Active sound box power amplifier module with damping function

Abstract

The invention relates to the technical field of audio equipment, in particular to an active sound box power amplifier module with a damping function, which comprises a wiring terminal, the lower end of the wiring terminal is fixedly connected with an installation device, the rear part of the lower wall of the installation device is fixedly connected with a heat dissipation device, and the left part of the lower wall of the installation device is provided with an aluminum electrolytic capacitor. A chip board is arranged in the middle of the lower wall of the mounting device, a power amplifier potentiometer is arranged on the front portion of the lower wall of the mounting device, and damping devices are fixedly connected to the upper end and the lower end of the mounting device. The damping device comprises a side plate. According to the active loudspeaker box power amplifier module with the damping function, accurate and efficient audio processing and adjustment are achieved through the wiring terminal, the chip board and the like, and stable operation is guaranteed through rapid heat dissipation of a copper heat conduction bent pipe, heat dissipation fins, a draught fan and the like of the heat dissipation device; by means of the buffering assembly, the connecting assembly and other multi-layer damping structures of the damping device, structural stability is guaranteed, and product performance is improved in an all-around mode.

Description

Technical Field

[0001] The present invention relates to the technical field of audio equipment, and particularly relates to an active speaker power amplifier module with shock absorption. Background Art

[0002] With the continuous development of audio technology, people's requirements for the sound quality and stability of active speakers are increasing day by day. In an active speaker, the power amplifier module, as a core component, is responsible for amplifying the input audio signal in power to drive the speaker to emit sound. However, in the actual use process, the power amplifier module faces many challenges. On the one hand, the speaker will generate vibrations when playing audio, and these vibrations may affect the connection stability of the internal electronic components of the power amplifier module, thereby causing damage to the sound quality or equipment failure. On the other hand, the power amplifier module will generate a large amount of heat during operation. If the heat cannot be dissipated in time and effectively, the temperature of the electronic components will be too high, resulting in a decline in performance, a shortened lifespan, and even equipment damage. Therefore, we introduce an active speaker power amplifier module with shock absorption. Content of the Utility Model

[0003] The main purpose of the present invention is to provide an active speaker power amplifier module with shock absorption, which can effectively solve the problems in the background art.

[0004] To achieve the above purpose, the technical solution adopted by the present invention is as follows: An active speaker power amplifier module with shock absorption includes a wiring terminal. The lower end of the wiring terminal is fixedly connected with an installation device. The rear part of the lower wall of the installation device is fixedly connected with a heat dissipation device. An aluminum electrolytic capacitor is arranged at the left part of the lower wall of the installation device. A chip board is arranged in the middle of the lower wall of the installation device. A power amplifier potentiometer is arranged at the front part of the lower wall of the installation device. A volume adjustment button is arranged at the front end of the power amplifier potentiometer. Shock absorption devices are fixedly connected to both the upper end and the lower end of the installation device; The shock absorption device includes side plates. There are two side plates. Two installation slots are opened at both the left end and the right end of the two side plates. A buffer assembly is fixedly connected between the left end and the right end of the two side plates. There are four buffer assemblies, and the four buffer assemblies are symmetrically distributed in pairs front and back. A connection assembly is rotatably connected between the left end and the right end of the four buffer assemblies. There are two connection assemblies, and the two connection assemblies are symmetrically distributed front and back.

[0005] As a further improvement of the above solution, the buffer assembly includes a connecting block. A rotating shaft rod is inserted and connected to the middle of the front end of the connecting block. One end of the connecting block is fixedly connected to a round block. One end of the round block is fixedly connected to a first damper. The other end of the first damper is fixedly connected to a rubber abutting block. A first shock-absorbing spring is sleeved on the outer surface of the first damper. The outer side of the first shock-absorbing spring is movably connected to an outer cylinder. A cavity is formed in the inner wall of the outer cylinder. The connecting block is connected by bearings in a groove on one side.

[0006] By adopting the above technical solution: The first shock-absorbing spring, the damper and the rubber abutting block cooperate to effectively buffer vibrations and protect internal components.

[0007] As a further improvement of the above solution, the connecting assembly includes a fixing block. A second damper is fixedly connected to the middle of the lower end of the fixing block. A connecting spring is sleeved on the outer surface of the second damper. The fixing block is installed between the left end and the right end of the front two buffer assemblies.

[0008] By adopting the above technical solution: The shock-absorbing effect is further enhanced, and the vibration suppression ability of the overall structure is improved.

[0009] As a further improvement of the above solution, the installation device includes a circuit board. Vertical rods are fixedly connected to the four corners of the upper end of the circuit board. Limiting rings are fixedly connected to the upper parts of the outer surfaces of the four vertical rods. A plurality of threads are engraved on the upper parts of the outer surfaces of the four vertical rods. Fixing nuts are fixedly connected to the upper parts of the outer surfaces of the four vertical rods. An upper plate is jointly connected to the upper parts of the outer surfaces of the four vertical rods. Docking holes are formed in the four corners of the upper end of the upper plate. The circuit board is fixedly connected to the lower end of the wiring terminal.

[0010] By adopting the above technical solution: A stable installation platform is provided for each component, which is convenient for docking and installation with other components to construct a complete structural system.

[0011] As a further improvement of the above solution, the heat dissipation device includes a housing. A plurality of connecting holes are formed in the upper end of the housing. Mounting holes are formed in the four corners of the lower end of the housing. Mounting bolts are fixedly connected in the four mounting holes. A plurality of heat dissipation fins are inserted and connected to the outer periphery of the housing. A plurality of copper heat-conducting bent pipes are inserted and connected to the upper end of the housing. Heat-conducting copper wires are wound and connected to the upper parts of the outer surfaces of the plurality of copper heat-conducting bent pipes. A rear housing plate is fixedly connected to the rear end of the housing. A heat dissipation fan is inserted and connected to the middle of the rear end of the rear housing plate. The housing is fixedly connected to the upper rear part of the circuit board through four mounting bolts.

[0012] By adopting the above technical solution: The heat conduction path is optimized, the heat conduction efficiency is improved, and the heat dissipation effect is strengthened.

[0013] As a further improvement of the above solution, several of the copper heat-conducting bent pipes are all in an arc structure, and several of the copper heat-conducting bent pipes are fixedly installed in the housing.

[0014] By adopting the above technical solution: the heat dissipation area is maximized, and the air flow is effectively accelerated by the fan to improve the heat dissipation efficiency.

[0015] As a further improvement of the above solution, several of the heat dissipation fins are longitudinally equidistantly distributed, and several of the heat dissipation fins are located outside several of the copper heat-conducting bent pipes, and the heat dissipation fan is directly behind several of the heat dissipation fins at the rear side.

[0016] By adopting the above technical solution: the heat dissipation area is maximized, and the air flow is effectively accelerated by the heat dissipation fan to improve the heat dissipation efficiency.

[0017] As a further improvement of the above solution, the front end and the rear end of the connecting block are movably connected to the inner wall of the groove on one side through bearings, and the first damper, the rubber abutting block and the first shock-absorbing spring are all located in the cavity, and the cavity is in a hollow cylindrical structure.

[0018] By adopting the above technical solution: ensure that the connecting block rotates flexibly, and at the same time provide protection for the internal shock-absorbing components to ensure stable shock-absorbing effect.

[0019] As a further improvement of the above solution, the position dimensions of the four vertical rods correspond to the position dimensions of the four docking holes one by one, and the upper plate is located above the limiting ring.

[0020] By adopting the above technical solution: achieve precise installation and ensure the stability and reliability of the installation device.

[0021] As a further improvement of the above solution, the circuit board is fixedly connected to the power amplifier potentiometer, the wiring terminal, the chip board and the aluminum electrolytic capacitor.

[0022] By adopting the above technical solution: ensure stable circuit connection and guarantee the normal electrical performance of the power amplifier module.

[0023] Compared with the prior art, the present invention has the following beneficial effects: 1. In the present invention, the housing of the heat dissipation device is fixed to the rear upper end of the circuit board by mounting bolts, providing a stable support for the heat dissipation components. The copper heat conduction bent pipe with an arc-shaped structure is fixed inside the housing. Utilizing its good heat conduction performance, it quickly conducts the heat generated by the chip board and the like to itself. The heat-conducting copper wires wound around the outer surface further assist in heat conduction, expanding the heat dissipation area. The heat dissipation fins longitudinally and equidistantly distributed on the outside of the copper heat conduction bent pipe greatly increase the heat dissipation area. After the heat dissipation fan at the rear is started, it accelerates the air flow and quickly takes away the heat on the surface of the heat dissipation fins. This series of designs can quickly and effectively dissipate the heat generated by the active speaker power amplifier module, preventing the performance degradation or damage of electrical components such as wiring terminals, power amplifier potentiometers, chip boards, and aluminum electrolytic capacitors due to overheating, and ensuring the stable operation of the power amplifier module under long-term and high-intensity work.

[0024] 2. In the present invention, the shock absorption device adopts a multi-layer shock absorption structure. The mounting grooves on the side plates are used for the overall installation and positioning. The two side plates are connected by four buffer components and two connecting components. In the buffer component, the rotating shaft rod at the front end of the connecting block can rotate. The damper one, shock absorption spring one, and rubber abutting block connected to the round block work together. When receiving vibrations, the shock absorption spring one expands and contracts to absorb the vibration energy, the damper one generates a damping effect to slow down the vibration transmission, and the rubber abutting block further buffers and dampens the shock. The damper two and connecting spring at the lower end of the fixed block in the connecting component also play a role during vibrations, jointly reducing the vibration transmission with the buffer component. This multi-layer shock absorption structure effectively reduces the influence of external vibrations on the components inside the power amplifier module, avoiding problems such as damage and poor contact of electrical components caused by vibrations, and ensuring the structural stability and stable operation of the active speaker power amplifier module in different usage environments.

[0025] 3. In the present invention, the active speaker power amplifier module introduces external audio signals through the wiring terminals. The chip board, as the core processing component, precisely processes and amplifies the input audio signals. The power amplifier potentiometer can finely adjust the amplified audio signals. The volume adjustment button enables users to flexibly control the output volume according to actual needs. The aluminum electrolytic capacitor plays roles such as storing and releasing electrical energy and stabilizing the voltage in the circuit, ensuring the stability of the entire audio processing process, providing high-quality audio output for users, and meeting the requirements for sound quality in different scenarios. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic diagram of the overall structure of an active speaker power amplifier module with shock absorption according to the present invention; Figure 2 is a schematic diagram of a partial structure of an active speaker power amplifier module with shock absorption according to the present invention; Figure 3 is a schematic diagram of the structure of the mounting device of an active speaker power amplifier module with shock absorption according to the present invention; Figure 4 Exploded structural schematic diagram of the heat dissipation device of an active speaker power amplifier module with shock absorption according to the present invention; Figure 5 Structural schematic diagram of the heat dissipation device of an active speaker power amplifier module with shock absorption according to the present invention; Figure 6 Structural schematic diagram of the shock absorption device of an active speaker power amplifier module with shock absorption according to the present invention; Figure 7 Structural schematic diagram of the connection component of an active speaker power amplifier module with shock absorption according to the present invention; Figure 8 Structural schematic diagram of the buffer component of an active speaker power amplifier module with shock absorption according to the present invention.

[0027] In the figure: 1, terminal; 2, chip board; 3, volume adjustment button; 4, power amplifier potentiometer; 5, aluminum electrolytic capacitor; 6, installation device; 7, heat dissipation device; 8, shock absorption device; 61, circuit board; 62, vertical rod; 63, fixing nut; 64, upper plate; 65, thread; 66, limiting ring; 67, docking hole; 71, outer shell; 72, connection hole; 73, copper heat conduction elbow; 74, heat-conducting copper wire; 75, installation hole; 76, installation bolt; 77, heat dissipation fin; 78, rear shell plate; 79, heat dissipation fan; 81, side plate; 82, installation groove; 83, connection component; 84, buffer component; 841, connection block; 842, rotating shaft rod; 843, outer cylinder; 844, cavity; 845, round block; 846, rubber abutting block; 847, first shock absorption spring; 848, first damper; 831, fixing block; 832, groove; 833, connection spring; 834, second damper. Detailed implementation manners

[0028] In order to make the technical means, creative features, achieved purposes and effects of the present invention easy to understand, the present invention will be further described below in conjunction with specific implementation manners.

[0029] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0030] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, terms such as "installation", "provided with", "connection", etc. should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0031] Please refer to Figure 1-8 , the present invention provides a technical solution: An active speaker power amplifier module with shock absorption, including a wiring terminal 1. The lower end of the wiring terminal 1 is fixedly connected with an installation device 6. The rear part of the lower wall of the installation device 6 is fixedly connected with a heat dissipation device 7. An aluminum electrolytic capacitor 5 is arranged at the left part of the lower wall of the installation device 6. A chip board 2 is arranged in the middle of the lower wall of the installation device 6. A power amplifier potentiometer 4 is arranged at the front part of the lower wall of the installation device 6. A volume adjustment button 3 is arranged at the front end of the power amplifier potentiometer 4. Shock absorption devices 8 are fixedly connected to both the upper end and the lower end of the installation device 6.

[0032] In this embodiment, the shock absorption device 8 includes side plates 81. There are two side plates 81. Two mounting grooves 82 are opened at both the left end and the right end of the two side plates 81. A buffer assembly 84 is fixedly connected between the left end and the right end of the two side plates 81. There are four buffer assemblies 84, and the four buffer assemblies 84 are symmetrically distributed in pairs front and back. A connection assembly 83 is jointly connected by bearings between the left end and the right end of the four buffer assemblies 84. There are two connection assemblies 83, and the two connection assemblies 83 are symmetrically distributed front and back. The buffer assembly 84 includes a connection block 841. A rotating shaft rod 842 is inserted through the middle of the front end of the connection block 841. One end of the connection block 841 is fixedly connected with a round block 845. One end of the round block 845 is fixedly connected with a damper one 848. The other end of the damper one 848 is fixedly connected with a rubber abutting block 846. A shock absorption spring one 847 is sleeved on the outer surface of the damper one 848. The outer side of the shock absorption spring one 847 is movably connected with an outer cylinder 843. A cavity 844 is opened on the inner wall of the outer cylinder 843. The connection block 841 is connected by bearings in a groove 832 on one side. The connection assembly 83 includes a fixing block 831. A damper two 834 is fixedly connected to the middle of the lower end of the fixing block 831. A connection spring 833 is sleeved on the outer surface of the damper two 834. The fixing block 831 is installed between the left end and the right end of the front two buffer assemblies 84. The front end and the rear end of the connection block 841 are movably connected by bearings to the inner groove wall of a groove 832 on one side. The damper one 848, the rubber abutting block 846 and the shock absorption spring one 847 are all located in the cavity 844. The cavity 844 is of a hollow cylindrical structure.

[0033] Through the above solution: The shock absorption device 8 mainly consists of side plates 81, buffer components 84 and connection components 83. An installation groove 82 is provided on the side plate 81 for installation and positioning. The buffer component 84 includes a connection block 841. A rotating shaft rod 842 inserted through the middle of the front end of the connection block 841 can achieve a certain rotating function. A round block 845 at one end thereof is connected to a first damper 848. A first shock absorption spring 847 is sleeved on the outer surface of the first damper 848. The other end is fixedly connected to a rubber abutting block 846. When subjected to vibration, the first shock absorption spring 847 can expand and contract according to the vibration situation, absorb and buffer part of the vibration energy. At the same time, the first damper 848 slows down the transmission of vibration through the damping effect inside. And the rubber abutting block 846 can further buffer and absorb shock. These components are all located in the hollow cylindrical cavity 844 of the outer cylinder 843, and the outer cylinder 843 provides protection and support for them. The fixed block 831 in the connection component 83 is installed between two buffer components 84. When the second damper 834 in the middle of the lower end thereof and the connection spring 833 sleeved on the outer surface of the second damper 834 are subjected to vibration, the connection spring 833 will expand and contract, and the second damper 834 will generate a damping effect, cooperate with the buffer component 84 to work, and further inhibit the propagation of vibration. The beneficial effect of this shock absorption device 8 is that through a multi-layer shock absorption structure, the elastic deformation of the spring is used to absorb vibration energy, and the damping effect of the damper is used to reduce the transmission of vibration, effectively reducing the influence of external vibration on each component in the active speaker power amplifier module, avoiding problems such as damage and poor contact of electrical components such as the wiring terminal 1, chip board 2, power amplifier potentiometer 4, aluminum electrolytic capacitor 5, etc. caused by vibration, ensuring that the active speaker power amplifier module can operate stably in different usage environments, and improving the reliability and service life of the product.

[0034] In this embodiment, the installation device 6 includes a circuit board 61. Vertical rods 62 are fixedly connected to the four corners of the upper end of the circuit board 61. Upper limit rings 66 are fixedly connected to the upper parts of the outer surfaces of the four vertical rods 62. A plurality of threads 65 are engraved on the upper parts of the outer surfaces of the four vertical rods 62. Fixed nuts 63 are fixedly connected to the upper parts of the outer surfaces of the four vertical rods 62. An upper plate 64 is jointly connected to the upper parts of the outer surfaces of the four vertical rods 62. Docking holes 67 are opened at the four corners of the upper end of the upper plate 64. The circuit board 61 is fixedly connected to the lower end of the wiring terminal 1. The position dimensions of the four vertical rods 62 correspond to the position dimensions of the four docking holes 67 one by one. The upper plate 64 is located above the upper limit ring 66. The circuit board 61 is fixedly connected to the power amplifier potentiometer 4, wiring terminal 1, chip board 2 and aluminum electrolytic capacitor 5.

[0035] Through the above solution: The installation device 6 mainly consists of a circuit board 61, a vertical rod 62, a limit ring 66, a thread 65, a fixing nut 63, an upper plate 64, and a docking hole 67. The circuit board 61 serves as the basic carrier and is fixedly connected to the lower end of the wiring terminal 1, and is fixedly connected to the power amplifier potentiometer 4, the chip board 2, and the aluminum electrolytic capacitor 5 to ensure the circuit connection between the electrical components, so that the entire active speaker power amplifier module forms a complete circuit system. Through the vertical rods 62 fixedly connected to the four corners of the upper end of the circuit board 61, the upper plate 64 is installed on the vertical rods 62 by using the thread 65 on the upper part of the outer surface of the vertical rods 62 in cooperation with the fixing nut 63, and the upper plate 64 is located above the limit ring 66. The limit ring 66 plays a role in restricting the downward movement position of the upper plate 64 to ensure the stability of the installation. The docking holes 67 opened at the four corners of the upper end of the upper plate 64 have position dimensions corresponding to the four vertical rods 62 one by one, which is convenient for precise docking and installation with other components, further constructing the structural system of the entire active speaker, ensuring the firm connection between components such as the wiring terminal 1, the power amplifier potentiometer 4, the chip board 2, and the aluminum electrolytic capacitor 5, avoiding circuit failures caused by shaking, displacement, etc. At the same time, its structural design is convenient for assembly with other components, enhancing the integration and stability of the entire active speaker system, contributing to improving the overall performance and reliability of the product, and meeting the requirements in different usage scenarios.

[0036] In this embodiment, the heat dissipation device 7 includes a housing 71. A plurality of connection holes 72 are opened at the upper end of the housing 71. Installation holes 75 are opened at the four corners of the lower end of the housing 71. A mounting bolt 76 is fixedly connected in each of the four installation holes 75. A plurality of heat dissipation fins 77 are inserted and connected around the outer side of the housing 71. A plurality of copper heat conduction bent pipes 73 are inserted and connected to the upper end of the housing 71. A heat copper wire 74 is wound and connected to the upper part of the outer surface of each of the plurality of copper heat conduction bent pipes 73. A rear shell plate 78 is fixedly connected to the rear end of the housing 71. A heat dissipation fan 79 is inserted and connected to the middle of the rear end of the rear shell plate 78. The housing 71 is fixedly connected to the upper rear part of the circuit board 61 through the four mounting bolts 76. Each of the plurality of copper heat conduction bent pipes 73 has an arc-shaped structure. The plurality of copper heat conduction bent pipes 73 are fixedly installed in the housing 71. The plurality of heat dissipation fins 77 are longitudinally and equidistantly distributed, and the plurality of heat dissipation fins 77 are located outside the plurality of copper heat conduction bent pipes 73. The heat dissipation fan 79 is directly behind the plurality of heat dissipation fins 77 at the rear side.

[0037] Through the above solution: The heat dissipation device 7 mainly consists of a housing 71, a connection hole 72, a mounting hole 75, a mounting bolt 76, heat dissipation fins 77, a copper heat-conducting elbow 73, a heat-conducting copper wire 74, a rear shell plate 78, and a heat dissipation fan 79. The housing 71 is fixed to the upper rear part of the circuit board 61 through the mounting bolts 76 in the mounting holes 75 at the four corners of the lower end, providing support and fixation for the entire heat dissipation assembly. When the active speaker power amplifier module generates heat, the heat is first transferred to the housing 71 in close contact with the circuit board 61. The copper heat-conducting elbow 73, which has an arc-shaped structure and is fixedly installed in the housing 71, uses its good heat-conducting performance to quickly conduct the heat to itself. The heat-conducting copper wire 74 wound around the upper surface of the outer side of the copper heat-conducting elbow 73 further assists in heat conduction and expands the heat dissipation area. The heat dissipation fins 77 longitudinally and equidistantly distributed on the outer side of the copper heat-conducting elbow 73 greatly increase the heat dissipation area, enabling the heat to be more efficiently dissipated into the surrounding air. At the same time, the heat dissipation fan 79 located directly behind several heat dissipation fins 77 at the rear starts, blows out air strongly, accelerates air flow, and quickly takes away the heat on the surface of the heat dissipation fins 77 to achieve efficient heat dissipation. The connection hole 72 at the upper end of the housing 71 may be used for connecting with other components or for air circulation to further optimize the heat dissipation effect. This heat dissipation device 7 can quickly and effectively dissipate the heat generated by the active speaker power amplifier module, prevent the performance degradation or damage of electrical components such as the wiring terminal 1, the power amplifier potentiometer 4, the chip board 2, and the aluminum electrolytic capacitor 5 due to overheating, ensure the stable operation of the power amplifier module. The stable operating temperature helps to extend the service life of each electrical component, improve the reliability and stability of the entire active speaker, meet the long-term and high-intensity use requirements in different environments, and enhance the overall performance and user experience of the product. It should be noted that the present invention is an active speaker power amplifier module with shock absorption. The active speaker power amplifier module mainly consists of components such as a wiring terminal 1, a mounting device 6, a heat dissipation device 7, an aluminum electrolytic capacitor 5, a chip board 2, a power amplifier potentiometer 4, a volume adjustment button 3, and a shock absorption device 8. First, the wiring terminal 1 serves as the signal access port to introduce the externally input audio signal into the module. The circuit board 61 in the mounting device 6 is the basic load-bearing part of the entire module. The vertical rods 62 at the four corners of its upper end are connected to the upper plate 64 through the threads 65 on the upper surface of the outer part, fixing nuts 63, and limit rings 66. The docking holes 67 at the four corners of the upper end of the upper plate 64 are used for the cooperative installation with other components. At the same time, the circuit board 61 is fixedly connected to the power amplifier potentiometer 4, the wiring terminal 1, the chip board 2, and the aluminum electrolytic capacitor 5 to ensure the stability of each electrical component and the circuit connection. During the working process, the chip board 2 is the core processing component that processes and amplifies the input audio signal. The power amplifier potentiometer 4 can adjust the amplified audio signal, while the volume adjustment button 3 facilitates the user to control the output volume. The aluminum electrolytic capacitor 5 plays roles such as storing and releasing electrical energy and stabilizing the voltage in the circuit. To ensure the stable operation of the power amplifier module, the heat dissipation device 7 plays an important role. Its housing 71 is fixed to the upper rear part of the circuit board 61 through the mounting bolts 76 in the mounting holes 75 at the four corners of the lower end. A plurality of copper heat conduction bent pipes 73 with an arc-shaped structure are arranged inside the housing 71. The upper part of the outer surface of these copper heat conduction bent pipes 73 is wound with heat copper wires 74, which can effectively conduct the heat generated by the chip board 2 and the like. A plurality of heat dissipation fins 77 are inserted and connected around the outer side of the housing 71, and these heat dissipation fins 77 are longitudinally equidistantly distributed and are located outside the copper heat conduction bent pipes 73, which can increase the heat dissipation area. The heat dissipation fan 79 inserted and connected in the middle of the rear end of the rear shell plate 78 is located directly behind a plurality of heat dissipation fins 77 at the rear side. During operation, the heat dissipation fan 79 will start to take away the heat on the heat dissipation fins 77 through the air flow, thereby achieving heat dissipation and preventing the power amplifier module from being damaged due to overheating. At the same time, to reduce the influence of external vibration on the module, the shock absorption device 8 plays a key role. The shock absorption device 8 includes side plates 81. The mounting grooves 82 on the side plates 81 are used for the overall installation and positioning. The left end and the right end between the two side plates 81 are connected through four buffer components 84 that are symmetrically distributed in pairs in the front and rear and two connection components 83 that are symmetrically distributed in the front and rear. The working principle of the buffer component 84 is that the rotating shaft rod 842 inserted in the middle of the front end of the connecting block 841 can achieve a certain rotation. The damper one 848 fixedly connected to the round block 845 at one end of the connecting block 841, the shock absorption spring one 847 sleeved on the outer surface of the damper one 848, and the rubber abutting block 846 fixedly connected to the other end of the damper one 848 cooperate. When subjected to vibration, the shock absorption spring one 847 will stretch and deform, and at the same time, the damper one 848 will produce a damping effect on the vibration, while the rubber abutting block 846 can play a role in buffering and shock absorption, and they are all located in the cavity 844 of the outer cylinder 843.The cavity 844 has a hollow cylindrical structure to protect the internal components. The fixing block 831 in the connection assembly 83 is installed between the left and right ends of the two front buffer assemblies 84. When the shock absorber two 834 in the middle of its lower end and the connection spring 833 sleeved on the outer surface of the shock absorber two 834 are also subjected to vibrations, through the expansion and contraction of the spring and the damping effect of the shock absorber, the vibration transmission is further reduced to ensure the stable operation of each component in the power amplifier module. In summary, through the cooperation of each component, the active speaker power amplifier module processes, amplifies, and adjusts the input audio signal, effectively dissipates heat through the heat dissipation device 7, and reduces the influence of external vibrations by using the shock absorption device 8 to achieve high-quality audio output and a stable working state.

[0038] The above shows and describes the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification only illustrates the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection claimed by the present invention is defined by the appended claims and their equivalents.

Claims

1. An active speaker amplifier module with shock absorption, comprising a connection terminal (1), characterized in that: The lower end of the wiring terminal (1) is fixedly connected to a mounting device (6), the rear portion of the lower wall of the mounting device (6) is fixedly connected to a heat dissipation device (7), the left portion of the lower wall of the mounting device (6) is provided with an aluminum electrolytic capacitor (5), the middle portion of the lower wall of the mounting device (6) is provided with a chip board (2), the front portion of the lower wall of the mounting device (6) is provided with an active power potentiometer (4), the front end of the active power potentiometer (4) is provided with a volume adjustment button (3), and the upper and lower ends of the mounting device (6) are both fixedly connected to a shock absorbing device (8); The shock absorbing device (8) comprises a side plate (81), two side plates (81) are provided, and two mounting grooves (82) are provided at the left end and the right end of the two side plates (81), a buffer assembly (84) is fixedly connected between the left end and the right end of the two side plates (81), four buffer assemblies (84) are provided, and the four buffer assemblies (84) are symmetrically distributed in pairs in the front and back, and a connecting assembly (83) is connected between the left end and the right end of the four buffer assemblies (84) by a common bearing, and two connecting assemblies (83) are provided, and the two connecting assemblies (83) are symmetrically distributed in the front and back.

2. The active speaker amplifier module with shock absorption according to claim 1, characterized in that: The buffer assembly (84) includes a connecting block (841), a rotating shaft rod (842) is inserted and connected in the middle of the front end of the connecting block (841), a round block (845) is fixedly connected to one end of the connecting block (841), a damper (848) is fixedly connected to one end of the round block (845), a rubber stop block (846) is fixedly connected to the other end of the damper (848), a shock absorbing spring (847) is sleeved on the outer surface of the damper (848), an outer side of the shock absorbing spring (847) is movably connected to an outer tube (843), an inner wall of the outer tube (843) is provided with a cavity (844), and the bearing of the connecting block (841) is connected to a groove (832) on one side.

3. The active speaker amplifier module with shock absorption according to claim 1, characterized in that: The connecting assembly (83) comprises a fixing block (831), a damper 2 (834) being fixedly connected to the middle portion of the lower end of the fixing block (831), a connecting spring (833) being sleeved on the outer surface of the damper 2 (834), and the fixing block (831) being installed between the left end and the right end of the two front buffer assemblies (84).

4. The active speaker amplifier module with shock absorption according to claim 1, characterized in that: The mounting device (6) comprises a circuit board (61), the four corners of the upper end of the circuit board (61) are fixedly connected to vertical poles (62), the upper parts of the outer surfaces of the four vertical poles (62) are fixedly connected to limit rings (66), the upper parts of the outer surfaces of the four vertical poles (62) are engraved with a plurality of threads (65), the upper parts of the outer surfaces of the four vertical poles (62) are fixedly connected to fixing nuts (63), the upper parts of the outer surfaces of the four vertical poles (62) are commonly connected to an upper plate (64), the upper four corners of the upper end of the upper plate (64) are provided with docking holes (67), and the circuit board (61) is fixedly connected to the lower end of the wiring terminal (1).

5. The active speaker amplifier module with shock absorption according to claim 1, characterized in that: The heat dissipation device (7) comprises a shell (71), the upper end of the shell (71) is provided with a plurality of connection holes (72), the four corners of the lower end of the shell (71) are provided with mounting holes (75), the four mounting holes (75) are fixedly connected with mounting bolts (76), the outer periphery of the shell (71) is connected with a plurality of heat dissipation fins (77), the upper end of the shell (71) is connected with a plurality of copper heat conduction curved tubes (73), the upper parts of the outer surfaces of the plurality of copper heat conduction curved tubes (73) are connected with hot copper wires (74), the rear end of the shell (71) is fixedly connected with a rear shell plate (78), the middle part of the rear end of the rear shell plate (78) is connected with a heat dissipation fan (79), and the shell (71) is fixedly connected to the upper rear part of the circuit board (61) via four mounting bolts (76).

6. The active speaker amplifier module with shock absorption according to claim 5, characterized in that: The plurality of copper heat-conducting curved pipes (73) are all in an arc-shaped structure, and the plurality of copper heat-conducting curved pipes (73) are fixedly installed in the outer shell (71).

7. The active speaker amplifier module with shock absorption according to claim 5, characterized in that: The plurality of heat dissipation fins (77) are longitudinally equidistantly distributed, and the plurality of heat dissipation fins (77) are located outside the plurality of copper heat conduction curved tubes (73), and the heat dissipation fan (79) is located directly behind the plurality of heat dissipation fins (77) on the rear side.

8. The active speaker amplifier module with shock absorption according to claim 2, characterized in that: The front and rear ends of the connection block (841) are movably connected to the inner groove wall of the groove (832) on one side via a bearing, and the damper 1 (848), the rubber stop block (846) and the shock absorbing spring 1 (847) are all located in the cavity (844), and the cavity (844) is a hollow cylindrical structure.

9. The active speaker amplifier module with shock absorption according to claim 4, characterized in that: The positional dimensions of the four upright poles (62) correspond to the positional dimensions of the four docking holes (67) one by one, and the upper plate (64) is located above the limiting ring (66).

10. The active speaker amplifier module with shock absorption according to claim 4, characterized in that: The circuit board (61) is fixedly connected to the power and discharge potentiometer (4), the connection terminal (1), the chip board (2) and the aluminum electrolytic capacitor (5).

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