Display device and apparatus using same

Abstract

The invention relates to a display device and an apparatus using the same. In a display device, a display area and a peripheral area disposed in the vicinity of the display area are disposed on a substrate. The display region includes, in order from the substrate side, at least a metal layer, an insulating layer, a lower electrode, a light emitting layer, and an upper electrode. The peripheral region includes at least a peripheral metal layer and a peripheral insulating layer in this order from the substrate side. In a plan view with respect to the substrate, a first region that isolates the metal layer from the peripheral metal layer is disposed between the metal layer and the peripheral metal layer. In a cross-section passing through the substrate, the display area, and the peripheral area, a width of the first area is less than or equal to twice a film thickness of the peripheral insulating layer.

Description

Technical Field

[0001] The present disclosure relates to a display device and an apparatus using the display device. Background Art

[0002] Some recent organic electroluminescence (EL) elements (hereinafter also referred to as “organic EL elements”, “organic light-emitting elements”, “display devices” or “organic devices”) have an optical resonator structure. In an organic device having an optical resonator structure, light emitted from the organic device passes through an anode, and the transmitted light is reflected by a reflective layer. The light emitted from the organic device and the reflected light interfere with each other and reinforce each other, thereby enhancing the light-emitting efficiency of the organic device. Japanese Patent Application Laid-Open No. 2021-72282 (Patent Document 1) discusses a display device having an optical resonator structure.

[0003] Patent Document 1 does not discuss the layout of the reflective layer related to the region between the display region and the peripheral region in the display device. Therefore, in the region between the display region and the peripheral region, the upper electrode film tends to become thin. In other words, in the display device discussed in Patent Document 1, the resistance of the upper electrode tends to increase. Summary of the Invention

[0004] In view of the above, the present disclosure has been completed, and an object of the present disclosure is to reduce an increase in the resistance of the upper electrode.

[0005] According to some embodiments, a display device includes a substrate, a display region on the substrate, and a peripheral region near the display region on the substrate, wherein the display region includes at least, in order from the substrate side, a metal layer, an insulating layer, a lower electrode, a light-emitting layer, and an upper electrode, wherein the peripheral region includes at least, in order from the substrate side, a peripheral metal layer and a peripheral insulating layer, wherein in a plan view with respect to the substrate, a first region that isolates the metal layer from the peripheral metal layer is disposed between the metal layer and the peripheral metal layer, and wherein in a cross section passing through the substrate, the display region, and the peripheral region, the width of the first region is less than or equal to twice the film thickness of the peripheral insulating layer.

[0006] Other features of the present disclosure will become apparent from the following description of exemplary embodiments with reference to the drawings. Brief Description of the Drawings

[0007] Figure 1A and Figure 1B are each a plan view illustrating a display device according to a first exemplary embodiment.

[0008] Figure 2A and Figure 2B are each a cross-sectional view illustrating a display device according to a first exemplary embodiment.

[0009] Figures 3A to 3CThese are all plan views showing a display device according to a second exemplary embodiment.

[0010] Figures 4A to 4D These are all plan views showing a display device according to a third exemplary embodiment.

[0011] Figure 5 This is a schematic diagram showing an example of a display device according to an exemplary embodiment of the present invention.

[0012] Figure 6A This is a schematic diagram showing an example of a camera device according to an exemplary embodiment of the present invention, Figure 6B This is a schematic diagram showing an example of an electronic device according to an exemplary embodiment of the present invention.

[0013] Figure 7A This is a schematic diagram showing an example of a display device according to an exemplary embodiment of the present invention, Figure 7B This is a schematic diagram showing an example of a foldable display device.

[0014] Figure 8A This is a schematic diagram showing an example of a lighting device according to an exemplary embodiment of the present invention, Figure 8B This is a schematic diagram showing an example of an automobile including a vehicle lamp according to an exemplary embodiment of the present invention.

[0015] Figure 9A This is a schematic diagram showing an example of a wearable device according to an exemplary embodiment of the present invention, Figure 9B This is a schematic diagram showing a structural example of a wearable device including a camera device according to an exemplary embodiment of the present invention.

[0016] Figure 10A This is a schematic diagram showing an example of an image forming device according to an exemplary embodiment of the present invention, Figure 10B This is a schematic diagram showing an example of an exposure light source of an image forming device according to an exemplary embodiment of the present invention, Figure 10C This is a schematic diagram showing an example of an exposure light source of an image forming device according to an exemplary embodiment of the present invention. Detailed Description of the Invention

[0017] Hereinafter, various exemplary embodiments, features, and aspects of the present invention will be described in detail with reference to the accompanying drawings. The following exemplary embodiments are not intended to limit the scope of the claimed invention. Although multiple features are illustrated in the exemplary embodiments, not all features are essential to the present invention, and these features may be combined in any manner. In addition, in the drawings, the same or similar configurations are given the same reference numerals, and redundant descriptions thereof are omitted.

[0018] In this specification, a specific one of the plurality of pixels 201 is referred to as, for example, pixel 201 "r" with a suffix added to the reference numeral. A pixel that can be any of the pixels 201 is simply referred to as pixel "201". This also applies to other components.

[0019] Reference will be made to Figures 1A to 2B describe a display device according to a first exemplary embodiment. Figure 1A is a plan view of a display device according to a first exemplary embodiment, Figure 1B illustrating a modified example of a display device according to a first exemplary embodiment. Figure 2A is along Figure 1A and Figure 1B a cross-sectional view of the display device taken along line A-A' shown. Figure 2B is a cross-sectional view illustrating a modified example of a display device according to a first exemplary embodiment.

[0020] A display device according to a first exemplary embodiment has a display area DA on a substrate and a peripheral area PA disposed near the display area DA. Each pixel 201 disposed in the display area DA includes a light-emitting element. The light-emitting element can be an organic light-emitting element or an inorganic light-emitting element. The following exemplary embodiment illustrates an example in which the light-emitting element included in each pixel 201 is an organic light-emitting element. Each pixel 201 disposed in the peripheral area PA may also include a light-emitting element or an organic light-emitting element.

[0021] As Figure 1A shown, the display area DA includes a first pixel 201r and a second pixel 201g. The first pixel 201r and the second pixel 201g may emit light of the same color or different colors. The display area DA may further include a third pixel 201b, and the third pixel 201b may emit light of the same color as the light emitted by the first pixel 201r or light of a different color from the light emitted by the first pixel 201r. The third pixel 201b may emit light of the same color as the light emitted by the second pixel 201g or light of a different color from the light emitted by the second pixel 201g. If the first pixel 201r, the second pixel 201g, and the third pixel 201b emit light of the same color, they may emit white light, for example.

[0022] If the first pixel 201r, the second pixel 201g, and the third pixel 201b emit light of different colors, the first pixel 201r, the second pixel 201g, and the third pixel 201b may emit red light, green light, and blue light, respectively.

[0023] In the present specification, the display area DA represents an area in which pixels 201 each including a light-emitting element contributing to light emission are arranged, and the peripheral area PA represents an area in which pixels 201 each including a light-emitting element not contributing to light emission are arranged. Specifically, the peripheral area PA can be regarded as an area superimposed on the peripheral circuit portion in a plan view with respect to the substrate.

[0024] Although Figure 1A a configuration example in which the pixels 201 are arranged in a delta arrangement is illustrated, the arrangement of the pixels 201 is not limited to this example. The pixels 201 can be arranged in a stripe arrangement, a Bayer arrangement, a square arrangement, or a PenTile arrangement.

[0025] In the display device according to the present exemplary embodiment, a metal layer 506 is arranged in the display area DA, and a peripheral metal layer 503 is arranged in the peripheral area PA. The metal layer 506 that can reflect light from the light-emitting elements included in the display area DA can also be referred to as a reflective layer. In a plan view with respect to the substrate 100, a first area 601 that isolates the metal layer 506 from the peripheral metal layer 503 is arranged between the display area DA and the peripheral area PA. As Figure 1A shown, the first area 601 can be arranged on the pixel 201 closest to the peripheral area PA among the pixels 201 configured in the pixel area DA, or as Figure 1B shown, it can be arranged along the pixel 201 closest to the peripheral area PA among the pixels 201 configured in the pixel area DA.

[0026] Although Figure 1A an example in which the peripheral metal layer 503 arranged in the peripheral area PA is rectangular is illustrated, the shape of the peripheral metal layer is not limited to this example. A pixel arrangement similar to the pixel arrangement in the display area DA is applicable, or a pixel arrangement different from the pixel arrangement in the display area DA is also applicable.

[0027] Reference will be made to Figure 2A and Figure 2B for a more detailed description of the display device according to the present exemplary embodiment. Figure 2B Different from Figure 2A is that the metal layer 506 includes an area 600, and the metal layer 506 electrically connected to the lower electrode 120 is isolated from the metal layer 506 not electrically connected to the lower electrode 120.

[0028] In the display area DA, each pixel 201 includes at least a metal layer 506, an insulating layer 110, a lower electrode 120, a light-emitting layer 140, and an upper electrode 150 in this order from the substrate 100 side.

[0029] The peripheral area PA includes at least a peripheral metal layer 503 and a peripheral insulating layer 118 in this order from the substrate 100 side.

[0030] In the display device according to the exemplary embodiment, a driving circuit layer 102 and an interlayer insulating layer 104 are disposed on a substrate 100.

[0031] The substrate 100 may be a semiconductor substrate, such as a silicon substrate or a resin substrate. The substrate 100 may include a metal oxide semiconductor (MOS) transistor for driving a light-emitting element and an element isolation region (e.g., shallow trench isolation [STI]). The MOS transistor includes a gate electrode and source and drain regions.

[0032] The driving circuit layer 102 is provided with an interlayer insulating layer 104, and a wiring layer is provided in the interlayer insulating layer 104. The interlayer insulating layer 104 may be provided with conductive plugs for connecting the wiring layer and the MOS transistors included in the substrate 100 to each other. Any conductive plug that can electrically connect the wiring layer to the MOS transistors included in the substrate 100 may be used. Specifically, a conductive material such as tungsten (W) may be used. The conductive plugs may include barrier metals, such as titanium (Ti), titanium nitride (TiN), or Ti / TiN. The wiring layer may be formed of AlCu and may include barrier metals, such as Ti, TiN, or Ti / TiN.

[0033] The interlayer insulating layer 104 included in the driving circuit layer 102 may desirably be a silicon oxide, silicon oxynitride, silicon nitride, or borophosphosilicate glass (BPSG) film. The interlayer insulating layer 104 may be formed by, for example, a chemical vapor deposition (CVD) method, a thermal CVD method, or a plasma CVD method.

[0034] The interlayer insulating layer 104 includes conductive plugs for connecting the driving circuit layer 102 and the metal layer 506 to each other. Specifically, the wiring layer disposed in the driving circuit layer 102 is connected to the metal layer 506. The interlayer insulating layer 104 may be provided with conductive plugs for connecting the driving circuit layer 102 and the peripheral metal layer 503 to each other. Specifically, the wiring layer disposed in the driving circuit layer 102 is connected to the peripheral metal layer 503. Any conductive plug that can electrically connect the wiring layer to the metal layer 506 or electrically connect the wiring layer to the peripheral metal layer 503 may be used. Specifically, the above-mentioned conductive materials may be used. The conductive plugs may include the above-mentioned barrier metals.

[0035] The interlayer insulating layer 104 may desirably be a silicon oxide, silicon oxynitride, silicon nitride, or BPSG film. The interlayer insulating layer 104 may be formed by, for example, a CVD method, a thermal CVD method, or a plasma CVD method.

[0036] The peripheral metal layer 503 includes at least a first metal layer 501. Appropriately, the peripheral metal layer 503 may further include a first layer 502 different from the first metal layer 501. As long as the first metal layer 501 can reflect light, there is no particular limitation on the first metal layer 501, but desirably it may have a reflectivity of 80% or more. Specifically, metal materials such as aluminum (Al), silver (Ag), platinum (Pt), nickel (Ni), or Ti, and alloys obtained by adding silicon (Si), copper (Cu), Ni, neodymium (Nd), or Ti to the metal materials. The first metal layer 501 desirably may be made of Al or an Al-containing alloy because the first metal layer 501 can be more finely patterned. As long as the first layer 502 can prevent light reflection, there is no particular limitation on the first layer 502. Specifically, Ti, TiN, Ti / TiN, etc. may be used. In other words, the reflectivity of the first metal layer 501 desirably may be higher than that of the first layer 502. The first metal layer 501 may be in contact with the first layer 502. The first metal layer 501 may be closer to the substrate 100 than the first layer 502. The peripheral metal layer 503 may further include the first layer 502 between the first metal layer 501 and the interlayer insulating layer 104.

[0037] The metal layer 506 includes at least a second metal layer 504. Appropriately, the metal layer 506 may further include a second layer 505 different from the second metal layer 504. As long as the second metal layer 504 can reflect light, there is no particular limitation on the second metal layer 504, and preferably it may have a reflectivity of 80% or more. Specifically, the above materials may be used. The second metal layer 504 desirably may be made of Al or an Al-containing alloy. This is because the second metal layer 504 can be more finely patterned. As long as the second layer 505 can prevent light reflection, there is no particular limitation on the second layer 505. Specifically, the above materials may be used. In other words, the reflectivity of the second metal layer 504 desirably may be higher than that of the second layer 505. The second metal layer 504 may be in contact with the second layer 505. The second metal layer 504 may be closer to the substrate 100 than the second layer 505.

[0038] The metal layer 506 may further include the second layer 505 between the second metal layer 504 and the interlayer insulating layer 104.

[0039] If the metal layer 506 includes the second layer 505, the metal layer 506 includes a region where the second layer 505 is not arranged so that the second metal layer 504 is exposed. In a plan view with respect to the substrate 100, the region where the second layer 505 is not arranged overlaps with the region where the insulator portion 130 (described below) is not arranged.

[0040] The peripheral metal layer 503 and the metal layer 506 desirably may be arranged in the same layer. Specifically, the peripheral metal layer 503 and the metal layer 506 desirably may be arranged on the interlayer insulating layer 104. It is also desirable to arrange the peripheral metal layer 503 and the metal layer 506 in contact with the interlayer insulating layer 104. With this configuration, the peripheral metal layer 503 and the metal layer 506 can be formed simultaneously, which is desirable from a processing perspective.

[0041] From a processing perspective, the first metal layer 501 and the second metal layer 504 desirably may be made of the same material. If the peripheral metal layer 503 and the metal layer 506 further include the first layer 502 and the second layer 505, the first layer 502 and the second layer 505 desirably may be made of the same material.

[0042] The insulating layer 110 is arranged on the metal layer 506 and is made of a material through which light emitted by the light-emitting element can be transmitted. Specific examples of such a material include inorganic materials such as silicon nitride, silicon oxynitride, or silicon oxide, and organic materials such as acrylic resin, polyimide resin, epoxy resin, or silicone resin. The insulating layer 110 can be formed by a known method such as a sputtering method or a CVD method. From the viewpoint of ease of processing, it is desirable to use silicon oxide.

[0043] The peripheral insulating layer 118 is arranged to cover the peripheral metal layer 503 and is made of a material similar to that used for the insulating layer 110. The peripheral insulating layer 118 includes the first peripheral insulating layer 111 and may also appropriately include the second peripheral insulating layer 113 and / or the third peripheral insulating layer 115.

[0044] In the insulating layer 110 of each pixel 201 included in the display area DA, the film thickness of the insulating layer 110 can vary among the plurality of pixels 201 according to the emission wavelength of the light emitted from the light-emitting element. In other words, the light-emitting element can have an optical resonator structure. In this case, the light-emitting element can be an organic light-emitting element. Specifically, the insulating layer 110 included in the first pixel 201r and the insulating layer 110 included in the second pixel 201g can have different film thicknesses. If the plurality of pixels 201 further includes a third pixel 201b, the insulating layer 110 included in the first pixel 201r, the insulating layer 110 included in the second pixel 201g, and the insulating layer 110 included in the third pixel 201b can have different film thicknesses. More specifically, the pixel (e.g., red light-emitting pixel) 201r with the longest emission wavelength can include a first insulating layer 112, a second insulating layer 114, and a third insulating layer 116. The pixel (e.g., blue light-emitting pixel) 201b with the shortest emission wavelength can include only the first insulating layer 112. The pixel (e.g., green light-emitting pixel) 201g with an emission wavelength shorter than that of the pixel 201r and longer than that of the pixel 201b can include the first insulating layer 112 and the second insulating layer 114. The insulating layer 110 can include voids between the plurality of pixels 201 or in the first region 601.

[0045] As long as the lower electrode 120 can transmit the light emitted by the light-emitting element toward the substrate 100, there is no particular limitation on the lower electrode 120. Desirably, the lower electrode 120 can be made of a transparent material. Specifically, a thin film made of a conductive material such as a conductive oxide (such as indium tin oxide (ITO) or indium zinc oxide (IZO)), a metal (such as Al, Ag, or Pt), or an alloy or metal oxide thereof can be used. In the display device according to the present exemplary embodiment, the lower electrode 120 is also disposed at the opening 108 formed in the insulating layer 110. The lower electrode 120 is electrically connected to the metal layer 506. There is no particular limitation on the film thickness of the lower electrode 120. The lower electrode 120 can have a uniform film thickness or a non-uniform film thickness. Specifically, the film thickness of the lower electrode 120 can be in the range of 20 nm to 100 nm (including 20 nm and 100 nm).

[0046] The lower electrode 120 can further include an insulator portion 130, and the insulator portion 130 is disposed to cover the end portion of the lower electrode 120. The insulator portion 130 is also referred to as a bank and is disposed to electrically insulate the lower electrode 120 among the plurality of pixels 201. The insulator portion 130 can be formed of an inorganic material such as silicon nitride, silicon oxynitride, or silicon oxide or an organic material such as an acrylic resin, a polyimide resin, an epoxy resin, or a silicone resin. The insulator portion 130 can be formed by a known method such as a sputtering method or a CVD method.

[0047] The light-emitting layer 140 is a layer that emits light. The light-emitting layer 140 may include not only a light-emitting layer but also a carrier transport layer and a carrier blocking layer. The light-emitting layer 140 may be continuously arranged in a plurality of pixels 201, or may be arranged independently of each pixel 201. If the light-emitting layer 140 is continuously arranged in a plurality of pixels 201, each pixel 201 may include a color filter to be described below. If the light-emitting layer 140 is arranged independently of each pixel 201, each pixel 201 may not include the color filter to be described below.

[0048] The upper electrode 150 is made of a material through which light emitted from the light-emitting layer 140 can be transmitted.

[0049] Specifically, a semi-transmissive and reflective material formed of a thin film made of a transparent conductive oxide material such as ITO or IZO, a metal such as Al, Ag, or Au, an alkali metal such as lithium (Li) or cesium (Cs), an alkaline earth metal such as Mg, Ca, or beryllium (Ba), or an alloy containing these metals. In particular, the upper electrode 150 may desirably be made of Ag or an alloy of Mg and Ag. The upper electrode 150 may be formed of a single layer or multiple layers as long as the upper electrode 150 can transmit light.

[0050] The display device according to the present disclosure may further include a sealing layer 160, a planarization layer 170, a color filter layer 180, and an optical member 190 on the upper electrode 150.

[0051] The sealing layer 160 is disposed on the upper electrode 150 and has a function of protecting the organic light-emitting element from being immersed in air and water. There is no particular limitation on the material for forming the sealing layer 160. However, a material having light transmission characteristics and capable of preventing oxygen and water from the outside from entering may desirably be used. Specifically, an inorganic material such as silicon nitride, silicon oxynitride, silicon oxide, aluminum oxide, or titanium oxide, or an organic material such as an acrylic resin, a polyimide resin, an epoxy resin, or a silicone resin may be used.

[0052] The sealing layer 160 may be formed by a known method such as a CVD method, an atomic layer deposition method (ALD method), or a sputtering method.

[0053] As long as the sealing layer 160 has the above functions, the sealing layer 160 may be formed of a single layer or multiple layers. In particular, if the sealing layer 160 is formed of multiple layers, the sealing layer 160 may have a stacked structure made of only inorganic materials or only organic materials, or may have a stacked structure including both inorganic materials and organic materials. The sealing layer 160 may be formed on a plurality of pixels 201.

[0054] The planarization layer 170 may be formed on the encapsulation layer 160. The planarization layer 170 is arranged to reduce the unevenness of the underlying layer. There is no particular limitation on the material for forming the planarization layer 170. The planarization layer 170 may be formed of an inorganic material or an organic material. If the planarization layer 170 is formed of an organic material, the planarization layer 170 may be formed of a low molecular material or a high molecular material.

[0055] The planarization layer 170 desirably may be formed by a wet process such as a spin coating method, a dip coating method, a slot die coating method, or a blade coating method. The planarization layer 170 formed by the wet process is beneficial to the planarization of the light-emitting side surface of the planarization layer 170. The planarization layer 170 formed by the wet process desirably may be cured by heating, ultraviolet (UV) irradiation, etc. after formation. The planarization layer 170 may be formed on a plurality of organic light-emitting elements.

[0056] The color filter layer 180 desirably may be formed on the planarization layer 170 (on the side opposite to the side facing the substrate 100). The light transmitted through the color filter layer 180r included in the first pixel 201r, the light transmitted through the color filter layer 180g included in the second pixel 201g, and the light transmitted through the color filter layer 180b included in the third pixel 201b may have the same wavelength or different wavelengths.

[0057] The color filter layer 180 may be formed by applying a color resist on a base layer such as the planarization layer 170 and then patterning the coated layer using photolithography. The color resist is formed of, for example, a photocurable resin. The pattern is formed by curing the portion irradiated with UV light.

[0058] The optical member 190 may be arranged on the color filter layer 180 (on the side opposite to the side facing the substrate 100) or arranged under the color filter layer 180 (on the side facing the substrate 100). The optical member 190 may be a lens, and the shape of the optical member 190 is not particularly limited. The optical member 190 may protrude toward the light-emitting layer 140, or may protrude in the direction opposite to the light-emitting layer 140. If the optical member 190 is a lens, the optical member 190 may also be referred to as a microlens. The microlens may be a spherical microlens, an aspherical microlens, or an asymmetric microlens.

[0059] The optical member 190 is formed of a material having a light transmission property. Specifically, the optical member 190 is formed of, for example, an organic material such as an acrylic resin, an epoxy resin, or a silicone resin, or an inorganic material such as silicon nitride, silicon oxynitride, or silicon oxide.

[0060] In the case where the optical member 190 protrudes in a direction opposite to the light-emitting layer 140, a material having a refractive index lower than that of the material forming the optical member 190 is disposed on the light-emitting side of the optical member 190. In particular, a material having a lower refractive index can be desirably used, for example, a gas such as air or nitrogen, or silica aerogel, or a vacuum state can be desirable. When the optical member 190 protrudes toward the light-emitting layer 140, a material having a refractive index higher than that of the material forming the lens is disposed on the light-emitting side.

[0061] A display device according to the present disclosure will be described in detail below.

[0062] In the display device discussed in Japanese Patent Application Laid-Open No. 2021-72282 (Patent Document 1) as a comparative example, in the case of a large width of the first region 601 disposed between the display region DA and the peripheral region PA, the insulating layer 110 cannot be easily deposited in some regions between the display region DA and the peripheral region PA. Therefore, the upper electrode 150 disposed in such a region is liable to become thin or break. Therefore, in the display device discussed in Patent Document 1, the resistance of the upper electrode 150 may increase.

[0063] In contrast, in the display device according to the present disclosure, the width of the first region 601 is less than or equal to twice the film thickness of the insulating layer 110 or the peripheral insulating layer 118. Specifically, in the plurality of pixels 201, the width of the first region 601 is less than or equal to twice the film thickness of the thickest portion of the insulating layer 110, or less than or equal to twice the film thickness of the thickest portion of the peripheral insulating layer 118. By satisfying this condition, the film thickness of the upper electrode 150 in the region between the display region DA and the peripheral region PA can be reduced. Therefore, the display device according to the present disclosure can reduce the increase in the resistance of the upper electrode 150.

[0064] In a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the first region 601 can be less than or equal to twice the film thickness of the peripheral insulating layer 118. More preferably, the width of the first region 601 can be less than the film thickness of the peripheral insulating layer 118.

[0065] If the metal layer 506 includes a region 600 as Figure 2B shown, in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the region 600 can be less than or equal to twice the film thickness of the insulating layer 110 or the peripheral insulating layer 118, or can be less than or equal to twice the film thickness of the insulating layer 110. More specifically, in the plurality of pixels 201, the width of the region 600 can be less than or equal to twice the film thickness of the thickest portion of the insulating layer 110.

[0066] Although Figure 1A and Figure 1BOnly a part of the peripheral metal layer 503 is illustrated, but this also applies to other peripheries. Specifically, in a plan view with respect to the substrate 100, the first region 601 may be arranged to surround the display region DA and may isolate the metal layer 506 from the peripheral metal layer 503.

[0067] In this specification, the term "width" refers to the length in a direction parallel to the substrate 100 in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA. The term "film thickness" refers to the length in a direction perpendicular to the substrate 100 in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA.

[0068] Except when patterning the metal layer 506 and the peripheral metal layer 503, by controlling the width of the first region 601 to be less than or equal to twice the film thickness of the insulating layer 110, the display device according to this exemplary embodiment can be obtained by known methods.

[0069] will be referred to Figures 3A to 3C to describe a display device according to a second exemplary embodiment. Figures 3A to 3C are plan views both illustrating a display device according to a second exemplary embodiment. For simplicity of illustration, both the metal layer 506 and the peripheral metal layer 503 are represented by a rectangular shape. However, the shape of each of the metal layer 506 and the peripheral metal layer 503 is not limited to a rectangular shape. The display device according to the second exemplary embodiment differs from the display device according to the first exemplary embodiment in the following aspects.

[0070] In the display device according to the second exemplary embodiment, the peripheral metal layer 503 includes a first peripheral metal layer 503a and a second peripheral metal layer 503b in the peripheral region PA. In a plan view with respect to the substrate 100, the first peripheral metal layer 503a is arranged between the metal layer 506 and the second peripheral metal layer 503b. The first region 601 is arranged between the metal layer 506 and the first peripheral metal layer 503a, and the second region 602 is arranged between the first peripheral metal layer 503a and the second peripheral metal layer 503b. With this configuration, the display device according to the second exemplary embodiment can further reduce an undesired electrical connection between the metal layer 506 and the peripheral metal layer 503 due to a defective pattern caused by foreign matter or defocus.

[0071] Figure 3A The second region 602 shown is arranged parallel to the first region 601. However, the second region 602 may be arranged in such a way that the first peripheral metal layer 503a and the second peripheral metal layer 503b can be isolated from each other. The same potential or different potentials may be applied to the first peripheral metal layer 503a and the second peripheral metal layer 503b.

[0072] The width of the second region 602 is not particularly limited. In a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the second region 602 may be less than or equal to twice the film thickness of the insulating layer 110 and may be less than or equal to twice the film thickness of the peripheral insulating layer 118. Specifically, among the plurality of pixels 201, the width of the second region 602 may be less than or equal to twice the film thickness of the thickest portion of the insulating layer 110, or may be less than or equal to twice the film thickness of the thickest portion of the peripheral insulating layer 118. In this case, the peripheral insulating layer 118 may be an insulating layer disposed on the first peripheral metal layer 503a or may be an insulating layer disposed on the second peripheral metal layer 503b.

[0073] As Figure 3B and Figure 3C shown, the first peripheral metal layer 503a may further include a fourth region 604 that connects the first region 601 and the second region 602 to each other. With this configuration, an undesired electrical connection between the metal layer 506 and the peripheral metal layer 503 can be further reduced.

[0074] In the present exemplary embodiment, the fourth region 604 is disposed in the first peripheral metal layer 503a, but alternatively may be disposed in the second peripheral metal layer 503b. In this case, the region of the fourth region 604 that connects the second region 602 and the outer edge of the second peripheral metal layer 503b to each other may be disposed in the second peripheral metal layer 503b.

[0075] The width of the fourth region 604 is not particularly limited. In a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the fourth region 604 may be less than or equal to twice the film thickness of the insulating layer 110 or may be less than or equal to twice the film thickness of the peripheral insulating layer 118. Specifically, among the plurality of pixels 201, the width of the fourth region 604 may be less than or equal to twice the film thickness of the thickest portion of the insulating layer 110, or may be less than or equal to twice the film thickness of the thickest portion of the peripheral insulating layer 118. In this case, the peripheral insulating layer 118 may be an insulating layer disposed on the first peripheral metal layer 503a or may be an insulating layer disposed on the second peripheral metal layer 503b.

[0076] In a plan view with respect to the substrate 100, as Figure 3CAs shown, the width of the fourth region 604 may be greater than the width of the first region 601 and may be greater than the width of the second region 602. Specifically, in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the fourth region 604 may be greater than twice the film thickness of the insulating layer 110 and may be greater than twice the film thickness of the peripheral insulating layer 118. More specifically, among the plurality of pixels 201, the width of the fourth region 604 may be greater than twice the film thickness of the thickest portion of the insulating layer 110 and may be greater than twice the film thickness of the thickest portion of the peripheral insulating layer 118.

[0077] As Figure 3B shown, the first peripheral metal layer 503a may include a plurality of fourth regions 604, or as Figure 3C shown, may include a single fourth region 604. As in the first exemplary embodiment, in a plan view with respect to the substrate 100, the first region 601 and the second region 602 may be arranged to surround the display region DA.

[0078] (Third Exemplary Embodiment)

[0079] A display device according to the third exemplary embodiment will be described with reference to Figures 4A to 4D FIGs. Figures 4A to 4D are plan views each illustrating a display device according to the third exemplary embodiment. The display device according to the third exemplary embodiment differs from the display device according to the first exemplary embodiment in the following aspects.

[0080] In the display device according to the third exemplary embodiment, the peripheral metal layer 503 includes a first peripheral metal layer 503a, a second peripheral metal layer 503b, and a third peripheral metal layer 503c in the peripheral region PA.

[0081] In a plan view with respect to the substrate 100, the first peripheral metal layer 503a is disposed between the metal layer 506 and the second peripheral metal layer 503b, and the second peripheral metal layer 503b is disposed between the first peripheral metal layer 503a and the third peripheral metal layer 503c. In a plan view with respect to the substrate 100, the second region 602 that isolates the first peripheral metal layer 503a from the second peripheral metal layer 503b is disposed between the first peripheral metal layer 503a and the second peripheral metal layer 503b. In a plan view with respect to the substrate 100, the third region 603 that isolates the second peripheral metal layer 503b from the third peripheral metal layer 503c is disposed between the second peripheral metal layer 503b and the third peripheral metal layer 503c. With this configuration, the display device according to the third exemplary embodiment can further reduce an undesired electrical connection between the metal layer 506 and the peripheral metal layer 503 due to a defective pattern caused by foreign matter or defocus.

[0082] Figure 4A The second region 602 shown is arranged parallel to the first region 601. However, the second region 602 may be arranged in such a manner that the first peripheral metal layer 503a and the second peripheral metal layer 503b can be isolated from each other. Similarly, the third region 603 may also be arranged in such a manner that the second peripheral metal layer 503b and the third peripheral metal layer 503c can be isolated from each other. The same potential or different potentials may be applied to the first peripheral metal layer 503a, the second peripheral metal layer 503b, and the third peripheral metal layer 503c.

[0083] There is no particular limitation on the width of the second region 602. In a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the second region 602 may be less than or equal to twice the film thickness of the insulating layer 110 and may be less than or equal to twice the film thickness of the peripheral insulating layer 118. Specifically, among the plurality of pixels 201, the width of the second region 602 may be less than or equal to twice the film thickness of the thickest portion of the insulating layer 110, or may be less than or equal to twice the film thickness of the thickest portion of the peripheral insulating layer 118. In this case, the peripheral insulating layer 118 may be an insulating layer disposed on the first peripheral metal layer 503a, may be an insulating layer disposed on the second peripheral metal layer 503b, or may be an insulating layer disposed on the third peripheral metal layer 503c. There is no particular limitation on the width of the third region 603 either. In a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the third region 603 may be less than or equal to twice the film thickness of the insulating layer 110 and may be less than or equal to twice the film thickness of the peripheral insulating layer 118. Specifically, among the plurality of pixels 201, the width of the third region 603 may be less than or equal to twice the film thickness of the thickest portion of the insulating layer 110, or may be less than or equal to twice the film thickness of the thickest portion of the peripheral insulating layer 118. In this case, the peripheral insulating layer 118 may be an insulating layer disposed on the first peripheral metal layer 503a, may be an insulating layer disposed on the second peripheral metal layer 503b, or may be an insulating layer disposed on the third peripheral metal layer 503c.

[0084] As Figure 4B and Figure 4C shown, the second peripheral metal layer 503b may include a fifth region 605 that connects the second region 602 and the third region 603 to each other. Although Figure 4BAn example is illustrated in which the second peripheral metal layer 503b includes the fifth region 605 and the first peripheral metal layer 503a does not include the fourth region 604. However, the configuration according to this exemplary embodiment is not limited to this example. The first peripheral metal layer 503a may include the fourth region 604 that connects the first region 601 and the second region 602 to each other, and the second peripheral metal layer 503b may not include the fifth region 605. The first peripheral metal layer 503a may include the fourth region 604, and the second peripheral metal layer 503b may include the fifth region 605.

[0085] Through the above configuration, the undesired electrical connection between the metal layer 506 and the peripheral metal layer 503 can be further reduced.

[0086] In this exemplary embodiment, the fifth region 605 is disposed in the second peripheral metal layer 503b. In addition, the region that connects the third region 603 to the outer edge of the third peripheral metal layer 503c may be disposed in the third peripheral metal layer 503c.

[0087] The width of the fifth region 605 is not particularly limited. In a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the fifth region 605 may be less than or equal to twice the film thickness of the insulating layer 110 and may be less than or equal to twice the film thickness of the peripheral insulating layer 118. Specifically, among the plurality of pixels 201, the width of the fifth region 605 may be less than or equal to twice the film thickness of the thickest portion of the insulating layer 110, or may be less than or equal to twice the film thickness of the thickest portion of the peripheral insulating layer 118. In this case, the peripheral insulating layer 118 may be an insulating layer disposed on the first peripheral metal layer 503a, may be an insulating layer disposed on the second peripheral metal layer 503b, or may be an insulating layer disposed on the third peripheral metal layer 503c. As Figure 4C shown, in a plan view with respect to the substrate 100, the width of the fifth region 605 may be greater than the width of the first region 601, may be greater than the width of the second region 602, and may be greater than the width of the third region 603. Specifically, in a cross-section passing through the substrate 100, the display region DA, and the peripheral region PA, the width of the fifth region 605 may be greater than twice the film thickness of the insulating layer 110 and may be greater than twice the film thickness of the peripheral insulating layer 118. More specifically, among the plurality of pixels 201, the width of the fifth region 605 may be greater than twice the film thickness of the thickest portion of the insulating layer 110 and may be greater than twice the film thickness of the thickest portion of the peripheral insulating layer 118.

[0088] The second peripheral metal layer 503b may include a plurality of fifth regions 605 as Figure 4B shown, or may be as Figure 4CAs shown, it includes a single fifth region 605. As in the first exemplary embodiment, the first region 601, the second region 602, and the third region 603 may be arranged to surround the display region DA.

[0089] When the first peripheral metal layer 503a includes the fourth region 604 and the second peripheral metal layer 503b includes the fifth region 605, it is desirable that, in a plan view with respect to the substrate 100, the intersection between the second region 602 and the fourth region 604 does not coincide with the intersection between the second region 602 and the fifth region 605. This is because, by setting the fourth region 604 and the fifth region 605 in such a way that the intersection between the second region 602 and the fourth region 604 does not coincide with the intersection between the second region 602 and the fifth region 605, the region where the insulating layer 110 is not easily deposited can be reduced. Therefore, the upper electrode 150 is not easily thinned or broken, which makes it possible to further reduce the increase in the resistance of the upper electrode 150. Specifically, the structure shown can be desirably used. Figure 4D The structure shown. Figure 4D The arrangement shown in can be interpreted as a state where the regions are arranged in a lattice, a state where the regions are arranged in a staggered manner, or a square pattern.

[0090] With this structure, the display device according to the present exemplary embodiment can further reduce the undesirable electrical connection between the metal layer 506 and the peripheral metal layer 503 due to defective patterns caused by foreign matter or defocusing. The thinning or step disconnection of the upper electrode 150 in the first region 601 can be reduced, so that the increase in the resistance of the upper electrode 150 can be further reduced.

[0091] (Application example)

[0092] Figure 5 It is a schematic diagram illustrating an example of a display device according to any of the above exemplary embodiments. The display device 1000 may include a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 arranged between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are respectively connected to flexible printed circuits (FPCs) 1002 and 1004. The display panel 1005 may include a display device according to any of the above exemplary embodiments. Transistors are printed on the circuit board 1007. If the display device is not a mobile device, the battery 1008 may be omitted. Even when the display device is a mobile device, the battery 1008 may be arranged at another position.

[0093] The display device according to any of the above exemplary embodiments may include red, green, and blue color filters. The red, green, and blue color filters may be configured in a delta arrangement.

[0094] The display device according to the present exemplary embodiment can be used for a display unit of an imaging device including an image sensor that receives light. The imaging device can include a display unit that displays information obtained by the image sensor. The display unit can be a display unit exposed to the outside of the imaging device, or can be a display unit arranged in the viewfinder. The imaging device can be a digital camera or a digital video camera.

[0095] Figure 6A is a schematic diagram illustrating an example of an imaging device according to the present exemplary embodiment. The imaging device 1100 can include a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 and the rear display 1102 can include a display device according to any one of the above exemplary embodiments. In this case, the display device can display not only the captured image but also environmental information, imaging instructions, and other types of information. The environmental information can include the intensity of external light, the orientation of external light, the moving speed of the subject, and the possibility that the subject is blocked by an obstacle.

[0096] The imaging device 1100 can also include an optical unit (not shown). The optical unit can include one or more lenses and can form an image on an image sensor housed in the housing 1104. The relative positions of the plurality of lenses can be adjusted, thereby adjusting the focus. This operation can also be performed automatically. The imaging device can also be referred to as a photoelectric conversion device. As an imaging method, the photoelectric conversion device can include not only a sequential imaging method but also a method of detecting a difference from a previous image, a method of cutting an image from continuously recorded images, or other methods.

[0097] Figure 6B is a schematic diagram illustrating an example of an electronic device according to any one of the above exemplary embodiments. The electronic device 1200 includes a display unit 1201, an operation unit 1202, and a housing 1203. The display unit 1201 can include a display device according to any one of the above exemplary embodiments. The housing 1203 can include a circuit, a printed board containing the circuit, a battery, and a communication unit. The operation unit 1202 can be a reaction unit of a button or touch panel type. The operation unit 1202 can be, for example, a biometric recognition unit configured to recognize fingerprints for unlocking. Such an electronic device including a communication unit can also be referred to as a communication device. The electronic device can also include a lens and an image sensor, thereby providing a camera function. The image captured by the camera function is displayed on the display unit 1201. Examples of the electronic device include a smartphone and a laptop computer.

[0098] Figure 7A and Figure 7B are schematic diagrams each illustrating an example of a display device according to any one of the above exemplary embodiments.Figure 7A A display device such as a television monitor or a personal computer (PC) monitor is illustrated. The display device 1300 includes a housing 1301 and a display unit 1302. The display device according to any of the above exemplary embodiments can be used as the display unit 1302.

[0099] The display device 1300 may further include a base 1303 that supports the housing 1301 and the display unit 1302. The form of the base 1303 is not limited to Figure 7A the form shown. The lower side of the housing 1301 may also serve as a base.

[0100] The housing 1301 and the display unit 1302 may be curved. The radius of curvature may be in the range of 5000 mm to 6000 mm (including 5000 mm and 6000 mm).

[0101] Figure 7B is a schematic diagram illustrating another example of a display device according to the present exemplary embodiment. Figure 7B The illustrated display device 1310 can be folded. In other words, the display device 1310 is a foldable display device. The display device 1310 includes a first display unit 1311, a second display unit 1312, a housing 1313, and a folding point 1314. The first display unit 1311 and the second display unit 1312 may include a display device according to any of the above exemplary embodiments. The first display unit 1311 and the second display unit 1312 may be integrally formed as a single seamless display device. The first display unit 1311 and the second display unit 1312 may be partitioned with respect to the folding point 1314. The first display unit 1311 and the second display unit 1312 may display different images, or the first display unit 1311 and the second display unit 1312 may display a single image.

[0102] Figure 8A is a schematic diagram illustrating an example of an illumination device according to any of the above exemplary embodiments. The illumination device 1400 may include a housing 1401, a light source 1402, and a circuit board 1403. The light source 1402 may include a display device according to any of the above exemplary embodiments. The illumination device 1400 may include an optical film 1404 to improve the color rendering property of the light source 1402. The illumination device 1400 may include a light diffusion unit 1405 to effectively diffuse the light from the light source 1402. The illumination device 1400 including the light diffusion unit 1405 can transmit light to a wide area. The optical film 1404 and the light diffusion unit 1405 may be disposed on the light-emitting side of the illumination device. Appropriately, the illumination device 1400 may include a cover on its outermost part.

[0103] The lighting device 1400 is, for example, an indoor lighting device. The color of the light emitted from the lighting device 1400 can be white, daylight white, or any color within the range from blue to red. The lighting device 1400 may include a light modulation circuit for modulating the light to be emitted. The lighting device 1400 may include a power supply circuit. The power supply circuit may be a circuit for converting an AC voltage into a DC voltage. In this case, "white" is a color with a color temperature of 4200 K (Kelvin), and "daylight white" is a color with a color temperature of 5000 K. The lighting device 1400 may include a color filter.

[0104] The lighting device 1400 according to the present exemplary embodiment may include a heat dissipation unit. The heat dissipation unit dissipates the heat in the device to the outside of the device and is made of, for example, a metal or ceramic having high thermal conductivity.

[0105] Figure 8B is a schematic diagram showing an example of an automobile as a movable body according to the present exemplary embodiment. The automobile includes a taillight as an example of a lamp. The automobile 1500 includes a taillight 1501. The taillight 1501 may be configured to turn on when a braking operation is applied. The automobile 1500 may include a body 1503 and a window 1502 attached to the body 1503.

[0106] The taillight 1501 may include a display device according to any one of the above exemplary embodiments. The taillight 1501 may include a protective member for protecting the light source. The protective member may be made of any material having relatively high strength and transparency. However, it is desirable that the protective member be made of, for example, polycarbonate. The polycarbonate may be mixed with, for example, a furandicarboxylic acid derivative or an acrylonitrile derivative.

[0107] The movable body according to the present exemplary embodiment includes one or both of a driving force generation unit that generates a driving force mainly for moving the movable body and a rotating member mainly for moving the movable body. The driving force generation unit may be an engine, a motor, etc. The rotating member may be a tire, a wheel, a screw of a ship, a propeller of an aircraft, etc. Specific examples of the movable body may include a bicycle, an automobile, a train, a ship, an airplane, and a drone. The movable body may include a main body and a lamp disposed on the main body. The lamp may emit light to indicate the position of the main body.

[0108] An electronic device or a display device may be applied to, for example, a system attachable to a user as a wearable device, such as smart glasses, a head-mounted display, or smart contact lenses. The electronic device may include an imaging device configured to perform photoelectric conversion on visible light and a display device configured to emit visible light.

[0109] Figure 9A and Figure 9Bare schematic diagrams each illustrating an example of glasses (smart glasses) according to the present exemplary embodiment. Reference will be made to Figure 9A explain glasses 1600 (smart glasses). The glasses 1600 include a display unit on the back side of the lens 1601. The display unit may include a display device according to any one of the above exemplary embodiments. In addition, an imaging device 1602 such as a complementary metal oxide semiconductor (CMOS) sensor or a single photon avalanche diode (SPAD) sensor may be provided on the front surface of the lens 1601.

[0110] The glasses 1600 further include a control device 1603. The control device 1603 serves as a power source that supplies power to each of the imaging device 1602 and the display unit. The control device 1603 controls the operations of the imaging device 1602 and the display unit. The lens 1601 includes an optical system for collecting light from the imaging device 1602 and the display unit.

[0111] Reference will be made to Figure 9B explain glasses 1610 (smart glasses). The glasses 1610 include a control device 1612. The control device 1612 is arranged with a display device, which includes a display device according to any one of the above exemplary embodiments. The control device 1612 may further include an imaging device corresponding to the imaging device 1602. The lens 1611 includes an optical system for projecting light emitted from the control device 1612, and projects an image onto the lens 1611. The control device 1612 serves as a power source that supplies power to each of the imaging device and the display device, and controls the operations of the imaging device and the display device. The control device 1612 may include a gaze detection unit that detects the gaze of the wearer. Infrared light may be used to detect the gaze. The infrared light emitting unit emits infrared light toward the eyeball of the user who is gazing at the displayed image. A part of the emitted infrared light reflected by the eyeball is detected by an imaging unit including a light receiving element. Thus, a captured image of the eyeball can be obtained. A light reducing unit that reduces light traveling from the infrared light emitting unit to the display unit in the plan view may be further arranged to reduce deterioration of the image quality.

[0112] The control device 1612 detects the gaze of the user observing the displayed image based on the captured eyeball image obtained by imaging using infrared light. Based on the captured eyeball image, any known method may be used to detect the gaze. For example, a gaze detection method based on a Purkinje image obtained by irradiating light reflected by the cornea may be used.

[0113] More specifically, the gaze detection process is performed according to the pupil center corneal reflection method. The pupil center corneal reflection method is used to calculate a gaze vector representing the orientation (rotation angle) of the eyeball based on the pupil image and the Purkinje image included in the captured eyeball image. Thus, the gaze of the user can be detected.

[0114] A display device according to an exemplary embodiment of the present disclosure may include an imaging device having a light receiving element. The display image on the display device may be controlled based on information about the user's line of sight obtained from the imaging device.

[0115] Specifically, the display device determines a first field of view area where the user is gazing and a second field of view area other than the first field of view area based on the line of sight information. The first field of view area and the second field of view area may be determined by a control device of the display device. Alternatively, an area determined by an external control device may be received. In the display area of the display device, the display resolution of the first field of view area may be controlled to be higher than that of the second field of view area. In other words, the resolution of the second field of view area may be set lower than that of the first field of view area.

[0116] Artificial intelligence (AI) may be used to determine the first display area and / or the display area with a higher priority. The AI may be a model configured to estimate the angle of the line of sight and the distance from the subject on the line of sight based on an eye image by using training data including the eye image and the actual viewing direction of the eye in the image. The AI may be included in the display device, may be included in the imaging device, or may be included in an external device. The AI included in the external device may be suitable for applications of smart glasses that also include an imaging device for capturing external images. The smart glasses are configured to display information about the captured external images in real time.

[0117] Figure 10A is a schematic diagram illustrating an example of an image forming device according to an exemplary embodiment. The image forming device 40 is an electrophotographic image forming device and includes a photosensitive member 27, an exposure light source 28, a charging unit 30, a developing unit 31, a transfer unit 32, a conveyance roller 33, and a fixing unit 35. Light 29 is radiated from the exposure light source 28 to form an electrostatic latent image on the surface of the photosensitive member 27. The exposure light source 28 may include the display device according to the present exemplary embodiment. The developing unit 31 includes toner and other components. The charging unit 30 charges the surface of the photosensitive member 27. The transfer unit 32 transfers the developed image onto a recording medium 34. The conveyance roller 33 conveys the recording medium 34. The recording medium 34 is paper, for example. The fixing unit 35 fixes the image formed on the recording medium 34.

[0118] Figure 10B and Figure 10C are schematic diagrams each illustrating the exposure light source 28 and also illustrating a state in which a plurality of light emitting portions 36 are arranged on a long substrate. The arrow 37 indicates the column direction in which the light emitting elements are arranged. This column direction is the same as the rotation axis direction of the photosensitive member 27. This direction may also be referred to as the long axis direction of the photosensitive member 27. Figure 10BIllustrated is a configuration in which the light-emitting portion 36 is arranged along the long-axis direction of the photosensitive member 27. Figure 10C Illustrated is a configuration Figure 10B different from the configuration shown in and in which the light-emitting portion 36 is alternately arranged in the column direction between the first column and the second column. The light-emitting portion 36 is arranged at different positions in the column direction between the first column and the second column. In the first column, a plurality of light-emitting portions 36 are arranged at intervals. In the second column, the light-emitting portion 36 is arranged at a position corresponding to the space between the light-emitting portions 36 in the first column. In other words, a plurality of light-emitting portions 36 are also arranged at intervals in the row direction. Figure 10C The configuration shown in can also represent a state in which the light-emitting portions 36 are arranged in a lattice, a state in which the light-emitting portions 36 are arranged in a staggered manner, which can be interpreted as a square pattern.

[0119] As described above, the use of a device using an organic light-emitting element according to any one of the above exemplary embodiments enables an image with high image quality to be stably displayed for a long time.

[0120] As described above, the display device according to any one of the above exemplary embodiments has a configuration in which the width of the first region disposed between the metal layer and the peripheral metal layer is less than or equal to twice the film thickness of the peripheral insulating layer, thereby reducing an increase in the resistance of the upper electrode. In addition, the region arranged in such a manner that the metal layer and the peripheral metal layer are isolated from each other is increased, thereby further reducing the possibility of electrical connection between the metal layer and the peripheral metal layer.

[0121] According to one aspect of the present disclosure, a display device capable of reducing an increase in the resistance of the upper electrode can be provided.

[0122] Although the present disclosure has been described with reference to the exemplary embodiments, it is to be understood that the present disclosure is not limited to the disclosed exemplary embodiments. The scope of the appended claims should be given the broadest interpretation so as to cover all such variations and equivalent structures and functions.

Claims

1. A display device, comprising: substrate; a display area on the substrate; and A peripheral area near the display area on the substrate, The display area includes at least a metal layer, an insulating layer, a lower electrode, a light-emitting layer and an upper electrode in order from the substrate side. The peripheral region includes at least a peripheral metal layer and a peripheral insulating layer in sequence from the substrate side. wherein, in a plan view relative to the substrate, a first region isolating the metal layer from the peripheral metal layer is arranged between the metal layer and the peripheral metal layer, and Wherein, in a cross section passing through the substrate, the display area and the peripheral area, a width of the first area is less than or equal to twice a film thickness of the peripheral insulating layer.

2. The display device according to claim 1, in, The peripheral metal layer includes a first peripheral metal layer and a second peripheral metal layer, and wherein, in a plan view relative to the substrate, the first peripheral metal layer is arranged between the metal layer and the second peripheral metal layer, the first region is arranged between the metal layer and the first peripheral metal layer, and A second region isolating the first peripheral metal layer from the second peripheral metal layer is disposed between the first peripheral metal layer and the second peripheral metal layer.

3. The display device according to claim 2, wherein: In a cross section passing through the substrate, the display region, and the peripheral region, a width of the second region is less than or equal to twice a film thickness of the peripheral insulating layer.

4. The display device according to claim 2, wherein: The first peripheral metal layer includes a fourth region connecting the first region to the second region.

5. The display device according to claim 2, in, The peripheral metal layer further includes a third peripheral metal layer, wherein, in a plan view relative to the substrate, the second peripheral metal layer is arranged between the first peripheral metal layer and the third peripheral metal layer, and Wherein, a third region isolating the second peripheral metal layer from the third peripheral metal layer is arranged between the second peripheral metal layer and the third peripheral metal layer.

6. The display device according to claim 5, wherein: In a cross section passing through the substrate, the display region, and the peripheral region, a width of the third region is less than or equal to twice a film thickness of the peripheral insulating layer.

7. The display device according to claim 5, wherein: The first peripheral metal layer includes a fourth region connecting the first region to the second region.

8. The display device according to claim 7, wherein: In a plan view with respect to the substrate, a width of the fourth region is greater than a width of the first region and greater than a width of the second region.

9. The display device according to claim 7 or 8, wherein: In a cross section passing through the substrate, the display region, and the peripheral region, a width of the fourth region is greater than twice a film thickness of the peripheral insulating layer.

10. The display device according to claim 5, wherein: The second peripheral metal layer includes a fifth region connecting the second region to the third region.

11. The display device according to claim 5, in, The first peripheral metal layer includes a fourth region connecting the first region to the second region, wherein the second peripheral metal layer includes a fifth region connecting the second region to the third region, and Wherein, in a plan view relative to the substrate, an intersection point between the second region and the fourth region does not coincide with an intersection point between the second region and the fifth region.

12. The display device according to claim 5, wherein: The first peripheral metal layer and the second peripheral metal layer include a plurality of peripheral metal layers, and The plurality of peripheral metal layers are arranged in a staggered manner.

13. The display device according to claim 1, wherein: The display area includes an organic light emitting element.

14. The display device according to claim 1, in, The display area includes at least a first pixel and a second pixel, Each of the first pixel and the second pixel includes an organic light emitting element, and The insulating layer included in the first pixel and the insulating layer included in the second pixel have different film thicknesses.

15. The display device according to claim 14, in, The display area further includes a third pixel, Wherein, the third pixel includes the organic light emitting element, and The insulating layer included in the first pixel, the insulating layer included in the second pixel, and the insulating layer included in the third pixel have different film thicknesses.

16. The display device according to claim 13, wherein: The organic light emitting element includes an optical resonator structure.

17. The display device according to claim 1, in, The peripheral metal layer includes a first metal layer and a first layer different from the first metal layer, and The reflectivity of the first metal layer is higher than the reflectivity of the first layer.

18. The display device according to claim 1, in, The metal layer includes a second metal layer and a second layer different from the second metal layer, and The reflectivity of the second metal layer is higher than the reflectivity of the second layer.

19. The display device according to claim 1, in, An interlayer insulating layer is disposed on the substrate, and Wherein, the metal layer and the peripheral metal layer are arranged on the interlayer insulating layer.

20. A photoelectric conversion device comprising: an image sensor configured to receive light; and A display unit configured to display an image captured by the image sensor, wherein the display unit is used as the display device according to any one of claims 1 to 19.

21. An electronic device comprising: A display unit comprising a display device according to any one of claims 1 to 19; and a housing including the display unit; as well as A communication unit is disposed on the housing and is configured to communicate with an external device.

22. A wearable device comprising: A display unit comprising a display device according to any one of claims 1 to 19; an optical system configured to collect light from the display unit; and A control device is configured to control the operation of the display unit.

Images