A software and hardware module for intelligent service robot

Abstract

This invention discloses a hardware and software module for an intelligent service robot, relating to the field of machine control module technology. It includes a module carrier frame with a layered folding mechanism inside for optimizing circuit layout. The circuit board is designed to be foldable in the middle, with circuit components and their layout separated. The hardware and software modules are mounted on opposite sides, employing a modular and foldable layout. The hardware module is mounted on the upper rear side of the circuit board, with related circuitry above the board. The software module carrier is located on the lower front side of the circuit board, with corresponding circuitry below the board. This layout effectively reduces the possibility of signal interference between hardware and software. Because the signal lines of different functional modules are separated, signal crosstalk is reduced, ensuring the stability and accuracy of signal transmission between the hardware and software modules, thereby improving the overall reliability of the robot's operation.

Description

Technical Field

[0001] This invention relates to the field of machine control module technology, specifically to a hardware and software module for an intelligent service robot. Background Technology

[0002] Hardware and software modules are key components of a robot. Hardware modules include physical components such as sensors, actuators, and processors, while software modules include non-physical elements such as control programs and algorithms. The two work together: the hardware module provides the operating environment for the software and executes the instructions issued by the software, while the software module directs the hardware's actions and data processing functions.

[0003] Compared to existing hardware and software modules, the design approach generally focuses on functional implementation and often lacks systematic planning in circuit board layout. Many design habits concentrate the connection lines and components of hardware and software modules in the same plane area, causing the connection lines to cross and entangle. This chaotic layout forces the circuit boards to connect various components in a roundabout way, which greatly increases the difficulty of wiring. Complex wiring not only occupies more circuit board area, but also easily leads to line crossing and overlapping, resulting in a significant increase in the risk of signal interference.

[0004] Furthermore, given that the hardware and software components are located on the same side and their connection lines are mixed together, when the hardware is running, strong electrical interference signals generated by motor operation and high-frequency signals during high-speed data transmission propagate in the same area as the relatively weaker and interference-sensitive data read / write signals and command transmission signals in the software module. This signal mixing can easily cause signal interference problems. Strong interference signals from the hardware can enter the software signal transmission lines, causing errors in the data received by the software and abnormal command transmission, which in turn makes the robot's software system unstable and causes various logical errors.

[0005] Existing technologies mostly adopt rigid single-board structures. When hardware or software modules need to be replaced, the entire circuit board must be disassembled. In particular, hardware modules are often connected to the motherboard by soldering, and their fixed physical position makes modular replacement difficult. This significantly increases maintenance time and costs, and other components are easily damaged during disassembly and assembly. Conversely, when hardware modules need to be expanded locally, they are also limited by planar layout space. For example, when adding a sensor module, the original circuit board area has been occupied by the software module, and the wiring layer or expansion connectors need to be redesigned, which leads to an extension of the hardware iteration cycle and requires additional wiring resources.

[0006] Therefore, in view of this, the present invention proposes a software and hardware module for intelligent service robots to make up for and improve the deficiencies of the prior art. Summary of the Invention

[0007] To address the aforementioned technical problems, this invention provides a hardware and software module for intelligent service robots, thereby resolving the technical issues raised in the background section.

[0008] To achieve the above objectives, the technical solution adopted by the present invention is as follows: a software and hardware module for an intelligent service robot, including a module carrier frame, wherein a layered folding mechanism is provided inside the module carrier frame, the layered folding mechanism is used to optimize the circuit layout, enhance electromagnetic shielding, and thus improve the overall efficiency and stability.

[0009] Furthermore, the layered folding mechanism includes a circuit board installed inside the module carrier frame, with a hardware module mounted on the surface of the circuit board and a software module carrier mounted on the surface of the circuit board.

[0010] Furthermore, the circuit board is configured to be foldable in the middle, and the circuit elements and layout on the circuit board are arranged separately. The hardware module is installed on the upper rear side of the circuit board, and the connection lines and components between the circuit board and the hardware module are designed on the upper side of the circuit board. The software module carrier is installed on the lower front side of the circuit board, and the connection lines and components between the circuit board and the software module carrier are designed on the lower side of the circuit board.

[0011] By adopting the above technical solution, the circuit layout design is carried out on the non-foldable parts of the circuit board surface, so as to reduce the layout of critical lines and components in the folded parts.

[0012] Furthermore, limit frames are symmetrically installed on both sides of the hardware module and software module carrier, and an assembly shaft is installed inside the limit frames.

[0013] By adopting the above technical solution, the assembly shaft connects the hardware and software modules in different areas from top to bottom, so that the entire module forms a whole after assembly, which enhances the stability and integrity of the structure.

[0014] Furthermore, the outer wall of the assembly shaft is uniformly provided with multiple threaded grooves, the assembly shaft and the limiting buckle frame are movably connected through the threaded grooves, and an elastic element is installed in the middle of the assembly shaft.

[0015] By adopting the above technical solution, the folding changes of the assembly shaft adaptable circuit board are controlled and its folding range is limited, which effectively protects the integrity of the circuit and components and extends their service life.

[0016] Furthermore, a foldable plate is installed in the foldable part of the circuit board. The foldable plate is made of aluminum alloy and its surface is coated with a conductive coating. The foldable plate is symmetrically distributed with the circuit board as a reference, and its two ends are respectively fixed to both sides of the foldable part of the circuit board.

[0017] By adopting the above technical solutions, the electromagnetic shielding effect can be enhanced, effectively blocking the influence of external electromagnetic interference on the signals on the circuit board, and also preventing the internal signals of the circuit board from interfering with the external environment.

[0018] Furthermore, the zigzag thin plate initially exhibits a corrugated and zigzag state, and supporting cylinders are fixedly connected at the zigzag points of the zigzag thin plate.

[0019] By adopting the above technical solutions, the structural strength of the curved thin plate is enhanced, enabling it to better withstand certain external impacts and vibrations, and protecting the circuit board from the influence of external physical factors.

[0020] Furthermore, a thermal pad is installed in the main heat-generating area of ​​the hardware module, and a heat dissipation assembly is installed on the upper surface of the thermal pad. The heat dissipation assembly consists of multiple sealed copper tubes filled with a low-boiling-point working liquid, which is acetone.

[0021] By adopting the above technical solution, efficient heat transfer is achieved through gas-liquid circulation, and the heat generated by the hardware is quickly transferred to the condensation section at the top of the device for heat dissipation.

[0022] Furthermore, in the heat dissipation assembly, the end of the copper pipe closest to the hardware module serves as the evaporation section, and the end furthest from the hardware module serves as the condensation section, with the radius ratio of the evaporation section to the condensation section being two to one.

[0023] By adopting the above technical solution, the larger evaporation section radius provides more space for the evaporation of acetone, which is conducive to the rapid evaporation of liquid to form steam, while the smaller condensation section radius makes the steam flow rate faster during the rising process.

[0024] Furthermore, connecting plates are uniformly installed on the outside of the copper tubes in the heat dissipation assembly, and sliding plates are uniformly fixedly connected to the inner wall of the condensation section in the heat dissipation assembly.

[0025] By adopting the above technical solution, the inclined surface of the slide can guide the condensed liquid to flow back quickly to the evaporation section, and the inclined surface design reduces the residence time of the liquid on the inner wall of the condensation section.

[0026] Furthermore, the connecting plate is cross-shaped and attached to the upper surface of the thermal pad. Both the thermal pad and the connecting plate are made of boron nitride material, and the slide plate is generally shaped with a pointed bevel.

[0027] Compared with the prior art, the beneficial effects of the present invention are:

[0028] (1) The device places the circuit board in the middle and the hardware and software modules on the two sides respectively. It adopts a modular and foldable layout. Specifically, the hardware module is installed on the upper rear side of the circuit board, and the relevant lines are on the upper side of the circuit board. The software module carrier is on the lower front side of the circuit board, and the corresponding lines are on the lower side of the circuit board. This layout effectively reduces the possibility of signal interference between hardware and software. Because the signal lines of different functional modules are separated, signal crosstalk is reduced, ensuring the stability and accuracy of signal transmission of hardware and software modules, thereby improving the overall reliability of robot operation.

[0029] Modular design ensures that each component has a clearly defined installation location and connection method. With prefabricated hardware and software modules and proper layout and connection to the circuit board, installation is smooth, facilitating production and assembly. During installation, workers can install the hardware and software modules onto the corresponding sides of the circuit board according to the predetermined module division. This clear operating procedure greatly reduces installation time and difficulty. Even personnel without professional technical backgrounds can complete the installation work after simple training. Conversely, disassembly can also be carried out in a modular manner. If a module malfunctions or needs to be replaced, the corresponding module can simply be removed from the circuit board without affecting the normal operation of other modules.

[0030] By producing circuit boards for hardware and those for software on separate production lines, specialized production can be achieved. Each production line can be optimized for the design and production of specific types of circuit boards, improving production efficiency. For example, the hardware circuit board production line can focus on the installation and soldering of hardware connection lines and components based on the characteristics of the hardware module, using specialized equipment and processes to improve production speed and quality. The software circuit board production line can focus on the processing of software module-related lines and components, achieving high-efficiency production.

[0031] Compared to the traditional method of mixing hardware and software components on a single production line, this parallel production model can make full use of production resources and improve production efficiency.

[0032] (2) The circuit board is designed to be foldable in the middle, which can increase the adaptability of the robot software and hardware modules in different application scenarios. For example, it can be used for robots that need to work in narrow or irregular spaces. By folding, it can better fit the shape of the space and complete the task. In addition, the circuit lines are planned and designed in the non-foldable part of the circuit board, which reduces the layout of critical lines and components in the folding part.

[0033] The assembly axis runs through and connects the hardware and software modules in different areas from top to bottom, making the entire module a whole after assembly. This enhances the stability and integrity of the structure. The assembly axis also adapts to the folding changes of the circuit board and limits the folding range, avoiding excessive stretching, bending or squeezing of the circuits and components during the folding process. This effectively protects the integrity of the circuits and components, extends their service life, and reduces the probability of failure.

[0034] (3) This device introduces a zigzag thin plate in the middle of the circuit board. The zigzag thin plate will change synchronously with the position of the circuit board. First, the zigzag thin plate is initially in a wavy and zigzag state. In the contracted state, it occupies very little space. For robot hardware and software modules with relatively compact internal space, it will not conflict with other components or modules around it, making the layout of the entire module more compact and reasonable. This helps to realize the miniaturization and integration design of the robot. Although it is in a contracted state, the aluminum alloy material itself has a certain electromagnetic shielding ability. In addition, the conductive coating on the surface can provide a good electromagnetic shielding effect for the circuit board without occupying too much space, thereby ensuring the normal operation of the electronic components on the circuit board and improving the stability and reliability of the entire hardware and software module.

[0035] Secondly, when the circuit board is folded, the folded thin plate will stretch along the bending direction of the circuit board. This adaptive stretching characteristic allows it to always cover the top and bottom parts of the circuit board, achieving all-round electromagnetic shielding. No matter what folding angle and shape the circuit board is in, the folded thin plate can fit tightly and continuously and effectively block electromagnetic interference, ensuring that the circuit board can operate in a relatively stable electromagnetic environment under various working conditions.

[0036] Among them, the supporting cylinders fixedly connected at the bending point of the curved thin plate can play a certain structural support role under normal conditions. They can enhance the structural strength of the curved thin plate itself, enabling it to better withstand certain external impacts and vibrations, and protect the circuit board from the influence of external physical factors. When the curved thin plate is stretched, they can ensure that the stress on each part of the curved thin plate is uniform during stretching, avoiding local overstretching or tearing, and maintaining the overall structural stability of the curved thin plate. At the same time, the supporting cylinders can also maintain a good connection with the two sides of the foldable part of the circuit board, so that the entire electromagnetic shielding structure will not loosen or fall off during the folding process, further enhancing the reliability of the electromagnetic shielding effect.

[0037] (4) The device installs a heat dissipation group consisting of multiple sealed copper tubes in the main heat-generating area of ​​the hardware module. The tubes are filled with low-boiling-point working liquids such as acetone. Utilizing the thermosiphon principle, efficient heat transfer is achieved through gas-liquid circulation, which quickly transfers the heat generated by the hardware to the condensation section at the top of the device for heat dissipation. Moreover, this heat dissipation structure does not require additional energy consumption and only relies on the thermosiphon effect to achieve gas-liquid circulation, which meets the needs of robot application scenarios that are sensitive to space and power consumption. At the same time, the design of the sealed copper tubes can be reasonably arranged according to the internal space of the module, making full use of the limited space to achieve efficient heat dissipation without causing too much impact on the overall structure and space occupation of the module.

[0038] Compared to traditional natural convection cooling, this heat dissipation structure significantly improves heat dissipation efficiency, effectively and promptly reducing the temperature of hardware modules, ensuring that the hardware operates within a suitable temperature range, improving hardware performance and reliability, and extending the hardware's lifespan.

[0039] The thermal pad is installed between the main heat-generating area of ​​the hardware module and the heat sink, effectively transferring the heat generated by the hardware to the copper pipes of the heat sink. The connecting plate is cross-shaped and fits onto the upper surface of the thermal pad, increasing the contact area and further improving the heat conduction efficiency. This allows heat to be quickly transferred from the hardware module to the heat sink, laying a good foundation for the subsequent heat dissipation process. In addition, the cross-shaped connecting plate design provides stable support and connection for the heat sink, firmly fixing it to the thermal pad and ensuring that the heat sink and the hardware module maintain good contact during robot operation.

[0040] The ratio of the evaporation section to the condensation section of the copper tube is 2:1. The larger radius of the evaporation section provides more space for the evaporation of acetone, which is conducive to the rapid evaporation of liquid into steam. The smaller radius of the condensation section increases the flow rate of steam during its ascent, allowing for more thorough contact with the inner wall of the condensation section and improving the condensation efficiency of the steam. At the same time, the condensed liquid can flow back to the evaporation section smoothly under the action of gravity, forming an efficient gas-liquid cycle and enhancing the heat transfer process.

[0041] The slide plate, which is uniformly and fixedly connected to the inner wall of the condensing section, has a pointed bevel shape. When the steam is cooled and liquefied in the condensing section, the bevel of the slide plate can guide the condensed liquid to flow back to the evaporation section quickly. The bevel design reduces the residence time of the liquid on the inner wall of the condensing section, avoids the accumulation of liquid from interfering with the rise of steam and the condensation process, ensures the smooth circulation of gas and liquid, and further improves the heat dissipation efficiency. Attached Figure Description

[0042] Figure 1 is a front-view stereoscopic structural diagram of the present invention;

[0043] Figure 2This is a three-dimensional structural diagram of the layered folding mechanism of the present invention;

[0044] Figure 3 This is a partial exploded view of the three-dimensional structure of the layered folding mechanism of the present invention;

[0045] Figure 4 This is a three-dimensional structural diagram of the assembly shaft in its normal state according to the present invention;

[0046] Figure 5 This is a three-dimensional structural diagram of the assembly shaft in its folded state according to the present invention;

[0047] Figure 6 This is a schematic diagram of the three-dimensional structure of the limiting buckle frame of the present invention;

[0048] Figure 7 For the present invention Figure 6 A magnified three-dimensional structural diagram of a portion of point A in the middle;

[0049] Figure 8 This is a three-dimensional structural diagram of the heat dissipation assembly of the present invention;

[0050] Figure 9 This is a schematic diagram of the three-dimensional structure of the connecting disk of the present invention;

[0051] Figure 10 For the present invention Figure 9 A magnified three-dimensional structural diagram of part B in the middle.

[0052] The numbers on the map are:

[0053] 1. Module carrier frame;

[0054] 2. Layered folding mechanism; 21. Circuit board; 22. Hardware module; 23. Software module carrier; 24. Limiting buckle frame; 25. Assembly shaft; 26. Elastic component; 27. Bending thin plate; 28. Support cylinder; 29. ​​Thermal pad; 210. Heat dissipation group; 211. Slide plate; 212. Connecting plate. Detailed Implementation

[0055] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0056] It should be noted that the structure and working principle of the above-mentioned module carrier frame 1, circuit board 21, hardware module 22 and software module carrier 23 are existing technologies and will not be described in detail here.

[0057] Example 1: Please refer to Figure 1 and Figure 2 As shown, a software and hardware module for an intelligent service robot includes a module carrier frame 1. The module carrier frame 1 is provided with a layered folding mechanism 2. The layered folding mechanism 2 is used to optimize the circuit layout, enhance electromagnetic shielding, and thus improve the overall efficiency and stability.

[0058] Please refer to Figure 1 to... Figure 7 As shown, the layered folding mechanism 2 includes a circuit board 21 installed inside the module carrier frame 1. A hardware module 22 is installed on the surface of the circuit board 21, and a software module carrier 23 is installed on the surface of the circuit board 21. The circuit board 21 is configured to be foldable in the middle. The circuit components and layout on the circuit board 21 are arranged separately. The hardware module 22 is installed on the upper rear side of the circuit board 21. The connection lines and components between the circuit board 21 and the hardware module 22 are designed on the upper part of the circuit board 21. The software module carrier 23 is installed on the lower front side of the circuit board 21. The connection lines and components between the circuit board 21 and the software module carrier 23 are designed on the lower part of the circuit board 21.

[0059] It should be noted that the hardware module 22 and the software module carrier 23 are symmetrically equipped with limit frames 24 on both sides. The limit frames 24 are equipped with an assembly shaft 25. The assembly shaft 25 runs through and connects the hardware and software modules distributed in different areas from top to bottom, so that the hardware and software modules form a whole after assembly. The outer wall of the assembly shaft 25 is evenly provided with multiple threaded grooves. The assembly shaft 25 and the limit frames 24 are movably connected through the threaded grooves. The middle part of the assembly shaft 25 is equipped with an elastic element 26. The foldable part in the middle of the circuit board 21 is equipped with a zigzag thin plate 27. The zigzag thin plate 27 is made of aluminum alloy and its surface is coated with a conductive coating. The zigzag thin plate 27 is symmetrically distributed with the circuit board 21 as a reference. Its two ends are fixed to the two sides of the foldable part of the circuit board 21. The zigzag thin plate 27 is initially in a corrugated state. The bending points of the zigzag thin plate 27 are all fixedly connected with support cylinders 28.

[0060] Specifically, circuit board 21 is installed inside module carrier frame 1. Because it is designed to be foldable in the middle, its accurate position within the carrier frame during installation ensures a stable foundation for the subsequent installation of hardware and software modules. Then, hardware module 22 is installed on the upper rear side of circuit board 21, ensuring that the symmetrical limiting frames 24 on both sides of hardware module 22 are aligned with the corresponding positions on circuit board 21. Software module carrier 23 is installed on the lower front side of circuit board 21, with an installation method similar to that of hardware module 22. Then, it is threaded through from top to bottom via assembly shaft 25. The threaded groove on the outer wall of assembly shaft 25 is threaded into the limiting frames 24. During the installation process, the hardware module 22 and the software module carrier 23 can be gradually fixed onto the circuit board 21, so that the three can initially form an integrated structure. After the installation is completed, the lines and components connecting the hardware module 22 and the circuit board 21 are arranged on the upper part of the circuit board 21 according to the design, and the lines and components connecting the software module carrier 23 and the circuit board 21 are arranged on the lower part of the circuit board 21. The installers must ensure that the lines are connected correctly and complete the electrical connection between the hardware module 22, the software module carrier 23 and the circuit board 21 to ensure that the three work together and that the hardware and software modules can transmit signals normally with the circuit board 21.

[0061] When the circuit board 21 is in an folded state, the corrugated thin plate 27, in a corrugated state, provides electromagnetic shielding protection for the top and bottom of the circuit board 21 using the electromagnetic shielding capability of the aluminum alloy material itself and the conductive coating on its surface. When the circuit board 21 is folded or during the folding process, firstly, the mounting shaft 25 adapts to the folding of the circuit board 21 with the help of the elastic member 26 in the middle, which limits the folding range of the circuit board 21 and prevents excessive stretching, bending or compression of the circuit and components during the folding process, effectively protecting the integrity of the circuit and components. Secondly, when the circuit board 21 is folded, the corrugated thin plate 27 stretches along the bending direction of the circuit board 21. Its adaptive stretching characteristics ensure that it can always tightly cover the top and bottom parts of the circuit board 21, achieving all-round electromagnetic shielding. No matter what folding state the circuit board 21 is in, the corrugated thin plate 27 can continuously and effectively block electromagnetic interference, providing a stable electromagnetic environment for the circuit board 21 and ensuring the normal operation of electronic components.

[0062] Example 2: Based on Example 1, please refer to... Figures 6 to 10As shown, a thermal pad 29 is installed in the main heat-generating area of ​​the hardware module 22. A heat dissipation assembly 210 is installed on the upper surface of the thermal pad 29. The heat dissipation assembly 210 is composed of multiple sealed copper tubes filled with a low-boiling-point working liquid, which is acetone. One end of the copper tube in the heat dissipation assembly 210 is close to the hardware module 22 as the evaporation section, and the other end is far from the hardware module 22 as the condensation section. The radius ratio of the evaporation section to the condensation section is 2:1. Connecting plates 212 are evenly installed on the outside of the copper tubes in the heat dissipation assembly 210. Slide plates 211 are evenly fixed to the inner wall of the condensation section in the heat dissipation assembly 210. The connecting plates 212 are cross-shaped and attached to the upper surface of the thermal pad 29. Both the thermal pad 29 and the connecting plates 212 are made of boron nitride. The slide plate 211 is generally shaped like a pointed bevel.

[0063] Specifically, the hardware module 22 generates heat during operation, especially as the temperature of the main heat-generating area gradually increases. The thermal pad 29, made of boron nitride, is installed in the main heat-generating area of ​​the hardware module 22 and has excellent thermal conductivity. It can effectively absorb the heat generated by the hardware module 22 and transfer it to the heat sink 210 that is attached to it. At the same time, the connecting plate 212, also made of boron nitride, is attached to the upper surface of the thermal pad 29 in a cross shape. The cross-shaped design increases the contact area with the thermal pad 29, further improving the heat conduction efficiency and enabling heat to be quickly transferred from the hardware module 22 to the copper pipe in the heat sink 210. In addition, the connecting plate 212 also provides stable support and connection for the heat sink 210, ensuring that the heat sink 210 and the hardware module 22 maintain good contact during robot operation.

[0064] The boiling point of acetone is 56.53℃. Under standard atmospheric pressure, its boiling point is generally considered to be between 56℃ and 57℃. Regarding the temperature range generated by the main heating area of ​​the hardware module 22 in the robot, the temperature of the main heating area of ​​the common robot hardware module 22 is around 40℃-80℃. Under high load and long-term operation, the temperature will exceed 80℃, and even reach 90℃-100℃.

[0065] The heat dissipation unit 210 consists of multiple sealed copper tubes filled with the low-boiling-point working liquid acetone. One end of each copper tube, close to the hardware module 22, serves as the evaporation section. The larger radius of this evaporation section provides more space for the acetone to evaporate. When heat is transferred to the evaporation section, the acetone absorbs heat and rapidly evaporates to form steam. After the steam forms in the evaporation section, due to pressure difference and thermosiphon effect, it rises towards the condensation section, which is further away from the hardware module 22. Since the ratio of the evaporation section radius to the condensation section radius is 2:1, the smaller condensation section radius increases the steam flow rate during its ascent, resulting in more thorough contact with the inner wall of the condensation section. When the vapor encounters cold air in the condensation section, it liquefies and releases heat. The slide plate 211, which is uniformly fixed to the inner wall of the condensation section, has a pointed sloping surface. After the vapor liquefies, the sloping surface of the slide plate 211 can guide the condensed liquid to flow back to the evaporation section quickly. The sloping surface design reduces the residence time of the liquid on the inner wall of the condensation section, avoids the accumulation of liquid from interfering with the rise of vapor and the condensation process, and ensures the smooth operation of the gas-liquid circulation. Under the action of gravity, the condensed liquid flows smoothly back to the evaporation section along the slide plate 211, absorbs heat again and evaporates, forming an efficient gas-liquid circulation, and continuously transfers the heat generated by the hardware module 22 to the condensation section for heat dissipation.

[0066] The sealed copper tube design allows for a reasonable layout within the module's internal space, making full use of the limited space to achieve efficient heat dissipation without significantly impacting the module's overall structure and space occupation. Furthermore, the heat dissipation unit 210 requires no additional energy consumption, meeting the needs of robot application scenarios that are sensitive to space and power consumption.

[0067] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A software and hardware module for intelligent service robots, comprising a module carrier frame (1), characterized in that: The interior of the module carrier frame (1) is provided with a layered folding mechanism (2) for optimizing the circuit layout, enhancing electromagnetic shielding and improving overall performance and stability. The layered folding mechanism (2) comprises a circuit board (21) mounted in the interior of the module carrier frame (1), the surface of the circuit board (21) is mounted with a hardware module (22), and the surface of the circuit board (21) is mounted with a software module carrier (23). The circuit board (21) is arranged in a foldable form in the middle, the circuit elements and layout on the circuit board (21) are arranged separately, the hardware module (22) is mounted above the rear side of the circuit board (21), the connecting lines and elements between the circuit board (21) and the hardware module (22) are designed above the circuit board (21), the software module carrier (23) is mounted below the front side of the circuit board (21), and the connecting lines and elements between the circuit board (21) and the software module carrier (23) are designed below the circuit board (21). The two side walls of the hardware module (22) and the software module carrier (23) are symmetrically mounted with limiting buckle frames (24), the interior of the limiting buckle frame (24) is mounted with an assembly shaft (25), the assembly shaft (25) penetrates through the software and hardware modules distributed in different areas from top to bottom, so that the software and hardware modules form an integral whole after assembly. The outer wall of the assembly shaft (25) is uniformly provided with a plurality of threaded grooves, the assembly shaft (25) and the limiting buckle frame (24) are movably connected through the threaded grooves, and the middle of the assembly shaft (25) is mounted with an elastic member (26). The middle foldable part of the circuit board (21) is mounted with a zigzag sheet (27), the zigzag sheet (27) is made of aluminum alloy material, the surface of the zigzag sheet (27) is coated with a conductive coating, the zigzag sheet (27) is symmetrically distributed with the circuit board (21) as a reference, and the two ends of the zigzag sheet (27) are respectively fixed on the two sides of the foldable part of the circuit board (21). The zigzag sheet (27) is initially in a corrugated and zigzag state, and the zigzag points of the zigzag sheet (27) are fixedly connected with supporting cylinders (28). The main heating area of the hardware module (22) is mounted with a heat-conducting pad (29), the upper surface of the heat-conducting pad (29) is mounted with a heat dissipation group (210), the heat dissipation group (210) is composed of a plurality of sealed copper pipes, the copper pipes are filled with a low-boiling working liquid, and the low-boiling working liquid is acetone. One end of the copper pipe of the heat dissipation group (210) close to the hardware module (22) is used as an evaporation section, the other end of the copper pipe away from the hardware module (22) is used as a condensation section, and the radius ratio of the evaporation section to the condensation section is two to one.

2. The software and hardware module for intelligent service robot according to claim 1, characterized in that: The outer wall of the copper pipe of the heat dissipation group (210) is uniformly mounted with a connecting disc (212), and the inner wall of the condensation section of the heat dissipation group (210) is fixedly connected with a sliding plate (211).

3. The software and hardware module for intelligent service robot according to claim 2, characterized in that: The connecting disc (212) is cruciform and is attached to the upper surface of the heat-conducting pad (29), the heat-conducting pad (29) and the connecting disc (212) are made of boron nitride material, and the sliding plate (211) is in the shape of a sharp inclined surface.

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