elastic piece, and during the movement, the cylindrical block contacts the elastic piece. The round rod is fixedly installed on the inner wall of the moving frame.

[0010] According to the above technical solution, the elastic pieces are equidistantly distributed on the inner wall of the moving frame with the rectangular plate as the axis of symmetry. When the cylindrical block continues to move and squeezes the elastic piece, the elastic piece deforms, and the surface of the deformed elastic piece that contacts the round rod separates. A second inclined surface is provided on the surface of the limiting plate close to the placement plate, and a round hole is provided on the surface of the limiting plate far from the moving frame.

[0011] According to the above technical solution, a first arc surface is provided on the surface of the elastic piece far from the round rod. When the cylindrical block moves back and contacts the first arc surface of the elastic piece, and the cylindrical block continues to move and squeezes the first arc surface, the elastic piece deforms, and the elastic piece contacts the circumferential surface of the round rod.

[0012] According to the above technical solution, the locking device includes a fixed plate, a moving rod, a second spring, a movable plate, a grip rod, a docking rod, an adapter seat, a rotating plate and a blocking plate. When the docking rod moves, it drives the movable plate to move towards the blocking plate, and when the movable plate moves, it drives the moving rod to move towards the blocking plate. The fixed plate is fixedly installed on the surface of the processing plate, the moving rod slidably penetrates inside the fixed plate, the second spring is arranged between the moving rod and the fixed plate, the movable plate is fixedly installed on the side of the moving rod close to the fixed plate, the grip rod is fixedly installed on the side of the movable plate far from the processing plate, the docking rod is fixedly installed on the side of the movable plate far from the grip rod, the adapter seat is fixedly installed on the top of the fixed plate, the rotating plate is rotatably installed inside the adapter seat, the blocking plate is fixedly installed on the top of the fixed plate. A second spherical surface is provided at the end of the docking rod far from the movable plate. During the movement, the second inclined surface of the limiting plate contacts the second spherical surface. When the second inclined surface continues to move, it applies a thrust to the second spherical surface, and under the influence of the thrust, the docking rod moves towards the movable plate.

[0013] According to the above technical solution, a volute spring is provided between the rotating plate and the connecting seat. A semi-circular groove is formed on the side of the rotating plate away from the grip rod. The circumferential surface of the grip rod contacts the semi-circular groove during movement, so that the rotating plate applies a limit to the movement of the grip rod. At the same time, the docking rod cannot contact the moving limit plate, and the rotating plate contacts the blocking plate.

[0014] The present invention provides a silicon crystal cylinder processing and grinding device for semiconductor production. It has the following beneficial effects: (1) For the silicon crystal cylinder processing and grinding device for semiconductor production, the T-shaped rod applies a thrust to the rubber plate under the action of tension, so that the first corrugation is in close contact with the silicon crystal cylinder. Through the tension applied during the deformation process of the first spring, it is ensured that the first corrugation is in close contact with the silicon crystal cylinder, which helps to improve the clamping stability. The two ends of the arc-shaped strip bend downward, and the anti-slip grooves of the arc-shaped strip are in close fit with the curved surface of the silicon crystal cylinder during the deformation process. The support force applied by the processing plate improves the grinding stability, and then the arc-shaped strip applies a pressure to the silicon crystal cylinder to ensure that the silicon crystal cylinder will not deflect during the grinding process and affect the grinding effect.

[0015] (2) For the silicon crystal cylinder processing and grinding device for semiconductor production, the second elastic piece applies a reaction force to the moving frame under its own elasticity. The two moving frames on both sides are in close contact under the influence of the reaction force. Through the reaction force applied by the second elastic piece, it is ensured that the glass cover can effectively prevent the powder generated during the grinding process from flying into the working area. The elastic piece is restored under its own elasticity. The elastic piece collides with the round rod during the restoration process to generate vibration. Through the intermittent collision between the elastic piece and the round rod, multiple vibrations are generated, and then the vibration is transmitted to the moving frame to avoid the accumulation of dust in the chute affecting the smooth movement of the moving frame.

[0016] (3) For the silicon crystal cylinder processing and grinding device for semiconductor production, the docking rod passes through the round hole, so that the docking rod limits the moving frame. By passing through the round hole, the docking rod limits the moving frame, so that the glass cover can only be opened after the staff operates in accordance with the specifications, which helps to improve the safety of operation. The rotating plate applies a limit to the movement of the grip rod. At the same time, the docking rod cannot contact the limit plate. By actively limiting the movable plate, it is convenient for the staff to rotate and use the docking rod according to the actual situation, which helps to improve the practicality of the docking rod. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a schematic diagram of the top structure of the processing plate of the present invention; Figure 3 For the present invention Figure 2 The enlarged schematic diagram at position A; Figure 4 It is a schematic diagram of the position structure of the driving motor and the loading plate of the present invention; Figure 5 Schematic diagram of the internal structure of the clamping device of the present invention; Figure 6 For the present invention Figure 5 Enlarged schematic diagram of the structure at position B in; Figure 7 Schematic diagram of the internal structure of the dust-proof device of the present invention; Figure 8 For the present invention Figure 7 Enlarged schematic diagram of the structure at position C in; Figure 9 Schematic diagram of the internal structure of the locking device of the present invention.

[0018] In the figure: 1, processing plate; 2, placing plate; 3, linear drive mechanism; 4, drive motor; 5, loading plate; 6, grinding mechanism; 7, electric push rod; 8, carrying plate; 9, T-shaped rod; 10, first spring; 11, rubber plate; 12, lifting plate; 13, first elastic sheet; 14, connecting rod; 15, arc bar; 16, support rod; 161, moving frame; 162, glass cover; 163, rectangular plate; 164, second elastic sheet; 165, contact plate; 166, limiting plate; 167, cylindrical block; 168, elastic sheet; 169, round rod; 171, fixing plate; 172, moving rod; 173, second spring; 174, movable plate; 175, grip rod; 176, docking rod; 177, connecting seat; 178, rotating plate; 179, blocking plate. Specific embodiments

[0019] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0020] Please refer to Figures 1-9, an embodiment of the present invention is: a silicon crystal cylinder processing and grinding device for semiconductor production, including a processing plate 1, a placing plate 2 is fixedly installed on the top of the processing plate 1, a linear driving mechanism 3 is fixedly penetrated through the top of the processing plate 1, a driving motor 4 is fixedly installed on the top of the moving end of the linear driving mechanism 3, a loading plate 5 is fixedly installed at the output end of the driving motor 4, a grinding mechanism 6 is fixedly penetrated through one end of the loading plate 5 away from the driving motor 4, a chute is opened on the top of the processing plate 1, and a clamping device is further included; wherein, the clamping device includes an electric push rod 7, a carrying plate 8, a T-shaped rod 9, a first spring 10, a rubber plate 11, a lifting plate 12, a first elastic sheet 13, two connecting rods 14, an arc-shaped strip 15 and a support rod 16. The electric push rod 7 is fixedly installed on the top of the processing plate 1, the carrying plate 8 is fixedly installed at the output end of the electric push rod 7, the T-shaped rod 9 slides through the side of the carrying plate 8 away from the electric push rod 7, the first spring 10 is arranged between the T-shaped rod 9 and the carrying plate 8, the rubber plate 11 is fixedly installed on the side of the T-shaped rod 9 away from the carrying plate 8, the lifting plate 12 slides through the top of the carrying plate 8, the first elastic sheet 13 is arranged between the lifting plate 12 and the carrying plate 8, two connecting rods 14 are fixedly installed on the side of the lifting plate 12 away from the electric push rod 7, the arc-shaped strip 15 is arranged at both ends of the connecting rod 14 away from the lifting plate 12, the support rod 16 is fixedly installed at the bottom of the lifting plate 12, the support rod 16 slides through the bottom of the carrying plate 8, and a first corrugation is opened on the side of the rubber plate 11 away from the carrying plate 8. Through the pulling force applied during the deformation of the first spring 10, it is ensured that the first corrugation is in close contact with the silicon crystal cylinder, which helps to improve the clamping stability.

[0021] A first spherical surface is opened at one end of the T-shaped rod 9 close to the lifting plate 12, and a first inclined surface is opened on the side of the lifting plate 12 close to the T-shaped rod 9. By opening the first spherical surface and the first inclined surface, it is ensured that when the first inclined surface contacts the first spherical surface, the T-shaped rod 9 can move downward smoothly.

[0022] The arc-shaped strip 15 itself has elasticity, and an anti-slip groove is opened on the side of the arc-shaped strip 15 close to the rubber plate 11. By the supporting force applied by the processing plate 1, the stability of the carrying plate 8 during grinding is improved, and then the arc-shaped strip 15 applies pressure to the silicon crystal cylinder to ensure that the silicon crystal cylinder does not deflect during the grinding process and affect the grinding effect.

[0023] During the operation of this embodiment, the silicon crystal cylinder is placed on the top of the placement plate 2. The electric push rod 7 is started, and the output end of the electric push rod 7 drives the carrier plate 8 to move towards the placement plate 2. The movement of the carrier plate 8 drives the T-shaped rod 9 to move towards the placement plate 2. The movement of the T-shaped rod 9 drives the rubber plate 11 to move towards the placement plate 2. The first corrugation of the rubber plate 11 contacts the silicon crystal cylinder during the movement. The rubber plate 11 stops moving under the blocking force exerted by the silicon crystal cylinder. The carrier plate 8 continues to move and stretches the first spring 10. The first spring 10 deforms under the stretching force. The first spring 10 exerts a pulling force on the T-shaped rod 9 under the action of its own elasticity. The T-shaped rod 9 exerts a pushing force on the rubber plate 11 under the action of the pulling force, making the first corrugation in close contact with the silicon crystal cylinder. Through the pulling force exerted during the deformation process of the first spring 10, it is ensured that the first corrugation is in close contact with the silicon crystal cylinder, which helps to improve the stability of clamping. The carrier plate 8 continues to move and drives the lifting plate 12 to move. The first inclined surface of the lifting plate 12 contacts the first spherical surface during the movement. The first inclined surface continues to move and moves downward under the resistance exerted by the first spherical surface. The lifting plate 12 moves downward and squeezes the first elastic sheet 13. The first elastic sheet 13 deforms under the extrusion. The lifting plate 12 moves and drives the support rod 16 to move downward. The support rod 16 contacts the top of the processing plate 1 during the movement. The processing plate 1 exerts an upward supporting force on the support rod 16. The support rod 16 transmits the supporting force to the carrier plate 8. At the same time, the lifting plate 12 moves and drives the connecting rod 14 to move downward. The movement of the connecting rod 14 drives the arc-shaped strip 15 to move downward. The middle position of the arc-shaped strip 15 contacts the curved surface of the silicon crystal cylinder during the movement. The middle position of the arc-shaped strip 15 stops moving under the blocking force. The connecting rod 14 moves and stretches the two ends of the arc-shaped strip 15. The arc-shaped strip 15 deforms under the stretching force, making the two ends of the arc-shaped strip 15 bend downward. The anti-slip groove of the arc-shaped strip 15 is in close fit with the curved surface of the silicon crystal cylinder during the deformation process. After the silicon crystal cylinder is clamped, the staff starts the linear driving mechanism 3. The moving end of the linear driving mechanism 3 drives the driving motor 4 to move back and forth. The driving motor 4 is started, and the output end of the driving motor 4 drives the loading plate 5 to move towards the placement plate 2. The movement of the loading plate 5 drives the grinding mechanism 6 to move towards the placement plate 2. The grinding mechanism 6 is started to grind the silicon crystal cylinder. The stability of grinding is improved by the supporting force exerted by the processing plate 1. Then, the arc-shaped strip 15 exerts a pressure on the silicon crystal cylinder to ensure that the silicon crystal cylinder will not deflect during the grinding process and affect the grinding effect.

[0024] Please refer to Figures 1-9, on the basis of the above embodiments, in another embodiment of the present invention, a dust-proof device and a locking device are further included; the dust-proof device includes a moving frame 161, a glass cover 162, a rectangular plate 163, a second elastic piece 164, a contact plate 165, a limiting plate 166, a cylindrical block 167, an elastic piece 168 and a round rod 169. The moving frame 161 is slidably installed on the top of the chute, the glass cover 162 is fixedly installed inside the moving frame 161, the rectangular plate 163 is slidably installed on the inner wall of the moving frame 161, the second elastic piece 164 is arranged between the rectangular plate 163 and the moving frame 161, the contact plate 165 is fixedly installed at the bottom of the rectangular plate 163, the limiting plate 166 is fixedly installed on the outer wall of the moving frame 161, the cylindrical block 167 is fixedly installed on the surface of the rectangular plate 163, the elastic piece 168 is fixedly installed on the inner wall of the moving frame 161, and the round rod 169 is fixedly installed on the inner wall of the moving frame 161. Through the reaction force exerted by the second elastic piece 164, it is ensured that the glass cover 162 can effectively prevent the powder generated during the grinding process from flying into the working area, thereby reducing the cleaning burden of the staff.

[0025] The elastic pieces 168 are equidistantly distributed on the inner wall of the moving frame 161 with the rectangular plate 163 as the axis of symmetry. A second inclined surface is formed on the surface of the limiting plate 166 close to the placing plate 2, and a round hole is formed on the surface of the limiting plate 166 far from the moving frame 161. Through the intermittent collision between the elastic piece 168 and the round rod 169 to generate multiple vibrations, and then transmit the vibrations to the moving frame 161, it is avoided that the accumulated dust in the chute affects the smooth movement of the moving frame 161.

[0026] An arc surface 1 is formed on the surface of the elastic piece 168 far from the round rod 169, and the elastic piece 168 is in contact with the circumferential surface of the round rod 169. By forming the arc surface 1, it is ensured that the elastic piece 168 does not hinder the staff from resetting the cylindrical block 167 to the initial position.

[0027] The locking device includes a fixing plate 171, a moving rod 172, a second spring 173, a movable plate 174, a grip rod 175, a docking rod 176, a connecting seat 177, a rotating plate 178 and a blocking plate 179. The fixing plate 171 is fixedly installed on the surface of the processing plate 1. The moving rod 172 slides through the inside of the fixing plate 171. The second spring 173 is arranged between the moving rod 172 and the fixing plate 171. The movable plate 174 is fixedly installed on the side of the moving rod 172 close to the fixing plate 171. The grip rod 175 is fixedly installed on the side of the movable plate 174 away from the processing plate 1. The docking rod 176 is fixedly installed on the side of the movable plate 174 away from the grip rod 175. The connecting seat 177 is fixedly installed on the top of the fixing plate 171. The rotating plate 178 is rotatably installed inside the connecting seat 177. The blocking plate 179 is fixedly installed on the top of the fixing plate 171. A spherical surface two is provided at one end of the docking rod 176 away from the movable plate 174. The moving frame 161 is limited by passing the docking rod 176 through the circular hole, so that the staff can open the glass cover 162 only after standard operation, which helps to improve the safety of the operation.

[0028] A scroll spring is arranged between the rotating plate 178 and the connecting seat 177. A semi-circular groove is provided on the side of the rotating plate 178 away from the grip rod 175. The rotating plate 178 contacts the blocking plate 179. By actively limiting the movable plate 174, it is convenient for the staff to rotate and use the docking rod 176 according to the actual situation, which helps to improve the practicability of the docking rod 176.

[0029] During the operation of this embodiment, when the lifting plate 12 moves and contacts the contact plate 165, the movement of the lifting plate 12 applies a thrust to the contact plate 165. Affected by the thrust, the contact plate 165 moves towards the placing plate 2. The movement of the contact plate 165 drives the rectangular plate 163 to move towards the placing plate 2. The movement of the rectangular plate 163 drives the moving frame 161 to move towards the placing plate 2. The movement of the moving frame 161 drives the limiting plate 166 to move towards the placing plate 2. At the same time, the movement of the moving frame 161 drives the glass cover 162 to move towards the placing plate 2. The two moving frames 161 come into contact during the movement process. Blocked, the moving frame 161 stops moving. The lifting plate 12 continues to apply a thrust to the contact plate 165. Affected by the thrust, the contact plate 165 moves, causing the rectangular plate 163 to continue moving and squeezing the second elastic piece 164. The second elastic piece 164 deforms under the extrusion. The deformed second elastic piece 164 exerts a reaction force on the moving frame 161 under the action of its own elasticity. Affected by the reaction force, the two moving frames 161 are in close contact. Through the reaction force applied by the second elastic piece 164, it is ensured that the glass cover 162 can effectively prevent the powder generated during the grinding process from flying into the working area. While the rectangular plate 163 moves, it drives the cylindrical block 167 to move towards the elastic piece 168. During the movement, the cylindrical block 167 contacts the elastic piece 168, causing the cylindrical block 167 to continue moving and squeezing the elastic piece 168. The elastic piece 168 deforms under the extrusion. The surface of the deformed elastic piece 168 that contacts the round rod 169 separates. When the surface of the cylindrical block 167 that contacts the elastic piece 168 separates, the elastic piece 168 restores itself under the action of its own elasticity. During the restoration process, the elastic piece 168 collides with the round rod 169 to generate vibration. When the cylindrical block 167 moves back and contacts the arc surface one of the elastic piece 168, the cylindrical block 167 continues to move and squeeze the arc surface one. The elastic piece 168 deforms under the extrusion. When the cylindrical block 167 separates from the arc surface one, the elastic piece 168 automatically restores itself. Through the intermittent collision of the elastic piece 168 and the round rod 169, multiple vibrations are generated, and then the vibrations are transmitted to the moving frame 161 to prevent the dust accumulated in the chute from affecting the smooth movement of the moving frame 161; The second inclined surface of the limit plate 166 contacts the second spherical surface during movement. As the second inclined surface continues to move, it exerts a thrust on the second spherical surface. Under the influence of the thrust, the docking rod 176 moves towards the movable plate 174. The movement of the docking rod 176 drives the movable plate 174 to move towards the blocking plate 179. The movement of the movable plate 174 drives the moving rod 172 to move towards the blocking plate 179. The moving rod 172 moves to compress the second spring 173. The second spring 173 deforms under the compression. The deformed second spring 173 stores energy under the action of its own elasticity. When the limit plate 166 moves to the specified position, the surface in contact with the second spherical surface separates, causing the second spring 173 to recover and drive the moving rod 172 to move away from the blocking plate 179. The movement of the moving rod 172 drives the movable plate 174 to move away from the blocking plate 179. The movement of the movable plate 174 drives the docking rod 176 to move away from the blocking plate 179. During the movement, the docking rod 176 passes through the circular hole, enabling the docking rod 176 to limit the movement of the moving frame 161. By passing the docking rod 176 through the circular hole to limit the moving frame 161, the glass cover 162 can only be opened by the staff after standard operation, which helps to improve the safety of the operation. When the staff does not need the docking rod 176 to limit the moving frame 161, manually press the rotating plate 178 to rotate away from the blocking plate 179. When the rotating plate 178 rotates, it stretches the scroll spring. The scroll spring deforms under the stretch. At the same time, the rotating plate 178 separates from the blocking plate 179. Then pull the grip rod 175 to move towards the blocking plate 179. The movement of the grip rod 175 drives the movable plate 174 to move towards the blocking plate 179. The movement of the movable plate 174 drives the docking rod 176 to move towards the blocking plate 179. After the grip rod 175 moves to the specified position, release the rotating plate 178. The scroll spring recovers and drives the rotating plate 178 to return to the initial position. The rotating plate 178 contacts the blocking plate 179 and stops rotating. Release the grip rod 175. The second spring 173 recovers and drives the moving rod 172 to move towards the processing plate 1. The movement of the moving rod 172 drives the movable plate 174 to move towards the processing plate 1. The movement of the movable plate 174 drives the grip rod 175 to move towards the processing plate 1. The circumferential surface of the grip rod 175 contacts the semi-circular groove during movement, enabling the rotating plate 178 to limit the movement of the grip rod 175. At the same time, the docking rod 176 cannot contact the moving limit plate 166. By actively limiting the movable plate 174, it is convenient for the staff to rotate and use the docking rod 176 according to the actual situation, which helps to improve the practicality of the docking rod 176.

[0030] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A silicon wafer cylindrical processing and grinding device for semiconductor production, comprising a processing plate (1), characterized in that: It also includes a clamping device, a dustproof device and a locking device, wherein a placing plate (2) is fixedly mounted on the top of the processing plate (1), a linear driving mechanism (3) is fixedly penetrated through the top of the processing plate (1), a driving motor (4) is fixedly mounted on the top of the moving end of the linear driving mechanism (3), a loading plate (5) is fixedly mounted on the output end of the driving motor (4), a grinding mechanism (6) is fixedly penetrated through the end of the loading plate (5) away from the driving motor (4), and a slide groove is provided on the top of the processing plate (1); The clamping device comprises an electric push rod (7), a carrying plate (8), a T-shaped rod (9), a first spring (10), a rubber plate (11), a lifting plate (12), a first spring sheet (13), two connecting rods (14), an arc strip (15) and a support rod (16); the electric push rod (7) is fixedly mounted on the top of the processing plate (1); the carrying plate (8) is fixedly mounted on the output end of the electric push rod (7); the T-shaped rod (9) slides through a side of the carrying plate (8) away from the electric push rod (7); the first spring (10) is arranged between the T-shaped rod (9) and the carrying plate (8); the rubber plate (11) is fixedly mounted on The T-shaped rod (9) is located on a side away from the carrying plate (8); the lifting plate (12) slides through the top of the carrying plate (8); the first spring sheet (13) is arranged between the lifting plate (12) and the carrying plate (8); the two connecting rods (14) are fixedly mounted on a side of the lifting plate (12) away from the electric push rod (7); the arc strips (15) are arranged at both ends of the connecting rods (14) away from the lifting plate (12); the support rod (16) is fixedly mounted on the bottom of the lifting plate (12); the support rod (16) slides through the bottom of the carrying plate (8); and the rubber plate (11) is provided with a corrugated surface on a side away from the carrying plate (8).

2. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 1, characterized in that: A spherical surface is provided on one end of the T-shaped rod (9) close to the lifting plate (12), and an inclined surface is provided on one side of the lifting plate (12) close to the T-shaped rod (9).

3. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 2, characterized in that: The arc strip (15) itself is elastic, and a non-slip groove is provided on a side of the arc strip (15) close to the rubber plate (11).

4. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 3, characterized in that: The dustproof device comprises a moving frame (161), a glass cover (162), a rectangular plate (163), a second spring sheet (164), a contact plate (165), a limit plate (166), a cylindrical block (167), an elastic sheet (168) and a round rod (169); the moving frame (161) is slidably mounted on the top of the slide groove; the glass cover (162) is fixedly mounted inside the moving frame (161); the rectangular plate (163) is slidably mounted on the inner wall of the moving frame (161); The second spring sheet (164) is arranged between the rectangular plate (163) and the moving frame (161), the contact plate (165) is fixedly mounted on the bottom of the rectangular plate (163), the limit plate (166) is fixedly mounted on the outer wall of the moving frame (161), the cylindrical block (167) is fixedly mounted on the surface of the rectangular plate (163), the elastic sheet (168) is fixedly mounted on the inner wall of the moving frame (161), and the round rod (169) is fixedly mounted on the inner wall of the moving frame (161).

5. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 4, characterized in that: The elastic sheets (168) are equidistantly distributed on the inner wall of the movable frame (161) with the rectangular plate (163) as the axis of symmetry; a second inclined surface is provided on a side of the limiting plate (166) close to the placement plate (2); and a circular hole is provided on a side of the limiting plate (166) away from the movable frame (161).

6. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 5, characterized in that: A curved surface 1 is provided on a surface of the elastic sheet (168) away from the round rod (169), and the elastic sheet (168) is in contact with the circumferential surface of the round rod (169).

7. The device for grinding a silicon wafer cylinder for semiconductor production according to claim 6, characterized in that: The locking device comprises a fixed plate (171), a moving rod (172), a second spring (173), a movable plate (174), a gripping rod (175), a docking rod (176), a docking seat (177), a rotating plate (178) and a blocking plate (179), wherein the fixed plate (171) is fixedly mounted on the surface of the processing plate (1), the moving rod (172) slides through the interior of the fixed plate (171), the second spring (173) is arranged between the moving rod (172) and the fixed plate (171), and the movable plate (174) is fixedly mounted on the moving rod (17 2) a side close to the fixed plate (171), the gripping rod (175) is fixedly mounted on a side of the movable plate (174) away from the processing plate (1), the docking rod (176) is fixedly mounted on a side of the movable plate (174) away from the gripping rod (175), the connecting seat (177) is fixedly mounted on the top of the fixed plate (171), the rotating plate (178) is rotatably mounted inside the connecting seat (177), the blocking plate (179) is fixedly mounted on the top of the fixed plate (171), and a spherical surface 2 is provided on one end of the docking rod (176) away from the movable plate (174).

8. The silicon wafer cylindrical processing and grinding device for semiconductor production according to claim 7, characterized in that: A spiral spring is provided between the rotating plate (178) and the connecting seat (177); a semicircular groove is provided on a side of the rotating plate (178) away from the gripping rod (175); and the rotating plate (178) is in contact with the blocking plate (179).

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