Plasma cleaning process for flexible circuit board of camera module

Abstract

The invention discloses a plasma cleaning process for a flexible circuit board of a camera module, which comprises the following steps of: setting packaging information of the flexible circuit board according to production requirements in a manufacturing execution system, and carrying out unique identity identification on a plasma cleaning tray; carrying out information binding on the set packaging information of the flexible circuit board and the plasma cleaning tray subjected to the unique identity identification, sending into a flexible circuit board plasma cleaning machine table, and carrying out flexible circuit board plasma cleaning on a product in the plasma cleaning tray; after plasma cleaning operation, a plasma cleaning tray is conveyed into a code scanning machine table for code scanning, the tray is taken out after code scanning is completed, flexible circuit board working tray information is set in a manufacturing execution system, and the plasma cleaning tray information and the flexible circuit board working tray information are bound through the manufacturing execution system. According to the invention, the error rate is effectively reduced, the tension data in the anisotropic conductive adhesive manufacturing process is obviously improved, and the reject ratio is reduced to zero.

Description

Technical Field

[0001] The present invention relates to the technical field of camera manufacturing, and specifically to a plasma cleaning process for flexible printed circuit boards of camera modules. Background Art

[0002] A flexible printed circuit board (FPC) is a highly reliable and extremely flexible printed circuit board made of polyimide or polyester film. It has the characteristics of high wiring density, light weight, thin thickness, and good bendability. During the manufacturing process of FPC, it needs to go through process flows such as chemical cleaning, pickling and etching. During this process, the surface of the FPC is easily contaminated by organic substances or chemical reagent residues. And organic contamination is difficult to inspect with the naked eye and is difficult to clean and detect whether it is cleaned thoroughly through traditional cleaning methods. Therefore, it will lead to a relatively high proportion of poor tensile data in the anisotropic conductive adhesive process, failing to achieve the ideal effect, and there is still a great room for improvement. Summary of the Invention

[0003] To solve the defects existing in the prior art, the present invention provides a plasma cleaning process for flexible printed circuit boards of camera modules.

[0004] To solve the above technical problems, the present invention provides the following technical solutions:

[0005] A plasma cleaning process for flexible printed circuit boards of camera modules according to the present invention includes the following steps:

[0006] Set the packing information of the flexible printed circuit board according to the production requirements in the manufacturing execution system, uniquely identify the plasma cleaning tray, and bind the set packing information of the flexible printed circuit board with the uniquely identified plasma cleaning tray;

[0007] Perform loading. Put the plasma cleaning tray with bound information onto the loading track of the flexible printed circuit board plasma cleaning machine. Under the feeding action of the loading track, it is sent into the flexible printed circuit board plasma cleaning machine to perform plasma cleaning on the products of the plasma cleaning tray;

[0008] After the flexible printed circuit board plasma cleaning machine completes the plasma cleaning operation on the products of the plasma cleaning tray, transfer the plasma cleaning tray into the barcode scanning machine;

[0009] The barcode scanning machine scans the plasma cleaning tray and transmits the scanned data to the manufacturing execution system; and after the scanning is completed, take out the plasma cleaning tray, set the working tray information of the flexible printed circuit board in the manufacturing execution system, and bind the plasma cleaning tray information with the flexible printed circuit board working tray information through the manufacturing execution system.

[0010] As a preferred technical solution of the present invention, a flexible circuit board packing information module, a plasma cleaning tray binding information module, a code scanning information module, and a flexible circuit board working tray binding information module are provided in the manufacturing execution system.

[0011] As a preferred technical solution of the present invention, the flexible circuit board packing information module is used for inputting and storing flexible circuit board packing information.

[0012] As a preferred technical solution of the present invention, the plasma cleaning tray binding information module is used for setting and displaying plasma cleaning tray information and plasma cleaning tray binding status.

[0013] As a preferred technical solution of the present invention, the code scanning information module is used for importing the identity information that identifies the unique identity of the plasma cleaning tray in the code scanning machine.

[0014] As a preferred technical solution of the present invention, the flexible circuit board working tray binding information module is used for setting the information of the flexible circuit board working tray and binding the plasma cleaning tray information and the flexible circuit board working tray information.

[0015] As a preferred technical solution of the present invention, when the plasma cleaning tray is not scanned in the code scanning machine, the manufacturing execution system issues an alarm signal and gives a reminder.

[0016] As a preferred technical solution of the present invention, the manufacturing execution system is provided with an abnormal alarm module. When the flexible circuit board working tray information is not bound to the plasma cleaning tray information, the manufacturing execution system issues an alarm signal and gives a reminder.

[0017] As a preferred technical solution of the present invention, when the cleaning duration of the flexible circuit board working tray exceeds the set duration, an alarm signal is issued.

[0018] As a preferred technical solution of the present invention, the method for uniquely identifying the plasma cleaning tray is to attach a bar code with unique identity mark information to the plasma cleaning tray, and the bar code attached to the plasma cleaning tray is scanned and identified for its identity in the code scanning machine.

[0019] The beneficial effects of the present invention are:

[0020] The plasma cleaning process of the flexible circuit board of this camera module sets the packaging information of the flexible circuit board according to production requirements in the manufacturing execution system, uniquely identifies the plasma cleaning tray, and binds the set packaging information of the flexible circuit board with the plasma cleaning tray after unique identification; puts the plasma cleaning tray with bound information onto the loading track of the flexible circuit board plasma cleaning machine, and under the feeding action of the loading track, sends it into the flexible circuit board plasma cleaning machine to perform plasma cleaning on the products of the plasma cleaning tray; after the flexible circuit board plasma cleaning machine completes the plasma cleaning operation on the products of the plasma cleaning tray, transfers the plasma cleaning tray into the barcode scanning machine; the barcode scanning machine scans the plasma cleaning tray and transmits the scanned data to the manufacturing execution system; and after the scanning is completed, takes out the plasma cleaning tray, sets the working tray information of the flexible circuit board in the manufacturing execution system, and binds the plasma cleaning tray information with the working tray information of the flexible circuit board through the manufacturing execution system, and binds the packaging information of the flexible circuit board with the plasma cleaning tray after unique identification, which effectively reduces the error rate, significantly improves the tensile data in the anisotropic conductive adhesive process, and reduces the defective rate to zero. Brief Description of the Drawings

[0021] The drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, and do not constitute a limitation to the present invention.

[0022] In the drawings:

[0023] Figure 1 is the working flow chart of the plasma cleaning process of the flexible circuit board of a camera module of the present invention. Detailed Embodiments

[0024] The following describes the preferred embodiments of the present invention with reference to the drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0025] Embodiment: As Figure 1 shown, the plasma cleaning process of the flexible circuit board of a camera module of the present invention includes the following steps:

[0026] Step 1. Set the packaging information of the flexible circuit board according to production requirements in the Manufacturing execution systems (MES for short), uniquely identify the plasma cleaning tray, and bind the set packaging information of the flexible circuit board with the plasma cleaning tray after unique identification.

[0027] Step 2: Load the materials. Put the plasma cleaning tray with bound information onto the loading track of the flexible circuit board plasma cleaning machine. Under the feeding action of the loading track, it is sent into the flexible circuit board plasma cleaning machine to perform flexible circuit board plasma cleaning on the products in the plasma cleaning tray.

[0028] Step 3: After the flexible circuit board plasma cleaning machine finishes the flexible circuit board plasma cleaning operation on the products in the plasma cleaning tray, transfer the plasma cleaning tray into the barcode scanning machine.

[0029] Step 4: The barcode scanning machine scans the plasma cleaning tray and transmits the scanned data to the manufacturing execution system; and after the scanning is completed, take out the plasma cleaning tray, set the flexible circuit board working tray information in the manufacturing execution system, and bind the plasma cleaning tray information and the flexible circuit board working tray information through the manufacturing execution system.

[0030] Bind the flexible circuit board packaging information with the plasma cleaning tray after unique identification, which effectively reduces the error rate. After the flexible circuit board is plasma cleaned, the tensile data in the anisotropic conductive adhesive process is significantly improved, and the defective rate is reduced to zero.

[0031] When the plasma equipment is working, gases such as oxygen, argon, nitrogen or air are ionized into plasma, and the plasma reacts chemically and physically with the material to be processed to achieve purposes such as etching, cleaning, and activation. Among them, oxygen plasma can turn non-volatile organic compounds into volatile water (H 2 O) and carbon dioxide (CO 2 ), and then use a vacuum pump to discharge the volatile substances, so as to achieve the purpose of removing contaminants on the FPC surface. Compared with the conventional pickling plus grinding plate treatment technology, plasma cleaning can improve the treatment effect on the copper surface of the circuit board, improve the product performance of the flexible circuit board, and also improve the processing efficiency of the entire process line.

[0032] Furthermore, after the flexible circuit board is plasma cleaned, it can increase the surface roughness of the flexible circuit board, and can remove the particles on the surface of the flexible circuit board, making the surface of the flexible circuit board cleaner without dust, etc. Therefore, the flexible circuit board and the substrate will be better adhered through the conductive adhesive, and the tensile data (the force for the flexible circuit board to peel off from the substrate) will be significantly improved.

[0033] The manufacturing execution system is equipped with a flexible circuit board packing information module, a plasma cleaning tray binding information module, a barcode scanning information module, and a flexible circuit board working tray binding information module. The flexible circuit board packing information module is used to input and store the flexible circuit board packing information. The plasma cleaning tray binding information module is used to set and display the plasma cleaning tray information and the plasma cleaning tray binding status. The barcode scanning information module is used to import the identity information that identifies the unique identity of the plasma cleaning tray in the barcode scanning machine. The flexible circuit board working tray binding information module is used to set the information of the flexible circuit board working tray and bind the plasma cleaning tray information with the flexible circuit board working tray information.

[0034] When the plasma cleaning tray is not scanned in the barcode scanning machine, the manufacturing execution system emits an alarm signal and gives a reminder. For example, a keyword reminder such as "The plasma cleaning tray has not been scanned" can be given. The manufacturing execution system is equipped with an abnormal alarm module. When the flexible circuit board working tray information is not bound with the plasma cleaning tray information, the manufacturing execution system emits an alarm signal and gives a reminder. For example, a keyword reminder such as "The flexible circuit board working tray information is not bound with the plasma cleaning tray information" can be given. When the cleaning duration of the flexible circuit board working tray exceeds the set duration, an alarm signal is emitted.

[0035] In addition, the method for uniquely identifying the plasma cleaning tray is to attach a barcode or QR code with unique identity marker information to the plasma cleaning tray, and the barcode or QR code attached to the plasma cleaning tray is scanned and identified for its identity in the barcode scanning machine.

[0036] During operation, Step 1: Set the packing information of the flexible circuit board in the manufacturing execution system according to production requirements, uniquely identify the plasma cleaning tray, and bind the set flexible circuit board packing information with the uniquely identified plasma cleaning tray;

[0037] Step 2: Load the materials. Put the plasma cleaning tray with bound information onto the loading track of the flexible circuit board plasma cleaning machine. Under the feeding action of the loading track, it is sent into the flexible circuit board plasma cleaning machine to perform flexible circuit board plasma cleaning on the products on the plasma cleaning tray;

[0038] Step 3: After the flexible circuit board plasma cleaning machine completes the flexible circuit board plasma cleaning operation on the products on the plasma cleaning tray, transfer the plasma cleaning tray into the barcode scanning machine;

[0039] Step 4: The barcode scanner scans the plasma cleaning tray and transmits the scanned data to the manufacturing execution system; after the scanning is completed, the plasma cleaning tray is taken out, the information of the flexible circuit board working tray is set in the manufacturing execution system, and the plasma cleaning tray information is bound to the flexible circuit board working tray information through the manufacturing execution system. The flexible circuit board packaging information is bound to the uniquely identified plasma cleaning tray, which effectively reduces the error rate. After the flexible circuit board is plasma cleaned, the tensile data is significantly improved in the anisotropic conductive adhesive process, and the defective rate is reduced to zero.

[0040] Finally, it should be noted that the above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A plasma cleaning process for a flexible circuit board of a camera module, characterized in that: The following steps are involved: In the manufacturing execution system, the packaging information of the flexible circuit board is set according to the production requirements, the plasma cleaning tray is uniquely identified, and the set flexible circuit board packaging information is bound to the plasma cleaning tray with the unique identification; Loading: Put the plasma cleaning tray with bound information into the loading track of the flexible circuit board plasma cleaning machine. Under the feeding action of the loading track, it is sent into the flexible circuit board plasma cleaning machine to perform plasma cleaning on the products on the plasma cleaning tray. After the flexible circuit board plasma cleaning machine completes the plasma cleaning operation on the products on the plasma cleaning tray, the plasma cleaning tray is transferred to the barcode scanning machine; The barcode scanner scans the plasma cleaning tray and transmits the scanned data to the manufacturing execution system; and After the code is scanned, the plasma cleaning tray is taken out, the flexible circuit board work tray information is set in the manufacturing execution system, and the plasma cleaning tray information and the flexible circuit board work tray information are bound through the manufacturing execution system.

2. The plasma cleaning process for a flexible circuit board of a camera module according to claim 1, characterized in that: The manufacturing execution system is provided with a flexible circuit board packaging information module, a plasma cleaning tray binding information module, a code scanning information module and a flexible circuit board working tray binding information module.

3. The plasma cleaning process for a flexible circuit board of a camera module according to claim 2, characterized in that: The flexible circuit board packaging information module is used to input and store flexible circuit board packaging information.

4. The plasma cleaning process for a flexible circuit board of a camera module according to claim 2, characterized in that: The plasma cleaning tray binding information module is used to set and display the plasma cleaning tray information and the plasma cleaning tray binding status.

5. The plasma cleaning process for a flexible circuit board of a camera module according to claim 2, characterized in that: The code scanning information module is used to import the identity information of the unique identity mark on the plasma cleaning tray identified in the code scanning machine.

6. The plasma cleaning process for a flexible circuit board of a camera module according to claim 2, characterized in that: The flexible circuit board work tray binding information module is used to set the information of the flexible circuit board work tray and bind the plasma cleaning tray information with the flexible circuit board work tray information.

7. The plasma cleaning process for a flexible circuit board of a camera module according to claim 1, characterized in that: When the plasma cleaning tray is not scanned in the barcode scanning machine, the manufacturing execution system sends an alarm signal and provides a reminder.

8. The plasma cleaning process for a flexible circuit board of a camera module according to claim 1, characterized in that: The manufacturing execution system is provided with an abnormal alarm module. When the flexible circuit board working tray information is not bound to the plasma cleaning tray information, the manufacturing execution system sends out an alarm signal and gives a reminder.

9. The plasma cleaning process for a flexible circuit board of a camera module according to claim 1, characterized in that: When the cleaning time of the flexible circuit board working tray exceeds the set time, an alarm signal is issued.

10. The plasma cleaning process for a flexible circuit board of a camera module according to claim 1, characterized in that: The method for uniquely identifying the plasma cleaning tray is to attach a barcode with unique identity information to the plasma cleaning tray, and scan the barcode attached to the plasma cleaning tray in a barcode scanning machine to identify the identity.

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