High-performance welding spot protection UV adhesive and preparation method thereof

Abstract

The invention belongs to the technical field of adhesives, and particularly relates to a high-performance welding spot protection UV adhesive and a preparation method thereof.The high-performance welding spot protection UV adhesive is prepared from, by weight, 45-55 parts of matrix resin, 15-25 parts of auxiliary resin, 3-13 parts of acrylic monomer, 11-21 parts of diluent, 2-4 parts of photoinitiator, 0.5-1.5 parts of coupling agent and 1-3 parts of white carbon black. A preparation method of the matrix resin comprises the following steps: mixing 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polycarbonate diol, adding a polymerization inhibitor and a catalyst, reacting at 70-80 DEG C for 1-3 hours, then adding 1-3 mol of dicyclohexylmethane diisocyanate, reacting for 1-3 hours, then adding 1-3 mol of hydroxyethyl methylacrylate, reacting for 2-3 hours, stopping heating, adding 1-3 mol of a catalyst, reacting for 1-3 hours, and cooling to room temperature to obtain the matrix resin. The matrix resin is obtained. The prepared UV adhesive for protecting the welding spots has high adhesive strength and good high and low temperature resistance and moisture resistance.

Description

Technical Field

[0001] The present invention belongs to the technical field of adhesives, and particularly relates to a high-performance solder joint protection UV adhesive and a preparation method thereof. Background Art

[0002] The solder joint protection UV glue is a kind of UV glue used for protecting the solder joints and connections of electronic components, and is widely applied to products such as electronic components, inductors, capacitors, circuit boards, flexible cables, data lines, connectors, speakers, etc. It mainly provides anti-corrosion protection, mechanical protection, insulation protection, high-temperature resistance protection, dust protection, etc. With the continuous development and progress of integrated circuits, the requirements for adhesion, flexibility, shrinkage rate, resistance to high and low temperatures, and resistance to moisture are also getting higher and higher. Ordinary solder joint protection glue can no longer meet these requirements, and developing new environmentally friendly high-performance solder joint protection UV glue products has become an urgent requirement in the market. Summary of the Invention

[0003] The first object of the present invention is to provide a high-performance solder joint protection UV adhesive, which has high adhesion, good high and low temperature resistance and moisture resistance.

[0004] The second object of the present invention is to provide a preparation method of a high-performance solder joint protection UV adhesive, which can prepare a solder joint protection UV adhesive with high adhesion, good high and low temperature resistance and moisture resistance. The preparation method is simple and suitable for industrial production.

[0005] In order to achieve the above invention objects, the technical solutions adopted by the present invention are as follows:

[0006] On the one hand, the present invention provides a high-performance solder joint protection UV adhesive, which comprises the following components in parts by weight:

[0007]

[0008]

[0009] Among them, the preparation method of the main resin is as follows:

[0010] Mix 0.5 - 1.5 mol of isophorone diisocyanate and 1 - 3 mol of polycarbonate diol, add a polymerization inhibitor and a catalyst, react at 70 - 80 °C for 1 - 3 hours, then add 1 - 3 mol of dicyclohexylmethane diisocyanate and react for 1 - 3 hours, then add 1 - 3 mol of 2-hydroxyethyl methacrylate and react for 2 - 3 hours, stop heating, and obtain the main resin.

[0011] Among them, the preparation method of the auxiliary resin is as follows: 0.5 - 1.5 mol of isophorone diisocyanate and 1 - 3 mol of polyether diol are mixed, a polymerization inhibitor and a catalyst are added, and the reaction is carried out at 70 - 80 °C for 1 - 3 hours. Then, 1 - 3 mol of isophorone diisocyanate is added and the reaction is carried out for 1 - 3 hours. Subsequently, 0.5 - 1.5 mol of hydroxyl polybutadiene is added and the reaction is carried out for 2 - 3 hours to obtain the auxiliary resin.

[0012] Among them, the acrylic monomer is at least one of tetrahydrofurfuryl acrylate, hydroxyethyl acrylate, and glycidyl methacrylate.

[0013] Among them, the diluent is at least one of isobornyl acrylate, trimethylolpropane triacrylate, and dipropylene glycol diacrylate.

[0014] Among them, the photoinitiator is a mixture composed of photoinitiator 184 and photoinitiator TMO in a mass ratio of 1 - 3:1.

[0015] Among them, the coupling agent is at least one of coupling agent KH570, coupling agent KH550, and coupling agent KH151.

[0016] On the other hand, the present invention provides a preparation method of a high-performance solder joint protection UV adhesive, including the following preparation steps: the main resin, acrylic monomer, auxiliary resin, diluent, photoinitiator, coupling agent, and fumed silica are mixed and stirred evenly to obtain a high-performance solder joint protection UV adhesive.

[0017] Among them, the stirring speed is 500 - 800 r / min, and the stirring time is 30 - 60 min.

[0018] The beneficial effects of the present invention:

[0019] The present invention obtains a high-performance solder joint protection UV adhesive with high bonding strength, good flexibility, low shrinkage rate, and good high and low temperature and moisture resistance by compounding the main resin prepared by a specific method, the auxiliary resin prepared by a specific method, acrylic monomer, diluent, photoinitiator, coupling agent, and fumed silica in a specific ratio. Specific embodiments

[0020] To make the objectives, technical solutions, and technical effects of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are clearly and completely described below. The embodiments described below are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art in combination with the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention. For those conditions not specified in the embodiments, they are carried out according to conventional conditions or conditions recommended by the manufacturer; for reagents or instruments whose manufacturers are not specified, they are all conventional products that can be obtained through commercial purchase.

[0021] In the description of the present invention, the term "and / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may indicate: A exists alone, A and B exist simultaneously, and B exists alone. Wherein A and B may be singular or plural. The character " / " generally indicates that the associated objects before and after are in an "or" relationship.

[0022] In the description of the present invention, "at least one" means one or more, and "a plurality" means two or more. "At least one (item)" or similar expressions thereof refer to any combination of these items, including any combination of single items (pieces) or plural items (pieces). For example, "at least one (item) of a, b, or c", or, "at least one (item) of a, b, and c" can all represent: a, b, c, a - b (that is, a and b), a - c, b - c, or a - b - c, where a, b, and c can be single or multiple respectively.

[0023] It should be understood that the weights of the relevant components mentioned in the embodiments of the present invention not only can refer to the specific contents of each component, but also can represent the proportional relationship of the weights between the components. Therefore, as long as the contents of the relevant components in the embodiments of the present invention are enlarged or reduced in proportion, they are within the scope disclosed by the present invention. Specifically, the weights described in the embodiments of the present invention can be mass units well-known in the chemical industry such as μg, mg, g, kg, etc.

[0024] In addition, unless otherwise explicitly stated in the context, the singular form of a word should be understood to include the plural form of the word. The terms "comprising" or "having" are intended to specify the existence of features, quantities, steps, operations, elements, parts, or combinations thereof, but are not used to exclude the existence or possible addition of one or more other features, quantities, steps, operations, elements, parts, or combinations thereof.

[0025] The embodiments of the present invention provide a high-performance solder joint protection UV adhesive, which comprises the following components in parts by weight:

[0026]

[0027] The solder joint protection UV adhesive of the present invention is compounded by mixing the main resin, auxiliary resin, acrylic monomer, diluent, photoinitiator, coupling agent and silica according to the above ratios, so as to enhance the bonding strength, improve the flexibility, reduce the shrinkage rate, and improve the performance of resistance to high and low temperatures and moisture.

[0028] Among them, the preparation method of the main resin is as follows:

[0029] Mix 0.5 - 1.5 mol of isophorone diisocyanate and 1 - 3 mol of polycarbonate diol, add a polymerization inhibitor and a catalyst, react at 70 - 80 °C for 1 - 3 hours, then add 1 - 3 mol of dicyclohexylmethane diisocyanate and react for 1 - 3 hours, then add 1 - 3 mol of 2 - hydroxyethyl methacrylate and react for 2 - 3 hours, and stop heating to obtain the main resin.

[0030] In the preparation process of the main resin of the present invention, isophorone diisocyanate (IPDI) and polycarbonate diol (PCDL) are used as the main reactants to form a prepolymer with high molecular weight and good elasticity, which can improve the mechanical strength and flexibility of the adhesive coating. The present invention also adds dicyclohexylmethane diisocyanate (HMDI) to expand the polymer chain and introduce additional cross - linking points, thereby improving the chemical resistance and weather resistance of the main resin. At the same time, the introduction of polycarbonate diol and dicyclohexylmethane diisocyanate makes the main resin have higher adhesion, better high - temperature resistance and higher bulk strength. The 2 - hydroxyethyl methacrylate (HEMA) added in this preparation method contains polymerizable double bonds, which can participate in the polymerization reaction during the subsequent curing process, enhance the compatibility and overall bonding performance between the main resin and other components of the present invention. At the same time, the hydroxyl group in HEMA can also form hydrogen bonds with the surface of inorganic substrates to improve the adhesion of the adhesive. This preparation method strictly controls the reaction temperature, time and reaction sequence to ensure the full progress of each stage of the reaction, avoid the generation of by - products, ensure the quality stability of the main resin, and make the subsequent curing process faster and more uniform, ensuring consistent product performance.

[0031] In summary, the main resin obtained by the preparation method of the present invention not only has high strength, high flexibility and excellent chemical resistance, but also has better adhesion and compatibility. As the main resin of the solder joint protection UV adhesive, it can improve the adhesive force, flexibility, shrinkage rate, and resistance to high and low temperatures and moisture of the adhesive.

[0032] Among them, the preparation method of the auxiliary resin is as follows: 0.5 - 1.5 mol of isophorone diisocyanate and 1 - 3 mol of polyether diol are mixed, a polymerization inhibitor and a catalyst are added, and the reaction is carried out at 70 - 80 °C for 1 - 3 hours. Then 1 - 3 mol of isophorone diisocyanate is added and the reaction is carried out for 1 - 3 hours. Then 0.5 - 1.5 mol of hydroxy polybutadiene is added and the reaction is carried out for 2 - 3 hours to obtain the auxiliary resin.

[0033] The preparation method of the auxiliary resin of the present invention uses isophorone diisocyanate and polyether diol as the main reactants to form a prepolymer with high elasticity. By introducing polyether diol, the auxiliary resin has excellent flexibility and elasticity, enabling it to return to its original state after undergoing large deformations. By adding isophorone diisocyanate again, the polymer chain is further extended and the crosslinking density is increased, which not only improves the mechanical strength of the auxiliary resin but also significantly enhances its high and low temperature resistance and moisture stability. Finally, hydroxy polybutadiene is added. This substance contains multiple active hydroxyl groups and can participate in the crosslinking reaction during the subsequent curing process, significantly improving the compatibility between the auxiliary resin and other components and the overall adhesion performance. In addition, the elastic properties of hydroxy polybutadiene itself further enhance the flexibility and impact resistance of the coating. At the same time, the introduction of both polyether diol and polybutene segments further improves the flexibility, low temperature resistance, and moisture resistance of the auxiliary resin. During the preparation process of the present invention, the reaction temperature (70 - 80 °C), time, and sequence are strictly controlled to ensure that the reactions in each stage proceed fully, avoid the generation of by-products, ensure the quality stability of the auxiliary resin, optimize its rheological properties, and facilitate the formation of a uniform coating after the adhesive cures.

[0034] Therefore, the auxiliary resin prepared by the preparation method of the present invention not only has high elasticity and flexibility, excellent high and low temperature and moisture resistance, but also has better adhesion and compatibility. When it is compounded with the main resin and other components of the present invention, the obtained solder joint protection UV adhesive has properties such as high adhesion, flexibility, shrinkage rate, high and low temperature resistance, and moisture resistance.

[0035] Among them, the acrylic monomer is at least one of tetrahydrofuran acrylate, hydroxyethyl acrylate, and glycidyl methacrylate.

[0036] Among them, the diluent is at least one of isobornyl acrylate, trimethylolpropane triacrylate, and dipropylene glycol diacrylate.

[0037] Among them, the photoinitiator is a mixture composed of photoinitiator 184 and photoinitiator TMO in a mass ratio of 1 - 3:1.

[0038] Among them, the coupling agent is at least one of coupling agent KH570, coupling agent KH550, and coupling agent KH151.

[0039] On the other hand, the present invention provides a method for preparing the above-mentioned high-performance solder joint protection UV adhesive, which includes the following preparation steps: mixing a main resin, an acrylic monomer, an auxiliary resin, a diluent, a photoinitiator, a coupling agent, and silica, and stirring evenly to obtain a high-performance solder joint protection UV adhesive.

[0040] The main resin in the present invention incorporates polycarbonate diol and dicyclohexylmethane diisocyanate, which improves adhesion, high-temperature resistance, and bulk strength. The auxiliary resin in the present invention incorporates polyether diol and polybutene segments, which improves flexibility, low-temperature resistance, and moisture resistance. Through the combination of the two resins with other components, the adhesion, flexibility, shrinkage rate, high and low temperature resistance, moisture resistance, and other properties are greatly improved.

[0041] Among them, the stirring speed is 500 - 800 r / min, and the stirring time is 30 - 60 min.

[0042] To enable those skilled in the art to clearly understand the above-mentioned implementation details and operations of the present invention, and to significantly reflect the improved performance of the embodiments of the present invention, the following uses multiple embodiments to illustrate the above-mentioned technical solutions.

[0043] Example 1

[0044] A method for preparing a high-performance solder joint protection UV adhesive, which includes the following preparation steps:

[0045] Step 1. Prepare the main resin:

[0046] Mix 1 mol of isophorone diisocyanate and 2 mol of polycarbonate diol, add 0.05 mol of hydroquinone monomethyl ether inhibitor and 0.1 mol of dibutyltin dilaurate catalyst, react at 75 °C for 2 hours, then add 2 mol of dicyclohexylmethane diisocyanate and react for 2 hours, then add 2 mol of 2-hydroxyethyl methacrylate and react for 2.5 hours, and stop heating to obtain the main resin.

[0047] Step 2. Prepare the auxiliary resin:

[0048] Mix 1 mol of isophorone diisocyanate and 2 mol of polyether diol, add 0.05 mol of hydroquinone monomethyl ether inhibitor and 0.1 mol of dibutyltin dilaurate catalyst, react at 75 °C for 2 hours, then add 2 mol of isophorone diisocyanate and react for 2 hours, then add 1 mol of hydroxyl-terminated polybutadiene and react for 2.5 hours to obtain the auxiliary resin.

[0049] Step 3: Mix 50 parts by weight of the main resin, 8 parts of tetrahydrofurfuryl acrylate, 20 parts of auxiliary resin, 16 parts of isobornyl acrylate diluent, 2 parts of photoinitiator 184, 1 part of photoinitiator TMO, 1 part of coupling agent KH570, and 2 parts of silica white at a stirring speed of 650 r / min for 45 min. After stirring evenly, a high-performance solder joint protection UV adhesive is obtained.

[0050] Example 2

[0051] A preparation method of a high-performance solder joint protection UV adhesive includes the following preparation steps:

[0052] Step 1: Prepare the main resin:

[0053] Mix 0.5 mol of isophorone diisocyanate and 1 mol of polycarbonate diol, add 0.01 mol of hydroquinone monomethyl ether inhibitor and 0.1 mol of dibutyltin dilaurate catalyst, react at 70 °C for 1 hour, then add 1 mol of dicyclohexylmethane diisocyanate and react for 1 hour, then add 1 mol of 2-hydroxyethyl methacrylate and react for 2 hours. Stop heating to obtain the main resin.

[0054] Step 2: Prepare the auxiliary resin:

[0055] Mix 0.5 mol of isophorone diisocyanate and 1 mol of polyether diol, add 0.01 mol of hydroquinone monomethyl ether inhibitor and 0.1 mol of dibutyltin dilaurate catalyst, react at 70 °C for 1 hour, then add 1 mol of isophorone diisocyanate and react for 1 hour, then add 0.5 mol of hydroxy-terminated polybutadiene and react for 2 hours to obtain the auxiliary resin.

[0056] Step 3: Mix 45 parts by weight of the main resin, 3 parts of tetrahydrofurfuryl acrylate, 15 parts of auxiliary resin, 11 parts of isobornyl acrylate diluent, 1 part of photoinitiator 184, 1 part of photoinitiator TMO, 0.5 part of coupling agent KH570, and 1 part of silica white at a stirring speed of 500 r / min for 30 min. After stirring evenly, a high-performance solder joint protection UV adhesive is obtained.

[0057] Example 3

[0058] A preparation method of a high-performance solder joint protection UV adhesive includes the following preparation steps:

[0059] Step 1: Prepare the main resin:

[0060] Mix 1.5 mol of isophorone diisocyanate and 3 mol of polycarbonate diol, add 0.1 mol of hydroquinone monomethyl ether inhibitor and 0.1 mol of dibutyltin dilaurate catalyst, react at 80 °C for 3 hours, then add 3 mol of dicyclohexylmethane diisocyanate and react for 3 hours, then add 3 mol of 2-hydroxyethyl methacrylate and react for 3 hours, stop heating to obtain the main resin.

[0061] Step 2: Prepare the auxiliary resin:

[0062] Mix 1.5 mol of isophorone diisocyanate and 3 mol of polyether diol, add 0.1 mol of hydroquinone monomethyl ether inhibitor and 0.1 mol of dibutyltin dilaurate catalyst, react at 80 °C for 3 hours, then add 3 mol of isophorone diisocyanate and react for 3 hours, then add 1.5 mol of hydroxy-terminated polybutadiene and react for 3 hours to obtain the auxiliary resin.

[0063] Step 3: By weight, mix 55 parts of the main resin, 13 parts of tetrahydrofurfuryl acrylate, 25 parts of the auxiliary resin, 21 parts of isobornyl acrylate diluent, 3 parts of photoinitiator 184, 1 part of photoinitiator TMO, 1.5 parts of coupling agent KH570, and 3 parts of fumed silica, stir at a stirring speed of 800 r / min for 60 min, after stirring evenly, obtain the high-performance solder joint protection UV adhesive.

[0064] Comparative Example 1

[0065] A preparation method of a solder joint protection UV adhesive. The difference between Comparative Example 1 and Example 1 is that the addition amount of the main resin in Comparative Example 1 is 70 parts by weight, the addition amount of the auxiliary resin is 0, and the other preparation conditions in Comparative Example 1 are the same as those in Example 1, which will not be elaborated here.

[0066] Performance test

[0067] Apply the solder joint protection UV adhesives prepared in Example 1 and Comparative Example 1 evenly on the surface of the PC substrate respectively, then press another PC substrate on the side coated with the adhesive, gently press to discharge the air bubbles inside the adhesive and make the adhesive layer evenly distributed, and use an ultraviolet light curing device to cure the adhesive and make the adhesive completely cured.

[0068] Test the hardness, shear strength, elongation at break and water absorption of the solder joint protection UV adhesives prepared in Example 1 and Comparative Example 1. Specifically:

[0069] Test the Shore D hardness of the solder joint protection UV adhesive according to the standard test method of ASTM D2240

[0070] The shear strength of the solder joint protection UV adhesive is tested according to the standard test method of ISO 4587 at room temperature;

[0071] The shear strength of the solder joint protection UV adhesive is tested according to the standard test method of ISO 18562 after 500 hours of thermal shock test at -40°C to 80°C;

[0072] The shear strength of the solder joint protection UV adhesive is tested according to the standard test method of ASTM D2093 after being exposed to the environment of high temperature and high humidity at 85°C, 85% RH for 500 hours;

[0073] The elongation at break of the solder joint protection UV adhesive is tested according to the standard test method of ASTM D638;

[0074] The water absorption rate of the solder joint protection UV adhesive is tested according to the standard test method of ASTM D570.

[0075] The test results are shown in the following table.

[0076]

[0077] It can be seen from the above test results that by compounding the main resin prepared by a specific method and the auxiliary resin prepared by a specific method with other components of the present invention, the solder joint protection UV adhesive obtained has good flexibility, high shear strength, excellent high and low temperature resistance, moisture resistance and other properties.

[0078] The above embodiments only represent several implementation manners of the present invention, and their descriptions are relatively specific and detailed, but should not be construed as limiting the scope of the patent of the present invention. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims

1. A high performance solder joint protection UV adhesive, characterized in that: The composition comprises the following components in parts by weight:

2. A high performance solder joint protection UV adhesive according to claim 1, characterized in that: The preparation method of the main resin is as follows: Mix 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polycarbonate diol, add inhibitor and catalyst, react at 70-80°C for 1-3 hours, then add 1-3 mol of dicyclohexylmethane diisocyanate and react for 1-3 hours, then add 1-3 mol of hydroxyethyl methacrylate and react for 2-3 hours, stop heating, and obtain the main resin.

3. A high performance solder joint protection UV adhesive according to claim 1, characterized in that: The preparation method of the auxiliary resin is as follows: 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polyether diol are mixed, an inhibitor and a catalyst are added, the mixture is reacted at 70-80° C. for 1-3 hours, 1-3 mol of isophorone diisocyanate is added, the mixture is reacted for 1-3 hours, 0.5-1.5 mol of hydroxy polybutadiene is added, the mixture is reacted for 2-3 hours, and the auxiliary resin is obtained.

4. The high performance solder joint protection UV adhesive according to claim 1, characterized in that: The acrylic monomer is at least one of tetrahydrofuran acrylate, hydroxyethyl acrylate and glycidyl methacrylate.

5. The high performance solder joint protection UV adhesive according to claim 1, characterized in that: The diluent is at least one of isobornyl acrylate, trimethylolpropane triacrylate and tripropylene glycol diacrylate.

6. The high performance solder joint protection UV adhesive according to claim 1, characterized in that: The photoinitiator is a mixture of photoinitiator 184 and photoinitiator TMO in a mass ratio of 1-3:

1.

7. The high performance solder joint protection UV adhesive according to claim 1, characterized in that: The coupling agent is at least one of coupling agent KH570, coupling agent KH550 and coupling agent KH151.

8. A method for preparing a high-performance solder joint protection UV adhesive according to any one of claims 1 to 7, characterized in that: The method comprises the following preparation steps: mixing a main resin, an acrylic monomer, an auxiliary resin, a diluent, a photoinitiator, a coupling agent and white carbon black, and stirring the mixture evenly to obtain a high-performance solder joint protection UV adhesive.

9. The method for preparing a high-performance solder joint protection UV adhesive according to claim 8, characterized in that: The stirring speed is 500-800 r / min, and the stirring time is 30-60 min.

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