Battery pack and electric equipment

Abstract

The invention discloses a battery pack and electric equipment, and belongs to the technical field of power batteries, the battery pack comprises a box body, a plurality of battery modules and a cooling plate, the box body comprises an edge beam and a bottom plate, the edge beam is connected with the bottom plate, and the edge beam is arranged in a surrounding mode in the circumferential direction of the bottom plate to form a containing cavity; an opening is formed in the side, away from the bottom plate, of the edge beam and communicates with the containing cavity. The plurality of battery modules are arranged in the accommodating cavity and are connected with the edge beams; the cooling plate comprises a first plate body and a second plate body, the first plate body is arranged on one side, deviating from the bottom plate, of the battery module and is connected with the edge beam, and the second plate body covers the first plate body and is connected with the first plate body; a plurality of first flow channels and second flow channels are arranged between the first plate body and the second plate body, and the depth of the second flow channels in the thickness direction of the cooling plate is larger than that of the first flow channels in the thickness direction of the cooling plate. The efficiency of flow distribution design and flow resistance design of the cooling plate is improved through the second flow channels, and the flow resistance of the cooling plate is effectively reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of power batteries, and specifically relates to a battery pack and electrical equipment. Background Art

[0002] In the design and development process of new energy vehicle power battery packs, the thermal management system is an important component that cannot be ignored. Since the flow resistance of the heat exchanger (mainly the cooling plate) in the thermal management system directly affects the selection of the vehicle water pump, the smaller the flow resistance of the thermal management system, the lower the head of the water pump that can be selected, and the price is relatively cheaper. At present, the automotive industry is under great cost pressure, so reducing the flow resistance of the battery pack thermal management system can effectively alleviate the cost pressure of the vehicle.

[0003] At this stage, the industry is committed to low cost, and most of them adopt non-pipeline solutions. The flow distribution principle of the large cold plate solution lies in the change of flow resistance. The commonly used solutions are changing the flow channel width and adding spoiler points. However, these two measures will also bring a series of problems. For example, changing the flow channel width will affect the choice of plate thickness. If the flow channel width is increased, in order to ensure the flatness and strength of the cold plate, the thickness of the cold plate needs to be increased, thereby increasing the cost and weight; adding spoiler points may bring the risk of local poor welding. Summary of the invention

[0004] An embodiment of the present application provides a battery pack, which aims to improve the efficiency of the cooling plate flow distribution design and the flow resistance reduction design without increasing the material cost and the width of the cooling plate, thereby effectively reducing the flow resistance of the cooling plate; another purpose of the embodiment of the present application is to provide an electrical equipment; another purpose of the embodiment of the present application is to provide a car.

[0005] An embodiment of the present application provides a battery pack, comprising:

[0006] The box body comprises a side beam and a bottom plate, wherein the side beam is connected to the bottom plate, and the side beam is arranged around the bottom plate circumferentially to form a receiving cavity; the side beam has an opening on a side away from the bottom plate, and the opening is communicated with the receiving cavity;

[0007] A plurality of battery modules are arranged in the accommodating cavity;

[0008] A cooling plate, comprising a first plate body and a second plate body, wherein the first plate body is arranged on a side of the battery module away from the bottom plate, and the second plate body is covered on the first plate body and connected to the first plate body;

[0009] There are multiple first flow channels and multiple second flow channels between the first plate body and the second plate body, and the first flow channels are connected to the second flow channels; the height of the second flow channels in the thickness direction of the cooling plate is greater than the height of the first flow channels in the thickness direction of the cooling plate.

[0010] In some embodiments, the battery pack further includes thermal insulation cotton, which is disposed on a side of the cooling plate away from the bottom plate to cover the opening and is connected to the cooling plate.

[0011] In some embodiments, the battery pack further includes structural adhesive, which is disposed between the battery module and the cooling plate to connect the battery module and the cooling plate.

[0012] In some embodiments, the battery pack further includes a sealing strip, which is disposed between the cooling plate and the side beam and is arranged around the opening to seal the accommodating cavity.

[0013] In some embodiments, the depth of the first flow channel in the thickness direction of the cooling plate is W 1 mm, satisfying 2.5 mm ≤ W 1 ≤ 3.6 mm, and the width of the first flow channel in its radial direction is L 1 mm, satisfying 5 mm ≤ L 1 ≤ 38 mm.

[0014] In some embodiments, the depth of the second flow channel in the thickness direction of the cooling plate is W 2 mm, satisfying 2.5 mm < W 2 ≤ 4 mm, and the width of the second flow channel in its radial direction is L 2 mm, satisfying 5 mm ≤ L 2 ≤ 38 mm.

[0015] In some embodiments, the width L of the first flow channel in its radial direction 1 is the same as the width L of the second flow channel in its radial direction. 2 Same.

[0016] In some embodiments, the second plate body is a corrugated plate formed by stamping in one piece.

[0017] In some embodiments, the thickness of the thermal insulation cotton is W 3 mm, satisfying 3 mm ≤ W 3 ≤ 30 mm.

[0018] An embodiment of the present application also discloses an electrical device, including the battery pack as described in the above embodiment.

[0019] One of the beneficial effects of multiple embodiments of the present application is as follows:

[0020] A battery pack and an electrical device according to an embodiment of the present application belong to the technical field of power batteries. The battery pack includes a box body, a plurality of battery modules, and a cooling plate. The box body includes side beams and a bottom plate. The side beams are connected to the bottom plate, and the side beams are arranged around the circumference of the bottom plate to form a receiving cavity. An opening is provided on the side of the side beam facing away from the bottom plate, and the opening communicates with the receiving cavity. A plurality of battery modules are arranged in the receiving cavity. The cooling plate includes a first plate body and a second plate body. The first plate body is arranged on the side of the battery module facing away from the bottom plate. The second plate body covers the first plate body and is connected to the first plate body. A plurality of first flow channels and second flow channels are provided between the first plate body and the second plate body. The depth of the second flow channel in the thickness direction of the cooling plate is greater than the depth of the first flow channel in the thickness direction of the cooling plate. In the present application, the second flow channel is used to improve the flow rate distribution design and reduce the flow resistance design efficiency of the cooling plate, effectively reducing the average flow resistance of the cooling plate.

[0021] The electrical device according to an embodiment of the present application includes the battery pack as described in the above embodiment. Therefore, it can have all the technical features and technical effects of the above battery pack, which will not be elaborated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative efforts.

[0023] Figure 1 It is an exploded view of the overall structure of the battery pack provided by the embodiment of the present application;

[0024] Figure 2 It is a schematic diagram of the overall structure of the cooling plate provided by the embodiment of the present application;

[0025] Figure 3 It is provided by the embodiment of the present application Figure 2 The enlarged view at A in

[0026] Figure 4 It is a schematic diagram of the partial sectional structure of the cooling plate provided by the embodiment of the present application;

[0027] Figure 5 It is a schematic diagram of the sectional structure of the thermal insulation cotton provided by the embodiment of the present application;

[0028] Figure 6 It is a schematic diagram of the sectional structure of the cooling plate provided by the embodiment of the present application;

[0029] Figure 7 It is a specific structure diagram of a product provided by the embodiment of the present application.

[0030] Description of the reference numerals:

[0031] 10 - Box body; 11 - Side beam; 12 - Bottom plate; 13 - Accommodation cavity; 14 - Opening;

[0032] 20 - Battery module;

[0033] 30 - Cooling plate; 31 - First plate body; 32 - Second plate body; 33 - First flow channel; 331 - First main flow channel; 332 - Second main flow channel; 333 - First secondary flow channel; 334 - Second secondary flow channel; 34 - Second flow channel; 35 - Liquid injection pipeline;

[0034] 40 - Thermal insulation cotton;

[0035] 50 - Structural adhesive;

[0036] 60 - Sealing strip. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present application.

[0038] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned accompanying drawings are used to distinguish similar objects, and do not necessarily need to describe a specific order or sequence. It should be understood that such used data can be interchanged under appropriate circumstances so that the embodiments of the present application described here can be implemented in an order other than those illustrated or described here. In the description of the present application, unless otherwise stated, "a plurality of" means two or more. "And / or" describes the association relationship of associated objects, indicating that three relationships can exist. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. The character " / " generally represents an "or" relationship between the associated objects before and after. In addition, the terms "comprising" and "having" and any of their deformations are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units does not necessarily have to be limited to those steps or units clearly listed, but may include other steps or units not clearly listed or inherent to these processes, methods, products, or devices.

[0039] Those skilled in the art can understand that the accompanying drawings are only schematic diagrams of the exemplary embodiments and may not be to scale. The modules or processes in the accompanying drawings are not necessarily essential for implementing the present application, and thus cannot be used to limit the protection scope of the present application.

[0040] In the design and R & D process of the power battery pack of new energy vehicles, the thermal management system, as an important component, cannot be ignored. Since the flow resistance of the heat exchanger (mainly the cooling plate) in the thermal management system directly affects the selection of the vehicle water pump, the smaller the flow resistance of the thermal management system, the lower the lift that the water pump can select, and the relatively cheaper the price. At present, the cost pressure in the automotive industry is relatively high. Therefore, reducing the flow resistance of the battery pack thermal management system can effectively relieve the cost pressure of the vehicle. At the present stage, the industry is committed to low-cost solutions. At present, most of them adopt the no-pipeline scheme. The flow distribution of the large cooling plate scheme is far from the change of flow resistance. The currently common solutions are to change the flow channel width, increase the turbulence points, etc. However, these two measures will also bring a series of problems. For example, changing the flow channel width will affect the selection of the plate thickness. If the flow channel width is increased, in order to ensure the flatness and strength of the cooling plate, it is necessary to increase the thickness of the cooling plate, thus increasing the cost and weight; increasing the turbulence points may bring the risk of local welding defects. Therefore, the quantitative relationship between the flow channel depth and the flow resistance will provide theoretical support for the design of the cooling plate, thereby improving the design efficiency.

[0041] Considering the basic cost of the current solution, the no-pipeline design is adopted, and the flow resistance of the cooling plate becomes the main part of the flow resistance of the thermal management system. Since the flow channel form of the cooling plate will affect the temperature distribution of the whole battery pack, after the flow channel form is determined, the most direct and effective way to optimize the flow resistance is to change the flow channel depth. There is a certain proportional relationship between the change of the flow channel depth and the reduction of the flow resistance. In addition, at the present stage, the industry is committed to low-cost solutions. At present, most of them adopt the no-pipeline scheme. The flow distribution of the large cooling plate scheme is far from the change of flow resistance. The currently common solutions are to change the flow channel width, increase the turbulence points, etc. However, these two measures will also bring a series of problems. For example, changing the flow channel width will affect the selection of the plate thickness. If the flow channel width is increased, in order to ensure the flatness and strength of the cooling plate, it is necessary to increase the thickness of the cooling plate, thus increasing the cost and weight; increasing the turbulence points may bring the risk of local welding defects. Therefore, the quantitative relationship between the flow channel depth, the flow resistance and the flow rate will provide theoretical support for the design of the cooling plate, thereby improving the design efficiency.

[0042] In view of this, the embodiments of the present application provide a battery pack, aiming to solve at least part of the above technical problems.

[0043] Please refer to Figures 1 to 6 The embodiments of the present application provide a battery pack. Please refer to Figure 1 、 Figure 2 、 Figure 3 , Figure 1 which is the overall structure explosion diagram of the battery pack provided by the embodiments of the present application, Figure 2 which is the overall structure schematic diagram of the cooling plate provided by the embodiments of the present application, Figure 3 which is provided by the embodiments of the present application Figure 2Enlarged view of area A. The battery pack includes a box body 10, a plurality of battery modules 20, and a cooling plate 30. Among them, the box body 10 includes side beams 11 and a bottom plate 12. The side beams 11 are connected to the bottom plate 12, and the side beams 11 are arranged circumferentially around the bottom plate 12 to form a receiving cavity 13. An opening 14 is provided on the side of the side beam 11 facing away from the bottom plate 12, and the opening 14 communicates with the receiving cavity 13. A plurality of battery modules 20 are arranged in the receiving cavity 13. The cooling plate 30 includes a first plate body 31 and a second plate body 32. The first plate body 31 is arranged on the side of the battery module 20 facing away from the bottom plate 12. The second plate body 32 covers the first plate body 31 and is connected to the first plate body 31. A plurality of first flow channels 33 and a plurality of second flow channels 34 are provided between the first plate body 31 and the second plate body 32, and the first flow channels 33 communicate with the second flow channels 34. The depth of the second flow channel 34 in the thickness direction of the cooling plate 30 is greater than the depth of the first flow channel 33 in the thickness direction of the cooling plate 30.

[0044] It should be noted that in this embodiment, the cooling plate 30 covers the top of the receiving cavity 13 of the box body 10, replacing the cover plate structure in the existing box body. That is, the cooling plate 30 in the embodiment has the function of cooling the battery module 20 and at the same time has the function of covering and sealing the receiving cavity 13. Among them, the cooling plate 30 is mainly used for heat exchange treatment of a plurality of battery modules 20, so as to ensure the temperature uniformity of the battery pack and improve the cycle service life of the battery pack. At the same time, the cooling plate 30 is arranged on the top of the receiving cavity 13 of the box body 10, so that the risk of damage to the cooling plate 30 due to bottoming during vehicle driving can be effectively avoided.

[0045] It can be understood that the first flow channel 33 is a channel for the coolant to flow through in the cooling plate 30. The first flow channel 33 can effectively guide the coolant to flow through the back of the battery module 20, thereby taking away the heat. This can effectively reduce the temperature of the battery module 20, improve the heat dissipation effect, and maintain the temperature uniformity of the battery pack. The setting of the first flow channel 33 can ensure the uniform distribution of the coolant on the entire cooling plate 30. This can avoid the generation of hot spots, make the temperature distribution of the battery module 20 more uniform, and improve the cycle service life of the battery pack.

[0046] It should be noted that the second flow channel 34 is arranged on the first flow channel 33, and the depth of the second flow channel 34 in the thickness direction of the cooling plate 30 is greater than the depth of the first flow channel 33 in the thickness direction of the cooling plate 30. Among them, the second flow channel 34 is formed by stamping the first flow channel 33 at a suitable position on the cooling plate 30 to form the second flow channel 34. Thus, without increasing the material cost and the width of the cooling plate 30, the second flow channel 34 formed by stamping is used to adjust the flow resistance reduction rate of the cooling plate 30, thereby improving the flow distribution design of the cooling plate 30 and effectively reducing the average flow resistance of the cooling plate 30.

[0047] In view of this, the depth of the second flow channel 34 in the thickness direction of the cooling plate 30 is greater than the depth of the first flow channel 33 in the thickness direction of the cooling plate 30. That is, the depth of the second flow channel 34 is greater than the depth of the first flow channel 33. By pre-calculating the reduction rate of the flow resistance and then adjusting the depth of the second flow channel 34 in the thickness direction of the cooling plate 30, the reduction rate of the flow resistance of the cooling plate 30 can be adjusted, thereby improving the flow rate distribution design of the cooling plate 30 and effectively reducing the average flow resistance of the cooling plate 30. In one example, when the widths and lengths of the first flow channel 33 and the second flow channel 34 are the same, with the width being M and the length being N, for every 0.1 mm increase in the depth of the second flow channel 34, the average flow resistance of the second flow channel 34 is reduced by 6%. According to this rule, in the design optimization stage of reducing the average flow resistance of the cooling plate 30, the depth design of the second flow channel can be more clearly and accurately based on this rule to improve the flow resistance performance of the cooling plate 30. For example: when the flow resistance needs to be reduced by 20%, according to the rule, simply increasing the depth of the second flow channel by 0.4 mm can reduce the flow resistance by 24%. The same method is applicable when increasing the average flow resistance of the cooling plate 30. According to this method, when the average flow resistance of the cooling plate 30 needs to be increased or decreased, the desired target depth can be directly calculated, increasing the design efficiency by at least more than 10 times. At the same time, according to this rule, on a design or mass production plan that has already completed flow optimization, the required flow channel depth can be directly calculated, avoiding repeated demonstration of the design plan due to the design plan being overturned and redone. Using this rule can ensure that the overall bursting pressure, structural strength, weight, and cost of the cooling plate 30 remain unchanged without increasing the flat thickness of the cooling plate 30. This method is not only applicable to the adjustment of the overall average flow resistance of the cooling plate 30 but also applicable to the optimization and adjustment of local flow resistance (deepening the flow channel depth for the corresponding flow channel section), and can quickly calculate the flow channel optimization plan for the required position, improving the flow rate distribution optimization efficiency of the cooling plate 30. It reduces the blockage problem caused by overly narrow flow channels. It improves the yield of the cooling plate 30 production, reduces the production cost of the cooling plate 30 supplier, and effectively reduces the finished product price of the cooling plate 30.

[0048] In some embodiments, refer to Figure 6 , Figure 6Schematic cross-sectional structure diagram of the cooling plate provided by the embodiment of the present application. The cooling plate 30 has liquid injection holes (not shown in the figure), and the liquid injection holes are respectively communicated with the first flow channel 33 and the second flow channel 34, so that the entry and flow of the cooling liquid can be realized. In addition to the liquid injection holes, the cooling plate 30 further includes a liquid injection pipeline 35. One end of the liquid injection pipeline 35 is connected to the liquid injection hole, and the other end is externally connected to the cooling liquid. In this way, the cooling liquid can enter the cooling plate 30 through the liquid injection pipeline 35 and flow through the first flow channel 33 and the second flow channel 34, thereby realizing the cooling effect on the cooling plate 30. Through the design of the liquid injection holes and the liquid injection pipeline 35, the cooling plate 30 can be conveniently connected to the cooling system of the battery pack to realize the supply and circulation of the cooling liquid. Such a design can effectively control the temperature of the cooling plate 30 and maintain its stability within the working temperature range.

[0049] In some embodiments, as Figure 1 shown, the battery pack further includes a heat insulation cotton 40. The heat insulation cotton 40 is disposed on the side of the cooling plate 30 facing away from the bottom plate 12 to cover and seal the opening 14 and is connected to the cooling plate 30. It should be noted that the heat insulation cotton 40 provides heat insulation and heat preservation effects. It can reduce the conduction and dissipation of heat, thereby effectively maintaining the temperature stability of the battery module 20. By using the heat insulation cotton 40, the influence of the external temperature on the battery module 20 can be reduced, the temperature control ability of the battery pack can be improved, and the battery module 20 can be protected from extreme temperatures. The connection method between the heat insulation cotton 40 and the cooling plate 30 can adopt various methods, such as adhesion, clamping or other appropriate connection methods. This can ensure a tight connection between the heat insulation cotton 40 and the cooling plate 30, prevent heat leakage and reduction of the heat preservation effect. The specific connection method can be determined according to the actual situation and design requirements to ensure that the heat insulation cotton 40 can effectively play its heat preservation function.

[0050] In some embodiments, as Figure 1As shown, the battery pack further includes a structural adhesive 50, which is disposed between the battery module 20 and the cooling plate 30 to connect the battery module 20 and the cooling plate 30. It should be noted that the structural adhesive 50 is a thermally conductive adhesive. The thermally conductive adhesive has good thermal conductivity and electrical insulation, and can effectively transfer heat. By using the thermally conductive adhesive, the cooling plate 30 can be better connected to the battery module 20. The thermally conductive adhesive can increase the heat conduction effect between the cooling plate 30 and the battery module 20, thereby improving the heat dissipation performance of the entire battery pack. This connection method can not only ensure the close contact between the battery module 20 and the cooling plate 30, but also improve the heat transfer efficiency, ensure the uniform temperature distribution of the battery module 20, and improve the overall performance of the battery pack. In addition, the thermally conductive adhesive can also provide electrical insulation to ensure the insulation between the battery module 20 and the cooling plate 30, thus ensuring the use safety of the battery pack. The electrical insulation performance of the thermally conductive adhesive can effectively prevent current short - circuit and other electrical problems between the battery module 20 and the cooling plate 30, and improve the reliability and safety of the battery pack.

[0051] In some embodiments, as Figure 1 shown, the battery pack further includes a sealing strip 60, which is disposed between the cooling plate 30 and the side beam 11, and the sealing strip 60 is arranged around the opening 14 to seal the accommodating cavity 13. The sealing strip 60 ensures the sealing performance of the accommodating cavity 13. The sealing strip 60 is placed between the cooling plate 30 and the side beam 11 to fill the gap between them, and is arranged around the opening 14 to prevent the entry of external substances and environmental factors. By using the sealing strip 60, harmful substances such as liquids, gases or dust can be effectively prevented from entering the accommodating cavity 13, thereby protecting the battery module 20 and other key components from the influence of the external environment.

[0052] In some embodiments, please refer to Figure 4 , Figure 4 is a partial cross - sectional structural schematic diagram of the cooling plate provided by the embodiment of the present application. The depth of the first flow channel 33 in the thickness direction of the cooling plate 30 is W 1 mm, satisfying 2.5mm ≤ W 1 ≤ 3.6mm, and the width of the first flow channel 33 in its radial direction is L 1 mm, satisfying 5mm ≤ L 1 ≤ 38mm. This design can realize the flow of the fluid in the cooling plate 30. The depth W 1 of the first flow channel 33 in the thickness direction of the cooling plate 30 determines the channel width of the fluid in this direction, and the width L 1This determines the channel spacing of the fluid in this direction. By adjusting these two spacings, the flow velocity and distribution of the fluid on the cooling plate 30 can be controlled to achieve an effective heat dissipation effect. The value ranges of these spacings are determined according to the design requirements and performance needs. The specific values should be determined based on the actual situation and design standards to ensure that the cooling plate 30 can meet the heat dissipation requirements and provide sufficient fluid channel space to maintain the temperature stability of the battery module 20.

[0053] In some embodiments, refer to Figure 4 , Figure 4 which is a schematic cross-sectional structure diagram of a part of the cooling plate provided by an embodiment of the present application. The depth of the second flow channel 34 in the thickness direction of the cooling plate 30 is W 2 mm, satisfying 2.5 mm < W2 ≤ 4 mm, and the width of the second flow channel 34 in its radial direction is L 2 mm, satisfying 5 mm ≤ L 2 ≤ 38 mm 。 The depth W of the second flow channel 34 in the thickness direction of the cooling plate 30 2 is greater than or equal to the depth W of the first flow channel 33 in the thickness direction of the cooling plate 30 1 ; when the depth W of the second flow channel 34 in the thickness direction of the cooling plate 30 2 is greater than the depth W of the first flow channel 33 in the thickness direction of the cooling plate 30 1 , this means that the channel width of the second flow channel 34 in the thickness direction of the cooling plate 30 is wider than that of the first flow channel 33. Such a design can provide a larger fluid channel to increase the fluid flow rate and heat dissipation effect, while reducing the average flow resistance of the cooling plate 30. The width of the first flow channel 33 in its radial direction is L 1 mm is the same as the width of the second flow channel 34 in its radial direction which is L 2 mm; this means that in the radial direction of the flow channel, the channel widths between the first flow channel 33 and the second flow channel 34 are consistent. Such a design can ensure the uniform flow of the fluid in the radial direction of the flow channel and provide the same heat dissipation effect. Through such a flow channel design, the cooling plate 30 can achieve better fluid flow and heat dissipation effects. The spacing W of the second flow channel 34 in the thickness direction of the cooling plate 30 2 provides a wider channel, increasing the fluid flow rate, thereby reducing the average flow resistance of the cooling plate 30. The width of the first flow channel 33 in its radial direction is L 1 being the same as the width L of the second flow channel 34 in its radial direction 2 ensures the uniform distribution of the fluid in the radial direction of the flow channel.

[0054] In some embodiments, such as Figure 4As shown, the second plate body 32 is a corrugated plate formed by stamping in one piece. This means that the second plate body 32 is formed by stamping a metal sheet, resulting in a corrugated structure. The design of the corrugated plate can increase the surface area and improve the heat dissipation effect. The corrugated structure can increase the contact area between the cooling plate 30 and the fluid, thereby enhancing the conduction and dissipation of heat. This design can effectively improve the heat dissipation efficiency of the cooling plate 30, enabling it to better absorb and dissipate heat. The second plate body 32 in the shape of a corrugated plate is combined with the first plate body 31 in the shape of a plate, thereby forming the first flow channel 33 and the second flow channel 34, which can facilitate the processing and manufacturing of the cooling plate 30. The shapes and sizes of the first flow channel 33 and the second flow channel 34 can be adjusted and customized according to the design requirements. This combination method can not only provide fluid channels but also ensure the structural stability and sealing of the cooling plate 30.

[0055] In some embodiments, please refer to Figure 5 , Figure 5 which is a schematic cross-sectional structure diagram of the thermal insulation cotton provided by the embodiment of the present application. The thickness of the thermal insulation cotton 40 is W 3 mm, satisfying 3mm ≤ W 3 ≤ 30mm. This means that the thickness of the thermal insulation cotton 40 is between 3mm and 30mm and can be selected and adjusted according to specific requirements. The thermal insulation cotton 40 provides heat insulation and heat preservation effects, preventing heat dissipation. By adding the thermal insulation cotton 40 between the cooling plate 30 and other components, the conduction and dissipation of heat can be reduced, and the efficiency and performance of the cooling plate 30 can be improved. The selection of the thickness of the thermal insulation cotton 40 needs to consider multiple factors, including heat dissipation requirements, space limitations, material costs, etc. A thicker thermal insulation cotton 40 can provide better heat insulation effects but may increase the overall size and weight. A thinner thermal insulation cotton 40 can reduce the size and weight but may reduce the heat insulation effect. Therefore, in actual applications, the thickness of the thermal insulation cotton 40 needs to be selected according to specific situations and requirements. Within the range of 3mm ≤ W 3 ≤ 30mm, a reasonable selection can be made according to factors such as heat dissipation requirements, space limitations, and costs to achieve the best heat insulation effects and performance.

[0056] Next, specific embodiments of the battery pack of the present application are also provided. Through specific embodiments, the present application is described in more detail. It can be seen from the following embodiments that in actual implementation, with the same flow channel width, the average flow resistance of the cooling plate 30 can be adjusted by adjusting the depth of the second flow channel 34.

[0057] In this embodiment, the depth W 1 of the first flow channel remains unchanged at 3mm, and the depth W 2 of the second flow channel is adjusted, changing the ratio of the depth W 1 of the first flow channel to the depth W 2 of the second flow channel, W1 / W 2 。

[0058] Examples 1-1 to 1-5 and Comparative Example 1 are as shown in Table 1 below:

[0059]

[0060] Table 1

[0061] It can be seen from the above Examples 1-1 to 1-5 and Comparative Example 1 that:

[0062] From Comparative Example 1, it can be seen that when the depth of the first flow channel W 1 is 3 mm and the depth of the second flow channel W 2 is also 3 mm, that is, when the ratio of W 1 / W 2 is 1, the average flow resistance of the cooling plate 30 is 40547 pa at this time.

[0063] In Example 1-1, the depth of the second flow channel W 2 is increased to 3.1 mm, and the ratio of W 1 / W 2 becomes 0.97, and the average flow resistance of the cooling plate 30 is reduced to 37473 pa, and the flow resistance reduction rate reaches 7.58%. This shows that as the depth of the second flow channel increases, the ratio of W 1 / W 2 decreases, and the average flow resistance of the cooling plate 30 is significantly reduced, initially demonstrating the feasibility of reducing the average flow resistance of the cooling plate 30 by adjusting the depth of the second flow channel, which is in line with the statement in the previous text that deepening the depth of the second flow channel can reduce the average flow resistance of the cooling plate 30.

[0064] In Example 1-2, the depth of the second flow channel W 2 is further increased to 3.2 mm, the ratio of W 1 / W 2 is 0.94, and the average flow resistance of the cooling plate 30 is reduced to 34799 pa, and the flow resistance reduction rate is 7.14%. Although the flow resistance reduction rate decreases compared with Example 1-1, the overall flow resistance is still decreasing, indicating again that the increase in the depth of the second flow channel has a positive effect on reducing the average flow resistance of the cooling plate 30.

[0065] In Example 1-3, the depth of the second flow channel W 2 is 3.3 mm, W 1 / W 2The ratio is 0.9. The average flow resistance of the cooling plate 30 is 32591 pa, and the flow resistance reduction rate is 6.34%. It also reflects the trend that as the depth of the second flow channel increases, the average flow resistance of the cooling plate 30 continues to decrease, but the decreasing amplitude gradually decreases, which also conforms to the general law. Because as the depth of the second flow channel continues to increase, it conforms to the statement in the previous text that deepening the depth of the second flow channel can reduce the average flow resistance of the cooling plate 30.

[0066] In Examples 1-4, the depth W of the second flow channel 2 reached 3.4 mm, and the ratio of W 1 / W 2 was 0.88. The average flow resistance of the cooling plate 30 dropped to 30554 pa, and the flow resistance reduction rate was 6.25%. In Example 1-5, the depth W of the second flow channel 2 was 3.5 mm, and the ratio of W 1 / W 2 was 0.86. The average flow resistance of the cooling plate 30 was 28812 pa, and the flow resistance reduction rate was 5.7%. These two examples also show that as the depth of the second flow channel increases, the ratio of W 1 / W 2 continually decreases, and the average flow resistance of the cooling plate 30 continues to decrease, further verifying that by adjusting the depth of the second flow channel, the average flow resistance of the cooling plate 30 can be effectively controlled. Just as emphasized in the previous text, by adjusting the depth of the second flow channel 34 in the thickness direction of the cooling plate 30, the flow resistance reduction rate of the cooling plate 30 can be adjusted, thereby realizing the optimal design of the average flow resistance of the cooling plate 30.

[0067] In summary, through the analysis of different examples and comparative examples in Table 1, it intuitively shows that when the depth of the first flow channel is fixed, increasing the depth of the second flow channel can reduce the average flow resistance of the cooling plate 30, and it can verify that the method of optimizing the flow resistance by adjusting the depth of the second flow channel is effective.

[0068] Examples 2-1 to 2-5 and Comparative Example 2 are as shown in Table 2 below:

[0069]

[0070] Table 2

[0071] The depth W of the first flow channel 1 is fixed at 2.5 mm and remains unchanged. By changing the depth W of the second flow channel 2 , and then changing the ratio of the depth W of the first flow channel 1 to the depth W of the second flow channel 2 W 1 / W 2 , the influence on the average flow resistance of the cooling plate 30 is observed.

[0072] From Comparative Example 2, when the depth W of the first flow channel1 is 2.5 mm, and the depth W of the second flow channel 2 is also 2.5 mm, that is, W 1 / W 2 When the ratio is 1, the average flow resistance of the cooling plate 30 reaches 69944 pa at this time.

[0073] In Example 2-1, the depth W of the second flow channel 2 is increased to 2.6 mm, W 1 / W 2 The ratio becomes 0.96, and the average flow resistance of the cooling plate 30 is reduced to 66840 pa, and the flow resistance reduction rate is 4.43%. This shows that as the depth of the second flow channel increases, the ratio of W 1 / W 2 decreases, and the average flow resistance of the cooling plate 30 shows an obvious decrease, initially reflecting the feasibility of reducing the average flow resistance of the cooling plate 30 by adjusting the depth of the second flow channel, which is in line with the fact that deepening the depth of the second flow channel can reduce the average flow resistance of the cooling plate 30.

[0074] In Example 2-2, the depth W of the second flow channel is further increased 2 to 2.7 mm, W 1 / W 2 The ratio is 0.93, and the average flow resistance of the cooling plate 30 is reduced to 64087 pa, and the flow resistance reduction rate is 4.12%. Although the flow resistance reduction rate has decreased compared with Example 2-1, the overall average flow resistance of the cooling plate 30 is still decreasing, indicating again that increasing the depth of the second flow channel has a positive effect on reducing the average flow resistance of the cooling plate 30.

[0075] In Example 2-3, the depth W of the second flow channel 2 becomes 2.8 mm, W 1 / W 2 The ratio is 0.89, and the average flow resistance of the cooling plate 30 is 61847 pa, and the flow resistance reduction rate is 3.5%. It continues to show the trend that the flow resistance continues to decrease as the depth of the second flow channel increases, but the reduction amplitude becomes smaller, probably because as the depth of the second flow channel continues to increase, the marginal effect on reducing the flow resistance gradually weakens.

[0076] In Example 2-4, the depth W of the second flow channel 2 reaches 2.9 mm, W 1 / W 2 The ratio is 0.86, and the average flow resistance of the cooling plate 30 is reduced to 59675 pa, and the flow resistance reduction rate is 3.51%; in Example 2-5, the depth W of the second flow channel 2 is 3 mm, W 1 / W 2The ratio is 0.83, the average flow resistance of the cooling plate 30 is 57908 pa, and the flow resistance reduction rate is 3.05%. These two embodiments still show that as the depth of the second flow channel increases,

[0077] W 1 / W 2 the ratio continuously decreases, and the average flow resistance of the cooling plate 30 continues to decrease.

[0078] In summary, through the analysis of Comparative Example 2 and each embodiment in Table 2, it can be clearly seen that when the depth W 1 of the first flow channel is fixed, increasing the depth W 2 of the second flow channel will reduce the ratio of the two depths, thereby reducing the average flow resistance of the cooling plate 30, which effectively verifies the method of adjusting the depth W 2 of the second flow channel to optimize the average flow resistance of the cooling plate 30, and further illustrates the effectiveness and reliability of this method under different initial flow channel depths.

[0079] Embodiments 3-1 to 3-5 and Comparative Example 3 are as shown in Table 3 below:

[0080]

[0081] Table 3

[0082] In this experiment, the depth W 1 of the first flow channel was fixed at 3.5 mm and remained unchanged. By changing the depth W 2 of the second flow channel, the ratio W 1 of the depth W 2 of the first flow channel to the depth W 1 / W 2 of the second flow channel was changed to explore the influence on the average flow resistance of the cooling plate 30.

[0083] Comparative Example 3 presents a reference state. When W 1 = 3.5 mm and W 2 = 3.5 mm, that is, W 1 / W 2 = 1, the flow resistance of the cooling plate 30 is 20157 pa, which provides a basic reference for the comparison of subsequent embodiments.

[0084] Fix the depth W 1 of the first flow channel at 3.5 mm and remain unchanged. By changing the depth W 2 of the second flow channel, the ratio W 1 of the depth W 2 of the first flow channel to the depth W 1 / W 2 of the second flow channel was changed to observe the specific influence on the average flow resistance of the cooling plate 30.

[0085] As can be seen from Comparative Example 3, when the depth W of the first flow channel 1 = 3.5 mm, and the depth W of the second flow channel 2 = 3.5 mm, that is, when W 1 / W 2 = 1, the average flow resistance of the cooling plate 30 at this time is 20157 pa, which can be used as the basic data for subsequent comparison.

[0086] In Example 3-1, the depth W of the second flow channel 2 is increased to 3.6 mm, and W 1 / W 2 = 0.97. The average flow resistance of the cooling plate 30 is reduced to 18948 pa, and the flow resistance reduction rate of the cooling plate 30 is 6.00%. This shows that when the depth of the second flow channel increases, making the ratio of W 1 / W 2 less than 1, the average flow resistance of the cooling plate 30 decreases significantly, indicating that the average flow resistance of the cooling plate 30 can be effectively reduced by adjusting the depth of the second flow channel, which is in line with the theory that increasing the depth of the second flow channel can reduce the flow resistance.

[0087] In Example 3-2, the depth W of the second flow channel 2 becomes 3.7 mm, and W 1 / W 2 = 0.94. The average flow resistance of the cooling plate 30 is reduced to 17849 pa, and the flow resistance reduction rate is 5.80%. Although the flow resistance reduction rate is slightly lower than that in Example 3-1, the average flow resistance of the cooling plate 30 is still decreasing as a whole, further indicating that increasing the depth of the second flow channel has a positive effect on reducing the average flow resistance of the cooling plate 30.

[0088] In Example 3-3, the depth W of the second flow channel 2 is 3.8 mm, and W 1 / W 2 = 0.92. The average flow resistance of the cooling plate 30 is 16742 pa, and the flow resistance reduction rate is 6.20%. This situation continues to show that as the depth of the second flow channel increases, the average flow resistance of the cooling plate 30 continues to decrease, but the reduction amplitude fluctuates, which may be due to the fact that the influence of the change in the flow channel depth on the average flow resistance of the cooling plate 30 is not completely linear and there is a certain complex relationship.

[0089] In Example 3-4, the depth W of the second flow channel 2 reaches 3.9 mm, and W 1 / W 2 = 0.89. The average flow resistance of the cooling plate 30 is reduced to 15851 pa, and the flow resistance reduction rate is 5.32%. In Example 3-5, the depth W of the second flow channel 2 is 4 mm, and W 1 / W 2 = 0.87, the average flow resistance of the cooling plate 30 is 14915 pa, and the flow resistance reduction rate is 5.91%. These two embodiments still show that as the depth of the second flow channel increases, W 1 / W 2 The ratio of continuously decreases, and the average flow resistance of the cooling plate 30 continues to decrease, further verifying the effectiveness and feasibility of the method of adjusting the depth of the second flow channel to optimize the average flow resistance of the cooling plate 30.

[0090] Through the analysis of Comparative Example 3 and each embodiment in Table 3, it can be clearly found that when the depth of the first flow channel W 1 is fixed, increasing the depth of the second flow channel W 2 , reducing the ratio of the two depths, the average flow resistance of the cooling plate 30 will decrease accordingly, and this law can be reflected within different change ranges of the depth of the second flow channel W 2 . It provides strong data support for the optimization of the flow channel design of the cooling plate 30, and further confirms the reliability of the technical solution of controlling the flow resistance by adjusting the flow channel depth.

[0091] In summary, in all the embodiments of the three tables, it shows that as the depth of the second flow channel W 2 increases, W 1 / W 2 The ratio of decreases, and the overall trend of the average flow resistance of the cooling plate 30 decreasing. For example, in Table 1, from Comparative Example 1 to Embodiment 1-5, the depth of the second flow channel increases from 3 mm to 3.5 mm, W 1 / W 2 decreases from 1 to 0.86, and the average flow resistance of the cooling plate 30 decreases from 40547 pa to 28812 pa; similar change trends can also be found in Table 2 and Table 3. This fully shows that the method of reducing the average flow resistance of the cooling plate 30 by adjusting the depth of the second flow channel W 2 is practical, consistent, and stable.

[0092] In some embodiments, such as Figure 7As shown in the figure, four battery modules 20 are configured. Two battery modules 20 form a group, thus forming two battery packs with balanced performance. To ensure that each battery pack can operate stably in a suitable temperature environment, an independent cooling plate 30 is specially equipped for each battery pack for efficient cooling. It should be noted that the cooling process of each battery pack depends on a carefully designed first flow channel 33. The structure of this first flow channel 33 is delicate and complex. It is jointly composed of a first main flow channel 331, a second main flow channel 332, a first sub-flow channel 333, and a second sub-flow channel 334. Among them, the first main flow channel 331 and the second main flow channel 332 are respectively closely arranged around a battery module 20 and are connected to each other, forming a smooth cooling circulation path. The first sub-flow channel 333 is connected to the first main flow channel 331. In terms of design, it pursues the ultimate fitting effect and closely contacts the surface of the corresponding battery module 20 with the maximum fitting degree, thereby realizing the efficient heat exchange between the cooling medium and the battery module 20 and ensuring that the heat generated by the battery module 20 during operation can be quickly removed. Similarly, the second sub-flow channel 334 is connected to the second main flow channel 332 and also closely contacts another battery module 20 with the maximum fitting degree, providing reliable cooling protection for this battery module 20. In addition, in order to further optimize the cooling efficiency and reduce the flow resistance, the second flow channel 34 is reasonably arranged at any one or more of the first main flow channel 331, the second main flow channel 332, the first sub-flow channel 333, and the second sub-flow channel 334. This flexible setting method can optimize the cooling system targeted according to the actual cooling requirements and flow channel characteristics, thereby significantly improving the performance and stability of the entire battery pack cooling system.

[0093] Correspondingly, the embodiment of the present application further provides an electrical device, and this electrical device includes the above-mentioned battery pack. This electrical device can be an electric vehicle (EV), a hybrid electric vehicle (HEV), a range extended electric vehicle (REEV), or a plug-in hybrid electric vehicle (PHEV). It can be understood that this electrical device can have all the technical features and corresponding beneficial effects of the above-mentioned battery pack, which will not be elaborated here.

[0094] In the above embodiments, the descriptions of each embodiment have their own focuses. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0095] The above has introduced in detail the battery pack and the electrical equipment provided by the embodiments of the present application, and specific examples have been used to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the technical solution and its core idea of the present application; those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A battery pack, characterized in that: include: The box body comprises a side beam and a bottom plate, wherein the side beam is connected to the bottom plate, and the side beam is arranged around the bottom plate to form a receiving cavity; The side of the side beam facing away from the bottom plate has an opening, and the opening is connected to the accommodating cavity; A plurality of battery modules are arranged in the accommodating cavity; A cooling plate, comprising a first plate body and a second plate body, wherein the first plate body is arranged on a side of the battery module away from the bottom plate, and the second plate body is covered on the first plate body and connected to the first plate body; There are multiple first flow channels and multiple second flow channels between the first plate body and the second plate body, and the first flow channels are connected to the second flow channels; the depth of the second flow channels in the thickness direction of the cooling plate is greater than the depth of the first flow channels in the thickness direction of the cooling plate.

2. The battery pack according to claim 1, characterized in that: The battery pack further comprises heat-insulating cotton, which is arranged on a side of the cooling plate away from the bottom plate to cover the opening and is connected to the cooling plate.

3. The battery pack according to claim 2, characterized in that: The battery pack further includes a structural adhesive, which is applied between the battery module and the cooling plate to connect the battery module to the cooling plate.

4. The battery pack according to claim 1, wherein: The battery pack further includes a sealing strip, which is disposed between the cooling plate and the side beam, and the sealing strip is disposed around the opening to seal the accommodating cavity.

5. The battery pack according to claim 1, wherein: The depth of the first flow channel in the thickness direction of the cooling plate is W1 mm, satisfying 2.5 mm≤W1≤3.6 mm, and the width of the first flow channel in the radial direction is L1 mm, satisfying 5 mm≤L1≤38 mm.

6. The battery pack according to claim 5, characterized in that: The depth of the second flow channel in the thickness direction of the cooling plate is W2 mm, satisfying 2.5 mm<W2≤4 mm, and the width of the second flow channel in the radial direction is L2 mm, satisfying 5 mm≤L2≤38 mm.

7. The battery pack according to claim 6, characterized in that: A width L1 of the first flow channel in the radial direction is the same as a width L2 of the second flow channel in the radial direction.

8. The battery pack according to claim 1, wherein: The second plate body is a corrugated plate formed in one piece by stamping.

9. The battery pack according to claim 2, characterized in that: The thickness of the thermal insulation cotton is W3mm, satisfying 3mm≤W3≤30mm.

10. An electrical device, characterized in that: A battery pack comprising any one of claims 1 to 9.

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