Chip burning method and burner

Abstract

The embodiment of the invention discloses a chip burning method and a burner, and relates to the field of chip burning. According to the invention, the pin switching unit is designed to be matched with the DIP socket and the IC socket, so that flexible adaptation of chips with different packaging forms is realized. According to the technical scheme, a jumper board does not need to be specially designed for packaging each chip, and the burner can be connected only by replacing the corresponding IC socket, so that the operation process is greatly simplified, and the production cost and the management complexity are reduced. The pin switching unit can automatically detect the chip and configure burning parameters, so that the complexity and the error rate of manual operation are reduced, and meanwhile, potential risks caused by the problem of a jumper board are avoided. By accurately matching the chip pins with the metal pin jacks and transmitting data based on a burning protocol, accurate transmission of burning data and correct realization of chip functions are ensured, and burning efficiency and stability are improved.

Description

Technical Field

[0001] This application relates to the field of chip programming, and particularly to a chip programming method and a programmer. Background Art

[0002] In the integrated circuit industry, chip programming is an essential part of the electronic product manufacturing process. It involves downloading pre-written program codes or data into the chip to endow the chip with specific functions or instructions. The traditional chip programming process usually includes the following key steps: First, the chip to be programmed needs to be accurately placed in a dedicated chip socket, which ensures stable and reliable electrical contact between the chip and subsequent connection components. Subsequently, this chip socket is inserted into a dual in-line package (DIP) socket. As a widely used interface standard, the DIP socket facilitates the connection between the chip and the programmer.

[0003] To achieve effective communication between the chip programming port and the programmer download port, it is usually necessary to connect the DIP socket to the download interface of the programmer through a jumper board. As a flexible connection solution, the jumper board can customize the transmission and conversion of electrical signals according to the specific hardware layout and signal transmission requirements. This design not only enhances the flexibility of the system but also facilitates switching between different models of chips to adapt to diverse application scenarios.

[0004] However, with the rapid development of semiconductor technology, in order to meet the design requirements of different electronic devices, the same model of chip often adopts multiple package forms, such as BGA (ball grid array package), QFP (quad flat package), SOP (small outline package), etc. Each package form is different in physical size, pin arrangement, and electrical characteristics, which requires the jumper board between the DIP socket and the programmer download port to be specifically designed according to the chip package type to ensure the accuracy and efficiency of signal transmission. Therefore, if a model of chip has multiple package forms, it means that a corresponding number of jumper boards are needed to adapt to different packages, which undoubtedly increases the production cost, management complexity, and operational inconvenience. Summary of the Invention

[0005] The embodiments of this application provide a chip programming method and a programmer, which can solve the problem of high hardware cost when programming chips with multiple package forms in the prior art. The technical solutions are as follows:

[0006] In a first aspect, an embodiment of the present application provides a chip programming method, which is applied to a chip programmer. The chip programmer includes a programming unit and a pin transfer unit. The pin transfer unit includes a DIP socket and a main control chip. The DIP socket includes a plurality of metal pin jacks distributed in two rows. Each pin jack is connected to a metal terminal, and each metal terminal is connected to each IO pin of the main control chip. The main control chip is connected to the programming unit.

[0007] The target chip to be programmed is provided with N chip pins. The target chip is inserted into the DIP socket through an IC socket. The IC socket includes a socket body and N chip pin jacks. The N chip pins are connected to the N chip pin jacks in a one-to-one manner. Each chip pin jack is connected to a test terminal, and each test terminal is connected to a metal pin jack at a corresponding position in the DIP socket. The number of metal pin jacks in the DIP socket is greater than or equal to N, and N is an integer greater than 1.

[0008] When the pin transfer unit detects that the target chip is inserted into the DIP socket through the IC socket, it queries the occupied status of the metal pin jacks in the DIP socket and obtains the chip model of the target chip, and sends the set of jack IDs of the occupied metal pin jacks and the chip model to the programming unit.

[0009] The programming unit determines the package type and programming protocol of the target chip according to the chip model, determines the chip pins that perform the programming function in the target chip according to the package type, and filters out the corresponding subset of jack IDs in the set of jack IDs of the metal pin jacks connected to the chip pins for the programming function in the DIP socket, and notifies the programming protocol and the subset of jack IDs to the pin transfer unit.

[0010] The programming unit obtains programming data and sends the programming data to the pin transfer unit.

[0011] The pin transfer unit receives the programming data from the programming unit and transmits the programming data to the target chip through the metal pin jacks indicated by the subset of jack IDs based on the programming protocol.

[0012] In a second aspect, an embodiment of the present application provides a programming unit and a pin transfer unit.

[0013] The pin transfer unit includes a DIP socket and a main control chip. The DIP socket includes a plurality of metal pin jacks distributed in two rows. Each pin jack is connected to a metal terminal, and each metal terminal is connected to each IO pin of the main control chip. The main control chip is connected to the programming unit.

[0014] The target chip to be programmed is provided with N chip pins, and the target chip is inserted into the DIP socket through an IC socket; the IC socket includes a socket body and N chip pin jacks, and the N chip pins are connected to the N chip pin jacks one by one; each chip pin jack is connected with a test terminal, and each test terminal is connected to a metal pin jack at a corresponding position in the DIP socket in a matching manner; the number of metal pin jacks included in the DIP socket is greater than or equal to N, and N is an integer greater than 1;

[0015] The pin transfer unit is configured to, when detecting that the target chip is inserted into the DIP socket through the IC socket, query the occupied metal pin jacks in the DIP socket and obtain the chip model of the target chip, and send the set of jack IDs of the occupied metal pin jacks and the chip model to the programming unit;

[0016] The programming unit is configured to determine the package type and programming protocol of the target chip according to the chip model, and determine the chip pins that perform the programming function in the target chip according to the package type, and screen out the corresponding subset of jack IDs from the set of jack IDs of the metal pin jacks connected to the chip pins for the programming function in the DIP socket, and notify the programming protocol and the subset of jack IDs to the pin transfer unit;

[0017] The pin transfer unit is further configured to receive the programming data from the programming unit, and transmit the programming data to the target chip through the metal pin jacks indicated by the subset of jack IDs based on the programming protocol.

[0018] In a third aspect, an embodiment of the present application provides a computer storage medium, which stores multiple instructions, and the instructions are suitable for being loaded and executed by a processor to perform the above method steps.

[0019] In a fourth aspect, an embodiment of the present application provides a programmer, which may include: a processor and a memory; wherein, the memory stores a computer program, and the computer program is suitable for being loaded and executed by the processor to perform the above method steps.

[0020] The beneficial effects brought by the technical solutions provided by some embodiments of the present application at least include:

[0021] By designing the cooperation of the pin transfer unit with the DIP socket and the IC socket, flexible adaptation to chips of different package forms is achieved. There is no need to specially design a jumper board for each chip package. Only by replacing the corresponding IC socket can the programmer be connected, greatly simplifying the operation process and reducing the production cost and management complexity. The pin transfer unit can automatically detect the chip and configure the programming parameters, reducing the complexity and error rate of manual operation, and at the same time avoiding potential risks caused by jumper board problems. By precisely matching the chip pins with the metal pin jacks and transmitting data based on the programming protocol, accurate transmission of the programming data and correct implementation of the chip functions are ensured, improving the programming efficiency and stability. Brief Description of the Drawings

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.

[0023] Figure 1 is a schematic structural diagram of the programmer provided by the embodiment of the present application;

[0024] Figure 2 is a schematic flow diagram of the chip programming method provided by the embodiment of the present application. Detailed Embodiments

[0025] To make the purpose, technical solutions and advantages of the present application clearer, the following will further describe the embodiments of the present application in detail in conjunction with the drawings.

[0026] As Figure 1 shown, it is a schematic structural diagram of the programmer provided by the embodiment of the present application. The programmer includes: a programming unit 1 and a pin transfer unit 2.

[0027] The programming unit is the core processing module of the chip programmer, responsible for receiving the externally input programming data, and selecting a suitable programming protocol for data transmission according to the model and characteristics of the target chip. The programming unit is connected to the main control chip in the pin transfer unit, obtains the information of the target chip through the main control chip, and controls the transmission of the programming data.

[0028] The pin transfer unit 2 includes two parts: a DIP socket 22 and a main control chip 21.

[0029] The DIP socket has multiple metal pin jacks distributed in two rows, and each jack is connected to the IO pin of the main control chip through a metal terminal. These jacks are used to match the pins of the target chip to achieve signal transmission. The main control chip is responsible for detecting the insertion state of the target chip, obtaining the model information of the target chip, and communicating with the programming unit. The main control chip is connected to the programming unit, and the DIP socket is connected to the metal pins of the target chip (inserted through the IC socket) through test terminals.

[0030] The target chip has N chip pins, where N is an integer greater than 1. These pins are used for communication and data transmission with the programmer. The IC socket includes a socket body and N chip pin jacks, and each jack is connected to one pin of the target chip in a one-to-one manner. The IC socket is used to fix and insert the target chip into the DIP socket.

[0031] The following will combine the attached Figure 2 , and introduce in detail the chip programming method provided by the embodiments of the present application. The execution subject is Figure 1 the programmer in

[0032] Please refer to Figure 2 , which is a schematic flowchart of a chip programming method provided by the embodiments of the present application. As Figure 2 shown, the method of the embodiments of the present application may include the following steps:

[0033] S201. When the pin transfer unit detects that the target chip is inserted into the DIP socket through the IC socket, query the occupied status of the metal pin jacks in the DIP socket, obtain the chip model of the target chip, and send the set of jack IDs of the occupied metal pin jacks and the chip model to the programming unit.

[0034] Among them, when the target chip is correctly inserted into the DIP (Dual In-line Package) socket through the IC socket, the key lies in the precise alignment and close contact between the metal pin jacks in the socket and the pins of the target chip. This contact ensures the continuity and reliability of the electrical signal. The metal pin jacks are usually made of conductive materials such as copper alloys, which have good electrical conductivity and corrosion resistance. When the pins are inserted into the jacks, the tiny gaps between them are filled to form a stable electrical connection. This connection allows current and signals to flow freely between the pin transfer unit and the target chip.

[0035] The main control chip detects changes in these electrical connection states through built-in monitoring circuits. These monitoring circuits may include analog comparators, digital input pins, or dedicated interface circuits. When the pins of the target chip establish a connection with the pin sockets of the DIP socket, it will cause changes in the voltage or current on the corresponding input pins of the main control chip. The main control chip utilizes these changes to detect the insertion action of the target chip. In addition, the main control chip may also have a debouncing function to eliminate false detections caused by transient interference generated during pin insertion.

[0036] Once the insertion of the target chip is detected, the main control chip initiates a scanning process to identify which pin sockets of the DIP socket have established effective electrical connections with the pins of the target chip. For example, when a high voltage is detected on a metal pin socket, it is determined that the metal pin socket is in an occupied state; when a low voltage is detected on a metal pin socket, it is determined that the metal pin socket is in an idle state. This process usually involves checking each relevant input pin of the main control chip one by one. There may be a register array or state machine inside the main control chip to record the occupied state of each pin socket. By comparing these states with the preset pin layout pattern, the main control chip can infer the actual pin layout of the target chip.

[0037] To determine the model of the target chip, the main control chip attempts to read specific hardware identifiers on the target chip. These identifiers may include specific pin combinations on the chip (such as model identification pins, configuration pins, etc.), or information stored in the internal EEPROM (Electrically Erasable Programmable Read-Only Memory) of the chip. For pin combinations, the main control chip checks the level states of specific pins; for EEPROM information, the main control chip may interact with the EEPROM through communication protocols such as I2C, SPI, etc. After the read identifier information is decoded, it is matched with the chip database stored inside the main control chip to identify the model and specifications of the chip.

[0038] Once the occupied metal pin sockets and the model of the target chip are determined, the main control chip packs this information into a data structure. This data structure may include the chip model, pin layout, and other relevant configuration information. Then, the main control chip sends this information to the programming unit through an appropriate communication interface (such as UART, USB, Ethernet, etc.). The programming unit can perform corresponding operations according to the received information, such as writing program code into the target chip, verifying the writing result, etc.

[0039] S202. The programming unit determines the package type and programming protocol of the target chip according to the chip model, determines the chip pins in the target chip that perform the programming function according to the package type, and filters out the corresponding jack ID subset in the jack ID set according to the metal pin jacks connected to the chip pins for the programming function, and notifies the programming protocol and the jack ID subset to the pin transfer unit.

[0040] Among them, when the programming unit receives the model information of the target chip, it will first consult the internal database or reference document. This database usually contains detailed information about various chip models, including package types, pin functions, applicable programming protocols, etc. The package type refers to the physical package form of the chip, which determines parameters such as the chip size, pin arrangement, and pitch. Different package types have different requirements for programming operations.

[0041] The programming protocol defines how data is transmitted into the chip, which usually includes data transmission format, rate, timing, and verification mechanism, etc. Different chip models may use different programming protocols. Therefore, the programming unit needs to determine the applicable programming protocol according to the model information of the target chip. These protocols may be provided by the chip manufacturer or formulated by industry standards organizations.

[0042] Once the package type and programming protocol are determined, the programming unit can identify which pins in the target chip are used to perform the programming function. These pins usually include data transmission pins (for transmitting programming data), clock pins (for providing clock signals to synchronize data transmission), reset pins (for resetting the chip to the initial state to start the programming process), etc. These pins play a crucial role in the programming process, and the changes in their states will directly affect the success or failure of the programming operation.

[0043] The programming unit will filter out the jack ID subset corresponding to the pins that perform the programming function among the metal pin jacks with known occupancy status. These jack IDs are the unique identifiers of the metal pin jacks in the pin transfer unit, and there is a one-to-one correspondence between them and the pins of the target chip. By filtering these jack IDs, the programming unit can determine which jacks will be used for subsequent programming data transmission.

[0044] Next, the programming unit sends the filtered jack ID subset and the programming protocol to the main control chip of the pin transfer unit through the communication interface. This communication interface may be a wired interface (such as UART, USB, Ethernet, etc.) or a wireless interface (such as Bluetooth, Wi-Fi, etc.), depending on the physical connection method and communication protocol between the programming unit and the pin transfer unit.

[0045] After receiving the information sent by the programming unit, the main control chip will use this information to configure its internal data transmission channels. This usually includes setting parameters such as the format, rate, and timing of data transmission to ensure they match the programming protocol. In addition, the main control chip also needs to activate the corresponding pin transfer circuit according to the subset of jack IDs so as to transfer the programming data from the programming unit to the corresponding pins of the target chip.

[0046] During the configuration process, the main control chip may also need to perform a series of checksum and test operations to ensure the correctness and reliability of the data transmission channels. These checksums and tests may include pin connectivity tests, data transmission rate tests, timing consistency tests, etc.

[0047] S203. The programming unit obtains the programming data and sends the programming data to the pin transfer unit.

[0048] Among them, the programming unit usually obtains the programming data to be written into the target chip from an external source. These external sources may include a computer, storage devices (such as hard disks, flash drives, SD cards, etc.) or a network. The data acquisition method depends on the specific design of the programming unit and the availability of the external source. The programming unit may be connected to the computer through USB, Ethernet or other wired / wireless interfaces and read the programming data from the computer's file system. The programming unit may have a built-in card reader or storage device interface (such as an SD card slot, USB interface, etc.) and directly read the programming data from the storage device. The programming unit may support network communication protocols (such as FTP, HTTP, SCP, etc.) and download the programming data from a remote server through the network.

[0049] Before sending the programming data to the pin transfer unit, the programming unit may need to perform a series of processing on the data to ensure the integrity and accuracy of the data. The programming data may be stored in various formats, such as text files, binary files, compressed packages, etc. The programming unit needs to convert this data into a format suitable for transmission and programming. For binary format data, bit operations or byte alignment operations may be required. To ensure the integrity of the data, the programming unit will generate a checksum (such as a CRC checksum, hash value, etc.) and append it to the end of the data packet. During transmission, the receiving party (pin transfer unit) can use the same algorithm to verify whether the received data is consistent with the original data. The programming data may be encapsulated into multiple data packets, and each data packet contains a part of the programming data and the corresponding checksum. This method helps to perform error detection and recovery during transmission.

[0050] After format conversion and verification, the programming unit sends the programming data to the main control chip of the pin transfer unit through the communication interface. This communication interface may be a wired interface (such as UART, SPI, I2C, USB, etc.) or a wireless interface (such as Bluetooth, Wi-Fi, etc.). A specific communication protocol needs to be followed between the programming unit and the pin transfer unit to ensure the correct transmission of data. These protocols may include the format, rate, timing, verification mechanism, etc. of data transmission. The programming unit will send the data packets to the main control chip of the pin transfer unit one by one according to the requirements of the communication protocol. During the transmission process, the programming unit and the pin transfer unit will perform a handshake operation to ensure that both sides are in a state ready to receive / send data. If an error occurs during the transmission (such as data packet loss, verification failure, etc.), the programming unit and the pin transfer unit will take corresponding error handling measures, such as retransmitting the data packet, requesting the verification code, etc.

[0051] After receiving the programming data, the main control chip will transmit the data to the target chip through the metal pin jacks in the DIP socket according to the subset of jack IDs and the information of the programming protocol received from the programming unit before. The main control chip will configure the corresponding pins according to the requirements of the programming protocol to perform operations such as data transmission, clock signal provision, and reset. After configuring the pins, the main control chip will transmit the programming data to the target chip through the pins according to the timing and data format requirements of the programming protocol. This process may involve the transmission and verification of multiple data packets. When all the programming data is successfully transmitted to the target chip, the main control chip will send an acknowledgment signal to the programming unit indicating that the programming process is completed. At this time, the programming unit may perform additional verification operations to verify the correctness of the programming result.

[0052] S204. The pin transfer unit receives the programming data from the programming unit and transmits the programming data to the target chip through the metal pin jacks indicated by the subset of jack IDs based on the programming protocol.

[0053] Among them, the main control chip will parse the received data packet according to the communication protocol agreed with the programming unit before. This includes identifying the start and end flags of the data packet, extracting the programming data and verification code in the data packet, etc. To ensure the correctness of the data, the main control chip will use the same verification algorithm as the programming unit to verify the received data. This usually involves calculating the verification code of the received data and comparing it with the verification code in the data packet. If the two are consistent, the data is considered correct; if not, the programming unit may be requested to retransmit the data packet. After confirming that the data is correct, the main control chip will transmit the programming data to the target chip through the metal pin jacks in the DIP socket in a specific timing and signal format according to the programming protocol and the pin configuration information.

[0054] For many chips, the data to be programmed is transmitted through a serial interface (such as SPI, I2C, etc.). In this case, the master chip will send the data bit by bit to the target chip according to the timing specified by the protocol. To ensure the correct transmission of data, the master chip will provide a clock signal to the target chip. This clock signal will control the rate and timing of data transmission. The target chip will receive the data synchronously according to this clock signal. Before starting to transmit data, the master chip may send a reset signal to the target chip to reset it to its initial state. This helps to ensure that the target chip is in the correct state when receiving data.

[0055] After receiving the programmed data, the target chip will write the data into the specified storage area according to its internal logic circuit and storage mechanism. The target chip will first decode the received data, convert it from serial format to parallel format (if necessary), and identify information such as the type and address of the data. According to the type and address information of the data, the target chip will calculate which storage area the data should be written into. This usually involves parsing and calculating the internal storage structure of the chip. Once the storage location of the data is determined, the target chip will write the data into the corresponding storage unit. This process may involve multiple steps, such as data caching, execution of the write operation, and confirmation of the write completion. When all the programmed data is successfully transmitted and written into the target chip, the programming process is completed. At this time, the target chip already contains the required program code or data and is ready for subsequent testing, verification, or deployment operations.

[0056] After programming is completed, the target chip is usually tested and verified to ensure that its functions and performance meet expectations. This may include functional testing, performance testing, stability testing, etc. If the tests and verifications are passed, then the target chip can be deployed into actual applications.

[0057] For example, chip model: Assume it is a target microcontroller chip with the model number MCU_008.

[0058] Number of pins: 8, distributed in a 2×4 pattern, that is, arranged in two rows and four columns. This means that there are two rows of pins on the top of the chip, with 4 pins in each row, and a total of 8 pins are used to communicate with external devices (such as programmers).

[0059] Number of metal pin jacks: 28, distributed in a 2×14 pattern, i.e., arranged in two rows and fourteen columns. This configuration provides enough jacks to accommodate chips with different numbers of pins, while ensuring compatibility with the target chip (MCU_008), even if the target chip has a smaller number of pins. The design of the DIP socket allows the pins of the target chip to be inserted into the corresponding jacks of the socket one by one. In this example, although the target chip has only 8 pins, a part of the 28 jacks of the DIP socket (especially those corresponding to the pin positions of the target chip) will be used.

[0060] Align and insert the target chip MCU_008 correctly into the DIP socket through its pins. Since the chip pins are distributed in a 2×4 pattern, the corresponding two rows and four columns of jacks in the socket will be occupied. The main control chip of the pin transfer unit detects the insertion of the MCU_008 chip and starts to identify the metal pin jacks of the chip model and occupancy status. The main control chip identifies the model of the MCU_008 chip and determines that the chip has 8 pins, distributed in a 2×4 pattern. The main control chip sends the ID set of the metal pin jacks in the occupancy status (in this example, it may be the ID set representing the positions of the two rows and four columns of jacks) and the chip model to the programming unit. The programming unit determines its package type and applicable programming protocol (such as SPI, I2C, or a proprietary protocol) according to the model of the MCU_008 chip. The programming unit further determines the chip pins for performing the programming function (for example, it may be the pins for data transmission, such as MOSI, MISO, SCK, etc.), and finds the corresponding jack IDs of these pins in the DIP socket. The programming unit notifies the main control chip of the pin transfer unit of the programming protocol and the subset of DIP socket jack IDs corresponding to the programming function pins of the target chip. The main control chip prepares to receive the programming data from the programming unit according to the received information. The programming data is transmitted to the programming function pins of the MCU_008 chip through the IO pins of the main control chip and the corresponding metal pin jacks in the DIP socket according to the determined programming protocol. When all the programming data is successfully transmitted to the MCU_008 chip, the programming process is completed. At this time, the target chip already contains the required program code or data.

[0061] Through the above example, we can clearly see that even if the target chip has a smaller number of pins (such as 8 in this example), the chip programmer can still work efficiently. The DIP socket provides enough jacks to accommodate chips of different sizes, while the programming unit and the pin transfer unit can intelligently identify the chip model, determine the programming protocol and pins, and safely and accurately transmit the programming data to the target chip.

[0062] This application specifically includes the following beneficial effects:

[0063] By designing a pin transfer unit that includes a DIP socket and a main control chip, as well as an IC socket used in conjunction with it, this solution can flexibly adapt to chips of different package forms. The one-to-one connection design between the IC socket and the DIP socket enables chips of different package types to be connected to the programmer simply by replacing the corresponding IC socket, eliminating the need to specifically design a jumper board for each package form.

[0064] The pin transfer unit can automatically detect the target chip inserted into the DIP socket, query the metal pin jacks in the occupied state, and obtain the chip model. The programming unit determines the package type and programming protocol based on the chip model, further determines the chip pins for performing the programming function, and filters out the corresponding metal pin jacks. This process realizes automatic identification and configuration, reducing the complexity and error rate of manual operations.

[0065] Since there is no need to prepare a dedicated jumper board for chips of each package form, this solution greatly simplifies the operation process, reduces production costs and management complexity. At the same time, due to the reduced use of jumper boards, the potential risks caused by improper design or damage of the jumper boards are also reduced.

[0066] By precisely matching the connection between the chip pins and the metal pin jacks, and based on the data transmission of the programming protocol, this solution can ensure the accurate transmission of the programming data and the correct realization of the chip functions. This not only improves the programming efficiency but also enhances the stability and reliability of the programming process.

[0067] Those of ordinary skill in the art can understand that all or part of the processes in the methods of the above embodiments can be completed by instructing relevant hardware through a computer program. The program can be stored in a computer-readable storage medium. When the program is executed, it can include the processes of the embodiments of the above methods. Among them, the storage medium can be a magnetic disk, an optical disc, a read-only memory, or a random access memory, etc.

[0068] The above-disclosed are only the preferred embodiments of the present application. Of course, the scope of the rights of the present application cannot be limited thereby. Therefore, equivalent changes made according to the claims of the present application still fall within the scope covered by the present application.

Claims

1. A chip burning method, characterized in that: Applied to a chip burner, the chip burner comprises: a burning unit and a pin transfer unit; the pin transfer unit comprises a DIP socket and a main control chip, the DIP socket comprises a plurality of metal pin jacks distributed in two rows, each pin jack is connected with a metal terminal, each metal terminal is connected with each IO pin of the main control chip, and the main control chip is connected with the burning unit; The target chip to be burned is provided with N chip pins, and the target chip is inserted into the DIP socket through an IC socket; the IC socket comprises a socket body and N chip pin jacks, the N chip pins are connected one-to-one with the N chip pin jacks, each chip pin jack is connected with a test terminal, and each test terminal is matched and connected with a metal pin jack at a corresponding position in the DIP socket; the number of metal pin jacks in the DIP socket is greater than or equal to N, and N is an integer greater than 1; When the pin transfer unit detects that the target chip is inserted into the DIP socket through the IC socket, it queries the metal pin sockets in the occupied state in the DIP socket and obtains the chip model of the target chip, and sends the socket ID set of the metal pin sockets in the occupied state and the chip model to the burning unit; The burning unit determines the package type and burning protocol of the target chip according to the chip model, determines the chip pins that perform the burning function in the target chip according to the package type, and selects the corresponding socket ID subset from the socket ID set according to the metal pin sockets connected to the chip pins of the burning function in the DIP socket, and notifies the pin switching unit of the burning protocol and the socket ID subset; The programming unit acquires programming data and sends the programming data to the pin transfer unit; The pin transfer unit receives the programming data from the programming unit, and transmits the programming data to the target chip through the metal pin sockets indicated by the socket ID subset based on the programming protocol.

2. The method according to claim 1, characterized in that When the pin transfer unit detects that the level on a certain metal pin plug hole in the DIP socket is a high level, it determines that the metal pin plug hole is in an occupied state.

3. The method according to claim 1 or 2, characterized in that: The step of obtaining the chip model of the target chip includes: The chip model is read from the EEPROM of the target chip through the I2C protocol or the SPI protocol.

4. The method according to claim 3, characterized in that The programming unit generates a verification code corresponding to the programming data by using a verification algorithm, and adds the verification code to the programming data and sends it to the pin transfer unit; The pin transfer unit parses the received programming data to obtain a check code, and uses the check algorithm to calculate the check code corresponding to the received programming data, and compares whether the parsed check code and the calculated check code are the same. If they are the same, the received programming data is transmitted to the target chip.

5. The method according to claim 1, 2 or 4, characterized in that: The burning protocol is IIC protocol or SPI protocol.

6. A burner, characterized in that: include: Burning unit and pin transfer unit; The pin transfer unit includes a DIP socket and a main control chip, the DIP socket includes a plurality of metal pin holes distributed in two rows, each pin hole is connected with a metal terminal, and each metal terminal is connected to each IO pin of the main control chip; the main control chip is connected to the burning unit; The target chip to be burned is provided with N chip pins, and the target chip is inserted into the DIP socket through an IC socket; the IC socket comprises a socket body and N chip pin jacks, and the N chip pins are connected one-to-one with the N chip pin jacks; each chip pin jack is connected with a test terminal, and each test terminal is matched and connected with a metal pin jack at a corresponding position in the DIP socket; the number of metal pin jacks included in the DIP socket is greater than or equal to N, and N is an integer greater than 1; The pin transfer unit is used to detect that the target chip is inserted into the DIP socket through the IC socket, query the metal pin sockets in the occupied state in the DIP socket and obtain the chip model of the target chip, and send the socket ID set of the metal pin sockets in the occupied state and the chip model to the burning unit; The burning unit is used to determine the package type and burning protocol of the target chip according to the chip model, and determine the chip pins that perform the burning function in the target chip according to the package type, and filter out the corresponding socket ID subset from the socket ID set according to the metal pin sockets connected to the chip pins of the burning function in the DIP socket, and notify the pin switching unit of the burning protocol and the socket ID subset; The pin transfer unit is further used to receive the programming data from the programming unit, and transmit the programming data to the target chip through the metal pin sockets indicated by the socket ID subset based on the programming protocol.

7. The burner according to claim 6, characterized in that: The main control chip has a built-in monitoring circuit, and the monitoring circuit is used to determine that the metal pin socket is in an occupied state when detecting that the level of the metal pin socket is a high level.

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