Display panel, method for manufacturing display panel, and electronic device

Abstract

The embodiments of the present application provide a display panel, a method for preparing a display panel, and an electronic device, which relate to the field of display technology. The display panel includes a substrate, an isolation structure, and a plurality of light-emitting units. The isolation structure is located on one side of the substrate and encloses a plurality of isolation openings. At least a portion of the light-emitting unit is located within the isolation opening. The light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode stacked in sequence in a direction away from the substrate. The plurality of light-emitting units include a first light-emitting unit. In the light-emitting region of the first light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the first light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a first microcavity distance, and the first microcavity distance is a first-order microcavity distance. The present application can prevent the hole transport layer of the first light-emitting unit from overlapping the isolation structure, thereby improving the problem of lateral crosstalk between adjacent light-emitting units.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing a display panel, and an electronic device. Background Art

[0002] Organic light-emitting diodes (OLEDs) and flat-panel displays based on technologies such as light-emitting diodes (LEDs) have become a mainstream display panel technology, widely used in a variety of consumer electronics products, including mobile phones, televisions, laptops, and desktop computers, due to their advantages of high image quality, power efficiency, thin design, and wide application range. Traditionally, the production of display panels involves patterning the luminous pixels using a fine metal mask (FMM). While FMM technology is mature and boasts extensive mass production experience, it also suffers from limited precision, high development costs, and long development cycles. FMM-free technology eliminates the limitations of traditional OLED processes on display size, resolution, and other performance characteristics, offering the advantages of high performance, full-scale scalability, and agile delivery. Patents CN118251982A, CN115666161A, CN116648095A, CN117062489A, CN118678742A, CN118785761A, CN115224220A, CN118678729A, CN118660529A, and CN118660589A describe the non-fine metal mask technology for reference.

[0003] However, there are still some problems with display panels that need to be solved urgently. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above technical background, an embodiment of the present application provides a display panel, wherein the display panel includes:

[0005] substrate;

[0006] An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings;

[0007] a plurality of light-emitting units, wherein at least a portion of the light-emitting units is located within the isolation opening, the light-emitting units comprising a first electrode, a light-emitting layer, and a second electrode stacked in sequence in a direction away from the substrate, the plurality of light-emitting units including a first light-emitting unit;

[0008] Among them, in the light-emitting area of ​​the first light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the first light-emitting unit away from the substrate and the side of the second electrode close to the substrate is the first microcavity distance, and the first microcavity distance is the first-order microcavity distance.

[0009] In some possible implementations, the first microcavity distance is equal to half the wavelength of light emitted by the light-emitting layer of the first light-emitting unit;

[0010] Optionally, the light-emitting unit further includes a hole transport layer located between the first electrode and the light-emitting layer, and along the thickness direction of the substrate, the thickness of the hole transport layer of the first light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å;

[0011] Optionally, the hole transport layer of the first light-emitting unit is overlapped with or spaced from the isolation structure;

[0012] Optionally, the orthographic projection of the hole transport layer of the first light-emitting unit on the substrate overlaps with the orthographic projection of the side of the isolation structure close to the substrate on the substrate; or, the orthographic projection of the hole transport layer of the first light-emitting unit on the substrate is outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate;

[0013] Optionally, the light-emitting layer of the first light-emitting unit is overlapped with or spaced from the isolation structure;

[0014] Optionally, the orthographic projection of the light-emitting layer of the first light-emitting unit on the substrate overlaps with the orthographic projection of the side of the isolation structure close to the substrate on the substrate; or, the orthographic projection of the light-emitting layer of the first light-emitting unit on the substrate is outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate;

[0015] In some possible implementations, the plurality of light emitting units include a second light emitting unit;

[0016] In the light-emitting region of the second light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the second light-emitting unit away from the substrate and the side of the second electrode close to the substrate is the second microcavity distance, and the second microcavity distance is the first-order microcavity distance;

[0017] Optionally, the second microcavity distance is equal to half the wavelength of light emitted by the light-emitting layer of the second light-emitting unit;

[0018] Optionally, the first light emitting unit and the second light emitting unit emit different colors;

[0019] Optionally, the light emitting color of the second light emitting unit includes green.

[0020] In some possible embodiments, the light-emitting unit further includes a hole transport layer located between the first electrode and the light-emitting layer, and along the thickness direction of the substrate, the thickness of the hole transport layer of the second light-emitting unit is greater than or equal to 50 Å and less than or equal to 100 Å;

[0021] Optionally, the hole transport layer of the second light-emitting unit is overlapped with or spaced from the isolation structure;

[0022] Optionally, the orthographic projection of the hole transport layer of the second light-emitting unit on the substrate overlaps with the orthographic projection of the side of the isolation structure close to the substrate on the substrate; or, the orthographic projection of the hole transport layer of the second light-emitting unit on the substrate is outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate;

[0023] Optionally, the light-emitting layer of the second light-emitting unit is overlapped with or spaced from the isolation structure;

[0024] Optionally, the orthographic projection of the light-emitting layer of the second light-emitting unit on the substrate overlaps with the orthographic projection of the side of the isolation structure close to the substrate on the substrate; or, the orthographic projection of the light-emitting layer of the second light-emitting unit on the substrate is outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate;

[0025] Optionally, the thickness of the hole transport layer of the second light-emitting unit is equal to the thickness of the hole transport layer of the first light-emitting unit.

[0026] In some possible implementations, the plurality of light emitting units include a third light emitting unit;

[0027] In the light-emitting region of the third light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the third light-emitting unit away from the substrate and the side of the second electrode of the third light-emitting unit close to the substrate is a third microcavity distance, and the third microcavity distance is an N-order microcavity distance, where N is an integer greater than or equal to 2;

[0028] Optionally, the third microcavity distance is equal to N times half the wavelength of light emitted by the light-emitting layer of the third light-emitting unit;

[0029] Optionally, the third microcavity distance is equal to the wavelength of light emitted by the light-emitting layer of the third light-emitting unit;

[0030] Optionally, the light-emitting unit further includes a hole transport layer located between the first electrode and the light-emitting layer, and the hole transport layer of the third light-emitting unit is spaced apart from the isolation structure;

[0031] Optionally, the orthographic projection of the hole transport layer of the third light-emitting unit on the substrate is located outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate;

[0032] Optionally, the light-emitting layer of the third light-emitting unit is spaced apart from the isolation structure;

[0033] Optionally, the orthographic projection of the light-emitting layer of the third light-emitting unit on the substrate is located outside the orthographic projection of a side of the isolation structure close to the substrate on the substrate;

[0034] Optionally, the thickness of the hole transport layer of the third light-emitting unit is greater than the thickness of the hole transport layer of the first light-emitting unit;

[0035] Optionally, the light-emitting unit further includes a hole blocking layer located between the light-emitting layer and the second electrode;

[0036] The thickness of the hole blocking layer of the third light-emitting unit is smaller than the thickness of the hole blocking layer of the first light-emitting unit;

[0037] Optionally, the light emitting color of the third light emitting unit includes blue.

[0038] In some possible implementations, the light-emitting unit further includes a first auxiliary layer located between the light-emitting layer and the second electrode;

[0039] The orthographic projection of the light-emitting layer on the substrate is located within the orthographic projection of the first auxiliary layer on the substrate;

[0040] Optionally, the orthographic projection area of ​​the light-emitting layer on the substrate is smaller than the orthographic projection area of ​​the first auxiliary layer on the substrate;

[0041] Optionally, the light-emitting unit further includes a second auxiliary layer located between the light-emitting layer and the first electrode;

[0042] The orthographic projection of the second auxiliary layer on the substrate is located within the orthographic projection of the light-emitting layer on the substrate; the orthographic projection area of ​​the second auxiliary layer on the substrate is smaller than the orthographic projection area of ​​the light-emitting layer on the substrate;

[0043] Optionally, the first auxiliary layer includes a hole blocking layer located between the light-emitting layer and the second electrode, and the second auxiliary layer includes a hole transport layer located between the first electrode and the light-emitting layer;

[0044] Optionally, the orthographic projection of the light-emitting layer on the substrate is located within the orthographic projection of the hole blocking layer on the substrate, and the orthographic projection area of ​​the light-emitting layer on the substrate is smaller than the orthographic projection area of ​​the hole blocking layer on the substrate;

[0045] Optionally, the orthographic projection of the hole transport layer on the substrate is located within the orthographic projection of the light-emitting layer on the substrate, and the orthographic projection area of ​​the hole transport layer on the substrate is smaller than the orthographic projection area of ​​the light-emitting layer on the substrate;

[0046] Optionally, the orthographic projection of the hole transport layer on the substrate is located within the orthographic projection of the hole blocking layer on the substrate, and the orthographic projection area of ​​the hole transport layer on the substrate is smaller than the orthographic projection area of ​​the hole blocking layer on the substrate;

[0047] Optionally, along the thickness direction of the substrate, the thickness of the hole blocking layer is greater than or equal to 100Å and less than or equal to 200Å.

[0048] In some possible embodiments, the light-emitting unit further includes an electron transport layer located between the hole blocking layer and the second electrode and an electron injection layer located between the electron transport layer and the second electrode;

[0049] Optionally, the light-emitting unit further includes a hole injection layer located between the hole transport layer and the first electrode.

[0050] In some possible implementations, the display panel further includes:

[0051] A plurality of packaging units, each packaging unit being located on a side of a corresponding light-emitting unit away from the substrate;

[0052] Optionally, a portion of the packaging unit extends from a side of the isolation structure facing the isolation opening to a side of the isolation structure away from the substrate;

[0053] Optionally, the multiple encapsulation units corresponding to the multiple light-emitting units are arranged at intervals;

[0054] Optionally, a gap is provided between the packaging unit located on a side of the isolation structure away from the substrate and the side of the isolation structure away from the substrate;

[0055] Optionally, the display panel further comprises a second encapsulation layer located on a side of the encapsulation unit away from the substrate, and a third encapsulation layer located on a side of the second encapsulation layer away from the substrate;

[0056] Optionally, the materials of the encapsulation unit and the third encapsulation layer both include inorganic materials;

[0057] Optionally, the material of the second encapsulation layer includes an organic material.

[0058] In some possible embodiments, the isolation structure includes a first isolation portion and a second isolation portion stacked sequentially in a direction away from the substrate, wherein an orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within an orthographic projection of the second isolation portion on the substrate;

[0059] Optionally, the isolation structure includes a conductive material, and the second electrode is electrically connected to the first isolation portion;

[0060] Optionally, the display panel further includes a pixel defining layer located between the first electrode and the isolation structure, the pixel defining layer defining a plurality of pixel openings, the pixel openings being connected to corresponding isolation openings, and the pixel openings exposing a portion of the first electrode;

[0061] Optionally, the isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the substrate, and the second electrode is electrically connected to the third isolation portion;

[0062] Optionally, the material of the third isolation portion includes molybdenum or titanium; and / or the material of the first isolation portion includes aluminum, silver or copper; and / or the material of the second isolation portion includes titanium or molybdenum.

[0063] In some possible implementations, the present application further provides a display panel, comprising:

[0064] substrate;

[0065] An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings;

[0066] A plurality of light-emitting units, wherein at least a portion of the light-emitting units is located within the isolation opening, the light-emitting units comprising a first electrode, a light-emitting layer, and a second electrode stacked sequentially in a direction away from the substrate, the plurality of light-emitting units comprising a first light-emitting unit and a third light-emitting unit; the light-emitting layer of the first light-emitting unit overlaps the isolation structure, and the light-emitting layer of the third light-emitting unit is spaced apart from the isolation structure; or, the overlap length of the light-emitting layer of the first light-emitting unit and the isolation structure is greater than the overlap length of the light-emitting layer of the third light-emitting unit and the isolation structure;

[0067] Wherein, in the light-emitting area of ​​the first light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the first light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a first microcavity distance, and the first microcavity distance is an M-order microcavity distance, where M is an integer greater than or equal to 1;

[0068] In the light-emitting area of ​​the third light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the third light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a third microcavity distance, and the third microcavity distance is an N-order microcavity distance, where N is an integer greater than M.

[0069] In some possible implementations, the present application further provides a display panel, comprising:

[0070] substrate;

[0071] An isolation structure is located on one side of the substrate, and the isolation structure encloses and forms a plurality of isolation openings;

[0072] A plurality of light-emitting units, at least a portion of each light-emitting unit is located within the isolation opening, the light-emitting unit includes a hole transport layer, and the plurality of light-emitting units include a first light-emitting unit, and along the thickness direction of the substrate, the thickness of the hole transport layer of the first light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å.

[0073] In some possible implementations, the hole transport layer of the first light-emitting unit is overlapped with or spaced from the isolation structure;

[0074] Optionally, the plurality of light-emitting units further include a second light-emitting unit, and along the thickness direction of the substrate, the thickness of the hole transport layer of the second light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å;

[0075] Optionally, the hole transport layer of the second light-emitting unit is overlapped with or spaced from the isolation structure;

[0076] Optionally, the hole transport layer of the second light-emitting unit is located outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate;

[0077] Optionally, the light emitting color of the first light emitting unit includes red, and / or the light emitting color of the second light emitting unit includes green.

[0078] In some possible implementations, the present application further provides a method for preparing a display panel, the method comprising:

[0079] providing a substrate;

[0080] An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings, and the plurality of isolation openings include a first isolation opening;

[0081] At least a portion of a first light-emitting unit is formed within the first isolation opening. The first light-emitting unit includes a first electrode, a light-emitting layer, and a second electrode stacked sequentially in a direction away from the substrate. In a light-emitting region of the first light-emitting unit, along a thickness direction of the substrate, a distance between a side of the first electrode of the first light-emitting unit away from the substrate and a side of the second electrode of the first light-emitting unit close to the substrate is a first microcavity distance, and the first microcavity distance is a first-order microcavity distance.

[0082] In some possible implementations, the plurality of isolation openings further include a second isolation opening and a third isolation opening; and after the step of forming at least a portion of the first light-emitting unit in the first isolation opening, the method further includes:

[0083] At least a portion of a second light-emitting unit is formed within the second isolation opening, the second light-emitting unit comprising a first electrode, a light-emitting layer, and a second electrode sequentially stacked in a direction away from the substrate, wherein along the thickness direction of the substrate, a distance between a side of the first electrode of the second light-emitting unit away from the substrate and a side of the second electrode close to the substrate is a second microcavity distance, and the second microcavity distance is a first-order microcavity distance;

[0084] Optionally, after the step of forming at least a portion of the second light emitting unit in the second isolation opening, the method further includes:

[0085] forming a hole transport material layer at a first evaporation angle, so that the hole transport material layer of the third light-emitting unit located in the third isolation opening is spaced apart from the isolation structure;

[0086] forming a light-emitting material layer at a second evaporation angle, so that the light-emitting material layer of the third light-emitting unit located in the third isolation opening is spaced apart from the isolation structure;

[0087] forming a second electrode material layer on a side of the light-emitting material layer away from the substrate, so that the second electrode material layer of the third light-emitting unit located in the third isolation opening overlaps the isolation structure;

[0088] performing patterning on the second electrode material layer, the light-emitting material layer, and the hole transport material layer to form a second electrode, a light-emitting layer, and a hole transport layer of the third light-emitting unit, respectively;

[0089] Optionally, the first microcavity distance is equal to half the wavelength of light emitted by the light-emitting layer of the first light-emitting unit;

[0090] Optionally, the second microcavity distance is equal to half the wavelength of light emitted by the light-emitting layer of the second light-emitting unit;

[0091] Optionally, the distance between the side of the first electrode of the third light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a third microcavity distance, and the third microcavity distance is equal to the wavelength of light emitted by the light-emitting layer of the third light-emitting unit.

[0092] In some possible implementations, the present application further provides an electronic device, which includes the display panel in the present application, or includes a display panel prepared by the method for preparing the display panel in the present application.

[0093] Compared with the prior art, this application has the following beneficial effects:

[0094] The present application provides a display panel, a method for preparing a display panel, and an electronic device. By setting the first microcavity distance to be equal to the first-order microcavity distance, the thickness of at least a portion of the film layer between the first electrode and the second electrode of the first light-emitting unit can be reduced, thereby increasing the impedance of at least a portion of the film layer between the first electrode and the second electrode of the first light-emitting unit, reducing lateral leakage caused by overlapping of at least a portion of the film layer between the first electrode and the second electrode of the first light-emitting unit with the isolation structure, and / or making it difficult for the hole transport layer of the first light-emitting unit to overlap with the isolation structure, thereby improving the problem of lateral crosstalk between adjacent light-emitting units. BRIEF DESCRIPTION OF THE DRAWINGS

[0095] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without creative work.

[0096] Figure 1 A schematic cross-sectional view of a display panel provided in an embodiment of the present application;

[0097] Figure 2 One of the cross-sectional schematic diagrams of the light-emitting unit of the display panel provided in an embodiment of the present application including a hole transport layer;

[0098] Figure 3A second cross-sectional schematic diagram of a light-emitting unit of a display panel provided in an embodiment of the present application including a hole transport layer;

[0099] Figure 4 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a third light-emitting unit;

[0100] Figure 5 A schematic cross-sectional view of a light-emitting unit of a display panel provided in an embodiment of the present application including a hole blocking layer;

[0101] Figure 6 A cross-sectional schematic diagram of a light-emitting unit provided in an embodiment of the present application including film layers such as a hole injection layer;

[0102] Figure 7 A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application includes a packaging unit;

[0103] Figure 8a A cross-sectional schematic diagram of a display panel provided in an embodiment of the present application including a second encapsulation layer and a third encapsulation layer;

[0104] Figure 8b A schematic cross-sectional view of the differentiated overlap between the light-emitting functional portion and the isolation structure of the light-emitting unit in the display panel provided by an embodiment of the present application;

[0105] Figure 8c A cross-sectional schematic diagram showing the difference in the overlap length between the light-emitting functional portion and the isolation structure of the light-emitting unit in the display panel provided by an embodiment of the present application;

[0106] Figure 9 A schematic flow chart of a method for manufacturing a display panel provided in an embodiment of the present application;

[0107] Figure 10 A cross-sectional schematic diagram of forming a first light-emitting unit in a first isolation opening according to an embodiment of the present application;

[0108] Figure 11 A cross-sectional schematic diagram of forming a second light-emitting unit in a second isolation opening according to an embodiment of the present application;

[0109] Figure 12 A schematic cross-sectional view of a hole transport material layer of a third light-emitting unit formed in a third isolation opening according to an embodiment of the present application;

[0110] Figure 13 A schematic cross-sectional view of a light-emitting material layer of a third light-emitting unit formed in a third isolation opening according to an embodiment of the present application;

[0111] Figure 14This is a schematic cross-sectional view of a second electrode material layer formed in a third isolation opening and located on a side of the light-emitting material layer away from the substrate, as provided in an embodiment of the present application.

[0112] Figure numerals: 1. substrate; 2. pixel defining layer; 21. pixel opening; 3. isolation structure; 31. first isolation portion; 32. second isolation portion; 33. third isolation portion; 4. first electrode; 5. light-emitting layer; 6. second electrode; 7. light-emitting unit; 8. isolation opening; 81. first isolation opening; 82. second isolation opening; 83. third isolation opening; 9. hole transport layer; 10. hole blocking layer; 11. hole injection layer; 12. electron transport layer; 13. electron injection layer; 14. encapsulation unit; 15. second encapsulation layer; 16. third encapsulation layer; 17. hole transport material layer; 18. light-emitting material layer; 19. second electrode material layer. DETAILED DESCRIPTION

[0113] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Generally, the components of the embodiments of the present application described and shown in the drawings herein can be arranged and designed in various different configurations.

[0114] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. All other embodiments obtained by persons of ordinary skill in the art based on the embodiments in the present application without making any creative efforts shall fall within the scope of protection of the present application.

[0115] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0116] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the inventive product is typically placed when in use. These terms are intended solely to facilitate the description of this application and simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0117] It should be noted that, in the absence of conflict, different features in the embodiments of the present application can be combined with each other.

[0118] Increasing the density of light-emitting units (i.e., pixel density) in display panels is a key approach to enhancing display quality. However, current display panels manufactured using fine metal mask (FMM) evaporation technology are currently limited by technical limitations and cannot achieve further increases in light-emitting unit density. Long-term research has revealed that, to address this limitation, some display panels incorporate isolation structures. During the full-layer evaporation of the light-emitting layer and the second electrode, these can be disconnected at the isolation structures. Through multiple evaporation and etching processes (i.e., light-emitting unit patterning), light-emitting units of different colors can be formed within the different isolation openings.

[0119] The display panel in the related art includes a substrate, an isolation structure located on one side of the substrate, and a light-emitting unit located in an isolation opening formed by the isolation structure. The light-emitting unit includes a hole transport layer, which is easily overlapped with the isolation structure, thereby easily causing lateral crosstalk between adjacent light-emitting units.

[0120] In order to solve the above-mentioned technical problems, the following technical solutions are innovatively designed. The specific implementation solutions of this application will be described in detail below with reference to the accompanying drawings. It should be noted that the defects existing in the solutions in the above-mentioned prior art are the results obtained after practice and careful study. Therefore, the discovery process of the above-mentioned technical problems and the solutions proposed in the following embodiments for the above-mentioned problems should all be contributions made to this application in the process of invention and creation, and should not be understood as technical contents known to those skilled in the art.

[0121] See Figure 1 This embodiment provides a display panel, which includes a substrate 1, an isolation structure 3 and a plurality of light-emitting units 7.

[0122] The substrate 1 may include a substrate, and the display panel may further include multiple driving units located on one side of the substrate. Alternatively, the substrate 1 may include a substrate and multiple driving units located on one side of the substrate. Each driving unit may include one or more semiconductor switching devices. The semiconductor switching devices may be formed by the cooperation of multiple film layers in the substrate 1. For example, the semiconductor switching devices may be thin film transistors formed by the cooperation of multiple film layers.

[0123] The isolation structure 3 is located on one side of the substrate 1 , and the isolation structure 3 encloses a plurality of isolation openings 8 .

[0124] At least part of the light emitting unit 7 is located in the isolation opening 8 . The light emitting unit 7 includes a first electrode 4 , a light emitting layer 5 and a second electrode 6 stacked in sequence along a direction Z away from the substrate 1 . The plurality of light emitting units 7 include a first light emitting unit.

[0125] Among them, in the light-emitting area of ​​the first light-emitting unit (which may correspond to the pixel opening), along the thickness direction Z of the substrate 1, the distance between the side of the first electrode 4 of the first light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1 is the first microcavity distance D1, and the first microcavity distance is a first-order microcavity distance.

[0126] A microcavity is a special physical structure that can confine optical signals to a very small volume. Typically constructed from high-refractive-index materials, such as optical waveguides or optical fibers, a microcavity can be spherical, cylindrical, or in other geometric shapes. Its diameter typically ranges from a few micrometers to a few millimeters. Light within the microcavity can form a standing wave pattern, where the light's energy propagates back and forth within the cavity.

[0127] The microcavity structure is a structure in which the light emitted by the light-emitting unit 7 can produce a microcavity effect. The microcavity effect is a resonance phenomenon that occurs between the first electrode 4 and the second electrode 6 when the light emitted by the light-emitting layer 5 in the light-emitting unit 7. The light waves are repeatedly reflected between the first electrode 4 and the second electrode 6, and the phases of multiple reflections are accumulated, thereby enhancing the intensity of light of a specific wavelength.

[0128] Microcavities can be divided into first-order microcavities, second-order microcavities, third-order microcavities, etc. according to their order. By adjusting the distance between the first electrode 4 and the second electrode 6 along the thickness direction of the substrate 1, microcavities of different orders can be obtained. Generally, the greater the distance between the first electrode 4 and the second electrode 6 along the thickness direction of the substrate 1, the higher the order of the microcavity.

[0129] The isolation opening 8 includes a first isolation opening 81, at least part of the first light-emitting unit is located in the first isolation opening 81, and a first microcavity is formed between the side of the first electrode 4 of the first light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1. In the related art, the first microcavity distance D1 is equal to the second-order microcavity distance. In this way, the thickness of the hole transport layer of the first light-emitting unit is thicker, so that the impedance of the hole transport layer of the first light-emitting unit is smaller, and the hole transport layer of the first light-emitting unit overlaps with the isolation structure, resulting in larger lateral leakage, and / or, making the hole transport layer of the first light-emitting unit easily overlap with the isolation structure 3, thereby making it easy for lateral crosstalk to occur between adjacent light-emitting units 7.

[0130] By setting the first microcavity distance to be equal to the first-order microcavity distance, the thickness of at least part of the film layer between the first electrode and the second electrode of the first light-emitting unit can be reduced, so that the impedance of at least part of the film layer between the first electrode and the second electrode of the first light-emitting unit is increased, and the lateral leakage caused by the overlap of at least part of the film layer between the first electrode and the second electrode of the first light-emitting unit and the isolation structure is reduced, and / or, the hole transport layer of the first light-emitting unit is not easily overlapped with the isolation structure, thereby improving the problem of lateral crosstalk between adjacent light-emitting units.

[0131] In this embodiment, the first microcavity distance D1 is set to be equal to the first-order microcavity distance. In this way, the thickness of the hole transport layer of the first light-emitting unit can be reduced, so that the impedance of the hole transport layer of the first light-emitting unit is larger, and the lateral leakage of the hole transport layer of the first light-emitting unit overlapping with the isolation structure is reduced, and / or, the hole transport layer of the first light-emitting unit is not easily overlapped with the isolation structure 3, and the problem of lateral leakage is not easily generated between adjacent light-emitting units 7, thereby improving the problem of lateral crosstalk between adjacent light-emitting units 7, making the display panel more uniform in brightness and chromaticity and better in picture quality under low grayscale conditions, thereby improving the display effect of the display panel.

[0132] Based on the above design, this embodiment sets the first microcavity distance D1 to be equal to the first-order microcavity distance, thereby reducing the thickness of the hole transport layer of the first light-emitting unit, so that the impedance of the hole transport layer of the first light-emitting unit is larger, reducing the lateral leakage of the hole transport layer of the first light-emitting unit overlapping with the isolation structure, and / or making it difficult for the hole transport layer of the first light-emitting unit to overlap with the isolation structure 3, thereby improving the problem of lateral crosstalk between adjacent light-emitting units 7.

[0133] For some possible implementations, see again Figure 1 The display panel further includes a pixel defining layer 2 positioned between the first electrode 4 and the isolation structure 3. The pixel defining layer 2 defines a plurality of pixel openings 21. The pixel openings 21 communicate with corresponding isolation openings 8, exposing portions of the first electrode 4. The orthographic projections of the pixel openings 21 on the substrate 1 are within the orthographic projections of the isolation openings 8 on the substrate 1. The area of ​​the pixel openings 21 near the substrate 1 serves as the light-emitting region of the corresponding light-emitting unit 7.

[0134] The provision of the isolation structure 3 enables the display panel to form film layers of light-emitting units 7 of different colors in different isolation openings 8 without the need for a fine mask. When forming the light-emitting material layer, the light-emitting material layer is separated by the isolation structure 3 to form multiple spaced light-emitting functional portions. When forming the second electrode material layer, the second electrode material layer is separated by the isolation structure 3 to form multiple spaced second electrodes 6. The isolation structure 3 includes a conductive material, and the second electrodes 6 are electrically connected to the isolation structure 3. A first electrode 4, a light-emitting layer 5, and a second electrode 6 form a light-emitting unit 7. The first electrode 4 can be an anode, and the second electrode 6 can be a cathode.

[0135] In this way, different light-emitting units 7 can be made independent of each other, thereby reducing crosstalk between adjacent light-emitting units 7 and improving the display effect of the display panel. At the same time, due to the presence of the isolation structure 3, the light-emitting material layer and the second electrode material layer in the light-emitting unit 7 of each color in the display panel can be first prepared on the entire surface and then patterned, thereby eliminating the need for a fine mask and further reducing the production cost of the display panel.

[0136] For some possible implementations, see Figure 2 , the first microcavity distance D1 is equal to half of the wavelength of the light emitted by the light-emitting layer 5 of the first light-emitting unit.

[0137] In the related art, the height of the first microcavity is equal to the wavelength of light emitted by the light-emitting layer 5 of the first light-emitting unit, that is, the first microcavity distance D1 is equal to the wavelength of light emitted by the light-emitting layer 5 of the first light-emitting unit. In this way, the thickness of the hole transport layer of the first light-emitting unit is thicker, so that the impedance of the hole transport layer of the first light-emitting unit is smaller, resulting in a larger lateral leakage of the hole transport layer of the first light-emitting unit overlapping with the isolation structure, and / or, making it easy for the hole transport layer of the first light-emitting unit to overlap with the isolation structure 3, thereby easily causing lateral crosstalk between adjacent light-emitting units 7.

[0138] In this embodiment, the first microcavity distance D1 is set to be equal to half the wavelength of the light emitted by the light-emitting layer 5 of the first light-emitting unit, that is, the first microcavity of the first light-emitting unit is set to a first-order microcavity. In this way, the thickness of the hole transport layer of the first light-emitting unit can be reduced, so that the impedance of the hole transport layer of the first light-emitting unit is larger, and the lateral leakage of the hole transport layer of the first light-emitting unit overlapping with the isolation structure is reduced, and / or the hole transport layer of the first light-emitting unit is not easily overlapped with the isolation structure 3, so that the problem of lateral leakage is not easily generated between adjacent light-emitting units 7.

[0139] Alternatively, see Figure 2The light-emitting unit 7 further includes a hole transport layer 9 located between the first electrode 4 and the light-emitting layer 5. Along the thickness direction Z of the substrate 1, the thickness H1 of the hole transport layer 9 of the first light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å.

[0140] Optionally, the light emitting color of the first light emitting unit includes red.

[0141] In the related art, the thickness of the hole transport layer 9 of the first light-emitting unit is greater than or equal to 1100 Å and less than or equal to 1300 Å, for example, 1100 Å, 1200 Å, or 1300 Å. In this embodiment, the first light-emitting unit is configured as a first-order microcavity, and the main film thickness reduction is the thickness of the hole transport layer 9.

[0142] Specifically, the thickness H1 of the thinned hole transport layer 9 of the first light-emitting unit can be 50Å, 60Å, 70Å, 80Å, 90Å or 100Å, etc. Reasonable setting of the thickness H1 can make the hole transport layer 9 of the first light-emitting unit less likely to overlap with the isolation structure 3.

[0143] For example, the hole transport layer 9 of the first light-emitting unit overlaps with the isolation structure 3. For example, the orthographic projection of the hole transport layer 9 of the first light-emitting unit on the substrate 1 overlaps with the orthographic projection of the side of the isolation structure 3 closest to the substrate 1 on the substrate 1. Setting the first microcavity distance equal to the first-order microcavity distance can reduce the thickness of at least a portion of the film layer between the first electrode and the second electrode of the first light-emitting unit, thereby increasing the impedance of at least a portion of the film layer between the first electrode and the second electrode of the first light-emitting unit and reducing lateral leakage caused by the overlap of at least a portion of the film layer between the first electrode and the second electrode of the first light-emitting unit and the isolation structure.

[0144] For example, the hole transport layer 9 of the first light-emitting unit is spaced apart from the isolation structure 3, and the orthographic projection of the hole transport layer 9 of the first light-emitting unit on the substrate 1 is located outside the orthographic projection of the side of the isolation structure 3 close to the substrate 1 on the substrate 1. That is, the hole transport layer 9 of the first light-emitting unit does not overlap with the isolation structure 3, thereby reducing the problem of lateral crosstalk between adjacent light-emitting units 7.

[0145] For some possible implementations, see Figure 3 The multiple light-emitting units 7 include a second light-emitting unit. In the light-emitting area of ​​the second light-emitting unit (which may correspond to the pixel opening), along the thickness direction of the substrate 1, the distance between the side of the first electrode 4 of the second light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1 is the second microcavity distance D2, and the second microcavity distance is a first-order microcavity distance.

[0146] Optionally, the second microcavity distance D2 is equal to half of the wavelength of light emitted by the light-emitting layer 5 of the second light-emitting unit.

[0147] Optionally, the first light emitting unit and the second light emitting unit emit different colors.

[0148] Optionally, the light emitting color of the second light emitting unit includes green.

[0149] The isolation opening 8 includes a second isolation opening 82, at least part of the second light-emitting unit is located in the second isolation opening 82, and a second microcavity is formed between the side of the first electrode 4 of the second light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1. In the related art, the height of the second microcavity is equal to the wavelength of light emitted by the light-emitting layer 5 of the second light-emitting unit, that is, the second microcavity distance D2 is equal to the wavelength of light emitted by the light-emitting layer 5 of the second light-emitting unit. In this way, the thickness of the hole transport layer 9 of the second light-emitting unit is relatively thick, and the impedance of the hole transport layer 9 of the second light-emitting unit is relatively small, resulting in a larger lateral leakage of the hole transport layer of the second light-emitting unit overlapping with the isolation structure, and / or making it easy for the hole transport layer 9 of the second light-emitting unit to overlap with the isolation structure 3, thereby making it easy for lateral crosstalk to occur between adjacent light-emitting units 7.

[0150] By setting the second microcavity distance to be equal to the first-order microcavity distance, the thickness of at least part of the film layer between the first electrode and the second electrode of the second light-emitting unit can be reduced, so that the impedance of at least part of the film layer between the first electrode and the second electrode of the second light-emitting unit is increased, and the lateral leakage caused by the overlap of at least part of the film layer between the first electrode and the second electrode of the second light-emitting unit and the isolation structure is reduced, and / or, the hole transport layer of the second light-emitting unit is not easily overlapped with the isolation structure, thereby improving the problem of lateral crosstalk between adjacent light-emitting units.

[0151] In this embodiment, the second microcavity distance D2 is set to be equal to half the wavelength of the light emitted by the light-emitting layer 5 of the second light-emitting unit, that is, the second microcavity of the second light-emitting unit is set to a first-order microcavity. In this way, the thickness of the hole transport layer 9 of the second light-emitting unit can be reduced, and the impedance of the hole transport layer 9 of the second light-emitting unit is relatively large, which reduces the lateral leakage of the hole transport layer of the second light-emitting unit overlapping with the isolation structure, and / or makes it difficult for the hole transport layer 9 of the second light-emitting unit to overlap with the isolation structure 3, and the problem of lateral leakage is not easy to occur between adjacent light-emitting units 7, thereby improving the problem of lateral crosstalk between adjacent light-emitting units 7, and further improving the display effect of the display panel.

[0152] For some possible implementations, see again Figure 3 , along the thickness direction Z of the substrate 1 , the thickness H2 of the hole transport layer 9 of the second light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å.

[0153] For example, the hole transport layer 9 of the second light emitting unit overlaps with the isolation structure 3. For example, the orthographic projection of the hole transport layer 9 of the second light emitting unit on the substrate 1 overlaps with the orthographic projection of the side of the isolation structure 3 close to the substrate 1 on the substrate 1.

[0154] Optionally, the hole transport layer 9 of the second light emitting unit is spaced apart from the isolation structure 3 , for example, the hole transport layer 9 of the second light emitting unit is located outside the orthographic projection of the side of the isolation structure 3 close to the substrate 1 on the substrate 1 .

[0155] In the related art, the thickness of the hole transport layer 9 of the second light-emitting unit is greater than or equal to 1100 Å and less than or equal to 1300 Å, for example, 1100 Å, 1200 Å, or 1300 Å. In this embodiment, the second microcavity of the second light-emitting unit is configured as a first-order microcavity, and the main film thickness reduction is the film thickness of the hole transport layer 9.

[0156] Specifically, the thickness H2 of the thinned hole transport layer 9 of the second light-emitting unit can be 50Å, 60Å, 70Å, 80Å, 90Å or 100Å, etc. Reasonable setting of the thickness H2 can make the hole transport layer 9 of the second light-emitting unit less likely to overlap with the isolation structure 3.

[0157] For some possible implementations, see Figure 4 The multiple light-emitting units 7 include a third light-emitting unit. In the light-emitting area of ​​the third light-emitting unit (which may correspond to the pixel opening), along the thickness direction Z of the substrate 1, the distance between the side of the first electrode 4 of the third light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1 is a third microcavity distance D3. The third microcavity distance D3 is an N-order microcavity distance, where N is an integer greater than or equal to 2. For example, N can be 2, 3, or 4.

[0158] Optionally, the third microcavity distance D3 is equal to N times half the wavelength of the light emitted by the light-emitting layer 5 of the third light-emitting unit.

[0159] Optionally, the third microcavity distance D3 is equal to the wavelength of light emitted by the light-emitting layer 5 of the third light-emitting unit.

[0160] Optionally, the hole transport layer 9 of the third light emitting unit is spaced apart from the isolation structure 3 , for example, the hole transport layer 9 of the third light emitting unit is located outside the orthographic projection of the side of the isolation structure 3 close to the substrate 1 on the substrate 1 .

[0161] Optionally, the light emitting color of the third light emitting unit includes blue.

[0162] For example, the luminous efficiency of the third light-emitting unit is lower than that of the first light-emitting unit. The third microcavity distance D3 is greater than the first microcavity distance D1, which can increase the brightness of the third light-emitting unit and improve the display effect.

[0163] For example, the luminous efficiency of the third light-emitting unit is lower than that of the second light-emitting unit. The third microcavity distance D3 is greater than the second microcavity distance D2, which can increase the brightness of the third light-emitting unit and improve the display effect.

[0164] For example, the isolation opening 8 includes a third isolation opening 83. At least a portion of the third light-emitting unit is located within the third isolation opening 83. A third microcavity is formed between the side of the first electrode 4 of the third light-emitting unit away from the substrate 1 and the side of the second electrode 6 of the third light-emitting unit close to the substrate 1. Since the film layer of the third light-emitting unit is relatively thinner, the third microcavity of the third light-emitting unit can usually only be set as a second-order microcavity.

[0165] When forming the hole transport layer 9 of the third light-emitting unit, the hole transport layer 9 of the third light-emitting unit can be prevented from overlapping with the corresponding isolation structure 3 by controlling the evaporation angle, thereby reducing the risk of lateral crosstalk between adjacent light-emitting units 7.

[0166] For example, see again Figure 2-Figure 4 , the thickness H3 of the hole transport layer 9 of the third light-emitting unit is greater than the thickness H1 of the hole transport layer of the first light-emitting unit.

[0167] For example, the thickness H3 of the hole transport layer 9 of the third light emitting unit is greater than the thickness H2 of the hole transport layer of the second light emitting unit.

[0168] For example, the thickness H1 of the hole transport layer of the first light emitting unit is equal to the thickness H2 of the hole transport layer of the second light emitting unit.

[0169] Optionally, the thickness of the hole transport layer 9 of the second light-emitting unit is greater than or equal to 1100Å and less than or equal to 1300Å, for example, it can be 1100Å, 1200Å or 1300Å.

[0170] For some possible implementations, see Figure 5 The light-emitting unit further includes a first auxiliary layer located between the light-emitting layer 5 and the second electrode 6 , and the orthographic projection of the light-emitting layer 5 on the substrate 1 is located within the orthographic projection of the first auxiliary layer on the substrate 1 .

[0171] Optionally, the orthographic projection area of ​​the light-emitting layer 5 on the substrate 1 is smaller than the orthographic projection area of ​​the first auxiliary layer on the substrate 1 .

[0172] Optionally, the light-emitting unit further includes a second auxiliary layer located between the light-emitting layer 5 and the first electrode 4; the orthographic projection of the second auxiliary layer on the substrate 1 is located within the orthographic projection of the light-emitting layer 5 on the substrate 1; the orthographic projection area of ​​the second auxiliary layer on the substrate 1 is smaller than the orthographic projection area of ​​the light-emitting layer 5 on the substrate 1.

[0173] In this way, the first auxiliary layer can block the carriers in the hole transport layer 9 from being transferred in the longitudinal direction, thereby effectively improving the longitudinal leakage problem of the corresponding light-emitting unit 7 and further improving the display effect of the display panel.

[0174] Optionally, the first auxiliary layer includes a hole blocking layer 10 located between the light-emitting layer 5 and the second electrode 6 , and the second auxiliary layer includes a hole transport layer 9 located between the first electrode 4 and the light-emitting layer 5 .

[0175] Optionally, the orthographic projection of the light-emitting layer 5 on the substrate 1 is located within the orthographic projection of the hole blocking layer 10 on the substrate 1 , and the orthographic projection area of ​​the light-emitting layer 5 on the substrate 1 is smaller than the orthographic projection area of ​​the hole blocking layer 10 on the substrate 1 .

[0176] Optionally, the orthographic projection of the hole blocking layer 10 on the substrate 1 is located within the orthographic projection of the hole transport layer 9 on the substrate 1 , and the orthographic projection area of ​​the hole blocking layer 10 on the substrate 1 is smaller than the orthographic projection area of ​​the hole transport layer 9 on the substrate 1 .

[0177] In related technologies, there may also be longitudinal leakage of carriers in the hole transport layer 9. For example, the carriers in the hole transport layer 9 flow toward the light-emitting layer 5, which will cause the corresponding light-emitting unit 7 to have a longitudinal leakage problem, thereby making the corresponding light-emitting unit 7 inefficient and difficult to light up, causing the display panel to have poor image quality at low grayscales, thereby affecting the display effect of the display panel.

[0178] In this embodiment, the light-emitting layer 5 is set to cover the hole transport layer 9, and the hole blocking layer 10 is set to cover the hole transport layer 9. The light-emitting layer 5 and the hole blocking layer 10 can block the carriers in the hole transport layer 9 from being transmitted in the longitudinal direction, thereby effectively improving the problem of longitudinal leakage of the corresponding light-emitting unit 7, and further improving the display effect of the display panel.

[0179] Optionally, see again Figure 5 , the thickness H4 of the hole blocking layer 10 of the third light emitting unit is less than the thickness H5 of the hole blocking layer 10 of the first light emitting unit.

[0180] Optionally, the thickness H4 of the hole blocking layer 10 of the third light-emitting unit is smaller than the thickness H6 of the hole blocking layer 10 of the second light-emitting unit.

[0181] Optionally, the thickness H5 of the hole blocking layer 10 of the first light-emitting unit is equal to the thickness H6 of the hole blocking layer 10 of the second light-emitting unit.

[0182] Optionally, see again Figure 5 , along the thickness direction Z of the substrate 1 , the thickness H5 of the hole blocking layer 10 of the first light-emitting unit is greater than or equal to 100Å and less than or equal to 200Å.

[0183] For example, the thickness H5 can be 100Å, 120Å, 150Å, 180Å or 200Å, etc. Properly increasing the thickness H5 of the hole blocking layer 10 can improve the blocking effect of the hole blocking layer 10 on the longitudinal transmission of carriers in the hole transport layer 9.

[0184] For some possible implementations, see Figure 6 The light-emitting unit 7 further includes an electron transport layer 12 located on a side of the hole blocking layer 10 away from the substrate 1 and an electron injection layer 13 located between the electron transport layer 12 and the second electrode 6 .

[0185] Optionally, the light emitting unit 7 further includes a hole injection layer 11 located between the hole transport layer 9 and the first electrode 4. The light emitting unit 7 with such a structure has a better light emitting effect.

[0186] For some possible implementations, see Figure 7 The display panel also includes a plurality of packaging units 14, which are located on the side of the corresponding light-emitting unit 7 away from the substrate 1. For example, part of the packaging unit 14 extends from the side of the isolation structure 3 toward the isolation opening 8 to the side of the isolation structure 3 away from the substrate 1.

[0187] Optionally, the multiple packaging units 14 corresponding to the multiple light-emitting units 7 are arranged at intervals, and there is a gap between the packaging unit 14 located on the side of the isolation structure 3 away from the substrate 1 and the side of the isolation structure 3 away from the substrate 1 .

[0188] During the patterning process of the light-emitting unit 7 , the first packaging material layer is disconnected at the isolation structure 3 to form the packaging unit 14 . The packaging unit 14 can completely and independently package the corresponding light-emitting unit 7 , thereby improving the display characteristics of the display panel.

[0189] For some possible implementations, see Figure 8a The display panel further includes a second encapsulation layer 15 located on a side of the encapsulation unit 14 away from the substrate 1 and a third encapsulation layer 16 located on a side of the second encapsulation layer 15 away from the substrate 1 .

[0190] Optionally, the material of the encapsulation unit 14 includes an inorganic material, and / or the material of the third encapsulation layer 16 includes an inorganic material, and / or the material of the second encapsulation layer 15 includes an organic material.

[0191] For example, the encapsulation unit 14 and the third encapsulation layer 16 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 15 can be formed by inkjet printing (IJP). The second encapsulation layer 15 and the third encapsulation layer 16 can provide a better encapsulation effect on the light-emitting unit 7, thereby further improving the encapsulation quality of the display panel.

[0192] For some possible implementations, see again Figure 7 The isolation structure 3 includes a first isolation portion 31 and a second isolation portion 32, which are stacked in a direction away from the substrate 1. The orthographic projection of the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is located within the orthographic projection of the second isolation portion 32 on the substrate 1. For example, the orthographic projection area of ​​the side of the first isolation portion 31 away from the substrate 1 on the substrate 1 is smaller than the orthographic projection area of ​​the second isolation portion 32 on the substrate 1. For example, the cross-section of the isolation structure 3 perpendicular to the substrate 1 is T-shaped.

[0193] Because the second isolating portion 32 is located on the side of the first isolating portion 31 away from the substrate 1 and the lateral width of the second isolating portion 32 is greater than the lateral width of the first isolating portion 31 in a plane parallel to the substrate 1, the second isolating portion 32 disconnects the light-emitting material layer 18 and the second electrode material layer at the isolation structure 3. Thus, the isolation structure 3 formed by the first isolating portion 31 and the second isolating portion 32 makes it easier to independently package each light-emitting unit 7, thereby improving the packaging yield of the display panel.

[0194] For example, the isolation structure includes a conductive material, and the second electrode 6 is electrically connected to the isolation structure 3 .

[0195] Please see again Figure 7 The second electrode 6 is electrically connected to the first isolation portion 31, the first isolation portion 31 includes a conductive material, and the second electrode 6 corresponding to the light-emitting unit 7 extends to contact the side wall of the first isolation portion 31 to achieve electrical connection between the second electrode 6 corresponding to the light-emitting unit 7 and the first isolation portion 31.

[0196] Optionally, see again Figure 8a The isolation structure 3 further includes a third isolation portion 33 located on a side of the first isolation portion 31 facing the substrate 1 , and the second electrode 6 is electrically connected to the third isolation portion 33 .

[0197] The third isolation portion 33 includes a conductive material. The second electrode 6 corresponding to the light emitting unit 7 extends to contact the third isolation portion 33 to achieve electrical connection between the second electrode 6 corresponding to the light emitting unit 7 and the third isolation portion 33 .

[0198] For example, the orthographic projection of the first isolation portion 31 on the substrate 1 is located within the orthographic projection of the third isolation portion 33 on the substrate 1. For example, the orthographic projection area of ​​the first isolation portion 31 on the substrate 1 is smaller than the orthographic projection area of ​​the third isolation portion 33 on the substrate 1. For example, the cross-section of the isolation structure 3 perpendicular to the substrate 1 is an I-shape.

[0199] Specifically, the third isolation portion 33 is made of molybdenum or titanium; and / or the first isolation portion 31 is made of aluminum, silver, or copper; and / or the second isolation portion 32 is made of titanium or molybdenum. Thus, when the isolation structure 3 separates the second electrode material layer into the second electrode 6, the second electrode 6 is more easily electrically connected to the third isolation portion 33.

[0200] For some possible implementations, see Figure 8b and Figure 8c The present application also provides another display panel, which includes a substrate 1, an isolation structure 3 and a plurality of light-emitting units 7.

[0201] The isolation structure 3 is located on one side of the substrate 1 , and the isolation structure 3 encloses a plurality of isolation openings 8 .

[0202] At least a portion of the light-emitting unit 7 is located within the isolation opening 8. The light-emitting unit 7 includes a first electrode 4, a light-emitting layer 5, and a second electrode 6, which are sequentially stacked in a direction away from the substrate 1. The multiple light-emitting units 7 include a first light-emitting unit and a third light-emitting unit. The light-emitting layer 5 of the first light-emitting unit overlaps the isolation structure 3, while the light-emitting layer 5 of the third light-emitting unit is spaced apart from the isolation structure 3. Alternatively, the overlap length W1 between the light-emitting layer 5 of the first light-emitting unit and the isolation structure 3 is greater than the overlap length W2 between the light-emitting layer 5 of the third light-emitting unit and the isolation structure 3. The overlap length can be the dimension in the radial direction from the center of the isolation opening to the edge of the isolation opening. Alternatively, the overlap length can be the dimension along the isolation structure toward the sidewall of the isolation opening, away from the substrate.

[0203] Among them, in the light-emitting area of ​​the first light-emitting unit, along the thickness direction of the substrate 1, the distance between the side of the first electrode 4 of the first light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1 is the first microcavity distance, and the first microcavity distance is an M-order microcavity distance, where M is an integer greater than or equal to 1.

[0204] In the light-emitting area of ​​the third light-emitting unit, along the thickness direction of the substrate 1, the distance between the side of the first electrode 4 of the third light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1 is the third microcavity distance, and the third microcavity distance is an N-order microcavity distance, where N is an integer greater than M.

[0205] For example, M can be 1 or 2, and N can be 2 or 3, etc.

[0206] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0207] In some embodiments, see again Figure 8c The light-emitting layer 5 of the first light-emitting unit overlaps the isolation structure 3 , and the light-emitting layer 5 of the third light-emitting unit is spaced apart from the isolation structure 3 .

[0208] By setting the first microcavity distance to be smaller than the third microcavity distance, the thickness of at least part of the film layer between the first electrode and the second electrode of the first light-emitting unit can be reduced, so that the impedance of at least part of the film layer between the first electrode and the second electrode of the first light-emitting unit is increased, and the lateral leakage caused by the overlap of at least part of the film layer between the first electrode and the second electrode of the first light-emitting unit and the isolation structure is reduced, and / or, the hole transport layer of the first light-emitting unit is not easily overlapped with the isolation structure, thereby improving the problem of lateral crosstalk between adjacent light-emitting units.

[0209] In this embodiment, because the first microcavity distance of the first light-emitting unit is less than the third microcavity distance, the hole transport layer of the first light-emitting unit is thinner, the impedance of the hole transport layer of the first light-emitting unit is increased, and / or the hole transport layer of the first light-emitting unit is not easily overlapped with the isolation structure, and the problem of lateral leakage between the first light-emitting unit and the adjacent light-emitting unit is not easily generated. Even if the light-emitting layer 5 of the first light-emitting unit overlaps with the isolation structure 3, the problem of lateral leakage between the first light-emitting unit and the adjacent light-emitting unit can be improved. The second light-emitting unit is the same as the first light-emitting unit and will not be described in detail here.

[0210] By controlling the evaporation angle of the light-emitting layer 5 of the third light-emitting unit, the light-emitting layer 5 of the third light-emitting unit can be prevented from overlapping with the isolation structure 3. Therefore, lateral leakage is less likely to occur between the third light-emitting unit and adjacent light-emitting units.

[0211] In other embodiments, please refer again to Figure 8c The overlapping length W1 between the light-emitting layer 5 of the first light-emitting unit and the isolation structure 3 is greater than the overlapping length W2 between the light-emitting layer 5 of the third light-emitting unit and the isolation structure 3 .

[0212] In this embodiment, because the first microcavity distance of the first light-emitting unit is less than the third microcavity distance, the hole transport layer of the first light-emitting unit is thinner, the impedance of the hole transport layer of the first light-emitting unit is increased, and / or the hole transport layer of the first light-emitting unit is not easily overlapped with the isolation structure 3. Even if the light-emitting layer 5 of the first light-emitting unit overlaps the isolation structure 3, the problem of lateral leakage between the first light-emitting unit and the adjacent light-emitting unit can be improved. The second light-emitting unit is the same as the first light-emitting unit and will not be described again here.

[0213] The overlap length between the light-emitting layer 5 of the third light-emitting unit and the isolation structure 3 is shorter than that between the light-emitting layer 5 of the first light-emitting unit and the isolation structure 3. Therefore, this embodiment can also improve the problem of lateral leakage between the third light-emitting unit and the adjacent light-emitting unit.

[0214] In summary, this embodiment can greatly improve the lateral leakage problem of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit.

[0215] In other embodiments, the overlapping length between the hole transport layer of the first light-emitting unit and the isolation structure 3 is greater than the overlapping length between the hole transport layer of the third light-emitting unit and the isolation structure 3 .

[0216] In other embodiments, the overlapping length between the hole blocking layer of the first light emitting unit and the isolation structure 3 is greater than the overlapping length between the hole blocking layer of the third light emitting unit and the isolation structure 3 .

[0217] In other embodiments, the overlapping length between the light-emitting layer 5 of the second light-emitting unit and the isolation structure 3 is greater than the overlapping length between the light-emitting layer 5 of the third light-emitting unit and the isolation structure 3 .

[0218] In other embodiments, the overlapping length between the hole transport layer of the second light emitting unit and the isolation structure 3 is greater than the overlapping length between the hole transport layer of the third light emitting unit and the isolation structure 3 .

[0219] In other embodiments, the overlapping length between the hole blocking layer of the second light emitting unit and the isolation structure 3 is greater than the overlapping length between the hole blocking layer of the third light emitting unit and the isolation structure 3 .

[0220] The remaining technical solutions of the display panel in this embodiment are the same as those in the above-mentioned embodiments, and will not be described again here.

[0221] For some possible implementations, see Figure 2 The present application also provides a display panel, which includes a substrate 1, an isolation structure 3 and a plurality of light-emitting units 7.

[0222] The isolation structure 3 is located on one side of the substrate 1 , and the isolation structure 3 encloses a plurality of isolation openings 8 .

[0223] At least a portion of the light-emitting unit 7 is located within the isolation opening 8. The light-emitting unit 7 includes a hole transport layer 9. The multiple light-emitting units 7 include a first light-emitting unit. Along the thickness direction Z of the substrate 1, the thickness H1 of the hole transport layer 9 of the first light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å.

[0224] In the related art, the thickness of the hole transport layer 9 of the first light-emitting unit is greater than or equal to 1100Å and less than or equal to 1300Å. For example, it can be 1100Å, 1200Å or 1300Å, etc. The hole transport layer 9 of the first light-emitting unit is relatively thick, which makes it easy for the hole transport layer 9 of the first light-emitting unit to overlap with the isolation structure 3, thereby causing lateral crosstalk between adjacent light-emitting units 7.

[0225] In this embodiment, the thickness H1 of the hole transport layer 9 of the first light-emitting unit is set to be greater than or equal to 50Å and less than or equal to 100Å. The thickness H1 can be 50Å, 60Å, 70Å, 80Å, 90Å, or 100Å. In this way, the thickness of the hole transport layer 9 of the first light-emitting unit can be reduced, making it less likely for the hole transport layer 9 of the first light-emitting unit to overlap with the isolation structure 3. The problem of lateral leakage between adjacent light-emitting units 7 is less likely to occur, thereby improving the problem of lateral crosstalk between adjacent light-emitting units 7 and further improving the display effect of the display panel.

[0226] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0227] The remaining technical solutions of the display panel in this embodiment are the same as those in the above-mentioned embodiments, and will not be described again here.

[0228] For some possible implementations, see Figure 9 and Figure 10 The present application also provides a method for manufacturing a display panel, which can be used to manufacture the display panel in the above embodiment. The method includes:

[0229] S10: providing a substrate 1.

[0230] S11 : forming an isolation structure 3 on one side of the substrate 1 , wherein the isolation structure 3 encloses a plurality of isolation openings 8 , and the plurality of isolation openings 8 include a first isolation opening 81 .

[0231] S12: A first light-emitting unit is formed in the first isolation opening 81, and the first light-emitting unit includes a first electrode 4, a light-emitting layer 5, and a second electrode 6 that are stacked in sequence along a direction away from the substrate 1. In the light-emitting area of ​​the first light-emitting unit, along the thickness direction Z of the substrate 1, the distance between the side of the first electrode 4 of the first light-emitting unit away from the substrate 1 and the side of the second electrode 6 close to the substrate 1 is a first microcavity distance D1, and the first microcavity distance is a first-order microcavity distance.

[0232] Optionally, the first microcavity distance D1 is equal to half of the wavelength of light emitted by the light-emitting layer 5 of the first light-emitting unit.

[0233] In the display panel formed by the above method, the first microcavity distance D1 is equal to half the wavelength of the light emitted by the light-emitting layer 5 of the first light-emitting unit, that is, the microcavity of the first light-emitting unit is set as a first-order microcavity, wherein the light emission color of the first light-emitting unit can be red. In this way, the thickness of the hole transport layer 9 of the first light-emitting unit can be reduced, making it less likely for the hole transport layer 9 of the first light-emitting unit to overlap with the isolation structure 3, and thus less likely to cause lateral leakage between adjacent light-emitting units 7. This can improve the problem of lateral crosstalk between adjacent light-emitting units 7, and further enhance the display effect of the display panel.

[0234] This embodiment can be combined with some or all of the features of the above embodiments, which will not be described in detail here.

[0235] In some possible implementations, the plurality of isolation openings 8 further include a second isolation opening 82 and a third isolation opening 83 ; and after the step of forming the first light-emitting unit in the first isolation opening 81 , the following steps are further included:

[0236] See Figure 11 A second light-emitting unit is formed in the second isolation opening 82. The second light-emitting unit includes a first electrode 4, a light-emitting layer 5, and a second electrode 6 stacked in sequence in a direction away from the substrate 1. The distance between a side of the first electrode 4 of the second light-emitting unit away from the substrate 1 and a side of the second electrode 6 close to the substrate 1 is a second microcavity distance D2. The second microcavity distance is a first-order microcavity distance.

[0237] Optionally, the second microcavity distance D2 is equal to half of the wavelength of light emitted by the light-emitting layer 5 of the second light-emitting unit.

[0238] In the display panel formed by the above method, the second microcavity distance D2 is equal to half the wavelength of the light emitted by the light-emitting layer 5 of the second light-emitting unit, that is, the microcavity of the second light-emitting unit is set as a first-order microcavity, wherein the light emission color of the second light-emitting unit can be green. In this way, the thickness of the hole transport layer 9 of the second light-emitting unit can be reduced, making it less likely for the hole transport layer 9 of the second light-emitting unit to overlap with the isolation structure 3, and thus less likely to cause lateral leakage between adjacent light-emitting units 7. This can improve the problem of lateral crosstalk between adjacent light-emitting units 7, and further enhance the display effect of the display panel.

[0239] See Figure 12 The hole transport material layer 17 of the third light emitting unit is formed by the first evaporation angle, so that the hole transport material layer 17 of the third light emitting unit located in the third isolation opening 83 is spaced apart from the isolation structure 3 .

[0240] The light emitting color of the third light emitting unit may be blue. The film thickness of the third light emitting unit is relatively thin. Therefore, the microcavity of the third light emitting unit is usually set to be a second-order microcavity.

[0241] In order to prevent the hole transport layer 9 of the third light-emitting unit from overlapping with the isolation structure 3, in this embodiment, when forming the hole transport material layer 17, the first evaporation angle of the hole transport material layer 17 can be controlled. For example, the first evaporation angle can be set to 10°, 15° or 20°, so that the hole transport material layer 17 located in the third isolation opening 83 does not overlap with the isolation structure 3, and the hole transport layer 9 finally formed does not overlap with the isolation structure 3, thereby improving the problem of lateral crosstalk between adjacent light-emitting units 7.

[0242] See Figure 13 The light-emitting material layer 18 of the third light-emitting unit is formed by the second evaporation angle, so that the light-emitting material layer 18 of the third light-emitting unit located in the third isolation opening 83 is spaced apart from the isolation structure 3 .

[0243] In order to prevent the light-emitting layer 5 of the third light-emitting unit from overlapping with the isolation structure 3, in this embodiment, when forming the light-emitting material layer 18, the second evaporation angle of the light-emitting material layer 18 can be controlled. For example, the second evaporation angle can be set to 10°, 15° or 20°, so that the light-emitting material layer 18 located in the third isolation opening 83 does not overlap with the isolation structure 3, and the light-emitting layer 5 finally formed does not overlap with the isolation structure 3, thereby improving the problem of lateral crosstalk between adjacent light-emitting units 7.

[0244] See Figure 14 The second electrode material layer 19 on the side of the light-emitting material layer 18 away from the substrate 1 is formed so that the second electrode material layer 19 of the third light-emitting unit located in the third isolation opening 83 overlaps with the isolation structure 3 .

[0245] The remaining material layers of the third light-emitting unit, such as the second electrode material layer, are continuously evaporated in the third isolation opening 83 .

[0246] Please see again Figure 7 The second electrode material layer 19, the light-emitting material layer 18 and the hole transport material layer 17 of the third light-emitting unit are patterned to form the second electrode 6, the light-emitting layer 5 and the hole transport layer 9 of the third light-emitting unit respectively.

[0247] In the display panel formed by the above method, the hole transport layers 9 of the first light-emitting unit, the second light-emitting unit and the third light-emitting unit are not easily overlapped with the corresponding isolation structure 3, so that lateral leakage is not easily generated between adjacent light-emitting units 7, thereby improving the display effect of the display panel formed by the above method.

[0248] In some possible implementations, the present application further provides an electronic device, comprising the display panel of the present application, or comprising a display panel produced by the method for producing a display panel of the present application. The electronic device may include a device with image processing capabilities, such as a server, a personal computer, a laptop computer, a mobile phone, a tablet computer, a wearable device, an in-vehicle display device, etc. Because the electronic device includes the display panel of the present application, the display effect of the electronic device is improved.

[0249] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0250] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A display panel, characterized in that: The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a plurality of light-emitting units, wherein at least a portion of each light-emitting unit is located within the isolation opening, the light-emitting unit comprising a first electrode, a light-emitting layer, and a second electrode sequentially stacked in a direction away from the substrate, the plurality of light-emitting units comprising a first light-emitting unit and a third light-emitting unit; the light-emitting layer of the first light-emitting unit overlaps the isolation structure, and the light-emitting layer of the third light-emitting unit is spaced apart from the isolation structure; or, the overlap length of the light-emitting layer of the first light-emitting unit and the isolation structure is greater than the overlap length of the light-emitting layer of the third light-emitting unit and the isolation structure; Among them, in the light-emitting area of ​​the first light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the first light-emitting unit away from the substrate and the side of the second electrode close to the substrate is the first microcavity distance, and the first microcavity distance is a first-order microcavity distance.

2. The display panel according to claim 1, wherein: The first microcavity distance is equal to half of the wavelength of light emitted by the light-emitting layer of the first light-emitting unit.

3. The display panel according to claim 1, wherein: The light-emitting unit further includes a hole transport layer located between the first electrode and the light-emitting layer. Along the thickness direction of the substrate, the thickness of the hole transport layer of the first light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å.

4. The display panel according to claim 1, wherein: The light-emitting unit further includes a hole transport layer located between the first electrode and the light-emitting layer, and the hole transport layer of the first light-emitting unit is overlapped with or spaced from the isolation structure; The orthographic projection of the hole transport layer of the first light-emitting unit on the substrate overlaps with the orthographic projection of the side of the isolation structure close to the substrate on the substrate; or, the orthographic projection of the hole transport layer of the first light-emitting unit on the substrate is outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate; And / or, the orthographic projection of the light-emitting layer of the first light-emitting unit on the substrate overlaps with the orthographic projection of a side of the isolation structure close to the substrate on the substrate; And / or, the light emitting color of the first light emitting unit includes red.

5. The display panel according to claim 1, wherein: The plurality of light emitting units include a second light emitting unit; In the light-emitting area of ​​the second light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the second light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a second microcavity distance, and the second microcavity distance is a first-order microcavity distance; The second microcavity distance is equal to half of the wavelength of light emitted by the light-emitting layer of the second light-emitting unit; The first light emitting unit and the second light emitting unit emit different colors; The light emitting color of the second light emitting unit includes green.

6. The display panel according to claim 5, wherein: The light-emitting unit further includes a hole transport layer located between the first electrode and the light-emitting layer. Along the thickness direction of the substrate, the thickness of the hole transport layer of the second light-emitting unit is greater than or equal to 50Å and less than or equal to 100Å.

7. The display panel according to claim 5, wherein: The hole transport layer of the second light-emitting unit is overlapped with or spaced from the isolation structure; The orthographic projection of the hole transport layer of the second light-emitting unit on the substrate overlaps with the orthographic projection of a side of the isolation structure close to the substrate on the substrate; Alternatively, the orthographic projection of the hole transport layer of the second light-emitting unit on the substrate is located outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate.

8. The display panel according to claim 5, wherein: The light-emitting layer of the second light-emitting unit is overlapped with or spaced from the isolation structure; The orthographic projection of the light-emitting layer of the second light-emitting unit on the substrate overlaps with the orthographic projection of the side of the isolation structure close to the substrate on the substrate; or the orthographic projection of the light-emitting layer of the second light-emitting unit on the substrate is located outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate; And / or, the thickness of the hole transport layer of the second light-emitting unit is equal to the thickness of the hole transport layer of the first light-emitting unit.

9. The display panel according to claim 1, wherein: In the light-emitting area of ​​the third light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the third light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a third microcavity distance, and the third microcavity distance is an N-order microcavity distance, where N is an integer greater than or equal to 2; The third microcavity distance is equal to N times half of the wavelength of light emitted by the light-emitting layer of the third light-emitting unit.

10. The display panel according to claim 9, wherein: The third microcavity distance is equal to the wavelength of light emitted by the light-emitting layer of the third light-emitting unit; And / or, the light-emitting unit further includes a hole transport layer located between the first electrode and the light-emitting layer, and the hole transport layer of the third light-emitting unit is spaced apart from the isolation structure; The orthographic projection of the hole transport layer of the third light-emitting unit on the substrate is located outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate; And / or, the light-emitting layer of the third light-emitting unit is spaced apart from the isolation structure; The orthographic projection of the light-emitting layer of the third light-emitting unit on the substrate is located outside the orthographic projection of the side of the isolation structure close to the substrate on the substrate; The thickness of the hole transport layer of the third light-emitting unit is greater than the thickness of the hole transport layer of the first light-emitting unit; And / or, the light-emitting unit further includes a hole blocking layer located between the light-emitting layer and the second electrode; The thickness of the hole blocking layer of the third light-emitting unit is smaller than the thickness of the hole blocking layer of the first light-emitting unit; And / or, the light emitting color of the third light emitting unit includes blue.

11. The display panel according to claim 1, wherein The light emitting unit further includes a first auxiliary layer located between the light emitting layer and the second electrode; The orthographic projection of the light-emitting layer on the substrate is located within the orthographic projection of the first auxiliary layer on the substrate; The orthographic projection area of ​​the light-emitting layer on the substrate is smaller than the orthographic projection area of ​​the first auxiliary layer on the substrate; And / or, the light-emitting unit further includes a second auxiliary layer located between the light-emitting layer and the first electrode; The orthographic projection of the second auxiliary layer on the substrate is located within the orthographic projection of the light-emitting layer on the substrate; the orthographic projection area of ​​the second auxiliary layer on the substrate is smaller than the orthographic projection area of ​​the light-emitting layer on the substrate; And / or, the first auxiliary layer includes a hole blocking layer located between the light-emitting layer and the second electrode, and the second auxiliary layer includes a hole transport layer located between the first electrode and the light-emitting layer; The orthographic projection of the light-emitting layer on the substrate is located within the orthographic projection of the hole blocking layer on the substrate; The orthographic projection area of ​​the light-emitting layer on the substrate is smaller than the orthographic projection area of ​​the hole blocking layer on the substrate; The orthographic projection of the hole transport layer on the substrate is located within the orthographic projection of the light-emitting layer on the substrate; The orthographic projection area of ​​the hole transport layer on the substrate is smaller than the orthographic projection area of ​​the light emitting layer on the substrate; The orthographic projection of the hole transport layer on the substrate is located within the orthographic projection of the hole blocking layer on the substrate; The orthographic projection area of ​​the hole transport layer on the substrate is smaller than the orthographic projection area of ​​the hole blocking layer on the substrate; Along the thickness direction of the substrate, the thickness of the hole blocking layer is greater than or equal to 100Å and less than or equal to 200Å.

12. The display panel according to claim 11, wherein: The light emitting unit further includes an electron transport layer located between the hole blocking layer and the second electrode and an electron injection layer located between the electron transport layer and the second electrode; The light emitting unit further includes a hole injection layer located between the hole transport layer and the first electrode.

13. The display panel according to any one of claims 1 to 12, wherein: The display panel further includes: a plurality of packaging units, each of the packaging units being located on a side of the corresponding light-emitting unit away from the substrate; The portion of the packaging unit extends from a side of the isolation structure toward the isolation opening to a side of the isolation structure away from the substrate; The plurality of packaging units corresponding to the plurality of light-emitting units are arranged at intervals; A gap is formed between the packaging unit located on a side of the isolation structure away from the substrate and the side of the isolation structure away from the substrate; The display panel further includes a second encapsulation layer located on a side of the encapsulation unit away from the substrate, and a third encapsulation layer located on a side of the second encapsulation layer away from the substrate; The materials of the encapsulation unit and the third encapsulation layer both include inorganic materials; The material of the second encapsulation layer includes organic material.

14. The display panel according to any one of claims 1 to 12, wherein: The isolation structure includes a first isolation portion and a second isolation portion stacked in sequence in a direction away from the substrate, wherein the orthographic projection of a side of the first isolation portion away from the substrate on the substrate is located within the orthographic projection of the second isolation portion on the substrate; The isolation structure includes a conductive material, and the second electrode is electrically connected to the first isolation portion; The display panel further includes a pixel defining layer located between the first electrode and the isolation structure, wherein the pixel defining layer defines a plurality of pixel openings, the pixel openings being connected to the corresponding isolation openings, and the pixel openings exposing a portion of the first electrode; And / or, the isolation structure further includes a third isolation portion located on a side of the first isolation portion facing the substrate, and the second electrode is electrically connected to the third isolation portion.

15. A display panel, characterized in that: The display panel includes: substrate; An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings; a plurality of light-emitting units, wherein at least a portion of each light-emitting unit is located within the isolation opening, the light-emitting unit comprising a first electrode, a light-emitting layer, and a second electrode sequentially stacked in a direction away from the substrate, the plurality of light-emitting units comprising a first light-emitting unit and a third light-emitting unit; the light-emitting layer of the first light-emitting unit overlaps the isolation structure, and the light-emitting layer of the third light-emitting unit is spaced apart from the isolation structure; or, the overlap length of the light-emitting layer of the first light-emitting unit and the isolation structure is greater than the overlap length of the light-emitting layer of the third light-emitting unit and the isolation structure; Wherein, in the light-emitting area of ​​the first light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the first light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a first microcavity distance, and the first microcavity distance is an M-order microcavity distance, where M is an integer greater than 1; In the light-emitting area of ​​the third light-emitting unit, along the thickness direction of the substrate, the distance between the side of the first electrode of the third light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a third microcavity distance, and the third microcavity distance is an N-order microcavity distance, where N is an integer greater than M.

16. A method for preparing a display panel, characterized in that: The method comprises: providing a substrate; An isolation structure is formed on one side of the substrate, wherein the isolation structure encloses a plurality of isolation openings, wherein the plurality of isolation openings include a first isolation opening and a third isolation opening; At least a portion of a first light-emitting unit is formed within the first isolation opening, the first light-emitting unit comprising a first electrode, a light-emitting layer, and a second electrode sequentially stacked in a direction away from the substrate, wherein in a light-emitting region of the first light-emitting unit, along the thickness direction of the substrate, a distance between a side of the first electrode of the first light-emitting unit away from the substrate and a side of the second electrode close to the substrate is a first microcavity distance, and the first microcavity distance is a first-order microcavity distance. At least a portion of a third light-emitting unit is formed in the third isolation opening, the light-emitting layer of the first light-emitting unit overlaps the isolation structure, and the light-emitting layer of the third light-emitting unit is spaced apart from the isolation structure; or, the overlapping length of the light-emitting layer of the first light-emitting unit and the isolation structure is greater than the overlapping length of the light-emitting layer of the third light-emitting unit and the isolation structure.

17. The method for manufacturing a display panel according to claim 16, wherein: The plurality of isolation openings further includes a second isolation opening; and after the step of forming at least a portion of the first light emitting unit in the first isolation opening, the method further includes: forming at least a portion of a second light-emitting unit within the second isolation opening, the second light-emitting unit comprising a first electrode, a light-emitting layer, and a second electrode sequentially stacked in a direction away from the substrate, wherein along the thickness direction of the substrate, a distance between a side of the first electrode of the second light-emitting unit away from the substrate and a side of the second electrode close to the substrate is a second microcavity distance, and the second microcavity distance is a first-order microcavity distance; And / or, after the step of forming at least a portion of the second light emitting unit in the second isolation opening, the method further includes: forming a hole transport material layer at a first evaporation angle, so that the hole transport material layer of the third light-emitting unit located in the third isolation opening is spaced apart from the isolation structure; forming a light-emitting material layer at a second evaporation angle, so that the light-emitting material layer of the third light-emitting unit located in the third isolation opening is spaced apart from the isolation structure; forming a second electrode material layer on a side of the light-emitting material layer away from the substrate, so that the second electrode material layer of the third light-emitting unit located in the third isolation opening overlaps the isolation structure; performing patterning on the second electrode material layer, the light-emitting material layer, and the hole transport material layer to form a second electrode, a light-emitting layer, and a hole transport layer of a third light-emitting unit, respectively; The first microcavity distance is equal to half of the wavelength of light emitted by the light-emitting layer of the first light-emitting unit; The second microcavity distance is equal to half of the wavelength of light emitted by the light-emitting layer of the second light-emitting unit; The distance between the side of the first electrode of the third light-emitting unit away from the substrate and the side of the second electrode close to the substrate is a third microcavity distance, which is equal to the wavelength of light emitted by the light-emitting layer of the third light-emitting unit.

18. An electronic device, characterized in that: The electronic device includes the display panel according to any one of claims 1 to 15, or includes a display panel manufactured by the method for manufacturing a display panel according to claim 16 or 17.

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