Power module, power module and packaging method thereof

Abstract

The application discloses a power module, which comprises a first insulating substrate, a first wiring layer located on the first insulating substrate, a lower bridge power device group and a plurality of power devices of the lower bridge power device group, wherein the plurality of power devices are located on the first wiring layer, and each power device comprises a first end, a second end and a third end. The second end of each power device is connected to a respective plurality of branch busbar parts of the lower bridge power device group and the lower bridge power device group, so that the conductive path length of each power device to the respective main busbar part is similar, and the current is uniformly distributed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically, to a power module and its packaging method. Background Technology

[0002] Power modules are a new type of high-power power electronic device with advantages such as high current density, low saturation voltage and high voltage resistance. They are currently widely used in various fields such as production and daily life.

[0003] Power modules, as power semiconductor devices used in power electronic systems to achieve power conversion and control, typically require multiple power devices to be connected in parallel to meet increasing power demands. Existing power modules with multiple power devices connected in parallel often suffer from current sharing problems. This means that some power devices are affected by the current shunting from other power devices, resulting in uneven current distribution among the devices. This can lead to some devices experiencing excessive current and overheating failure. Furthermore, existing parallel multi-power device connections also exhibit switching oscillation problems. Due to the varying lengths of the gate and source circuit paths of each power device and the long coupling of power circuit inductance, the switching times of the gates of each device are inconsistent. Crosstalk between multiple power devices causes instability in the gate voltage, source-drain current, and voltage among the parallel power devices, resulting in significant oscillations. This negatively impacts the overall performance of the power module. Summary of the Invention

[0004] In view of the above problems, the purpose of this invention is to provide a power module to improve the current distribution of each power device in the power module, reduce uneven current distribution and switching oscillation problems, and improve the electrical performance of the power module.

[0005] This invention provides a power module, comprising:

[0006] First insulating substrate;

[0007] A first wiring layer is located on a first insulating substrate;

[0008] The lower bridge power device group includes multiple power devices. The multiple power devices of the lower bridge power device group are located on the corresponding first wiring layer. Each power device of the lower bridge power device group includes a first terminal, a second terminal and a third terminal.

[0009] The upper bridge power device group includes multiple power devices. The multiple power devices of the upper bridge power device group are located on the corresponding first wiring layer. Each power device of the upper bridge power device group includes a first terminal, a second terminal and a third terminal.

[0010] The busbar includes the main busbar and multiple branch busbars;

[0011] Multiple branch busbars are electrically connected to the second terminals of the corresponding power devices in the lower bridge power device group, and / or multiple branch busbars are electrically connected to the second terminals of the corresponding power devices in the upper bridge power device group.

[0012] Furthermore, the second terminal of the power device in the lower bridge power device group is electrically connected to the second power terminal of the power module, and the third terminal of the power device in the lower bridge power device group is electrically connected to the first control terminal; the first terminal of the power device in the upper bridge power device group is electrically connected to the first power terminal of the power module, the second terminal of the power device in the upper bridge power device group is electrically connected to the third power terminal of the power module, and the third terminal of the power device in the upper bridge power device group is electrically connected to the second control terminal. The bus section includes a second bus section and a third bus section. The main bus section includes a first main bus section and a second main bus section. The multiple branch bus sections shown include multiple first branch bus sections and multiple second branch bus sections. The second bus section includes a first main bus section and multiple first branch bus sections. The third bus section includes a second main bus section and multiple second branch bus sections. The multiple first branch bus sections are electrically connected to the second terminals of the corresponding power devices in the lower bridge power device group. The first main bus section is electrically connected to the second power terminal. The multiple second branch bus sections are electrically connected to the second terminals of the corresponding power devices in the upper bridge power device group. The second main bus section is electrically connected to the third power terminal. The first terminals of the power devices in the lower bridge power device group are electrically connected to the second main bus section.

[0013] Furthermore, multiple first branch busbars are electrically connected to the second terminals of corresponding power devices in the lower bridge power device group via one of the second metal interconnect layer, bonding wire, or bonding strip of the lower bridge power device group.

[0014] Furthermore, multiple second branch busbars are electrically connected to the second terminals of corresponding power devices in the upper bridge power device group via one of the second metal interconnect layer, bonding wire, or bonding strip of the upper bridge power device group.

[0015] Furthermore, the first terminal of the power device in the lower bridge power device group is electrically connected to the third power terminal of the power module via one of the following: a first solder layer, a first sintered layer, a first eutectic bond, or a first conductive adhesive.

[0016] Furthermore, the first end of the power device of the upper bridge power device group is electrically connected to the first power terminal of the power module through one of the second brazing layer, the second sintering layer, the second eutectic bonding layer or the second conductive adhesive of the upper bridge power device group.

[0017] Furthermore, the first wiring layer includes a first portion, a second portion, a third portion, a fourth portion, a fifth portion, and a sixth portion of the first wiring layer that are isolated from each other.

[0018] Furthermore, multiple power devices of the lower bridge power device group are located on the first part of the corresponding first wiring layer, and multiple power devices of the lower bridge power device group are located on the fourth part of the corresponding first wiring layer.

[0019] Furthermore, the second power terminal and the first main busbar are integrally formed metal clips.

[0020] Furthermore, the third power terminal and the second main busbar are integral metal clips.

[0021] Furthermore, the second power terminal and the first main busbar are separate metal clips.

[0022] Furthermore, the third power terminal and the second main busbar are separate metal clips.

[0023] Furthermore, at least a portion of the first main bus section is a bond line or bond band;

[0024] Furthermore, at least a portion of the second main bus section is a bond line or bond band.

[0025] Furthermore, the first main busbar and the first branch busbar are integrated metal clips;

[0026] Furthermore, the second main busbar and the second branch busbar are integrated metal clips.

[0027] Furthermore, the first main busbar and the first branch busbar are separate metal clips;

[0028] Furthermore, the second main busbar and the second branch busbar are separate metal clips.

[0029] Furthermore, the first branch busbars corresponding to some adjacent power devices in the lower bridge power device group are integrated into a single structure;

[0030] Furthermore, the first branch busbar of the upper bridge power device group corresponding to some adjacent power devices of the upper bridge power device group is an integral structure.

[0031] Furthermore, the first branch busbars corresponding to some adjacent power devices in the lower bridge power device group are discrete structures, and the second ends of some adjacent power devices in the lower bridge power device group are interconnected by one of the following: bonding wire, bonding tape, or discrete metal clips.

[0032] Furthermore, the second branch busbars corresponding to some adjacent power devices in the upper bridge power device group are discrete structures, and the second ends of some adjacent power devices in the upper bridge power device group are interconnected by one of the following: bonding wire, bonding tape, or discrete metal clip.

[0033] Furthermore, the currents of the first main bus and the multiple first branch bus intersect at the first converging terminal. The first main bus includes a first end and a second end. The first converging terminal is located at the first end of the first main bus. The distance from the first end of the first main bus to the second power terminal is greater than the distance from the second end of the first main bus to the second power terminal.

[0034] Furthermore, the power module also includes a first sampling terminal, the second end of which is electrically connected to the first converging terminal.

[0035] Furthermore, the second end of the first sampling terminal is interconnected with the first converging terminal via a bonding wire or bonding tape.

[0036] Furthermore, the second end of the first sampling terminal is interconnected with the first convergence terminal and the first wiring layer through a third metal interconnect layer.

[0037] Furthermore, the second end of the first sampling terminal and the first convergence terminal are directly interconnected with the second portion of the first wiring layer of the lower bridge power device group region.

[0038] Furthermore, the second end of the first sampling terminal and the first converging end are integrated into one structure.

[0039] Furthermore, the power module also includes a first sampling terminal, the second end of which is electrically connected to the second end of the power device in the lower bridge power device group via a bonding wire, bonding tape, or metal clip.

[0040] Furthermore, the power module also includes a first sampling terminal, the second end of which is electrically connected to the first branch bus via a bonding wire, a bonding strip, or a metal clip.

[0041] Furthermore, the currents of the second main bus and the multiple second branch bus intersect at the second converging terminal. The second main bus includes a first terminal and a second terminal. The second converging terminal is located at the first terminal of the second main bus. The distance from the first terminal of the second main bus to the third power terminal is greater than the distance from the second terminal of the second main bus to the third power terminal.

[0042] Furthermore, the power module also includes a second sampling terminal, the second end of which is electrically connected to the second converging terminal.

[0043] Furthermore, the second end of the second sampling terminal is interconnected with the second convergence terminal via a bonding wire or bonding tape.

[0044] Furthermore, the second end of the second sampling terminal is interconnected with the second convergence terminal through the fourth metal interconnect layer and the fifth part of the first wiring layer.

[0045] Furthermore, the second end of the second sampling terminal and the second convergence end are directly interconnected with the fifth portion of the first wiring layer of the upper bridge power device group region.

[0046] Furthermore, the second end and the second convergence end of the second sampling terminal are integrated into one structure.

[0047] Furthermore, the power module also includes a second sampling terminal, the second end of which is electrically connected to the second end of the power device in the upper bridge power device group via a bonding wire, bonding tape, or metal clip.

[0048] Furthermore, the power module also includes a second sampling terminal, the second end of which is electrically connected to the second branch bus via a bonding wire, bonding tape, or metal clip.

[0049] Furthermore, during the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, the first main bus, converges to the first convergence terminal, and then flows through the second part of the first wiring layer in the lower bridge power device group area, or through one of the bonding wires or bonding strips to the first sampling terminal.

[0050] Furthermore, during the turn-on process of each power device in the lower bridge power device group, the control current of the lower bridge power device group flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, the first main bus, converges to the first convergence terminal, and then flows to the first sampling terminal.

[0051] Furthermore, during the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, and then through one of the bonding wires, bonding strips, or metal clips to the first sampling terminal.

[0052] Furthermore, during the turn-on process of each power device in the upper bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, the second main bus, converges to the second convergence terminal, and then flows through the fifth part of the first wiring layer in the upper bridge power device group area, one of the bonding wires or bonding strips to the second sampling terminal.

[0053] Furthermore, during the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch busbar, the second main busbar, converges to the second convergence terminal, and then flows to the second sampling terminal.

[0054] Furthermore, during the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, and then through one of the bonding wires, bonding strips, or metal clips to the second sampling terminal.

[0055] Furthermore, when each power device in the power module is forward-biased, the current flows sequentially through: the first power terminal, the fourth part of the first wiring layer in the upper bridge power device group area, the first end of the power device in the upper bridge power device group, the second end of the power device in the upper bridge power device group, the second branch bus, then converges to the second main bus, the second part of the first wiring layer in the lower bridge power device group area, the first end of the power device in the lower bridge power device group, the second end of the power device in the lower bridge power device group, the first branch bus, then to the first main bus, and finally output through the second power terminal.

[0056] Furthermore, the first main bus is located above the power devices of the lower bridge power device group, and a portion of the projection of the first main bus onto the first insulating substrate is located between adjacent power devices of the lower bridge power device group.

[0057] Furthermore, the second main bus is located above the power devices of the upper bridge power device group, and the partial projection of the second main bus onto the first insulating substrate is located between the partially adjacent power devices of the upper bridge power device group.

[0058] Furthermore, the second busbar also includes a second insulating substrate and a second wiring layer. The second wiring layer is located on the second insulating substrate, which is located on the first wiring layer. The second insulating substrate and the second wiring layer are located between some adjacent power devices in the lower bridge power device group. The second wiring layer is electrically connected to a plurality of first branch busbars and a first main busbar.

[0059] Furthermore, the third bus section also includes a third insulating substrate and a third wiring layer. The third wiring layer is located on the third insulating substrate, which is located on the first wiring layer. The third insulating substrate and the third wiring layer are located between some adjacent power devices in the upper bridge power device group. The third wiring layer is electrically connected to multiple second branch bus sections and a second main bus section.

[0060] Furthermore, during the turn-on process of each power device in the lower bridge power device group, the control current flows through the first branch busbar, then through the second wiring layer, and finally to the first main busbar; and / or

[0061] Furthermore, during the turn-on process of each power device in the upper bridge power device group, after the control current flows through the second branch bus, it also flows through the third wiring layer to the second main bus.

[0062] Furthermore, the second busbar also includes a fourth wiring layer that is independent of the first wiring layer. The fourth wiring layer is located between some adjacent power devices. The first side of the fourth wiring layer is electrically connected to a plurality of first branch busbars and a first main busbar. The second side of the fourth wiring layer is located on the first insulating substrate.

[0063] Furthermore, the third busbar also includes a fifth wiring layer that is independent of the first wiring layer. The fifth wiring layer is located between some adjacent power devices. The first side of the fifth wiring layer is electrically connected to multiple second branch busbars and a second main busbar. The second side of the fifth wiring layer is located on the first insulating substrate.

[0064] Furthermore, during the turn-on process of each power device in the lower bridge power device group, the control current flows through the first branch busbar, then through the fourth wiring layer, and finally to the first main busbar; and / or

[0065] Furthermore, during the turn-on process of each power device in the upper bridge power device group, the control current flows through the second branch busbar and then through the fifth wiring layer to the second main busbar.

[0066] Furthermore, the first branch junction is one of a bonding wire, a bonding tape, or a metal clip.

[0067] Furthermore, the second branch junction is one of a bonding wire, a bonding tape, or a metal clip.

[0068] Furthermore, the power devices in the lower bridge power device group are arranged in two columns; the power devices in the upper bridge power device group are arranged in two columns.

[0069] Furthermore, the lower bridge power device group has four power devices, and the first branch bus section includes four first connection terminals, each of which is connected to the second terminal of the four power devices in the lower bridge power device group; the upper bridge power device group has four power devices, and the second branch bus section includes four second connection terminals, each of which is connected to the second terminal of the four power devices in the upper bridge power device group.

[0070] Furthermore, the first insulating substrate also includes a first heat dissipation base plate, which is exposed on the lower surface of the molding compound.

[0071] Furthermore, the power devices in the lower bridge power device group are metal-oxide-semiconductor field-effect transistors or silicon carbide metal-oxide-semiconductor field-effect transistors; the power devices in the upper bridge power device group are metal-oxide-semiconductor field-effect transistors or silicon carbide metal-oxide-semiconductor field-effect transistors.

[0072] Furthermore, the first power terminal is a DC+ power terminal, the second power terminal is a DC- power terminal, and the third power terminal is an AC power terminal.

[0073] Furthermore, in the lower bridge power device group, the first terminal of the power device is the drain, the second terminal of the power device is the source, and the third terminal of the power device is the gate. Similarly, in the upper bridge power device group, the first terminal of the power device is the drain, the second terminal of the power device is the source, and the third terminal of the power device is the gate.

[0074] Furthermore, the power module also includes a molding compound that at least covers a first insulating substrate, a first wiring layer, power devices of the lower bridge power device group, and power devices of the upper bridge power device group. The molding compound includes opposing first and second sides, as well as opposing third and fourth sides, with the first and third sides of the molding compound being perpendicular. A first power terminal extends from a first surface of the molding compound, which is parallel to the first insulating substrate. A second power terminal and a first control terminal and a first sampling terminal of the lower bridge power device group extend from the first side of the molding compound. A third power terminal and a second control terminal and a second sampling terminal of the upper bridge power device group extend from the second side of the molding compound.

[0075] Furthermore, the first power terminal extends from the first surface of the molding compound, which is parallel to the first insulating substrate. The power module adopts the power module described above.

[0076] Furthermore, some adjacent power devices are power devices in the same row.

[0077] A power module employing the power module described above.

[0078] A method for packaging a power module, using the power module described above.

[0079] According to the power module, power assembly, and power module packaging method provided by the present invention, the power module includes a lower-bridge power device group and an upper-bridge power device group. The second bus component of the lower-bridge power device group includes a first main bus and multiple first branch bus components. The multiple first branch bus components are respectively electrically connected to the second terminal (e.g., the source of a metal-oxide-semiconductor field-effect transistor or a silicon carbide metal-oxide-semiconductor field-effect transistor) of a corresponding power device in the lower-bridge power device group. The third bus component of the upper-bridge power device group includes a second main bus and multiple second branch bus components. The multiple second branch bus components are respectively electrically connected to the second terminal (e.g., the source of a metal-oxide-semiconductor field-effect transistor or a silicon carbide metal-oxide-semiconductor field-effect transistor) of a corresponding power device in the upper-bridge power device group. The sources of either metal-oxide-semiconductor (MOSFET) or silicon carbide (SiMCC) MOSFETs are electrically connected. When each power device is forward-biased, the current flows sequentially through: the first power terminal, the fourth part of the first wiring layer in the upper bridge power device group region, the first terminal of the power device in the upper bridge power device group, the second terminal of the power device in the upper bridge power device group, the second branch bus, then converges to the second main bus, the second part of the first wiring layer in the lower bridge power device group region, the first terminal of the power device in the lower bridge power device group, the second terminal of the power device in the lower bridge power device group, the first branch bus, then to the first main bus, and finally output through the second power terminal. Thus, the conductive path length from each power device in the upper bridge power device group to the second main bus is similar, and the conductive path length from each power device in the lower bridge power device group to the first main bus is similar, achieving uniform current distribution.

[0080] According to the power module, power assembly, and power assembly packaging method provided by the present invention, during the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, the first main bus, converges to the first convergence terminal, and then flows through the second part of the first wiring layer in the region of the lower bridge power device group, the bonding wire, or the bonding strip to the first sampling terminal.

[0081] This invention also provides multiple control current paths during the turn-on process of power devices to reduce switching oscillations:

[0082] During the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, the first main bus, converges to the first convergence terminal, and then flows to the first sampling terminal.

[0083] During the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, and then through one of the bonding wires, bonding strips or metal clips to the first sampling terminal.

[0084] During the turn-on process of each power device in the upper bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, the second main bus, converges to the second convergence terminal, and then flows through the fifth part of the first wiring layer in the upper bridge power device group area, one of the bonding wires or bonding strips to the second sampling terminal.

[0085] During the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, the second main bus, converges to the second convergence terminal, and then flows to the second sampling terminal.

[0086] During the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, and then through one of the bonding wires, bonding strips or metal clips to the second sampling terminal.

[0087] The power module provided by this invention simultaneously encapsulates both the lower-bridge power device group and the upper-bridge power device group. Compared with the traditional method of separately encapsulating the upper-bridge power device group and the lower-bridge power device group, this greatly saves area and cost, and makes it more convenient for users to use.

[0088] The power module provided by the present invention can also employ a second insulating substrate and a second wiring layer, thereby further reducing the size of the power module, and allowing for flexible selection of different sizes of the second insulating substrate to meet different application scenarios according to requirements. Attached Figure Description

[0089] The above and other objects, features and advantages of the present invention will become clearer from the following description of embodiments of the invention with reference to the accompanying drawings, in which:

[0090] Figure 1 This is a three-dimensional schematic diagram of the power module according to the first embodiment of the present invention;

[0091] Figure 2 This is a schematic diagram of a first embodiment of the power module of the present invention;

[0092] Figure 3This is a schematic diagram of the current path when the power module is forward-turned on according to the first embodiment of the present invention;

[0093] Figure 4 This is a schematic diagram of the control current path of the power module in the first embodiment of the present invention;

[0094] Figure 5 This is a schematic diagram of the power module according to the second embodiment of the present invention;

[0095] Figure 6 This is an exploded view of the power module according to the second embodiment of the present invention;

[0096] Figure 7 This is a schematic diagram of the power module according to the third embodiment of the present invention;

[0097] Figure 8 This is a schematic diagram of the power module according to the fourth embodiment of the present invention;

[0098] Figure 9 This is a schematic diagram of the power module according to the fifth embodiment of the present invention;

[0099] Figure 10 This is a schematic diagram of the power module according to the sixth embodiment of the present invention;

[0100] Figure 11 This is a schematic diagram of the power module according to the seventh embodiment of the present invention;

[0101] Figure 12 This is a three-dimensional schematic diagram of the power module according to the seventh embodiment of the present invention.

[0102] Figure 13 This is a schematic diagram of the power module according to the eighth embodiment of the present invention;

[0103] Figure 14 This is a perspective view of the power module according to the eighth embodiment of the present invention.

[0104] Figure 15 This is a schematic diagram of the power module according to the ninth embodiment of the present invention;

[0105] Figure 16 This is a three-dimensional schematic diagram of the power module according to the ninth embodiment of the present invention;

[0106] Figure 17 This is a schematic diagram of the control current path of the power module in the ninth embodiment of the present invention.

[0107] Figure 18 This is a schematic diagram of the power module according to the ninth embodiment of the present invention;

[0108] Figure 19 This is a three-dimensional schematic diagram of the power module according to the ninth embodiment of the present invention. Detailed Implementation

[0109] The present application is described below based on embodiments, but it is not limited to these embodiments. In the detailed description of the present application below, certain specific details are described in detail. Those skilled in the art can fully understand the present application without these details. To avoid obscuring the substance of the present application, well-known methods, processes, flows, elements, and circuits are not described in detail.

[0110] Furthermore, those skilled in the art should understand that the accompanying drawings provided herein are for illustrative purposes only and are not necessarily drawn to scale.

[0111] Unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0112] For ease of explanation, spatially related terms such as “inside,” “outside,” “below,” “below,” “lower,” “above,” “upper,” etc., are used herein to describe the relationship between one element or feature illustrated in the figure and another. It will be understood that spatially related terms may be intended to encompass different orientations of the device in use or operation besides those depicted in the figure. For example, if the device in the figure is flipped, an element described as “below” or “below” another element or feature would then be positioned “above” that other element or feature. Thus, the exemplified term “below” can encompass both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or in other orientations), and the spatially related descriptive terms used herein should be interpreted accordingly.

[0113] Unless the context explicitly requires it, words such as "including" or "contains" throughout the application should be interpreted as including rather than exclusive or exhaustive; that is, meaning "including but not limited to".

[0114] In the description of this application, it should be understood that the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Furthermore, in the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0115] like Figures 1 to 17 A power module shown includes:

[0116] First insulating substrate 101;

[0117] The first wiring layer 102 is located on the first insulating substrate 101;

[0118] The lower bridge power device group includes multiple power devices 103-1, which are located on the corresponding first wiring layer 102. Each power device 103-1 in the lower bridge power device group includes a first terminal, a second terminal, and a third terminal. The upper bridge power device group includes multiple power devices 103-2, which are located on the corresponding first wiring layer 102. Each power device 103-2 in the upper bridge power device group includes a first terminal, a second terminal, and a third terminal.

[0119] The busbar includes the main busbar and multiple branch busbars;

[0120] Multiple branch busbars are electrically connected to the second terminals of corresponding power devices in the lower bridge power device group, and / or multiple branch busbars are electrically connected to the second terminals of corresponding power devices in the upper bridge power device group.

[0121] The embodiments of the present invention are based on Figures 1 to 17 For example, Figures 1 to 17 As shown, multiple branch bus sections are electrically connected to the second terminals of corresponding power devices in the lower bridge power device group. However, the present invention is not limited to the foregoing embodiments, except... Figures 1 to 17 The power module shown can have multiple branch bus sections that are electrically connected only to the second terminal of the corresponding power device in the lower bridge power device group, or multiple branch bus sections that are electrically connected only to the second terminal of the corresponding power device in the upper bridge power device group.

[0122] Figures 1 to 17 The power module shown:

[0123] The second terminal of the power device 103-1 in the lower bridge power device group is electrically connected to the second power terminal of the power module, and the third terminal of the power device 103-1 in the lower bridge power device group is electrically connected to the first control terminal 136-1.

[0124] The first terminal of the power device 103-2 of the upper bridge power device group is electrically connected to the first power terminal 120 (i.e., DC+ power terminal) of the power module, the second terminal of the power device 103-2 of the upper bridge power device group is electrically connected to the third power terminal 122 (i.e., AC power terminal) of the power module, and the third terminal of the power device 103-2 of the upper bridge power device group is electrically connected to the second control terminal 136-2.

[0125] The busbar includes a second busbar 130-1 and a third busbar 130-2. The main busbar includes a first main busbar 131-1 and a second main busbar 131-2. The multiple branch busbars shown include multiple first branch busbars 132-1 and multiple second branch busbars 132-2. The second busbar 130-1 includes a first main busbar 131-1 and multiple first branch busbars 132-1. The third busbar 130-2 includes a second main busbar 131-2 and multiple second branch busbars 132-2.

[0126] Multiple first branch busbars 132-1 are electrically connected to the second terminals of corresponding power devices 103-1 in the lower bridge power device group, and the first main busbar 131-1 is electrically connected to the second power terminal 121 (DC-power terminal);

[0127] Multiple second branch busbars 132-2 are electrically connected to the second terminals of the corresponding power devices 103-2 of the upper bridge power device group, and the second main busbar 131-2 is electrically connected to the third power terminal 122 (AC power terminal);

[0128] The first terminal of the power device 103-1 in the lower bridge power device group is electrically connected to the second main bus 131-2.

[0129] like Figures 1 to 4 The power module shown is the first embodiment, such as Figure 5 , Figure 6 The power module shown is a second embodiment, such as... Figures 7 to 10 These are the third to sixth embodiments, respectively. Figure 11 , Figure 12 This is the seventh embodiment, such as Figure 13 , Figure 14 This is the eighth embodiment. Figures 15 to 19 This is the ninth embodiment.

[0130] like Figures 1 to 8 , Figures 11 to 17 As shown, multiple first branch busbars 132-1 are electrically connected to the second terminals of corresponding power devices 103-1 in the lower bridge power device group via the second metal interconnect layer 112-1 of the lower bridge power device group; or, as shown... Figure 9 or Figure 10 As shown, multiple first branch bus sections 132-1 are electrically connected to the second terminals of corresponding power devices 103-1 in the lower bridge power device group via bonding wires or bonding tapes.

[0131] like Figures 1 to 8 , Figures 11 to 17 As shown, multiple second branch busbars 132-2 are electrically connected to the second terminals of corresponding power devices 103-2 in the upper bridge power device group via the second metal interconnect layer 112-2 of the upper bridge power device group; or, as... Figure 9 or Figure 10 As shown, multiple second branch bus sections 132-2 are electrically connected to the second terminals of corresponding power devices 103-2 of the upper bridge power device group via bonding wires or bonding tapes.

[0132] like Figures 1 to 17 As shown, the first end of the power device of the lower bridge power device group is electrically connected to the third power terminal 122 (AC power terminal) of the power module through one of the following: the first solder layer 111-1, the first sintering layer 111-1, the first eutectic solder, or the first conductive adhesive.

[0133] like Figures 1 to 17 As shown, the first end of the power device of the upper bridge power device group is electrically connected to the first power terminal 120 (DC+ power terminal) of the power module through a 111-2 junction layer, which is a second brazing layer 111-2, a second sintering layer 111-2, a second eutectic bond, or a second conductive adhesive.

[0134] The first wiring layer includes a first part, a second part, a third part, a fourth part, a fifth part, and a sixth part of the first wiring layer that are isolated from each other.

[0135] like Figures 1 to 17 As shown, multiple power devices 103-1 of the lower bridge power device group are located on the first part of the corresponding first wiring layer, and multiple power devices 103-2 of the upper bridge power device group are located on the fourth part of the corresponding first wiring layer.

[0136] like Figures 1 to 8 , Figures 11 to 17 As shown, the second power terminal 121 and the first main bus 131-1 are an integral metal clip.

[0137] like Figures 1 to 8 , Figures 11 to 17 As shown, the third power terminal 122 and the second main bus 131-2 are an integral metal clip.

[0138] The second power terminal 121 and the first main bus 131-1 can also be separate metal clips.

[0139] The third power terminal 122 and the second main bus 131-2 can also be separate metal clips.

[0140] like Figure 9 and Figure 10 As shown, at least a portion of the first main bus 131-1 is a bonding wire or a bonding band;

[0141] like Figure 9 and Figure 10As shown, at least a portion of the second main bus section 131-2 is a bonding line or a bonding band.

[0142] like Figures 1 to 4 As shown, the first main busbar 131-1 and the first branch busbar 132-1 are an integral metal clip;

[0143] like Figures 1 to 4 As shown, the second main busbar 131-2 and the second branch busbar 132-2 are an integral metal clip.

[0144] like Figures 5 to 8 , Figures 11 to 17 As shown, the first main busbar 131-1 and the first branch busbar 132-1 are separate metal clips;

[0145] like Figures 5 to 8 , Figures 11 to 17 As shown, the second main busbar 131-2 and the second branch busbar 132-2 are separate metal clips.

[0146] like Figures 1 to 4 , Figure 7 , Figure 8 , Figures 11 to 17 As shown, the first branch bus section 132-1 corresponding to some adjacent power devices in the lower bridge power device group is an integral structure;

[0147] like Figures 1 to 4 , Figure 7 , Figure 8 , Figures 11 to 17 As shown, the second branch bus section 132-2 of the upper bridge power device group, which is adjacent to some of the power devices, is an integral structure.

[0148] like Figure 5 , Figure 6 The first branch bus 132-1 corresponding to all the power devices in the lower bridge power device group shown is a discrete structure. The second ends of some adjacent power devices in the lower bridge power device group are connected to each other by one of the following: bonding wire, bonding tape or discrete metal clip.

[0149] like Figure 5 , Figure 6 The second branch bus section 132-2 corresponding to all the power devices in the upper bridge power device group shown is a discrete structure. The second ends of some adjacent power devices in the upper bridge power device group are connected to each other by one of the following: bonding wire, bonding tape, or discrete metal clip.

[0150] like Figures 1 to 17As shown, the currents from the first main bus 131-1 and the multiple first branch bus 132-1 intersect at the first converging terminal 135-1. The first main bus 131-1 includes a first end and a second end. The first converging terminal 135-1 is located at the first end of the first main bus 131-1. The distance from the first end of the first main bus 131-1 to the second power terminal 121 is greater than the distance from the second end of the first main bus 131-1 to the second power terminal 121. The power module also includes a first sampling terminal 134-1, such as... Figures 1 to 12 The second end of the first sampling terminal 134-1 is electrically connected to the first converging terminal 135-1. For example... Figures 1 to 17 As shown, the second sampling terminal 134-2 of the upper bridge power device group is connected to the third power terminal 122 (i.e., the AC power terminal).

[0151] like Figures 5 to 7 , Figure 9 , Figure 10 As shown, the second end of the first sampling terminal 134-1 is interconnected with the first converging terminal 135-1 via a bonding wire or bonding tape.

[0152] like Figures 1 to 4 As shown, the second end of the first sampling terminal 134-1 is interconnected with the second part of the first converging terminal 135-1 through the third metal interconnect layer 114 and the second part of the first wiring layer 102.

[0153] refer to Figures 1 to 4 The third metal interconnect layer 114 can be removed, and the second end and the first convergence end of the first sampling terminal are directly interconnected with the second part of the first wiring layer of the lower bridge power device group region.

[0154] like Figure 8 , Figure 11 , Figure 12 As shown, the second end of the first sampling terminal 134-1 and the first converging terminal 135-1 are integrated into one structure. This integrated structure offers better stability than bonded wires, preventing the bonded wires from shifting or collapsing during production, which could lead to positional changes at the converging terminal.

[0155] The second end of the first sampling terminal can also be electrically connected to the second end of the power device in the lower bridge power device group via a bonding wire, bonding tape, or metal clip.

[0156] like Figures 13 to 17 As shown, the second end of the first sampling terminal can also be electrically connected to the first branch bus via a bonding wire, bonding tape, or metal clip.

[0157] like Figure 18 , Figure 19As shown, the currents of the second main bus and the multiple second branch bus intersect at the second converging terminal. The second main bus includes a first terminal and a second terminal. The second converging terminal is located at the first terminal of the second main bus. The distance from the first terminal of the second main bus to the third power terminal is greater than the distance from the second terminal of the second main bus to the third power terminal.

[0158] The power module also includes a second sampling terminal, the second end of which is electrically connected to the second converging terminal.

[0159] The second end of the second sampling terminal is interconnected with the second converging terminal via a bonding wire or bonding tape.

[0160] The second end of the second sampling terminal is interconnected with the second convergence terminal through the fourth metal interconnect layer and the fifth part of the first wiring layer;

[0161] The second end of the second sampling terminal and the second convergence end are directly interconnected with the fifth part of the first wiring layer; or

[0162] The second end and the second convergence end of the second sampling terminal are integrated into one structure.

[0163] The power module also includes a second sampling terminal, the second end of which is electrically connected to the second end of the power device in the upper bridge power device group via a bonding wire, bonding tape, or metal clip.

[0164] The power module also includes a second sampling terminal, the second end of which is electrically connected to the second branch bus via a bonding wire, bonding tape, or metal clip.

[0165] like Figures 1 to 7 , Figure 9 , Figure 10 The power module shown, during the turn-on process of each power device in the lower bridge power device group, controls the current to flow through the first control terminal 136-1, the third terminal of each power device 103-1 in the lower bridge power device group, the second terminal of each power device 103-1 in the lower bridge power device group, the first branch bus 132-1, the first main bus 131-1, to the first convergence terminal 135-1, and then through the second part of the first wiring layer 102-1 in the lower bridge power device group region, and through one of the bonding wires or bonding strips to the first sampling terminal 134-1. Specifically, the present invention uses... Figure 4The power module shown is used as an example for illustration, where the dashed line indicates the control current path. Similarly, in the power module of the present invention, during the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, the second main bus, converges to the second convergence terminal, and then flows through the fourth part of the first wiring layer in the lower bridge power device group region, one of the bonding wires or bonding strips, to the second sampling terminal.

[0166] Figure 8 , Figure 11 , Figure 12 The power module shown, during the turn-on process of each power device in the lower bridge power device group, controls the current flowing through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, the first main bus, converging at the first converging terminal, and then flowing to the first sampling terminal. Similarly, during the turn-on process of each power device in the upper bridge power device group, controls the current flowing through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, the second main bus, converging at the second converging terminal, and then flowing to the second sampling terminal.

[0167] Figures 13 to 17 The power module shown, during the turn-on process of each power device in the lower bridge power device group, controls the current to flow through the first control terminal 136-1, the third terminal of each power device 103-1 in the lower bridge power device group, the second terminal of each power device 103-1 in the lower bridge power device group, the first branch bus 132-1, and then through one of the following: bonding wire, bonding tape, or metal clip, to the first sampling terminal 134-1. Specifically, the present invention uses... Figure 17 The power module shown is used as an example for explanation, where the dashed line indicates the control current path. Similarly, during the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal 136-2, the third terminal of each power device 103-2 in the upper bridge power device group, the second terminal of each power device 103-2 in the upper bridge power device group, the second branch bus 132-2, and then through one of the bonding wires, bonding tapes, or metal clips to the second sampling terminal 134-1.

[0168] like Figure 1-17The power module shown, when each power device is forward-biased, the current flows sequentially through: the first power terminal 120 (i.e., the DC+ power terminal), the first wiring layer 102 of the upper bridge power device group area, the first end of the power device in the upper bridge power device group, the second end of the power device in the upper bridge power device group, the second branch bus 132-2, and then converges to the second main bus 131-2, the first wiring layer 102 of the lower bridge power device group area, the first end of the power device in the lower bridge power device group, the second end of the power device in the lower bridge power device group, converges through the first branch bus 132-1, then to the first main bus 131-1, and finally outputs through the second power terminal 121 (i.e., the DC- power terminal). Specifically, the present invention uses... Figure 3 The power module shown is used as an example for illustration, where the dashed line indicates the control current path. From Figure 3 It is evident that, based on the current sharing design of this power module, each power device only needs to bear a portion of the total current (e.g., one-quarter), eliminating the uneven distribution of loads on individual power devices. In this application's power module, each power device carries a similar current, and the conductive path length from each power device to the main bus region is also similar, effectively achieving uniform current distribution and improving system stability. Furthermore, the converging terminal 135 is located at the first end of the main bus section 131, which reduces the influence of the main bus section 131 on its control current.

[0169] like Figures 1 to 17 As shown, the first main bus 131-1 is located above the power device 103-1 of the lower bridge power device group, and a portion of the projection of the first main bus 131-1 onto the first insulating substrate 101 is located between adjacent power devices 103-1 of the lower bridge power device group.

[0170] like Figures 1 to 17 As shown, the second main bus 131-2 is located above the power device 103-2 of the upper bridge power device group, and the partial projection of the second main bus 131-2 on the first insulating substrate 101 is located between the adjacent power devices 103-2 of the upper bridge power device group.

[0171] like Figures 5 to 14 As shown:

[0172] The second bus 130-1 also includes a second insulating substrate and a second wiring layer 141-1. The second wiring layer is located on the second insulating substrate, which is located on the first wiring layer. The second insulating substrate and the second wiring layer 141-1 are located between some adjacent power devices in the lower bridge power device group. The second wiring layer is electrically connected to a plurality of first branch bus 132-1 and a first main bus 131-1.

[0173] The third bus 130-2 also includes a third insulating substrate and a third wiring layer 141-2. The third wiring layer is located on the third insulating substrate, which is located on the first wiring layer. The third insulating substrate and the third wiring layer 141-2 are located between some adjacent power devices in the upper bridge power device group. The third wiring layer is electrically connected to a plurality of second branch bus 132-2 and a second main bus 131-2.

[0174] like Figures 5 to 14 The power module shown, during the turn-on process of each power device in the lower bridge power device group, after the control current flows through the first branch busbar, it also flows through the second wiring layer before flowing to the first main busbar. For example... Figures 5 to 14 The power module shown in the diagram, during the turn-on process of each power device in the upper bridge power device group, after the control current flows through the second branch bus, it also flows through the third wiring layer to the second main bus.

[0175] The second busbar 130-1 also includes a fourth wiring layer that is independent of the first wiring layer. The fourth wiring layer is located between some adjacent power devices 103-1. The first side of the fourth wiring layer is electrically connected to a plurality of first branch busbars 132-1 and a first main busbar 131-1. The second side of the fourth wiring layer is located on the first insulating substrate 101.

[0176] The third busbar 130-2 also includes a fifth wiring layer that is independent of the first wiring layer. The fifth wiring layer is located between some adjacent power devices 103-1. The first side of the fifth wiring layer is electrically connected to a plurality of second branch busbars 132-1 and a second main busbar 131-1. The second side of the fifth wiring layer is located on the first insulating substrate 101.

[0177] During the turn-on process of each power device in the lower bridge power device group, after the control current flows through the first branch bus, it also flows through the fourth wiring layer to the first main bus; and / or

[0178] During the turn-on process of each power device in the upper bridge power device group, the control current flows through the second branch bus section, then through the fifth wiring layer, and finally flows to the second main bus section.

[0179] like Figures 1 to 17As shown, the power devices 103-1 of the lower bridge power device group are arranged in two columns; the power devices 103-2 of the upper bridge power device group are arranged in two columns. There are four power devices 103-1 in the lower bridge power device group, arranged in two columns and two rows. The first branch busbar 132-1 includes four first connection terminals, each connected to the second terminal of one of the four power devices in the lower bridge power device group. There are four power devices 103-2 in the upper bridge power device group. The second branch busbar 132-2 includes four second connection terminals, each connected to the second terminal of one of the four power devices in the upper bridge power device group.

[0180] like Figures 1 to 17 As shown, the first insulating substrate 101 also includes a first heat dissipation base plate, which is exposed on the lower surface of the molding compound.

[0181] The power devices in the lower-bridge power device group are metal-oxide-semiconductor field-effect transistors (MOSFETs) or silicon carbide metal-oxide-semiconductor field-effect transistors (SiMNTs), but the power devices in this application are not limited to this embodiment. The first power terminal 120 of the power module is a DC+ power terminal, the second power terminal 121 is a DC- power terminal, and the third power terminal is an AC power terminal. The first terminal of the power device in the lower-bridge power device group is the drain, the second terminal is the source, and the third terminal is the gate. Similarly, the first terminal of the power device in the upper-bridge power device group is the drain, the second terminal is the source, and the third terminal is the gate.

[0182] like Figures 1 to 17 As shown, the power module also includes a molding compound 106-1 or 106, which at least covers the first insulating substrate 101, the power device 103-1 of the lower bridge power device group, and the power device 103-2 of the upper bridge power device group. The molding compound includes opposing first and second sides, as well as opposing third and fourth sides, with the first and third sides of the molding compound being perpendicular. The second power terminal 121 and the first control terminal and the first sampling terminal of the lower bridge power device group extend from the first side of the molding compound, while the third power terminal 122 and the second control terminal and the second sampling terminal of the upper bridge power device group extend from the second side of the molding compound.

[0183] like Figures 1 to 17 As shown, the first power terminal 120 extends from the first surface of the molding compound, and the first surface of the molding compound is parallel to the first insulating substrate. However, the first power terminal of the present invention is not subject to... Figures 1 to 17 The illustrated embodiments are limited.

[0184] In the power module section, adjacent power devices can be in the same row.

[0185] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A power module, characterized in that, include: First insulating substrate; A first wiring layer is located on the first insulating substrate; A lower bridge power device group, the lower bridge power device group comprising multiple power devices, the multiple power devices of the lower bridge power device group being located on the corresponding first wiring layer, each power device of the lower bridge power device group comprising a first terminal, a second terminal and a third terminal; An upper bridge power device group, the upper bridge power device group comprising multiple power devices, the multiple power devices of the upper bridge power device group being located on the corresponding first wiring layer, each power device of the upper bridge power device group comprising a first terminal, a second terminal and a third terminal; The busbar includes a main busbar and multiple branch busbars; The plurality of branch busbars are electrically connected to the second terminal of the corresponding power device of the lower bridge power device group, and / or the plurality of branch busbars are electrically connected to the second terminal of the corresponding power device of the upper bridge power device group. The second terminal of the power device in the lower bridge power device group is electrically connected to the second power terminal of the power module, and the third terminal of the power device in the lower bridge power device group is electrically connected to the first control terminal. The first end of the power device in the upper bridge power device group is electrically connected to the first power terminal of the power module, the second end of the power device in the upper bridge power device group is electrically connected to the third power terminal of the power module, and the third end of the power device in the upper bridge power device group is electrically connected to the second control terminal. The busbar includes a second busbar and a third busbar, the main busbar includes a first main busbar and a second main busbar, the multiple branch busbars include multiple first branch busbars and multiple second branch busbars, the second busbar includes the first main busbar and the multiple first branch busbars, and the third busbar includes the second main busbar and the multiple second branch busbars. The plurality of first branch busbars are electrically connected to the second terminals of the corresponding power devices of the lower bridge power device group, and the first main busbar is electrically connected to the second power terminal; the plurality of second branch busbars are electrically connected to the second terminals of the corresponding power devices of the upper bridge power device group, the second main busbar is electrically connected to the third power terminal, and the first terminals of the power devices of the lower bridge power device group are electrically connected to the second main busbar.

2. The power module according to claim 1, characterized in that, The plurality of first branch busbars are electrically connected to the second terminal of the corresponding power device in the lower bridge power device group via one of the second metal interconnect layer, bonding wire, or bonding strip of the lower bridge power device group; and / or The plurality of second branch busbars are electrically connected to the second terminals of the corresponding power devices in the upper bridge power device group via one of the second metal interconnect layer, bonding wires, or bonding strips of the upper bridge power device group.

3. The power module according to claim 1, characterized in that, The first terminal of the power device in the lower bridge power device group is electrically connected to the third power terminal of the power module via one of the following: a first solder layer, a first sintered layer, a first eutectic bond, or a first conductive adhesive; and / or The first end of the power device of the upper bridge power device group is electrically connected to the first power terminal of the power module through one of the second brazing layer, the second sintering layer, the second eutectic bonding layer or the second conductive adhesive of the upper bridge power device group.

4. The power module according to claim 1, characterized in that, The first wiring layer includes a first portion, a second portion, a third portion, a fourth portion, a fifth portion, and a sixth portion of the first wiring layer that are isolated from each other.

5. The power module according to claim 4, characterized in that, The multiple power devices of the lower bridge power device group are located on the first portion of the corresponding first wiring layer, and the multiple power devices of the lower bridge power device group are located on the fourth portion of the corresponding first wiring layer.

6. The power module according to claim 1, characterized in that... The second power terminal and the first main busbar are integral metal clips.

7. The power module according to claim 1, characterized in that... The third power terminal and the second main busbar are integral metal clips.

8. The power module according to claim 1, characterized in that... The second power terminal and the first main busbar are separate metal clips.

9. The power module according to claim 1, characterized in that... The third power terminal and the second main bus are separate metal clips.

10. The power module according to claim 1, characterized in that... At least a portion of the first main bus is a bond line or bond band; and / or At least a portion of the second main bus is a bonding wire or a bonding band.

11. The power module according to claim 1, characterized in that... The first main busbar and the first branch busbar are integrally formed metal clips; and / or The second main busbar and the second branch busbar are an integral metal clip.

12. The power module according to claim 1, characterized in that... The first main busbar and the first branch busbar are separate metal clips; and / or The second main busbar and the second branch busbar are separate metal clips.

13. The power module according to claim 1, characterized in that... The first branch busbars corresponding to some adjacent power devices in the lower bridge power device group are integral structures; and / or The second branch busbar of the upper bridge power device group, which is adjacent to the power device in the upper bridge power device group, is an integral structure.

14. The power module according to claim 1, characterized in that... The first branch busbars corresponding to some adjacent power devices in the lower bridge power device group are discrete structures, and the second ends of some adjacent power devices in the lower bridge power device group are interconnected by one of the following: bonding wires, bonding tapes, or discrete metal clips; and / or The second branch busbars corresponding to some adjacent power devices in the upper bridge power device group are discrete structures, and the second ends of some adjacent power devices in the upper bridge power device group are interconnected by one of the following: bonding wire, bonding tape, or discrete metal clip.

15. The power module according to claim 1, characterized in that: The currents of the first main bus and the plurality of first branch bus intersect at a first converging end. The first main bus includes a first end and a second end. The first converging end is located at the first end of the first main bus. The distance from the first end of the first main bus to the second power terminal is greater than the distance from the second end of the first main bus to the second power terminal.

16. The power module according to claim 15, characterized in that: The power module further includes a first sampling terminal, the second end of which is electrically connected to the first converging terminal.

17. The power module according to claim 16, characterized in that: The second end of the first sampling terminal is electrically connected to the first converging terminal in one of the following ways: (1) The second end of the first sampling terminal is interconnected with the first converging terminal by a bonding wire or a bonding tape; (2) The second end of the first sampling terminal is interconnected with the first converging terminal through a third metal interconnect layer and the second part of the first wiring layer; (3) The second end of the first sampling terminal and the first converging end are directly interconnected with the second portion of the first wiring layer of the lower bridge power device group region; or (4) The second end of the first sampling terminal and the first converging terminal are integrated into one structure.

18. The power module according to claim 1, wherein the power module further comprises a first sampling terminal, and the second end of the first sampling terminal is electrically connected to the second end of the power device of the lower bridge power device group via a bonding wire, a bonding strip or a metal clip.

19. The power module according to claim 1, wherein the power module further comprises a first sampling terminal, and the second end of the first sampling terminal is electrically connected to the first branch bus via a bonding wire, a bonding strip, or a metal clip.

20. The power module according to claim 1, characterized in that: The currents of the second main bus and the plurality of second branch bus intersect at the second converging terminal. The second main bus includes a first terminal and a second terminal. The second converging terminal is located at the first terminal of the second main bus. The distance from the first terminal of the second main bus to the third power terminal is greater than the distance from the second terminal of the second main bus to the third power terminal.

21. The power module according to claim 20, characterized in that: The power module further includes a second sampling terminal, the second end of which is electrically connected to the second converging terminal.

22. The power module according to claim 21, characterized in that: The second terminal of the second sampling terminal is electrically connected to the second converging terminal in one of the following ways: (1) The second end of the second sampling terminal is interconnected with the second converging terminal by a bonding wire or a bonding tape; (2) The second end of the second sampling terminal is interconnected with the second convergence terminal through the fourth metal interconnect layer and the fifth part of the first wiring layer; (3) The second end of the second sampling terminal and the second converging end are directly interconnected with the fifth part of the first wiring layer; or (4) The second end of the second sampling terminal and the second converging end are an integral structure.

23. The power module according to claim 1, wherein the power module further comprises a second sampling terminal, the second end of the second sampling terminal being electrically connected to the second end of the power device of the upper bridge power device group via a bonding wire, a bonding strip or a metal clip.

24. The power module according to claim 1, wherein the power module further comprises a second sampling terminal, the second end of the second sampling terminal being electrically connected to the second branch bus via a bonding wire, a bonding strip, or a metal clip.

25. The power module according to claim 17, characterized in that: During the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, the first main bus, converges to the first convergence terminal, and then flows through the second part of the first wiring layer in the region of the lower bridge power device group, the bonding wire or the bonding strip to the first sampling terminal.

26. The power module according to claim 17, characterized in that, During the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, the first main bus, converges to the first convergence terminal, and then flows to the first sampling terminal.

27. The power module according to claim 19, characterized in that, During the turn-on process of each power device in the lower bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the lower bridge power device group, the second terminal of each power device in the lower bridge power device group, the first branch bus, and then through one of the bonding wires, bonding tapes or metal clips to the first sampling terminal.

28. The power module according to claim 22, characterized in that: During the turn-on process of each power device in the upper bridge power device group, the control current flows through the first control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, the second main bus, converges to the second convergence terminal, and then flows through the fifth part of the first wiring layer of the upper bridge power device group region, a bonding wire or a bonding strip to the second sampling terminal.

29. The power module according to claim 22, characterized in that, During the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, the second main bus, converges to the second convergence terminal, and then flows to the second sampling terminal.

30. The power module according to claim 23, characterized in that, During the turn-on process of each power device in the upper bridge power device group, the control current flows through the second control terminal, the third terminal of each power device in the upper bridge power device group, the second terminal of each power device in the upper bridge power device group, the second branch bus, and then through one of the bonding wires, bonding tapes or metal clips to the second sampling terminal.

31. The power module according to claim 5, characterized in that: When each power device is forward-biased, the current flows sequentially through: the first power terminal, the fourth part of the first wiring layer of the upper bridge power device group region, the first end of the power device of the upper bridge power device group, the second end of the power device of the upper bridge power device group, the second branch bus, then converges to the second main bus, the second part of the first wiring layer of the lower bridge power device group region, the first end of the power device of the lower bridge power device group, the second end of the power device of the lower bridge power device group, the first branch bus, then to the first main bus, and finally output through the second power terminal.

32. The power module according to claim 1, characterized in that: The first main bus is located above the power devices of the lower bridge power device group, and the partial projection of the first main bus onto the first insulating substrate lies between partially adjacent power devices of the lower bridge power device group; and / or The second main bus is located above the power devices of the upper bridge power device group, and the projection of the second main bus onto the first insulating substrate is located between the power devices of the upper bridge power device group.

33. The power module according to claim 1, characterized in that, The second busbar further includes a second insulating substrate and a second wiring layer, the second wiring layer being located on the second insulating substrate, the second insulating substrate being located on the first wiring layer, the second insulating substrate and the second wiring layer being located between partially adjacent power devices in the lower bridge power device group, the second wiring layer being electrically connected to the plurality of first branch busbars and the first main busbar; and / or, The third busbar further includes a third insulating substrate and a third wiring layer. The third wiring layer is located on the third insulating substrate, which is located on the first wiring layer. The third insulating substrate and the third wiring layer are located between some adjacent power devices in the upper bridge power device group. The third wiring layer is electrically connected to the plurality of second branch busbars and the second main busbar.

34. The power module according to claim 33, characterized in that, During the turn-on process of each power device in the lower bridge power device group, after the control current flows through the first branch bus, it also flows through the second wiring layer to the first main bus.

35. The power module according to claim 33, characterized in that, During the turn-on process of each power device in the upper bridge power device group, after the control current flows through the second branch bus, it also flows through the third wiring layer to the second main bus.

36. The power module according to claim 1, characterized in that, The second busbar further includes a fourth wiring layer independent of the first wiring layer. The fourth wiring layer is located between partially adjacent power devices. A first surface of the fourth wiring layer is electrically connected to the plurality of first branch busbars and the first main busbar. A second surface of the fourth wiring layer is located on the first insulating substrate; and / or The third busbar also includes a fifth wiring layer that is independent of the first wiring layer. The fifth wiring layer is located between some of the adjacent power devices. The first side of the fifth wiring layer is electrically connected to the plurality of second branch busbars and the second main busbar. The second side of the fifth wiring layer is located on the first insulating substrate.

37. The power module according to claim 36, characterized in that, During the turn-on process of each power device in the lower bridge power device group, after the control current flows through the first branch bus, it also flows through the fourth wiring layer to the first main bus.

38. The power module according to claim 36, characterized in that, During the turn-on process of each power device in the upper bridge power device group, after the control current flows through the second branch bus, it also flows through the fifth wiring layer to the second main bus.

39. The power module according to claim 1, characterized in that, The first branch bus is one of a bonding wire, a bonding tape, or a metal clip; and / or The second branch bus is one of a bonding wire, a bonding tape, or a metal clip.

40. The power module according to claim 1, characterized in that, The power devices of the lower bridge power device group are arranged in two columns; the power devices of the upper bridge power device group are arranged in two columns.

41. The power module according to claim 1, characterized in that, The lower bridge power device group has four power devices, and the first branch bus includes four first connection terminals. Each first connection terminal of the first branch bus is connected to the second terminal of the four power devices in the lower bridge power device group. The upper bridge power device group has four power devices, and the second branch bus includes four second connection terminals. Each second connection terminal of the second branch bus is connected to the second terminal of the four power devices in the upper bridge power device group.

42. The power module according to claim 1, characterized in that, The first insulating substrate further includes a first heat dissipation base plate, which is exposed on the lower surface of the molding compound.

43. The power module according to claim 1, characterized in that, The power devices in the lower bridge power device group are metal-oxide-semiconductor field-effect transistors or silicon carbide metal-oxide-semiconductor field-effect transistors; the power devices in the upper bridge power device group are metal-oxide-semiconductor field-effect transistors or silicon carbide metal-oxide-semiconductor field-effect transistors.

44. The power module according to claim 1, characterized in that, The first power terminal is a DC+ power terminal, the second power terminal is a DC- power terminal, and the third power terminal is an AC power terminal.

45. The power module according to claim 41, characterized in that, The first terminal of the power device in the lower bridge power device group is the drain, the second terminal of the power device in the lower bridge power device group is the source, and the third terminal of the power device in the lower bridge power device group is the gate. The first terminal of the power device in the upper bridge power device group is the drain, the second terminal of the power device in the upper bridge power device group is the source, and the third terminal of the power device in the upper bridge power device group is the gate.

46. ​​The power module according to claim 1, characterized in that, The power module further includes a molding compound that at least covers the first insulating substrate, the first wiring layer, the power devices of the lower bridge power device group, and the power devices of the upper bridge power device group. The molding compound includes opposing first and second sides, as well as opposing third and fourth sides, with the first and third sides perpendicular to each other. The second power terminal and the first control terminal and the first sampling terminal of the lower bridge power device group extend from the first side of the molding compound, while the third power terminal and the second control terminal and the second sampling terminal of the upper bridge power device group extend from the second side of the molding compound.

47. The power module according to claim 46, characterized in that, The first power terminal extends from the first surface of the encapsulation, which is parallel to the first insulating substrate.

48. The power module according to any one of claims 13, 14, 26, 32 or 33, characterized in that... The power devices that are adjacent to each other in the aforementioned section are power devices in the same row.

49. A power module, characterized in that, The power module is the power module described in any one of claims 1 to 48.

50. A method for packaging a power module, characterized in that, The power module is the power module described in any one of claims 1 to 48.

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