High performance solder joint protection uv adhesive and method of making same

Abstract

The application belongs to the technical field of adhesives, and particularly relates to a high-performance welding spot protection UV adhesive and a preparation method thereof. The high-performance welding spot protection UV adhesive comprises the following components in parts by weight: 45-55 parts of a main resin, 15-25 parts of an auxiliary resin, 3-13 parts of an acrylic monomer, 11-21 parts of a diluent, 2-4 parts of a photoinitiator, 0.5-1.5 parts of a coupling agent, and 1-3 parts of white carbon black. The preparation method of the main resin comprises the following steps: mixing 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polycarbonate diol, adding a polymerization inhibitor and a catalyst, reacting at 70-80 DEG C for 1-3 hours, adding 1-3 mol of dicyclohexyl methane diisocyanate and reacting for 1-3 hours, adding 1-3 mol of hydroxyethyl methacrylate and reacting for 2-3 hours, and stopping heating to obtain the main resin. The prepared welding spot protection UV adhesive has high adhesion, good high and low temperature resistance, and good moisture resistance.

Description

Technical Field

[0001] This invention belongs to the field of adhesive technology, specifically relating to a high-performance UV adhesive for solder joint protection and its preparation method. Background Technology

[0002] UV solder joint protection adhesive is a type of UV adhesive used to protect solder joints and connections in electronic components. It is widely used in electronic components, inductors, capacitors, circuit boards, ribbon cables, data cables, connectors, speakers, and other products. Its main functions include providing corrosion protection, mechanical protection, insulation protection, high-temperature protection, and dust protection. With the continuous development and advancement of integrated circuits, the requirements for adhesion strength, flexibility, shrinkage rate, high and low temperature resistance, and moisture resistance are becoming increasingly stringent. Ordinary solder joint protection adhesives can no longer meet these requirements, making the development of new, environmentally friendly, high-performance UV solder joint protection adhesive products an urgent market demand. Summary of the Invention

[0003] The primary objective of this invention is to provide a high-performance UV adhesive for solder joint protection, which has high adhesion, good resistance to high and low temperatures, and good resistance to moisture.

[0004] The second objective of this invention is to provide a method for preparing a high-performance UV adhesive for solder joint protection, which can produce a UV adhesive for solder joint protection with high adhesion, good resistance to high and low temperatures and moisture. The preparation method is simple and suitable for industrial production.

[0005] To achieve the above-mentioned objectives, the technical solution adopted by this invention is as follows:

[0006] This invention provides a high-performance UV adhesive for protecting solder joints, comprising the following components in parts by weight:

[0007]

[0008]

[0009] The preparation method of the main resin is as follows:

[0010] Mix 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polycarbonate diol, add a polymerization inhibitor and a catalyst, and react at 70-80℃ for 1-3 hours. Then add 1-3 mol of dicyclohexylmethane diisocyanate and react for 1-3 hours. Then add 1-3 mol of hydroxyethyl methacrylate and react for 2-3 hours. Stop heating to obtain the main resin.

[0011] The auxiliary resin is prepared as follows: 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polyether diol are mixed, a polymerization inhibitor and a catalyst are added, and the mixture is reacted at 70-80°C for 1-3 hours. Then, 1-3 mol of isophorone diisocyanate is added, and the mixture is reacted for 1-3 hours. Finally, 0.5-1.5 mol of hydroxyl polybutadiene is added, and the mixture is reacted for 2-3 hours to obtain the auxiliary resin.

[0012] The acrylic monomer is at least one of tetrahydrofuran acrylate, hydroxyethyl acrylate, and glycidyl methacrylate.

[0013] The diluent is at least one of isoborneol acrylate, trimethylolpropane triacrylate, and tripropylene glycol diacrylate.

[0014] The photoinitiator is a mixture of photoinitiator 184 and photoinitiator TMO in a mass ratio of 1-3:1.

[0015] The coupling agent is at least one of coupling agent KH570, coupling agent KH550, and coupling agent KH151.

[0016] Another aspect of the present invention provides a method for preparing a high-performance UV adhesive for solder joint protection, comprising the following preparation steps: mixing a main resin, an acrylic monomer, an auxiliary resin, a diluent, a photoinitiator, a coupling agent, and silica, and stirring evenly to obtain a high-performance UV adhesive for solder joint protection.

[0017] The stirring speed is 500-800 r / min, and the stirring time is 30-60 min.

[0018] The beneficial effects of this invention are:

[0019] This invention combines a main resin prepared by a specific method, an auxiliary resin prepared by a special method, an acrylic monomer, a diluent, a photoinitiator, a coupling agent, and silica in a specific ratio to obtain a high-performance UV adhesive for solder joint protection with high adhesion, good flexibility, low shrinkage, and good resistance to high and low temperatures and moisture. Detailed Implementation

[0020] To make the objectives, technical solutions, and technical effects of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. The embodiments described below are some embodiments of the present invention, but not all embodiments. All other embodiments obtained by those skilled in the art in conjunction with the embodiments of the present invention without creative effort are within the scope of protection of the present invention. Where specific conditions are not specified in the embodiments, conventional conditions or conditions recommended by the manufacturer shall be followed; where the manufacturers of reagents or instruments are not specified, they are all conventional products that can be purchased commercially.

[0021] In the description of this invention, the term "and / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0022] In the description of this invention, "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or multiple items. For example, "at least one of a, b, or c", or "at least one of a, b, and c", can both mean: a, b, c, ab (i.e., a and b), ac, bc, or abc, where a, b, and c can be single or multiple.

[0023] It should be understood that the weights of the relevant components mentioned in the embodiments of this invention can refer not only to the specific content of each component, but also to the proportional relationship between the weights of the components. Therefore, any scaling up or down of the content of the relevant components according to the embodiments of this invention is within the scope of this invention. Specifically, the weights mentioned in the embodiments of this invention can be well-known units of mass in the chemical industry, such as μg, mg, g, and kg.

[0024] Furthermore, unless the context explicitly uses it otherwise, the singular form of a word should be understood as including the plural form of that word. The terms "comprising" or "having" are intended to specify the presence of a feature, quantity, step, operation, element, part, or combination thereof, but are not intended to exclude the presence or possible addition of one or more other features, quantities, steps, operations, elements, parts, or combinations thereof.

[0025] This invention provides a high-performance UV adhesive for solder joint protection, comprising the following components in parts by weight:

[0026]

[0027] The UV adhesive for solder joint protection of the present invention is achieved by compounding the main resin, auxiliary resin, acrylic monomer, diluent, photoinitiator, coupling agent and precipitated silica in the above proportions to enhance adhesion, improve flexibility, reduce shrinkage, and improve resistance to high and low temperatures and moisture.

[0028] The preparation method of the main resin is as follows:

[0029] Mix 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polycarbonate diol, add a polymerization inhibitor and a catalyst, and react at 70-80℃ for 1-3 hours. Then add 1-3 mol of dicyclohexylmethane diisocyanate and react for 1-3 hours. Then add 1-3 mol of hydroxyethyl methacrylate and react for 2-3 hours. Stop heating to obtain the main resin.

[0030] In the preparation of the main resin of this invention, isophorone diisocyanate (IPDI) and polycarbonate diol (PCDL) are used as the main reactants to form a prepolymer with high molecular weight and good elasticity, which can improve the mechanical strength and flexibility of the adhesive coating. This invention also adds dicyclohexylmethane diisocyanate (HMDI) to extend the polymer chain and introduce additional crosslinking points, thereby improving the chemical resistance and weather resistance of the main resin. Simultaneously, the introduction of polycarbonate diol and dicyclohexylmethane diisocyanate gives the main resin higher adhesion, better high-temperature resistance, and higher bulk strength. The hydroxyethyl methacrylate (HEMA) added in this preparation method contains polymerizable double bonds, which can participate in inexpensive reactions during subsequent curing, enhancing the compatibility and overall adhesion between the main resin and other components of this invention. Furthermore, the hydroxyl groups in HEMA can form hydrogen bonds with inorganic aggregate surfaces, improving the adhesion of the adhesive. This preparation method strictly controls the reaction temperature, time, and reaction sequence to ensure the full progress of each stage of the reaction, avoid the formation of by-products, guarantee the quality stability of the main resin, and enable the subsequent curing process to be faster and more uniform, ensuring consistent product performance.

[0031] In summary, the main resin obtained by the preparation method of the present invention not only has high strength, high flexibility and excellent chemical resistance, but also has better adhesion and compatibility. As the main resin of the UV adhesive for solder joint protection, it can improve the adhesive's adhesion, flexibility, shrinkage rate, high and low temperature resistance and moisture resistance.

[0032] The auxiliary resin is prepared as follows: 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polyether diol are mixed, a polymerization inhibitor and a catalyst are added, and the mixture is reacted at 70-80°C for 1-3 hours. Then, 1-3 mol of isophorone diisocyanate is added, and the mixture is reacted for 1-3 hours. Finally, 0.5-1.5 mol of hydroxyl polybutadiene is added, and the mixture is reacted for 2-3 hours to obtain the auxiliary resin.

[0033] The preparation method of the auxiliary resin of this invention uses isophorone diisocyanate and polyether diol as the main reactants to form a highly elastic prepolymer. The introduction of polyether diol imparts excellent flexibility and elasticity to the auxiliary resin, enabling it to recover its original shape after undergoing significant deformation. Further addition of isophorone diisocyanate extends the polymer chain and increases the crosslinking density, which not only improves the mechanical strength of the auxiliary resin but also significantly enhances its high and low temperature resistance and moisture stability. Finally, hydroxyl polybutadiene is added. This substance contains multiple active hydroxyl groups, which can participate in the crosslinking reaction during subsequent curing, significantly improving the compatibility and overall adhesion between the auxiliary resin and other components. Furthermore, the elastic properties of hydroxyl polybutadiene itself further enhance the flexibility and impact resistance of the coating, and the simultaneous introduction of polyether diol and polybutene segments further improves the flexibility, low temperature resistance, and moisture resistance of the auxiliary resin. This invention strictly controls the reaction temperature (70-80℃), time, and sequence during the preparation process to ensure that the reaction at each stage is fully carried out, avoid the generation of by-products, guarantee the quality stability of the auxiliary resin, optimize its rheological properties, and facilitate the formation of a uniform coating after the adhesive has cured.

[0034] Therefore, the auxiliary resin prepared by the method of the present invention not only has high elasticity and flexibility, excellent resistance to high and low temperatures and moisture, but also has better adhesion and compatibility. When it is compounded with the main resin and other components of the present invention, the resulting UV adhesive for solder joint protection has high adhesion, flexibility, shrinkage rate, resistance to high and low temperatures, and resistance to moisture.

[0035] The acrylic monomer is at least one of tetrahydrofuran acrylate, hydroxyethyl acrylate, and glycidyl methacrylate.

[0036] The diluent is at least one of isoborneol acrylate, trimethylolpropane triacrylate, and tripropylene glycol diacrylate.

[0037] The photoinitiator is a mixture of photoinitiator 184 and photoinitiator TMO in a mass ratio of 1-3:1.

[0038] The coupling agent is at least one of coupling agent KH570, coupling agent KH550, and coupling agent KH151.

[0039] Another aspect of the present invention provides a method for preparing the above-mentioned high-performance UV adhesive for solder joint protection, comprising the following preparation steps: mixing a main resin, an acrylic monomer, an auxiliary resin, a diluent, a photoinitiator, a coupling agent, and silica, and stirring evenly to obtain a high-performance UV adhesive for solder joint protection.

[0040] The main resin of this invention incorporates polycarbonate diol and dicyclohexylmethane diisocyanate, which improves adhesion, high temperature resistance and bulk strength. The auxiliary resin of this invention incorporates polyether diol and polybutene segments, which improves flexibility, low temperature resistance and moisture resistance. By combining the two resins with other components, the adhesive strength, flexibility, shrinkage rate, high and low temperature resistance, and moisture resistance are greatly improved.

[0041] The stirring speed is 500-800 r / min, and the stirring time is 30-60 min.

[0042] To enable those skilled in the art to clearly understand the above-described implementation details and operations of the present invention, and to demonstrate the significant advancements in the performance of the embodiments of the present invention, the following examples illustrate the above technical solutions.

[0043] Example 1

[0044] A method for preparing a high-performance UV adhesive for solder joint protection includes the following preparation steps:

[0045] Step 1: Preparation of the main resin:

[0046] 1 mol of isophorone diisocyanate and 2 mol of polycarbonate diol were mixed, and 0.05 mol of hydroquinone monomethyl ether polymerization inhibitor and 0.1 mol of dibutyltin dilaurate catalyst were added. The mixture was reacted at 75°C for 2 hours, then 2 mol of dicyclohexylmethane diisocyanate was added and reacted for 2 hours, then 2 mol of hydroxyethyl methacrylate was added and reacted for 2.5 hours. Heating was then stopped to obtain the main resin.

[0047] Step 2: Preparation of auxiliary resin:

[0048] 1 mol of isophorone diisocyanate and 2 mol of polyether diol were mixed, and 0.05 mol of hydroquinone monomethyl ether polymerization inhibitor and 0.1 mol of dibutyltin dilaurate catalyst were added. The mixture was reacted at 75°C for 2 hours. Then, 2 mol of isophorone diisocyanate was added and the mixture was reacted for 2 hours. Finally, 1 mol of hydroxyl polybutadiene was added and the mixture was reacted for 2.5 hours to obtain the auxiliary resin.

[0049] Step 3: By weight, mix 50 parts of main resin, 8 parts of tetrahydrofuran acrylate, 20 parts of auxiliary resin, 16 parts of isobornyl acrylate diluent, 2 parts of photoinitiator 184, 1 part of photoinitiator TMO, 1 part of coupling agent KH570, and 2 parts of silica. Stir at 650 r / min for 45 min until homogeneous to obtain a high-performance UV adhesive for solder joint protection.

[0050] Example 2

[0051] A method for preparing a high-performance UV adhesive for solder joint protection includes the following preparation steps:

[0052] Step 1: Preparation of the main resin:

[0053] 0.5 mol of isophorone diisocyanate and 1 mol of polycarbonate diol were mixed, and 0.01 mol of hydroquinone monomethyl ether polymerization inhibitor and 0.1 mol of dibutyltin dilaurate catalyst were added. The mixture was reacted at 70 °C for 1 hour, then 1 mol of dicyclohexylmethane diisocyanate was added and reacted for 1 hour. Then 1 mol of hydroxyethyl methacrylate was added and the mixture was reacted for 2 hours. Heating was then stopped to obtain the main resin.

[0054] Step 2: Preparation of auxiliary resin:

[0055] 0.5 mol of isophorone diisocyanate and 1 mol of polyether diol were mixed, and 0.01 mol of hydroquinone monomethyl ether polymerization inhibitor and 0.1 mol of dibutyltin dilaurate catalyst were added. The mixture was reacted at 70 °C for 1 hour, then 1 mol of isophorone diisocyanate was added and the mixture was reacted for 1 hour. Finally, 0.5 mol of hydroxyl polybutadiene was added and the mixture was reacted for 2 hours to obtain the auxiliary resin.

[0056] Step 3: By weight, mix 45 parts of main resin, 3 parts of tetrahydrofuran acrylate, 15 parts of auxiliary resin, 11 parts of isobornyl acrylate diluent, 1 part of photoinitiator 184, 1 part of photoinitiator TMO, 0.5 parts of coupling agent KH570, and 1 part of silica. Stir at 500 rpm for 30 minutes until homogeneous to obtain a high-performance UV adhesive for solder joint protection.

[0057] Example 3

[0058] A method for preparing a high-performance UV adhesive for solder joint protection includes the following preparation steps:

[0059] Step 1: Preparation of the main resin:

[0060] 1.5 mol of isophorone diisocyanate and 3 mol of polycarbonate diol were mixed, and 0.1 mol of hydroquinone monomethyl ether polymerization inhibitor and 0.1 mol of dibutyltin dilaurate catalyst were added. The mixture was reacted at 80 °C for 3 hours, then 3 mol of dicyclohexylmethane diisocyanate was added and reacted for 3 hours, then 3 mol of hydroxyethyl methacrylate was added and reacted for 3 hours. Heating was then stopped to obtain the main resin.

[0061] Step 2: Preparation of auxiliary resin:

[0062] 1.5 mol of isophorone diisocyanate and 3 mol of polyether diol were mixed, and 0.1 mol of hydroquinone monomethyl ether polymerization inhibitor and 0.1 mol of dibutyltin dilaurate catalyst were added. The mixture was reacted at 80 °C for 3 hours. Then, 3 mol of isophorone diisocyanate was added and the mixture was reacted for 3 hours. Finally, 1.5 mol of hydroxyl polybutadiene was added and the mixture was reacted for 3 hours to obtain the auxiliary resin.

[0063] Step 3: By weight, mix 55 parts of main resin, 13 parts of tetrahydrofuran acrylate, 25 parts of auxiliary resin, 21 parts of isobornyl acrylate diluent, 3 parts of photoinitiator 184, 1 part of photoinitiator TMO, 1.5 parts of coupling agent KH570, and 3 parts of silica. Stir at 800 r / min for 60 min until homogeneous to obtain a high-performance UV adhesive for solder joint protection.

[0064] Comparative Example 1

[0065] A method for preparing a UV adhesive for solder joint protection. The difference between Comparative Example 1 and Example 1 is that the amount of main resin added in Comparative Example 1 is 70 parts by weight, and the amount of auxiliary resin added is 0. The other preparation conditions of Comparative Example 1 are the same as those of Example 1, and will not be repeated here.

[0066] Performance testing

[0067] The UV adhesive for solder joint protection prepared in Example 1 and Comparative Example 1 was evenly applied to the surface of a PC substrate. Then, another PC substrate was pressed on the side coated with adhesive. The air bubbles inside the adhesive were gently pressed to make the adhesive layer evenly distributed. The adhesive was cured using a UV curing device and the adhesive was completely cured.

[0068] The hardness, shear strength, elongation at break, and water absorption of the UV adhesives for solder joint protection prepared in Example 1 and Comparative Example 1 were tested. Specifically:

[0069] The Shore D hardness of the UV-protective adhesive for solder joints was tested according to the standard test method of ASTM D2240.

[0070] The shear strength of the UV adhesive for solder joint protection at room temperature was tested according to the standard test method of ISO 4587.

[0071] The shear strength of the UV adhesive for solder joint protection was tested according to the standard test method of ISO 18562 after 500 hours of thermal shock test at -40°C to 80°C.

[0072] The shear strength of the UV adhesive for solder joint protection was tested according to the standard test method of ASTM D2093 after 500 hours of exposure to a high temperature and high humidity environment of 85°C and 85%RH.

[0073] The elongation at break of the UV adhesive for solder joint protection was tested according to the standard test method of ASTM D638.

[0074] The water absorption rate of the UV adhesive for solder joint protection was tested according to the standard test method of ASTM D570.

[0075] The test results are shown in the table below.

[0076]

[0077] As can be seen from the above test results, the UV adhesive for solder joint protection prepared by the present invention, which combines the main resin prepared by a specific method and the auxiliary resin prepared by a specific method with other components of the present invention, has good flexibility, high shear strength, excellent high and low temperature resistance, and moisture resistance.

[0078] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of this patent should be determined by the appended claims.

Claims

1. A high-performance UV adhesive for protecting solder joints, characterized in that, The components include the following parts by weight: 45-55 parts of main resin 15-25 parts of auxiliary resin 3-13 parts of acrylic monomer 11-21 parts diluent 2-4 parts of photoinitiator 0.5-1.5 parts of coupling agent 1-3 parts of silica; The preparation method of the main resin is as follows: Mix 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polycarbonate diol, add polymerization inhibitor and catalyst, react at 70-80℃ for 1-3 hours, then add 1-3 mol of dicyclohexylmethane diisocyanate and react for 1-3 hours, then add 1-3 mol of hydroxyethyl methacrylate and react for 2-3 hours, then stop heating to obtain the main resin; The auxiliary resin is prepared as follows: 0.5-1.5 mol of isophorone diisocyanate and 1-3 mol of polyether diol are mixed, a polymerization inhibitor and a catalyst are added, and the mixture is reacted at 70-80°C for 1-3 hours. Then, 1-3 mol of isophorone diisocyanate is added, and the mixture is reacted for 1-3 hours. Finally, 0.5-1.5 mol of hydroxyl polybutadiene is added, and the mixture is reacted for 2-3 hours to obtain the auxiliary resin.

2. The high-performance UV adhesive for solder joint protection according to claim 1, characterized in that, The acrylic monomer is at least one of tetrahydrofuran acrylate, hydroxyethyl acrylate, and glycidyl methacrylate.

3. The high-performance UV adhesive for solder joint protection according to claim 1, characterized in that, The diluent is at least one of isobornyl acrylate, trimethylolpropane triacrylate, and tripropylene glycol diacrylate.

4. The high-performance UV adhesive for solder joint protection according to claim 1, characterized in that, The photoinitiator is a mixture of photoinitiator 184 and photoinitiator TMO in a mass ratio of 1-3:

1.

5. The high-performance UV adhesive for solder joint protection according to claim 1, characterized in that, The coupling agent is at least one of coupling agent KH570, coupling agent KH550, and coupling agent KH151.

6. A method for preparing a high-performance UV adhesive for solder joint protection as described in any one of claims 1-5, characterized in that, The preparation steps include the following: mixing the main resin, acrylic monomer, auxiliary resin, diluent, photoinitiator, coupling agent, and silica, and stirring evenly to obtain a high-performance UV adhesive for solder joint protection.

7. The method for preparing a high-performance UV adhesive for solder joint protection according to claim 6, characterized in that, The stirring speed is 500-800 r / min, and the stirring time is 30-60 min.

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