Control module, method and device for battery pack of electric vehicle

Abstract

The invention provides a control module, method and device for an electric vehicle battery pack, the control module comprises a circuit assembly, a first sealing packaging shell and a second heat conduction packaging shell, the circuit assembly comprises an external connection interface and a PCB unit, the external connection interface is used for control connection of the battery pack, and the PCB unit is used for function realization; the first sealing packaging shell comprises a first reserved cavity used for containing the PCB unit, a first sealant reserved groove and a second sealant reserved groove, wherein the first sealant reserved groove and the second sealant reserved groove are arranged around the first reserved cavity and used for dispensing sealing. The second heat conduction packaging shell comprises a second reserved cavity used for containing the circuit assembly. According to the technical scheme, the simple control module and method can be applied to be matched with a low-cost device, the sealant in the control module is evenly smeared, and therefore durability and reliability are improved.

Description

Technical Field

[0001] The present invention relates to the field of electromechanical technology, and particularly relates to a control module, method and device for an electric vehicle battery pack. Background Art

[0002] The control module of an electric vehicle battery pack, namely the battery management system (BMS), plays a crucial role in the development of electric vehicles. The BMS can monitor the battery state in real time and take measures to prevent overcharging, over-discharging, abnormal temperature, etc. that may cause battery damage or fire. With the progress of artificial intelligence and machine learning technologies, the BMS will become more intelligent, capable of predicting battery behavior, self-learning, and optimizing management strategies. The future design trend of the BMS is higher integration, smaller volume, while maintaining high performance and high reliability. As a key component of electric vehicles, the technological innovation and development of the BMS are crucial for promoting the progress of the entire electric vehicle industry. Therefore, improving the durability and reliability of the electric vehicle BMS has also become an important research direction for current manufacturing enterprises. Currently, the durability and reliability of the BMS are usually improved by means of sealing to extend the service life. Therefore, good control modules, methods, and sealant dotting processes have a significant impact on improving durability and reliability.

[0003] With the rapid advancement of the modern industrial intelligent manufacturing process, the dispensing process is applied more and more widely and has replaced the screw locking and welding processes in some scenarios. It has been widely used especially in industries such as 3C, automotive electronics, instrumentation, and smart wearables.

[0004] Subsequently, enterprises have higher requirements for production processes and the yield rate. Therefore, each stage of the dispensing process needs to be strictly controlled. The dispensing process is roughly divided into four stages: glue supply, metering, dispensing, and glue replacement. Any problem in any stage will affect the entire process. Especially in the glue supply stage, once a problem occurs, the dispensing effect and the yield rate will surely be affected.

[0005] During the dispensing process, key factors such as whether the glue bucket is sealed properly, the stability of the glue output, and the control of the glue remaining amount will directly affect the product quality and production efficiency. If the glue bucket is not sealed properly, it is easy to introduce air into the glue, which may lead to insufficient glue supply or no glue on the product. Unstable glue output will also cause situations of excessive or insufficient glue in local areas. Insufficient glue remaining amount will lead to unstable product performance. And improper control of the glue remaining amount will also cause the problem of no glue on the product, resulting in individual or batch defective products. After defective products appear, it is necessary to clean and refill the glue on the products. Seriously, it may even cause product scrapping.

[0006] Therefore, a technical solution is needed that can apply a simple control module and method in cooperation with a low-cost system device to evenly apply the sealant in the control module, thereby improving durability and reliability. Summary of the Invention

[0007] This application aims to provide a control module, method, and device for an electric vehicle battery pack that can apply a simple control module and method in cooperation with a low-cost device to evenly apply the sealant in the control module, thereby improving durability and reliability.

[0008] According to one aspect of the present application, there is provided a control module for an electric vehicle battery pack, including: a circuit component, a first sealed encapsulation case, and a second heat-conducting encapsulation case. The circuit component includes an external connection interface and a PCB board unit. The external connection interface is used for the control connection of the battery pack, and the PCB board unit is used for function implementation. The first sealed encapsulation case includes a first reserved cavity for accommodating the PCB board unit and a first sealant reserved groove and a second sealant reserved groove for dispensing sealant provided around the first reserved cavity. The second heat-conducting encapsulation case includes a second reserved cavity for accommodating the circuit component. Sealant is added to the first sealant reserved groove and the second sealant reserved groove to seal between the PCB board unit and the first sealed encapsulation case and between the first sealed encapsulation case and the second heat-conducting encapsulation case, ensuring the tightness of the control module structure.

[0009] According to some embodiments, the surface of the main power component of the PCB board unit is coated with heat-dissipating glue for assisting heat dissipation.

[0010] According to some embodiments, the first sealed encapsulation case and the second heat-conducting encapsulation case adopt an integral structure or a multi-part splicing structure. Among them, the splicing parts of the multi-part splicing structure are sealed with sealant.

[0011] According to some embodiments, the width-depth ratio λ of the first sealant reserved groove and the second sealant reserved groove satisfies: 0.7 < λ < 1.5.

[0012] According to another aspect of the present application, there is provided a method for a control module as described in any one of the above, including: Coating heat-dissipating glue on the surface of the PCB board unit; Pushing sealant along the first sealant reserved groove; Installing the PCB board unit of the circuit component in the first sealed encapsulation case so that it is sealed between the PCB board unit and the first sealed encapsulation case. Push sealant along the second sealant reserved groove; Install the first sealed package housing inside the second heat-conducting package housing so that the space between the first sealed package housing and the second heat-conducting package housing is sealed.

[0013] According to some embodiments, it further includes: When the first sealed package housing and the second heat-conducting package housing adopt a multi-part splicing structure, push sealant along each part of the splicing structure for sealing.

[0014] According to another aspect of the present application, there is provided a device for the method described in any one of the above. The device includes: A cartridge, having a cavity inside for accommodating a glue bucket; A cartridge seal cover, disposed at the tail end of the cartridge, fixedly connected to the cartridge through a buckle to form a cavity for accommodating the glue bucket; a glue outlet, disposed at the front end of the cartridge, communicating with the glue bucket for conveying glue outwards; A push head, movably disposed inside the cavity of the cartridge for pushing the piston of the glue bucket; A pneumatic push rod, including a push rod and a first cylinder for controlling the movement of the push rod. The push rod is connected to one side of the push head for pushing the push head to extrude glue. The first cylinder includes: a cylinder rising air inlet and a cylinder falling air inlet, which are respectively disposed at both ends of the cylinder for driving the push rod to rise or fall; A sealing head, disposed inside the cartridge, between the push head and the cartridge seal cover, for sealing the cartridge and fixing the pneumatic push rod; A magnetic sensor, disposed in the movement stroke of the push rod for detecting the displacement of the pneumatic push rod. Among them, a magnetic ring for controlling the magnetic sensor is disposed at the tail of the push rod of the pneumatic push rod so that the magnetic sensor senses the end position of the pneumatic push rod.

[0015] According to some embodiments, the device further includes: a second cylinder. Among them, the cartridge includes: a glue supply air inlet joint, and the second cylinder adjusts the air pressure inside the cartridge through the glue supply air inlet joint to assist in pushing the piston of the glue bucket by air pressure.

[0016] According to some embodiments, the glue supply air inlet joint, the cylinder rising air inlet, and the cylinder falling air inlet are independently controlled or jointly controlled.

[0017] According to some embodiments, the device further includes: a controller, and the controller calculates the remaining glue amount according to the displacement of the pneumatic push rod sensed by the magnetic sensor, The controller is configured to: Send the remaining glue amount information to the dispensing controller, so that the dispensing controller determines whether to replace the glue bucket according to the remaining glue amount information and the next dispensing path information; and / or obtain the next dispensing path information in the dispensing controller, and determine whether to replace the glue bucket according to the relationship between the glue amount required by the next dispensing path information and the remaining glue amount; and / or determine whether to replace the glue bucket according to the remaining glue amount.

[0018] According to an embodiment of the present application, the design solution of the present invention adopts a double-layer control module. By applying the first sealed packaging shell, the PCB board unit of the control module is sealed in the first reserved cavity to prevent external interference and improve the operating stability of the control module; by adding the second heat-conducting packaging shell, the overall heat dissipation performance of the control module is improved. Cooperating with the application of heat dissipation glue on the PCB board further improves the heat dissipation performance, so that the control module can maintain a constant temperature and operate stably.

[0019] According to some embodiments, by applying the first cylinder, the control of the glue supply propulsion amount is more precise and accurate, and the glue output is more stable and smooth. Cooperating with the second cylinder, the system realizes the stable extrusion of glue, so that the system can be applied to scenarios with high-viscosity glue or scenarios that require more precise control of the dispensing amount. By flexibly applying the magnetic sensor to sense and detect the pusher and feedback it to the controller, the detection of the remaining glue amount is more accurate, the timing of replacing the glue bucket is accurately grasped, the accuracy of the glue supply control is further improved, and the yield rate is guaranteed.

[0020] According to some embodiments, under the precise control of the controller, a glue remaining amount detection system design with simple equipment, low cost and high accuracy is truly realized. Through the system device of the present invention, the remaining glue amount can be accurately detected, and a comprehensive determination can be made on whether to replace the glue. It is simple, convenient and low-cost, and can be widely applied to various application scenarios.

[0021] It should be understood that the above general description and the following detailed description are only exemplary and do not limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for the description of the embodiments will be briefly introduced below.

[0023] Figure 1A FIG. shows a schematic diagram of a control module of an electric vehicle battery pack according to an exemplary embodiment.

[0024] Figure 1B FIG. shows a schematic diagram of a control module of an electric vehicle battery pack according to an exemplary embodiment.

[0025] Figure 2A method flow chart of a control module for an electric vehicle battery pack according to an exemplary embodiment is shown.

[0026] Figure 3 A schematic cross-sectional view of an apparatus for a method of a control module for an electric vehicle battery pack according to an exemplary embodiment is shown.

[0027] Figure 4 A schematic external view of an apparatus for a method of a control module for an electric vehicle battery pack according to an exemplary embodiment is shown.

[0028] Figure 5 A schematic diagram of the basic working process of an apparatus for a method of a control module for an electric vehicle battery pack according to an exemplary embodiment is shown. Detailed implementation manners

[0029] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in various forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. Like reference numerals in the figures denote like or similar parts, and thus their repetitive description will be omitted.

[0030] In addition, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of this application. However, those skilled in the art will realize that the technical solutions of this application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. may be adopted. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of this application.

[0031] The flow charts shown in the accompanying drawings are only illustrative and not necessarily include all the contents and operations / steps, nor are they necessarily executed in the order described. For example, some operations / steps can be decomposed, while some operations / steps can be combined or partially combined, so the actual execution order may be changed according to the actual situation.

[0032] It should be understood that although terms such as first, second, and third may be used herein to describe various components, these components should not be limited by these terms. These terms are used to distinguish one component from another. Thus, the first component discussed below may be referred to as the second component without departing from the teachings of the concept of this application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0033] Those skilled in the art can understand that the drawings are only schematic diagrams of exemplary embodiments, and the modules or processes in the drawings are not necessarily essential for implementing the present application. Therefore, they cannot be used to limit the protection scope of the present application.

[0034] With the increasing demand for precision in fields such as electronics, medical, semiconductor, and automotive, the market has higher and higher requirements for the accuracy of dispensing machines. Among them, the output control of the glue and the control of the glue residue directly affect the quality of the product, and both will lead to unstable product performance and the generation of defective products. Therefore, it is necessary to monitor the real-time status of the glue supply step to avoid product defects caused by glue supply problems.

[0035] Currently, methods for detecting glue residue in industrial production include visual inspection method, weighing detection method, ultrasonic detection method, laser detection method, etc. Among them, the visual inspection method captures the glue flow situation through a camera or other image sensors, and judges the glue residue by processing and analyzing the image. It is suitable for transparent or light-colored glue, and the glue surface needs to be relatively flat. It has strong real-time performance and is easy to realize automation. However, it has certain requirements for the glue color and surface shape, and is easily affected by the light environment. The weighing detection method monitors the weight change of the glue in real time through a weighing device, and then calculates the glue residue. It is suitable for scenarios where the glue quality is relatively stable, and the detection accuracy is relatively high. The disadvantage is that the equipment cost is relatively high, and the requirements for the production environment are relatively high. The ultrasonic detection method uses the speed and reflection characteristics of ultrasonic waves propagating in the glue, and judges the glue residue by calculating the echo time and amplitude. It is suitable for various colors of glue, but has certain requirements for the glue surface shape. Although the applicable range is relatively wide and it is not affected by the glue color, in the ultrasonic detection method, the glue surface shape affects the detection result, and it is easily interfered by noise. The laser detection method irradiates a laser beam on the glue, measures the length and speed of the laser beam passing through the glue, and then calculates the glue residue. It is suitable for detecting a relatively wide range of glue residues, has a wide detection range, and is suitable for large-scale production. However, the equipment cost is also relatively high, and there are certain requirements for the glue surface.

[0036] For this reason, the present application proposes a control module, method, and device for an electric vehicle battery pack, which can apply a simple control module and method in cooperation with a low-cost device to evenly apply the sealant in the control module, thereby improving durability and reliability. According to the embodiment, the design scheme of the present invention adopts a double-layer control module. By applying the first sealing package shell, the PCB board unit of the control module is sealed in the first reserved cavity to prevent external interference and improve the operation stability of the control module; by adding the second heat-conducting package shell, the overall heat dissipation performance of the control module is improved. Cooperating with the application of heat-dissipating glue on the PCB board further improves the heat dissipation performance, so that the control module can maintain a constant temperature and operate stably.

[0037] According to some embodiments, by applying the first cylinder, the control of the glue supply propulsion amount is made more precise and accurate, and the glue output is more stable and smooth. In cooperation with the second cylinder, the auxiliary system realizes the stable extrusion of glue, enabling the system to be applicable to scenarios of high-viscosity glue or requiring more precise control of the dispensing amount. By flexibly applying the magnetic sensor to detect and feedback the pusher to the controller, the detection of the remaining glue amount is more accurate, accurately grasping the timing of glue bucket replacement, further improving the accuracy of glue supply control, and ensuring the yield rate.

[0038] According to some embodiments, under the precise control of the controller, a glue remaining amount detection system design with simple equipment, low cost, and high precision is truly realized.

[0039] The exemplary embodiments of the present application will be described below with reference to the accompanying drawings.

[0040] Figure 1A A schematic diagram of a control module for an electric vehicle battery pack according to an exemplary embodiment is shown.

[0041] Figure 1B A schematic diagram of a control module for an electric vehicle battery pack according to an exemplary embodiment is shown.

[0042] See Figure 1A And FIGS. 1A and 1B show a control module for an electric vehicle battery pack, including: a circuit component E01, a first hermetic package E02, and a second heat-conducting package E03. The circuit component E01 includes an external connection interface E0102 and a PCB board unit E0101. The external connection interface E0102 is used for the control connection of the battery pack, and the PCB board unit E0101 is used for function implementation. The first hermetic package E02 includes a first reserved cavity E0201 for accommodating a part of the PCB board unit E0101, and a first sealant reserved groove E0202 and a second sealant reserved groove E0203 for dispensing sealant disposed around the first reserved cavity E0201. The second heat-conducting package E03 includes a second reserved cavity E0301 for accommodating the circuit component E01. Sealant is added to the first sealant reserved groove E0202 and the second sealant reserved groove E0203, so that the PCB board unit E0101 is sealed with the first hermetic package E02, and the first hermetic package E02 is sealed with the second heat-conducting package E03, ensuring the tightness of the control module structure.

[0043] According to some embodiments, a heat-dissipating glue is coated on the surface of the main power components of the PCB board unit for auxiliary heat dissipation. To further improve the heat dissipation performance of the control module, heat-dissipating glue can also be coated on the surface of the PCB board unit E0101 to assist in heat dissipation, enabling the control module to operate stably at a constant temperature.

[0044] According to some embodiments, the design solution of the present invention adopts a double - layer control module. By applying the first sealed encapsulation shell E02, the PCB board unit E0101 part of the control module is sealed in the first reserved cavity E0201 to prevent external interference and improve the operating stability of the control module. By adding the second heat - conducting encapsulation shell E03, the overall heat - dissipation performance of the control module is improved. Cooperating with coating heat - dissipation glue on the PCB board, the heat - dissipation performance is further improved, enabling the control module to maintain a constant temperature and operate stably.

[0045] According to some embodiments, according to the actual design and encapsulation requirements, the first sealed encapsulation shell E02 and the second heat - conducting encapsulation shell E03 can adopt an integral structure or a multi - part splicing structure to facilitate the encapsulation or installation operation. Among them, at the splicing structure of each part in the multi - part splicing structure, sealant is used for sealing, and sealant is continuously spot - coated at the component connection points to ensure reliable sealing between components.

[0046] According to some embodiments, the width - to - depth ratio λ of the first sealant reserved groove and the second sealant reserved groove satisfies: 0.7 < λ < 1.5. When designing the control module, the geometric parameters (such as width, depth, and their ratio) of the sealant reserved groove have an important impact on the sealing effect. If the width - to - depth ratio is too small (i.e., the groove width is too narrow or the groove depth is too deep), it will lead to insufficient filling of the sealant. Too narrow a groove width may cause gas to be unable to be discharged smoothly when injecting the sealant, forming bubbles, reducing the sealing effect, and resulting in insufficient sealing performance. If the width - to - depth ratio is too large (i.e., the groove width is too wide or the groove depth is too shallow), it will lead to excessive consumption of the sealant. Too wide a groove body will consume more sealant, increasing the material cost. Too shallow a groove body may result in an insufficient thickness of the sealant layer, unable to withstand large pressures or vibrations, thus affecting the sealing reliability. Therefore, an appropriate width - to - depth ratio can ensure the smooth filling of the sealant and achieve a good sealing effect. According to a large number of embodiments, preferably, the range of the width - to - depth ratio λ of the first sealant reserved groove and the second sealant reserved groove is controlled to be 0.7 < λ < 1.5 to ensure the stability of the sealing performance.

[0047] According to some embodiments, the width - to - depth ratio of the first sealant reserved groove and the second sealant reserved groove can be adjusted within the design range according to the actual application scenario. For example, the control module of an electric - vehicle battery pack usually works in harsh environments such as high temperature, high humidity, and vibration. Therefore, optionally, in a high - temperature environment, a slightly larger λ (such as close to 1.5) can be selected to reduce the thermal expansion stress. In a high - vibration environment, a slightly smaller λ (such as close to 0.7) may be selected to increase the filling density of the sealant, so that the control module can meet the usage requirements of the control module of the electric - vehicle battery pack under complex working conditions.

[0048] Figure 2 The flowchart of the method for the control module of an electric vehicle battery pack according to an exemplary embodiment is shown.

[0049] See Figure 2 , a method for the control module as described in any of the above is shown in the figure, including: In S201, apply heat-dissipating glue on the surface of the PCB board unit; In S203, push the sealant along the first sealant reserved groove; In S205, install the PCB board unit of the circuit component in the first sealed package housing, so that the PCB board unit is sealed with the first sealed package housing; In S207, push the sealant along the second sealant reserved groove; In S209, install the first sealed package housing in the second heat-conducting package housing, so that the first sealed package housing is sealed with the second heat-conducting package housing.

[0050] According to some embodiments, according to the actual design and packaging requirements, when the first sealed package housing and the second heat-conducting package housing adopt an integral structure or a multi-part splicing structure, it is necessary to push the sealant along each part of the splicing structure for sealing, so that reliable sealing is achieved between the components.

[0051] Figure 3 The schematic cross-sectional view of the device for the method of the pneumatic glue supply system for the control module of an electric vehicle battery pack according to an exemplary embodiment is shown.

[0052] Figure 4 The schematic external view of the device for the method of the pneumatic glue supply system for the control module of an electric vehicle battery pack according to an exemplary embodiment is shown.

[0053] See Figure 3 and Figure 4 , a device for the method as described in any of the above is shown in the figure, and the device includes: cartridge 01, cartridge seal cover 03, glue outlet 05, push head 07, pneumatic push rod 09, magnetic sensor 11.

[0054] As Figure 2 shown, the cartridge 01 has a cavity inside for accommodating the glue bucket. The cartridge seal cover 03 is arranged at the tail end of the cartridge 01 and is fixedly connected to the cartridge 01 through a buckle to form a cavity for accommodating the glue bucket. The glue outlet 05 is arranged at the front end of the cartridge 01 and is communicated with the glue bucket for delivering glue outward.

[0055] According to some embodiments, a cavity is designed inside the cartridge 01 for accommodating and fixing the glue bucket, providing a stable container for the entire glue supply process. The cartridge sealing cap 03 is installed at the tail end of the cartridge 01 and is connected to the cartridge 01 through a buckle to ensure that a closed space is formed inside the cartridge 01 to accommodate the glue bucket and prevent external contaminants from entering. The glue outlet 05 is arranged at the front end of the cartridge 01 to export the glue from the glue bucket and transport it to the required place, which is the output point of the entire glue supply system.

[0056] According to some embodiments, the pusher head 07 is movably arranged inside the cavity of the cartridge 01 for pushing the piston of the glue bucket. The pusher head 07 is located inside the cavity of the cartridge 01 and can move back and forth therein. After the glue bucket is installed, it contacts the glue piston, making the glue piston always closely fit the glue surface. The glue is extruded from the glue bucket by the way that the pusher head 07 contacts and pushes the piston inside the glue bucket.

[0057] According to some embodiments, the pneumatic push rod 09 includes a push rod 0901 and a first cylinder 0902 for controlling the movement of the push rod 0901. The push rod 0901 is connected to one side of the pusher head 07 for pushing the pusher head 07 to extrude the glue. The pneumatic push rod 09 includes two parts, the push rod 0901 and the first cylinder 0902. The first cylinder 0902 is used to control the movement of the push rod 0901. The first cylinder 0902 drives the push rod 0901 to perform linear motion by receiving compressed air. The push rod 0901 can be pushed inwards or outwards under the drive of the first cylinder 0902. Among them, one end of the push rod 0901 is connected to the pusher head 07. During the inward pushing process of the push rod 0901, the pusher head 07 is pushed, so that the pusher head 07 squeezes the piston of the glue bucket, and thus the glue in the glue bucket is extruded from the glue outlet 05 at the front end of the cartridge 01. This design ensures that the glue can be pushed out smoothly and evenly.

[0058] According to some embodiments, when the first cylinder 0902 receives compressed air, it will drive the push rod 0901 to move forward or backward. Specifically, the first cylinder 0902 can control the direction of the push rod 0901 through different air inlets (such as the rising air inlet and the falling air inlet). As the push rod 0901 moves forward or backward, the push rod 0901 will drive the pusher head 07 to move inside the cartridge 01. When the push rod 0901 is pushed forward, the pusher head 07 will push the piston inside the glue bucket, thus extruding the glue; on the contrary, when the push rod 0901 moves backward, it can prepare for the next push. The pneumatic push rod 09 system drives the push rod 0901 through the first cylinder 0902, and then drives the pusher head 07 to squeeze the piston inside the glue bucket to realize the automatic supply of glue, which not only ensures the stability and accuracy of the glue supply process, but also improves the work efficiency.

[0059] According to some embodiments, a magnetic sensor is disposed in the movement stroke of the push rod 0901 for detecting the displacement of the pneumatic push rod 09. A magnetic ring for controlling the magnetic sensor 11 is disposed at the tail of the push rod 0901 of the pneumatic push rod 09, so that the magnetic sensor 11 senses the end position of the pneumatic push rod 09. The magnetic sensor measures the position or displacement of an object based on magnetic field changes. A magnetic ring or other type of magnetic marker is installed at the tail end of the push rod 0901, and the magnetic sensor 11 is disposed at a fixed position in the movement stroke of the push rod 0901, and the push rod 0901 moves within its stroke range. When the pneumatic push rod 09 moves back and forth due to the action of compressed air, the magnetic ring connected to the tail of the push rod 0901 also moves accordingly. The magnetic sensor can sense the position change of this magnetic ring, thereby accurately measuring the displacement of the push rod 0901. The magnetic sensor 11 converts the detected position information into an electrical signal and transmits it to the controller for interpretation to obtain a specific displacement value. By monitoring the displacement of the push rod 0901, not only can the extrusion amount of the glue be accurately controlled, but also the remaining glue amount can be calculated according to the displacement of the push rod 0901, and when to replace the glue bucket can be predicted.

[0060] According to some embodiments, the magnetic sensor 11 can provide very high position measurement accuracy, ensuring the accuracy of glue supply. Since the magnetic sensor 11 adopts a non-contact measurement method, the magnetic sensor 11 has a long service life and can work stably in a relatively harsh environment. Moreover, modern magnetic sensors are designed compactly, with small volume and high precision, and are more easily integrated into existing automation systems. By applying the magnetic sensor 11, the device can achieve efficient and precise glue supply, improving the overall automation level and intelligent monitoring ability of the equipment.

[0061] According to some embodiments, refer to Figure 1A and 1B, the device further includes: a sealing head 13, disposed inside the cartridge 01, between the push head 07 and the cartridge sealing cover 03, for sealing the cartridge 01 and fixing the push rod 0901. The sealing head 13 is disposed inside the cartridge 01, between the push head 07 and the cartridge sealing cover 03. After the glue bucket is installed, the sealing head 13 contacts and seals the tail of the glue bucket to ensure the tightness of the glue bucket, prevent glue leakage, block external contaminants from entering the inside of the cartridge 01, thereby maintaining the cleanliness of the glue bucket and the system, and avoiding blockage or quality problems caused by contamination. The sealing head 13 can also play a role in fixing the push rod 0901, which can ensure that the push rod 0901 remains correctly centered and stable during movement, reducing unnecessary swing or deviation. By firmly fixing the push rod 0901, the sealing head 13 helps to achieve precise control of the glue supply amount, ensure that the amount of glue extruded each time is consistent, and improve the reliability and repeatability of the glue supply process.

[0062] According to some embodiments, the first cylinder 0902 includes: a cylinder rising air inlet 09021 and a cylinder falling air inlet 09022, which are respectively disposed at both ends of the cylinder for driving the push rod 0901 to rise or fall. Among them, the cylinder rising air inlet 09021 is disposed at the end of the cylinder for receiving compressed air to drive the push rod 0901 to advance forward (i.e., into the inside of the cartridge 01). When the compressed air enters the cylinder through the cylinder rising air inlet 09021, the piston in the cylinder will move forward, driving the push rod 0901 to advance, thereby pushing the piston in the glue bucket to extrude the glue. The cylinder falling air inlet 09022 is disposed at the other end of the cylinder for receiving compressed air to drive the push rod 0901 to retract backward. When the compressed air enters the cylinder through the cylinder falling air inlet 09022, the piston in the cylinder will move backward, driving the push rod 0901 to retract, preparing for the next push.

[0063] According to some embodiments, during the glue supply process, when it is necessary to extrude the glue, compressed air enters the first cylinder 0902 through the cylinder rising air inlet 09021, causing the piston in the first cylinder 0902 to move forward, and then driving the push rod 0901 connected to the piston to advance, squeezing the piston in the glue bucket, so that the glue is extruded from the glue outlet 05. When it is necessary for the push rod 0901 to retract, compressed air enters the first cylinder 0902 through the cylinder falling air inlet 09022, causing the piston in the first cylinder 0902 to move backward, driving the push rod 0901 to retract and return to the preparation position, preparing for the next push. During this process, the magnetic sensor monitors the displacement of the push rod 0901 in real time and transmits the data to the controller.

[0064] According to some embodiments, through the design of the cylinder rising air inlet 09021 and the cylinder descending air inlet 09022 of the first cylinder 0902, the device achieves precise control of the push rod 0901, thus ensuring the stability and precision of the glue supply process. Further combined with the intelligent management and optimization of the controller, the automation level and intelligence degree of the system are improved, enabling the device to perform excellently in various complex application scenarios.

[0065] According to some embodiments, the system further includes a second cylinder. Wherein, the cartridge 01 includes: a glue supply air inlet joint 15, and the second cylinder adjusts the internal air pressure of the cartridge 01 through the glue supply air inlet joint 15 to assist in pushing the piston of the glue bucket by air pressure. The second cylinder is used to adjust the internal air pressure of the cartridge 01 to provide additional driving force to further assist the system in achieving stable extrusion of the glue, enabling the system to be applicable to scenarios with high-viscosity glue or requiring more precise control of the dispensed glue volume.

[0066] According to some embodiments, the glue supply air inlet joint 15 is arranged between the second cylinder and the cartridge 01. Through the glue supply air inlet joint 15, the second cylinder conveys compressed air into the interior of the cartridge 01, changing its internal air pressure, making the glue piston move more smoothly under the push of the push head 07 and the push rod. Specifically, when it is necessary to assist the push head 07 in pushing the piston in the glue bucket, according to the control logic of the system or by manual operation, the second cylinder is started. The second cylinder inputs compressed air into the interior of the cartridge 01 through the glue supply air inlet joint 15, increasing the internal air pressure of the cartridge 01. As the internal air pressure of the cartridge 01 rises, an additional pressure is exerted on the glue in the glue bucket, helping the push head 07 to more easily squeeze the glue bucket piston, so that the glue flows smoothly out of the glue outlet 05.

[0067] According to some embodiments, by introducing the second cylinder and adjusting the internal air pressure of the cartridge 01 through the glue supply air inlet joint 15, not only the adaptability of the system to glues with different viscosities is enhanced, meeting the requirements of application scenarios that require high-precision and high-reliability dispensing operations, such as the fields of electronic manufacturing and medical device assembly. At the same time, the efficiency and stability of the glue supply process are improved.

[0068] According to some embodiments, the glue supply air inlet joint 15, the cylinder rising air inlet 09021, and the cylinder descending air inlet 09022 are independently controlled or linked for control. Under different application scenarios, the glue supply air inlet joint 15, the cylinder rising air inlet 09021, and the cylinder descending air inlet 09022 can be independently or linked for control. Independent control allows for refined management of each air circuit, enabling fine adjustment of air pressure according to the actual working conditions (such as changes in glue viscosity and glue supply rate requirements), thereby achieving precise control over the movement speed, acceleration, and stop position of the push rod 0901, improving the accuracy and efficiency of the glue supply operation, and reducing the risk of system failures. Linkage control can also be adopted to coordinately operate multiple air inlets simultaneously according to preset programs or conditions to achieve specific functions or effects, improving the automation level and efficiency of the system.

[0069] According to some embodiments, under different application scenarios, the control strategy can be adjusted according to the actual control accuracy. Considering the cost and quality requirements, and based on the specific working accuracy requirements and glue types, a specific control strategy can be selected to independently control the glue supply air inlet joint 15 or the first cylinder 0902 for glue flow rate adjustment, or a combined complementary method of linkage control of both can be used for specific glue flow rate adjustment.

[0070] According to some embodiments, the device further includes: a controller, which calculates the remaining glue amount based on the displacement of the pneumatic push rod 09 by the magnetic sensor 11. Specifically, the magnetic sensor 11 precisely measures the moving distance of the push rod 0901 by sensing the position change of the magnetic ring connected to the tail of the push rod 0901, and converts this data into an electrical signal and transmits it to the controller. When starting to use a new glue bucket, the initial position of the push rod 0901 and the total capacity of the glue bucket are recorded. As the push rod 0901 advances, the magnetic sensor continuously monitors the displacement of the push rod 0901 and transmits the data to the controller. Based on the current position of the push rod 0901 and the known initial conditions, the controller uses a preset algorithm or mathematical model to calculate the approximate volume or weight of the remaining glue in the glue bucket. As the glue is continuously extruded, the push head 07 will gradually penetrate deeper into the glue bucket. The controller monitors in real time the remaining glue amount corresponding to each certain distance of movement of the push rod 0901, and based on the calculated remaining glue amount, the controller makes a logical judgment to decide whether to start the program for replacing the glue bucket.

[0071] According to some embodiments, a preset program configures a controller to determine whether to prompt for a glue bucket replacement based on the currently remaining amount of glue. The controller can not only accurately calculate the remaining glue amount, but also make intelligent decisions by combining other system data to ensure the efficient operation of the glue supply system. In addition to real-time control, the controller may also record historical data of glue usage for subsequent analysis, optimizing the glue supply strategy or maintenance plan, as well as serving as a basis for quality control and cost accounting during the production process. The controller not only realizes the active management and automatic control of the operation of the glue supply system, but also improves production efficiency and resource utilization rate, reduces the need for human intervention, and ensures the continuity and stability of the production process.

[0072] Figure 5 The schematic diagram of the basic working process of the device showing the method of the control module of the pneumatic glue supply system for an electric vehicle battery pack according to an exemplary embodiment.

[0073] See Figure 5 , according to the basic working process of the device of the method of the control module for an electric vehicle battery pack according to an exemplary embodiment. First, disassemble the snap connection between the cartridge 01 and the cartridge seal cover 03, put the glue bucket into the end of the cartridge 01, install the cartridge seal cover 03, and fasten the snap. Then, input the glue supply pressure, and control the glue supply speed by driving the push rod 0901 through the first cylinder 0902 and / or by filling the cartridge 01 with compressed air through the second cylinder, so that the glue flows out at a stable speed, and the position of the push rod 0901 is monitored in real time by the magnetic sensor, and the controller determines whether to perform a glue replacement operation.

[0074] According to some embodiments, when the magnetic sensor 11 senses that the cylinder push rod 09 has descended to the corresponding position of the alarm threshold preset by the controller, the controller issues a prompt for replacing the glue bucket. Before replacing the glue bucket, control the first cylinder 0902 to rise and / or control the second cylinder to stop supplying air into the cartridge 01. Before replacing the glue bucket, stop the current glue supply operation and no longer output glue to the production line or the application point to prepare for entering the glue bucket replacement process. Specifically, the push rod 0901 in the first cylinder 0902 can be retracted upward by controlling the first cylinder 0902 to rise and / or controlling the second cylinder to stop supplying air into the cartridge 01. After the push head 07 retracts to the initial position and it is confirmed that there is no residual pressure inside the cartridge 01, the operator can perform the glue bucket replacement operation.

[0075] According to some embodiments, the controller is configured to: send the remaining glue amount information to the dispensing controller, so that the dispensing controller determines whether to replace the glue bucket according to the remaining glue amount information and the next dispensing path information; and / or obtain the next dispensing path information in the dispensing controller, and determine whether to replace the glue bucket according to the relationship between the glue amount required by the next dispensing path information and the remaining glue amount. The controller exchanges data with the dispensing controller to decide whether to replace the glue bucket. Specifically, the controller sends the remaining glue amount information to the dispensing controller. After receiving the remaining glue amount information, the dispensing controller combines the next dispensing path information (i.e., the glue amount required for the upcoming dispensing task) to make a decision on whether to replace the glue bucket; the controller can also actively obtain the next dispensing path information from the dispensing controller to understand the next task requirements. Based on the relationship between the glue amount required by the next dispensing path information and the current remaining glue amount, the controller can determine by itself whether to replace the glue bucket.

[0076] According to some embodiments, the controller is further configured to: determine whether to replace the glue bucket according to the remaining glue amount. Specifically, one or more thresholds are set inside the controller. When the remaining glue amount is lower than a certain threshold, a prompt or instruction to replace the glue bucket is triggered. The controller continuously monitors the remaining glue amount and issues an alarm or instruction when necessary to remind the operator to prepare to replace the glue bucket.

[0077] Through the above mechanism, by closely collaborating with the dispensing controller, the controller can not only accurately calculate the remaining glue amount, but also make intelligent judgments based on the remaining glue amount and the next dispensing path information, ensuring the efficient operation of the glue supply system, and is widely applicable to various complex industrial application scenarios, such as electronic manufacturing, medical device assembly, etc. While improving production efficiency, the consistency and accuracy of each dispensing operation are guaranteed.

[0078] According to some embodiments, the design solution of the present invention can also be applied to the design of a dispensing system. The dispensing system includes the glue supply system as described in any one of the above, so that the control system can more accurately monitor the remaining glue amount, and the overall glue dispensing of the dispensing system is more stable and smooth.

[0079] According to some embodiments, the design solution of the present invention adopts a double-layer control module and applies the first sealed packaging shell E02 to seal a part of the PCB board unit E0101 of the control module in the first reserved cavity E0201 to prevent external interference and improve the operation stability of the control module. By adding the second heat-conducting packaging shell E03, the overall heat dissipation performance of the control module is improved. In cooperation with coating heat-dissipating glue on the PCB board, the heat dissipation performance is further improved, so that the control module can maintain a constant temperature and operate stably. In cooperation with corresponding sealing methods, the control module becomes more stable and effective. Applying the device enables the sealing glue to accurately coat the sealing glue and / or heat-dissipating glue stably and controllably, ensuring the reliability, sealing property of the control module and the effectiveness of the sealing method, and improving the overall stability and reliability.

[0080] According to some embodiments, the design solution of the present invention makes the control of the glue supply propulsion amount more precise and accurate and the glue output more stable and smooth by applying the first cylinder 0902. In cooperation with the second cylinder, the system realizes the stable extrusion of glue, so that the system can be applied to scenarios of high-viscosity glue or scenarios where more precise control of the dispensing amount is required. By flexibly applying the magnetic sensor 11 to detect and sense the push head 07 and feed back to the controller, the detection of the glue remaining amount is more accurate, the timing of replacing the glue bucket is accurately grasped, the precision of the glue supply control is further improved, and the yield rate is ensured. Under the precise control of the controller, a glue remaining amount detection system design with simple equipment, low cost and high precision is truly realized.

[0081] Those skilled in the art can clearly understand that the technical solutions of the present application can be implemented by means of software and / or hardware. The "units" and "modules" in this specification refer to software and / or hardware that can independently complete or cooperate with other components to complete specific functions, and the hardware can be, for example, a field programmable gate array, an integrated circuit, etc.

[0082] It should be noted that for the foregoing method embodiments, for the sake of simple description, they are all expressed as a series of action combinations. However, those skilled in the art should know that the present application is not limited by the described action sequence, because according to the present application, certain steps can be performed in other sequences or simultaneously. Secondly, those skilled in the art should also know that the embodiments described in the specification are all preferred embodiments, and the actions and modules involved are not necessarily essential to the present application.

[0083] In the above embodiments, the descriptions of the various embodiments have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0084] In several embodiments provided in the present application, it should be understood that the disclosed device can be implemented in other ways. For example, the device embodiments described above are merely illustrative. For example, the division of units is only a logical function division. In actual implementation, there may be other division methods. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the displayed or discussed coupling or direct coupling or communication connection between each other can be through some service interfaces. The indirect coupling or communication connection of the device or unit can be in electrical or other forms.

[0085] The units described as separate components may or may not be physically separated. The components displayed as units may or may not be physical units, that is, they may be located in one place, or may be distributed to multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0086] In addition, each functional unit in various embodiments of the present application can be integrated in a processing unit, or each unit can exist physically alone, or two or more units can be integrated in one unit. The above-mentioned integrated unit can be implemented in the form of hardware or in the form of a software functional unit.

[0087] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable memory. Based on this understanding, the technical solution of the present application, in essence, or the part that contributes to the prior art, or all or part of this technical solution, can be embodied in the form of a software product. This computer software product is stored in a memory and includes several instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the steps of the methods in various embodiments of the present application.

[0088] In the above embodiments, the descriptions of each embodiment have their own emphases. For the parts not detailed in a certain embodiment, reference can be made to the relevant descriptions of other embodiments.

[0089] The above specifically shows and describes the exemplary embodiments of the present application. It should be understood that the present application is not limited to the detailed structure, setting method, or implementation method described here; on the contrary, the present application is intended to cover various modifications and equivalent settings included within the spirit and scope of the appended claims.

Claims

1. A control module for an electric vehicle battery pack, characterized in that: include: a circuit assembly, a first sealed package shell, and a second thermally conductive package shell, The circuit assembly includes an external connection interface and a PCB board unit, wherein the external connection interface is used for control connection of the battery pack, and the PCB board unit is used for function realization; The first sealed packaging shell comprises a first reserved cavity for accommodating the PCB board unit and a first sealant reserved groove and a second sealant reserved groove for glue dispensing and sealing arranged around the first reserved cavity; The second heat-conductive packaging shell includes a second reserved cavity for accommodating the circuit component. Sealant is added to the first sealant reserved groove and the second sealant reserved groove, so that the PCB board unit and the first sealed packaging shell and the first sealed packaging shell and the second heat-conducting packaging shell are sealed to ensure the sealing of the control module structure.

2. The control module according to claim 1, characterized in that: The surface of the main power element of the PCB board unit is coated with heat dissipation glue to assist in heat dissipation.

3. The control module according to claim 1, characterized in that: The first sealed packaging shell and the second heat-conducting packaging shell adopt an integral structure or a multi-part splicing structure, wherein each splicing structure of the multi-part splicing structure is sealed with a sealant.

4. The control module according to claim 1, characterized in that: The width-to-depth ratio λ of the first sealant reserved groove and the second sealant reserved groove satisfies: 0.7<λ<1.

5.

5. A method for a control module according to any one of claims 1 to 4, characterized in that: include: Apply heat dissipation glue on the surface of the PCB board unit; Pushing the sealant along the first sealant reserved groove; Installing the PCB board unit of the circuit assembly in the first sealed packaging shell so that the PCB board unit and the first sealed packaging shell are sealed; Pushing the sealant along the second sealant reserved groove; The first sealed packaging case is installed in the second heat conductive packaging case, so that the first sealed packaging case and the second heat conductive packaging case are sealed.

6. The method according to claim 5, characterized in that Also includes: When the first sealed packaging shell and the second heat-conducting packaging shell adopt a multi-part splicing structure, the sealant is pushed along the splicing structures of each part to seal.

7. A device for the method according to any one of claims 5 to 6, characterized in that: The device comprises: The cartridge has a cavity inside for accommodating the plastic barrel; The cartridge sealing cover is arranged at the rear end of the cartridge and is fixedly connected to the cartridge through a buckle to form a cavity for accommodating the rubber barrel; A glue outlet is provided at the front end of the cartridge and is connected to the glue barrel for conveying glue outwards; A pusher head is movably disposed inside the cavity of the cartridge and is used to push the piston of the rubber barrel; A pneumatic push rod, comprising a push rod and a first cylinder for controlling the movement of the push rod, wherein the push rod is connected to one side of a push head and is used to push the push head to squeeze out the glue, wherein the first cylinder comprises: a cylinder ascending air inlet and a cylinder descending air inlet, wherein the cylinder ascending air inlet and the cylinder descending air inlet are respectively arranged at two ends of the cylinder and are used to drive the push rod to ascend or descend; A sealing head, arranged inside the cartridge and between the push head and the cartridge sealing cover, for sealing the cartridge and fixing the pneumatic push rod; A magnetic sensor is arranged in the movement stroke of the push rod and is used to detect the displacement of the pneumatic push rod. Wherein, the magnetic ring for controlling the magnetic sensor is arranged at the tail of the pneumatic push rod, so that the magnetic sensor senses the end position of the pneumatic push rod.

8. The device according to claim 7, characterized in that Also includes: The second cylinder, wherein the cartridge includes: a glue supply and air inlet connector, and the second cylinder adjusts the internal air pressure of the cartridge through the glue supply and air inlet connector to assist in pushing the piston of the glue barrel by air pressure.

9. The device according to claim 8, characterized in that The glue supply air inlet joint, the cylinder ascending air inlet and the cylinder descending air inlet are independently controlled or linked controlled.

10. The device according to claim 7, characterized in that Also includes: A controller, wherein the controller calculates the remaining amount of glue according to the displacement of the pneumatic push rod sensed by the magnetic sensor, The controller is configured as follows: The remaining glue amount information is sent to the glue dispensing controller, so that the glue dispensing controller determines whether to replace the glue barrel based on the remaining glue amount information and the next glue path information; and / or obtains the next glue path information in the glue dispensing controller, and determines whether to replace the glue barrel based on the relationship between the glue amount required by the next glue path information and the remaining glue amount; and / or determines whether the glue barrel needs to be replaced based on the remaining glue amount.

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